Substrate alignment device, substrate processing apparatus, substrate alignment method, and substrate processing method

Abstract

To provide a wafer alignment device capable of accurately aligning a wafer at a predetermined position with high precision, a wafer processing device, a wafer alignment method and a wafer processing method.SOLUTION: A wafer alignment device includes a first support member 11A and a second support member 11B which are disposed so as to be opposed to each other and separated in a planar view and respectively support an outer peripheral end of a wafer W from a position below the wafer W. The wafer alignment device also comprises a first pressing member 12B which is disposed so as to be opposed to the first support member 11A in the planar view and moves the wafer W by pressing a portion of the outer peripheral end of the wafer W in a first direction from the second support member 11B to the first support member 11A in a state where the wafer W is supported by the first and second support members 11A and 11B. The first support member 11A includes a movement limit part 202 for limiting movements of the wafer W in the first direction beyond a predetermined specific position e1.SELECTED DRAWING: Figure 18

Description

[Technical Field]

[0001] The present invention relates to a substrate alignment apparatus, a substrate processing apparatus, a substrate alignment method, and a substrate processing method. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates, such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral edge of the back surface of the wafer, a spin chuck that holds the central part of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central part of the back surface of the wafer is cleaned with the brush. The spin chuck then receives the wafer from the suction pads and rotates around a vertical axis (rotation axis) while holding the central part of the back surface of the wafer. In this state, the peripheral part of the back surface of the wafer is cleaned with the brush. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-described substrate cleaning apparatus, if the wafer is not accurately aligned when transferred from the suction pad to the spin chuck, the wafer will be held by the spin chuck with its center offset from the rotation axis. In this case, the substrate will rotate eccentrically when the spin chuck rotates. This causes turbulence in the airflow around the rotating substrate. Furthermore, the contact state of the brush with the peripheral backside edge of the wafer will vary depending on the rotation angle of the wafer. In these cases, it is difficult to uniformly clean the peripheral backside edge of the wafer. Therefore, when placing the wafer on the spin chuck, it is necessary to position the wafer with high precision relative to the spin chuck.

[0006] An object of the present invention is to provide a substrate alignment apparatus, a substrate processing apparatus, a substrate alignment method, and a substrate processing method that are capable of accurately positioning a substrate at a predetermined position with high precision. [Means for solving the problem]

[0007] (1) A substrate alignment device according to a first aspect of the present invention is a substrate alignment device for aligning a substrate, comprising: first and second support members that are arranged to face each other and spaced apart in a plan view and that support the outer peripheral edge of the substrate from a position below the substrate; a first pressing member that is arranged to face the first support member in a plan view and that, while the substrate is supported by the first and second support members, presses a portion of the outer peripheral edge of the substrate in a first direction from the second support member toward the first support member, thereby moving the substrate on the first and second support members; and a first pressing drive unit that drives the first pressing member. a second pressing member that is disposed so as to face the second support member in a plan view and that presses another portion of the outer peripheral end of the substrate in a second direction opposite to the first direction; a second pressing drive unit that drives the second pressing member; and a control unit. the first support member includes a movement limiting portion that limits movement of the substrate in the first direction beyond a predetermined position. The control unit controls the first pressing drive unit while the movement limiting unit is in the specified position to move the substrate supported on the first and second support members in the first direction and bring another portion of the substrate into contact with the movement limiting unit, and after the other portion of the substrate has come into contact with the movement limiting unit, controls the second pressing drive unit while the portion of the substrate supported by the first and second support members is pressed by the first pressing member to cause the second pressing member to press the other portion of the outer peripheral edge of the substrate in the second direction. .

[0008] In the substrate alignment device, the outer peripheral edge of the substrate is supported from below the substrate by first and second support members. In this state, a first pressing member presses the substrate in a first direction. This causes the substrate to move in the first direction on the first and second support members. At this time, the movement of the substrate is limited by a movement limiting unit so that it does not exceed a specified position.

[0009] As a result, the defined position is appropriately determined in accordance with the size of the substrate, and the substrate supported on the first and second support members can be positioned accurately and precisely at the predetermined position. Furthermore, according to the above configuration, the substrate is firmly fixed between the first pressing member and the second pressing member, so that the predetermined processing can be appropriately performed on the fixed substrate.

[0010] (2) The first support member may have a first inclined support surface capable of supporting the outer peripheral edge of the substrate and extending obliquely downward toward the second support member, and the second support member may have a second inclined support surface capable of supporting the outer peripheral edge of the substrate and extending obliquely downward toward the first support member.

[0011] In this case, when the substrate is supported on the first and second support members, the contact area between the first and second support members and the substrate can be reduced, thereby reducing the transfer of contaminants and the like, and reducing the deterioration of the cleanliness of the substrate.

[0012] (3) Each of the first and second support members may be configured to be movable in a direction parallel to the first direction, and the substrate alignment device may further include a first support drive unit that drives the first support member and a second support drive unit that drives the second support member.

[0013] In this case, by appropriately adjusting the distance between the first and second support members, the substrate supported by the first and second support members can be smoothly moved to a position below the first and second support members. In addition, since the distance between the first and second support members can be adjusted according to the size of the substrate, the range of substrate sizes that can be aligned is expanded.

[0016] (4 ) Each of the first and second pressing members may be configured to be movable in a first direction and a second direction. In this case, by appropriately adjusting the distance between the first pressing member and the second pressing member, it is possible to easily switch between a state in which the substrate is firmly fixed and a state in which the substrate is not firmly fixed. In addition, the distance between the first and second pressing members can be adjusted according to the size of the substrate. This expands the range of substrate sizes that can be fixed between the first pressing member and the second pressing member.

[0017] ( 5 ) The control unit Second pressing drive unit By controlling After the second pressing member presses the other portion of the substrate in the second direction, and before the first pressing member moves away from the portion of the substrate. The second pressing member is Separated from other parts Let me Good too.

[0018] In this case, the second pressing member moves away from the other portions of the substrate, so that only the pressing force from the first pressing member acts on the substrate. As a result, the substrate moves in the first direction. In this state, the movement of the substrate is limited by the movement limiting portion so that it does not exceed the specified position. Therefore, even after the substrate is fixed by the first and second pressing members, the substrate can be accurately and easily positioned at a predetermined position with high precision.

[0019] ( 6 ) The first pressing member may include a first contact surface that contacts a portion of the substrate and a first upper end protrusion that protrudes in a first direction from an upper end of the first contact surface, and the second pressing member may include a second contact surface that contacts another portion of the substrate and a second upper end protrusion that protrudes in a second direction from an upper end of the second contact surface.

[0020] When a portion of the substrate and another portion thereof are pressed simultaneously by the first and second pressing members, the substrate may be deformed. Even in such a case, the portion of the substrate is held between the second support member and the first upper end protrusion of the first pressing member. The other portion of the substrate is held between the first support member and the second upper end protrusion of the second pressing member. Therefore, the substrate is prevented from coming out from between the first and second pressing members.

[0021] ( 7 A substrate processing apparatus according to a second aspect of the present invention includes the substrate alignment device described above, thereby enabling substrates to be processed appropriately.

[0022] ( 8 A substrate alignment method according to a third aspect of the present invention is a substrate alignment method for aligning a substrate, the method comprising the steps of: placing the substrate on first and second support members that are arranged to face each other but spaced apart in a plan view, and using the first and second support members to support an outer circumferential edge of the substrate from a position below the substrate; and, with the substrate supported by the first and second support members, pressing a portion of the outer circumferential edge of the substrate in a first direction from the second support member toward the first support member with a first pressing member that is arranged to face the first support member in a plan view, thereby moving the substrate on the first and second support members. Includes , The first support member includes a movement limiting portion that limits movement of the substrate in the first direction beyond a predetermined specified position, and the step of moving the substrate includes moving the substrate supported on the first and second support members in the first direction with the movement limiting portion at the specified position and abutting another portion of the outer peripheral edge of the substrate against the movement limiting portion, and the substrate alignment method further includes a step of, after the other portion of the substrate abuts against the movement limiting portion, pressing the other portion of the substrate in a second direction opposite to the first direction with a second pressing member arranged to face the second support member in a plan view with the portion of the substrate supported by the first and second support members pressed by the first pressing member. .

[0023] In the substrate alignment method, the outer peripheral edge of the substrate is supported from below the substrate by first and second support members. In this state, a first pressing member presses the substrate in a first direction. As a result, the substrate moves in the first direction on the first and second support members. At this time, the movement of the substrate is limited by a movement limiting unit so that it does not exceed a specified position.

[0024] As a result, the defined position is appropriately determined in accordance with the size of the substrate, and the substrate supported on the first and second support members can be positioned accurately and precisely at the predetermined position. Furthermore, according to the above method, the substrate is firmly fixed between the first pressing member and the second pressing member, so that the fixed substrate can be appropriately subjected to a predetermined process.

[0025] ( 9 The substrate alignment method may further include a step of moving each of the first and second support members in a direction parallel to the first direction. In this case, by appropriately adjusting the distance between the first and second support members, the substrate supported by the first and second support members can be smoothly moved to a position below the first and second support members. In addition, since the spacing between the first and second support members can be adjusted according to the size of the substrate, the range of substrate sizes that can be aligned is expanded.

[0028] ( 10 ) The substrate alignment method may further include the step of moving the first and second pressing members in a first direction and a second direction, respectively.

[0029] In this case, by appropriately adjusting the distance between the first and second pressing members, it is possible to easily switch between a state in which the substrate is firmly fixed and a state in which the substrate is not firmly fixed. Also, the distance between the first and second pressing members can be adjusted according to the size of the substrate. Therefore, the range of sizes of substrates that can be fixed between the first and second pressing members is expanded.

[0030] ( 11 ) The substrate alignment method may further include a step of, after the second pressing member presses the other portion of the substrate in the second direction, moving the second pressing member away from the other portion before the first pressing member moves away from the portion of the substrate.

[0031] In this case, the second pressing member moves away from the other portions of the substrate, so that only the pressing force from the first pressing member acts on the substrate. As a result, the substrate moves in the first direction. In this state, the movement of the substrate is limited by the movement limiting portion so that it does not exceed the specified position. Therefore, even after the substrate is fixed by the first and second pressing members, the substrate can be accurately and easily positioned at a predetermined position with high precision.

[0032] ( 12 ) A substrate processing method according to a fourth aspect of the present invention includes the substrate alignment method described above, thereby enabling the substrate to be processed appropriately. [Effects of the Invention]

[0033] According to the present invention, it is possible to accurately position a substrate at a predetermined position with high precision. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus of FIG. [Figure 3] FIG. 3 is an external perspective view of the lower chuck of FIGS. 1 and 2. [Figure 4] FIG. 3 is an external perspective view of the upper chuck of FIGS. 1 and 2. [Figure 5] FIG. 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus. [Figure 6] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 7] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 8] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 9] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 10] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 11] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 12] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 13] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 14] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 15] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 16] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 17] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 18] 10A and 10B are schematic side views for explaining in detail the holding and releasing operations of the substrate by the upper holding device. [Figure 19] 10A and 10B are schematic side views for explaining in detail the holding and releasing operations of the substrate by the upper holding device. DETAILED DESCRIPTION OF THE INVENTION

[0035] The following describes a substrate alignment apparatus, substrate processing apparatus, substrate alignment method, and substrate processing method according to embodiments of the present invention with reference to the drawings. In the following description, the term "substrate" refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape. Furthermore, in the following description, a substrate cleaning apparatus for cleaning substrates will be described as an example of a substrate processing apparatus equipped with the substrate alignment apparatus of the present invention.

[0036] 1.Configuration of substrate cleaning equipment FIG. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of FIG. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationships. In FIG. 1 and certain figures following FIG. 2, the X, Y, and Z directions are indicated by appropriate arrows. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the vertical direction.

[0037] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0038] The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is an loading / unloading opening 2x for the substrate W, and is used when loading and unloading the substrate W into and from the unit housing 2. In FIG. 2, the loading / unloading opening 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading opening 2x toward the outside of the unit housing 2 (the direction from the side wall 2c toward the side wall 2b) is referred to as the front, and the opposite direction (the direction from the side wall 2b toward the side wall 2c) is referred to as the rear.

[0039] An opening / closing device 90 is provided in the portion of the side wall 2b where the loading / unloading opening 2x is formed and in the area nearby. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0040] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided to extend in the Y direction from near the side wall portion 2b to near the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0041] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck, and has a circular suction surface that can suction-hold the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In the following description, when the substrate W is suction-held by the suction holding unit 21, the region of the lower surface of the substrate W that should be suctioned by the suction surface of the suction holding unit 21 is referred to as a lower surface central region. On the other hand, the region of the lower surface of the substrate W that surrounds the lower surface central region is referred to as a lower surface outer region.

[0042] The suction hold driving unit 22 includes a motor. The motor of the suction hold driving unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction hold unit 21 is attached to the upper end of the rotation shaft of the suction hold driving unit 22. A suction path is formed on the rotation shaft of the suction hold driving unit 22 to allow the suction hold unit 21 to suction and hold the substrate W. The suction path is connected to an air suction device (not shown). The suction hold driving unit 22 rotates the suction hold unit 21 around the rotation shaft.

[0043] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of (three in this example) support pins 41, a pin connecting member 42, and a pin lifting / lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view and connects the plurality of support pins 41. The plurality of support pins 41 extend upward by a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting / lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0044] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in FIG. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be able to move up and down. The lifting support unit 54 has an upper surface 54u that slopes obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0045] 1, the lower surface brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. The diameter of the lower surface brush 51 is also larger than 1 / 3 and smaller than 1 / 2 of the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0046] The lower surface brush 51 has a cleaning surface that can come into contact with the lower surface of the substrate W. The lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0047] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lifting support part 54 so as to be located near the lower surface brush 51 and so that the liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 5) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0048] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection unit 53 is attached to the upper surface 54u of the lifting support unit 54 so that it is located between the lower surface brush 51 and the suction holding unit 21 in a plan view and has its gas ejection port facing upward. A jet gas supply unit 57 (FIG. 5) is connected to the gas ejection unit 53. The jet gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects gas supplied from the jet gas supply unit 57 onto the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W and when drying the lower surface of the substrate W, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21.

[0049] The lower surface brush rotation drive unit 55a includes a motor, and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder, and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor, and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the lower surface brush movement drive unit 55c moves the moving support unit 55 in the Y direction, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is referred to as the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is referred to as the separated position.

[0050] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the pedestal device 30 in a plan view and is capable of being raised and lowered. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which portion of the underside of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W that is sucked and held by the suction holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding unit 21.

[0051] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across pedestal device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driver 13A, and an upper chuck driver 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driver 13B, and an upper chuck driver 14B. Upper holding devices 10A, 10B constitute a substrate alignment device of the present invention.

[0052] Figure 3 is an external perspective view of the lower chucks 11A and 11B shown in Figures 1 and 2. In Figure 3, the lower chucks 11A and 11B are indicated by thick solid lines. Furthermore, the upper chucks 12A and 12B are indicated by dotted lines. In the external perspective view of Figure 3, the enlargement and reduction ratio of each part has been changed from that of the external perspective view of Figure 2 so that the shapes of the lower chucks 11A and 11B can be more easily understood.

[0053] 3, the lower chucks 11A and 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces 200. Each support piece 200 is provided with an inclined support surface 201 and a movement limiting surface 202.

[0054] In the lower chuck 11A, the inclined support surface 201 of each support piece 200 is formed so as to be able to support the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11B. The movement limiting surface 202 extends upward a certain distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11A. On the other hand, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 is formed so as to be able to support the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11A. The movement limiting surface 202 extends upward a certain distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11B.

[0055] The lower chuck drivers 13A and 13B include air cylinders or motors as actuators. The lower chuck drivers 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B approach each other or move away from each other. Here, if the target positions of the lower chucks 11A and 11B in the X direction are predetermined, the lower chuck drivers 13A and 13B can individually adjust the positions of the lower chucks 11A and 11B in the X direction based on the target position information. For example, by making the distance between the lower chucks 11A and 11B smaller than the outer diameter of the substrate W, the substrate W can be placed on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B. In this case, the outer peripheral edge of the substrate W is supported by each inclined support surface 201.

[0056] Figure 4 is an external perspective view of the upper chucks 12A and 12B shown in Figures 1 and 2. In Figure 4, the upper chucks 12A and 12B are indicated by thick solid lines. The lower chucks 11A and 11B are indicated by dotted lines. In the external perspective view of Figure 4, the scale of each part has been changed from that of the external perspective view of Figure 2 so that the shapes of the upper chucks 12A and 12B can be more easily understood.

[0057] 4, like the lower chucks 11A and 11B, the upper chucks 12A and 12B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces 300. Each holding piece 300 has an abutment surface 301 and a protrusion 302.

[0058] In the upper chuck 12A, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12B and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12B. On the other hand, in the upper chuck 12B, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12A and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12A.

[0059] The upper chuck driving units 14A, 14B include air cylinders or motors as actuators. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move away from each other. Here, when the target positions of the upper chucks 12A, 12B in the X direction are determined in advance, the upper chuck driving units 14A, 14B can individually adjust the positions of the upper chucks 12A, 12B in the X direction based on information about the target positions.

[0060] In the upper holding devices 10A and 10B, the upper chucks 12A and 12B are moved toward the outer circumferential edge of the substrate W supported by the lower chucks 11A and 11B. The two abutment surfaces 301 of the upper chuck 12A and the two abutment surfaces 301 of the upper chuck 12B come into contact with multiple portions of the outer circumferential edge of the substrate W, thereby holding the outer circumferential edge of the substrate W and firmly fixing the substrate W. Details of the operations of the upper holding devices 10A and 10B when holding the substrate W and when releasing the held state of the substrate W will be described later.

[0061] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotary support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0062] The rotation support shaft 71 is supported on the bottom surface portion 2a by an upper surface cleaning drive unit 74 so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0063] An upper surface cleaning fluid supply unit 75 (FIG. 5) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0064] The upper surface cleaning drive unit 74 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc over the upper surface of the substrate W that is suction-held and rotated by the suction holding unit 21, it is possible to clean the entire upper surface of the substrate W.

[0065] 1, an edge cleaning device 80 is provided on the other side of cup 61 so as to be located near upper holding device 10A in a plan view. Edge cleaning device 80 includes a rotary support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0066] The rotation support shaft 81 is supported by a bevel brush drive unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotation support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around an axis extending in the vertical direction.

[0067] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer peripheral edge of the substrate W can be cleaned at the central portion in the vertical direction of the outer peripheral surface.

[0068] The bevel brush driving unit 84 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is being sucked and held by the sucking and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0069] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 around an axis extending in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W.

[0070] Figure 5 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1. Control device 9 in Figure 5 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program.

[0071] 5, the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a delivery control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in / carry-out control unit 91. The functional units of the control device 9 are realized by a CPU executing, on a RAM, a substrate cleaning program stored in a storage device. Some or all of the functional units of the control device 9 may be realized by hardware such as electronic circuits.

[0072] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W by the suction holding unit 21 and rotate the suction-held substrate W.

[0073] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holder 21.

[0074] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 in order to clean the lower surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 in order to use a cup 61 to catch the cleaning liquid splashed from the substrate W when the substrate W sucked and held by the suction holding unit 21 is cleaned.

[0075] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W sucked and held by the suction holder 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W sucked and held by the suction holder 21. The loading / unloading control unit 9I controls the shutter drive unit 92 to open and close the loading / unloading opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0076] 2. Overview of the operation of the substrate cleaning device 6 to 17 are schematic diagrams illustrating the overall operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 6 to 17, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. The middle part shows a side view of the lower holding device 20 and its surroundings as viewed along the Y direction, and the lower part shows a side view of the lower holding device 20 and its surroundings as viewed along the X direction. The side view in the middle part corresponds to the side view taken along line AA in FIG. 1, and the side view in the lower part corresponds to the side view taken along line BB in FIG. 1. To facilitate understanding of the shapes and operating states of each component of the substrate cleaning apparatus 1, the scale of some components is different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 6 to 17, the cup 61 is indicated by a two-dot chain line, and the outline of the substrate W is indicated by a thick dashed line.

[0077] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading opening 2x. As shown in FIG. 1 , the lower chucks 11A and 11B are maintained in a state where the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained in a state where the distance between them is sufficiently larger than the diameter of the substrate W. The movable pedestal 32 of the pedestal device 30 is disposed so that the center of the suction holding part 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed at a close position on the movable pedestal 32. The lifting support part 54 of the lower surface cleaning device 50 is disposed so that the cleaning surface (upper end) of the lower surface brush 51 is located below the suction holding part 21.

[0078] In addition, in the delivery device 40, the multiple support pins 41 are positioned below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following explanation, the center position of the cup 61 in a planar view is referred to as the planar reference position rp. In addition, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a planar view is referred to as the first horizontal position.

[0079] A substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by the thick solid arrow a1 in Fig. 6, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W through the loading / unloading opening 2x into a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B, as shown in Fig. 6.

[0080] Next, as indicated by the thick solid arrow a2 in Fig. 7, the lower chucks 11A and 11B approach each other so that the multiple support pieces 200 (Fig. 3) of the lower chucks 11A and 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits through the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces 200 (Fig. 3) of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x. The operation of the lower chucks 11A and 11B in Fig. 7 will be described in detail later.

[0081] Next, as indicated by thick solid arrow a3 in Fig. 8, the upper chucks 12A and 12B approach each other so that the multiple holding pieces 300 (Fig. 4) of the upper chucks 12A and 12B come into contact with the outer peripheral edge of the substrate W. As the multiple holding pieces 300 (Fig. 4) of the upper chucks 12A and 12B come into contact with multiple portions of the outer peripheral edge of the substrate W, the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Details of the operation of the upper chucks 12A and 12B in Fig. 8 will be described later.

[0082] 8, the suction and holding unit 21 is displaced a predetermined distance from the planar reference position rp, and the movable base 32 moves forward from the first horizontal position so that the center of the lower brush 51 is positioned at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom surface portion 2a is referred to as the second horizontal position.

[0083] Next, as indicated by a thick solid arrow a5 in Fig. 9, the lifting support 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W. Furthermore, as indicated by a thick solid arrow a6 in Fig. 9, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0084] The lower part of Figure 9 shows an enlarged side view of the portion where the lower-surface brush 51 contacts the underside of the substrate W in a bubble. As shown in the bubble, with the lower-surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection unit 53 are held in positions close to the underside of the substrate W. At this time, the liquid nozzle 52 ejects cleaning liquid toward the underside of the substrate W at a position near the lower-surface brush 51, as indicated by the outline arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W is guided to the contact portion between the lower-surface brush 51 and the substrate W, and contaminants removed from the back surface of the substrate W by the lower-surface brush 51 are washed away by the cleaning liquid. In this way, in the lower-surface cleaning device 50, the liquid nozzle 52 and the lower-surface brush 51 are attached to the lifting support unit 54. This allows the cleaning liquid to be efficiently supplied to the portion of the underside of the substrate W being cleaned by the lower-surface brush 51. This reduces the amount of cleaning liquid consumed and suppresses excessive splashing of the cleaning liquid.

[0085] Here, the upper surface 54u of the lifting support member 54 is inclined obliquely downward in a direction away from the suction holder 21. In this case, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support member 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holder 21.

[0086] Furthermore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holder 21, as indicated by the outlined arrow a52 in the blowout in FIG. 9 . In this embodiment, the gas ejection unit 53 is attached to the lifting support unit 54 so that its gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holder 21. This prevents the cleaning liquid containing contaminants from splashing toward the suction holder 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holder 21, and the suction surface of the suction holder 21 is kept clean.

[0087] 9, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outline arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0088] 9, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W is stopped. At this time, the spray of gas from the gas blowing part 53 onto the substrate W continues.

[0089] 10, the movable base 32 moves backward so that the suction holder 21 is positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, the gas ejection unit 53 continues to eject gas onto the substrate W, so that the central region of the lower surface of the substrate W is gradually dried by the gas curtain.

[0090] Next, as indicated by a thick solid arrow a8 in Fig. 11, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. Furthermore, as indicated by a thick solid arrow a9 in Fig. 11, the upper chucks 12A and 12B move away from each other so that the holding pieces of the upper chucks 12A and 12B move away from the outer circumferential edge of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B. Details of the operation of the upper chucks 12A and 12B in Fig. 11 will be described later.

[0091] 11, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0092] Next, the lower chucks 11A and 11B move away from each other as indicated by the thick solid arrow a11 in Fig. 12. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both the upper holding devices 10A and 10B return to their initial states.

[0093] 13, the pin connecting member 42 is lowered so that the upper ends of the plurality of support pins 41 are positioned below the suction holder 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the suction holder 21. In this state, the suction holder 21 suction-holds the central region of the underside of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position as shown by the thick solid arrow a13 in FIG.

[0094] 14, the suction holding part 21 rotates around the vertical axis (the axis of the rotation axis of the suction holding drive part 22), thereby rotating the substrate W sucked and held by the suction holding part 21 in a horizontal position.

[0095] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, the spray nozzle 73 moves to a position above the center of the substrate W, as shown by a thick solid arrow a15 in Fig. 14, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. The rotary support shaft 71 also rotates. As a result, the spray nozzle 73 moves to a position above the rotating substrate W, as shown by a thick solid arrow a16 in Fig. 14. The mixed fluid is sprayed onto the entire upper surface of the substrate W, thereby cleaning the entire upper surface of the substrate W.

[0096] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as indicated by the thick solid arrow a17 in FIG. 14 . The central portion of the outer circumferential surface of the bevel brush 83 descends so as to come into contact with the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around its vertical axis. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

[0097] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support member 54 is raised so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. Also, as indicated by the thick solid arrow a18 in Fig. 14, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. Furthermore, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W, and the gas ejection member 53 sprays gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer region of the lower surface of the substrate W that is being sucked and held by the suction holding member 21 and rotated.

[0098] The rotation direction of the lower surface brush 51 may be opposite to the rotation direction of the suction holding unit 21. In this case, the outer region of the lower surface of the substrate W can be efficiently cleaned. If the lower surface brush 51 is not relatively large, the moving support unit 55 may move forward and backward between the close position and the separated position on the movable base 32, as shown by the thick solid arrow a19 in Fig. 14. Even in this case, the entire outer region of the lower surface of the substrate W that is rotated while being sucked and held by the suction holding unit 21 can be cleaned by the lower surface brush 51.

[0099] Next, when cleaning of the upper surface, outer peripheral edge, and outer region of the lower surface of the substrate W is completed, spraying of the mixed fluid from the spray nozzle 73 onto the substrate W is stopped. Furthermore, as indicated by a thick solid arrow a20 in FIG. 15 , the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Furthermore, as indicated by a thick solid arrow a21 in FIG. 15 , the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, rotation of the lower surface brush 51 is stopped, and the lifting support member 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. Furthermore, discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W and spraying of the gas from the gas ejection member 53 onto the substrate W are stopped. In this state, the suction holder 21 rotates at high speed, thereby shaking off the cleaning liquid adhering to the substrate W and drying the entire substrate W.

[0100] Next, the cup 61 descends from the upper cup position to the lower cup position as shown by a thick solid arrow a22 in Fig. 16. Furthermore, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W as shown by a thick solid arrow a23 in Fig. 16.

[0101] Finally, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x just before the substrate W is unloaded. Thereafter, as indicated by the thick solid arrow a24 in FIG. 17, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading opening 2x. Next, the hand RH receives the substrate W on the suction holder 21 and exits through the loading / unloading opening 2x. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0102] 3. Details of the operation of the upper holding devices 10A and 10B In the above-described series of schematic operations, it is desirable that the substrate W immediately before being transferred from the upper holding devices 10A, 10B to the suction holder 21 is positioned so that the center of the substrate W coincides with the rotation axis of the suction holder 21 (the rotation axis of the suction holder drive unit 22) in a plan view. In this case, when the transfer device 40 transfers the substrate W from the upper holding devices 10A, 10B to the lower holding device 20, the center of the substrate W can be accurately and appropriately positioned on the rotation axis of the suction holder 21. Therefore, in this embodiment, the upper holding devices 10A, 10B operate under the control of the chuck control unit 9A in Fig. 5 so that the center of the substrate W is positioned on the rotation axis of the suction holder 21 in a plan view. Details of this operation will be described.

[0103] 18 and 19 are schematic side views for explaining in detail the holding and releasing operations of the upper holding devices 10A, 10B for holding and releasing the substrate W. The side views in Fig. 18 and 19 correspond to the side view along line AA in Fig. 1, and show in chronological order the operating states of the upper holding devices 10A, 10B up until the substrate W carried into the substrate cleaning apparatus 1 is transferred to the suction holder 21 by the transfer device 40.

[0104] 18 and 19, the lower chucks 11A and 11B of the upper holding devices 10A and 10B are represented by solid lines, and the upper chucks 12A and 12B are represented by dotted lines. Furthermore, the position in the X direction of a line extending vertically through the planar reference position rp is represented by the symbol sc. The line extending vertically through the planar reference position rp coincides with the line extending along the rotation axis of the suction holding unit 21 when the movable base 32 is in the first horizontal position.

[0105] Furthermore, when the center wc of the substrate W is located on the planar reference position rp, the position in the X direction at which the outer circumferential edge of the substrate W should be supported by the upper holding device 10A is represented by symbol e1. Furthermore, when the center wc of the substrate W is located on the planar reference position rp, the position in the X direction at which the outer circumferential edge of the substrate W should be supported by the upper holding device 10B is represented by symbol e2. Positions e1 and e2 are determined in advance based on the design dimensions of each part of the substrate cleaning apparatus 1 and the dimensions of the substrate W so that an excessive load is not applied to the substrate W (so that the substrate W is not significantly deformed) when the outer circumferential edge of the substrate W is supported by the upper holding devices 10A and 10B.

[0106] First, as shown in the first row of FIG. 18, when the substrate W is loaded into the substrate cleaning apparatus 1, the lower chucks 11A and 11B approach each other as described with reference to FIGS. 6 and 7. At this time, as shown in the second row of FIG. 18, one of the lower chucks, the lower chuck 11A, moves in the X direction (arrow aa1) so that the movement limiting surface 202 is located at position e1. In other words, the lower chuck 11A moves in the X direction with the target position of the movement limiting surface 202 set at position e1. This movement operation of the lower chuck 11A can be realized, for example, by teaching the movement limiting surface 202 of the lower chuck 11A to actually move to position e1.

[0107] The other lower chuck 11B moves in the X direction (arrow aa2) so that the movement limiting surface 202 is located on the opposite side of position e1 relative to position e2 and the distance between the lower chucks 11A and 11B is smaller than the diameter of the substrate W. As a result, the substrate W is placed on the lower chucks 11A and 11B. Specifically, multiple portions of the outer circumferential edge of the substrate W are supported on the multiple (four in this example) inclined support surfaces 201 of the lower chucks 11A and 11B. In this state, the lower chucks 11A and 11B are fixed.

[0108] Next, as shown in the third row of FIG. 18, the upper chuck 12B moves in the X direction (arrow aa3) so as to approach the upper holding device 10A. As shown in the fourth row of FIG. 18, the upper chuck 12B moves in the X direction (arrow aa4) until the contact surface 301 is located at position e2, and then stops. In other words, the upper chuck 12B moves in the X direction with position e2 as the target position of the contact surface 301. This movement operation of the upper chuck 12B can be realized, for example, by performing teaching to actually move the contact surface 301 of the upper chuck 12B to position e2.

[0109] During the above movement, the contact surface 301 of the upper chuck 12B presses a part of the outer periphery of the substrate W on the inclined support surface 201 of the lower chuck 11B, thereby moving the substrate W toward the upper holding device 10A.

[0110] When the abutment surface 301 of the upper chuck 12B reaches position e2, i.e., when a portion of the outer circumferential edge of the substrate W reaches position e2, another portion of the outer circumferential edge of the substrate W abuts against the movement limiting surface 202 of the lower chuck 11A. As a result, the movement of the substrate W is limited by the movement limiting surface 202 so that the other portion of the outer circumferential edge of the substrate W does not exceed position e1. In this state, the center wc of the substrate W is positioned at position sc in the X direction.

[0111] When the substrate W is loaded into the substrate cleaning apparatus 1, a substrate transport robot (not shown) positions the substrate W in the Y direction. Therefore, in the state shown in the fourth row of Fig. 18, the substrate W is positioned so that the center wc of the substrate W overlaps with the planar reference position rp.

[0112] 18 and the first to third side views of Fig. 19, which will be described later, there is a slight difference in height between the portion of the substrate W supported by the lower chuck 11A and the portion of the substrate W supported by the lower chuck 11B. However, the difference (deviation) between these height positions is negligibly small compared to the diameter of the substrate W, and has almost no effect on the positioning accuracy of the center wc of the substrate W.

[0113] Thereafter, when the substrate W is held between the upper holding devices 10A and 10B, i.e., when the substrate W is firmly fixed, the upper chuck 12A moves toward the upper holding device 10B (arrow aa5) as shown in the first row of FIG. 19 . At this time, the contact surface 301 of the upper chuck 12A moves to a position closer to the upper holding device 10B than position e1 and stops there. This causes the substrate W to deform, and the outer peripheral edge of the substrate W and the movement limiting surface 202 of the lower chuck 11A are spaced apart by a small distance. Furthermore, the substrate W is firmly fixed between the contact surface 301 of the upper chuck 12A and the contact surface 301 of the upper chuck 12B. This holding state corresponds to the example of FIG. 8 . As a result, as described with reference to FIG. 9 , it becomes possible to physically clean the central region of the lower surface of the substrate W with an appropriate force.

[0114] When the substrate W is firmly fixed between the contact surfaces 301 of the upper chucks 12A and 12B, the substrate W is deformed as described above. Even in this case, a portion of the outer circumferential edge of the substrate W located on the upper holding device 10B side is held between the inclined support surface 201 of the lower chuck 11B and the protrusion 302 of the upper chuck 12B so as to be sandwiched from above and below. Furthermore, the other portion of the outer circumferential edge of the substrate W located on the upper holding device 10A side is held between the inclined support surface 201 of the lower chuck 11A and the protrusion 302 of the upper chuck 12A so as to be sandwiched from above and below. Therefore, the substrate W is prevented from coming out from between the upper chucks 12A and 12B.

[0115] After the central region of the lower surface of the substrate W has been cleaned, the substrate W held by the upper holding devices 10A, 10B is transferred onto the suction holding part 21 by the transfer device 40, as described with reference to Figures 10 to 13. The transfer device 40 moves the substrate W only in the vertical direction by moving a plurality of support pins 41 up and down. Therefore, when the transfer device 40 receives the substrate W from the upper holding devices 10A, 10B, it is desirable that the substrate W is positioned so that its center wc is located on the planar reference position rp.

[0116] Therefore, in this embodiment, when the held state of the substrate W is released, the upper holding devices 10A and 10B operate so that the center wc of the substrate W is positioned on the planar reference position rp. Specifically, when the held state of the substrate W by the upper chucks 12A and 12B is released, as shown in the second row of FIG. 19 , first, only the upper chuck 12A pressing the other portion of the outer circumferential edge of the substrate W moves in the X direction away from the upper holding device 10B (arrow aa6). In this case, the pressing force applied to the substrate W by the upper chuck 12A is released, so that the other portion of the outer circumferential edge of the substrate W abuts against the movement limiting surface 202 of the lower chuck 11A. Meanwhile, a portion of the outer circumferential edge of the substrate W is maintained in a state of abutting against the abutting surface 301 of the upper chuck 12B. As a result, the center wc of the substrate W is positioned on the planar reference position rp without a strong pressing force acting on the substrate W.

[0117] Next, as shown in the third row of Figure 19, the upper chuck 12B, which is in contact with a portion of the outer peripheral edge of the substrate W, moves in the X direction (arrow aa7) away from the upper holding device 10A. At this time, the center wc of the substrate W remains positioned on the planar reference position rp. Thereafter, as described with reference to Figure 11, the substrate W is received by the multiple support pins 41 of the delivery device 40, and the upper holding devices 10A and 10B return to their initial states. The substrate W received by the multiple support pins 41 is placed on the suction holder 21 with the center wc of the substrate W positioned on the planar reference position rp.

[0118] As described above, in the present embodiment, when the substrate W is released from the state held by the upper chucks 12A and 12B, the upper chuck 12A moves so that one upper chuck 12A moves away from the substrate W before the other upper chuck 12B moves away from the substrate W. In this case, when only the upper chuck 12A moves away from the substrate W, only the pressing force from the upper chuck 12B acts on a portion of the outer circumferential edge of the substrate W. As a result, the substrate W moves in a direction approaching the upper holding device 10A. In this state, the movement of the substrate W is limited by the movement limiting surface 202 of the lower chuck 11A so that the other portion of the outer circumferential edge of the substrate W does not exceed position e1. Therefore, even after the substrate W is fixed by the upper chucks 12A and 12B, the substrate W can be accurately and easily positioned at a predetermined position with high precision.

[0119] 4.Effects (1) In the above-described substrate cleaning apparatus 1, when a substrate W is loaded by a substrate transport robot (not shown), the outer peripheral edge of the loaded substrate W is supported from a position below the substrate W by the support pieces 200 of the lower chucks 11A and 11B. In this state, the lower chuck 11B presses a portion of the outer peripheral edge of the substrate W toward the upper holding device 10A. This causes the substrate W to move on the lower chucks 11A and 11B. At this time, the movement of the substrate W is limited by the movement limiting surface 202 of the lower chuck 11A so that the other portion of the outer peripheral edge of the substrate W does not exceed a predetermined position e1.

[0120] As a result, the positions e1 and e2 are appropriately determined in accordance with the size of the substrate W, so that the substrate W supported on the lower chucks 11A and 11B can be positioned accurately at a predetermined position with high precision.

[0121] (2) As described above, the support pieces 200 of the lower chucks 11A and 11B are provided with a plurality of inclined support surfaces 201. Each inclined support surface 201 is formed so as to be capable of supporting the outer peripheral edge of the substrate W and to extend obliquely downward toward the substrate W to be supported. In this case, when the substrate W is supported on the lower chucks 11A and 11B, the contact area between the inclined support surfaces 201 of the lower chucks 11A and 11B and the substrate W can be reduced. This reduces the transfer of contaminants and the like, and reduces the deterioration in the cleanliness of the substrate W.

[0122] (3) Each of the lower chucks 11A and 11B is configured to be movable in a direction parallel to the X direction. Therefore, by appropriately adjusting the distance between the lower chucks 11A and 11B, the substrate W supported by the lower chucks 11A and 11B can be smoothly moved to a position below the upper holding devices 10A and 10B. In addition, since the distance between the lower chucks 11A and 11B can be adjusted according to the size of the substrate W, the range of sizes of the substrate W that can be aligned is expanded.

[0123] (4) Each of the upper chucks 12A and 12B is configured to be movable in a direction parallel to the X direction. Therefore, by appropriately adjusting the distance between the upper chucks 12A and 12B, it is possible to easily switch between a state in which the substrate W is firmly fixed and a state in which the substrate W is not firmly fixed. In addition, the distance between the upper chucks 12A and 12B can be adjusted according to the size of the substrate W. Therefore, the range of sizes of the substrate W that can be fixed between the upper chucks 12A and 12B is expanded.

[0124] 5. Other Embodiments (1) In the above embodiment, the substrate W is positioned relative to the suction holding portion 21 while being sandwiched between the movement limiting surface 202 of the lower chuck 11A and the abutment surface 301 of the upper chuck 12B, but the present invention is not limited to this.

[0125] The substrate W may be positioned in a state in which the substrate W is sandwiched between the movement limiting surface 202 of the lower chuck 11B and the abutting surface 301 of the upper chuck 12A, instead of between the movement limiting surface 202 of the lower chuck 11A and the abutting surface 301 of the upper chuck 12B. In this case, the upper holding devices 10A, 10B perform operations that are reversed in the X direction from the examples in Figures 18 and 19 described above. As a result, as in the examples in Figures 18 and 19, the positions e1 and e2 are appropriately determined according to the size of the substrate W, and the substrate W supported on the lower chucks 11A, 11B can be accurately positioned at a predetermined position with high precision.

[0126] (2) In the above embodiment, the support pieces 200 of the lower chucks 11A and 11B are provided with the inclined support surfaces 201, but the present invention is not limited to the above example. The support pieces 200 may be provided with flat support surfaces parallel to the XY plane instead of the inclined support surfaces 201. In this case, the lower surface of the substrate W and the support surfaces are in surface contact with each other, so that the support state of the substrate W is stable.

[0127] (3) The upper holding devices 10A, 10B may be configured to be able to move the lower chucks 11A, 11B and the upper chucks 12A, 12B in the vertical direction. In this case, instead of the delivery device 40, the upper holding devices 10A, 10B may deliver the substrate W supported by the lower chucks 11A, 11B onto the suction holder 21.

[0128] Alternatively, the lower chucks 11A, 11B of the upper holding devices 10A, 10B may receive the substrate W sucked and held on the suction holding unit 21 and hold the received substrate W at a position above the suction holding unit 21.

[0129] (4) In the substrate cleaning apparatus 1 according to the above embodiment, as shown in FIGS. 6 to 17, at least a portion of the lower chucks 11A, 11B and the upper chucks 12A, 12B of the upper holding devices 10A, 10B basically overlaps with the cup 61 in a plan view, but the present invention is not limited to this. The lower chucks 11A, 11B and the upper chucks 12A, 12B may each be configured to be movable in the X direction to a position spaced apart from the cup 61 in a plan view. In this case, the lower chucks 11A, 11B and the upper chucks 12A, 12B may also be configured to be movable in the vertical direction.

[0130] (5) In the above embodiment, the substrate W positioned with respect to the suction holder 21 by the upper holding devices 10A, 10B is transferred to the suction holder 21, but the present invention is not limited to this. For example, consider a case where a substrate transport robot (not shown) inserts its hand into the substrate cleaning apparatus 1 to receive the substrate W held by the upper holding devices 10A, 10B, and transports the received substrate W. In this case, the receiving position of the substrate W by the hand may be predetermined, so that the upper holding devices 10A, 10B may position the substrate W at the predetermined receiving position. As a result, the received substrate W is disposed at the predetermined position on the hand. This improves the transport accuracy of the substrate W.

[0131] (6) In the above embodiment, the substrate W positioned by the upper holding devices 10A, 10B is transferred to the suction holder 21 and then subjected to a cleaning process, but the present invention is not limited to this. After the substrate W positioned by the upper holding devices 10A, 10B is transferred to the suction holder 21, the substrate W suction-held by the suction holder 21 may be subjected to an edge rinse process to remove a film formed on the peripheral edge of the substrate W. Alternatively, an edge exposure process to expose a film formed on the peripheral edge of the substrate W may be performed. Even in these cases, it is possible to perform a highly accurate process on the substrate W suction-held by the suction holder 21.

[0132] (7) In the above embodiment, the substrate W positioned by the upper holding devices 10A, 10B is transferred to the suction holder 21, but the present invention is not limited to this. The substrate W positioned by the upper holding devices 10A, 10B may be transferred onto a temperature adjustment plate that performs a heating process or a cooling process on the substrate W, instead of the suction holder 21. In this case, it becomes possible to perform a heating process or a cooling process with high accuracy on the substrate W placed on the temperature adjustment plate.

[0133] (8) In the above embodiment, after the upper holding devices 10A, 10B clean the central region of the underside of the substrate W, the lower holding device 20 cleans the outer region of the underside of the substrate W and cleans the lower surface brush 51, but the embodiment is not limited to this. After the lower holding device 20 cleans the outer region of the underside of the substrate W and cleans the lower surface brush 51, the upper holding devices 10A, 10B may clean the central region of the underside of the substrate W.

[0134] (9) In the above embodiment, the upper surface of the substrate W is cleaned using the spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush or a rinse nozzle that ejects a rinse liquid. Also, the upper surface of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer peripheral edge of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the edge cleaning apparatus 80.

[0135] (10) In the above embodiment, substrate cleaning apparatus 1 includes control device 9, but the embodiment is not limited to this. If substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include control device 9.

[0136] (11) In the above embodiment, the substrate W is positioned relative to the suction holder 21 in a state where the substrate W is sandwiched between the movement limiting surface 202 of the lower chuck 11A and the abutting surface 301 of the upper chuck 12B, but the present invention is not limited to this. The substrate W may be positioned in a state where the substrate W is sandwiched between the abutting surface 301 of the upper chuck 12B and the abutting surface 301 of the upper chuck 12A, instead of the movement limiting surface 202 of the lower chuck 11A and the abutting surface 301 of the upper chuck 12B.

[0137] In this case, in the upper holding devices 10A and 10B, for example, when the substrate W is loaded, the lower chucks 11A and 11B move in the X direction so that the distance between the lower chucks 11A and 11B becomes smaller than the diameter of the substrate W. At this time, the movement limiting surfaces 202 of the lower chucks 11A and 11B are adjusted so as not to be positioned between positions e1 and e2. In this state, the substrate W is placed on the lower chucks 11A and 11B.

[0138] Thereafter, the contact surface 301 of one of the upper chucks 12A, 12B moves to position e1. After the contact surface 301 of one of the upper chucks 12A, 12B reaches position e1, the contact surface 301 of the other of the upper chucks 12A, 12B moves to position e2. As a result, similar to the examples in FIGS. 18 and 19 , the positions e1 and e2 are appropriately determined in accordance with the size of the substrate W, and the substrate W supported on the lower chucks 11A, 11B can be accurately positioned at a predetermined position with high precision.

[0139] 6. Correspondence between each element of the claims and each part of the embodiment Below, examples of correspondence between each element of the claims and each element of the embodiments will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0140] In the above embodiment, the upper holding devices 10A and 10B are examples of substrate alignment devices, the lower chuck 11A is an example of a first support member, the upper chuck 12B is an example of a first pressing member, the upper chuck driving unit 14B is an example of a first pressing driving unit, the position e1 is an example of a specified position, and the movement limiting surface 202 is an example of a movement limiting unit.

[0141] Furthermore, the inclined support surface 201 of the lower chuck 11A is an example of a first inclined support surface, the inclined support surface 201 of the lower chuck 11B is an example of a second inclined support surface, the lower chuck driving unit 13A is an example of a first support driving unit, the lower chuck driving unit 13B is an example of a second support driving unit, the upper chuck 12A is an example of a second pressing member, and the upper chuck driving unit 14A is an example of a second pressing driving unit.

[0142] Furthermore, the abutment surface 301 of the upper chuck 12B is an example of a first abutment surface, the protrusion 302 of the upper chuck 12B is an example of a first upper end protrusion, the abutment surface 301 of the upper chuck 12A is an example of a second abutment surface, the protrusion 302 of the upper chuck 12A is an example of a second upper end protrusion, and the substrate cleaning apparatus 1 is an example of a substrate processing apparatus. 7. Reference form (1) A substrate alignment device according to a first reference embodiment is a substrate alignment device that aligns a substrate, and includes first and second support members that are arranged to face each other and spaced apart in a planar view and that each support the outer peripheral edge of the substrate from a position below the substrate; a first pressing member that is arranged to face the first support member in a planar view and that, while the substrate is supported by the first and second support members, moves the substrate on the first and second support members by pressing a portion of the outer peripheral edge of the substrate in a first direction from the second support member toward the first support member; and a first pressing drive unit that drives the first pressing member, and the first support member includes a movement limiting unit that limits movement of the substrate in the first direction beyond a predetermined specified position. In the substrate alignment device, the outer peripheral edge of the substrate is supported from below the substrate by first and second support members. In this state, a first pressing member presses the substrate in a first direction. This causes the substrate to move in the first direction on the first and second support members. At this time, the movement of the substrate is limited by a movement limiting unit so that it does not exceed a specified position. As a result, the defined position is appropriately determined in accordance with the size of the substrate, and the substrate supported on the first and second support members can be positioned accurately and precisely at the predetermined position. (2) The first support member may have a first inclined support surface capable of supporting the outer peripheral edge of the substrate and extending obliquely downward toward the second support member, and the second support member may have a second inclined support surface capable of supporting the outer peripheral edge of the substrate and extending obliquely downward toward the first support member. In this case, when the substrate is supported on the first and second support members, the contact area between the first and second support members and the substrate can be reduced, thereby reducing the transfer of contaminants and the like, and reducing the deterioration of the cleanliness of the substrate. (3) Each of the first and second support members may be configured to be movable in a direction parallel to the first direction, and the substrate alignment device may further include a first support drive unit that drives the first support member and a second support drive unit that drives the second support member. In this case, by appropriately adjusting the distance between the first and second support members, the substrate supported by the first and second support members can be smoothly moved to a position below the first and second support members. In addition, since the distance between the first and second support members can be adjusted according to the size of the substrate, the range of substrate sizes that can be aligned is expanded. (4) The substrate alignment device may further include a second pressing member arranged to face the second support member in a planar view, and which, while the substrate is supported by the first and second support members and a portion of the substrate is pressed by the first pressing member, presses another portion of the outer peripheral edge of the substrate in a second direction opposite to the first direction, and a second pressing drive unit which drives the second pressing member. In this case, the substrate is firmly fixed between the first pressing member and the second pressing member, so that the predetermined processing can be appropriately performed on the fixed substrate. (5) Each of the first and second pressing members may be configured to be movable in a first direction and a second direction. In this case, by appropriately adjusting the distance between the first pressing member and the second pressing member, it is possible to easily switch between a state in which the substrate is firmly fixed and a state in which the substrate is not firmly fixed. Furthermore, the distance between the first and second pressing members can be adjusted according to the size of the substrate. This expands the range of substrate sizes that can be fixed between the first pressing member and the second pressing member. (6) The second pressing drive unit may drive the second pressing member so that after the second pressing member presses another portion of the substrate in the second direction, the second pressing member moves away from the other portion before the first pressing member moves away from the portion of the substrate. In this case, the second pressing member moves away from the other portions of the substrate, so that only the pressing force from the first pressing member acts on the substrate. As a result, the substrate moves in the first direction. In this state, the movement of the substrate is limited by the movement limiting portion so that it does not exceed the specified position. Therefore, even after the substrate is fixed by the first and second pressing members, the substrate can be accurately and easily positioned at a predetermined position with high precision. (7) The first pressing member may include a first contact surface that contacts a portion of the substrate and a first upper end protrusion that protrudes in a first direction from an upper end of the first contact surface, and the second pressing member may include a second contact surface that contacts another portion of the substrate and a second upper end protrusion that protrudes in a second direction from an upper end of the second contact surface. When a portion of the substrate and another portion thereof are pressed simultaneously by the first and second pressing members, the substrate may be deformed. Even in such a case, the portion of the substrate is held between the second support member and the first upper end protrusion of the first pressing member. The other portion of the substrate is held between the first support member and the second upper end protrusion of the second pressing member. Therefore, the substrate is prevented from coming out from between the first and second pressing members. (8) A substrate processing apparatus according to a second embodiment includes the substrate alignment device described above, thereby enabling appropriate processing of substrates. (9) A substrate alignment method according to a third reference embodiment is a substrate alignment method for aligning a substrate, comprising the steps of: placing the substrate on first and second support members that are arranged so as to face each other but are spaced apart in a planar view, and using the first and second support members to support the outer peripheral edge of the substrate from a position below the substrate; moving the substrate on the first and second support members by pressing a portion of the outer peripheral edge of the substrate in a first direction from the second support member to the first support member with a first pressing member that is arranged so as to face the first support member in a planar view; and restricting, as the substrate moves on the first and second support members, movement of the substrate in the first direction beyond a predetermined position by a movement restricting portion provided on the first support member. In the substrate alignment method, the outer peripheral edge of the substrate is supported from below the substrate by first and second support members. In this state, a first pressing member presses the substrate in a first direction. As a result, the substrate moves in the first direction on the first and second support members. At this time, the movement of the substrate is limited by a movement limiting unit so that it does not exceed a specified position. As a result, the defined position is appropriately determined in accordance with the size of the substrate, and the substrate supported on the first and second support members can be positioned accurately and precisely at the predetermined position. (10) The substrate alignment method may further include a step of moving each of the first and second support members in a direction parallel to the first direction. In this case, by appropriately adjusting the distance between the first and second support members, the substrate supported by the first and second support members can be smoothly moved to a position below the first and second support members. In addition, since the spacing between the first and second support members can be adjusted according to the size of the substrate, the range of substrate sizes that can be aligned is expanded. (11) The substrate alignment method may further include a step of pressing another portion of the outer peripheral edge of the substrate in a second direction opposite to the first direction using a second pressing member arranged to face the second support member in a planar view, while the substrate is supported by the first and second support members and a portion of the substrate is pressed by the first pressing member. In this case, the substrate is firmly fixed between the first pressing member and the second pressing member, so that the predetermined processing can be appropriately performed on the fixed substrate. (12) The substrate alignment method may further include the step of moving the first and second pressing members in a first direction and a second direction, respectively. In this case, by appropriately adjusting the distance between the first and second pressing members, it is possible to easily switch between a state in which the substrate is firmly fixed and a state in which the substrate is not firmly fixed. Also, the distance between the first and second pressing members can be adjusted according to the size of the substrate. Therefore, the range of sizes of substrates that can be fixed between the first and second pressing members is expanded. (13) The substrate alignment method may further include a step of, after the second pressing member presses the other portion of the substrate in the second direction, moving the second pressing member away from the other portion before the first pressing member moves away from the portion of the substrate. In this case, the second pressing member moves away from the other portions of the substrate, so that only the pressing force from the first pressing member acts on the substrate. As a result, the substrate moves in the first direction. In this state, the movement of the substrate is limited by the movement limiting portion so that it does not exceed the specified position. Therefore, even after the substrate is fixed by the first and second pressing members, the substrate can be accurately and easily positioned at a predetermined position with high precision. (14) A substrate processing method according to a fourth embodiment includes the substrate alignment method described above, thereby enabling the substrate to be processed appropriately. [Explanation of symbols]

[0143] 1...substrate cleaning apparatus, 2...unit housing, 2a...bottom surface portion, 2b to 2e...side wall portions, 2x...loading / unloading port, 9...control device, 9A...chuck control unit, 9B...suction control unit, 9C...pedestal control unit, 9D...delivery control unit, 9E...lower surface cleaning control unit, 9F...cup control unit, 9G...upper surface cleaning control unit, 9H...bevel cleaning control unit, 9I...loading / unloading control unit, 10A, 10B...upper holding device, 11 A, 11B... lower chuck, 12A, 12B... upper chuck, 13A, 13B... lower chuck drive unit, 14A, 14B... upper chuck drive unit, 20... lower holding device, 21... suction holding unit, 22... suction holding drive unit, 30... base device, 31... linear guide, 32... movable base, 33... base drive unit, 40... transfer device, 41... support pin, 42... pin connecting member, 43... pin lifting drive unit 50...underside cleaning device, 51...underside brush, 52...liquid nozzle, 53...gas ejection unit, 54...lifting support unit, 54u...upper surface, 55...movement support unit, 55a...lower surface brush rotation drive unit, 55b...lower surface brush lifting drive unit, 55c...lower surface brush movement drive unit, 56...underside cleaning liquid supply unit, 57...ejected gas supply unit, 60...cup device, 70...upper surface cleaning device, 71, 81...rotating support shaft, 7 2, 82...arm, 73...spray nozzle, 75...upper surface cleaning fluid supply unit, 74...upper surface cleaning drive unit, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening / closing device, 91...shutter, 92...shutter drive unit, 200...support piece, 201...inclined support surface, 202...movement limiting surface, 300...holding piece, 301...contact surface, 302...protrusion, RH...hand

Claims

1. A substrate alignment apparatus for aligning a substrate, first and second support members arranged to face each other and spaced apart in a plan view, and each supporting an outer peripheral edge of the substrate from a position below the substrate; a first pressing member that is disposed to face the first support member in a plan view, and that, while the substrate is supported by the first and second support members, presses a portion of an outer peripheral edge of the substrate in a first direction from the second support member toward the first support member, thereby moving the substrate on the first and second support members; a first pressing drive unit that drives the first pressing member; a second pressing member that is disposed so as to face the second support member in a plan view and that presses another portion of the outer peripheral end of the substrate in a second direction opposite to the first direction; a second pressing drive unit that drives the second pressing member; a control unit; the first support member includes a movement limiting portion that limits movement of the substrate in the first direction beyond a predetermined defined position; The control unit by controlling the first pressing drive unit while the movement limiting unit is at the specified position, the substrate supported on the first and second support members is moved in the first direction, and the other portion of the substrate is brought into contact with the movement limiting unit; a substrate alignment device that, after the other portion of the substrate abuts the movement limiting portion, causes the second pressing member to press the other portion of the outer peripheral end of the substrate in the second direction by controlling the second pressing drive unit while the portion of the substrate supported by the first and second support members is pressed by the first pressing member.

2. the first support member has a first inclined support surface that is capable of supporting an outer peripheral edge of the substrate and that extends obliquely downward toward the second support member; 2. The substrate alignment apparatus according to claim 1, wherein the second support member has a second inclined support surface that is capable of supporting the outer peripheral edge of the substrate and that extends obliquely downward toward the first support member.

3. each of the first and second support members is configured to be movable in a direction parallel to the first direction; the substrate alignment apparatus, a first support drive unit that drives the first support member; 3. The substrate alignment apparatus according to claim 1, further comprising: a second support drive unit that drives the second support member.

4. 4. The substrate alignment apparatus according to claim 1, wherein each of the first and second pressing members is configured to be movable in the first direction and the second direction.

5. A substrate alignment device as described in claim 4, wherein the control unit controls the second pressing drive unit so that after the second pressing member presses the other portion of the substrate in the second direction, the second pressing member moves away from the other portion of the substrate before the first pressing member moves away from the portion of the substrate.

6. The first pressing member includes: a first abutment surface that contacts the portion of the substrate; a first upper end protrusion protruding in the first direction from an upper end of the first contact surface, The second pressing member is a second abutment surface that contacts the other portion of the substrate; 6. The substrate alignment apparatus according to claim 1, further comprising: a second upper end protrusion protruding in the second direction from an upper end of the second contact surface.

7. A substrate processing apparatus comprising the substrate alignment apparatus according to any one of claims 1 to 6.

8. A substrate alignment method for aligning a substrate, comprising: a step of placing the substrate on first and second support members that are arranged to face each other and be spaced apart in a plan view, thereby supporting an outer peripheral edge of the substrate from a position below the substrate using the first and second support members, respectively; and a step of moving the substrate on the first and second support members by pressing a part of an outer peripheral edge of the substrate in a first direction from the second support member toward the first support member using a first pressing member arranged to face the first support member in a plan view, while the substrate is supported by the first and second support members; the first support member includes a movement limiting portion that limits movement of the substrate in the first direction beyond a predetermined defined position; the step of moving the substrate includes moving the substrate supported on the first and second support members in the first direction with the movement limiting portion at the specified position, and bringing another portion of the outer peripheral edge of the substrate into contact with the movement limiting portion; The substrate alignment method includes: a second pressing member arranged to face the second support member in a planar view, the second pressing member being positioned ...

9. The method of aligning a substrate according to claim 8 , further comprising the step of moving each of the first and second support members in a direction parallel to the first direction.

10. 10. The substrate alignment method according to claim 8, further comprising the step of moving the first and second pressing members in the first direction and the second direction, respectively.

11. 11. The substrate alignment method of claim 10, further comprising the step of: after the second pressing member presses the other portion of the substrate in the second direction, moving the second pressing member away from the other portion before the first pressing member moves away from the one portion of the substrate.

12. A substrate processing method comprising the substrate alignment method according to any one of claims 8 to 11.

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