CAN-type optical module

Abstract

A conductive carrier (7) is provided on the temperature control module (5). A submount (9) is provided on the side of the carrier (7). An optical semiconductor element (10) is mounted on the surface of the submount (9). A signal line (11a) is provided on the surface of the submount (9) and connects the lead pin (2a) to the optical semiconductor element (10). Ground conductors (11b) are provided on both sides of the signal line (11a) on the surface of the submount (9) and are connected to the carrier (7). A conductive coaxial block (4) surrounds the protruding portion of the lead pin (2a) protruding from the top surface of the metal stem (1) and is bonded to the top surface of the metal stem (1). A conductive post (8) is provided between the coaxial block (4) and the carrier (7) and is bonded to the top surface of the metal stem (1). A connecting member (6a) directly connects the post (8) to the carrier (7). The coaxial block (4) and the post (8) are integrated.

Description

[Technical Field]

[0001] The present disclosure relates to a CAN-type optical module. [Background technology]

[0002] A CAN-type optical module has been proposed in which a temperature control module is placed flat on a metal stem, a carrier is mounted on the temperature control module, and an optical semiconductor element is mounted on the side of the carrier (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2010 / 140473 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional CAN-type optical modules use a bridge board to supply signals from the lead pins that pass through the metal stem to the optical semiconductor element. Impedance mismatches occur at each connection point in this supply path. There is also line loss in the bridge board itself. In addition, the carrier mounted on the temperature control module is separated from the metal stem, which is at ground potential, and is connected via a wire. This causes resonance in the high-frequency characteristics, resulting in unstable gain behavior. This has resulted in problems such as impeding broadbandization and causing a drop in gain. In recent years, there has been a demand for broadbandization due to the increasing volume of communication traffic.

[0005] The present disclosure has been made to solve the above-mentioned problems, and its purpose is to obtain a CAN-type optical module that can achieve a wider bandwidth and prevent a drop in gain. [Means for solving the problem]

[0006] The CAN-type optical module according to the present disclosure comprises a metal stem, lead pins penetrating the metal stem, a temperature control module provided on the upper surface of the metal stem, a conductive carrier provided on the temperature control module, a submount provided on a side of the carrier, an optical semiconductor element mounted on the surface of the submount, a signal line provided on the surface of the submount and connecting the lead pins to the optical semiconductor element, ground conductors provided on both sides of the signal line on the surface of the submount and connected to the carrier, a conductive coaxial block surrounding a protruding portion of the lead pin protruding from the upper surface of the metal stem and joined to the upper surface of the metal stem, a conductive post provided between the coaxial block and the carrier and joined to the upper surface of the metal stem, and a connecting member directly connecting the post and the carrier, wherein the coaxial block and the post are integrated. [Effects of the Invention]

[0007] In this disclosure, a conductive coaxial block surrounds the protruding portion of the lead pin protruding from the top surface of the metal stem. This maintains impedance up to just before the submount, shortening the signal path to the optical semiconductor element and reducing loss. Furthermore, the coaxial block and post are integrated and joined to the metal stem, acting as a large AC ground. A connecting member directly connects the post and carrier. Therefore, even if the carrier and metal stem are separated by a temperature control module, a stable reference potential can be applied to the carrier. The ground conductor connected to the carrier also acts as an AC ground. This strengthens the ground, preventing resonance, achieving a wide bandwidth, and preventing gain drops. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing the front side of a CAN-type optical module according to a first embodiment. [Figure 2]1 is a perspective view showing the rear side of a CAN-type optical module according to a first embodiment. [Figure 3] FIG. 2 is a top view of the submount. [Figure 4] FIG. 2 is a side view of the submount. [Figure 5] FIG. 2 is a bottom view of the submount. [Figure 6] 1 is a perspective view showing the front side of a first modified example of the CAN-type optical module according to the first embodiment. [Figure 7] 10 is a perspective view showing the rear side of a first modified example of the CAN-type optical module according to the first embodiment. FIG. [Figure 8] FIG. 10 is a perspective view showing the front side of a second modified example of the CAN-type optical module according to the first embodiment. [Figure 9] FIG. 10 is a perspective view showing the front side of a third modified example of the CAN-type optical module according to the first embodiment. [Figure 10] FIG. 10 is a perspective view showing the front side of a fourth modified example of the CAN-type optical module according to the first embodiment. [Figure 11] FIG. 10 is a perspective view showing the front side of a CAN-type optical module according to a second embodiment. [Figure 12] FIG. 12 is an enlarged perspective view of the coaxial block of FIG. 11. [Figure 13] FIG. 11 is a perspective view showing the front side of a CAN-type optical module according to a third embodiment. [Figure 14] FIG. 11 is a perspective view showing the rear side of the CAN-type optical module according to the third embodiment. [Figure 15] FIG. 10 is a perspective view showing the front side of a CAN-type optical module according to a fourth embodiment. [Figure 16] FIG. 10 is a perspective view showing the rear side of the CAN-type optical module according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] A CAN-type optical module according to an embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 Fig. 1 is a perspective view showing the front side of the CAN-type optical module according to the first embodiment. Fig. 2 is a perspective view showing the rear side of the CAN-type optical module according to the first embodiment. Lead pins 2a to 2e penetrate vertically through a metal stem 1. The lead pins 2a to 2e are fixed to the metal stem 1 via a glass material 3. The metal stem 1 and the lead pins 2a to 2e are made of a metal such as copper, iron, aluminum, or stainless steel, and their surfaces may be plated with gold or nickel.

[0011] A conductive coaxial block 4 surrounds the protruding portion of the signal lead pin 2a protruding from the top surface of the metal stem 1 and is bonded to the top surface of the metal stem 1. The gap between the lead pin 2a and the coaxial block 4 is also sealed with glass material 3. Note that the gap between the lead pin 2a and the coaxial block 4 may be an air gap rather than being glass sealed. The coaxial block 4 is cylindrical, but it may also be a square prism, and the shape of the coaxial block 4 is not important.

[0012] A temperature control module 5 is provided on the upper surface of the metal stem 1. The temperature control module 5 is a thermoelectric cooler (TEC) having a Peltier element 5c sandwiched between a heat dissipation surface 5a and a cooling surface 5b. The heat dissipation surface 5a of the temperature control module 5 is joined to the upper surface of the metal stem 1. Lead pins 2b to 2e are arranged along the periphery of the temperature control module 5. The anode and cathode electrodes of the temperature control module 5 are connected by wire to the lead pins 2b and 2c for supplying current, respectively.

[0013] A conductive carrier 7 is provided on the temperature control module 5. The carrier 7 is bonded to the cooling surface 5b of the temperature control module 5 with a conductive bonding material such as solder. A conductive post 8 is provided between the coaxial block 4 and the carrier 7, and is bonded to the upper surface of the metal stem 1 with a conductive bonding material such as solder. A plurality of wires 6a directly connect the post 8 to the carrier 7. Note that instead of the wires 6a, the post 8 and the carrier 7 may be directly connected with a connecting member such as solder.

[0014] The coaxial block 4 and the post 8 are integrated together. This integrated assembly is joined to the upper surface of the metal stem 1 with a conductive adhesive such as solder. The post 8 and the carrier 7 are made of a metal such as copper, iron, aluminum, or stainless steel.

[0015] A submount 9 is provided on the side of the carrier 7. The submount 9 is made of a ceramic such as alumina. An optical semiconductor element 10 is mounted on the surface of the submount 9. The optical semiconductor element 10 is an electro-absorption modulator integrated laser diode (EML) in which a distributed feedback laser diode and an electro-absorption optical modulator are monolithically integrated.

[0016] FIG. 3 is a top view of the submount. FIG. 4 is a side view of the submount. FIG. 5 is a bottom view of the submount. A signal line 11a is provided on the surface of the submount 9. Ground conductors 11b are provided on both sides of the signal line 11a on the surface of the submount 9, spaced a certain distance apart. The signal line 11a and the ground conductor 11b form a grounded coplanar line. The ground conductor 11b extends below the optical semiconductor device 10 on the surface of the submount 9. The ground conductor 11b is provided continuously on the surface, side, and back of the submount 9. Therefore, the ground conductor 11b on the back of the submount 9 is connected to the ground conductor 11b on the front of the submount 9 via the ground conductor 11b on the side of the submount 9. Alternatively, a through hole 12 may be formed penetrating the submount 9, and the ground conductor 11b on the back of the submount 9 may be connected to the ground conductor 11b on the front of the submount 9 via the through hole 12. Conductors 11c, 11d, and 11e are also provided on the surface of the submount 9. Conductor 11d and conductor 11e are connected by resistor 11f.

[0017] The back electrode of the optical semiconductor element 10 is joined to the ground conductor 11b with a conductive adhesive such as solder. One end of the signal line 11a is connected to the lead pin 2a with a wire 6b. The other end of the signal line 11a is connected to the modulator pad 10a of the optical semiconductor element 10 with a wire 6c. The ground conductor 11b on the front surface of the submount 9 is connected to the coaxial block 4 or the post 8 with a wire 6d. The ground conductor 11b and the coaxial block 4 may be joined with a conductive adhesive such as solder. The ground conductor 11b provided on the entire back surface of the submount 9 is joined to the carrier 7 with a conductive adhesive such as solder.

[0018] When an electrical signal is input to lead pin 2a, it is transmitted to signal line 11a via wire 6b and then applied to modulator pad 10a of optical semiconductor device 10 via wire 6c. At this time, the electrical signal input to lead pin 2a is electromagnetically coupled to metal stem 1, so metal stem 1 acts as an AC ground. Coaxial block 4 and post 8 connected to metal stem 1 also act as AC ground. Wire 6a directly connects post 8 to carrier 7, so ground conductor 11b connected to carrier 7 also acts as an AC ground.

[0019] The conductor 11c on the surface of the submount 9 is wire-connected to the pad 10b for the laser portion of the optical semiconductor element 10. The conductor 11d is wire-connected to the pad 10a for the modulator of the optical semiconductor element 10.

[0020] Capacitors 12a and 12b are mounted on the side of the carrier 7. The bottom electrodes of capacitors 12a and 12b are joined to the carrier 7 with a conductive joining material such as solder. The surface electrode of capacitor 12a is wire-connected to conductor 11c and also to lead pin 2d. The surface electrode of capacitor 12b is wire-connected to conductor 11e. Capacitor 12a serves as a bypass capacitor. Capacitor 12b is provided to reduce power consumption. Note that capacitor 12b may be omitted and modulator pad 10a may be DC-coupled to carrier 7.

[0021] Thermistor 13 is provided on the back side of carrier 7. The bottom electrode of thermistor 13 is joined to carrier 7 with a conductive bonding material such as solder. The top electrode of thermistor 13 is connected to lead pin 2e by wire. Thermistor 13 measures the temperature of carrier 7, thereby measuring the temperature of optical semiconductor element 10.

[0022] As described above, in this embodiment, the conductive coaxial block 4 surrounds the protruding portion of the lead pin 2a protruding from the upper surface of the metal stem 1. This maintains impedance up to just before the submount 9, shortening the signal path to the optical semiconductor element 10 and reducing loss.

[0023] Furthermore, the coaxial block 4 and post 8 are integrated and joined to the metal stem 1, acting as a large AC ground. The wire 6a directly connects the post 8 to the carrier 7. Therefore, even if the carrier 7 and metal stem 1 are separated by the temperature control module 5, a stable reference potential can be applied to the carrier 7. The ground conductor 11b connected to the carrier 7 also acts as an AC ground. This strengthens the ground, preventing resonance, achieving a wider bandwidth, and preventing a drop in gain. As a result, high-frequency characteristics are improved.

[0024] Furthermore, because there is a space limit for the posts 8 alone, there is a limit to the number of wires 6a that can be inserted to connect the posts 8 to the carrier 7 in order to strengthen the ground. Therefore, by integrating the coaxial block 4 and the posts 8, it is possible to ensure space for inserting the wires 6a. This alleviates assembly restrictions such as the size of the capillary of the bonding device and the number of wires 6a.

[0025] Furthermore, by integrating the coaxial block 4 and the post 8, they can be joined to the metal stem 1 at one time, thereby reducing manufacturing costs. The coaxial block 4 and the post 8 may also be integrated with the metal stem 1, in which case they are manufactured by die molding, cutting, or the like.

[0026] FIG. 6 is a perspective view showing the front side of the CAN-type optical module according to the first embodiment. FIG. 7 is a perspective view showing the rear side of the CAN-type optical module according to the first embodiment. The posts 8 extend to the rear side of the carrier 7, which is opposite to the front side of the carrier 7 on which the submount 9 is provided. As a result, the structure in which the coaxial block 4 and the posts 8 are integrated extends from the side to the rear side of the carrier 7 and is L-shaped in plan view. Note that the posts 8 may extend to the opposite side of the carrier 7, and the structure in which the coaxial block 4 and the posts 8 are integrated may be U-shaped in plan view. The posts 8 and the rear side of the carrier 7 are connected by a plurality of wires 6a. Extending the posts 8 to the rear side of the carrier 7 in this way makes it easier to connect them with wires or solder, thereby further strengthening the ground.

[0027] 8 is a perspective view showing the front side of a second modification of the CAN-type optical module according to the first embodiment. The modulator pad 10a of the optical semiconductor element 10 and the lead pin 2a are connected by a signal wiring 15a on the flexible substrate 14 instead of the signal line 11a. The signal wiring 15a and the pad 10a are connected by a through-hole that penetrates the flexible substrate 14. The signal wiring 15a is joined to the lead pin 2a with solder 16a. This makes it possible to reduce impedance deviation compared to wire connection.

[0028] 9 is a perspective view showing the front side of a third variation of the CAN-type optical module according to the first embodiment. The modulator pad 10a of the optical semiconductor element 10 and the lead pin 2a are connected by a signal wiring 15a on a dielectric substrate 17 instead of a signal line 11a. The dielectric substrate 17 is made of, for example, aluminum nitride, which has a high dielectric constant, or quartz, which has a low dielectric constant. The signal wiring 15a is joined to the lead pin 2a by solder 16a. This allows for a smaller impedance deviation than with wire connection.

[0029] 10 is a perspective view showing the front side of a fourth variation of the CAN-type optical module according to the first embodiment. The submount 9 extends above the lead pins 2a. The signal line 11a is joined to the lead pins 2a with solder 16a. This reduces the impedance deviation compared to wire connection. The signal line 11a and the lead pins 2a may also be connected by a wire, a flexible substrate, a dielectric substrate, or the like.

[0030] Embodiment 2 FIG. 11 is a perspective view showing the front side of a CAN-type optical module according to the second embodiment. FIG. 12 is an enlarged perspective view of the coaxial block of FIG. 11. The protruding portion of the lead pin 2a protruding from the upper surface of the metal stem 1 is bent toward the signal line 11a. The coaxial block 4 also surrounds the bent portion of the lead pin 2a. This makes the distance between the lead pin 2a and the modulator pad 10a of the optical semiconductor element 10 closer than in the first embodiment, further improving the high-frequency characteristics. Note that the bend in the protruding portion of the lead pin 2a does not have to be at a right angle. The other configurations and effects are the same as those of the first embodiment.

[0031] Embodiment 3 Fig. 13 is a perspective view showing the front side of the CAN-type optical module according to the third embodiment. Fig. 14 is a perspective view showing the rear side of the CAN-type optical module according to the third embodiment. The submount 9 extends up to above the lead pin 2a. The ground conductor 11b is joined to the metal stem 1 with solder 16b. The signal line 11a is joined to the lead pin 2a with solder 16a. This eliminates the need for wires between the submount 9 and the lead pin 2a, improving high-frequency characteristics.

[0032] The ground conductor 11b on the back surface of the submount 9 is joined to the carrier 7 and post 8 with a conductive bonding material such as solder. The post 8 is joined to the metal stem 1 with a conductive bonding material such as solder and acts as an AC ground. A wire 6a directly connects the post 8 to the carrier 7. This strengthens the ground, preventing resonance, achieving a wider bandwidth, and preventing a drop in gain. As a result, high-frequency characteristics are improved. The other configurations and effects are the same as those of the first embodiment.

[0033] Embodiment 4 FIG. 15 is a perspective view showing the front side of the CAN-type optical module according to the fourth embodiment. FIG. 16 is a perspective view showing the rear side of the CAN-type optical module according to the fourth embodiment. As in the other embodiments, a conductive post 8 is joined to the upper surface of the metal stem 1. A wire 6a directly connects the post 8 to the carrier 7. A ground conductor 11b is also formed on the back surface of the submount 9. The ground conductor 11b on the back surface of the submount 9 is connected to the ground conductor 11b on the front surface of the submount 9 and is joined to the carrier 7.

[0034] In this embodiment, a flexible substrate 14 is provided on the side of a post 8. A signal wiring 15a is provided on the surface of the flexible substrate 14. Ground wiring 15b is provided on both sides of the signal wiring 15a on the surface of the flexible substrate 14. Ground wiring 15b is also formed on the back surface of the flexible substrate 14. The ground wiring 15b on the back surface of the flexible substrate 14 is connected to the ground wiring 15b on the front surface of the flexible substrate 14 and is joined to the post 8. As a result, the ground wiring 15b of the flexible substrate 14 is connected to the post 8, which acts as an AC ground.

[0035] The signal line 11a and the signal wiring 15a are joined by solder 16c. The signal wiring 15a is joined to the lead pin 2a by solder 16a. Therefore, the signal wiring 15a connects the lead pin 2a and the signal line 11a. The ground conductor 11b and the ground wiring 15b are joined by solder 16d. The ground wiring 15b is joined to the metal stem 1 by solder 16b. This eliminates the need for wires between the lead pin 2a, the flexible substrate 14, and the submount 9, thereby improving high-frequency characteristics. Other configurations and effects are the same as those of the first embodiment. [Explanation of symbols]

[0036] 1 metal stem, 2a lead pin, 4 coaxial block, 5 temperature control module, 6a wire (connecting member), 7 carrier, 8 post, 9 submount, 10 optical semiconductor element, 11a signal line, 11b ground conductor, 12 through hole, 14 flexible substrate, 15a signal wiring, 15b ground wiring, 17 dielectric substrate

Claims

1. Metal stem and a lead pin that penetrates the metal stem; a temperature control module provided on the upper surface of the metal stem; a conductive carrier disposed on the temperature control module; a submount provided on a side surface of the carrier; an optical semiconductor element mounted on a surface of the submount; a signal line provided on a surface of the submount and connecting the lead pin and the optical semiconductor element; ground conductors provided on both sides of the signal line on the surface of the submount and connected to the carrier; a conductive coaxial block that surrounds the protruding portion of the lead pin protruding from the upper surface of the metal stem and is joined to the upper surface of the metal stem; a conductive post disposed between the coaxial block and the carrier and bonded to an upper surface of the metal stem; a connecting member that directly connects the post and the carrier; A CAN-type optical module, wherein the coaxial block and the post are integrated.

2. the ground conductor is also formed on the back surface of the submount; 2. The CAN-type optical module according to claim 1, wherein the ground conductor on the back surface of the submount is connected to the ground conductor on the front surface of the submount and is joined to the carrier.

3. the post extends to a rear side of the carrier opposite to a front side of the carrier on which the submount is provided, 3. The CAN-type optical module according to claim 1, wherein the connecting members are a plurality of wires connecting the posts and the carrier.

4. 3. The CAN-type optical module according to claim 1, wherein the signal line includes signal wiring on a flexible substrate.

5. 3. The CAN-type optical module according to claim 1, wherein the signal line has signal wiring on a dielectric substrate.

6. 5. The CAN-type optical module according to claim 4, wherein the signal wiring is joined to the lead pin.

7. 3. The CAN-type optical module according to claim 1, wherein the submount extends above the lead pins.

8. 8. The CAN type optical module according to claim 7, wherein the signal line is joined to the lead pin.

9. the protruding portion of the lead pin is bent toward the signal line, 3. The CAN-type optical module according to claim 1, wherein the coaxial block surrounds the bent portion of the lead pin.

10. 3. The CAN-type optical module according to claim 2, wherein the ground conductor is provided continuously on the front, side and rear surfaces of the submount.

11. 3. The CAN-type optical module according to claim 2, wherein the ground conductor on the back surface of the submount is connected to the ground conductor on the front surface of the submount via a through hole that penetrates the submount.

12. the ground conductor extends to below the optical semiconductor element on the surface of the submount, 3. The CAN-type optical module according to claim 1, wherein a back electrode of the optical semiconductor element is joined to the ground conductor.

Images