Contact pin for testing semiconductor devices with high speed signals, and spring contact and socket device including the same

Abstract

The present invention relates to a contact pin (100) having a minimum length suitable for testing high-speed semiconductor devices (ICs) and capable of ensuring a maximum compression distance, and a spring contact and socket device including the same. The contact pin (100) of the present invention includes a plate-shaped body (110) having a width and a thickness, a head (120) integrally formed at the upper end of the body (110), and a leg (130) integrally extending from the lower end of the body (120). The head (120) is a plate-shaped strip (122) having the same length on both sides with respect to the center of the body (110) at the upper end of the body (110) and having an upper pointed end (121) along its upper tip. A first strip section (122) is located on the same plane as the body (110) and is provided at the same left and right distances from the center of the body (110). The body portion (110) includes a first strip section (112a) and a second strip section (122b) having a semicircular arc shape and rolled from both ends of the first strip section (112a), so that the first strip section (122a) is located in the radial direction of the cylinder formed by the entire second strip section (122b). The body portion (110) has a groove (111) recessed in the lengthwise direction at the center of each of its two faces, and a stepped locking step (111a) is formed at the lower end of the groove (111), and the upper end of the groove (111) extends to the upper end of the first strip section (122a) and is open.

Description

[Technical Field]

[0001] The present invention relates to a contact pin for testing semiconductor devices, and a spring contact and socket device including the same, and more particularly to a contact pin that has a minimum length suitable for testing high-speed signal semiconductor devices (ICs) and can ensure a maximum compression distance, and a spring contact and socket device including the same. [Background technology]

[0002] Generally, in the manufacturing process of semiconductor devices, various tests are performed to check for defects in the semiconductor devices. One of the tests for semiconductor devices is an electrical characteristic test for the semiconductor device. Such a test for semiconductor devices is performed via a socket device that electrically connects the semiconductor device to a wiring board such as a test board (PCB).

[0003] Generally, the socket device is an important part of the socket device for testing the semiconductor device by including contacts for electrical contact corresponding to the terminals of the semiconductor device. Generally, contacts must be able to apply sufficient pressure to ensure reliable contact with the contact points (terminals). Therefore, contacts must have sufficient elasticity within an appropriate range. Furthermore, it is preferable to shorten the length to minimize contact electrical resistance. To meet these requirements, various contact shapes have emerged.

[0004] Meanwhile, various semiconductor devices have been developed recently to process high-speed signals for 5G and 6G communications. Contacts for performing function tests or real-time burn-in tests on semiconductor devices with high-speed signals (approximately 40 GHz or higher) must also be developed to be suitable for high-speed test signals.

[0005] The length of the contact to process high-speed signals of about 40 GHz must be about 1.0 mm, but conventional contacts such as pogo pins are structurally difficult to manufacture to lengths of less than 1.0 mm.

[0006] Therefore, this application is an improvement on the applicant's Patent Document 1 to develop contact pins, spring contacts, and socket devices suitable for testing high-speed signal semiconductor elements, which can be manufactured with a contact length of 1.0 mm or less, and is filed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent No. 10-2055773 (Publication date: December 13, 2019) Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention aims to improve the above-mentioned problems of the prior art, and its object is to provide a contact pin having a minimum length suitable for testing high-speed signal semiconductor devices, and a spring contact and socket device including the same. [Means for solving the problem]

[0009] The contact pin according to one aspect of the present invention includes a plate-shaped body portion (t < w) having a width w and a thickness t, a head portion integrally formed at the upper end of the body portion, and a leg portion integrally extending from the lower end of the body portion. The head portion is a plate-shaped strip having the same length on the left and right with respect to the center of the body portion at the upper end of the body portion, and an upper tip portion is formed along the upper tip. The strip includes a first strip section provided on the same plane as the body portion and having the same distance from the center of the body portion on the left and right, and a second strip section having a semi-arc shape by rolling from both ends of the first strip section. Thus, the first strip section is positioned in the cylindrical radial direction formed by the entire second strip section. The body portion has concave grooves recessed in the longitudinal direction at the center of each of the two surfaces. A locking step having a step is formed at the lower end of the concave groove. The upper end of the concave groove extends to the upper end of the first strip section and is open. The leg portion is composed of a pair extending symmetrically to the left and right with a first width w1 sandwiched from the body portion, and includes hook protrusions protruding inward from each end and having a second width w2 smaller than the first width w1, and a lower tip portion protruding from the lower tip.

[0010] Preferably, the thickness t1 of the tip of the upper tip portion is smaller than the thickness t of the strip of the head portion (t1 < t).

[0011] Preferably, concave portions are provided inwardly at both corners where the body portion and the head portion contact.

[0012] Preferably, each edge in the thickness direction of the lower end of the body portion adjacent between the leg portions forms a chamfered inclined surface having an inclination.

[0013] Preferably, the hook protrusion has an inclined surface in the opening direction.

[0014] Preferably, the thickness t3 of the hook protrusion is smaller than the thickness t of the body portion.

[0015] Preferably, the lower tip portion is thinner than the thickness of the hook protrusion.

[0016] Preferably, the first width w1 between the legs is greater than the thickness of the body.

[0017] Preferably, the second width w2 between the hook protrusions is smaller than the thickness t of the body portion and is equal to or larger than the thickness t2 of the section where the groove is formed.

[0018] Preferably, the first strip section further includes a connecting tab protruding from an upper end thereof lower than the upper pointed end, and more preferably, the connecting tab has a through hole recessed therein and is configured as a pair of left and right connecting tabs centered on the through hole.

[0019] A spring contact according to one aspect of the present invention is a spring contact including the above-mentioned contact pins as a pair of first and second contact pins, wherein the legs of the first and second contact pins intersect perpendicularly with each other, and a coil spring is supported by the heads of the first and second contact pins to elastically support the first and second contact pins.

[0020] Preferably, the overall length of the spring contact is equal to the sum of the length of each head of the first contact pin and the second contact pin and the length of the coil spring.

[0021] According to another aspect of the present invention, there is provided a spring contact including the above-described contact pin as a first contact pin, the spring contact including a coil spring having one end supported by a head of the first contact pin, and a second contact pin that is elastically supported via the coil spring and perpendicularly intersects with the first contact pin, the second contact pin having a plate-like second body portion having a width and a thickness, a pair of shoulder portions protruding from left and right ends of the second body portion and supporting one end of the coil spring, and a second upper pointed portion protruding upward, the second contact pin being integrally formed on the same plane as the upper end of the second body portion. the second body has a second groove recessed longitudinally at the center of each of its two faces, a second engagement groove having a stepped portion formed at a lower end thereof, and an open upper end of the second groove extending to an upper end of the second head; the second legs are formed as a pair symmetrically across a first width w1 from the second body, and include a second hook protrusion protruding inward from each end and having a second width w2 smaller than the first width w1, and a second lower pointed end protruding from a lower tip thereof.

[0022] Preferably, the overall length of the spring contact is equal to the sum of the length of the head of the first contact pin, the length from the second upper pointed end to the lower end of the shoulder, and the length of the coil spring.

[0023] Preferably, the first contact pin and the second contact pin have the same length.

[0024] Next, a test socket device according to another aspect of the present invention is a test socket device including the above-mentioned spring contacts, and includes: a flexible socket body portion having receiving holes through which the spring contacts pass and are received; a mounting plate fixed to the socket body portion and having mounting guide holes for fixed position mounting; an upper film plate having first through holes corresponding to the receiving holes and attached to the upper surface of the socket body portion; and a lower film plate attached to the underside of the mounting plate and having second and third through holes corresponding to the receiving holes and the mounting guide holes, respectively.

[0025] Preferably, the mounting plate and the lower film plate are further provided with drilled mounting holes for attachment.

[0026] Preferably, the connector further includes a silicone caulking portion inserted into the upper open end of the receiving hole to fix the upper end of the spring contact.

[0027] Preferably, the film transport device further includes an upper guide plate provided on an upper surface of the upper film plate, the upper guide plate having a guide hole larger than the receiving hole and corresponding to the receiving hole.

[0028] Preferably, the film feeder further includes a lower guide plate, which is larger than the receiving hole, has a flow hole formed therein corresponding to the receiving hole, and is disposed on the lower surface of the lower film plate. [Effects of the Invention]

[0029] The contact pin for testing semiconductor devices of the present invention minimizes the overall length of the spring contact (approximately 1.0 mm or less) and increases the maximum compression length of the spring contact, thereby increasing the contact force with the terminal of the semiconductor device. This makes it particularly suitable for high-speed signal semiconductor devices and has the effect of extending the life cycle of the spring contact. [Brief explanation of the drawings]

[0030] [Figure 1] FIG. 1 is a front view of a contact pin according to a first embodiment of the present invention. [Figure 2] 2(a) and 2(b) are a plan view and a cross-sectional view taken along line AA in FIG. 1, respectively, of a contact pin according to a first embodiment of the present invention. [Figure 3] 3(a) and 3(b) are a plan view and a front view showing the contact pin according to the first embodiment of the present invention in an expanded state. [Figure 4] 4(a) and 4(b) are cross-sectional views taken along the lines BB and CC in FIG. 3(b), respectively. [Figure 5] 5(a), 5(b), and 5(c) are diagrams briefly illustrating a process for manufacturing a spring contact using a contact pin according to the first embodiment of the present invention. [Figure 6] 6(a), 6(b), 6(c), and 6(d) are diagrams each showing a simplified process of manufacturing a spring contact without a coil spring using a contact pin according to the first embodiment of the present invention. [Figure 7] 7(a) to 7(e) are diagrams showing a spring contact according to a first embodiment of the present invention. [Figure 8] FIG. 10 is a front view of a contact pin according to a second embodiment of the present invention. [Figure 9] 9(a) and 9(b) are a plan view and a cross-sectional view taken along line EE of the contact pin of FIG. 8, respectively. [Figure 10] FIG. 10 is a front view of a spring contact according to a second embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view taken along line FF in FIG. 10 of the present invention. [Figure 12] FIG. 10 is a front view of a spring contact according to a third embodiment of the present invention. [Figure 13] FIG. 13 is a cross-sectional view of the present invention taken along line GG in FIG. 12. [Figure 14] 1 is a plan view of a socket device according to an embodiment of the present invention; [Figure 15] FIG. 15 is a cross-sectional view taken along line HH in FIG. [Figure 16] FIG. 15 is a cross-sectional view taken along line HH in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0031] First, the terms and words used in this specification and claims should not be interpreted limitedly to their ordinary and dictionary meanings, but should be interpreted in a meaning and concept that is consistent with the technical idea of ​​the present invention, in accordance with the principle that an inventor can appropriately define the concept of a term in order to best explain his or her invention.

[0032] Therefore, it should be understood that the embodiment described in this specification and the configuration shown in the drawings are merely the most preferred embodiment of the present invention and do not represent the entire technical idea of ​​the present invention, and that there may be various equivalents and modifications that can replace them at the time of this application.

[0033] The terms "first," "second," "third," etc. in the present invention are used interchangeably to distinguish one component from another, and do not refer to the position or importance of each component. In addition, terms relating to directions, such as upper, lower, left, and right, used in the present invention are used to indicate the relationship between components with reference to the accompanying drawings, and do not absolutely indicate the actual position of each component.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the case of multiple identical components, only one reference numeral will be used for each component, and separate reference numerals will be used only when separate descriptions are required.

[0035] FIG. 1 is a front view of a contact pin according to a first embodiment of the present invention, and FIGS. 2(a) and 2(b) are a plan view and a cross-sectional view taken along line AA in FIG. 1, respectively, of the contact pin according to the first embodiment of the present invention.

[0036] 1 to 2(b), the contact pin 100 of this embodiment includes a body portion 110, a head portion 120, and a leg portion .

[0037] The body 110 has a groove 111 recessed in the center of each side with a certain width and length in the longitudinal direction, and a stepped locking step 111a is formed at the lower end of the groove 111, and the upper end of the groove 111 extends to the upper end of the head 120. Preferably, the body 110 has a chamfered inclined surface 11a formed at each edge in the thickness direction of the lower end of the body 110 adjacent to the legs 130, so that assembly can be easily performed in the process of assembling two contact pins by crossing them.

[0038] The head 120 is made up of plate-like strips 122a, 122b at the upper end of the body 110, which have the same length on both sides relative to the center of the body 110 and have an upper pointed end 121 formed along the upper tip. The strips 122a, 122b are located on the same plane as the body 110 and include a first strip section 122a which is disposed at the same distance on both sides from the center of the body 110, and a second strip section 122b which is rolled from both ends of the first strip section 122a and has a semicircular arc shape, so that the first strip section 122a is positioned in the radial direction of the cylinder formed by the entire second strip section 122b.

[0039] The legs 130 are formed in a pair and extend symmetrically from the body 110 across a first width w1, and each leg 130 includes hook protrusions 131 that protrude inward from an end and face each other with a second width w2 smaller than the first width w1. Preferably, the first width w1 between the two legs 130 is greater than the thickness t of the body 110, thereby preventing sliding friction between the two contact pins when they are combined to be used as a spring contact.

[0040] In particular, as shown in FIG. 2(b), preferably, the length C12 of the leg 130 including the lower tip 132 is at least equal to or even longer than the length C11 from the upper tip 121 to the lower end of the body 110 (C11≦C12).

[0041] The contact pin 100 configured as described above is manufactured by stamping a ribbon-shaped plate material having a certain thickness t and width w. Specifically, the plate material is stamped to produce a reel-type contact pin, which is then heat-treated and plated with gold or PdCo in the reel state according to the required characteristics, and then assembled with a spring to manufacture a spring contact.

[0042] Preferably, the contact pin 100 includes a connecting tab 123 protruding from the upper end of the first strip section 122a lower than the upper tip 121, and this connecting tab 123 is connected to the carrier strip 101 during sheet metal processing, and the carrier strip 101 is finally removed after assembly with the coil spring is completed, which will be described in detail again later in the manufacturing process of the spring contact.

[0043] Figures 3(a) and 3(b) are a plan view and a front view showing the contact pin according to the first embodiment of the present invention in an expanded state, and Figures 4(a) and 4(b) are cross-sectional views taken along lines BB and CC in Figure 3(b), respectively.

[0044] Referring to (a) of FIG. 3 to (b) of FIG. 4, the contact pin 100' includes strips 122a and 122b that are integrally and horizontally provided at the upper part of the body portion 110, and upper tip portions 121 are provided at the upper ends of the strips 122a and 122b. Preferably, the upper tip portion 121 has a tip thickness t1 that is even smaller than the thickness t of the strips 122a and 122b that constitute the head portion (t1 < t), and the upper tips of the strips 122a and 122b can be coined to reduce the thickness t1 of the upper tip portion 121, thereby enhancing the contact reliability with the terminal.

[0045] Particularly referring to (a) of FIG. 4, in this embodiment, the upper tip portion 121 is illustrated as having the same left / right inclination gradient, but the left / right inclination gradients can be made different, and by making the left / right inclination gradients different, the upper tip portion 12 can be positioned closer to the outer diameter or inner diameter of the head portion 120. Also, as another modification example, a plurality of upper tip portions may have different left / right inclination gradients from each other. By having different inclination gradients for each upper tip portion, compared to the upper tip portions being linearly (one-dimensional) distributed in a circular shape, they are distributed in a planar (two-dimensional) shape, thereby enhancing the contact efficiency with the terminals of the semiconductor element.

[0046] The strips 122a and 122b are rolled with the same left and right lengths with respect to the center of the body portion 110 and manufactured in a cylindrical shape, thereby forming the head portion.

[0047] Specifically, the strips 122a and 122b include a first strip section 122a that is located on the same plane as the body portion 310 and is provided so as to have the same left and right distances from the center of the body portion 110, and a second strip section 122b that is rolled clockwise (or counterclockwise) from both ends of the first strip section 122a and has a semi-arc shape, forming a cylindrical head portion having this structure. The head portion having this structure has a substantially "S" shape on the plane (refer to (a) of FIG. 2). On the other hand, depending on the rolling direction of the second strip section 122b, the head portion can have a left / right symmetric shape of "S" on the plane.

[0048] The first strip section 122a is located in the radial direction of the cylindrical head, its length d corresponds to the diameter of the substantially cylindrical shape, and the sum of the lengths R / 2 of the respective second strip sections 122b provided at both ends of the first strip section 122a corresponds to the circumferential length R of the cylindrical head. Therefore, the length d of the first strip section 122a and the sum R of the two second strip sections 122b have the relationship of R (circumferential length of the cylinder) = d (diameter of the circle) × π.

[0049] The body portion 110 has concave grooves 111 having a constant width w3 and depth in the longitudinal direction on both sides, and the thickness t2 of the section where the concave grooves 111 are formed is smaller than the thickness t of the body portion 110 (t2 < t). In particular, the concave grooves 111 of the body portion 110 extend to the upper end of the first strip section 122a and the upper end of the concave grooves 111 is open.

[0050] Each leg portion 130 is provided with a hook projection 131 on the lower side and a lower tip portion 132 in the vertical direction at the lower tip. Preferably, the lower tip portion 132 includes an edge line formed by contacting two different inclined surfaces. In the present embodiment, it is shown that an inner inclined surface 132a and an outer inclined surface 132b contact each other based on the lower tip portion 132 to form a tip edge line. At this time, the inclined surface may be a curved surface having a constant curvature and should be understood as including all inclined surfaces having a constant angle of inclination. On the other hand, the inner inclined surface 132a defines the hook projection 131, and the hook projection 131 includes a bending end 131a where the bending of the inner inclined surface 132a occurs, and this bending end 131a functions as a hook that restricts the vertical movement between two contact pins.

[0051] Preferably, the thickness t3 of the hook projection 131 is smaller than the thickness t of the body portion 110, and more preferably, the thickness t4 of the lower tip portion 132 is even smaller than the thickness t3 of the hook projection 131 (t4 < t3 < t). The lower tip portion 132 can improve the contact reliability with the terminal by coining the lower tip of the hook projection 131 to reduce the thickness t4 of the lower tip portion 132.

[0052] In addition, the width w2 between the hook protrusions 131 of each leg portion 130 is smaller than the thickness t of the body portion 110, and is equal to or larger than the thickness t2 of the section of the body portion 110 where the recessed groove 111 is formed (t2≦w2 <t)

[0053] As described above, the upper end of the first strip section 122a includes a connecting tab 123 that protrudes lower than the upper tip 121, and this connecting tab 123 is integrally connected to the carrier strip 101, and a V-shaped groove 123a is formed horizontally in the thickness direction, making it easy to separate the carrier strip 101 and the contact pin 100.

[0054] Preferably, a through hole 123b can be formed between the connecting tab 123 and the carrier strip 101 so as to include a V-shaped groove 123a, and the connecting tabs 123 can be configured as a pair on the left and right with the through hole 123b at the center. On the other hand, when the connecting tab 123 and the carrier strip 101 are separated, the connecting tabs 123 that ultimately protrude can be configured as a pair on the left and right with the concave through hole 123b at the center.

[0055] Preferably, the body 110 and the head 120 have recesses at both corners where they meet. Department 112 can be formed, and such a concave shape Department 112, the second strip section 122b is rolled in a semicircular arc shape to facilitate processing of the head.

[0056] The contact pin 100 configured in this manner can be configured as a pair of contact pins or combined with a different type of contact pin to form a pair and used as a spring contact, and can be manufactured to a length of approximately 1.0 mm or less, while maximizing the maximum compression distance (full stroke) of the spring contact.

[0057] 5(a), (b), and (c) are diagrams showing a process for manufacturing a spring contact using contact pins according to the first embodiment of the present invention, where (a) shows the state before assembly, (b) is a cross-sectional view taken along line DD in (a), and (c) is a view showing the state after assembly. The diagram shows a process for manufacturing a spring contact by assembling a pair of contact pins 100 according to the previous embodiment. In the following description, the reference numerals for each component are the same as those in the previous embodiment, and the first contact pin 100U and the second contact pin 100D will be distinguished by adding "U" and "D" to the end of the reference numerals, respectively.

[0058] Referring to Figures 5(a) to 5(c), in the pre-assembly step of the spring contact 200, the first contact pin 100U and the second contact pin 100D are connected to the first carrier strip 101U and the second carrier strip 101D, respectively, and the first head 120U and the second head 120D are rolled into a cylindrical shape.

[0059] Next, the first contact pin 100U and the second contact pin 100D are arranged so as to intersect at right angles to each other, and the first leg portion 130U and the second leg portion 130D are inserted inside the coil spring 140 with the coil spring 140 sandwiched therebetween, for assembly.

[0060] Reference symbol L1 denotes the natural length of the coil spring 140 in an uncompressed state.

[0061] After the assembly of the first contact pin 100U and the second contact pin 100D is completed, the carrier strips 101U and 101D of the contact pins 100U and 100D are removed.

[0062] The spring contact 200 manufactured in this manner has a total length H1 which is the sum of the height H2×2 of the two heads in an uncompressed state and the height L2 of the coil spring 140 after assembly.

[0063] 6(a), 6(b), 6(c), and 6(d) are diagrams each showing a simplified process of manufacturing a spring contact without a coil spring using a contact pin according to the first embodiment of the present invention.

[0064] 6(a) to 6(d), the first contact pin 100U and the second contact pin 100D have the same height C1, and when the first leg portion 130U and the second leg portion 130D are fitted together by intersecting each other at a right angle, the first hook protrusion 131U is assembled along the second groove 111U of the second contact pin 100D, and similarly, the second hook protrusion 131D is assembled along the first groove 111D of the first contact pin 100U. Meanwhile, as the first contact pin 100U and the second contact pin 100D move up and down, the hook protrusions 131U and 131D come into contact with the bottom surfaces of the corresponding grooves 111U and 111D into which they are inserted, and the first contact pin 100U and the second contact pin 100D are electrically connected.

[0065] Fig. 6(d) shows the spring contacts at the maximum compression distance S1 of the first contact pin 100U and the second contact pin 100D. As shown in Fig. 6(d), the upper ends of the grooves 111 (see Fig. 3(b)) of the first contact pin 100U and the second contact pin 100D are open, and the maximum compression distance S1 during the compression process of the contact pins 100U and 100D is such that the second lower pointed end 132D of the second contact pin 100D can be compressed to the position of the first upper pointed end 121U of the first contact pin 100U, and similarly, the first lower pointed end 132U of the first contact pin 100U can be compressed to the position of the second upper pointed end 121D of the second contact pin 100D.

[0066] The length (height) HC1 of the spring contact at the maximum compressed distance S1 is calculated by subtracting the maximum compressed distance S1 from the length H1 of the spring contact in the uncompressed state.

[0067] 7(a) to (e) are diagrams showing a spring contact according to a first embodiment of the present invention, where (a) is a front view of the spring contact 200, (b) and (c) are plan views of the spring contact 200 as seen from the top and bottom, respectively, and (d) and (e) show a comparison of the uncompressed state and the maximum compressed state of the spring contact 200, respectively.

[0068] By configuring the total length H1 of the spring contact 200 in an uncompressed state to be the sum of the assembled length L2 of the coil spring 140 and the total length H2 x 2 of the first head 120U and the second head 120D, it is possible to obtain the maximum compression distance S1 while minimizing the overall length (height) of the spring contact 200.

[0069] To minimize the overall length H1 of the spring contact 200, the length H2 of the first head 120U and the second head 120D can be shortened, for example, if the overall length H1 of the spring contact is made to be approximately 1.0 mm, the length H2 of each head can be approximately 0.15 mm. Preferably, the natural length L1 of the coil spring 140 is greater than or at least equal to the length L2 of the coil spring 140 after the spring contact is assembled (in an uncompressed state).

[0070] Such spring contacts 200 can be manufactured to approximately 1.0 mm or less, which allows for a significantly shorter contact length compared to conventional techniques, while still allowing for a longer maximum compression distance S1. The inventors have confirmed that the spring contacts of this embodiment can be manufactured with an initial length of 1.0 mm, allowing for compression to a maximum compression distance S1 of approximately 0.25 mm to 0.3 mm, and that an elastic force of approximately 15 gf to 30 gf / pin can be achieved.

[0071] A spring contact having such characteristics is highly useful for testing devices, particularly high-speed signals, and can extend the service life of the spring contact.

[0072] FIG. 8 is a front view of the contact pin according to the second embodiment of the present invention, and FIGS. 9(a) and 9(b) are a plan view and a cross-sectional view taken along line EE of the contact pin in FIG. 8, respectively.

[0073] 8 to 9(b), the contact pin 300 of this embodiment has a plate-like structure with a predetermined length C2, width w4, and thickness t5, and includes a body portion 310 having a groove 311 recessed in the longitudinal direction on each side thereof, shoulder portions 320 protruding from the left and right ends of the body portion 310, a head portion 330 having an upper pointed end 331 protruding upward and formed integrally with the upper end of the leg portion 310, and a pair of legs 340 extending symmetrically from the lower end of the body portion 310.

[0074] The body 310 has grooves 311 on both sides, recessed along the central axis in the lengthwise direction with a constant width w5 and depth, the upper end of which passes through the head 330 and opens to the upper end, while the lower end of the groove has a stepped locking step 311a. The body 310 has a constant overall thickness t5, and the section of the body 310 where the grooves 311 are formed is recessed, and its thickness t6 is even smaller (t6 <t5)。

[0075] The body 310 has a pair of protruding shoulders 320 extending from the left and right ends, which serve to support the coil spring. Preferably, each shoulder 320 is connected to the carrier strip 301 during sheet metal processing, and the carrier strip 301 is removed after the final assembly with the coil spring, as in the previous embodiment. A V-shaped groove 321 is formed between the shoulders 320 and the carrier strip 301 in the thickness direction, allowing the carrier strip 301 and the contact pin 300 to be easily separated after the assembly process is completed.

[0076] The head 330 is provided with an upper tip 331 protruding upward and is integrally formed at the upper end of the body portion 310. Preferably, the thickness t7 of the tip of the upper tip 331 is smaller than the thickness t6 of the concave groove 311 section of the body portion 310 (t7 < t6). By embossing the upper tip of the head 330, the thickness t7 of the upper tip 331 can be thinned, thereby enhancing the contact reliability with the terminal.

[0077] On the other hand, in this embodiment, although one tip protruding sharply upward is exemplified at the upper tip of the head 330, the upper tip can be composed of a plurality of tips.

[0078] The legs 340 are configured as a pair symmetrically on the left and right, separated from the lower end of the body portion 310 by a certain width w6. The lower ends of each leg 340 include a lower tip 342 at the lower tip together with hook protrusions 341 that protrude inward and face each other with a certain width w7 (w7 < w6).

[0079] Preferably, the width w6 between the two legs 340 is larger than the thickness t5 of the body portion 340. Therefore, when two contact pins are combined and used as a spring contact, the sliding friction between the two contact pins can be minimized.

[0080] Preferably, the thickness t8 of the hook protrusion 341 is smaller than the thickness t5 of the body portion 310. More preferably, the thickness t9 of the lower tip 342 is even smaller than the thickness t8 of the hook protrusion 341 (t9 < t8 < t5). By embossing the lower tip of the hook protrusion 341, the thickness t9 of the lower tip 342 can be thinned, thereby enhancing the contact reliability with the terminal.

[0081] Also, the width w7 between the hook protrusions 341 of each leg 340 is smaller than the thickness t5 of the body portion 340 and is the same as or larger than the thickness t6 of the concave groove 311 formation section of the body portion 310 (t6 ≦ w7 < t5).

[0082] Preferably, the length C22 of the leg portion 340 including the side tip 342 is at least equal to or even longer than the length C21 from the upper tip 331 to the lower end of the body portion 310 (C21≦C22).

[0083] The contact pin 300 of this embodiment configured in this manner can be used as a spring contact in combination with the previous embodiment.

[0084] FIG. 10 is a front view of a spring contact according to a second embodiment of the present invention, and FIG. 11 is a cross-sectional view of the present invention taken along line FF in FIG.

[0085] 10 and 11, the spring contact 400 of this embodiment is a spring contact that combines the above-mentioned contact pins, and includes a first contact pin 100 having a cylindrical first head 120, a second contact pin 300 having a plate-shaped second head 330, and a coil spring 410 that elastically supports the first contact pin 100 and the second contact pin 300.

[0086] The first contact pin 100 is the same as the contact pin of the first embodiment, and the second contact pin 300 is the same as the contact of the second embodiment. The coil spring 410 is supported between the first head 120 of the first contact pin 100 and the shoulder 320 of the second contact pin 300, and elastically supports the first contact pin 100 and the second contact pin 300.

[0087] The length C1 of the first contact pin 100 and the length C2 of the second contact pin 300 are equal to each other (C1=C2), and the spring contact 400 having this structure can obtain the maximum compression distance while minimizing the overall length (height) H3 of the spring contact 400, as described in the previous embodiment (see FIG. 7). For reference, the length H4 of the second contact pin 300, which corresponds to the first head 120 of the first contact pin 100 and determines the overall length H3 of the spring contact 400, corresponds to the length from the upper pointed end 331 to the lower end of the shoulder 320.

[0088] FIG. 12 is a front view of a spring contact according to a third embodiment of the present invention, and FIG. 13 is a cross-sectional view of the present invention taken along line GG in FIG.

[0089] 12 and 13, the spring contact 500 of this embodiment is another modified example of the spring contact of the second embodiment, and includes a first contact pin 100 having a cylindrical first head portion 120, a second contact pin 510 having a plate-shaped second head portion 530, and a coil spring 520 that elastically supports the first contact pin 100 and the second contact pin 510.

[0090] Such a spring contact 500 is substantially the same as that of the second embodiment, except that the second contact pin 510 includes a head 530 having a pair of symmetrical upper pointed ends 531. The number and shape of the upper pointed ends 531 formed integrally with the head 530 of the second contact pin 510 can be modified in various ways to improve contact with the terminal.

[0091] Fig. 14 is a plan view of a socket device according to an embodiment of the present invention, Figs. 15 and 16 are cross-sectional views taken along line HH in Fig. 14, and Fig. 16 shows the socket device with a semiconductor element seated in it. For reference, in the following description, the spring contact 200 will be described as the spring contact of the first embodiment described above, but is not limited to this.

[0092] 14 and 15, the socket device 600 of this embodiment includes a flexible socket body 610 having receiving holes 611 through which the spring contacts 200 are received, a mounting plate 620 fixed to the socket body 610 and having mounting guide holes 621 for fixed position mounting, a flexible upper film plate 630 having a first through hole 631 corresponding to the receiving hole 611 and attached to the upper surface of the socket body 610, and a lower film plate 640 attached to the underside of the mounting plate 620 and having a second through hole 641 and a third through hole 642 corresponding to the receiving hole 611 and the mounting guide hole 621, respectively.

[0093] The socket body 610 has a plurality of receiving holes 611 for receiving the spring contacts 200 arranged corresponding to the terminals of the semiconductor device, and may be made of a stretchable material that is easily elastically deformed in the vertical direction. The socket body 610 may be made of, but is not limited to, electrically insulating stretchable silicone.

[0094] The mounting plate 620 fixes the socket body 610, and has at least one mounting guide hole 621 formed therein for mounting the socket in a fixed position, and may further have a first mounting hole 622 formed therein for mounting.

[0095] The upper film plate 630 has a first through hole 631 corresponding to the receiving hole 611, is attached to the upper surface of the socket body 610, and serves to hold the spring contact in place. The upper film plate 630 is made of an electrically insulating and elastic material.

[0096] The lower film plate 640 has a second through hole 641 and a third through hole 642 corresponding to the receiving hole 611 and the mounting guide hole 621, respectively, and is attached to the lower surface of the mounting plate 620. When the first mounting hole 622 is added to the mounting plate 620, the lower film plate 640 may have a second mounting hole 643 drilled therein corresponding to the first mounting hole 622.

[0097] Preferably, the connector further includes a first silicone caulking portion 651 that is inserted into the upper opening of the receiving hole 611 to secure the upper ends of the spring contacts. The first silicone caulking portion 651 secures the spring contacts 200 housed in the receiving hole 611 so that they do not slip out, and may be made of elastic silicone rubber. Furthermore, a second silicone caulking portion 652 is added to the lower opening of the receiving hole 611, so that the lower ends of the spring contacts 200 can be secured together.

[0098] Preferably, an upper guide plate 660 may be further provided on the upper surface of the upper film plate 630. The upper guide plate 660 has a size larger than that of the receiving hole 611 and has guide holes 661 formed therein corresponding to the receiving hole 611 to guide the position of the ball terminals of the semiconductor device during loading of the semiconductor device. The upper guide plate 660 may be made of an elastic, electrically insulating material.

[0099] Preferably, a lower guide plate 670 may be further provided on the lower surface of the lower film plate 640, and the lower guide plate 670 has a size larger than the receiving holes 611, and flow holes 671 are formed in the lower guide plate 670 corresponding to each receiving hole 611. The lower guide plate 670 provides a space for the socket body 610 and the lower film plate 640 to flexibly collapse downward, thereby allowing the spring contacts 200 to be compressed downward more effectively.

[0100] 16, when the semiconductor device 10 is seated in the socket device 600 and each ball terminal 11 is positioned in each guide hole of the upper guide plate 660, and the semiconductor device 10 is pushed by a pusher (not shown), the ball terminals 11 come into contact with the spring contacts 200, compressing the spring contacts 200 downward. At this time, the spring contacts 200 can be compressed up to a maximum compression distance S1.

[0101] Although the present invention has been described above using limited embodiments and drawings, the present invention is not limited thereto, and it goes without saying that various modifications and variations can be made by a person having ordinary knowledge in the technical field to which the present invention pertains within the technical spirit of the present invention and the equivalent scope of the following claims. [Explanation of symbols]

[0102] 100, 300 contact pins 200, 400, 500 spring contact 110 Body 111 Groove 120 Head 121 Upper tip 123 Connecting Tap 130 Legs 131 Hook protrusion 132 Lower tip 140, 410, 520 coil spring 600 Socket Device 610 Socket body 611 Receptor hole 620 Mounting Plate 630 Upper Film Plate 640 Lower Film Plate 651, 652 Silicone caulking part 660 Upper guide plate 670 Lower guide plate

Claims

1. The device includes a plate-shaped (t<w) body portion having a width (w) and a thickness (t), a head portion integrally formed at the upper end of the body portion, and a leg portion integrally extending from the lower end of the body portion, The head portion is a plate-like strip that has the same length on both sides relative to the center of the body portion at the upper end of the body portion and has an upper pointed end formed along the upper tip, and the strip includes a first strip section that is located on the same plane as the body portion and has the same distance on both sides from the center of the body portion, and a second strip section that is rolled from both ends of the first strip section and has a semicircular arc shape, so that the first strip section is located in the radial direction of a cylinder formed by the entire second strip section, a contact pin for a spring contact, the contact pin having a body portion having a groove recessed in the lengthwise direction at the center of each of the two faces, a locking step having a step formed at the lower end of the groove, an upper end of the groove extending to the upper end of the first strip section and formed open, the contact pin comprising a pair of legs extending symmetrically from the body portion across a first width (w1), and including hook protrusions protruding inward from each end and sandwiching a second width (w2) smaller than the first width (w1), and a lower pointed end protruding from a lower tip.

2. 2. The contact pin for a spring contact according to claim 1, wherein the thickness (t1) of the tip of the upper pointed portion is smaller than the thickness (t) of the strip of the head portion (t1<t).

3. 2. The contact pin for a spring contact according to claim 1, wherein recesses are formed inward at both corners where the body and head meet.

4. 2. The contact pin for a spring contact according to claim 1, wherein each edge in the thickness direction of the lower end of the body portion adjacent to the leg portions is formed with a chamfered inclined surface having an inclination.

5. 2. The contact pin for a spring contact according to claim 1, wherein the hook projection has an inclined surface in the opening direction.

6. 2. The contact pin for a spring contact according to claim 1, wherein the thickness (t3) of the hook protrusion is smaller than the thickness (t) of the body portion.

7. 2. The contact pin for a spring contact according to claim 1, wherein the lower pointed end is thinner than the hook projection.

8. 2. The contact pin for a spring contact according to claim 1, wherein the first width (w1) between the legs is greater than the thickness of the body.

9. 2. The contact pin for a spring contact according to claim 1, wherein the second width (w2) between the hook protrusions is smaller than the thickness (t) of the body portion and is equal to or larger than the thickness (t2) of the section in which the groove is formed.

10. 2. The contact pin for a spring contact as set forth in claim 1, further comprising a connecting tab protruding from an upper end of the first strip section to a position lower than the upper pointed end.

11. The contact pin for a spring contact according to claim 10, wherein the connecting taps are formed with a pair of left and right through-holes formed therein and centered on the through-hole.

12. A spring contact including the contact pin according to any one of claims 1 to 11 as a pair of first and second contact pins, A spring contact including a coil spring, the legs of which intersect perpendicularly with each other, supported by the heads of the first contact pin and the second contact pin, and elastically supporting the first contact pin and the second contact pin.

13. 13. The spring contact according to claim 12, wherein the overall length of the spring contact is equal to the sum of the lengths of the heads of the first and second contact pins and the length of the coil spring.

14. 13. The spring contact according to claim 12, wherein the first contact pin and the second contact pin have the same length.

15. A spring contact including the contact pin according to any one of claims 1 to 11 as a first contact pin, a coil spring having one end supported by the head of the first contact pin; a second contact pin that is elastically supported via the coil spring and perpendicularly intersects with the first contact pin, the second contact pin includes a plate-like second body portion having a width and a thickness; a pair of shoulder portions protruding from left and right ends of the second body portion and supporting one end of the coil spring; a second head portion having a second upper pointed end protruding upward and integrally formed on the same plane as the upper end of the second body portion; and a second leg portion extending integrally from the lower end of the second body portion and assembled to cross the leg portion of the first contact pin, the second body portion has a second groove recessed in the lengthwise direction at the center of each of both surfaces, a second locking step having a step formed at a lower end of the second groove, and an upper end of the second groove extending to an upper end of the second head portion and being open; The second leg portion is a spring contact that is formed as a pair extending symmetrically from the second body portion across a first width (w1), and includes a second hook protrusion that protrudes inward from each end and defines a second width (w2) smaller than the first width (w1), and a second lower pointed end that protrudes from a lower tip.

16. 16. The spring contact according to claim 15, wherein the total length of the spring contact is equal to the sum of the length of the head of the first contact pin, the length from the second upper pointed end to the lower end of the shoulder, and the length of the coil spring.

17. 16. The spring contact according to claim 15, wherein the first contact pin and the second contact pin have the same length.

18. A test socket device including the spring contact of claim 12, a retractable socket body portion having receiving holes through which the spring contacts are received; a mounting plate fixed to the socket body and having a mounting guide hole for fixed position mounting; an upper film plate having a first through hole corresponding to the receiving hole and having flexibility and attached to an upper surface of the socket body; a lower film plate attached to the underside of the mounting plate, the lower film plate having a second through hole and a third through hole corresponding to the receiving hole and the mounting guide hole, respectively.

19. 20. The semiconductor device test socket apparatus according to claim 18, wherein the mounting plate and the lower film plate are further provided with mounting holes drilled for mounting.

20. 20. The semiconductor device test socket apparatus of claim 18, further comprising a silicone caulking portion inserted into an upper open end of the receiving hole and fixing an upper end of the spring contact.

21. 20. The semiconductor element test socket device of claim 18, further comprising an upper guide plate having a size larger than the receiving hole, a guide hole corresponding to the receiving hole, and an upper guide plate provided on the upper surface of the upper film plate.

22. 20. The semiconductor element test socket device of claim 18, further comprising a lower guide plate having a size larger than the receiving hole, a flow hole corresponding to the receiving hole, and disposed on the lower surface of the lower film plate.

Images