Assembly for replicating flexible stamps from a master

Abstract

1. An assembly comprising a master for imprinting microstructures and nanostructures, the master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, the master having a thickness d master and the assembly further comprises a frame piece disposed around and closely fitting along the periphery of the master, the frame piece having a thickness d frame and the thickness of the frame piece d frame is the thickness of the master, d master The present application also relates to a flexible stamp with improved alignment.

Description

[Technical Field]

[0001] The present invention relates to an assembly and process for replicating flexible stamps for imprinting micro- and nanostructures from a master.

[0002] Micro- and nanostructures are used to improve product performance, for example, by improving the efficiency of solar panels using anti-reflective structures, or by creating optical 3D effects for displays through the use of microlenses.

[0003] UV nanoimprint lithography (UV-NIL) technology can be used to add structure to products. Various variations of this technology exist, including wafer-scale UV-NIL, roll-to-roll imprint UV-NIL, and roll-to-plate UV-NIL imprint. In each case, a master structure with the inverse structure required for the product is pressed onto the product with a UV-curable or thermosetting resin sandwiched between them. After curing, the resin solidifies and the master is removed from the product. Another method uses a master with the structures required for imprinting micro- and nanostructures to replicate a flexible stamp from the master. If necessary, an anti-stick surface can be added to the flexible stamp, which is then used to replicate various products.

[0004] Masters typically have a distinct thickness. This thickness can create drawbacks with regard to the quality of the flexible stamp replicated from the master. When replicating from such a master, the goal is often to replicate the entire surface of the master. Therefore, some of the resin used to create the flexible stamp from the master can flow to the sides and underside of the master. This can contaminate the backside of the master and result in uncontrolled step heights and / or protuberances on the flexible stamp, often measuring more than 500 μm in thickness, and sometimes even up to approximately 1 mm. This can have detrimental effects, as the thick resin layer can cause the flexible stamp to wrinkle and / or the protuberances can affect the replication quality in the subsequent replication step to produce the final product. To solve the problems caused by resin overflow, often only the inner region of the master is spin-coated with resin, while the outer region is left uncoated. However, in this case, not all areas of the master are used for replication.

[0005] Another adverse effect of significant uncontrolled height steps adjacent to the master is that, for example, with the often used compressible imprint rollers, the pressure near the edge of the master may not be the same as the pressure away from the edge, i.e., the pressure in the interior regions of the master.

[0006] Masters often have a small surface area. However, for imprint technology, there is a need to move to large area imprints. This is 1) have the opportunity to imprint textures on large products (i.e. solar panels or large displays); 2) Replicating multiple products in one replication cycle; This is due to two reasons:

[0007] Large-area replication requires a large-area master. The price of the master depends on the production time and therefore the size of the master. Therefore, large-area masters are expensive. In roll-to-roll imprinting technology, this problem is solved by using a seamless drum, as disclosed in International Publication No. 2017 / 032758. In this case, the diameter of the drum is carefully selected to ensure that there is a continuous area without stitch lines. However, not all textures can be produced in this way at an affordable price.

[0008] Another solution is to create a large extended master from a small base master. Using a step-and-repeat method, the master structure is replicated multiple times in a matrix structure. Stitch or seam lines exist between replicated areas. By optimizing the process, attempts are made to minimize the stitch or seam width. Examples of the step-and-repeat method are described in, for example, U.S. Patent Application Publication No. 2004 / 0124566 and U.S. Patent No. 7,077,992, which use a wafer stepper, and Korean Patent No. 1017807289, which uses a roller. Korean Patent No. 1017807289 also aims to avoid stitch lines that may appear on the borders of display products. According to the publication, a tiling technique is applied in which replicated regions are arranged so that their adjacent edges overlap (see also non-patent document Jong G. Ok et al., “A step toward next-generation nanoimprint lithography: extending productivity and applicability”; Appl. Phys. A (2015) 121:343-356).

[0009] Another method for expanding a master is to physically align multiple master units together. This is done, for example, in U.S. Pat. No. 8,027,086. A flexible plastic master tile is then wrapped around the diameter of a stainless steel roller and fixed. This often results in a larger stitch area than the step-and-repeat method. By pressing different master unit tiles together, the stitch area or seam between master units is kept as small as possible. Certain textures can tolerate larger resulting stitch or seam widths. A second possibility is to tile multiple products together with a single expanded master. CN Patent Publication No. 105911815 discloses stitching together multiple master tiles or template units to form a tiled pattern. The template units are placed on a substrate along alignment marks.

[0010] Tiling multiple masters or multiple nanoimprint template units onto one enhanced master works well only if the stitching quality is well controlled. Good control of positional accuracy is required during the tiling process. Only with well-controlled positional accuracy can imprinted samples made from the enhanced master be cut out in straight lines. However, the appearance of the seams between the tiled master units and the width of the seams between the tiled master units are often of poor quality in that the width is too large and / or the tiled master units are misaligned and / or rotated.

[0011] An improved approach is described in European Patent Application No. 19202151.7, unpublished at the time of writing, which relates to an enhanced master for imprinting microstructures and nanostructures, the master being composed of tile-shaped master units. In these enhanced masters, adjacent edges of adjacent master units are parallel to each other, and the master units forming the master are arranged such that the joint lines between the master units only have junctions between the master units where at most three corners of adjacent master units meet. The application also discloses a flexible stamp copied from such an enhanced master.

[0012] The challenges associated with resin overflow and the occurrence of uncontrolled step heights and / or bumps in flexible stamps replicated from the master become particularly evident when large-sized enhanced masters, such as tiled enhanced masters, are employed. Furthermore, when using tiled enhanced masters comprised of multiple tiled master units, misregistration challenges can arise, as discussed above.

[0013] The fundamental problem addressed by the present invention is therefore to make available an assembly for replicating a flexible stamp for imprinting microstructures and nanostructures from a master, the assembly comprising the master and allowing the entire area of ​​the master to be used for replication without being adversely affected by the effects of resin overflow and / or uneven imprint pressure.A further object of the present invention is to make available a process for replicating a flexible stamp for imprinting microstructures and nanostructures from a master, in which the entire area of ​​the master is available for replication without being adversely affected by the effects of resin overflow and / or uneven imprint pressure.A further object of the present invention is to make available an assembly for replicating a high-precision flexible stamp for imprinting microstructures and nanostructures from a large master, in particular a master composed of a large number of tiled master units.

[0014] The problem is to provide an assembly comprising a master for imprinting micro- and nanostructures, the master being arranged on a substrate carrier and having on its upper surface an active area with a relief structure for imprinting micro- and nanostructures, the master having a thickness d master and the assembly further comprises a set of frame pieces mounted on the substrate carrier and positioned around and closely fitting along the periphery of the master, the frame pieces having a thickness d frame and the thickness of the frame piece d frame is the thickness of the master, d master The maximum difference is 250 μm, which is resolved by the assembly.

[0015] Using the assembly of the present invention, it is possible to at least reduce uncontrolled resin flow across the master. Furthermore, it is possible to at least reduce the occurrence of uneven bulges and uncontrolled steps at the outer edges of the flexible stamp replicated from the master. Unlike prior art processes, the use of the present assembly with a frame piece allows the use of the entire surface area of ​​the master. On the other hand, if the thickness of the frame piece is adjusted to a predetermined value required relative to the thickness of the master so that it differs from the master thickness by a maximum of 250 μm, it becomes possible to control and adjust the height step near the texture to a predetermined value, resulting in a defined state at the edges of the master and the replicated flexible stamp, as well as in the frame area.

[0016] The configuration can include a substrate carrier onto which the master and frame pieces are mounted as separate components. The substrate carrier can be, for example, rigid and can be in the form of a glass, ceramic, or metal panel. Preferably, the substrate carrier is made from a rigid or flexible polymeric material such as polycarbonate (PC), polyethylene naphthalate (PEN), polyethylene terephthalate (PET or PETP), biaxially oriented polyethylene terephthalate (BOPET), or polymethyl methacrylate (PMMA).

[0017] Within the scope of this application, the expression "frame piece" refers to a separate piece of material that is arranged around the master and is distinct from the substrate carrier or substrate support. Thus, in the assembly of the present invention, the master and frame piece are mounted and arranged as separate parts on the substrate carrier, and thus the master and frame piece are distinct and separate from the substrate carrier. Preferably, the master and / or frame piece are removably mounted to the substrate carrier, but they can also be glued to the substrate carrier, for example by adhesive.

[0018] The use of an assembly of the present invention with a set of frame pieces according to the present invention has the advantage that the frame pieces are separate, individual components from the substrate carrier, and in addition to the advantages mentioned above, the frame pieces can be flexibly adapted to the needs of the microstructure and nanostructure imprinting process. For example, the frame pieces can be easily adapted to the shape or size of the master being used. Furthermore, a frame piece of the set of frame pieces can be in close contact with only one side edge of the master, or with more side edges of the master. A set of frame pieces can consist of only one frame piece that is the same height as all side edges of the master. Furthermore, the frame pieces of the set of frame pieces can be flexibly selected in terms of the thickness of the frame pieces in order to set a defined height difference between the thickness of the master and the thickness of the frame pieces, i.e., a defined height step between the master and the frame pieces, as will be explained below.

[0019] In a preferred embodiment, the master is not a single-piece master but an extended master, which is composed of a number of tiled master units having active areas on their upper surfaces with relief structures for imprinting microstructures and nanostructures, and the upper surfaces of the tiled master units can collectively form the upper surface of the extended master. Particularly in this case, when the master is an extended master composed of a number of tiled master units, it is often difficult to achieve high-precision alignment of the master units in the imprinting process. In many cases, for example, as described in unpublished European Patent Application No. 19202151.7, when four master units or master tiles having a square or rectangular shape are used to form intersection joints where their corners meet, the positional accuracy of the master units that can be achieved is insufficient. The use of a frame piece surrounding the extended master unit formed from the tiled master units can facilitate alignment or (self-)alignment of the tiles, i.e., the tiled master units.

[0020] In a further preferred embodiment, alignment marks may be applied to the frame pieces and thus outside the active area of ​​the master. The alignment marks may for example be in the form of a relief structure, a cross or a dot applied to the upper surface of one or more frame pieces. Such alignment marks are advantageous in subsequent process steps, for example the cutting step, and thus allow for accurate cutting of the final imprinted product.

[0021] Therefore, the present invention also relates to the use of this assembly comprising a frame piece to facilitate alignment of a tiled master unit in a process of replicating a flexible stamp from an extended master consisting of a number of tiled master units, wherein the tiled master unit and frame piece are mounted on a substrate carrier and are distinct from the substrate carrier.

[0022] In one embodiment of the present invention, when the master is an extended master composed of multiple tiled master units, the set of frame pieces can further include intermediate frame pieces mounted on the substrate carrier, separate from the substrate carrier, that are positioned between the tiled master units forming the extended master and closely contact the side edges of the tiled master units adjacent to the intermediate frame pieces. The intermediate frame pieces may be present between all of the tiled master units forming the extended master, or may be present only between some of the master units. When such an assembly including intermediate frame pieces is used, it is possible to control not only resin overflow at the outer periphery of the extended master, but also local resin flow in inner regions of the extended master, thereby defining local resin outflow. Furthermore, when the tiled master units forming the extended master have, for example, different textures or structures on their upper surfaces, which results in different imprint products, the intermediate frame pieces positioned between the tiled master units enable clear distinction between regions of the tiled master units and therefore different imprint products.

[0023] In one embodiment, the thickness of the frame piece d frame is the thickness of the master, d master This intentionally provides a defined height step between the master and the frame piece, the height of the step being at most 250 μm. In this case, the frame piece can function as a vertical spacer to provide imprint thickness control for the flexible stamp in the process of replicating the flexible stamp from the master. Therefore, the present invention also relates to the use of a frame piece to control the thickness of a flexible stamp in the process of replicating the flexible stamp from the master, where the master has a thickness d master The frame piece has a thickness d frame and the thickness of the frame piece d frame is the thickness of the master, d master The present invention relates to the use of a frame piece that is at least 2 μm and at most 250 μm larger than the master, and that in the replication process is positioned so that the frame piece surrounds and closely fits around the periphery of the master.

[0024] In another embodiment, the thickness of the frame piece d frame is the thickness of the master, d master The thickness of the flexible stamp can later function as a vertical spacer to provide imprint thickness control for the final imprinted product in the process of replicating the final imprinted product from the flexible stamp. Thus, the present invention also relates to the use of a frame piece to control the thickness of a flexible stamp in the frame area in the process of replicating the final imprinted product from the flexible stamp, where the master has a thickness d master The frame piece has a thickness d frame and the thickness of the frame piece d frame is the thickness of the master, d master and the use of a frame piece that is at least 2 μm and at most 250 μm smaller than the master, the frame piece being positioned in close proximity to and surrounding the periphery of the master in the replication process.

[0025] The width of the frame piece, i.e., its extension perpendicular to the master's edge, along the master, generally depends on the size of the master. That is, the larger the master, the wider the frame piece must be. To ensure the frame piece's effective function, i.e., to achieve significant effects of the frame piece of the present assembly in the process of replicating the flexible stamp from the master, for example, with respect to height control and resin flow control, the frame piece preferably has a width of at least 5 mm. In addition, the width of the frame piece is preferably less than about 200 mm. More preferably, the width of the frame piece is at least 10 mm, and equally preferably, the width is less than 150 mm.

[0026] In the process of replicating a flexible stamp from a master, it is advantageous to allow the resin to flow beyond the edges of the master in order to utilize the entire active area of ​​the master. This is even more advantageous when the active area covers at least a large portion of the master's upper surface. When using this assembly with a frame piece, the resin flow can be controlled and easily defined. In a preferred embodiment, the frame piece is made of a transparent material, such as glass, a transparent polymer material, or a transparent foil. If the resin overflows into the frame piece area, i.e., the frame area, the area of ​​the frame piece covered with resin is optically detectable because of a different light reflection compared to the area without resin. The difference in light reflection can be measured with the naked eye or, preferably, via a camera system, which also enables automated quality control during the imprinting process. Resin flow detection in the case of an opaque frame piece can be performed, for example, through the stamp if the stamp itself is transparent. To improve the optical detectability of the resin flow, in a further preferred embodiment of the assembly, the frame piece has an optically detectable relief structure on its upper surface, i.e., on the surface of the frame piece oriented in the same direction as the upper surface of the master. Thus, not only does the master have an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, but the frame pieces also have relief structures on their upper surfaces. The relief structure of the frame pieces is optically detectable. The optically detectable relief structure of the frame pieces may be in the form of a surface roughness, preferably having a roughness depth of at least 250 nm up to a few tenths of a micrometer. In further embodiments, the optically detectable relief structure of the frame pieces may be in the form of hatching, cross-hatching, dots, etc., which can simultaneously function as alignment marks to facilitate further process steps in the manufacturing process of the final imprinted product, as described above. Preferably, the optically detectable relief structure of the frame pieces is different from the relief structure of the master.

[0027] If the frame pieces have a preferably optically detectable relief structure, resin flow into the frame area can also be advantageously optically detected during the process of replicating the flexible stamp from the master. The optically detectable relief structure on the top surface of the frame pieces can also be transferred to the flexible stamp, which in turn can be useful during further processing, i.e., during the replication of the final imprinted product from the flexible stamp.

[0028] The present invention therefore relates to the use of a frame piece in a manufacturing process for a flexible stamp, wherein the flexible stamp is replicated from a master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, the frame piece being positioned so as to surround and closely fit around the periphery of the master, and the frame piece having a relief structure on its upper surface, which facilitates control of resin flow during the imprinting process.

[0029] In a further advantageous assembly embodiment, at least one of the frame pieces that surround the periphery of the master and are closely spaced along the periphery is shaped and oriented so that two adjacent edges of the at least one frame piece form complementary edges of the two adjacent edges of the master. In this case, the length of the at least one frame piece does not need to exactly match the length of the master's edge adjacent to the frame piece, although the length of the at least one frame piece may be longer. In a more preferred embodiment, all of the frame pieces that surround the periphery of the master and are closely spaced along the periphery are shaped and oriented so that two adjacent edges of each frame piece form complementary edges of the two adjacent edges of the master. In this case, a mismatch in the length of the frame pieces relative to the length of the master's edge can be avoided.

[0030] The outer contour or shape of the master included in the assembly can have a variety of geometric shapes. The master can preferably have a square, rectangular, triangular, or hexagonal shape, or can have a trapezoidal shape. Similarly, in preferred embodiments, the master can have curved edges, and in more preferred embodiments, can have a concave, convex, or oscillating curve shape, or can have a sinusoidal shape, or can have a circular or elliptical shape.

[0031] The outer contour of the assembly can follow the contour of the master included in the assembly, i.e., can have a similar shape such as a square, rectangle, or triangle. However, if the master has a shape that deviates from a square or rectangle, i.e., if the periphery of the master has a contour other than a square or rectangle, it can be advantageous for the frame piece configuration to have the master contour on the inner edge of the frame piece adjacent to the master, while the outer contour of the frame piece configuration has a square or rectangular shape. Since square or rectangular elements are easier to handle than elements of a different shape than a square or rectangle, this facilitates the imprinting process for replicating flexible stamps from these types of masters, particularly when the master is a tiled extended master composed of multiple tiled master units. Therefore, in a further preferred embodiment, the periphery of the master has a contour other than a square or rectangle, and the frame pieces arranged around the periphery of the master are shaped and arranged so that the outer edges of the frame pieces form a square or rectangle, while the shape and size of the edges of the frame pieces adjacent to the master are adapted to follow the contour of the periphery of the master.

[0032] In one embodiment, the assembly according to the present invention can also be used as a rigid stamp in a plate-to-plate imprint process.

[0033] The present invention also relates to a flexible stamp replicated from a master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, which is imparted to the flexible stamp by the assembly of the present invention.

[0034] The tiling frame has additional advantages. Typically, the base of the flexible stamp does not have anti-stick properties. If the base of the flexible stamp comes into contact with the resin, the flexible stamp will not peel off well. If the resin flows out of the outer tiling frame, the resin area of ​​the flexible stamp will expand. The manufacturing process of the flexible stamp ensures that the resin has anti-stick properties (either directly or after an anti-stick process). The resin is a copy from a tiled master / enhanced master. This also means that the imprint of the tiling frame is at least partially visible on the flexible stamp.

[0035] Essentially, the present invention relates to a flexible stamp that includes an inverse texture of a portion of the frame area that is replicated in the flexible stamp when the flexible stamp is made from an enhanced master with a frame.

[0036] As can be seen, the flexible stamp has side regions and non-active regions, which may be seen as frame pieces with additional non-active region surfaces (flat or rough) having seams between them.

[0037] The present invention will be described in more detail with reference to the following drawings, but the scope of the present invention is not limited by these drawings. [Brief explanation of the drawings]

[0038] [Figure 1] FIG. 1 shows an assembly of a tiled master unit with four corner joints (prior art). [Figure 2] FIG. 2 is a diagram of an assembly of the tiled master units of FIG. 1 with four corner joints (prior art) after they have been moved together as they are transported to the imprint station. [Figure 3] 2 is a cross-sectional view along line AA of the assembly of FIG. 1 (prior art) positioned on a substrate carrier. [Figure 4] 1 is a diagram of an assembly according to the present invention comprising an extended master made up of four tiled master units, plus an outer frame piece. [Figure 5] 5 is a cross-sectional view along line BB of the assembly of FIG. 4 with a frame piece placed on a substrate carrier and having the same thickness as the master unit. [Figure 6] 5 is a cross-sectional view along line BB of the assembly of FIG. 4 with a frame piece placed on a substrate carrier and having a thickness greater than that of the master unit. [Figure 7] 5 is a cross-sectional view along line BB of the assembly of FIG. 4 with a frame piece placed on a substrate carrier and having a thickness less than that of the master unit. [Figure 8] 1 is a diagram of an assembly according to the present invention comprising an extended master made up of four master units, further comprising outer frame pieces, plus intermediate frame pieces between the master units. [Figure 9] FIG. 1 is a diagram of an assembly according to the present invention, comprising an extended master made up of four master units, and additionally comprising an outer frame piece shaped and oriented such that two adjacent edges of the frame piece form complementary exteriors of two adjacent edges of the master. [Figure 10] FIG. 1 is a diagram of an assembly according to the present invention comprising a triangular expansion master and further comprising an outer frame piece shaped and arranged such that its inner edge forms a triangle that fits into the expansion master and its outer edge forms a rectangle.

[0039] FIG. 1 shows a prior art assembly 1 including an extended master 2 comprised of four master units 3, 4, 5, and 6. In this example, the four rectangular master units 3, 4, 5, and 6 are positioned so that their corners meet at a center point, thus forming a cross joint or cross junction 7. The master units 3, 4, 5, and 6 may have active areas 8 with relief structures, in which case the active areas 8 cover a portion of the surface of the master units 3, 4, 5, and 6. Initially, the four master units 3, 4, 5, and 6 are positioned so that adjacent edges of adjacent master units are parallel to each other, and the seam lines (also called stitch lines or seams) formed between the adjacent edges of the master units 3, 4, 5, and 6 are uniform and well-controlled.

[0040] When the master units 3, 4, 5, and 6 of the prior art assembly 1 of FIG. 1 are pushed or moved together as they are transported to the imprint station for transfer, i.e., when the relief structures of the multiple master units 3, 4, 5, and 6 and the extended master are imprinted and replicated on the flexible stamp, the last master units 5 and 6 may displace the other master units 3 and 4, resulting in a misaligned and rotated tiling. Note that for such an assembly of master units forming an extended master, as shown in FIG. 2, the misaligned and rotated tiling may already have occurred during the tiling process itself, i.e., when the master units 3, 4, 5, and 6 are placed next to each other. This results in uneven gaps 9 and 10 between the master units 3, 4, 5, and 6, as shown in FIG. 2, and high distortion levels at the corners of the crossover junctions 7. If a large area flexible stamp is manufactured from this assembly 1 of master units 3, 4, 5, 6, with misaligned and rotated tile placement and uneven gaps, the flexible stamp will also exhibit the same defects.

[0041] 3 shows a cross-sectional view of the assembly 1 of FIG. 1 along line AA, with master units 5, 6 mounted on a substrate carrier 12 and arranged side by side, each having an active area 8 with a relief structure. The master units 5, 6 have a thickness d that results in a height step 13 between the top surface 14 of the master units 5, 6 and the top surface 15 of the substrate carrier 12. master The height difference has a thickness d master is equal to.

[0042] FIG. 4 illustrates an assembly 101 according to the present invention, which includes an enhanced master 102 composed of four master units 103, 104, 105, and 106, each having an active area 108 with a relief structure. In addition to the prior art assembly 1 shown in FIG. 1, the assembly 101 of FIG. 3 includes frame pieces 116, 117, 118, and 119 that surround the periphery of the master 102 and are closely spaced along the periphery. By surrounding the periphery of the enhanced master 102 and closely spaced along the periphery, the frame pieces 116, 117, 118, and 119 can at least reduce misalignment and rotation of the master units 103, 104, 105, and 106 during processing to replicate a flexible stamp. Alternatively, the accurate alignment of the tiled master units 103, 104, 105, and 106 can be facilitated during the process of replicating a flexible stamp from the enhanced master 102 composed of the tiled master units 103, 104, 105, and 106.

[0043] FIG. 5 is a cross-sectional view of the assembly 101′ of FIG. 4 along line BB. The master units 105 and 106 shown in FIG. 5 are arranged side-by-side on a substrate carrier 112, with each master unit 105 and 106 having an active area 108 with a relief structure. Frame pieces 117′ and 119′ are mounted as separate parts on the substrate carrier and arranged around the master units, relative to outer edges 120 and 121 of the master units 105 and 106. Preferably, the frame pieces 117′ and 119′ are removably mounted on the substrate carrier, but they can also be fixed to the substrate carrier, for example, by adhesive. In the embodiment shown in FIG. 5, the frame pieces 117′ and 119′ have the same thickness as the master units 105 and 106.

[0044] In the assembly 101′ shown in cross section in FIG. 5, when a flexible stamp is replicated from the enhanced master 102 shown in FIG. 4, resin overflow is transferred to the area of ​​the frame pieces 117′, 119′. The resin flowing into the frame area has a controlled thickness identical to that of the replicated flexible stamp. The formation of uncontrolled height steps and / or ridges at the edges of the enhanced master unit 102 can be avoided, and the height step 113′ between the top surfaces 114 of the master units 105, 106 and the top surfaces 123 of the frame pieces 117′, 119′ and the top surface 115 of the substrate carrier 112 is spaced apart from the master units 105, 106, respectively.

[0045] 6 shows a cross section along line BB of a further embodiment 101'' of the assembly of FIG. 4, including the master units 105, 106. Frame pieces 117'', 119'' are attached to the substrate carrier and arranged around the master units, against the outer edges 120, 121 of the master units 105, 106. These frame pieces have a thickness greater than that of the master units 105, 106. In this case, a defined height step 122'' occurs between the upper surface 114 of the master units 105, 106 and the upper surfaces 123'' of the frame pieces 117'', 119'', which predetermines the thickness of the effective area of ​​the flexible stamp to be replicated from the assembly 101'' shown in FIG. 6. The frame pieces 117'', 119'' separate the master units 105, 106 from the upper surface 115 of the substrate carrier 112 by a height step 113''. As with FIG. 4, the frame pieces 117'', 119'' in FIG. 6 are separate and distinct components from the support carrier.

[0046] A cross section of a further embodiment 101''' of the assembly of FIG. 4 along line BB is shown in FIG. 7. In this embodiment, an assembly is shown with master units 105 and 106. Frame pieces 117''', 119''' are mounted on the substrate carrier and arranged around the master units relative to the outer edges 120 and 121 of the master units 105 and 106. The frame pieces have a thickness smaller than that of the master units 105 and 106 and the extended master unit 102. In this case, a defined height step 122''' occurs between the upper surface 114 of the master units 105 and 106 and the upper surface 123''' of the lower frame pieces 117''', 119'''. By adjusting the amount of resin used to replicate the flexible stamp from the assembly shown in FIG. 7, the overflow of resin into the frame area can be controlled, resulting in a defined height step in the outer area of ​​the flexible stamp allocated to the frame area during replication. The step of increasing thickness of the flexible stamp on the side of the master unit can later function as a vertical spacer to provide imprint thickness control of the final imprint product in the process of replicating the final imprint product from the flexible stamp.

[0047] Also, in the embodiment shown in FIG. 7, frame pieces 117''', 119''' separate the height step 113''' to the top surface 115 of the substrate carrier 112 from the master units 105, 106.

[0048] FIG. 8 illustrates an embodiment of an assembly 201 according to the present invention, including an enhanced master 202 composed of four master units 203, 204, 205, and 206 having an active area 208 similar to the assembly shown in FIG. 4. Unlike the assembly of FIG. 4, this assembly 201 includes intermediate frame pieces 231, 232, and 233, as well as outer frame pieces 216, 217, 218, and 219 that surround and closely surround the periphery of the master 202. Using such an assembly, which also includes intermediate frame pieces 231, 232, and 233, allows for control of resin overflow at the periphery of the enhanced master 202 and localized resin flow in the interior regions of the enhanced master 202. In FIG. 8, examples of resin flow during replication of a flexible stamp from the four master units 203, 204, 205, and 206 are indicated by dark gray areas 243, 244, 245, and 246. As can be seen in this example, the resin covers the entire active area 208 and can also cover the areas of the master units 203, 204, 205, and 206 that surround the active area 208. In addition, the resin can flow into the frame areas of the outer frame pieces 216, 217, 218, and 219 and the frame areas of the intermediate frame pieces 231, 232, and 233, with the thickness of the resin area within the frame areas being controlled by the thickness of the frame pieces 216, 217, 218, 219, 231, 232, and 233 relative to the thickness of the master units 203, 204, 205, and 206. Thus, the master units 203, 204, 205, and 206 can have different textures or structures, for example, in the active areas 208 on the top surfaces of the master units, which ultimately results in different imprint products. When the intermediate frame pieces 223, 224, 225 are positioned between the master units 203, 204, 205, 206, they allow clear differentiation between the active areas 208 of the master units 203, 204, 205, 206 and therefore between different imprint products. As described in the previous embodiment, the step height of the intermediate frame pieces can act as vertical spacers in the product replication process.

[0049] 9 shows an assembly 301 according to the present invention that includes frame pieces, and is similar to assembly 101 of FIG. 4. Unlike assembly 101 of FIG. 4, assembly 301 includes frame pieces 316, 317, 318, and 319 that are closely spaced around and surround the periphery of master 302, which is made up of master units 303, 304, 305, and 306. Two adjacent edges of the frame pieces are shaped and oriented to form complementary exteriors of two adjacent edges of master 302. For example, edges 331 and 332 of frame piece 316 form complementary exteriors of edges 341 and 342 of master 302.

[0050] With this design of frame pieces 316, 317, 318, 319, the length of the frame pieces does not have to exactly match the length of the edge of the master 302 to which they abut, but the length of the frame pieces can be longer, as shown in Figure 9. In this way, mismatches in the length of the frame pieces relative to the edge length of the master can be avoided.

[0051] FIG. 10 illustrates an assembly 401 according to the present invention, comprising a master 402 having a triangular shape. The master 402 is comprised of four triangular master units 403, 404, 405, and 406, each having an active area 408 with a relief structure on the top surface of the master unit. The assembly 401 of FIG. 10 further comprises frame pieces 412, 413, and 414, which surround and closely space around the periphery of the master 402. The shape, orientation, and configuration of the frame pieces 412, 413, and 414 form a triangle whose shape and size are adapted to the master 402, with the inner edges of the frame pieces adjacent to the master 402. The periphery of the configuration of frame pieces 412, 413, and 414 has a rectangular outline. 10 allows for easy handling of the assembly in the imprint process for replicating a flexible stamp from the triangular master 402, even when the master 402 is composed of multiple tiled master units 403, 404, 405, 406 that also have triangular shapes. In addition, the frame pieces 412, 413, 414 also facilitate alignment of the triangular master units 403, 404, 405, 406 during the process of replicating a flexible stamp from the enhanced master 402.

[0052] Note that for the assembly shown in Figure 10, frame pieces 412, 413, and 414 are also formed and oriented so that two adjacent edges of a frame piece form complementary exteriors of two adjacent edges of master 402. As with the assembly shown in Figure 9, this problem due to mismatches between the lengths of the frame pieces and the edges of the master can be reduced. However, in the example shown in Figure 10, the length of frame piece 414 still needs to be precisely matched to the length of the edge of master 402 adjacent to frame piece 414 and the width of frame piece 412.

Claims

1. 1. An assembly comprising a master for imprinting microstructures and nanostructures, said master being arranged on a substrate carrier and having on its upper surface an active area with a relief structure for imprinting said microstructures and nanostructures, said master having a thickness d ｍａｓｔｅｒ the assembly further comprising a set of frame pieces mounted on the substrate carrier and positioned around and closely fitting along the periphery of the master, the frame pieces having a thickness d ｆｒａｍｅ and the thickness d of the frame piece ｆｒａｍｅ is the thickness d of the master ｍａｓｔｅｒ It differs by up to 250 μm from the frame pieces disposed around the periphery of the master are shaped and oriented so that two adjacent edges of each frame piece form complementary outer edges of two adjacent edges of the master. assembly.

2. An assembly comprising a master for imprinting microstructures and nanostructures, said master being arranged on a substrate carrier and having on its upper surface an active area with a relief structure for imprinting said microstructures and nanostructures, said master having a thickness d master, said assembly further comprising a set of frame pieces mounted on said substrate carrier and arranged around and closely fitting along the periphery of said master, said frame pieces having a thickness d frame, said thickness d frame of said frame pieces differing from said thickness d master of said master by at most 250 μm, the master is an enhanced master, the enhanced master being composed of a number of tiled master units, the tiled master units having active areas on their top surfaces with relief structures for imprinting the microstructures and nanostructures, the top surfaces of the tiled master units collectively forming the top surface of the enhanced master; the set of frame pieces further comprises intermediate frame pieces mounted on the substrate carrier, disposed between the tiled master units, and closely fitting along side edges of the tiled master units adjacent to the intermediate frame pieces. assembly.

3. An assembly comprising a master for imprinting microstructures and nanostructures, said master being arranged on a substrate carrier and having on its upper surface an active area with a relief structure for imprinting said microstructures and nanostructures, said master having a thickness d master, said assembly further comprising a set of frame pieces mounted on said substrate carrier and arranged around and closely fitting along the periphery of said master, said frame pieces having a thickness d frame, said thickness d frame of said frame pieces differing from said thickness d master of said master by at most 250 μm, the periphery of the master has a contour different from a square or a rectangle, and the frame pieces arranged around the periphery of the master are shaped and arranged such that the shape and size of the edges adjacent to the master are adapted to follow the contour of the periphery of the master, while the outer edges of the frame pieces form a square or a rectangle. assembly.

4. An assembly comprising a master for imprinting microstructures and nanostructures, said master being arranged on a substrate carrier and having on its upper surface an active area with a relief structure for imprinting said microstructures and nanostructures, said master having a thickness d master, said assembly further comprising a set of frame pieces mounted on said substrate carrier and arranged around and closely fitting along the periphery of said master, said frame pieces having a thickness d frame, said thickness d frame of said frame pieces differing from said thickness d master of said master by at most 250 μm, the master is an enhanced master, the enhanced master being composed of a number of tiled master units, the tiled master units having active areas on their top surfaces with relief structures for imprinting the microstructures and nanostructures, the top surfaces of the tiled master units collectively forming the top surface of the enhanced master; The extended master is composed of tiled master units, adjacent edges of adjacent master units are parallel to each other, and the master units forming the master are arranged so that joint lines between the master units have only joint points where a maximum of three corners of adjacent master units meet between the master units. assembly.

5. The thickness d of the frame piece ｆｒａｍｅ is the thickness d of the master ｍａｓｔｅｒ 5. An assembly according to claim 1, wherein the assembly is different from the assembly of claim 1.

6. 6. An assembly according to any one of claims 1 to 5, characterized in that the frame pieces have a width of at least 5 mm.

7. 7. An assembly according to claim 1, wherein the frame piece has an optically detectable relief structure on a surface of the frame piece oriented in the same direction as the top surface of the master.

8. Use of a frame piece in an imprinting process to manufacture a flexible stamp, said flexible stamp being replicated from a master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, said master having a thickness d ｍａｓｔｅｒ The frame piece is disposed around and closely contacts the outer periphery of the master, and the frame piece has a thickness d ｆｒａｍｅ and the thickness d of the frame piece ｆｒａｍｅ is the thickness d of the master ｍａｓｔｅｒ and the master and frame pieces are mounted on a substrate carrier and are distinct from said substrate carrier; the frame pieces have relief structures on their top surfaces to facilitate control of resin flow during the imprinting process; Use of frame pieces.

9. 9. The use of a frame piece according to claim 8, wherein the master is an expanded master composed of a number of tiled master units having effective areas on their upper surfaces with relief structures for imprinting microstructures and nanostructures, the upper surfaces of the tiled master units collectively forming the upper surface of the expanded master, and the frame piece is arranged to at least surround and closely fit along the outer periphery of the expanded master.

10. Use of a frame piece in an imprinting process to manufacture a flexible stamp, the flexible stamp being replicated from a master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, the master having a thickness d master, the frame piece being positioned around and closely fitting along the periphery of the master, the frame piece having a thickness d frame, the thickness d frame of the frame piece differing from the thickness d master of the master by at most 250 μm, the master and frame piece being mounted on a substrate carrier and distinct from the substrate carrier, the master is an enhanced master composed of a number of tiled master units having effective areas on their upper surfaces with relief structures for imprinting microstructures and nanostructures, the upper surfaces of the tiled master units collectively forming an upper surface of the enhanced master, and the frame piece is arranged to at least surround and closely fit along the periphery of the enhanced master; The extended master is comprised of tiled master units in a tiled shape, adjacent edges of adjacent tiled master units are parallel to each other, and the tiled master units are arranged on the flexible stamp such that joint lines between subunits have only joint points between the subunits where at most three corners of adjacent subunits meet. Use of frame pieces.

11. The thickness d of the frame piece is controlled to control the thickness of the flexible stamp. ｆｒａｍｅ is the thickness d of the master ｍａｓｔｅｒ 11. Use of a frame piece according to any one of claims 8 to 10, wherein the thickness of the frame piece is at most 250 μm greater.

12. 10. A method for manufacturing a flexible stamp replicated from a master having an active area on its upper surface with a relief structure for imprinting microstructures and nanostructures, the flexible stamp being rendered by the assembly of claim 1.

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