Processing data creation device
The processing data creation device addresses product shifting and waviness in laser cutting by allocating a long final cutting path parallel to the Y-axis, enhancing rigidity and enabling stable product removal.
Patent Information
- Application Number
- JP2021079855
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-05-10
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2041-05-10
AI Technical Summary
In laser cutting systems, products may shift and fall under the workpiece during processing, especially when the final cutting path is short, leading to processing defects such as waviness and difficulty in stable transportation due to the low rigidity of the uncut portion.
A processing data creation device allocates a final cutting path parallel to the Y-axis direction with a length equal to or greater than a determined length, ensuring the rigidity of the uncut portion and preventing product shifting by only moving the machining head in the Y-axis direction during the final cut.
This approach stabilizes the transportation of products by preventing waviness and shifting, allowing for stable removal without interference with the remaining workpiece material.
Smart Images

Figure 0007748819000001 
Figure 0007748819000002 
Figure 0007748819000003
Abstract
Description
[Technical Field]
[0001] The present invention provides Processing data creation device Regarding. [Background technology]
[0002] Patent Document 1 discloses a processing system equipped with a processing machine that performs laser cutting using a laser beam emitted from a processing head. The processing machine can cut out a product from a workpiece by irradiating the workpiece with a laser beam along an outline cutting line for cutting out the outline of the product. This processing machine can irradiate the workpiece with the laser beam two-dimensionally by combining movement of the workpiece along a first axis direction with movement of the processing head along a second axis direction perpendicular to the first axis direction.
[0003] The products cut out from the workpiece are taken out by a product carrying-out device and carried to a predetermined loading location. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-192465 Summary of the Invention [Problem to be solved by the invention]
[0005] However, in laser cutting using such a processing system, depending on the final cutting path where the laser beam cuts the outline cutting line last, the product may shift and fall under the workpiece during processing. Furthermore, if the length of the final cutting path is short, the rigidity of the uncut portion before the final cutting path is low, which can result in processing defects such as waviness during the final cutting path. This can cause the product to get caught on the remaining workpiece material when being transported, making it difficult to transport the product stably. [Means for solving the problem]
[0006] A processing data creation device according to one embodiment of the present invention creates processing data for a processing system that performs laser cutting to cut a plate-shaped workpiece to produce a product. The processing system includes a processing machine that two-dimensionally irradiates the workpiece with a laser beam output from a processing head by combining movement of the workpiece in a first axial direction along the workpiece plane and movement of the processing head in a second axial direction along the workpiece plane, perpendicular to the first axial direction, to cut the workpiece according to the shape of the product, and a product delivery device that moves to a first side, which is one side of the first axial direction, and advances toward the processing head to remove the cut product from the workpiece. The processing data creation device includes an acquisition unit that acquires product data including the shape of the product, a cutting line setting unit that sets an outline cutting line for cutting the outline of the product from the workpiece based on the product data, and an allocation setting unit that allocates a cutting path of the laser beam to the outline cutting line to create processing data for the product. The allocation setting unit identifies as a reference line segment a line segment on the first side of the outline cutting line in the first axis direction that is parallel to the second axis direction and has a length equal to or greater than a determined length, and allocates to the reference line segment a final cutting path, which is the path along which the laser beam last cuts on the outline cutting line.
[0007] A machining data creation device according to one embodiment of the present invention assigns a final cutting path to a line segment (reference line segment) that is parallel to the second axis direction and long among the line segments on the first side of the outline cutting line in the first axis direction. Because the length of the final cutting path is increased, the rigidity of the uncut portion before cutting along the final cutting path increases. As a result, it is possible to prevent machining defects such as waviness from occurring during cutting along the final cutting path. Furthermore, because the final cutting path is parallel to the Y-axis direction, cutting along the final cutting path requires only movement of the machining head in the second axis direction, without movement of the workpiece in the first axis direction. Therefore, it is possible to prevent the product from shifting and slipping under the workpiece during machining. [Effects of the Invention]
[0008] According to one aspect of the present invention, the product can be stably transported without getting caught on the remaining workpiece. [Brief explanation of the drawings]
[0009] [Figure 1] FIG. 1 is a block diagram showing the configuration of a processed data generating device and a processing system according to this embodiment. [Figure 2] FIG. 2 is an explanatory diagram showing a simplified configuration of a laser processing unit provided in the processing machine. [Figure 3] FIG. 3 is an explanatory diagram showing a simplified configuration of a product carrying-out device provided in the processing system. [Figure 4] FIG. 4 is an explanatory diagram of the outline cutting line. [Figure 5] FIG. 5 is an explanatory diagram showing a method of allocating a cutting path of a laser beam to an outline cutting line. [Figure 6] FIG. 6 is an explanatory diagram showing the setting of the relief. [Figure 7] FIG. 7 is an explanatory diagram showing the laser cutting method according to this embodiment. [Figure 8] FIG. 8 is an explanatory diagram showing the shape of a product in which no reference line segment exists in the outline cutting line. DETAILED DESCRIPTION OF THE INVENTION
[0010] Hereinafter, the processing data creation device and the laser cutting method according to the present embodiment will be described with reference to the drawings.
[0011] FIG. 1 is a block diagram showing the configuration of a processing data creation device and a processing system according to this embodiment. FIG. 2 is an explanatory diagram showing a simplified configuration of a laser processing unit provided in a processing machine. FIG. 3 is an explanatory diagram showing a simplified configuration of a product discharge device provided in a processing machine. In the following description, directions are defined as an X-axis direction (first axis direction) and a Y-axis direction (second axis direction) that are orthogonal to the horizontal direction, and a Z-axis direction that is orthogonal to the X-axis direction and the Y-axis direction. The X-axis direction corresponds to the left-right direction, with one side being the left side (first side) and the other side opposite to the one side being the right side (second side). The Y-axis direction corresponds to the front-rear direction, with one side being the front side and the other side being the rear side. The Z-axis direction corresponds to the up-down direction, with one side being the upper side and the other side being the lower-rear side. Note that these directions are used merely for convenience of explanation.
[0012] The processing data creation device 21 according to this embodiment creates processing data for a processing system 40 that performs laser cutting processing to cut a plate-shaped workpiece (e.g., sheet metal) W to produce a product P. The processing system 40 includes a processing machine 50 that combines movement of the workpiece W in the X-axis direction along the workpiece plane and movement of the processing head 52a in the Y-axis direction along the workpiece plane, which is perpendicular to the X-axis direction, to two-dimensionally irradiate the workpiece W with a laser beam output from the processing head 52a, thereby cutting the workpiece W according to the shape of the product P, and a product carrying-out device 60 that moves to the left in the X-axis direction and advances toward the processing head 52a, thereby removing the product P cut from the workpiece W.
[0013] The processing data creation device 21 includes an acquisition unit 21a that acquires product data including the shape of the product P, a cutting line setting unit 21b that sets an outline cutting line CL for cutting out the outline of the product P from the workpiece W based on the product data, and an allocation setting unit 21c that allocates a cutting path of the laser beam to the outline cutting line CL to create processing data for the product P. The allocation setting unit 21c identifies, as a reference line segment CLs, a line segment that is parallel to the Y-axis direction and has a length equal to or greater than a determined length among line segments on the left side of the outline cutting line CL in the X-axis direction. The allocation setting unit 21c allocates, to the reference line segment CLs, a final cutting path Rcf that is the path along which the laser beam will last cut on the outline cutting line CL.
[0014] The overall system including the machining data creation device and machining system will be described below. The overall system is mainly composed of a CAD (Computer Aided Design) 10, a CAM (Computer Aided Manufacturing) 20, a control device 30, and a machining machine 50.
[0015] CAD 10 is a computer equipped with CAD functions. CAD 10 is configured as a computer having a hardware processor such as a CPU (Central Processing Unit), memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAD 10 are realized by having the hardware processor execute programs stored in the memory.
[0016] The CAD 10 functions as a product data creation device 11 by executing a computer program. The product data creation device 11 creates product data, which is data related to the product P to be cut out from the workpiece W. The product data includes information such as the shape, size, and weight of the product P. The product data created by the product data creation device 11 is input to the CAM 20.
[0017] CAM20 is a computer equipped with CAM functions. CAM20 is composed of a computer having a hardware processor such as a CPU, memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAM20 are realized by having the hardware processor execute programs stored in the memory.
[0018] The CAM 20 executes a computer program to function as a machining data creation device 21. The machining data creation device 21 creates data used by a control device 30 that controls the machining system 40. The CAM 20 is connected to an input device 22 for inputting information to the CAM 20 and a display device 23 for displaying information created by the CAM 20.
[0019] The product data created by the product data creation device 11 is input to the processing data creation device 21. Work data including the size, thickness, material, etc. of the workpiece W is input to the processing data creation device 21 from the input device 22. Equipment data including information on the processing machine 50 of the processing system 40 is input to the processing data creation device 21. The equipment data may be acquired from the processing machine 50 or the control device 30, or may be acquired from an external device that holds information on the processing machine 50.
[0020] The processing data creation device 21 creates processing data for the product P. The processing data for the product P is data in which a cutting path of the laser beam is allocated to an outline cutting line CL for cutting out the outline of the product P from the workpiece W. The processing data creation device 21 creates a processing program based on the processing data. The processing program is composed of machine control codes with which the control device 30 controls the processing system 40.
[0021] The machining program created by the machining data creating device 21 is stored in the control device 30. The machining data creating device 21 may store the created machining program in a database in a data management server (not shown). In this case, the control device 30 may read out the machining program stored in the database of the data management server.
[0022] In relation to this embodiment, the processing data creation device 21 includes an acquisition unit 21a, a cutting line setting unit 21b, and an allocation setting unit 21c. The acquisition unit 21a acquires product data, for example, from the product data creation device 11. The cutting line setting unit 21b sets an outline cutting line CL for cutting out the outline of the product P from the workpiece W based on the product data. The allocation setting unit 21c allocates a cutting path of the laser beam to the outline cutting line CL to create processing data for the product P.
[0023] The control device 30 is a device that controls the machining system 40 based on a machining program, and is, for example, an NC device (numerical control device). The control device 30 is configured by a computer having a hardware processor such as a CPU, a memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of the control device 30 are realized by having the hardware processor execute the program stored in the memory.
[0024] For example, the control device 30 controls the processing machine 50 to cut out a product P from the workpiece W based on a processing program. When the processing machine 50 cuts out the product P from the workpiece W, the product P is manufactured. Furthermore, the control device 30 controls the product carrying-out device 60 based on the processing program to take out and carry out the product P cut from the workpiece W. When the product carrying-out device 60 carries out the product P, the product P is accumulated on an accumulation pallet (not shown).
[0025] The processing system 40 includes a processing machine 50 and a product carrying-out device 60 .
[0026] The processing machine 50 is equipped with a punch processing unit 51 and a laser processing unit 52. The punch processing unit 51 performs punch processing on the workpiece W using a mold consisting of a punch and a die. The laser processing unit 52 performs laser cutting processing on the workpiece W using a laser beam. The processing machine 50 of this embodiment is premised on being a multi-processing machine equipped with the punch processing unit 51 and the laser processing unit 52, but since its main feature is the laser processing unit 52, the following description will focus on the laser processing unit 52.
[0027] A table that is movable in the Y-axis direction is placed on the base of the processing machine 50, and the workpiece W is placed horizontally on the table with the workpiece plane facing up and down. A carriage 50a that is movable in the X-axis direction is provided near the table, and multiple clamp members 50b that hold the workpiece W are provided on the carriage 50a. By moving the carriage 50a in the X-axis direction, the workpiece W can be moved along the X-axis direction.
[0028] The laser processing unit 52 cuts out a product P from the workpiece W by laser cutting. The laser processing unit 52 is equipped with a processing head 52a that irradiates the workpiece W with a laser beam. The processing head 52a is configured to be movable in the Y-axis direction and the Z-axis direction. When performing laser cutting, under the control of the control device 30, the processing machine 50 combines movement of the workpiece W in the X-axis direction with movement of the processing head 52a in the Y-axis direction, and irradiates the workpiece W with the laser beam output from the processing head 52a in a two-dimensional manner. In this way, the laser processing unit 52 cuts the workpiece W according to the outer shape of the product P.
[0029] The product discharge device 60 removes and carries out the product P cut out from the workpiece W. The product discharge device 60 carries out the product P every time the laser processing unit 52 cuts out the product P from the workpiece W. The product discharge device 60 has a pair of discharge arms 61 that separate the product P cut out from the workpiece W from the remaining workpiece and remove it. Each discharge arm 61 has a surface facing the workpiece W that is provided with a plurality of suction pads 61a for suctioning the product P. When carrying out the product P, under the control of the control device 30, the product discharge device 60 moves the pair of discharge arms 61 to the left in the X-axis direction and advances the pair of discharge arms 61 toward the processing head 52a. When the pair of discharge arms 61 reach the product P, the product discharge device 60 uses the pair of discharge arms 61 to suction the product P, separate it from the remaining workpiece, and remove it. The product discharge device 60 carries out the removed product P to a collection pallet (not shown) and collects it.
[0030] Next, a procedure for creating processing data by the processing data creating device 21 will be described. Fig. 4 is an explanatory diagram of an outline cutting line. Fig. 5 is an explanatory diagram showing a method for allocating a cutting path of a laser beam to the outline cutting line.
[0031] First, the cutting line setting unit 21b sets an outline cutting line CL based on the product data acquired by the acquisition unit 21a. The outline cutting line CL is a cutting line for cutting out the outline of the product P from the workpiece W, and corresponds to the outline shape of the product P. The cutting line setting unit 21b identifies the outline shape of the product P from the product data and sets the outline cutting line CL according to the outline shape of the product P. The outline cutting line CL is made up of multiple line segments, and the multiple line segments are connected in series to form a single closed figure. Each line segment that makes up the outline cutting line CL is made up of a straight line or an arc (curve).
[0032] The allocation setting unit 21c allocates a cutting path of the laser beam to the outline cutting line CL. The cutting path of the laser beam is a path along which the laser beam passes when cutting the workpiece W. The cutting path of the laser beam includes a cutting path that cuts the outline cutting line CL and an approach path Ra that cuts from the pierce Pa toward the outline cutting line CL.
[0033] Specifically, the layout setting unit 21c sets a search range Rs at the outermost position on the left side of the outline cutting line CL in the X-axis direction, i.e., a range that is a reference distance to the right from the left end of the outline cutting line CL. Within the search range Rs, the layout setting unit 21c identifies a line segment that is parallel to the Y-axis direction and has a determination length Lth or greater as the reference line segment CLs. In this way, the reference line segment CLs is identified from among the line segments on the left side of the outline cutting line CL in the X-axis direction.
[0034] If there are multiple line segments that satisfy the requirements within the search range Rs, the layout setting unit 21c identifies the longest line segment among the multiple line segments as the reference line segment CLs. If there are multiple longest line segments, the layout setting unit 21c identifies the leftmost line segment among those line segments as the reference line segment CLs.
[0035] The reference distance and the judgment length Lth that define the search range Rs for searching the reference line segment CLs may be preset fixed values. However, the allocation setting unit 21c may use values input by the operator using the input device 22 as the reference distance and the judgment length Lth of the search range Rs.
[0036] Once the reference line segment CLs is identified, the allocation setting unit 21c allocates a cutting path of the laser beam to the outline cutting line CL so that the reference line segment CLs becomes the final cutting path Rcf. The final cutting path Rcf is the last path that the laser beam takes among the cutting paths that cut the outline cutting line CL, and is the path along which the product P is separated from the workpiece W. As shown in FIG. 5, the allocation setting unit 21c allocates, as the cutting path of the laser beam, a path that starts from the cutting start point Ps, goes around the outline cutting line CL, passes through the final cutting path Rcf, and returns to the cutting start point Ps. In other words, the final cutting path Rcf is a path in which the end of the final cutting path Rcf reaches the cutting start point Ps.
[0037] In the processing system 40 according to this embodiment, the product discharge device 60 discharges the product P each time the laser processing unit 52 cuts out one product P. The discharge arm 61 of the product discharge device 60 waits at a position a certain distance to the right of the processing head 52a during laser cutting processing by the laser processing unit 52. When the product P is cut out from the workpiece W and the processing head 52a rises, the discharge arm 61 moves from the standby position to the left. This causes the discharge arm 61 to advance below the processing head 52a and remove the cut-out product P. In this embodiment, taking into consideration the manner in which the product P is removed by the discharge arm 61, the reference line segment CLs and the final cutting path Rcf are set with respect to the line segment on the left side of the outline cutting line CL.
[0038] Furthermore, the allocation setting unit 21c allocates a pierce Pa and an approach Ra that cuts from the pierce Pa toward the outline cutting line CL, in addition to the cutting path that cuts the outline cutting line CL. The approach Ra is set so as to lead from the pierce Pa to the cutting start point Ps of the outline cutting line CL.
[0039] 6 is an explanatory diagram illustrating the setting of the clearance. The layout setting unit 21c can allocate the clearance CLr in addition to the cutting path for cutting the outline cutting line CL, the pierce Pa, and the approach Ra. In this case, it is preferable that the layout setting unit 21c sets the clearance CLr so that it proceeds straight along the Y-axis direction from the end point of the final cutting path Rcf. Note that if the clearance CLr cannot be set along the Y-axis direction, it is preferable that the layout setting unit 21c set the clearance CLr in any direction within a range that does not interfere with the product P.
[0040] In this way, the allocation setting unit 21c creates processing data for the product P by allocating the cutting path of the laser beam to the outline cutting line CL. In addition, the allocation setting unit 21c creates processing data in which suction positions of the pair of carry-out arms 61 are allocated to the product P so that the product P cut from the workpiece W can be taken out by the product carry-out device 60. The allocation setting unit 21c allocates suction positions of the pair of carry-out arms 61 to the product P based on the final cutting path Rcf and the product data. The processing data creation device 21 creates a processing program based on these processing data. The created processing program is used by the control device 30.
[0041] FIG. 7 is an explanatory diagram showing a laser cutting method according to this embodiment. The control device 30 controls the processing machine 50 and the product discharge device 60 based on a processing program. First, the processing machine 50 cuts the workpiece W according to the outer shape of the product P using laser cutting processing by the laser processing unit 52. Specifically, the laser processing unit 52 starts emitting a laser beam from the processing head 52a at the piercing position to open a pierce Pa, and then cuts until it reaches a cutting start point Ps on the outer cutting line CL to form an approach line Ra. The laser processing unit 52 moves the processing head 52a clockwise from the cutting start point Ps along the outer cutting line CL. Then, the laser processing unit 52 cuts the final cutting point (cutting start point Ps), which is the end of the final cutting path Rcf, stops emitting the laser beam, and raises the processing head 52a.
[0042] When the final cutting path Rcf is cut by the laser beam, the product P is completely separated from the workpiece W. The product discharge device 60 moves the discharge arm 61 to the left in the X-axis direction and advances it toward the processing head 52a. When the product discharge device 60 advances each discharge arm 61 to a predetermined suction position, it starts the suction operation using the suction pad 61a, and separates and removes the product P from the remaining workpiece. The product discharge device 60 carries out the removed product P to an accumulation pallet (not shown) and accumulates it.
[0043] The laser cutting method according to this embodiment is realized through this series of steps. This laser cutting method is performed each time a product P allocated to the workpiece W is cut.
[0044] As described above, according to this embodiment, the allocation setting unit 21c identifies, as a reference line segment CLs, a line segment that is parallel to the Y-axis direction and has a determination length Lth or greater among the line segments on the left side of the outline cutting line CL in the X-axis direction. Then, the allocation setting unit 21c allocates, to the reference line segment CLs, a final cutting path Rcf, which is the path along which the laser beam last cuts the outline cutting line CL.
[0045] As described above, according to the machining data creation device 21 of this embodiment, the longest line segment on the left side of the outline cutting line CL that is parallel to the Y-axis direction is assigned as the final cutting path Rcf. Because the length of the final cutting path Rcf is increased, the rigidity of the uncut portion before cutting along the final cutting path Rcf increases. As a result, it is possible to prevent machining defects such as waviness from occurring during cutting along the final cutting path Rcf. Furthermore, because the final cutting path Rcf is parallel to the Y-axis direction, when cutting along the final cutting path Rcf, the machining head 52a moves only in the Y-axis direction, without moving the workpiece W in the X-axis direction. Therefore, it is possible to prevent the product P from shifting and slipping under the workpiece W during machining. This prevents the product P from getting caught on the remaining workpiece material when the product P is being carried out, allowing the product P to be carried out stably.
[0046] Furthermore, according to the machining data creation device 21 of this embodiment, as described above, the final cutting path Rcf is automatically assigned to the reference line segment CLs that meets the predetermined requirements. Without a function for automatically assigning the final cutting path Rcf to the reference line segment CLs, the operator would need to manually modify the final cutting path Rcf. Assigning the final cutting path Rcf requires appropriate knowledge and experience, such as knowledge about the delivery of the product P by the product delivery device 60. Furthermore, when the final cutting path Rcf is modified, the suction position of the delivery arm 61 must be modified, which takes a long time to create the machining data. However, according to this embodiment, manual modification is not required, thereby eliminating such inconvenience.
[0047] Furthermore, according to the laser cutting method of this embodiment, among the line segments on the left side of the contour cutting line CL, the longest line segment that is parallel to the Y-axis direction is cut last. Therefore, the length of the final cutting path Rcf is increased, thereby increasing the rigidity of the uncut portion before cutting the final cutting path Rcf. As a result, it is possible to prevent processing defects such as waviness from occurring when cutting along the final cutting path Rcf. Furthermore, because the final cutting path Rcf is parallel to the Y-axis direction, when cutting along the final cutting path Rcf, the processing head 52a only moves in the Y-axis direction, without moving the workpiece W in the X-axis direction. Therefore, it is possible to prevent the product P from shifting and slipping under the workpiece W during processing. This prevents the product P from getting caught on the remaining workpiece material when the product P is being carried out, allowing the product P to be carried out stably.
[0048] According to the processing data creation device 21 of this embodiment, the layout setting unit 21c sets a search range Rs within a range that is a reference distance to the right in the X-axis direction, based on the outermost position on the left side of the outline cutting line CL. Then, the layout setting unit 21c identifies a reference line segment CLs within the search range Rs.
[0049] According to this configuration, the layout setting unit 21c performs processing to identify the reference line segment CLs by limiting the line segments that exist within the search range Rs among the multiple line segments that make up the outline cutting line CL. Since the layout setting unit 21c does not need to determine whether all line segments that make up the outline cutting line CL correspond to the reference line segment CLs, the calculation load can be reduced. Furthermore, by setting the search range Rs, line segments that exist on the left side of the outline cutting line CL are extracted, so the reference line segment CLs can be identified on the left side of the outline cutting line CL.
[0050] According to the processing data creation device 21 of this embodiment, the allocation setting unit 21c sets a clearance CLr along the Y-axis direction from the final cutting point (cutting start point Ps) where the laser beam last cuts on the outline cutting line CL.
[0051] According to this configuration, cutting the recess CLr involves only moving the machining head 52a in the Y-axis direction, and does not involve moving the workpiece W in the X-axis direction. Therefore, it is possible to prevent the product P from shifting and sinking under the workpiece W when cutting the recess CLr. This makes it possible to prevent the product P from getting caught on the remaining workpiece when carrying out the product P, so that the product P can be carried out stably.
[0052] According to the above-described embodiment, it is assumed that the outer shape of the product P has a line segment that is parallel to the Y-axis direction and has a length equal to or greater than the determination length Lth. However, depending on the outer shape of the product P, there may be a line segment that is parallel to the Y-axis direction but does not have a length equal to or greater than the determination length Lth. In such a case, the reference line segment CLs can be set for the line segment that is parallel to the Y-axis direction. This allows the final cutting path Rcf to be set taking into account the product discharge by the product discharge device 60.
[0053] 8 is an explanatory diagram showing the shape of a product for which no reference line segment exists on the outline cutting line. Depending on the outline shape of the product P, such as a circle, triangle, or trapezoid, there may be no line segment parallel to the Y-axis direction. In this case, it is preferable that the allocation setting unit 21c allocates the cutting path of the laser beam so that the final cutting point (cutting start point Ps) where the laser beam last cuts on the outline cutting line CL is located at the outermost position on the left side of the outline cutting line CL.
[0054] According to this configuration, the cutting path of the laser beam can be allocated taking into consideration the product discharge by the product discharge device 60.
[0055] Although the embodiments of the present invention have been described above, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure. [Explanation of symbols]
[0056] 10 CAD 11 Product data creation device 20 CAM 21 Processing data creation device 21a Acquisition Department 21b Cutting line setting section 21c Allocation setting section 22 Input Devices 23 Display device 30 Control device 40 Processing System 50 Processing machine 50a Carriage 50b Clamping member 51 Punch processing section 52 Laser Processing Section 52a Processing head 60 Product unloading device 61 Loading arm 61a Suction pad
Claims
1. In a processing data creation device for creating processing data for a processing system that performs laser cutting processing to cut a plate-shaped workpiece to manufacture a product, The processing system includes: a processing machine that two-dimensionally irradiates the workpiece with a laser beam output from the processing head by combining movement of the workpiece in a first axial direction along a workpiece plane and movement of the processing head in a second axial direction along the workpiece plane that is perpendicular to the first axial direction, and cuts the workpiece according to the shape of the product; a product carrying-out device that moves to a first side that is one side in the first axial direction and advances toward the processing head, thereby removing the product cut from the workpiece every time the processing machine cuts the product; The processing data creation device includes: an acquisition unit that acquires product data including the shape of the product; a cutting line setting unit that sets an outline cutting line for cutting out the outline of the product from the workpiece based on the product data; an allocation setting unit that allocates a cutting path of the laser beam to the outline cutting line and creates processing data for the product, The allocation setting unit a search range is set within a range that is a reference distance from a first side of the outline cutting line in the first axis direction toward a second side opposite to the first side in the first axis direction; Identifying a plurality of line segments that are parallel to the second axis direction and have a length equal to or greater than a determination length from among the line segments within the search range; Identifying the longest line segment among a plurality of line segments that are parallel to the second axis direction and have a length equal to or greater than a determination length as a reference line segment; A final cutting path, which is the path along which the laser beam cuts last on the outline cutting line, is assigned to the reference line segment. Processing data creation device.
2. The allocation setting unit If there are a plurality of the longest line segments, the line segment located closest to the first side among the plurality of longest line segments is identified as the reference line segment.
2. The processing data creating device according to claim 1.
3. The allocation setting unit A relief is set along the second axis from a final cutting point where the laser beam finally cuts the outline cutting line.
2. The processing data creating device according to claim 1.
4. The allocation setting unit When it is determined that the reference line segment does not exist on the outline cutting line, a cutting path of the laser beam is allocated to the outline cutting line so that a final cutting point where the laser beam last cuts on the outline cutting line is positioned on the outermost side of the outline cutting line in the first axial direction.
3. The processing data creating device according to claim 1 or 2.
Citation Information
Patent Citations
Method for laser cutting as well as associated laser processing machine and computer program product
DE102019203946A1
Method for removing oxide film by laser processing machine
JP1999033754A
System and method for working and carrying-out product
JP2006192465A
Laser machining system
JP2013035056A
Laser cutting method and laser cutting device
JP2013094838A