Processing device and alignment condition registration method

Abstract

To execute re-registration of an alignment condition with excellent workability.SOLUTION: A processing device having a processing unit for processing a processing object along a street comprises: a camera which images the processing object; an alignment condition registration unit; and a control unit. A key pattern, a position of the key pattern in the processing object, and a positional relation between the key pattern and the street are registered in the alignment condition registration unit. The control unit detects the key pattern from a photographed image obtained by imaging the processing object with the camera. Alignment can be executed by specifying a position of the street of the processing object on the basis of the positional relation between the key pattern and the street registered in the alignment condition registration unit. The key pattern, the position of the key pattern in the processing object, and the positional relation between the key pattern and the street registered in the alignment condition registration unit can be individually re-registered in the alignment condition registration unit.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus in which alignment conditions for detecting streets (lines to be processed) by observing a workpiece are registered, and to a method for registering alignment conditions. [Background technology]

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and computers, first, multiple intersecting processing lines called streets are set on the surface of a semiconductor wafer or other material. Then, devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each area defined by the streets. Next, the wafer is ground from the backside to thin it to a predetermined thickness, and then divided along the streets to form individual device chips.

[0003] The wafer is divided by a processing device such as a cutting device equipped with an annular cutting blade or a laser processing device that processes the workpiece with a laser. These processing devices are equipped with a camera that captures images of the surface of the workpiece to detect the positions of the streets on the workpiece. Furthermore, the processing device has registered therein the shapes of characteristic structures provided on the surface of the workpiece as key patterns, and the positional relationship between these key patterns and the streets is also registered.

[0004] The camera scans the workpiece while capturing an image of the workpiece, and detects a key pattern from the captured image using a technique such as pattern matching. The position of the street can then be identified based on the positional relationship between the registered key pattern and the street. Alignment is then performed to adjust the position of a processing tool such as a cutting blade to match the detected street position.

[0005] In processing equipment, in order to detect the position of streets at high speed, pattern matching is sometimes performed in two stages. That is, first, a camera captures an image of the surface of the workpiece at low magnification over a wide field of view to detect a key pattern for low-magnification observation. Then, the camera captures an image at high magnification of only a specific range determined based on the key pattern for low-magnification observation. After that, the key pattern is detected and the position of the street is identified (see Patent Document 1).

[0006] To align a processing tool using such pattern matching, it is necessary to register in advance in the memory unit of the processing device alignment conditions including the key pattern, the position of the key pattern, the positional relationship between the key pattern and the planned processing line, etc. When registering the alignment conditions in the memory unit of the processing device, the worker executes a dedicated program or the like stored in the memory unit and registers each item of the alignment conditions according to a predetermined procedure.

[0007] Specifically, the worker determines the light receiving level and focus position of the camera, adjusts the orientation of the workpiece as seen by the camera, observes the workpiece at low magnification with the camera, selects a suitable structure as a key pattern for low-magnification observation, and registers it in a memory unit. At this time, the relative positional relationship between the chuck table and the camera is acquired, the position of the key pattern for low-magnification observation on the workpiece is specified, and the position of the key pattern for low-magnification observation is registered in the memory unit.

[0008] The workpiece is then observed at high magnification with a camera, and a suitable structure is selected as a key pattern and registered in a memory unit. At this time, the relative positional relationship between the chuck table and the camera is acquired, the position of the key pattern on the workpiece is identified, and the position of the key pattern is registered in the memory unit.

[0009] Next, the chuck table is moved to bring the street of the workpiece into the field of view of the camera, and the position of the center line of the street in the image is specified. At this time, the positional relationship between the key pattern and the street is registered in the memory unit.

[0010] It is preferable to register the key pattern and its positional relationship separately in a first direction and a second direction perpendicular to the first direction. That is, the worker rotates the chuck table 90 degrees, adjusts the orientation of the workpiece captured by the camera, observes the workpiece at high magnification, selects a suitable structure as the second key pattern, and registers the position of the second key pattern in the memory. Next, the worker places a street along the second direction in the field of view of the camera and specifies the position of the center line of the street captured in the captured image. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] Special Publication No. 3-27043 Summary of the Invention [Problem to be solved by the invention]

[0012] If there is a problem with some of the alignment conditions registered in the memory of the processing device through these multiple processes, the alignment of the processing unit for processing the workpiece will not be performed properly. In this case, the processing device may stop or the processing quality may deteriorate. Therefore, the alignment conditions will be re-registered in the memory.

[0013] However, in the past, even if there was a problem with some of the conditions, it was necessary to re-run the alignment condition program and perform all procedures. This required registering all items, including those that had no problems, which was extremely time-consuming and labor-intensive. Furthermore, re-registering alignment conditions for items that had no problems could actually result in problems with the alignment conditions registered for those items, potentially reducing alignment accuracy.

[0014] The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing apparatus and a method for registering alignment conditions that enable re-registration of alignment conditions with good operability. [Means for solving the problem]

[0015] According to one aspect of the present invention, there is provided a processing device having a chuck table for holding a workpiece, and a processing unit for processing the workpiece held by the chuck table along streets defined on the surface of the workpiece, the processing device further comprising: a camera for capturing an image of the workpiece held on the chuck table; and an alignment condition registration unit for registering alignment conditions to be referenced when the camera detects the streets of the workpiece and performs alignment to adjust the position of the processing unit relative to the workpiece; a control unit for controlling components including the chuck table and the processing unit; an input interface for inputting the alignment conditions to the alignment condition registration unit; and a display unit for displaying an image captured by the camera; A key pattern that can be detected when the surface of the workpiece is imaged with the camera, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street are registered as conditions, and the control unit detects the key pattern registered in the alignment condition registration unit from an image obtained by imaging the surface of the workpiece held on the chuck table with the camera, and identifies the position of the street of the workpiece held on the chuck table based on the positional relationship between the key pattern and the street registered in the alignment condition registration unit, thereby performing the alignment, and the key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street can each be individually re-registered in the alignment condition registration unit. When correcting either the key pattern registered in the alignment condition registration unit or the position of the key pattern on the workpiece, the control unit causes the camera to capture an image of the surface of the workpiece at the position of the key pattern on the workpiece registered in the alignment condition registration unit and displays the obtained image on the display unit, and when correcting the positional relationship between the key pattern registered in the alignment condition registration unit and the street, the control unit causes the camera to capture an image of the surface of the workpiece at the position of the street specified based on the positional relationship between the key pattern registered in the alignment condition registration unit and the street and displays the obtained image on the display unit. A processing device characterized by the above features is provided.

[0016] Preferably, the camera is capable of imaging the workpiece at a first magnification and a second magnification higher than the first magnification, and the alignment condition registration section further registers a key pattern for low-magnification observation that can be detected when the surface of the workpiece is imaged by the camera at the first magnification, and a position of the key pattern for low-magnification observation on the workpiece, and when the alignment is performed, the control unit determines the alignment from a low-magnification image obtained by imaging the surface of the workpiece held on the chuck table by the camera at the first magnification. The key pattern for low-magnification observation registered in the alignment condition registration unit is detected, an imaging area is determined based on the position of the key pattern for low-magnification observation on the workpiece registered in the alignment condition registration unit and the position of the key pattern on the workpiece, and the imaging area of ​​the workpiece is imaged with the camera at the second magnification to obtain the captured image, and the key pattern for low-magnification observation registered in the alignment condition registration unit and the position of the key pattern for low-magnification observation on the workpiece can each be individually re-registered in the alignment condition registration unit.

[0018] According to another aspect of the present invention, there is provided a control unit including a chuck table for holding a workpiece, a machining unit for machining the workpiece held by the chuck table along streets set on the surface of the workpiece, a camera for imaging the workpiece held on the chuck table, and an alignment condition registration unit, wherein the alignment condition registration unit stores alignment conditions that are referenced when the camera detects the streets of the workpiece and performs alignment to adjust the position of the machining unit relative to the workpiece, and the alignment condition registration unit stores alignment conditions that are detectable when the camera images the surface of the workpiece. A method for registering alignment conditions in a processing device in which a key pattern, a position of the key pattern on the workpiece, and a positional relationship between the key pattern and the street are registered, the method comprising: a selection step of selecting an item to be corrected of the alignment condition from options including the key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street; and a correction step of re-registering in the alignment condition registration unit only the alignment condition related to the item to be corrected selected in the selection step, thereby correcting the item to be corrected. The camera of the processing device is capable of capturing an image of the workpiece at a first magnification and a second magnification higher than the first magnification, and the alignment condition registration unit further registers, as the alignment conditions, a key pattern for low-magnification observation that is detectable when the surface of the workpiece is captured by the camera at the first magnification, and a position of the key pattern for low-magnification observation on the workpiece, and the key pattern is detectable when the surface of the workpiece is captured by the camera at the second magnification, and the options further include the key pattern for low-magnification observation and the position of the key pattern for low-magnification observation on the workpiece. The present invention provides a method for registering alignment conditions, characterized by:

[0020] More preferably, the processing apparatus further includes a display unit for displaying an image captured by the camera, and if the correction item of the alignment conditions selected in the selection step is either the key pattern or the position of the key pattern on the workpiece, then in the correction step, the surface of the workpiece is imaged by the camera at the position of the key pattern on the workpiece registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit; and if the correction item of the alignment conditions selected in the selection step is the positional relationship between the key pattern and the street, then in the correction step, the surface of the workpiece is imaged by the camera at the position of the street specified based on the positional relationship between the key pattern and the street registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit. According to another aspect of the present invention, there is provided a method for registering alignment conditions in a processing apparatus having a chuck table for holding a workpiece, a processing unit for processing the workpiece held by the chuck table along streets set on the surface of the workpiece, a camera for imaging the workpiece held on the chuck table, and a control unit having an alignment condition registration unit, wherein the alignment condition registration unit registers a key pattern that can be detected when the surface of the workpiece is imaged by the camera, a position of the key pattern on the workpiece, and a positional relationship between the key pattern and the street as alignment conditions to be referenced when the camera detects the street on the workpiece and performs alignment to adjust the position of the processing unit relative to the workpiece, the method comprising: a selection step of selecting a correction item for the alignment condition from options including the key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street; and and a correction step of re-registering in the alignment condition registration section only the alignment condition related to the correction item selected in the selection step to correct the correction item, wherein the processing apparatus further comprises a display unit that displays an image captured by the camera, and if the correction item of the alignment condition selected in the selection step is either the key pattern or the position of the key pattern on the workpiece, the correction step involves capturing an image of the surface of the workpiece with the camera at the position of the key pattern on the workpiece registered in the alignment condition registration section by the control unit, and displaying the obtained image on the display unit, and if the correction item of the alignment condition selected in the selection step is the positional relationship between the key pattern and the street, the correction step involves capturing an image of the surface of the workpiece with the camera at the position of the street specified on the basis of the positional relationship between the key pattern and the street registered in the alignment condition registration section by the control unit, and displaying the obtained image on the display unit. [Effects of the Invention]

[0021] In a processing apparatus and a method for registering alignment conditions according to one aspect of the present invention, a key pattern, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street are registered as alignment conditions in an alignment condition registration section of a control unit. If a problem with any of these alignment conditions is discovered during the process of processing the workpiece with the processing apparatus, it is necessary to re-register the alignment conditions.

[0022] In this case, the operator selects a specific item of the alignment conditions as an item to be corrected, and re-registers only the alignment conditions related to the selected item in the alignment condition registration unit to correct the item to be corrected. This eliminates the need to re-register all alignment conditions from scratch, and allows only problematic items to be corrected, allowing for quick re-registration of alignment conditions. Furthermore, since the registered content of items that are not particularly problematic is not changed, re-registration of alignment conditions does not cause any problems, and alignment accuracy is not adversely affected.

[0023] Therefore, one aspect of the present invention provides a processing apparatus and a method for registering alignment conditions that allow re-registration of alignment conditions with good workability. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a perspective view schematically showing a workpiece to be machined by a cutting device (machining device). [Figure 2] FIG. 2 is a perspective view schematically showing a cutting device (processing device). [Figure 3] FIG. 2 is an enlarged plan view schematically showing the surface of a workpiece. [Figure 4] FIG. 10 is a plan view schematically showing a screen for correcting alignment conditions. [Figure 5] 10 is a flowchart showing the flow of each step of a method for registering alignment conditions. DETAILED DESCRIPTION OF THE INVENTION

[0025] An embodiment of the present invention will be described with reference to the drawings. According to the processing device and alignment condition registration method of this embodiment, specific items of alignment conditions can be registered in the alignment condition registration section of the control unit. First, the workpiece to be processed by the processing device will be described. Figure 1 is a perspective view showing a workpiece 1 in a schematic manner.

[0026] The workpiece 1 is a disk-shaped wafer made of, for example, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or other semiconductor material. Alternatively, the workpiece 1 is made of a material such as sapphire, glass, or quartz. Examples of the glass include alkali glass, alkali-free glass, soda-lime glass, lead glass, borosilicate glass, and quartz glass.

[0027] The surface 1a of the workpiece 1 is partitioned by a plurality of streets (lines to be processed) 3 that intersect with one another. Furthermore, devices 5 such as ICs and LSIs are formed in each area partitioned by the streets 3 on the surface 1a of the workpiece 1. Furthermore, wiring layers, electrodes, etc. (not shown) that contribute to the input and output of electrical signals to the devices 5 are formed on the surface 1a of the workpiece 1. However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece 1. There are also no restrictions on the type, number, shape, structure, size, arrangement, etc. of the devices 5.

[0028] When workpiece 1, which has a plurality of devices 5 provided on its surface 1a, is divided along streets 3, a plurality of chips are obtained, each having a device 5. Workpiece 1 is carried into a processing device in the state of frame unit 11 shown in FIG. 1 and divided. That is, workpiece 1 to be processed and divided is preferably integrated in advance with tape 7, known as dicing tape, and an annular frame 9, and frame unit 11 is preferably formed.

[0029] Handling the workpiece 1 via the frame 9 and tape 7 protects the workpiece 1 from shocks and other impacts that occur during transportation, making it easier to handle the workpiece 1. Furthermore, the individual chips formed by dividing the workpiece 1 are supported by the tape 7, making it easier to handle the chips that are formed. Thereafter, when the tape 7 is expanded radially outward within the opening 9a of the frame 9, the spacing between the chips increases, making it easier to pick up the chips.

[0030] The tape 7 includes a flexible sheet-like substrate and an adhesive layer provided on the substrate. The substrate may be made of, for example, polyolefin (PO), polyethylene terephthalate (PET), polyvinyl chloride, polystyrene, etc. The adhesive layer may be made of, for example, silicone rubber, an acrylic material, or an epoxy material.

[0031] The annular frame 9 is made of a material such as metal and has an opening 9a with a diameter larger than that of the workpiece 1. Tape 7 is attached in advance to the periphery of the opening 9a of the frame 9 so as to close the opening 9a, and the adhesive surface of the tape 7 is exposed in the opening 9a. Then, by attaching the back surface 1b of the workpiece 1 to the adhesive surface exposed in the opening 9a of the tape 7 attached to the frame 9, the frame unit 11 can be formed.

[0032] To divide the workpiece 1, for example, a cutting device equipped with a cutting unit equipped with an annular cutting blade is used. Alternatively, a laser processing device is used that can laser process the workpiece 1 by irradiating the workpiece 1 with a laser beam along the streets 3. In these processing devices, an image of the surface 1a of the workpiece 1 is taken with a camera to detect the streets 3, and alignment is performed in advance to adjust the positions of processing units such as the cutting unit and laser processing unit so that the workpiece 1 can be processed along the streets 3.

[0033] The following description will be given taking a cutting device as an example of the processing device according to this embodiment, but the processing device is not limited to cutting devices. Fig. 2 is a perspective view showing a cutting device (processing device) 2. A cassette table 6 on which a cassette 13 is placed is provided at a corner of a base 4 of the cutting device 2. The cassette table 6 can be raised and lowered in the vertical direction (Z-axis direction) by an elevation mechanism (not shown). In Fig. 2, the outline of the cassette 13 placed on the cassette table 6 is shown by a two-dot chain line.

[0034] A temporary placement table 10 including a pair of guide rails 8 that move toward and away from each other while maintaining a parallel state in the Y-axis direction (left-right direction, indexing feed direction) is provided on the upper surface of the base 4 at a position adjacent to the cassette table 6. Also, a carry-out unit 12 that carries out, from the cassette 13, a frame unit 11 housed in a cassette 13 placed on the cassette table 6 is provided on the upper surface of the base 4 at a position adjacent to the temporary placement table 10. The carry-out unit 12 has a gripping portion on its front surface that can grip a frame 9.

[0035] When unloading the frame unit 11 housed in the cassette 13, the unloading unit 12 is moved toward the cassette 13 and grips the frame 9 with its gripping portion, and then the unloading unit 12 is moved in a direction away from the cassette 13. Then, the frame unit 11 is pulled out from the cassette 13 onto the temporary placement table 10. At this time, the pair of guide rails 8 are moved in conjunction with each other in the X-axis direction, and the frame 9 is sandwiched between the pair of guide rails 8, thereby positioning the frame unit 11 at a predetermined position.

[0036] An opening 4a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed at a position adjacent to the cassette table 6 on the top surface of the base 4. A ball screw type X-axis movement mechanism (processing feed unit) (not shown) and a bellows-shaped dustproof and drip-proof cover 26 that covers the top of the X-axis movement mechanism are disposed within the opening 4a.

[0037] The X-axis movement mechanism is connected to the lower part of the X-axis movement table 16 and has the function of moving the X-axis movement table 16 in the X-axis direction. For example, the X-axis movement table 16 moves between a loading / unloading area adjacent to the cassette table 6 and a processing area below the cutting unit 32, which will be described later.

[0038] A table base 18 and a chuck table 20 mounted on the table base 18 are provided on the X-axis moving table 16. A porous plate (not shown) is provided on top of the chuck table 20, and one end of a suction path (not shown) formed in the chuck table 20 is connected to the porous plate. A suction source (not shown) is connected to the other end of the suction path. When the suction source is operated, negative pressure is generated on the surface of the porous plate. As a result, the surface of the porous plate functions as a holding surface 22 that suctions and holds the workpiece 1.

[0039] A rotation drive mechanism (not shown) that rotates the chuck table 20 around a predetermined rotation axis is provided below the chuck table 20. Clamps 24 that grip the frame 9 are provided radially outward of the chuck table 20. The chuck table 20 moves in the X-axis direction by the X-axis movement mechanism described above.

[0040] The frame unit 11 is transported from the temporary placement table 10 to the chuck table 20 by a first transport unit 14 provided at a position adjacent to the temporary placement table 10 and the opening 4a on the upper surface of the base 4. The first transport unit 14 has a shaft portion that protrudes upward from the upper surface of the base 4 and is movable up and down and rotatable, an arm portion that extends horizontally from the upper end of the shaft portion, and a holder provided below the tip of the arm portion.

[0041] When the frame unit 11 is transported by the first transport unit 14 from the temporary placement table 10 to the chuck table 20, the X-axis moving table 16 is moved to position the chuck table 20 in the carry-in / out area. Then, the frame 9 of the frame unit 11 temporarily placed on the temporary placement table 10 is held by the holding portion, the frame unit 11 is lifted, and the shaft portion is rotated to move the frame unit 11 above the chuck table 20.

[0042] Thereafter, the frame unit 11 is lowered and placed on the holding surface 22 of the chuck table 20. Then, the frame 9 is fixed with the clamp 24, and the workpiece 1 is suction-held by the chuck table 20 via the tape 7 of the frame unit 11.

[0043] The cutting device 2 includes a support structure 28 disposed across the opening 4a above the movement path of the X-axis moving table 16 from the loading / unloading area to the machining area. A camera 30 facing downward is provided on the support structure 28.

[0044] The camera 30 is, for example, a visible light camera or an infrared camera, and is equipped with a light receiving element such as a CMOS sensor or a CCD sensor. It is connected to a control unit 44, which will be described later, and transmits the captured image to the control unit 44. The cutting device 2 performs alignment by capturing an image of the surface 1a of the workpiece 1, which is suction-held on the chuck table 20, with the camera 30. The details of the alignment will be described later.

[0045] In the processing area where cutting of the workpiece 1 is carried out, a cutting unit (processing unit) 32 that cuts the workpiece 1 of the frame unit 11 held by the chuck table 20 is provided. The cutting unit 32 includes a cutting blade 34 with an annular cutting edge on the outer periphery, and a spindle 36 that is attached to the tip of the cutting blade 34 and extends in the Y-axis direction as the rotation axis of the cutting blade 34.

[0046] A rotary drive source (not shown), such as a motor, is connected to the base end of the spindle 36, and the cutting blade 34, which is attached to one end of the spindle 36, rotates by the force generated by this rotary drive source. The cutting blade 34 includes an annular base made of aluminum or the like, and an annular cutting blade fixed to the outer periphery of the base. The cutting blade is formed, for example, by fixing abrasive grains, such as diamond, with a binder, such as resin or metal.

[0047] The cutting device 2 also includes an indexing feed unit (not shown) inside the support structure 28 that moves the cutting unit 32 along an indexing feed direction (Y-axis direction) perpendicular to the processing feed direction (X-axis direction). When the processing feed unit and the indexing feed unit are operated, the chuck table 20 that holds the workpiece 1 by suction and the cutting unit 32 can be moved relative to each other.

[0048] When the rotating cutting blade 34 cuts into the workpiece 1 contained in the frame unit 11 held by the chuck table 20, the workpiece 1 is cut to form dividing grooves that reach the back surface 1b. When the workpiece 1 is cut along all the streets 3, the workpiece 1 is divided into individual device chips. The chuck table 20 is then moved to the loading / unloading area by the X-axis movement mechanism.

[0049] An opening 4b is formed on the upper surface of the base 4 at a position adjacent to the temporary placement table 10 and the opening 4a, and the opening 4b houses a cleaning unit 38 that cleans the frame unit 11 after processing. The cleaning unit 38 has a spinner table that holds the frame unit 11.

[0050] The cutting device 2 includes a second transport unit 40 that transports the frame unit 11 from the chuck table 20 positioned in the loading / unloading area to the cleaning unit 38. The second transport unit 40 has an arm that is movable along the Y-axis direction and a holder provided below the tip of the arm.

[0051] When the second transport unit 40 transports the frame unit 11 from the chuck table 20 to the cleaning unit 38, the frame unit 11 is first held by the holding portion. Then, the arm portion is moved along the Y-axis direction to place the frame unit 11 on the spinner table of the cleaning unit 38. Thereafter, the frame unit 11 is held by the spinner table and the workpiece 1 is cleaned.

[0052] When the workpiece 1 is cleaned by the cleaning unit 38, the spinner table is rotated while a cleaning fluid (typically a mixed fluid of water and air) is sprayed onto the surface of the workpiece 1. Then, the frame unit 11 cleaned by the cleaning unit 38 is stored in a cassette 13 placed on the cassette table 6.

[0053] When storing the frame unit 11 in the cassette 13, the frame unit 11 is transported from the cleaning unit 38 to the temporary placement table 10 using the first transport unit 14. Then, the carry-out unit 12 is moved toward the cassette 13 to push the frame unit 11 into the cassette 13.

[0054] In this way, in the cutting device 2, the frame unit 11 is carried out from the cassette 13, the frame unit 11 is held by suction on the chuck table 20, and the workpiece 1 is cut by the cutting unit 32. Thereafter, the frame unit 11 is cleaned in the cleaning unit 38 and stored again in the cassette 13. In the cutting device 2, the frame units 11 are carried out one after another from the cassette 13, and the workpieces 1 are cut one after another by the cutting unit 32 on the chuck table 20.

[0055] When the workpiece 1 is cut by the cutting blade 34, first, the chuck table 20 that holds the workpiece 1 is rotated around an axis perpendicular to the holding surface 22, and the processing feed direction (X-axis direction) of the cutting device 2 is aligned with the direction of the street 3 of the workpiece 1.

[0056] Then, while rotating the cutting blade 34, the cutting unit 32 is lowered until the lower end of the cutting blade 34 reaches the tape 7, and then the chuck table 20 is moved along the X-axis direction. As a result, the cutting blade 34 cuts into the workpiece 1, forming dividing grooves in the workpiece 1. Thereafter, the cutting unit 32 is raised, and similarly, the cutting blade 34 cuts the workpiece 1 one after another along multiple streets 3 that extend in the same direction.

[0057] Then, after dividing grooves have been formed in the workpiece 1 along all of the parallel streets 3, the chuck table 20 is rotated to align the streets 3 along other directions with the X-axis direction. Then, dividing grooves are formed by cutting the workpiece 1 along all of the streets 3 in the same way. This separates the workpiece 1 into individual device chips.

[0058] The cutting device 2 is equipped with a display unit 42 that can display various information and images such as the state of the cutting device 2, the progress of processing, and processing conditions. The display unit 42 is, for example, a display with a touch panel, and is a liquid crystal display equipped with a touch panel that serves as an input interface. For example, various operation images are displayed on the display unit 42, and the operator uses the touch panel as an input interface to input various commands to the cutting device 2.

[0059] The cutting device 2 further includes a control unit 44 that controls each component such as the chuck table 20, the cutting unit 32, the camera 30, the first transport unit 14, the unloading unit 12, the second transport unit 40, the cleaning unit 38, and the display unit 42.

[0060] The control unit 44 is connected to each component of the cutting device 2 and has the function of controlling each component. The control unit 44 is configured by a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory. The functions of the control unit 44 are realized by operating the processing device and the like in accordance with software stored in the auxiliary storage device.

[0061] Machining conditions for machining the workpiece 1 to be machined are input and registered in advance in the control unit 44. Then, the control unit 44 controls each component in accordance with the machining conditions. The control unit 44 also includes an alignment condition registration section 46 in which alignment conditions to be referenced when aligning the cutting unit (machining unit) 32 are registered.

[0062] Next, the alignment procedure for the cutting unit (processing unit) 32 and each item of the alignment conditions registered in the alignment condition registration unit 46 will be described. A camera 30 is used for aligning the cutting unit 32. The alignment is performed by capturing an image of the surface 1a of the workpiece 1 with the camera 30 and analyzing the obtained image. However, it is not easy to directly and precisely detect the streets 3 on the surface 1a of the workpiece 1 from the captured image obtained by the camera 30.

[0063] Therefore, a specific portion that can be detected by the camera 30 is selected as a key pattern from various structures formed on the surface 1a of the workpiece 1. Then, the key pattern, its position on the workpiece 1, and the positional relationship between the key pattern and the street 3 are registered in the alignment condition registration unit 46 as alignment conditions.

[0064] In this case, when alignment of the cutting unit 32 is performed, the control unit 44 causes the camera 30 to capture an image of the surface 1a of the workpiece 1 held by the chuck table 20. Then, the control unit 44 detects a key pattern registered in the alignment condition registration unit 46 from the captured image, and identifies the position of the street 3 of the workpiece 1 based on the positional relationship between the key pattern registered in the alignment condition registration unit 46 and the street 3. Then, the control unit 44 adjusts the positions of the cutting unit 32 and the like so that cutting of the workpiece 1 is performed appropriately.

[0065] Here, to perform alignment with high precision, it is preferable to precisely detect the position of the key pattern on the workpiece 1. And, in order to precisely detect the position of the key pattern, it is preferable to increase the zoom magnification of the camera 30 to capture an image of the surface 1a of the workpiece 1. However, if the zoom magnification of the camera 30 is high, the area of ​​the surface 1a of the workpiece 1 that fits within the imaging area of ​​the camera 30 becomes narrow. Therefore, it is necessary to scan the camera 30 for a long time to search for the key pattern, which reduces the efficiency of the alignment work.

[0066] Therefore, it is preferable that the alignment condition registration unit 46 further registers a key pattern for low-magnification observation that can be referenced when specifying the position of the key pattern, and the position of the key pattern for low-magnification observation on the workpiece 1. Then, before detecting the key pattern, the zoom magnification of the camera 30 is reduced to capture an image of the surface 1a of the workpiece 1, and the key pattern for low-magnification observation is detected.

[0067] Thereafter, the position of the key pattern for low-magnification observation registered in the alignment condition registration unit 46 and the position of the key pattern are referenced to identify an area where the key pattern is expected to exist. Then, the zoom magnification of the camera 30 is increased to capture an image of the surface 1a of the workpiece 1 and detect the key pattern. In this case, the key pattern can be detected early without having to scan the surface 1a of the workpiece 1 with the camera 30 for a long time in search of the key pattern, thereby improving the efficiency of the alignment work.

[0068] In other words, the camera 30 can capture images of the workpiece 1 at a first magnification and a second magnification that is higher than the first magnification. The alignment condition registration unit 46 registers key patterns for low-magnification observation that can be detected when the surface 1a of the workpiece 1 is imaged by the camera 30 at the first magnification, and the positions of the key patterns for low-magnification observation on the workpiece 1.

[0069] When performing alignment, the control unit 44 detects the low-magnification observation key pattern registered in the alignment condition registration unit 46 from a low-magnification image obtained by capturing an image of the surface 1a of the workpiece 1 held on the chuck table 20 using the camera 30 at the first magnification.

[0070] Then, an imaging area is determined based on the position of the key pattern for low magnification observation on the workpiece 1 registered in the alignment condition registration unit 46 and the position of the key pattern, and the imaging area of ​​the workpiece 1 is imaged at the second magnification by the camera 30. This makes it possible to easily and quickly detect the key pattern.

[0071] The alignment conditions are registered in advance in the alignment condition registration unit 46 by an operator or the like when starting operation of the cutting device 2 or when starting cutting of a new type of workpiece 1. For example, the sequence for registering the alignment conditions is carried out in accordance with a dedicated program stored in the memory unit of the control unit 44. Next, the procedure for registering the alignment conditions will be described.

[0072] When registering alignment conditions, first, the workpiece 1 is placed on the holding surface 22 of the chuck table 20, the chuck table 20 holds the workpiece 1 by suction, and the workpiece 1 is moved below the camera 30. Then, the camera 30 starts capturing an image of the surface 1a of the workpiece 1. The images captured by the camera 30 may be displayed on the display unit 42 as needed. During the alignment condition registration sequence, the captured images are repeatedly displayed on the display unit 42. The worker proceeds with the work while checking the captured images on the display unit 42.

[0073] First, the light intensity is adjusted so that the camera 30 can clearly detect the key pattern. That is, if the camera 30 is used with a light source, the brightness of the light source is adjusted. Also, the light receiving level of the light receiving element of the camera 30 is adjusted. The worker adjusts the light intensity while checking the captured image displayed on the display unit 42. Also, the focus is adjusted so that the camera 30 is focused on the structure formed on the surface 1a of the workpiece 1.

[0074] Next, the direction of the chuck table 20 is adjusted so that the street 3 of the workpiece 1 is aligned with the processing feed direction (X-axis direction). The worker adjusts the position of the workpiece 1 etc. so that the street 3 is within the imaging area of ​​the camera 30, and moves the chuck table 20 significantly along the processing feed direction. At this time, if the position of the street 3 in the captured image appears to have moved in the indexing feed direction (Y-axis direction), it will be understood that the orientation of the street 3 does not match the orientation of the processing feed direction.

[0075] In this case, the operator rotates the chuck table 20 slightly around an axis that intersects with the holding surface 22 to adjust the orientation of street 3. Then, the operator again moves the chuck table 20 by a large amount along the machining feed direction to check whether street 3 appears to move in the indexing feed direction. If the position of street 3 in the indexing feed direction does not change at this time, it can be understood that the orientation of street 3 and the orientation of the machining feed direction are consistent. In this way, the orientation of the chuck table 20 is adjusted.

[0076] Next, it is preferable to image the surface 1a of the workpiece 1 with the camera 30 at a first magnification which is a relatively low magnification, and to select a key pattern for low-magnification observation from the image showing the surface 1a of the workpiece 1 and register it in the alignment condition registration unit 46. At this time, the control unit 44 specifies the position of the key pattern for low-magnification observation on the workpiece 1 from the relative positions of the chuck table 20 and the camera 30, and registers the position of the key pattern for low-magnification observation on the workpiece 1 in the alignment condition registration unit 46.

[0077] Then, the camera 30 captures an image of the surface 1a of the workpiece 1 at a relatively high second magnification, and a key pattern is selected from the captured image showing the surface 1a of the workpiece 1 and registered in the alignment condition registration unit 46. The key pattern is then selected and registered from the captured image showing the surface 1a of the workpiece 1. At this time, the control unit 44 identifies the position of the key pattern on the workpiece 1 from the relative positions of the chuck table 20 and the camera 30, and registers the position of the key pattern on the workpiece 1 in the alignment condition registration unit 46.

[0078] FIG. 3 is a plan view schematically illustrating an enlarged view of the surface 1a of the workpiece 1. FIG. 3 schematically illustrates a plurality of devices 5 formed on the workpiece 1 and a plurality of intersecting streets 3. The devices 5 include various elements such as electrical elements such as transistors, circuits, wiring, and electrodes. These elements are composed of functional layers such as conductive layers, insulating layers, and semiconductor layers. Various structures are provided on the devices 5 in shapes determined for their use and purpose.

[0079] 3 schematically shows example structures 15 and 17 provided on device 5 and an example key pattern 19. There are no particular restrictions on the structures 15 and 17 set as key pattern 19 used for alignment, but to prevent erroneous detection of key pattern 19, it is preferable that no similar structures exist in other areas of surface 1a of workpiece 1.

[0080] Next, the positional relationship between the key pattern 19 and the street 3 is registered in the alignment condition registration unit 46. More specifically, the imaging area of ​​the camera 30 is moved so that the camera 30 can capture the street 3 closest to the key pattern 19. Then, an area in the captured image in which the street 3 appears is selected. For example, the center line 21 of the street 3 is selected.

[0081] The positional relationship between the key pattern 19 and the street 3 is identified based on the amount of movement of the chuck table 20 etc. at this time, the position of the street 3 in the captured image, and the position of the key pattern registered in the alignment condition registration unit 46. For example, a distance 23 between the key pattern 19 and the center line 21 of the street 3 is identified, and the distance 23 is registered in the alignment condition registration unit 46 as the positional relationship between the key pattern 19 and the street 3.

[0082] The alignment conditions registered by the above-described procedure for registering alignment conditions enable detection of streets 3 along one direction among a plurality of intersecting streets 3 set on the workpiece 1. Then, in order to enable detection of streets 3 along other directions, the chuck table 20 is rotated by approximately 90°, and a second key pattern and the positional relationship between the second key pattern and the streets 3 are registered in the alignment condition registration unit 46 according to the same procedure.

[0083] As described above, the process of registering alignment conditions in the alignment condition registration section 46 of the control unit 44 of the cutting device 2 involves many steps, and if any one of these steps is not performed properly, it will be impossible to properly align the cutting unit 32. As a result, alignment may not be possible when starting to cut the workpiece 1, causing the cutting device 2 to stop, or the workpiece 1 may be cut improperly, preventing the desired machining results from being obtained.

[0084] In this case, it is necessary to re-register appropriate alignment conditions in the alignment condition registration unit 46. However, it is very time-consuming to execute the sequence for registering alignment conditions and perform all the steps again. In addition, in this case, alignment conditions that do not pose any particular problems are also re-registered, and there is a risk that inappropriate alignment conditions will be registered in the alignment condition registration unit 46 as a result of the re-registration, which could result in a decrease in alignment accuracy.

[0085] Therefore, in the cutting device (processing device) 2 and alignment condition registration method according to this embodiment, some items of the alignment conditions registered in the alignment condition registration unit 46 can be selected as correction items and these items can be individually re-registered. Next, the functions and operations of the cutting device (processing device) 2 will be explained by explaining the alignment condition registration method for re-registering specific items of the alignment conditions. Figure 5 is a flowchart illustrating the flow of each step of the alignment condition registration method.

[0086] In the alignment condition registration method, first, a selection step S10 is performed in which correction items of the alignment conditions registered in the alignment condition registration unit 46 are selected from options. The options for the correction items include the key pattern 19, the position of the key pattern 19 on the workpiece 1, and the positional relationship between the key pattern 19 and the street 3.

[0087] If a key pattern for low-magnification observation and the position of the key pattern for low-magnification observation on the workpiece 1 are further registered in the alignment condition registration unit 46, these should be selectable as correction items. In other words, the options for the correction items should further include the key pattern for low-magnification observation and the position of the key pattern for low-magnification observation on the workpiece.

[0088] 4 is a plan view schematically showing display unit 42 displaying selection screen 42a for selecting an alignment condition correction item. Selection screen 42a displays explanatory text 48 indicating that selection screen 42a is a selection screen for selecting an alignment condition correction item, image 50 captured by camera 30, and explanatory text 52 explaining that image 50 is an image captured by camera 30.

[0089] The need to correct the alignment conditions is recognized by the operator, for example, when an alignment error occurs while attempting to cut the workpiece 1 with the cutting unit 32. At this time, if the workpiece 1 is held by suction on the chuck table 20, the work to correct the alignment conditions can be carried out directly on the workpiece 1 held by suction on the chuck table 20. Then, the camera 30 captures an image of the surface 1a of the workpiece 1 held by the chuck table 20, and the display unit 42 displays the captured image 50 showing the surface 1a of the workpiece 1.

[0090] The display unit 42 displaying the selection screen 42a further displays a description 52 indicating that the captured image 50 is an image captured by the camera 30, and also displays an X coordinate display 54a and a Y coordinate display 54b as indications of the position of the area appearing in the captured image 50. Also displayed is a movement button 62 for inputting a command to move the chuck table 20 or the like to move the display area of ​​the captured image 50.

[0091] Furthermore, the selection screen 42a displays various buttons for selecting input items of the alignment conditions. That is, the selection screen 42a displays a button 58 for inputting a command to adjust the focus of the camera 30, and a button 60 for inputting a command to change the orientation of the workpiece 1 (chuck table 20). Furthermore, the selection screen 42a displays a button 68 for inputting a command to change the key pattern 19, and a button 70 for inputting a command to change the positional relationship between the key pattern 19 and the street 3.

[0092] Furthermore, for the reference of the operator, the selection screen 42a includes an image 64 of the key pattern 19 registered in the alignment condition registration unit 46, and an image 66 showing the street 3 that is the basis for the positional relationship between the key pattern 19 and the street 3. It also includes various buttons 72 for inputting other specific commands.

[0093] The image 64 is an image registered in the alignment condition registration unit 46 as the key pattern 19. It is preferable that the image 66 is registered in the alignment condition registration unit 46 when the positional relationship between the key pattern 19 and the street 3 is registered.

[0094] In selection step S10, the operator uses selection screen 42a displayed on display unit 42 to select an item to be corrected (an item to be re-registered) from among the alignment conditions registered in alignment condition registration section 46. Then, next, correction step S20 is performed in which only the alignment conditions related to the item to be corrected selected in selection step S10 are re-registered in alignment condition registration section 46, thereby correcting the item to be corrected.

[0095] 4 schematically shows the display unit 42 that displays the selection screen 42a when the button 68 for inputting a command to change the key pattern 19 is touched. When a specific item of the alignment conditions is re-registered, the control unit 44 refers to the registered content of the item registered in the alignment condition registration unit 46 at that time, and controls each component to cause the camera 30 to capture an image of the corresponding area on the surface 1a of the workpiece 1.

[0096] For example, if the alignment condition correction item selected in selection step S10 is either the key pattern 19 or the position of the key pattern 19 on the workpiece 1, in correction step S20, each component is controlled so that the key pattern 19 is captured. That is, the surface 1a of the workpiece 1 is imaged by the camera 30 at the position of the key pattern 19 on the workpiece 1 registered in the alignment condition registration section 46 by the control unit 44, and the obtained image is displayed on the display unit 42.

[0097] More specifically, when changing the key pattern 19, the chuck table 20 and the like are moved so that the structure 15 set as the key pattern 19 is included in the imaging area of ​​the camera 30. In addition, a designation frame 56 for selecting a new key pattern 19 is displayed on the display unit 42. The worker operates the position, shape, size, etc. of the designation frame 56 so that the designation frame 56 surrounds the area to be registered as the new key pattern 19.

[0098] Furthermore, if the alignment condition correction item selected in selection step S10 is the positional relationship between key pattern 19 and street 3, in correction step S20, each component is controlled so as to capture street 3. That is, the surface 1a of the workpiece 1 is imaged by camera 30 at the position of street 3 specified based on the positional relationship between key pattern 19 and street 3 registered in alignment condition registration section 46 by control unit 44, and the obtained image is displayed on display unit 42.

[0099] More specifically, the worker touches button 70 included in selection screen 42a to correct the positional relationship between key pattern 19 and street 3. At this time, control unit 44 controls chuck table 20 and the like so that camera 30 can capture street 3 based on the position of key pattern 19 registered in alignment condition registration section 46 and the positional relationship between key pattern 19 and street 3 before the change.

[0100] The display unit 42 displays a captured image 50 showing the street 3 and a straight line (not shown) for specifying the center line of the street 3. The operator specifies the position of the street 3 by moving this straight line to the center line of the street 3, thereby registering the positional relationship between the key pattern 19 and the street 3 in the alignment condition registration unit 46. For example, the distance between the key pattern 19 and the center line of the street 3 is registered in the alignment condition registration unit 46.

[0101] When changing other items of the alignment conditions registered in the alignment condition registration unit 46, it is preferable that the camera 30 captures an image of the surface 1a of the workpiece 1 in an area suitable for inputting new conditions for each item, and the captured image is displayed on the display unit 42. It is also preferable that various cursors and the like suitable for inputting the alignment conditions for that item are displayed on the display unit 42. Then, in the correction step S20, the operator uses the display unit 42 to re-register and correct a specific item of the alignment conditions.

[0102] For example, in the cutting device 2, the key pattern 19 registered in the alignment condition registration unit 46, the position of the key pattern 19 on the workpiece 1, and the positional relationship between the key pattern 19 and the street 3 can each be individually re-registered in the alignment condition registration unit 46. Also, if a key pattern for low-magnification observation and the position of the key pattern for low-magnification observation on the workpiece 1 are registered in the alignment condition registration unit 46, these can each be individually re-registered in the alignment condition registration unit 46.

[0103] As described above, with the cutting device (processing device) 2 and alignment condition registration method according to this embodiment, if a problem with any of the alignment conditions becomes apparent during the process of processing a workpiece, the item can be re-registered. That is, the operator selects a specific item of the alignment conditions, and re-registers only the alignment condition related to the selected correction item in the alignment condition registration unit 46, thereby correcting the correction item.

[0104] Therefore, there is no need to re-register all the alignment condition items from scratch, and only the problematic items can be corrected, allowing the re-registration of the alignment conditions to be carried out quickly. Also, since the registered contents of items that are not particularly problematic can be used as is, no problems will arise from re-registering the alignment conditions, and the alignment accuracy will not deteriorate. Therefore, the above embodiment provides a cutting device (processing device) 2 and a method for registering alignment conditions that allow the re-registration of alignment conditions to be carried out with good operability.

[0105] The present invention is not limited to the above-described embodiment, and various modifications can be made. In the above-described embodiment, the operator selects one correction item from the alignment conditions registered in the alignment condition registration unit 46 and re-registers only that item. However, one aspect of the present invention is not limited to this.

[0106] For example, the operator may select multiple correction items from among the alignment conditions registered in the alignment condition registration unit 46 and re-register the alignment conditions for multiple items. In this case, the control unit 44 may cause the display unit 42 to display an explanatory message urging the operator to correct, starting with the item that will have the greatest impact on the other items, from among the multiple items selected as correction items.

[0107] For example, when two items, the position of key pattern 19 and the positional relationship between key pattern 19 and street 3, are selected as items to be corrected for the alignment conditions, a correction screen may be displayed on display unit 42 so that the position of key pattern 19 is corrected first. The positional relationship between key pattern 19 and street 3 is based on the position of key pattern 19. Therefore, if the positional relationship between key pattern 19 and street 3 is corrected first, it may become necessary to correct that positional relationship again when the position of key pattern 19 is corrected.

[0108] When the position of the key pattern 19 is corrected first, the position of the key pattern 19 that will be the basis for the positional relationship to be corrected next will already be corrected, so that the positional relationship only needs to be re-registered once, thereby enabling the alignment conditions to be re-registered more quickly and efficiently.

[0109] Furthermore, in one aspect of the present invention, when an operator selects one of the alignment conditions registered in the alignment condition registration unit 46 to be corrected, and that item is corrected, the control unit 44 may prompt the operator to correct the other items.

[0110] For example, it is conceivable that key pattern 19 is selected as a correction item among the alignment conditions registered in alignment condition registration unit 46, and the worker selects as key pattern 19 a structure that is in a completely different position from the previously registered key pattern 19. In this case, even if there is no problem with the position of the previously registered key pattern 19 and the positional relationship between key pattern 19 and street 3, re-registration of key pattern 19 may result in these becoming inappropriate alignment conditions.

[0111] Therefore, the control unit 44 may evaluate the content of the item selected as the item to be corrected after the item is corrected. If the control unit 44 determines that the item will have a large impact on other items, it may cause the display unit 42 to display an explanatory message urging the operator to correct the item that now needs to be corrected.

[0112] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0113] 1 Workpiece 1a surface 1b back side 3 Street 5 Devices 7. Tape 9 frames 9a aperture 11 Frame Unit 13 Cassette 15 Structures 17 Structures 19 Key Pattern 21 Center line 23 distance 2 Cutting equipment 4 Foundation 4a,4b opening 6 Cassette Table 8 guide rails 10 Temporary table 12 Unloading unit 14,40 Transport unit 16 X-axis moving table 18 Table Base 20 Chuck table 22 Holding surface 24 Clamp 26 Dustproof and water-resistant cover 28 Support structure 30 Camera 32 Cutting unit 34 Cutting blade 36 Spindle 38 Cleaning Unit 42 Display unit 42a Selection screen 44 Control Unit 46 Alignment condition registration section 48,52 Description 50 Captured images 54a X coordinate display 54b Y coordinate display 56 Designated slots 58, 60, 68, 70, 72 buttons 62 Movement button 64,66 images

Claims

1. A processing device having a chuck table for holding a workpiece, and a processing unit for processing the workpiece held by the chuck table along streets set on a surface of the workpiece, a camera for capturing an image of the workpiece held on the chuck table; a control unit that includes an alignment condition registration unit in which alignment conditions that are referenced when the camera detects the street on the workpiece and alignment is performed to adjust the position of the machining unit relative to the workpiece is registered, and that controls components including the chuck table and the machining unit; an input interface that can be used to input the alignment conditions to the alignment condition registration unit; a display unit that displays an image captured by the camera, The alignment condition registration unit registers, as the alignment conditions, a key pattern that can be detected when the surface of the workpiece is imaged by the camera, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street; the control unit detects the key pattern registered in the alignment condition registration unit from an image obtained by imaging the surface of the workpiece held on the chuck table with the camera, and identifies the position of the street of the workpiece held on the chuck table based on the positional relationship between the key pattern registered in the alignment condition registration unit and the street, thereby performing the alignment; The key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street can be re-registered in the alignment condition registration unit individually, When correcting either the key pattern registered in the alignment condition registration unit or the position of the key pattern on the workpiece, the control unit causes the camera to capture an image of the surface of the workpiece at the position of the key pattern on the workpiece registered in the alignment condition registration unit, and causes the display unit to display the obtained image; When correcting the positional relationship between the key pattern and the street registered in the alignment condition registration unit, the control unit causes the camera to capture an image of the surface of the workpiece at the position of the street specified based on the positional relationship between the key pattern and the street registered in the alignment condition registration unit, and causes the display unit to display the obtained image.

2. the camera is capable of capturing an image of the workpiece at a first magnification and a second magnification that is higher than the first magnification; the alignment condition registration unit further registers a key pattern for low-magnification observation that can be detected when the surface of the workpiece is imaged by the camera at the first magnification, and a position of the key pattern for low-magnification observation on the workpiece; When the alignment is performed, the control unit detects the key pattern for low-magnification observation registered in the alignment condition registration unit from a low-magnification image obtained by imaging the surface of the workpiece held on the chuck table with the camera at the first magnification, determines an imaging area based on the position of the key pattern for low-magnification observation on the workpiece registered in the alignment condition registration unit and the position of the key pattern on the workpiece, and images the imaging area of ​​the workpiece with the camera at the second magnification to obtain the image; 2. The processing device according to claim 1, wherein the key pattern for low-magnification observation registered in the alignment condition registration unit and the position of the key pattern for low-magnification observation on the workpiece can be individually re-registered in the alignment condition registration unit.

3. 1. A method for registering alignment conditions in a processing device having a chuck table for holding a workpiece, a processing unit for processing the workpiece held by the chuck table along streets set on the surface of the workpiece, a camera for imaging the workpiece held on the chuck table, and a control unit having an alignment condition registration unit, wherein the alignment condition registration unit registers a key pattern that can be detected when the surface of the workpiece is imaged by the camera, the position of the key pattern on the workpiece, and a positional relationship between the key pattern and the street as alignment conditions to be referenced when the camera detects the streets of the workpiece and performs alignment to adjust the position of the processing unit relative to the workpiece, a selection step of selecting an item to be corrected for the alignment condition from options including the key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street; a correction step of re-registering in the alignment condition registration unit only the alignment conditions related to the correction items selected in the selection step, and correcting the correction items; the camera of the processing device is capable of capturing an image of the workpiece at a first magnification and a second magnification that is higher than the first magnification; the alignment condition registration unit further registers, as the alignment conditions, a key pattern for low-magnification observation that can be detected when the surface of the workpiece is imaged by the camera at the first magnification, and a position of the key pattern for low-magnification observation on the workpiece; the key pattern is detectable when the surface of the workpiece is imaged with the camera at the second magnification; The alignment condition registration method is characterized in that the options further include the key pattern for low-magnification observation and the position of the key pattern for low-magnification observation on the workpiece.

4. The processing device further includes a display unit that displays an image captured by the camera, When the correction item of the alignment condition selected in the selection step is either the key pattern or the position of the key pattern on the workpiece, in the correction step, the surface of the workpiece is imaged by the camera at the position of the key pattern on the workpiece registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit; The alignment condition registration method according to claim 3, characterized in that, when the correction item of the alignment condition selected in the selection step is the positional relationship between the key pattern and the street, in the correction step, the surface of the workpiece is imaged by the camera at the position of the street identified based on the positional relationship between the key pattern and the street registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit.

5. A method for registering alignment conditions in a processing device having a chuck table for holding a workpiece, a processing unit for processing the workpiece held by the chuck table along streets set on the surface of the workpiece, a camera for imaging the workpiece held on the chuck table, and a control unit having an alignment condition registration unit, wherein the alignment condition registration unit registers a key pattern that can be detected when the surface of the workpiece is imaged by the camera, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street as alignment conditions to be referenced when alignment is performed to detect the street of the workpiece with the camera and adjust the position of the processing unit relative to the workpiece, a selection step of selecting an item to be corrected for the alignment condition from options including the key pattern registered in the alignment condition registration unit, the position of the key pattern on the workpiece, and the positional relationship between the key pattern and the street; a correction step of re-registering in the alignment condition registration unit only the alignment conditions related to the correction items selected in the selection step, and correcting the correction items; The processing device further includes a display unit that displays an image captured by the camera, When the correction item of the alignment condition selected in the selection step is either the key pattern or the position of the key pattern on the workpiece, in the correction step, the surface of the workpiece is imaged by the camera at the position of the key pattern on the workpiece registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit; A method for registering alignment conditions, characterized in that if the correction item of the alignment condition selected in the selection step is the positional relationship between the key pattern and the street, in the correction step, the surface of the workpiece is imaged by the camera at the position of the street specified based on the positional relationship between the key pattern and the street registered in the alignment condition registration section by the control unit, and the obtained image is displayed on the display unit.

Images