Method for manufacturing composite circuit board structure, and composite circuit board structure

Abstract

To provide a manufacturing method of a composite circuit board structure and a composite circuit board structure, which is unlikely to affect the precision of a thin circuit layer and is unlikely to cause short-circuit problems.SOLUTION: A method for manufacturing a composite circuit board structure includes preparing, patterning, sputtering, shielding, electroplating, and chemical etching steps. The electroplating step electroplates a first sputtered layout block of a first sputtered conductor layer to form a first electroplated layer connected to the first sputtered layout block. The chemical etching step removes the first shielding layer and the shielded first sputtered conductor layer, and leaves the first electroplated layer and the first sputtered layout block connected thereto to collectively define a first thin circuit layer.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to circuit boards, and more particularly to a composite circuit board structure and a method for manufacturing the same. [Background technology]

[0002] Many conventional ceramic circuit boards require the use of chemical etching to form the metal circuits. Summary of the Invention [Problem to be solved by the invention]

[0003] However, chemical etching has problems such as difficulty in maintaining precision due to lateral etching of the metal circuit, making it prone to short circuits, and the need to subsequently adapt existing ceramic circuit boards to accommodate circuits of different thicknesses depending on the application.

[0004] In view of these problems, the present invention aims to improve the above drawbacks, to concentrate on research and apply scientific principles, and ultimately to rationally design and effectively improve the above problems. [Means for solving the problem]

[0005] In view of the above problems, the present invention has the following configuration. A method for manufacturing a composite circuit board structure, the method comprising: preparing, patterning, sputtering, shielding, electroplating, and chemical etching steps; the preparing step providing a metallized ceramic substrate, the metallized ceramic substrate comprising a ceramic plate and a first metal layer and a second metal layer, the ceramic plate having a first plate surface and a second plate surface respectively located opposite to each other, the first metal layer and the second metal layer respectively forming the first plate surface and the second plate surface of the ceramic plate; the patterning step patterning the first metal layer and removing a local portion of the first metal layer to form a first thick circuit layer, the first thick circuit layer having a thickness of 200 μm or more, and a portion of the first plate surface being exposed outside the first thick circuit layer to define a first processing area; and the sputtering step sputtering the first processing area of ​​the ceramic plate. a first sputtered conductor layer is formed by shielding the first sputtered conductor layer, the first shielding layer having first patterned slots, and portions of the first sputtered conductor layer are exposed through the first patterned slots to define first sputtered layout blocks; the electroplating step electroplates the first sputtered layout blocks of the first sputtered conductor layer to form first electroplated layers connected to the first sputtered layout blocks; and the chemical etching step removes the first shielding layer and the shielded first sputtered conductor layer, leaving the first electroplated layer and the first sputtered layout blocks connected thereto to collectively define a first thin circuit layer, the first thin circuit layer having a thickness of between 1 μm and 150 μm.

[0006] Furthermore, the first thin circuit layer comprises a plurality of circuits, and the line distance between any two adjacent circuits or the line width of any one of the circuits is within the range of 30 μm to 60 μm after the shielding step, the electroplating step, and the chemical etching step.

[0007] Furthermore, the thickness of the first sputtering layout block is between 0.1 μm and 1 μm, and the material of the first electroplating layer is different from the material of the first sputtering layout block, so that the first electroplating layer is not etched laterally in the chemical etching step.

[0008] In the patterning step, the second metal layer is patterned to remove localized portions thereof to form a second thick circuit layer, the thickness of which is 200 μm or more.

[0009] In addition, in the patterning step, a portion of the second plate surface is exposed outside the second thick circuit layer to define a second processing area, in the sputtering step, the second processing area is sputtered to form a second sputtering conductor layer, and in the shielding step, a second shielding layer is formed on the second sputtering conductor layer.

[0010] In addition, the second shielding layer and the second sputtering conductor layer are removed in the chemical etching step to expose the second processing area.

[0011] In addition, in the shielding step, the second shielding layer has a second patterned slot, and a portion of the second sputtered conductor layer is exposed outside the second shielding layer through the second patterned slot to define a second sputtered layout block; in the electroplating step, the second sputtered layout block is electroplated to form a second electroplated layer connected thereto; in the chemical etching step, the second shielding layer and the second sputtered conductor layer it shields are removed, and the second electroplated layer and the second sputtered layout block connected thereto are removed to jointly define a second thin circuit layer.

[0012] In addition, in the preparation step, the metallized ceramic substrate is a direct-bonded copper ceramic substrate, and the first metal layer and the second metal layer are sintered and fixed onto the first plate surface and the second plate surface of the ceramic plate, respectively.

[0013] Furthermore, in the preparation step, the metallized ceramic substrate is an active metal brazed ceramic substrate, and the first metal layer and the second metal layer are brazed and fixed to the first plate surface and the second plate surface of the ceramic plate, respectively.

[0014] Also, in a composite circuit board structure including a ceramic plate, a first thick circuit layer, and a first thin circuit layer, the ceramic plate has a first plate surface and a second plate surface located opposite each other, the first thick circuit layer is formed on the first plate surface of the ceramic plate, the thickness of the first thick circuit layer is 200 μm or more, a portion of the first plate surface is exposed outside the first thick circuit layer to define a first processing area, the first thin circuit layer is formed in the first processing area of ​​the first plate surface, and the thickness of the first thin circuit layer is between 1 μm and 150 μm, the first thin circuit layer includes first sputtering layout blocks connected to the first plate surface and first electroplating layers connected to the first sputtering layout blocks, and the material of the first electroplating layer is different from the material of the first sputtering layout blocks.

[0015] Additionally, the first thick circuit layer and the first thin circuit layer are spaced apart from each other.

[0016] The composite circuit board structure also includes at least one horizontal joint formed on the first plate surface, and the at least one horizontal joint is connected to each other between the first thick circuit layer and the first thin circuit layer.

[0017] Also, the thickness of at least one of the lateral joints gradually decreases in a direction from the first thick circuit layer to the first thin circuit layer.

[0018] The composite circuit board structure further includes a second thick circuit layer, which is formed on the second plate surface of the ceramic plate, and the thickness of the second thick circuit layer is 200 μm or more.

[0019] Furthermore, a portion of the second surface is exposed outside the second thick circuit layer to define a second processing area, and the composite circuit board structure further includes a sputtered circuit layer formed in the second processing area of ​​the second surface, and the thickness of the sputtered circuit layer is between 0.1 μm and 1 μm.

[0020] The first thick circuit layer and the second thick circuit layer are sintered and fixed to the first plate surface and the second plate surface of the ceramic plate, respectively.

[0021] The first thick circuit layer and the second thick circuit layer are fixed by brazing to the first plate surface and the second plate surface of the ceramic plate, respectively.

[0022] The first thin circuit layer is formed on a projection area formed by orthogonally projecting the second thick circuit layer onto the first plate surface.

[0023] Furthermore, the first thin circuit layer has a plurality of circuits, and the lower limit of the line distance between any two adjacent circuits or the line width of any one of the circuits is between 30 μm and 60 μm.

[0024] Also, in a composite circuit board structure including a ceramic plate, a first thick circuit layer, and a sputtered circuit layer, the ceramic plate has a first plate surface and a second plate surface located opposite each other, the first thick circuit layer is formed on the first plate surface of the ceramic plate, and the thickness of the first thick circuit layer is 200 μm or more, a portion of the first plate surface is exposed outside the first thick circuit layer to define a first processing area, the sputtered circuit layer forms the first processing area of ​​the first plate surface, and the thickness of the sputtered circuit layer is between 0.1 μm and 1 μm. [Effects of the Invention]

[0025] As described above, according to the composite circuit board structure and manufacturing method thereof disclosed in the embodiments of the present invention, the steps and structure adopted only result in a slight lateral etching of the sputtered layout block (or sputtered circuit layer), which does not affect the precision of the thin circuit layer (or sputtered circuit layer) and is less likely to cause short circuits. The first thick circuit layer and the first thin circuit layer (or sputtered circuit layer) can be accurately formed through the above steps and can be adapted to different requirements. [Brief explanation of the drawings]

[0026] [Figure 1] 3 is a flowchart of a method for manufacturing a composite circuit board structure according to a first embodiment of the present invention. [Figure 2] FIG. 2 is an explanatory diagram of a preparation step in FIG. [Figure 3] FIG. 2 is an explanatory diagram of the patterning step in FIG. [Figure 4] FIG. 2 is an explanatory diagram of a sputtering step in FIG. [Figure 5] FIG. 2 is an explanatory diagram of a shielding step in FIG. [Figure 6] FIG. 2 is an explanatory diagram of the electroplating step in FIG. 1. [Figure 7] FIG. 2 is an explanatory diagram of the chemical etching step in FIG. 1. [Figure 8] FIG. 2 is a first explanatory diagram of a modified embodiment of the composite circuit board structure according to the first embodiment of the present invention. [Figure 9] FIG. 2 is a second explanatory diagram of a modified embodiment of the composite circuit board structure according to the first embodiment of the present invention. [Figure 10] FIG. 10 is a third explanatory diagram of a modified embodiment of the composite circuit board structure according to the first embodiment of the present invention; [Figure 11] 5A and 5B are explanatory diagrams of a composite circuit board structure according to a second embodiment of the present invention. [Figure 12] 10A to 10C are explanatory views of a shielding step in the manufacturing method of the composite circuit board structure according to the third embodiment of the present invention. [Figure 13] 10A and 10B are diagrams illustrating an electroplating step in a manufacturing method of a composite circuit board structure according to a third embodiment of the present invention. [Figure 14] 10A and 10B are diagrams illustrating a chemical etching step in a manufacturing method for a composite circuit board structure according to a third embodiment of the present invention. [Figure 15] 10A and 10B are explanatory diagrams of a composite circuit board structure according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0027] To better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and drawings, which are only used to explain the present invention and are not intended to limit the scope of the embodiments of the present invention, and the protection scope of the present invention is not limited thereto.

[0028] The following describes the embodiments of the "composite circuit board structure and its manufacturing method" described in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents described in this specification.

[0029] The present invention may be implemented or applied through other different specific embodiments. Various details in this description can be modified and changed in various ways based on various viewpoints and applications without departing from the concept of the present invention. Furthermore, as previously mentioned, the drawings in the present invention are merely for explanatory purposes and are not drawn to actual scale. In the following embodiments, technical contents related to the present invention will be described in more detail. However, the contents described in the present invention do not limit the technical scope of the present invention.

[0030] In this specification, terms such as "first," "second," and "third" may be used to describe various components or signals. However, these components or signals should not be limited by these terms, and these terms are primarily used to distinguish one component from another or one signal from another. Furthermore, the term "or" used in this specification includes any one or more combinations of the associated items, depending on the actual situation.

[0031] First Embodiment A first embodiment of the present invention will be described with reference to Figures 1 to 10. Here, Figures 1 to 7 show a manufacturing method S100 of a composite circuit board structure of an embodiment of the present invention, which includes or performs a preparing step S110, a patterning step S120, a sputtering step S130, a shielding step S140, an electroplating step S150, and a chemical etching step.

[0032] In this embodiment, the composite circuit board structure 100 is manufactured by sequentially performing steps S110 to S160 of the composite circuit board structure manufacturing method S100 as follows, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the above-described steps S110 to S160 of the composite circuit board structure manufacturing method S100 can be added, deleted, or adjusted according to design requirements.

[0033] Next, this embodiment will be described with reference to Figures 1 and 2. Here, Figure 1 is a flowchart of a method for manufacturing a composite circuit board structure according to a first embodiment of the present invention, and Figure 2 is an explanatory view of the preparation step in Figure 1 and a cross-sectional view of a composite circuit board structure 100.

[0034] 1 and 2, in the preparation step, a metallized ceramic substrate 1 is prepared. The metallized ceramic substrate 1 includes a ceramic plate 13 and a first metal layer 11 and a second metal layer 12 formed on both sides of the ceramic plate 13, respectively.

[0035] That is, the ceramic plate 13 has a first plate surface 131 and a second plate surface 132 located on opposite sides. A first metal layer 11 and a second metal layer 12 are formed on the first plate surface 131 and the second plate surface 132, respectively.

[0036] In the preparation step S110, the metallized ceramic substrate 1 may be a direct bonded copper (DBC) ceramic substrate, and the first metal layer 11 and the second metal layer 12 are sintered to be fixed to the first surface 131 and the second surface 132 of the ceramic plate 13. That is, in this embodiment, the first metal layer 11 and the second metal layer 12 are fixed to the ceramic plate 13 via connecting layers 14 (e.g., sintered layers), respectively.

[0037] Alternatively, in the preparation step S110, the metallized ceramic substrate 1 may be an active metal brazing (AMB) ceramic substrate, and the first metal layer 11 and the second metal layer 12 are brazed to the first plate surface 131 and the second plate surface 132 of the ceramic plate 13, respectively. That is, in this embodiment, the first metal layer 11 and the second metal layer 12 are each fixed to the ceramic plate 13 via a connecting layer 14 (such as a brazing layer).

[0038] Next, a description will be given with reference to Figures 1 to 3. Here, Figure 3 is an explanatory diagram of the patterning step in Figure 1, and is a cross-sectional view for explaining the patterning step.

[0039] In the patterning step S120, the first metal layer 11 and the second metal layer 12 shown in Fig. 2 are patterned, and a portion of the first metal layer 11 is removed to form the first thick circuit layer 111 shown in Fig. 3, and further, the second metal layer 12 shown in Fig. 2 is partially removed to form the second thick circuit layer 121 shown in Fig. 3. In addition, the first thick circuit layer 111 and the second thick circuit layer 121 can have different patterns (or thicknesses) from each other, but are not limited to this.

[0040] For example, in other embodiments not shown in the present invention, the manufacturing method S100 of the composite circuit board structure can omit the patterning of the second metal layer 12 shown in FIG. 2 according to design requirements (i.e., the second metal layer 12 can maintain its original structure without forming the second thick circuit layer 121 shown in FIG. 3).

[0041] 2 can be realized by, but not limited to, film attachment, exposure, development, etc. Furthermore, the thickness of the first thick circuit layer 111 and the second thick circuit layer 121 shown in FIG. 3 is greater than 200 micrometers (μm), a portion of the first plate surface 131 is exposed to the outside of the first thick circuit layer 111 and is defined as a first processing area 1311, and a portion of the second plate surface 132 is exposed to the outside of the second thick circuit layer 121 and is defined as a second processing area 1321.

[0042] The sputtering step S130 will be described with reference to Figures 1, 3, and 4. Here, Figure 4 is an explanatory view of the sputtering step in Figure 1, and is a cross-sectional view of the composite circuit board structure 100. A first sputtering conductor layer 2 is formed by sputtering on the processing area 1311 of the ceramic plate 13, and a second sputtering conductor layer 3 is formed by sputtering on the second processing area 1321, but the present invention is not limited to this.

[0043] For example, in other embodiments not shown in the present invention, if the second metal layer 12 shown in FIG. 2 is not patterned in the patterning step S120, the manufacturing method S100 of the composite circuit board structure does not form the second processing area 1321 and the second sputtered conductor layer 3 on its surface.

[0044] In particular, the material of the first sputtering conductor layer 2 is the same as the material of the second sputtering conductor layer 3, and the thickness of the first sputtering conductor layer 2 and the thickness of the second sputtering conductor layer 3 are each between 0.1 microns and 1 micron.

[0045] Next, the shielding step S140 will be described with reference to Figures 1, 4, and 5. Here, Figure 5 is an explanatory view of the shielding step in Figure 1, and is a cross-sectional view of the composite circuit board structure 100. A first shielding layer 4 is formed on the first sputtered conductor layer 2, and a second shielding layer 5 is formed on the second sputtered conductor layer 3.

[0046] Here, the first shielding layer 4 has a first patterned slot 41, and a portion of the first sputtering conductor layer 2 is exposed to the outside of the first shielding layer 4 from the first patterned slot 41, thereby defining a first sputtering layout block 21, but the present invention is not limited thereto.

[0047] For example, in another embodiment not shown in the present invention, if the second metal layer 12 shown in FIG. 2 is not patterned, the manufacturing method S100 of the composite circuit board structure may not require forming the second shielding layer 5 covering the second sputtered conductor layer 3 shown in FIG. 5 according to design requirements.

[0048] Next, the electroplating step S150 will be described with reference to Figures 1, 5, and 6. Here, Figure 6 is an explanatory view of the electroplating step in Figure 1, and is a cross-sectional view of the composite circuit board structure 100. The first sputtering layout block 21 of the first sputtering conductor layer 2 shown in Figure 5 is electroplated to form a first electroplated layer 6 connected to the first sputtering layout block 21.

[0049] In this embodiment, the material of the first electroplated layer 6 is different from the material of the first sputtered layout block 21, and the first electroplated layer 6 is advantageously not affected by lateral etching in the chemical etching step S160 described below.

[0050] Next, the chemical etching step S160 will be described with reference to Figures 1, 6, and 7. Here, Figure 7 is an explanatory diagram of the chemical etching step in Figure 1, and is a cross-sectional view of the composite circuit board structure 100.

[0051] The first shielding layer 4 shown in FIG. 6 and the first sputtered conductor layer 2 it shields are removed, leaving the first sputtered layout block 21 connected to the first electroplated layer 6 shown in FIG. 7, which are collectively defined as the first thin circuit layer C1.

[0052] Here, the thickness of the first thin circuit layer C1 is in the range of 1 micron to 150 microns, and the thickness of the first sputtered layout block 21 is in the range of 0.1 micron to 1 micron. Furthermore, in the chemical etching step S160 in this embodiment, the second shielding layer 5 and the second sputtered conductor layer 3 shown in Figure 6 are also removed, exposing the second processing area 1321 as shown in Figure 7.

[0053] As described above, in the manufacturing method S100 of the composite circuit board structure, only a small amount of lateral etching is formed on the first sputtering layout block 21 in the chemical etching step S160. Therefore, the precision of the first thin circuit layer C1 is hardly affected, and the first thin circuit layer C1 is less likely to short. Furthermore, the first thick circuit layer 111 and the first thin circuit layer C1 are accurately formed under the above process, which can meet different requirements.

[0054] Specifically, in this embodiment, the first thin circuit layer C1 may have a plurality of circuits (which may also be interpreted as tracks or lines) C11, and the line distance G between any two adjacent circuits C11 or the line width W of any one of the circuits C11 has a lower limit (or minimum value) between 30 microns and 60 microns after being determined by the shielding step S140 (e.g., FIG. 5), the electroplating step S150 (e.g., FIG. 6), and the chemical etching step S160 (e.g., FIG. 7).

[0055] That is, the line distance G or line width W of the first thin circuit layer C1 can be accurately maintained at a minimum value of 30 microns to 60 microns according to design requirements, but is not limited thereto.

[0056] As described above, in this embodiment, the implementation process of the method for manufacturing a composite circuit board structure S100 has been outlined using the above content. Below, the specific structure of the composite circuit board structure 100 manufactured by the method for manufacturing a composite circuit board structure S100 will be introduced from a structural perspective. Therefore, some technical features of the composite circuit board structure 100 can be referenced from the content of the method for manufacturing a composite circuit board structure S100, but the present invention is not limited thereto.

[0057] In this embodiment, the composite circuit board structure 100 includes a ceramic plate 13, a first thick circuit layer 111 and a first thin circuit layer C1 formed on a first plate surface 131, and a second thick circuit layer 121 formed on a second plate surface 132.

[0058] Here, the thickness of the first thick circuit layer 111 and the second thick circuit layer 121 are the same, and each is not less than 200 microns, but is not limited to this.

[0059] In this embodiment, the first thick circuit layer 111 and the second thick circuit layer 121 are sintered and fixed to the first plate surface 131 and the second plate surface 132 of the ceramic plate 13, respectively (via the two connecting layers 14). Alternatively, the first thick circuit layer 111 and the second thick circuit layer 121 are fixed by brazing to the first plate surface 131 and the second plate surface 132 of the ceramic plate 13, respectively (via the two connecting layers 14).

[0060] In detail, the first processing area 1311 of the first plate surface 131 is not covered by the first thick circuit layer 111 and is not connected to the corresponding connecting layer 14, and further, the second processing area 1321 of the second plate surface 132 is not covered by the second thick circuit layer 121 and is not connected to the corresponding connecting layer 14.

[0061] Furthermore, a first thin circuit layer C1 is formed in the first processing area 1311 of the first plate surface 131, and the first thin circuit layer C1 and the first thick circuit layer 111 are arranged at a distance from each other, and in this embodiment, no circuits (tracks, lines) are formed in the second processing area 1321 of the second plate surface 132.

[0062] Here, the first thin circuit layer C1 has a plurality of circuits C11, and the lower limit that can be formed by the line distance G between any two adjacent circuits C11 or the line width W of any one circuit C11 is between 30 microns and 60 microns.

[0063] Furthermore, in this embodiment, the first thin circuit layer C1 includes a first sputtering layout block 21 connected to the first board surface 131 and a first electroplating layer 6 connected to the first sputtering layout block 21, and the material of the first electroplating layer 6 is different from the material of the first sputtering layout block 21.

[0064] Here, the thickness of the first thin circuit layer C1 is between 1 micron and 150 microns, and the thickness of the first sputtered layout block 21 is between 0.1 micron and 1 micron.

[0065] 7 as an example, the composite circuit board structure 100 can be adjusted and modified based on design requirements. For example, as shown in FIGS. 8 to 10, the second thick circuit layer 121 may be an unpatterned structure. The first thin circuit layer C1 is formed on a projection area formed by orthogonally projecting the second thick circuit layer 121 onto the first board surface 131.

[0066] 9, the composite circuit board structure 100 further includes a lateral joint C4 formed on the first board surface 131, the lateral joint C4 being connected between the first thick circuit layer 111 and the first thin circuit layer C1. Here, the thickness of the lateral joint C4 gradually decreases from the first thick circuit layer 111 toward the first thin circuit layer C1. That is, the lateral joint C4 has a substantially one-sided tapered cross section.

[0067] 10, the composite circuit board structure 100 includes two lateral joints C4 formed on the first board surface 131. Each lateral joint C4 is connected between the first thick circuit layer 111 and the first thin circuit layer C1.

[0068] That is, the two horizontal joints C4 are respectively connected to both sides of the first thick circuit layer 111 and are respectively connected to two circuits (rails, lines) C11 of the first thin circuit layer C1 adjacent to the first thick circuit layer 111.

[0069] Here, the thickness of each lateral joint C4 gradually decreases from the first thick circuit layer 111 to the first thin circuit layer C1. That is, the cross section of each lateral joint C4 is approximately tapered, and the two lateral joints C4 and the first thick circuit layer 111 are formed to embed the corresponding connecting layer 14.

[0070] <Second embodiment> Please refer to Fig. 11, which is a second embodiment of the present invention. Here, Fig. 11 is an illustration of a composite circuit board structure according to the second embodiment of the present invention, which is a cross-sectional view of a composite circuit board structure 100.

[0071] This embodiment has many features in common with the first embodiment described above, so a detailed description of the features common to both embodiments will be omitted and only the differences between this embodiment and the first embodiment described above will be briefly described.

[0072] In this embodiment, the first electroplated layer is not formed on the composite circuit board structure 100, and the first sputtered layout block 21 is the sputtered circuit layer C3. In other words, in this embodiment, the sputtered circuit layer C3 of the composite circuit board structure 100 is formed in the first processing area 1311 of the first board surface 131. The thickness of the sputtered circuit layer C3 is between 0.1 microns and 1 micron.

[0073] <Third embodiment> Next, a third embodiment of the present invention will be described with reference to Figures 12 to 14. Here, Figure 12 is an explanatory view of a shielding step in the method for manufacturing a composite circuit board structure according to the third embodiment of the present invention. Also, Figure 13 is an explanatory view of an electroplating step in the method for manufacturing a composite circuit board structure according to the third embodiment of the present invention. Also, Figure 14 is an explanatory view of a chemical etching step in the method for manufacturing a composite circuit board structure according to the third embodiment of the present invention.

[0074] This embodiment has many features in common with the first embodiment 1 described above, so detailed explanations of the features common to both embodiments (patterning step, sputtering step) will be omitted, and only the differences between this embodiment and the first embodiment described above will be briefly explained.

[0075] In the shielding step S140, a first shielding layer 4 is formed on the first sputtered conductor layer 2, and a second shielding layer 5 is formed on the second sputtered conductor layer 3, as shown in FIG.

[0076] Here, the first shielding layer 4 has a first patterned slot 41, and a portion of the first sputtered conductor layer 2 is exposed to the first shielding layer 4 from the first patterned slot 41 to define a first sputtered layout block 21.

[0077] Furthermore, the second shielding layer 5 has a second patterned slot 51, and a portion of the second sputtering conductor layer 3 is exposed to the outside of the second shielding layer 5 from the second patterned slot 51 to define a second sputtering layout block 31, but the present invention is not limited thereto.

[0078] The electroplating step S150 will be described with reference to Figures 12 and 13. As shown in Figures 12 and 13, the first sputtering layout block 21 of the first sputtering conductor layer 2 and the second sputtering layout block 31 of the second sputtering conductor layer 3 are electroplated to form a first electroplated layer 6 connected to the first sputtering layout block 21 and a second electroplated layer 7 connected to the second sputtering layout block 31. Here, the first electroplated layer 6 and the second electroplated layer 7 are made of the same material but different from the material of the first sputtering layout block 21.

[0079] As shown in Figures 13 and 14, the chemical etching step S160 removes the first shielding layer 4 and the first sputtered conductor layer 2, removes the second shielding layer 5 and the second sputtered conductor layer 3 it shields, and leaves the first electroplated layer 6 and the connected first sputtered layout block 21, which are collectively defined as the first thin circuit layer C1, and also leaves the second electroplated layer 7 and the connected second sputtered layout block 31, which are collectively defined as the second thin circuit layer C2.

[0080] <Fourth embodiment> A fourth embodiment of the present invention will be described with reference to Fig. 15. Here, Fig. 15 is an explanatory diagram of a composite circuit board structure according to the fourth embodiment of the present invention, and is a cross-sectional view of a composite circuit board structure 100.

[0081] This embodiment has many features in common with the third embodiment described above, so the features common to the two embodiments will not be described again. The differences between this embodiment and the third embodiment described above will be described below.

[0082] In this embodiment, the second electroplated layer 7 is not formed on the composite circuit board structure 100. The second sputtered layout block 31 is the sputtered circuit layer C3. In other words, in this embodiment, the sputtered circuit layer C3 of the composite circuit board structure 100 is formed in the second processing area 1321 of the second board surface 132. The thickness of the sputtered circuit layer C3 is between 0.1 microns and 1 micron.

[0083] In this way, the composite circuit board structure 100 in this embodiment can form three different types of circuits to meet more different needs, such as the first thick circuit layer 111 formed by sintering or brazing, the first thin circuit layer C1 formed by sputtering and electroplating, and the sputtered circuit layer C3 formed by sputtering.

[0084] <Effects of the Examples of the Present Invention> As described above, the composite circuit board structure and manufacturing method thereof disclosed in the embodiment of the present invention employs a process and structure that performs only a small amount of lateral etching on the first sputtered layout block (or sputtered circuit layer). Therefore, the precision of the first thin circuit layer (or sputtered circuit layer) is hardly affected, and short circuits are unlikely to occur. Furthermore, the first thick circuit layer and the first thin circuit layer (or sputtered circuit layer) can be accurately formed using the above-mentioned process steps to meet different requirements.

[0085] Furthermore, the above description is merely a preferred embodiment of the present invention and does not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made using the contents of the specification and drawings of the present invention are also within the technical scope of the present invention. [Explanation of symbols]

[0086] 100 Composite circuit board structure 1. Metallized ceramic substrate 11 First metal layer 111 First thick circuit layer 12 Second Metal Layer 121 Second thick circuit layer 13 Ceramic plate 131 First Board 1311 First Processing Area 132 Second board 1321 Second Processing Area 14 Connecting layer 2. First sputtered conductor layer 21 First sputtering layout block 3 Second sputtered conductor layer 31 Second sputtering layout block 4. First Shielding Layer 41 First Patterned Slot 5 Second Shielding Layer 51 Second Patterned Slot 6 First electroplated layer 7 Second electroplating layer C1 First thin circuit layer C11 circuit C2 Second thin circuit layer C3 sputtered circuit layer C4 Horizontal joint G Line Distance W line width S100 Manufacturing method for composite circuit board structure S110 Preparation Steps S120 Patterning Step S130 Sputtering Step S140 Shielding Step S150 Electroplating Step S160 Chemical Etching Step

Claims

1. 1. A method for manufacturing a composite circuit board structure, comprising the steps of preparing, patterning, sputtering, shielding, electroplating, and chemical etching, the providing step providing a metallized ceramic substrate; The metallized ceramic substrate includes a ceramic plate, a first metal layer, and a second metal layer; the ceramic plate has a first plate surface and a second plate surface located opposite each other; the first metal layer and the second metal layer are formed on the first plate surface and the second plate surface of the ceramic plate, respectively; The patterning step includes patterning the first metal layer and removing a local portion of the first metal layer to form a first thick circuit layer, the thickness of the first thick circuit layer being 200 μm or more, and a portion of the first board surface being exposed outside the first thick circuit layer to define a first processing area; The sputtering step includes sputtering the first processing area of ​​the ceramic plate to form a first sputtering conductor layer; the shielding step includes forming a first shielding layer on the first sputtered conductor layer, the first shielding layer having a first patterned slot, and exposing a portion of the first sputtered conductor layer from the first patterned slot to the outside of the first shielding layer to define a first sputtered layout block; The electroplating step includes electroplating the first sputtered layout block of the first sputtered conductor layer to form a first electroplated layer interconnected with the first sputtered layout block; the chemical etching step removes the first shielding layer and the shielded first sputtered conductor layer, leaving the first electroplated layer and the first sputtered layout blocks connected thereto, which collectively define a first thin circuit layer, and the thickness of the first thin circuit layer is between 1 μm and 150 μm.

2. 2. The method for manufacturing a composite circuit board structure according to claim 1, wherein the first thin circuit layer comprises a plurality of circuits, and the line distance between any two adjacent circuits or the line width of any one of the circuits is within the range of 30 μm to 60 μm after the shielding step, the electroplating step, and the chemical etching step.

3. 2. The method for manufacturing a composite circuit board structure according to claim 1, wherein the thickness of the first sputtered layout block is between 0.1 μm and 1 μm, and the material of the first electroplated layer is different from the material of the first sputtered layout block, so that the first electroplated layer is not etched laterally in the chemical etching step.

4. 2. The method for manufacturing a composite circuit board structure according to claim 1, wherein in the patterning step, the second metal layer is patterned and locally removed to form a second thick circuit layer, the thickness of which is 200 μm or more.

5. 5. The method for manufacturing a composite circuit board structure according to claim 4, wherein in the patterning step, a portion of the second board surface is exposed outside the second thick circuit layer to define a second processing area, in the sputtering step, the second processing area is sputtered to form a second sputtered conductor layer, and in the shielding step, a second shielding layer is formed on the second sputtered conductor layer.

6. 6. The method for manufacturing a composite circuit board structure according to claim 5, wherein in the chemical etching step, the second shielding layer and the second sputtering conductor layer are removed to expose the second processing area.

7. 6. The method for manufacturing a composite circuit board structure according to claim 5, wherein in the shielding step, the second shielding layer has second patterned slots, and portions of the second sputtered conductor layer are exposed outside the second shielding layer through the second patterned slots to define second sputtered layout blocks; in the electroplating step, the second sputtered layout blocks are electroplated to form second electroplated layers connected thereto; and in the chemical etching step, the second shielding layer and the second sputtered conductor layer it shields are removed, leaving the second electroplated layers and the second sputtered layout blocks connected thereto to jointly define a second thin circuit layer.

8. 2. The method for manufacturing a composite circuit board structure according to claim 1, wherein in the preparation step, the metallized ceramic substrate is a direct-bonded copper ceramic substrate, and the first metal layer and the second metal layer are sintered and fixed onto the first plate surface and the second plate surface of the ceramic plate, respectively.

9. 2. The method for manufacturing a composite circuit board structure according to claim 1, wherein in the preparation step, the metallized ceramic substrate is an active metal brazed ceramic substrate, and the first metal layer and the second metal layer are brazed and fixed to the first plate surface and the second plate surface of the ceramic plate, respectively.

10. 1. A composite circuit board structure including a ceramic plate, a first thick circuit layer, and a first thin circuit layer, the ceramic plate has a first plate surface and a second plate surface located on opposite sides, the first thick circuit layer is formed on the first plate surface of the ceramic plate, and the thickness of the first thick circuit layer is 200 μm or more; a portion of the first board surface exposed outside the first thick circuit layer to define a first processing area; The first thin circuit layer is formed on the first processing area of ​​the first board surface, and the thickness of the first thin circuit layer is between 1 μm and 150 μm; The first thin circuit layer includes a first sputtering layout block connected to the first board surface, and a first electroplating layer connected to the first sputtering layout block, and the material of the first electroplating layer is different from the material of the first sputtering layout block; a connecting layer positioned between the first thick circuit layer and the ceramic plate; A composite circuit board structure, characterized in that the first processing area of ​​the first board surface is not covered by the first thick circuit layer and the connecting layer.

11. 11. The composite circuit board structure of claim 10, wherein the first thick circuit layer and the first thin circuit layer are spaced apart from each other.

12. 11. The composite circuit board structure of claim 10, wherein the composite circuit board structure includes at least one lateral joint formed on the first plate surface, and the at least one lateral joint is connected to each other between the first thick circuit layer and the first thin circuit layer.

13. 13. The composite circuit board structure of claim 12, wherein the thickness of at least one of the lateral joints gradually decreases in a direction from the first thick circuit layer to the first thin circuit layer.

14. the composite circuit board structure further includes a second thick circuit layer; the second thick circuit layer is formed on the second plate surface of the ceramic plate; 11. The composite circuit board structure of claim 10, wherein the second thick circuit layer has a thickness of 200 [mu]m or more.

15. A portion of the second board surface is exposed outside the second thick circuit layer to define a second processing area, and the composite circuit board structure further includes a sputtered circuit layer; 15. The composite circuit board structure of claim 14, wherein the sputtered circuit layer is formed on the second processing area of ​​the second board surface, and the thickness of the sputtered circuit layer is between 0.1 μm and 1 μm.

16. 15. The composite circuit board structure of claim 14, wherein the first thick circuit layer and the second thick circuit layer are sintered and fixed to the first plate surface and the second plate surface of the ceramic plate, respectively.

17. 15. The composite circuit board structure of claim 14, wherein the first thick circuit layer and the second thick circuit layer are brazed and fixed to the first plate surface and the second plate surface of the ceramic plate, respectively.

18. 15. The composite circuit board structure according to claim 14, wherein the first thin circuit layer is formed on a projection area formed by orthogonally projecting the second thick circuit layer onto the first board surface.

19. 11. The composite circuit board structure of claim 10, wherein the first thin circuit layer comprises a plurality of circuits, and the lower limit of the line distance between any two adjacent circuits or the line width of any one of the circuits is between 30 μm and 60 μm.

20. 1. A composite circuit board structure including a ceramic plate, a first thick circuit layer, and a sputtered circuit layer, the ceramic plate has a first plate surface and a second plate surface located on opposite sides, The first thick circuit layer is formed on the first plate surface of the ceramic plate, and the thickness of the first thick circuit layer is 200 μm or more, and a portion of the first plate surface is exposed outside the first thick circuit layer to define a first processing area; The sputtered circuit layer is formed on the first processing area of ​​the first plate surface, and the thickness of the sputtered circuit layer is between 0.1 μm and 1 μm; a connecting layer positioned between the first thick circuit layer and the ceramic plate; A composite circuit board structure, characterized in that the first processing area of ​​the first board surface is not covered by the first thick circuit layer and the connecting layer.

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