Wire saw and workpiece processing method using the same

Abstract

To provide a wire saw excellent in processing accuracy and processing efficiency, and a workpiece processing method using the same.SOLUTION: A wire saw includes: a plurality of wire guides 5 that are driven to rotate; a wire 3 wound in between the wire guides to form a wire row; a workpiece holding member 6 that holds a workpiece W so as to be movable in a direction orthogonal to an axial direction of the wire and presses the workpiece against the wire row; a support frame 22 that supports the workpiece holding member; a wire guide displacement measurement device 7 that measures an amount of displacement of the wire guide in a direction parallel to the wire arrangement direction of the wire row; and a temperature controlled water control device 8 that controls temperature controlled water to be supplied to a temperature controlled water passage 30 formed in the inside of the support frame. The temperature controlled water control device controls the temperature controlled water on the basis of the amount of displacement of the wire guide that has been measured by the wire guide displacement measurement device, and thereby the support frame is elastically deformed in the direction parallel to the wire arrangement direction of the wire row.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a wire saw and a workpiece machining method using the same. [Background technology]

[0002] Wire saws are known as a means for cutting a workpiece (hereinafter referred to as a workpiece) such as a silicon ingot into slices. In a wire saw, a wire is unwound from a bobbin on one side, wound around multiple wire guides to form a wire array, and then wound onto a bobbin on the other side. The wire is driven at high speed, and the wire array cuts the workpiece into multiple workpieces.

[0003] When cutting out workpieces such as wafers that will become semiconductor substrates, high-precision processing is required, with quality indicators including thickness, warpage (flatness), roughness, and nanotopography. However, there is a problem in that the wire guide expands in the direction of the rotation axis due to the rotation heat during processing, causing a relative displacement difference between the wire guide and the workpiece, resulting in warpage in the cut wafer.

[0004] Conventionally, to solve this problem, there is a method of warming up the rotational drive of the wire guide, which displaces the wire guide in advance by warming up, thereby reducing the displacement of the wire guide from the start of machining until a certain time has elapsed, and suppressing warping of the workpiece.

[0005] Furthermore, as a method for controlling the shape of the workpiece cut out by the wire saw, Patent Document 1 proposes a wire saw in which the central axis of the guide roller is supported on the main frame via a bearing portion, and cooling water is supplied to the bearing portion to absorb frictional heat, thereby controlling the temperature of the bearing portion and therefore the amount of thermal displacement of the roller support shaft, thereby controlling the position of the main roller and the cutting position of the workpiece. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 8-323741 Summary of the Invention [Problem to be solved by the invention]

[0007] In the method of performing a warm-up operation, if the warm-up time is extended, a workpiece with less warpage can be obtained, but the time until cutting is completed is extended, resulting in poor processing efficiency.If the warm-up time is shortened, the time until cutting is completed can be shortened, but there is a problem that a workpiece with large warpage can be obtained.

[0008] Furthermore, in the method of controlling the amount of thermal deformation of the bearing portion as in Patent Document 1, if not only the bearing portion but also the frame supporting the bearing portion undergoes thermal deformation, there is a risk that the processing accuracy will become unstable.

[0009] The present invention has been made in consideration of these points, and its purpose is to provide a wire saw that suppresses relative displacement between the wire guide and the workpiece, and has excellent machining accuracy and machining efficiency, and a workpiece machining method using the same. [Means for solving the problem]

[0010] In order to achieve the above object, in the present invention, the support frame that supports the workpiece is displaced in accordance with the displacement of the wire guide.

[0011] Specifically, in the first invention, a plurality of rotationally driven wire guides; a wire wound between the wire guides to form a wire row; a workpiece holding member that holds a workpiece so as to be movable in a direction perpendicular to the axial direction of the wires and presses the workpiece against the wire array; a support frame that supports the work holding member; a wire guide displacement measuring device that measures the amount of displacement of the wire guide in a direction parallel to the wire arrangement direction of the wire array; a temperature-controlled water control device that controls the temperature-controlled water supplied to the temperature-controlled water passage formed inside the support frame, The temperature control water control device is configured to control the temperature control water based on the displacement of the wire guide measured by the wire guide displacement measuring device, thereby elastically deforming the support frame in a direction parallel to the wire arrangement direction of the wire row, thereby suppressing the relative displacement between the work holding member and the wire guide.

[0012] According to the above configuration, by displacing the support frame based on the displacement amount of the wire guide, machining can be performed with a small relative displacement between the wire guide and the workpiece. Therefore, even if the warm-up time is shortened, it is possible to obtain a workpiece with little warping, resulting in excellent machining accuracy and efficiency.

[0013] In the second invention, in the first invention, The temperature-adjusted water control device is characterized in that it is configured to control the temperature-adjusted water in accordance with the interval time from when the wire guide is stopped to when it is restarted.

[0014] According to the above configuration, the amount of displacement of the wire guide can be adjusted in accordance with the interval time, so that the warp of the workpiece can be reduced regardless of the length of the interval time.

[0015] In the third invention, in the second invention, The temperature-controlled water control device is characterized in that it is configured to control the temperature-controlled water so that the amount of displacement of the support frame is smaller when the interval time is short than when it is longer.

[0016] When the interval between the stop and restart of the wire guide is short, such that the wire guide is restarted before the rotational heat of the wire guide has completely dissipated after being stopped, the amount of displacement of the wire guide during machining is smaller than when the interval is longer. Therefore, if the amount of displacement of the support frame is always kept constant, the support frame will be displaced too much, which could actually cause warping of the workpiece. With the above configuration, stable and excellent machining accuracy can be maintained regardless of the interval.

[0017] In a fourth aspect of the present invention, in the second or third aspect of the present invention, a calculation unit that predicts and calculates the displacement of the wire guide based on a pre-stored relationship between the interval time and the displacement of the wire guide and the interval time when machining is performed, and determines a displacement index of the support frame based on the prediction calculation so that the relative displacement between the workpiece holding member and the wire guide falls within a predetermined range, The temperature-adjusted water control device is characterized in that it is configured to control the temperature-adjusted water based on the displacement index.

[0018] According to the above configuration, the support frame can be displaced based on the length of the interval time when processing is performed, based on pre-stored information, so there is no need to set it each time processing is performed, resulting in excellent processing accuracy and efficiency.

[0019] A fifth invention is a wire saw workpiece processing method, a wire saw including a plurality of rotationally driven wire guides, wires wound between the wire guides to form a wire array, a workpiece holding member that presses a held workpiece against the wire array, a support frame that supports the workpiece holding member, a wire guide displacement measuring device that measures the amount of displacement of the wire guides in a direction parallel to the wire arrangement direction of the wire array, and a temperature control water control device that controls temperature control water to be supplied to a temperature control water passage formed inside the support frame; the temperature control water control device controls the temperature control water based on the displacement of the wire guide measured by the wire guide displacement measuring device; The temperature-adjusted water is controlled to cause the support frame to elastically deform in a direction parallel to the wire arrangement direction of the wire array, thereby suppressing relative displacement between the workpiece holding member and the wire guide.

[0020] According to the above configuration, by displacing the support frame based on the displacement amount of the wire guide, machining can be performed with a small relative displacement between the wire guide and the workpiece. Therefore, even if the warm-up time is shortened, it is possible to obtain a workpiece with little warping, resulting in excellent machining accuracy and efficiency. [Effects of the Invention]

[0021] As described above, by displacing the frame in accordance with the displacement of the wire guide, it is possible to provide a wire saw with excellent machining accuracy and machining efficiency, and a workpiece machining method using the same. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a schematic diagram showing a configuration of a wire saw according to an embodiment of the present invention. [Figure 2] 1 is a schematic front view of a wire saw according to an embodiment of the present invention. [Figure 3] FIG. 10 is a diagram showing the relationship between the displacement of the wire guide and the warp of the workpiece. [Figure 4] FIG. 10 is a diagram showing the relationship between the displacement of the support frame and the warp of the workpiece. [Figure 5] FIG. 10 is a diagram showing the relationship between the displacement of the support frame and the warp of the workpiece. [Figure 6] FIG. 10 is a diagram showing the relationship between the displacement of the support frame and the warp of the workpiece. [Figure 7] 10 is a table showing the relationship between the displacement index of the support frame and the temperature of the support frame. [Figure 8] FIG. 10 is a diagram illustrating the relationship between the displacement index of the support frame and the temperature of the support frame. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0024] Fig. 1 is a side view of a wire saw 1 according to an embodiment of the present invention and a schematic diagram showing its configuration, and Fig. 2 is a schematic front view. This wire saw 1 is used to simultaneously cut a workpiece (hereinafter referred to as workpiece W), such as a silicon ingot used in the manufacture of semiconductor devices, solar cells, etc., at multiple locations to obtain workpieces such as thin wafers.

[0025] The wire saw 1 is equipped with a new wire bobbin 2, a wire 3, a take-up bobbin 4, a wire guide 5, a workpiece holding member 6 for holding the workpiece W, a wire guide displacement measuring device 7, a temperature and water control device 8, a calculation unit 9, etc.

[0026] The wire 3 unwound from the new wire bobbin 2 is guided by multiple wire pulleys 10 and extends to the wire guides 5, where it is wound between the multiple wire guides 5 to form a wire row, and is further guided by multiple wire pulleys 10 to be wound onto the take-up bobbin 4. A wire tensioning device 11 is provided between the new wire bobbin 2 and the take-up bobbin 4 and the wire guide 5, respectively, to adjust the tension of the wire 3. The new wire bobbin 2 and the take-up bobbin 4 are each driven to rotate by a drive motor (not shown), and unwinding and winding are alternately performed synchronously.

[0027] The wire guides 5, 5 have rotation axes extending in the front-rear direction and are spaced apart laterally and generally parallel to each other. The wire guides 5 are driven to rotate by a wire guide drive motor (not shown). A wire 3 is wound between the wire guides 5, 5, and the direction in which the rotation axes of the wire guides 5 extend is parallel to the direction in which the wires of the wire array are arranged. The wire 3 can travel at high speed in a direction generally perpendicular to the rotation axes of the wire guides 5. The workpiece W is pressed against the wire array while the spirally wound wire 3 travels between a pair of wire guides 5, 5 arranged in parallel, and the workpiece W is cut.

[0028] The rotating shaft of the wire guide 5 has its axis supported by a column 20 erected behind the wire guide 5 and a support wall 23 erected in front of the wire guide. The rotating shaft is configured by attaching an outer cylinder that rotates about this axis supported at both ends. The outer cylinder of the rotating shaft, or the outer cylinder and axis of the rotating shaft, expands and contracts in the direction of the rotation axis due to rotation heat or temperature-controlled water inside the axis. A base 21 located below the wire guide 5 is provided at the lower end of the column 20. A support frame 22 extends forward from the upper end of the column 20.

[0029] The support frame 22 supports the workpiece holding member 6, which extends in the vertical direction. A temperature-controlled water passage 30 is formed inside the support frame 22, extending at least in the front-to-rear direction. The support frame 22 elastically deforms depending on the temperature of the temperature-controlled water supplied to the temperature-controlled water passage 30. The temperature-controlled water supplied to the temperature-controlled water passage 30 is controlled by a temperature-controlled water control device 8.

[0030] The temperature control water control device 8 is configured to control the temperature control water based on the displacement of the wire guide 5 measured by the wire guide displacement measuring device 7 described later, thereby elastically deforming the support frame 22 in a direction parallel to the wire arrangement direction of the wire row, i.e., in the forward / backward direction in this embodiment, thereby suppressing the relative displacement between the work holding member 6 and the wire guide 5.

[0031] The temperature control water control device 8 may be configured to control the temperature control water in accordance with the interval time from when the rotation of the wire guide 5 stops to when it restarts. For example, the temperature control water control device 8 may be configured to control the temperature control water so that the amount of deformation of the support frame 22 is smaller when the interval time is short compared to when the interval time is longer.

[0032] The workpiece holding member 6 is located above and between the wire guides 5, 5, and extends from inside the support frame 22 toward the wire guide 5. A workpiece W, such as a semiconductor ingot, is removably attached to the lower end of the workpiece holding member 6. The workpiece holding member 6 is driven by a drive motor (not shown) to move the workpiece W in a direction perpendicular to the axial direction of the wire 3, i.e., in the vertical direction in this embodiment, and press the workpiece W against the wire row. The workpiece holding member 6 is displaced in the front-to-rear direction as the support frame 22 elastically deforms.

[0033] Above the wire guides 5, 5, there may be provided a machining fluid supply unit (not shown) that supplies a slurry containing abrasive grains to the wire 3, and a machining fluid supply unit (not shown) that supplies machining fluid to the wire 3 carrying abrasive grains on its outer periphery. The workpiece holding member 6 is lowered while the wire 3 carrying abrasive grains is traveling at high speed, thereby cutting the workpiece W between the wire guides 5, 5.

[0034] A support wall 23 stands upright at the front end of the base 21. The support wall 23 is disposed on the front side with a gap between it and the front end of the wire guide 5. The support wall 23 has a wire guide displacement measuring device 7 at a position facing the wire guide 5, which measures the amount of displacement of the wire row in the wire guide 5 in a direction parallel to the wire arrangement direction. The wire guide displacement measuring device 7 is connected to the temperature control water control device 8 via a calculation unit 9.

[0035] The calculation unit 9 determines a displacement index of the support frame 22 so that the relative displacement between the workpiece holding member 6 and the wire guide 5 falls within a predetermined range, based on data on the displacement amount of the wire guide 5 measured by the wire guide displacement measuring device 7. The data obtained by measurement by the wire guide displacement measuring device 7 is processed in the calculation unit 9, and the displacement index determined by the calculation unit 9 is sent to the temperature control water control device 8. The temperature control water control device 8 may be configured to control the temperature control water based on the displacement index.

[0036] In addition, the calculation unit 9 may be configured to predict and calculate the displacement of the wire guide 5 based on the relationship between the interval time from when the rotation of the wire guide 5 stops until it restarts, which is stored in advance, and the displacement of the wire guide 5, and the interval time when processing is performed, and to determine the displacement index of the support frame 22 based on the predicted calculation so that the relative displacement between the work holding member 6 and the wire guide 5 falls within a predetermined range.

[0037] Next, the operation of the wire saw 1, the relationship between the displacement of the wire guide 5 and the warpage of the workpiece, and the state of the warpage of the workpiece when the support frame 22 is displaced will be described.

[0038] Starting the wire saw 1 starts the wire guide 5, and the wire 3 is driven in the axial direction as the wire guide 5, new wire bobbin 2, and take-up bobbin 4 rotate. In addition, the workpiece holding member 6 is driven and slowly lowered. The workpiece W held by the workpiece holding member 6 is pressed against the wire row and cut into multiple workpieces by the multiple wires 3. During processing, the outer tube of the rotating shaft of the wire guide 5, or the outer tube and shaft center of the rotating shaft, expands in the rotational axis direction due to rotational heat, causing the wire guide 5 to expand in the rotational axis direction.

[0039] Figure 3 shows the relationship between the temperature change of the wire guide and the warpage of the workpiece. The vertical axis shows the temperature change of the wire guide and the magnitude of the warpage of the cut workpiece, and the horizontal axis shows the processing time. The notations "start" and "stop" written on the horizontal axis indicate the start and stop of the wire guide rotation.

[0040] When the wire guide starts to rotate, its temperature gradually rises, but after a certain amount of time has passed since it was started, the rotational heat stabilizes and temperature T1 is maintained. When the wire guide stops rotating, its temperature drops to 0, the temperature at startup. Note that the amount of displacement of the wire guide 5 in the direction parallel to the wire arrangement direction of the wires also shows a similar trend to the temperature displacement of the wire guide 5. If the support frame is not displaced, the workpiece will be affected by this temperature displacement of the wire guide 5, and the workpiece cut from the workpiece will have a warp Y1 immediately after the wire guide 5 starts, i.e., at the start of the cut.

[0041] Furthermore, when cutting is performed repeatedly by repeatedly starting and stopping the rotation of the wire guide, the state of warping of the workpiece changes depending on the length of the interval between the stopping and starting of rotation.

[0042] For example, as shown in Figure 3, if the interval time X1 is longer than the time it takes for the temperature change in the wire guide to return to 0 from T1, as in the case of the second start-up of the wire guide after the first stop of the wire guide, the temperature of the wire guide after the second start-up will rise from 0 to T1, just like after the first start-up. The temperature change in the wire guide at the first start-up is similar to that at the second start-up. However, if the interval time X2 is shorter than the time it takes for the temperature change in the wire guide to return to 0 from T1 after the stop, as in the case of the third start-up after the second stop, the wire guide will be restarted before the temperature change in the wire guide returns to 0. In this case, the temperature change by which the wire guide rises to temperature T1 is smaller than the change in temperature at the first and second starts. The warpage of the workpiece cut in this third cut-up will be smaller than the warpage of the workpiece cut in the first and second cut-ups.

[0043] According to the wire saw of this embodiment, the relative displacement between the wire guide and the workpiece can be suppressed by controlling the temperature-controlled water to displace the support frame based on the displacement amount of the wire guide, and the warp of the workpiece can be stably reduced regardless of the interval time.

[0044] During processing, when the wire guide 5 thermally expands in the direction of its rotation axis due to its rotational heat, the relative distance between the front end of the wire guide 5 and the wire guide displacement measuring device 7 decreases. During processing, the wire guide displacement measuring device 7 measures the amount of displacement of the wire guide 5 in a direction parallel to the wire arrangement direction of the wire row, and sends the obtained data to the calculation unit 9.

[0045] The calculation unit 9 determines a displacement index of the support frame 22 based on the displacement amount of the wire guide 5 measured by the wire guide displacement measuring device 7. The temperature control water control device 8 displaces the support frame 22 by controlling the temperature control water based on the displacement index.

[0046] For example, when the wire guide 5 expands in the direction of the rotation axis due to thermal expansion, the calculation unit 9 transmits a displacement index that increases the temperature of the support frame 22. The temperature control water control device 8 raises the temperature of the temperature control water to a temperature corresponding to the displacement index according to the displacement index received from the calculation unit 9. When the temperature of the temperature control water flowing through the temperature control water passage 30 increases, the support frame 22 elastically deforms due to thermal expansion and expands forward. Along with this elastic deformation of the support frame, the workpiece holding member 6 arranged on the support frame also displaces forward. As a result, the relative displacement between the wire guide 5 and the workpiece holding member 6 is suppressed, and warping of the cut workpiece can be suppressed.

[0047] Figure 4 shows the relationship between the displacement of the support frame and the warpage of the workpiece when the support frame is displaced based on the displacement of the wire guide. In Figures 4 to 6, the vertical axis represents the temperature displacement of the support frame and the magnitude of the warpage of the cut workpiece, and the horizontal axis represents the processing time. The notations "start" and "stop" written on the horizontal axis indicate the start and stop of the rotation of the wire guide.

[0048] As described above, by elastically deforming the support frame, the relative displacement between the workpiece holding member and the wire guide falls within a predetermined range, and as shown in Figure 4, the warp Y2 of the workpiece can be made smaller than the warp Y1 of the workpiece when machining is performed without displacing the support frame.

[0049] In Figure 4, the support frame 22 is repeatedly displaced by the same displacement amount Z1 from the first to third machining passes. As in the case of the first stop and second start, there is no problem if the interval time X1 is longer than the time it takes for the temperature displacement of the wire guide to return to zero after the wire guide rotation stops. However, if the interval time X2 is shorter than the time it takes for the temperature displacement of the wire guide to return to zero after the wire guide rotation stops, the displacement amount of the support frame will be larger than the displacement amount of the wire guide, causing a warp Y4 in the opposite direction in the workpiece.

[0050] Fig. 5 is a diagram showing the relationship between the displacement of the support frame and the warp of the workpiece when the support frame is displaced based on the displacement of the wire guide, and shows a case in which the displacement Z2 of the support frame is larger than that shown in Fig. 4. In this way, when the amount of thermal displacement applied to the support frame is increased, the warp Y3 of the workpiece can be made even smaller than the warp Y2 of the workpiece in Fig. 4.

[0051] However, if the temperature displacement of the support frame is increased, and the interval time X2 is shorter than the time it takes for the temperature displacement of the wire guide to return to zero after rotation has stopped, the displacement of the support frame will become even larger than the displacement of the wire guide, and the warp Y5 of the workpiece in the opposite direction will become larger than the warp Y4 of the workpiece in Figure 4.

[0052] To solve such problems, the wire saw of this embodiment is provided with a calculation unit 9 that predicts and calculates the displacement of the wire guide 5 based on the pre-stored relationship between the interval time from when the wire guide stops rotating until it restarts and the displacement of the wire guide, and the interval time when processing is performed, and that determines the displacement index of the support frame 22 based on the predicted calculation so that the relative displacement between the work holding member 6 and the wire guide 5 falls within a predetermined range, and it is desirable that the temperature control water control device 8 is configured to control the temperature control water according to the interval time from when the wire guide 5 stops rotating until it restarts.

[0053] FIG. 6 shows the relationship between the displacement of the support frame and the warp of the workpiece when the displacement of the support frame is changed based on the interval time from when the wire guide rotation stops to when it restarts.

[0054] If the interval time X1 is longer than the time required for the temperature displacement of the wire guide to return to 0 after the wire guide stops rotating, a displacement Z2 is applied to the support frame, thereby suppressing the magnitude of the warp of the workpiece to Y3. If the interval time X2 is shorter than the time required for the temperature displacement of the wire guide to return to 0 after the wire guide stops rotating, a displacement Z3, which is smaller than displacement Z2, is applied to the support frame, thereby suppressing the magnitude of the warp of the workpiece to Y3.

[0055] When the interval time X2 is short, the temperature control water control device controls the temperature control water so that the displacement of the support frame is smaller than when the interval time X1 is longer, thereby keeping the warp of the workpiece small and approximately constant regardless of the interval time, and making it possible to provide a wire saw and a workpiece processing method using the same that have excellent processing accuracy and processing efficiency.

[0056] Figure 7 is a table showing the temperature of the support frame and the corresponding displacement index of the support frame, and Figure 8 is a graph of this.

[0057] The calculation unit 9 stores the relationship between the temperature of the support frame and the displacement index, as shown in Figures 7 and 8, and furthermore, the calculation unit 9 predicts and calculates the displacement amount of the wire guide 5 based on the relationship between the interval time from when the rotation of the wire guide stops until it restarts and the displacement amount of the wire guide, which is stored in advance, and the interval time when processing is performed.

[0058] The above-described embodiments are essentially preferred examples, and are not intended to limit the scope of the present invention, its applications, or uses. [Explanation of symbols]

[0059] 1 wire saw 2 New wire bobbins 3 wire 4 Take-up bobbins 5 Wire Guide 6 Work holding member 7. Wire guide displacement measuring device 8. Water temperature control device 9 Arithmetic section 10 Wire pulley 11 Wire tensioning device 20 Column 21 Base 22 Support frame 23 Supporting wall double work

Claims

1. a plurality of rotationally driven wire guides; a wire wound between the wire guides to form a wire row; a workpiece holding member that holds a workpiece so as to be movable in a direction perpendicular to the axial direction of the wires and presses the workpiece against the wire array; a support frame that supports the work holding member; a wire guide displacement measuring device that measures the amount of displacement of the wire guide in a direction parallel to the wire arrangement direction of the wire array; a temperature-controlled water control device that controls the temperature-controlled water supplied to a temperature-controlled water passage formed inside the support frame; a calculation unit that predicts and calculates the displacement of the wire guide based on a pre-stored relationship between an interval time from when the wire guide is stopped until when it is restarted and an amount of displacement of the wire guide, and the interval time when machining is performed, and that determines a displacement index of the support frame based on the prediction calculation so that the relative displacement between the workpiece holding member and the wire guide falls within a predetermined range, The wire saw is characterized in that the temperature control water control device is configured to control the temperature control water based on the displacement index, thereby elastically deforming the support frame in a direction parallel to the wire arrangement direction of the wire array, thereby suppressing the relative displacement between the work holding member and the wire guide.

2. a wire guide displacement measuring device that measures the amount of displacement of the wire guide in a direction parallel to the wire arrangement direction of the wire array; a temperature control water control device that controls the temperature control water to be supplied to a temperature control water passage formed inside the support frame; and a calculation unit that predicts and calculates the amount of displacement of the wire guide based on a pre-stored relationship between the interval time from when the wire guide is stopped until when it is restarted and the amount of displacement of the wire guide, and based on the pre-stored interval time when machining is performed, and determines a displacement index of the support frame based on the prediction calculation so that the relative displacement between the work holding member and the wire guide falls within a predetermined range; The water temperature control device controls the water temperature based on the displacement index, A workpiece processing method characterized in that, by controlling the temperature-controlled water, the support frame elastically deforms in a direction parallel to the wire arrangement direction of the wire array, thereby suppressing relative displacement between the workpiece holding member and the wire guide.

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