SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To avoid the excessive use of sulfuric acid and hydrogen peroxide solution.SOLUTION: A substrate processing method includes the steps of: acquiring substrate information; selecting any of a liquid replacing step and a density adjusting step; discharging at least a part of a process liquid in a processing tank from the processing tank and supplying sulfuric acid and hydrogen peroxide solution to the processing tank when the liquid replacing step is selected in the selecting step and the process liquid in the processing tank does not satisfy a prescribed condition (first process liquid adjusting step); adjusting the density of the process liquid in the processing tank while circulating the process liquid in the processing tank via a piping connected to the processing tank when the density adjusting step is selected in the selecting step (second process liquid adjusting step); and immersing the substrate in the process liquid in the processing tank while circulating the process liquid in the processing tank adjusted in the first process liquid adjusting step or in the second process liquid adjusting step via the piping connected to the processing tank.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] Substances generated during the manufacturing process of a semiconductor device may adhere to the surface of a substrate to be processed, such as a semiconductor wafer (hereinafter referred to as "wafer"). These substances degrade the characteristics of the semiconductor device, so in order to remove these substances, the wafer surface is cleaned using several types of chemical solutions.

[0003] SPM liquid is used to clean wafer surfaces. It is a mixture of sulfuric acid and hydrogen peroxide. In addition to stripping off resist remaining on wafer surfaces and removing residues from substrates after resist ashing, SPM liquid is also used as a chemical liquid for oxidizing substrates after element separation. SPM liquid is used not only in single-wafer processing systems, in which chemical liquid is supplied to the surface of a wafer held on a rotating table while it is rotating, but also in batch processing systems, in which multiple wafers are simultaneously immersed in a processing tank filled with chemical liquid for cleaning.

[0004] When processing wafers using SPM liquid in a batch-type substrate processing apparatus, several dozen wafers are immersed in the SPM liquid, which is generally heated to 100°C to 130°C, and after a predetermined time has passed, the wafers are removed and the next wafer is immersed, repeating this process to process multiple wafers continuously. In such continuous processing, the SPM liquid in the processing tank adheres to the wafer surfaces and some of it is carried out of the processing tank, causing the liquid level to drop, so the SPM liquid is replenished with sulfuric acid and hydrogen peroxide at predetermined times.

[0005] Furthermore, hydrogen peroxide is known to be a relatively unstable substance. Hydrogen peroxide decomposes over time to produce water. Therefore, even if sulfuric acid and hydrogen peroxide solution are replenished as the liquid level drops, the sulfuric acid concentration in the SPM liquid decreases over time. A decrease in sulfuric acid concentration reduces the contaminant removal ability, requiring wafer processing using this processing tank to be periodically stopped and the entire SPM liquid in the processing tank replaced. This reduces processing efficiency and / or increases chemical consumption, resulting in higher chemical costs. For this reason, methods have been studied to prevent the decrease in contaminant removal ability in batch-type substrate processing equipment (see Patent Document 1).

[0006] In the substrate processing apparatus of Patent Document 1, sulfuric acid is replenished downstream of the heater in the circulation flow path. Patent Document 1 describes that by replenishing sulfuric acid downstream of the heater in the circulation flow path, hydrogen peroxide and Caro's acid, which are thought to effectively contribute to the removal of contaminants, are prevented from being directly heated and decomposed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-114305 Summary of the Invention [Problem to be solved by the invention]

[0008] In the substrate processing apparatus of Patent Document 1, the SPM concentration in the processing bath is adjusted to a constant value regardless of the type of substrate. However, depending on the type of substrate, the substrate can be processed appropriately without strict adjustment of the SPM concentration in the processing bath, and in the substrate processing apparatus of Patent Document 1, sulfuric acid and hydrogen peroxide solution may be wasted compared to the amounts of sulfuric acid and hydrogen peroxide solution required to process the substrate.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can avoid excessive use of sulfuric acid and hydrogen peroxide solution. [Means for solving the problem]

[0010] According to one aspect of the present invention, a substrate processing method includes processing a substrate by immersing the substrate in a processing bath containing a processing liquid including sulfuric acid and hydrogen peroxide solution. The substrate processing method includes the steps of: acquiring substrate information indicating information about the substrate before immersing the substrate in the processing liquid in the processing tank; selecting, based on the substrate information, either a liquid exchange process or a concentration adjustment process as a processing liquid adjustment process for adjusting the processing liquid; if the liquid exchange process is selected in the selecting process, a first processing liquid adjustment process for discharging at least a portion of the processing liquid in the processing tank from the processing tank and supplying sulfuric acid and hydrogen peroxide water to the processing tank when the processing liquid in the processing tank does not satisfy a predetermined condition; if the concentration adjustment process is selected in the selecting process, a second processing liquid adjustment process for adjusting the concentration of the processing liquid in the processing tank while circulating the processing liquid in the processing tank through a pipe connected to the processing tank; and immersing the substrate in the processing liquid in the processing tank while circulating the processing liquid in the processing tank adjusted in the first processing liquid adjustment process or the second processing liquid adjustment process through a pipe connected to the processing tank.

[0011] In one embodiment, the substrate information indicates a process performed on the substrate before the substrate was immersed in the process liquid. In one embodiment, if, in the process of acquiring substrate information, the substrate information indicates that an ashing process has been performed on the resist of the substrate, the liquid exchange process is selected in the selection process, and if, in the process of acquiring substrate information, the substrate information indicates that ion implantation has been performed on the resist of the substrate or that the substrate has been isolated, the concentration adjustment process is selected in the selection process.

[0012] In one embodiment, in the first treatment liquid adjusting step, if the treatment liquid in the treatment tank satisfies a predetermined condition, the treatment liquid in the treatment tank is not discharged.

[0013] In one embodiment, the first processing liquid adjustment step includes a step of setting the amount of processing liquid to be discharged from the processing tank based on the time elapsed since the substrate was immersed in the processing liquid of the processing tank before immersing the substrate.

[0014] In one embodiment, the second treatment liquid adjusting step includes a step of adjusting the hydrogen peroxide concentration of the treatment liquid based on a measurement result from a concentration sensor that measures the concentration of the treatment liquid in the treatment tank.

[0015] In one embodiment, the second treatment liquid adjustment process includes a process of supplying hydrogen peroxide water to the treatment tank so as to increase the hydrogen peroxide concentration of the treatment liquid in the treatment tank before immersing the substrate in the treatment liquid in the treatment tank, and a process of decreasing the hydrogen peroxide concentration of the treatment liquid in the treatment tank after immersing the substrate in the treatment liquid in the treatment tank.

[0016] According to another aspect of the present invention, a substrate processing apparatus includes a processing tank that stores a processing liquid containing sulfuric acid and hydrogen peroxide solution, a circulation unit having piping through which the processing liquid in the processing tank circulates, a drainage unit that discharges the processing liquid from the processing tank, a processing liquid supply unit that supplies sulfuric acid and hydrogen peroxide solution to the processing tank, a substrate holding unit that holds a substrate and immerses the substrate in the processing liquid in the processing tank, and a control unit that controls the circulation unit, the drainage unit, the processing liquid supply unit, and the substrate holding unit. The control unit selects either a liquid exchange process or a concentration adjustment process as a processing liquid adjustment process for adjusting the processing liquid based on substrate information indicating information about the substrate before immersing the substrate in the processing liquid in the processing tank, and when the liquid exchange process is selected, the control unit controls the processing liquid supply unit to perform a first processing liquid adjustment process in which, when the processing liquid in the processing tank does not satisfy a predetermined condition, at least a part of the processing liquid in the processing tank is discharged from the processing tank and the processing liquid supply unit supplies the sulfuric acid and the hydrogen peroxide solution to the processing tank to adjust the processing liquid in the processing tank. The control unit controls the drainage unit and the processing liquid supply unit, and when the concentration adjustment process is selected, the control unit controls the circulation unit and the processing liquid supply unit to perform a second processing liquid adjustment process in which the concentration of the processing liquid is adjusted while circulating the processing liquid in the processing tank through the piping of the circulation unit, and the control unit controls the circulation unit and the substrate holding unit to immerse the substrate in the processing liquid in the processing tank while circulating the processing liquid in the processing tank adjusted in the first processing liquid adjustment process or the second processing liquid adjustment process through the piping of the circulation unit. In one embodiment, the substrate information indicates a process performed on the substrate before the substrate was immersed in the process liquid. [Effects of the Invention]

[0017] According to the present invention, excessive use of sulfuric acid and hydrogen peroxide solution can be avoided. [Brief explanation of the drawings]

[0018] [Figure 1] 1(a) and 1(b) are schematic perspective views of a substrate processing apparatus according to the present embodiment. [Figure 2] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 3] 1 is a schematic block diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 4] FIG. 2 is a flow chart of a substrate processing method according to the present embodiment. [Figure 5] 1(a) to 1(c) are schematic views illustrating a liquid changing step in the substrate processing method of the present embodiment. [Figure 6] 10 is a graph showing changes over time in sulfuric acid concentration and hydrogen peroxide concentration in the processing tank during a liquid exchange process in the substrate processing method of the present embodiment. [Figure 7] FIG. 10 is a flowchart showing a case where a liquid changing step is selected in the substrate processing method of the present embodiment. [Figure 8] 5(a) to 5(c) are schematic views showing a concentration adjusting step in the substrate processing method of the present embodiment. [Figure 9] 6 is a graph showing changes over time in sulfuric acid concentration and hydrogen peroxide concentration in the processing tank during concentration adjustment in the substrate processing method of the present embodiment. [Figure 10] 6(a) and 6(b) are graphs showing the changes over time in the sulfuric acid concentration and the hydrogen peroxide concentration in the processing bath in the substrate processing method of the present embodiment. [Figure 11] FIG. 10 is a flowchart showing a case where a concentration adjusting step is selected in the substrate processing method of the present embodiment. [Figure 12] FIG. 2 is a flow chart of a substrate processing method according to the present embodiment. [Figure 13] 1 is a schematic diagram of a substrate processing system including a substrate processing apparatus according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. Typically, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0020] An embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Fig. 1. Fig. 1(a) and Fig. 1(b) are schematic perspective views of the substrate processing apparatus 100 of this embodiment. Fig. 1(a) shows the substrate processing apparatus 100 before a substrate W is loaded into a processing bath 110. Fig. 1(b) shows the substrate processing apparatus 100 after the substrate W has been loaded into the processing bath 110.

[0021] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, oxidation treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0022] The substrate W is thin and plate-shaped. Typically, the substrate W is thin and approximately disk-shaped. Examples of the substrate W include semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0023] The substrate processing apparatus 100 is a batch-type substrate processing apparatus. The substrate processing apparatus 100 processes a plurality of substrates W in a batch. Typically, the substrate processing apparatus 100 processes a plurality of substrates W in units of a lot. For example, one lot consists of 25 substrates W.

[0024] As shown in FIG. 1(a), the substrate processing apparatus 100 includes a processing tank 110, a substrate holder 120, and a processing liquid supply unit 130. The processing tank 110 stores a processing liquid for processing a substrate W. The processing liquid is a mixed liquid containing sulfuric acid and hydrogen peroxide solution. The processing liquid supply unit 130 supplies the processing liquid to the processing tank 110. For example, the processing liquid supply unit 130 supplies sulfuric acid and hydrogen peroxide solution to the processing tank 110. In one example, the sulfuric acid and hydrogen peroxide solution are mixed in the processing tank 110 to generate the processing liquid. However, the sulfuric acid and hydrogen peroxide solution supplied from the processing liquid supply unit 130 may be mixed before reaching the processing tank 110 to generate the processing liquid.

[0025] The substrate holding unit 120 holds a substrate W. The normal direction of the main surface of the substrate W held by the substrate holding unit 120 is parallel to the Y direction. The multiple substrates W are arranged in a line along the Y direction. The multiple substrates W are arranged approximately parallel to the horizontal direction. Furthermore, the normal line of each of the multiple substrates W extends in the Y direction, and each of the multiple substrates W extends approximately parallel to the X direction and the Z direction.

[0026] Typically, the substrate holding unit 120 holds a plurality of substrates W together. Here, the substrate holding unit 120 holds the substrates W lined up in a row along the Y direction. The substrate holding unit 120 moves the substrates W while holding them. For example, the substrate holding unit 120 moves vertically upward or vertically downward along the vertical direction while holding the substrates W.

[0027] Specifically, the substrate holding unit 120 includes a lifter. The substrate holding unit 120 moves vertically upward or vertically downward while holding a plurality of substrates W. As the substrate holding unit 120 moves vertically downward, the plurality of substrates W held by the substrate holding unit 120 are immersed in the processing liquid L stored in the processing bath 110.

[0028] 1(a), the substrate holder 120 is located above the processing bath 110. The substrate holder 120 descends vertically downward (in the Z direction) while holding multiple substrates W. As a result, the multiple substrates W are introduced into the processing bath 110.

[0029] 1(b), when the substrate holder 120 descends to the processing tank 110, the plurality of substrates W are immersed in the processing liquid in the processing tank 110. The substrate holder 120 immerses the plurality of substrates W, which are aligned at predetermined intervals, in the processing liquid stored in the processing tank 110.

[0030] The treatment tank 110 has a double tank structure. The treatment tank 110 has an inner tank 112 and an outer tank 114. The outer tank 114 surrounds the inner tank 112. Both the inner tank 112 and the outer tank 114 have upper openings that open upward.

[0031] The inner bath 112 and the outer bath 114 each store a processing liquid. A plurality of substrates W are loaded into the inner bath 112. More specifically, the plurality of substrates W held by the substrate holder 120 are loaded into the inner bath 112. By being loaded into the inner bath 112, the plurality of substrates W are immersed in the processing liquid in the inner bath 112.

[0032] The substrate holding part 120 includes a main body plate 122 and holding rods 124. The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rods 124 extend horizontally (Y direction) from one main surface of the main body plate 122. In Figures 1(a) and 1(b), three holding rods 124 extend horizontally from one main surface of the main body plate 122. The multiple substrates W are aligned at a predetermined interval, and are held in an upright position (vertical position) by the multiple holding rods 124 abutting the lower edge of each substrate W.

[0033] The substrate holding part 120 may further include a lifting unit 126. The lifting unit 126 raises and lowers the main body plate 122 between a lower position (position shown in FIG. 1(b)) where the plurality of substrates W held by the holding rods 124 are located within the processing bath 110, and an upper position (position shown in FIG. 1(a)) where the plurality of substrates W held by the holding rods 124 are located above the processing bath 110. Therefore, by moving the main body plate 122 to the lower position by the lifting unit 126, the plurality of substrates W held by the holding rods 124 are immersed in the processing liquid.

[0034] The multiple substrates W are held by the multiple holding rods 124. Specifically, the lower edge of each substrate W abuts against the multiple holding rods 124, thereby holding the multiple substrates W in an upright position (vertical position) by the multiple holding rods 124. More specifically, the multiple substrates W held by the substrate holding unit 120 are aligned at intervals along the Y direction. Therefore, the multiple substrates W are arranged in a line along the Y direction. Furthermore, each of the multiple substrates W is held by the substrate holding unit 120 in a position approximately parallel to the XZ plane.

[0035] The lifting unit 126 raises and lowers the main body plate 122 and the holding rods 124. As the lifting unit 126 raises and lowers the main body plate 122 and the holding rods 124, the main body plate 122 and the holding rods 124 move vertically upward or downward while holding multiple substrates W. The lifting unit 126 has a drive source and a lifting mechanism, and the drive source drives the lifting mechanism to raise and lower the main body plate 122 and the holding rods 124. The drive source includes, for example, a motor. The lifting mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0036] More specifically, the lifting unit 126 raises and lowers the substrate holding part 120 between a processing position (position shown in FIG. 1(b)) and a retracted position (position shown in FIG. 1(a)). As shown in FIG. 1(b), when the substrate holding part 120 moves vertically downward (in the Z direction) while holding multiple substrates W and moves to the processing position, the multiple substrates W are loaded into the inner bath 112. More specifically, the multiple substrates W held by the substrate holding part 120 move into the inner bath 112. As a result, the multiple substrates W are immersed in the processing liquid in the inner bath 112 and are processed by the processing liquid. On the other hand, as shown in FIG. 1(a), when the substrate holding part 120 moves to the retracted position, the multiple substrates W held by the substrate holding part 120 move above the inner bath 112 and are pulled out of the processing liquid.

[0037] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 and 2. Figure 2 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment.

[0038] 2, the substrate processing apparatus 100 includes a processing bath 110, a substrate holding unit 120, a processing liquid supply unit 130, a circulation unit 140, a drainage unit 150, and a control device 180. The control device 180 controls the substrate holding unit 120, the processing liquid supply unit 130, the circulation unit 140, and the drainage unit 150.

[0039] The processing tank 110 stores the processing liquid L. The substrate holding unit 120 holds the substrates W. The substrate holding unit 120 includes a lifter. The substrate holding unit 120 allows multiple substrates W to be immersed in the processing liquid L stored in the processing tank 110 all at once.

[0040] The processing liquid supply unit 130 supplies a processing liquid to the processing tank 110. The processing liquid supply unit 130 has a sulfuric acid supply unit 132 and a hydrogen peroxide supply unit 134. The sulfuric acid supply unit 132 supplies sulfuric acid to the processing tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide water to the processing tank 110.

[0041] As described above, hydrogen peroxide decomposes over time to produce water. Therefore, in order to maintain a constant concentration of the treatment solution in the treatment tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and aqueous hydrogen peroxide to the treatment tank 110. Typically, the amount of sulfuric acid supplied per unit time from the sulfuric acid supply unit 132 is greater than the amount of aqueous hydrogen peroxide supplied per unit time from the hydrogen peroxide supply unit 134. For example, the ratio of the amount (volume) of sulfuric acid supplied to the amount (volume) of aqueous hydrogen peroxide supplied is 5:1 to 10:1.

[0042] The circulation unit 140 circulates the processing liquid L stored in the processing tank 110. When the circulation unit 140 circulates the processing liquid L in the processing tank 110, the processing liquid is heated to a predetermined temperature. Furthermore, when the circulation unit 140 circulates the processing liquid L in the processing tank 110, the processing liquid can be filtered to remove impurities from the processing liquid.

[0043] The drainage unit 150 discharges the processing liquid L stored in the processing tank 110. The processing liquid in the processing tank 110 can be discharged by the drainage unit 150. Furthermore, by discharging the processing liquid L stored in the processing tank 110 and by the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supplying sulfuric acid and hydrogen peroxide solution to the processing tank 110 using the drainage unit 150, the processing liquid L stored in the processing tank 110 can be replaced with a new processing liquid.

[0044] As described above, the processing tank 110 stores the processing liquid L. The processing liquid L is a mixture of sulfuric acid and hydrogen peroxide. In the processing liquid L, the sulfuric acid concentration (mass concentration) is 80% or more and 90% or less, and the hydrogen peroxide concentration (mass concentration) is 0.8% or more and 2.0% or less.

[0045] Here, the processing tank 110 has a double tank structure. The processing tank 110 has an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upper opening that opens upward. The inner tank 112 is configured to store processing liquid L and to be able to accommodate multiple substrates W. The outer tank 114 is provided on the outer surface of the upper opening of the inner tank 112. The height of the upper edge of the outer tank 114 is higher than the height of the upper edge of the inner tank 112.

[0046] The treatment tank 110 further has a lid 116. The lid 116 can be opened and closed relative to the upper opening of the inner tank 112. When the lid 116 is closed, the lid 116 can close the upper opening of the inner tank 112.

[0047] The lid 116 has a door portion 116a and a door portion 116b. The door portion 116a is located on one side of the upper opening of the inner tank 112 in the X direction. The door portion 116a is located near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. The door portion 116b is located on the other side of the upper opening of the inner tank 112 in the X direction. The door portion 116b is located near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. The inner tank 112 of the treatment tank 110 can be closed by closing the door portions 116a and 116b to cover the upper opening of the inner tank 112.

[0048] The substrate holding part 120 holds the substrate W. The substrate holding part 120 moves vertically upward or vertically downward while holding the substrate W. When the substrate holding part 120 moves vertically downward, the substrate W held by the substrate holding part 120 is immersed in the processing liquid L stored in the inner bath 112.

[0049] The substrate holding part 120 includes a main body plate 122 and holding rods 124. The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rods 124 extend in the horizontal direction (Y direction) from one main surface of the main body plate 122. Here, three holding rods 124 extend in the Y direction from one main surface of the main body plate 122. The multiple substrates W are arranged in the front-to-rear direction of the page, and the lower edges of each substrate W are abutted by the multiple holding rods 124 to be held in an upright position (vertical position).

[0050] The substrate holding part 120 may further include a lifting unit 126. The lifting unit 126 raises and lowers the main body plate 122 between a processing position (position shown in FIG. 2) where the substrates W held by the substrate holding part 120 are located in the inner bath 112 and a retracted position (not shown) where the substrates W held by the substrate holding part 120 are located above the inner bath 112. Therefore, when the lifting unit 126 moves the main body plate 122 to the processing position, the multiple substrates W held by the holding rods 124 are immersed in the processing liquid. In this way, the substrates W are subjected to processing.

[0051] The sulfuric acid supply unit 132 includes a pipe 132a and a valve 132b. Sulfuric acid is discharged from one end of the pipe 132a into the treatment tank 110. The pipe 132a is connected to a sulfuric acid supply source. A valve 132b is disposed in the pipe 132a. The supply of sulfuric acid to the treatment tank 110 can be controlled by the valve 132b. When the valve 132b is opened under the control of the control device 180, the sulfuric acid that has passed through the pipe 132a is supplied to the treatment tank 110. In the treatment tank 110, the sulfuric acid is mixed with the treatment liquid in the treatment tank 110.

[0052] For example, sulfuric acid discharged from the pipe 132a is supplied to the inner tank 112. When the processing liquid overflows from the upper edge of the inner tank 112, the overflowing processing liquid is received and recovered by the outer tank 114. Here, the sulfuric acid is discharged into the inner tank 112. One end of a pipe 132a that supplies sulfuric acid from the sulfuric acid supply unit 132 to the inner tank 112 may be disposed in the inner tank 112.

[0053] The hydrogen peroxide supply unit 134 includes a pipe 134a and a valve 134b. Hydrogen peroxide solution is discharged from one end of the pipe 134a into the treatment tank 110. The pipe 134a is connected to a hydrogen peroxide solution supply source. A valve 134b is disposed on the pipe 134a. The supply of hydrogen peroxide solution to the treatment tank 110 can be controlled by the valve 134b. When the valve 134b is opened under the control of the control device 180, the hydrogen peroxide solution that has passed through the pipe 134a is supplied to the treatment tank 110. In the treatment tank 110, the hydrogen peroxide solution is mixed with the treatment liquid in the treatment tank 110.

[0054] For example, hydrogen peroxide solution discharged from pipe 134a is supplied to inner tank 112. If the processing liquid overflows from the upper edge of inner tank 112, the overflowing processing liquid is received and collected by outer tank 114. Here, the hydrogen peroxide solution is discharged into inner tank 112. One end of pipe 134a that supplies hydrogen peroxide solution from hydrogen peroxide supply unit 134 to inner tank 112 may be disposed in inner tank 112.

[0055] The circulation unit 140 includes a pipe 141, a pump 142, a filter 143, a heater 144, an adjustment valve 145, a valve 146, and a circulating fluid supply pipe 148. The pump 142, the filter 143, the heater 144, the adjustment valve 145, and the valve 146 are arranged in this order from the upstream to the downstream of the pipe 141.

[0056] The pipe 141 guides the treatment liquid discharged from the treatment tank 110 back into the treatment tank 110. Specifically, the upstream end of the pipe 141 is located in the outer tank 114, and the downstream end of the pipe 141 is located in the inner tank 112. The downstream end of the pipe 141 is connected to a circulating liquid supply pipe 148 located in the inner tank 112.

[0057] The pump 142 sends the processing liquid from the pipe 141 to the circulating liquid supply pipe 148. The filter 143 filters the processing liquid flowing through the pipe 141. The filter 143 filters out foreign matter such as particles in the processing liquid flowing through the pipe 141 and removes them.

[0058] The heater 144 heats the processing liquid flowing through the pipe 141. The heater 144 adjusts the temperature of the processing liquid. The heater 144 heats the processing liquid flowing through the pipe 141 and adjusts the temperature to a processing temperature (for example, approximately 100°C to 120°C). The heater 144 may be capable of measuring the temperature of the processing liquid as well as heating it. In this case, the heater 144 has a heating unit and a temperature measuring unit.

[0059] The adjustment valve 145 adjusts the opening of the pipe 141 to adjust the flow rate of the processing liquid supplied to the circulating liquid supply pipe 148. The adjustment valve 145 adjusts the flow rate of the processing liquid. The adjustment valve 145 includes a valve body (not shown) with a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position. The same applies to the other adjustment valves. The valve 146 opens and closes the pipe 141. The adjustment valve 145 may be omitted. In this case, the flow rate of the processing liquid supplied to the circulating liquid supply pipe 148 is adjusted by controlling the pump 142.

[0060] The circulating liquid supply pipe 148 is disposed in the inner tank 112. Here, the circulating liquid supply pipe 148 is disposed at the bottom of the inner tank 112 of the processing tank 110. The circulating liquid supply pipe 148 is disposed in the processing liquid L stored in the inner tank 112. The circulating liquid supply pipe 148 supplies the circulated processing liquid to the inner tank 112.

[0061] The drainage unit 150 has a drainage pipe 151, a valve 152, a drainage pipe 153, a valve 154, and a valve 155. The treatment liquid in the inner bath 112 is discharged through the drainage pipe 151 and the valve 152. The treatment liquid in the outer bath 114 is discharged through the drainage pipe 153, the valve 154, and the valve 155.

[0062] A drainage pipe 151 is connected to the bottom wall of the inner tank 112. A valve 152 is disposed in the drainage pipe 151. The valve 152 is opened and closed by a control device 180. When the valve 152 is opened, the treatment liquid stored in the inner tank 112 is discharged to the outside through the drainage pipe 151. The discharged treatment liquid is sent to a wastewater treatment device (not shown) and treated.

[0063] A drainage pipe 153 is connected to the pipe 141. Here, the drainage pipe 153 is connected to the pipe 141 downstream of the pump 142. A valve 154 is arranged in the pipe 141 downstream of the connection with the drainage pipe 153. A valve 155 is located in the drainage pipe 153. By opening the valve 154 and closing the valve 155, the processing liquid in the processing tank 110 can pass through the pipe 141 and return to the processing tank 110, and the processing liquid in the processing tank 110 can be circulated. Furthermore, by closing the valve 154 and opening the valve 155, the processing liquid in the processing tank 110 can be discharged through the pipe 141 and the drainage pipe 153.

[0064] In FIG. 2, one regulating valve 145 and one valve 146 are shown to avoid overly complicating the drawing, but at least one of the regulating valves 145 and the valves 146 may be provided in plurality.

[0065] The control device 180 is configured using, for example, a microcomputer. The control device 180 has an arithmetic unit such as a central processing unit (CPU), a storage unit such as a fixed memory device or a hard disk drive, and an input / output unit. The storage unit stores programs executed by the arithmetic unit.

[0066] Next, an embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Figures 1 to 3. Figure 3 is a schematic block diagram of the substrate processing apparatus 100 of this embodiment.

[0067] 3, the control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 controls the operations of the respective units of the substrate processing apparatus 100.

[0068] The control unit 182 includes a processor. The processor may include, for example, a central processing unit (CPU). Alternatively, the processor may include a general-purpose computer.

[0069] The memory unit 184 stores data and computer programs. The memory unit 184 includes a main memory and an auxiliary memory. The main memory is, for example, a semiconductor memory. The auxiliary memory is, for example, a semiconductor memory and / or a hard disk drive. The memory unit 184 may include removable media. The processor of the control unit 182 executes the computer program stored in the memory unit 184 to perform the substrate processing method.

[0070] The control device 180 controls the substrate holder 120, the sulfuric acid supply unit 132, the hydrogen peroxide supply unit 134, the circulation unit 140, and the drainage unit 150 in accordance with a predetermined program. Specifically, the control device 180 controls the operations of the lifting unit 126, the pump 142, the filter 143, the heater 144, etc. The control device 180 also controls the opening and closing operations of the valves 132b, 134b, 146, 152, 154, and 155. The control device 180 also controls the opening adjustment operation of the adjustment valve 145.

[0071] The substrate processing apparatus 100 includes a concentration sensor 162. The concentration sensor 162 measures the sulfuric acid concentration and the hydrogen peroxide concentration in the processing liquid in the processing bath 110.

[0072] For example, the concentration sensor 162 is attached to the treatment tank 110. The concentration sensor 162 measures a value indicating the specific gravity of the treatment liquid stored in the treatment tank 110. The concentration sensor 162 measures the back pressure of the treatment tank 110.

[0073] For example, the tip of the concentration sensor 162 is disposed at a predetermined depth from the surface of the processing liquid in the processing tank 110. The concentration sensor 162 supplies gas to the tip of the concentration sensor 162 to form bubbles in the processing liquid in the processing tank 110. As a result, the liquid pressure of the processing liquid stored in the processing tank 110 is detected as the gas pressure at the tip of the concentration sensor 162, which is disposed at a predetermined depth from the liquid surface in the processing tank 110. Nitrogen gas is typically used as the gas. By measuring the relationship between the gas pressure and the sulfuric acid concentration and hydrogen peroxide concentration of the processing liquid in advance and creating a lookup table showing the relationship between the gas pressure and the processing liquid in advance, the specific gravity of the processing liquid can be measured according to the gas pressure at which bubbles are formed by the gas.

[0074] Furthermore, the control unit 182 functions as a substrate information acquisition unit 182a and a treatment liquid adjustment process selection unit 182b by executing a computer program stored in the storage unit 184. Therefore, the control unit 182 includes the substrate information acquisition unit 182a and the treatment liquid adjustment process selection unit 182b.

[0075] The substrate information acquisition unit 182a acquires substrate information indicating information about the substrate W before the substrate processing apparatus 100 processes the substrate W. The substrate information may indicate processing performed on the substrate W before it was loaded into the substrate processing apparatus 100.

[0076] The processing liquid adjustment process selection unit 182b selects whether to perform a liquid exchange process or a concentration adjustment process as a processing liquid adjustment process for adjusting the processing liquid in the processing tank 110. The processing liquid adjustment process selection unit 182b selects either the liquid exchange process or the concentration adjustment process based on the substrate information. The liquid exchange process and the concentration adjustment process will be described later.

[0077] Furthermore, the control unit 182 functions as a treatment liquid information acquisition unit 182c by executing a computer program stored in the storage unit 184. For this reason, the control unit 182 includes a treatment liquid information acquisition unit 182c. The treatment liquid information acquisition unit 182c acquires treatment liquid information that indicates information about the treatment liquid in the treatment tank 110. For example, the treatment liquid information acquisition unit 182c acquires the treatment liquid information based on the measurement results of the concentration sensor 162.

[0078] Next, the substrate processing method of the present embodiment will be described with reference to Figures 1 to 4. Figure 4 is a flow chart of the substrate processing method of the present embodiment.

[0079] 4, in step S10, substrate information indicating information about a substrate to be processed by the substrate processing apparatus 100 is acquired. For example, the substrate information acquisition unit 182a acquires the substrate information from the storage unit 184.

[0080] For example, the substrate information indicates the processing performed on the substrate W before it is loaded into the substrate processing apparatus 100. In one example, the substrate information indicates that ashing processing was performed on the resist of the substrate W before it is loaded into the substrate processing apparatus 100. Alternatively, the substrate information indicates that ion implantation was performed on the resist of the substrate W before it is loaded into the substrate processing apparatus 100. Alternatively, the substrate information indicates the state of the substrate W before it is subjected to element isolation and oxidation processing.

[0081] In step S20, a processing liquid adjustment process is selected. The control unit 182 selects either a liquid exchange process or a concentration adjustment process as the processing liquid adjustment process based on the substrate information. For example, the processing liquid adjustment process selection unit 182b selects either the liquid exchange process or the concentration adjustment process.

[0082] For example, if the substrate W is a substrate that can be appropriately processed even when the concentration range of the processing liquid required for appropriately processing the target substrate to be processed by the substrate processing apparatus 100 is set relatively loose, the control unit 182 selects the liquid replacement process as the processing liquid adjustment process. As an example, when processing a substrate to remove residue from a substrate that has been subjected to ashing processing for resist, the substrate can be appropriately processed even if the concentration range of the processing liquid is set relatively loose. Therefore, if the substrate is a substrate that has been subjected to ashing processing for resist, the control unit 182 selects the liquid replacement process.

[0083] On the other hand, if the substrate W is a substrate that cannot be properly processed unless the concentration range of the processing liquid required to properly process the target substrate is set relatively narrowly, the control unit 182 selects the concentration adjustment process as the processing liquid adjustment process. As an example, if the substrate W has a resist that has been ion-implanted, the resist cannot be properly removed or stripped unless the concentration range of the processing liquid is set relatively narrowly. Therefore, if the substrate W is a substrate that has a resist that has been ion-implanted, the control unit 182 selects the concentration adjustment process.

[0084] Alternatively, when an oxidation process is performed on a substrate after element separation, the substrate cannot be properly treated unless the concentration range of the treatment liquid is set relatively strictly. Therefore, when the substrate W is a substrate to be subjected to oxidation process after element separation, the control unit 182 selects the concentration adjustment step.

[0085] In this way, the control unit 182 controls the processing solution in the processing bath 110 based on the substrate information. About Either the liquid changing process or the concentration adjusting process is selected. Typically, before the target substrate arrives at the substrate processing apparatus 100, the control unit 182 selects the processing liquid adjusting process based on the substrate information.

[0086] If the liquid changing process is selected in step S20, the process proceeds to step S30. On the other hand, if the concentration adjusting process is selected in step S20, the process proceeds to step S40.

[0087] In step S30, a liquid exchange process is performed. The liquid exchange process adjusts the processing liquid in the processing tank 110. In this specification, the adjustment of the processing liquid when the liquid exchange process is selected may be referred to as a first processing liquid adjustment process.

[0088] In this case, it is determined whether the processing solution in the processing bath 110 satisfies the standard. The standard may be set based on the sulfuric acid concentration and / or hydrogen peroxide concentration of the processing solution in the processing bath 110.

[0089] Alternatively, the criterion may be set based on the time since the processing liquid in the processing tank 110 was replaced. Alternatively, the criterion may be set based on the number of lots of substrates W processed after the processing liquid in the processing tank 110 was replaced. The criterion may be set based on the time elapsed since the previous substrate was immersed in the processing liquid in the processing tank 110.

[0090] If the treatment solution in the treatment tank 110 satisfies the standard, the treatment solution in the treatment tank 110 is not discharged. However, even in this case, the hydrogen peroxide supply unit 134 may continue to supply a constant amount of hydrogen peroxide to the treatment tank 110 in order to maintain the hydrogen peroxide concentration through decomposition of the hydrogen peroxide solution.

[0091] On the other hand, if the processing solution in the processing tank 110 does not meet the standard, at least a portion of the processing solution in the processing tank 110 is replaced. In this case, at least a portion of the processing solution in the processing tank 110 is drained, while processing solution is supplied to the processing tank 110.

[0092] When the processing solution in the processing bath 110 is to be discharged, for example, the processing solution in the outer bath 114 is to be discharged. In this case, the control unit 182 drives the pump 142 to open the valve 15. 5 Open valve 15 4 This allows the processing liquid in the outer bath 114 to be discharged. The processing liquid in the inner bath 112 is also discharged. For example, the control unit 182 opens the valve 152 to discharge the processing liquid in the inner bath 112.

[0093] A processing solution is also supplied to the processing tank 110. In this case, the processing solution supply unit 130 supplies the processing solution to the processing tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the processing tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the processing tank 110. This adjusts the processing solution in the processing tank 110. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution, respectively, at a ratio such that the processing solution containing sulfuric acid and hydrogen peroxide solution supplied to the processing tank 110 has a predetermined concentration. In this case, the temperature of the processing solution rises due to the reaction between the sulfuric acid and the hydrogen peroxide solution.

[0094] Alternatively, the treatment liquid may be heated while being circulated by driving the pump 142 and the heater 144 so that the treatment liquid maintains a predetermined temperature. In this case, the heater 144 heats the treatment liquid as needed. For example, if the temperature of the treatment liquid is lower than a predetermined temperature, the heater 144 heats the treatment liquid so that the temperature rises to the predetermined temperature. On the other hand, if the temperature of the treatment liquid rises above the predetermined temperature due to a reaction between sulfuric acid and hydrogen peroxide solution, the heater 144 stops heating the treatment liquid so that the temperature drops to the temperature of the treatment liquid. Next, the process proceeds to step S50A.

[0095] In step S50A, the substrate W is immersed in the processing liquid in the processing bath 110. Thereafter, the substrate W is taken out from the processing liquid in the processing bath 110. In this manner, the substrate processing is completed.

[0096] In step S40, a concentration adjustment process is performed. The concentration adjustment process adjusts the processing liquid in the processing tank 110. In this specification, the adjustment of the processing liquid when the concentration adjustment process is selected may be referred to as a second processing liquid adjustment process.

[0097] In this case, the concentration of the processing solution in the processing bath 110 is adjusted. For example, the concentration of hydrogen peroxide in the processing solution in the processing bath 110 is adjusted. In one example, the concentration of hydrogen peroxide in the processing solution in the processing bath 110 is increased.

[0098] Alternatively, the sulfuric acid concentration in the processing solution in the processing bath 110 is adjusted. In one example, the sulfuric acid concentration in the processing solution in the processing bath 110 is increased.

[0099] Typically, the processing solution supply unit 130 supplies the processing solution to the processing tank 110. For example, the sulfuric acid supply unit 132 supplies sulfuric acid to the processing tank 110. The hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the processing tank 110. The sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution, respectively, at a ratio such that the processing solution containing sulfuric acid and hydrogen peroxide solution supplied to the processing tank 110 reaches a predetermined concentration.

[0100] For example, when increasing the hydrogen peroxide concentration in the processing solution in the processing tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide so as to increase the ratio of hydrogen peroxide and increase the hydrogen peroxide concentration in the processing tank 110.

[0101] In this case, the processing liquid is circulated in the processing tank 110. Here too, the processing liquid may be heated while being circulated by driving the pump 142 and the heater 144 so that the processing liquid maintains a predetermined temperature.

[0102] The control unit 182 supplies sulfuric acid and hydrogen peroxide solution until the sulfuric acid concentration and / or hydrogen peroxide concentration measured by the concentration sensor 162 reach a predetermined concentration. The control unit 182 also supplies sulfuric acid and hydrogen peroxide solution so that the sulfuric acid concentration and / or hydrogen peroxide concentration measured by the concentration sensor 162 are maintained at the predetermined concentration. In this manner, the control unit 182 may adjust the sulfuric acid concentration and / or hydrogen peroxide concentration by feedback control using the concentration sensor 162. Note that the concentration adjustment is preferably performed immediately before the substrate W is immersed in the processing bath 110, and is not performed if the substrate W is not immersed in the processing bath 110 for a predetermined period of time. Next, the process proceeds to step S50B.

[0103] In step S50B, the substrate is immersed in the processing liquid in which the hydrogen peroxide concentration has been adjusted. Thereafter, the substrate W is taken out from the processing liquid in the processing bath 110. In this manner, the substrate processing is completed.

[0104] According to this embodiment, substrates are processed with processing liquids adjusted in different ways depending on the substrate W. For example, if a substrate to be processed in the substrate processing apparatus 100 can be processed with a processing liquid adjusted to a relatively loose concentration range, the processing liquid in the processing tank 110 is adjusted in a liquid exchange process. As a result, the processing liquid in the processing tank 110 is exchanged only when the processing liquid does not meet the standard. This reduces the frequency of exchanging the processing liquid in the processing tank 110 and reduces the cost associated with the processing liquid. Furthermore, if a substrate to be processed in the substrate processing apparatus 100 needs to be processed with a processing liquid adjusted to a relatively strict concentration range, the processing liquid in the processing tank 110 is adjusted in a concentration adjustment process. This avoids maintaining the processing liquid in the processing tank 110 in a concentration-adjusted state when no substrate is loaded, and allows the loaded substrate to be properly processed. Therefore, according to this embodiment, excessive use of sulfuric acid and hydrogen peroxide solution depending on the substrate W can be avoided.

[0105] Next, a liquid changing process in the substrate processing apparatus 100 according to the present embodiment will be described with reference to Figures 1 to 5. Figures 5(a) to 5(c) are schematic views for explaining the liquid changing process in the substrate processing method according to the present embodiment.

[0106] As shown in Fig. 5(a), a processing liquid is stored in the processing tank 110. Here, a fixed amount of processing liquid is stored in each of the inner tank 112 and the outer tank 114. As described above, processing liquid that overflows from the inner tank 112 flows into the outer tank 114. The fixed amount of the inner tank 112 is set to the maximum amount of the container of the inner tank 112.

[0107] The fixed quantity of the outer bath 114 is set to a quantity smaller than the maximum quantity of the container of the outer bath 114. When more processing liquid than the fixed quantity flows into the outer bath 114, the control unit 182 drives the pump 142 to cause the processing liquid in the outer bath 114 to flow out to the outside.

[0108] 5(b), the processing liquid is discharged from the processing bath 110. For example, when discharging the processing liquid from the inner bath 112, the control unit 182 opens the valve 152 to discharge the processing liquid from the inner bath 112.

[0109] Furthermore, when discharging the processing liquid from the outer bath 114, the control unit 182 drives the pump 142, closes the valve 154, and opens the valve 155, thereby discharging the processing liquid from the outer bath 114.

[0110] The amount of processing liquid discharged from the processing tank 110 may be set according to the time that has elapsed since the previous liquid exchange. For example, if a relatively long time has elapsed since the previous liquid exchange, the amount of processing liquid discharged from the processing tank 110 is set to be relatively large. Conversely, if a relatively short time has elapsed since the previous liquid exchange, the amount of processing liquid discharged from the processing tank 110 is set to be relatively small.

[0111] Alternatively, the amount of processing liquid discharged from the processing tank 110 may be set according to the time that has elapsed since the previous substrate immersion. If a relatively long time has elapsed since the previous substrate immersion, the amount of processing liquid discharged from the processing tank 110 is set to be relatively large. Conversely, if a relatively short time has elapsed since the previous substrate immersion, the amount of processing liquid discharged from the processing tank 110 is set to be relatively small.

[0112] Typically, the processing liquid in the processing tank 110 is not circulated when it is discharged from the processing tank 110. However, the processing liquid in the processing tank 110 may be discharged from the processing tank 110 while being circulated.

[0113] 5(c), the processing liquid supply unit 130 supplies the processing liquid to the processing tank 110. Specifically, the sulfuric acid supply unit 132 supplies sulfuric acid to the processing tank 110. Furthermore, the hydrogen peroxide supply unit 134 supplies hydrogen peroxide solution to the processing tank 110. In this case, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 so that the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the processing tank 110, respectively.

[0114] After the processing liquid is supplied to the processing tank 110, the processing liquid in the processing tank 110 circulates via the circulation unit 140. For example, the control unit 182 drives the pump 142 to open the adjustment valves 145 and 146, opens the valve 154, and closes the valve 155, thereby circulating the processing liquid from the processing tank 110 to the processing tank 110 through the pipe 141. The control unit 182 also drives the heater 144 to heat the processing liquid flowing through the pipe 141.

[0115] At this time, in order to maintain the processing solution in the processing tank 110, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 may supply sulfuric acid and hydrogen peroxide solution to the processing tank 110. The ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 to the amount of hydrogen peroxide supplied from the hydrogen peroxide supply unit 134 is the same as before the liquid change.

[0116] In this manner, the processing liquid in the processing tank 110 can be adjusted by liquid exchange. According to this embodiment, the processing liquid in the processing tank 110 can be partially discharged and supplied to the processing tank 110. Therefore, the processing liquid in the processing tank 110 can be quickly adjusted to processing conditions suitable for substrate processing. Furthermore, since the processing liquid in the processing tank 110 is not completely discarded, the substrate processing cost can be reduced.

[0117] Next, the liquid changing step in the substrate processing method of this embodiment will be described with reference to Figures 1 to 6. Figure 6 is a graph showing the changes in sulfuric acid concentration and hydrogen peroxide concentration over time in the processing tank 110 during the liquid changing step in the substrate processing method of this embodiment. In Figure 6, line Lsp shows the change in sulfuric acid concentration over time, and line Lhp shows the change in hydrogen peroxide concentration over time.

[0118] As shown by the line Lsp, the sulfuric acid concentration is approximately constant before the liquid exchange period Pp. However, strictly speaking, the sulfuric acid concentration gradually decreases over time. This is because the hydrogen peroxide solution reacts with the sulfuric acid in the treatment tank 110 and is decomposed to produce water.

[0119] During the liquid exchange period Pp, the processing liquid in the processing tank 110 is at least partially discharged. Furthermore, during the liquid exchange period Pp, new sulfuric acid and hydrogen peroxide solution are supplied to the processing tank 110. Typically, after the processing liquid in the processing tank 110 has started to be discharged, new processing liquid is supplied to the processing tank 110. However, the discharge and supply of the processing liquid in the processing tank 110 may be performed at any timing.

[0120] After the liquid exchange period Pp, the sulfuric acid concentration increases compared to before the liquid exchange period Pp. Thereafter, the sulfuric acid concentration gradually decreases over time.

[0121] As shown by line Lhp, the hydrogen peroxide concentration is approximately constant before the liquid exchange period Pp. However, strictly speaking, the hydrogen peroxide concentration gradually decreases over time. This is because the hydrogen peroxide solution reacts with sulfuric acid in the treatment tank 110 and is decomposed to produce water.

[0122] After the end of the liquid exchange period Pp, the hydrogen peroxide concentration increases compared to before the liquid exchange period Pp. Thereafter, the hydrogen peroxide concentration decreases over time.

[0123] 6, before and after the liquid exchange period Pp, the processing liquid in the processing tank 110 is heated while being circulated through the circulation unit 160. During the liquid exchange period Pp, the processing liquid in the processing tank 110 may also be heated while being circulated through the circulation unit 160.

[0124] Next, the substrate processing method of the present embodiment will be described with reference to Figures 1 to 7. Figure 7 is a flow chart showing the substrate processing method of the present embodiment in which the liquid changing step is selected.

[0125] 7, in step S102, the substrate processing apparatus 100 determines whether the substrate W to be processed is a target substrate for the liquid exchange process. For example, if the substrate W is a substrate on which the resist has been ashed, the control unit 182 determines that the substrate W is a target substrate for the liquid exchange process. Typically, the substrate processing apparatus 100 Based onBefore the board arrives, the control unit 182 determines whether the substrate W is a target substrate.

[0126] If the substrate W is not the target substrate (No in step S102), the process returns to step S102. On the other hand, if the substrate W is the target substrate (Yes in step S102), the process proceeds to step S104.

[0127] In step S104, it is determined whether the processing liquid in the processing tank 110 satisfies a predetermined standard. The predetermined standard is set as an index indicating that the processing liquid in the processing tank 110 is capable of appropriately processing the substrate W without adjustment. If the processing liquid in the processing tank 110 satisfies the predetermined standard, the processing liquid in the processing tank 110 is not discharged. On the other hand, if the processing liquid in the processing tank 110 does not satisfy the predetermined standard, the processing liquid in the processing tank 110 is discharged and adjusted.

[0128] The predetermined standard may be set based on the concentration of the treatment liquid in the treatment tank 110. For example, the predetermined standard is set based on the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110. In one example, when the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is equal to or greater than a predetermined value, the control unit 182 determines that the predetermined standard is met. On the other hand, when the concentration of hydrogen peroxide in the treatment liquid in the treatment tank 110 is lower than the predetermined value, the control unit 182 determines that the predetermined standard is not met.

[0129] If the processing liquid in the processing tank 110 satisfies the predetermined standard (Yes in step S104), the process proceeds to step S112. On the other hand, if the processing liquid in the processing tank 110 does not satisfy the predetermined standard (No in step S104), the process proceeds to step S106.

[0130] In step S106, the processing liquid in the processing tank 110 is discharged. At least a portion of the processing liquid stored in the processing tank 110 is discharged. The control unit 182 drives the pump 142 to open the valve 154 and close the valve 155, thereby discharging the processing liquid in the outer tank 114. The control unit 182 also opens the valve 152 to discharge the processing liquid in the inner tank 112.

[0131] In step S108, the processing liquid is supplied to the processing tank 110. The processing liquid supply unit 130 supplies the processing liquid to the processing tank 110. Under the control of the control unit 182, the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 supply sulfuric acid and hydrogen peroxide solution to the processing tank 110.

[0132] In step S110, the supply of the processing solution to the processing tank 110 is stopped. Under the control of the control unit 182, the supply of sulfuric acid and hydrogen peroxide solution to the processing tank 110 from the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 is stopped.

[0133] In step S112, the processing liquid is heated while being circulated in the processing tank 110. Under the control of the control unit 182, the pump 142 is driven to open the adjustment valves 145 and 146, and also the valve 154 is opened and the valve 155 is closed, whereby the processing liquid in the processing tank 110 is circulated from the processing tank 110 through the pipe 141 to the processing tank 110. Also, under the control of the control unit 182, the heater 144 heats the processing liquid flowing through the pipe 141.

[0134] In step S114, it is determined whether the temperature of the treatment liquid is at a predetermined temperature. If the temperature of the treatment liquid is not at the predetermined temperature (No in step S114), the process returns to step S112. On the other hand, if the temperature of the treatment liquid is at the predetermined temperature (Yes in step S114), the process proceeds to step S116.

[0135] In step S116, the substrate W is immersed in the processing solution in the processing tank 110. Typically, the substrate holder 120, while holding the substrate W, is lowered toward the processing tank 110 to immerse the substrate W in the processing solution in the processing tank 110. At this time, the processing solution supply unit 130 does not need to supply sulfuric acid and hydrogen peroxide solution to the processing tank 110. Alternatively, the processing solution supply unit 130 may supply only hydrogen peroxide solution to the processing tank 110. In either case, it is preferable to heat the processing solution in the processing tank 110 while circulating it by driving the heater 144 together with the pump 142.

[0136] Thereafter, the substrate W is lifted out of the processing bath 110. Typically, the substrate W is unloaded from the substrate processing apparatus 100.

[0137] In step S118, it is determined whether the substrate W to be processed next by the substrate processing apparatus 100 is the target substrate. Based on Before the board arrives, the control unit 182 determines whether the substrate W is a target substrate.

[0138] If the next substrate W is not the target substrate (No in step S118), the process ends. On the other hand, if the next substrate W is the target substrate (Yes in step S118), the process proceeds to step S120.

[0139] In step S120, it is determined whether the processing liquid in the processing tank 110 satisfies a predetermined standard. The predetermined standard is set in the same manner as in step S104.

[0140] If the processing liquid in the processing tank 110 does not satisfy the predetermined standard (No in step S120), the process returns to step S106. On the other hand, if the processing liquid in the processing tank 110 satisfies the predetermined standard (Yes in step S120), the process returns to step S116. In this case, the processing liquid supply unit 130 does not need to supply sulfuric acid and hydrogen peroxide solution to the processing liquid in the processing tank 110. Alternatively, the processing liquid supply unit 130 may supply only hydrogen peroxide solution to the processing liquid in the processing tank 110. In either case, it is preferable to heat the processing liquid in the processing tank 110 while circulating it by driving the heater 144 together with the pump 142.

[0141] In this embodiment, as described above, when the processing liquid in the processing tank 110 meets the predetermined standard, the substrate W is immersed in the processing liquid without being drained. On the other hand, when the processing liquid in the processing tank 110 does not meet the predetermined standard, at least a portion of the processing liquid in the processing tank 110 is drained and new sulfuric acid and hydrogen peroxide solution are supplied, thereby at least partially replacing the processing liquid in the processing tank 110. This reduces the number of times the processing liquid is replaced and suppresses increases in costs related to the processing liquid.

[0142] As described above, the liquid changing step in the substrate processing method of this embodiment and the flow when the liquid changing step is selected have been described with reference to Figures 5 to 7. Note that the concentration adjusting step in the substrate processing method of this embodiment is performed as follows.

[0143] Next, the concentration adjusting step in the substrate processing method of the present embodiment will be described with reference to Figures 1 to 8. Figures 8(a) to 8(c) are schematic views for explaining the concentration adjusting step in the substrate processing method of the present embodiment.

[0144] As shown in Fig. 8(a), the state of the processing liquid in the processing tank 110 is maintained. Here, a fixed amount of processing liquid is stored in each of the inner tank 112 and the outer tank 114. For example, the processing liquid in the processing tank 110 is heated while being circulated, thereby maintaining a constant state.

[0145] For example, the treatment liquid in the treatment tank 110 is maintained at a sulfuric acid concentration of 75% to 90%, a hydrogen peroxide concentration of 0.8% to 2.0%, and a temperature of 100° C. to 140° C. In one example, the treatment liquid maintained in the treatment tank 110 has a sulfuric acid concentration of 82%, a hydrogen peroxide concentration of 1.0%, and a temperature of 110° C.

[0146] The temperature of the treatment liquid in the treatment tank 110, the sulfuric acid concentration of the treatment liquid, and the hydrogen peroxide concentration of the treatment liquid are maintained under the control of the control unit 182. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the treatment liquid with a constant amount of power.

[0147] 8(b), the concentration of the processing liquid in the processing tank 110 is adjusted by changing the ratio of the amount of sulfuric acid supplied from the sulfuric acid supply unit 132 to the amount of hydrogen peroxide supplied from the hydrogen peroxide supply unit 134. For example, the concentration of the processing liquid in the processing tank 110 is adjusted immediately before the substrate W is immersed in the processing liquid in the processing tank 110.

[0148] Here, the hydrogen peroxide concentration is increased while maintaining the sulfuric acid concentration in the processing solution in the processing tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 to increase the supply amount of hydrogen peroxide solution until the hydrogen peroxide concentration in the processing solution in the processing tank 110 increases. The control unit 182 also controls the sulfuric acid supply unit 132 to supply sulfuric acid to an amount that maintains the sulfuric acid concentration in the processing solution in the processing tank 110.

[0149] In one example, the treatment liquid maintained in the treatment tank 110 has a sulfuric acid concentration of 82% and a hydrogen peroxide concentration of 1.4%, and is at a temperature of 110°C.

[0150] Thereafter, the control unit 182 immerses the substrate W in the processing solution in the processing tank 110, and maintains the temperature of the processing solution, the sulfuric acid concentration of the processing solution, and the hydrogen peroxide concentration of the processing solution in the processing tank 110 until the substrate W is removed from the processing solution in the processing tank 110. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the processing tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the processing tank 110. In addition, the heater 144 heats the processing solution with a constant amount of power.

[0151] After the substrate W is pulled out of the processing liquid in the processing tank 110, the control unit 182 changes the temperature of the processing liquid, the sulfuric acid concentration of the processing liquid, and the hydrogen peroxide concentration of the processing liquid in the processing tank 110. Typically, the control unit 182 changes any one of the temperature of the processing liquid, the sulfuric acid concentration of the processing liquid, and the hydrogen peroxide concentration of the processing liquid in the processing tank 110 to the state before the substrate W is immersed.

[0152] As shown in FIG. 8(c), the state of the processing solution in the processing tank 110 is restored. Here, the hydrogen peroxide concentration is reduced while maintaining the sulfuric acid concentration in the processing solution in the processing tank 110. In this case, the control unit 182 controls the hydrogen peroxide supply unit 134 to reduce the supply amount of hydrogen peroxide solution until the hydrogen peroxide concentration in the processing solution in the processing tank 110 decreases. The control unit 182 also controls the sulfuric acid supply unit 132 to supply sulfuric acid to an amount that maintains the sulfuric acid concentration in the processing solution in the processing tank 110. At this time, the ratio of the amounts of sulfuric acid supplied from the sulfuric acid supply unit 132 and hydrogen peroxide solution supplied from the hydrogen peroxide supply unit 134 is changed again.

[0153] In one example, the treatment liquid maintained in the treatment tank 110 has a sulfuric acid concentration of 82% and a hydrogen peroxide concentration of 1.0%, and is at a temperature of 110°C.

[0154] Thereafter, the control unit 182 maintains the temperature of the treatment solution in the treatment tank 110, the sulfuric acid concentration of the treatment solution, and the hydrogen peroxide concentration of the treatment solution. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the treatment tank 110. In addition, the heater 144 heats the treatment solution with a constant amount of power.

[0155] Next, the concentration adjusting step in the substrate processing method of this embodiment will be described with reference to Figures 1 to 9. Figure 9 is a graph showing the changes in sulfuric acid concentration and hydrogen peroxide concentration over time in the processing tank 110 during the concentration adjusting step in the substrate processing method of this embodiment. In Figure 9, line Lsc shows the change in sulfuric acid concentration over time, and line Lhc shows the change in hydrogen peroxide concentration over time.

[0156] As indicated by the line Lsc, before the concentration adjustment period Pc, the sulfuric acid concentration is maintained at the target concentration Tsb. However, strictly speaking, the sulfuric acid concentration fluctuates with time relative to the target concentration Tsb. This is because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the treatment tank 110 based on the measurement results of the concentration sensor 162. Here, when the sulfuric acid concentration decreases and reaches the target concentration Tsb, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the treatment tank 110. Therefore, the sulfuric acid concentration temporarily increases from the target concentration Tsb.

[0157] During the concentration adjustment period Pc New Sulfuric acid and hydrogen peroxide solution, which serve as new processing liquids, are supplied to the processing bath 110. Typically, the concentration adjustment period Pc is a period immediately before the substrate W is immersed in the processing liquid in the processing bath 110.

[0158] Here, the sulfuric acid concentration is maintained at the target concentration Tsb after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. In this case, strictly speaking, the sulfuric acid concentration fluctuates with time relative to the target concentration Tsb.

[0159] On the other hand, as shown by line Lhc, before the concentration adjustment period Pc, the hydrogen peroxide concentration is maintained at target concentration Tob1. However, strictly speaking, the hydrogen peroxide concentration fluctuates relative to target concentration Tob1 over time. This is because hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide solution to treatment tank 110. Here too, when the hydrogen peroxide concentration decreases and reaches target concentration Tob1, hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to treatment tank 110. As a result, the hydrogen peroxide concentration temporarily increases from target concentration Tob1.

[0160] The hydrogen peroxide concentration increases after the concentration adjustment period Pc compared to before the concentration adjustment period Pc. This is because the target concentration of the hydrogen peroxide solution is changed from target concentration Tob1 to target concentration Tob2 due to the concentration adjustment. However, strictly speaking, the hydrogen peroxide concentration fluctuates relative to target concentration Tob2 over time. This is because, as described above, the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide solution to the treatment tank 110.

[0161] After that, when a predetermined period of time has elapsed and the substrate W is no longer scheduled to be immersed in the processing liquid in the processing bath 110, the target concentration of hydrogen peroxide returns from the target concentration Tob2 to the target concentration Tob1.

[0162] Next, an embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Figures 1 to 10. Figure 10(a) is a graph showing the change over time in the sulfuric acid concentration in the processing tank 110 in the substrate processing method of this embodiment, and Figure 10(b) is a graph showing the change over time in the hydrogen peroxide concentration in the processing tank 110 in the substrate processing method of this embodiment.

[0163] 10(a), the sulfuric acid concentration fluctuates relative to the target concentration Ts because the sulfuric acid supply unit 132 intermittently supplies sulfuric acid to the treatment tank 110 based on the measurement result of the concentration sensor 162.

[0164] Specifically, when the sulfuric acid supply unit 132 stops supplying sulfuric acid for a specific period of time, the sulfuric acid concentration gradually decreases over time. When the concentration sensor 162 detects that the sulfuric acid concentration has reached the lower limit Tsd, the control unit 182 controls the sulfuric acid supply unit 132 to supply a predetermined amount of sulfuric acid to the treatment tank 110. The amount of sulfuric acid supplied by the sulfuric acid supply unit 132 is set so that the sulfuric acid concentration measured by the concentration sensor 162 does not exceed the upper limit Tsu. Therefore, the sulfuric acid concentration fluctuates with time relative to the target concentration Ts.

[0165] 10(b), the hydrogen peroxide concentration fluctuates relative to the target concentration Th because the hydrogen peroxide supply unit 134 intermittently supplies hydrogen peroxide water to the treatment tank 110 based on the measurement results of the concentration sensor 162.

[0166] Specifically, when hydrogen peroxide supply unit 134 stops supplying aqueous hydrogen peroxide for a specific period of time, the hydrogen peroxide concentration gradually decreases over time. When concentration sensor 162 detects that the hydrogen peroxide concentration has reached lower limit Thd, control unit 182 controls hydrogen peroxide supply unit 134 to supply a predetermined amount of aqueous hydrogen peroxide to treatment tank 110. The amount of aqueous hydrogen peroxide supplied by hydrogen peroxide supply unit 134 is set so that the hydrogen peroxide concentration measured by concentration sensor 162 does not exceed upper limit Thu. Therefore, the hydrogen peroxide concentration fluctuates relative to target concentration Th over time.

[0167] As shown in Figures 10(a) and 10(b), the sulfuric acid concentration and the hydrogen peroxide concentration may be feedback-controlled relative to the target concentrations. The feedback control is preferably performed in the concentration adjustment process. However, the feedback control may also be performed in the liquid replacement process.

[0168] Next, the concentration adjusting step in the substrate processing method of this embodiment will be described with reference to Figures 1 to 11. Figure 11 is a flow chart showing a case where the concentration adjusting step is selected in the substrate processing method of this embodiment.

[0169] 11, in step S202, the state of the processing liquid in the processing tank 110 is maintained. The control unit 182 maintains the temperature of the processing liquid in the processing tank 110, and the sulfuric acid concentration and hydrogen peroxide concentration of the processing liquid. Based on the results of the concentration sensor 162, the control unit 182 controls the sulfuric acid supply unit 132 and the hydrogen peroxide supply unit 134 so that the sulfuric acid concentration and hydrogen peroxide concentration of the processing liquid become predetermined values, respectively. Furthermore, based on the temperature measured by the heater 144, the control unit 182 controls the heater 144 so that the processing liquid maintains the predetermined temperature.

[0170] In step S204, it is determined whether the substrate W to be processed by the substrate processing apparatus 100 is a target substrate for concentration adjustment. Based on Before the board arrives, the control unit 182 determines whether the substrate W is a target substrate.

[0171] For example, if the substrate W is a substrate having a resist that has been subjected to ion implantation, the control unit 182 determines that the substrate W is a target substrate for concentration adjustment. Alternatively, if the substrate W is a substrate that is to undergo oxidation treatment after element separation, the control unit 182 determines that the substrate W is a target substrate for concentration adjustment.

[0172] If the substrate W is not the target substrate (No in step S204), the process returns to step S202. On the other hand, if the substrate W is the target substrate (Yes in step S204), the process proceeds to step S206.

[0173] In step S206, the hydrogen peroxide concentration in the processing solution in the processing tank 110 is increased. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 to increase the supply amount of hydrogen peroxide solution until the hydrogen peroxide concentration in the processing solution in the processing tank 110 increases. The control unit 182 also controls the sulfuric acid supply unit 132 to supply sulfuric acid to an amount that maintains the sulfuric acid concentration in the processing solution in the processing tank 110.

[0174] In step S208, it is determined whether or not the concentration adjustment of the treatment liquid has been completed. When the hydrogen peroxide concentration increases and the concentration sensor 162 indicates a predetermined value, the concentration adjustment of the treatment liquid is completed.

[0175] If the adjustment of the treatment liquid has not been completed (No in step S208), the process returns to step S208. On the other hand, if the adjustment of the treatment liquid has been completed (Yes in step S208), the process proceeds to step S210.

[0176] In step S210, the state of the processing solution in the processing tank 110 is maintained. The control unit 182 maintains the temperature of the processing solution in the processing tank 110, the sulfuric acid concentration of the processing solution, and the hydrogen peroxide concentration of the processing solution. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the processing tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the processing tank 110. In addition, the heater 144 heats the processing solution with a constant amount of power.

[0177] In step S212, the substrate W is immersed in the processing solution in the processing bath 110. Typically, the substrate W is loaded into the substrate processing apparatus 100 and immersed in the processing solution in the processing bath 110. Then, the substrate W is loaded from the substrate processing apparatus 100. Then, the process proceeds to step S214.

[0178] In step S214, the substrate processing apparatus 100 determines whether there is a substrate W to be processed next and whether the substrate W is a target substrate. Based on Before the board arrives, the control unit 182 determines whether or not there is a next substrate W and whether or not the next substrate W is the target substrate.

[0179] If there is no next substrate W or the next substrate W is not the target substrate (No in step S214), the process proceeds to step S216. On the other hand, if there is a next substrate W and that substrate W is the target substrate (Yes in step S214), the process returns to step S210.

[0180] In step S216, the hydrogen peroxide concentration of the processing solution in the processing tank 110 is reduced. Typically, the control unit 182 controls the hydrogen peroxide supply unit 134 to reduce the supply amount of hydrogen peroxide solution until the hydrogen peroxide concentration in the processing solution in the processing tank 110 is reduced. The control unit 182 also controls the sulfuric acid supply unit 132 to supply sulfuric acid at an amount sufficient to maintain the sulfuric acid concentration in the processing solution in the processing tank 110.

[0181] In step S218, it is determined whether or not the concentration adjustment of the treatment liquid has been completed. When the hydrogen peroxide concentration has decreased and the concentration sensor 162 indicates a predetermined value, the concentration adjustment of the treatment liquid is completed.

[0182] If the adjustment of the treatment liquid has not been completed (No in step S218), the process returns to step S216. On the other hand, if the adjustment of the treatment liquid has been completed (Yes in step S218), the process proceeds to step S220.

[0183] In step S220, the state of the processing solution in the processing tank 110 is maintained. The control unit 182 maintains the temperature of the processing solution in the processing tank 110, the sulfuric acid concentration of the processing solution, and the hydrogen peroxide concentration of the processing solution. Specifically, the sulfuric acid supply unit 132 supplies a predetermined amount of sulfuric acid to the processing tank 110, and the hydrogen peroxide supply unit 134 supplies a predetermined amount of hydrogen peroxide solution to the processing tank 110. In addition, the heater 144 heats the processing solution with a constant amount of power.

[0184] According to this embodiment, the concentration of the processing liquid in the processing tank 110 is adjusted in the above manner. According to this embodiment, the processing liquid in the processing tank 110 is adjusted to a concentration suitable for processing the substrate W immediately before the substrate W is immersed in the processing tank 110. Therefore, if the substrate is not one that requires concentration adjustment, there is no need to adjust the concentration of the processing liquid in the processing tank 110, and excessive use of hydrogen peroxide can be avoided.

[0185] 9 and 11, as an example of concentration adjustment, the hydrogen peroxide concentration is increased when the substrate W is the target substrate, but this embodiment is not limited to this. When the substrate W is the target substrate, the sulfuric acid concentration may be increased.

[0186] 4, the processing liquid adjustment process is selected based on the substrate information indicating information about the substrate performed before the substrate is processed by the substrate processing apparatus 100, but this embodiment is not limited to this. The processing liquid adjustment process may be selected based on information other than the substrate information.

[0187] Next, the substrate processing method of this embodiment will be described with reference to Figures 1 to 12. Figure 12 is a flow chart of the substrate processing method of this embodiment.

[0188] 12, in step S10, substrate information is acquired about the substrate W to be processed by the substrate processing apparatus 100. For example, the substrate information acquisition unit 182a acquires the substrate information from the storage unit 184.

[0189] In step S10A, processing liquid information indicating the state of the processing liquid in the processing tank 110 is acquired. The processing liquid information may indicate any of the sulfuric acid concentration, the hydrogen peroxide concentration, and the temperature of the processing liquid in the processing tank 110. For example, the concentration sensor 162 measures the sulfuric acid concentration and the hydrogen peroxide concentration of the processing liquid in the processing tank 110. Furthermore, the heater 144 measures the temperature of the processing liquid. The processing liquid information acquisition unit 182c acquires the processing liquid information from the concentration sensor 162 and / or the heater 144.

[0190] In step S20, a processing liquid adjustment process is selected. The control unit 182 selects whether to adjust the processing liquid in the processing tank 110 through a liquid exchange process or a concentration adjustment process based on the substrate information and the processing liquid information. Typically, the control unit 182 selects the processing liquid adjustment process based on the substrate information and the processing liquid information before the substrate W arrives at the substrate processing apparatus 100.

[0191] For example, based on the substrate information, target values ​​of the processing liquid in the processing tank 110 are set. In one example, a target sulfuric acid concentration, a target hydrogen peroxide concentration, and a target temperature in the processing liquid in the processing tank 110 are set according to the processing performed on the substrate W before it is loaded into the substrate processing apparatus 100.

[0192] The processing liquid adjustment process selection unit 182b selects a processing liquid adjustment process. For example, the processing liquid adjustment process selection unit 182b selects a processing liquid adjustment process by comparing the target sulfuric acid concentration, the target hydrogen peroxide concentration, and the target temperature set based on the substrate information with the sulfuric acid concentration of the processing liquid in the processing bath 110 indicated in the processing liquid information. , past Hydrogen oxide concentration and Bi-onThe processing liquid adjustment process is selected based on the difference between the concentration and the concentration. For example, if the difference is relatively large, the processing liquid adjustment process selection unit 182b selects the liquid changing process as the processing liquid adjustment process. On the other hand, if the difference is relatively small, the processing liquid adjustment process selection unit 182b selects the concentration adjustment process as the processing liquid adjustment process.

[0193] If the liquid changing process is selected in step S20, the process proceeds to step S30. On the other hand, if the concentration adjusting process is selected in step S20, the process proceeds to step S40.

[0194] In step S30, a liquid exchange process is performed. The liquid exchange process adjusts the processing liquid in the processing tank 110. As described above, it is determined whether the processing liquid in the processing tank 110 meets the criteria. If the processing liquid meets the criteria, the processing liquid in the processing tank 110 is not discharged. If the processing liquid does not meet the criteria, the processing liquid in the processing tank 110 is discharged and new sulfuric acid and hydrogen peroxide solution are supplied to the processing tank 110. Then, the process proceeds to step S50A.

[0195] In step S50A, the substrate W is immersed in the processing liquid in the processing bath 110. Thereafter, the substrate W is taken out from the processing liquid in the processing bath 110. In this manner, the substrate processing is completed.

[0196] In step S40, a concentration adjustment step is performed, in which the concentration of the processing liquid in the processing tank 110 is adjusted. Next, the process proceeds to step S50B.

[0197] In step S50B, the substrate W is immersed in the processing liquid in the processing bath 110. Thereafter, the substrate W is taken out from the processing liquid in the processing bath 110. In this manner, the substrate processing is completed.

[0198] According to this embodiment, the processing liquid adjustment step is selected taking into consideration not only substrate information but also processing liquid information, thereby making it possible to appropriately process the substrate W while also taking into consideration the time required for processing liquid adjustment.

[0199] 1 to 12, in order to avoid excessively complicating the invention, the substrate W is processed in one substrate processing apparatus 100, but this embodiment is not limited to this. The substrate W may be processed in two or more substrate processing apparatuses 100.

[0200] Next, a substrate processing system 10 including the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 13. Fig. 13 is a schematic diagram of the substrate processing system 10 including the substrate processing apparatus 100 of this embodiment. The substrate processing system 10 shown in Fig. 13 includes a first substrate processing apparatus 100A to a third substrate processing apparatus 100C.

[0201] As shown in FIG. 13, the substrate processing system 10 includes an input section 20, a plurality of storage sections 30, a transfer mechanism 40, a discharge section 50, a buffer unit BU, a first transport device CTC, a second transport device WTR, a plurality of substrate processing devices 100, and a control device 180.

[0202] The plurality of substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in a line in one direction. For example, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged adjacent to the transport path of the first transfer apparatus CTC in the order of closest to the transport path of the first transfer apparatus CTC: first substrate processing apparatus 100A, second substrate processing apparatus 100B, and third substrate processing apparatus 100C.

[0203] Here, the first to third substrate processing apparatuses 100A to 100C store processing liquids containing sulfuric acid and hydrogen peroxide solution. Substrates W that have been subjected to different processes may be loaded into each of the first to third substrate processing apparatuses 100A to 100C.

[0204] The substrates W to be processed in the substrate processing apparatus 100 are loaded through an input section 20. The input section 20 includes a plurality of mounting tables 22. The substrates W processed in the substrate processing apparatus 100 are unloaded through an output section 50. The output section 50 includes a plurality of mounting tables 52.

[0205] The storage units 30 that house substrates W are placed on the input unit 20. The storage units 30 placed on the input unit 20 store substrates W that have not been processed by the substrate processing apparatus 100. Here, the two storage units 30 are placed on the two mounting tables 22, respectively.

[0206] Each of the plurality of storage units 30 stores a plurality of substrates W. Each substrate W is stored in the storage unit 30 in a horizontal position. The storage unit 30 is, for example, a FOUP (Front Opening Unified Pod).

[0207] The storage units 30 placed on the discharge unit 50 store the substrates W processed by the substrate processing apparatus 100. The discharge unit 50 includes a plurality of mounting tables 52. The two storage units 30 are each placed on two mounting tables 52. The discharge unit 50 stores the processed substrates W in the storage units 30 and discharges the storage units 30 together.

[0208] The buffer unit BU is arranged adjacent to the input section 20 and the discharge section 50. The buffer unit BU takes in the storage section 30 placed in the input section 20 together with the substrate W, and places the storage section 30 on a shelf (not shown). The buffer unit BU also receives the processed substrate W and stores it in the storage section 30, and places the storage section 30 on the shelf. A transfer mechanism 40 is arranged inside the buffer unit BU.

[0209] The transfer mechanism 40 transfers the storage unit 30 between the input unit 20 and the output unit 50 and the shelves. The transfer mechanism 40 also transfers only the substrates W to the first transport device CTC. In other words, the transfer mechanism 40 transfers the lot of substrates W to the first transport device CTC.

[0210] After receiving a lot of unprocessed substrates W from the transfer mechanism 40, the first transfer device CTC converts the orientation of the substrates W from a horizontal orientation to a vertical orientation and transfers the substrates W to the second transfer device WTR. Furthermore, after receiving a lot of processed substrates W from the second transfer device WTR, the first transfer device CTC converts the orientation of the substrates W from a vertical orientation to a horizontal orientation and transfers the lot of substrates W to the transfer mechanism 40.

[0211] The second transfer device WTR is movable from the third substrate processing apparatus 100C to the second substrate processing apparatus 100B along the longitudinal direction of the substrate processing system 10. The second transfer device WTR can transfer lots of substrates W to and from the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C.

[0212] The control device 180 controls various operations of the substrate processing system 10. In detail, the control device 180 controls the delivery mechanism 40, the first transfer device CTC, the second transfer device WTR, and the substrate processing apparatus 100.

[0213] The control device 180 includes a control unit 182 and a memory unit 184. The control unit 182 has a processor. The control unit 182 has, for example, a central processing unit. Alternatively, the control unit 182 may have a general-purpose computer.

[0214] The storage unit 184 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0215] The storage unit 184 includes a main storage unit and an auxiliary storage unit. The main storage unit is, for example, a semiconductor memory. The auxiliary storage unit is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 184 may also include removable media. The storage unit 184 corresponds to an example of a non-transitory computer-readable storage medium.

[0216] The memory unit 184 stores a computer program with predetermined procedures. The substrate processing apparatus 100 operates according to the procedures defined in the computer program. The control unit 182 executes the computer program stored in the memory unit 184 to perform substrate processing operations. The processor of the control unit 182 executes the computer program stored in the memory unit 184 to control the transfer mechanism 40, the first transfer device CTC, the second transfer device WTR, and the substrate processing apparatus 100.

[0217] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each illustrated component may differ from the actual components due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention. [Industrial Applicability]

[0218] The present invention is suitably used in a substrate processing apparatus and a substrate processing method. [Explanation of symbols]

[0219] 10. Substrate Processing System 100 Substrate processing apparatus 110 Treatment tank 112 Inner tank 114 Outer tank 120 Board holding part 130 Processing liquid supply unit 180 Control device 182 Control Unit 184 Memory section W substrate

Claims

1. A substrate processing method for processing a substrate by immersing the substrate in a processing liquid stored in a processing tank containing sulfuric acid and hydrogen peroxide solution, the method comprising: acquiring substrate information indicating information about the substrate before immersing the substrate in the processing solution in the processing bath; a step of selecting, based on the substrate information, either a liquid changing step or a concentration adjusting step as a processing liquid adjusting step for adjusting the processing liquid; a first processing solution adjusting step of discharging at least a portion of the processing solution in the processing tank from the processing tank and supplying sulfuric acid and hydrogen peroxide solution to the processing tank when the processing solution in the processing tank does not satisfy a predetermined condition, if the processing solution in the processing tank is selected in the selecting step; a second treatment liquid adjusting step of adjusting a concentration of the treatment liquid in the treatment tank while circulating the treatment liquid in the treatment tank through a pipe connected to the treatment tank, when the concentration adjusting step is selected in the selecting step; immersing the substrate in the processing liquid in the processing tank while circulating the processing liquid in the processing tank prepared in the first processing liquid preparation step or the second processing liquid preparation step through a pipe connected to the processing tank; A substrate processing method comprising:

2. The substrate processing method according to claim 1, wherein the substrate information indicates a process performed on the substrate before the substrate was immersed in the processing liquid.

3. If the substrate information indicates that an ashing process has been performed on the resist of the substrate in the step of acquiring substrate information, the liquid changing process is selected in the step of selecting; 2. The substrate processing method according to claim 1, wherein, in the step of acquiring substrate information, if the substrate information indicates that ions have been implanted into the resist of the substrate, or that the substrate has been isolated, the concentration adjustment step is selected in the step of selecting.

4. 4. The substrate processing method according to claim 1, wherein, in the first processing solution adjusting step, the processing solution in the processing bath does not get discharged if the processing solution in the processing bath satisfies a predetermined condition.

5. 5. A substrate processing method according to claim 1, wherein the first processing liquid adjustment step includes a step of setting the amount of the processing liquid to be discharged from the processing tank based on the time elapsed since the substrate was immersed in the processing liquid in the processing tank before the substrate is immersed.

6. 6. The substrate processing method according to claim 1, wherein the second processing liquid adjusting step includes a step of adjusting a hydrogen peroxide concentration of the processing liquid based on a measurement result of a concentration sensor that measures the concentration of the processing liquid in the processing tank.

7. The second treatment liquid preparation step includes: supplying hydrogen peroxide solution to the treatment bath so as to increase the hydrogen peroxide concentration of the treatment bath before immersing the substrate in the treatment bath; a step of reducing a hydrogen peroxide concentration in the processing solution in the processing bath after immersing the substrate in the processing solution in the processing bath; The substrate processing method according to claim 1 , further comprising:

8. a treatment tank for storing a treatment liquid containing sulfuric acid and hydrogen peroxide; a circulation unit having a pipe through which the processing solution in the processing tank circulates; a drainage section for discharging the treatment liquid from the treatment tank; a processing solution supply unit that supplies sulfuric acid and hydrogen peroxide solution to the processing tank; a substrate holder that holds a substrate and immerses the substrate in the processing solution in the processing bath; a control unit that controls the circulation unit, the drainage unit, the processing liquid supply unit, and the substrate holding unit; Equipped with the control unit selects either a liquid changing process or a concentration adjusting process as a processing liquid adjusting process for adjusting the processing liquid based on substrate information indicating information about the substrate before the substrate is immersed in the processing liquid in the processing tank; When the liquid changing step is selected, the control unit controls the drainage unit and the processing liquid supply unit so that, when the processing liquid in the processing tank does not satisfy a predetermined condition, at least a part of the processing liquid in the processing tank is discharged from the processing tank, and the processing liquid supply unit supplies the sulfuric acid and the hydrogen peroxide solution to the processing tank to perform a first processing liquid adjustment step, When the concentration adjusting step is selected, the control unit controls the circulation unit and the processing liquid supply unit to perform a second processing liquid adjusting step of adjusting a concentration of the processing liquid while circulating the processing liquid in the processing tank through the piping of the circulation unit; The control unit controls the circulation unit and the substrate holding unit so that the substrate is immersed in the processing liquid in the processing tank while circulating the processing liquid in the processing tank adjusted in the first processing liquid adjustment process or the second processing liquid adjustment process through the piping of the circulation unit.

9. A substrate processing apparatus as described in claim 8, wherein the substrate information indicates processing performed on the substrate before the substrate was immersed in the processing liquid.

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