Transfer film, display panel substrate, method for manufacturing display panel substrate, and display panel

Abstract

To provide a transfer film that (1) forms patterns resistant to occurrence of falling and deformation, and is used in manufacturing of a display panel base material, (2) forms patterns high in aspect ratio, and is used in the manufacturing of the display panel base material, and to provide (3) these applications.SOLUTION: A transfer film is used in manufacturing of a display panel base material that includes: (1) a temporary supporting body; and a transfer layer including a photosensitive layer, in which a softening temperature of the post-exposed photosensitive layer is 300°C or higher. A transfer film is used in the manufacturing of the display panel base material that includes: (2) the temporary supporting body; and the transfer layer including the photosensitive layer, in which transmittance of a photosensitive wavelength of the photosensitive layer is 30% or higher. A transfer film is composed of (3) these applications.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a transfer film, a display panel substrate, a method for manufacturing a display panel substrate, and a display panel. [Background technology]

[0002] In a display panel of a display device such as an LED display, a technique for forming pixels in an area surrounded by partition walls is known. LED is an abbreviation for "Light Emitting Diode." For example, in a micro LED display panel including a color conversion device disclosed in Patent Document 1, an emitting layer is surrounded by first and second partition walls. Each of the first and second partition walls is formed by forming a coating film by applying a photosensitive resin, followed by exposure and development. In other words, the partition walls in Patent Document 1 are formed by photolithography.

[0003] Although the photolithography disclosed in Patent Document 1 utilizes a method of applying a photosensitive resin, a method using a transfer film is also utilized in general photolithography. For example, Patent Document 2 discloses a dry film including a resin layer composed of a curable resin composition containing an amide-imide resin, a compound having an ethylenic double bond, and a photopolymerization initiator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2020-204759 [Patent Document 2] Patent Publication No. 2021-042369 Summary of the Invention [Problem to be solved by the invention]

[0005] Conventional display panels often experience problems such as collapse and deformation of barrier ribs separating pixels. These collapse and deformation are likely to occur during manufacturing processes, such as heating and forming pixels in the spaces defined by the barrier ribs. Examples of barrier rib deformation include meandering. Furthermore, these problems become more likely as the aspect ratio of the barrier ribs increases. The aspect ratio of a barrier rib represents the ratio of its height to its width. A "larger aspect ratio" encompasses (1) a smaller width and an larger height, (2) a constant width and an increased height, and (3) a constant height and a smaller width, compared to a reference standard. Demand for barrier ribs with a high aspect ratio is expected to increase with the miniaturization of pixels in applications such as micro LED displays.

[0006] The application of a transfer film to a manufacturing method for a display panel substrate, particularly a manufacturing method for a display panel substrate including partition walls separating pixels, is believed to contribute to improved productivity, reduced labor hours, and increased partition wall height. In this disclosure, the term "display panel substrate" refers to an article for constituting a display panel. In this disclosure, the term "display panel substrate" may refer not only to the material of the display panel but also to a portion of the display panel, depending on the embodiment. Meanwhile, as shown in Patent Document 1, partition walls separating pixels have generally been manufactured by applying a photosensitive resin, and therefore, a transfer film suitable for manufacturing display panel substrates is needed.

[0007] An object of one embodiment of the present disclosure is to provide a display panel substrate including partition walls that are resistant to collapse and deformation. Another embodiment of the present disclosure has an object to provide a method for manufacturing a display panel substrate including partition walls that are resistant to collapse and deformation. Another embodiment of the present disclosure aims to provide a display panel including partition walls that are less likely to collapse or deform. Another embodiment of the present disclosure has an object to provide a transfer film that forms a pattern that is resistant to collapse and deformation and is used in manufacturing a display panel substrate. Another embodiment of the present disclosure has an object to provide a transfer film that forms a pattern having a high aspect ratio and is used in manufacturing a substrate for a display panel. [Means for solving the problem]

[0008] The present disclosure encompasses the following aspects. <1> A display panel substrate comprising a partition wall separating pixels, the partition wall being made of a composition containing an organic resin, the partition wall having a width of 1 μm or more, a ratio of a height of the partition wall to a width of 1 or more, and a softening temperature of the partition wall being 300° C. or more. <2> The elastic modulus of the partition wall is 4 GPa or more. <1> The display panel substrate according to claim 1. <3> The partition wall has a double bond valence of 2.0 mmol / g or less. <1> or <2> The display panel substrate according to claim 1. <4> The double bond valence of the partition wall is 0.01 mmol / g or more. <1> ~ <3> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <5> the solubility of the partition wall in propylene glycol monomethyl ether acetate is 0.1 g / L or less; <1> ~ <4> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <6> The composition comprises a nitrogen-containing compound. <1> ~ <5> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <7> The composition comprises a chlorine compound. <1> ~ <6> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <8> the composition contains at least one compound selected from the group consisting of a compound having an oxime ester structure, a compound having an α-hydroxyalkylphenone structure, a compound having an acylphosphine oxide structure, and a compound having a triarylimidazole structure; <1> ~ <7> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <9> the composition contains at least one compound selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds; <1> ~ <8> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <10> The composition contains a compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group. <1> ~ <9> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <11> The composition includes an ultraviolet absorber. <1> ~ <10> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <12> The composition comprises a pigment. <1> ~ <11> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <13> The optical density of the partition wall is 2.5 or more. <1> ~ <12> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <14> a light-shielding film covering at least a part of a surface of the partition wall; <1> ~ <13> 10. The display panel substrate according to claim 9, wherein the display panel substrate is a substrate for a display panel. <15> The thickness of the light-shielding film is 50 nm or more. <14> The display panel substrate according to claim 1. <16> <1> ~ <15> A display panel comprising the display panel substrate according to any one of the above items. <17> A method for producing a display panel substrate, the display panel substrate including partition walls separating pixels, the partition walls being made of a composition containing an organic resin, the partition walls having a width of 1 μm or more, a ratio of the height of the partition walls to the width of the partition walls being 1 or more, and the partition walls having a softening temperature of 300°C or more, the method comprising: preparing a transfer film including a temporary support and a transfer layer including a photosensitive layer; bonding the transfer film to a substrate and arranging the transfer layer and the temporary support on the substrate in this order; exposing the transfer layer to a pattern; and developing the transfer layer to form a pattern that constitutes the partition walls. <18> peeling off the temporary support disposed on the substrate; <17> 10. A method for producing the display panel substrate according to claim 9. <19> heating the septum. <17> or <18> 10. A method for producing the display panel substrate according to claim 9. <20> and covering at least a part of a surface of the partition wall with a light-shielding film. <17> ~ <19> 10. A method for producing a display panel substrate according to any one of the above items. <21> A transfer film used in the manufacture of a display panel substrate, comprising a temporary support and a transfer layer including a photosensitive layer, wherein the softening temperature of the photosensitive layer after exposure is 300°C or higher. <22> A transfer film used in the production of a display panel substrate, comprising a temporary support and a transfer layer including a photosensitive layer, wherein the transmittance of the photosensitive layer at the photosensitive wavelength is 30% or more. <23> the photosensitive layer contains a crosslinkable compound; <21> or <22> The transfer film described in <24> the photosensitive layer contains at least one photopolymerization initiator selected from the group consisting of a compound having an oxime ester structure, a compound having an α-hydroxyalkylphenone structure, a compound having an acylphosphine oxide structure, and a compound having a triarylimidazole structure; <21> ~ <23> 10. A transfer film according to any one of the preceding items. <25> the photosensitive layer contains at least one sensitizer selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds; <21> ~ <24> 10. A transfer film according to any one of the preceding items. <26> the photosensitive layer contains a polymerizable compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group; <21> ~ <25> 10. A transfer film according to any one of the preceding items. <27> The photosensitive layer contains an ultraviolet absorber. <21> ~ <26> 10. A transfer film according to any one of the preceding items. <28> The photosensitive layer contains a pigment. <21> ~ <27> 10. A transfer film according to any one of the preceding items. [Effects of the Invention]

[0009] According to one embodiment of the present disclosure, there is provided a display panel substrate including partition walls that are resistant to collapse and deformation. According to another embodiment of the present disclosure, there is provided a method for manufacturing a display panel substrate including partition walls that are resistant to collapse and deformation. According to another embodiment of the present disclosure, there is provided a display panel including a partition wall that is resistant to collapse and deformation. According to another embodiment of the present disclosure, there is provided a transfer film that forms a pattern that is resistant to collapse and deformation and is used in manufacturing a display panel substrate. According to another embodiment of the present disclosure, there is provided a transfer film that forms a pattern having a high aspect ratio and is used in manufacturing a substrate for a display panel. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic enlarged cross-sectional view showing a display panel according to an embodiment. [Figure 2] 2A to 2C are enlarged cross-sectional views each showing a manufacturing method of the display panel shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described in detail. The present disclosure is not limited to the following embodiments. The following embodiments may be modified as appropriate within the scope of the present disclosure.

[0012] When describing embodiments of the present disclosure with reference to the drawings, explanations of overlapping components and symbols in the drawings may be omitted. Components indicated by the same symbols in the drawings are the same components. The dimensional ratios in the drawings do not necessarily represent the actual dimensional ratios.

[0013] In the present disclosure, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the upper and lower limits. In the present disclosure, in numerical ranges described in stages, the upper or lower limit value described in a certain numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in the present disclosure, the upper or lower limit value described in a certain numerical range may be replaced with a value shown in the examples.

[0014] In the present disclosure, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved.

[0015] In the present disclosure, "transparent" means that the average transmittance of visible light with a wavelength of 400 to 700 nm is 80% or more, and preferably 90% or more.

[0016] In the present disclosure, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd.

[0017] In this disclosure, unless otherwise specified, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are values ​​converted using a polystyrene standard substance measured with a gel permeation chromatography (GPC) analyzer using a TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all trade names manufactured by Tosoh Corporation) column, THF (tetrahydrofuran) as an eluent, a differential refractometer as a detector, and polystyrene as a standard substance.

[0018] In the present disclosure, unless otherwise specified, the molecular weight of a compound having a molecular weight distribution is the weight average molecular weight (Mw).

[0019] In the present disclosure, unless otherwise specified, the content of metal elements is a value measured using an inductively coupled plasma (ICP) spectroscopic analyzer.

[0020] In this disclosure, unless otherwise specified, the refractive index is a value measured using an ellipsometer at a wavelength of 550 nm.

[0021] In this disclosure, unless otherwise specified, the hue is a value measured using a color difference meter (CR-221, manufactured by Minolta Co., Ltd.).

[0022] In the present disclosure, "(meth)acrylic" is a concept that encompasses both acrylic and methacrylic, and "(meth)acryloxy group" is a concept that encompasses both acryloxy group and methacryloxy group.

[0023] In the present disclosure, "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous solution of sodium carbonate at 22°C is 0.1 g or more.

[0024] In this disclosure, "solids" means all components excluding solvent.

[0025] In this disclosure, terms indicating the positional relationship between one component and another component (e.g., "above" and "below") refer to the relative positional relationship between the one component and another component, unless otherwise specified.

[0026] In the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment.

[0027] <Transfer film> Hereinafter, a transfer film according to one embodiment of the present disclosure, specifically a transfer film used in the manufacture of a display panel substrate, will be described.

[0028] The transfer film includes a temporary support and a transfer layer including a photosensitive layer. The transfer layer may have a single-layer structure or a multi-layer structure. The transfer layer may include a photosensitive layer and other layers. Examples of the other layers include a thermoplastic resin layer and an intermediate layer. The transfer film may include a protective film in addition to the temporary support and the transfer layer. For example, the transfer film may include a temporary support, a transfer layer including a photosensitive layer, and a protective film in this order. Examples of the configuration of the transfer film are shown below. However, the configuration of the transfer film is not limited to the specific examples below. (1) "Temporary support / photosensitive layer" (2) "Temporary support / photosensitive layer / protective film" (3) "Temporary support / intermediate layer / photosensitive layer / protective film" (4) "Temporary support / thermoplastic resin layer / intermediate layer / photosensitive layer / protective film"

[0029] [Temporary support] The transfer film includes a temporary support. The temporary support supports the transfer layer. When the transfer film is used, the temporary support may be finally removed.

[0030] The temporary support may have a single-layer structure or a multi-layer structure.

[0031] The temporary support is preferably a film, more preferably a resin film, which is flexible and does not significantly deform, shrink, or stretch under pressure or under pressure and heat.

[0032] Examples of the film include polyethylene terephthalate film (e.g., biaxially stretched polyethylene terephthalate film), polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, and polycarbonate film. The temporary support is preferably a polyethylene terephthalate film. Furthermore, the film used as the temporary support is preferably free from deformations such as wrinkles and scratches.

[0033] The temporary support preferably has high transparency so that pattern exposure can be performed through the temporary support, and the transmittance at 365 nm is preferably 60% or more, more preferably 70% or more.

[0034] From the viewpoints of pattern formability during pattern exposure through the temporary support and transparency of the temporary support, it is preferable that the haze of the temporary support is small. Specifically, the haze value of the temporary support is preferably 2% or less, more preferably 0.5% or less, and even more preferably 0.1% or less.

[0035] From the viewpoint of pattern formation during pattern exposure through the temporary support and the transparency of the temporary support, it is preferable that the number of fine particles, foreign matter, and defects contained in the temporary support is small. The number of fine particles, foreign matter, and defects with a diameter of 1 μm or more in the temporary support is 50 / 10 mm. 2 Preferably less than 10 pieces / 10mm 2 Less than 3 pieces / 10mm is more preferable. 2 Less than 0 pieces / 10mm is more preferable. 2 is particularly preferred.

[0036] The thickness of the temporary support is not particularly limited, but is preferably 5 μm to 200 μm, and from the viewpoints of ease of handling and versatility, is more preferably 5 μm to 150 μm, even more preferably 5 μm to 50 μm, and most preferably 5 μm to 25 μm. The thickness of the temporary support is calculated as the average value of any five points measured by cross-sectional observation using an SEM (Scanning Electron Microscope).

[0037] In order to improve the adhesion between the temporary support and the transfer layer, the surface of the temporary support facing the transfer layer may be surface-modified by ultraviolet irradiation, corona discharge, or plasma. In the surface modification by ultraviolet irradiation, the exposure dose is 10 mJ / cm. 2 ~2000mJ / cm 2 and preferably 50 mJ / cm 2 ~1000mJ / cm 2 Examples of light sources for ultraviolet irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, electrodeless discharge lamps, and light-emitting diodes (LEDs), all of which emit light in the wavelength range of 150 nm to 450 nm. As long as the exposure dose is within the above ranges, the output and illuminance of the light source are not limited.

[0038] Examples of the temporary support include a biaxially oriented polyethylene terephthalate film having a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film having a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film having a thickness of 9 μm.

[0039] Preferred forms of the temporary support are described, for example, in paragraphs

[0017] to

[0018] of JP 2014-085643 A, paragraphs

[0019] to

[0026] of JP 2016-027363 A, paragraphs

[0041] to

[0057] of WO 2012 / 081680 A, and paragraphs

[0029] to

[0030] of WO 2018 / 179370 A.

[0040] The contents of these publications are incorporated herein by reference.

[0040] To improve handling properties, a layer containing fine particles (lubricant layer) may be provided on the surface of the temporary support. The lubricant layer may be provided on one or both sides of the temporary support. The diameter of the particles contained in the lubricant layer is preferably 0.05 μm to 0.8 μm. The thickness of the lubricant layer is preferably 0.05 μm to 1.0 μm.

[0041] Commercially available temporary supports include Lumirror 16KS40 and Lumirror 16FB40 (all manufactured by Toray Industries, Inc.), Cosmoshine A4100, Cosmoshine A4300, and Cosmoshine A8300 (all manufactured by Toyobo Co., Ltd.).

[0042] [Photosensitive layer] The transfer film includes a photosensitive layer. The photosensitive layer is one component of the transfer layer. The photosensitive layer can form a pattern through exposure and development. The photosensitive layer is preferably a negative photosensitive layer. A negative photosensitive layer is a photosensitive layer in which the solubility of the exposed portion in a developer decreases upon exposure. When the photosensitive layer is a negative photosensitive layer, the formed pattern corresponds to a hardened layer.

[0043] (Softening temperature) The softening temperature of the photosensitive layer after exposure is preferably 300°C or higher, more preferably 350°C or higher, and even more preferably 400°C or higher. When the softening temperature of the photosensitive layer after exposure is 300°C or higher, the thermal stability of the pattern formed from the photosensitive layer is improved. As a result, a pattern that is less likely to collapse or deform can be obtained. Furthermore, when the softening temperature of the photosensitive layer after exposure is 300°C or higher, the pattern is less likely to collapse or deform even if the aspect ratio of the pattern is large. For example, when the photosensitive layer is used as a material for partition walls of a display panel substrate as described below, partition walls that are less likely to collapse or deform can be obtained. Therefore, a transfer film in which the softening temperature of the photosensitive layer after exposure is adjusted to 300°C or higher is suitable for producing display panel substrates. The upper limit of the softening temperature of the photosensitive layer after exposure is not limited. The softening temperature of the photosensitive layer after exposure may be 800°C or lower, 700°C or lower, 600°C or lower, or 500°C or lower. The photosensitive layer after exposure may be a photosensitive layer exposed to light having at least one wavelength selected from the group consisting of 365 nm and 405 nm. The photosensitive layer after exposure may be a photosensitive layer exposed to light having a wavelength of 365 nm. The photosensitive layer after exposure may be a photosensitive layer exposed to light having a wavelength of 405 nm. The softening temperature of the photosensitive layer after exposure is measured using an atomic force microscope (AFM). The specific procedure is as follows: First, using a measuring device utilizing an atomic force microscope (e.g., a combination of an AFM5100N SPM manufactured by Hitachi High-Tech Science Corporation and a nano-TA local heating system manufactured by Anasys Instruments), the penetration depth of a probe (e.g., PR-EX-AN2-200-5, 0.6 kΩ to 3.5 kΩ, 55 kHz to 88 kHz, 0.5 N / m to 3 N / m) into the surface of the measurement sample is measured under heating conditions ranging from room temperature (e.g., 25°C) to 500°C at a heating rate of 10°C / s. Next, the softening temperature of the measurement sample is determined based on a graph showing the change in penetration depth versus heating temperature. The above series of operations is performed three to five times, and the average softening temperature of the measurement sample is calculated. The average softening temperature obtained is used as the softening temperature in this disclosure.The softening temperature is corrected based on the difference between the known softening temperature of a standard sample (e.g., polycaprolactone, polypropylene, and polyethylene terephthalate) and the softening temperature of the standard sample calculated according to the softening temperature measurement method using an atomic force microscope described above. The softening temperature of the photosensitive layer after exposure can be adjusted, for example, by the composition of the photosensitive layer. For example, adjusting the composition of the photosensitive layer so that a component with a high softening temperature is present in the photosensitive layer after exposure can contribute to increasing the softening temperature of the photosensitive layer after exposure. For example, the softening temperature of the photosensitive layer after exposure may be adjusted by the contents of the crosslinking compound, polymerization initiator, sensitizer, and hydrogen donor compound. The softening temperature of the photosensitive layer after exposure may be adjusted by the type and number of functional groups in the crosslinking compound, the composition ratio of the crosslinking compound, and the amount of double bonds in the crosslinking compound. For example, since the crosslinking density of the photosensitive layer after exposure varies depending on the number of crosslinking groups (including polymerizable groups) of the compound contained in the photosensitive layer, the softening temperature of the photosensitive layer after exposure may be adjusted by adjusting the crosslinking density.

[0044] (Transmittance of photosensitive wavelength) The transmittance of the photosensitive layer at the photosensitive wavelength is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. When the transmittance of the photosensitive layer at the photosensitive wavelength is 30% or more, resolution is improved. Furthermore, when the transmittance of the photosensitive layer at the photosensitive wavelength is 30% or more, high resolution is maintained even when the thickness of the photosensitive layer is increased. As a result, a pattern with a high aspect ratio is obtained. For example, when the photosensitive layer is used as a material for partition walls of a display panel substrate as described below, partition walls with a high aspect ratio are obtained. Therefore, a transfer film in which the transmittance of the photosensitive layer at the photosensitive wavelength is adjusted to 30% or more is suitable for manufacturing display panel substrates. Furthermore, with regard to a negative photosensitive layer, when the transmittance of the photosensitive wavelength of the negative photosensitive layer is 30% or more, the uniformity of the curing reaction in the thickness direction of the negative photosensitive layer is improved. From the viewpoint of photosensitivity (e.g., polymerization rate), the transmittance of the photosensitive layer at the photosensitive wavelength is preferably 95% or less, more preferably 90% or less, and even more preferably 85% or less. "Photosensitive wavelength" refers to the wavelength to which the object is photosensitive. The photosensitive wavelength may be at least one wavelength selected from the group consisting of 365 nm and 405 nm. The photosensitive wavelength may be 365 nm. The photosensitive wavelength may be 405 nm. The transmittance of the photosensitive layer at the photosensitive wavelength is measured using a spectrophotometer. The transmittance of the photosensitive layer at the photosensitive wavelength is adjusted, for example, by the composition of the photosensitive layer (e.g., the type and content of the initiator and sensitizer).

[0045] The components of the photosensitive layer include the following. The photosensitive layer may contain one or more components selected from the components shown below. However, the components of the photosensitive layer are not limited to the specific examples below.

[0046] (Component: Binder polymer) The photosensitive layer may contain a binder polymer, such as a (meth)acrylic resin, a styrene resin, an epoxy resin, an amide resin, an amide epoxy resin, an alkyd resin, a phenolic resin, an ester resin, a urethane resin, an epoxy acrylate resin obtained by reacting an epoxy resin with (meth)acrylic acid, or an acid-modified epoxy acrylate resin obtained by reacting an epoxy acrylate resin with an acid anhydride.

[0047] One preferred embodiment of the binder polymer is a (meth)acrylic resin, which has excellent alkali developability and film formability. In the present disclosure, the (meth)acrylic resin refers to a resin having structural units derived from a (meth)acrylic compound. The content of the structural units derived from a (meth)acrylic compound is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more, based on the total structural units of the (meth)acrylic resin. The (meth)acrylic resin may be composed solely of structural units derived from a (meth)acrylic compound, or may also contain structural units derived from a polymerizable monomer other than a (meth)acrylic compound. In other words, the upper limit of the content of structural units derived from a (meth)acrylic compound is 100% by mass or less, based on the total structural units of the (meth)acrylic resin.

[0048] Examples of the (meth)acrylic compound include (meth)acrylic acid, (meth)acrylic acid esters, (meth)acrylamide, and (meth)acrylonitrile.

[0049] Examples of (meth)acrylic acid esters include (meth)acrylic acid alkyl esters, (meth)acrylic acid tetrahydrofurfuryl esters, (meth)acrylic acid dimethylaminoethyl esters, (meth)acrylic acid diethylaminoethyl esters, (meth)acrylic acid glycidyl esters, (meth)acrylic acid benzyl esters, 2,2,2-trifluoroethyl (meth)acrylate, and 2,2,3,3-tetrafluoropropyl (meth)acrylate, and (meth)acrylic acid alkyl esters are preferred.

[0050] The alkyl group of the (meth)acrylic acid alkyl ester may be linear or branched. Specific examples include (meth)acrylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate.

[0051] As the (meth)acrylic acid ester, a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferred, and methyl (meth)acrylate or ethyl (meth)acrylate is more preferred.

[0052] Examples of (meth)acrylamides include acrylamides such as diacetone acrylamide.

[0053] The (meth)acrylic resin may have a structural unit other than the structural unit derived from the (meth)acrylic compound. The polymerizable monomer forming the structural unit is not particularly limited as long as it is a compound other than the (meth)acrylic compound that is copolymerizable with the (meth)acrylic compound. Examples include styrene compounds such as styrene, vinyltoluene, and α-methylstyrene, which may have a substituent at the α-position or aromatic ring, vinyl alcohol esters such as acrylonitrile and vinyl-n-butyl ether, maleic acid, maleic anhydride, maleic acid monoesters such as monomethyl maleate, monoethyl maleate, and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, and crotonic acid. These polymerizable monomers may be used alone or in combination of two or more.

[0054] In addition, the (meth)acrylic resin preferably has a structural unit having an acid group in order to improve alkaline developability. Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, and a phosphonate group. Among these, the (meth)acrylic resin more preferably has a structural unit having a carboxy group, and even more preferably has a structural unit derived from the above-mentioned (meth)acrylic acid.

[0055] The content of structural units having an acid group in the (meth)acrylic resin (preferably structural units derived from (meth)acrylic acid) is preferably 10% by mass or more relative to the total mass of the (meth)acrylic resin in terms of excellent developability. While there is no particular upper limit, it is preferably 50% by mass or less, more preferably 40% by mass or less, in terms of excellent alkali resistance.

[0056] The (meth)acrylic resin more preferably contains structural units derived from the above-mentioned (meth)acrylic acid alkyl ester. The content of the structural units derived from the (meth)acrylic acid alkyl ester in the (meth)acrylic resin is preferably 50% by mass to 90% by mass, more preferably 60% by mass to 90% by mass, and even more preferably 65% ​​by mass to 90% by mass, based on the total structural units of the (meth)acrylic resin.

[0057] As the (meth)acrylic resin, a resin having both a structural unit derived from (meth)acrylic acid and a structural unit derived from a (meth)acrylic acid alkyl ester is preferred, and a resin composed only of a structural unit derived from (meth)acrylic acid and a structural unit derived from a (meth)acrylic acid alkyl ester is more preferred.

[0058] Furthermore, as the (meth)acrylic resin, an acrylic resin having a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, and a structural unit derived from ethyl acrylate is also preferred.

[0059] Furthermore, in order to achieve superior effects of the present disclosure, the (meth)acrylic resin preferably has at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from methacrylic acid alkyl esters, and preferably has both structural units derived from methacrylic acid and structural units derived from methacrylic acid alkyl esters. In order to achieve superior effects of the present disclosure, the total content of structural units derived from methacrylic acid and structural units derived from methacrylic acid alkyl esters in the (meth)acrylic resin is preferably 40% by mass or more, more preferably 60% by mass or more, based on the total structural units of the (meth)acrylic resin. The upper limit is not particularly limited, and may be 100% by mass or less, and preferably 80% by mass or less.

[0060] In order to obtain a more excellent effect of the present disclosure, the (meth)acrylic resin preferably contains at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from methacrylic acid alkyl esters, and at least one selected from the group consisting of structural units derived from acrylic acid and structural units derived from acrylic acid alkyl esters. In order to obtain a more excellent effect of the present disclosure, the total content of the structural units derived from methacrylic acid and structural units derived from methacrylic acid alkyl esters is preferably in a mass ratio of 60 / 40 to 80 / 20 relative to the total content of the structural units derived from acrylic acid and structural units derived from acrylic acid alkyl esters.

[0061] The (meth)acrylic resin preferably has an ester group at its terminal, since this provides excellent developability for the photosensitive layer after transfer. The terminal portion of the (meth)acrylic resin is composed of a moiety derived from the polymerization initiator used in the synthesis. The (meth)acrylic resin having an ester group at its terminal can be synthesized by using a polymerization initiator that generates a radical having an ester group.

[0062] Another preferred embodiment of the binder polymer is an alkali-soluble resin. From the viewpoint of developability, the binder polymer is preferably a binder polymer having an acid value of 60 mgKOH / g or more. Furthermore, the binder polymer is more preferably a resin having a carboxy group with an acid value of 60 mgKOH / g or more (a so-called carboxy group-containing resin), and even more preferably a (meth)acrylic resin having a carboxy group with an acid value of 60 mgKOH / g or more (a so-called carboxy group-containing (meth)acrylic resin), because it is easily thermally crosslinked with the crosslinking component by heating to form a strong film. When the binder polymer is a resin having a carboxy group, the three-dimensional crosslinking density can be increased by, for example, adding a thermally crosslinkable compound such as a blocked isocyanate compound to thermally crosslink the resin. Furthermore, when the carboxy group of the resin having a carboxy group is anhydrous and hydrophobicized, the wet heat resistance can be improved.

[0063] The carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited as long as it satisfies the above-mentioned acid value requirement, and can be appropriately selected from known (meth)acrylic resins. For example, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the polymers described in paragraph

[0025] of JP-A No. 2011-095716, and carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the polymers described in paragraphs

[0033] to

[0052] of JP-A No. 2010-237589 can be preferably used.

[0064] Another preferred embodiment of the binder polymer is a styrene-acrylic copolymer. In the present disclosure, the term "styrene-acrylic copolymer" refers to a resin having structural units derived from a styrene compound and structural units derived from a (meth)acrylic compound. The total content of the structural units derived from the styrene compound and the structural units derived from the (meth)acrylic compound is preferably 30% by mass or more, more preferably 50% by mass or more, based on the total structural units of the copolymer. The content of the structural units derived from the styrene compound is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 5% to 80% by mass, based on the total structural units of the copolymer. The content of the structural units derived from the (meth)acrylic compound is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 20% to 95% by mass, based on the total structural units of the copolymer.

[0065] In order to obtain superior effects of the present disclosure, the binder polymer preferably has an aromatic ring structure, and more preferably has a structural unit having an aromatic ring structure. Examples of monomers that form structural units having an aromatic ring structure include monomers having an aralkyl group, styrene, and polymerizable styrene derivatives (e.g., methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, and styrene trimer). Among these, monomers having an aralkyl group or styrene are preferred. Examples of aralkyl groups include substituted or unsubstituted phenylalkyl groups (excluding benzyl groups) and substituted or unsubstituted benzyl groups, with substituted or unsubstituted benzyl groups being preferred.

[0066] Examples of the monomer having a phenylalkyl group include phenylethyl (meth)acrylate.

[0067] Examples of the monomer having a benzyl group include (meth)acrylates having a benzyl group, such as benzyl (meth)acrylate and chlorobenzyl (meth)acrylate, and vinyl monomers having a benzyl group, such as vinylbenzyl chloride and vinylbenzyl alcohol. Of these, benzyl (meth)acrylate is preferred.

[0068] Furthermore, the binder polymer more preferably has a structural unit represented by the following formula (S) (a structural unit derived from styrene), in terms of achieving better effects of the present disclosure.

[0069] [ka]

[0070] When the binder polymer has a structural unit having an aromatic ring structure, the content of the structural unit having an aromatic ring structure is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 70% by mass, and even more preferably 20% by mass to 60% by mass, based on the total structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0071] Furthermore, the content of the structural units having an aromatic ring structure in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 60 mol %, based on the total structural units of the binder polymer, in order to achieve better effects of the present disclosure.

[0072] Furthermore, the content of the structural unit represented by the above formula (S) in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, even more preferably 20 mol % to 60 mol %, and particularly preferably 20 mol % to 50 mol %, based on the total structural units of the binder polymer, in order to obtain better effects of the present disclosure.

[0073] In the present disclosure, when the content of a "structural unit" is specified by a molar ratio, the "structural unit" is considered to be synonymous with a "monomer unit." In addition, in the present disclosure, the "monomer unit" may be modified after polymerization by a polymer reaction or the like. The same applies hereinafter.

[0074] The binder polymer preferably has an aliphatic hydrocarbon ring structure in order to obtain better effects of the present disclosure. That is, the binder polymer preferably has a structural unit having an aliphatic hydrocarbon ring structure. The aliphatic hydrocarbon ring structure may be monocyclic or polycyclic. In particular, the binder polymer more preferably has a ring structure in which two or more aliphatic hydrocarbon rings are condensed.

[0075] Examples of the ring that constitutes the aliphatic hydrocarbon ring structure in the structural unit having an aliphatic hydrocarbon ring structure include a tricyclodecane ring, a cyclohexane ring, a cyclopentane ring, a norbornane ring, and an isoborone ring. Among these, in terms of achieving better effects of the present disclosure, a ring in which two or more aliphatic hydrocarbon rings are condensed is preferred, and a tetrahydrodicyclopentadiene ring (tricyclo[5.2.1.0]) is particularly preferred. 2,6 ]decane ring) is more preferred.

[0076] Examples of monomers that form a structural unit having an aliphatic hydrocarbon ring structure include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate.

[0077] Furthermore, in terms of achieving better effects of the present disclosure, the binder polymer more preferably has a constitutional unit represented by the following formula (Cy), and more preferably has a constitutional unit represented by the above formula (S) and a constitutional unit represented by the following formula (Cy).

[0078] [ka]

[0079] In the formula (Cy), RM represents a hydrogen atom or a methyl group, and R Cy represents a monovalent group having an aliphatic hydrocarbon ring structure.

[0080] R in formula (Cy) M is preferably a methyl group. R in formula (Cy) Cy is preferably a monovalent group having an aliphatic hydrocarbon ring structure having 5 to 20 carbon atoms, more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 6 to 16 carbon atoms, and even more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 8 to 14 carbon atoms, in terms of achieving better effects of the present disclosure.

[0081] Also, R in formula (Cy) Cy In terms of achieving better effects of the present disclosure, the aliphatic hydrocarbon ring structure in is preferably a cyclopentane ring structure, a cyclohexane ring structure, a tetrahydrodicyclopentadiene ring structure, a norbornane ring structure, or an isoborone ring structure, more preferably a cyclohexane ring structure or a tetrahydrodicyclopentadiene ring structure, and even more preferably a tetrahydrodicyclopentadiene ring structure.

[0082] Furthermore, R in formula (Cy) Cy In terms of achieving better effects of the present disclosure, the aliphatic hydrocarbon ring structure in is preferably a ring structure in which two or more aliphatic hydrocarbon rings are fused, and more preferably a ring in which two to four aliphatic hydrocarbon rings are fused.

[0083] Furthermore, R in formula (Cy) Cy is preferably a group in which the oxygen atom of —C(═O)O— in formula (Cy) is directly bonded to an aliphatic hydrocarbon ring structure, i.e., an aliphatic hydrocarbon ring group, more preferably a cyclohexyl group or a dicyclopentanyl group, and even more preferably a dicyclopentanyl group, in terms of achieving better effects of the present disclosure.

[0084] The binder polymer may have one type of structural unit having an aliphatic hydrocarbon ring structure, or two or more types of structural units.

[0085] When the binder polymer has a structural unit having an aliphatic hydrocarbon ring structure, the content of the structural unit having an aliphatic hydrocarbon ring structure is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, based on the total structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0086] Furthermore, the content of the structural units having an aliphatic hydrocarbon ring structure in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the binder polymer, in order to achieve better effects of the present disclosure.

[0087] Furthermore, the content of the structural unit represented by the above formula (Cy) in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the binder polymer, in order to obtain better effects of the present disclosure.

[0088] When the binder polymer has structural units having an aromatic ring structure and structural units having an aliphatic hydrocarbon ring structure, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 40% by mass to 75% by mass, relative to all structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0089] Furthermore, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure in the binder polymer is preferably 10 mol % to 80 mol %, more preferably 20 mol % to 70 mol %, and even more preferably 40 mol % to 60 mol %, based on the total structural units of the binder polymer, in order to achieve better effects of the present disclosure.

[0090] Furthermore, the total content of the structural units represented by the above formula (S) and the structural units represented by the above formula (Cy) in the binder polymer is preferably 10 mol % to 80 mol %, more preferably 20 mol % to 70 mol %, and even more preferably 40 mol % to 60 mol %, relative to all structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0091] Furthermore, in order to obtain better effects of the present disclosure, the molar amount nS of the constitutional unit represented by the above formula (S) and the molar amount nCy of the constitutional unit represented by the above formula (Cy) in the binder polymer preferably satisfy the relationship shown in the following formula (SCy), more preferably satisfy the following formula (SCy-1), and even more preferably satisfy the following formula (SCy-2). 0.2≦nS / (nS+nCy)≦0.8: Formula (SCy) 0.30≦nS / (nS+nCy)≦0.75: Formula (SCy-1) 0.40≦nS / (nS+nCy)≦0.70: Formula (SCy-2)

[0092] In order to obtain better effects of the present disclosure, the binder polymer preferably has a structural unit having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphonic acid group, and a phosphoric acid group, and the carboxy group is preferred. As the structural unit having the acid group, a structural unit derived from (meth)acrylic acid shown below is preferred, and a structural unit derived from methacrylic acid is more preferred.

[0093] [ka]

[0094] The binder polymer may have one type of structural unit having an acid group, or two or more types of structural units having an acid group.

[0095] When the binder polymer has a structural unit having an acid group, the content of the structural unit having an acid group is preferably 5% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 10% by mass to 30% by mass, based on the total structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0096] Furthermore, the content of the structural units having an acid group in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 50 mol %, and even more preferably 20 mol % to 40 mol %, based on the total structural units of the binder polymer, in order to obtain better effects of the present disclosure.

[0097] Furthermore, the content of the (meth)acrylic acid-derived structural units in the binder polymer is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 50 mol%, and even more preferably 20 mol% to 40 mol%, based on the total structural units of the binder polymer, in order to obtain better effects of the present disclosure.

[0098] In order to obtain superior effects of the present disclosure, the binder polymer preferably has a reactive group, and more preferably has a structural unit having a reactive group. As the reactive group, a radically polymerizable group is preferable, and an ethylenically unsaturated group is more preferable. Furthermore, when the binder polymer has an ethylenically unsaturated group, the binder polymer preferably has a structural unit having an ethylenically unsaturated group in a side chain. In the present disclosure, the "main chain" refers to the relatively longest bonding chain in the molecule of the polymer compound constituting the resin, and the "side chain" refers to an atomic group branched from the main chain.

[0099] The ethylenically unsaturated group is more preferably an allyl group or a (meth)acryloxy group.Examples of the structural unit having a reactive group include, but are not limited to, those shown below.

[0100] [ka]

[0101] The binder polymer may have one type of structural unit having a reactive group, or two or more types of structural units.

[0102] When the binder polymer has a structural unit having a reactive group, the content of the structural unit having a reactive group is preferably 5% by mass to 70% by mass, more preferably 10% by mass to 50% by mass, and even more preferably 20% by mass to 40% by mass, based on the total structural units of the binder polymer, in terms of achieving better effects of the present disclosure.

[0103] Furthermore, the content of the structural units having a reactive group in the binder polymer is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the binder polymer, in order to obtain better effects of the present disclosure.

[0104] Examples of a method for introducing a reactive group into a binder polymer include a method of reacting a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, or a sulfo group with a compound such as an epoxy compound, a blocked isocyanate compound, an isocyanate compound, a vinyl sulfone compound, an aldehyde compound, a methylol compound, or a carboxylic acid anhydride.

[0105] A preferred example of a method for introducing a reactive group into a binder polymer is to synthesize a polymer having a carboxy group by polymerization, and then react some of the carboxy groups of the resulting polymer with glycidyl (meth)acrylate by a polymerization reaction to introduce a (meth)acryloxy group into the polymer. This method allows for the production of a binder polymer having a (meth)acryloxy group in its side chain. The polymerization reaction is preferably carried out at a temperature of 70°C to 100°C, more preferably at a temperature of 80°C to 90°C. The polymerization initiator used in the polymerization reaction is preferably an azo-based initiator, and more preferably V-601 (trade name) or V-65 (trade name) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. The polymerization reaction is preferably carried out at a temperature of 80°C to 110°C. A catalyst such as an ammonium salt is preferably used in the polymerization reaction.

[0106] As the binder polymer, the polymers shown below are preferred in terms of achieving better effects of the present disclosure. Note that the content ratios (a to d) of the structural units shown below and the weight average molecular weight Mw can be changed appropriately depending on the purpose.

[0107] [ka]

[0108] The preferred ranges for the content ratios (a to d) of the above structural units are shown below. a: 20% by mass ~ 60% by mass b: 10% by mass ~ 50% by mass c: 5.0% by mass ~ 25% by mass d: 10% by mass to 50% by mass

[0109] [ka]

[0110] The preferred ranges for the content ratios (a to d) of the above structural units are shown below. a: 20% by mass ~ 60% by mass b: 10% by mass ~ 50% by mass c: 5.0% by mass ~ 25% by mass d: 10% by mass to 50% by mass.

[0111] [ka]

[0112] The preferred ranges for the content ratios (a to d) of the above structural units are shown below. a: 30% by mass ~ 65% by mass b: 1.0% by mass ~ 20% by mass c: 5.0% by mass ~ 25% by mass d: 10% by mass to 50% by mass

[0113] [ka]

[0114] The preferred ranges for the content ratios (a to d) of the above structural units are shown below. a: 1.0% by mass ~ 20% by mass b: 20% by mass ~ 60% by mass c: 5.0% by mass ~ 25% by mass d: 10% by mass to 50% by mass.

[0115] The binder polymer may also contain a polymer (hereinafter also referred to as "polymer X") having a structural unit having a carboxylic acid anhydride structure. The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, but is preferably a cyclic carboxylic acid anhydride structure. The ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5- or 6-membered ring, and even more preferably a 5-membered ring.

[0116] The structural unit having a carboxylic acid anhydride structure is preferably a structural unit containing, in its main chain, a divalent group obtained by removing two hydrogen atoms from a compound represented by the following formula P-1, or a structural unit in which a monovalent group obtained by removing one hydrogen atom from a compound represented by the following formula P-1 is bonded to the main chain directly or via a divalent linking group.

[0117] [ka]

[0118] In formula P-1, R A1a represents a substituent, n 1a R A1a may be the same or different, and Z 1a represents a divalent group forming a ring containing -C(=O)-OC(=O)-, and n 1a represents an integer greater than or equal to 0.

[0119] R A1a Examples of the substituent represented by the formula include an alkyl group.

[0120] Z 1a As the alkylene group, an alkylene group having 2 to 4 carbon atoms is preferable, an alkylene group having 2 or 3 carbon atoms is more preferable, and an alkylene group having 2 carbon atoms is even more preferable.

[0121] n 1a represents an integer greater than or equal to 0. Z 1a When represents an alkylene group having 2 to 4 carbon atoms, n 1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0.

[0122] n 1a If represents an integer of 2 or more, there are multiple R A1a may be the same or different. A1a may be bonded to each other to form a ring, but preferably do not bond to each other to form a ring.

[0123] As a structural unit having a carboxylic acid anhydride structure, a structural unit derived from an unsaturated carboxylic acid anhydride is preferred, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferred, a structural unit derived from an unsaturated aliphatic cyclic carboxylic acid anhydride is even more preferred, a structural unit derived from maleic anhydride or itaconic anhydride is particularly preferred, and a structural unit derived from maleic anhydride is most preferred.

[0124] Specific examples of structural units having a carboxylic acid anhydride structure are listed below, but the structural units having a carboxylic acid anhydride structure are not limited to these specific examples. In the following structural units, Rx represents a hydrogen atom, a methyl group, a CH2OH group, or a CF3 group, and Me represents a methyl group.

[0125] [ka]

[0126] [ka]

[0127] The structural unit having a carboxylic acid anhydride structure in the polymer X may be of one type alone or may be of two or more types.

[0128] The total content of structural units having a carboxylic acid anhydride structure relative to all structural units of polymer X is preferably 0 mol % to 60 mol %, more preferably 5 mol % to 40 mol %, and even more preferably 10 mol % to 35 mol %.

[0129] The photosensitive layer may contain only one type of polymer X, or may contain two or more types. .

[0130] When the photosensitive layer contains polymer X, the content of polymer X is preferably 0.1% by mass to 30% by mass, more preferably 0.2% by mass to 20% by mass, even more preferably 0.5% by mass to 20% by mass, and still more preferably 1% by mass to 20% by mass, relative to the total mass of the photosensitive layer, in order to obtain better effects of the present disclosure.

[0131] The weight average molecular weight (Mw) of the binder polymer is preferably 5,000 or more, more preferably 10,000 or more, further preferably 10,000 to 50,000, and particularly preferably 20,000 to 30,000, in terms of achieving better effects of the present disclosure.

[0132] From the viewpoint of developability, the dispersity of the binder polymer is preferably from 1.0 to 6.0, more preferably from 1.0 to 5.0, still more preferably from 1.0 to 4.0, and particularly preferably from 1.0 to 3.0.

[0133] The acid value of the binder polymer is preferably 10 mgKOH / g to 200 mgKOH / g, more preferably 60 mgKOH / g to 200 mgKOH / g, still more preferably 60 mgKOH / g to 150 mgKOH / g, and particularly preferably 70 mgKOH / g to 125 mgKOH / g. The acid value of the binder polymer is a value measured according to the method described in JIS K0070:1992.

[0134] The photosensitive layer may contain only one type of binder polymer, or may contain two or more types of binder polymer.

[0135] The content of the binder polymer is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 30% by mass to 70% by mass, relative to the total mass of the photosensitive layer, in order to obtain better effects of the present disclosure.

[0136] (Component: Polymerizable compound) The photosensitive layer may contain a polymerizable compound. The polymerizable compound is a compound having a polymerizable group. Examples of the polymerizable group include a radically polymerizable group and a cationic polymerizable group, with a radically polymerizable group being preferred. The photosensitive layer preferably contains a polymerizable compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group.

[0137] The polymerizable compound preferably contains a radical polymerizable compound having an ethylenically unsaturated group (hereinafter also simply referred to as "ethylenically unsaturated compound"). The ethylenically unsaturated group is preferably a (meth)acryloxy group. The ethylenically unsaturated compound in this specification is a compound other than the binder polymer, and preferably has a molecular weight of less than 5,000.

[0138] One preferred embodiment of the polymerizable compound is a compound represented by the following formula (M) (also simply referred to as "compound M"). Q 2 -R 1 -Q 1 :Formula(M) In formula (M), Q 1 and Q 2 each independently represents a (meth)acryloyloxy group, R 1 represents a divalent linking group having a chain structure.

[0139] Q in formula (M) 1 and Q 2 In terms of ease of synthesis, Q 1 and Q 2 It is preferable that Q in formula (M) are the same group. 1 and Q 2 is preferably an acryloyloxy group from the viewpoint of reactivity.

[0140] R in formula (M) 1 As the alkylene group, an alkyleneoxyalkylene group (-L 1 -OL 1 -), or a polyalkyleneoxyalkylene group (-(L 1 -O) p -L 1-) is preferred, a hydrocarbon group having 2 to 20 carbon atoms or a polyalkyleneoxyalkylene group is more preferred, an alkylene group having 4 to 20 carbon atoms is even more preferred, and a straight-chain alkylene group having 6 to 18 carbon atoms is particularly preferred. The hydrocarbon group may have a chain structure at least in part, and the portion other than the chain structure is not particularly limited, and may be, for example, a branched, cyclic, or straight-chain alkylene group having 1 to 5 carbon atoms, an arylene group, an ether bond, or a combination thereof. An alkylene group or a group combining two or more alkylene groups and one or more arylene groups is preferred, an alkylene group is more preferred, and a straight-chain alkylene group is even more preferred. It should be noted that the above L 1 each independently represents an alkylene group, preferably an ethylene group, a propylene group, or a butylene group, and more preferably an ethylene group or a 1,2-propylene group. p represents an integer of 2 or more, preferably an integer of 2 to 10.

[0141] Also, Q in compound M 1 and Q 2 The number of atoms in the shortest linking chain connecting "Q" and "Q" is preferably 3 to 50, more preferably 4 to 40, even more preferably 6 to 20, and particularly preferably 8 to 12, in terms of more excellent effects of the present disclosure. 1 and Q 2 The number of atoms in the shortest chain connecting the 1 Connect to R 1 Q from atoms in 2 Connect to R 1 is the shortest number of atoms that connects to the atom in

[0142] Specific examples of compound M include 1,3-butanediol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, di(meth)acrylate of hydrogenated bisphenol A, di(meth)acrylate of hydrogenated bisphenol F, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, poly(ethylene glycol / propylene glycol) di(meth)acrylate, and polybutylene glycol di(meth)acrylate. The above ester monomers can also be used as a mixture. Among the above compounds, in terms of achieving better effects of the present disclosure, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate is preferred, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,10-decanediol di(meth)acrylate is more preferred, and at least one compound selected from the group consisting of 1,9-nonanediol di(meth)acrylate and 1,10-decanediol di(meth)acrylate is even more preferred.

[0143] Furthermore, one preferred embodiment of the polymerizable compound is a difunctional or higher ethylenically unsaturated compound. In the present disclosure, "difunctional or higher ethylenically unsaturated compound" refers to a compound having two or more ethylenically unsaturated groups in one molecule. The ethylenically unsaturated group in the ethylenically unsaturated compound is preferably a (meth)acryloyl group. The ethylenically unsaturated compound is preferably a (meth)acrylate compound.

[0144] The bifunctional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. Examples of the bifunctional ethylenically unsaturated compound other than the compound M include tricyclodecane dimethanol di(meth)acrylate and 1,4-cyclohexanediol di(meth)acrylate.

[0145] Commercially available bifunctional ethylenically unsaturated compounds include tricyclodecane dimethanol diacrylate (trade name: NK Ester A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimenanol dimethacrylate (trade name: NK Ester DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (trade name: NK Ester A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (trade name: NK Ester A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0146] The tri- or higher functional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. Examples of tri- or higher functional ethylenically unsaturated compounds include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds having a glycerin tri(meth)acrylate skeleton. Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

[0147] Examples of the polymerizable compound include caprolactone-modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide-modified (meth)acrylate compounds (KAYARAD (registered trademark) RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Corporation, etc.), and ethoxylated glycerin triacrylate (NK Ester A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.).

[0148] The polymerizable compound also includes a urethane (meth)acrylate compound. Examples of the urethane (meth)acrylate include urethane di(meth)acrylate, such as propylene oxide-modified urethane di(meth)acrylate and ethylene oxide and propylene oxide-modified urethane di(meth)acrylate. Examples of the urethane (meth)acrylate also include trifunctional or higher urethane (meth)acrylate. The lower limit of the number of functional groups is more preferably 6 or more, and even more preferably 8 or more. The upper limit of the number of functional groups is preferably 20 or less. Examples of tri- or higher functional urethane (meth)acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), AH-600 (trade name) manufactured by Kyoeisha Chemical Co., Ltd., as well as UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

[0149] One preferred embodiment of the polymerizable compound is an ethylenically unsaturated compound having an acid group. Examples of the acid group include a phosphate group, a sulfo group, and a carboxy group. Among these, the carboxy group is preferred as the acid group.

[0150] Examples of the ethylenically unsaturated compound having an acid group include a tri- or tetrafunctional ethylenically unsaturated compound having an acid group [a compound having a carboxy group introduced into a pentaerythritol tri- or tetraacrylate (PETA) skeleton (acid value: 80 mg KOH / g to 120 mg KOH / g)], a penta- or hexafunctional ethylenically unsaturated compound having an acid group [a compound having a carboxy group introduced into a dipentaerythritol penta- or hexaacrylate (DPHA) skeleton (acid value: 25 to 70 mg KOH / g)], etc. These tri- or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with a difunctional ethylenically unsaturated compound having an acid group, if necessary.

[0151] The ethylenically unsaturated compound having an acid group is preferably at least one selected from the group consisting of difunctional or higher ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof. When the ethylenically unsaturated compound having an acid group is at least one selected from the group consisting of difunctional or higher ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof, developability and film strength are further improved. The difunctional or higher ethylenically unsaturated compound having a carboxy group is not particularly limited and can be appropriately selected from known compounds. Examples of difunctional or higher ethylenically unsaturated compounds having a carboxy group include Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and Aronix (registered trademark) M-510 (manufactured by Toagosei Co., Ltd.).

[0152] As the ethylenically unsaturated compound having an acid group, the polymerizable compound having an acid group described in paragraphs

[0025] to

[0030] of JP-A-2004-239942 is preferred, and the contents of this publication are incorporated herein by reference.

[0153] Examples of polymerizable compounds include compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid, compounds obtained by reacting a glycidyl group-containing compound with an α,β-unsaturated carboxylic acid, urethane monomers such as (meth)acrylate compounds having a urethane bond, phthalic acid compounds such as γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, and β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, and (meth)acrylic acid alkyl esters. These may be used alone or in combination of two or more.

[0154] Examples of compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid include bisphenol A-based (meth)acrylate compounds such as 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane; polyethylene glycol di(meth)acrylate having 2 to 14 ethylene oxide groups; polypropylene glycol di(meth)acrylate having 2 to 14 propylene oxide groups; polyethylene polypropylene glycol di(meth)acrylate having 2 to 14 ethylene oxide groups and 2 to 14 propylene oxide groups; Examples of the acrylate include trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate, trimethylolpropane diethoxy tri(meth)acrylate, trimethylolpropane triethoxy tri(meth)acrylate, trimethylolpropane tetraethoxy tri(meth)acrylate, trimethylolpropane pentaethoxy tri(meth)acrylate, di(trimethylolpropane) tetraacrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. Among these, ethylenically unsaturated compounds having a tetramethylolmethane structure or a trimethylolpropane structure are preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate is more preferred.

[0155] Examples of the polymerizable compound include caprolactone-modified ethylenically unsaturated compounds (e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd.), alkylene oxide-modified ethylenically unsaturated compounds (e.g., KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Corporation), and ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0156] As the polymerizable compound (particularly, an ethylenically unsaturated compound), one containing an ester bond is particularly preferred, as it provides excellent developability of the photosensitive layer after transfer. The ethylenically unsaturated compound containing an ester bond is not particularly limited as long as it contains an ester bond in the molecule, but in terms of providing excellent effects of the present disclosure, an ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure is preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate is more preferred.

[0157] From the viewpoint of providing reliability, the ethylenically unsaturated compound preferably contains an ethylenically unsaturated compound having an aliphatic group having 6 to 20 carbon atoms and the above-mentioned ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure. Examples of the ethylenically unsaturated compound having an aliphatic structure having 6 or more carbon atoms include 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and tricyclodecane dimethanol di(meth)acrylate.

[0158] One preferred embodiment of the polymerizable compound is a polymerizable compound having an aliphatic hydrocarbon ring structure (preferably a bifunctional ethylenically unsaturated compound). The polymerizable compound is preferably a polymerizable compound having a ring structure in which two or more aliphatic hydrocarbon rings are fused (preferably a structure selected from the group consisting of a tricyclodecane structure and a tricyclodecene structure), more preferably a bifunctional ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are fused, and even more preferably tricyclodecane dimethanol di(meth)acrylate. The aliphatic hydrocarbon ring structure is preferably a cyclopentane structure, a cyclohexane structure, a tricyclodecane structure, a tricyclodecene structure, a norbornane structure, or an isoborone structure, in terms of achieving superior effects of the present disclosure.

[0159] The molecular weight of the polymerizable compound is preferably from 200 to 3,000, more preferably from 250 to 2,600, still more preferably from 280 to 2,200, and particularly preferably from 300 to 2,200. Among the polymerizable compounds contained in the photosensitive layer, the content ratio of polymerizable compounds having a molecular weight of 300 or less is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, relative to the content of all polymerizable compounds contained in the photosensitive layer.

[0160] As one preferred embodiment of the photosensitive layer, the photosensitive layer preferably contains a difunctional or higher ethylenically unsaturated compound, more preferably a trifunctional or higher ethylenically unsaturated compound, and even more preferably a trifunctional or tetrafunctional ethylenically unsaturated compound.

[0161] In addition, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure and a binder polymer having a structural unit having an aliphatic hydrocarbon ring.

[0162] Furthermore, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a compound represented by Formula (M) and an ethylenically unsaturated compound having an acid group, more preferably 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, and even more preferably 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a succinic acid-modified product of dipentaerythritol pentaacrylate.

[0163] Furthermore, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a compound represented by Formula (M), an ethylenically unsaturated compound having an acid group, and a thermally crosslinkable compound described later, and more preferably contains a compound represented by Formula (M), an ethylenically unsaturated compound having an acid group, and a blocked isocyanate compound described later.

[0164] In addition, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a bifunctional ethylenically unsaturated compound (preferably a bifunctional (meth)acrylate compound) and a trifunctional or higher functional ethylenically unsaturated compound (preferably a trifunctional or higher functional (meth)acrylate compound) from the viewpoints of suppressing development residues and rust prevention.

[0165] The mass ratio of the content of the difunctional ethylenically unsaturated compound to the content of the tri- or higher functional ethylenically unsaturated compound is preferably 10:90 to 90:10, more preferably 30:70 to 70:30.

[0166] The content of the difunctional ethylenically unsaturated compound relative to the total amount of all ethylenically unsaturated compounds is preferably from 20 to 80% by mass, more preferably from 30 to 70% by mass.

[0167] The content of the difunctional ethylenically unsaturated compound in the photosensitive layer is preferably from 10% by mass to 60% by mass, more preferably from 15% by mass to 40% by mass.

[0168] In addition, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a compound M and a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure from the viewpoint of rust prevention.

[0169] In addition, as one preferred embodiment of the photosensitive layer, from the viewpoints of substrate adhesion, suppression of development residues, and rust prevention, the photosensitive layer preferably contains compound M and an ethylenically unsaturated compound having an acid group, more preferably contains compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, and an ethylenically unsaturated compound having an acid group, still more preferably contains compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, and an ethylenically unsaturated compound having an acid group, and particularly preferably contains compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, an ethylenically unsaturated compound having an acid group, and a urethane (meth)acrylate compound.

[0170] Furthermore, as one preferred embodiment of the photosensitive layer, from the viewpoints of substrate adhesion, suppression of development residues, and rust prevention, the photosensitive layer preferably contains 1,9-nonanediol diacrylate and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, more preferably 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, more preferably 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, dipentaerythritol hexaacrylate, and an ethylenically unsaturated compound having a carboxylic acid group, and particularly preferably 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, an ethylenically unsaturated compound having a carboxylic acid group, and a urethane acrylate compound.

[0171] The photosensitive layer may contain a monofunctional ethylenically unsaturated compound as the ethylenically unsaturated compound. The content of the difunctional or higher ethylenically unsaturated compound in the ethylenically unsaturated compound is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass, based on the total content of all ethylenically unsaturated compounds contained in the photosensitive layer.

[0172] The polymerizable compound (particularly, the ethylenically unsaturated compound) may be used alone or in combination of two or more kinds.

[0173] The content of the polymerizable compound (particularly, the ethylenically unsaturated compound) in the photosensitive layer is preferably 1% by mass to 70% by mass, more preferably 5% by mass to 70% by mass, even more preferably 5% by mass to 60% by mass, and particularly preferably 5% by mass to 50% by mass, relative to the total mass of the photosensitive layer.

[0174] (Component: Polymerization initiator) The photosensitive layer may contain a polymerization initiator, preferably a photopolymerization initiator.

[0175] The photopolymerization initiator is not particularly limited, and known photopolymerization initiators can be used. Examples of the photopolymerization initiator include a compound having an oxime ester structure (hereinafter also referred to as an "oxime-based photopolymerization initiator"), a compound having an α-aminoalkylphenone structure (hereinafter also referred to as an "α-aminoalkylphenone-based photopolymerization initiator"), a compound having an α-hydroxyalkylphenone structure (hereinafter also referred to as an "α-hydroxyalkylphenone-based photopolymerization initiator"), a compound having an acylphosphine oxide structure (hereinafter also referred to as an "acylphosphine oxide-based photopolymerization initiator"), a compound having a triarylimidazole structure (hereinafter also referred to as a "triarylimidazole-based photopolymerization initiator"), and a photopolymerization initiator having an N-phenylglycine structure (hereinafter also referred to as an "N-phenylglycine-based photopolymerization initiator"). The photosensitive layer preferably contains at least one photopolymerization initiator selected from the group consisting of compounds having an oxime ester structure, compounds having an α-hydroxyalkylphenone structure, compounds having an acylphosphine oxide structure, and compounds having a triarylimidazole structure.

[0176] Furthermore, as the photopolymerization initiator, for example, the polymerization initiators described in paragraphs

[0031] to

[0042] of JP 2011-95716 A and paragraphs

[0064] to

[0081] of JP 2015-014783 A may be used.

[0177] Commercially available photopolymerization initiators include 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyloxime) [trade name: IRGACURE® OXE-01, manufactured by BASF], 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) [trade name: IRGACURE® OXE-02, manufactured by BASF], IRGACURE® OXE03 (manufactured by BASF), IRGACURE® OXE04 (manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone [trade name: Omnirad® 379EG, manufactured by IGM Resins], and the like. BV], 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one [trade name: Omnirad® 907, IGM Resins BV], 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one [trade name: Omnirad® 127, IGM Resins BV], 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 [trade name: Omnirad® 369, IGM Resins BV], 2-hydroxy-2-methyl-1-phenylpropan-1-one [trade name: Omnirad® 1173, IGM Resins BV], 1-hydroxycyclohexyl phenyl ketone [trade name: Omnirad® 184, IGM Resins BV] BV)], 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad (registered trademark) 651, IGM Resins B.oxime esters [trade name: Lunar (registered trademark) 6, manufactured by DKSH Japan Co., Ltd.], 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-305, manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), 1,2-propanedione, 3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazol-3-yl]-, 2-(O-acetyloxime) (trade name: TR-PBG-305, manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), G-326 (manufactured by Changzhou Powerful Electronic New Materials Co., Ltd.), 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazol-3-yl)-propane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-391, manufactured by Changzhou Powerful Electronic New Materials Co., Ltd.), and APi-307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one, manufactured by Shenzhen UV-ChemTech Ltd.).

[0178] The photopolymerization initiator may be used alone or in combination of two or more. When two or more types are used, it is preferable to use an oxime-based photopolymerization initiator and at least one selected from an α-aminoalkylphenone-based photopolymerization initiator and an α-hydroxyalkylphenone-based polymerization initiator.

[0179] When the photosensitive layer contains a photopolymerization initiator, the content of the photopolymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, based on the total mass of the photosensitive layer, and the upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive layer.

[0180] (Component: Heterocyclic compound) The photosensitive layer may contain a heterocyclic compound. The heterocyclic ring contained in the heterocyclic compound may be either a monocyclic or polycyclic heterocyclic ring. Examples of heteroatoms contained in the heterocyclic compound include a nitrogen atom, an oxygen atom, and a sulfur atom. The heterocyclic compound preferably contains at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom, and a sulfur atom, and more preferably contains a nitrogen atom.

[0181] Examples of heterocyclic compounds include triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, benzoxazole compounds, and pyrimidine compounds. Among these, the heterocyclic compound is preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzimidazole compounds, and benzoxazole compounds, and more preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, and benzoxazole compounds.

[0182] Preferred specific examples of the heterocyclic compound are shown below. Examples of the triazole compound and benzotriazole compound include the following compounds.

[0183] [ka]

[0184] [ka]

[0185] Examples of the tetrazole compound include the following compounds.

[0186] [ka]

[0187] [ka]

[0188] Examples of the thiadiazole compound include the following compounds:

[0189] [ka]

[0190] Examples of the triazine compound include the following compounds:

[0191] [ka]

[0192] Examples of rhodanine compounds include the following compounds:

[0193] [ka]

[0194] Examples of the thiazole compound include the following compounds:

[0195] [ka]

[0196] Examples of the benzothiazole compound include the following compounds:

[0197] [ka]

[0198] Examples of the benzimidazole compound include the following compounds:

[0199] [ka]

[0200] [ka]

[0201] Examples of the benzoxazole compound include the following compounds:

[0202] [ka]

[0203] The heterocyclic compounds may be used alone or in combination of two or more.

[0204] When the photosensitive layer contains a heterocyclic compound, the content of the heterocyclic compound is preferably 0.01% by mass to 20.0% by mass, more preferably 0.10% by mass to 10.0% by mass, still more preferably 0.30% by mass to 8.0% by mass, and particularly preferably 0.50% by mass to 5.0% by mass, relative to the total mass of the photosensitive layer.

[0205] (Ingredient: Aliphatic thiol compound) The photosensitive layer may contain an aliphatic thiol compound. When the photosensitive layer contains the aliphatic thiol compound, the aliphatic thiol compound undergoes an ene-thiol reaction with the radical polymerizable compound having an ethylenically unsaturated group, thereby suppressing cure shrinkage of the formed film and alleviating stress.

[0206] As the aliphatic thiol compound, a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (i.e., a bifunctional or higher aliphatic thiol compound) is preferred. Among the above, as the aliphatic thiol compound, a polyfunctional aliphatic thiol compound is preferred from the viewpoint of the adhesion of the formed pattern (particularly the adhesion after exposure). In the present disclosure, a "polyfunctional aliphatic thiol compound" means an aliphatic compound having two or more thiol groups (also called "mercapto groups") in the molecule.

[0207] The polyfunctional aliphatic thiol compound is preferably a low molecular weight compound having a molecular weight of at least 100. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and even more preferably 150 to 1,000.

[0208] The number of functional groups in the polyfunctional aliphatic thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from the viewpoint of the adhesion of the pattern to be formed.

[0209] Examples of polyfunctional aliphatic thiol compounds include trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetrakis(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolethane tris(3-mercaptobutyrate), tris[(3-mercaptopropionyloxy)ethyl]isocyanurate, trimethylolpropane tris(3-mercaptopropionyloxy)ethyl ester), pentaerythritol tetrakis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,4-bis(3-mercaptobutyryloxy)butane, 1,2-ethanedithiol, 1,3-propanedithiol, 1,6-hexamethylenedithiol, 2,2'-(ethylenedithio)diethanethiol, meso-2,3-dimercaptosuccinic acid, and di(mercaptoethyl)ether.

[0210] Among the above, the polyfunctional aliphatic thiol compound is preferably at least one compound selected from the group consisting of trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, and 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

[0211] Examples of monofunctional aliphatic thiol compounds include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.

[0212] The photosensitive layer may contain one kind of aliphatic thiol compound alone, or may contain two or more kinds of aliphatic thiol compounds.

[0213] When the photosensitive layer contains an aliphatic thiol compound, the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5% by mass to 50% by mass, even more preferably 5% by mass to 30% by mass, and particularly preferably 8% by mass to 20% by mass, relative to the total mass of the photosensitive layer.

[0214] (Component: crosslinkable compound) The photosensitive layer preferably contains a crosslinkable compound from the viewpoints of the strength of the resulting cured film and the adhesiveness of the resulting uncured film.

[0215] The crosslinkable compound is preferably a thermally crosslinkable compound. In the present disclosure, a thermally crosslinkable compound having an ethylenically unsaturated group, which will be described later, is not considered an ethylenically unsaturated compound but is considered a thermally crosslinkable compound.

[0216] Examples of the thermally crosslinkable compound include epoxy compounds, oxetane compounds, methylol compounds, and blocked isocyanate compounds. Among these, blocked isocyanate compounds are preferred in terms of the strength of the resulting cured film and the adhesiveness of the resulting uncured film. Since blocked isocyanate compounds react with hydroxy groups and carboxy groups, for example, when at least one of the binder polymer and the radically polymerizable compound having an ethylenically unsaturated group has at least one of a hydroxy group and a carboxy group, the hydrophilicity of the formed film tends to decrease and the function as a protective film tends to be enhanced. Note that the blocked isocyanate compound refers to a "compound having a structure in which the isocyanate group of an isocyanate is protected (so-called masked) with a blocking agent."

[0217] The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably 100 to 160°C, and more preferably 130 to 150°C. The dissociation temperature of the blocked isocyanate means "the temperature of the endothermic peak accompanying the deprotection reaction of the blocked isocyanate when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter." As the differential scanning calorimeter, for example, a differential scanning calorimeter (Model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited thereto.

[0218] Examples of blocking agents having a dissociation temperature of 100°C to 160°C include active methylene compounds [malonic acid diesters (dimethyl malonate, diethyl malonate, di-n-butyl malonate, di-2-ethylhexyl malonate, etc.)], and oxime compounds (compounds having a structure represented by -C(=N-OH)- in the molecule, such as formaldoxime, acetaldoxime, acetoxime, methylethylketoxime, and cyclohexanoneoxime). Among these, as the blocking agent having a dissociation temperature of 100° C. to 160° C., at least one selected from oxime compounds is preferred from the viewpoint of storage stability, for example.

[0219] The blocked isocyanate compound preferably has an isocyanurate structure, for example, from the viewpoint of improving the brittleness of the film and improving the adhesion to the transfer target. A blocked isocyanurate compound having an isocyanurate structure can be obtained, for example, by protecting hexamethylene diisocyanate through isocyanuration. Among blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure in which an oxime compound is used as a blocking agent is preferred because it is easier to adjust the dissociation temperature to a preferred range and to reduce development residues than a compound not having an oxime structure.

[0220] The blocked isocyanate compound may have a polymerizable group. The polymerizable group is not particularly limited, and known polymerizable groups can be used, with a radical polymerizable group being preferred. Examples of the polymerizable group include ethylenically unsaturated groups such as (meth)acryloxy groups, (meth)acrylamide groups, and styryl groups, as well as groups having an epoxy group such as a glycidyl group. Among these, the polymerizable group is preferably an ethylenically unsaturated group, more preferably a (meth)acryloxy group, and even more preferably an acryloxy group.

[0221] Commercially available blocked isocyanate compounds can be used. Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP, etc. (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, etc., manufactured by Asahi Kasei Chemicals Corporation).

[0222] The crosslinkable compound may be used alone or in combination of two or more kinds.

[0223] When the photosensitive layer contains a crosslinkable compound, the content of the crosslinkable compound is preferably 1% by mass to 50% by mass, and more preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive layer.

[0224] (Ingredient: surfactant) The photosensitive layer may contain a surfactant. Examples of the surfactant include those described in paragraph

[0017] of Japanese Patent No. 4502784 and paragraphs

[0060] to

[0071] of JP-A-2009-237362. Preferred surfactants are nonionic surfactants, fluorine-based surfactants, and silicone-based surfactants.

[0225] Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-566, F-567, F-568, F-569, F-570, F-571, F-572, F-573, F-574, F-575, F-576, F-577, F-579, F-582, F-583, F-584, F-585, F-586, F-587, F-588, F-589, F-589, F-580, F-581 ...90, F-591, F-592, F-593, F-594, F-595, F-596, F-597, F-598, F-599, F-599, F-590, F -563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Futergent Examples include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation).

[0226] Also suitable for use as fluorosurfactants are acrylic compounds that have a molecular structure with a functional group containing a fluorine atom, and when heated, the functional group containing the fluorine atom is cleaved and the fluorine atom volatilizes. Examples of such fluorosurfactants include the Megafac DS series manufactured by DIC Corporation (The Chemical Daily, February 22, 2016; The Nikkei Business Daily, February 23, 2016), such as Megafac DS-21.

[0227] As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.

[0228] Furthermore, a block polymer can also be used as the fluorine-based surfactant.

[0229] Furthermore, as the fluorine-based surfactant, a fluorine-containing polymer compound containing a structural unit derived from a (meth)acrylate compound having a fluorine atom and a structural unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups, propyleneoxy groups) can also be preferably used.

[0230] As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used, such as Megafac RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0231] From the viewpoint of improving environmental friendliness, it is preferable that the fluorine-based surfactant be a surfactant derived from an alternative material to compounds having a linear perfluoroalkyl group having seven or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS).

[0232] Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), and Solsperse 20000 (all manufactured by Lubrizol Japan Corporation), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries Corporation), Paionin D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), and the like.

[0233] Examples of silicone surfactants include linear polymers consisting of siloxane bonds and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0234] Specific examples of silicone surfactants include DOWSIL 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Toray Dow Corning Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, and KF- 945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicones Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie), and the like.

[0235] The surfactants may be used alone or in combination of two or more.

[0236] When the photosensitive layer contains a surfactant, the content of the surfactant is preferably 0.01% by mass to 3.0% by mass, more preferably 0.01% by mass to 1.0% by mass, and even more preferably 0.05% by mass to 0.80% by mass, relative to the total mass of the photosensitive layer.

[0237] (Ingredient: Polymerization inhibitor) The photosensitive layer may contain a polymerization inhibitor. The polymerization inhibitor refers to a compound that has the function of delaying or inhibiting a polymerization reaction. As the polymerization inhibitor, for example, a known compound used as a polymerization inhibitor can be used.

[0238] Examples of the polymerization inhibitor include phenothiazine compounds such as phenothiazine, bis-(1-dimethylbenzyl)phenothiazine, and 3,7-dioctylphenothiazine; bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylenebis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl), 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, and pentaerythritol tetrakis 3-(3,5-di-te nitroso compounds or salts thereof such as 4-nitrosophenol, N-nitrosodiphenylamine, N-nitrosocyclohexylhydroxylamine, and N-nitrosophenylhydroxylamine; quinone compounds such as methylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, and 4-benzoquinone; phenol compounds such as 4-methoxyphenol, 4-methoxy-1-naphthol, and t-butylcatechol; and metal salt compounds such as copper dibutyldithiocarbamate, copper diethyldithiocarbamate, manganese diethyldithiocarbamate, and manganese diphenyldithiocarbamate. Among these, in terms of achieving better effects of the present disclosure, the polymerization inhibitor is preferably at least one selected from the group consisting of a phenothiazine compound, a nitroso compound or a salt thereof, and a hindered phenol compound, and more preferably phenothiazine, bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid], [ethylenebis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), p-methoxyphenol, and N-nitrosophenylhydroxylamine aluminum salt.

[0239] The polymerization inhibitor may be used alone or in combination of two or more kinds.

[0240] When the photosensitive layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.001% by mass to 5.0% by mass, more preferably 0.01% by mass to 3.0% by mass, and even more preferably 0.02% by mass to 2.0% by mass, relative to the total mass of the photosensitive layer. The content of the polymerization inhibitor is preferably 0.005% by mass to 5.0% by mass, more preferably 0.01% by mass to 3.0% by mass, and even more preferably 0.01% by mass to 1.0% by mass, relative to the total mass of the polymerizable compounds.

[0241] (Component: Hydrogen donor compound) The photosensitive layer may contain a hydrogen donor compound, which has the effects of further improving the sensitivity of the photopolymerization initiator to actinic rays and suppressing the inhibition of polymerization of the polymerizable compound by oxygen.

[0242] Examples of hydrogen donor compounds include amines and amino acid compounds.

[0243] Examples of amines include compounds described in MRSander et al., Journal of Polymer Society, Vol. 10, p. 3173 (1972), JP-B-44-020189, JP-A-51-082102, JP-A-52-134692, JP-A-59-138205, JP-A-60-084305, JP-A-62-018537, JP-A-64-033104, and Research Disclosure No. 33825. More specific examples include 4,4'-bis(diethylamino)benzophenone, tris(4-dimethylaminophenyl)methane (also known as leuco crystal violet), triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline. Among these, at least one amine selected from the group consisting of 4,4'-bis(diethylamino)benzophenone and tris(4-dimethylaminophenyl)methane is preferred in terms of achieving better effects of the present disclosure.

[0244] Examples of the amino acid compound include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine. Among these, N-phenylglycine is preferred as the amino acid compound in that it provides superior effects of the present disclosure.

[0245] Further, examples of the hydrogen donor compound include organometallic compounds (such as tributyltin acetate) described in JP-B-48-042965, hydrogen donors described in JP-B-55-034414, and sulfur compounds (such as trithiane) described in JP-A-6-308727.

[0246] The hydrogen donor compounds may be used alone or in combination of two or more.

[0247] When the photosensitive layer contains a hydrogen donor compound, the content of the hydrogen donor compound is preferably 0.01% by mass to 10.0% by mass, more preferably 0.01% by mass to 8.0% by mass, and even more preferably 0.03% by mass to 5.0% by mass, relative to the total mass of the photosensitive layer, from the viewpoint of improving the curing rate through a balance between the polymerization growth rate and chain transfer.

[0248] (Ingredient: Sensitizer) The photosensitive layer may contain a sensitizer. Examples of sensitizers include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds. The photosensitive layer preferably contains at least one sensitizer selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0249] The sensitizers may be used alone or in combination of two or more.

[0250] When the photosensitive layer contains a sensitizer, the content of the sensitizer is preferably 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass, relative to the total mass of the photosensitive layer, from the viewpoints of improving sensitivity to the light source and improving the curing rate through a balance between the polymerization rate and chain transfer.

[0251] (Ingredient: UV absorber) The photosensitive layer may contain an ultraviolet absorber, which allows a pattern to be obtained that has low ultraviolet transmittance.

[0252] Examples of ultraviolet absorbers include benzophenone compounds, benzotriazole compounds, benzoate compounds, salicylate compounds, triazine compounds, and cyanoacrylate compounds.

[0253] Examples of benzotriazole compounds include 2-(2H-benzotriazole-2-yl)-p-cresol, 2-(2H-benzotriazole-2-yl)-4-6-bis(1-methyl-1-phenylethyl)phenol, 2-[5-chloro(2H)-benzotriazole-2-yl]-4-methyl-6-(tert-butyl)phenol, 2-(2H-benzotriazole-yl)-4,6-di-tert-pentylphenol, and 2-(2H-benzotriazole-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol.

[0254] Examples of triazine compounds include 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[(hexyl)oxy]phenol, 2-[4-[(2-hydroxy-3-dodecyloxypropyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2-[4-[(2-hydroxy-3-tridecyloxypropyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, and 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-isooctyloxyphenyl)-s-triazine.

[0255] The photosensitive layer may contain one or more ultraviolet absorbers.

[0256] When the photosensitive layer contains an ultraviolet absorber, the content of the ultraviolet absorber is preferably 0.01% by mass to 5% by mass, and more preferably 0.01% by mass to 1% by mass, relative to the total mass of the photosensitive layer.

[0257] (Ingredients: Pigment) The photosensitive layer may contain a pigment. The pigment may be appropriately selected according to the desired hue, and may be selected from black pigments, white pigments, and pigments of chromatic colors other than black and white. In particular, when a black pattern is to be formed, a black pigment is preferably selected as the pigment.

[0258] As the black pigment, any known black pigment (such as an organic pigment or an inorganic pigment) can be appropriately selected as long as the effects of the present disclosure are not impaired. Among these, from the viewpoint of optical density, suitable black pigments include, for example, carbon black, titanium oxide, titanium carbide, iron oxide, titanium oxide, and graphite, with carbon black being particularly preferred. As the carbon black, from the viewpoint of surface resistance, carbon black at least a portion of the surface of which is coated with a resin is preferred.

[0259] From the viewpoint of dispersion stability, the particle size of the black pigment is preferably 0.001 μm to 0.1 μm, more preferably 0.01 μm to 0.08 μm, in terms of number average particle size. Here, the particle size refers to the diameter of a circle having the same area as the pigment particle, calculated from a photograph of the pigment particle taken with an electron microscope, and the number average particle size is the average value obtained by calculating the particle sizes of 100 random particles and averaging the particle sizes of the 100 particles.

[0260] As for the white pigment other than the black pigment, the white pigments described in paragraphs

[0015] and

[0114] of JP-A No. 2005-007765 can be used. Specifically, among the white pigments, inorganic pigments such as titanium oxide, zinc oxide, lithopone, precipitated calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, or barium sulfate are preferred, with titanium oxide or zinc oxide being more preferred, and titanium oxide being even more preferred. Rutile or anatase titanium oxide is more preferred as the inorganic pigment, with rutile titanium oxide being particularly preferred. The surface of the titanium oxide may be subjected to silica treatment, alumina treatment, titania treatment, zirconia treatment, or organic treatment, or two or more treatments may be performed. This suppresses the catalytic activity of the titanium oxide and improves heat resistance, fading resistance, and the like. From the viewpoint of reducing the thickness of the photosensitive layer after heating, the surface treatment of the titanium oxide is preferably at least one of alumina treatment and zirconia treatment, and particularly preferably both alumina treatment and zirconia treatment.

[0261] Furthermore, when the photosensitive layer is a colored resin layer, it is also preferable that the photosensitive layer further contains a chromatic pigment other than a black pigment and a white pigment from the viewpoint of transferability. When a chromatic pigment is contained, the particle size of the chromatic pigment is preferably 0.1 μm or less, more preferably 0.08 μm or less, in terms of better dispersibility. Examples of chromatic pigments include Victoria Pure Blue BO (Color Index (CI) 42595), Auramine (CI 41000), Fat Black HB (CI 26150), Monolight Yellow GT (CI Pigment Yellow 12), Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Hoster Balm Red ESB (CI Pigment Violet 19), Permanent Ruby FBH (CI Pigment Red 11), Fastel Pink B Supra (CI Pigment Red 81), Monastral Fast Blue (CI Pigment Red 146), Examples of pigments that can be used include CI Pigment Blue 15), Monolight Fast Black B (CI Pigment Black 1) and carbon, CI Pigment Red 97, CI Pigment Red 122, CI Pigment Red 149, CI Pigment Red 168, CI Pigment Red 177, CI Pigment Red 180, CI Pigment Red 192, CI Pigment Red 215, CI Pigment Green 7, CI Pigment Blue 15:1, CI Pigment Blue 15:4, CI Pigment Blue 22, CI Pigment Blue 60, CI Pigment Blue 64, and CI Pigment Violet 23. Of these, CI Pigment Red 177 is preferred.

[0262] When the photosensitive layer contains a pigment, the content of the pigment is preferably more than 3% by mass and not more than 40% by mass, more preferably more than 3% by mass and not more than 35% by mass, even more preferably more than 5% by mass and not more than 35% by mass, and particularly preferably 10% by mass or more and not more than 35% by mass, relative to the total mass of the photosensitive layer.

[0263] When the photosensitive layer contains pigments other than black pigments (white pigments and chromatic pigments), the content of the pigments other than black pigments is preferably 30% by mass or less, more preferably 1% by mass to 20% by mass, and even more preferably 3% by mass to 15% by mass, relative to the black pigment.

[0264] When the photosensitive layer contains a black pigment and is formed from a photosensitive composition, the black pigment (preferably carbon black) is preferably introduced into the photosensitive composition in the form of a pigment dispersion. The dispersion may be prepared by premixing the black pigment and a pigment dispersant, adding the resulting mixture to an organic solvent (or vehicle), and dispersing the mixture using a disperser. The pigment dispersant may be selected based on the pigment and solvent; for example, a commercially available dispersant may be used. The vehicle refers to the medium in which the pigment is dispersed when the pigment dispersion is prepared. It is liquid and contains a binder component that maintains the black pigment in a dispersed state and a solvent component (organic solvent) that dissolves and dilutes the binder component. The disperser is not particularly limited, and examples thereof include known dispersers such as a kneader, roll mill, attritor, super mill, dissolver, homomixer, and sand mill. Furthermore, fine pulverization may be achieved by mechanical grinding using frictional force. For details about dispersers and fine grinding, please refer to the descriptions in "Pigment Dictionary" (by Kunizo Asakura, 1st edition, Asakura Shoten, 2000, pp. 438, 310).

[0265] (Ingredients: Impurities) The photosensitive layer may contain a predetermined amount of impurities. Specific examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among these, halide ions, sodium ions, and potassium ions are likely to be mixed in as impurities, so the following contents are preferred.

[0266] The content of impurities in the photosensitive layer is preferably 80 ppm or less, more preferably 10 ppm or less, and even more preferably 2 ppm or less, by mass. The content of impurities can be 1 ppb or more or 0.1 ppm or more by mass.

[0267] Methods for keeping the impurity content within the above range include selecting raw materials for the photosensitive layer that contain a small amount of impurities, preventing impurities from being mixed in during the formation of the photosensitive layer, and removing them by washing. By using these methods, the amount of impurities can be kept within the above range.

[0268] The amount of impurities can be determined by known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.

[0269] The content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive layer is preferably low. The content of these compounds in the photosensitive layer is preferably 100 ppm or less by mass, more preferably 20 ppm or less, and even more preferably 4 ppm or less. The lower limit can be 10 ppb or more, and even more preferably 100 ppb or more, by mass. The content of these compounds can be reduced in the same manner as for the metal impurities described above. Furthermore, they can be quantified by known measurement methods.

[0270] The water content in the photosensitive layer is preferably 0.01% by mass to 1.0% by mass, and more preferably 0.05% by mass to 0.5% by mass, from the viewpoint of improving reliability and lamination properties.

[0271] (Component: Residual monomer) The photosensitive layer may contain residual monomers of each structural unit of the alkali-soluble resin. From the viewpoints of patterning ability and reliability, the content of the residual monomers is preferably 5,000 ppm by mass or less, more preferably 2,000 ppm by mass or less, and even more preferably 500 ppm by mass or less, based on the total mass of the alkali-soluble resin. There is no particular lower limit, but it is preferably 1 ppm by mass or more, and more preferably 10 ppm by mass or more.

[0272] From the viewpoints of patterning ability and reliability, the residual monomer content of each structural unit of the alkali-soluble resin is preferably 3,000 ppm by mass or less, more preferably 600 ppm by mass or less, and even more preferably 100 ppm by mass or less, relative to the total mass of the photosensitive layer. Although there is no particular lower limit, it is preferably 0.1 ppm by mass or more, and more preferably 1 ppm by mass or more.

[0273] The amount of residual monomers in the synthesis of an alkali-soluble resin by a polymer reaction is also preferably within the above range. For example, when the alkali-soluble resin is synthesized by reacting glycidyl acrylate with a carboxylic acid side chain, the content of glycidyl acrylate is preferably within the above range.

[0274] The amount of residual monomer can be measured by known methods such as liquid chromatography and gas chromatography.

[0275] (Ingredients: Other ingredients) The photosensitive layer may contain other components. Examples of the other components include colorants, antioxidants, and particles (e.g., metal oxide particles). Examples of the other components also include other additives described in paragraphs

[0058] to

[0071] of JP-A No. 2000-310706.

[0276] The particles are preferably metal oxide particles, and the metals in the metal oxide particles include metalloids such as B, Si, Ge, As, Sb, and Te.

[0277] The average primary particle diameter of the particles is preferably 1 to 200 nm, more preferably 3 to 80 nm, from the viewpoint of the transparency of the cured film. The average primary particle diameter of the particles is calculated by measuring the particle diameters of 200 random particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particles is not spherical, the particle diameter is determined as the longest side.

[0278] When the photosensitive layer contains particles, it may contain only one type of particles or two or more types of particles differing in metal type, size, etc.

[0279] The photosensitive layer does not contain particles, or if it does contain particles, the particle content is preferably more than 0 mass % and not more than 35 mass % relative to the total mass of the photosensitive layer; more preferably, the photosensitive layer does not contain particles or the particle content is more than 0 mass % and not more than 10 mass % relative to the total mass of the photosensitive composition; even more preferably, the photosensitive layer does not contain particles or the particle content is more than 0 mass % and not more than 5 mass % relative to the total mass of the photosensitive layer; even more preferably, the photosensitive layer does not contain particles or the particle content is more than 0 mass % and not more than 1 mass % relative to the total mass of the photosensitive layer; and particularly preferably, the photosensitive layer does not contain particles.

[0280] Examples of antioxidants include 3-pyrazolidones such as 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorohydroquinone; para-methylaminophenol, para-aminophenol, para-hydroxyphenylglycine, and para-phenylenediamine. Among these, 3-pyrazolidones are preferred, and 1-phenyl-3-pyrazolidone is more preferred, as they provide superior effects of the present disclosure. When the photosensitive layer contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and even more preferably 0.01% by mass or more, based on the total mass of the photosensitive layer. There is no particular upper limit, but 1% by mass or less is preferred.

[0281] (Thickness) From the viewpoint of resolution, the thickness of the photosensitive layer is preferably 30 μm or less, more preferably 20 μm or less, even more preferably 15 μm or less, particularly preferably 10 μm or less, and most preferably 5.0 μm or less. The lower limit is preferably 0.60 μm or more, more preferably 1.5 μm or more, in order to obtain a film having excellent strength when cured from the photosensitive layer. The thickness of the photosensitive layer can be calculated, for example, as the average value of any five points measured by cross-sectional observation using a scanning electron microscope (SEM).

[0282] (Other characteristics) The refractive index of the photosensitive layer is preferably from 1.41 to 1.59, more preferably from 1.47 to 1.56.

[0283] The photosensitive layer is preferably achromatic. Specifically, the total reflection (incident angle 8°, light source: D-65 (2° visual field)) is preferably in accordance with CIE1976 (L * ,a * ,b * ) color space, L * The value is preferably 10 to 90, and a * The value is preferably -1.0 to 1.0, and b * The value is preferably between -1.0 and 1.0.

[0284] The pattern obtained by curing the photosensitive layer (cured film of the photosensitive layer) is preferably achromatic. Specifically, the total reflection (incident angle 8°, light source: D-65 (2° field of view)) is preferably achromatic. * ,a * ,b * ) color space, the L * The value is preferably 10 to 90, and the pattern a * The value is preferably -1.0 to 1.0, and the b * The value is preferably between -1.0 and 1.0.

[0285] The visible light transmittance per 1.0 μm of film thickness of the photosensitive layer is preferably 80% or more, more preferably 90% or more, and most preferably 95% or more. It is preferable that the average transmittance at wavelengths of 400 nm to 800 nm, the minimum transmittance at wavelengths of 400 nm to 800 nm, and the transmittance at a wavelength of 400 nm all satisfy the above. Preferred transmittance values ​​include, for example, 87%, 92%, and 98%. The same applies to the transmittance per 1 μm of film thickness of the cured film of the photosensitive layer.

[0286] The moisture permeability of the pattern (cured film of the photosensitive layer) obtained by curing the photosensitive layer at a film thickness of 40 μm is 500 g / m from the viewpoint of rust prevention of the electrodes or wiring and reliability of the device. 2 / 24hr or less is preferable, and 300g / m 2 / 24hr or less is more preferable, and 100g / m 2 The moisture permeability is more preferably 1 / 24 hr or less. 2 After exposure to light at 1000 K, the photosensitive layer is post-baked at 145°C for 30 minutes to harden the photosensitive layer, and the moisture permeability is measured on the cured film. The moisture permeability is measured in accordance with the cup method of JIS Z0208. It is preferable that the moisture permeability is within the above range under any of the test conditions of 40°C temperature / 90% humidity, 65°C temperature / 90% humidity, and 80°C temperature / 95% humidity. Specific preferred values ​​are, for example, 80 g / m 2 / 24hr, 150g / m 2 / 24hr, 220g / m 2 / 24hr, etc.

[0287] The dissolution rate of the photosensitive layer in a 1.0% sodium carbonate aqueous solution is preferably 0.01 μm / sec or more, more preferably 0.10 μm / sec or more, and even more preferably 0.20 μm / sec or more, from the viewpoint of suppressing residues during development. From the viewpoint of pattern edge shape, the dissolution rate is preferably 5.0 μm / sec or less, more preferably 4.0 μm / sec or less, and even more preferably 3.0 μm / sec or less. Specific preferred values ​​include 1.8 μm / sec, 1.0 μm / sec, and 0.7 μm / sec. The dissolution rate per unit time of the photosensitive layer in a 1.0% by mass sodium carbonate aqueous solution is measured as follows: A photosensitive layer (with a film thickness of 1.0 to 10 μm) formed on a glass substrate and from which the solvent has been thoroughly removed is subjected to shower development using a 1.0% by mass sodium carbonate aqueous solution at 25°C until the photosensitive layer is completely dissolved (however, this is limited to a maximum of 2 minutes). The thickness is calculated by dividing the thickness of the photosensitive layer by the time it takes for the photosensitive layer to completely dissolve. If the layer does not completely dissolve in 2 minutes, the thickness is calculated in the same way from the amount of change in film thickness up to that point. For development, a 1 / 4MINJJX030PP shower nozzle manufactured by Ikeuchi Co., Ltd. is used, and the shower spray pressure is 0.08MPa. Under the above conditions, the shower flow rate per unit time is 1,800mL / min.

[0288] The dissolution rate of the cured film of the photosensitive layer (within the range of film thickness 1.0 to 10 μm) in a 1.0% aqueous solution of sodium carbonate is preferably 3.0 μm / sec or less, more preferably 2.0 μm / sec or less, even more preferably 1.0 μm / sec or less, and most preferably 0.2 μm / sec or less. The cured film of the photosensitive layer is obtained by exposing the photosensitive layer to i-rays at an exposure dose of 300 mJ / cm. 2 Specific preferred values ​​include, for example, 0.8 μm / sec, 0.2 μm / sec, and 0.001 μm / sec.

[0289] The swelling ratio of the photosensitive layer after exposure to a 1.0 mass % aqueous sodium carbonate solution is preferably 100% or less, more preferably 50% or less, and even more preferably 30% or less, from the viewpoint of improving pattern formability. The swelling ratio of the photosensitive layer after exposure to a 1.0 mass % aqueous sodium carbonate solution is measured as follows: A photosensitive layer (with a film thickness of 1.0 to 10 μm) formed on a glass substrate and from which the solvent has been thoroughly removed is irradiated with 500 mJ / cm using an ultra-high pressure mercury lamp. 2 The film is exposed to light (i-line measurement). The glass substrate is immersed in a 1.0 mass % sodium carbonate aqueous solution at 25°C, and the film thickness is measured after 30 seconds. The percentage increase in film thickness after immersion relative to the film thickness before immersion is then calculated. Specific preferred values ​​include, for example, 4%, 13%, and 25%.

[0290] From the viewpoint of pattern formation, the number of foreign particles with a diameter of 1.0 μm or more in the photosensitive layer should be 10 / mm 2 It is preferable that the number of particles is less than 5 / mm 2 The number of foreign particles is measured as follows: Five randomly selected regions (1 mm x 1 mm) on the surface of the photosensitive layer are visually observed using an optical microscope from the normal direction of the surface of the photosensitive layer, and the number of foreign particles with a diameter of 1.0 μm or more in each region is counted, and the arithmetic average of these is calculated as the number of foreign particles. A specific preferred numerical value is, for example, 0 particles / mm 2 , 1 piece / mm 2 , 4 pieces / mm 2 , 8 pieces / mm 2 The following can be mentioned:

[0291] From the viewpoint of preventing the generation of aggregates during development, 1.0 cm of 1.0 mass % sodium carbonate solution at 30°C was added to 1.0 liter of the solution. 3 The haze of the solution obtained by dissolving the photosensitive layer is preferably 60% or less, more preferably 30% or less, even more preferably 10% or less, and most preferably 1% or less. The haze is measured as follows. First, a 1.0% by mass aqueous solution of sodium carbonate is prepared, and the liquid temperature is adjusted to 30°C. 1.0 cm3 of sodium carbonate is added to 1.0 L of the aqueous solution of sodium carbonate.3 The photosensitive layer is added. The mixture is stirred at 30°C for 4 hours, taking care not to introduce air bubbles. After stirring, the haze of the solution in which the photosensitive layer has been dissolved is measured. The haze is measured using a haze meter (product name "NDH4000", manufactured by Nippon Denshoku Industries Co., Ltd.) with a liquid measurement unit and a dedicated liquid measurement cell with an optical path length of 20 mm. Specific preferred values ​​include, for example, 0.4%, 1.0%, 9%, and 24%.

[0292] [Protection film] The transfer film may include a protective film. As the protective film, a resin film having heat resistance and solvent resistance can be used, for example, a polyolefin film such as a polypropylene film or a polyethylene film, a polyester film such as a polyethylene terephthalate film, a polycarbonate film, and a polystyrene film. Alternatively, a resin film made of the same material as the temporary support may be used as the protective film. Among them, a polyolefin film is preferred as the protective film, a polypropylene film or a polyethylene film is more preferred, and a polyethylene film is even more preferred.

[0293] The thickness of the protective film is preferably 1 μm to 100 μm, more preferably 5 μm to 50 μm, still more preferably 5 μm to 40 μm, and particularly preferably 15 μm to 30 μm. The thickness of the protective film is preferably 1 μm or more in terms of excellent mechanical strength, and is preferably 100 μm or less in terms of relatively low cost.

[0294] In addition, the number of fisheyes with a diameter of 80 μm or more contained in the protective film is 5 / m 2 The following is preferable: "Fisheyes" are foreign matter, undissolved matter, oxidized degradation products, etc., that are trapped in the film when the material is thermally melted and then kneaded, extruded, biaxially stretched, cast, or other methods are used to produce the film.

[0295] The number of particles with a diameter of 3 μm or more contained in the protective film is 30 / mm 2 Preferably less than 10 pieces / mm 2 Less than 5 pieces / mm is more preferable. 2 The following is more preferable: Defects caused by irregularities due to particles contained in the protective film being transferred to the photosensitive layer or the conductive layer can be suppressed.

[0296] In order to provide good winding properties, the arithmetic mean roughness Ra of the surface of the protective film opposite to the surface in contact with the transfer layer is preferably 0.01 μm or more, more preferably 0.02 μm or more, and even more preferably 0.03 μm or more, and is preferably less than 0.50 μm, more preferably 0.40 μm or less, and even more preferably 0.30 μm or less.

[0297] In order to prevent defects during transfer, the surface roughness Ra of the protective film on the surface in contact with the transfer layer is preferably 0.01 μm or more, more preferably 0.02 μm or more, and even more preferably 0.03 μm or more, and is preferably less than 0.50 μm, more preferably 0.40 μm or less, and even more preferably 0.30 μm or less.

[0298] [Relationship between temporary support, photosensitive layer and protective film] It is preferred that the breaking elongation at 120°C of the cured film obtained by curing the photosensitive layer is 15% or more, the arithmetic mean roughness Ra of the surface of the temporary support facing the photosensitive layer is 50 nm or less, and the arithmetic mean roughness Ra of the surface of the protective film facing the photosensitive layer is 150 nm or less.

[0299] It is preferable that the following formula (1) is satisfied. X×Y<1500: Formula (1) In formula (1), X represents the breaking elongation (%) at 120°C of the cured film obtained by curing the photosensitive layer, and Y represents the arithmetic mean roughness Ra (nm) of the surface of the temporary support on the photosensitive layer side. X×Y is more preferably 750 or less. Specific values ​​of X include 18%, 25%, 30%, and 35%. Specific values ​​of X×Y include 4 nm, 8 nm, 15 nm, and 30 nm. Specific values ​​of X×Y include 150, 200, 300, 360, and 900.

[0300] The breaking elongation at 120°C of the cured film obtained by curing the photosensitive layer is preferably at least twice as large as the breaking elongation at 23°C.

[0301] The breaking elongation was measured by exposing a 20 μm thick photosensitive layer to 120 mJ / cm with an ultra-high pressure mercury lamp. 2 After curing by exposure, it is irradiated with a high-pressure mercury lamp at 400mJ / cm 2 The cured film is then subjected to additional exposure at 145°C for 30 minutes, and then subjected to a tensile test.

[0302] It is preferable that the following formula (2) is satisfied. Y≦Z: Formula (2) Here, in formula (2), Y represents the arithmetic mean roughness Ra (nm) of the surface of the temporary support on the photosensitive layer side, and Z represents the arithmetic mean roughness Ra (nm) of the surface of the protective film on the photosensitive layer side.

[0303] [Transfer film manufacturing method] The method for producing a transfer film is not limited as long as the desired transfer film can be obtained. The method for producing a transfer film preferably includes applying a photosensitive composition to a temporary support to form a coating film, and drying the coating film to form a photosensitive layer. According to the method described above, a transfer film including a temporary support and a photosensitive layer can be obtained. A transfer film further including a protective film may be produced by pressing the protective film onto the photosensitive layer. The method for producing a transfer film may include forming a photosensitive layer and a temporary support on the protective film in this order. In the method for producing a transfer film, a transfer film in a roll form may be produced by winding. The transfer film may be stored in a roll form. The transfer film in a roll form is provided in its original form to the lamination step in a roll-to-roll system described below.

[0304] The components of the photosensitive composition are determined depending on the components of the intended photosensitive layer. The photosensitive composition may contain a solvent in addition to the components constituting the photosensitive layer described above. The solvent is preferably an organic solvent. Examples of organic solvents include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, and 2-propanol. Furthermore, as the solvent, an organic solvent having a boiling point of 180°C to 250°C (high-boiling point solvent) can also be used, if necessary.

[0305] The solvents may be used alone or in combination of two or more.

[0306] The total solid content of the photosensitive composition is preferably 5% by mass to 80% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 5% by mass to 30% by mass, relative to the total mass of the photosensitive composition. That is, the content of the solvent in the photosensitive composition is preferably 20% by mass to 95% by mass, more preferably 60% by mass to 95% by mass, and even more preferably 70% by mass to 95% by mass, relative to the total mass of the photosensitive composition.

[0307] The viscosity of the photosensitive composition at 25°C is, for example, preferably 1 mPa·s to 50 mPa·s, more preferably 2 mPa·s to 40 mPa·s, and even more preferably 3 mPa·s to 30 mPa·s, from the viewpoint of coatability. The viscosity is measured using a viscometer. For example, a viscometer manufactured by Toki Sangyo Co., Ltd. (product name: VISCOMETER TV-22) can be suitably used. However, the viscometer is not limited to the above-mentioned viscometers.

[0308] The surface tension of the photosensitive composition at 25°C is, for example, preferably 5 mN / m to 100 mN / m, more preferably 10 mN / m to 80 mN / m, and even more preferably 15 mN / m to 40 mN / m, from the viewpoint of coatability. The surface tension is measured using a surface tensiometer. For example, a surface tensiometer manufactured by Kyowa Interface Science Co., Ltd. (product name: Automatic Surface Tensiometer CBVP-Z) can be suitably used. However, the surface tensiometer is not limited to the above-mentioned surface tensiometer.

[0309] Examples of methods for applying the photosensitive composition include printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (that is, slit coating).

[0310] Heat drying and vacuum drying are preferred methods for drying the coating film of the photosensitive composition. In the present disclosure, "drying" means removing at least a portion of the solvent contained in the composition. Examples of drying methods include natural drying, heat drying, and vacuum drying. The above methods can be applied alone or in combination.

[0311] The drying temperature is preferably 80° C. or higher, more preferably 90° C. or higher, and the upper limit is preferably 130° C. or lower, more preferably 120° C. or lower. Drying can also be performed by continuously changing the temperature.

[0312] The drying time is preferably 20 seconds or more, more preferably 40 seconds or more, and even more preferably 60 seconds or more. There is no particular upper limit, but the drying time is preferably 600 seconds or less, and more preferably 300 seconds or less.

[0313] The method for laminating the protective film and the photosensitive layer is not particularly limited, and known methods can be used. Examples of devices for laminating the protective film and the photosensitive layer include known laminators such as vacuum laminators and auto-cut laminators. The laminator is preferably equipped with any heatable roller such as a rubber roller and capable of applying pressure and heat.

[0314] [Uses of transfer film] The transfer film is used in the manufacture of a display panel substrate. The transfer film is preferably used in the manufacture of a display panel substrate described in the section "Display Panel" below. Preferred embodiments of the method of using the transfer film are described in the sections "Display Panel Substrate" and "Display Panel" below.

[0315] <Display panel substrate> Hereinafter, a display panel substrate according to one embodiment of the present disclosure will be described.

[0316] [Bulkhead] The display panel substrate includes partition walls that separate pixels. In the present disclosure, the term "partition walls that separate pixels" refers to partition walls that have the function and purpose of separating pixels. In other words, unless it is explicitly stated that the display panel substrate includes pixels, the term "partition walls that separate pixels" refers not only to partition walls that actually separate pixels, but also to partition walls that are intended to be disposed between pixels to separate them.

[0317] The softening temperature of the partition walls is preferably 300°C or higher, more preferably 350°C or higher, and even more preferably 400°C or higher. When the softening temperature of the partition walls is 300°C or higher, the thermal stability of the partition walls is improved. The improved thermal stability of the partition walls can reduce collapse and deformation of the partition walls. Therefore, according to the above embodiment, a display panel substrate including partition walls that are less likely to collapse and deform is provided. Furthermore, when the softening temperature of the partition walls is 300°C or higher, the partition walls are less likely to collapse and deform even when the aspect ratio of the partition walls is large. The upper limit of the softening temperature of the partition walls is not limited. The softening temperature of the partition walls may be 800°C or lower, 700°C or lower, 600°C or lower, or 500°C or lower. The softening temperature of the partition walls is measured by a method similar to the method for measuring the "softening temperature of the photosensitive layer after exposure" described above. The softening temperature of the partition walls is adjusted, for example, by the softening temperature of the components (preferably organic resin) of the partition walls. For example, an increase in the softening temperature of the organic resin tends to increase the softening temperature of the partition walls. When a photosensitive layer is used as the material of the partition walls, the elastic modulus of the partition walls may be adjusted by the composition of the photosensitive layer as described above. When a negative photosensitive layer is used as the material of the partition walls, the softening temperature of the partition walls may be adjusted by the degree of curing of the negative photosensitive layer.

[0318] The elastic modulus of the partition walls is preferably 2 GPa or more, more preferably 3 GPa or more, still more preferably 4 GPa or more, and particularly preferably 5 GPa or more. When the elastic modulus of the partition walls is 2 GPa or more, collapse and deformation of the partition walls are reduced. Furthermore, when the elastic modulus of the partition walls is 5 GPa or more, collapse and deformation of the partition walls are unlikely to occur even if the aspect ratio of the partition walls is large. From the viewpoint of suppressing cracks in the cured product, the elastic modulus of the partition walls is preferably 10 GPa or less, more preferably 9 GPa or less, and even more preferably 8 GPa or less. In the present disclosure, the "elastic modulus of the partition walls" means the elastic modulus of the partition walls at 25°C. The elastic modulus of the partition walls is measured with an atomic force microscope (AFM). The specific procedure is as follows. Measurement is performed in QNM mode using an atomic force microscope (for example, AFM Dimension Icon manufactured by Bruker). As a probe, for example, an RTESPA-150 (150 KHz, 5 N / m) is used. A total of five fields of view, each 2 μm square, are measured, and a total of 50 force curves are measured at 10 points per field of view. The elastic modulus is calculated from the slope of the return force curve (the region between 20% and 90% of the maximum load) using Hertz contact theory. A specific example of AFM probe calibration is as follows: The warpage sensitivity is calculated from the slope of the force curve measured in advance on a quartz substrate. The spring constant is calculated by measuring the thermal fluctuation of the probe. For example, the spring constant is calculated using the Thermal Tune method included in the Bruker AFM software. The tip curvature is calculated by measuring the shape of a tip curvature calibration sample (RM-12M: Ti Roughness Sample) and using, for example, the image analysis mode (Tip Qualification) included in the Bruker AFM software. The elastic modulus of the partition wall is adjusted, for example, by the elastic modulus of the partition wall components (preferably organic resin). For example, an increase in the elastic modulus of the organic resin tends to increase the elastic modulus of the partition wall. When a photosensitive layer is used as the material of the partition walls, the elastic modulus of the partition walls may be adjusted by the composition of the photosensitive layer as described above.When a negative photosensitive layer is used as the material of the partition walls, the elastic modulus of the partition walls may be adjusted by the degree of curing of the negative photosensitive layer.

[0319] From the viewpoint of reducing collapse and deformation of the partition walls, the double bond valence of the partition walls is preferably 2.0 mmol / g or less, more preferably 1.5 mmol / g or less, and even more preferably 1.0 mmol / g or less. The double bond valence of the partition walls is preferably 0.01 mmol / g or more, more preferably 0.05 mmol / g or more, and even more preferably 0.08 mmol / g or more. The double bond valence of the partition walls is measured by Fourier transform infrared spectroscopy (FT-IR). The double bond valence of the partition walls is adjusted, for example, by the composition of the partition walls and the composition of the material for the partition walls. When a negative photosensitive layer is used as the material for the partition walls, the double bond valence of the partition walls may be adjusted by the degree of curing of the negative photosensitive layer.

[0320] From the viewpoint of solvent resistance, the solubility of the partition walls in propylene glycol monomethyl ether acetate is preferably 0.1 g / L or less, more preferably 0.05 g / L or less, and even more preferably 0.01 g / L or less. The lower limit of the solubility of the partition walls in propylene glycol monomethyl ether acetate may be 0 g / L. The solubility is measured using propylene glycol monomethyl ether acetate at 25°C. The solubility of the partition walls is adjusted, for example, by the composition of the partition walls and the composition of the partition wall material. When a negative photosensitive layer is used as the material for the partition walls, the solubility of the partition walls may be adjusted by the degree of curing of the negative photosensitive layer.

[0321] From the viewpoint of light-blocking properties, the optical density of the partition walls is preferably 2.5 or more, more preferably 3.0 or more, and even more preferably 3.5 or more. The upper limit of the optical density of the partition walls may be 4.0, 4.5, or 5. The optical density of the partition walls is measured using a colorimeter.

[0322] From the viewpoint of light blocking properties and prevention of color mixing, the width of the partition wall is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more. From the viewpoint of high resolution (for example, an increase in the number of pixels), the width of the partition wall is preferably 10 μm or less, more preferably 8 μm or less, and even more preferably 6 μm or less.

[0323] From the viewpoint of increasing brightness (for example, increasing pixel filling), the height of the partition wall is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. Furthermore, the height of the partition wall is preferably 15 μm or more, and more preferably 20 μm or more. From the viewpoint of rectangularity of the partition wall shape, the height of the partition wall is preferably 35 μm or less, more preferably 30 μm or less, and even more preferably 25 μm or less.

[0324] From the viewpoint of achieving higher brightness and higher resolution, the ratio of the partition wall height to the partition wall width, i.e., the aspect ratio of the partition wall, is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more. From the viewpoint of reducing the collapse of the partition wall, the aspect ratio of the partition wall is preferably 10 or less, more preferably 9 or less, and even more preferably 8 or less. When the partition wall width is 1 μm or more, the aspect ratio of the partition wall is preferably set within the above range.

[0325] The cross-sectional shape of the partition wall may be, for example, a square, a rectangle, or a trapezoid.

[0326] The partition wall may have a single-layer structure or a multi-layer structure.

[0327] The partition walls are preferably a composition containing an organic resin. A composition containing an organic resin allows for easy adjustment of the partition wall properties. Furthermore, a composition containing an organic resin has excellent chemical stability and can form fine partition walls. The organic resin includes known organic resins. Examples of the organic resin include the binder polymers described in the "Photosensitive Layer" section above. Examples of the organic resin include polymers of the polymerizable compounds described in the "Photosensitive Layer" section above. The composition may contain other components in addition to the organic resin. Examples of the other components include the components described in the "Photosensitive Layer" section above (excluding the binder polymer). Specific examples of the other components are shown below. The composition may contain one or more components selected from the following components. However, the types of the other components are not limited to the specific examples below.

[0328] The composition may contain a nitrogen-containing compound. The type of the nitrogen-containing compound is not limited. The nitrogen-containing compound may be selected from the components of the photosensitive layer described in the "Photosensitive Layer" section above (e.g., polymerization initiators, sensitizers, and polymerization inhibitors).

[0329] The composition may contain a chlorine compound. The type of the chlorine compound is not limited. The chlorine compound may be selected from the components of the photosensitive layer (e.g., polymerization initiators) described in the "Photosensitive Layer" section above.

[0330] The composition may contain at least one compound selected from the group consisting of compounds having an oxime ester structure, compounds having an α-hydroxyalkylphenone structure, compounds having an acylphosphine oxide structure, and compounds having a triarylimidazole structure. Examples of such compounds include the polymerization initiators described in the above section on "Photosensitive Layer."

[0331] The composition may contain at least one compound selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds. Examples of such compounds include the sensitizers described above in the "Photosensitive Layer" section.

[0332] The composition may contain a compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group. Examples of such compounds include the polymerizable compounds described in the "Photosensitive Layer" section above.

[0333] The composition may contain an ultraviolet absorber. The ultraviolet absorber reduces the proportion of ultraviolet light that passes through the partition wall, and can prevent, for example, unintended color mixing when the display panel is used. Examples of the ultraviolet absorber include the ultraviolet absorbers described in the above section on "Photosensitive Layer."

[0334] The composition may contain a pigment, such as the pigments described above in the "Photosensitive Layer" section.

[0335] [Other components] The display panel substrate may include other components in addition to the partition walls. Examples of the other components include a light-shielding film, pixels, light-emitting elements, and a bonding substrate. However, the other components are not limited to the above specific examples and may be selected from known display panel components.

[0336] The display panel substrate preferably includes a light-shielding film covering at least a portion of the surface of the partition wall. The light-shielding film has the property of absorbing or reflecting light. The light-shielding film may have the property of absorbing and reflecting light. The light-shielding film can contribute to improving the luminous efficiency of the display panel and preventing color mixing. When the display panel substrate includes the above-mentioned light-shielding film, another layer may be disposed between the partition wall and the light-shielding film.

[0337] Examples of components of the light-shielding film include metals. Examples of metals include aluminum and nickel. The metals may be alloys. Examples of alloys include aluminum alloys and nickel alloys.

[0338] From the viewpoint of light-shielding properties, the thickness of the light-shielding film is preferably 10 nm or more, more preferably 50 nm or more, and even more preferably 100 nm or more. From the viewpoint of increasing the pixel filling amount, the thickness of the light-shielding film is preferably 500 nm or less, more preferably 300 nm or less, and even more preferably 200 nm or less.

[0339] The light-shielding film can be formed by, for example, sputtering, vapor deposition, or electroless plating.

[0340] The display panel substrate may include pixels. Specifically, the display panel substrate may include a plurality of pixels and partition walls separating the pixels from one another. In the present disclosure, the term "pixel" refers to the smallest unit that displays a color in a display image. The term "pixel" encompasses single-color pixels. For example, in a method of expressing a specific color by combining multiple colors (e.g., red, green, and blue), a region that displays one of the multiple colors may be referred to as a "pixel."

[0341] Examples of colors displayed by pixels include red, green, and blue. In other words, examples of pixels include pixels that display red, pixels that display green, and pixels that display blue. However, the colors displayed by pixels are not limited to the above specific examples. The colors displayed by pixels are determined, for example, depending on the method of expressing colors in the displayed image.

[0342] Examples of pixel components include phosphors, which will be described later, and quantum dots, which will be described later.

[0343] The types of pixel components are not limited. The pixel components are determined, for example, depending on the desired color display method. Examples of pixel components include a wavelength conversion layer and a light-emitting element. The pixel may also include other components as needed. Preferred embodiments of pixel components and combinations are described below. (1) The pixel includes a wavelength conversion layer. (2) The pixel includes a light-emitting element and a wavelength conversion layer. (3) The pixels contain light-emitting elements that emit visible light.

[0344] According to the embodiment shown in (1) above, the pixel can display a desired color by, for example, converting the wavelength of light emitted from a light source (e.g., a light-emitting element) to a specific wavelength using a wavelength conversion layer. According to the embodiment shown in (2) above, the pixel can display a desired color by, for example, converting the wavelength of light emitted from a light-emitting element to a specific wavelength using a wavelength conversion layer. According to the embodiment shown in (3) above, the pixel can display a desired color by, for example, visible light emitted from a light-emitting element.

[0345] The wavelength conversion layer can convert the wavelength of light incident on the wavelength conversion layer. The wavelength conversion layer may absorb or reflect a portion of the light incident on the wavelength conversion layer. The wavelength conversion layer may emit fluorescence. That is, the wavelength conversion layer may be a fluorescent layer. The wavelength conversion layer may absorb light having a wavelength of 500 nm or less and emit light having a wavelength longer than the absorbed wavelength. The wavelength conversion layer may convert ultraviolet light to visible light.

[0346] The wavelength conversion layer preferably contains a wavelength conversion material. The wavelength conversion layer may contain one or more wavelength conversion materials. Examples of wavelength conversion materials include phosphors. A wavelength conversion layer containing a phosphor can emit fluorescence by absorbing light. Phosphors include known phosphors. Examples of phosphors include organic phosphors and inorganic phosphors. Examples of wavelength conversion materials include the phosphors described in paragraphs

[0069] to

[0078] of WO 2018 / 186300. The contents of the above documents are incorporated herein by reference. Examples of wavelength conversion materials include quantum dots.

[0347] Examples of organic fluorescent materials include pyrromethene-based compounds, perylene-based compounds, porphyrin-based compounds, oxazine-based compounds, and pyrazine-based compounds.

[0348] Examples of inorganic phosphors include YAG (yttrium aluminum garnet) phosphors, TAG (terbium aluminum garnet) phosphors, and sialon phosphors. Examples of inorganic phosphors include Y2O3:Eu, YVO4:Eu, (Y,Gd)BO3:Eu, Y(P,V)O4:Eu, Y2O3S:Eu, Zn2GeO2:Mn, and BaAl 12 O 19 :Mn, Zn2SiO4:Mn, Zn2SiO4:Mn,As, Y3Al5O 12 :Ce, Gd2O2S:Tb, BaMgAl 14 O 23 :Eu, BaMgAl 16 O 27 :Eu, BaMg2Al 14O 24 :Eu and Y2SiO3:Ce.

[0349] Examples of quantum dot components include Si, Ge, Sn, Se, Te, B, C, P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, SiN, GeN, and AlO. The quantum dots may have a core-shell structure. Examples of quantum dots include those described in paragraphs

[0070] to

[0078] of International Publication No. 2018 / 186300, the contents of which are incorporated herein by reference.

[0350] The wavelength converting substance may be in the form of particles, for example, spherical particles, columnar particles, plate-like particles, and irregularly shaped particles.

[0351] The wavelength conversion layer may contain other components. Examples of other components include polymers. The polymers can function as binders. Examples of polymers include polyvinyl acetate, polyvinyl alcohol, ethyl cellulose, methyl cellulose, polyethylene, silicone resins (e.g., polymethylsiloxane and polymethylphenylsiloxane), polystyrene, butadiene / styrene copolymers, polystyrene, polyvinylpyrrolidone, polyamide, high molecular weight polyethers, copolymers of ethylene oxide and propylene oxide, polyacrylamide, and acrylic resins.

[0352] The wavelength converting layer is manufactured using, for example, a composition containing a wavelength converting material. The composition of the composition containing a wavelength converting material is determined, for example, depending on the composition of the target wavelength converting layer. The composition containing a wavelength converting material may be a resist material. The wavelength converting layer is usually manufactured by introducing the composition into a space defined by the partition wall. The wavelength converting layer may be manufactured by introducing the composition into the space defined by the partition wall and then curing the composition. The wavelength converting layer may be manufactured by introducing the composition into the space defined by the partition wall and then exposing and developing the composition.

[0353] The display panel substrate may include a light-emitting element. As described above, the light-emitting element may be a part of a pixel. The light-emitting element may be a component separate from the pixel. An example of the latter embodiment is a display panel substrate including a plurality of pixels, partition walls separating the pixels in the plurality of pixels, and a light-emitting element. The number of light-emitting elements in the display panel substrate may be one or two or more.

[0354] The type of light-emitting element is not limited. Examples of light-emitting elements include light-emitting diodes (LEDs). The light-emitting diodes (LEDs) may be light-emitting elements called micro LEDs or mini LEDs. The light-emitting diodes (LEDs) may be organic light-emitting diodes (OLEDs).

[0355] Light emitted from the light-emitting element includes ultraviolet light and visible light. Light-emitting elements that emit visible light include, for example, red light-emitting elements, green light-emitting elements, and blue light-emitting elements. The light-emitting element may be a light-emitting element that emits ultraviolet light or blue light. The light-emitting element may be a light-emitting element that emits light having a wavelength of 500 nm or less. The light-emitting element may be a light-emitting element that emits light having a wavelength of 10 nm to 500 nm. A light-emitting element that emits light having a short wavelength is suitable for use in combination with a wavelength conversion layer (preferably a fluorescent light-emitting layer).

[0356] The display panel substrate may include a bonding substrate. The bonding substrate can improve adhesion between the components. The bonding substrate or the material of the bonding substrate may have a property of exhibiting adhesiveness or tackiness when exposed to ultraviolet light or heat. The bonding substrate may be formed using a thermosetting or ultraviolet-curing adhesive.

[0357] [Manufacturing method for display panel substrate] There are no limitations on the manufacturing method of the display panel substrate as long as the desired display panel substrate can be obtained. In a preferred embodiment, the manufacturing method of the display panel substrate including partition walls separating pixels includes the steps of preparing a transfer film including a temporary support and a transfer layer including a photosensitive layer (hereinafter sometimes referred to as a "preparation step"); laminating the transfer film to a substrate and arranging the transfer layer and temporary support in this order on the substrate (hereinafter sometimes referred to as a "lamination step"); pattern-exposing the transfer layer (hereinafter sometimes referred to as an "exposure step"); and developing the transfer layer to form a pattern constituting the partition walls (hereinafter sometimes referred to as a "development step"). Hereinafter, an embodiment of each step will be described.

[0358] (preparation process) In the preparation step, a transfer film including a temporary support and a transfer layer including a photosensitive layer is prepared. The embodiment of the transfer film is described in the above section "Transfer Film." The embodiment of the transfer film is determined, for example, depending on the embodiment of the target display panel substrate (for example, the composition, characteristics, and dimensions of the partition walls). The preferred embodiment of the transfer film is the same as the preferred embodiment of the transfer film described in the above section "Transfer Film."

[0359] (Lamination process) In the laminating step, the transfer film and the substrate are laminated together, and the transfer layer and the temporary support are disposed on the substrate in this order. When the transfer film includes a protective film, the laminating step is performed after the protective film is peeled off.

[0360] Examples of the substrate include a resin substrate, a glass substrate, and a semiconductor substrate. Preferred embodiments of the substrate are described, for example, in paragraph

[0140] of International Publication No. 2018 / 155193. The contents of the above document are incorporated herein by reference. Preferred components of the resin substrate include, for example, cycloolefin polymer and polyimide. The thickness of the resin substrate is preferably 5 μm to 200 μm, and more preferably 10 μm to 100 μm.

[0361] In the laminating step, a known laminator (for example, a vacuum laminator or an auto-cut laminator) may be used. The laminating step preferably includes pressure bonding the transfer film and the substrate. Examples of pressure bonding methods include known transfer methods and laminating methods. In the pressure bonding, pressure and heat are preferably applied using a roll or the like. The laminating temperature is preferably, for example, 70°C to 130°C.

[0362] (Exposure process) In the exposure step, the transfer layer is subjected to pattern exposure. "Pattern exposure" refers to a form of pattern exposure, that is, exposure that forms exposed and non-exposed areas. The positional relationship between the exposed and non-exposed areas is determined, for example, depending on the shape of the target pattern. The transfer layer may be exposed from the temporary support side or from the substrate side.

[0363] Examples of light sources used in the exposure step include various lasers, light-emitting diodes (LEDs), ultra-high pressure mercury lamps, high pressure mercury lamps, and metal halide lamps.

[0364] Examples of wavelengths of the exposure light in the exposure step include 365 nm and 405 nm. The dominant wavelength of the exposure light is preferably 365 nm. The dominant wavelength is the wavelength with the highest intensity.

[0365] The exposure dose in the exposure process was 5 mJ / cm 2 ~200mJ / cm 2 and preferably 10 mJ / cm 2~200mJ / cm 2 It is more preferable that:

[0366] Preferred embodiments of the light source, exposure dose, and exposure method used for exposure are described, for example, in paragraphs

[0146] to

[0147] of WO 2018 / 155193, the contents of which are incorporated herein by reference.

[0367] (Development process) In the development process, the transfer layer is subjected to a development treatment to form a pattern that constitutes the partition walls. In the transfer layer containing a positive photosensitive layer, the exposed areas are removed and the non-exposed areas form a pattern. However, in the transfer layer containing a negative photosensitive layer, the non-exposed areas are removed and the exposed areas form a pattern.

[0368] The development treatment is preferably carried out using a developer. The developer is preferably an alkaline aqueous solution. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide). Examples of preferred developers include the developer described in paragraph

[0194] of WO 2015 / 093271.

[0369] Examples of the development method include puddle development, shower development, spin development, and dip development. Preferred development methods include the development method described in paragraph

[0195] of WO 2015 / 093271.

[0370] (Other processes) Depending on the form of the target display panel substrate, the method for manufacturing a display panel substrate may include other steps. Exemplary other steps are shown below. However, the other steps are not limited to the following specific examples.

[0371] The method for manufacturing a display panel base material may include peeling off a temporary support disposed on a substrate. The temporary support is preferably peeled off between the laminating step and the exposure step, or between the exposure step and the development step. The peeling method is not limited. The temporary support may be peeled off using a mechanism similar to the cover film peeling mechanism described in paragraphs

[0161] and

[0162] of JP 2010-072589 A.

[0372] The method for manufacturing a display panel substrate may include exposing the pattern. The method for manufacturing a display panel substrate may include heating the pattern. The method for manufacturing a display panel substrate may include exposing the pattern and heating the pattern. Heating the pattern is preferably performed after exposing the pattern. The exposure dose is 100 mJ / cm2. 2 ~5000mJ / cm 2 and preferably 200 mJ / cm 2 ~3000mJ / cm 2 The heating temperature is preferably 80° C. to 250° C., more preferably 90° C. to 160° C. The heating time is preferably 1 minute to 180 minutes, more preferably 10 minutes to 60 minutes.

[0373] The manufacturing method of a display panel substrate may include covering at least a portion of the surface of the pattern with a light-shielding film. The method for forming the light-shielding film is not limited. The method for forming the light-shielding film may be determined depending on the components and thickness of the light-shielding film. Examples of methods for forming the light-shielding film include sputtering, vapor deposition, and electroless plating. The light-shielding film other than the light-shielding film covering the surface of the pattern facing the region for forming pixels may be removed as necessary.

[0374] An exemplary method for manufacturing a display panel substrate is also described in the description of the method for manufacturing a display panel in the section "Display Panel" below. The display panel substrate may be manufactured based on the above-mentioned items and the items described in the section "Display Panel" below.

[0375] [Application] Examples of display panels to which the display panel substrate is applied include LED display panels, which may be LED display panels called micro LED display panels or mini LED display panels.

[0376] <Display panel> A display panel according to one embodiment of the present disclosure will be described below.

[0377] The display panel includes a display panel substrate according to the present disclosure. Preferred aspects of the display panel substrate are the same as those described above in the section "Display Panel Substrate."

[0378] The display panel may include other components in addition to the display panel substrate. The other components may be selected from known display panel components. Examples of the other components include a wiring substrate.

[0379] The wiring board may be a wiring board included in a known display panel. Examples of the wiring board include a wiring board including a substrate and a conductive layer. Examples of the substrate include a resin substrate, a glass substrate, and a semiconductor substrate. Examples of the conductive layer include a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer. Examples of the wiring board include a flexible printed circuit board (FPC). The wiring board may be electrically connected to other components (e.g., light-emitting elements).

[0380] Next, the configuration of a display panel will be described with reference to Fig. 1. Fig. 1 is a schematic enlarged cross-sectional view showing a display panel according to an embodiment. The display panel 100 shown in Fig. 1 includes a wiring substrate 10 and a display panel base material 20. The display panel base material 20 includes a bonding base material 30, a light-emitting element 40, a red pixel 50R, a green pixel 50G, a blue pixel 50B, and a partition wall 60.

[0381] 1, the display panel 100 includes a wiring substrate 10. The wiring substrate 10 is electrically connected to the light-emitting elements 40, and transmits signals for driving the light-emitting elements 40 to the light-emitting elements 40.

[0382] As shown in FIG. 1, the display panel 100 includes a bonding substrate 30. The bonding substrate 30 is disposed on the wiring substrate 10. Specifically, the bonding substrate 30 is disposed between the wiring substrate 10 and the display panel substrate 20. The bonding substrate 30 improves adhesion between the wiring substrate 10 and the display panel substrate 20. The bonding substrate 30 is formed using, for example, a thermosetting or ultraviolet-curing adhesive.

[0383] As shown in FIG. 1, the display panel 100 includes a light-emitting element 40. The light-emitting element 40 is disposed on a wiring substrate 10. Specifically, the light-emitting element 40 is disposed between the wiring substrate 10 and the pixels (50R, 50G, 50B). The light-emitting element 40 can emit light toward the pixels (50R, 50G, 50B). The light-emitting element 40 is a light-emitting diode (LED). A display panel using a light-emitting diode (LED) is called an LED display panel. However, the display panel according to the present disclosure is not limited to an LED display panel.

[0384] As shown in FIG. 1 , the display panel 100 includes a red pixel 50R, a green pixel 50G, and a blue pixel 50B. The red pixel 50R, the green pixel 50G, and the blue pixel 50B are disposed on the light-emitting element 40. Each pixel (50R, 50G, 50B) is surrounded by a partition 60 and separated from another pixel by the partition 60. Each pixel (50R, 50G, 50B) contains a phosphor. Each pixel (50R, 50G, 50B) functions as a wavelength conversion layer, specifically, a fluorescent light-emitting layer. Each pixel (50R, 50G, 50B) absorbs a portion of the light emitted from the light-emitting element 40 and emits fluorescence.

[0385] As shown in FIG. 1, the display panel 100 includes a partition 60. The partition 60 is disposed between two adjacent pixels to separate the pixels. The partition 60 is a composition containing an organic resin. The softening temperature of the partition 60 is adjusted to 300°C or higher. The cross-sectional shape of the partition 60 is rectangular. The aspect ratio of the partition 60 is represented by the ratio of the height L of the partition 60 to the width H of the partition 60. At least a portion of the surface of the partition 60 is covered with a light-shielding film (not shown). Specifically, the light-shielding film (not shown) covers the side surface of the partition 60, i.e., the surface facing the pixels.

[0386] Next, a method for manufacturing a display panel will be described with reference to Fig. 2. Fig. 2 is a schematic enlarged cross-sectional view showing a method for manufacturing the display panel shown in Fig. 1.

[0387] As shown in FIG. 2( a), partition walls 60 are formed on a substrate 70. The partition walls 60 are formed on the substrate 70 by photolithography using a transfer film. Specifically, a transfer film including a temporary support and a transfer layer including a photosensitive layer is bonded to the substrate 70, and the transfer layer and temporary support are then disposed on the substrate 70. As described above in the section "Display Panel Substrate," a pattern constituting the partition walls 60 is formed through exposure and development of the photosensitive layer disposed on the substrate 70. In FIG. 2( a), a light-shielding film is formed on the partition walls 60, thereby forming a light-shielding film that covers at least a portion of the surface of the partition walls 60. During the light-shielding film formation process, if necessary, the light-shielding film other than the light-shielding film covering the surface of the partition walls 60 facing the space for forming pixels may be removed.

[0388] As shown in FIG. 2(b), a red pixel 50R, a green pixel 50G, or a color pixel 50B is formed in each region defined by the partition walls. For example, the red pixel 50R is formed by applying a composition containing a red phosphor, exposing it to light, developing it, and heating it. For example, the green pixel 50G is formed by applying a composition containing a green phosphor, exposing it to light, developing it, and heating it. For example, the blue pixel 50B is formed by applying a composition containing a blue phosphor, exposing it to light, developing it, and heating it.

[0389] As shown in Fig. 2(c), the laminate obtained in the step shown in Fig. 2(b) is bonded to a bonding substrate 30 including a light-emitting element 40. Before bonding the laminate to the bonding substrate 30 including the light-emitting element 40, an adhesive may be applied to the bonding substrate 30. The bonding substrate 30 and the light-emitting element 40 are disposed on another substrate (not shown). The other substrate (not shown) is removed before bonding the display panel substrate 20 and the wiring substrate 10, which will be described later.

[0390] As shown in FIG. 2(d), the substrate 70 is removed to form the display panel base material 20, and then the display panel base material 20 and the wiring substrate 10 are bonded together to obtain the display panel 100.

[0391] As described above, FIG. 2 shows a method for manufacturing the display panel 100 by bonding each pixel (50R, 50G, 50B) and the partition wall 60 to the bonding base material 30 including the light-emitting elements 40. However, the display panel 100 may also be manufactured by forming the partition wall 60 on the bonding base material 30 including the light-emitting elements 40 by photolithography using a transfer film, and then forming each pixel (50R, 50G, 50B) by the method described above. Alternatively, the display panel 100 may be manufactured by arranging the partition wall 60, which has been previously formed by photolithography using a transfer film, on the bonding base material 30 including the light-emitting elements 40, and then forming each pixel (50R, 50G, 50B) by the method described above. [Example]

[0392] The present disclosure will be described in detail below with reference to examples. However, the present disclosure is not limited to the following examples. The details shown in the following examples (e.g., materials, amounts used, ratios, processing details, and processing procedures) may be changed as appropriate without departing from the spirit of the present disclosure.

[0393] <Production of Photosensitive Composition> Photosensitive compositions were prepared having the formulations shown in Table 1. In Table 1, the content of each component is expressed in parts by mass.

[0394] [Table 1]

[0395] Details of the binder polymers shown in Table 1 are shown in Table 2.

[0396] [Table 2]

[0397] The following abbreviations shown in Table 2 have the following meanings: "MAA": methacrylic acid "St": Styrene "MMA": methyl methacrylate "BzMA": benzyl methacrylate "GMA-MMA": A structural unit in which glycidyl methacrylate is added to a structural unit derived from methyl methacrylate. [Tg]: Glass transition temperature

[0398] The details of the polymerizable compounds shown in Table 1 are shown in Table 3.

[0399] [Table 3]

[0400] Example 1 [Transfer film manufacturing] A polyethylene terephthalate film (Lumirror 16KS40, manufactured by Toray Industries, Inc., thickness: 16 μm) was prepared as a temporary support. Photosensitive composition 1 was applied onto the temporary support and dried at 120°C for 3 minutes to form a photosensitive layer. A polyethylene terephthalate film (Lumirror 16KS40, manufactured by Toray Industries, Inc., thickness: 16 μm) was pressure-bonded to the photosensitive layer as a protective film. By the above procedure, a transfer film was obtained that included, in this order, a temporary support, a photosensitive layer, and a protective film. The photosensitive layer was a negative photosensitive layer, and had a thickness of 20 μm.

[0401] [Manufacturing of display panel substrates and display panels] Glass (Corning Eagle XG, thickness: 0.7 mm) was prepared as a substrate. After peeling the protective film from the transfer film, the transfer film and the substrate were bonded together under the following lamination conditions. The obtained laminate contained a substrate, a photosensitive layer, and a temporary support in this order. Rubber roller temperature: 80℃ Line pressure: 100N / cm Conveying speed: 2.0m / min

[0402] The photosensitive layer was subjected to pattern exposure through the temporary support using a proximity exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) equipped with an ultra-high pressure mercury lamp and a photomask at a dose of 140 mJ / cm. 2 The photosensitive layer was exposed to an exposure dose of (i-line). The photomask included a light-transmitting pattern for forming a pattern that constitutes the partition walls. The line width of the light-transmitting pattern formed on the photomask was set in 1 μm increments within a range of 1 μm to 10 μm.

[0403] After peeling off the temporary support from the laminate, the photosensitive layer was subjected to a developing process. Specifically, development was performed for 100 seconds using a 1% by mass aqueous solution of sodium carbonate (liquid temperature: 25°C) as the developer. Air was blown onto the pattern obtained by development to remove moisture.

[0404] The pattern was subjected to a heat treatment at 200° C. for 20 minutes. By the above procedure, a partition wall was formed (see, for example, FIG. 2(a)). The pattern constituting the partition wall formed an opening in plan view.

[0405] A light-shielding film was formed on the partition walls by sputtering. The light-shielding film was a thin aluminum film. The thickness of the light-shielding film was 50 nm. The light-shielding film except for the light-shielding film covering the surface of the partition walls facing the space for forming pixels was removed using a laser.

[0406] A resist material containing a red phosphor (Lumidot 610, manufactured by SIGMA-ALDRICH) was filled into the space defined by the partition wall (i.e., the opening), and then red pixels were formed through exposure, development, and heating processes (see, for example, FIG. 2(b)). Similarly, a green pixel was formed using a resist material containing a green phosphor (Lumidot 530, manufactured by SIGMA-ALDRICH), and a blue pixel was formed using a resist material containing a blue phosphor (Lumidot 480, manufactured by SIGMA-ALDRICH) (see, for example, FIG. 2(b)). Red, green, and blue pixels were formed by the above method. Each pixel was surrounded by a partition wall and separated from each other by the partition wall.

[0407] A bonding substrate material (specifically, an ultraviolet-curing adhesive) was applied onto a sapphire substrate on which a light-emitting diode was arranged as a light-emitting element. The bonding substrate material covering the light-emitting element was removed to expose a portion of the light-emitting element. The quartz glass substrate was bonded to the light-emitting element and bonding substrate. The bonding substrate material was hardened by irradiation with ultraviolet light, improving adhesion between the light-emitting element and the bonding substrate. The sapphire substrate was peeled off by laser lift-off, obtaining a bonding substrate containing the light-emitting element. The light-emitting element and bonding substrate were arranged on the quartz glass. On the quartz glass, the outer periphery of the light-emitting element was surrounded by the bonding substrate.

[0408] The partition walls and pixels arranged on the substrate were bonded to a bonding base material including light-emitting elements arranged on a quartz glass substrate. The quartz glass substrate and the substrate were peeled off from the resulting laminate by laser lift-off, thereby obtaining a display panel base material (see, for example, Figures 2(c) and 2(d)).

[0409] The display panel base material and the wiring substrate were bonded together to obtain a display panel (see, for example, FIG. 2(d)).

[0410] <Examples 2 to 3, 6 and Comparative Example 1> A transfer film, a display panel substrate, and a display panel were obtained in the same manner as in Example 1, except that the type of photosensitive composition was changed as shown in Table 4.

[0411] Example 4 A transfer film, a display panel substrate, and a display panel were obtained in the same manner as in Example 1, except that the thickness of the photosensitive layer was changed to 30 μm.

[0412] <Example 5> A transfer film, a display panel substrate, and a display panel were obtained in the same manner as in Example 1, except that the thickness of the photosensitive layer was changed to 10 μm.

[0413] <Evaluation: Resolution> The cross section of the pattern (i.e., barrier ribs) formed using the transfer film was observed using an electron microscope. The width and height of the appropriate barrier rib having the smallest width were measured to determine the aspect ratio of the barrier rib. An appropriate barrier rib means a barrier rib having a width comparable to the design value and having no defects in appearance. Based on the width W and aspect ratio R of the barrier rib, the resolution was evaluated according to the following criteria. The measurement and evaluation results are shown in Table 4.

[0414] [Resolution evaluation standard: width W] A: 1 μm ≦ W ≦ 4 μm B: 4 μm <W≦10μm

[0415] [Resolution evaluation criteria: aspect ratio R] A:5≦R B:1≦R<5 C:R<1

[0416] <Evaluation: Collapse and deformation) The partition walls of the display panel substrate were observed from above using an electron microscope, and collapse and deformation were evaluated according to the following criteria. The evaluation results are shown in Table 4. A: The bulkhead is not collapsed and is not serpentine. B: The partition wall is not collapsed and part of the partition wall is meandering. C: The bulkhead has fallen over or the entire bulkhead is meandering.

[0417] [Table 4]

[0418] In Table 4, the value listed in the "Transmittance of Photosensitive Wavelength" column indicates the transmittance at a wavelength of 365 nm. In Table 4, the value listed in the "Softening Temperature after Exposure" column indicates the softening temperature of the photosensitive layer exposed to light having a wavelength of 365 nm. The softening temperatures listed in Table 4 were measured using a Hitachi High-Tech Science AFM5100N SPM and an Anasys Instruments nano-TA local heating system according to the method described above. The elastic modulus listed in Table 4 was measured using a Bruker AFM Dimension Icon according to the method described above. The calibration of the AFM probe used to measure the elastic modulus is as follows: The warpage sensitivity was calculated as 66.74 nm / V from the slope of the force curve measured in advance on a quartz substrate. The spring constant was calculated by measuring the thermal fluctuation of the probe. Specifically, the spring constant was calculated to be 1.828 N / m using the Thermal Tune method included in the Bruker AFM software. The tip curvature was calculated to be 9.2 nm by measuring the shape of a tip curvature calibration sample (RM-12M: Ti Roughness Sample) and using the image analysis mode (Tip Qualification) included in the Bruker AFM software.

[0419] Regarding transfer films, Table 4 shows that increasing the transmittance of the photosensitive layer at the wavelength at which the photosensitive layer is sensitive improves resolution, allowing for the formation of finer patterns. Table 4 also shows that increasing the transmittance of the photosensitive layer at the wavelength at which the photosensitive layer is sensitive improves resolution, allowing for the formation of patterns with high aspect ratios. Furthermore, Table 4 shows that increasing the softening temperature of the photosensitive layer after exposure increases the softening temperature of the resulting pattern.

[0420] Regarding the display panel substrate including the partition walls separating the pixels, Table 4 shows that when the softening temperature of the partition walls is 300° C. or higher, the collapse and deformation of the partition walls is reduced. [Explanation of symbols]

[0421] 10: Wiring board 20: Display panel substrate 30: Bonding base material 40: Light emitting element 50R: Red pixels 50G: Green pixels 50B: Blue pixel 60: Bulkhead 70: Circuit board H: Height of the partition W: Width of the partition 100: Display panel

Claims

1. a partition wall separating pixels from each other; the partition wall is a composition containing an organic resin, The width of the partition wall is 1 μm or more, a ratio of the height of the partition wall to the width of the partition wall is 1 or more; The softening temperature of the partition walls is 300°C or higher, The elastic modulus of the partition wall is 4 GPa or more. Substrate for display panels.

2. 2. The display panel substrate according to claim 1, wherein the partition wall has a double bond valence of 2.0 mmol / g or less.

3. 3. The display panel substrate according to claim 1, wherein the partition walls have a double bond valence of 0.01 mmol / g or more.

4. 4. The display panel substrate according to claim 1, wherein the solubility of the partition walls in propylene glycol monomethyl ether acetate is 0.1 g / L or less.

5. 5. The display panel substrate according to claim 1, wherein the composition contains a nitrogen-containing compound.

6. 6. The display panel substrate according to claim 1, wherein the composition contains a chlorine compound.

7. 7. The display panel substrate according to claim 1, wherein the composition comprises at least one compound selected from the group consisting of a compound having an oxime ester structure, a compound having an α-hydroxyalkylphenone structure, a compound having an acylphosphine oxide structure, and a compound having a triarylimidazole structure.

8. The display panel substrate according to any one of claims 1 to 7, wherein the composition comprises at least one compound selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

9. The display panel substrate according to any one of claims 1 to 8, wherein the composition contains a compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group.

10. 10. The display panel substrate according to claim 1, wherein the composition contains an ultraviolet absorber.

11. The display panel substrate according to any one of claims 1 to 10, wherein the composition contains a pigment.

12. 12. The display panel substrate according to claim 1, wherein the partition walls have an optical density of 2.5 or more.

13. 13. The display panel substrate according to claim 1, further comprising a light-shielding film that covers at least a part of the surface of the partition wall.

14. The display panel substrate according to claim 13 , wherein the light-shielding film has a thickness of 50 nm or more.

15. A display panel comprising the display panel substrate according to any one of claims 1 to 14.

16. A method for manufacturing a display panel substrate, comprising partition walls separating pixels from each other, the partition walls being made of a composition containing an organic resin, the partition walls having a width of 1 μm or more, a ratio of a height of the partition walls to a width of 1 or more, a softening temperature of the partition walls being 300° C. or more, and a modulus of elasticity of the partition walls being 4 GPa or more, Preparing a transfer film including a temporary support and a transfer layer including a photosensitive layer; bonding the transfer film to a substrate, and arranging the transfer layer and the temporary support in this order on the substrate; patternwise exposing the transfer layer; performing a development process on the transfer layer to form a pattern that constitutes the partition walls; the photosensitive layer contains a binder polymer having an ethylenically unsaturated group; A method for manufacturing a display panel substrate.

17. 17. The ethylenically unsaturated group is an allyl group or a (meth)acryloxy group.

10. A method for producing the display panel substrate according to claim 9.

18. The method for producing a display panel base material according to claim 16 or 17, further comprising peeling off the temporary support disposed on the substrate.

19. The method for manufacturing a display panel substrate according to any one of claims 16 to 18, further comprising heating the partition walls.

20. 20. The method for manufacturing a display panel substrate according to claim 16, further comprising covering at least a part of a surface of the partition wall with a light-shielding film.

21. A temporary support; a transfer layer including a photosensitive layer, the softening temperature of the photosensitive layer after exposure is 300°C or higher; the elastic modulus of the partition wall formed by exposure and development using the photosensitive layer as a material is 4 GPa or more; Transfer film used in the manufacture of display panel substrates.

22. The transmittance of the photosensitive layer at a photosensitive wavelength is 30% or more. The transfer film according to claim 21, which is used in the production of a substrate for a display panel.

23. The transfer film according to claim 21 or 22, wherein the photosensitive layer contains a crosslinkable compound.

24. The transfer film according to any one of claims 21 to 23, wherein the photosensitive layer contains at least one photopolymerization initiator selected from the group consisting of a compound having an oxime ester structure, a compound having an α-hydroxyalkylphenone structure, a compound having an acylphosphine oxide structure, and a compound having a triarylimidazole structure.

25. The transfer film according to any one of claims 21 to 24, wherein the photosensitive layer contains at least one sensitizer selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

26. The transfer film according to any one of claims 21 to 25, wherein the photosensitive layer contains a polymerizable compound having at least one polymerizable group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group.

27. The transfer film according to any one of claims 21 to 26, wherein the photosensitive layer contains an ultraviolet absorber.

28. The transfer film according to any one of claims 21 to 27, wherein the photosensitive layer contains a pigment.

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