Film package structure and display panel

Abstract

To provide a film package structure and a display panel.SOLUTION: A film package structure includes: a first inorganic package layer 10 for covering a device to be packaged; an organic package layer 11 formed on one side of the layer; a second inorganic package layer 12 formed on the organic package layer on a side separated from the first inorganic package layer; and at least one first inorganic adjustment layer 13 formed on the first inorganic package layer on a side separated from the device to be packaged. The content of oxygen in the at least one first inorganic adjustment layer is higher than the content of oxygen in the first inorganic package layer and / or the second inorganic package layer. The film package structure improves the stability of the film package structure in a bending process, avoids the occurrence of rupture of the film package structure or separation of film layers, ensures the package stability of the film package structure, and thereby can improve the bending performance and the durable period of a display panel.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This application claims priority from Chinese Patent Application No. 201910812392.4, filed on August 30, 2019, the entire contents of which are incorporated herein by reference as part of this application. SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to a film package structure and a display panel. [Background technology]

[0002] As the application fields of flexible OLED (Organic Light-Emitting Diode) display panels continue to expand, the demand for reliability of flexible OLED devices in harsh environments is also increasing.

[0003] Currently, OLED devices are packaged using thin film encapsulation technology to prevent water and oxygen from entering them. The conventional film packaging structure includes inorganic and organic layers stacked in order, and the inorganic layer in the film packaging structure is subject to relatively large stress when bent, which can easily cause the inorganic layer to tear or the film layer to separate between the film packaging structure, reducing the flexibility of the display panel.

[0004] The information disclosed in the above Background Art is only used to enhance understanding of the background of the present application, and therefore includes information that does not constitute related art known to those of ordinary skill in the art. Summary of the Invention [Means for solving the problem]

[0005] An object of the present disclosure is to provide a film packaging structure and a display panel that have good bending performance.

[0006] One embodiment of the present disclosure provides a film package structure, comprising: a first inorganic packaging layer for covering the device to be packaged; an organic package layer formed on one side of the first inorganic package layer; a second inorganic package layer formed on the organic package layer on a side remote from the first inorganic package layer; at least one first inorganic adjustment layer formed on the first inorganic packaging layer on a side away from the device to be packaged; Here, the oxygen content of the at least one first inorganic adjustment layer is higher than the oxygen content of the first inorganic package layer and / or the second inorganic package layer.

[0007] For example, in one exemplary embodiment of the present disclosure, one of the at least one first inorganic adjustment layer is formed between the first inorganic package layer and the organic package layer.

[0008] For example, in one exemplary embodiment of the present disclosure, one of the at least one first inorganic adjustment layer is formed between the organic package layer and the second inorganic package layer.

[0009] For example, in one exemplary embodiment of the present disclosure, one of the at least one first inorganic adjustment layer is formed on a side of the second inorganic package layer away from the organic package layer.

[0010] For example, in one exemplary embodiment of the present disclosure, one of the at least one first inorganic adjustment layer is formed on a side of the first inorganic packaging layer facing the device to be packaged.

[0011] For example, in one exemplary embodiment of the present disclosure, the film package structure comprises: a second inorganic adjustment layer formed on a side of the first inorganic packaging layer facing the device to be packaged; The refractive index of the second inorganic adjustment layer is lower than the refractive index of the first inorganic package layer.

[0012] For example, in one exemplary embodiment of the present disclosure, the material of the second inorganic adjustment layer includes lithium fluoride.

[0013] For example, in one exemplary embodiment of the present disclosure, the material of the at least one first inorganic adjustment layer includes silicon oxide.

[0014] For example, in one exemplary embodiment of the present disclosure, the at least one first inorganic adjustment layer has a thickness of 10 nm to 100 nm.

[0015] For example, in one exemplary embodiment of the present disclosure, the at least one first inorganic adjustment layer includes two first inorganic adjustment layers, one of which is located between the first inorganic package layer and the organic package layer, and the other of which is located between the second inorganic package layer and the organic package layer.

[0016] For example, in one exemplary embodiment of the present disclosure, the oxygen content of the first inorganic adjustment layer located between the first inorganic packaging layer and the organic packaging layer is higher than the oxygen content of the first inorganic packaging layer, and the oxygen content of the first inorganic adjustment layer located between the second inorganic packaging layer and the organic packaging layer is higher than the oxygen content of the second inorganic packaging layer.

[0017] For example, in one exemplary embodiment of the present disclosure, the thickness of the first inorganic adjustment layer located between the first inorganic package layer and the organic package layer is greater than the thickness of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer.

[0018] For example, in one exemplary embodiment of the present disclosure, the material of the first inorganic adjustment layer located between the first inorganic packaging layer and the organic packaging layer is the same as the material of the first inorganic packaging layer.

[0019] For example, in one exemplary embodiment of the present disclosure, the material of the first inorganic adjusting layer located between the second inorganic packaging layer and the organic packaging layer is different from the material of the second inorganic packaging layer.

[0020] For example, in one exemplary embodiment of the present disclosure, the material of the first inorganic packaging layer includes silicon oxynitride.

[0021] For example, in one exemplary embodiment of the present disclosure, the material of the second inorganic packaging layer includes silicon nitride.

[0022] For example, in one exemplary embodiment of the present disclosure, the material of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer includes silicon oxide.

[0023] For example, in one exemplary embodiment of the present disclosure, the material of the first inorganic adjustment layer located between the first inorganic package layer and the organic package layer includes silicon oxynitride.

[0024] One embodiment of the present disclosure further provides a display panel, Package waiting devices, and The film package structure includes any of the above.

[0025] For example, in one exemplary embodiment of the present disclosure, the package-ready device includes an organic light emitting diode device.

[0026] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. [Brief explanation of the drawings]

[0027] The drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments in accordance with the disclosure, and together with the specification serve to explain the principles of the embodiments of the present disclosure. The drawings in the following description are certain embodiments of the present disclosure, and it is obvious to those skilled in the art that other drawings can be derived based on these drawings without creative work.

[0028] [Figure 1] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 3] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 5] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 6] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 7] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 8] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 10] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 11] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 12] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 13] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 14]FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 15] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. [Figure 16] FIG. 2 is a schematic diagram illustrating a film package structure according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0029] Next, exemplary embodiments will be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. On the contrary, these embodiments will make the examples of the present disclosure thorough and complete and fully convey the concept of the exemplary embodiments to those skilled in the art. Since the same reference numerals in the drawings represent the same or similar structures, detailed descriptions thereof will be omitted.

[0030] Although relative terms such as "above" and "below" have been used herein to describe the relative relationship of one illustrated member to another, these terms are used herein only for convenience, e.g., depending on the orientation of the examples depicted in the drawings. If the illustrated device is inverted and the top and bottom are reversed, it will be understood that the member described as "above" becomes the "below" member. When one structure is referred to as being above another structure, this may mean that the structure is integrally formed on the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0031] The embodiments of the present disclosure provide a flexible film package structure, specifically, as shown in Figures 1 to 16, the film package structure includes a first inorganic package layer 10, an organic package layer 11, a second inorganic package layer 12, and at least one first inorganic adjustment layer 13.

[0032] The first inorganic packaging layer 10 is used to cover a device to be packaged, which may be an OLED device, that is, the film packaging structure is used to package an OLED device. The first inorganic packaging layer 10 packages the OLED device, which can prevent water and oxygen from entering the OLED device, thereby ensuring the service life of the OLED device.

[0033] For example, this first inorganic packaging layer 10 may be silicon oxynitride, which is deposited on the surface of the device to be packaged by a CVD (Chemical Vapor Deposition) method so as to realize packaging of the device to be packaged.

[0034] For example, in some embodiments, the organic package layer 11 is formed on one side of the first inorganic package layer 10. The organic package layer 11 can improve the flatness of the film package structure and the bending ability of the entire film package structure. For example, the organic package layer 11 can be an inkjet-printed layer formed by inkjet printing an organic liquid. The second inorganic package layer 12 is formed on the side of the organic package layer 11 away from the first inorganic package layer 10. The second inorganic package layer 12 can further improve the packaging effect of the film package structure. For example, the second inorganic package layer 12 can be silicon nitride, which is deposited on the organic package layer 11 by chemical vapor deposition.

[0035] For example, in some embodiments, the first inorganic adjustment layer 13 is formed on the side of the first inorganic packaging layer 10 away from the device to be packaged, and the elastic modulus of the first inorganic adjustment layer 13 is higher than the elastic modulus of the first inorganic packaging layer 10 and the second inorganic packaging layer 12. In this embodiment, by providing the first inorganic adjustment layer 13 with a relatively high elastic modulus on the side of the first inorganic packaging layer 10 away from the device to be packaged, the stability of the film packaging structure during the bending process can be improved, preventing the film packaging structure from tearing or separation between the film layers, and ensuring the packaging stability of the film packaging structure, thereby improving the bending performance and service life of the display panel.

[0036] For example, in some embodiments, the thickness of the first inorganic adjustment layer 13 may be 10 nm to 100 nm, such as 10 nm, 30 nm, 50 nm, 70 nm, 90 nm, 100 nm, etc. That is, the thickness of the first inorganic adjustment layer 13 can be obtained between 10 nm and 100 nm. In this embodiment, by designing the thickness of the first inorganic adjustment layer 13 to be between 10 nm and 100 nm, on the one hand, it is possible to prevent the first inorganic adjustment layer 13 from being too thin to adjust the position of the stress neutral layer, and on the other hand, it is possible to avoid a situation where the first inorganic adjustment layer 13 is too thick, resulting in low light extraction efficiency of the film package structure.

[0037] For example, in embodiments of the present disclosure, the stress-neutral layer comprises a structure (eg, a surface) formed by all locations where the internal tangential stress is zero when the membrane layer is deformed in bending.

[0038] For example, in some embodiments, the first inorganic adjusting layer 13 may be selected as silicon oxide. The silicon oxide may be deposited on one side of the first inorganic packaging layer 10 by chemical vapor deposition. Silicon oxide has properties such as a high elastic modulus and high transmittance, thereby improving the stability of the film packaging structure and also increasing the transmittance of the film packaging structure. Furthermore, since the thickness of the silicon oxide is easy to control, using silicon oxide as the first inorganic adjusting layer 13 allows the thickness of the first inorganic adjusting layer 13 to be adjusted according to the actual problems present in the bending process of the film packaging structure, so that the stress-neutral layer at the bending point is closer to the inorganic packaging layer that is prone to tearing or separation.

[0039] In addition, in this embodiment, not only can the thickness of the first inorganic adjustment layer 13 be adjusted according to the actual problems existing in the bending process of the film packaging structure so that the stress neutral layer at the bending point is closer to the inorganic packaging layer that is prone to tearing or separation, but also the positional relationship between the first inorganic adjustment layer 13 and the first inorganic packaging layer 10 and the second inorganic packaging layer 12 can be adjusted according to the actual problems existing in the bending process of the film packaging structure so that the stress neutral layer at the bending point is closer to the inorganic packaging layer that is prone to tearing or separation.

[0040] The structure of the film package structure will be described in detail below in conjunction with the drawings.

[0041] For example, in some embodiments, if the first inorganic packaging layer 10 of the film packaging structure is likely to tear or separate from other film layers during the actual bending process of the display panel, a first inorganic adjustment layer 13 is formed between the first inorganic packaging layer 10 and the organic packaging layer, as shown in Figure 1, thereby offsetting the stress neutral layer at the bending point toward the first inorganic packaging layer 10, i.e., reducing the distance between the first inorganic packaging layer 10 and the stress neutral layer. In this way, compared to the conventional method in which the first inorganic packaging layer 10 is directly combined with the organic packaging layer 11, the deformation amount of the first inorganic packaging layer 10 can be reduced while achieving the same bending radius, thereby mitigating the risk of the first inorganic packaging layer 10 tearing or separating from other film layers during the bending process, ensuring the stability of the film packaging structure, and improving the packaging effect of the film packaging structure.

[0042] When the first inorganic adjustment layer 13 is silicon oxide and the first inorganic package layer 10 is silicon oxynitride, the oxygen content of the first inorganic adjustment layer 13 is greater than that of the first inorganic package layer 10, and therefore the contact angle between the first inorganic adjustment layer 13 and the organic package layer 11 is smaller than the contact angle between the first inorganic package layer 10 and the organic package layer 11. Therefore, after curing, the bond strength between the first inorganic adjustment layer 13 and the organic package layer 11 is greater than the bond strength between the first inorganic package layer 10 and the organic package layer 11.

[0043] Based on this, in this embodiment, the first inorganic adjustment layer 13 is formed between the first inorganic packaging layer 10 and the organic packaging layer 11, which can improve the bonding stability between the first inorganic packaging layer 10 and the organic packaging layer 11 compared to when the first inorganic packaging layer 10 and the organic packaging layer 11 are directly bonded, and avoid separation between the first inorganic packaging layer 10 and the organic packaging layer 11, thereby ensuring the stability of the film packaging structure and improving the packaging effect of the film packaging structure.

[0044] For example, in some embodiments, when first inorganic adjusting layer 13 is silicon oxide and second inorganic package layer 12 is silicon nitride, the oxygen content of first inorganic adjusting layer 13 is greater than the oxygen content of second inorganic package layer 12, and therefore the contact angle between first inorganic adjusting layer 13 and organic package layer 11 is smaller than the contact angle between second inorganic package layer 12 and organic package layer 11. After curing, the bond strength between first inorganic adjusting layer 13 and the organic package layer is greater than the bond strength between second inorganic package layer 12 and organic package layer 11.

[0045] For example, in some embodiments, as shown in Fig. 2, compared to the embodiment shown in Fig. 1, not only the first inorganic adjustment layer 13 is formed between the first inorganic package layer 10 and the organic package layer 11, but also the first inorganic adjustment layer 13 may be formed between the second inorganic package layer 12 and the organic package layer 11. Compared to directly bonding the second inorganic package layer 12 and the organic package layer 11, this improves the bonding stability between the second inorganic package layer 12 and the organic package layer 11 and prevents separation between the second inorganic package layer 12 and the organic package layer 11. This ensures the stability of the film package structure and improves the packaging effect of the film package structure.

[0046] Furthermore, when the stress neutral layer is located on one side of the first inorganic package layer 10 and the second inorganic package layer 12 during the actual bending process, the arrangement in this embodiment further offsets the stress neutral layer toward the first inorganic package layer 10 and the second inorganic package layer 12, thereby reducing the distance between the first inorganic package layer 10 and the second inorganic package layer 12 and the stress neutral layer, thereby reducing the deformation of the first inorganic package layer 10 and the second inorganic package layer 12, mitigating the first inorganic package layer 10 and the second inorganic package layer 12 from being torn or separated from other film layers during the bending process, ensuring the stability of the film package structure, and improving the packaging effect of the film package structure.

[0047] In addition, the thickness of the first inorganic adjustment layer 13 located between the second inorganic packaging layer 12 and the organic packaging layer 11 may be thinner than the thickness of the first inorganic adjustment layer 13 between the first inorganic packaging layer 10 and the organic packaging layer 11, but is not limited to this, and may be thinner or equal to the thickness depending on the specific situation.

[0048] For example, in some embodiments, the material of the first inorganic adjustment layer 13 formed between the first inorganic package layer 10 and the organic package layer 11 includes silicon oxynitride, and the material of the first inorganic package layer 10 includes silicon oxynitride. The material of the first inorganic adjustment layer 13 formed between the second inorganic package layer 12 and the organic package layer 11 includes silicon oxide, and the material of the second inorganic package layer 12 includes silicon oxide. This can improve the structural stability of the film package structure and the transparency of the film package structure.

[0049] For example, in some embodiments, if the second inorganic package layer 12 of the film package structure is likely to tear or separate from other film layers during the actual bending process of the display panel, the first inorganic adjustment layer 13 can be formed between the second inorganic package layer 12 and the organic package layer 11, as shown in FIG. 3. Alternatively, the first inorganic adjustment layer 13 can be formed on the side of the second inorganic package layer 12 away from the organic package layer 11, as shown in FIG. 4. Alternatively, one first inorganic adjustment layer 13 can be formed between the second inorganic package layer 12 and the organic package layer 11, and another first inorganic adjustment layer 13 can be formed on the side of the second inorganic package layer 12 away from the organic package layer 11, as shown in FIG. 5. These methods can offset the stress neutral layer at the bending point toward the second inorganic package layer 12, i.e., reduce the distance between the second inorganic package layer 12 and the stress neutral layer. Compared with the conventional method of directly bonding the second inorganic packaging layer 12 and the organic packaging layer 11, this method can reduce the deformation of the second inorganic packaging layer 12 while maintaining the same bending radius, thereby reducing the risk of the second inorganic packaging layer 12 breaking or separating from other film layers during the bending process, ensuring the stability of the film packaging structure and improving the packaging effect of the film packaging structure.

[0050] When the first inorganic adjustment layer 13 is silicon oxide and the second inorganic package layer 12 is silicon nitride, the oxygen content of the first inorganic adjustment layer 13 is greater than that of the second inorganic package layer 12, and therefore the contact angle between the first inorganic adjustment layer 13 and the organic package layer 11 is smaller than the contact angle between the second inorganic package layer 12 and the organic package layer 11. Therefore, after curing, the bond strength between the first inorganic adjustment layer 13 and the organic package layer 11 is greater than the bond strength between the second inorganic package layer 12 and the organic package layer 11.

[0051] Based on this, this embodiment adopts a method of having a first inorganic adjusting layer 13 between the second inorganic packaging layer 12 and the organic packaging layer 11, which improves the bonding stability between the second inorganic packaging layer 12 and the organic packaging layer 11 compared to when the second inorganic packaging layer 12 and the organic packaging layer 11 are directly bonded, and can prevent the separation of the film layer between the second inorganic packaging layer 12 and the organic packaging layer 11. This ensures the stability of the film packaging structure and improves the packaging effect of the film packaging structure.

[0052] For example, in some embodiments, when first inorganic adjusting layer 13 is silicon oxide and first inorganic package layer 10 is silicon oxynitride, the oxygen content of first inorganic adjusting layer 13 is greater than the oxygen content of first inorganic package layer 10, and therefore the contact angle between first inorganic adjusting layer 13 and organic package layer 11 is smaller than the contact angle between first inorganic package layer 10 and organic package layer 11. After curing, the bond strength between first inorganic adjusting layer 13 and organic package layer 11 is greater than the bond strength between first inorganic package layer 10 and organic package layer 11.

[0053] For example, in some embodiments, as shown in Figures 6 to 8, compared to the embodiments shown in Figures 3 to 5, the first inorganic adjustment layer 13 is formed between the second inorganic package layer 12 and the organic package layer 11, and / or the first inorganic adjustment layer 13 is formed on the side of the second inorganic package layer 12 away from the organic package layer 11. In addition, the first inorganic adjustment layer 13 is formed between the first inorganic package layer 10 and the organic package layer 11. Compared to when the first inorganic package layer 10 is directly bonded to the organic package layer 11, the bonding stability between the first inorganic package layer 10 and the organic package layer 11 is improved, and separation between the first inorganic package layer 10 and the organic package layer 11 can be avoided. This ensures the stability of the film package structure and improves the packaging effect of the film package structure.

[0054] Furthermore, when the stress neutral layer is located on one side of the first inorganic package layer 10 and the second inorganic package layer 12 during the actual bending process, the arrangement in this embodiment can further offset the stress neutral layer toward the first inorganic package layer 10 and the second inorganic package layer 12, thereby reducing the distance between the first inorganic package layer 10 and the second inorganic package layer 12 and the stress neutral layer. This reduces the amount of deformation of the first inorganic package layer 10 and the second inorganic package layer 12 and mitigates the possibility of the first inorganic package layer 10 and the second inorganic package layer 12 tearing or separating from other film layers during the bending process. This also ensures the stability of the film package structure and improves the packaging effect of the film package structure.

[0055] In addition, the thickness of the first inorganic adjustment layer 13 located between the first inorganic package layer 10 and the organic package layer 11 may be thinner than the thickness of the first inorganic adjustment layer 13 between the second inorganic package layer 12 and the organic package layer 11, but is not limited to this, and may be greater than or equal to the thickness depending on the specific situation.

[0056] For example, in some embodiments, as shown in Figures 9 to 16, one of the main differences compared to the embodiments shown in Figures 1 to 8 is that a first inorganic adjustment layer 13 is also provided on the side of the first inorganic packaging layer 10 facing the device to be packaged. By providing the first inorganic adjustment layer 13, the stress neutral layer can be offset to the first inorganic packaging layer 10, or the stress neutral layer can be offset to the first inorganic packaging layer 10 and the second inorganic packaging layer 12, depending on the initial position of the stress neutral layer. This can mitigate the first inorganic packaging layer 10 and the second inorganic packaging layer 12 from tearing or separation from other film layers during the bending process, ensure the stability of the film packaging structure, and improve the packaging effect of the film packaging structure.

[0057] For example, in some embodiments of the present disclosure, the first inorganic adjustment layer 13 is silicon oxide, which does not absorb water and has good water and oxygen blocking capabilities, thereby further preventing water and oxygen from entering the interior of the packaged device and improving product reliability. Moreover, because silicon oxide has a relatively low refractive index, it does not affect light extraction efficiency.

[0058] For example, in some embodiments, as shown in Figures 9 to 16, compared to the embodiments shown in Figures 1 to 8, the main difference is that a second inorganic adjustment layer 14 is provided on the side of the first inorganic packaging layer 10 facing the device to be packaged, where the refractive index of the second inorganic adjustment layer 14 is lower than the refractive index of the first inorganic packaging layer 10. For example, the second inorganic adjustment layer 14 may be lithium fluoride.

[0059] When the film package structure of this embodiment is applied to the package of a display device, it can improve the light extraction efficiency of the display panel.

[0060] It should be noted that the first inorganic adjustment layer 13 in any of the above-described embodiments is not limited to silicon oxide and may be silicon oxynitride, but the oxygen content of the first inorganic adjustment layer 13 should be greater than the oxygen content of the first inorganic package layer 10. This makes it possible to achieve properties such as a high elastic modulus and high bonding strength.

[0061] For example, in some embodiments, as shown in Figures 1 to 16, the oxygen content of at least one first inorganic adjusting layer 13 is higher than the oxygen content of the first inorganic package layer 10 and / or the second inorganic package layer 12. For example, as shown in Figure 1, the oxygen content of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is higher than the oxygen content of the first inorganic package layer 10 and the second inorganic package layer 12, and the contact angle between the first inorganic adjusting layer 13 and the organic package layer 11 is smaller than the contact angle between the first inorganic package layer 10 and the organic package layer 11. This increases the bonding strength between the first inorganic adjusting layer 13 and the first inorganic package layer 10, improving the stability of the film package structure during bending, preventing the film package structure from tearing or separation between the film layers, and ensuring the packaging stability of the film package structure, thereby improving the bending performance and service life of the display panel.

[0062] For example, in some embodiments, the oxygen content of the first inorganic adjusting layer located between the first inorganic package layer and the organic package layer is higher than the oxygen content of the first inorganic package layer. The oxygen content of the first inorganic adjusting layer located between the second inorganic package layer and the organic package layer is higher than the oxygen content of the second inorganic package layer. As shown in FIG. 2 , the oxygen content of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is higher than the oxygen content of the first inorganic package layer 10. As a result, the contact angle between the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 and the organic package layer 11 is smaller than the contact angle between the first inorganic package layer 10 and the organic package layer 11. Therefore, after curing, the bond strength between the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 and the organic package layer 11 is greater than the bond strength between the first inorganic package layer 10 and the organic package layer 11. The oxygen content of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 is higher than the oxygen content of the second inorganic package layer 12. As a result, the contact angle between the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 and the organic package layer 11 is smaller than the contact angle between the second inorganic package layer 12 and the organic package layer 11. After curing, the bond strength between the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 and the organic package layer 11 can be greater than the bond strength between the second inorganic package layer 12 and the organic package layer 11.

[0063] For example, in some embodiments, as shown in Figures 1 to 16, the material of the first inorganic packaging layer 10 includes silicon oxynitride, which can be deposited on the surface of the device to be packaged by a chemical vapor deposition (CVD) method, thereby realizing packaging of the device to be packaged.

[0064] For example, in some embodiments, the material of the second inorganic package layer 12 includes silicon nitride, as shown in Figures 1 through 16. The silicon nitride may be deposited on the organic package layer 11 by chemical vapor deposition.

[0065] For example, in some embodiments, as shown in Figures 2-3, 5-6, 8, 10-11, and 13-16, the material of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 includes silicon oxide or silicon oxynitride. For example, the material of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 includes silicon oxide. Silicon oxide has properties such as a high elastic modulus and high transmittance, and thus can improve the structural stability of the film package structure and the transmittance of the film package structure. The oxygen content of the material (e.g., silicon oxide) selected for the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 is higher than the oxygen content of the material (e.g., silicon nitride) selected for the second inorganic package layer 12. This increases the bonding strength between the first inorganic adjustment layer 13 and the second inorganic package layer 12.

[0066] For example, in some embodiments, as shown in Figures 1-2, 6-10, and 14-16, the material of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 includes silicon oxynitride or silicon oxide. For example, the material of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 includes silicon oxynitride. The oxygen content of the material (e.g., silicon oxynitride) selected for the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is greater than the oxygen content of the material (e.g., silicon oxynitride) selected for the first inorganic package layer 10. This increases the bond strength between the first inorganic adjusting layer 13 and the first inorganic package layer 10.

[0067] For example, in some embodiments, as shown in FIG. 2 , the thickness of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is greater than the thickness of the first inorganic adjusting layer 13 located between the second inorganic package layer 12 and the organic package layer 11. Thus, the stress-neutral layer at the bent portion is closer to the inorganic package layer that is prone to fracture or separation, such as the first inorganic package layer 10. For example, in some embodiments, as shown in FIGS. 1-2 , 6-10 , and 14-16 , the material of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is the same as the material of the first inorganic package layer 10. For example, the material of the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 and the material of the first inorganic package layer 10 both include silicon oxynitride. For example, the oxygen content of silicon oxynitride in the first inorganic adjusting layer 13 located between the first inorganic package layer 10 and the organic package layer 11 is greater than the oxygen content of silicon oxynitride in the first inorganic package layer 10. This increases the bonding strength between the first inorganic adjusting layer 13 and the first inorganic package layer 10.

[0068] For example, in some embodiments, as shown in Figures 2-3, 5-6, 8, 10-11, and 13-16, the material of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 is different from the material of the second inorganic package layer 12. For example, the material of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 includes silicon oxide, and the material of the second inorganic package layer 12 includes silicon nitride, so that the oxygen content of the first inorganic adjustment layer 13 located between the second inorganic package layer 12 and the organic package layer 11 is greater than the oxygen content of the second inorganic package layer 12. This ensures the light transmittance of the film package structure and improves the stability of the film package structure during bending, preventing the film package structure from tearing or separation between the film layers, and ensuring the packaging stability of the film package structure. This improves the bending performance and service life of the display panel.

[0069] At least one embodiment of the present disclosure further provides a display panel applicable to display devices such as mobile phones and computers. The display panel includes a packaged device (not shown in the drawings) and a film packaging structure for packaging the packaged device. The packaged device includes an OLED display device, and the film packaging structure may be the film packaging structure described in any of the above embodiments, which will not be described in detail here. The display panel of this embodiment may be a flexible display panel.

[0070] The method of the technology provided by the embodiments of the present disclosure can achieve the following beneficial effects:

[0071] The film packaging structure and display panel provided by the embodiments of the present disclosure have a first inorganic adjustment layer with a relatively high elastic modulus on the side of the first inorganic packaging layer away from the device to be packaged, thereby improving the stability of the film packaging structure during the bending process, preventing the film packaging structure from tearing or causing separation between the film layers, ensuring the packaging stability of the film packaging structure, and improving the bending performance and service life of the display panel.

[0072] The terms "a," "an," "equivalent," and "said" are used to indicate the presence of one or more elements / components, etc. The terms "comprise" and "have" are used to indicate an open inclusion and mean that there may be other elements / components, etc. in addition to the stated elements / components, etc. The terms "first," "second," etc. are used as labels only and are not a limitation on the number of their objects.

[0073] It is believed that those skilled in the art will be able to readily conceive of other embodiments of the present application after studying and practicing the present disclosure. This application is intended to cover any modifications, uses, or adaptations of the present application that comply with the general principles of the present application and include known or customary technical means in the art that are not disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the present application being defined by the appended claims. [Explanation of symbols]

[0074] 10 First inorganic package layer 11 Organic Package Layer 12 Second inorganic package layer 13 First inorganic adjustment layer 14 Second inorganic adjustment layer

Claims

1. It has a film package structure, a first inorganic packaging layer for covering the device to be packaged; an organic package layer formed on one side of the first inorganic package layer; a second inorganic package layer formed on the organic package layer on a side remote from the first inorganic package layer; at least one first inorganic adjustment layer formed on the first inorganic packaging layer on a side away from the device to be packaged; the oxygen content of the at least one first inorganic adjustment layer is higher than the oxygen content of the first inorganic package layer and / or the second inorganic package layer; the at least one first inorganic adjustment layer includes at least one first inorganic adjustment layer located between the first inorganic package layer and the organic package layer; a material of at least one first inorganic adjustment layer located between the first inorganic package layer and the organic package layer is silicon oxide, a material of the first inorganic package layer is silicon oxynitride, and a material of the second inorganic package layer is silicon nitride; A film package structure, wherein one of the at least one first inorganic adjustment layer is formed on a side of the second inorganic package layer away from the organic package layer.

2. The film package structure according to claim 1 , wherein one of the at least one first inorganic adjustment layer is formed between the first inorganic package layer and the organic package layer.

3. The film package structure according to claim 1 or 2, characterized in that one of the at least one first inorganic adjustment layer is formed between the organic package layer and the second inorganic package layer.

4. A film package structure described in any one of claims 1 to 3, characterized in that one of the at least one first inorganic adjustment layer is formed on the side of the first inorganic package layer facing the device to be packaged.

5. a second inorganic adjustment layer formed on a side of the first inorganic packaging layer facing the device to be packaged; The film package structure according to claim 1 , wherein the refractive index of the second inorganic adjustment layer is lower than the refractive index of the first inorganic package layer.

6. The film packaging structure according to claim 5 , wherein the material of the second inorganic adjustment layer includes lithium fluoride.

7. The film packaging structure according to claim 1 , wherein the thickness of the at least one first inorganic adjustment layer is 10 nm to 100 nm.

8. the at least one first inorganic adjustment layer includes two first inorganic adjustment layers; 8. A film package structure described in any one of claims 1 to 7, characterized in that one of the two first inorganic adjustment layers is located between the first inorganic package layer and the organic package layer, and the other of the two first inorganic adjustment layers is located between the second inorganic package layer and the organic package layer.

9. The film package structure described in claim 8, characterized in that the oxygen content of the first inorganic adjustment layer located between the first inorganic package layer and the organic package layer is higher than the oxygen content of the first inorganic package layer, and the oxygen content of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer is higher than the oxygen content of the second inorganic package layer.

10. The film package structure described in claim 8 or 9, characterized in that the thickness of the first inorganic adjustment layer located between the first inorganic package layer and the organic package layer is greater than the thickness of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer.

11. 11. The film package structure of claim 8, wherein the material of the first inorganic adjustment layer located between the first inorganic package layer and the organic package layer is the same as the material of the first inorganic package layer.

12. 11. The film package structure of claim 8, wherein the material of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer is different from the material of the second inorganic package layer.

13. 13. The film package structure of claim 8, wherein the material of the first inorganic adjustment layer located between the second inorganic package layer and the organic package layer comprises silicon oxide.

14. a display panel, A film package structure according to any one of claims 1 to 13, and A display panel comprising the package waiting device.

15. 15. The display panel of claim 14, wherein the package-ready device comprises an organic light-emitting diode device.

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