Pickup device and electronic component mounting device

Abstract

To provide a pickup device with which it is possible to pick up an electronic component suppressing the effect of generated particles, and an electronic component mounting device.SOLUTION: In the pickup device, an arm unit 71 includes: a pickup collet 72 for holding and picking up an electronic component C; a hollow arm unit 71, to one end of which the pickup collet 72 is provided; a support unit 732 for supporting the pickup collect; and a reverse drive unit 73 having a rotation axis 730a that protrudes from a space inside of the arm unit 71 via a through-hole 711a provided to the arm unit 71 and connects to the support unit 732, and by rotating the support unit 732 with the rotation axis 730a, reversing the pickup collect 72. An air suction hole 733a for supplying negative pressure is provided at a position in the inside of the arm unit 71, the position communicating with the space including the rotation axis 730a and the space outside of the arm unit 71.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a pickup device and an electronic component mounting device. [Background technology]

[0002] There are two methods for mounting electronic components, such as logic, memory, and image sensors, which are semiconductor chips, onto a board: the face-up method and the face-down method. The surface of an electronic component on which the fine circuits are formed (the functional surface) is called the face. The face-up method is a method of mounting electronic components with this face side facing upward (opposite the board side). For example, mounting an electronic component using the face-up method is used when mounting an electronic component on a lead frame or the like and wiring between the electrodes and the frame with wires.

[0003] The face-down method is a method of mounting electronic components with the face side facing downward (towards the substrate). For example, in the case of flip-chip connection, where bump electrodes are provided on the surface of the semiconductor layer and pressed against the wiring on the substrate to secure and electrically connect the components, the face-down method is used for mounting.

[0004] When mounting such electronic components on a substrate, a wafer on which semiconductor elements are formed is cut into individual semiconductor chips (electronic components). The electronic components are attached to an adhesive wafer sheet. These electronic components are then picked up one by one from the wafer sheet, transferred to a substrate, and mounted. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-129913 Summary of the Invention [Problem to be solved by the invention]

[0006] In a mounting device that picks up electronic components one by one from a wafer sheet and transfers them to a substrate for mounting, a pickup collet that holds the electronic components by suction is positioned facing the electronic component to be picked up, moved toward the electronic component, brought into contact with the electronic component, and then moved away from the wafer sheet to pick up the electronic component. The picked-up electronic component is then transferred to a mounting tool that mounts the electronic component on the substrate. To do this, the pickup collet that holds the picked-up electronic component moves to the electronic component transfer position with the mounting tool. Dust (hereinafter referred to as "particles") is generated from the mechanisms of each operation of the pickup device that picks up electronic components and transfers them to the mounting tool.

[0007] In particular, for face-down mounting, a flipping mechanism for flipping the functional side is typically added to the pickup device, further increasing the possibility of particle generation. For example, when picking up electronic components from a wafer sheet, particles are generated by the operation of the flipping mechanism. If such particles adhere to the picked-up electronic components or electronic components attached to the wafer sheet before mounting, adverse effects such as poor mounting or poor connections can occur.

[0008] The embodiments of the present invention have been proposed to solve the above-mentioned problems, and their purpose is to provide a pickup device and an electronic component mounting device that can pick up components while suppressing the effects of generated particles. [Means for solving the problem]

[0009] A pickup device according to an embodiment of the present invention includes: a pickup collet that holds and picks up electronic components; a hollow arm having the pickup collet attached to one end thereof; The arm unit has a support part that supports the pickup collet, and a rotating shaft that protrudes from the space inside the arm part through a through hole provided in the arm part and connects to the support part, and an inversion drive part that inverts the pickup collet by rotating the support part with the rotating shaft, and an intake hole that supplies negative pressure is provided at a position inside the arm part that connects the space including the rotating shaft to the space outside the arm part.

[0010] A pickup device according to another embodiment of the present invention includes a pickup collet that holds and picks up electronic components, a hollow arm having the pickup collet at one end, a support that supports the pickup collet, a rotating shaft that protrudes from the interior space of the arm through a through hole provided in the arm and connects to the support, and an inversion drive unit that rotates the support by the rotating shaft to invert the pickup collet, and is provided with a pneumatic circuit that supplies negative pressure to the interior space of the arm.

[0011] An electronic component mounting device according to an embodiment of the present invention includes the pickup device, a supply unit that supplies the electronic components to the pickup device, a mounting mechanism in which a mounting head that holds the electronic components handed over from the pickup device mounts the electronic components onto a substrate at a mounting position, and a substrate support mechanism that supports the substrate on which the electronic components are mounted. [Effects of the Invention]

[0012] The embodiments of the present invention can provide a pickup device and an electronic component mounting device that can pick up electronic components while suppressing the influence of generated particles. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a front view showing a schematic configuration of a mounting device according to an embodiment; [Figure 2] FIG. 2 is a plan view showing the electronic component and the substrate. [Figure 3]1A is a plan view of the mounting device, and FIG. 1B is an enlarged plan view of the mounting location. [Figure 4] 1A is a partially sectional plan view showing the arm unit and the inversion drive unit, FIG. 1B is a perspective view of the rotation shaft, and FIG. 1C is a sectional view of the rotation shaft. [Figure 5] 10A and 10B are enlarged views showing the inversion operation of the electronic component, the left side being a front view and the right side being a plan view. [Figure 6] 10A and 10B are explanatory diagrams showing an operation of picking up an electronic component. [Figure 7] 10A and 10B are explanatory diagrams showing an electronic component delivery operation. [Figure 8] FIG. 2 is an explanatory diagram showing the mounting operation of the mounting device. [Figure 9] 10 is a flowchart showing a procedure for picking up and transferring an electronic component. [Figure 10] 10 is a flowchart showing a mounting procedure for electronic components. [Figure 11] FIG. 10 is a partially cross-sectional plan view showing a modified example of the arm portion. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1 and Fig. 2, this embodiment is a mounting apparatus 1 that mounts an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of the mounting apparatus 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, and relative size ratios of each part may differ from the actual ones.

[0015] [Electronic Components] First, the electronic component C to be mounted in this embodiment can be, for example, a semiconductor chip made up of a semiconductor element such as an IC or an LSI.

[0016] In this embodiment, as shown in Fig. 2, a rectangular parallelepiped semiconductor chip is used as the electronic component C. Each semiconductor chip is a bare chip obtained by dicing a semiconductor wafer into individual chips. The bare chip has bump or bumpless electrodes on the exposed semiconductor, and is mounted by flip-chip connection to pads on the substrate S.

[0017] The electronic component C is provided with a plurality of marks m for positioning. In this embodiment, two marks m are provided, one at each of a pair of diagonal corners of the rectangular electronic component C. The marks m are provided on the surface of the electronic component C on which the electrodes are formed, i.e., on the face. This embodiment is an example of an apparatus for face-down mounting in which the face side faces the board S.

[0018] [substrate] In this embodiment, the substrate S on which the electronic component C is mounted is, as shown in Fig. 2, a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed. Electronic parts C A mounting area B is provided in which the electronic component C is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are provided at positions outside the mounting area B that correspond to marks m of the electronic component C.

[0019] [Mounting equipment] The mounting apparatus 1 of this embodiment is a mounting apparatus 1 that can achieve high precision mounting, for example, with a mounting precision of ±0.2 μm or less, and as shown in Figures 1 and 3, has a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a pickup device 7, and a control device 8. Figure 3(A) is a plan view of the mounting apparatus 1, and Figure 3(B) is a plan view showing a mark M transmitted through a mounting head 31, which will be described later.

[0020] In the following description, the axis along which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is referred to as the Z axis, and two axes perpendicular to each other in a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as downward, and the direction against gravity is referred to as upward, and a position on the Z axis is referred to as height. The X axis and Y axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X axis is the left-right direction and the Y axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side, based on the substrate S or the substrate support mechanism 2.

[0021] The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is to be mounted, and is what is called a substrate stage. The mounting mechanism 3 is a mechanism that mounts the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmission part that allows a mark M on the substrate S facing the electronic component C to be recognized through transmission while holding the electronic component C.

[0022] The first imaging unit 4 is disposed below the board support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the board S. When the board S is retracted from the mounting position OA by the board support mechanism 2, the first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, i.e., from below. The mounting position OA is the position where the electronic component C is mounted on the board S, and is indicated in the figure by a dashed-dotted line in the direction along the Z axis passing through a point (e.g., the center point) on the XY coordinate system within the area of ​​the electronic component C to be mounted. As will be described later, the mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA and images the mark M on the board S through a transparent portion of the mounting head 31 (hereinafter, this will be referred to as "imaging through the mounting head 31"). Based on the image thus captured, the marks m and M can be detected, that is, the marks m and M can be recognized.

[0023] The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C determined from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. Each of the above-described components of the mounting apparatus 1 is mounted on a support base 11 installed on an installation surface. The top surface of the support base 11 is horizontal.

[0024] The supply unit 6 supplies electronic components C. The pickup device 7 picks up the electronic components C from the supply unit 6 and transports them to the mounting position OA. The pickup device 7 has a pickup collet 72 and a transport mechanism 74. The pickup collet 72 picks up the electronic components C from the supply unit 6, turns them over, and delivers them to the mounting head 31. The transport mechanism 74 moves the pickup collet 72 into the space created when the board support mechanism 2 retracts the board S from the mounting position OA, and positions it at the mounting position OA.

[0025] The control device 8 controls the operation of the mounting device 1. This control device 8 is configured, for example, by an electronic circuit or a computer that operates according to a predetermined program. In other words, the control device 8 controls the mounting device 1 by using a processing device such as a PLC or CPU to read out programs and data from a storage device.

[0026] Each part of the mounting device 1 will be described in detail below. (Substrate support mechanism) As shown in FIGS. 1 and 3(A), the substrate support mechanism 2 is disposed on a support base 11 and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 is a two-axis movement mechanism that has, for example, an X-axis guide rail 22a and a Y-axis guide rail 22b, and moves the stage 21 in a horizontal plane using a belt or ball screw with a motor (not shown) as the drive source. This drive mechanism 22 functions as a positioning mechanism that positions the substrate S. Although not shown, the drive mechanism 22 also includes a θ drive mechanism that rotates and moves the stage 21 in a horizontal plane.

[0027] The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through-hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can capture an image of the electronic component C.

[0028] Although not shown, a loader / unloader that supplies / stores the substrate S to / from the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side in the figure). With the stage 21 moved to the moving end, the substrate support mechanism 2 receives the substrate S from the loader and hands the substrate S over to the unloader.

[0029] (Implementation mechanism) The mounting mechanism 3 has a mounting head 31 and a drive mechanism 32. The mounting head 31 has a roughly rectangular parallelepiped shape and has a hollow portion 31a and a holding portion 31b as transmission portions. The hollow portion 31a is a cylindrical through-hole formed with its axis in the Z-axis direction. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to cover the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool and holds the electronic component C.

[0030] As shown in FIG. 3B, a suction area D for suction-holding an electronic component C is provided in the center of the holder 31b. Although not shown, suction holes are formed in the suction area D. A flow path is formed inside the holder 31b to connect the suction holes to a negative pressure source, and the holder 31b is configured to be able to suction-hold the electronic component C by generating negative pressure in the suction holes. The periphery of the suction area D of the holder 31b is a transparent area T that allows the mark M on the board S to be transmitted and imaged even when the electronic component C is suctioned. In other words, the mounting head 31 has a transparent portion so that the mark M on the board S can be imaged by the second imaging unit 5. The holding surface (suction surface) of the holder 31b that holds the electronic component C is referred to as the bottom surface.

[0031] The drive mechanism 32 includes movable bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided movably along a Y-axis guide rail 33a provided on the support base 11. The movable body 34 is provided movably along an X-axis guide rail 34a provided on the top surface of the movable body 33. The movable body 35 is provided movably along a Z-axis guide rail 35a provided on the front surface of the movable body 34. The movable body 35 is formed in a generally concave shape in a plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like, which uses a motor as a drive source.

[0032] The mounting head 31 is provided below a movable body 35 that moves in the Z-axis direction. Therefore, the movable body 35 performs an operation to mount the electronic component C held by the holder 31b of the mounting head 31 onto the board S. Furthermore, the movable body 35 on which the mounting head 31 is provided moves in the X-axis and Y-axis directions due to the movement of the movable bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown, the drive mechanism 32 is equipped with a θ drive mechanism that rotates and moves the mounting head 31 in a horizontal plane.

[0033] In this embodiment, it is preferable to set the distances of movement in the X-axis, Y-axis, and Z-axis directions by the drive mechanism 32 as short as possible to prevent movement errors. For example, the distances of movement in the X-axis and Y-axis directions by the movable bodies 33 and 34 are each set to several millimeters to several tens of millimeters. The distance of movement in the Z-axis direction by the movable body 35 is also set to several millimeters to several tens of millimeters. That is, the mounting head 31 receives the electronic component C and captures an image of the mark m of the received electronic component C at a height position where the lower end surface of the holding portion 31b is spaced apart (vertical separation distance) by several millimeters, for example, 1 to 2 mm, from the upper surface of the substrate S placed on the stage 21. Therefore, the distance of movement in the Z-axis direction by the movable body 35 should be at least sufficient to mount the electronic component C held by the holding portion 31b on the substrate S by applying a predetermined pressure to the substrate S from this height position.

[0034] (First imaging unit) The first imaging unit 4 includes a camera, a lens, a lens barrel, a light source, etc., and is fixed to the accommodation hole 11a provided in the support base 11. The first imaging unit 4 is positioned so that the optical axis of the camera can capture an image of the mark m of the electronic component C held by the mounting head 31. Specifically, the first imaging unit 4 is positioned so that the optical axis is vertical. The first imaging unit 4 is immobile with respect to the mounting position OA of the electronic component C. In this embodiment, the first imaging unit 4 is positioned in the accommodation hole 11a of the support base 11, which is located below the board support mechanism 2, facing upward with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 with a size and positional relationship such that the two marks m do not fall outside the imaging field of view even if the electronic component C moves to its maximum extent for positioning. In other words, the imaging field of view of the first imaging unit 4 is set taking into account the maximum range of movement of the two marks m of the electronic component C for positioning when the optical axis is aligned with the mounting position OA.

[0035] Here, "immobile" means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when capturing images of the marks m and M. For example, immobile includes a configuration in which the imaging units 4 and 5 are equipped with drive devices for the X and Y axes (horizontal directions) and drive devices for the Z axis (vertical direction), and these drive devices adjust the horizontal and vertical positions of the imaging units 4 and 5 as preparation work for the device to operate, and the imaging units do not move thereafter during operation of the device.

[0036] (Second imaging unit) The second imaging unit 5 includes a camera, lens, lens barrel, light source, etc., and is supported and fixed by a frame (not shown) or the like above the support base 11, more specifically, above the mounting head 31. The second imaging unit 5 is positioned such that the optical axis of the camera passes through the holding portion 31b of the mounting head 31 and can capture images of the marks M around the mounting area B of the board S. That is, in this embodiment, the second imaging unit 5 is positioned directly above the mounting head 31, facing downward with the optical axis of the camera aligned with the mounting position OA. Like the first imaging unit 4, the second imaging unit 5 is stationary relative to the mounting position OA of the electronic component C. That is, the imaging field of the second imaging unit 5 is set taking into account the maximum range of movement of the two marks affixed to the mounting area B of the board S for positioning. Therefore, the size of the transparent portion of the mounting head 31 is set to match the imaging field of the second imaging unit 5.

[0037] (Supply Department) The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports a wafer sheet WS to which electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis and Y-axis directions. In the supply unit 6, the surface (area) on which the electronic components C are mounted is called the placement surface F. In this embodiment, the electronic components C are formed by dicing a wafer attached to the wafer sheet WS into individual pieces. Therefore, the surface of the wafer sheet WS to which the electronic components C are attached (the wafer surface) is the placement surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a to which the wafer ring is attached. In other words, the surface of the support mechanism 61 that supports the wafer sheet WS can also be called the placement surface F.

[0038] Although not shown, a loader / unloader that supplies / stores wafer rings in the ring holder 61a is provided at one of the movement ends in the Y-axis direction of the support mechanism 61 (specifically, the movement end on the front side in the figure). When the support mechanism 61 is moved to the movement end, it receives wafer rings from the loader and passes wafer rings to the unloader.

[0039] Although not shown, the support mechanism 61 also has an expanding mechanism that stretches the wafer sheet WS to create gaps between the electronic components C, and a push-up mechanism that separates the electronic components C by sandwiching the stretched wafer sheet WS and pushing up the electronic components C individually. The support mechanism 61 also has a θ drive mechanism that rotates the ring holder 61a within a horizontal plane. The push-up mechanism is fixedly disposed on the support base 11, and the pickup device 7 receives the electronic components C from the supply unit 6, i.e., picks them up, at this position (pick-up position).

[0040] The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has an X-axis guide rail 62a and a Y-axis guide rail 62b, and is a mechanism that moves the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane using a belt or a ball screw with a motor (not shown) as a drive source. The drive mechanism 62 functions as a positioning mechanism that positions the electronic component C with respect to the pickup collet 72. The drive mechanism 62 is disposed at a position lower than the height position L (see FIG. 6) of the placement surface F.

[0041] (Pickup device) The pickup device 7 has an arm section 71, a pickup collet 72, a reversing drive section 73, and a transfer mechanism 74. The arm section 71 is 4 As shown in (A), it has an extension part 711, a tube 712, and a base part 713. The extension portion 711 is an L-shaped member made up of a rectangular parallelepiped member extending linearly in the Y-axis direction and another rectangular parallelepiped member extending linearly in the X-axis direction toward the mounting mechanism 3. As shown in FIG. 4A, the extension portion 711 is a hollow member having an internal space and has a rectangular cylindrical shape. A first through-hole 711a and a second through-hole 711b facing the first through-hole 711a are provided at the tip of the extension portion 711. A shaft portion 730 having a rotation shaft 730a for rotating the pickup collet 72 is provided so as to pass through the first through-hole 711a and the second through-hole 711b. That is, the rotation shaft 730a exists in the internal space of the extension portion 711. The shaft portion 730 will be described later.

[0042] 4 and 6, tube 712 is a hollow member through which gas can flow. Tube 712 is built into arm portion 71 by being inserted into a space formed inside extension portion 711. Built-in means that it is not exposed to the outside because it is covered by the exterior of arm portion 71. Tube 712 forms an L-shaped ventilation path along extension portion 711.

[0043] Base portion 713 is a plate-like body parallel to the X-axis direction, and is fixed to the other end of extension portion 711 (see FIG. 3(A)). An air pressure circuit (not shown) is connected to the base portion 713 side of tube 712, and a suction force can be applied to the extension portion 711 side of tube 712 by negative pressure.

[0044] The space inside extension portion 711 is partitioned by partition wall 711c into a space including rotation shaft 730a and a space on the base portion 713 side. Partition wall 711c is provided with communication hole 711d that connects the two spaces, and negative pressure can be supplied to the space including rotation shaft 730a through communication hole 711d. For example, an end of the above-mentioned tube 712 is connected to communication hole 711d, and negative pressure is supplied to the space including rotation shaft 730a through communication hole 711d, thereby generating a suction force.

[0045] The pickup collet 72 is a member that holds and picks up electronic components C. The pickup collet 72 has a suction hole connected to a pneumatic circuit (not shown), and sucks the electronic component C to its tip by negative pressure, and releases the electronic component C by releasing the negative pressure or by applying positive pressure. The pickup collet 72 is provided at the tip of the arm portion 71.

[0046] In this embodiment, an inversion drive unit 73, which will be described later, is provided at one end of the extension unit 711 facing the mounting mechanism 3, and the pickup collet 72 is provided in an invertible manner on this inversion drive unit 73. That is, as shown in Figures 5(A) and 5(B), the pickup collet 72 is provided so as to be rotatable by the inversion drive unit 73 between a downward direction in the Z-axis direction (a direction in which the electronic component C faces the wafer sheet WS) and an upward direction in the Z-axis direction (a direction in which the electronic component C faces the mounting head 31).

[0047] As shown in FIGS. 4(A) and 5, the reversal drive unit 73 has a shaft 730, a drive source 731, and a support unit 732. The shaft 730 is composed of a rotation shaft 730a extending in the Z-axis direction and a support 730b. The rotation shaft 730a is a member having an internal space and is cylindrical in shape. One end of the rotation shaft 730a protrudes from the internal space of the extension unit 711 via a first through-hole 711a and is connected to a support unit 732, which will be described later.

[0048] The support post 730b is a rod-shaped member that passes through a second through-hole 711b provided in the extension portion 711. The other end of the rotation shaft 730a is connected to a driving source 731 (described later) via the support post 730b. A ball bearing is disposed between the second through-hole 711b and the support post 730b, and the power of the driving source 731 is transmitted to the support post 730b, causing the rotation shaft 730a to rotate, thereby causing the support portion 732 to rotate. 30 The axis center O of a is the rotation axis 7 30 a, which is the center of rotation of the support 730b.

[0049] As shown in FIGS. 4B and 4C, the rotating shaft 730a is provided with a first opening 730c and a second opening 730d. The first opening 730c is provided on the circumferential surface of the rotating shaft 730a and opens to the internal space of the extension portion 711. The first opening 730c is provided to face the base portion 713 and is an opening formed by cutting out the circumferential surface at a central angle θ around the axial center O of the rotating shaft 730a. The central angle θ is preferably 180° or greater. As described below, this prevents interference with the connection tube 735a and the cable 734c even when the rotating shaft 730a is rotated (flipped) by 180° with the connection tube 735a and the cable 734c inserted into the first opening 730c. The first opening 730c has a rectangular cross section when viewed from a direction (X-axis direction) perpendicular to the axial direction (Z-axis direction) of the rotating shaft 730a. The second opening 730d is provided at one end of the rotary shaft 730a, communicates with the first opening 730c, and faces the space outside the extension portion 711.

[0050] The driving source 731 is a motor that rotates the rotary shaft 730a via the support 730b, and is provided at one end of the extending portion 711. The supporting portion 732 supports the pickup collet 72. The supporting portion 732 has a rotating body 733, a buffer portion 734, and an attaching / detaching portion 735.

[0051] Rotating body 733 is an L-shaped plate-like member connected to rotating shaft 730a. Rotating body 733 has a surface parallel to the XZ plane and a surface parallel to the YZ plane. Rotating body 733 is provided with k at a position facing second opening 730d of rotating shaft 730a on the surface parallel to the XZ plane. Air intake hole 733a communicates with the inside of rotating shaft 730a via second opening 730d.

[0052] As described above, the internal space of the rotating shaft 730a is in communication with the internal space of the extending portion 711 through the first opening 730c. Furthermore, the internal space of the extending portion 711 is in communication with the intake hole 733a through the first opening 730c and the second opening 730d of the rotating shaft 730a. Therefore, the internal spaces of the extending portion 711 and the rotating shaft 730a are suctioned by the air pressure circuit connected to the tube 712, and ambient air can be sucked through the intake hole 733a that communicates with these spaces. That is, the intake hole 733a is located at a position of the support portion 732 facing the second opening 730d of the rotating shaft 730a so that it can suck ambient air by negative pressure. Note that, by suctioning the internal space of the extending portion 711, ambient air can also be sucked through the gap formed between the first through-hole 711a and the rotating shaft 730a. That is, since the first through-hole 711a also functions as an intake hole, the intake hole also includes the first through-hole 711a.

[0053] The buffer unit 734 applies an appropriate load and absorbs excessive load when the tip of the pickup collet 72 contacts the electronic component C. The buffer unit 734 includes a bracket 734a and a buffer member 734b. The bracket 734a is an L-shaped plate-like member attached to a surface of the rotating body 733 parallel to the YZ plane. The buffer member 734b only needs to have a buffer function for applying and absorbing load to the pickup collet 72, and may be powered by a supply line (piping or wiring) connected to the control device 8. For example, if a voice coil motor is used as the buffer member 734b, a cable 734c that supplies power is connected to the control device 8, inserted into the extension portion 711 from the base portion 713 side, passed through the extension portion 711, and drawn out from the intake hole 733a via the first opening 730c and the second opening 730d of the rotating shaft 730a, and connected to the buffer member 734b.

[0054] The detachable portion 735 is attached to the drive shaft of the buffer member 734b, and is a member to which the pickup collet 72 is attached and detached. In this embodiment, the detachable portion 735 is provided so that the pickup collet 72 can be attached and detached using a magnet. The detachable portion 735 is also connected to an air pressure circuit that supplies negative or positive pressure to the suction hole of the pickup collet 72, as described above, via a connection tube 735a. The connection tube 735a is inserted into the extension portion 711 from the base portion 713 side, passes through the extension portion 711, and is drawn out from the intake hole 733a via the first opening 730c and the second opening 730d of the rotation shaft 730a, and is connected to the pickup collet 72 via the detachable portion 735.

[0055] The connection tube 735a and the cable 734c are inserted into the extension portion 711 from the base portion 713 side and connected to the pickup collet 72 by passing through an opening 711e provided in the partition wall 711c. The diameter of the opening 711e is preferably set so that the opening 711e is substantially filled by inserting the connection tube 735a and the cable 734c. This prevents particles generated in the space including the rotation shaft 730a from diffusing through the gap in the opening 711e beyond the partition wall 711c and into other spaces.

[0056] As shown in FIG. 3, the transfer mechanism 74 moves the pickup collet 72 between the supply unit 6 and the mounting position OA by driving the arm unit 71. The transfer mechanism 74 has a sliding unit SL that is provided at a position that does not overlap with the placement surface F in a plan view. In other words, the sliding unit SL of the transfer mechanism 74 is provided outside the movement range of the support mechanism 61. The transfer mechanism 74 drives the arm unit 71 in accordance with the sliding of the sliding unit SL. The sliding unit SL here refers to a component in which members move while in contact with each other. Such a sliding unit SL can be a source of particle generation. As shown in FIG. 6, the sliding unit SL in this embodiment includes a first sliding unit 742b and a second sliding unit 744b, which will be described later. The first sliding unit 742b and the second sliding unit 744b are provided at a position lower (below) than the height position L of the placement surface F.

[0057] 6, the transfer mechanism 74 has a fixed body 741, a first drive unit 742, a moving body 743, and a second drive unit 744. The fixed body 741 is a rectangular parallelepiped member fixed to the support base 11 (see FIG. 3(A)) and extending in the X-axis direction. The position of the fixed body 741 is fixed with respect to the mounting position OA.

[0058] The first driving unit 742 drives the arm unit 71 in the X-axis direction. The first driving unit 742 has a first driving source 742a and a first sliding portion 742b. The first driving source 742a is a linear motor extending in the X-axis direction, and is provided along the upper surface of the fixed body 741 (a surface parallel to the XY plane). The first sliding portion 742b is a linear guide extending in the X-axis direction, and is provided on the front surface of the fixed body 741 (a surface parallel to the XZ plane). Note that, because the mover of a linear motor moves without contacting the stator, the first driving source 742a does not have a sliding portion SL.

[0059] The movable body 743 is a rectangular parallelepiped block to which the movable element of the first driving source 742a and the slider of the first sliding portion 742b are attached, so that it can slide in the X-axis direction in accordance with the operation of the first driving source 742a.

[0060] The second driving unit 744 drives the arm unit 71 in the Z-axis direction. The second driving unit 744 has a second driving source 744a and a second sliding unit 744b. The second driving source 744a is a linear motor extending in the Z-axis direction and is provided on the moving body 743. The second sliding unit 744b is a linear guide extending in the Z-axis direction and is provided on the moving body 743.

[0061] The base portion 713 of the arm portion 71 is provided so as to be slidable in the Z-axis direction by attaching the mover of the second drive source 744a and attaching the slider of the second sliding portion 744b thereto. As described above, the sliding portion SL of the present embodiment has the first sliding portion 742b and the second sliding portion 744b that linearly slide along two orthogonal axes. The first sliding portion 742b and the second sliding portion 744b are arranged in a positional relationship where they overlap in the height direction on two opposite side surfaces of the common moving body 743. That is, the positions of the two orthogonal axes are in close proximity. Also, it is preferable that the distance between the two side surfaces of the moving body 743 is short, that is, the moving body 743 is thin.

[0062] (The facing interval between the substrate on the stage and the mounting head, and Pickup collet the relationship with the dimensions of The present embodiment is configured such that, as shown in FIG. 1, in order for the pickup collet 72 to move to the mounting position OA, the facing interval between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be retracted. In other words, in order for the pickup collet 72 to move to the mounting position OA, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set in proximity to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2. More specifically, the interval h when the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA faces the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the dimension H in the height direction of the pickup collet 72 at the tip of the arm portion 71 (h < H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several millimeters.

[0063] (Dimensions of the arm portion) 1, 3(A), and 5(A), the extension portion 711 of the arm portion 71 has a width w of the member extending linearly in the Y-axis direction and a width d of the member extending linearly in the X-axis direction that are both longer than the thickness t of the arm portion 71 in the Z-axis direction (w>t, d>t). This ensures the rigidity of the relatively long arm portion 71 while suppressing an increase in the height dimension of the arm portion 71, making it possible to stabilize the position of the electronic component C transferred by the pickup collet 72. By suppressing an increase in the height dimension of the arm portion 71, it is not necessary to raise the receiving position of the mounting head 31.

[0064] (Control device) The control device 8 controls the positioning mechanism so that the board S and the electronic component C are positioned based on the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. That is, the control device 8 stores in a storage device the position of the mark m of the designed electronic component C on the XY coordinate system and the position of the mark M of the designed board S on the XY coordinate system as their respective reference positions, corresponding to the position where the electronic component C should be accurately mounted.

[0065] This reference position may not be a design position, but may be the position of marks m and M when the electronic component C is mounted accurately as a result of a trial mounting of the electronic component C on the board S in advance. The control device 8 determines the deviation between the mark m imaged by the first imaging unit 4, the mark M imaged by the second imaging unit 5, and the reference position, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) so that the electronic component C and the board S move in a direction and by an amount that corrects the deviation.

[0066] Furthermore, the control device 8 controls the transfer mechanism 74 of the pickup device 7 and the drive mechanism 62 of the supply unit 6 based on map information indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby sequentially positioning the electronic components C to be picked up at the pickup position. Note that "pickup" here refers to removing and receiving the electronic components C from a member on which the electronic components C are placed, such as a wafer sheet WS. Furthermore, the control device 8 controls the intake of air from the intake holes 733a, the holding of the electronic components C by the pickup collet 72, the inversion of the pickup collet 72 by the inversion drive unit 73, the movement of the pickup collet 72 to the mounting head 31 by the transfer mechanism 74, the delivery of the electronic components C to the mounting head 31, etc.

[0067] [Operation] The operation of this embodiment as described above will be described with reference to the explanatory diagrams of Figures 3 to 8 and the flowcharts of Figures 9 and 10. Note that in the initial state, the substrate S is handed over from the loader to the stage 21 of the substrate support mechanism 2, but is retracted together with the stage 21 from the position facing the mounting head 31, i.e., from the mounting position OA.

[0068] [Transfer of electronic parts] The operation of transferring electronic components C will be described with reference to the explanatory diagrams of FIGS. 3 to 7 and the flowchart of FIG. 9. A wafer ring with a wafer sheet WS attached thereto is attached by an autoloader to ring holder 61a of support mechanism 61 in supply unit 6 (see FIG. 3). Electronic components C, which have been diced into individual pieces, are attached to this wafer sheet WS. Note that in FIG. 6, only the electronic components C to be picked up are shown. Furthermore, from the start of operation, a negative pressure is applied to tube 712 by the air pressure circuit, and ambient air is sucked in through intake hole 733a, as indicated by the white arrows in FIGS. 5 and 6.

[0069] 6(A) and 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. Also, by moving the arm unit 71 in the X-axis direction, the pickup collet 72 is positioned directly above the electronic component C to be mounted, i.e., at the pickup position (step S101).

[0070] At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm unit 71 in the X-axis direction is performed by the movement of the movable body 743 along the first sliding portion 742b as a result of the first drive source 742a of the first drive unit 742 being activated.

[0071] 6(B), a push-up mechanism (not shown) pushes up the electronic component C to be mounted. Then, the pickup collet 72 picks up the electronic component C (step S102). That is, the arm portion 71 and the buffer portion 734 move in a direction approaching the wafer sheet WS, and the pickup collet 72 sucks and holds the electronic component C, and then moves in a direction away from the wafer sheet WS, thereby separating the electronic component C from the wafer sheet WS.

[0072] At this time, the movement of the arm unit 71 is achieved by actuating the second drive source 744a of the second drive unit 744 and moving the base unit 713 along the second sliding unit 744b. Then, as shown in Figures 5(A), (B), 6(C), and (D), the inversion drive unit 73 rotates the pickup collet 72 by 180 degrees to invert the electronic component C (step S103). At this time, particles generated by sliding between the members due to the rotation are sucked in through the intake hole 733a, thereby reducing adhesion of particles to the electronic component C.

[0073] Next, as shown in FIGS. 7A and 7B, the arm unit 71 moves in the X-axis direction to position the pickup collet 72 at the mounting position OA (step S104). That is, the electronic component C held by the pickup collet 72 is positioned opposite the holder 31b of the mounting head 31 in the mounting mechanism 3. The arm unit 71 moves in the X-axis direction at this time by actuating the first drive source 742a of the first drive unit 742, causing the moving body 743 to move along the first sliding portion 742b from the pickup position to the mounting position OA. At this time, the mounting head 31 waits at a height where the distance between the lower end surface of the holder 31b and the upper surface of the board S is a few millimeters. This height is maintained until the positioning of the electronic component C and the board S is completed, as described below, and the mounting head 31 is about to be driven toward the board S.

[0074] As shown in Fig. 7(C), the arm portion 71 moves in a direction approaching the holding portion 31b and presses the electronic component C against the holding portion 31b. As shown in Fig. 7(D), the holding portion 31b of the mounting head 31 sucks and holds the electronic component C by using negative pressure and receives it (step S105). At the same time, the pickup collet 72 releases the negative pressure, and the arm portion 71 moves in a direction away from the holding portion 31b, thereby releasing the electronic component C. The movement of the arm portion 71 at this time is achieved by the second drive source 744a of the second drive portion 744 being activated and the base portion 713 moving along the second sliding portion 744b.

[0075] 7(E), arm unit 71 moves toward supply unit 6, causing pickup collet 72 to retract from directly below holder 31b. At this time, arm unit 71 moves as first drive source 742a of first drive unit 742 operates to move movable body 743 in the X-axis direction along first sliding portion 742b. Note that, because pickup device 7 delivers electronic component C to holder 31b at mounting position OA, stage 21 remains retracted during delivery to avoid interference with transport mechanism 74.

[0076] [Electronic component mounting] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of FIG. 8 and the flowchart of FIG. 10. Here, as shown in FIG. 8(A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is positioned directly below the second imaging unit 5. The first imaging unit 4 captures an image of the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 calculates the amount of deviation between the position of the mark m imaged by the first imaging unit 4 and a reference position, and positions the electronic component C by operating the drive mechanism 32 so as to eliminate the amount of deviation (step S202).

[0077] 8(B), the substrate support mechanism 2 moves the stage 21 to a position where the mounting area B of the substrate S (the mounting area B where the electronic component C will be mounted this time) faces the electronic component C held by the mounting head 31, that is, so that the center of the mounting area B is at the mounting position OA (step S203). Then, as shown in FIG. 3(B), the second imaging unit 5 images the mark M of the substrate S that is visible in the transparent area T around the electronic component C through the mounting head 31 (step S204).

[0078] The control device 8 determines the amount of deviation between the position of the mark M imaged by the second imaging unit 5 and the reference position, and positions the board S by operating the driving mechanism 22 so as to eliminate the amount of deviation (step S205). Furthermore, as shown in Fig. 8(C), the driving mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S (step S206).

[0079] In this way, by repeating the operations of transferring the electronic components C from the wafer sheet WS, handing over the electronic components C to the mounting head 31, positioning the electronic components C and the board S, and mounting, the electronic components C are sequentially mounted in each mounting area B of the board S. The board S on which a predetermined number of electronic components C have been mounted is transported by the board support mechanism 2 and stored in the unloader.

[0080] [Action and effect] (1) The pickup device 7 of this embodiment has a pickup collet 72 that holds and picks up an electronic component C, a hollow arm portion 71 having the pickup collet 72 at one end, a support portion 732 that supports the pickup collet 72, a rotating shaft 730a that protrudes from the space inside the arm portion 71 via a through hole (first through hole 711a) provided in the arm portion 71 and connects to the support portion 732, and an inversion drive portion 73 that inverts the pickup collet 72 by rotating the support portion 732 with the rotating shaft 730a, and an intake hole 733a that supplies negative pressure is provided at a position inside the arm portion 71 that connects the space including the rotating shaft 730a to the space outside the arm portion 71.

[0081] In addition, the mounting device 1 for electronic components C in this embodiment has a supply unit 6 that supplies electronic components C to the pickup device 7, a mounting mechanism 3 in which a mounting head 31 that holds the electronic components C handed over from the pickup device 7 mounts the electronic components C on a substrate S at a mounting position OA, and a substrate support mechanism 2 that supports the substrate S on which the electronic components C are mounted.

[0082] Therefore, when the pickup collet 72 is reversed, particles generated by sliding between members can be sucked through the intake holes 733a, reducing adhesion of particles to the electronic components C held by the pickup collet 72. This also reduces the chance of particles falling onto the electronic components C attached to the wafer sheet WS. In other words, it is possible to prevent particles from adhering to the electronic components C before they are mounted. This allows the electronic components C to be picked up while reducing the effects of generated particles.

[0083] (2) In the pickup device 7 of the above-described embodiment, the rotating shaft 730a is a hollow member having a space inside, and has a first opening 730c facing the space inside the arm portion 71, and a second opening 730d communicating with the first opening 730c and facing the space outside the arm portion 71, and the air intake hole 733a is provided in the support portion 732 at a position facing the second opening 730d.

[0084] Therefore, the internal space of arm portion 71 communicates with the external space via first opening 730c and second opening 730d of rotating shaft 730a, and negative pressure can be generated in the internal space of rotating shaft 730a and in intake hole 733a by suctioning the internal space of arm portion 71. This allows particles to be sucked in from the position of support portion 732 facing rotating shaft 730a, particularly where sliding occurs between components, when pickup collet 72 is reversed, thereby reducing adhesion of particles to surrounding components.

[0085] (3) In the pickup device 7 of the present embodiment described above, the intake hole is a through-hole (first through-hole 711a) through which the rotation shaft 730a protrudes from the space inside the arm portion 71. Therefore, particles near the first through-hole 711a through which the rotation shaft 730a protrudes from the space inside the arm portion 71 can also be sucked into the inside of the arm portion 71, and particles generated by rotation can also be kept from escaping to the outside from the arm portion 71.

[0086] (4) The pickup device 7 of the present embodiment described above includes a tube 712 that is built into the arm portion 71 and supplies negative pressure to the space including the rotation shaft 730a. Therefore, when the pickup collet 72 is reversed, particles that are generated in the space including the rotation shaft 730a, where sliding between components occurs, are sucked in by the tube 712. Furthermore, because the tube 712 is built into the arm portion 71, even if particles are generated from the tube 712 or its interior, which deforms as the arm portion 71 moves, they can be contained within the arm portion 71. The particles do not escape from the arm portion 71, reducing adhesion of particles to surrounding components.

[0087] (5) In the pickup device 7 of the present embodiment described above, the partition wall 711c that divides the internal space of the arm portion 71 into a space including the rotation shaft 730a haveThe partition wall 711c is provided with a communication hole 711d that uses negative pressure to suck the space including the rotating shaft 730a. Therefore, when the pickup collet 72 is reversed, the space including the rotating shaft 730a, where sliding between components occurs, is partitioned by the partition wall 711c, and particles generated in this space can be trapped and sucked through the communication hole 711d. As a result, compared to when the entire space inside the arm portion 71 is sucked, the exhaust volume can be reduced, and particles can be sucked in with a small suction force.

[0088] (6) The pickup device 7 of the present embodiment described above includes a tube 712 built into the arm portion 71 and supplying negative pressure to the space including the rotating shaft 730a. The tube 712 is connected to the communication hole 711d of the partition wall 711c. Therefore, when the pickup collet 72 is inverted, the space including the rotating shaft 730a, where sliding between components occurs, is partitioned by the partition wall 711c, and particles generated in this space can be trapped. Furthermore, the particles trapped in the partitioned space are sucked in by the tube 712. As a result, compared to suctioning the entire interior space of the arm portion 71, the exhaust volume can be reduced, and particles can be sucked in with a small suction force. Furthermore, because the tube 712 is built into the arm portion 71, even if particles are generated from the tube 712 or its interior, which deforms as the arm portion 71 moves, they can be trapped inside the arm portion 71. Since the particles do not escape from the arm portion 71, adhesion of particles to surrounding components can be reduced.

[0089] (7) In the pickup device 7 of the present embodiment described above, the connection tube 735a for supplying negative pressure or positive pressure to the pickup collet 72 passes through the first opening 730c and the second opening 730d, is drawn out from the intake hole 733a, and is connected to the pickup collet 72. That is, the connection tube 735a passes through the interior of the rotating shaft 730a, where negative pressure is generated, and the intake hole 733a, and is connected to the pickup collet 72. Therefore, when the pickup collet 72 is turned over or the arm unit 71 is moved, particles generated by sliding between the connection tube 735a and the intake hole 733a are sucked into the space inside the arm unit 71, thereby reducing adhesion of particles to surrounding members.

[0090] (8) The pickup collet 72 of the pickup device 7 of the present embodiment described above is connected to a buffer member 734b, and wiring or piping (cable 734c) that supplies power to the buffer member 734b passes through the first opening 730c and the second opening 730d, is drawn out from the intake hole 733a, and is connected to the buffer member 734b. That is, the cable 734c passes through the inside of the rotating shaft 730a, where negative pressure is generated, and the intake hole 733a, and is connected to the buffer member 734b. Therefore, when the pickup collet 72 is turned over or the arm unit 71 is moved, particles generated by sliding between the cable 734c and the intake hole 733a are sucked into the space inside the arm unit 71, thereby reducing adhesion of particles to surrounding components.

[0091] (9) In the pickup device 7 of the present embodiment described above, the first opening 730c of the rotating shaft 730a is an opening formed by cutting out a circumferential surface of the rotating shaft 730a at a central angle of 180° or more about the axial center of the rotating shaft 730a. Therefore, while the rotating shaft 730a rotates (reverses) 180°, the connecting tube 735a and the cable 734c passing through the first opening 730c and the second opening 730d of the rotating shaft 730a do not come into contact with the rotating shaft 730a around the first opening 730c, thereby preventing unnecessary sliding. As a result, further particle generation can be prevented.

[0092] (10) A pickup collet 72 that holds and picks up an electronic component C, a hollow arm portion 71 having the pickup collet 72 at one end, a support portion 732 that supports the pickup collet, and a rotating shaft 730a that protrudes from the internal space of the arm portion 71 via a through hole provided in the arm portion 71 and connects to the support portion 732, and an inversion drive portion 73 that inverts the pickup collet 72 by rotating the support portion 732 with the rotating shaft 730a, and a pneumatic circuit is provided that supplies negative pressure to the internal space of the arm portion 71.

[0093] Therefore, by making the pressure inside the arm portion 71 lower than the external pressure (negative pressure), particles generated inside the arm portion 71 can be kept inside the arm portion 71. As a result, even if there are gaps in the arm portion 71, such as a joint or a through-hole in the rotating shaft 730a, particles are prevented from diffusing to the outside, and adhesion of particles to surrounding members can be reduced.

[0094] (11) The pickup collet 72 is provided with a sliding portion SL (742b, 744b) arranged at a position where there is no overlap in a planar view on the mounting surface F on which the electronic component C to be picked up is mounted, and a transport mechanism 74 that transports the pickup collet 72 by driving the arm portion 71 in accordance with the sliding of the sliding portion SL.

[0095] In this way, since the sliding portion SL is located in a position that does not overlap the mounting surface F on which the electronic component C is mounted in a planar view, when the arm portion 71 moves in accordance with the sliding of the sliding portion SL, particles generated from the sliding portion SL are less likely to fall onto the mounting surface F, thereby preventing poor bonding caused by particles adhering to the electronic component C.

[0096] (12) The sliding portion SL is located at a position lower than the height of the mounting surface F. Therefore, particles generated from the sliding portion SL fall below the mounting surface F, and therefore hardly reach the mounting surface F, which further reduces bonding defects.

[0097] (13) The sliding portion SL is made up of a first sliding portion 742b and a second sliding portion 744b that are arranged on two opposing side surfaces of a common moving body 743 and slide linearly along two perpendicular axes.

[0098] Therefore, the two shafts of the first sliding portion 742b and the second sliding portion 744b are disposed in close proximity via a common member, which makes it possible to prevent the positional deviation of the pickup collet 72 caused by the rattle of the first sliding portion 742b and the second sliding portion 744b from increasing. Therefore, by providing the sliding portion SL in a position that does not overlap with the placement surface F in a plan view, even if the arm portion 71 is long, accurate positioning and transportation of the electronic component C is possible.

[0099] (14) The pickup device 7 has a pickup collet 72 that picks up an electronic component C from the supply unit 6, inverts it, and passes it to the mounting head 31, and a transfer mechanism 74 that moves the pickup collet 72 into the space created by the substrate support mechanism 2 retracting the substrate S (stage 21) from the mounting position OA.

[0100] Therefore, there is no need for the mounting head 31 to move in order to receive the electronic component C from the transfer mechanism 74, and the position of the electronic component C at the mounting position OA can be maintained constant, and the electronic component C can be received at a height position close to the height position of the upper surface of the board S, thereby achieving high mounting accuracy. In this way, the amount of movement of the mounting head 31 can be reduced, and the amount of particles generated at the mounting position OA can also be reduced.

[0101] (15) The distance between the board S at the mounting position OA and the mounting head 31 is set so that the board S needs to be retracted in order for the pickup collet 72 to move to the mounting position OA. This allows the position of the mounting head 31 when receiving the electronic component C to be close to the board S at the time of mounting. This makes it possible to significantly shorten the distance that the mounting head 31 moves for mounting after receiving the electronic component C, preventing misalignment due to movement of the mounting head 31 and improving mounting accuracy.

[0102] (16) The mounting head 31 has a transparent portion that allows the mark M on the board S to be recognized through the transparent portion when the mounting head 31 holds the electronic component C. The mounting device 1 has a first imaging unit 4 that is arranged below the board support mechanism 2 at the mounting position OA and captures an image of the mark m of the electronic component C held by the mounting head 31 when the board S is retracted from the mounting position OA, a second imaging unit 5 that is arranged above the mounting head 31 at the mounting position OA and captures an image of the mark M on the board S through the transparent portion, and a positioning mechanism that positions the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5.

[0103] According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 arranged below the board support mechanism 2 at the mounting position OA while the board S is retracted from the mounting position OA, and the board S supported by the board support mechanism 2 is imaged through the transparent part of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that it is possible to image the mark m of the electronic component C and the mark M of the board S while bringing the electronic component C and the board S as close as possible to each other.

[0104] This makes it possible to minimize the amount of movement of the electronic component C (mounting head 31) and the board S (board support mechanism 2) when capturing images of the marks m and M, and the amount of relative movement between the electronic component C (mounting head 31) and the board S (board support mechanism 2) after capturing images of the marks m and M. This makes it possible to suppress the increase in error that would otherwise occur if the mounting head 31 or the board support mechanism 2 were moved a long distance. Furthermore, although the longer the movement distance of the mechanism, the more particles are generated, in this embodiment, the movement distance can be reduced, thereby preventing particles from reducing cleanliness and causing poor bonding.

[0105] Here, if the marks M are imaged by a camera provided adjacent to the mounting head 31 rather than through the mounting head 31, it is practically impossible to achieve the required high accuracy using a high-magnification camera. In other words, the area on the board S where the marks M are to be placed is only a few millimeters larger than the area where the electronic components C are to be mounted, and the diameter of the mounting head 31 is also only a few millimeters larger than the area where the marks M are to be placed. For this reason, even if the camera barrel is placed adjacent to the mounting head 31, multiple marks M will not fit within the camera's field of view, and multiple marks M cannot be imaged simultaneously with the camera.

[0106] Therefore, in order to capture an image of multiple (two) marks M on the board S, it is necessary to move the camera (mounting head 31) by a distance greater than the separation distance between the two marks M, and an error occurs during this movement. In other words, after recognizing and aligning the mark m of the electronic component C, the camera must be moved together with the mounting head 31 in order to recognize the mark M on the board S, and even if the camera is then returned to its original position, there is a possibility that the position of the electronic component C will be shifted.

[0107] To address this issue, if the recognition and alignment of the mark M on the board S is performed first, the position of the electronic component C cannot be recognized when the board S is in the position where it should be mounted, and therefore the board S must be moved after alignment, resulting in misalignment of the board S.

[0108] Furthermore, it is also possible to prepare a template with a mark corresponding to the mark M on the substrate S at a position different from the actual mounting position, and perform positioning based on the relative positions of the mark on this template and the mark M on the substrate S. However, in this case, the mounting head 31 and the camera must be moved to recognize the mark on the template each time an electronic component C is mounted. This requires additional time to recognize the mark on the template and to position the electronic component C, reducing productivity. Furthermore, the increased distance the mechanism must travel also increases the amount of particles generated.

[0109] In this embodiment, after the images of the marks m and M are captured, the movement distance of the electronic component C and the substrate S can be reduced, so that positional deviation, reduction in productivity, and generation of particles can all be reduced.

[0110] (17) The transmission portion has a transparent plate-like member. Therefore, it is possible to hold the electronic component C and ensure transparent imaging of the mark M on the substrate S in a narrow area corresponding to the size of the microscopic electronic component C.

[0111] (18) The first imaging unit 4 and the second imaging unit 5 are fixed relative to the mounting position OA. Therefore, there is no misalignment between the imaging areas of the first imaging unit 4 and the second imaging unit 5, and the generation of particles due to movement can be prevented.

[0112] [Variations] (1) Opening 711e of extension 711 of arm 71 may be common to or different from communication hole 711d through which negative pressure is supplied, i.e., suction is performed. When opening 711e is common to communication hole 711d, for example, as shown in FIG. 11 , connection tube 735a and cable 734c are inserted into tube 712, pass through tube 712, exit communication hole 711d, and then drawn out through intake hole 733a to connect to pickup collet 72. When connection tube 735a and cable 734c pass through tube 712 in this way, particles generated by sliding between connection tube 735a, intake hole 733a, and tube 712 when pickup collet 72 is inverted or arm 71 is moved remain inside tube 712. Therefore, even if arm 71 has a seam, particles are prevented from diffusing outside arm 71, reducing particle adhesion to surrounding components.

[0113] (2) Tube 712 does not have to be provided. In this case, the internal space of extension portion 711 serves as tube 712, and a negative pressure is supplied to the internal space of extension portion 711 by an air pressure circuit provided on the base portion 713 side, thereby generating a suction force. For example, a negative pressure is supplied from the space on the base portion 713 side to a space including rotation shaft 730a via communication hole 711d by the air pressure circuit provided on the base portion 713 side, thereby generating a suction force.

[0114] (3) A fluid cylinder may be used as the buffer member 734b. In this case, it is sufficient that a pipe for supplying a fluid (gas or liquid) that serves as power is connected to the buffer member 734b. Alternatively, an elastic member such as a spring or rubber may be used as the buffer member 734b. In this case, the supply line corresponding to the cable 734c that supplies power can be omitted.

[0115] (4) The position of air intake hole 733a may be any position as long as it faces the axis of rotation of support portion 732 (rotating body 733). Therefore, the axis of rotation and the center of air intake hole 733a do not need to be concentric, and air intake hole 733a may be located near the axis of rotation. As long as air intake hole 733a, connection tube 735a, and cable 734c rotate without changing their relative positions while maintaining contact with air intake hole 733a, even when support portion 732 rotates, generation of particles due to sliding at the contact points can be suppressed.

[0116] (5) The pickup collet 72 may be provided so as to be rotatable in a direction parallel to the XY plane, that is, in a direction (θ direction) parallel to the top surface of the electronic component C (the surface of the wafer sheet WS). In this case, a cable that supplies power to a motor that rotates the pickup collet 72 in the θ direction is configured to pass through the tube 712, be drawn out from the intake hole 733a, and be connected to the motor. This prevents particles generated by sliding between the cable, the intake hole 733a, and the tube 712 when the pickup collet 72 is turned over or the arm unit 71 is moved from escaping outside the arm unit 71 and thus does not affect the surrounding area.

[0117] (6) The supply unit 6 is not limited to a device that supplies electronic components C attached to a wafer sheet WS. For example, it may be a device that supplies electronic components C arranged on a tray. The configuration of the transfer mechanism 74 is also sufficient as long as it can individually pick up and transfer electronic components C from the supply unit 6. For this reason, the arm unit 71 may be configured to move in the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

[0118] (7) In the transfer mechanism 74, the drive unit that drives the arm unit 71 is not limited to a mechanism using a linear motor as a drive source. It may also be a mechanism using a ball screw or a belt driven by a motor with a rotating shaft. In such a mechanism, since the mechanism includes a sliding unit SL, it is preferable to provide the sliding unit SL at a position that does not overlap with the mounting surface F in a planar view. Furthermore, it is preferable to provide the sliding unit SL at a position lower than the height of the mounting surface F. Note that, when there are multiple sliding units SL, some of the sliding units SL do not have to be provided at a position that does not overlap with the mounting surface F in a planar view. Furthermore, it is also preferable that some of the sliding units SL do not have to be provided at a position that does not overlap with the mounting surface F in a planar view. In such a case, it is preferable to provide a shield, such as an exterior, a wall, or another component, between the sliding unit SL and the mounting surface F. It is also preferable to increase the distance between the sliding unit SL and the mounting surface F.

[0119] (8) The mounting head 31 is only required to be configured so that the second imaging unit 5 can capture an image of the mark M on the substrate S. Therefore, the transmissive portion of the mounting head 31 does not need to be made of a transparent material, and a through-hole may be formed at a location corresponding to the mark M. More specifically, the holding portion 31b may be made of an opaque material, and a through-hole may be formed at a location corresponding to the mark M, or the hollow portion 31a may not exist, the holding portion 31b may be made of an opaque material, and a through-hole may be formed at a location corresponding to the mark M on the mounting head 31 and the holding portion 31b. In other words, such a through-hole is also a transmissive portion of the mounting head 31.

[0120] (9) The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable relative to the position (mounting position OA) where the electronic component C is mounted. In other words, if it is not possible to simultaneously image multiple marks m on the electronic component C or multiple marks M on the board S, the first imaging unit 4 and the second imaging unit 5 may be configured to move between the marks m or M to capture images. That is, the first imaging unit 4 may be provided with a moving device for moving between the marks m, and the second imaging unit 5 may be provided with a moving device for moving between the marks M. Even in this case, the movement distance is short and remains within the range of the size of the mounting area B for the electronic component C or the board S, so that errors and particle generation can be suppressed.

[0121] (10) The position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are aligned to their respective reference positions, but this is not limited to this, and the position of the mounting area B may be aligned with the position of the electronic component C, or the position of the electronic component C may be aligned with the position of the mounting area B. The point is that it is sufficient to be able to align the position of the mounting area B of the substrate S with the position of the electronic component C.

[0122] (11) The board S may be transferred to and from the stage 21 of the board support mechanism 2 at the mounting position OA. In this case, after the board S is supplied to the stage 21, the board S may be retracted from the mounting position OA before the first imaging unit 4 captures an image of the mark m of the electronic component C.

[0123] [Other embodiments] Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0124] 1 Mounting equipment 2 Board support mechanism 3. Mounting mechanism 4 First imaging unit 5 Second imaging unit 6 Supply section 7 Pickup device 8 Control Device 11 Support stand 11a Receiving hole 21 Stages 22 Drive mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b guide rails 23 Moving board 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 32 Drive mechanism 33, 34, 35 Mobile 61 Support mechanism 61a Ring holder 62 Drive mechanism 71 Arm section 711 Extension 711a First through hole 711b Second through hole 711c Bulkhead 711d Communication hole 711e aperture 712 tubes 713 Base 72 Pickup collet 73 Reversing drive unit 730 Shaft 730a Rotating shaft 730b strut 730c First opening 730d Second opening 731 Power Source 732 Support part 733 Rotating Body 733a Intake hole 734 Buffer section 734a Bracket 734b Cushioning material 734c cable 735 Detachable part 735a Connecting Tube 74 Transfer mechanism 741 Fixed body 742 First Drive Unit 742a First driving source 742b First sliding part 743 Mobile 744 Second Drive 744a Secondary driving source 744b Second sliding part

Claims

1. a pickup collet that holds and picks up electronic components; a hollow arm portion having the pickup collet provided at one end thereof; a reversal drive unit that has a support unit that supports the pickup collet and a rotary shaft that protrudes from the internal space of the arm unit via a through hole provided in the arm unit and is connected to the support unit, and that rotates the support unit by the rotary shaft to reverse the pickup collet; and a pickup device, characterized in that an intake hole for supplying negative pressure is provided at a position inside the arm portion that communicates with a space including the rotation shaft and a space outside the arm portion;

2. the rotation shaft is a hollow member having an internal space, and has a first opening facing the internal space of the arm portion, and a second opening communicating with the first opening and facing the external space of the arm portion, 2. The pickup device according to claim 1, wherein the air intake hole is provided in the support portion at a position facing the second opening.

3. 3. The pickup device according to claim 1, wherein the air intake hole is the through hole.

4. 4. The pickup device according to claim 1, further comprising a tube built into the arm portion for supplying negative pressure to a space including the rotation shaft.

5. a partition wall that divides the internal space of the arm portion into a space including the rotation shaft; 4. The pickup device according to claim 1, wherein the partition wall is provided with a communication hole for supplying negative pressure to a space including the rotation shaft.

6. 6. The pickup device according to claim 5, further comprising a tube built into the arm portion for supplying negative pressure to a space including the rotation shaft, the tube being connected to the communication hole.

7. 3. The pickup device according to claim 2, wherein a connection tube for supplying negative pressure or positive pressure to the pickup collet passes through the first opening and the second opening, is drawn out from the intake hole, and is connected to the pickup collet.

8. The pickup collet is connected to a buffer member, 3. The pickup device according to claim 2, wherein a cable for supplying power to the buffer member passes through the first opening and the second opening, is drawn out from the air intake hole, and is connected to the buffer member.

9. 9. The pickup device according to claim 7, wherein the first opening is an opening formed by cutting out a circumferential surface of a circle having a central angle of 180 degrees or more about the center of the rotation shaft.

10. a pickup collet that holds and picks up electronic components; a hollow arm portion having the pickup collet provided at one end thereof; a reversal drive unit that has a support unit that supports the pickup collet and a rotary shaft that protrudes from the internal space of the arm unit via a through hole provided in the arm unit and is connected to the support unit, and that rotates the support unit by the rotary shaft to reverse the pickup collet; and A pickup device characterized in that a pneumatic circuit for supplying negative pressure to the space inside the arm portion is provided.

11. A pickup device according to any one of claims 1 to 10; a supply unit that supplies the electronic components to the pickup device; a mounting mechanism in which a mounting head holding the electronic component delivered from the pickup device mounts the electronic component on a substrate at a mounting position; a substrate support mechanism for supporting the substrate on which the electronic components are mounted; An electronic component mounting device comprising:

Images