Imaging device

Abstract

To provide an imaging apparatus that satisfies heat dissipation performance while suppressing the size increase of the apparatus.SOLUTION: In the imaging apparatus, a duct 310 has a first air vent 332 formed in a bottom side of a rear face 21 or a side face 25 of exterior members 21-25, extends from a rear face side to a front face side in an optical axis direction, passes through an area between an imaging element substrate 11 and a control circuit substrate 12 and the bottom surface 24 of the exterior members, and is connected to a second air vent 333 formed to face the first air vent 332 across the optical axis on the bottom face side of the exterior members. A heat dissipation fan 331 is arranged in the duct 310 arranged in the area between the imaging element substrate 11 and the control circuit substrate 12 and the bottom surface of the exterior member.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an imaging device having a heat dissipation structure for heat generated from a heat source. [Background technology]

[0002] 2. Description of the Related Art In recent years, with the demand for miniaturization of electronic devices, there has been a remarkable trend toward miniaturization and higher density of mounted components inside the devices.

[0003] On the other hand, there is an ever-increasing demand for higher performance in imaging devices, particularly in video functions, and the amount of heat generated by the devices is on the rise.

[0004] When shooting video in a high-temperature environment, the temperature inside the imaging device rises, which can lead to malfunctions and performance degradation of mounted components, and ultimately to failure of the imaging device.

[0005] Furthermore, in recent years, imaging devices that perform shake correction by moving the imaging element in a direction perpendicular to the optical axis direction have become widespread in order to improve image quality.

[0006] Even in imaging devices that perform such shake correction, sufficient heat dissipation is required because heat generated in the imaging element when the shake correction mechanism is operating, when continuous shooting is performed, or when video is shot affects image quality.

[0007] Therefore, when the amount of heat dissipated by natural heat dissipation is insufficient for the amount of heat generated by the imaging device, a heat dissipation structure that uses forced air cooling with a fan is used.

[0008] Patent Document 1 discloses a device that uses a fan located on the bottom of the camera to exhaust air in the gap between a heat sink for an imaging element and an opposing heat sink for a circuit board to the outside.

[0009] Furthermore, Patent Document 2 discloses a device in which an L-shaped heat sink / duct having a blower fan is disposed between an imaging element and a main board. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Japanese Patent Application Publication No. 2017-228876 [Patent Document 2] Japanese Patent Application Publication No. 2015-204422 Summary of the Invention [Problem to be solved by the invention]

[0011] However, the device disclosed in the above-mentioned Patent Document 1 takes in outside air directly into the device, which causes a problem in that outside dust and dirt can easily get into the device.

[0012] Furthermore, in the device disclosed in Patent Document 2, a fan is disposed in a part of the heat sink / duct, which causes the device to become large in size.

[0013] The present invention has been made in view of the above problems, and an object of one embodiment of the present invention is to provide an imaging device that satisfies heat dissipation performance while suppressing an increase in size of the device. [Means for solving the problem]

[0014] An imaging device having an imaging element according to one embodiment of the present invention, the imaging device includes a control circuit that controls the imaging device, a display panel that is disposed on a rear side of an exterior member, and a heat dissipation fan that is disposed on a bottom side of the exterior member; an imaging element substrate on which the imaging element is mounted, a control circuit substrate on which the control circuit is mounted, and the display panel are arranged in this order from the front side to the rear side in the optical axis direction; a duct having a first ventilation opening formed on the bottom surface side of the rear surface or side surface of the exterior member extends from the rear surface side to the front surface side in the optical axis direction, passes through a region between the imaging element board and the control circuit board and the bottom surface of the exterior member, and is connected to a second ventilation opening formed on the bottom surface side of the exterior member opposite the first ventilation opening across the optical axis, The heat dissipation fan is disposed inside a duct disposed in an area between the imaging element board, the control circuit board, and the bottom surface of the exterior member. And, A first fin is disposed inside the duct and on the intake side of the heat dissipation fan, and a first heat conduction member thermally connected to the imaging element substrate is thermally connected directly above the first fin. It is characterized by the presence of [Effects of the Invention]

[0015] According to one embodiment of the present invention, it is possible to satisfy the heat dissipation performance while suppressing an increase in the size of the device. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of a digital camera 100 according to a first embodiment of the present invention; [Figure 2] FIG. 1 is an exploded perspective view of a digital camera 100 according to a first embodiment of the present invention; [Figure 3] FIG. 1 is an explanatory diagram of a heat dissipation mechanism 320 according to a first embodiment of the present invention. [Figure 4] 1 is a structural explanatory diagram of a duct 310 according to a first embodiment of the present invention; [Figure 5] FIG. 10 is an explanatory diagram of the air volume of the duct 310 according to the first embodiment of the present invention. [Figure 6] Schematic diagram of the internal structure of a duct 310 according to the first embodiment of the present invention. [Figure 7] Block diagram of the present invention DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, exemplary embodiments of the technology of the present disclosure will be described in detail with reference to the drawings.

[0018] However, the dimensions, materials, shapes and relative arrangement of the components described below should be changed as appropriate depending on the configuration and various conditions of the device to which the invention is applied.

[0019] Therefore, the scope of the present invention is not intended to be limited to the following description.

[0020] For configurations and steps that are not particularly illustrated or described, well-known or publicly known techniques in the relevant technical field can be applied. Furthermore, duplicated explanations may be omitted.

[0021] In the drawings, the same reference numbers are used between the drawings to indicate identical or functionally similar elements.

[0022] (Block diagram showing an example of the configuration of a digital camera 400 according to the present invention) FIG. 7 is a block diagram showing an example of the configuration of a digital camera 400 according to the present invention.

[0023] The shutter 410 is a focal plane shutter that can freely control the exposure time of an imaging unit 411, which will be described later. This control is performed by a system control unit 420, which will be described later.

[0024] The imaging unit 411 is an imaging device that has an imaging surface on which an object image (optical image) that has passed through the lens 501 is formed, and outputs an electrical signal (analog signal) corresponding to the optical image on the imaging surface through photoelectric conversion.

[0025] The imaging unit 411 may be a CCD (Charge Couple Device) or a CMOS (Complementary MOS) sensor.

[0026] The A / D converter 412 is a signal conversion means used to convert an analog signal output from the imaging unit 411 into a digital signal.

[0027] The image processing unit 413 is an image calculation means that performs predetermined pixel interpolation, resizing processing such as reduction, and color conversion processing on the digital signal from the A / D converter 412 or the digital signal from the memory control unit 422 described later, to generate image data.

[0028] Based on the calculation results obtained by the image processing unit 413, the system control unit 420 controls the aperture position and the lens position.

[0029] The image processing unit 413 further performs calculation processing using the image data, and performs TTL type AWB (auto white balance) processing based on the calculation results obtained.

[0030] The system control unit 420 is a control unit that is made up of at least one processor or circuit, and controls the entire digital camera 400 .

[0031] Each process of the present invention is realized by executing a program recorded in a nonvolatile memory 423, which will be described later.

[0032] The memory 421 is a storage means for temporarily recording the digital signals obtained by the imaging unit 411 and converted by the A / D converter 412 and the image data generated by the image processing unit 413 .

[0033] The memory 421 has a storage capacity sufficient to store a predetermined number of still images and a predetermined period of moving images and audio.

[0034] The memory control unit 422 is a memory control means that controls the transmission and reception of data controlled by the system control unit 420 to and from the A / D converter 412 , the image processing unit 413 , and the memory 421 .

[0035] The digital signal output from the A / D converter 412 is written directly into the memory 421 via the image processing unit 413 and the memory control unit 422, or via the memory control unit 422 only.

[0036] The nonvolatile memory 423 is an electrically erasable and recordable read-only storage means, and stores constants, programs, etc. for the operation of the system control unit 420.

[0037] The system memory 424 is a readable and writable storage means that stores constants and variables for the operation of the system control unit 420, programs read from the nonvolatile memory 423, and the like.

[0038] The system timer 425 is a timing unit that measures the time until an auto power-off function that turns off various display members (described later) is executed, and the exposure time.

[0039] The auto power off function has a function of turning off various display members (described later) to prevent battery consumption when it is determined that the photographer is not operating the digital camera 400.

[0040] The power supply unit 430 is made up of a primary battery such as an alkaline battery or a lithium battery, a secondary battery such as an NiCd battery, an NiMH battery, or a Li battery, an AC adapter, or the like.

[0041] The power supply control unit 431 is configured with a circuit for detecting the power supply unit 430 that serves as the power source for driving the digital camera 400, a DC-DC converter, a switch circuit for switching the power supply destination, and the like.

[0042] The power supply unit 430 then detects whether a battery is installed, the type of battery, and the remaining battery power.

[0043] Furthermore, the power supply control unit 431 controls the DC-DC converter based on the detection result and instructions from the system control unit 420, and supplies the required voltage to the supply destination at the required timing.

[0044] The communication terminal 440 is provided on the digital camera 400 and is electrically connected to a lens communication terminal 506, which will be described later.

[0045] By electrically connecting the communication terminal 440, the system control unit 420 that controls the entire digital camera 400 can communicate with the lens 500, which will be described later.

[0046] The recording medium I / F 441 is an interface with a recording medium 600, which will be described later.

[0047] The orientation detection unit 442 detects the orientation of the digital camera 400 relative to the direction of gravity.

[0048] Based on the orientation detected by the orientation detection unit 442, orientation information can be output indicating whether the image captured by the imaging unit 411 was captured with the digital camera held horizontally or vertically.

[0049] The system control unit 420 can add the orientation information output by the orientation detection unit 442 to the image data.

[0050] The attitude detection unit 442 may be an acceleration sensor, a gyro sensor, or the like.

[0051] If an acceleration sensor and a gyro sensor are used as the attitude detection unit 442, it is also possible to detect the movement of the digital camera 400 (panning, tilting, lifting, whether it is stationary, etc.).

[0052] Eyepiece 443 is the part where the photographer's eye (object) 700 approaches (comes into contact with) digital camera 400.

[0053] The eyepiece detection unit 444 is a proximity or eyepiece detection sensor that detects the approach (eyepiece approach) and departure (eye separation) of the eye 700 to the eyepiece unit 443.

[0054] Eye proximity detection unit 444 detects whether eye 700 is in proximity to eyepiece unit 443 based on whether a light receiving unit (not shown) of the infrared proximity sensor receives light.

[0055] After detecting eye contact, system control unit 420 determines that the eye contact state continues until eye removal is detected.

[0056] After detecting eye separation, the system control unit 420 remains in the eye-displacement state until it detects eye placement.

[0057] The infrared proximity sensor is just an example, and other sensors may be used for the eye proximity detection unit 444 as long as they can detect the approach of an eye or an object that can be regarded as an eye.

[0058] The memory 421 also serves as a memory for displaying images (video memory).

[0059] The digital signals and image data written in the memory 421 are displayed on the rear display unit 450 and EVF 451 via the memory control unit 422 .

[0060] The rear display unit 450 performs display in accordance with a signal from the memory control unit 422 .

[0061] When the eye-contact detection unit 444 detects that the eye is in contact with the EVF 451 , the EVF 451 displays a picture in accordance with a signal from the memory control unit 422 .

[0062] The analog signal generated by the imaging unit 411 is A / D converted by the A / D converter 412, and the digital signal recorded in the memory 421 is sequentially transferred to the rear display unit 450 or the EVF 451 for display.

[0063] This allows for real-time live view display.

[0064] The system control unit 420 switches the display (display state) / non-display (non-display state) of the rear display unit 450 and the EVF 451 according to the state detected by the eyepiece detection unit 444 described above.

[0065] When the eyepiece is not in use, the image is displayed on the rear display unit 450, and the EVF 451 is not displayed.

[0066] Also, while the eyepiece is in viewfinder, the image is displayed on the EVF 451, and the rear display unit 450 is not displayed.

[0067] The operation unit 460 is a variety of operation members serving as an input unit that accepts operations from the user.

[0068] The operation unit 460 includes various operation members (mode changeover switch 461, shutter button 462, first shutter switch 463, second shutter switch 464, touch panel 465, and power switch 466) which will be described later.

[0069] The operation unit 460 is an operation means for inputting various operation instructions to the system control unit 420 .

[0070] A mode changeover switch 461 switches the operation mode of the system control unit 420 between a still image capturing mode, a moving image capturing mode, and the like.

[0071] The still image shooting mode includes an auto shooting mode, an auto scene determination mode, and a manual shooting mode.

[0072] Furthermore, the still image shooting modes include aperture priority mode (Av mode), shutter speed priority mode (Tv mode), and program AE mode (P mode).

[0073] Similarly, the video shooting mode may include multiple shooting modes.

[0074] The shutter button 462 is a button that allows the photographer to give instructions for preparation for shooting and instructions for shooting.

[0075] The first shutter switch 463 is turned on when the shutter button 462 provided on the digital camera 400 is pressed halfway (a shooting preparation instruction) during operation, and generates a first shutter switch signal SW1.

[0076] The first shutter switch signal SW1 starts photographing preparation operations such as AF (autofocus) processing, AE (auto exposure) processing, and AWB (auto white balance) processing.

[0077] The second shutter switch 464 is turned on when the shutter button 462 is fully pressed (a photographing instruction) and generates a second shutter switch signal SW2.

[0078] In the system control unit 420, the analog signal is read from the imaging unit 411 and then converted into a signal by the A / D converter 412 and the image processing unit 413 in response to the second shutter switch signal SW2.

[0079] Furthermore, the system control unit 420 starts the photographing process operation up to writing the image data temporarily recorded in the memory 421 to the recording medium 600, which will be described later.

[0080] The touch panel 465 is a device that detects touch or drag operations by the photographer.

[0081] Here, it is integrated with the rear display unit 450, and operations can be performed by touching the display unit of the rear display unit 450 with a finger.

[0082] The power switch 466 is a switch that switches the power supply ON / OFF. The power supply control unit 431 controls the power supply from the power supply unit 430 by the switching operation of the power switch 466.

[0083] The fan 470 is located inside a duct which will be described later in the embodiments of the present invention.

[0084] This fan 470 is controlled by the system control unit 420, and expels heat from a heat source inside the digital camera 400 to the outside by airflow.

[0085] The lens unit 500 is an interchangeable lens that can be attached to and detached from the digital camera 400 .

[0086] Lens 501 is a group of lenses for generating an optical image (subject image) from subject light reflected by the subject, and is composed of multiple lenses, but in this diagram, for simplicity, only one lens is shown.

[0087] The lens communication terminal 506 is a communication terminal through which the lens unit 500 communicates with the digital camera 400 .

[0088] As described above, the lens unit 500 is able to communicate with the system control unit 420 that controls the entire digital camera 400 by electrically connecting the lens communication terminal 506 and the communication terminal 440 .

[0089] This allows the system control unit 420 to communicate with the lens system control circuit 505 and the aperture drive circuit 504 to control the position of the aperture 503 and the focus state of the real image when the lens 501 is displaced.

[0090] The recording medium 600 is detachable from the digital camera 400 and is a recording medium such as a memory card for recording captured images.

[0091] For example, an SD card, a FLASH (registered trademark) memory, a hard disk, etc. can be used.

[0092] [First embodiment] 1 to 5, a method for cooling the aforementioned heat sources, that is, the image sensor section 11 and the main board 12, will be described. The basic configuration of the image sensor is the same as in the first and second embodiments, and therefore a description thereof will be omitted.

[0093] (Perspective view of imaging device 300) FIG. 1(a) is a front perspective view of the imaging device 300, and FIG. 1(b) is a rear perspective view of the imaging device 300. As shown in FIG.

[0094] The imaging device 300 has a built-in heat dissipation mechanism 320, which will be described later, and air taken in through the ventilation opening 21c provided in the rear cover 21 passes through the duct 310, which will be described later, and is exhausted through the ventilation opening 22b provided in the front base 22.

[0095] Here, the ventilation opening 21c is located on the rear surface of the imaging device, below the rear display unit, and the ventilation opening 21b is located on the front surface of the imaging device, below the imaging area.

[0096] In this embodiment, the air flow is as described above, intake through the vent 21c and exhaust through the vent 22b, but if the desired cooling effect can be achieved, air may be taken in through the vent 22b and exhausted through the vent 21c.

[0097] (An exploded perspective view of the internal structure of the imaging device 300) FIG. 2 is an exploded perspective view for explaining the internal structure of the imaging device 300. As shown in FIG.

[0098] 2, the imaging device 300 contains an imaging element unit 11, which is a first heat source, a main board 12, which is a second heat source, and a duct 310. The duct 310 is disposed below the heat sources.

[0099] (An exploded perspective view of the duct 310 and multiple heat sources) The heat dissipation mechanism 320 will be described with reference to the exploded perspective view of FIG. 3, which shows the duct 310 and a plurality of heat sources.

[0100] The duct 310 is mainly composed of a duct upper cover 310a, a duct lower cover 310b, and a centrifugal fan 331 contained therein.

[0101] Centrifugal fan 331 is a centrifugal fan that serves as a blowing means for creating an air flow within duct 310, and is fixed inside the duct with screws (not shown).

[0102] Duct upper cover 310a and duct lower cover 310b are fixed by sandwiching an elastic member (not shown), thereby forming duct 310 as a single sealed space.

[0103] The duct upper cover 310a and duct lower cover 310b may be fixed by any fastening method, such as screws, adhesive, or crimping, as long as they are tightly fastened.

[0104] Duct upper cover 310a and duct lower cover 310b are preferably made of a material with high thermal conductivity and specific gravity that efficiently diffuses and cools heat from the heat source and does not affect the weight of digital camera 300, and in this embodiment they are made of aluminum metal.

[0105] The duct 310 also has an intake port 332 and an exhaust port 333 , and a centrifugal fan 331 generates an air flow inside the duct 310 .

[0106] An elastic member (not shown) is provided between the intake port 332 and the ventilation port 21c provided in the rear cover 21, thereby forming a sealed structure between the intake port 332 and the ventilation port 21c.

[0107] An elastic member (not shown) is provided between the exhaust port 333 and the ventilation port 22b provided in the front base 22, thereby forming a sealed structure between the exhaust port 332 and the ventilation port 22b.

[0108] With the above configuration, a single sealed space is formed between the vent holes 22b, thereby forming an air flow path.

[0109] At the same time, water droplets, sand, and the like can be prevented from entering the digital camera 300 from the outside.

[0110] Next, the connection to the heat source will be described.

[0111] The duct 310 and the first heat source 11 are connected by a first heat conducting member 321. Furthermore, the duct 310 and the second heat source 12 are connected by a second heat conducting member 322.

[0112] The first and second heat conducting members allow heat to escape into the duct, thereby suppressing temperature rise.

[0113] The first and second heat conducting members are made of a material with high thermal conductivity, such as a graphite sheet or a heat pipe.

[0114] (Efficient thermal connection with heat dissipation fins 312) Figure 4 explains efficient thermal connections.

[0115] First heat dissipation fins 311 and second heat dissipation fins 312 each having a convex shape are provided inside duct 310, and by increasing the surface area of ​​duct 310, heat is diffused and cooling efficiency is improved.

[0116] First heat dissipation fins 311 are arranged on the intake side of centrifugal fan 331 , and first heat conduction member 321 is connected to the vicinity of first heat dissipation fins 311 .

[0117] Second heat dissipating fins 312 are arranged on the exhaust side of centrifugal fan 331 , and second heat conducting member 322 is connected to the vicinity of first heat dissipating fins 312 .

[0118] When centrifugal fan 331 is driven, air is drawn in through intake port 332 and passes through first heat dissipation fins 311 and second heat dissipation fins 312 .

[0119] At this time, the air is heated by first heat conductive member 321 and second heat conductive member 322, and cools first heat dissipation fin 311 and second heat dissipation fin 312. The heated air passes through exhaust port 333 and is exhausted to the outside of imaging device 300 from vent 22b.

[0120] Here, the second heat source 12 is a heat source with a higher temperature than the first heat source 11, and by connecting the second heat source 12 to the exhaust side of the centrifugal fan 331, the heated air is exhausted more quickly.

[0121] In addition, although a centrifugal fan is used as the air blowing means in this embodiment, the present invention is not limited to this and may be any other means such as an axial flow fan as long as the intended purpose can be achieved.

[0122] (Tripod mount 22d placement) The arrangement of the tripod mount 22d will be described with reference to FIG.

[0123] Since the duct 310 is disposed on the bottom surface of the imaging device, it overlaps with the tripod mount 22d, blocking the airflow path.

[0124] In this embodiment, the area where the amount of air discharged from the centrifugal fan 331 is large is defined as a first area, and the area where the amount of air discharged is small is defined as a second area, and the tripod mount 22d is installed in the second area.

[0125] By arranging the tripod seat 22d in the second area where the air volume is small and arranging the heat dissipation fins in the first area where the air volume is large, it is possible to prevent deterioration of heat dissipation properties.

[0126] (Comparative data on heat dissipation effect)

[0127] [Table 1]

[0128] Table 1 compares the maximum temperatures reached when recording and shooting at 8K30P in a 23° environment using the digital camera of embodiment 1 and a digital camera of embodiment 1 that does not have the built-in centrifugal fan 331 and duct 310. 8K30P means video recording at 8K and 30 frames per second.

[0129] In the first embodiment, the centrifugal fan 331 is operated at a wind speed of 12 L / min. Liters per minute (L / min) is a unit of volumetric flow rate.

[0130] As shown in this table, by incorporating the centrifugal fan 331 and the duct 310, the maximum temperature reached is reduced from 111.5 degrees to 58.6 degrees for the imaging element unit 11 and from 95.6 degrees to 89.9 degrees for the main board 12.

[0131] This shows that the temperature rise of the heat source is suppressed. Furthermore, if the temperature limit at which a digital camera stops functioning is set to 95°C or below, the configuration of embodiment 1 makes it possible to achieve unlimited 8K30P shooting in an environment of 23°C.

[0132] The description of each embodiment and modification is merely an example for explaining the technology of the present disclosure, and the technology of the present disclosure can be implemented by appropriately modifying or combining them within the scope of the spirit of the invention. Specifically, the present invention is not limited to digital cameras, but can be widely applied to electronic devices and imaging devices with video shooting functions, such as video cameras and network cameras.

[0133] The invention of this embodiment will be briefly described below with reference to FIG.

[0134] As shown in FIG. 6, the imaging device 300 contains an imaging element unit 11, which is a first heat source, a control IC group 12a mounted on a main board 12, which is a second heat source, and a duct 310 housed in the bottom portion.

[0135] Duct 310 and first heat source 11 are connected by first heat conductive member 321. Furthermore, duct 310 and second heat source 12 are connected by second heat conductive member 322. In this way, by dissipating heat into the duct using the first and second heat conductive members, it is possible to suppress temperature rise.

[0136] The imaging device 300 includes a control circuit 12a that controls the imaging device, a display panel 31 arranged on the back side of the exterior members 21 to 25, and a heat dissipation fan 331 arranged on the bottom side of the exterior members.

[0137] In the optical axis direction, an imaging element board 11 on which an imaging element is mounted, a control circuit board 12 on which a control circuit is mounted, and the display panel are arranged in this order from the front side to the rear side.

[0138] Duct 310, in which first ventilation opening 332 is formed on the bottom surface side of rear surface 21 or side surface 25 of the exterior member, extends from the rear surface side to the front surface side in the optical axis direction.

[0139] It then passes through the area between the imaging element board 11 and the control circuit board 12 and the bottom surface 24 of the exterior member, and is connected to a second ventilation opening 333 formed on the bottom side of the exterior member opposite the first ventilation opening 332 across the optical axis 0.

[0140] The heat dissipation fan 331 is disposed inside a duct 310 that is disposed in the area between the imaging element board 11, the control circuit board 12 and the bottom surface 24 of the exterior member.

[0141] A first fin 311 is arranged inside the duct 310 on the intake side of the heat dissipation fan 331, and a first heat conduction member 322 thermally connected to the imaging element substrate is thermally connected directly above the first fin.

[0142] A second fin 312 is arranged inside the duct 310 on the exhaust side of the heat dissipation fan 310, and a second heat conduction member 323 thermally connected to the control circuit board 12 is thermally connected directly above the second fin 312.

[0143] The bottom surface 24 of the exterior member is provided with a fixing portion for the tripod 224, and the fixing portion is arranged on the exhaust side of the heat dissipation fan 310. In the first region where the air volume of the heat dissipation fan is large and the second region where the air volume is small, the fixing portion of the tripod 224 is arranged in the second region, and the second fin 312 is arranged in the first region.

[0144] The temperature of the image pickup element is higher than the temperature of the control circuit 12a.

[0145] The imaging element substrate 11 moves in a direction different from the optical axis for image blur correction.

[0146] The imaging element substrate 11 is moved by a movable mechanism in a direction different from the optical axis O for image blur correction. The movable mechanism constitutes a voice coil motor (VCM) made up of a coil and a magnet.

[0147] The imaging element substrate 11 is driven based on the vibration detection result of an angular velocity detection sensor (gyro) (not shown).

[0148] To correct image blur on the imaging surface of the imaging element due to hand shake by the user, the imaging element substrate 11 is moved in the yaw, pitch, and roll directions around the optical axis of the imaging optical system.

[0149] The rotation axis of the heat dissipation fan 310 is in a direction perpendicular to the optical axis, and the second ventilation opening 333 formed on the bottom surface side of the exterior member is formed on the front surface 22 or side surface 25 of the exterior member.

[0150] A first heat conducting member 322 is provided on the imaging element substrate 11 to conduct heat from the imaging element substrate 11 to the duct 310 .

[0151] and a second heat conduction member 323 formed on the control circuit board 12 for conducting heat from the control circuit board 12 to the duct 310.

[0152] First heat conducting member 322 has higher thermal conductivity than second heat conducting member 323 . [Industrial Applicability]

[0153] The technology of the present disclosure is used in electronic devices and imaging systems. [Explanation of symbols]

[0154] 11 Image sensor section 11a CMOS 12 Main board 12a Control IC group 21c, 22b, 25b Ventilation holes 300 digital cameras 310 Duct 311, 312 Fin 320 Heat dissipation mechanism 331 Centrifugal Fan 333 Exhaust port 332 Air intake 322, 323 Heat conduction materials

Claims

1. An imaging device having an imaging element, the imaging device includes a control circuit that controls the imaging device, a display panel that is disposed on a rear side of an exterior member, and a heat dissipation fan that is disposed on a bottom side of the exterior member; an imaging element substrate on which the imaging element is mounted, a control circuit substrate on which the control circuit is mounted, and the display panel are arranged in this order from the front side to the rear side in the optical axis direction; a duct having a first vent hole formed on the bottom surface of the rear surface or side surface of the exterior member extends from the rear surface side to the front surface side in the optical axis direction, passes through a region between the image pickup element board and the control circuit board and the bottom surface of the exterior member, and is connected to a second vent hole formed on the bottom surface of the exterior member opposite the first vent hole across the optical axis, the heat dissipation fan is disposed inside a duct that is disposed in a region between the imaging element board, the control circuit board, and a bottom surface of the exterior member, An imaging device characterized in that a first fin is arranged inside the duct and on the intake side of the heat dissipation fan, and a first heat conduction member thermally connected to the imaging element substrate is thermally connected directly above the first fin.

2. 2. The imaging device of claim 1, wherein a second fin is disposed inside the duct and on the exhaust side of the heat dissipation fan, and a second heat conduction member thermally connected to the control circuit board is thermally connected directly above the second fin.

3. a tripod fixing portion provided on the bottom surface of the exterior member; 3. The imaging device according to claim 2, wherein the fixing portion is disposed on the exhaust side of the heat dissipation fan, and in a first region of the heat dissipation fan having a high air volume and a second region of the heat dissipation fan having a low air volume, the fixing portion of the tripod is disposed in the second region, and the second fin is disposed in the first region.

4. The imaging device according to claim 1 , wherein the temperature of the imaging element is higher than the temperature of the control circuit.

5. The imaging device according to claim 1 , wherein the imaging element substrate moves in a direction different from an optical axis for image blur correction.

6. 6. The imaging device according to claim 1, wherein a rotation axis of the heat dissipation fan is perpendicular to an optical axis, and the second ventilation opening formed on the bottom surface side of the exterior member is formed on a front surface or a side surface of the exterior member.

7. 7. The imaging device according to claim 1, further comprising: a first heat conduction member formed on the imaging element board for conducting heat from the imaging element board to the duct; and a second heat conduction member formed on the control circuit board for conducting heat from the control circuit board to the duct, wherein the first heat conduction member has higher thermal conductivity than the second heat conduction member.

Images