Motion control device, lithography device, planarization device, processing device, and article manufacturing method

Abstract

To provide a technique advantageous for accurately performing relative alignment of a plurality of movable parts.SOLUTION: A motion control unit comprises: a first movable part; a second movable part; a first measuring instrument that measures the motion of the first movable part; a first compensator that generates a first operation amount based on a target value for controlling the motion of the first movable part and output from the first measuring instrument; a generator that generates an observed value related to the relative motion of the first movable part and the second movable part; a second compensator that generates a second operation amount based on the observed value; and a computing unit that generates an operation amount for driving the first movable part based on the output from the first compensator and output from the second compensator. In the second compensator, a parameter value for generating the second operation amount is determined by machine learning.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to motion control devices, lithography devices, planarization devices, processing devices, and methods for manufacturing articles. [Background technology]

[0002] Classical controllers such as PID controllers are widely used as control devices for controlling the physical quantities of a controlled object. In recent years, in addition to control systems based on classical control theory and modern control theory, control systems constructed using machine learning such as reinforcement learning are sometimes used. Also, control systems that combine a control system that does not include machine learning with a control system based on machine learning are sometimes used. In Patent Document 1, by using a feedback control device that combines a control system that does not include machine learning with a control system based on machine learning, the control deviation of a controlled object that cannot be compensated for by a control system that does not include machine learning alone is reduced by using a control system based on machine learning. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-71405 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when aligning the relative positions of multiple movable parts in a device having multiple movable parts, even if each movable part is feedback controlled using the method shown in Patent Document 1, it is not possible to improve the accuracy of the relative positions (especially high-frequency components) of the multiple movable parts.

[0005] An object of the present invention is to provide an advantageous technique for performing high-precision relative positioning of a plurality of movable parts in an apparatus having the plurality of movable parts. [Means for solving the problem]

[0006] One aspect of the present invention relates to a motion control device comprising: a first movable part; a second movable part; a first measuring device that measures the motion of the first movable part; a first compensator that generates a first manipulated variable based on a target value for controlling the motion of the first movable part and an output of the first measuring device; a generator that generates an observed value regarding the relative motion between the first movable part and the second movable part; a second compensator that generates a second manipulated variable based on the observed value; and a calculator that generates a manipulated variable for driving the first movable part based on an output of the first compensator and an output of the second compensator, wherein a parameter value for generating the second manipulated variable of the second compensator is determined by machine learning. [Effects of the Invention]

[0007] According to the present invention, an advantageous technique is provided for performing relative positioning of a plurality of movable parts with high precision in an apparatus having the plurality of movable parts. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic view showing the configuration of an imprint apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic diagram of a control system according to the first embodiment. [Figure 3] FIG. 1 is a schematic diagram illustrating the configuration of a neural network (NN) controller. [Figure 4] FIG. 10 is a schematic view showing the configuration of an imprint apparatus according to a second embodiment. [Figure 5] FIG. 10 is a schematic diagram of a control system according to a second embodiment. [Figure 6] FIG. 10 is a schematic diagram showing the configuration of an exposure apparatus according to a third embodiment. [Figure 7] FIG. 11 is a schematic diagram of a control system according to a third embodiment. [Figure 8] FIG. 10 is a schematic view showing the configuration of a vibration isolation apparatus according to a fourth embodiment. [Figure 9] FIG. 10 is a schematic diagram of a control system according to a fourth embodiment. [Figure 10] 1A to 1C are diagrams illustrating an imprint method. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] Although several embodiments of the present invention are exemplified below, the present invention is not limited to the exemplified embodiments below and can be applied to various forms having a function of controlling the relative movement of two movable bodies. In the following description, directions are described according to the XYZ coordinate system. First Embodiment The first embodiment provides an example in which the present invention is applied to an imprinting apparatus, which is an example of a lithography apparatus that forms a pattern on a substrate. FIG. 1 is a schematic diagram of an imprinting apparatus 1000 according to the first embodiment. The imprinting apparatus 1000 transfers a pattern of a mold 2, which serves as a second member, to a substrate 1, which serves as a first member. The imprinting apparatus 1000 brings an imprinting material 7 supplied or placed on the substrate 1 into contact with the mold 2 and applies energy for curing to the imprinting material 7, thereby forming a cured pattern to which the concave-convex pattern of the mold 2 has been transferred. For example, the imprinting apparatus 1000 supplies the imprinting material 7 onto the substrate 1 and hardens the imprinting material 7 while bringing the mold 2, which has a concave-convex pattern, into contact with the imprinting material 7 on the substrate 1. The imprinting apparatus 1000 then widens the gap between the mold 2 and the substrate 1 to peel (release) the mold 2 from the cured imprinting material 7, thereby transferring the pattern of the mold 2 to the imprinting material 7 on the substrate 1. This series of processes can be understood as an imprinting process. The imprint process can be performed on each of the multiple shot areas when the substrate 1 has multiple shot areas. In other words, when the imprint process is performed on each of the multiple shot areas on one substrate 1, the imprint process is repeated the same number of times as the number of shot areas on the one substrate 1.

[0011] The imprint material is a curable composition (sometimes referred to as an uncured resin) that cures when curing energy is applied. Examples of curing energy include electromagnetic waves and heat. Electromagnetic waves can be, for example, light with a wavelength selected from the range of 10 nm to 1 mm, such as infrared light, visible light, and ultraviolet light. The curable composition can be a composition that cures when irradiated with light or when heated. Among these, photocurable compositions that cure when irradiated with light contain at least a polymerizable compound and a photopolymerization initiator and may further contain a non-polymerizable compound or a solvent, as needed. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, and polymer components. The imprint material can be arranged on a substrate in the form of droplets, islands, or a film formed by connecting multiple droplets. Alternatively, the imprint material can be applied to a substrate in the form of a film using a spin coater or slit coater. The viscosity of the imprint material (at 25°C) may be, for example, 1 mPa·s or more and 100 mPa·s or less. Materials that can be used for the substrate include, for example, glass, ceramics, metals, semiconductors (Si, GaN, SiC, etc.), and resins. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate may be, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0012] In one aspect, the imprint apparatus 1000 includes a mechanical structure 100 and a control system 200. The mechanical structure 100 will be described. The imprint apparatus 1000 includes a main body structure 101, which can be installed on the floor via a tripod or four-legged vibration isolation mechanism 102 using an air spring or the like. The imprint apparatus 1000 can include a stage 13 as a first movable body. The stage 13 is configured to hold the substrate 1. For example, a substrate chuck 11 is mounted on the stage 13, and the substrate 1 can be held by the substrate chuck 11. The stage 13 can be arranged to be movable with strokes in the X and Y directions sufficient to perform imprint processing on each of multiple shot areas of the substrate 1. The stage 13 can also be arranged to be able to move to an exchange position for loading and unloading the substrate 1 using a substrate exchange hand (not shown).

[0013] Stage 13 is guided to move freely in the X direction using, for example, a hydrostatic guide, and a driving force in the X direction can be applied by a linear motor 19 (actuator). In addition, a Y stage (not shown) can be disposed on stage 13 so that it can move in the Y direction using a hydrostatic guide and a linear motor. Linear motor 19 can be driven by a current driver 14 (drive circuit). Stage 13, linear motor 19, and current driver 14 constitute a positioning mechanism that positions substrate 1 as an object to be positioned. The positioning unit is not limited to this configuration, and a higher-precision positioning mechanism, such as a positioning mechanism for an exposure apparatus, can also be used.

[0014] The position of the stage 13 in the X direction can be measured by a stage position measurement unit 18. The stage position measurement unit 18 constitutes a first measurement device that measures the motion of the stage 13 as a first movable unit. The stage position measurement unit 18 includes, for example, a linear encoder, which can include a scale (not shown) arranged on the main body structure 101, a head arranged on the stage 13, and a calculation unit that calculates the position based on the output from the head. Similarly, a Y-axis linear encoder (not shown) that measures the position of the stage 13 (or a Y stage on the stage 13) in the Y direction can also be provided. The position of the stage 13 can be measured by a measurement device having an interferometer arranged on the main body structure 101 and a reflecting mirror arranged on the stage 13.

[0015] A curable composition serving as the imprint material 7 can be supplied or placed by a dispenser 107 at the position of the shot area on the substrate 1. The imprint material can be placed in the shot area by discharging the imprint material 7 from the dispenser 107 while moving the stage 13. Thereafter, the stage 13 can be positioned so that the shot area on the substrate 1 is positioned directly below the mold 2. The mold 2 serving as the second member can be held by an imprint head 23 serving as a second movable body. The imprint head 23 can be driven in the Z direction by an actuator 29, thereby driving the mold 2 in the Z direction.

[0016] Mold 2 waits in a position above substrate 1 in the Z direction until the shot area of ​​substrate 1 moves to a position directly below mold 2. Once the shot area of ​​substrate 1 is positioned directly below mold 2, actuator 29 lowers mold 2, and the pattern portion of mold 2 is pressed against the imprint material 7. When manufacturing semiconductor devices or the like using imprint apparatus 1000, it is important to align mold 2 with the previous layer when the pattern of mold 2 is transferred to substrate 1 (imprint material 7 on substrate 1). This alignment is called alignment.

[0017] The alignment detector 106 optically detects and processes the image formed by the first mark provided on the substrate 1 and the second mark provided on the mold 2, and detects misalignment between the first mark and the second mark in the X and Y directions (misalignment between the substrate 1 and the mold 2). The alignment detector 106 constitutes a generator that generates an observation value related to the relative movement between the stage 13 as the first movable part and the imprint head 23 as the second movable part. The generator or alignment detector 106 can be understood as an example of a relative measuring instrument that measures relative movement or relative position.

[0018] The output of the alignment detector 106, i.e., the detection result of the misalignment between the substrate 1 and the mold 2, is sent to the control system 200. Based on this detection result, the control system 200 controls the alignment to correct the position of the stage 13 or the imprint head 23 in the X and Y directions.

[0019] Once alignment is complete, the illumination system 108 irradiates the imprint material 7 with curing light, thereby curing the imprint material 7. After the imprint material 7 has cured, the actuator 29 raises the mold 2, and the mold 2 is separated from the cured imprint material 7 on the substrate 1. Through this series of steps, a pattern corresponding to the pattern of the mold 2 is transferred to the imprint material 7 on the substrate 1. Similarly, the imprint process is sequentially performed on the remaining shot areas of the substrate 1, and when the imprint process is completed for all shot areas on the substrate 1 that are to be patterned, the stage 13 can be moved to the substrate exchange position. Then, the substrate 1 is retrieved by a substrate exchange hand (not shown), and the next substrate 1 can be supplied to the stage 13.

[0020] FIG. 2 is a diagram showing an outline of a control system 200 in the first embodiment. The control system 200 is enclosed within a dashed line, and may be configured with a digital computer to perform complex calculations. The control system 200 may include, for example, an arithmetic processing device such as a CPU and FPGA, and a storage device such as memory. The control system 200 constitutes a motion control device. The main apparatus control unit 206 is a control unit that controls the entire imprint apparatus 1000, and may have the function of managing the sequence of jobs performed by the imprint apparatus 1000 as well as the function of sending commands to the stage control unit 201 and other control units (not shown).

[0021] The stage position command unit 203 can acquire and store target values ​​for the position of the stage 13 from the apparatus main control unit 206, and can send the target values ​​to the stage control unit 201. Positional deviation information indicating the positional deviation between the substrate 1 and the mold 2 detected by the alignment detector 106 is also sent to the position command unit 203, and can be reflected in controlling the position of the stage 13. The stage position measurement unit 18 can measure the position of the stage 13 at each sampling time, and send the measured value of the position of the stage 13 (hereinafter referred to as the stage position) to the stage control unit 201.

[0022] In the stage control unit 201, a deviation calculation unit 213 calculates the difference between the stage position sent from the stage position measurement unit 18 and the target value for the position of the stage 13 sent from the position command unit 203, i.e., the control deviation (hereinafter referred to as the stage deviation). A PID controller 210 serving as a first compensator generates and outputs a first manipulated variable U1 for controlling the stage 13 based on the stage deviation provided by the deviation calculation unit 213.

[0023] In the first embodiment, as shown in FIG. 2, positional deviation information indicating the positional deviation between the substrate 1 and the mold 2 detected by the alignment detector 106 serving as a generator that generates an observation value is sent to an NN (neural network) controller 220 serving as a second compensator. The NN controller 220 can be configured as a control system including a neural network. Based on the positional deviation information indicating the positional deviation between the substrate 1 and the mold 2, the NN controller 220 generates and outputs a second manipulated variable U2 for reducing the positional deviation. That is, in the first embodiment, the PID controller 210 mainly functions as a component of a position feedback control system. On the other hand, the NN controller 220 functions as a component that suppresses the positional deviation between the substrate 1 and the mold 2, which is difficult to reduce through feedback control of the position of the stage 13 (substrate) by the PID controller 210.

[0024] The misalignment information, which is detected by the alignment detector 106 and indicates the misalignment between the substrate 1 and the mold 2, may be filtered before being sent to the NN controller 220. The filter that performs such filtering may be, for example, a cutoff filter that removes a predetermined frequency component. The cutoff filter may be, for example, a low-pass filter, a high-pass filter, or a band-pass filter.

[0025] 3 illustrates an example of the configuration of the NN controller 220. The NN controller 220 may include a memory 215 that stores a history of stage deviations, and an NN (neural network) 216. The memory 215 may store stage deviations for the most recent N steps (N steps, where N is a natural number). The NN 216 may be adjusted in advance to, for example, take the stage deviations for the N steps stored in the memory 215 into an input layer, and output a second manipulated variable U2 from an output layer, the second manipulated variable U2 corresponding to a correction value for correcting the output (first manipulated variable U1) of the PID controller 210.

[0026] The parameter values ​​of the NN 216 are determined in advance by some method. The parameter values ​​of the NN 216 can be determined, for example, by machine learning such as reinforcement learning. The NN may be a network (policy network) that outputs something corresponding to the dimension of the instruction value, or may be a network (action-value network) that calculates the value of the instruction value. In the case of an action-value network, a selection unit that selects the action with the maximum value is provided after the NN, and the instruction value selected by the selection unit becomes the output (second manipulated variable U2) of the NN controller 220.

[0027] The adder 214 generates a manipulated variable for controlling the linear motor 19 (stage 13) by adding the output value (first manipulated variable U1) generated by the PID controller 210 and the output value (second manipulated variable U2) generated by the NN controller 220. The adder 214 constitutes a computing unit that generates a manipulated variable for controlling the linear motor 19 (stage 13) based on the output value (first manipulated variable U1) generated by the PID controller 210 and the output value (second manipulated variable U2) generated by the NN controller 220. In one example, the output of the adder 214 may be converted into an analog signal by a D / A converter (not shown) and sent to the current driver 14. The current driver 14 controls the value of the current flowing through the coil of the linear motor 19 according to the output of the adder 214. Because the thrust of the linear motor 19 is proportional to the current flowing through the coil, a force corresponding to the sum of the output value of the PID controller 210 and the output value of the NN controller 220 may be applied to the stage 13.

[0028] As described above, in the first embodiment, the output (second manipulated variable U2) of the NN controller 220, which receives as input positional deviation information between the substrate 1 and the mold 2 detected by the alignment detector 106, is added to the output value (first manipulated variable U1) of the PID controller 210. This applies a force to the stage 13 that reduces the positional deviation between the substrate 1 and the mold 2, thereby reducing the positional deviation between the substrate 1 and the mold 2.

[0029] The pattern of the cured product formed using the imprinting apparatus is used permanently on at least a portion of various articles, or temporarily when manufacturing various articles. Examples of articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of electrical circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0030] The pattern of the cured product may be used as it is as at least a part of a component of the article, or may be used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0031] Next, we will explain a method for manufacturing an article, in which a pattern is formed on a substrate using an imprinting apparatus, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in Figure 10(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then an imprinting material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, the state in which multiple droplets of the imprinting material 3z are applied to the substrate is shown.

[0032] As shown in Figure 10(b), the imprinting mold 4z is placed with its side on which the concave-convex pattern is formed facing the imprinting material 3z on the substrate. As shown in Figure 10(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as hardening energy, the imprinting material 3z hardens.

[0033] 10(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured imprint material 3z is formed on the substrate 1z. In this cured material pattern, the recesses of the mold correspond to the protrusions of the cured material, and the protrusions of the mold correspond to the recesses of the cured material, i.e., the recess-protrusion pattern of the mold 4z is transferred to the imprint material 3z.

[0034] As shown in Figure 10(e), when etching is performed using the cured material pattern as an etching-resistant mask, the portions of the surface of the workpiece 2z where no cured material or only a thin layer remains are removed, forming grooves 5z. As shown in Figure 10(f), when the cured material pattern is removed, an article is obtained in which grooves 5z are formed in the surface of the workpiece 2z. Here, the cured material pattern is removed, but it may also be used as an interlayer insulating film included in a semiconductor device or the like, i.e., a component of an article, without being removed after processing. Second Embodiment The second embodiment will be described below. Matters not mentioned in the second embodiment may follow the first embodiment. In the first embodiment described above, misalignment information indicating the misalignment between the substrate 1 and the mold 2 detected by the alignment detector 106 is used as the input to the NN controller 220, i.e., the observation value regarding the relative motion between the substrate 1 and the mold 2. On the other hand, in the second embodiment, the relative acceleration between the substrate 1 and the mold 2 is used as the observation value.

[0035] 4 is a schematic diagram of an imprint apparatus 1000 according to a second embodiment. The imprint apparatus 1000 according to the second embodiment also provides an example of a lithography apparatus. The imprint apparatus 1000 according to the second embodiment includes, as a first measuring device, a position measuring unit 18 that measures the position of the stage 13. The imprint apparatus 1000 according to the second embodiment includes, as a second measuring device, an acceleration measuring unit 28 that measures the acceleration of the imprint head 23. The acceleration of the imprint head 23 measured by the acceleration measuring unit 28 is sent to the control system 200, or more specifically, to a subtractor 222 in the stage control unit 201, as shown in FIG. 5.

[0036] Furthermore, in the second embodiment, the stage control unit 201 obtains the acceleration of the stage 13 by differentiating the value measured by the stage position measurement unit 18 using a second-order differentiator 221, and sends this acceleration to a difference calculator 222. The difference calculator 222 calculates the relative acceleration between the stage 13 and the imprint head 23 by calculating the difference between the acceleration of the imprint head 23 and the acceleration of the stage 13, and sends this to an NN controller 220 serving as a second compensator. The stage position measurement unit 18, second-order differentiator 221, acceleration measurement unit 28, and difference calculator 222 constitute a generator that generates an observation value related to the relative motion between the stage 13 as a first movable unit and the imprint head 23 as a second movable unit. The second-order differentiator 221 and difference calculator 222 are examples of computing units that generate an observation value based on the output of the stage position measurement unit 18 as a first measuring unit and the output of the acceleration measurement unit 28 as a second measuring unit. Based on relative acceleration information indicating the relative acceleration between the substrate 1 and the mold 2, the NN controller 220 generates and outputs a second manipulated variable U2 for reducing the relative acceleration.

[0037] In the example shown in FIG. 5, the physical quantity measured by the stage position measuring unit 18 is information having a dimension of length (m) (example of first dimension), and the physical quantity measured by the acceleration measuring unit 28 is information having a dimension of acceleration (m / s 2 ) (an example of a second dimension). In the generator that generates observation values ​​related to the relative motion between the stage 13 and the imprint head 23, the second-order differentiator 221 constitutes a dimension converter that converts the first-dimensional output of the position measurement unit 18, which serves as the first measurement unit, into information indicating second-dimensional motion. Instead of this configuration, a dimension converter may be provided that converts the second-dimensional output of the acceleration measurement unit 28, which serves as the second measurement unit, into information indicating first-dimensional motion, and the differentiator 222 may calculate the difference between the output of the position measurement unit 18 and the output of the dimension converter. The stage control unit 201 may be configured so that the dimension converter is any one of a first-order differentiator, a second-order differentiator, a first-order integrator, and a second-order integrator.

[0038] In the second embodiment, the relative acceleration between the stage 13 and the imprint head 23 can be reduced by inputting information indicating the relative acceleration between the stage 13 and the imprint head 23 to the NN controller 220. The information indicating the relative acceleration between the stage 13 and the imprint head 23 may be filtered before being sent to the NN controller 220. The filter that performs such filtering may be, for example, a cutoff filter that removes predetermined frequency components. The cutoff filter may be, for example, a low-pass filter, a high-pass filter, or a band-pass filter.

[0039] As described above, in the second embodiment, the output (second manipulated variable U2) of the NN controller 220, which receives as input relative acceleration information between the stage 13 and the imprint head 23, is added to the output value (first manipulated variable U1) of the PID controller 210. This applies a force to the stage 13 that reduces the relative acceleration between the substrate 1 and the mold 2, so that the relative acceleration between the substrate 1 and the mold 2 can be reduced.

[0040] A generator that generates an observation value regarding the relative movement between the stage 13 as the first movable part and the imprint head 23 as the second movable part may include, for example, a measuring device that measures the relative movement. <Third embodiment> A third embodiment will be described below. Matters not mentioned in the third embodiment may follow the first or second embodiment. The third embodiment provides an exposure apparatus as another example of a lithography apparatus. FIG. 6 is a schematic diagram of an exposure apparatus 2000 according to the third embodiment. The position of the stage 13 (substrate stage) in the X direction can be measured by a stage position measurement unit 18. The stage position measurement unit 18 constitutes a first measurement device that measures the movement of the stage 13 as a first movable unit. The stage position measurement unit 18 can include, for example, a laser interferometer. Similarly, a Y-axis laser interferometer (not shown) can also be provided that measures the position of the stage 13 (or a Y stage on the stage 13) in the Y direction.

[0041] The exposure apparatus 2000 includes a mask stage 33 as a second movable part that holds a mask 3 as a second member. In one example, a mask chuck 31 is mounted on the mask stage 33, and the mask 3 can be held by the mask chuck 31.

[0042] The position of the mask stage 33 in the X direction can be measured by a mask stage position measurement unit 28. The mask stage position measurement unit 28 can include, for example, a laser interferometer. The mask stage position measurement unit 28 can constitute a second measuring device that measures the movement of the mask stage 33 as a second movable unit. Similarly, a laser interferometer (not shown) is provided for the Y direction.

[0043] The exposure apparatus 2000 further includes a projection optical system 4 that projects the pattern of the mask 3 onto the substrate 1. The substrate 1 has a photoresist, and the pattern of the mask 3 is projected onto the substrate 1 by the projection optical system 4, thereby exposing the photoresist (substrate 1), and the pattern of the mask 3 can be transferred to the photoresist (substrate 1) as a latent image.

[0044] 7, the measurement value of the position of the stage 13 (substrate stage position) measured by the stage position measurement unit 18 is sent to the control system 200, more specifically, to the stage control unit 201. The measurement value of the position of the mask stage 33 (mask stage position) measured by the mask stage position measurement unit 28 is also sent to the stage control unit 201. The substrate stage position measured by the stage position measurement unit 18 is sent to the deviation calculation unit 213, and can also be sent to a differentiator 222. The deviation calculation unit 213 calculates the difference between the substrate stage position sent from the stage position measurement unit 18 and the target value for the position of the stage 13 sent from the position command unit 203, i.e., the control deviation (hereinafter referred to as the stage deviation).

[0045] The mask stage position measured by the mask stage position measurement unit 28 can be multiplied by a gain in a gain multiplier 223 and then sent to a difference unit 222. The gain can include the projection magnification of the projection optical system 4. The gain may further include a positive or negative sign. The difference unit 222 calculates the difference between the substrate stage position measured by the stage position measurement unit 18 and the mask stage position measured by the mask stage position measurement unit 28 and multiplied by the gain in the gain multiplier 223, and sends this difference to the NN controller 220. This difference indicates the relative position (relative movement) between the stage 13 and the mask stage 33, i.e., the synchronization error.

[0046] The NN controller 220 generates and outputs a second manipulated variable U2 for reducing the synchronization error based on the relative position between the stage 13 and the mask stage 33, i.e., the synchronization error. The adder 214 generates a manipulated variable for controlling the linear motor 19 (stage 13) by adding the output value (first manipulated variable U1) generated by the PID controller 210 and the output value (second manipulated variable U2) generated by the NN controller 220.

[0047] The relative position between stage 13 and mask stage 33, i.e., the synchronization error, may be filtered before being sent to NN controller 220. The filter that performs such filtering may be, for example, a cutoff filter that removes predetermined frequency components. The cutoff filter may be, for example, a low-pass filter, a high-pass filter, or a band-pass filter.

[0048] As described above, in the third embodiment, the output (second manipulated variable U2) of the NN controller 220, which receives as input the synchronization error between the stage 13 and the mask stage 33, is added to the output value (first manipulated variable U1) of the PID controller 210. This provides the stage 13 with a force that reduces the synchronization error between the stage 13 and the mask stage 33, thereby reducing the synchronization error.

[0049] In the third embodiment, a second manipulated variable U2 based on a synchronization error between the stage 13 and the mask stage 33 is added to a first manipulated variable U1 output from the PID controller 210 for controlling the stage 13. Alternatively, the second manipulated variable U2 may be used to correct the manipulated variable for controlling the mask stage 33.

[0050] Furthermore, in the third embodiment, the relative position between the stage 13 and the mask stage 33 is supplied to the NN controller 220, but the relative velocity or relative acceleration between the stage 13 and the mask stage 33 may also be supplied to the NN controller 220. <Fourth embodiment> The fourth embodiment will be described below. Matters not mentioned in the fourth embodiment may follow the first to third embodiments. The fourth embodiment provides an example in which the present invention is applied to a vibration isolation apparatus having a stage. FIG. 8 is a schematic diagram of a vibration isolation apparatus 3000 of the fourth embodiment. A stage 13 serving as a second movable part is mounted on a main body structure (vibration isolation table) 101 serving as a first movable part. The relative position between the main body structure 101 and the stage 13, i.e., the positional deviation between the main body structure 101 and the stage 13, is measured by a stage position measurement unit 18. The stage position measurement unit 18 constitutes a generator that generates an observation value related to the relative motion between the main body structure 101 and the stage 13.

[0051] 9, the positional deviation measured by the stage position measurement unit 18 is sent to the control system 200. The acceleration of the main body structure 101 serving as the first movable part is measured by the acceleration measurement unit 48. The measurement value of the acceleration measurement unit 48 is sent to the control system 200. The positional deviation measured by the stage position measurement unit 18 is provided to the deviation calculation unit 213 of the stage control unit 201 and the NN controller 260 of the vibration isolation apparatus control unit 241. The PID controller 210 of the stage control unit 201 generates and outputs an operation amount U1 for controlling the stage 13 serving as the second movable part.

[0052] The vibration isolation apparatus control unit 241 obtains the velocity of the main structure 101 by integrating the acceleration of the main structure 101 provided by the acceleration measurement unit 48 using a first-order integrator 261. Thereafter, a deviation calculation unit 253 calculates the difference between the target velocity value of the main structure 101 provided by the velocity command unit 243 and the velocity of the main structure 101 (hereinafter referred to as velocity deviation), and sends this velocity deviation to a proportional controller 250. The proportional controller 250 generates and outputs a first manipulated variable U41 for controlling the main structure 101 based on the velocity deviation. The first manipulated variable U41 can be converted into an analog signal by a D / A converter (not shown) and sent to a current driver 44. Because the thrust of the linear motor 19 is proportional to the current flowing through the coil, a force corresponding to the output value of the proportional controller 250 is applied to the main structure 101.

[0053] In the fourth embodiment, as shown in FIG. 9 , the positional deviation between the main structure 101 and the stage 13 (the relative position of the stage 13 with respect to the main structure 101) measured by the stage position measurement unit 18 is sent to the NN controller 260. Based on the positional deviation, the NN controller 260 generates and outputs a second manipulated variable U42 so as to reduce the positional deviation between the main structure 101 and the stage 13. The measured value of the stage position measurement unit 18 may be filtered before being sent to the NN controller 220. The filter that performs such filtering may be, for example, a cutoff filter that removes predetermined frequency components. The cutoff filter may be, for example, a low-pass filter, a high-pass filter, or a band-pass filter.

[0054] As described above, in the fourth embodiment, the output (second manipulated variable U42) of the NN controller 260, which receives as its input the positional deviation between the main structure 101 and the stage 13 measured by the stage position measurement unit 18, is added to the output value (first manipulated variable U41) of the proportional controller 250. This provides the main structure 101 with a force that reduces the positional deviation between the main structure 101 and the stage 13, thereby making it possible to reduce the positional deviation between the main structure 101 and the stage 13.

[0055] In addition, in the fourth embodiment, the velocity of the main structure 101 is determined by integrating the acceleration of the main structure 101 measured by the acceleration measuring unit 48 using a first-order integrator 261, but the velocity of the main structure 101 may also be measured directly using a speedometer. Fifth Embodiment The lithography apparatus exemplified as the first or second embodiment may be modified into a planarization apparatus that uses a mold without a pattern instead of a mold with a pattern to planarize the curable composition on a substrate to form a planarized film. In such a planarization apparatus, the motion control device may also be applied to control the motion of a movable part that holds the substrate or the mold.

[0056] Furthermore, the present invention is not limited to lithography apparatuses and planarization apparatuses, but may be applied to various processing apparatuses that process a member held by a first movable unit or a second movable unit while controlling the relative motion between the first movable unit and the second movable unit. The lithography apparatus or planarization apparatus described above may be understood as an example of such a processing apparatus. The processing apparatus may be configured as an apparatus that measures, inspects, observes, or processes a member held by the first movable unit or the second movable unit. Examples of processing apparatuses that measure members include apparatuses with contact probes and apparatuses with non-contact interferometers. Examples of processing apparatuses that process members include apparatuses that process members using a cutting tool and apparatuses that process members using laser light. <Product manufacturing method> Below, some examples of methods for manufacturing articles are given.

[0057] The first article manufacturing method may include a transfer step of transferring a pattern of a second member to a first member by a lithography apparatus represented by any of the first to third embodiments, and a processing step of processing the first member that has undergone the transfer step to obtain an article. The first member may be a substrate, and the second member may be a mold or a mask.

[0058] The second article manufacturing method may include a planarization step of forming a planarization film on a member using a planarization apparatus typified by the fifth embodiment, and a processing step of processing the member that has undergone the planarization step to obtain an article. The member may be a substrate.

[0059] The third article manufacturing method may include a first processing step of processing a member using a processing apparatus typified by the fifth embodiment, and a second processing step of obtaining an article by further processing the member that has been subjected to the first processing step. The member may be a substrate.

[0060] Below, a more specific article manufacturing method using an imprinting apparatus will be described. This article manufacturing method is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having fine structures. The article manufacturing method of this embodiment includes a step of forming a pattern on an imprinting material supplied (applied) to a substrate using the above-described imprinting apparatus (imprinting method), and a step of processing the substrate on which the pattern has been formed. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0061] Next, we will explain a method for manufacturing articles (semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc.) using the above-mentioned exposure apparatus. The articles are manufactured by using the above-mentioned exposure apparatus to expose a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent, developing the substrate (photosensitive agent), and processing the developed substrate in other well-known processing steps. Other well-known steps include etching, resist stripping, dicing, bonding, packaging, etc. This manufacturing method makes it possible to manufacture articles of higher quality than conventional methods.

[0062] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0063] 1: substrate, 2: mold, 3: mask, 13: stage (first movable part), 23: imprint head (second movable part), 210: PID compensator (first compensator), 214: adder (computing unit), 220: NN controller (second compensator)

Claims

1. A first movable part; A second movable part; a first measuring device that measures the movement of the first movable part; a first compensator that generates a first manipulated variable based on a target value for controlling the movement of the first movable part and an output of the first measuring device; a generator for generating observations relating to the relative motion between the first movable part and the second movable part; a second compensator that generates a second manipulated variable based on the observed value; a calculator that generates an operation amount for driving the first moving part based on an output of the first compensator and an output of the second compensator, A motion control device, wherein the second compensator has a parameter value for generating the second manipulated variable determined by machine learning.

2. the first measuring device measures one of a position, a velocity, and an acceleration of the first movable part; The motion control device according to claim 1 .

3. the generator includes a relative measuring device that measures the relative movement between the first movable part and the second movable part.

3. The motion control device according to claim 1 or 2.

4. the relative measuring device measures the relative position between the first movable part and the second movable part as the relative movement. The motion control device according to claim 3 .

5. Further provided is a second measuring device that measures the movement of the second movable part, the generator generates the observation value based on the output of the first measuring device and the output of the second measuring device.

3. The motion control device according to claim 1 or 2.

6. the second measuring device measures one of a position, a velocity, and an acceleration of the second movable part; The motion control device according to claim 5 .

7. the generator includes a calculator that generates the observation value based on the output of the first measuring device and the output of the second measuring device.

7. The motion control device according to claim 5 or 6.

8. the output of the first measuring device is information indicating a first-dimensional movement, and the output of the second measuring device is information indicating a second-dimensional movement; the generator includes a dimension converter that converts the output of the first measuring device into information indicating the second-dimensional motion, and a difference calculator that calculates a difference between the output of the dimension converter and the output of the second measuring device. The motion control device according to any one of claims 5 to 7.

9. the output of the first measuring device is information indicating a first-dimensional movement, and the output of the second measuring device is information indicating a second-dimensional movement; the generator includes a dimension converter that converts the output of the second measuring device into information indicating the first-dimensional motion, and a difference calculator that calculates a difference between the output of the first measuring device and the output of the dimension converter. The motion control device according to any one of claims 5 to 7.

10. the dimension converter is any one of a first-order differentiator, a second-order differentiator, a first-order integrator, and a second-order integrator; 10. The motion control device according to claim 8 or 9.

11. the generator generates, as the observation value, a value obtained by filtering information about the relative movement between the first movable part and the second movable part. The motion control device according to any one of claims 1 to 10.

12. the relative measuring device measures a positional deviation between a first mark provided on a first member mounted on the first movable section and a second mark provided on a second member mounted on the second movable section; 5. The motion control device according to claim 3 or 4.

13. the relative measuring device is mounted on the first movable part or the second movable part; 5. The motion control device according to claim 3 or 4.

14. A lithographic apparatus comprising a motion control device according to any one of claims 1 to 13, the first movable portion is configured to hold a first member; the second movable portion is configured to hold a second member; A lithography apparatus configured so that a pattern of the second member is transferred to the first member.

15. A planarizing device comprising the motion control device according to any one of claims 1 to 13, the first movable portion is configured to hold a first member; the second movable portion is configured to hold a second member; A planarizing apparatus configured such that a curable composition disposed on the first member is planarized using the second member.

16. A processing device comprising the motion control device according to any one of claims 1 to 13, A processing apparatus configured to process a member held by the first movable part or the second movable part while controlling relative movement between the first movable part and the second movable part.

17. a transferring step of transferring a pattern of a second member to a first member by the lithography apparatus according to claim 14; a processing step of processing the first member that has undergone the transfer step to obtain an article; A method for manufacturing an article, comprising:

18. a planarization step of forming a planarization film on a member by the planarization apparatus according to claim 15; a processing step for processing the member that has undergone the planarization step to obtain an article; A method for manufacturing an article, comprising:

19. a first processing step of processing a member using the processing device according to claim 16; a second processing step of further processing the member that has been subjected to the first processing step to obtain an article; A method for manufacturing an article, comprising:

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