Semiconductor chip manufacturing method and semiconductor chip manufacturing device

Abstract

To provide a manufacturing method for a semiconductor chip and a manufacturing apparatus for a semiconductor chip, in which an unnecessary piece is preferably not left on a second adhesive sheet.SOLUTION: A manufacturing apparatus EA for a semiconductor chip includes division schedule line forming means 10, first attaching means 20 that performs a step of attaching a first adhesive sheet AS1, dividing means 40 that forms a semiconductor chip CP sectioned along a division line SL and forms an unnecessary piece UF outside a chip collection region WF3, second attaching means 30 that attaches a second adhesive sheet AS2 on the other surface WF2 side of a semiconductor wafer WF, and first adhesive sheet separating means 90 that separates the first adhesive sheet AS1. In the second attaching step, the second adhesive sheet AS2 is attached to the other surface WF2 side of the semiconductor wafer WF so that the chip collection region WF3 is covered entirely and so as not to be in contact with an outer edge of the semiconductor wafer WF. In the first adhesive sheet separating step, the unnecessary piece UF is removed together with the first adhesive sheet AS1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method and an apparatus for manufacturing semiconductor chips. [Background technology]

[0002] BACKGROUND ART There is known a method for manufacturing a semiconductor chip in which a second adhesive sheet is attached to a semiconductor chip attached to a first adhesive sheet, and then the first adhesive sheet is peeled off (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-78430 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the method for manufacturing electronic components (method for manufacturing semiconductor chips) described in Patent Document 1, after peeling off film 3 (first adhesive sheet) from wafer 1 (wafer) attached to wafer fixing tape 5 (second adhesive sheet), wafer parts (unwanted pieces) other than electronic components 8 (semiconductor chips) remain on the second adhesive sheet. Therefore, during the semiconductor chip pick-up process in the die bonding process, the unwanted pieces may come off the second adhesive sheet and pile up on the semiconductor chip, or the presence of the unwanted pieces may interfere and hinder the semiconductor chip pick-up operation.

[0005] An object of the present invention is to provide a semiconductor chip manufacturing method and semiconductor chip manufacturing apparatus that can minimize the amount of unwanted pieces remaining on the second adhesive sheet. [Means for solving the problem]

[0006] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0007] According to the present invention, the unnecessary pieces are removed when the first adhesive sheet is peeled off, so that as few unnecessary pieces as possible remain on the second adhesive sheet. [Brief explanation of the drawings]

[0008] [Figure 1] 1A and 1B are explanatory diagrams of a semiconductor chip manufacturing apparatus for carrying out the semiconductor chip manufacturing method of the present invention and an explanatory diagram of the operation of the apparatus; DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, the view from the front in Fig. 1 parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the figure, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the front direction in Fig. 1 parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The semiconductor chip manufacturing apparatus EA of the present invention comprises: a dividing line forming means 10 for performing a dividing line forming step of forming dividing lines PL made up of mutually intersecting modified portions inside a semiconductor wafer (hereinafter also simply referred to as "wafer") WF; a first attaching means 20 for performing a first attaching step of attaching a first adhesive sheet AS1 to one surface WF1 of the wafer WF so as to cover the entire outer edge of the wafer WF; a wafer inverting means 30 for performing a wafer inverting step of inverting the wafer WF upside down; and a semiconductor chip manufacturing apparatus EA for applying an external force to the wafer WF to form dividing lines SL starting from the dividing lines PL, and forming semiconductor chips (hereinafter also simply referred to as "chips") CP divided by the dividing lines SL inside a predetermined chip picking region WF3 (the region surrounded by a thick solid line in FIG. 1(B)) on the wafer WF, and forming semiconductor chips (hereinafter also simply referred to as "chips") CP outside the chip picking region WF3. The wafer WF mounting device is provided with a dividing means 40 that performs a dividing step to form the unnecessary pieces UF, a second attaching means 50 that performs a second attaching step to attach a second adhesive sheet AS2 to the other surface WF2 of the wafer WF, a frame placing means 60 that performs a frame placing step to place a ring frame RF as a frame member on the outside of the wafer WF, a third attaching means 70 that performs a third attaching step to attach a third adhesive sheet AS3 having an outer edge shape larger than the outer edge shape of the wafer WF onto the second adhesive sheet AS2 attached to the wafer WF, a unit inverting means 80 that performs a unit inverting step to invert the unit UP upside down, and a first adhesive sheet peeling means 90 that performs a first adhesive sheet peeling step to remove the unnecessary pieces UF together with the first adhesive sheet AS1 from the wafer WF, and is arranged near a wafer transport means TM that performs a wafer transport step to transport the wafer WF.

[0011] The division line forming means 10 is composed of multiple arms and includes a so-called articulated robot 11 as a driving device that can displace what is supported by its working part, the tip arm 11A, to any position and any angle within its working range, a laser bracket 12 into which the tip arm 11A of the articulated robot 11 fits and which has a laser holding part 12A held by the articulated robot 11, and a laser irradiator 13 that is supported by the laser bracket 12 and irradiates the wafer WF with a laser LS to form the division line PL.

[0012] The first attachment means 20 includes a support roller 21 that supports the first web RS1 having a strip-shaped first adhesive sheet substrate BS1 temporarily attached to the first release sheet RL1, cutting means 22 that forms a closed-loop first slit CU1 in the first adhesive sheet substrate BS1 and forms the first adhesive sheet AS1 and the first unnecessary sheet US1 on the inside and outside of the first slit CU1, a guide roller 23 that guides the first web RS1, a peeling plate 24 that serves as peeling means that folds back the first release sheet RL1 at a peeling edge 24A and peels the first adhesive sheet AS1 from the first release sheet RL1, and a cutting means 23 that holds the first adhesive sheet AS1 on the object to be attached. The semiconductor chip manufacturing apparatus EA is provided with a pressure roller 25 as a pressing means for pressing and adhering the first release sheet RL1 and the unnecessary sheet US1, a drive roller 26 supported by an output shaft (not shown) of a rotary motor 26A as a driving device and for sandwiching the first release sheet RL1 and the unnecessary sheet US1 between it and a pinch roller 26B, and a recovery roller 27 as a recovery means supported by an output shaft (not shown) of the driving device and for constantly applying a predetermined tension to the first release sheet RL1 and the unnecessary sheet US1 present between it and the pinch roller 26B while the semiconductor chip manufacturing apparatus EA is in automatic operation, and for recovering the first release sheet RL1 and the unnecessary sheet US1. The cutting means 22 is supported by the output shaft 22B of a rotary motor 22A as a driving device, and includes a die-cut roller 22C having a flat loop-shaped cutting blade 22D as a cutting member supported on its outer surface, and an anvil roller 22E that rotates synchronously with the die-cut roller 22C.

[0013] The wafer inversion means 30 includes a rotary motor 32 as a driving device supported by a slider 31A of a linear motor 31 as a driving device, and a chuck motor 33 as a driving device (holding means) supported by the output shaft 32A of the rotary motor 32 and having a pair of chuck arms 33A that hold the object to be held.

[0014] The dividing means 40 comprises an XY table 41 as a driving device, a linear motor 42 as a driving device supported on an output base 41A of the XY table 41, a rotary motor 43 as a driving device supported on the output shaft 42A of the linear motor 42, and a grinding member 44 such as a grinding wheel or end mill supported on the output shaft 43A of the rotary motor 43 via a support plate 44A. The grinding member 44 grinds the wafer WF from the other surface WF2 side, thereby grinding the wafer WF to a predetermined thickness, and the vibrations generated when grinding the wafer WF act as an external force to form dividing lines SL starting from the planned dividing lines PL.

[0015] The second adhering means 50 is configured to adhere a second adhesive sheet AS2 to the other surface WF2 of the wafer WF so as to cover the entire chip collection region WF3 and not contact the outer edge of the wafer WF. Note that the second adhering means 50 has the same configuration as the first adhering means 20, and can be explained by changing the 2 in the tens digit of the numbers in the configuration description of the first adhering means 20 to 5, changing AS1, BS1, CU1, RL1, RS1, and US1 to AS2, BS2, CU2, RL2, RS2, and US2, respectively, and replacing "first" with "second" in each configuration, so the second adhering means 50 is only illustrated and a detailed configuration description will be omitted.

[0016] The frame placement means 60 includes a linear motor 62 as a driving device supported by a slider 61A of a linear motor 61 as a driving device, a suction pad 63 supported on an output shaft 62A of the linear motor 62 via a suction arm 63A and capable of being suction-held by a pressure-reducing means (holding means) such as a vacuum pump or a vacuum ejector (not shown), and a ring frame stocker 64 for storing ring frames RF.

[0017] The third joining means 70 has the same configuration as the first joining means 20, and can be explained by changing the 2 in the tens digit of the numbering in the explanation of the configuration of the first joining means 20 to 7, changing AS1, BS1, CU1, RL1, RS1, and US1 to AS3, BS3, CU3, RL3, RS3, and US3, respectively, and replacing the "first" in each configuration with "third," so it is only illustrated in the figure and a detailed explanation of the configuration will be omitted. In this case, the third joining means 70 is configured to join the third adhesive sheet AS3 to the wafer WF and the ring frame RF to form the integrated object UP.

[0018] The integrated inversion means 80 has the same configuration as the wafer inversion means 30, and can be explained by changing the tens digit of the numbering in the explanation of the configuration of the wafer inversion means 30 from 3 to 8, so it is only illustrated in the figure and a detailed explanation of its configuration will be omitted.

[0019] The first adhesive sheet peeling means 90 comprises a support roller 91 that supports the strip-shaped peeling tape PT as a holding means, a guide roller 92 that guides the peeling tape PT, a peeling roller 94 that is rotatably supported on the output shaft 93A of a linear motor 93 that serves as a driving device, a drive roller 95 that is supported on the output shaft (not shown) of a rotary motor 95A that serves as a driving device and that pinches the peeling tape PT between itself and a pinch roller 95B, and a recovery roller 96 that is driven by the driving device (not shown) and that constantly applies a predetermined tension to the peeling tape PT that is present between itself and the pinch roller 95B while the semiconductor chip manufacturing equipment EA is operating automatically, and that recovers the peeling tape PT, thereby constituting an unwanted piece removal means that removes unwanted pieces UF from the wafer WF together with the first adhesive sheet AS1.

[0020] The wafer transfer means TM includes a linear motor TM1 as a driving device having a slider TM1A that moves in the X-axis direction, and a support table TM2 that is supported by the slider TM1A and has a holding surface TM2A that can be sucked and held by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector. The support table TM2 has a notch TM2B formed therein.

[0021] The operation of the semiconductor chip manufacturing apparatus EA will now be described. 1(A), in which each component is placed in the initial position indicated by the solid line, a user of the semiconductor chip manufacturing apparatus EA (hereinafter simply referred to as "user") sets first, second, and third webs RS1, RS2, and RS3 as shown in the figure, and then inputs a signal to start automatic operation via an operation means (not shown) such as an operation panel or a personal computer. Then, first, second, and third bonding means 20, 50, and 70 drive rotary motors 22A, 26A, 52A, 56A, and 72A, 76A, which rotate die-cut rollers 22C, 52C, and 72C to form first, second, and third incisions CU1, CU2, and CU3 in first, second, and third sheet base materials BS1, BS2, and BS3, while unwinding first, second, and third webs RS1, RS2, and RS3. When the leading ends in the payout direction of the leading first, second, and third adhesive sheets AS1, AS2, and AS3 formed by the first, second, and third incisions CU1, CU2, and CU3 have been peeled off by a predetermined length at the peeling edges 24A, 54A, and 74A of the peeling plates 24, 54, and 74, the first, second, and third bonding means 20, 50, and 70 stop driving the rotary motors 22A, 26A, 52A, 56A and 72A, 76A. Next, when a user or unillustrated transport means such as an articulated robot or a belt conveyor places the wafer WF on the support table TM2 as shown in FIG. 1(A), the wafer transport means TM drives unillustrated pressure reducing means to begin suction-holding the wafer WF on the holding surface TM2A.

[0022] Thereafter, the wafer transport means TM drives the linear motor TM1 to move the support table TM2 to the left, and when the wafer WF reaches the working range of the division line forming means 10, the driving of the linear motor TM1 is stopped. After this stopping, the division line forming means 10 drives the articulated robot 11 and the laser irradiator 13 to form a division line PL on the wafer WF, as shown by the two-dot chain line in Figure 1(A) and in Figure 1(B). Next, the wafer transport means TM drives the linear motor TM1 to move the support table TM2 leftward until the wafer WF reaches a predetermined position relative to the first bonding means 20. The first bonding means 20 then drives the rotating motors 22A and 26A to pay out the first web RS1 in accordance with the movement speed of the support table TM2, forming a new first incision CU1 in the first sheet base material BS1, while bonding a first adhesive sheet AS1 to one surface WF1 of the wafer WF so as to cover the entire outer edge of the wafer WF, as shown by the two-dot chain line in Figure 1(A). Then, when the leading end of the next first adhesive sheet AS1 following the leading first adhesive sheet AS1 in the payout direction has been peeled off by a predetermined length by the peeling edge 24A of the peeling plate 24, the first bonding means 20 stops driving the rotating motors 22A and 26A. As support table TM2 continues to move leftward, and when notch TM2B reaches the front of chuck arm 33A, wafer transfer device TM stops driving linear motor TM1, and wafer inverting device 30 drives chuck motor 33 to hold wafer WF, etc., with chuck arm 33A, as shown by the two-dot chain line in Fig. 1(C). Next, wafer transfer device TM stops driving decompression means (not shown) and releases wafer WF from suction and holding on holding surface TM2A, and wafer inverting device 30 drives linear motor 31 and rotary motor 32 to lift wafer WF, etc., held by chuck arm 33A, to a predetermined height and turn wafer WF, etc., upside down, as shown by the two-dot chain line in Fig. 2(C). Thereafter, the wafer inversion means 30 drives the linear motor 31, and places the wafer WF, etc. on the holding surface TM2A with the first adhesive sheet AS1 facing the holding surface TM2A. Then, the wafer transport means TM drives the pressure reducing means (not shown) and begins to suction-hold the wafer WF, etc. on the holding surface TM2A. Then, the wafer inversion means 30 drives the chuck motor 33, and returns the chuck arm 33A to its initial position.

[0023] Next, the wafer transport means TM drives the linear motor TM1 to move the support table TM2 to the left, and when the wafer WF reaches the working range of the dividing means 40, the driving of the linear motor TM1 is stopped. After this, the dividing means 40 drives the XY table 41, the linear motor 42, and the rotary motor 43, and grinds the wafer WF with the grinding member 44 until the wafer WF has a predetermined thickness, as shown by the two-dot chain line in Fig. 1(A). Note that the vibrations generated during this grinding act as an external force, and this external force causes the modified portion to collapse, turning the planned dividing line PL into dividing lines SL, and the wafer WF is divided into chips CP and waste pieces UF by the dividing line SL, as shown by the dashed line in Fig. 1(B). When the wafer WF has been ground to a predetermined thickness, the dividing means 40 stops driving the XY table 41, the linear motor 42, and the rotary motor 43, and then drives the XY table 41 and the linear motor 42 to return the grinding member 44 to its initial position. Then, the wafer transport means TM drives the linear motor TM1 to move the support table TM2 leftward until the wafer WF reaches a predetermined position relative to the second bonding means 50. The second bonding means 50 performs the same operation as the first bonding means 20, and bonds a second adhesive sheet AS2 to the other surface WF2 of the wafer WF so as to cover the entire chip collection region WF3 and not to contact the outer edge of the wafer WF, as shown by the two-dot chain line in FIG. 1(A) and FIG. 1(B).

[0024] Thereafter, the linear motor TM1 of the wafer transfer means TM continues to move the support table TM2 to the left, and when the center position of the wafer WF in the left-right direction reaches the center position of the suction arm 63A in the front view from the Y-axis direction, the wafer transfer means TM stops driving the linear motor TM1. Next, the frame placement means 60 drives the linear motor 61A, the direct-acting motor 62, and the pressure reducing means (not shown) to suck and hold the ring frame RF in the ring frame stocker 64 and place the ring frame RF on the holding surface TM2A as shown by the two-dot chain line in Figure 1(D). After that, the wafer transfer means TM drives the pressure reducing means (not shown) to start sucking and holding the ring frame RF on the holding surface TM2A. Thereafter, the frame placement means 60 stops driving the pressure reducing means (not shown) and releases the suction pads 63 from suction holding of the ring frame RF, then drives the linear motor 61A and the direct-acting motor 62 to return the suction pads 63 to their initial positions, and the wafer transport means TM drives the linear motor TM1 to move the support table TM2 to the left. Next, when the support table TM2 reaches a predetermined position relative to the third joining means 70, the third joining means 70 performs the same operation as the first joining means 20, and joins the third adhesive sheet AS3 onto the ring frame RF and the second adhesive sheet AS2, as shown by the two-dot chain line in Figure 1(A), to form an integrated object UP.

[0025] Thereafter, the support table TM2 continues to move leftward, and when the notch TM2B reaches the front of the chuck arm 83A, the wafer transport means TM stops driving the linear motor TM1 and then performs an operation equivalent to that of the wafer inverting means 30 to turn the integrated object UP upside down. The wafer transport means TM then drives the linear motor TM1 to move the support table TM2 leftward, and when the left end of the first adhesive sheet AS1 in the integrated object UP reaches just below the bottom end of the peeling roller 94, the drive of the linear motor TM1 is stopped. Next, the first adhesive sheet peeling means 90 drives the linear motor 93 to lower the peeling roller 94, applying the peeling tape PT to the left edge of the first adhesive sheet AS1. The wafer transport means TM and the first adhesive sheet peeling means 90 then drive the linear motor TM1 and rotary motor 95A to feed the peeling tape PT toward the collection roller 96 at the same speed as the support table TM2 moves leftward, peeling the first adhesive sheet AS1 from the wafer WF, as shown by the two-dot chain line in FIG. 1A. During this process, most of the waste pieces UF located on the outer edge of the wafer WF (those located outside the chip collection area WF3) are attached to the first adhesive sheet AS1 without being attached to the second adhesive sheet AS2, and are therefore removed from the wafer WF together with the first adhesive sheet AS1. In this embodiment, the waste pieces UF shown shaded in FIG. 1B among the waste pieces UF were successfully removed from the wafer WF together with the first adhesive sheet AS1. Thereafter, when the entire first adhesive sheet AS1 has been peeled off from the wafer WF, the first adhesive sheet peeling means 90 drives the linear motor 93 to return the peeling roller 94 to its initial position, and then stops driving the rotary motor 95A. Next, when the support table TM2 moves out from under the peeling roller 94, the wafer transport means TM stops driving the linear motor TM1 and then stops driving the pressure reducing means (not shown), thereby releasing the suction and holding of the integrated object UP on the holding surface TM2A. Then, when the user or the transport means (not shown) transports the integrated object UP to the next process, the wafer transport means TM drives the linear motor TM1 to return the support table TM2 to its initial position, and the same operations as those described above are repeated thereafter.

[0026] According to the embodiment described above, the unnecessary piece UF is removed when the first adhesive sheet AS1 is peeled off, so that as little unnecessary piece UF as possible can be left on the second adhesive sheet AS2.

[0027] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the first attachment step may be any step that attaches a first adhesive sheet to one side of a semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer, and is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0028] The planned dividing line forming means 10 may share the articulated robot 11 with the frame placement means 60, and the articulated robot 11 may hold the suction arm 63A and transport the ring frame RF, or the planned dividing line PL may be formed by weakening, pulverizing, liquefying or hollowing out the wafer WF by applying laser light, electromagnetic waves, vibration, heat, chemicals, chemical substances or the like to the wafer WF to change its characteristics, properties, properties, material, composition, configuration, dimensions, etc., and the planned dividing line PL may be any type that can become a dividing line SL when an external force is applied. The dividing line forming means 10 may form dividing lines PL consisting of intersecting grooves on one side WF1 of the wafer WF. In this case, the dividing line forming means 10 may form dividing lines PL consisting of grooves on one side WF1 of the wafer WF by applying laser light, electromagnetic waves, heat, chemicals, or other substances, or by using a groove forming means such as a cutting blade or a cutting edge, taking into account the characteristics, properties, properties, material, composition, and configuration of the wafer WF. In this case, the dividing means 40 thins the wafer WF, exposing the dividing lines PL to the other side WF2 of the wafer WF to form dividing lines SL, forming chips CP separated by the dividing lines SL inside a predetermined chip picking area WK3 on the wafer WF, and forming waste pieces UF outside the chip picking area WK3. Note that any device may be used to thin the wafer WF, such as a known grinding device, a known cutting device, or a known slicing device.

[0029] The first, second and third attaching means 20, 50 and 70 do not employ cutting means 22, 52 and 72, but instead form closed loop cuts in advance in the strip-shaped first, second and third adhesive sheet base materials BS1, BS2 and BS3 that are temporarily attached to the strip-shaped first, second and third release sheets RL1, RL2 and RL3, and the predetermined areas partitioned by the cuts become the first, second and third adhesive sheets AS1, AS2 and AS3. 2, RS3 may be fed out, and the first, second, and third adhesive sheets AS1, AS2, and AS3 may be attached to the wafer WF or the like, or when the first, second, and third adhesive sheets AS1, AS2, and AS3 are attached to the wafer WF or the like, the speed and tension of the first, second, and third rolls RS1, RS2, and RS3 being fed out may be controlled so that a predetermined tension is applied to the first, second, and third adhesive sheets AS1, AS2, and AS3, or no tension is applied. Alternatively, the first, second, and third adhesive sheets AS1, AS2, AS3 may be peeled from the first, second, and third raw rolls RS1, RS2, RS3 that have been fan-folded, for example, without being rolled up, and applied to the wafer WF or the like. Alternatively, recovery means may be employed for recovering the first, second, and third release sheets RL1, RL2, RL3, etc. by fan-folding the sheets without rolling them up, shredding them with a shredder, or simply piling them up. Alternatively, unnecessary sheet recovery means may be provided for peeling and recovering the first, second, and third unnecessary sheets US1, US2, US3 from the first, second, and third release sheets RL1, RL2, RL3, or no recovery means may be employed. Alternatively, the first, second, and third adhesive sheets AS1, AS2, AS3 that are not temporarily attached to the first, second, and third release sheets RL1, RL2, RL3 may be unwound and applied. The cutting means 22, 52, 72 may, for example, employ so-called flat blades as cutting members that move away from and approach the first, second and third sheet substrates BS1, BS2 and BS3, or may employ cutting blades 22E, 52E, 72E that may or may not be detachable from the die-cut rollers 22C, 52C and 72C, or may form cuts in the entire short width direction of the strip-shaped first, second and third adhesive sheet substrates BS1, BS2 and BS3, and the areas partitioned by the cuts become the first, second and third adhesive sheets AS1, AS2 and AS3, or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention. The first attaching step may be carried out before the division line forming step. The second attaching means 50 may use a second adhesive sheet AS2 on which a third adhesive sheet AS3 having an outer periphery larger than that of the wafer WF is laminated. The third attaching means 70 may or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention.

[0030] The wafer inversion means 30 may share the articulated robot 11 with the division line formation means 10, and the articulated robot 11 may hold the chuck motor 33 to invert the wafer WF etc. upside down, or the one-piece inversion means 80 may serve as both. In these cases, after the first adhesive sheet AS1 is attached, the support table TM2 may be moved within the working range of the articulated robot 11 or the one-piece inversion means 80. The wafer inversion means 30 may hold at least one of the first adhesive sheet AS1 and the wafer WF and invert the wafer WF etc. upside down, or may move the support table TM2 and invert the wafer WF etc. upside down without lifting the wafer WF etc., or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention if the dividing means 40 can grind the wafer WF from below and the second and third bonding means 50, 70 can bond the second and third adhesive sheets AS2, AS3 to the wafer WF etc. without inverting the wafer WF etc. upside down.

[0031] The dividing means 40 may form the dividing lines SL using the planned dividing lines PL as a trigger by using the force of polishing the wafer WF as an external force or by using the force of cutting the wafer WF as an external force, or may form the dividing lines SL using the planned dividing lines PL as a trigger by applying an external force using a vibration device such as an ultrasonic vibration device or a vibrator without grinding, polishing or cutting the wafer WF, or may form the entire planned dividing lines PL as the dividing lines SL, or may form only a part of the planned dividing lines PL as the dividing lines SL.

[0032] The frame placement means 60 may share the articulated robot 11 with the division line formation means 10, and the articulated robot 11 may hold the suction arm 63A to transport the ring frame RF, or the ring frame stocker 64 may be placed in front of the support table TM2 or in another location, and may or may not be included in the semiconductor chip manufacturing apparatus EA of the present invention.

[0033] The one-piece inverting means 80 may share the articulated robot 11 with the division line forming means 10, and the articulated robot 11 may hold the chuck motor 83 to invert the one-piece UP upside down, or the wafer inverting means 30 may also serve as this means. In these cases, after the third adhesive sheet AS3 is attached, the support table TM2 may be moved into the working range of the articulated robot 11 or the working range of the wafer inverting means 30. The integrated object inversion means 80 may hold at least one of the ring frame RF, the first adhesive sheet AS1, the second adhesive sheet AS2, the third adhesive sheet AS3 and the wafer WF and invert the integrated object UP upside down, or may move the support table TM2 without lifting the integrated object UP and invert the integrated object UP upside down, or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention if the first adhesive sheet peeling means 90 can peel the first adhesive sheet AS1 from the wafer WF without inverting the integrated object UP upside down.

[0034] The first adhesive sheet peeling means 90 may apply the peeling tape PT to the first adhesive sheet AS1 without stopping the movement of the support table TM2, or may apply the peeling tape PT to the first adhesive sheet AS1 without raising or lowering the peeling roller 94, or may move itself to peel the first adhesive sheet AS1 from the wafer WF without moving the support table TM2 or while moving the support table TM2, or may employ a strip-shaped or single-piece peeling sheet PT as the holding means, or may hold the first adhesive sheet AS1 with a holding member that is supported on the output shaft of a linear motor as a driving device and can be sucked and held by a decompression means such as a decompression pump or a vacuum ejector, or may hold the first adhesive sheet AS1 with a chuck motor or the like, and The sheet AS1 may be peeled off from the wafer WF, or may be supported on a support table TM2, or a first adhesive sheet AS1 whose adhesive strength is reduced by energy rays such as ultraviolet rays, infrared rays, visible light, X-rays or gamma rays may be used, and the first adhesive sheet AS1 may be irradiated with energy rays using an energy ray irradiation means that irradiates the energy rays to the first adhesive sheet AS1, and then the first adhesive sheet AS1 may be peeled off from the wafer WF, or some of the unnecessary pieces UF that are shaded in Figure 1(B) may be removed from the wafer WF together with the first adhesive sheet AS1, or the shaded unnecessary pieces UF and other unnecessary pieces UF may be removed from the wafer WF together with the first adhesive sheet AS1, or all of the unnecessary pieces UF may be removed from the wafer WF together with the first adhesive sheet AS1.

[0035] The wafer transport means TM may be configured to transport or move the wafer WF relative to each of the first bonding means 20, wafer inversion means 30, dividing means 40, second bonding means 50, frame placement means 60, third bonding means 70, integral object inversion means 80 and first adhesive sheet peeling means 90 individually, or any of these may be configured as a common means. The wafer transport means TM may move the first, second, and third bonding means 20, 50, and 70 without or while moving the wafer WF, and bond the first, second, and third adhesive sheets AS1, AS2, and AS3 to the wafer WF, or may move the first adhesive sheet peeling means 90 without or while moving the wafer WF, and peel the first adhesive sheet AS1 from the wafer WF.The wafer transport means TM may or may not be included in the semiconductor chip manufacturing apparatus EA of the present invention, and if it is not included, the wafer WF can be transported by another apparatus.

[0036] When the semiconductor chip manufacturing apparatus EA is configured to peel off the first adhesive sheet AS1 from the wafer WF that has undergone the division line formation process, the first bonding process, and the division process, it may be composed of a second bonding means 50 and an unnecessary piece removal means.

[0037] The first adhesive sheet AS1 may have the same outer edge shape as the outer edge shape of the wafer WF, or may have an outer edge shape larger than the outer edge shape of the wafer WF. The second adhesive sheet AS2 may have the same outer edge shape as the tip-taking region WF3, or may have an outer edge shape that is similar to but enlarged from the tip-taking region WF3. The frame member may be annular, circular, elliptical, triangular, quadrangular or more polygonal, or may be a non-annular (non-closed loop) frame member, or may not be present at all.

[0038] The materials, types, shapes, etc. of the first, second, and third adhesive sheets AS1, AS2, and AS3, the peeling tape PT, and the wafer WF in the present invention are not particularly limited. For example, the first, second, and third adhesive sheets AS1, AS2, and AS3, the peeling tape PT, and the wafer WF may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes. The first, second, and third adhesive sheets AS1, AS2, and AS3 and the peeling tape PT may be pressure-sensitive, heat-sensitive, or other adhesive forms. When heat-sensitive adhesive first, second, and third adhesive sheets AS1, AS2, and AS3 or the peeling tape PT are used, they may be bonded by an appropriate method, such as providing heating means such as a coil heater or the heated side of a heat pipe to heat the first, second, and third adhesive sheets AS1, AS2, and AS3 or the peeling tape PT. The first, second, and third adhesive sheets AS1, AS2, and AS3 and the peeling tape PT may be, for example, a single-layer adhesive sheet; a two-layer structure consisting of a substrate and an adhesive layer; a three-layer structure consisting of a substrate and an adhesive layer with one or more intermediate layers laminated between them; a three-layer structure consisting of a substrate and an intermediate layer with one or more cover layers laminated on the top surface of the substrate; a structure in which the substrate, intermediate layer, or cover layer are releasably provided; a double-sided adhesive sheet consisting of a single layer consisting of an adhesive layer; a double-sided adhesive sheet in which adhesive layers are laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the wafer WF may be, for example, a single object such as a silicon semiconductor wafer or a compound semiconductor wafer, or a composite formed from two or more of these. The first, second, and third adhesive sheets AS1, AS2, and AS3 may be referred to in terms of their function or purpose, and may refer to any sheet, film, tape, etc., such as an information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, or recording layer-forming resin sheet.

[0039] The driving device in the above-described embodiments may be an electric device such as a rotary motor, a linear motor, a single-axis robot, or an articulated robot with two or more joints, or an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder, or may be a direct or indirect combination of these. In the above-described embodiments, when a rotating member such as a roller is used, a driving device for rotating the rotating member may be provided, the surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member, or other members such as a rotating or non-rotating shaft or blade may be used instead of the roller, and when a pressing means or pressing member such as a pressure roller or a pressure head that presses the object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with those exemplified above, and the pressing means may be made of a deformable member such as rubber, resin, sponge, or may be made of a non-deformable member such as metal or resin, and when a peeling means or peeling member such as a peeling plate or peeling roller that peels the object to be peeled is used, In combination, members such as plate-shaped members, round bars, rollers, etc. may be used, and the peeling element may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When a supporting (holding) means or a supporting (holding) member that supports (holds) the supported member (held member) is used, a configuration in which the supported member is supported (held) may be used, such as a gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure-sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, driving equipment, etc. When a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting elements such as a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, or spraying of gas or liquid may be used instead of or in combination with the above examples, or a cutting element may be moved and cut using a combination of appropriate driving equipment. [Explanation of symbols]

[0040] EA: Semiconductor chip manufacturing equipment 10...Division line forming means 20...First attachment means 40...Dividing means 50...Second attachment means 70...Third attachment means 90...First adhesive sheet peeling means (unwanted piece removing means) AS1...First adhesive sheet AS2: Second adhesive sheet AS3...Third adhesive sheet CP: semiconductor chip PL: Planned division line SL...Dividing line UF...Unnecessary piece WF: Semiconductor wafer WF1...One side WF2...The Other Side WF3: Chip collection area

Claims

1. a dividing line forming step of forming dividing lines, each of which is made up of modified portions intersecting each other, inside the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of applying an external force to the semiconductor wafer, forming dividing lines along the planned dividing lines, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas; a second attachment step of attaching a second adhesive sheet to the other surface side of the semiconductor wafer; a third bonding step of bonding a third adhesive sheet having an outer edge shape larger than an outer edge shape of the semiconductor wafer onto the second adhesive sheet bonded to the semiconductor wafer; a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer; In the second attaching step, a second adhesive sheet is attached to the other surface side of the semiconductor wafer so as to cover the entire chip collection region and not to contact the outer edge of the semiconductor wafer; The method for manufacturing a semiconductor chip, wherein in the first adhesive sheet peeling step, the unnecessary piece is removed together with the first adhesive sheet.

2. a dividing line forming step of forming dividing lines, each of which is made up of modified portions intersecting each other, inside the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of applying an external force to the semiconductor wafer, forming dividing lines along the planned dividing lines, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas; a second attachment step of attaching a second adhesive sheet to the other surface side of the semiconductor wafer; a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer; In the second attaching step, the second adhesive sheet is attached to the other surface of the semiconductor wafer so as to cover the entire chip collection area and not contact the outer edge of the semiconductor wafer, using the second adhesive sheet on which a third adhesive sheet having an outer edge shape larger than the outer edge shape of the semiconductor wafer is laminated. The method for manufacturing a semiconductor chip, wherein in the first adhesive sheet peeling step, the unnecessary piece is removed together with the first adhesive sheet.

3. a dividing line forming step of forming dividing lines, which are grooves intersecting each other, on one surface of the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of thinning the semiconductor wafer, exposing the planned dividing lines on the other surface of the semiconductor wafer to form dividing lines, and forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer and forming unnecessary pieces outside the chip picking areas; a second attachment step of attaching a second adhesive sheet to the other surface side of the semiconductor wafer; a third bonding step of bonding a third adhesive sheet having an outer edge shape larger than an outer edge shape of the semiconductor wafer onto the second adhesive sheet bonded to the semiconductor wafer; a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer; In the second attaching step, a second adhesive sheet is attached to the other surface side of the semiconductor wafer so as to cover the entire chip collection region and not to contact the outer edge of the semiconductor wafer; The method for manufacturing a semiconductor chip, wherein in the first adhesive sheet peeling step, the unnecessary piece is removed together with the first adhesive sheet.

4. a dividing line forming step of forming dividing lines, which are grooves intersecting each other, on one surface of the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of thinning the semiconductor wafer, exposing the planned dividing lines on the other surface of the semiconductor wafer to form dividing lines, and forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer and forming unnecessary pieces outside the chip picking areas; a second attachment step of attaching a second adhesive sheet to the other surface side of the semiconductor wafer; a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer; In the second attaching step, the second adhesive sheet is attached to the other surface of the semiconductor wafer so as to cover the entire chip collection area and not contact the outer edge of the semiconductor wafer, using the second adhesive sheet on which a third adhesive sheet having an outer edge shape larger than the outer edge shape of the semiconductor wafer is laminated, The method for manufacturing a semiconductor chip, wherein in the first adhesive sheet peeling step, the unnecessary piece is removed together with the first adhesive sheet.

5. a dividing line forming step of forming dividing lines, each of which is made up of modified portions intersecting each other, inside the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a semiconductor chip manufacturing apparatus for peeling off the first adhesive sheet from a semiconductor wafer that has undergone a dividing step of applying an external force to the semiconductor wafer, forming dividing lines starting from the planned dividing lines, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas; a second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area where the semiconductor chips are picked from the semiconductor wafer and not to contact the outer edge of the semiconductor wafer; a third adhering means for adhering a third adhesive sheet having an outer periphery larger than an outer periphery of the semiconductor wafer onto the second adhesive sheet adhered to the semiconductor wafer; a waste piece removing means for removing the waste piece together with the first adhesive sheet from the semiconductor wafer;

6. a dividing line forming step of forming dividing lines, each of which is made up of modified portions intersecting each other, inside the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a semiconductor chip manufacturing apparatus for peeling off the first adhesive sheet from a semiconductor wafer that has undergone a dividing step of applying an external force to the semiconductor wafer, forming dividing lines starting from the planned dividing lines, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas; a second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area where the semiconductor chips are picked from the semiconductor wafer and not to contact the outer edge of the semiconductor wafer; an unnecessary piece removing means for removing the unnecessary piece together with the first adhesive sheet from the semiconductor wafer, The semiconductor chip manufacturing device is characterized in that the second bonding means bonds the second adhesive sheet on which a third adhesive sheet having an outer edge shape larger than the outer edge shape of the semiconductor wafer is laminated.

7. a dividing line forming step of forming dividing lines, which are grooves intersecting each other, on one surface of the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of thinning the semiconductor wafer, forming dividing lines by exposing the planned dividing lines on the other surface of the semiconductor wafer, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas, the semiconductor chip manufacturing apparatus peeling off the first adhesive sheet from the semiconductor wafer; a second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area where the semiconductor chips are picked from the semiconductor wafer and not to contact the outer edge of the semiconductor wafer; a third adhering means for adhering a third adhesive sheet having an outer periphery larger than an outer periphery of the semiconductor wafer onto the second adhesive sheet adhered to the semiconductor wafer; a waste piece removing means for removing the waste piece together with the first adhesive sheet from the semiconductor wafer;

8. a dividing line forming step of forming dividing lines, which are grooves intersecting each other, on one surface of the semiconductor wafer; a first attachment step of attaching a first adhesive sheet to one surface of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer; a dividing step of thinning the semiconductor wafer, forming dividing lines by exposing the planned dividing lines on the other surface of the semiconductor wafer, forming semiconductor chips separated by the dividing lines inside predetermined chip picking areas on the semiconductor wafer, and forming unnecessary pieces outside the chip picking areas, the semiconductor chip manufacturing apparatus peeling off the first adhesive sheet from the semiconductor wafer; a second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area where the semiconductor chips are picked from the semiconductor wafer and not to contact the outer edge of the semiconductor wafer; an unnecessary piece removing means for removing the unnecessary piece together with the first adhesive sheet from the semiconductor wafer, The semiconductor chip manufacturing device is characterized in that the second bonding means bonds the second adhesive sheet on which a third adhesive sheet having an outer edge shape larger than the outer edge shape of the semiconductor wafer is laminated.

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