Electroformed pipe manufacturing method

Abstract

This method for producing an electrocast tube includes a core material preparation step (S1), an electroconductive layer formation step (S3), a support layer formation step (S5), a support-layer-equipped core material cutting step (S7), a crack formation step (S9), a gap formation step (S11), a securing step (S13), a block cutting step (S15), a core material removal step (S17), and a resin removal step (S19).　According to this method for producing an electrocast tube, it is possible to provide a production method that resolves at least one issue from among the issue that an electroconductive layer 2 readily separates from a core material 1, the issue that the electroconductive layer 2 is readily scratched, and the issue that an electrocast tube 4 readily deforms.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electroformed pipe. [Background technology]

[0002] In recent years, there has been a growing need for long, thin tubes with very small outer diameters in a variety of fields. Examples of such tubes include metal tubes called microtubes or micropipes, which are used for contact probes for semiconductor testing, connectors for optical communication, metal ferrules for optical communication, nozzles, needles, etc. For example, tubes for semiconductor inspection contact probes are used in semiconductor inspection probe devices to check whether semiconductor integrated circuits (LSI) are as designed. This device is equipped with numerous contact probes with springs inside the tubes that allow pins to move back and forth within the tubes, and is used to inspect semiconductors by bringing the pins into contact with the electrodes of the semiconductor. Therefore, a long, thin tube with a very small outer diameter is required, and the tube must have high quality such as good electrical conductivity inside the hollow tube and no distortion in the hollow cross section. However, with the recent trend toward higher integration and miniaturization of semiconductors, it has become increasingly difficult to manufacture high-quality tubes.

[0003] Japanese Patent Publication No. 3889689 (Patent Document 1) describes a method for manufacturing electroformed pipes that aims to meet these quality requirements. The method proposes electroforming a stainless steel thin wire (core wire) that has a conductive layer made of a metal different from the electroformed or surrounding material on its outer surface, forming an electroformed or surrounding material (support layer) around the thin wire (core wire) by electroforming, and then removing the thin wire (core wire) while leaving the conductive layer on the inner surface of the electroformed or surrounding material (support layer). Specifically, the thin wire (core wire) around which the electroformed or surrounding material (support layer) is formed is grasped from above and pulled from one or both sides to deform the thin wire (core wire) so that its cross-sectional area decreases, forming a gap between the deformed thin wire (core wire) and the conductive layer, and the deformed thin wire (core wire) is then pulled and removed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3889689 Summary of the Invention [Problem to be solved by the invention]

[0005] The above method seems to be an excellent method, but the gripping part of the thin wire (core wire) that is gripped to reduce the cross-sectional area of ​​the thin wire (core wire) is easily deformed by the gripping force to a degree larger than the inner diameter of the support layer made of the electrodeposit or surrounding material. On the other hand, if that part is cut from above the support layer with scissors, nippers, etc., burrs and the like are left at the cut part of the thin wire (core wire). but Therefore, the thin wire (core wire) is pulled and removed. and, This can easily cause serious quality problems, such as the conductive layer being easily damaged or the electroformed pipe being easily deformed. Therefore, the present invention aims to solve these serious quality problems, namely the law of nature, The object of the present invention is to provide a method for manufacturing an electroformed pipe that solves at least one of the problems that the conductive layer is easily damaged or the electroformed pipe is easily deformed.

[0006] The method for producing an electroformed pipe of the present invention comprises the steps of: A method for manufacturing an electroformed pipe, comprising forming a support layer made of an electroformed electrodeposit or a surrounding material around a core wire having a conductive layer formed on its outer circumferential surface, and removing the core wire while leaving the conductive layer on the inner surface of the support layer, a core wire preparation step of preparing the core wire used in manufacturing the electroformed pipe; a conductive layer forming step of forming a conductive layer around the core wire by electroforming using electroplating to form a conductive layer-coated core wire; a support layer forming step of forming a support layer around the conductive layer-attached core wire by electroforming using electroplating to form a support layer-attached core wire; a support layer-attached core wire cutting step of cutting the support layer-attached core wire to a predetermined length; a crack forming step of swinging the cut core wire with a support layer while holding one or both longitudinal ends of the cut core wire with a support layer, thereby forming a cracked core wire with a support layer in which a crack is formed in the support layer; a gap forming step in which the core wire with the cracked support layer is deformed at the tip of the crack so that its cross-sectional area is reduced by gripping and pulling the core wire with the cracked support layer, thereby forming a gap between the deformed core wire and the conductive layer to form a core wire with a gap support layer; a fixing step of arranging a plurality of the core wires with the gap support layer in parallel along the wall or groove on a cutting jig provided with a wall or groove and fixing them with resin to form a core wire fixing block; a block cutting step of cutting the core wire fixing block in the minor axis direction of the core wire to obtain a cut core wire fixing block; a core wire removal step of removing the core wire from the cut core wire fixing block by tilting or washing the cut core wire fixing block in a liquid or gas so that the longitudinal axis of the core wire is vertical, thereby obtaining a core wire removal fixing block; a resin removal step of removing the resin from the core wire removal fixing block to produce an electroformed pipe in which the conductive layer remains on the inner surface of the support layer; The present invention is characterized by comprising:

[0007] According to the method for manufacturing an electroformed pipe of the present invention, the core wire with a support layer is formed into a cracked core wire with a support layer in the crack forming process by forming cracks in the support layer, the core wire with a gap support layer in the gap forming process by forming gaps between the core wire and the conductive layer, the core wire with a gap support layer is formed in the fixing process by arranging multiple core wires with gap support layers in parallel and fixing them with resin to form core wire fixing blocks, the core wire fixing blocks are cut in the short axis direction of the core wire in the block cutting process to form cut core wire fixing blocks, the cut core wire fixing blocks are tilted and washed in the core wire removal process to form core wire removal fixing blocks from which the core wire has been removed, and the resin is removed from the core wire removal fixing blocks in the resin removal process to produce an electroformed pipe with a conductive layer remaining on the inner surface of the support layer. Therefore, since the core wire with deformed or burrs or the like does not need to be pulled from inside the conductive layer to be removed, the defects that occur when pulling and removing the core wire can be eliminated. R This makes it possible to solve at least one of the serious quality problems that the conductive layer is easily damaged or the electroformed pipe is easily deformed. [Brief explanation of the drawings]

[0008] [Figure 1] 1A and 1B are diagrams for explaining an outline of a method for manufacturing an electroformed pipe according to the first embodiment. [Figure 2] 3 is a diagram for explaining an annealing step (core wire preparation step S1) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 3] 2 is a diagram illustrating the layer structure of a passive film F, a conductive layer 2, a support layer 3, and the like formed by the method for producing an electroformed pipe according to the first embodiment. FIG. [Figure 4] 4A and 4B are diagrams for explaining the conductive layer forming step (S3) and the support layer forming step (S5) in the method for manufacturing an electroformed pipe according to the first embodiment. [Figure 5] 1A and 1B are diagrams for explaining the electroplating process (conductive layer forming step S3) and the support layer forming step (S5) in the method for producing an electroformed pipe according to the first embodiment. [Figure 6] 3 is a diagram illustrating a core wire 13 with a support layer in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 7]5 is a diagram for explaining the crack forming step (S9) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 8] 4 is a diagram for explaining a gap forming step (S11) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 9] 4 is a diagram for explaining a fixing step (S13) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 10] 4 is a diagram for explaining a block cutting step (S15) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 11] 4 is a diagram for explaining a core wire removing step (S17) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 12] 4 is a diagram for explaining a resin removal step (S19) in the method for manufacturing an electroformed pipe according to the first embodiment. FIG. [Figure 13] 1 is a diagram for explaining an outline of the steps of a method for manufacturing an electroformed pipe according to the first embodiment. [Figure 14] 1 is a diagram for explaining an outline of the steps in the method for manufacturing an electroformed pipe according to Embodiments 2 to 9. [Figure 15] 10 is a diagram for explaining an outline of the steps of the method for manufacturing an electroformed pipe according to Embodiments 10 and 11. DETAILED DESCRIPTION OF THE INVENTION

[0009] The method for manufacturing an electroformed pipe of the present invention will be described below with reference to the drawings as appropriate. The figures described below are schematic diagrams that simplify the actual shape, configuration, method, etc. Furthermore, each embodiment does not limit the invention according to the claims. Not all of the elements and combinations thereof described in each embodiment are necessarily essential to the present invention. In the following description, the same reference numerals are used across embodiments for components, steps (processes), etc. that are considered to be substantially equivalent, and repeated explanations may be omitted.

[0010] [Embodiment 1] 1 to 13 are diagrams for explaining the method for manufacturing an electroformed pipe according to embodiment 1. The method for manufacturing an electroformed pipe according to embodiment 1 will be explained with reference to these figures. [Outline of electroformed pipe manufacturing method] FIG. 1 is a diagram for explaining an outline of a method for manufacturing an electroformed pipe according to the first embodiment (in this specification, "step Sxx" may be written as "Sxx"). The method for manufacturing an electroformed pipe according to embodiment 1 is a method for manufacturing an electroformed pipe 4 (see Figure 12 described later) in which a support layer 3 made of an electroformed electrodeposit or surrounding material is formed around a core wire 1 having a conductive layer 2 (see Figure 3 described later) formed on its outer surface, and the core wire 1 is removed while leaving the conductive layer 2 on the inner surface of the support layer 3. The manufacturing method includes a core wire preparation process (S1), a conductive layer formation process (S3), a support layer formation process (S5), a core wire with support layer cutting process (S7), a crack formation process (S9), a gap formation process (S11), a fixing process (S13), a block cutting process (S15), a core wire removal process (S17), and a resin removal process (S19) (see Figure 1).

[0011] To briefly explain each step S1 to S19, in the core wire preparation step (S1), a core wire 1 to be used in manufacturing an electroformed pipe 4 is prepared (described later using FIGS. 3 and 4). In the conductive layer formation step (S3), a conductive layer 2 is formed around the core wire 1 by electroforming using electroplating to form a conductive-layer-equipped core wire 12 (described later using FIGS. 4 to 6). In the support layer formation step (S5), a support layer 3 is formed around the conductive-layer-equipped core wire 12 by electroforming using electroplating to form a support-layer-equipped core wire 13 (described later using FIGS. 4 to 6).

[0012] In the support layer-attached core wire cutting step (S7), the support layer-attached core wire 13 is cut to a predetermined length (described later using FIG. 4). In the crack forming step (S9), the cut support layer-attached core wire 13 is held at one or both longitudinal ends and swung to form a crack K in the support layer 3, resulting in a cracked support layer-attached core wire 13K (described later using FIG. 7). In the gap forming step (S11), the cracked support layer-attached core wire 13K is held and pulled, deforming the core wire 1 beyond the crack K so that its cross-sectional area decreases, and a gap S is formed between the deformed core wire 1 and the conductive layer 2, resulting in a gap support layer-attached core wire 13S (described later using FIG. 8).

[0013] In the fixing step (S13), the gap support layer-attached core wires 13S are arranged in parallel along the walls 62 or grooves 65 on a cutting jig 60 provided with walls 62 or grooves 65 and fixed with resin 63 to form a core wire fixing block B1 (described later using FIG. 9). In the block cutting step (S15), the core wire fixing block B1 is cut in the minor axis direction of the core wire 1 to form a cut core wire fixing block B2 (described later using FIG. 10). In the core wire removing step (S17), the cut core wire fixing block B2 is tilted or washed in liquid or air so that the major axis of the core wire 1 is vertical, thereby removing the core wire 1, to form a core wire removal fixing block B3 (described later using FIG. 11). In the resin removing step (S19), the resin 63 is removed from the core wire removal fixing block B3 to form a 4-electroformed pipe with the conductive layer 2 remaining on the inner surface of the support layer 3 (described later using FIG. 12). Even if the core wire 1, support layer 3, etc. at the gripped portion is deformed by gripping in the gap forming step (S11), the deformed portion is cut and removed in the block cutting step (S15). Alternatively, the deformed portion is cut and removed in a cutting step (a gap support layer-attached core wire cutting step described below) or the like between the gap forming step (S11) and the block cutting step (S15). Therefore, the cut core wire fixing block B2 is a block having the core wire 1 and support layer 3 in a state where they are not deformed by gripping, and in the core wire removing step (S17), the core wire 1 is removed from such a cut core wire fixing block B2. As an outline of the steps of the method for manufacturing an electroformed pipe according to the first embodiment, the materials, dimensions, etc. of the core wire 1, conductive layer 2, support layer 3, etc. are summarized in the table of FIG. 13 (described later).

[0014] [Core wire preparation process (S1)] [Core wire 1] Stainless steel containing chromium in iron, more specifically SUS304 (Cr-Ni type) austenitic stainless steel, is used as the core wire 1. The wire has a diameter of 0.2 mm (circular cross section) and a length of 200 to 2000 m.

[0015] [Annealing] In the manufacturing method of the electroformed pipe according to embodiment 1, in the core wire preparation process (S1), if the core wire 1 is a hardened core wire that has been drawn to reduce its cross-sectional area, the core wire 1 may be annealed.

[0016] 2 is a diagram illustrating the annealing step (core wire preparation step S1) in the method for manufacturing an electroformed pipe according to embodiment 1. The left side of FIG. 2 shows the core wire 1 before annealing. The core wire 1 before annealing may have a passivation film F, or may have a passivation film F and a conductive layer 2 (the passivation film F will be described later). The material of this core wire 1 is stainless steel SUS304.

[0017] Before annealing, the core wire 1 is drawn (processed) by passing a thick stainless steel wire through a slightly smaller hole (die) to gradually make it thinner. The drawing process hardens the core wire 1 and creates a large internal stress 22 (see the bottom left of Figure 2). Such core wire material 1 is placed in a heat treatment furnace 21 and annealed (see the center of FIG. 2). For example, the core wire material 1 is heated to a high temperature in the heat treatment furnace 21 and then the temperature is gradually lowered, thereby performing stress relief annealing to remove or reduce residual stress. After annealing (see the right side of Figure 2), the internal stress 22 of the core wire 1 is reduced (or eliminated) as shown in the lower right of Figure 2. If the core wire 1 is prone to so-called springback, springback will no longer occur or will be less likely to occur.

[0018] [Passive film] In the method for manufacturing an electroformed pipe according to the first embodiment, in the core wire preparation step (S1), a passivation film F may be formed on the surface of the core wire 1, or a surface treatment for forming a passivation film may be performed. FIG. 3 is a diagram illustrating the layer structure of the passive film F, conductive layer 2, support layer 3, etc. formed by the method for manufacturing an electroformed pipe according to the first embodiment (reference numeral 12 denotes a core wire with a conductive layer, reference numeral 13 denotes a core wire with a support layer). Material As shown in FIG. 3, a passive film F (oxide film) is formed on the surface of the core wire 1, or the surface of the core wire 1 is subjected to a surface treatment for forming a passive film. The passive film F is an oxidized film (thin film) that forms on the surface of a metal. If the material (raw material) of the core wire 1 is stainless steel, the chromium contained in the stainless steel combines with oxygen to form a thin, dense film on the surface. The surface treatment for forming a passive film is carried out, for example, by immersing the core wire 1 in an aqueous solution of nitric acid with a concentration of 0.5 to 3.0 wt % (electrolysis may also be carried out).

[0019] [Conductive layer formation process (S3)] [Support layer formation step (S5)] [Electrolytic plating] In the manufacturing method of electroformed pipe according to embodiment 1, electroplating in the conductive layer forming step (S3) and electroplating in the support layer forming step (S5) are carried out successively, and electroplating is carried out in the conductive layer forming step (S3) to form a conductive layer 2 around the core wire 1 to produce a conductive layer-equipped core wire 12, and then electroplating is carried out in the support layer forming step (S5) to form a support layer 3 around the conductive layer-equipped core wire 12 to produce a support layer-equipped core wire 13 (see Figure 4).

[0020] 4 is a diagram illustrating the conductive layer forming step (S3) and the support layer forming step (S5) in the method for manufacturing an electroformed pipe according to embodiment 1. The steps (S3, S5) of forming the conductive layer and the support layer by electroforming using electroplating will be described with reference to FIG. The core wire 1 (which may or may not have been annealed, which may or may not have a passivation film formed thereon, and which may or may not have been surface-treated to form a passivation film) is wound around a supply roller 31 and pulled by a gripping device 35 on the right side. A load adjusting roller 32 and a conveying roller 33 are installed between the supply roller 31 and the gripping device 35, and a predetermined tension is applied to the core wire 1 as it moves from left to right, preventing excessive slack.

[0021] Of the plating tanks 41 where electrolytic plating is performed, the plating tank 41A on the left side is used for electrolytic plating to form the conductive layer, and the plating tank 41B on the right side is used for electrolytic plating to form the support layer, and both tanks contain plating liquid 42 (42A, 42B). The wall (plating tank 41) through which the core wire 1 passes has holes for passage, and the plating liquid 42 leaks out through these holes and is collected in collection tanks 43 (43A, 43B), filtered, and returned to the plating tank 41 for recycling.

[0022] Before and after the core wire 1 passes through the plating tank 41, cleaning tanks 44 (44A, 44B, 44C, 44D) are installed to clean the core wire 1 before and after plating, and cleaning liquid 45 (45A, 45B, 45C, 45D) is contained in each tank. Like the plating tank 41, the cleaning tank 44 has holes in the wall through which the core wire 1 passes, and the cleaning liquid 45 leaks out and is collected in a recovery tank 46 (46A, 46B, 46C, 46D), filtered, and returned to the cleaning tank 44 for recycling or disposal. Pure water, for example, is used as the cleaning liquid 45. The cleaning liquid 45 in the recovery tanks 46B, 46C, 46D may be, for example, pure water to which an ion capture agent that captures ions in the previous plating liquid has been added.

[0023] 4, the cleaning tank 44A, plating tank 41A, and cleaning tank 44B constitute the conductive layer forming step (S3), and the cleaning tank 44C, plating tank 41B, and cleaning tank 44D constitute the support layer forming step (S5). Either the cleaning tanks 44B and 44C may be omitted. In embodiment 1, the electrolytic plating in the conductive layer forming step (S3) and the electrolytic plating in the support layer forming step (S5) are performed consecutively (continuously). That is, in the conductive layer forming step (S3), conductive layer 2 is formed around core wire 1 by electrolytic plating in plating tank 41A to form conductive-layer-equipped core wire 12, and then, in the support layer forming step (S5), support layer 3 is formed around conductive-layer-equipped core wire 12 by electrolytic plating in plating tank 41B to form support-layer-equipped core wire 13.

[0024] [Support layer core wire cutting process (S7)] In the support layer-attached core wire cutting step (S7), the support layer-attached core wire 13 is cut to a predetermined length (see the right side of FIG. 4). That is, the core wire 13 with support layer 3 formed in the support layer forming process (S5) is cut to a predetermined length (e.g., 400 to 600 mm) by a cutting tool 36 in the core wire cutting process (S7). 4, the core wire 13 with the support layer is gripped by a gripping tool 35 and pulled to the right. For example, a plurality of (at least three) gripping tools 35 (35A, 35B, 35C) are rotated. Between positions P1 and P2, first gripping tool 35A moves at the same speed as core wire 13 with support layer without gripping core wire 13 with support layer. When the first gripping tool 35A reaches position P2, it grips the support layer-attached core wire 13 and moves to the right. (When the first gripping tool 35A reaches position P2, the second gripping tool 35B reaches position P1.) When the first gripping tool 35A reaches position P3, the second gripping tool 35B reaches position P2 and grips the support layer-attached core wire 13. (The third gripping tool 35C reaches position P1.) The cutting tool 36 then cuts (severs) the support layer-attached core wire 13 near position P2 (between positions P2 and P3, near the first gripping tool 35A). The first gripping tool 35A then releases its grip, and the support layer-attached core wire 13, cut to a predetermined length, falls to the ground. The second and third gripping tools (35B, 35C) are controlled to operate in the same manner as the first gripping tool 35A. The core wires 13 with support layers cut to a predetermined length fall one after another. The cut core wires 13 with support layers are sent to the next process.

[0025] ([Conductive layer formation step (S3)], [Support layer formation step (S5)]) [Agitation of plating solution 42] In the manufacturing method of electroformed pipe according to embodiment 1, when electroplating a core wire 1 or a core wire 12 with a conductive layer in a plating tank 41 (41A, 41B) containing a plating liquid 42 (42A, 42B), the plating liquid 42 (42A, 42B) is stirred, and the core wire 1 or the core wire 12 with a conductive layer is moved through the stirred plating liquid in the longitudinal direction to perform electroplating.

[0026] Fig. 5 is a diagram illustrating the electroplating process in the manufacturing method for an electroformed pipe according to embodiment 1. The electroplating process for forming the conductive layer 2 and the electroplating process for forming the support layer 3 (S3, S5) are basically the same, so Fig. 5 will explain the electroplating process for forming the conductive layer 2. When electroplating the core wire 1 in the plating tank 41A, the core wire 1 is moved (while being moved) in the longitudinal direction (from left to right in FIG. 5) to perform electroplating. 48A1 and 48A2 are holes in the plating tank 41A and the recovery tank 43A, respectively, provided for the passage of the core wire 1.

[0027] The core wire 1 and electrode plate 47A are arranged so that they are below the position of the hole 48A1 in the plating tank 41A. The plating solution 42A leaks out from the hole 48A1, but is constantly replenished so that the liquid level is above the position of the hole 48A1. The core wire 1 (object to be plated) is connected to the cathode of a DC power source DC1, and the electrode plate 47A is connected to the anode. The electrode plate 47A may be made of a metal used for plating, but for example, platinum may also be used. In this case, a gold-cobalt alloy plating solution, that is, a solution (aqueous solution, etc.) in which metal ions of gold and cobalt for plating are dissolved, is used as the plating solution. For example, an aqueous solution in which gold ions and an aqueous solution in which cobalt ions are dissolved are prepared, and these are replenished as necessary so that the measured concentration of gold ions or cobalt ions in the plating solution 42A remains constant. Formed by electrolytic plating R The layer is a gold-cobalt alloy layer (thickness 1 μm) containing 0.3 wt% cobalt. The support layer 3 is formed in the same manner. A solution (aqueous solution, etc.) containing nickel and cobalt metal ions for plating is used. For example, an aqueous solution containing nickel ions and an aqueous solution containing cobalt ions are prepared, and are appropriately replenished so that the measured concentration of nickel ions or cobalt ions in the plating solution 42A remains constant. R The layer is a nickel-cobalt alloy layer (thickness: 25 μm) containing 4.0 to 35.0 wt% of cobalt.

[0028] Rotating blade 49A of a stirrer (motor) is installed in plating tank 41A with its longitudinal axis aligned with the longitudinal axis of core wire 1. When rotating blade 49A rotates around its longitudinal axis, plating solution 42A is stirred. Plating solution 42A is stirred so as to generate a flow around core wire 1 (or between core wire 1 and electrode plate 47A) in at least a direction intersecting the longitudinal axis.

[0029] [Conductive layer formation using alloys] 6 is a diagram illustrating a core wire 13 with a support layer in the method for manufacturing an electroformed pipe according to embodiment 1. As shown in FIG. 6, the core wire 13 with a support layer has a conductive layer 2 (AuCo alloy) and a support layer 3 (NiCo alloy) laminated on a core wire 1 (stainless steel). If a passivation film F is to be formed, it is formed between the core wire 1 and the conductive layer 2. In the method for manufacturing an electroformed pipe according to embodiment 1, in the conductive layer formation step (S3), the conductive layer 2 is formed from an alloy of one or more elements selected from the group consisting of Au, Ag, Pd, and Pt and one or more elements selected from the group consisting of Co and Ni.

[0030] When the conductive layer 2 is made of an alloy, it may be made of an AuNi alloy, an AgCo alloy, an AgNi alloy, a PdCo alloy, a PdNi alloy, a PtCo alloy, or a PtNi alloy.

[0031] [Crack formation process (S9)] FIG. 7 is a diagram illustrating the crack forming step (S9) in the method for manufacturing an electroformed pipe according to the first embodiment. In the crack formation process (S9) shown in Figure 7, the cut core wire 13 with support layer is swung while being held at one or both ends in the longitudinal direction, to form a cracked core wire 13K with support layer in which a crack K is formed in the support layer 3. In the method for manufacturing an electroformed pipe according to the first embodiment, in the crack forming step (S9), cracks K are formed in at least the support layer 3 adjacent to the gripped portion.

[0032] To explain further, the core wire 13 with support layer cut in the core wire with support layer cutting process (S7, see right side of Figure 4) has one end in the longitudinal direction grasped (clamped) by a grasping tool 51 (clamping device) in the crack formation process (S9), and the other end grasped by a human hand (or a mechanical arm) with a grasping tool 52 (radial pliers) (top diagram of Figure 7). In this state, when the gripping tool 52 is swung, the support layer-attached core wire 13 swings in a direction intersecting the longitudinal axis direction, and a crack K occurs in the area between the gripping tools 51 and 52 (see the bottom diagram in Figure 7). When the gripping tool 52 is swung so that the angle between the longitudinal axis direction of the support layer-attached core wire 13 at gripping position G1 of the gripping tool 52 and the longitudinal axis direction of the support layer-attached core wire 13 to the left of that increases, a crack K forms in the support layer 3 at position G2 adjacent to gripping position G1 (see the bottom diagram in Figure 7). (Similarly, when the gripping tool 51 is swung so that the angle between the longitudinal axis direction of the support layer-attached core wire 13 at that gripping position increases and the longitudinal axis direction of the support layer-attached core wire 13 to the right of that increases, a crack K forms in the support layer 3 at the area adjacent to the gripping position of the gripping tool 51.) In this way, the core wire 13 with support layer becomes a cracked core wire 13K with support layer, in which cracks K are formed in the support layer 3.

[0033] [Gap formation process (S11)] FIG. 8 is a diagram illustrating the gap forming step (S11) in the method for manufacturing an electroformed pipe according to the first embodiment. In the gap forming process (S11) shown in Figure 8, the core wire 13K with a cracked support layer (see the lower diagram in Figure 7) is grasped and pulled, thereby deforming the core wire 1 at the end of the crack K so that its cross-sectional area becomes smaller, thereby forming a gap S between the deformed core wire 1 and the conductive layer 2, resulting in the core wire 13S with a gap support layer. That is, while being held in the crack forming step (S9, see Fig. 7), the cracked core wire 13K with support layer is pulled to the right with the holding tool 51 as shown in Fig. 8, whereby the support layer 3 and the conductive layer 2 are broken by the crack K, and the core wire 1 beyond the crack K is deformed so that its cross-sectional area decreases. Then, a gap S is formed between the deformed core wire 1 and the conductive layer 2, resulting in the core wire 13S with gap support layer.

[0034] [Cutting process for core wire with gap support layer] In the manufacturing method of the electroformed pipe according to embodiment 1, a core wire with gap support layer cutting process may be further included between the gap forming process (S11) and the fixing process (S13), in which the core wire with gap support layer 13S is cut to a predetermined length (e.g., 40 to 60 mm) to form the core wire with gap support layer 13S (not shown).

[0035] [Fixing process (S13)] FIG. 9 is a diagram for explaining the fixing step (S13) in the method for manufacturing an electroformed pipe according to the first embodiment. In the fixing process (S13) shown in Figure 9, the core wire 13S with gap support layer is arranged in parallel along the wall 62 or groove 65 on a cutting jig 60 (60A, 60B, 60C) having a wall 62 or groove 65, and fixed with resin 63 to form a core wire fixing block B1 (the length of the wall 62 or groove 65 is 40 to 60 mm corresponding to the length of the core wire 13S with gap support layer).

[0036] In the manufacturing method of the electroformed pipe according to embodiment 1, in the fixing step (S13), the core wire 13S with the gap support layer may be fixed by spraying powdered resin 63 onto the cutting jig 60 or the core wire 13S with the gap support layer and solidifying it.

[0037] Four examples of the fixation process are shown in Figure 9(a) to (d). In the example shown in FIG. 9(a), a cutting jig 60 (60A) is made up of a floor board with a flat upper surface 61, Floorboards (flooring materials) The floor board and the wall material have a pair of walls 62 provided on an upper surface 61 so as to face each other. The materials of the floor board and the wall material are resin, carbon, glass, etc. The core wires 13S with gap support layers are arranged in parallel on the upper surface 61 of the floor board along the walls 62 (in the long axis direction) (parallel to the walls 62), and are fixed in this state with resin 63, thereby forming a core wire fixing block B1.

[0038] Methods for fixing the gap support layer-equipped core wire 13S with resin 63 include, for example, using a thermoplastic resin as resin 63, powdering the resin 63, (a) sprinkling it onto the aligned core wires 13S with gap support layers, (b) sprinkling it onto the upper surface 61 or the core wires 13S with gap support layers before or after arranging the core wires 13S with gap support layers, or (c) sprinkling it while arranging the core wires 13S with gap support layers (left diagram in Figure 9(a)). Examples of such thermoplastic resins include polypropylene, polyethylene, acrylonitrile butadiene styrene, acrylic (PMMA), polyamide, etc. The cutting jig 60 is then passed through a heating bath to soften the resin 63 (for example, to a paste-like state), and then the temperature is returned to room temperature (cooled) to harden the resin, forming a core wire fixing block B1 in which multiple core wires 13S with gap support layers are fixed by the resin 63 in a parallel arrangement along the wall 62 (right diagram in Figure 9(a)). This method is used in the first embodiment.

[0039] 9(a) is basically the same as the example shown in Fig. 9(b), but in this example, multiple layers of core wire 13S with gap support layers are formed on cutting jig 60 (60A) to form core wire fixing block B1. For example, multiple core wires 13S with gap support layers are lined up in parallel for one layer, sprayed with resin 63, passed through a heating tank (where the resin 63 softens and adheres to the core wires 13S with gap support layers), hardened at room temperature, and then lined up in parallel for the next layer, sprayed with resin 63, passed through a heating tank, and hardened at room temperature, repeating this process to form core wire fixing block B1 with multiple layers of core wire 13S with gap support layers.

[0040] The example shown in FIG. 9(c) is basically the same as the example shown in FIG. 9(a), but the cutting jig 60 (60A) cuts the wall in the longitudinal direction of the core wire 13S with the gap support layer. 62 The upper surface of the floor plate 61 The difference is that the cutting jig 60 (60B) has a groove 65 (65A) formed in the cutting jig 60 (60B). The plurality of core wires 13S with gap support layers are cut by the wall of the cutting jig 60 (60B). 62The longitudinal direction of the core wires 13S with gap support layers is aligned along the wall 62 and the groove 65 (65A). The structure of the cutting jig 60 (60B) is 62 is provided but the groove 65 (65A) is not provided, or the wall 62 Alternatively, the groove 65 (65A) may be provided without providing the groove 65 (65B).

[0041] The example shown in FIG. 9(d) is basically the same as the example shown in FIG. 9(a), except that the cutting jig 60 (60C) has a groove 65 (65B) instead of the wall 62. hand The plurality of core wires 13S with gap support layers are aligned so that their longitudinal directions are aligned with the grooves 65 (65B). A thermosetting resin may be used as the resin 63. In this case, the resin is made fluid (liquid or paste-like) at room temperature, and then applied, poured, or otherwise disposed between the gap support layer-attached core wires 13S and between the gap support layer-attached core wires 13S and the cutting jig 60. The resin is then heated to harden. Examples of thermosetting resins include epoxy resin, unsaturated polyester resin, and thermosetting polyimide. The resin 63 may be an adhesive resin.

[0042] [Block cutting process (S15)] FIG. 10 is a diagram illustrating the block cutting step (S15) in the method for manufacturing an electroformed pipe according to the first embodiment. In the manufacturing method of the electroformed pipe according to embodiment 1, in the block cutting process (S15), the core wire fixing block B1 is cut in the short axis direction of the core wire 1 to form a cut core wire fixing block B2 (the cut length is 3 mm, which is the length of the electroformed pipe 4). The term "minor axis direction" refers to a direction intersecting the major axis. It includes not only a direction completely perpendicular to the major axis, but also directions at angles of 30 degrees or 45 degrees between the minor axis and the major axis (the same applies elsewhere in the specification). In this block cutting process (S15), the core wire fixing block B1 is cut sequentially while being shifted in the longitudinal direction of the core wire 1 (see Figure 10(a)), or the core wire fixing block B1 is cut simultaneously at multiple locations (see Figure 10(a)).

[0043] [Sequential Cut] 10(a) is a diagram illustrating the sequential cutting of the core wire fixing block B1. The cutting machine 70 (70A) has a mounting table 71 on which the core wire fixing block B1 (the cutting target) is placed, a drive roller 75 that moves a cutting wire 77 at high speed, and a driven roller 76. The cutting wire 77 is wound between the drive roller 75 and the driven roller 76 and moves at high speed between them to cut the core wire fixing block B1. The mounting table 71 is provided with a recess 72 into which the core wire fixing block B1 (the cutting target) fits, and is configured so that the core wire fixing block B1 can be pushed and moved along the recess 72.

[0044] When the core wire fixing block B1 is pushed and pops out from the end of the recess 72, the mounting table 71 moves in the direction of the cutting wire 77 and the core wire 1 is cut (severed) in the minor axis direction, resulting in a cut core wire fixing block B2. When cutting is complete, the core wire fixing block B1 is pushed and a new section to be cut pops out from the end of the recess 72. Then, the mounting table 71 moves in the direction of the cutting wire 77 and the new section to be cut is cut (severed), resulting in a cut core wire fixing block B2. In this way, the core wire fixing blocks B1 are cut in sequence, and successively become cut core wire fixing blocks B2. If the core wire 13S with gap support layer (or the core wire 1 therein) in the core wire fixing block B1 is deformed by being held in the gap forming step (S11), the deformed portion is cut and removed. The portion that is cut and removed is mainly the first or last portion (the end of the core wire fixing block B1) when the core wire fixing block B1 is cut sequentially.

[0045] [Simultaneous Cut] Figure 10(b) is a diagram illustrating simultaneous cutting of the core wire fixing block B1. Simultaneous cutting is basically the same as sequential cutting, but there are some differences, which will be mainly explained below. The cutting machine 70 (70B) has a mounting table 71, a setting tool 73 (on which the core wire fixing block B1 is set) attached to the mounting table 71, a driving roller 75, and a driven roller 76. Multiple cutting wires 77 are wound in parallel around the driven roller 76, and the multiple parallel-arranged cutting wires 77 move at high speed from the driving roller 75 side to the driven roller 76 side.

[0046] When the mounting table 71 moves in the direction of the cutting wire 77, the core wire fixing block B1 is cut simultaneously (meaning not just completely simultaneously but almost simultaneously) in the short axis direction at multiple locations, resulting in multiple cut core wire fixing blocks B2. If the core wire 13S with gap support layer (or the core wire 1 therein) in the core wire fixing block B1 is deformed by being held in the gap forming step (S11), the deformed portion is cut and removed. The portion that is cut and removed is mainly the end of the core wire fixing block B1 when the core wire fixing block B1 is cut at the same time.

[0047] In addition, in Figure 10(a) (sequential cutting) and Figure 10(b) (simultaneous cutting), instead of moving the mounting table 71 in the direction of the cutting wire 77, the cutting wire 77 may be moved in the direction of the mounting table 71. Furthermore, regardless of the cutting method, including sequential cutting and simultaneous cutting, the core wire 13S with gap support layer is cut from the outside while fixed with resin 63, so there is almost no deformation of the core wire 1 or support layer 3 due to cutting. In any cutting method, including sequential cutting and simultaneous cutting, cutting may be performed using abrasive grains (artificial or naturally occurring granular or powdery substances with high hardness).

[0048] [Core wire removal process (S17)] FIG. 11 is a diagram illustrating the core wire removing step (S17) in the method for manufacturing an electroformed pipe according to the first embodiment. In the manufacturing method of an electroformed pipe according to embodiment 1, in the core wire removal process (S17), the cut core wire fixing block B2 is tilted or washed in liquid or gas so that the longitudinal axis direction of the core wire 1 is vertical, thereby removing the core wire 1 from the cut core wire fixing block B2 and forming a core wire removal fixing block B3. The cut core wire fixing block B2 is a block having a core wire 1 and a support layer 3 in a state where there is no deformation due to gripping, and in the core wire removal process (S17), the core wire 1 is removed from such a cut core wire fixing block B2. The cut ends of the cut core wire fixing block B2 are cleanly cut without deforming the core wire 1 or the support layer 3, but cutting debris tends to adhere to the gap S (mainly the gap at the end) between the core wire 1 and the conductive layer 2. Alternatively, when cutting using abrasive grains, the abrasive grains tend to get into the gap S. However, by tilting or washing the cut core wire fixing block B2, cutting debris and the like can be removed, and the core wire 1 can be removed without damaging the conductive layer 2 or the like.

[0049] In the method for producing an electroformed pipe according to the first embodiment, when the cut core wire fixing block B2 is cleaned in a liquid in the core wire removing step (S17), ultrasonic cleaning, moving the liquid, or Pre-cut core wire fixing block B2 By moving the cut core wire fixing block B2, the core wire 1 is removed from the cut core wire fixing block B2.

[0050] [Tilt the cut core wire fixing block B2] Figure 11(a) is a diagram illustrating the removal of the core wire 1 by tilting the cut core wire fixing block B2. In this case, as shown in Figure 11(a), the cut core wire fixing block B2 is grasped with a gripping tool 81 (81A) and tilted so that the long axis direction of the core wire 1 is vertical in the cleaning solution or in the air. The core wire 1 then falls due to gravity and is removed, becoming a core wire removal fixing block B3. Note that "long axis direction is vertical" does not mean that the long axis direction is exactly the same as the plumb line, but rather that the tilted long axis direction includes a vector component in the vertical line direction (the same applies to other parts). Furthermore, moving the gripping tool 81 (81A) facilitates removal of the core wire 1.

[0051] [Cleaning of cut core wire fixing block B2] FIG. 11(b) is a diagram for explaining the removal of the core wire 1 by ultrasonically cleaning the cut core wire fixing block B2. In this case, as shown in FIG. 11(b), the cut core wire fixing block B2 is held by a holder 81 (81B) and ultrasonically cleaned in a cleaning solution 85. An ultrasonic generator 87 is installed in the cleaning solution 85 and generates ultrasonic waves. This generates fine bubbles 88 (cavitation) in the cleaning solution 85, which expand, burst, etc. Therefore Shock waves 89 are generated, removing cutting debris and other materials adhering to the gap S of the cut core wire fixing block B2, and the core wire 1 falls and is removed from the cut core wire fixing block B2. The cut core wire fixing block B2 then becomes the core wire removal fixing block B3. In Figure 11(b), the cut core wire fixing block B2 is tilted so that the core wire 1 (long axis) inside is vertical (so that it has a vector component in the vertical direction).

[0052] The core wire 1 can also be removed by stirring the cleaning solution 85 or by moving the cut core wire fixing block B2 in the cleaning solution 85. The core wire 1 can also be removed by placing the cut core wire fixing block B2 in the air and blowing high-pressure air onto it to clean it. The cleaning liquid may be an alkaline solution, an acidic solution, a solution containing detergent, or pure water. Furthermore, the air may be air or a specific gas such as nitrogen.

[0053] [Resin removal process (S19)] FIG. 12 is a diagram illustrating the resin removing step (S19) in the method for manufacturing an electroformed pipe according to the first embodiment. In the method for manufacturing an electroformed pipe according to the first embodiment, in the resin removal step (S19), the resin 63 is removed from the core wire removal fixing block B3, leaving an electroformed pipe 4 with the conductive layer 2 remaining on the inner surface of the support layer 3. This process is schematically illustrated in FIG.

[0054] In the method for manufacturing an electroformed pipe according to the first embodiment, in the resin removing step (S19), the resin 63 is removed from the core wire removal fixing block B3 by chemically dissolving the resin 63 or by peeling it off by dissolving it with heat.

[0055] In the first embodiment, a thermoplastic resin is used as the resin 63. This is chemically dissolved using a resin dissolving agent, and the resin 63 is removed from the core wire removal fixing block B3. An example of a resin dissolving agent is e-Solv 21HE from Kaneko Chemical Co., Ltd. (when thermoplastic polyurethane is used as the resin 63). Alternatively, the resin 63 may be removed using, for example, an alkaline cleaner. An alkaline cleaner is a cleaner whose main components are sodium carbonate, sodium hydroxide, potassium hydroxide, sodium silicate (water glass), sodium phosphate, etc. The resin 63 is removed by applying such a cleaner to the core wire removal fixing block B3, immersing the core wire removal fixing block B3 in the cleaner, or the like. If the resin 63 is a thermoplastic resin, it can also be removed by heating it to soften (melt). When a thermosetting resin such as an epoxy resin is used as the resin 63, it can be removed using, for example, the resin dissolving agent e-solv 21HE. When an adhesive resin is used as the resin 63, it can be removed using, for example, a resin dissolving agent such as toluene or benzine.

[0056] [Process overview diagram] FIG. 13 is a diagram illustrating an outline of the steps in the method for manufacturing an electroformed pipe according to the first embodiment. R The materials, dimensions, etc. of the core wire 1, conductive layer 2, support layer 3, etc. explained up to this point are collectively described. As shown in the lower part of Figure 13, the method for manufacturing an electroformed pipe according to embodiment 1 is further divided into four modes for the core wire preparation step (S1). In embodiment 1-(1), annealing and passivation film formation (or surface treatment) are performed in the core wire preparation step (S1). In this mode, it is preferable to form a passivation film after the annealing. A degreasing and cleaning treatment may be performed between the annealing and passivation film formation to further facilitate passivation film formation. In embodiment 1-(2), only annealing is performed. In embodiment 1-(3), only passivation film formation (or surface treatment) is performed. In embodiment 1-(4), neither annealing nor passivation film formation (or surface treatment) is performed. Embodiment 1-(1) is the most preferred mode.

[0057] [Effects of the manufacturing method for electroformed pipe according to embodiment 1] According to the manufacturing method of the electroformed pipe according to the first embodiment, the core wire 13 with a support layer is formed into a cracked core wire 13K with a support layer in which a crack is formed in the support layer 3 in the crack forming step (S9), and is formed into a core wire 13S with a gap support layer in which a gap is formed between the core wire 1 and the conductive layer 2 in the gap forming step (S11). In the fixing step (S13), a core wire fixed block B1 is formed in which a plurality of core wires with a gap support layer 13S are arranged in parallel and fixed with resin 63, and the block is cut. In step (S15), the core wire fixing block B1 is cut in one minor axis direction of the core wire to form a cut core wire fixing block B2, and in the core wire removal step (S17), the cut core wire fixing block B2 is tilted and washed to form a core wire removal fixing block B3 from which the core wire 1 has been removed, and in the resin removal step (S19), the resin 63 is removed from the core wire removal fixing block B3, producing an electroformed pipe 4 with the conductive layer 2 remaining on the inner surface of the support layer 3. Therefore, the core wire, which has been deformed at the gripping point or has burrs, does not need to be removed by pulling it from inside the conductive layer. eye, This makes it possible to solve at least one of the serious quality problems that the conductive layer is easily damaged or the electroformed pipe is easily deformed. It is not easy to check the quality of the inside of an electroformed pipe (peeling of the conductive layer 2, scratches, etc.), but the method for manufacturing an electroformed pipe according to embodiment 1 makes it possible to eliminate or reduce such checks.

[0058] Furthermore, if the core wire 1 is a core wire that has been hardened by wire drawing (a process of stretching to reduce the cross-sectional area), annealing in the core wire preparation step (S1) removes or reduces stress, making it easier to remove the core wire 1 in the core wire removal step (S17). For example, when using a core wire 1 wound on a reel, so-called spring back is less likely to occur, making it easier to remove the conductive layer 2 without damaging it.

[0059] In addition, before electrolytic plating, the passive film F is usually removed or a surface treatment for removing the passive film is performed to make the plating easier. However, in embodiment 1, on the contrary, in the core wire preparation step (S1), if a passive film F is formed on the surface of the core wire 1 or a surface treatment for forming a passive film is performed, the adhesion of the conductive layer 2 to the core wire 1 can be weakened, making it easier to form a gap between the core wire 1 and the conductive layer 2 in the subsequent gap formation step (S11).

[0060] Furthermore, if the electrolytic plating in the conductive layer forming step (S3) and the electrolytic plating in the support layer forming step (S5) are carried out consecutively, and the formation of the conductive layer 2 by electrolytic plating is followed by the formation of the support layer 3 by electrolytic plating, the adhesion of the support layer 3 to the conductive layer 2 can be further improved, the thickness of the conductive layer 2 and the support layer 3 can be easily controlled, and foreign matter is less likely to be mixed in between the conductive layer 2 and the support layer 3. Furthermore, if the long core wire 1 is electroplated by passing it continuously through each plating tank in the longitudinal direction, productivity is improved compared to batch processing (processing in which the short core wire 1 is electroplated while being pulled up from each plating tank). case It is possible to raise it up a level.

[0061] Furthermore, when electroplating the core wire 1 or the core wire 12 with a conductive layer in a plating tank 41 (41A, 41B) containing plating liquid 42 (42A, 42B), if the plating liquid 42 (42A, 42B) is stirred, when the core wire 1 or the core wire 12 with a conductive layer is moved in the longitudinal direction through the stirred plating liquid to perform electroplating, it is easier to achieve uniform plating layer thickness not only in the longitudinal direction but also in the circumferential direction (short axis direction).

[0062] Furthermore, when the conductive layer 2 is formed from an alloy of one or more elements selected from the group consisting of Au, Ag, Pd, and Pt and one or more elements selected from the group consisting of Co and Ni in the conductive layer formation step (S3), a harder conductive layer 2 can be formed compared to when the conductive layer 2 is formed from pure Au, pure Ag, pure Pd, or pure Pt. Therefore, it is possible to form a conductive layer 2 that is resistant to scratches.

[0063] Furthermore, if the cracks K are formed in at least the support layer 3 adjacent to the gripped portion in the crack forming step (S9), it becomes possible to adjust the position where the cracks K are formed by selecting the gripped portion.

[0064] Furthermore, if there is a gap support layer-attached core wire cutting step between the gap forming step (S11) and the fixing step (S13), in which the gap support layer-attached core wire 13S is cut to a predetermined length to form the gap support layer-attached core wire 13S, it becomes possible to adjust the length of the gap support layer-attached core wire 13S to the length of the cutting jig 60. For example, when there are many types of electroformed pipes 4, the core wires 13S can be cut to a fixed length in the support layer-attached core wire cutting step (S7), and the types of electroformed pipes 4 can be adjusted. to By further cutting to the length of the cutting jig 60 made accordingly, it becomes even easier to manufacture electroformed pipes 4 of various lengths. Furthermore, if there is deformation due to gripping or the like in the gap forming step (S11), the deformed portion can be cut and removed to produce core wire 13S with gap support layer.

[0065] Furthermore, in the fixing step (S13), if the gap support layer-equipped core wire 13S is fixed by spraying powdered resin 63 onto the cutting jig 60 or the gap support layer-equipped core wire 13S and solidifying it, it becomes possible to cut the gap support layer-equipped core wire 13S, which has a small cross-sectional area and is slender, without it becoming unstable (shaking). In particular, it becomes possible to prevent shaking in the minor axis direction. Therefore, it becomes possible to suppress (or prevent) bending of the gap support layer-equipped core wire 13S in the minor axis direction or distortion of the cut cross section (of the core wire 1, conductive layer 2, or support layer 3).

[0066] Furthermore, in the block cutting step (S15), if the core wire fixing block B1 is cut sequentially while being shifted in the longitudinal direction of the core wire 1, it becomes easier to produce small lots of electroformed pipes 4 of different lengths, for example. Also, if the core wire fixing block B1 is cut at multiple locations simultaneously, it becomes easier to produce large lots of electroformed pipes 4 of the same length, for example. In addition, if there is deformation due to gripping or the like in the gap forming process (S11), it is also possible to cut and remove the deformed areas in the block cutting process (S15) to create a cut core wire fixed block B2, regardless of whether the cutting is done sequentially or simultaneously.

[0067] In the core wire removal step (S17), when the cut core wire fixing block B2 is washed in a liquid, ultrasonic cleaning is performed, the liquid is moved, or Pre-cut core wire fixing block B2 3. By moving the and, This makes it possible to more easily remove the core wire 1 without causing serious quality problems such as scratches on the conductive layer 2 or deformation of the electroformed tube 4.

[0068] Furthermore, if the resin 63 is removed from the core wire removal fixing block B3 by chemically dissolving the resin 63 or by peeling it off by dissolving it with heat in the resin removing step (S19), the resin 63 can be removed even more easily.

[0069] [Embodiments 2 to 11]

[0070] 14 and 15 are diagrams for explaining an outline of the steps in the method for manufacturing electroformed pipes according to the second to eleventh embodiments. The methods for manufacturing electroformed pipes according to embodiments 2 to 9 (see FIG. 14) and embodiments 10 and 11 (see FIG. 15) are basically the same as the method for manufacturing an electroformed pipe according to embodiment 1, but differ in any of the material and dimensions of the core wire 1, the core wire preparation step (S1), the conductive layer formation step (S3), the support layer formation step (S5), the fixing step (S13), the block cutting step (S15), etc. Furthermore, the electroformed pipes 4 manufactured differ in any of the length, inner diameter, outer diameter, material and thickness of the conductive layer 2, and material and thickness of the support layer 3. These are as shown in the diagrams of Figures 14 and 15. As the contents of the diagrams of Figures 14 and 15 are assumed to be described in the specification, they will not be put into writing as a general rule.

[0071] As with embodiment 1, stainless steel (SUS304) is used for the core wire 1 in embodiments 2, 3, 7 to 9, and 10 to 11. However, the diameter is different from that of embodiment 1 (see FIGS. 14 and 15). Nichrome (NCH1, nickel chromium type 1) is used in embodiments 4 and 6, and nichrome (JIS code NW2200) is used in embodiment 5. The diameter is as shown in FIG. 14. Furthermore, the length of the core wire 1 in embodiments 2 to 9 is the same as that of embodiment 1, but the range of the length in embodiments 10 to 11 is different from that of embodiment 1 (see FIGS. 14 and 15).

[0072] The core wire preparation step (S1) is divided into four forms depending on whether or not annealing treatment and passive film formation (or surface treatment) are performed, in the same manner as in the first embodiment, in the second to eleventh embodiments. The descriptions at the bottom of Figures 14 and 15 explain the four further subdivisions of the second embodiment (X is any of the first to eleven), that is, X-(1) to X-(4) (see the explanation of the [Outline of the Process] in the first embodiment). For passive film formation (or surface treatment), in embodiments 4, 6, 10, and 11, the steel is immersed in a 0.5 to 3.0 WT% (mass %) nitric acid aqueous solution as in embodiment 1, while in embodiments 2 and 7, the steel is immersed in a 1.0 to 3.0 WT% hydrochloric acid aqueous solution. In addition, in embodiments 3, 5, 8, and 9, the steel is immersed in pure water. In the case of pure water, the passive film is formed (or the surface is treated) by the oxygen dissolved in the pure water.

[0073] In the conductive layer forming step (S3), in embodiments 3 to 6 and 8 to 9, the conductive layer 2 of AuCo alloy is formed by electroplating using an AuCo alloy plating solution, as in embodiment 1, but in embodiment 2, the conductive layer 2 of pure Pd is formed by electroplating using a Pd plating solution, and in embodiment 7, the conductive layer 2 of pure Pt is formed by electroplating using a Pt plating solution. The thickness of each conductive layer 2 is as shown in FIG. In addition, in embodiments 10 and 11, the conductive layer 2 of an AuCo alloy is formed by electrolytic plating using an AuCo alloy plating solution, as in embodiment 1. The range of Co mass % in the AuCo alloy is slightly different from embodiment 1. The layer thickness of each conductive layer 2 is as shown in FIG.

[0074] Regarding the support layer forming step (S5), in the eighth embodiment, the support layer 3 of NiCo alloy is formed by electroplating using a NiCo alloy plating solution as in the first embodiment, but in the second to seventh and ninth embodiments, pure Ni is formed by electroplating using a Ni plating solution. Support layer 3 The thickness of each support layer 3 is as shown in FIG. In the tenth embodiment, a Sn layer is formed by electroplating using a Sn plating solution, a Cu layer is formed thereon by electroplating using a Cu plating solution, and then the whole is heat-treated (for example, at a temperature of 150°C to 210°C) to form an alloyed CuSn alloy layer (conductive layer 2). The thickness of the CuSn alloy layer (conductive layer 2) and the Sn content in the CuSn alloy are as shown in FIG. In the eleventh embodiment, a Cu layer is formed by electroplating using a Cu plating solution, a Pb layer is formed thereon by electroplating using a Pb plating solution, and then the whole is heat-treated (for example, at a temperature of 450 to 550°C) to form an alloyed CuPb alloy layer (conductive layer 2). The thickness of the CuPb alloy layer (conductive layer 2) and the Pb content in the CuPb alloy are as shown in FIG.

[0075] Regarding the support layer-attached core wire cutting step (S7), the cutting length in the second to eleventh embodiments is the same as that in the first embodiment (400 to 600 mm).

[0076] In the fixing step (S13), in any of the second to eleventh embodiments, similar to the first embodiment, the substrate is further cut to a length that matches the cutting jig 60. The respective cut lengths are as shown in Figs. 14 and 15. The resins used in the fixing step in the second to ninth embodiments are all thermoplastic resins similar to those in the first embodiment. In contrast, the resins used in the fixing step in the tenth and eleventh embodiments are all thermosetting resins (epoxy resins).

[0077] Regarding the block cutting step (S15), the cut lengths (which become the lengths of the electroformed pipes 4) in each of the second to eleventh embodiments are as shown in FIGS.

[0078] Regarding the resin removal process (S19), in all of the embodiments 2 to 11, the resin 63 was removed from the core wire removal fixed block B3 by dissolving the resin 63 with a resin solvent, as in the embodiment 1, to produce an electroformed pipe 4 with the conductive layer 2 remaining on the inner surface of the support layer 3.

[0079] 14 and 15, the length, inner diameter, outer diameter, material and thickness of the conductive layer 2, and material and thickness of the support layer 3 of the manufactured electroformed pipe 4 are listed.

[0080] [Effects of the methods for manufacturing electroformed pipes according to embodiments 2 to 11] The manufacturing methods of electroformed pipes according to embodiments 2 to 11 differ from the manufacturing method of electroformed pipe according to embodiment 1 in terms of the material of the core wire 1, etc., but are otherwise similar to embodiment 1, and have the same effects as embodiment 1 in the similar points.

[0081] [Variations] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be modified within the scope of the invention, for example, the following modifications are also possible.

[0082] (1) In the above-described embodiments 1 to 3, 7 to 9, 10 to 11, stainless steel (SUS304) is used for the core wire 1, but the stainless steel is not limited to this. For example, stainless steel (SUS303) may also be used.

[0083] (2) In the above-described embodiments 1 to 11, the core wire 1 has a circular cross section, but the cross section of the core wire 1 is not limited to a circular cross section. For example, the cross section of the core wire 1 may be a polygon such as a triangle, quadrangle (square, rectangle), or pentagon.

[0084] (3) In the above embodiment, the support layer 3 formed in the support layer forming step (S5) is a single layer, but the support layer 3 is not limited to a single layer. For example, it may be a multi-layer structure such as two or three layers. Similarly, the conductive layer 2 formed in the conductive layer forming step (S3) teeth Although it is a single layer, it is not limited to a single layer and may be a multi-layer. [Explanation of symbols]

[0085] 1...core wire, 12...core wire with conductive layer, 13...core wire with support layer, 2...conductive layer, 3...support layer, F...passivation film, 21...heat treatment furnace, 22...stress, 31...supply roller, 32...load adjustment roller, 33...conveyor roller, 35...gripping tool, 36...cutting tool, P1, P2, P3...position, 41, 41A, 41B...plating tank, 42, 42A, 42B...plating solution, 43, 43A, 43B...circulation Storage tank, 44, 44A to 44D... cleaning tank, 45, 45A to 45D... cleaning solution, 46, 46A to 46D... recovery tank, 47... electrode, 48A1, 48A2... hole, DC1... DC power supply, 49A... agitator, 51... gripping tool, 52... gripping tool, K... crack, 13K... core wire with cracked support layer, 13S... core wire with gap support layer, S... gap, 60, 60A, 60B, 60c... cutting jig, 61... top surface , 62...wall, 63...resin, 65...groove 、 B1...Core wire fixing block, B2...Cut core wire fixing block, B3...Core wire removal fixing block, 70, 70A, 70B...Cutting machine, 71...Placement table, 72...Recess, 73...Setting tool, 75...Drive roller, 76...Follower roller, 77...Cutting wire, 81, 81A, 81B...Gripping tool, 82...Receptacle, 85...Cleaning liquid, 86...Cleaning tank, 87...Ultrasonic generator, 88...Air bubbles, 89...Shock wave

Claims

1. A method for manufacturing an electroformed pipe, comprising forming a support layer made of an electroformed electrodeposit or a surrounding material around a core wire having a conductive layer formed on its outer circumferential surface, and removing the core wire while leaving the conductive layer on the inner surface of the support layer, a conductive layer forming step of forming a conductive layer around the core wire by electroforming using electroplating to form a conductive layer-coated core wire; a support layer forming step of forming a support layer around the conductive layer-attached core wire by electroforming using electroplating to form a support layer-attached core wire; a support layer-attached core wire cutting step of cutting the support layer-attached core wire to a predetermined length; a crack forming step of swinging the cut core wire with a support layer while holding one or both longitudinal ends of the cut core wire with a support layer, thereby forming a cracked core wire with a support layer in which a crack is formed in the support layer; a gap forming step in which the core wire with the cracked support layer is deformed at the tip of the crack so that its cross-sectional area is reduced by gripping and pulling the core wire with the cracked support layer, thereby forming a gap between the deformed core wire and the conductive layer to form a core wire with a gap support layer; a fixing step of arranging a plurality of the core wires with the gap support layer in parallel along the wall or groove on a cutting jig provided with a wall or groove and fixing them with resin to form a core wire fixing block; a block cutting step of cutting the core wire fixing block in the minor axis direction of the core wire to obtain a cut core wire fixing block; a core wire removal step of removing the core wire from the cut core wire fixing block by tilting or washing the cut core wire fixing block in a liquid or gas so that the longitudinal axis of the core wire is vertical, thereby obtaining a core wire removal fixing block; a resin removal step of removing the resin from the core wire removal fixing block to produce an electroformed pipe in which the conductive layer remains on the inner surface of the support layer; A method for manufacturing an electroformed pipe, comprising:

2. The method for manufacturing an electroformed pipe according to claim 1, a core wire preparation step of preparing the core wire to be used in manufacturing the electroformed pipe before the conductive layer formation step; In the core wire preparation step, when the core wire is a hardened core wire that has been drawn to reduce its cross-sectional area, the core wire is annealed. A method for manufacturing an electroformed pipe.

3. The method for manufacturing an electroformed pipe according to claim 1, a core wire preparation step of preparing the core wire to be used in manufacturing the electroformed pipe before the conductive layer formation step; In the core wire preparation step, a passive film is formed on the surface of the core wire, or a surface treatment for forming a passive film is performed. A method for manufacturing an electroformed pipe.

4. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, The electrolytic plating of the conductive layer forming step and the electrolytic plating of the support layer forming step are carried out successively, In the conductive layer forming step, electrolytic plating is performed to form the conductive layer around the core wire to form the conductive layer-attached core wire, and subsequently in the support layer forming step, electrolytic plating is performed to form the support layer around the conductive layer-attached core wire to form the support layer-attached core wire. A method for manufacturing an electroformed pipe.

5. The method for manufacturing an electroformed pipe according to claim 4, When electroplating the core wire or the core wire with a conductive layer in a plating tank containing a plating solution, the plating solution is stirred, and the core wire or the core wire with a conductive layer is moved in the longitudinal direction through the stirred plating solution to perform electroplating. A method for manufacturing an electroformed pipe.

6. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the conductive layer forming step, the conductive layer is formed of an alloy of one or more elements selected from the group consisting of Au, Ag, Pd, and Pt and one or more elements selected from the group consisting of Co and Ni. A method for manufacturing an electroformed pipe.

7. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the crack forming step, a crack is formed in the support layer adjacent to at least the gripped portion. A method for manufacturing an electroformed pipe.

8. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, Between the gap forming step and the fixing step, there is a gap support layer-attached core wire cutting step in which the gap support layer-attached core wire is cut to a predetermined length to form a gap support layer-attached core wire. A method for manufacturing an electroformed pipe.

9. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the fixing step, powdered resin is sprayed onto the cutting jig or the core wire with the gap support layer and solidified to fix the core wire with the gap support layer. A method for manufacturing an electroformed pipe.

10. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the block cutting step, the core wire fixing block is sequentially cut while being shifted in the longitudinal direction of the core wire, or the core wire fixing block is simultaneously cut at a plurality of positions. A method for manufacturing an electroformed pipe.

11. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the core wire removal step, when the cut core wire fixing block is washed in a liquid, the core wire is removed from the cut core wire fixing block by ultrasonic cleaning, moving the liquid, or moving the core wire removal fixing block. A method for manufacturing an electroformed pipe.

12. The method for manufacturing an electroformed pipe according to any one of claims 1 to 3, In the resin removal step, the resin is removed from the core wire removal fixing block by chemically dissolving the resin or by dissolving the resin by heating. A method for manufacturing an electroformed pipe.

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