Grinding equipment

Abstract

To provide a grinding device that grinds a wafer held on a holding surface of a chuck table, which can prevent machining chips from adhering onto an upper surface of the wafer, when separating the wafer from the holding surface.SOLUTION: The grinding device comprises: a chuck table 2 constituted of a porous member 21 that suctions and holds a wafer 10 in a holding surface 210 and a frame body 22 that exposes the holding surface 210 and stores the porous member 21; a table holding part 23 comprising a support surface 230 supporting a lower surface of the chuck table 2; a grinding mechanism that makes a grinding stone grind the wafer 10 suctioned and held in the holding surface 210; and a control part. The table support part 23 is provided with a water jetting part 223 that jets water from a center of the support surface 230, and the frame body 22 comprises a supply hole 231 through which water is supplied to a center of a lower surface of the porous member 21. The control part jets water from the center part of the holding surface 210 through the water jetting part 223 and the supply hole 231, so as to separate the wafer 10 from the holding surface 210.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a grinding apparatus that grinds a wafer held on a chuck table. [Background technology]

[0002] A grinding device for grinding wafers holds the wafer by suction on the holding surface of a chuck table and grinds the wafer with a grinding wheel while supplying grinding water (see, for example, Patent Document 1). After grinding is completed, a mixed fluid of water and air is ejected from the holding surface of the chuck table to break the surface tension of the grinding water that has entered between the wafer and the holding surface, thereby separating the wafer from the holding surface (see, for example, Patent Document 1). The mixed fluid ejected from the holding surface passes through the inside of a porous member, so the air and water impact processing debris that has entered the porous member and eject it from the holding surface, but the processing debris adheres to the underside of the wafer. Therefore, a cleaning mechanism for cleaning the entire underside of a wafer has been proposed (see, for example, Patent Documents 2 and 3).

[0003] Another problem is that when the upper surface of a wafer held on the holding surface of the chuck table is suction-held by a holding pad and then carried out, processing debris ejected from the holding surface can find its way around to the upper surface of the wafer and adhere to the suction surface of the holding pad. To address this problem, a configuration has been proposed in which a carrying-out mechanism for carrying out the ground wafer is equipped with a shower ring that sprays water in a circular pattern around the outside of the suction surface (see, for example, Patent Documents 4 and 5). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-145776 [Patent Document 2] Japanese Patent Application Publication No. 11-031674 [Patent Document 3] Japanese Patent Application Laid-Open No. 2010-094785 [Patent Document 4] Japanese Patent Application Laid-Open No. 2000-208593 [Patent Document 5] Japanese Patent Application Laid-Open No. 2010-114353 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the case of a holding pad whose suction surface holds the entire upper surface of the wafer by suction, even if water is sprayed from the shower ring, water may enter the gap between the upper surface of the wafer, which has unevenness due to grinding marks after grinding, and the flat surface of the suction surface of the holding pad, causing processing debris to adhere to the suction surface and the upper surface of the wafer.Even in grinding machines equipped with a spinner cleaning unit that cleans the upper surface of the wafer after grinding, there is a problem in that it is difficult to remove processing debris that has adhered to the suction surface and the upper surface of the wafer.

[0006] The present invention has been made in consideration of such problems, and has as its object to prevent processing debris from adhering to the upper surface of a wafer when the wafer is separated from the holding surface in a grinding apparatus that grinds a wafer held on the holding surface of a chuck table. [Means for solving the problem]

[0007] The present invention provides a grinding device comprising: a chuck table including a porous member that suction-holds a wafer on a holding surface and a frame that exposes the holding surface and accommodates the porous member; a table support unit that includes a support surface that supports the lower surface of the chuck table; a grinding mechanism that grinds the wafer suction-held by the holding surface with a grinding wheel; and a control unit, the porous member includes an annular barrier that rises from a lower surface toward the holding surface and does not reach the holding surface; the frame includes a supply hole for supplying water to the center of the lower surface of the porous member, and an annular fluid jetting portion for supplying fluid to the porous member outside the barrier; The table support includes: Communicating with the supply hole A water jetting portion that jets water from the center of the support surface. a fluid jetting portion communicating with the annular fluid jetting portion; the control unit causes the water to be ejected from the central portion of the holding surface via the water ejection unit and the supply hole. and spraying water from the outer periphery of the holding surface via the fluid jetting portion and the annular fluid jetting portion to clean the holding surface when the wafer is not being held. . The grinding device includes a holding pad that holds the wafer held by the holding surface, and a carrying-out mechanism that carries out the wafer from the holding surface, and the control unit controls the holding of the wafer, the water ejection unit to eject water from the center of the holding surface, and the holding pad that holds the wafer to move in a direction away from the holding surface, thereby separating the wafer from the holding surface. and then, by using the annular fluid jetting portion, jetting water from an outer peripheral portion of the holding surface where the wafer is not being held, thereby cleaning the holding surface. Good too. [Effects of the Invention]

[0008] The grinding device of the present invention sprays water from the central part of the holding surface through the water spray section and supply hole to separate the wafer from the holding surface, thereby reducing the risk of processing debris that has entered the outer periphery of the holding surface scattering and adhering to the top surface of the wafer or the holding surface of the holding pad. Furthermore, the risk of processing debris adhering to the central portion of the underside of the wafer due to the water jetted from the water jetting portion is reduced, so there is no need to clean the central portion of the underside of the wafer after grinding. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an example of a grinding device. [Figure 2] FIG. 2 is a cross-sectional view schematically illustrating an example of a chuck table. [Figure 3] 1 is a cross-sectional view schematically illustrating an example of a chuck table, a loading mechanism, and a loading / unloading mechanism. [Figure 4] FIG. 10 is a cross-sectional view schematically showing a state in which a wafer is carried out from a chuck table. [Figure 5] 10 is a perspective view showing an example of a lower surface cleaning mechanism that cleans the lower surface of the wafer and the suction surface of the holding pad. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] The grinding apparatus 1 shown in FIG. 1 is an apparatus that grinds a wafer 10 held on a chuck table 2 by means of a grinding mechanism 3 .

[0011] The front of the grinding apparatus 1 is provided with cassette placement areas 61 and 62 on which cassettes 610 and 620 for accommodating wafers 10 are placed. The cassette 610 accommodates, for example, wafers 10 before grinding, and the cassette 620 accommodates, for example, wafers 10 after grinding.

[0012] A robot 63 is disposed behind (on the +Y side of) the cassette placement area and transports wafers 10 into and out of cassettes 610 and 620. The robot 63 includes a hand 631 that holds the wafer 10 by suction, an inversion drive unit 632 that inverts the hand 631, and an arm unit 633 that is connected to the inversion drive unit 632 and rotates and raises and lowers the hand 631.

[0013] A temporary placement mechanism 64 on which the wafer 10 before grinding is temporarily placed is disposed within the movable range of the hand 631. The temporary placement mechanism 64 includes a placement table 641 on which the wafer 10 is placed, and a plurality of positioning pins 642 arranged in an arc and movable in the radial direction toward the center of the placement table 641. When the wafer 10 is placed on the placement table 641, the positioning pins 642 move in directions approaching each other, thereby aligning the wafer 10 at a predetermined position.

[0014] A cleaning mechanism 65 for cleaning the ground wafer 10 is disposed in the movable range of the hand 631, at a position aligned in the X-axis direction with the temporary placement mechanism 64. The cleaning mechanism 65 includes a spinner table 651 for suction-holding the ground wafer 10, a cleaning liquid nozzle 652 for spraying cleaning liquid onto the wafer 10 held on the spinner table 651, and an air nozzle 653 for spraying high-pressure air onto the cleaned wafer 10 to dry it.

[0015] The chuck table 2 includes a porous member 21 having a holding surface 210 on its surface for holding the wafer 10 by suction, and a frame 22 for accommodating the porous member 21, with the holding surface 210 exposed from the inner periphery of the frame 22. The holding surface 210 and an upper surface 220 of the frame 22 are formed flush with each other.

[0016] Below the chuck table 2, there is provided a table support section 23 having a support surface 230 that supports the underside of the chuck table 2. A rotating shaft 240 is connected to the lower part of the table support section 23, and the rotating shaft 240 is rotatably supported by a support plate 241. The support plate 241 is supported at least at three points by three support shafts 242 (only two are shown in FIG. 1). Of these, at least two support shafts 242 have the function of adjusting the height of the chuck table 2 and thereby adjusting the inclination of the holding surface 210.

[0017] The chuck table 2 is driven by a horizontal movement mechanism 4 to be movable in the Y-axis direction. The horizontal movement mechanism 4 includes a ball screw 40 having a rotation axis in the Y-axis direction, a motor 41 that rotates the ball screw 40, a pair of guide rails 42 arranged parallel to the ball screw 40, and a slide plate 43 whose bottom is in sliding contact with the guide rails 42 and has a nut (not shown) inside that screws onto the ball screw 40. A support shaft 242 is provided on the upper part of the slide plate 43. When the ball screw 40 rotates, the slide plate 43 is guided by the guide rails 42 to move in the Y-axis direction, and as the slide plate 43 moves in the Y-axis direction, the chuck table 2 also moves in the Y-axis direction.

[0018] A thickness measuring device 66 for measuring the thickness of the wafer 10 is disposed on the side of the movement path of the chuck table 2 in the Y-axis direction. The thickness measuring device 66 includes a first measuring unit 661 that comes into contact with the upper surface 220 of the frame 22 of the chuck table 2 to measure the height of the upper surface 220, and a second measuring unit 662 that comes into contact with the upper surface 100 of the wafer 10 held on the holding surface 210 to measure the height of the upper surface 100. The thickness of the wafer 10 is calculated from the difference between the measurement value of the first measuring unit 661 and the measurement value of the second measuring unit 662.

[0019] A carry-in mechanism 71 that carries the wafer 10 from the placement table 641 onto the chuck table 2 is disposed near the temporary placement mechanism 64. The carry-in mechanism 71 includes a holding unit 740 that suction-holds the upper surface 100 of the wafer 10 before grinding, an arm unit 731 to the tip of which the holding unit 740 is connected, an elevation drive unit 737 that raises and lowers the holding unit 740 and the arm unit 731, and a rotation drive unit (not shown) that rotates the holding unit 740 and the arm unit 731.

[0020] A carry-out mechanism 72 is disposed near the cleaning mechanism 65, which carries out the ground wafer 10 from the chuck table 2 to the spinner table 651. The carry-out mechanism 72 includes a holder 740 that holds by suction the upper surface 100 of the ground wafer 10, an arm 731 to the tip of which the holder 740 is connected, an elevation drive unit 737 that raises and lowers the holder 740 and the arm 731, and a rotation drive unit (not shown) that rotates the holder 740 and the arm 731.

[0021] The grinding mechanism 3 includes a spindle 30 having a rotation axis extending in the Z-axis direction, a spindle rotation mechanism 31 that rotates the spindle 30, a spindle housing 32 that rotatably supports the spindle 30, a mount 33 connected to the lower end of the spindle 30, and a grinding wheel 34 attached to the mount 33. When the spindle rotation mechanism 31 rotates the spindle 30, the grinding wheel 34 also rotates. The grinding wheel 34 is composed of a base 340 fixed to the mount 33 and a plurality of grinding stones 341 fixed in an annular shape to the lower surface of the base 340.

[0022] The grinding mechanism 3 is supported by a grinding feed mechanism 5 so that it can move up and down. The grinding feed mechanism 5 includes a ball screw 50 having a rotation axis in the Z-axis direction, a motor 51 that rotates the ball screw 50, a pair of guide rails 52 arranged parallel to the ball screw 50, a lifting plate 53 whose sides are in sliding contact with the guide rails 52 and which has a nut (not shown) inside that screws onto the ball screw 50, and a holder 54 that is connected to the lifting plate 53 and supports the spindle housing 32. When the ball screw 50 rotates, the lifting plate 53 moves in the Z-axis direction while being guided by the guide rails 52, and accordingly, the grinding mechanism 3 also moves in the Z-axis direction.

[0023] The grinding device 1 is equipped with a control unit 8 that controls the chuck table 2, grinding mechanism 3, horizontal movement mechanism 4, grinding feed mechanism 5, robot 63, cleaning mechanism 65, thickness measuring device 66, carry-in mechanism 71, carry-out mechanism 72, etc.

[0024] 2, the lower end of the rotary shaft 240 is rotatably supported by a shaft support portion (rotary joint) 243. A driven pulley 244 is disposed around the rotary shaft 240, and a drive pulley 245 is disposed to the side of the driven pulley 244. The drive pulley 245 is driven by a motor 246. A belt 247 is wound around the drive pulley 245 and the driven pulley 244, and when the drive pulley 245 is driven by the motor 246 to rotate, the rotational force is transmitted to the driven pulley 244 by the belt 247, causing the rotary shaft 240 to rotate, and the chuck table 2 to rotate.

[0025] A first flow path 251 and a second flow path 252 for passing a fluid are formed through the frame 22, the table support 23, the rotating shaft 240, and the shaft support 243. The upper end of the first flow path 251 opens to a supply hole 223 formed in the center of the recess 222 of the frame 22. The supply hole 223 communicates with the porous member 21 above it and supplies water to the center of the lower surface of the porous member 21. A water jetting portion 231 is formed midway along the first flow path 251 at the center of the support surface 230 of the table support 23. The lower portion of the first flow path 251 is connected to a center valve 253 through the shaft support 243. The center valve 253 is connected to a suction source 261, an air supply source 262, and a water supply source 263 via valves 254, 255, and 256.

[0026] The upper end of the second flow path 252 opens at an annular fluid jetting portion 224 formed on the outer periphery of the recess 222 of the frame 22. A fluid jetting portion 232 is formed midway along the second flow path 252, on the outer periphery side of the water jetting portion 231. The lower portion of the second flow path 252 is connected to an annular valve 257 through the shaft support portion 243. The annular valve 257 is connected to a suction source 261, an air supply source 262, and a water supply source 263 via valves 254, 255, and 256. That is, the first flow path 251 and the second flow path 252 merge at a common flow path 258 beyond the central valve 253 and the annular valve 257. A pressure gauge 259 that measures the pressure within the common flow path 258 is connected to the common flow path 258.

[0027] An annular barrier 225 is provided inside the porous member 21, rising from the lower surface of the porous member 21 toward the holding surface 210 but not reaching the holding surface 210. The barrier 225 divides the porous member 21 into a central region 226 and an annular region 227. The barrier 225 may also be formed to reach the holding surface 210.

[0028] 3, the carry-in mechanism 71 and the carry-out mechanism 72 are configured in the same manner, and therefore will be described using the same reference numerals. The carry-in mechanism 71 and the carry-out mechanism 72 each include an arm 731, an elevation drive unit 737 that raises and lowers the arm 731, an annular support member 733 fixed to the arm 731, at least three pins 736 that have enlarged heads 734 and that fit loosely into through holes 735 formed in the annular support member 733, and a holder 740 connected to the lower ends of the pins 736. The pins 736 hang down with their enlarged heads 734 supported on the upper surface of the annular support member 733. The holding portion 740 includes a frame 741 to which the pins 736 are connected, and a holding pad 742 that is held from above and the sides by the frame 741. The holding pad 742 is formed of, for example, a porous material, and its lower surface serves as a suction surface 743 that holds the upper surface 100 of the wafer 10 by suction. The holding pad 742 may also be an edge clamp that supports the outer periphery of the wafer 10 .

[0029] An air flow path 751 is formed through the annular support member 733 and the frame body 741, and the upper part of the air flow path 751 branches into two paths, one of which is connected to a suction source 753 via a valve 752, and the other of which is connected to an air supply source 755 via a valve 754.

[0030] Next, the operation of the grinding apparatus 1 shown in Fig. 1 when grinding the upper surface 100 of the wafer 10 will be described. A plurality of wafers 10 are stored inside the cassette 610 shown in Fig. 1. Then, the arm part 633 rotates and moves up and down, causing the hand 631 of the robot 63 to enter the inside of the cassette 610 and suck and hold one wafer 10, after which the hand 631 retreats to the outside of the cassette 610 and places the wafer 10 on the placement table 641 of the temporary placement mechanism 64. Then, the positioning pins 642 move in directions approaching each other, and the wafer 10 is aligned at a predetermined position.

[0031] Next, the arm unit 731 of the carry-in mechanism 71 pivots to move the holding unit 740 above the wafer 10 placed on the placement table 641. Then, the lifting / lowering driver 737 lowers the holding unit 740 and opens the valve 752 shown in FIG. 3 to apply suction force to the suction surface 743 of the holding pad 742, thereby suction-holding the upper surface 100 of the wafer 10. Next, the lifting / lowering driver 737 lifts the holding unit 740, and then the turning driver turns the arm unit 731 to move the wafer 10 above the chuck table 2, which has been positioned in advance on the -Y direction side. Then, the lifting / lowering driver 737 lowers the holding unit 740, and the wafer 10 is placed on the holding surface 210 of the chuck table 2. In the chuck table 2, by opening the central valve 253, the annular valve 257, and the valve 254, the first flow path 251 and the second flow path 252 are connected to the suction source 261, and a suction force is applied to the holding surface 210 to hold the lower surface 101 of the wafer 10 by suction on the holding surface 210. Next, the valve 752 is closed to release the suction force of the suction surface 743, and then the lifting drive unit 737 lifts the holding unit 740, thereby separating the suction surface 743 from the upper surface 100 of the wafer 10.

[0032] Next, the horizontal movement mechanism 4 moves the chuck table 2 in the +Y direction to position the wafer 10 below the grinding mechanism 3. Then, the chuck table 2 is rotated by the motor 246, and the spindle rotation mechanism 31 shown in FIG. 1 rotates the spindle 30 to rotate the grinding wheel 341. Furthermore, the grinding feed mechanism 5 lowers the grinding mechanism 3, causing the rotating grinding wheel 341 to contact the upper surface 100 of the wafer 10. This causes the upper surface 100 of the wafer 10 to be ground. During grinding, the tip of the first measurement part 661 of the thickness gauge 66 is brought into contact with the upper surface 220 of the frame 22, and the tip of the second measurement part 662 of the thickness gauge 66 is brought into contact with the upper surface 100 of the wafer 10. The thickness of the wafer 10 is calculated from the difference between the measurement values ​​of the first measurement part 661 and the second measurement part 662. Then, when the calculated thickness reaches a predetermined thickness value, the grinding feed mechanism 5 raises the grinding mechanism 3 to end the grinding.

[0033] Next, the horizontal movement mechanism 4 moves the chuck table 2 in the -Y direction. Then, under the control of the control unit 8, the arm unit 731 of the carry-out mechanism 72 is rotated to move the holder 740 above the wafer 10 held on the chuck table 2. Then, as shown in FIG. 3 , under the control of the control unit 8, the lifting drive unit 737 lowers the holder 740, bringing the suction surface 743 closer to the ground upper surface 100 of the wafer 10. Then, when the suction surface 743 comes into contact with the upper surface 100, the valve 752 is opened under the control of the control unit 8, and the upper surface 100 of the wafer 10 is suction-held on the suction surface 743. Note that, although the protective tape 11 is attached to the lower surface 101 of the wafer 10 in the example shown in FIG. 3 , the protective tape 11 may not be attached.

[0034] Next, under the control of the control unit 8, the valve 254 is closed to release the suction force on the holding surface 210 of the chuck table 2, the annular valve 257 is also closed, and the central valve 253 and the valve 256 are opened. Then, water from the water supply source 263 flows through the common flow path 258 and rises in the first flow path 251, passes through the water ejection unit 231 and is ejected from the supply holes 223, passes through the inside of the porous member 21, and is ejected from the center of the holding surface 210. As a result, the wafer 10 is slightly lifted from the holding surface 210. Since the barrier 225 is formed in the porous member 21, it is possible to prevent water from flowing toward the outer periphery inside the porous member 21.

[0035] In this way, water is ejected from the center of the holding surface 210, causing the protective tape 11 side to move away from the holding surface 210. Then, as shown in Fig. 4, the lifting and lowering drive unit 737 raises the holding unit 740, which suction-holds the upper surface 100 of the wafer 10 on the suction surface 743 under the control of the control unit 8, and the wafer 10 is carried out from the chuck table 2. Furthermore, the risk of processing debris adhering to the protective tape 11 on the underside of the wafer 10 due to the water jetted from the supply holes 223 is reduced, so there is no need to clean the central portion of the underside of the protective tape 11 after grinding.

[0036] Grinding debris generated by grinding the top surface 100 of the wafer 10 enters the gap between the holding surface 210 and the protective tape 11 from the outer periphery of the wafer 10, and accumulates on the outer periphery of the gap, but the grinding device 1 is provided with supply holes 223 that spray water only from the center, and the water used to separate the wafer 10 from the holding surface 210 is sprayed from the center of the holding surface 210, so it is possible to prevent the water from scattering the grinding debris and causing it to wrap around to the top surface 100. This reduces the risk of grinding debris adhering to the top surface 100 of the wafer 10. Note that the water ejected from the holding surface 210 separates the wafer 10 from the holding surface 210, and a water layer is formed between the holding surface 210 and the underside of the protective tape 11 on the wafer 10. In order to break the surface tension caused by this water layer, the holding unit 740, which has been raised by the formation of the water layer, may be rotated by the rotation drive unit, and the water in the water layer may be caused to drip from the outer periphery of the holding surface 210 of the chuck table 2, thereby breaking the surface tension of the water, and then the lifting drive unit 737 may lift the holding unit 740 and carry the wafer 10 out of the chuck table 2.

[0037] The wafer 10 thus separated from the holding surface 210 is moved above the spinner table 651 of the cleaning mechanism 65 by the rotation of the arm unit 731. Then, the lifting / lowering drive unit 737 lowers the holding unit 740 to place the protective tape 11 side on the spinner table 651, and after a suction force is applied to the spinner table, the lifting / lowering drive unit 737 raises the holding unit 740 to separate it from the wafer 10. Thereafter, the spinner table 651 rotates, and a cleaning liquid is sprayed from the cleaning liquid nozzle 652 toward the upper surface 100 of the wafer 10, thereby cleaning the upper surface 100. After the upper surface 100 has been cleaned, the upper surface 100 is dried by spraying high-pressure air from the air nozzle 653 toward the upper surface 100 of the wafer 10 while the spinner table 651 is rotating.

[0038] After the cleaning and drying of the wafer 10 is completed, the arm 633 of the robot 63 is rotated and raised and lowered to suction-hold the upper surface 100 of the wafer 10 with the hand 631. Then, the hand 631 is rotated and raised and lowered to enter a predetermined slot in the cassette 620, and the suction-holding by the hand 631 is released, whereby the ground wafer 10 is stored in the cassette 620.

[0039] After the wafer 10 is separated from the holding surface 210 of the chuck table 2 and transported to the spinner table 651, the holding surface 210 may be cleaned by closing the central valve 253 and opening the annular valve 257, and spraying water from the annular fluid spraying portion 224 through the second flow path 252.

[0040] As shown in FIG. 5, a lower surface cleaning mechanism 9 for cleaning the protective tape 11 attached to the lower surface 101 of the wafer 10 and the suction surface 743 of the holding pad 742 may be disposed within the movable range of the holding unit 740 of the unloading mechanism 72. This lower surface cleaning mechanism 9 includes a first cleaning member 91 and a second cleaning member 92 that intersect horizontally, with a shaft 93 connected to the lower portion of the intersection. The shaft 93 is driven by a motor 94. The first cleaning member 91 can be raised and lowered independently of the second cleaning member 92. A nozzle 95 is disposed parallel to the first cleaning member 91, and multiple nozzles 951 are aligned along the longitudinal direction of the nozzle 95 and open upward. The first cleaning member 91 is formed, for example, by a cleaning grindstone, and the second cleaning member 92 is formed, for example, by a brush made of nylon. The second cleaning member 92 may also be formed by a sponge.

[0041] When cleaning the suction surface 743 of the holding pad 742, the holding part 740 is positioned so that the center of the suction surface 743, which is not holding the wafer 10, is located above the shaft part 93. Then, with the upper surface of the first cleaning member 91 positioned higher than the bristles of the brush of the second cleaning member 92, the motor 94 rotates the first cleaning member 91 and the second cleaning member 92. Also, cleaning liquid is supplied to the nozzle 95 and ejected from the ejection port 951. Then, the holding part 740 is lowered to bring the suction surface 743 of the holding pad 742 into contact with the rotating first cleaning member 91, thereby scraping off and removing processing debris adhering to the suction surface 743.

[0042] On the other hand, when cleaning the protective tape 11 attached to the underside 101 of the wafer 10, the first cleaning member 91 is lowered and the bristles of the brush of the second cleaning member 92 are positioned higher than the upper surface of the first cleaning member 91. Then, with the holder 740 positioned so that the center of the wafer 10 held by suction on the suction surface 743 is positioned above the shaft 93, the motor 94 rotates the first cleaning member 91 and the second cleaning member 92. Also, cleaning liquid is supplied to the nozzle 95 and ejected from the ejection port 951. Then, the holder 740 is lowered to bring the protective tape 11 into contact with the rotating second cleaning member 92, whereby the suction surface 743 is cleaned by the second cleaning member 92 and processing debris is removed.

[0043] 2-4 is configured to include a bottomed recess 222, but a cylindrical frame without a bottom can also be used instead of this frame 22. In this case, the frame is formed in an annular shape so as to support the side surface of the porous member 21. [Explanation of symbols]

[0044] 1: Grinding device 2: Chuck table 21: Porous member 210: Holding surface 22: Frame 220: Upper surface 222: Recess 223: Supply hole 224: Annular fluid jetting portion 225: Barrier 226: Central area 227: Annular area 23: Table support part 230: Support surface 231: Water jet part 232: Fluid jet part 240: Rotating shaft 241: Support plate 242: Support shaft 243: Shaft support section 244: Driven pulley 245: Driving pulley 246: Motor 247: Belt 251: First flow path, 252: Second flow path, 253: Central valve 254, 255, 256: Valves 257: Annular valve 258: Common flow path 259: Pressure gauge 261: Suction source 262: Air supply source 263: Water supply source 3: Grinding mechanism 30: Spindle 31: Spindle rotation mechanism 32: Spindle housing 33: Mount 34: Grinding wheel 340: Base 341: Grinding stone 4: Horizontal movement mechanism 40: Ball screw 41: Motor 42: Guide rail 43: Slide plate 5: Grinding feed mechanism 50: Ball screw 51: Motor 52: Guide rail 53: Lifting plate 54: Holder 61, 62: cassette placement area 610, 620: cassette 63: Robot 631: Hand 632: Inversion drive unit 633: Arm unit 64: Temporary placement mechanism 641: Placement table 642: Positioning pin 65: Cleaning mechanism 651: Spinner table 652: Cleaning liquid nozzle 653: Air nozzle 66: Thickness measuring device 661: First measuring unit 662: Second measuring unit 71: Carrying-in mechanism 72: Carrying-out mechanism 721: Holding pad 722: Arm part 731: Arm portion 733: Annular support member 734: Head portion 735: Through hole 736: Pin 737: Lifting drive unit 740: Holding portion 741: Frame body 742: Holding pad 743: Suction surface 751: Air flow path 752: Valve 753: Suction source 754: Valve 755: Air supply source 8: Control unit 9: Underside cleaning mechanism 91: First cleaning member 92: Second cleaning member 93: Shaft 94: Motor 95: Nozzle 951: Spout 10: Wafer 100: Top surface 101: Bottom surface 11: Protective tape

Claims

1. A grinding device comprising: a chuck table including a porous member that suction-holds a wafer on a holding surface and a frame that exposes the holding surface and houses the porous member; a table support unit that includes a support surface that supports a lower surface of the chuck table; a grinding mechanism that grinds the wafer suction-held by the holding surface with a grinding wheel; and a control unit, the porous member includes an annular barrier that rises from a lower surface toward the holding surface and does not reach the holding surface; the frame includes a supply hole for supplying water to the center of the lower surface of the porous member, and an annular fluid jetting portion for supplying fluid to the porous member outside the barrier; the table support portion includes a water jetting portion that communicates with the supply hole and jets water from the center of the support surface, and a fluid jetting portion that communicates with the annular fluid jetting portion; The control unit causes water to be ejected from the central portion of the holding surface via the water ejection unit and the supply hole to separate the wafer from the holding surface, and causes water to be ejected from the outer periphery of the holding surface via the fluid ejection unit and the annular fluid ejection unit to clean the holding surface that is not holding a wafer. Grinding equipment.

2. a holding pad for holding a wafer held by the holding surface, and a carrying-out mechanism for carrying out the wafer from the holding surface; 2. The grinding device of claim 1, wherein the control unit controls the holding pad to hold the wafer, the water jetting unit to jet water from the center of the holding surface, and the holding pad holding the wafer in a direction to move it away from the holding surface, thereby separating the wafer from the holding surface, and the annular fluid jetting unit to jet water from the outer periphery of the holding surface where the wafer is not being held, thereby cleaning the holding surface.

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