Wafer polishing system, mounting method and method of use

Abstract

The present invention discloses a wafer polishing system, which includes a wafer transport device and a polishing module. The wafer transport device includes a fixed seat and a sheet placement platform, and the fixed seat can move along the X-axis direction in the wafer transport passage with the sheet placement platform. The polishing module is installed on the side of the wafer transfer passage, and can pick up and polish the wafer on the sheet placement platform. A docking mechanism is provided between the fixed seat and the sheet placement platform, and the docking mechanism has a part connected to the fixed seat and a part connected to the sheet placement platform. When the two parts are docked, the sheet placement platform and the fixed seat realize a stopper function, and the docking mechanism can move within the plane where the X-axis and the Y-axis are located, and move the sheet placement platform to a target position. The present invention further discloses a mounting method for the wafer polishing system. The present invention further discloses a method for using the wafer polishing system. The present invention effectively ensures that the sheet placement platform moves to a target position, and is adjusted by overlapping in two dimensions, and has a wide docking range. The function of docking to realize a stopper can be performed in different processes and can be flexibly applied.

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor integrated circuit chip manufacturing technology, and more particularly to a wafer polishing system, a mounting method, and a method for using the same. [Background technology]

[0002] Chemical Mechanical Planarization (CMP) equipment typically includes a semiconductor equipment front-end module (EFEM), a cleaning unit, and a polishing unit. The EFEM primarily includes a wafer storage cartridge, a sheet-transport robot arm, and an air purification system. The cleaning unit primarily includes a variable number of megasonic cleaning components, roll brush cleaning components, drying components, and a wafer transport device between components. The polishing unit primarily includes a polishing table, a polishing head, a polishing fluid supply system, and a polishing pad repair system.

[0003] With the evolution of CMP equipment, in pursuit of higher polishing yields, one equipment usually contains multiple polishing units, and the transfer of wafers between each module during wafer processing has a significant impact on the overall polishing yield of the chemical mechanical planarization equipment. Wafer transfer between the polishing units and the outside, and between polishing units, is usually achieved by devices such as sheet carriers and robotic arms.

[0004] As shown in Figure 1, the sheet placement table and robot arm usually have multiple workstations, and the robot arm 101 moves from a to b, and the sheet placement table moves from c to d. However, due to various errors, the ab and cd lines cannot be perfectly parallel. As a result, when the robot arm comes into contact with the wafer, it deviates from the design state, making it difficult to remove the chip and ultimately damaging the wafer. Summary of the Invention

[0005] To overcome the deficiencies of the prior art, the present invention provides a wafer polishing system, a mounting method, and a method of use thereof that overcomes the misalignment that exists between the robot arm and the sheet loading platform and ensures that the robot arm can effectively remove the wafer.

[0006] The technical solution adopted by the present invention to solve the technical problem is a wafer polishing system, which includes: The wafer transport device includes a fixed seat and a sheet rest for carrying the wafer. The fixed seat can move along the X-axis direction within the wafer transport path while holding the sheet mounting table. The polishing module is provided on the side of the wafer transport path and can pick up and polish a wafer on a sheet mounting table. A docking mechanism is provided between the fixed seat and the sheet rest, and the docking mechanism has a portion connected to the fixed seat and a portion connected to the sheet rest. When both parts of the docking mechanism are docked, the sheet support and the fixed seat jointly realize a stopper function, and the docking mechanism can move within the plane where the X-axis and Y-axis are located, thereby moving the sheet support to a target position within the plane where the X-axis and Y-axis are located.

[0007] Furthermore, the docking mechanism a movable plate provided on the fixed seat so as to be movable by a slide rail; an upper docking section provided on the sheet placing table; a lower docking portion provided on the moving plate; The moving plate can move within a plane where the X-axis and Y-axis are located, and moves the sheet placing table to a target position by axial docking of the lower docking portion and the upper docking portion.

[0008] Furthermore, the upper docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the lower docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is close to the lower docking portion. Alternatively, the lower docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the upper docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is close to the upper docking portion.

[0009] Furthermore, the sheet placing platform has a slight movement state in which it floats at least in the X-axis direction and the Y-axis direction, and when the sheet placing platform is in the slight movement state, a docking mechanism realizes a fixed seat and stopper function, and the sheet placing platform switches from the slight movement state to a stop state.

[0010] Furthermore, the moving plate is provided with a groove that contacts the eccentric cam, and when an external force drives the eccentric cam to rotate, the moving plate moves along the plane where the X-axis and Y-axis are located.

[0011] The apparatus further includes a storage unit for storing the rotation angle of the eccentric cam at each working position.

[0012] Furthermore, the target position is a position where the sheet support and the clamp face each other, thereby overcoming the misalignment of the sheet support in the plane where the X-axis and Y-axis are located when the fixed seat moves to different working positions along the X-axis direction.

[0013] Furthermore, the number of the clamps is at least two, at least one clamp is used for loading and unloading the wafer before polishing, and at least one clamp is used for loading and unloading the wafer after polishing.

[0014] The present invention further discloses a method for installing the wafer polishing system, which includes the following steps. A part of the docking mechanism moves in the plane where the X-axis and Y-axis are located relative to the fixed seat. The sheet placing table moves up and down along the Z axis to approach the fixed seat. The docking mechanism and the sheet rest provide axial docking. The above three steps can be performed in sequence, in parallel, or simultaneously. The sheet placing table is moved to a target position within a plane where the X-axis and Y-axis are located.

[0015] It further includes the following steps: The moving plate moves within the plane where the X-axis and Y-axis are located relative to the fixed seat. The sheet placing table moves up and down along the Z axis to approach the fixed seat. The upper docking portion below the sheet placing table and the lower docking portion above the moving plate are docked in the axial direction. The above three steps can be performed in sequence, in parallel, or simultaneously. The sheet placing table is moved to a target position within a plane where the X-axis and Y-axis are located.

[0016] It further includes the following steps: The moving plate moves within the plane where the X-axis and Y-axis are located relative to the fixed seat. The sheet placing table starts to move up and down in the Z-axis direction and approaches the fixed seat. The moving plate continues to move relative to the fixed seat within the plane where the X-axis and Y-axis are located, and the sheet placing table continues to move up and down in the Z-axis direction until the upper docking section and the lower docking section dock in the axial direction, approaching the fixed seat. The moving plate stops moving. The sheet rest stops moving up and down.

[0017] It further includes the following steps: The moving plate moves to a target position within the plane where the X-axis and Y-axis are located relative to the fixed seat. The sheet placing table moves up and down in the Z-axis direction to approach the fixed seat until the upper docking section and the lower docking section are docked in the axial direction.

[0018] It further includes the following steps: The seat platform begins to move up and down in the Z-axis direction until the upper docking section and the lower docking section dock together, approaching the fixed seat. The moving plate holds the sheet placing table and moves to a target position in the Y-axis direction relative to the fixed seat.

[0019] The present invention also discloses a method for using the wafer polishing system, which includes the following steps. The docking mechanism docks the sheet mounting table and the fixed seat to realize a stopper function, and the sheet mounting table is positioned at a position opposite to the clamp target position, and the clamp places the wafer on the sheet mounting table. The polishing head of the polishing module rotates above the sheet mounting table, which switches to a fine-motion state that allows it to float in the X-axis and Y-axis directions, and the polishing head removes the wafer. The docking mechanism docks the sheet rest and the fixed seat to realize a stopper function, and the sheet rest moves to different working positions in the X-axis direction. The above three steps can be carried out in order, or any steps can be selected and combined, or one, two or more steps can be repeated and combined. The misalignment of the sheet placing table in the X-axis and Y-axis directions is removed, and the sheet placing table and the clamp are aligned.

[0020] The method further includes the following steps: After both parts of the docking mechanism have completed docking, the docking mechanism moves within the plane in which the X-axis and Y-axis lie, and positions the sheet mounting table opposite the clamp, and the clamp places the wafer on the sheet mounting table.

[0021] It further includes the following steps: The docking mechanism docks the sheet rest and the fixed seat to realize a stopper function, and positions the sheet rest in a position opposite the clamp. The clamp moves above the sheet placement table in the X-axis direction, carrying the wafer, and moves up and down in the Z-axis direction to place the wafer on the sheet placement table. The polishing head rotates above the sheet loading table. The sheet placing table moves up and down in the Z-axis direction and switches to a fine-motion state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head under the constraints of the stopper function structure. The seat platform moves up and down in the Z-axis direction, and a docking mechanism docks the seat platform with the fixed seat to achieve a stopper function. The polishing head picks up the wafer and polishes it. The sheet placement table moves in the X-axis direction to another working position. The sheet placing table moves up and down in the Z-axis direction and switches to a fine-motion state where it floats in the X-axis and Y-axis directions. A part of the docking mechanism moves to a target position within the plane where the X and Y axes are located due to the action of an external force. The sheet placing table moves up and down in the Z-axis direction and docks with the fixed seat using a docking mechanism to achieve a stopper function, eliminating misalignment in the X-axis and Y-axis directions and aligning with the clamp.

[0022] It further includes the following steps: The docking mechanism docks the sheet placing table and the fixed seat to realize a stopper function, and positions the sheet placing table at a position opposite the clamp target position. The clamp holds the wafer and moves above the sheet mounting table along the X-axis direction, then moves up and down in the Z-axis direction to place the wafer on the sheet mounting table, and then moves the clamp. The polishing head rotates above the sheet table, which rises in the Z-axis direction and floats within the plane where the X-axis and Y-axis are located to align the polishing head. The polishing head picks up the wafer on the sheet mounting table. The sheet rest moves up and down in the Z-axis direction, and the docking mechanism docks the sheet rest and the fixed seat to a target position required for the sheet rest at the next work position, limiting the position, and this target position is stored in the memory unit. The polishing head places the wafer in a polishing position in the polishing module. The sheet placing table moves in the X-axis direction to another working position.

[0023] The beneficial effects of the present invention are as follows: 1) Even when the fixed base moves to different work positions, it still docks with the sheet support table at the same work position to achieve the stop function. These operations effectively ensure that the sheet support table moves accurately to the target position. 2) The docking mechanism uses the sliding of the movable plate on the slide rail to achieve movement relative to the fixed base, and the axial docking of the upper and lower docking sections allows for two-dimensional overlap adjustment to achieve docking between the sheet support table and the fixed base. This provides a wide docking range, making it suitable for various use scenarios and widely applicable. 3) The docking mechanism has a relatively simple structure, is easy to assemble, and has a simple drive structure. 4) The stop function achieved by docking between the docking mechanisms can be performed in different processes, allowing for flexible application. 5) While ensuring that the docking between the polishing head and wafer transport device is not affected, the precise docking of the wafer transport device and the clamp is overlapped, resulting in a compact structure and precise double docking at each workstation. 6) The docking mechanism is located on the wafer transfer device and can move dynamically according to the wafer transfer device, adjusting the position of the wafer transfer device at each workstation. 7) The docking mechanism can memorize multiple positions for a specific workstation and adjust its position in real time to meet the misalignment needs of multiple clamp workstations. 8) It has a high adaptability to robot arms, allowing for accurate alignment in any situation, whether multiple robot arms are used at a single workstation, multiple workstations, or multiple workstations. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a schematic diagram of the misalignment that occurs when a robot arm and a sheet platform move to different workstations in the prior art. [Figure 2] 1 is a schematic diagram of the structure of a wafer polishing system of the present invention; [Figure 3] FIG. 3 is an enlarged view of the structure of portion A in FIG. 2. [Figure 4] 1 is a schematic diagram of the docking mechanism of the present invention when both parts of the docking mechanism are not fully docked. [Figure 5] 1 is a schematic diagram of the docking mechanism of the present invention when both parts of the docking mechanism have been docked. [Figure 6] 1 is a schematic diagram showing an eccentric cam of the docking mechanism of the present invention. [Figure 7] 10 is a schematic diagram of the structure between the sheet placing table and the moving plate of the present invention when the docking between the upper docking portion and the lower docking portion is not completed. FIG. [Figure 8] 10 is a schematic diagram of the structure between the sheet placing table and the moving plate of the present invention when the docking between the upper docking portion and the lower docking portion is completed. FIG. [Figure 9] 1 is a schematic diagram of the structure of the docking process between the upper docking portion and the lower docking portion of the present invention; [Figure 10] 1 is a schematic plan view of the moving plate of the present invention; [Figure 11] FIG. 1 is a schematic diagram of overcoming the misalignment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] In order to allow those skilled in the art to better understand the embodiments of the present invention, the following clearly and completely describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. It is clear that the described embodiments are only some embodiments of the present invention, and are not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without any creative work shall fall within the protection scope of the present invention.

[0026] As shown in FIG. 2, the wafer polishing system includes a wafer transport device 1 for transporting wafers within a wafer transport path 3, a polishing module 4 provided on one side of the wafer transport path 3, and a gripping mechanism having a clamp 6. As shown in the coordinate system of FIG. 2, the longitudinal extension direction of the wafer transport path 3 is defined as the X-axis direction, the width direction of the wafer transport path 3 as the Y-axis direction, and the direction perpendicular to the plane in which the X-axis and Y-axis exist as the Z-axis direction. The wafer transport device 1 further includes a fixed seat 11 and a sheet mounting table 12 for supporting the wafer 2, and the fixed seat 11 can move in the X-axis direction within the wafer transport path 3 while holding the sheet mounting table 12. The polishing module 4 can retrieve the wafer 2 from the sheet mounting table 12 and polish it.

[0027] A docking mechanism 5 is provided between the fixed seat 11 and the sheet support 12, one part of the docking mechanism 5 is connected to the fixed seat 11, and the other part is connected to the sheet support 12. When the two parts of the docking mechanism 5 are docked, the sheet support 12 and the fixed seat 11 function as a stopper, and the docking mechanism 5 can move within the plane on which the X and Y axes are located, thereby moving the sheet support 12 to a target position within the plane on which the X and Y axes are located.

[0028] Here, the sheet placing table 12 and the fixed seat 11 realizing a stopper function means that they do not move relative to each other, particularly in the plane where the X-axis and Y-axis are located. In this embodiment, the position of the fixed seat 11 is relatively fixed, and when the docking of both parts of the docking mechanism 5 is not complete, the fixed seat 11 and the sheet placing table 12 are connected in the conventional configuration, but are in a floating state relative to each other, and a small amount of relative movement may occur between them.

[0029] Therefore, when the docking mechanism 5 is present and the sheet platform 12 is not at the target position, the target position may be a position directly opposite the clamp 6 of the gripping mechanism, or may be another position. The position of the fixed base 11 is fixed relatively, and after both parts of the docking mechanism 5 complete docking, the positions of the docking mechanism 5 and the sheet platform 12 are fixed relatively, and the docking mechanism 5 again moves the sheet platform 12 to the target position by moving in the plane where the X-axis and Y-axis are located relative to the fixed base 11. Alternatively, after a part of the docking mechanism 5 moves in the plane where the X-axis and Y-axis are located and the position of the docking mechanism 5 is fixed relatively to the fixed base 11, both parts of the docking mechanism 5 complete docking and move the sheet platform 12 to the target position. The specific order is not limited.

[0030] As shown in FIGS. 2 to 8 , the docking mechanism 5 includes a movable plate 51, an upper docking section 53, and a lower docking section 54. The movable plate 51 is movably mounted on the fixed base 11 via slide rails 52. That is, the movable plate 51 moves relative to the fixed base 11 via the slide rails 52 within the plane in which the X-axis and Y-axis are located. The function of the slide rails 52 is conventionally realized and will not be described here. The upper docking section 53 is mounted on the sheet platform 12, and in this embodiment, it is particularly mounted on the lower surface of the sheet platform 12. However, it may be mounted at another position on the sheet platform 12 in other embodiments. The lower docking section 54 is mounted on the movable plate 51, and in this embodiment, it is particularly mounted on the upper surface of the movable plate 51, but it may be mounted at another position on the movable plate 51 in other embodiments.

[0031] The movable plate 51 is movable within a plane in which the X-axis and Y-axis are located, and the sheet placing table 12 is moved to a target position by docking the lower docking section 54 and the upper docking section 53 in the axial direction. As shown in FIG. 9 , the upper docking section 53 includes at least a first section 531 and a second section 532 that are coaxially arranged, and the inner diameter of the first section 531 matches the outer diameter of the lower docking section 54. Here, "matching" means that, when the lower docking section 54 is cylindrical, the inner diameter of the first section 531 and the outer diameter of the lower docking section 54 are equal. The inner diameter of the second section 532 is larger than the inner diameter of the first section 531, and the second section 532 is close to the lower docking section 54. In this embodiment, the tip of the lower docking section 54 is cut to form a tapered surface 541, and a tapered segment 533 is further formed between the first section 531 and the second section 532. As a result, when the upper docking portion 53 and the lower docking portion 54 are docked in the axial direction, as shown in Figure 9a, first the lower docking portion 54 is inserted into the second body 532, then the tapered surface 541 abuts against the inner wall of the throttle segment 533 and slides, as shown in Figure 9b, into the first body 531, and as shown in Figure 9c, axial docking of the upper docking portion 53 and the lower docking portion 54 is achieved.

[0032] Of course, in other embodiments, the restrictor segment 533 may be the second body 532, as long as its inner diameter is larger than that of the first body 531 to ensure easy insertion of the lower docking part 54.

[0033] Alternatively, the structure is interchangeable, i.e., the lower docking section includes at least a first section and a second section arranged coaxially, the inner diameter of the first section matches the outer diameter of the upper docking section, the inner diameter of the second section is larger than the inner diameter of the first section, and the second section is adjacent to the upper docking section.

[0034] The sheet placing table 12 has a slight movement state in which it can float at least in the X-axis direction and the Y-axis direction, and when the sheet placing table 12 is in the slight movement state, the docking mechanism 5 realizes a stopper function with the fixed seat 11, so that the sheet placing table 12 switches from the slight movement state to a stopped state. The slight movement state of the sheet placing table 12 here means that, although the fixed seat 11 and the sheet placing table 12 are connected by an existing configuration, they move relatively by a small amount. The stopped state here means that at least the sheet placing table 12 and the docking mechanism 5 do not move relatively.

[0035] As shown in Fig. 7, when the sheet placing table 12 is in the upper position, the upper docking portion 53 and the lower docking portion 54 are separated, and the sheet placing table 12 remains in the slight movement state. As shown in Fig. 8, when the sheet placing table 12 descends to the lower position along the Z axis, the upper docking portion 53 and the lower docking portion 54 enter an axial docking state, and the sheet placing table 12 switches to a stop state.

[0036] The docking mechanism 5 moves relative to the fixed seat 11 using an external force. In this embodiment, a groove 56 is formed in the movable plate 51. An eccentric cam 55 connected to a motor 551 extends into the groove 56 and contacts the inner wall of the groove 56. Specifically, as shown in FIG. 10 , the outer diameter of the eccentric cam 55 is equal to the width of the groove 56, the length of the groove 56 is greater than the outer diameter of the eccentric cam 55, the axis of the output shaft of the motor 551 is located at point A, the point of contact between the eccentric cam 55 and the groove 56 is located at normal line B, and the offset between A and B is in the X-axis direction. The position of the motor 551 is fixed relative to the movable plate 51. When the motor 551 drives the eccentric cam 55 to rotate, the movable plate 51 moves along the slide rail 52 within the plane defined by the X-axis and Y-axis, particularly in the X-axis direction. The movable plate 51 can be controlled to stop at any position within its stroke range depending on the rotation angle of the motor 551.

[0037] The wafer polishing system also includes a memory unit for storing the rotation angle of the eccentric cam 55 for each working position, so that it can quickly rotate to the target position according to the values ​​stored in the memory unit. In the above, one part of the docking mechanism 5 first moves within the plane of the X-axis and Y-axis, and then fixes it relative to the position of the fixed base 11. Then, the two parts of the docking mechanism 5 complete the docking and move the sheet support 12 to the target position; that is, the memory unit is used to first move the movable plate 51 to the target position, and then the two parts of the docking mechanism 5 are docked. The installation of the memory unit allows automatic adjustment of the clamps at different positions, and also allows one sheet support to accommodate multiple clamps.

[0038] When the target position of the sheet support table 12 is a position directly facing the clamp 6 of the gripping mechanism, the conventional clamp 6 structure can only move parallel to the X axis and move up and down along the Z axis, but cannot move along the Y axis. Therefore, by providing two work stations along the Z axis, when the clamp is in the upper position, wafers can be transported to different areas as they move along the X axis, and when the clamp is in the lower position, wafers can be placed on or removed from the sheet support table. This overcomes the problem of the sheet support table 12 not being able to directly face the clamp 6 due to misalignment of the X and Y axes of the sheet support table 12 when the fixed base 11 moves along the X axis to different work stations on the wafer transport path 3, for example, to wafer loading / unloading positions corresponding to the polishing heads of the two polishing modules.

[0039] To ensure that the clamps 6 do not contaminate the wafers 2, the number of clamps 6 is at least two, with at least one clamp used for loading and unloading wafers before polishing and at least one clamp used for loading and unloading wafers after polishing, i.e., the sheet-loading clamp is responsible for loading wafers to be polished onto the sheet-loading table, and the sheet-removing clamp is responsible for removing polished wafers from the sheet-loading table, with the two clamps located on either side of the wafer transport path 3. Of course, in other embodiments, the number of clamps 6 may be one.

[0040] A method for mounting a wafer polishing system is performed based on the structure of the wafer polishing system, and includes the following steps. A part of the docking mechanism 5 moves relative to the fixed seat 11 within the plane where the X-axis and Y-axis are located. The sheet placing table 12 moves up and down in the Z-axis direction to approach the fixed seat 11 . The docking mechanism 5 realizes docking with the sheet placing table 12 in the axial direction. The above three steps can be performed in sequence, in parallel, or simultaneously. The final goal is to move the sheet placing table 12 to a target position within a plane on which the X and Y axes are located.

[0041] More specifically, A mounting method for a wafer polishing system is performed based on the structure of the wafer polishing system, and includes the following steps. The movable plate 51 moves relative to the fixed base 11 within a plane on which the X-axis and Y-axis are located. The sheet placing table 12 moves up and down in the Z-axis direction to approach the fixed seat 11 . An upper docking portion 53 below the sheet placing table 12 and a lower docking portion 54 above the moving plate 51 are docked in the axial direction. The above three steps can be performed in sequence, in parallel, or simultaneously. The final goal is to move the sheet placing table 12 to a target position on a plane on which the X and Y axes are located.

[0042] Three embodiments will be specifically described below. Embodiment 1 A method for mounting a wafer polishing system based on the structure of the wafer polishing system includes the following steps. The moving plate 51 moves relative to the fixed base 11 within a plane on which the X-axis and Y-axis are located, and this movement is defined as movement A. The sheet placing table 12 starts to move up and down in the Z-axis direction and approaches the fixed seat 11; this movement is defined as movement B. The movable plate 51 continues to move within a plane of the X-axis and Y-axis relative to the fixed seat 11, and the sheet placing table 12 continues to move up and down in the Z-axis direction to approach the fixed seat; that is, both the above-mentioned movements A and B exist until the upper docking section 53 and the lower docking section 54 are docked in the axial direction. The movement of the moving plate 51 stops, and the movement A ends. The sheet placing table 12 stops moving up and down, and movement B ends. The start and end order of the above movements A and B is interchangeable and will not be explained in detail. In this embodiment, the entire docking process requires less movement time and is more time efficient.

[0043] Embodiment 2 A method for mounting a wafer polishing system based on the structure of the wafer polishing system includes the following steps. The moving plate 51 moves relative to the fixed base 11 within a plane on which the X-axis and Y-axis are located, and this movement is defined as movement A. When the robot reaches the target position, movement A ends. The sheet placing table 12 moves up and down in the Z-axis direction to approach the fixed seat 11, and this movement is defined as movement B. Movement B ends when the upper docking portion 53 and the lower docking portion 54 are axially docked. In this embodiment, the requirements for the structural design are low, and the position adjustment function of the sheet placing table 12 can be realized by simply driving the moving plate 51 with an external force.

[0044] Embodiment 3 The sheet placing table 12 moves up and down in the Z-axis direction to approach the fixed seat 11, and this movement is defined as movement B. When the upper docking section 53 and the lower docking section 54 are docked, movement B ends. The moving plate 51 moves in the Y-axis direction relative to the fixed base 11 while holding the sheet placing table 12, and this movement is defined as movement A. When the robot reaches the target position, movement A ends. In this embodiment, before the moving plate 51 moves, both parts of the docking mechanism are in a docking stop state, so that the external force directly drives the moving plate 51 and the sheet placing table 12 as a whole to move.

[0045] Embodiment 4 The wafer polishing system and its installation method are applied to a specific use scenario, i.e., a method for using a wafer polishing system is based on the structure and installation method of the wafer polishing system, and includes the following steps: The docking mechanism 5 docks the sheet mounting table 12 and the fixed seat 11 to achieve a stopper function, and the sheet mounting table 12 is positioned opposite the target position of the clamp 6, and the clamp 6 places the wafer 2 on the sheet mounting table 12. The above step may also be such that, after the docking between the sheet mounting table 12 and the fixed seat 11 is completed, the docking mechanism 5 is allowed to move within the plane in which the X-axis and Y-axis are located, and the sheet mounting table 12 is positioned opposite the clamp 6, and the clamp 6 places the wafer on the sheet mounting table 12. The polishing head 41 of the polishing module 4 rotates above the sheet placing table 12, the sheet placing table 12 switches to a fine movement state in which it can float in the X-axis and Y-axis directions, and the polishing head 41 removes the wafer 2. The docking mechanism 5 docks the sheet placing table 12 and the fixed seat 11 to realize a stopper function, and the sheet placing table 12 moves to different operating positions in the X-axis direction. The above three steps may be performed in order, or any steps may be selected and combined, or one, two or more of the steps may be repeated and combined. The misalignment of the sheet placing table 12 in the X-axis direction and the Y-axis direction is eliminated, and the position of the sheet placing table 12 with the clamp 6 is adjusted.

[0046] 11, this embodiment absorbs various errors that inevitably occur in a polishing apparatus during manufacturing and assembly, and prevents the actual movement paths of the clamp 6 and fixed base 11 along the X axis from becoming non-parallel due to the presence of errors. Furthermore, when the clamp 6 loads or unloads a wafer 2 on the sheet loading table 12 at a different position along the X axis, the alignment between the clamp 6 and the sheet loading table 12 does not match in the X axis and Y axis directions, especially in the Y axis direction. Taking FIG. 11 as an example, the ideal wafer loading / unloading position is position d, but due to errors, the actual wafer loading / unloading position is position e, with a deviation Δy between the two in the Y axis direction. This embodiment eliminates this deviation Δy, achieving accurate alignment between the clamp 6 and the sheet loading table 12. The following will specifically explain the third embodiment in the form of two embodiments.

[0047] Embodiment 5 A method of using a wafer polishing system, comprising the steps of: The docking mechanism 5 docks the sheet placing table 12 and the fixed seat 11 so that the sheet placing table 12 is positioned opposite the target position of the clamp 6, thereby realizing a stopper function. The clamp 6 moves above the sheet placing table 12 in the X-axis direction, carrying the wafer 2, and moves up and down in the Z-axis direction to place the wafer 2 on the sheet placing table 12. The polishing head 41 rotates above the sheet placing table 12 . The sheet placing table 12 moves up and down in the Z-axis direction, switches to a fine-motion state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head 41 under the constraints of the stopper function structure. The stopper function structure here can be realized by conventional technology, and no further description will be given. The sheet placing table 12 moves up and down in the Z-axis direction, and the docking mechanism 5 docks the sheet placing table 12 with the fixed seat 11 to realize a stopper function. The polishing head 41 takes out the wafer 2 and polishes it. The sheet placing table 12 moves in the X-axis direction to another working position. The sheet placing table 12 moves up and down in the Z-axis direction and switches to a fine movement state in which it can float in the X-axis and Y-axis directions. A moving plate 51, which is a part of the docking mechanism 5, is moved to a target position in a plane on which the X and Y axes are located by an external force. The sheet placing table 12 moves up and down in the Z-axis direction, and is docked with the fixed seat 11 by the docking mechanism 5 to realize a stopper function, eliminating misalignment in the X-axis and Y-axis directions, and aligning the sheet placing table 12 with the other clamp 6.

[0048] Embodiment 6 A method of using a wafer polishing system, comprising the steps of: The docking mechanism 5 docks the sheet placing table 12 and the fixed seat 11 so that the sheet placing table 12 is positioned opposite the target position of the clamp 6, thereby realizing a stopper function. The clamp 6 holds the wafer 2 and moves in the X-axis direction above the sheet placing table 12, then moves up and down in the Z-axis direction to place the wafer 2 on the sheet placing table 12, and the clamp 6 moves again. The polishing head 41 rotates above the sheet placing table 12. The sheet placing table 12 rises in the Z-axis direction, floats within the plane where the X-axis and Y-axis are located, and is aligned with the polishing head 41. The polishing head 41 picks up the wafer 2 on the sheet mounting table 12 . The sheet placing table 12 moves up and down in the Z-axis direction, and the docking mechanism 5 docks the sheet placing table 12 and the fixed seat 11 to the target position required for the sheet placing table 12 at the next working position, thereby realizing the stopper function, and the target position is stored in the memory unit. The polishing head 41 transports the wafer 2 to the polishing position in the polishing module 4 . The sheet placing table 12 moves in the X-axis direction to another working position.

[0049] Embodiment 7 A method of using a wafer polishing system, comprising the steps of: The clamp 6 holds the wafer 2 and moves in the X-axis direction above the sheet placing table 12, and moves up and down in the Z-axis direction so as to place the wafer 2 on the sheet placing table 12. The polishing head 41 rotates above the sheet placing table 12 . The sheet placing table 12 moves up and down in the Z-axis direction, switches to a fine movement state in which it can float in the X-axis and Y-axis directions, and moves to a position corresponding to the polishing head 41 under the constraints of the stopper function structure. A moving plate 51, which is a part of the docking mechanism 5, is moved to a target position in a plane on which the X and Y axes are located by an external force. The sheet placing table 12 moves up and down along the Z-axis direction, and docks with the fixed seat 11 via the docking mechanism 5 to achieve a stopper function. The polishing head 41 picks up the wafer on the sheet mounting table 12 and polishes it. The sheet placing table 12 moves in the X-axis direction to another working position.

[0050] The above specific embodiments are intended to illustrate the present invention and are not intended to limit the present invention. Any modifications and variations to the present invention within the spirit of the present invention and the scope of protection of the claims are included in the scope of protection of the present invention.

Claims

1. a wafer transport device (1) including a fixed seat (11) and a sheet placement table (12) for carrying a wafer (2), wherein the fixed seat (11) can move along the X-axis direction in a wafer transport path (3) together with the sheet placement table (12); a polishing module (4) provided on a side of the wafer transport path (3) and capable of picking up and polishing a wafer (2) on a sheet placing table (12), A docking mechanism (5) is provided between the fixed seat (11) and the seat placement table (12), The docking mechanism (5) has a portion connected to a fixed seat (11) and a portion connected to a seat mounting base (12), When both parts of the docking mechanism (5) are docked, the sheet mounting table (12) and the fixed seat (11) function as a stopper, and the docking mechanism (5) can move within a plane on which the X axis and the Y axis, which is the width direction of the wafer transport path (3), are located, thereby moving the sheet mounting table (12) to a target position within the plane on which the X axis and the Y axis are located.

2. The docking mechanism (5) a movable plate (51) provided on the fixed seat (11) so as to be movable by a slide rail (52); an upper docking section (53) provided on the sheet placing table (12); A lower docking portion (54) is provided on the moving plate (51), 2. The wafer polishing system according to claim 1, wherein the movable plate (51) can move within a plane in which the X-axis and Y-axis are located, and the sheet placing table (12) is moved to a target position by axial docking of the lower docking portion (54) and the upper docking portion (53).

3. The upper docking section (53) comprises at least a first section (531) and a second section (532) arranged coaxially, the inner diameter of the first section (531) conforming to the outer diameter of the lower docking section (54), the inner diameter of the second section (532) being larger than the inner diameter of the first section (531), and the second section (532) being adjacent to the lower docking section (54); Alternatively, the lower docking portion includes at least a first portion and a second portion arranged coaxially, the inner diameter of the first portion corresponds to the outer diameter of the upper docking portion, the inner diameter of the second portion is larger than the inner diameter of the first portion, and the second portion is adjacent to the upper docking portion.

4. 2. The wafer polishing system of claim 1, wherein the sheet mounting table (12) has a fine-motion state that allows it to float at least in the X-axis and Y-axis directions, and when the sheet mounting table (12) is in the fine-motion state, a stopper function is realized by the docking mechanism (5) and the fixed seat (11), and the sheet mounting table (12) switches from the fine-motion state to the stop state.

5. 3. The wafer polishing system according to claim 2, wherein the movable plate has a groove that comes into contact with the eccentric cam, and when an external force drives the eccentric cam to rotate, the movable plate moves along a plane on which the X-axis and Y-axis are located.

6. 6. The wafer polishing system according to claim 5, further comprising a memory unit for storing the rotation angle of said eccentric cam (55) at each working position.

7. 2. The wafer polishing system according to claim 1, wherein the target position is a position opposite the sheet mounting table (12) and the clamp (6), and is a position that overcomes any deviation in the plane in which the X-axis and Y-axis of the sheet mounting table (12) are located when the fixed seat (11) is moved to a different working position along the X-axis direction.

8. 8. The wafer polishing system of claim 7, wherein the number of clamps (6) is at least two, at least one clamp is used for loading and unloading the wafer before polishing, and at least one clamp is used for loading and unloading the wafer after polishing.

9. A method for mounting a wafer polishing system according to any one of claims 1 to 8, comprising: A step of moving a part of the docking mechanism (5) relative to the fixed seat (11) in a plane on which the X-axis and Y-axis are located; A step in which the sheet placing table (12) moves up and down along the Z-axis direction to approach the fixed seat (11); a step in which the docking mechanism (5) and the sheet placing table (12) realize axial docking; The above three steps can be performed in sequence, in parallel, or simultaneously. A method for mounting a wafer polishing system, comprising the steps of: moving the sheet mounting table (12) to a target position within a plane on which the X-axis and the Y-axis are located.

10. A step in which the moving plate (51) moves relative to the fixed seat (11) in a plane where the X-axis and Y-axis are located; A step in which the sheet placing table (12) moves up and down along the Z-axis direction to approach the fixed seat (11); and a step in which an upper docking portion (53) below the sheet placing table (12) and a lower docking portion (54) above the moving plate (51) are docked in the axial direction, The above three steps can be performed in sequence, in parallel, or simultaneously.

10. The method for mounting a wafer polishing system according to claim 9, wherein the sheet mounting table (12) is moved to a target position within a plane in which the X-axis and the Y-axis lie.

11. A step in which the moving plate (51) moves relative to the fixed seat (11) in a plane where the X-axis and Y-axis are located; a step in which the sheet placing table (12) starts to move up and down in the Z-axis direction and approaches the fixed seat (11); a step in which the moving plate (51) continues to move relative to the fixed seat (11) within a plane where the X-axis and Y-axis are located, and the sheet placing table (12) continues to move up and down in the Z-axis direction until the upper docking portion (53) and the lower docking portion (54) dock in the axial direction, approaching the fixed seat (11); The moving plate (51) stops moving; 10. The method for mounting a wafer polishing system according to claim 9, further comprising the step of: stopping the lifting and lowering of the sheet mounting table (12).

12. A step of moving the moving plate (51) to a target position within a plane where the X-axis and Y-axis are located relative to the fixed seat (11); 10. The method for mounting a wafer polishing system according to claim 9, wherein the sheet mounting table (12) moves up and down in the Z-axis direction to approach the fixed seat (11) until the upper docking portion (53) and the lower docking portion (54) are docked in the axial direction.

13. The sheet placing table (12) starts to move up and down in the Z-axis direction until the upper docking section (53) and the lower docking section (54) are docked together, and approaches the fixed seat (11).

10. The method for mounting a wafer polishing system according to claim 9, wherein the movable plate (51) moves together with the sheet placing table (12) in the Y-axis direction relative to the fixed seat (11) to a target position.

14. A method for using the wafer polishing system according to any one of claims 1 to 8, comprising: a step of docking the sheet placing table (12) and the fixed seat (11) with a docking mechanism (5) to realize a stopper function, thereby positioning the sheet placing table (12) at a position opposite to the target position of the clamp (6), and the clamp (6) placing the wafer (2) on the sheet placing table (12); a step in which the polishing head (41) of the polishing module (4) rotates above the sheet mounting table (12), the sheet mounting table (12) switches to a fine movement state in which it can float in the X-axis direction and the Y-axis direction, and the polishing head (41) removes the wafer (2); and a step of docking the sheet placing table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function, and moving the sheet placing table (12) to different working positions in the X-axis direction. The above three steps are carried out in order, or any steps are selected and combined, or one, two or more steps are repeatedly combined, A method of using a wafer polishing system, characterized in that after docking the sheet mounting table (12) and the fixed seat (11) using the docking mechanism (5), the sheet mounting table (12) is moved to a target position within a plane in which the X-axis and Y-axis are located, thereby eliminating any misalignment of the sheet mounting table (12) in the X-axis and Y-axis directions and aligning the sheet mounting table (12) with the clamp (6).

15. 15. A method of using a wafer polishing system as described in claim 14, wherein after both parts of the docking mechanism (5) have completed docking, the docking mechanism (5) moves in a plane along the X-axis and Y-axis to position the sheet mounting table (12) opposite the clamp (6), and the clamp (6) places the wafer (2) on the sheet mounting table (12).

16. a step of docking the sheet placing table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function, thereby positioning the sheet placing table (12) at a position opposite the clamp (6); a step in which the clamp (6) holds the wafer (2) and moves in the X-axis direction above the sheet placement table (12), and moves up and down in the Z-axis direction to place the wafer (2) on the sheet placement table (12); A step in which the polishing head (41) rotates above the sheet placing table (12); a step in which the sheet placing table (12) moves up and down in the Z-axis direction, switches to a fine movement state in which it can float in the X-axis and Y-axis directions, and moves to a corresponding position of the polishing head (41) under the constraints of the stopper function structure; a step of lifting and lowering the sheet placing table (12) in the Z-axis direction and docking the sheet placing table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function; A polishing head (41) picks up and polishes a wafer (2); moving the sheet placing table (12) to another working position in the X-axis direction; a step of moving the sheet placing table (12) up and down in the Z-axis direction and switching to a fine movement state in which the sheet placing table (12) can float in the X-axis and Y-axis directions; a step of moving a part of the docking mechanism (5) to a target position in a plane where the X-axis and Y-axis are located by the action of an external force; 15. A method of using a wafer polishing system as described in claim 14, further comprising a step of lifting and lowering the sheet mounting table (12) in the Z-axis direction and docking it with the fixed seat (11) by the docking mechanism (5) to achieve a stopper function, thereby eliminating misalignment in the X-axis direction and Y-axis direction and aligning the sheet mounting table (12) with the clamp (6).

17. a step of docking the sheet placing table (12) and the fixed seat (11) by the docking mechanism (5) to realize a stopper function, and positioning the sheet placing table (12) at a position opposite to the target position of the clamp (6); a step in which the clamp (6) holds the wafer (2) and moves along the X-axis direction to above the sheet mounting table (12), moves up and down along the Z-axis direction to place the wafer (2) on the sheet mounting table (12), and then moves the clamp (6); A step in which the polishing head (41) rotates above the sheet placing table (12); a step in which the sheet placing table (12) rises in the Z-axis direction and floats in a plane where the X-axis and Y-axis are located, thereby aligning with the polishing head (41); A step in which a polishing head (41) acquires a wafer (2) on a sheet mounting table (12); The sheet placement table (12) moves up and down in the Z-axis direction, and the sheet is placed by the docking mechanism (5). a step of docking the table (12) and the fixed seat (11) to realize a stopper function, and setting the sheet placing table (12) to a target position required for the next work position, and storing this target position in a memory unit; a polishing head (41) carrying the wafer (2) to a polishing position in a polishing module (4); 15. The method of claim 14, further comprising the step of: moving the sheet placing table (12) to another working position in the X-axis direction.

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