Substrate carrier with gas diffuser mounting structure

The integrated mounting structure for gas diffusers in substrate carriers addresses the issues of high assembly costs and interference by securely holding diffusers outside the robot arm's reach, simplifying assembly and reducing dust generation.

JP7746366B2Active Publication Date: 2025-09-30GUDENG PRECISION IND CO LTD
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Patent Information

Application Number
JP2023221339
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-03-17
Filing Date
2023-12-27
Publication Date
2025-09-30
Estimated Expiration
2043-12-27

AI Technical Summary

Technical Problem

Conventional substrate carriers with assembly-type tube clamps require numerous parts, leading to high assembly time and costs, are prone to falling, interfere with robot arms, generate dust due to large contact areas, and cause friction.

Method used

An integrated mounting structure with clamping arms and an abutment portion that securely holds gas diffusers outside the robot arm's range, reducing assembly time and costs, minimizing dust generation, and preventing interference.

Benefits of technology

The integrated mounting structure simplifies assembly, reduces dust, and prevents collisions by securely holding gas diffusers outside the robot arm's reach, enhancing stability and reducing friction-related dust accumulation.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a substrate carrier including a gas diffuser attachment structure.SOLUTION: The invention provides a substrate carrier including: a shell defining therein a wafer storage space; and at least one attachment structure integrally formed with an inner wall of the shell and adapted to hold at least one gas diffuser, allowing the at least one gas diffuser to be disposed outside a movable range of a front end of a robotic arm. A structure of attaching the substrate carrier to the gas diffuser is structurally simplified, and the gas diffuser is also prevented from interfering with the robotic arm.SELECTED DRAWING: Figure 3A
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Description

[Technical Field]

[0001] The present invention relates to substrate (wafer) carriers, particularly Front Opening Unified Pods (FOUPs), and more particularly to substrate carriers with gas diffuser mounting structures. [Background technology]

[0002] Currently, a conventional substrate carrier equipped with a gas diffuser includes a casing, in which a plurality of gas diffusers, a plurality of supports, and a plurality of assembled tube clamps are provided. The assembled tube clamps are removably assembled to the casing, and the gas diffusers are held within the casing via the assembled tube clamps. The casing defines a wafer storage space. By disposing a plurality of gas diffusers near the rear of the casing within the wafer storage space, gas can be uniformly diffused through the gas diffusers into the wafer storage space.

[0003] However, conventional assembly-type tube clamps for holding gas diffusers require too many parts, making assembly time and costs high. Furthermore, assembly-type tube clamps are prone to falling, and their placement can easily cause interference with a robot arm, potentially affecting the wafers stored inside. Furthermore, conventional assembly-type tube clamps have a large contact area with the gas diffuser, which can easily cause friction and generate a large amount of dust. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention has been made in consideration of the above circumstances, and provides an integrated mounting structure that simplifies the assembly process by fixing a gas diffuser to the inside of a housing, thereby reducing assembly man-hours and costs. Furthermore, dust generation is reduced by reducing the contact area between the clamping portion of the integrated mounting structure and the gas diffuser. [Means for solving the problem]

[0005] An object of the present invention is to provide a substrate carrier comprising a housing defining a wafer storage space, and at least one mounting structure integrally molded on an inner wall of the housing for holding at least one gas diffuser and positioning the at least one gas diffuser outside the range of motion of the tip of a robot arm.

[0006] In one specific embodiment, the mounting structure includes a first clamping arm, a second clamping arm, and an abutment portion, the first clamping arm and the second clamping arm clamp the gas diffuser, and the abutment portion abuts against the gas diffuser.

[0007] In one specific embodiment, the first clamping arm or the second clamping arm has elasticity.

[0008] In one specific embodiment, the first clamping arm or the second clamping arm further includes a support portion extending from the inner wall and a clamping portion extending from the support portion, and the thickness of the support portion is greater than the thickness of the clamping portion.

[0009] In one specific embodiment, the first clamping arm and the second clamping arm define an upper opening and a lower opening, the upper opening being smaller than the lower opening.

[0010] In one specific embodiment, an upper inner diameter defined by the first clamping arm and the second clamping arm is smaller than a lower inner diameter.

[0011] In one specific embodiment, the diameter of the gas diffuser is smaller than the lower inner diameter defined by the first clamping arm and the second clamping arm.

[0012] In one specific embodiment, the contact area between the first clamping arm and the second clamping arm and the gas diffuser is smaller than the contact area between the abutting portion and the gas diffuser.

[0013] In one specific embodiment, the cross section of the gas diffuser is circular, oval, or other shape.

[0014] In one specific embodiment, the first clamping arm, the second clamping arm, the abutment portion, and the gas diffuser define at least one drain opening.

[0015] Another object of the present invention is to provide a substrate carrier comprising a housing defining a wafer storage space and at least one mounting structure extending integrally from an inner wall of the housing and including first and second clamping arms for clamping at least one gas diffuser.

[0016] In one specific embodiment, the mounting structure further includes an abutment disposed between the first clamping arm and the second clamping arm.

[0017] In one specific embodiment, the contact area between the first clamping arm and the second clamping arm and the gas diffuser is smaller than the contact area between the abutting portion and the gas diffuser.

[0018] In one specific embodiment, the first clamping arm, the second clamping arm, and the gas diffuser define at least one drain opening.

[0019] In one specific embodiment, an upper inner diameter defined by the first clamping arm and the second clamping arm is smaller than a lower inner diameter.

[0020] In one specific embodiment, the diameter of the gas diffuser is smaller than the lower inner diameter defined by the first clamping arm and the second clamping arm.

[0021] In one specific embodiment, the upper ends of the first clamping arm and the second clamping arm directly contact the at least one gas diffuser, and there is a gap between the lower ends of the first clamping arm and the second clamping arm and the at least one gas diffuser.

[0022] In one specific embodiment, the first clamping arm or the second clamping arm further includes a support portion extending from the inner wall and a clamping portion extending from the support portion, and the mechanical strength of the support portion is greater than that of the clamping portion.

[0023] In one specific embodiment, the clamping portion has elasticity, and the thickness of the support portion is greater than that of the clamping portion.

[0024] In one specific embodiment, the mounting structure is provided outside the range of motion of the tip of the robot arm. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a front view schematically showing a substrate carrier equipped with a gas diffuser mounting structure according to a first embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional top view taken along line AA in FIG. [Figure 3A] 1 is an enlarged view of a mounting structure for a substrate carrier according to a first embodiment of the present invention. [Figure 3B] 1 is an enlarged three-dimensional view of a mounting structure for a substrate carrier according to a first embodiment of the present invention. [Figure 3C] 1 is a front view of a mounting structure for a substrate carrier according to a first embodiment of the present invention. [Figure 3D] 1 is a front view showing a state in which a gas diffuser is clamped by a mounting structure for a substrate carrier according to a first embodiment of the present invention. FIG. [Figure 4]FIG. 10 is an enlarged top view of a mounting structure for a substrate carrier according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] Referring to FIG. 1, a substrate carrier 100 including a gas diffuser mounting structure 11 according to a first embodiment of the present invention is shown. The substrate carrier 100 includes at least one mounting structure 11 and a housing 13. The housing 13 has an inner wall 132 and defines a wafer storage space 131. The mounting structure 11 is integrally molded on the rear inner wall 132 facing the front opening of the housing 13 and is used to hold at least one gas diffuser 31. The substrate carrier 100 of the present invention further includes a wafer support 17 and a chuck 19. The wafer support 17 is disposed within the wafer storage space 131 and is used to mount a wafer 41 thereon, as shown in FIG. 2.

[0027] 2, which is a cross-sectional view taken along line AA in FIG. 1. The mounting structure 11 extends integrally from the inner wall 132 of the housing 13 and is located outside the operating range 133 of the tip of the robot arm, so that when the gas diffuser 31 is attached to the substrate carrier 100, the gas diffuser 31 is located outside the operating range 133 of the tip of the robot arm and does not come into contact with the stored wafers 41, thereby reducing the risk of collision between the gas diffuser 31 and the robot arm.

[0028] 3A and 3B, the mounting structure 11 of the present invention includes a first clamping arm 111 and a second clamping arm 113 that extend integrally from an inner wall 132 of a housing 13. In this embodiment, the mounting structure 11 and the housing 13 are made of the same material. In another possible embodiment, a portion of the mounting structure 11 and the housing 13 are made of the same material, and another portion of the mounting structure 11 and the housing 13 are made of different materials. The mounting structure 11 holds or clamps the gas diffuser 31 via the first clamping arm 111 and the second clamping arm 113. The mounting structure 11 further includes an abutment 115 formed between the first clamping arm 111 and the second clamping arm 113 that abuts against the gas diffuser 31 to enhance the stability of the gas diffuser 31. Furthermore, the contact area between the abutting portion 115 and the gas diffuser 31 is smaller than the contact areas between the first clamping arm 111 and the gas diffuser 31 and the second clamping arm 113, respectively, thereby reducing the contact area between the mounting structure 11 and the gas diffuser 31. The contact surface of the abutting portion 115 is preferably a convex curved surface to prevent scratches on the gas diffuser 31.

[0029] In this embodiment of the present invention, the first clamping arm 111 further includes a first clamping portion 1111 and a first support portion 1113, and the second clamping arm 113 further includes a second clamping portion 1131 and a second support portion 1133. The first support portion 1113 and the second support portion 1133 each extend from the inner wall 132 and are each configured to have an appropriate thickness to provide clamping strength and stability. The first clamping portion 1111 extends from the first support portion 1113, and the second clamping portion 1131 extends from the second support portion 1133. The ends of the first clamping portion 1111 and the second clamping portion 1131 define openings, allowing the gas diffuser 31 to enter the installation space defined between the first clamping arm 111 and the second clamping arm 113, thereby bringing the first clamping portion 1111 and the second clamping portion 1131 into contact with the gas diffuser 31. The first clamping arm 111 and the second clamping arm 113 are elastic and can deform appropriately according to the contour of the gas diffuser 31 and the force received, facilitating the assembly of the gas diffuser 31. When the substrate carrier 100 is moved or used within a factory, the first clamping arm 111 and the second clamping arm 113 can absorb and reduce vibrations generated by the gas diffuser 31 when it is filled with air.

[0030] Furthermore, the mechanical strength of the first support portion 1113 is greater than that of the first clamping portion 1111, and the mechanical strength of the second support portion 1133 is greater than that of the second clamping portion 1131. By providing the first support portion 1113 or the second support portion 1133 with a high mechanical strength, deformation or breakage can be avoided. In other words, the first support portion 1113 and the second support portion 1133 have a stronger ability to resist deformation or bending than the first clamping portion 1111 and the second clamping portion 1131. In an embodiment of the present invention, as shown in FIG. 3A , the cross-sectional thickness 1113A of the first support portion 1113 is greater than the cross-sectional thickness 1111A of the first clamping portion 1111, and the cross-sectional thickness 1133A of the second support portion 1133 is greater than the cross-sectional thickness 1131A of the second clamping portion 1131.

[0031] When the gas diffuser 31 is attached to the substrate carrier 100, one end of the gas diffuser 31 is positioned at a coupling portion 135 at the bottom of the substrate carrier. For example, the coupling portion 135 is located at the bottom of the housing 13 and is a union for receiving the bottom of the gas diffuser 31, and the coupling portion 135 has a sealing means for forming an airtight seal between the gas diffuser 31 and the coupling portion 135. Alternatively, the coupling portion 135 can be a connecting seat located at the bottom of the housing 13, and the bottom of the gas diffuser 31 can be fitted into the connecting seat. The pipe body of the gas diffuser 31 is held by the first clamping arm 111 and the second clamping arm 113. By controlling the opening between the first clamping portion 1111 and the second clamping portion 1131 through appropriate deformation of the first clamping portion 1111 and the second clamping portion 1131, the tubular body of the gas diffuser 31 can be inserted into the installation space between the first clamping arm 111 and the second clamping arm 113, and mechanical strength is provided by the first support portion 1113 or the second support portion 1133, which have high mechanical strength, thereby preventing the mounting structure 11 from breaking during assembly.

[0032] At least one drain port 117 is further defined between the first clamping arm 111 and the second clamping arm 113 of the mounting structure 11, thereby achieving a drainage function by draining the cleaning liquid behind the housing 13 when the gas diffuser 31 is mounted on the housing 13. In an embodiment of the present invention, when the gas diffuser 31 is mounted in the housing 13, a drain port 117 is defined between the first clamping arm 111 and the abutment portion 115, and another drain port 117 is defined between the second clamping arm 113 and the abutment portion 115.

[0033] 3C and 3D, the first clamping arm 111 and the second clamping arm 113 define an upper opening and a lower opening through which the gas diffuser 31 can pass, the upper opening being slightly smaller than the lower opening. As shown in Fig. 3C, the first clamping arm 111 and the second clamping arm 113 have thick upper ends and thin lower ends, allowing the first clamping arm 111 and the second clamping arm 113 to partially come into direct contact with the gas diffuser 31, partially forming a small gap between the first clamping arm 111 and the second clamping arm 113 and the gas diffuser 31. Furthermore, portions of the first clamping arm 111 and the second clamping arm 113 are not in surface contact with the gas diffuser 31, thereby reducing the contact area between the mounting structure 11 and the gas diffuser 31 and reducing dust generation. Specifically, the upper ends of the first clamping arm 111 and the second clamping arm 113 are in direct contact with the gas diffuser 31, and the lower ends of the first clamping arm 111 and the second clamping arm 113 are not in contact with the gas diffuser 31. By preventing the lower ends of the first clamping arm 111 and the second clamping arm 113 from contacting the gas diffuser 31, it is possible to prevent dust from accumulating between the gas diffuser 31 and the first clamping arm 111 and the second clamping arm 113 due to friction.

[0034] Furthermore, when the gas diffuser 31 is not attached to the mounting structure 11, the upper opening has an upper inner diameter d1, the lower opening has a lower inner diameter d2, the inner diameter lengths of the first clamping arm 111 and the second clamping arm 113 gradually increase from the upper inner diameter d1 to the lower inner diameter d2, the upper inner diameter d1 is smaller than the lower inner diameter d2, and the upper inner diameter d1 is slightly smaller than the gas diffuser diameter d, ensuring that the mounting structure 11 can stably hold the gas diffuser 31, and because the lower inner diameter d2 is larger than the gas diffuser diameter d, a gap exists between the undersides of the first clamping arm 111 and the second clamping arm 113 and the surface of the gas diffuser 31, reducing dust generation. Note that other means can be used to partially contact the first clamping arm 111 and the second clamping arm 113 with the gas diffuser 31. For example, the first clamping arm 111 and the second clamping arm 113 may have different thicknesses, or the first clamping arm 111 and the second clamping arm 113 may have contoured surfaces.

[0035] The contact portion 115 can be in partial or complete direct contact with the gas diffuser 31. The contact portion 115 can be in complete contact with the gas diffuser 31 to ensure stable holding of the gas diffuser 31, or the contact portion 115 can be in partial contact with the gas diffuser 31, for example, with only the upper end in direct contact with the gas diffuser 31 and a gap between the lower end and the surface of the gas diffuser 31, thereby reducing the contact area between the contact portion 115 and the gas diffuser 31 and reducing dust generation.

[0036] Referring to FIG. 4, FIG. 4 is a cross-sectional view of a mounting structure according to a second embodiment of the present invention, the structure and features of which are basically the same as those of the first embodiment of the present application, with the difference being that it can clamp a gas diffuser 31′ having an elliptical cross section, but other structures and features can be combined with or substituted for those disclosed in the first embodiment.

[0037] Specifically, in the second embodiment of the present invention, the mounting structure 11 of the substrate carrier 100 equipped with the mounting structure for a gas diffuser 31′ is formed on the inner wall 232 of the housing 23 and includes a first clamping arm 211 and a second clamping arm 213 for holding or clamping the gas diffuser 31′ having an elliptical cross section. Specifically, the first clamping arm 211 and the second clamping arm 213 are configured to clamp both sides of the elliptical gas diffuser 31′ corresponding to the major axis. In another possible embodiment, the first clamping arm 211 and the second clamping arm 213 may be configured to clamp a gas diffuser 31′ having at least one cross-sectional shape or a gas diffuser 31 having one shape but in a different orientation. The mounting structure further includes an abutting portion 215 for abutting against the gas diffuser 31′.

[0038] When the gas diffuser 31' is attached to the substrate carrier 100, the gas diffuser 31' is positioned at the housing joint 235 at the bottom of the substrate carrier 100, and is held or clamped by the first clamping arm 211 and the second clamping arm 213, and is abutted by the abutment part 215. At this time, drainage holes 217 are defined between the first clamping arm 211 and the abutment part 215, and between the second clamping arm 213 and the abutment part 215, respectively, to drain the cleaning liquid and achieve a drainage function.

[0039] The mounting structure 11 extends from the inner wall 232 of the housing 23 so that when the gas diffuser 31' is attached to the substrate carrier 100, it is outside the operating range 133 of the tip of the robot arm and does not come into contact with the stored wafers 41, thereby reducing the risk of collision between the gas diffuser 31' and the robot arm.

[0040] The mounting structures of the first and second embodiments of the present invention are integrally molded with the casing. During the manufacturing process, the mold insert and angle lifter structures can be exchanged for the same set of molds to manufacture mounting structures suitable for clamping gas diffusers of different shapes, for example, the mounting structures can clamp gas diffusers with circular, elliptical or other cross-sectional shapes, thereby reducing the manufacturing cost of the casing and improving manufacturing convenience. [Explanation of symbols]

[0041] 100 PCB Carriers 11 Mounting structure 111 First clamping arm 1111 First clamping part 1111A Cross-sectional thickness of the first clamping part 1113 1st support part 1113A Cross-sectional thickness of first support 113 Second clamping arm 1131 Second clamping part 1131A Cross-sectional thickness of the second clamping part 1133 Second support part 1133A Cross-sectional thickness of second support 115 Contact part 117 Drain 13. Cabinet 131 Wafer storage space 132 Interior wall 133 Operating Range 135 Joint 17 Wafer support 19. Chuck 211 First clamping arm 213 Second clamping arm 215 Contact part 217 Drain 23 Case 232 Interior wall 235 Joint 31, 31' Gas Diffuser 41 wafers d1 Upper inner diameter d2 Lower inner diameter d Gas diffuser diameter

Claims

1. a housing defining a wafer storage space; at least one mounting structure integrally molded on an inner wall of the housing for holding at least one gas diffuser and positioning the at least one gas diffuser outside the working range of the tip of the robot arm; Equipped with The mounting structure of the substrate carrier includes a first clamping arm, a second clamping arm, and an abutment portion, the first clamping arm and the second clamping arm clamp the gas diffuser, the abutment portion abuts against the gas diffuser, and the contact surface of the abutment portion is a convex curved surface.

2. The substrate carrier according to claim 1 , wherein the first clamping arm or the second clamping arm has elasticity.

3. The substrate carrier of claim 1 , wherein the first clamping arm or the second clamping arm further comprises a support portion extending from the inner wall and a clamping portion extending from the support portion, and the thickness of the support portion is greater than the thickness of the clamping portion.

4. The substrate carrier of claim 1 , wherein the first clamping arm and the second clamping arm define an upper opening and a lower opening, the upper opening being smaller than the lower opening.

5. 5. The substrate carrier of claim 4, wherein an upper inner diameter defined by said first clamping arm and said second clamping arm is smaller than a lower inner diameter.

6. 6. The substrate carrier of claim 5, wherein the gas diffuser has a diameter smaller than a lower inner diameter defined by the first clamping arm and the second clamping arm.

7. The substrate carrier according to claim 1 , wherein a contact area between the first and second clamping arms and the gas diffuser is smaller than a contact area between the abutting portion and the gas diffuser.

8. The substrate carrier of claim 1 , wherein the gas diffuser has a cross section that is circular, elliptical, or other shape.

9. The substrate carrier of claim 1 , wherein the first clamping arm, the second clamping arm, the abutment portion, and the gas diffuser define at least one drain opening.

10. a housing defining a wafer storage space; at least one mounting structure extending integrally from an inner wall of the housing, the mounting structure including a first clamping arm and a second clamping arm for clamping at least one gas diffuser; Equipped with A substrate carrier, wherein upper ends of the first clamping arm and the second clamping arm directly contact the at least one gas diffuser, and there is a gap between lower ends of the first clamping arm and the second clamping arm and the at least one gas diffuser.

11. The substrate carrier of claim 10 , wherein the mounting structure further comprises an abutment disposed between the first clamping arm and the second clamping arm.

12. The substrate carrier of claim 11 , wherein a contact area between the first and second clamping arms and the gas diffuser is smaller than a contact area between the abutment portion and the gas diffuser.

13. The substrate carrier of claim 10 , wherein the first clamping arm, the second clamping arm, and the gas diffuser define at least one drain opening.

14. The substrate carrier of claim 10 , wherein an upper inner diameter defined by the first clamping arm and the second clamping arm is smaller than a lower inner diameter.

15. 15. The substrate carrier of claim 14, wherein the gas diffuser has a diameter smaller than a lower inner diameter defined by the first and second clamping arms.

16. The substrate carrier of claim 10 , wherein the first clamping arm or the second clamping arm further comprises a support portion extending from the inner wall and a clamping portion extending from the support portion, and the mechanical strength of the support portion is greater than that of the clamping portion.

17. The substrate carrier of claim 16 , wherein the clamping portion is elastic and the support portion has a thickness greater than the clamping portion.

18. The substrate carrier of claim 10 , wherein the mounting structure is provided outside the range of motion of the tip of a robot arm.

Citation Information

Patent Citations

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