Substrate processing apparatus and substrate processing method

Abstract

To efficiently clean a bottom face central area of a substrate.SOLUTION: A substrate cleaning device 1 includes: a pair of upper holding units 10A, 10B for holding the outer peripheral end portion of a substrate; a bottom face brush 51 coming into contact with the bottom face of the substrate to clean the bottom face of the substrate; and a control unit for changing push-up force that pushes a cleaning tool upward while the bottom face brush 51 cleans a bottom face central area of the substrate W.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates, such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (ElectroLuminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral edge of the back surface of the wafer, a spin chuck that holds the central part of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central part of the back surface of the wafer is cleaned with the brush. The spin chuck then receives the wafer from the suction pads and rotates around a vertical axis (rotation axis) while holding the central part of the back surface of the wafer. In this state, the peripheral part of the back surface of the wafer is cleaned with the brush. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] When the wafer's peripheral edge is held by a suction pad, the wafer's weight causes the center of the wafer to displace downward, resulting in a curved underside. Furthermore, when a brush is pressed against the center of the wafer's backside from below to bring the brush into contact with the wafer, the load from the brush causes the center of the wafer to displace upward, resulting in a curved underside. Furthermore, the wafer itself may be warped due to the effects of a previous processing step. In such a situation, if the top surface of the brush is flat, the entire top surface of the brush will not come into contact with the wafer, reducing the contact area between the brush and the wafer and reducing the frequency of cleaning the areas of the wafer that are not in contact with the brush.

[0006] An object of the present invention is to provide a substrate processing apparatus that improves the efficiency of substrate processing. [Means for solving the problem]

[0007] (1) According to one aspect of the present invention, a substrate processing apparatus includes a substrate holding unit that holds an outer peripheral edge of a substrate, a processing unit that processes the front or back surface of the substrate, and a holding control unit that controls the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit. Because the substrate holding unit is controlled so that the central portion of the substrate is displaced upward or downward while the substrate is being processed, the substrate can be displaced into a shape suited to the processing. This makes it possible to provide a substrate processing apparatus that improves the efficiency of substrate processing.

[0008] (2) The substrate holder has two pressing units arranged opposite each other with the substrate sandwiched between them, and the holding control unit adjusts the distance between the two pressing units, so that the substrate can be easily deformed by adjusting the distance between the two pressing units.

[0009] (3) The substrate holding unit has two gripping units arranged opposite each other across the substrate, each of which includes an upper gripping unit that contacts the front surface of the substrate and a lower gripping unit that contacts the back surface of the substrate, and the holding control unit adjusts the force that the upper gripping unit applies to the front surface of the substrate and the force that the lower gripping unit applies to the back surface of the substrate.

[0010] (4) The processing unit includes a cleaning tool that contacts the underside of the substrate to clean the underside of the substrate, and the holding control unit controls the substrate holding unit so that the central portion of the substrate is displaced upward or downward while the cleaning tool cleans the central region of the underside of the substrate. Since the central portion of the substrate is displaced upward or downward while the cleaning tool cleans the central region of the underside of the substrate, the displacement of the substrate causes the contact surface between the cleaning tool and the substrate to vary. This allows for more efficient cleaning of the central region of the underside of the substrate.

[0011] (5) The apparatus further includes a displacement sensor that detects displacement of the substrate, and the holding control unit controls the substrate holding unit so that the displacement of the substrate falls within a predetermined range, thereby preventing damage to the substrate.

[0012] (6) A substrate processing apparatus includes a substrate holder that holds the outer peripheral edge of a substrate, a displacement sensor that detects displacement of the central portion of the substrate, and a holding controller that controls the substrate holder so that the central portion of the substrate is displaced upward or downward, and the holding controller displaces the central portion of the substrate held by the substrate holder upward or downward based on the displacement detected by the displacement sensor so that the displacement of the central portion of the substrate held by the substrate holder falls within a predetermined range. Therefore, by displacing the central portion of the substrate upward or downward during substrate processing, the substrate can be displaced into a shape suited to the processing. As a result, a substrate processing apparatus can be provided that improves the efficiency of substrate processing.

[0013] (7) A substrate processing method is a substrate processing method performed by a substrate processing apparatus including a substrate holding unit that holds an outer peripheral edge of a substrate and a processing unit that processes the front or back surface of the substrate, and includes a holding control step of controlling the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit. Thus, a substrate processing method that improves the efficiency of substrate processing can be provided.

[0014] (8) A substrate processing method executed by a substrate processing apparatus including a substrate holder that holds the outer peripheral edge of a substrate, a displacement sensor that detects displacement of a central portion of the substrate, and a holding control unit that controls the substrate holder so that the central portion of the substrate is displaced upward or downward based on the displacement detected by the displacement sensor so that the displacement of the central portion of the substrate held by the substrate holder falls within a predetermined range. Thus, a substrate processing method that improves the efficiency of substrate processing can be provided. [Effects of the Invention]

[0015] According to the present invention, substrates can be processed efficiently. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1. [Figure 3] FIG. 2 is an external perspective view of a pair of upper holding devices. [Figure 4] FIG. [Figure 5] FIG. 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus. [Figure 6] 3A and 3B are schematic diagrams for explaining the general operation of the substrate cleaning apparatus. [Figure 7] 10 is a diagram schematically illustrating the positional relationship between the substrate and the lower surface brush when the substrate is not displaced. FIG. [Figure 8] 10 is a diagram showing an example of a contact surface between the substrate and the lower surface brush when the substrate is not displaced; FIG. [Figure 9] 10 is a diagram schematically illustrating the positional relationship between the substrate and the lower surface brush when the substrate is displaced to the minus side. FIG. [Figure 10] 10 is a diagram showing an example of the contact surface between the substrate and the lower surface brush when the substrate is displaced to the minus side; FIG. [Figure 11]10 is a diagram schematically illustrating the positional relationship between the substrate and the lower surface brush when the substrate is displaced to the plus side. FIG. [Figure 12] 10 is a diagram showing an example of a contact surface between the substrate and the lower surface brush when the substrate is displaced to the plus side; FIG. [Figure 13] 10 is a time chart showing an example of a change in pressing force. [Figure 14] 10 is a flowchart showing an example of the flow of a pressure control process. [Figure 15] FIG. 10 is an external perspective view showing the internal configuration of a substrate cleaning apparatus according to a second embodiment. [Figure 16] FIG. 10 is an external perspective view of a pair of upper holding devices according to a second embodiment. [Figure 17] FIG. 10 is a front view schematically showing a pair of upper holding devices according to a second embodiment. [Figure 18] 10 is a first time chart showing an example of changes in the rotation angles of the upper roller and the lower roller. [Figure 19] 10 is a flowchart showing an example of the flow of a substrate displacement control process. [Figure 20] 10 is a time chart showing an example of changes in the rotation angles of the upper roller and the lower roller in the first modified example. [Figure 21] 10 is a flowchart showing an example of the flow of a substrate displacement control process in a first modified example. [Figure 22] FIG. 10 is a front view schematically showing an example of a modified example of a pair of upper holding devices; [Figure 23] FIG. 10 is an external perspective view showing the internal configuration of a substrate cleaning apparatus 1 according to a third embodiment. [Figure 24] 13 is a flowchart showing an example of the flow of a substrate displacement control process in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] A substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, a substrate cleaning apparatus and a substrate cleaning method will be described as an example of the substrate processing apparatus and the substrate processing method. The substrate may be a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (ElectroLuminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0018] [First embodiment] 1.Configuration of substrate cleaning equipment FIG. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is an external perspective view showing the internal configuration of substrate cleaning apparatus 1. In substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationships. In FIG. 1 and certain figures following FIG. 2, the X, Y, and Z directions are indicated by appropriate arrows. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the vertical direction.

[0019] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0020] The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is an loading / unloading opening 2x for the substrate W, and is used when loading and unloading the substrate W into and from the unit housing 2. In FIG. 2, the loading / unloading opening 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading opening 2x toward the outside of the unit housing 2 (the direction from the side wall 2c toward the side wall 2b) is referred to as the front, and the opposite direction (the direction from the side wall 2b toward the side wall 2c) is referred to as the rear.

[0021] An opening / closing device 90 is provided in the portion of the side wall 2b where the loading / unloading opening 2x is formed and in the area nearby. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0022] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided to extend in the Y direction from near the side wall portion 2b to near the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0023] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck, and has a circular suction surface that can suction-hold the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In the following description, when the substrate W is suction-held by the suction holding unit 21, the region of the lower surface of the substrate W that should be suctioned by the suction surface of the suction holding unit 21 is referred to as a lower surface central region. On the other hand, the region of the lower surface of the substrate W that surrounds the lower surface central region is referred to as a lower surface outer region.

[0024] The suction hold driving unit 22 includes a motor. The motor of the suction hold driving unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction hold unit 21 is attached to the upper end of the rotation shaft of the suction hold driving unit 22. A suction path is formed on the rotation shaft of the suction hold driving unit 22 to allow the suction hold unit 21 to suction and hold the substrate W. The suction path is connected to an air suction device (not shown). The suction hold driving unit 22 rotates the suction hold unit 21 around the rotation shaft.

[0025] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of (three in this example) support pins 41, a pin connecting member 42, and a pin lifting / lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view and connects the plurality of support pins 41. The plurality of support pins 41 extend upward by a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting / lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0026] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush operation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush movement drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in FIG. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be able to move up and down. The lifting support unit 54 has an upper surface 54u that slopes obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0027] 1, the lower surface brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. The diameter of the lower surface brush 51 is also larger than 1 / 3 and smaller than 1 / 2 of the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0028] The lower surface brush 51 has a cleaning surface that can come into contact with the lower surface of the substrate W. The lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0029] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lifting support part 54 so as to be located near the lower surface brush 51 and so that the liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 5) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0030] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection unit 53 is attached to the upper surface 54u of the lifting support unit 54 so that it is located between the lower surface brush 51 and the suction holding unit 21 in a plan view and has its gas ejection port facing upward. A jet gas supply unit 57 (FIG. 5) is connected to the gas ejection unit 53. The jet gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects gas supplied from the jet gas supply unit 57 onto the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W and when drying the lower surface of the substrate W, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21.

[0031] The lower surface brush operation drive unit 55a includes an air cylinder and an electro-pneumatic regulator that drives the air cylinder, and when the lower surface brush 51 cleans the substrate W, it drives the air cylinder by controlling the electro-pneumatic regulator, thereby controlling the force with which the lower surface brush 51 is pressed against the lower surface of the substrate W.

[0032] The lower surface brush operation drive unit 55a further includes a motor, and when the lower surface brush 51 cleans the substrate W, the motor is driven in a state in which the lower surface brush 51 is in contact with the lower surface of the substrate W. This causes the lower surface brush 51 to rotate. The lower surface brush operation drive unit 55a will be described in detail later.

[0033] The lower surface brush lifting / lowering drive unit 55b includes a stepping motor or an air cylinder, and moves the lifting support unit 54 up and down relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor, and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the lower surface brush movement drive unit 55c moves the moving support unit 55 in the Y direction, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is referred to as the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is referred to as the separated position.

[0034] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the pedestal device 30 in a plan view and is capable of being raised and lowered. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which portion of the underside of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W that is sucked and held by the suction holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding unit 21.

[0035] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across pedestal device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driver 13A, and an upper chuck driver 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driver 13B, and an upper chuck driver 14B. Upper holding devices 10A, 10B constitute a substrate alignment device of the present invention.

[0036] Figure 3 is an external perspective view of a pair of upper holding devices. In Figure 3, lower chucks 11A and 11B are indicated by thick solid lines. Furthermore, upper chucks 12A and 12B are indicated by dotted lines. In the external perspective view of Figure 3, the enlargement and reduction ratio of each part has been changed from that of the external perspective view of Figure 2 so that the shapes of lower chucks 11A and 11B can be more easily understood.

[0037] 3, the lower chucks 11A and 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces 200. Each support piece 200 is provided with an inclined support surface 201 and a movement limiting surface 202.

[0038] In the lower chuck 11A, the inclined support surface 201 of each support piece 200 is formed so as to be able to support the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11B. The movement limiting surface 202 extends upward a certain distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11A. On the other hand, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 is formed so as to be able to support the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11A. The movement limiting surface 202 extends upward a certain distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11B.

[0039] The lower chuck drivers 13A and 13B include air cylinders or motors as actuators. The lower chuck drivers 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B approach each other or move away from each other. Here, if the target positions of the lower chucks 11A and 11B in the X direction are predetermined, the lower chuck drivers 13A and 13B can individually adjust the positions of the lower chucks 11A and 11B in the X direction based on the target position information. For example, by making the distance between the lower chucks 11A and 11B smaller than the outer diameter of the substrate W, the substrate W can be placed on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B. In this case, the outer peripheral edge of the substrate W is supported by each inclined support surface 201.

[0040] Figure 4 is an external perspective view of the upper chucks 12A and 12B shown in Figures 1 and 2. In Figure 4, the upper chucks 12A and 12B are indicated by thick solid lines. The lower chucks 11A and 11B are indicated by dotted lines. In the external perspective view of Figure 4, the scale of each part has been changed from that of the external perspective view of Figure 2 so that the shapes of the upper chucks 12A and 12B can be more easily understood.

[0041] 4, like the lower chucks 11A and 11B, the upper chucks 12A and 12B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces 300. Each holding piece 300 has an abutment surface 301 and a protrusion 302.

[0042] In the upper chuck 12A, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12B and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12B. On the other hand, in the upper chuck 12B, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12A and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12A.

[0043] The upper chuck driving units 14A, 14B include air cylinders or motors as actuators. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move away from each other. Here, when the target positions of the upper chucks 12A, 12B in the X direction are determined in advance, the upper chuck driving units 14A, 14B can individually adjust the positions of the upper chucks 12A, 12B in the X direction based on information about the target positions.

[0044] In the upper holding devices 10A and 10B, the upper chucks 12A and 12B are moved toward the outer circumferential edge of the substrate W supported by the lower chucks 11A and 11B. The two abutment surfaces 301 of the upper chuck 12A and the two abutment surfaces 301 of the upper chuck 12B come into contact with multiple portions of the outer circumferential edge of the substrate W, thereby holding the outer circumferential edge of the substrate W and firmly fixing the substrate W.

[0045] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotary support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0046] The rotation support shaft 71 is supported on the bottom surface portion 2a by an upper surface cleaning drive unit 74 so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0047] An upper surface cleaning fluid supply unit 75 (FIG. 5) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0048] The upper surface cleaning drive unit 74 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc over the upper surface of the substrate W that is suction-held and rotated by the suction holding unit 21, it is possible to clean the entire upper surface of the substrate W.

[0049] 1, an edge cleaning device 80 is provided on the other side of cup 61 so as to be located near upper holding device 10A in a plan view. Edge cleaning device 80 includes a rotary support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0050] The rotation support shaft 81 is supported by a bevel brush drive unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotation support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around an axis extending in the vertical direction.

[0051] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer peripheral edge of the substrate W can be cleaned at the central portion in the vertical direction of the outer peripheral surface.

[0052] The bevel brush driving unit 84 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is being sucked and held by the sucking and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0053] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 around an axis extending in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W.

[0054] Figure 5 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1. Control device 9 in Figure 5 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program.

[0055] 5, the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a delivery control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in / carry-out control unit 91. The functional units of the control device 9 are realized by a CPU executing, on a RAM, a substrate cleaning program stored in a storage device. Some or all of the functional units of the control device 9 may be realized by hardware such as electronic circuits.

[0056] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W by the suction holding unit 21 and rotate the suction-held substrate W.

[0057] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holder 21.

[0058] The lower surface cleaning control unit 9E controls the lower surface brush operation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 in order to clean the lower surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 in order to use a cup 61 to catch the cleaning liquid splashed from the substrate W when the substrate W sucked and held by the suction holding unit 21 is cleaned.

[0059] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W sucked and held by the suction holder 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W sucked and held by the suction holder 21. The loading / unloading control unit 9I controls the shutter drive unit 92 to open and close the loading / unloading opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0060] 2. Overview of operation when cleaning the central area of ​​the bottom surface of the substrate cleaning device FIG. 6 is a schematic diagram for explaining the overall operation of the substrate cleaning apparatus 1. In FIG. 6, the upper part shows a plan view of the substrate cleaning apparatus 1. The lower part shows a side view of the lower holding device 20 and its surrounding area as viewed along the X direction. The side view in the lower part corresponds to the side view taken along line AA in FIG. 1. Note that to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the scale of some components differs between the plan view in the upper part and the side view in the lower part. The cup 61 is indicated by a two-dot chain line, and the outline of the substrate W is indicated by a thick dashed line.

[0061] 6, as indicated by the thick solid arrow a5, the lifting support 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W. Furthermore, as indicated by the thick solid arrow a6, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0062] The lower part of FIG. 6 shows an enlarged side view of the portion where the lower-surface brush 51 contacts the underside of the substrate W in a bubble. As shown in the bubble, with the lower-surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection unit 53 are held in positions close to the underside of the substrate W. At this time, the liquid nozzle 52 ejects cleaning liquid toward the underside of the substrate W at a position near the lower-surface brush 51, as indicated by the outline arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W is guided to the contact portion between the lower-surface brush 51 and the substrate W, and contaminants removed from the back surface of the substrate W by the lower-surface brush 51 are washed away by the cleaning liquid. In this way, in the lower-surface cleaning device 50, the liquid nozzle 52 and the lower-surface brush 51 are attached to the lifting support unit 54. This allows the cleaning liquid to be efficiently supplied to the portion of the underside of the substrate W being cleaned by the lower-surface brush 51. This reduces the amount of cleaning liquid consumed and suppresses excessive splashing of the cleaning liquid.

[0063] 6, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W is stopped. At this time, the spray of gas from the gas ejection part 53 onto the substrate W continues.

[0064] 3. Pressure control of the pair of upper holding devices In this embodiment, the substrate W is firmly fixed by being sandwiched between a pair of upper holding devices 10A, 10B that are arranged opposite each other with the substrate W sandwiched therebetween in a plan view. Since the substrate W has a certain weight, the substrate W is curved by gravity. In this case, the downward displacement of the central portion of the substrate W is maximized. Furthermore, as the pressing force with which the pair of upper holding devices 10A, 10B press the substrate W in the direction of sandwiching it between themselves increases, the downward displacement of the central portion of the substrate W increases. Therefore, the amount of downward displacement of the central portion of the substrate W can be adjusted by adjusting the pressing force. Adjusting the pressing force corresponds to adjusting the distance between the upper holding devices 10A, 10B. Specifically, the pressing force increases when the upper chuck driving units 14A, 14B move the upper chucks 12A, 12B closer to each other, and the pressing force decreases when the upper chuck driving units 14A, 14B move the upper chucks 12A, 12B away from each other.

[0065] On the other hand, while the lower surface brush 51 is cleaning the central region of the lower surface of the substrate W, the lower surface brush 51 is pressed against the lower surface of the substrate W. At this time, whether the central portion of the substrate W is displaced or not is determined by the resultant force of gravity acting on the substrate W and the forces acting on the substrate W from the upper holding devices 10A and 10B, and the upward force acting on the lower surface brush 51.

[0066] In the substrate cleaning apparatus 1 of this embodiment, the lower surface brush operation drive unit 55a maintains a constant upward pushing force on the lower surface of the substrate W while the lower surface brush 51 is cleaning the central region of the lower surface of the substrate W. Therefore, the upper chuck drive units 14A, 14B adjust the pushing force by changing the distance between the upper chucks 12A, 12B, thereby adjusting the displacement amount of the central portion of the substrate W. Here, the displacement amount is expressed as the vertical distance between the position of the central portion of the substrate W and the reference position, where the position at which the substrate W is held by the pair of upper holding devices 10A, 10B is defined as a reference position. The displacement amount is defined as a negative value below the reference position and a positive value above the reference position. The maximum displacement amount by which the central portion of the substrate W is allowed to displace in the positive direction is referred to as the upper limit, and the minimum displacement amount by which the central portion of the substrate W is allowed to displace in the negative direction is referred to as the lower limit.

[0067] Fig. 7 is a diagram showing a schematic diagram of the positional relationship between the substrate W and the lower-surface brush when the substrate is not displaced. Fig. 8 is a diagram showing an example of the contact surface between the substrate W and the lower-surface brush when the substrate is not displaced. In Fig. 7, the area where the substrate W and the lower-surface brush 51 contact is shown by a thick line, and in Fig. 8, the area where the substrate W and the lower-surface brush 51 contact is shown by hatching.

[0068] 7 and 8, the central portion of the substrate W is located at the reference position. In this case, the displacement of the substrate W is zero, the substrate W is substantially horizontal over its entirety, and the lower surface central region BC of the substrate W is flat. Meanwhile, the upper surface of the lower surface brush 51 is substantially horizontal. Therefore, the lower surface brush 51 and the substrate W come into contact over the entire region R1 that covers the entire lower surface central region BC. In this case, the force acting between the lower surface brush 51 and the lower surface central region BC is evenly distributed over the entire region R1.

[0069] Fig. 9 is a diagram showing a schematic diagram of the positional relationship between the substrate W and the lower-surface brush when the substrate is displaced to the minus side. Fig. 10 is a diagram showing an example of the contact surface between the substrate W and the lower-surface brush when the substrate is displaced to the minus side. In Fig. 9, the area where the substrate W and the lower-surface brush 51 contact is shown by a thick line, and in Fig. 10, the area where the substrate W and the lower-surface brush 51 contact is shown by hatching.

[0070] 9, when the center of the substrate W is displaced toward the negative side from the reference position, the substrate W assumes a downward protrusion, and the lower surface central region BC becomes curved. On the other hand, the upper surface of the lower surface brush 51 is approximately horizontal. Therefore, the entire upper surface of the lower surface brush 51 does not come into contact with the substrate W. Referring to FIG. 10, the lower surface brush 51 and the substrate W come into contact with each other in a circular or elliptical central region R2 of the lower surface central region BC that includes the center of the substrate W and has a smaller diameter than the lower surface central region BC.

[0071] Fig. 11 is a diagram showing a schematic diagram of the positional relationship between the substrate W and the lower-surface brush when the substrate is displaced to the plus side. Fig. 12 is a diagram showing an example of the contact surface between the substrate W and the lower-surface brush when the substrate is displaced to the plus side. In Fig. 11, the area where the substrate W and the lower-surface brush 51 contact is shown by a thick line, and in Fig. 12, the area where the substrate W and the lower-surface brush 51 contact is shown by hatching.

[0072] 11, when the center of the substrate W is displaced to the positive side, the lower surface central region becomes convex upward, and the lower surface central region BC becomes curved. On the other hand, the upper surface of the lower surface brush 51 is approximately horizontal. Therefore, the entire upper surface of the lower surface brush 51 does not come into contact with the substrate W. Referring to FIG. 12, the lower surface brush 51 and the substrate W come into contact with each other in an annular region R3 of the lower surface central region BC that includes the outer periphery and excludes the center portion of the substrate W.

[0073] Fig. 13 is a time chart showing an example of changes in pressure, in which the vertical axis represents pressure and the horizontal axis represents time.

[0074] 13, at time t0 before the lower surface brush 51 starts cleaning the lower surface central region BC of the substrate W, the upper chuck driving units 14A and 14B control the actuators to press the substrate W with a pressing force f1. The pressing force f1 is a predetermined value as a force capable of holding the substrate W without rotating while the substrate W is being cleaned by the lower surface brush 51.

[0075] At time t1, the upper chuck driving units 14A and 14B control the actuators to press the substrate W with a pressing force f2. The pressing force f2 is a predetermined value so that the displacement amount of the substrate W reaches its lower limit when the substrate W receives an upward force from the lower surface brush 51. Therefore, at time t1, the displacement amount of the central portion of the substrate W reaches its lower limit. Therefore, as shown in FIGS. 9 and 10, the central region R2 of the substrate W is cleaned by the lower surface brush 51.

[0076] Then, the upper chuck driving units 14A and 14B aret1 Between time t1 and time t2, the actuator is controlled to reduce the pressing force. Time t2 is a time point before time t3, which is a time point before the end of a predetermined cleaning period during which the lower surface brush 51 cleans the lower surface central region BC of the substrate W. The upper chuck drive units 14A and 14B reduce the pressing force between time t1 and time t2 so that the pressing force becomes pressing force f1 at time t2, and the force that displaces the central portion of the substrate W downward gradually decreases. Because the upward pressing force applied to the lower surface brush 51 is constant, the lower surface brush 51 rises while in contact with the substrate W. As a result, the central portion of the substrate W rises from the lower limit to the reference position. At time t2, the entire region R1 within the lower surface central region BC of the substrate W comes into contact with the lower surface brush 51. Therefore, during the period from time t1 to time t2, the area where the lower surface brush 51 contacts the substrate W gradually expands from the central region R2 to the entire region R1.

[0077] Between time t2 and time t3, the upper chuck drivers 14A and 14B control the actuators to maintain the pressing force f1. As a result, the downward force that the lower brush 51 receives from the substrate W is constant. The upward pushing force applied to the lower brush 51 is constant and is set to a value greater than the downward force that the lower brush 51 receives from the substrate W held by the pressing force f1. As a result, between time t2 and time t3, the lower brush 51 rises while in contact with the substrate W. As a result, the central portion of the substrate W rises from the reference position to an upper limit. At time t3, an annular region R3 within the lower surface central region BC of the substrate W comes into contact with the lower brush 51. Therefore, during the period from time t2 to time t3, the area where the lower brush 51 and the substrate W contact each other gradually narrows to the annular region R3, becoming the entire region R1.

[0078] Fig. 14 is a flowchart showing an example of the flow of a pressing force control process. The pressing force control process is a process executed by the control device 9. Referring to Fig. 14, the control device 9 controls the upper chuck driving units 14A and 14B to cause the upper chucks 12A and 12B to press the substrate W with a pressing force f1 (step S01).

[0079] In the next step S02, the control device 9 controls the upper chuck driving units 14A and 14B to cause the upper chucks 12A and 12B to press the substrate W with a pressing force f2. At this stage, the lower surface brush 51 comes into contact with the substrate W in a central region R2 within the central region BC of the lower surface of the substrate W. As a result, the central region R2 of the substrate W is cleaned by the lower surface brush 51.

[0080] In step S03, the pressure starts to be reduced, and the process proceeds to step S04. The reduction rate is determined so that the pressure becomes f1 at time t2, as shown in FIG.

[0081] In step S04, it is determined whether a predetermined time has elapsed since the start of cleaning. The process remains on standby until the predetermined time has elapsed since the start of cleaning (NO in step S04), and once the predetermined time has elapsed (YES in step S04), the process proceeds to step S05. The predetermined time is the time from time t1 to time t2 in FIG. 13. Therefore, between time t1 and time t2, the pressing force gradually decreases from f2 to f1 at time t2. Because the pressing force gradually decreases from f2 to f1 between time t1 and time t2, the area where the lower surface brush 51 contacts the substrate W gradually expands from the central region R2 to the entire region R1.

[0082] In step S05, the control device 9 controls the upper chuck driving units 14A and 14B to press the substrate W with a pressing force f1. The downward force that the lower surface brush 51 receives from the substrate W pressed with the pressing force f1 is constant. As a result, the lower surface brush 51 presses the central portion of the substrate W upward. This causes the central portion of the substrate W to gradually move upward from the reference position. As a result, the area where the lower surface brush 51 and the substrate W contact each other gradually narrows from the entire area R1 to an annular area R3. At time t3 when the cleaning period ends, the central portion of the substrate W moves to the upper limit value.

[0083] In the next step S06, it is determined whether the cleaning period has ended. The process waits until the cleaning period has ended (NO in step S06), and if the cleaning period has ended (YES in step S06), the process ends.

[0084] 4.Effects (1) The pair of upper holding devices 10A, 10B are controlled by the upper chuck driving units 14A, 14B so that the central portion of the substrate W is displaced upward or downward while the central region BC of the lower surface of the substrate W is being cleaned by the lower surface brush 51, so that the substrate W can be deformed into a shape suited to cleaning by the lower surface brush 51. This makes it possible to improve the efficiency of the cleaning process of the substrate W.

[0085] (2) The upper chuck driving units 14A, 14B adjust the distance between the pair of upper holding devices 10A, 10B that are arranged opposite each other with the substrate sandwiched therebetween, so that the substrate W can be easily deformed.

[0086] [Second embodiment] FIG. 15 is an external perspective view showing the internal configuration of a substrate cleaning apparatus according to the second embodiment. Referring to FIG. 15, in substrate cleaning apparatus 1 according to the second embodiment, a pair of upper holding devices 10A and 10B provided in substrate cleaning apparatus 1 according to the first embodiment shown in FIG. 2 are replaced by a pair of upper holding devices 210A and 210B. Furthermore, regarding the functions of substrate cleaning apparatus 1 according to the second embodiment, upper chuck driving units 14A and 14B and lower chuck driving units 13A and 13B provided in substrate cleaning apparatus 1 according to the first embodiment shown in FIG. 5 are replaced by holding device driving units 221A and 221B and roller driving units 223A and 223B, respectively. Below, differences between substrate cleaning apparatus 1 according to the second embodiment and substrate cleaning apparatus 1 according to the first embodiment will be mainly described.

[0087] 1. A pair of upper holding devices FIG. 16 is an external perspective view of a pair of upper holding devices according to the second embodiment. FIG. 17 is a front view schematically illustrating a pair of upper holding devices according to the second embodiment. Referring to FIGS. 16 and 17, the pair of upper holding devices 210A, 210B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the pair of upper holding devices 210A, 210B has a roller support unit 211, an upper roller 213, and a lower roller 215. The upper roller 213 and the lower roller 215 are cylindrical. The upper roller 213 and the lower roller 215 are each supported by the roller support unit 211 with their rotation axes parallel to the Y direction, with the center of rotation as the axis. The upper roller 213 is biased toward the lower roller 215. For example, the rotation axis of the upper roller 213 is biased downward by an elastic body such as a spring, etc. Therefore, the upper roller 213 and the lower roller 215 are in contact with each other without any gap when the substrate W is not being held therebetween.

[0088] The holding device drivers 221A and 221B include air cylinders or motors as actuators. The holding device drivers 221A and 221B move the upper holding devices 210A and 210B so that the upper holding devices 210A and 210B approach each other or move away from each other. Here, if the target positions of the upper holding devices 210A and 210B in the X direction are predetermined, the holding device drivers 221A and 221B can individually adjust the positions of the upper holding devices 210A and 210B in the X direction based on the target position information. For example, by making the distance between the upper holding devices 210A and 210B smaller than the outer diameter of the substrate W, the substrate W can be inserted between the upper rollers 213 and lower rollers 215 of each of the upper holding devices 210A and 210B. While the holding device drivers 221A, 221B are individually adjusting the positions of the upper holding devices 210A, 210B, the upper rollers 213 and lower rollers 215 are rotatable so that the substrate W can be smoothly inserted between them. At this stage, multiple portions of the outer circumferential edge of the substrate W are inserted between the upper rollers 213 and lower rollers 215 of the upper holding devices 210A, 210B, whereby the outer circumferential edge of the substrate W is held by the upper holding devices 210A, 210B, and the substrate W is firmly fixed.

[0089] At least one of the upper roller 213 and the lower roller 215 may be made of an elastic material. In this case, it is not necessary to bias the rotation shaft of the upper roller 213 with an elastic body.

[0090] The roller drivers 223A and 223B include a stepping motor and multiple gears. The multiple gears transmit the rotational force of the stepping motor to the rotation shafts of the upper roller 213 and the lower roller 215. The multiple gears are combined so that the upper roller 213 and the lower roller 215 rotate in opposite directions as the stepping motor rotates. The roller drivers 223A and 223B drive the stepping motors to rotate the upper roller 213 and the lower roller 215 in opposite directions. The roller drivers 223A and 223B rotate the upper roller 213 and the lower roller 215 after the positions of the upper holding devices 210A and 210B have been adjusted by the holding device drivers 221A and 221B.

[0091] The sides of the upper roller 213 and the lower roller 215 that come into contact with the substrate W preferably have a predetermined coefficient of friction so that frictional force is generated at the contact portions with the substrate W. In this case, the upper roller 213 and the lower roller 215 can prevent idling while holding the substrate W. The roller drivers 223A and 223B displace the center portion of the substrate W by rotating the upper roller 213 and the lower roller 215 in opposite directions. When the roller drivers 223A and 223B rotate the upper roller 213 in a direction to feed the substrate W and rotate the lower roller 215 in a direction to draw the substrate W, a force is applied that displaces the center portion of the substrate W downward. Conversely, when the roller drivers 223A and 223B rotate the upper roller 213 in a direction to draw the substrate W and rotate the lower roller 215 in a direction to feed the substrate W, a force is applied that displaces the center portion of the substrate W upward. Hereinafter, the rotation direction of the upper roller 213 and the lower roller 215 when a force is acting to displace the central portion of the substrate W downward is referred to as negative rotation, and the rotation direction of the upper roller 213 and the lower roller 215 when a force is acting to displace the central portion of the substrate W upward is referred to as positive rotation.

[0092] 2. Substrate displacement control As described above, in the second embodiment, the upward pushing force applied to the lower-surface brush 51 is constant. When the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the negative direction, a force is generated on the substrate W that pushes the lower-surface brush 51 downward. When the force with which the substrate W pushes the lower-surface brush 51 downward becomes greater than the upward pushing force, the lower-surface brush 51 moves downward. When the force with which the substrate W pushes the lower-surface brush 51 downward becomes equal to the upward pushing force while the lower-surface brush 51 is moving downward, the lower-surface brush 51 stops moving downward and comes to a halt.

[0093] Furthermore, when the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the forward direction, the force with which the substrate W presses the lower-surface brush 51 downward becomes smaller. When the force with which the substrate W presses the lower-surface brush 51 downward becomes smaller than the upward force, the lower-surface brush 51 moves upward. When the force with which the substrate W presses the lower-surface brush 51 downward becomes equal to the upward force while the lower-surface brush 51 is moving upward, the lower-surface brush 51 stops moving upward and comes to a halt.

[0094] The amount of displacement of the central portion of the substrate W is determined by the rotation angles of the upper roller 213 and the lower roller 215. Furthermore, the force with which the substrate W presses the lower-surface brush 51 downward varies while the upper roller 213 and the lower roller 215 are rotating. While the upper roller 213 and the lower roller 215 are stopped rotating, the force with which the substrate W presses the lower-surface brush 51 downward becomes equal to the upward pushing force.

[0095] Fig. 18 is a first time chart showing an example of changes in the rotation angles of the upper roller and the lower roller. In the time chart of Fig. 18, the vertical axis represents the rotation angles of the upper roller 213 and the lower roller 215, and the horizontal axis represents time. Furthermore, Rp represents the rotation angle of the upper roller 213 and the lower roller 215 when the amount of displacement of the central portion of the substrate W is at its upper limit, and Rn represents the rotation angle of the upper roller 213 and the lower roller 215 when the amount of displacement of the central portion of the substrate W is at its lower limit.

[0096] 18, at time t0, before the lower surface brush 51 starts cleaning the substrate W, the rotation angle of the upper roller 213 and the lower roller 215 is 0. Time t1 is the time when the lower surface brush 51 starts cleaning the lower surface central region BC of the substrate W. Between time t0 and time t1, the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the negative direction up to a rotation angle Rn. During this time, the upper roller 213 and the lower roller 215 rotate in the negative direction, generating a force that presses the lower surface brush 51 downward from the substrate W, and the central portion of the substrate W is displaced downward together with the lower surface brush 51. At time t1, the amount of displacement of the central portion of the substrate W reaches a lower limit value.

[0097] Then, between time t1 and time t3, the roller drivers 223A and 223B rotate the upper roller 213 and the lower roller 215 in the forward direction until the rotation angle reaches Rp. The period from time t1 to time t3 is a cleaning period that is predetermined as a period during which the lower surface brush 51 cleans the lower surface central region BC of the substrate W. During this period, the upper roller 213 and the lower roller 215 rotate in the forward direction, so that the force with which the substrate W presses the lower surface brush 51 downward becomes smaller than the pressing force, and the central portion of the substrate W is displaced upward together with the lower surface brush 51. At time t3, the amount of displacement of the central portion of the substrate W reaches its upper limit.

[0098] During the period from time t3 to time t4, roller driving units 223A and 223B rotate upper roller 213 and lower roller 215 in the negative direction until the rotation angle reaches zero.

[0099] At time t1, the lower surface brush 51 comes into contact with the substrate W in the central region R2 within the central region BC of the lower surface of the substrate W. Therefore, at time t1, the lower surface brush 51 comes into contact with the substrate W in the central region R2 within the central region BC of the lower surface of the substrate W. Therefore, the central region R2 of the substrate W is cleaned.

[0100] At time t2, when the rotation angle of the upper roller 213 and the lower roller 215 becomes 0, the lower surface brush 51 comes into contact with the substrate W in the entire region R1 within the lower surface central region BC of the substrate W. Therefore, at time t2, the lower surface brush 51 comes into contact with the substrate W in the entire region R1 within the lower surface central region BC of the substrate W. Therefore, the entire region R1 (lower surface central region BC) of the substrate W is cleaned. During the period from time t1 to time t2, the area where the lower surface brush 51 and the substrate W come into contact gradually expands from the central region R2 to become the entire region R1.

[0101] At time t3, the lower surface brush 51 comes into contact with the substrate W in annular region R3 within the lower surface central region BC of the substrate W. Therefore, at time t3, the lower surface brush 51 comes into contact with the substrate W in annular region R3 within the lower surface central region BC of the substrate W. Therefore, the annular region R3 of the substrate W is cleaned. During the period from time t2 to time t3, the area where the lower surface brush 51 and the substrate W come into contact gradually narrows from the entire region R1 to the annular region R3.

[0102] 19 is a flowchart showing an example of the flow of the substrate displacement control process. The substrate displacement control process is a process executed by the control device 9. Referring to FIG. 19, the control device 9 controls the roller driving units 223A and 223B to drive the upper roller 213 and the lower roller 215 is rotated in the negative direction to a rotation angle Rn (step S11). In the next step S12, it is determined whether cleaning by the lower surface brush 51 has started. The process waits until cleaning starts (NO in step S12), and if cleaning has started (YES in step S12), the process proceeds to step S13.

[0103] In step S13, the control device 9 controls the upper roller 213 and the lower roller 215 is rotated forward at a predetermined speed, and the process proceeds to step S14. The predetermined speed is the speed at which the rotation angles of the upper roller 213 and the lower roller 215 change from Rn to Rp during the cleaning period, as shown in FIG.

[0104] In step S14, it is determined whether the cleaning period has ended. The process waits until the cleaning period ends (NO in step S14), and if the cleaning period ends (YES in step S14), the process ends.

[0105] In step S15, the control device 9 controls the upper roller 213 and the lower roller 215 is rotated in the negative direction to a rotation angle of 0, and the process ends.

[0106] In this embodiment, from time t1 to time t3 to 1 shows an example in which the upper roller 213 and the lower roller 215 are rotated forward at a predetermined speed. At time t1, the upper roller 213 and the lower roller 215 are rotated to the rotation angle Rp, and then the rotation angle Rp is increased from time t1 to time t3. to Alternatively, the upper roller 213 and the lower roller 215 may be rotated in the negative direction at a predetermined speed.

[0107] 3. First Modification of Substrate Displacement Control Fig. 20 is a time chart showing an example of changes in the rotation angles of the upper roller and the lower roller in the first modified example. In the time chart of Fig. 20, the vertical axis represents the rotation angles of the upper roller 213 and the lower roller 215, and the horizontal axis represents time. Furthermore, Rp represents the rotation angle of the upper roller 213 and the lower roller 215 when the amount of displacement of the central portion of the substrate W is at its upper limit, and Rn represents the rotation angle of the upper roller 213 and the lower roller 215 when the amount of displacement of the central portion of the substrate W is at its lower limit.

[0108] 20, at time t0, before the lower surface brush 51 starts cleaning the substrate W, the rotation angle of the upper roller 213 and the lower roller 215 is 0. Time t1 is the time when the lower surface brush 51 starts cleaning the lower surface central region BC of the substrate W. Between time t0 and time t1, the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the negative direction up to a rotation angle Rn. During this time, the upper roller 213 and the lower roller 215 rotate in the negative direction, generating a force that presses the lower surface brush 51 downward from the substrate W, and the central portion of the substrate W is displaced downward together with the lower surface brush 51. At time t1, the amount of displacement of the central portion of the substrate W reaches a lower limit value.

[0109] During period T1 from time t1 to time t2, the rotation angle Rn of the upper roller 213 and the lower roller 215 is maintained. Period T1 is a period determined in advance as a period during which the lower surface brush 51 cleans a central region R2 of the central region on the lower surface of the substrate W. During this period, the lower surface brush 51 comes into contact with the substrate W in the central region R2 within the central region BC on the lower surface of the substrate W. Therefore, the central region R2 of the substrate W is cleaned during period T1.

[0110] From time t2 to time t3, the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the forward direction to a rotation angle of 0. During this time, the upper roller 213 and the lower roller 215 rotate in the forward direction, so that the force with which the substrate W presses the lower surface brush 51 downward becomes smaller than the pressing force, and the central portion of the substrate W is displaced upward together with the lower surface brush 51. At time t3, the central portion of the substrate W becomes the reference position.

[0111] Then, during period T2 from time t3 to time t4, the rotation angle of the upper roller 213 and the lower roller 215 is maintained at 0. Period T2 is a period determined in advance as a period during which the lower surface brush 51 cleans the entire region R1 of the lower surface central region BC of the substrate W. During this period, the lower surface brush 51 comes into contact with the substrate W over the entire region R1 within the lower surface central region BC of the substrate W. Therefore, the entire region R1 (lower surface central region BC) of the substrate W is cleaned during period T2.

[0112] From time t4 to time t5, the roller driving units 223A, 223B rotate the upper roller 213 and the lower roller 215 in the forward direction to a rotation angle of Rp. During this time, the upper roller 213 and the lower roller 215 rotate in the forward direction, so that the force with which the substrate W presses the lower surface brush 51 downward becomes smaller than the pressing force, and the central portion of the substrate W is displaced upward together with the lower surface brush 51. At time t5, the amount of displacement of the central portion of the substrate W reaches its upper limit.

[0113] Then, during a period T3 from time t5 to time t6, the rotation angles of the upper roller 213 and the lower roller 215 are maintained at Rp. The period T3 is a period determined in advance as a period during which the lower surface brush 51 cleans the annular region R3 in the lower surface central region BC of the substrate W. During this period, the lower surface brush 51 comes into contact with the substrate W in the annular region R3 within the lower surface central region BC of the substrate W. Therefore, the annular region R3 of the substrate W is cleaned during the period T3.

[0114] During the period from time t6 to time t7, roller driving units 223A and 223B rotate upper roller 213 and lower roller 215 in the negative direction until the rotation angle reaches zero.

[0115] 21 is a flowchart showing an example of the flow of the substrate displacement control process in the first modified example. Referring to FIG. 21, the control device 9 controls the roller driving units 223A and 223B to drive the upper roller 213 and the lower roller 215 is rotated in the negative direction by a rotation angle Rn (step S21), and the process proceeds to step S22.

[0116] In step S22, it is determined whether cleaning has started with the lower surface brush 51. The process remains on standby until cleaning starts (NO in step S22), and once cleaning has started (YES in step S22), the process proceeds to step S23.

[0117] In step S23, it is determined whether or not the period T1 has elapsed. The period T1 is a predetermined period for cleaning the central region R2 of the central region BC of the lower surface of the substrate W with the lower surface brush 51. The process remains in a standby state until the period T1 has elapsed (NO in step S23), and once the period T1 has elapsed (YES in step S23), the process proceeds to step S24.

[0118] In step S24, the control device 9 controls the roller driving units 223A and 223B to rotate the upper roller 213 and the lower roller 215 is rotated forward to a rotation angle of 0, and the process proceeds to step S25. In step S25, it is determined whether or not period T2 has elapsed. Period T2 is a predetermined period for cleaning the entire region R1 of the central region BC of the lower surface of the substrate W with the lower surface brush 51. The process remains in a standby state until period T2 has elapsed (NO in step S25), and once period T2 has elapsed (YES in step S25), the process proceeds to step S26.

[0119] In step S26, the control device 9 controls the roller drivers 223A and 223B to rotate the upper roller 213 and the lower roller in the forward direction up to a rotation angle Rp, and the process proceeds to step S27. In step S27, it is determined whether or not the period T3 has elapsed. The period T3 is a predetermined period for cleaning the annular region R3 in the lower surface central region BC of the substrate W with the lower surface brush 51. The process remains in a standby state until the period T3 has elapsed (NO in step S27), and once the period T3 has elapsed (YES in step S27), the process proceeds to step S28. In step S28, the control device 9 controls the roller drivers 223A and 223B to rotate the upper roller 213 and the lower roller in the reverse direction up to a rotation angle of 0, and the process ends.

[0120] 4. Modification of Substrate Displacement Control The upper roller 213 and the lower roller 214 shown in FIG. 215 The cycle of continuously rotating the upper roller 213 and the lower roller 214 may be repeated. 215Alternatively, a cycle of continuous positive rotation and a cycle of continuous negative rotation may be alternately repeated.

[0121] In addition, the upper roller 213 and the lower roller 214 shown in FIG. 215 The upper roller 213 and the lower roller 214 may be rotated in a stepwise forward direction in a cycle repeated. 215 Alternatively, a cycle of gradually rotating the rotor in the positive direction and a cycle of gradually rotating the rotor in the negative direction may be alternately repeated.

[0122] Alternatively, a cycle of continuous positive or negative rotation and a cycle of stepwise positive or negative rotation may be alternately repeated.

[0123] 5. Modification of a pair of upper holding devices Fig. 22 is a front view schematically showing an example of a modification of a pair of upper holding devices. Referring to Fig. 22, in the modification of the second embodiment, the pair of upper holding devices 210A, 210B included in the substrate cleaning apparatus 1 in the second embodiment are changed to a pair of upper holding devices 230A, 230B, and the holding device drivers 221A, 221B and roller drivers 223A, 223B are changed to holding device drivers 241A, 241B and rotation drivers 243A, 243B, respectively.

[0124] The pair of upper holding devices 230A, 230B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the pair of upper holding devices 230A, 230B has a gripping unit 231, an upper surface abutting unit 233, and a lower surface abutting unit 235. The upper surface abutting unit 233 and the lower surface abutting unit 235 are flat plate-shaped. The upper surface abutting unit 233 and the lower surface abutting unit 235 are supported by the gripping unit 231 so that the lower surface of the upper surface abutting unit 233 faces the upper surface of the lower surface abutting unit 235. The gripping unit 231 is pivotally supported by a rotation shaft 231A parallel to the Y direction.

[0125] The upper surface abutment portion 233 is supported by the gripping portion 231 so as to be movable in the vertical direction. The gripping portion 231 is equipped with a mechanism for adjusting the distance between the upper surface abutment portion 233 and the lower surface abutment portion 235. Therefore, with the gripping portion 231 moving the upper surface abutment portion 233 upward, the substrate W is inserted into the space between the upper surface abutment portion 233 and the lower surface abutment portion 235. Thereafter, the gripping portion 231 moves the upper surface abutment portion 233 downward, thereby sandwiching the substrate W between the upper surface abutment portion 233 and the lower surface abutment portion 235. In this state, the upper surface abutment portion 233 abuts against a part of the upper surface of the substrate W, and the lower surface abutment portion 235 abuts against a part of the lower surface of the substrate W.

[0126] Holding device drive unit 241A, 241B includes an air cylinder or a motor as an actuator. 241A, 241B The upper holding devices 230A and 230B are moved so that the upper holding devices 230A and 230B approach each other or move away from each other. Here, if the target positions of the upper holding devices 230A and 230B in the X direction are predetermined, the holding device driving unit 241A, 241B can individually adjust the positions of the upper holding devices 230A, 230B in the X direction based on the information on the target positions. For example, by making the distance between the upper holding devices 230A, 230B smaller than the outer diameter of the substrate W, the substrate W can be inserted between the upper surface abutment portion 233 and the lower surface abutment portion 235 of each of the upper holding devices 230A, 230B. 241A, 241B While the adjuster 231 is individually adjusting the positions of the upper holding devices 230A, 230B, the gripper 231 moves the upper surface abutment 233 upward. At this stage, multiple portions of the outer circumferential edge of the substrate W are inserted between the upper surface abutment 233 and the lower surface abutment 235 of each of the upper holding devices 230A, 230B. Thereafter, the gripper 231 moves the upper surface abutment 233 downward, whereby the outer circumferential edge of the substrate W is held by the upper holding devices 230A, 230B, and the substrate W is firmly fixed.

[0127] The rotational driving units 243A and 243B include stepping motors. The rotational driving units 243A and 243B drive the stepping motors to rotate the gripper 231 around the rotation axis 231A. Around The rotation drive units 243A and 243B are the holding device drive units. 241A, 241B After the positions of the upper holding devices 230A and 230B are adjusted by the rotation of the holding device drive unit, the gripping unit 231 is rotated. 241A, 241B While the positions of the upper holding devices 230A and 230B are being adjusted, the rotation drive units 243A and 243B fix the contact surfaces of the upper surface contact portion 233 and the lower surface contact portion 235 in horizontal positions so that the gripping portion 231 does not rotate.

[0128] The rotational drive units 243A and 243B rotate the gripping unit 231 of the upper holding device 230A and the gripping unit 231 of the upper holding device 230B in opposite directions. In Fig. 22, when the rotational drive unit 243A rotates the gripping unit 231 of the upper holding device 230A clockwise, the rotational drive unit 243B rotates the gripping unit 231 of the upper holding device 230B counterclockwise. In Fig. 22, when the rotational drive unit 243A rotates the gripping unit 231 of the upper holding device 230A counterclockwise, the rotational drive unit 243B rotates the gripping unit 231 of the upper holding device 230B clockwise.

[0129] Hereinafter, the clockwise rotation of the gripping portion 231 of the upper holding device 230A by the upper holding device 230A and the counterclockwise rotation of the gripping portion 231 of the upper holding device 230B by the rotation drive unit 243B will be referred to as the negative rotation of the pair of upper holding devices. Also, the counterclockwise rotation of the gripping portion 231 of the upper holding device 230A by the upper holding device 230A and the clockwise rotation of the gripping portion 231 of the upper holding device 230B by the upper holding device 230B will be referred to as the positive rotation of the pair of upper holding devices.

[0130] Rotation drive units 243A, 243B When the pair of upper holding devices 230A, 230B rotate in the forward direction, a force acts to displace the central portion of the substrate W upward. When the pair of upper holding devices 230A, 230B rotate in the reverse direction, a force acts to displace the central portion of the substrate W downward.

[0131] 6.Effects The substrate cleaning apparatus 1 in the second embodiment has the same effects as the substrate cleaning apparatus 1 in the first embodiment. Furthermore, the upper roller 213 and the lower roller 215 of each of the pair of upper holding devices 210A, 210B adjust the force that the upper roller 213 applies to the front surface of the substrate W and the force that the lower roller 215 applies to the back surface of the substrate W. This makes it possible to easily deform the substrate W.

[0132] [Third embodiment] The following describes substrate cleaning apparatus 1 according to the third embodiment, focusing on the differences from substrate cleaning apparatus 1 according to the second embodiment.

[0133] 1.Configuration of substrate cleaning equipment FIG. 23 is an external perspective view showing the internal configuration of a substrate cleaning apparatus 1 according to the third embodiment. Referring to FIG. 23, the substrate cleaning apparatus 1 according to the third embodiment further includes a displacement sensor 95 in addition to the components of the substrate cleaning apparatus 1 according to the second embodiment shown in FIG. 15. The displacement sensor 95 is provided vertically above the center of the substrate W held by the pair of upper holding devices 10A, 10B. The displacement sensor 95 measures the distance to the center of the substrate W held by the pair of upper holding devices 10A, 10B. Therefore, the displacement sensor 95 detects the vertical (Z-direction) displacement of the center of the substrate W. Here, the position at which the substrate W is held by the upper holding devices 10A, 10B is defined as a reference position, and the displacement amount of the center of the substrate W is represented by the vertical distance between the position of the center of the substrate W and the reference position. The displacement amount below the reference position is a negative value, and above the reference position is a positive value.

[0134] In the substrate cleaning apparatus 1 of the third embodiment, the displacement amount of the central portion of the substrate W is varied based on the output of the displacement sensor 95. Specifically, the displacement amount is adjusted so that the displacement of the central portion of the substrate W falls between an upper limit and a lower limit. The upper limit and lower limit values ​​of the displacement amount of the central portion of the substrate W are predetermined values. As shown in FIG. 11, when the central portion of the substrate W is displaced to the positive side, the substrate W has an upward protrusion and the central region BC of the lower surface becomes a curved surface. The upper limit is the limit at which the central portion of the substrate W is allowed to displace to the positive side. Maximum 9, when the central portion of the substrate W is displaced to the negative side, the substrate W has a downward protrusion, and the central region BC of the lower surface becomes a curved surface. The lower limit value is defined as the minimum value to which the central portion of the substrate W is allowed to displace to the negative side.

[0135] 2. Substrate displacement control 24 is a flowchart showing an example of the flow of a substrate displacement control process in the third embodiment. Referring to FIG. 24, the control device 9 controls the roller driving units 223A and 223B to move the upper roller 213 and the lower roller 215 is rotated in the negative direction by a rotation angle Rn (step S31), and the process proceeds to step S32. At this stage, the lower surface brush 51 comes into contact with the substrate W in a central region R2 within the central region BC of the lower surface of the substrate W. As a result, the central region R2 of the substrate W is cleaned by the lower surface brush 51.

[0136] In step S32, the control device 9 controls the upper roller 213 and the lower roller 215 The upper roller 213 and the lower roller 214 are rotated forward at a predetermined speed, and the process proceeds to step S33. 215 When the brush 51 rotates forward, the lower surface brush 51 rises together with the substrate W. This changes the shape of the substrate W, and the area of ​​the contact surface between the substrate W and the lower surface brush 51 increases over time. Then, the entire region R1 of the substrate W comes into contact with the lower surface brush 51, and thereafter, the amount of displacement of the central portion of the substrate W reaches an upper limit value.

[0137] In step S33, it is determined whether or not a predetermined cleaning period has elapsed, which is a period during which the lower surface brush 51 cleans the substrate W. If the cleaning period has not elapsed (NO in step S33), the process proceeds to step S34, and if the cleaning period has elapsed (YES in step S33), the process ends.

[0138] In step S34, it is determined whether the displacement amount of the substrate W is at the upper limit. The displacement amount of the substrate W is detected based on the output of the displacement sensor 95. If the displacement amount of the substrate W is at the upper limit, the process proceeds to step S35; otherwise, the process proceeds to step S36. If the process proceeds to step S35, the contact surface between the lower surface brush 51 and the substrate W is the annular region R3 shown in FIGS. 11 and 12.

[0139] In step S35, the control device 9 controls the upper roller 213 and the lower roller 215 The upper roller 213 and the lower roller 214 are rotated in the negative direction at a predetermined speed, and the process proceeds to step S36. 215 When the brush rotates in the negative direction, the lower brush 51 descends together with the substrate W. This changes the shape of the substrate W, gradually reducing the area of ​​the contact surface between the substrate W and the lower brush 51. Then, the substrate W comes into contact with the lower brush 51 in the central region R2, and thereafter the displacement amount of the central portion of the substrate W reaches a lower limit value.

[0140] In step S36, it is determined whether the displacement amount of the substrate W is at the lower limit value. The displacement amount of the substrate W is detected based on the output of the displacement sensor 95. If the displacement amount of the substrate W is at the lower limit value, the process returns to step S33; otherwise, the process returns to step S32.

[0141] 3.Effects The substrate cleaning apparatus 1 in the third embodiment has the same effects as the substrate cleaning apparatus 1 in the first and second embodiments. Furthermore, the pair of upper holding devices 10A, 10B are controlled so that the displacement of the substrate W detected by the displacement sensor 95 falls within a predetermined range, so that the substrate W can be displaced into a shape suited to the cleaning process by the lower surface brush 51. Furthermore, the substrate W can be cleaned without being damaged even if the pressing force applied to the lower surface brush 51 is changed.

[0142] [Other embodiments] (1) The substrate displacement control process in the third embodiment can also be applied to the substrate cleaning apparatus 1 in the first embodiment. In this case, the upper limit value is the displacement amount of the substrate W when the center of the substrate W is at the reference position, and the lower limit value is the minimum displacement amount by which the center of the substrate W is allowed to displace to the negative side. Therefore, the central region R2 and the entire region R1 can be cleaned by the lower surface brush 51 in that order.

[0143] (2) In this embodiment, the force acting between the substrate W and the lower surface brush 51 is changed by changing the force that the pair of upper holding devices 10A, 10B (210A, 210B, 230A, 230B) apply to the substrate W. The present invention is not limited to this. The force acting between the substrate W and the lower surface brush 51 may be changed by keeping the force that the pair of upper holding devices 10A, 10B (210A, 210B, 230A, 230B) apply to the substrate W constant and changing the pressing force that pushes the lower surface brush 51 upward.

[0144] (3) In the second and third embodiments, the process of cleaning the central region BC of the lower surface of the substrate W with the lower surface brush 51 has been described as an example, but the present invention is not limited to this. The substrate cleaning apparatus in the second and third embodiments may deform the substrate W when cleaning or drying the upper surface of the substrate W.

[0145] In this case, when cleaning or drying the top surface of the substrate W, the substrate W is deformed so that the displacement amount of the substrate W is an upper limit or a lower limit. For example, when cleaning the substrate W while deforming the substrate so that the displacement amount of the substrate W is an upper limit, the cleaning liquid flows toward the periphery of the substrate W, and by supplying the cleaning liquid to the central portion, the peripheral portion of the substrate W can be efficiently cleaned. Also, when drying the substrate W while deforming the substrate W so that the displacement amount of the substrate W is an upper limit, by blowing drying air toward the central portion of the substrate W, the liquid on the substrate W flows toward the periphery, and the substrate W can be efficiently dried.

[0146] [Correspondence between each element of the claims and each part of the embodiment] Below, examples of correspondence between each element of the claims and each element of the embodiments will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0147] In the above embodiment, the pair of upper holding devices 10A, 10B (210A, 210B, 230A, 230B) are an example of a substrate holding unit, the lower surface brush 51 is an example of a processing unit, the control device 9 is an example of a holding control unit, and the upper chucks 12A, 12B are examples of two pressing units. The upper roller 213 and the upper surface abutment portion 233 are an example of an upper gripping unit, and the lower roller 215 and the lower surface abutment portion 235 are an example of a lower gripping unit. The lower surface brush 51 is an example of a cleaning tool, and the displacement sensor 95 is an example of a displacement sensor. [Explanation of symbols]

[0148] 1 substrate cleaning device, 2 unit housing, 9 control device, 9A chuck control unit, 9E lower surface cleaning control unit, 9G upper surface cleaning control unit, 10A, 10B, 210A, 210B, 230A, 230B upper holding device, 12A, 12B upper chuck, 300 holding piece, 301 abutment surface, 302 protrusion, 14A, 14B upper chuck drive unit, 50 lower surface cleaning device, 51 lower surface brush, 55a lower surface brush operation drive unit, 55b lower surface brush lift drive unit, 55c lower surface brush movement drive unit, 70 upper surface cleaning device, 74 upper surface cleaning drive unit, 95 displacement sensor, 211 roller support unit, 213 upper roller, 215 lower roller, 221A, 221B holding device drive unit, 223A, 223B roller drive unit, 231 Grip part, 231A rotation shaft, 233 top contact part, 235 bottom contact part, 240A grip part, 241A, 241B holding device drive part, 243A, 243B rotation drive part, W board, BC bottom center area, R1 whole area, R2 center area, R3 annular area.

Claims

1. a substrate holder that holds an outer peripheral edge of the substrate; a processing unit for processing the front or rear surface of the substrate; a holding control unit that controls the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit, the substrate holding unit has two gripping units arranged opposite to each other with the substrate sandwiched therebetween, each of the two gripping portions includes an upper gripping portion that contacts the front surface of the substrate and a lower gripping portion that contacts the back surface of the substrate; The holding control unit adjusts the force applied by the upper gripping unit to the front surface of the substrate and the force applied by the lower gripping unit to the back surface of the substrate. Substrate processing equipment.

2. A substrate holding part that holds an outer peripheral edge of a substrate; a processing unit for processing the front or rear surface of the substrate; a holding control unit that controls the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit, the processing section includes a cleaning tool that comes into contact with a lower surface of the substrate to clean the lower surface of the substrate, The substrate processing apparatus, wherein the holding control unit controls the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the cleaning tool cleans a central region of a lower surface of the substrate.

3. the substrate holding portion has two pressing portions disposed opposite to each other with the substrate interposed therebetween, The substrate processing apparatus according to claim 1 , wherein the holding control unit adjusts the distance between the two pressing units.

4. a displacement sensor for detecting a displacement of the substrate; 4. The substrate processing apparatus according to claim 1, wherein the holding control unit controls the substrate holding unit so that displacement of the substrate falls within a predetermined range.

5. a substrate holder that holds an outer peripheral edge of the substrate; a processing unit for processing a front surface or a rear surface of the substrate, a holding control step of controlling the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit, the substrate holding unit has two gripping units arranged opposite to each other with the substrate sandwiched therebetween, each of the two gripping portions includes an upper gripping portion that contacts the front surface of the substrate and a lower gripping portion that contacts the back surface of the substrate; A substrate processing method, wherein the holding control step includes adjusting a force applied by the upper gripping part to the front surface of the substrate and a force applied by the lower gripping part to the back surface of the substrate.

6. A substrate holding part that holds an outer peripheral edge of a substrate; a processing unit for processing a front surface or a rear surface of the substrate, a holding control step of controlling the substrate holding unit so that a central portion of the substrate is displaced upward or downward while the substrate is being processed by the processing unit, the processing section includes a cleaning tool that comes into contact with a lower surface of the substrate to clean the lower surface of the substrate, The substrate processing method, wherein the holding control step includes controlling the substrate holding part so that a central portion of the substrate is displaced upward or downward while the cleaning tool cleans a central region of the lower surface of the substrate.

7. The substrate processing method according to claim 5 or 6, comprising: a displacement sensor for detecting a displacement of the substrate; The substrate processing method, wherein the holding control step includes controlling the substrate holder so that displacement of the substrate falls within a predetermined range.

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