Liquid resin application device

Abstract

To provide a liquid resin coating device which can uniformly coat a liquid resin to an object.SOLUTION: A liquid resin coating device 1 includes an ultrasonic horn 10 having an ultrasonic vibrator 11 having a columnar shape and vibrating one end face 12, a diaphragm 40 that faces the end face 12 and is arranged at an interval with the end face, a connection part 50 connecting the end face 12 and the diaphragm 40, and a liquid resin supply unit 60 supplying a liquid resin 61 to the gap, wherein the liquid resin supply unit 60 is connected to a flow channel 13 that is formed inside the ultrasonic horn 10 and has one end opened on the end face 12, and supplies the liquid resin 61 to the gap through the flow channel 13, and the diaphragm 40 has a groove part 41 which is formed on a surface on a side opposite to the end face 12 in the diaphragm 40, receives the liquid resin 61 guided by the flow channel 13 and flows the liquid resin 61, atomizes the liquid resin 61 by vibrating the end face 12 and the diaphragm 40 by the ultrasonic vibrator 11, and discharges the atomized liquid resin 61 from the gap and coats the liquid resin 61 onto an object.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a liquid resin application device. [Background technology]

[0002] A known method is to ablate a semiconductor wafer with devices formed on its surface by irradiating it with a laser beam along streets (planned dividing lines) set on the surface, thereby dividing it into chip size. This method generates processing waste called debris during processing, which can scatter and reattach to the wafer, potentially contaminating the devices.

[0003] To solve this problem, for example, Patent Document 1 discloses a method of forming a protective film by applying a water-soluble liquid resin to the surface of a wafer. A typical method of forming a protective film involves supplying liquid resin to the wafer while rotating a spinner table holding the wafer at high speed, and then moving the liquid resin by centrifugal force to cover the wafer surface. Patent Documents 2 and 3 also disclose methods of atomizing a liquid. The present applicant has devised a method of forming a protective film by supplying atomized liquid resin to the surface of a wafer using the atomization techniques of Patent Documents 2 and 3. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-140311 [Patent Document 2] Japanese Patent Application Publication No. 6-210236 [Patent Document 3] Japanese Patent Application Laid-Open No. 2016-147248 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the wafer has steps or bumps such as electrodes, the method of Patent Document 1, which uses centrifugal force, has the problem of some areas not being covered with the liquid resin. Also, it has become clear that the methods using atomization technology of Patent Documents 2 and 3 cannot apply the liquid resin uniformly to the wafer because the liquid resin is atomized locally at the area where it is supplied.

[0006] The present invention has been made in view of the above problems, and an object of the present invention is to provide a liquid resin application device that can apply liquid resin uniformly to an object. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the liquid resin application device of the present invention is a liquid resin application device that atomizes liquid resin and applies it to an object, and includes an ultrasonic horn having a columnar ultrasonic vibrator that vibrates one end face, a vibration plate that faces the end face with a gap therebetween, and a liquid resin application device that atomizes liquid resin and applies it to an object, the liquid resin application device comprising: Center of and the diaphragm The center of the surface facing the end surface and a liquid resin supply unit that supplies liquid resin to the gap, the liquid resin supply unit being connected to a flow path formed inside the ultrasonic horn and having one end opening at the end face, and supplying the liquid resin to the gap via the flow path, the vibration plate having a groove formed on the surface facing the end face of the vibration plate that receives the liquid resin guided by the flow path and allows it to flow inside, the liquid resin being atomized by vibrating the end face and the vibration plate with the ultrasonic vibrator, and the atomized liquid resin being released from the gap and applied to the object.

[0009] In the liquid resin applicator of the present invention, the vibration plate may be disk-shaped, and the groove may be annular along the outer periphery of the vibration plate.

[0010] Furthermore, in the liquid resin application device of the present invention, the vibration plate includes a plurality of vibration plates arranged in a line perpendicular to the end face, and the vibration plate located furthest from the end face among the plurality of vibration plates faces the end face, and the connecting portion may further connect adjacent vibration plates.

[0011] In addition, in the liquid resin application device of the present invention, the flow path may have the other end opening on the side surface that is the node position of the ultrasonic horn, and the liquid resin supply unit may be provided with a supply pipe that supplies liquid resin to the flow path from the other end.

[0012] The liquid resin application device of the present invention may further include a gas injection unit that is arranged to surround the ultrasonic horn and that injects gas in a direction toward the object. [Effects of the Invention]

[0013] The present invention can apply liquid resin uniformly to an object. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a side view schematically showing an example of the arrangement of a liquid resin application device according to an embodiment. [Figure 2] FIG. 2 is a side view schematically showing an example of the configuration of the liquid resin applying device shown in FIG. [Figure 3] FIG. 3 is an explanatory diagram illustrating the vibration amplitude distribution of the ultrasonic horn shown in FIG. [Figure 4] FIG. 4 is a plan view showing a first example of the diaphragm and the connecting portion shown in FIG. [Figure 5] FIG. 5 is a plan view showing a second example of the diaphragm and the connecting portion shown in FIG. [Figure 6] FIG. 6 is a plan view showing a third example of the diaphragm and the connecting portion shown in FIG. [Figure 7] FIG. 7 is a side view schematically showing a configuration example of a liquid resin applying device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0015] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0016] [Embodiment] First, a liquid resin applicator 1 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view schematically showing an example of the arrangement of the liquid resin applicator 1 according to the embodiment. As shown in FIG. 1, the liquid resin applicator 1 is an apparatus that applies atomized liquid resin 61 to an object 100 held on a holding table 2, thereby forming a protective film on the object 100. The liquid resin applicator 1 according to the embodiment is disposed above the holding table 2. The liquid resin applicator 1 is movable between an operating position located above the holding table 2 and a retracted position spaced apart from above the holding table 2.

[0017] The object 100 is, for example, a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose substrate is made of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs), silicon carbide (SiC), or the like. The wafer has, for example, devices formed in areas defined by a plurality of planned division lines set on the surface. The devices are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integration), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), etc.

[0018] The wafer, for example, has a plurality of electrode bumps mounted on the surface of the device, forming an uneven surface. The device has an uneven structure due to the electrode bumps mounted on its surface. The target object 100 is not limited to a wafer having electrode bumps protruding from the surface of the device as exemplified, but may be any object having uneven surface 101.

[0019] The object 100 is held, for example, on a holding surface 3 of a holding table 2. The holding surface 3 is, for example, a disk-shaped surface made of porous ceramic or the like. In this embodiment, the holding surface 3 is a flat surface parallel to the horizontal direction. The holding surface 3 is, for example, in communication with a vacuum suction source via a vacuum suction path. The holding table 2 suction-holds the object 100 placed on the holding surface 3.

[0020] In this embodiment, the object 100 is attached to an annular frame 110, and tape 111, the diameter of which is larger than the outer diameter of the object 100, is attached to the backside of the object 100. The object 100 is supported within an opening in the frame 110 and held by the holding table 2. A plurality of clamp members 4 are arranged around the periphery of the holding table 2 to clamp the frame 110 that supports the object 100. The holding table 2 is movable in the horizontal direction by a moving unit (not shown). The holding table 2 is also rotatable around a vertical axis.

[0021] The detailed configuration of the liquid resin applicator 1 will be described. Fig. 2 is a side view schematically showing an example of the configuration of the liquid resin applicator 1 shown in Fig. 1. Fig. 3 is an explanatory diagram showing a vibration amplitude distribution 20 of the ultrasonic horn 10 shown in Fig. 1. As shown in Fig. 2, the liquid resin applicator 1 includes the ultrasonic horn 10, a high-frequency power supply 30, a vibration plate 40, a connecting section 50, a liquid resin supply unit 60, and a gas injection section 70.

[0022] The ultrasonic horn 10 is cylindrical and includes an ultrasonic vibrator 11. The ultrasonic vibrator 11 generates ultrasonic waves by vibrating at a predetermined amplitude and frequency. In this embodiment, the ultrasonic vibrator 11 vibrates, for example, with an amplitude of 30 μm, an output of 20 W, and a frequency of 52 kHz. The ultrasonic vibrator 11 includes, for example, a piezoelectric element that expands and contracts when charged. The ultrasonic horn 10 is configured so that the vibration of the ultrasonic vibrator 11 is amplified to vibrate one end surface 12. In this embodiment, the end surface 12 is a flat surface on the lower end side of the ultrasonic horn 10.

[0023] The ultrasonic transducer 11 may further include a heat dissipation unit that dissipates heat that is heated by vibration from the ultrasonic transducer 11. The heat dissipation unit includes, for example, a heat sink. The heat sink can be cooled, for example, by water cooling.

[0024] A flow path 13 is formed inside the ultrasonic horn 10. One end of the flow path 13 opens (opening 14) at the end face 12 of the ultrasonic horn 10. The other end of the flow path 13 opens (opening 15) at the side face of the ultrasonic horn 10. That is, the flow path 13 is formed inside the ultrasonic horn 10 between the opening 14 at the end face 12 and the opening 15 at the side face. The flow path 13 guides liquid resin 61 supplied by a liquid resin supply unit 60 (described below) from the opening 15 on the side face to the opening 14 on the end face 12 side. The opening 14 on the end face 12 side of the flow path 13 discharges the liquid resin 61.

[0025] Due to the vibration of the ultrasonic vibrator 11, the ultrasonic horn 10 vibrates at each position in the axial direction with an amplitude shown in the vibration amplitude distribution 20 of the vibration waveform shown in FIG. 3. The vibration amplitude distribution 20 has antinodes 21, which are the maximum points of vibration, and nodes 22, which are the minimum points of vibration. As shown in FIG. 3, the opening 15 is preferably formed at the node 22 position of the ultrasonic horn 10. By forming the opening 15 at the node 22 position where the vibration is minimum, the introduction of the liquid resin 61 into the flow path 13 is stabilized. Note that the node 22 position is the position where the amplitude of the vibration caused by the ultrasonic vibrator 11 in the axial direction of the ultrasonic horn 10 is minimum, so the other end of the flow path 13 opens at the node 22 position on the side of the ultrasonic horn 10.

[0026] The high-frequency power supply 30 applies a voltage to the ultrasonic vibrator 11. The high-frequency power supply 30 applies a voltage of a predetermined magnitude and frequency to the ultrasonic vibrator 11, thereby vibrating the ultrasonic vibrator 11 at a predetermined amplitude and frequency. For example, if the ultrasonic vibrator 11 includes a piezoelectric element, the piezoelectric element to which the voltage is applied from the high-frequency power supply 30 expands and contracts, thereby generating vibrations.

[0027] The diaphragm 40 faces the end face 12 of the ultrasonic horn 10, with a small gap between them. The diaphragm 40 is fixed to the ultrasonic horn 10 via a connecting part 50, which will be described later. The planar shape of the diaphragm 40 is preferably the same as or similar to the shape of the end face 12 of the ultrasonic horn 10. Liquid resin 61 is supplied into the gap between the end face 12 of the ultrasonic horn 10 and the diaphragm 40 from a liquid resin supply unit 60, which will be described later. The diaphragm 40 has a groove 41 formed on the surface facing the end face 12. The groove 41 receives the liquid resin 61 that is guided to the flow path 13 inside the ultrasonic horn 10 and discharged from the opening 14, and allows it to flow inside.

[0028] The liquid resin application device 1 atomizes the liquid resin 61 flowing in the groove 41 by supplying the liquid resin 61 into the gap between the end face 12 of the ultrasonic horn 10 and the vibration plate 40 while vibrating the end face 12 and the vibration plate 40 with the ultrasonic vibrator 11. The atomized liquid resin 61 is released from the gap and applied to the target object 100 shown in FIG.

[0029] In the drawings accompanying this specification, for the sake of explanation, the vibration plate 40 is depicted as being relatively larger than the ultrasonic horn 10 and other components, but in reality, its thickness is less than 100 μm. Similarly, the gap between the vibration plate 40 and the end face 12 is depicted as being exaggerated, but in reality, the vertical distance is less than 100 μm. Furthermore, when atomized liquid resin 61 is applied to the object 100 shown in FIG. 1, the distance between the vibration plate 40 and the surface 101 of the object 100 is 10 mm or more and 20 mm or less in this embodiment.

[0030] The connecting portion 50 connects the end face 12 of the ultrasonic horn 10 and the vibration plate 40. The connecting portion 50 includes, for example, a screw. The connecting portion 50 is preferably provided so as to connect the center of the end face 12 and the center of the surface of the vibration plate 40 facing the end face 12. Compared to a configuration in which the outer peripheries are connected, a configuration in which the centers are connected can suppress damage due to metal fatigue. A gap adjustment plate 51 is arranged around the connecting portion 50 to adjust the distance between the end face 12 and the vibration plate 40. In this embodiment, the gap adjustment plate 51 is a ring-shaped spacer (shim ring).

[0031] 4 is a plan view showing a first example of the diaphragm 40 and the connecting portion 50 shown in FIG. 4. The diaphragm 40-1 of the first example shown in FIG. 4 is disk-shaped. The groove portion 41-1 formed in the diaphragm 40-1 of the first example is annular and extends along the outer periphery of the diaphragm 40-1. Furthermore, the connecting portion 50-1 that connects the diaphragm 40-1 of the first example and the end surface 12 of the ultrasonic horn 10 (see FIG. 2) is cylindrical.

[0032] Fig. 5 is a plan view showing a second example of diaphragm 40 and connecting portion 50 shown in Fig. 1. Diaphragm 40-2 of the second example shown in Fig. 5 differs from diaphragm 40-1 of the first example in that it has groove 41-2 in addition to groove 41-1. A plurality of grooves 41-2 are formed radially between the outer periphery of annular groove 41-1 and the outer periphery of diaphragm 40-1.

[0033] 6 is a plan view showing a third example of the diaphragm 40 and the connecting portion 50 shown in FIG. 6. The diaphragm 40-3 of the third example shown in FIG. 6 has a rectangular plate shape. The groove portion 41-3 formed in the diaphragm 40-3 of the third example has a rectangular ring shape along the outer periphery of the diaphragm 40-3. Furthermore, the connecting portion 50-3 connecting the diaphragm 40-3 of the third example and the end face 12 of the ultrasonic horn 10 (see FIG. 2) has a prismatic shape that is rectangular in plan view.

[0034] 2 is a unit that supplies liquid resin 61 to the gap between the end face 12 of the ultrasonic horn 10 and the vibration plate 40. The liquid resin supply unit 60 includes a liquid resin supply source 62 and a supply pipe 63. The liquid resin supply source 62 stores the liquid resin 61.

[0035] The upstream end of the supply pipe 63 is connected to the liquid resin supply source 62, and the downstream end is connected to the opening 15. That is, the supply pipe 63 supplies the liquid resin 61 from the opening 15 to the flow path 13. The liquid resin supply unit 60 supplies the liquid resin 61 from the liquid resin supply source 62 via the supply pipe 63 and the flow path 13 to the gap between the end face 12 of the ultrasonic horn 10 and the vibration plate 40.

[0036] In this embodiment, the liquid resin supply unit 60 supplies the liquid resin 61 at a supply rate of 0.2 mL / min to 1 mL / min. In this embodiment, the viscosity of the liquid resin 61 is 52 cP. The viscosity of the liquid resin 61 is not limited to that in this embodiment and may be changed as appropriate as long as the liquid resin 61 can be atomized by the ultrasonic horn 10.

[0037] The gas injection unit 70 is disposed so as to surround the ultrasonic horn 10, and injects gas 71 in a direction toward the target object 100. The gas 71 includes, for example, air. The gas injection unit 70 is a unit that uses the supplied gas 71 to form a so-called air curtain that surrounds the sides of the area from the gap between the end surface 12 of the ultrasonic horn 10 and the vibration plate 40 to the target object 100, where the atomized liquid resin 61 is applied to the target object 100.

[0038] The gas injection unit 70 includes a gas supply source 72, a supply path 73, and an injection port 74. The gas supply source 72 includes a pump or the like that sends gas 71 to the supply path 73. The upstream end of the supply path 73 is connected to the gas supply source 72, and the downstream end is connected to the injection port 74. The supply path 73 is disposed, for example, in a cylindrical shape that surrounds the side of the ultrasonic horn 10. The supply path 73 may be, for example, in the shape of a tube with multiple supply paths 73 arranged in an annular shape. The injection port 74 is disposed, for example, in the shape of a slit that opens downward.

[0039] The gas injection unit 70 forms an air curtain surrounding the atomized liquid resin 61 by a flow of gas 71 injected from an injection port 74 of the supply path 73 toward the target object 100. When the injection ports 74 are arranged in an annular shape, the air curtain is formed in a roughly cylindrical shape. In the embodiment shown in FIG. 2, the injection port 74 is inclined so as to inject gas downward in the vertical direction toward the inner ultrasonic horn 10, but the gas injection unit 70 can change the range to which the liquid resin 61 is applied by adjusting the angle at which the gas 71 is injected.

[0040] In the embodiment, the flow of gas 71 forming the air curtain is aligned with the direction of atomized liquid resin 61 toward target object 100. Here, "aligned" includes being parallel and forming a small angle with each other. Also, in the embodiment, the direction of the flow of gas 71 forming the air curtain is the same as the direction of atomized liquid resin 61 toward target object 100.

[0041] The gas 71 supplied from the supply path 73 is preferably hot air or dry air at a temperature of 25°C to 80°C, or a mixture of hot air and dry air. The gas spraying unit 70 may further include a heat source for heating the gas 71 supplied from the supply path 73. This can promote drying of the liquid resin 61 applied to the surface 101 of the target object 100. In this embodiment, the gas spraying unit 70 supplies the gas 71 at a flow rate of 70 mL / min.

[0042] The liquid resin applicator 1 supplies the liquid resin 61 into the gap between the end face 12 of the ultrasonic horn 10 and the vibration plate 40 while vibrating the end face 12 and the vibration plate 40 with the ultrasonic vibrator 11, thereby applying the atomized liquid resin 61 to the object 100. At this time, an air curtain formed by the gas 71 ejected from the supply path 73 surrounds the atomized liquid resin 61, making it possible to apply the atomized liquid resin 61 to the object 100 in a state where the effects of external disturbances are suppressed.

[0043] 1, the liquid resin applicator 1 moves relative to the holding table 2, thereby applying liquid resin 61 to the entire surface 101 of the object 100 held on the holding table 2, and can form a protective film that covers the surface 101 of the object 100. The liquid resin applicator 1 moves, for example, in a spiral shape relative to the holding table 2. The liquid resin applicator 1 also repeatedly applies the resin for, for example, five passes until the irregularities (e.g., electrode bumps) on the surface 101 of the object 100 are covered.

[0044] As described above, the liquid resin applicator 1 of the embodiment supplies liquid resin 61 to the end surface 12 using the flow path 13 formed inside the ultrasonic horn 10, and causes the liquid resin 61 guided by this flow path 13 to flow inside the groove portion 41 on the vibration plate 40. As a result, the liquid resin 61 spreads throughout the entire gap between the end surface 12 and the vibration plate 40, and the liquid resin 61 atomized in this gap can be uniformly released from the gap. Therefore, the liquid resin applicator 1 has the effect of being able to apply the liquid resin 61 uniformly and without bias to the object 100.

[0045] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. For example, the flow path 13 for the liquid resin 61 may pass through the center of the ultrasonic horn 10. Furthermore, the opening 14 of the flow path 13 may be located in multiple places, rather than in one place.

[0046] Furthermore, the shape of grooves 41 formed in diaphragm 40 is not limited to the shapes shown in the first to third examples. Groove 41 may, for example, not include annular groove 41-1 (see FIGS. 4 and 5) but include only radially formed grooves 41-2. Groove 41 may also be intersecting straight grooves, etc.

[0047] The holding table 2 may also be provided with a mechanism for heating the holding surface 3 to promote drying of the applied liquid resin 61. Also, a mechanism for irradiating the upper surface (surface 101) of the object 100 with a halogen light may also be provided. Ethanol may also be mixed into the supplied liquid resin 61 to improve drying properties. Also, the gas injection unit 70 for forming an air curtain may not be provided.

[0048] Although the embodiment includes one vibration plate 40, the present invention may include, for example, a plurality of vibration plates. An example of a liquid resin application device including a plurality of vibration plates is shown in the following modified example.

[0049] [Modification] Fig. 7 is a side view showing a schematic configuration example of a liquid resin applicator 1-1 of a modified example. Note that the gas injection unit 70 is omitted in Fig. 7. The liquid resin applicator 1-1 of the modified example differs from the liquid resin applicator 1 of the embodiment in that it has multiple vibration plates 80 and connecting units 90 instead of one vibration plate 40 and connecting unit 50.

[0050] In a modified example, the plurality of diaphragms 80 includes two diaphragms 80-1 and 80-2. The diaphragms 80-1 and 80-2 are arranged side by side in a direction perpendicular to the end face 12 of the ultrasonic horn 10. Of the plurality of diaphragms 80, diaphragm 80-1, which is positioned closest to the end face 12, faces the end face 12. The diaphragm 80-2 faces the surface of diaphragm 80-1 opposite to the surface facing the end face 12, and is arranged with a small gap between them.

[0051] Each of the plurality of diaphragms 80 has a groove 81. Diaphragm 80-1 has a groove 81-1 formed on the surface facing end face 12. Diaphragm 80-2 has a groove 81-2 formed on the surface facing diaphragm 80-1.

[0052] Diaphragm 80-1 has a through-hole 82 that penetrates from the bottom surface of groove 81-1 to the surface facing diagnosing plate 80-2. Diaphragm 80-2 does not have a through-hole 82. The through-hole 82 guides the liquid resin 61 flowing inside groove 81-1 into the gap between diagnosing plates 80-1 and 80-2. That is, of the multiple diagnosing plates 80, all diagnosing plates 80 except for the diagnosing plate 80 located farthest from ultrasonic horn 10 have through-holes 82, which successively supply liquid resin 61 to the groove 81 of the diagnosing plate 80 located below. The gap between adjacent diagnosing plates 80 is less than 100 μm.

[0053] Connecting portion 90 connects end face 12 of ultrasonic horn 10 to diaphragm 80-1, and also connects adjacent diaphragms 80-1 and 80-2. Connecting portion 90 includes connecting portion 90-1 that connects end face 12 of ultrasonic horn 10 to diaphragm 80-1, and connecting portion 90-2 that connects adjacent diaphragms 80-1 and 80-2. Connecting portion 90-1 and connecting portion 90-2 may be integrally molded pillar-shaped that penetrates diaphragm 80-1, or may be separate bodies.

[0054] A gap adjustment plate 91 is arranged around connecting portion 90-1 to adjust the distance between end face 12 and diaphragm 80-1. A gap adjustment plate 91 is arranged around connecting portion 90-2 to adjust the distance between diaphragm 80-1 and diaphragm 80-2. In a modified example, gap adjustment plate 91 is a ring-shaped spacer (shim ring).

[0055] The diaphragm 80 in the modified example includes two diaphragms 80-1 and 80-2, but may include three or more diaphragms in the present invention. Also, in the modified example, the two diaphragms 80-1 and 80-2 are arranged side by side in a direction perpendicular to the end face 12, but in the case of a configuration including multiple diaphragms, some of the diaphragms may be arranged side by side in the horizontal direction. [Explanation of symbols]

[0056] 1 Liquid resin application device 10 Ultrasonic Horn 11 Ultrasonic vibrator 12 End face 13 Flow path 14, 15 aperture 20 Vibration amplitude distribution 21 Belly Verse 22 30 High frequency power supply 40 diaphragm 41 Groove 50 Connection part 51 Gap adjustment plate 60 Liquid resin supply unit 61 Liquid Resin 62 Liquid Resin Supply Source 63 Supply pipe 70 Gas injection section 71 Gas 72 Gas supply source 73 Supply route 74 Nozzle 100 objects

Claims

1. A liquid resin application device that atomizes liquid resin and applies it to an object, an ultrasonic horn having a columnar ultrasonic vibrator that vibrates one end face; a diaphragm disposed facing the end surface with a gap therebetween; a connecting portion connecting the center of the end surface and the center of the surface of the diaphragm facing the end surface; a liquid resin supply unit that supplies liquid resin to the gap; Equipped with The liquid resin supply unit comprises: a flow path formed inside the ultrasonic horn and having one end open at the end surface, and the liquid resin is supplied to the gap through the flow path; The diaphragm is a groove formed on a surface of the vibration plate facing the end surface, the groove receiving the liquid resin guided by the flow path and allowing the liquid resin to flow therein; The liquid resin is atomized by vibrating the end surface and the vibration plate with the ultrasonic vibrator; The atomized liquid resin is released from the gap and applied to the object. Liquid resin application device.

2. The diaphragm is disc-shaped, The groove portion is annular and extends along the outer periphery of the diaphragm. The liquid resin application device according to claim 1 .

3. The diaphragm is a plurality of vibration plates arranged side by side in a direction perpendicular to the end surface; The diaphragm located closest to the end face among the plurality of diaphragms faces the end face, The connecting portion is Further, adjacent diaphragms are connected to each other.

3. The liquid resin application device according to claim 1 or 2.

4. The flow path is The other end opens at a side surface that is a node position of the ultrasonic horn, The liquid resin supply unit comprises: a supply pipe for supplying liquid resin from the other end to the flow path, The liquid resin applying device according to any one of claims 1 to 3.

5. The ultrasonic wave measuring device further includes a gas injection unit that is arranged to surround the ultrasonic horn and that injects gas in a direction toward the target object. The liquid resin applying device according to any one of claims 1 to 4.

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