SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To effectively reduce a use amount of a phosphoric acid and a diluted solution, used for a phosphoric acid treatment.SOLUTION: A substrate processing apparatus (100) comprises: a first storage tank (110) that stores a phosphoric acid; a second storage tank (120) that stores a rinse liquid; a substrate holding part (130) that falls the substrate while being held, and implants a substrate (W) to a rinse liquid of the second storage tank (120); and a rinse liquid transfer part (140) that supplies the rinse liquid of the second storage tank (120) in a specific period of a rinse liquid immersion period where the substrate (W) is implanted into the second storage tank (120) to the first storage tank (110), and supplies the rinse liquid of the second storage tank (120) in a period after the specific period of the rinse liquid immersion period to the first storage tank (110).SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] 2. Description of the Related Art Substrate processing apparatuses are known that process substrates. Substrate processing apparatuses are suitable for processing semiconductor substrates. Typically, substrate processing apparatuses process substrates using a processing liquid.

[0003] In a batch-type processing apparatus that processes multiple substrates at once, it has been studied to process the substrates using a predetermined phosphoric acid solution, silicon, and DIW supplied to a processing tank (Patent Document 1). In the substrate processing apparatus of Patent Document 1, in order to prevent clogging of the drain line, the liquid received in the liquid receiver is discharged via a liquid receiver discharge pipe to an external discharge pipe provided outside. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-64746 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate processing apparatus of Patent Document 1, a predetermined phosphoric acid aqueous solution, silicon, and DIW are supplied to a processing bath. However, Patent Document 1 does not consider reducing the amount of the predetermined liquid supplied to the processing bath.

[0006] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can efficiently reduce the amount of phosphoric acid solution used in phosphoric acid processing. [Means for solving the problem]

[0007] According to one aspect of the present invention, a substrate processing apparatus includes a first storage tank for storing a phosphoric acid solution, a second storage tank for storing a rinse solution, a substrate holding unit that holds and lowers a substrate to immerse the substrate in the rinse solution in the second storage tank, and a rinse solution diversion unit that supplies the rinse solution from the second storage tank to the first storage tank during a specific period of a rinse solution immersion period during which the substrate is immersed in the rinse solution in the second storage tank, and stops supplying the rinse solution from the second storage tank to the first storage tank during a period after the specific period of the rinse solution immersion period.

[0008] In one embodiment, the substrate processing apparatus further includes a circulation pipe that circulates the phosphoric acid solution in the first storage tank so that it flows out of the first storage tank and returns to the first storage tank, and the rinse solution diversion unit supplies the rinse solution in the second storage tank to the first storage tank via the circulation pipe.

[0009] In one embodiment, the substrate processing apparatus further includes a phosphoric acid supply unit that supplies phosphoric acid to the first storage tank, a diluted liquid supply unit that supplies a diluted liquid to the first storage tank, and a rinse liquid supply unit that supplies a rinse liquid to the second storage tank.

[0010] In one embodiment, the substrate processing apparatus further includes a heater that heats the phosphoric acid solution flowing through the circulation pipe, and the rinse solution supply unit heats the rinse solution and supplies it to the second storage tank before the specific period, and supplies the rinse solution to the second storage tank without heating it after the specific period.

[0011] In one embodiment, the rinse liquid diversion unit includes a storage tank that stores at least a portion of the rinse liquid in the second storage tank for the specific period.

[0012] In one embodiment, the substrate processing apparatus further includes a temperature-adjusted tank disposed in the circulation pipe, and the storage tank is disposed adjacent to the temperature-adjusted tank.

[0013] According to another aspect of the present invention, a substrate processing method includes the steps of immersing a substrate in phosphoric acid liquid stored in a first storage tank; immersing the substrate in rinse liquid stored in a second storage tank; a diversion step of supplying the rinse liquid from the second storage tank to the first storage tank during a specific period of a rinse liquid immersion period during which the substrate is immersed in the rinse liquid; and a diversion stop step of stopping the supply of the rinse liquid from the second storage tank to the first storage tank during a period after the specific period of the rinse liquid immersion period.

[0014] In one embodiment, the substrate processing method further includes a step of circulating the phosphoric acid solution in the first storage tank through a circulation pipe through which the phosphoric acid solution flows out of the first storage tank and returns to the first storage tank, and the diversion step supplies the rinse solution in the second storage tank to the first storage tank through the circulation pipe.

[0015] In one embodiment, the substrate processing method further includes the steps of supplying phosphoric acid to the first storage tank, supplying a diluting liquid to the first storage tank, and supplying a rinsing liquid to the second storage tank.

[0016] In one embodiment, the substrate processing method further includes a step of heating the phosphoric acid solution flowing through the circulation pipe, and in the step of supplying the rinse solution, the rinse solution is heated and supplied to the second storage tank before the specific period, and the rinse solution is supplied to the second storage tank without being heated after the specific period.

[0017] In one embodiment, the diverting step includes a step of storing the rinse liquid in the second storage tank in a storage tank for the specific period.

[0018] In one embodiment, the substrate processing method further includes a step of storing the phosphoric acid solution flowing through the circulation pipe in a temperature-regulated tank, the storage tank being disposed adjacent to the temperature-regulated tank. [Effects of the Invention]

[0019] According to the present invention, the amounts of phosphoric acid and diluent used in the phosphating treatment can be efficiently reduced. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 3] 1 is a schematic block diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 4] 1(a) to 1(e) are schematic diagrams of a substrate processing apparatus according to the present embodiment. [Figure 5] FIG. 2 is a flow chart of a substrate processing method according to the present embodiment. [Figure 6] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 7] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 8] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 9] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 10] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 11] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 12] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Figure 13] 1(a) to 1(d) are schematic diagrams of a substrate processing apparatus according to the present embodiment. [Figure 14] 1(a) to 1(c) are schematic diagrams of a substrate processing apparatus according to the present embodiment. [Figure 15] 1 is a schematic diagram of a substrate processing system including a substrate processing apparatus according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. Typically, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0022] An embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Fig. 1. Fig. 1 is a schematic perspective view of the substrate processing apparatus 100 of this embodiment.

[0023] The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, oxidation treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0024] The substrate W is thin and plate-shaped. Typically, the substrate W is thin and approximately disk-shaped. Examples of the substrate W include semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0025] The substrate processing apparatus 100 is a batch-type substrate processing apparatus. The substrate processing apparatus 100 processes a plurality of substrates W in a batch. Typically, the substrate processing apparatus 100 processes a plurality of substrates W in units of a lot. For example, one lot consists of 25 substrates W. Alternatively, one lot may consist of 50 substrates W.

[0026] 1, the substrate processing apparatus 100 includes a first storage tank 110, a second storage tank 120, and a substrate holder 130. Here, the second storage tank 120 is disposed adjacent to the first storage tank 110. However, the second storage tank 120 may be disposed away from the first storage tank 110.

[0027] The first reservoir 110 stores a phosphoric acid solution. The substrate W is immersed in the phosphoric acid solution in the first reservoir 110, whereby the substrate W is subjected to a phosphoric acid treatment.

[0028] The second storage tank 120 stores a rinse liquid. The substrate W is immersed in the rinse liquid in the second storage tank 120, whereby the substrate W is subjected to a rinse process.

[0029] The rinse liquid may include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water).

[0030] The substrate holding unit 130 holds the substrate W. The substrate holding unit 130 moves while holding the substrate W. For example, the substrate holding unit 130 descends into the first storage tank 110 while holding the substrate W. As a result, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110.

[0031] Furthermore, the substrate holder 130 descends into the second storage tank 120 while holding the substrate W. As a result, the substrate W is immersed in the rinse liquid in the second storage tank 120.

[0032] The substrate holding unit 130 holds a substrate W. The normal direction of the main surface of the substrate W held by the substrate holding unit 130 is parallel to the Y direction. The multiple substrates W are arranged in a line along the Y direction. The multiple substrates W are arranged approximately parallel to the horizontal direction. Furthermore, the normal line of each of the multiple substrates W extends in the Y direction, and each of the multiple substrates W extends approximately parallel to the X direction and the Z direction.

[0033] Typically, the substrate holding unit 130 holds a plurality of substrates W together. Here, the substrate holding unit 130 holds the substrates W arranged in a line along the Y direction. The substrate holding unit 130 moves the substrates W while holding them. For example, the substrate holding unit 130 moves vertically upward or vertically downward along the vertical direction while holding the substrates W.

[0034] Specifically, the substrate holding unit 130 includes a lifter. The substrate holding unit 130 moves vertically upward or vertically downward while holding a plurality of substrates W. As the substrate holding unit 130 moves vertically downward, the plurality of substrates W held by the substrate holding unit 130 are immersed in the phosphoric acid solution stored in the first storage tank 110. The substrate holding unit 130 allows the plurality of substrates W to be immersed all at once in the phosphoric acid solution stored in the first storage tank 110.

[0035] The substrate holding unit 130 may also move horizontally. For example, the substrate holding unit 130 moves from above the first storage tank 110 to above the second storage tank 120. The substrate holding unit 130 may also move from above the second storage tank 120 to above the first storage tank 110.

[0036] Above the second storage tank 120, the substrate holding unit 130 moves vertically downward, so that the plurality of substrates W held by the substrate holding unit 130 are immersed in the rinse liquid stored in the second storage tank 120. The substrate holding unit 130 allows the plurality of substrates W to be immersed collectively in the rinse liquid stored in the second storage tank 120.

[0037] The substrate W may be immersed in the phosphoric acid solution and then in the rinse solution while being held by the same substrate holder 130. Alternatively, the substrate W may be immersed in the phosphoric acid solution while being held by one substrate holder 130, and then transferred to another substrate holder 130, and then immersed in the rinse solution. In this way, the immersion of the substrate W in the phosphoric acid solution and the immersion of the substrate W in the rinse solution may be performed by different substrate holders 130.

[0038] The first reservoir 110 stores a phosphoric acid solution for treating the substrate W. The phosphoric acid solution is produced by mixing phosphoric acid with a diluent. The phosphoric acid and the diluent may be supplied to the first reservoir 110 separately.

[0039] In one example, the phosphoric acid and the diluent are mixed in the first storage tank 110. As a result, a phosphoric acid solution in which the phosphoric acid and the diluent are mixed is produced in the first storage tank 110.

[0040] The substrate holding part 130 includes a main body plate 132 and holding rods 134. The main body plate 132 is a plate that extends in the vertical direction (Z direction). The holding rods 134 extend in the horizontal direction (Y direction) from one main surface of the main body plate 132. In FIG. 1, three holding rods 134 extend horizontally from one main surface of the main body plate 132. The multiple substrates W are aligned at a predetermined interval, and are held in an upright position (vertical position) by the multiple holding rods 134 abutting the lower edge of each substrate W.

[0041] The substrate holding section 130 may further include a moving unit 136. The moving unit 136 raises and lowers the main body plate 132 between a lower position where the plurality of substrates W held by the holding rods 134 are located within the first reservoir tank 110 and an upper position (the position shown in FIG. 1 ) where the plurality of substrates W held by the holding rods 134 are located above the first reservoir tank 110. Therefore, by moving the main body plate 132 to the lower position by the moving unit 136, the plurality of substrates W held by the holding rods 134 are immersed in the phosphoric acid solution in the first reservoir tank 110.

[0042] The multiple substrates W are held by the multiple holding rods 134. Specifically, the lower edge of each substrate W abuts against the multiple holding rods 134, thereby holding the multiple substrates W in an upright position (vertical position) by the multiple holding rods 134. More specifically, the multiple substrates W held by the substrate holding unit 130 are aligned at intervals along the Y direction. Therefore, the multiple substrates W are arranged in a line along the Y direction. Furthermore, each of the multiple substrates W is held by the substrate holding unit 130 in a position approximately parallel to the XZ plane.

[0043] The moving unit 136 raises and lowers the main body plate 132. As the moving unit 136 raises and lowers the main body plate 132, the main body plate 132 and the holding rods 134 move vertically upward or downward while holding multiple substrates W. The moving unit 136 has a drive source and an elevating mechanism, and the drive source drives the elevating mechanism to raise and lower the main body plate 132. The drive source includes, for example, a motor. The elevating mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0044] More specifically, the moving unit 136 raises and lowers the main body plate 132 between the processing position and the retracted position (the position shown in FIG. 1). When the main body plate 132 moves vertically downward (in the Z direction) while holding the plurality of substrates W and moves to the processing position, the plurality of substrates W are introduced into the first storage tank 110. More specifically, the plurality of substrates W held by the substrate holder 130 moves into the first storage tank 110. As a result, the plurality of substrates W are immersed in the phosphoric acid solution in the first storage tank 110 and subjected to phosphoric acid treatment. Meanwhile, as shown in FIG. 1, when the main body plate 132 moves to the retracted position, the plurality of substrates W held by the holding rods 134 move above the first storage tank 110 and are pulled up from the phosphoric acid solution.

[0045] The moving unit 136 may move the main body plate 132 in the horizontal direction. In this case, the moving unit 136 moves the main body plate 132 and the holding rods 134 between a position above the first storage tank 110 (the position shown in FIG. 1) and a position above the second storage tank 120. When the substrate holding part 130 moves vertically downward (in the Z direction) while holding the plurality of substrates W and moves to the processing position, the plurality of substrates W are introduced into the second storage tank 120. More specifically, the plurality of substrates W held by the substrate holding part 130 moves into the second storage tank 120. As a result, the plurality of substrates W are immersed in the rinse liquid in the second storage tank 120 and are rinsed. When the main body plate 132 moves to the retracted position, the plurality of substrates W held by the holding rods 134 move above the second storage tank 120 and are pulled up from the rinse liquid.

[0046] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 and 2. Figure 2 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment.

[0047] 2, the substrate processing apparatus 100 includes a first storage tank 110, a second storage tank 120, and a substrate holder 130. The first storage tank 110 stores a phosphoric acid liquid, and the second storage tank 120 stores a rinse liquid.

[0048] As described above, the first storage tank 110 stores a phosphoric acid solution. The phosphoric acid solution is a mixture of phosphoric acid and a dilution solution. In the phosphoric acid solution, the concentration (mass concentration) of phosphoric acid is 80% or more and 95% or less.

[0049] The substrate holder 130 moves while holding the substrate W. The substrate holder 130, while holding the substrate W, descends into the phosphoric acid solution stored in the first storage tank 110, so that the substrate W is immersed in the phosphoric acid solution in the first storage tank 110. In this way, the substrate W is subjected to a phosphoric acid treatment.

[0050] Furthermore, the substrate holder 130, while holding the substrate W, descends into the rinse liquid stored in the second storage tank 120, so that the substrate W is immersed in the rinse liquid in the second storage tank 120. In this way, the substrate W is rinsed.

[0051] The substrate processing apparatus 100 includes a phosphoric acid supply unit 112 and a diluent supply unit 114. The phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110.

[0052] The dilute solution supply unit 114 supplies the dilute solution to the first storage tank 110. The dilute solution is used to dilute phosphoric acid. The dilute solution may include any of deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water). The dilute solution preferably contains at least some of the components of the rinse solution. The dilute solution may also be composed of the same components as the rinse solution.

[0053] In one example, phosphoric acid and a diluent are mixed in the first storage tank 110. As a result, a phosphoric acid solution in which phosphoric acid and a diluent are mixed is generated in the first storage tank 110. Note that the phosphoric acid supply unit 112 supplies the phosphoric acid solution in which phosphoric acid and a diluent are mixed to the first storage tank 110, and the concentration of the phosphoric acid solution may be adjusted by the diluent supplied by the diluent supply unit 114.

[0054] The substrate processing apparatus 100 further includes a rinse liquid supply unit 122. The rinse liquid supply unit 122 supplies the second storage tank 120 with a rinse liquid.

[0055] The phosphoric acid supply unit 112 includes a pipe 112a and a valve 112b. Phosphoric acid is discharged from one end of the pipe 112a into the first storage tank 110. The pipe 112a is connected to a phosphoric acid supply source. A valve 112b is disposed in the pipe 112a. The supply of phosphoric acid to the first storage tank 110 can be controlled by the valve 112b. When the valve 112b is opened, the phosphoric acid that has passed through the pipe 112a is supplied to the first storage tank 110. In the first storage tank 110, the phosphoric acid is mixed with the phosphoric acid solution in the first storage tank 110.

[0056] The diluent supply unit 114 includes a pipe 114a and a valve 114b. The diluent is discharged from one end of the pipe 114a into the first storage tank 110. The pipe 114a is connected to a diluent supply source. A valve 114b is disposed on the pipe 114a. The supply of the diluent to the first storage tank 110 can be controlled by the valve 114b. When the valve 114b is opened, the diluent that has passed through the pipe 114a is supplied to the first storage tank 110. In the first storage tank 110, the diluent is mixed with the phosphoric acid solution in the first storage tank 110.

[0057] The rinse liquid supply unit 122 includes a pipe 122a and a valve 122b. The rinse liquid is discharged from one end of the pipe 122a into the second storage tank 120. The pipe 122a is connected to a rinse liquid supply source. A valve 122b is disposed in the pipe 122a. The supply of the rinse liquid to the second storage tank 120 can be controlled by the valve 122b. When the valve 122b is opened under the control of the control device 180, the rinse liquid that has passed through the pipe 122a is supplied to the second storage tank 120.

[0058] In this embodiment, the substrate processing apparatus 100 further includes a rinse liquid diverter 140 in addition to the first storage tank 110, the second storage tank 120, and the substrate holder 130. The rinse liquid diverter 140 diverts the rinse liquid from the second storage tank 120. Specifically, the rinse liquid diverter 140 diverts the rinse liquid from the second storage tank 120 and supplies it to the first storage tank 110.

[0059] More specifically, the rinse liquid diversion unit 140 supplies the rinse liquid from the second storage tank 120 to the first storage tank 110 during a specific period of the rinse liquid immersion period during which the substrates W are immersed in the rinse liquid in the second storage tank 120. The rinse liquid in the second storage tank 120 contains phosphoric acid liquid components that have flowed from the substrates W. For example, the phosphoric acid concentration of the rinse liquid in the second storage tank 120 is 0.5% or more and 5% or less. By diverting the rinse liquid from the second storage tank 120 to the first storage tank 110 and supplying it thereto, the phosphoric acid liquid components that have flowed from the substrates W can be utilized in the first storage tank 110. Furthermore, by diverting the rinse liquid from the second storage tank 120 to the first storage tank 110, the phosphoric acid liquid in the first storage tank 110 can be replenished.

[0060] Furthermore, the rinse liquid diversion unit 140 stops supplying the rinse liquid from the second storage tank 120 to the first storage tank 110 during a period after a specific period of the rinse liquid immersion period. As time passes, the amount of phosphoric acid liquid components flowing from the substrate W into the rinse liquid in the second storage tank 120 decreases. Therefore, by stopping the diversion of the rinse liquid from the second storage tank 120 to the first storage tank 110, it is possible to prevent the concentration of the phosphoric acid liquid in the first storage tank 110 from decreasing excessively.

[0061] The rinse liquid diversion unit 140 has a pipe 141, a valve 142, and a pump 143. The pipe 141 supplies the rinse liquid from the second storage tank 120 to the first storage tank 110. One end of the pipe 141 is connected to the second storage tank 120, and the other end of the pipe 141 is directed toward the first storage tank 110. The pump 143 sends the rinse liquid to the first storage tank 110 via the pipe 141. Therefore, the rinse liquid that has flowed through the pipe 141 is discharged from the other end of the pipe 141 into the first storage tank 110.

[0062] A valve 142 and a pump 143 are arranged in the pipe 141. Typically, the valve 142 is arranged downstream of the pump 143. The valve 142 can control the supply of the rinse liquid to the first storage tank 110. When the valve 142 is opened, the rinse liquid that has passed through the pipe 141 is supplied to the first storage tank 110. In the first storage tank 110, the rinse liquid is mixed with the phosphoric acid liquid in the first storage tank 110. When the valve 142 is closed, the rinse liquid does not pass through the pipe 141, and the supply of the rinse liquid to the first storage tank 110 stops.

[0063] It is preferable that a filter be disposed in the pipe 141. The filter can remove impurities from the rinse liquid flowing through the pipe 141. It is preferable that the filter be disposed upstream of the valve 142 and the pump 143.

[0064] Next, an embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Figures 1 to 3. Figure 3 is a schematic block diagram of the substrate processing apparatus 100 of this embodiment.

[0065] 3, the control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 controls the operations of the respective units of the substrate processing apparatus 100.

[0066] The control unit 182 includes a processor. The processor may include, for example, a central processing unit (CPU). Alternatively, the processor may include a general-purpose computer.

[0067] The memory unit 184 stores data and computer programs. The memory unit 184 includes a main memory and an auxiliary memory. The main memory is, for example, a semiconductor memory. The auxiliary memory is, for example, a semiconductor memory and / or a hard disk drive. The memory unit 184 may include removable media. The processor of the control unit 182 executes the computer program stored in the memory unit 184 to perform the substrate processing method.

[0068] The control unit 182 controls the phosphoric acid supply unit 112, the dilution liquid supply unit 114, the rinse liquid supply unit 122, the substrate holder 130, and the rinse liquid diversion unit 140 in accordance with a predetermined program. Specifically, the control unit 182 controls the operation of the moving unit 136. The control unit 182 also controls the opening and closing operations of the valves 112b, 114b, 122b, and 142. Furthermore, the control unit 182 controls the driving of the pump 143.

[0069] The control unit 182 controls the movement unit 136 to move the main body plate 132. For example, the control unit 182 can cause the movement unit 136 to move (raise and lower) the main body plate 132 in the vertical direction. The control unit 182 can also cause the movement unit 136 to move the main body plate 132 in the horizontal direction.

[0070] The control unit 182 controls the valve 112b of the phosphoric acid supply unit 112 to switch the state of the valve 112b between an open state and a closed state. Specifically, the control unit 182 controls the valve 112b of the phosphoric acid supply unit 112 to open the valve 112b, thereby allowing the phosphoric acid flowing through the pipe 112a to pass. The control unit 182 also controls the valve 112b of the phosphoric acid supply unit 112 to close the valve 112b, thereby stopping the supply of phosphoric acid flowing through the pipe 112a. The control unit 182 can also control the valve 114b of the dilution liquid supply unit 114 and the valve 122b of the rinse liquid supply unit 122 in a similar manner.

[0071] Furthermore, the control unit 182 controls the valve 142 of the rinse liquid diversion unit 140 to switch the state of the valve 142 between an open state and a closed state. The control unit 182 controls the pump 143 of the rinse liquid diversion unit 140 to switch the state of the pump 143 between an activated state and a stopped state. Specifically, the control unit 182 controls the valve 142 and the pump 143 of the rinse liquid diversion unit 140 to open the valve 142 and activate the pump 143, thereby allowing the rinse liquid from the second storage tank 120 to flow through the pipe 141 and be supplied to the first storage tank 110. The control unit 182 also controls the valve 142 and the pump 143 of the rinse liquid diversion unit 140 to close the valve 142 or stop the pump 143, thereby stopping the rinse liquid from the second storage tank 120 from flowing through the pipe 141 and being supplied to the first storage tank 110.

[0072] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 4. Figures 4(a) to 4(e) are schematic diagrams of the substrate processing apparatus 100 according to this embodiment.

[0073] 4(a), the first storage tank 110 and the second storage tank 120 are disposed adjacent to each other. As described above, the first storage tank 110 is capable of storing a phosphoric acid solution, and the second storage tank 120 is capable of storing a rinse solution. However, in this example, both the first storage tank 110 and the second storage tank 120 are empty.

[0074] As shown in FIG. 4(b), a phosphoric acid solution is supplied to the first storage tank 110. For example, a phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110. Furthermore, a diluent supply unit 114 supplies a diluent to the first storage tank 110. In the first storage tank 110, the phosphoric acid and the diluent are mixed to generate a phosphoric acid solution as a mixed solution. As a result, the first storage tank 110 stores the phosphoric acid solution. Here, the first storage tank 110 stores the phosphoric acid solution to its full capacity.

[0075] 4(c), the substrate W is immersed in the phosphoric acid solution in the first storage tank 110. For example, the substrate holder 130, while holding the substrate W, is lowered to immerse the substrate W in the phosphoric acid solution in the first storage tank 110. In this way, the substrate W is subjected to the phosphoric acid treatment.

[0076] 4(b), if the amount of phosphoric acid solution is large relative to the capacity of the first storage tank 110, immersion of the substrate W may cause some of the phosphoric acid solution to overflow from the first storage tank 110. Even when the substrate W is immersed in the phosphoric acid solution in the first storage tank 110 in FIG. 4(c), the amount of phosphoric acid solution supplied to the first storage tank 110 may be adjusted so that some of the phosphoric acid solution does not overflow from the first storage tank 110.

[0077] Furthermore, a rinse liquid may be supplied to the second storage tank 120 while the substrate W is immersed in the phosphoric acid liquid in the first storage tank 110. For example, the rinse liquid supply unit 122 supplies the rinse liquid to the second storage tank 120.

[0078] As shown in FIG. 4(d), the substrate W is immersed in the rinse liquid in the second storage tank 120. For example, the substrate holder 130 lifts the substrate W from the phosphoric acid liquid in the first storage tank 110 and moves horizontally above the second storage tank 120. The substrate holder 130 then lowers while holding the substrate W, immersing the substrate W in the rinse liquid in the second storage tank 120. This causes the substrate W to be rinsed. The substrate W is immersed in the rinse liquid in the second storage tank 120 for a predetermined period of time. In this specification, the period during which the substrate W is immersed in the rinse liquid in the second storage tank 120 may be referred to as a rinse liquid immersion period.

[0079] It should be noted that, as the substrate holder 130 lifts the substrate W out of the phosphoric acid solution in the first reservoir 110, the amount of phosphoric acid solution in the first reservoir 110 decreases.

[0080] In this embodiment, during a specific period of the rinse liquid immersion period, the rinse liquid in the second storage tank 120 is diverted to the first storage tank 110. For example, the rinse liquid diverter 140 supplies the rinse liquid in the second storage tank 120 to the first storage tank 110. The controller 182 opens the valve 142 and drives the pump 143, thereby allowing the rinse liquid in the second storage tank 120 to flow through the pipe 141 and be supplied to the first storage tank 110.

[0081] When the substrate W is immersed in the rinse liquid in the second storage tank 120, phosphoric acid liquid components flow out from the previously phosphoric acid-treated substrate W into the rinse liquid in the second storage tank 120. Therefore, by diverting the rinse liquid in the second storage tank 120 to the first storage tank 110, the phosphoric acid liquid components that flow out from the substrate W can be used in the first storage tank 110. Furthermore, by diverting the rinse liquid in the second storage tank 120 to the first storage tank 110, even if the phosphoric acid liquid in the first storage tank 110 decreases, the phosphoric acid liquid in the first storage tank 110 can be efficiently replenished.

[0082] 4(e), during a period after a specific period of the rinse liquid immersion period, the rinse liquid diversion unit 140 stops diverting the rinse liquid from the second storage tank 120 to the first storage tank 110. For example, the rinse liquid diversion unit 140 stops supplying the rinse liquid from the second storage tank 120 to the first storage tank 110. In one example, the control unit 182 closes the valve 142, thereby stopping the rinse liquid from the second storage tank 120 from flowing through the pipe 141 and being supplied to the first storage tank 110.

[0083] As time passes, the amount of phosphoric acid solution components flowing out from the substrate W into the rinse solution in the second storage tank 120 decreases. Therefore, by stopping the diversion of the rinse solution in the second storage tank 120 to the first storage tank 110, it is possible to prevent the concentration of the phosphoric acid solution in the first storage tank 110 from being excessively reduced by the rinse solution in the second storage tank 120.

[0084] According to this embodiment, the amount of phosphoric acid solution used in the phosphoric acid treatment can be efficiently reduced. By diverting the rinse solution from the second storage tank 120 to the first storage tank 110, the phosphoric acid solution components that have flowed from the substrate W can be utilized in the first storage tank 110. Furthermore, by diverting the rinse solution from the second storage tank 120 to the first storage tank 110, even if the phosphoric acid solution in the first storage tank 110 decreases, the phosphoric acid solution in the first storage tank 110 can be efficiently replenished. Furthermore, by subsequently stopping the diversion of the rinse solution from the second storage tank 120 to the first storage tank 110, the concentration of the phosphoric acid solution in the first storage tank 110 can be prevented from being excessively reduced by the rinse solution from the second storage tank 120.

[0085] Next, the substrate processing method of this embodiment will be described with reference to Figures 1 to 5. Figure 5 is a flow chart of the substrate processing method of this embodiment.

[0086] 5, in step S10, a phosphoric acid solution is supplied to the first storage tank 110. For example, a phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110. A diluent supply unit 114 supplies diluent to the first storage tank 110. The phosphoric acid and the diluent are mixed in the first storage tank 110 to generate a phosphoric acid solution.

[0087] In step S12, immersion of the substrate W in the phosphoric acid solution in the first storage tank 110 begins. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130, while holding the substrate W, descends into the first storage tank 110. As a result, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110, and phosphoric acid treatment of the substrate W begins.

[0088] During the phosphoric acid treatment, a phosphoric acid solution of a predetermined concentration may be supplied to the first storage tank 110. For example, the phosphoric acid supply unit 112 may supply phosphoric acid to the first storage tank 110, and the diluent supply unit 114 may supply the diluent to the first storage tank 110.

[0089] In step S14, the immersion of the substrate W in the phosphoric acid solution in the first storage tank 110 is terminated. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130 rises from within the first storage tank 110 while holding the substrate W.

[0090] In step S20, phosphoric acid solution is supplied to the second storage tank 120. For example, the rinse solution supply unit 122 supplies phosphoric acid to the second storage tank 120. Note that step S20 may be performed during step S12 and / or step S14. Alternatively, step S20 may be performed before step S12 or after step S14.

[0091] In step S22, the substrate W begins to be immersed in the rinse liquid in the second storage tank 120. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130, while holding the substrate W, descends into the second storage tank 120. As a result, the substrate W is immersed in the rinse liquid in the second storage tank 120, and the rinse process for the substrate W begins.

[0092] During the rinsing process, a rinse liquid may be supplied to the second storage tank 120. For example, the rinse liquid supply unit 122 may supply the rinse liquid to the second storage tank 120.

[0093] In step S24, the rinse liquid in the second storage tank 120 is diverted to the first storage tank 110. The rinse liquid diverter 140 diverts the rinse liquid in the second storage tank 120 to the first storage tank 110. In one example, the controller 182 opens the valve 142, causing the rinse liquid in the second storage tank 120 to flow through the pipe 141 and be supplied to the first storage tank 110.

[0094] In step S26, the rinse liquid in the second storage tank 120 is stopped from being diverted to the first storage tank 110. The rinse liquid diverter 140 stops diverting the rinse liquid in the second storage tank 120 to the first storage tank 110. In one example, the controller 182 closes the valve 142 to stop the rinse liquid in the second storage tank 120 from flowing through the pipe 141 and being supplied to the first storage tank 110.

[0095] In step S28, the immersion of the substrate W in the rinse liquid in the second storage tank 120 is completed. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130 rises from within the second storage tank 120 while holding the substrate W.

[0096] According to this embodiment, the substrate W is subjected to a phosphoric acid treatment and then a rinse treatment. The rinse liquid from the second storage tank 120 is supplied to the first storage tank 110 during a specific period of the rinse liquid immersion period, and then the supply of the rinse liquid from the second storage tank 120 to the first storage tank 110 is stopped. This makes it possible to efficiently reduce the amount of phosphoric acid liquid used in the phosphoric acid treatment.

[0097] The rinse liquid diversion unit 140 may supply the rinse liquid that overflows from the second storage tank 120 to the first storage tank 110.

[0098] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 6. Figure 6 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 6 has the same configuration as that described above with reference to Figure 2, except that a rinse liquid diversion unit 140 receives the rinse liquid that has overflowed from the second storage tank 120, a pipe 141 is connected to a pipe 114a of the dilution liquid supply unit 114, the phosphoric acid concentration of the rinse liquid that has overflowed from the second storage tank 120 is measured, and the pipe 141 is connected to the pipe 114a. Therefore, redundant description will be omitted to avoid redundancy.

[0099] 6, the rinse liquid diversion unit 140 further includes a rinse liquid receiving unit 146 in addition to the pipe 141, the valve 142, and the pump 143. The rinse liquid receiving unit 146 receives the rinse liquid that has overflowed from the second storage tank 120. For example, when the substrate W is immersed in the rinse liquid in the second storage tank 120, the rinse liquid receiving unit 146 receives the rinse liquid that has overflowed from the second storage tank 120.

[0100] The rinse liquid receiving section 146 is disposed vertically below the second storage tank 120. The width and length (length in the X and Y directions) of the rinse liquid receiving section 146 are preferably greater than the width and length of the second storage tank 120. However, the depth (length in the Z direction) of the rinse liquid receiving section 146 is preferably greater than the depth (length in the Z direction) of the second storage tank 120.

[0101] The rinse liquid received by the rinse liquid receiving unit 146 is supplied to the first storage tank 110 via the pipe 141. Here, the pipe 141 of the rinse liquid receiving unit 146 is connected to the pipe 114a of the dilution liquid supply unit 114.

[0102] The rinse liquid diversion unit 140 may further include a pipe 148a and a valve 148b. The pipe 148a connects the rinse liquid receiving unit 146 and a waste liquid mechanism. The pipe 148a is provided with a valve 148b. When the valve 148b is opened, the rinse liquid that has passed through the pipe 148a is supplied to the waste liquid mechanism. In this way, the rinse liquid in the rinse liquid receiving unit 146 can be discarded by the pipe 148a and the valve 148b.

[0103] When the rinse liquid diverter 140 diverts the rinse liquid from the second storage tank 120 to the first storage tank 110, the controller 182 opens the valve 142 and closes the valve 148b, so that the rinse liquid received by the rinse liquid receiving unit 146 from the second storage tank 120 flows through the pipe 141 and is supplied to the first storage tank 110. Thereafter, when the rinse liquid diverter 140 stops diverting the rinse liquid from the rinse liquid receiving unit 146 to the first storage tank 110, the controller 182 closes the valve 142 and opens the valve 148b, so that the rinse liquid from the rinse liquid receiving unit 146 flows through the pipe 148a and is discarded.

[0104] The rinse liquid diversion unit 140 may further include a concentration sensor 149 capable of detecting the concentration of phosphoric acid contained in the rinse liquid. For example, the control unit 182 may determine whether to divert the rinse liquid from the rinse liquid receiving unit 146 to the first storage tank 110 based on the detection result of the concentration sensor 149. Typically, when the phosphoric acid concentration in the rinse liquid detected by the concentration sensor 149 is higher than a threshold value, the control unit 182 determines to divert the rinse liquid from the rinse liquid receiving unit 146 to the first storage tank 110. On the other hand, when the phosphoric acid concentration in the rinse liquid detected by the concentration sensor 149 decreases to a value equal to or lower than the threshold value, the control unit 182 determines to stop diverting the rinse liquid from the rinse liquid receiving unit 146 to the first storage tank 110.

[0105] The concentration sensor 149 measures the phosphoric acid concentration in the rinse liquid stored in the second storage tank 120. For example, the concentration sensor 149 is attached to the rinse liquid receiving part 146. The concentration sensor 149 measures a value indicating the specific gravity of the rinse liquid stored in the rinse liquid receiving part 146. The concentration sensor 149 measures the back pressure of the rinse liquid receiving part 146.

[0106] For example, the tip of the concentration sensor 149 is disposed at a predetermined depth from the liquid surface of the rinse liquid receiving section 146. The concentration sensor 149 supplies gas to the tip of the concentration sensor 149 to form bubbles in the rinse liquid in the rinse liquid receiving section 146. As a result, the liquid pressure of the rinse liquid stored in the rinse liquid receiving section 146 is detected as the gas pressure at the tip of the concentration sensor 149, which is disposed at a predetermined depth from the liquid surface of the rinse liquid receiving section 146. Nitrogen gas is typically used as the gas. By measuring the relationship between the gas pressure and the phosphoric acid concentration of the rinse liquid in advance and creating a lookup table showing the relationship between the gas pressure and the rinse liquid in advance, the specific gravity of the rinse liquid can be measured according to the gas pressure at which bubbles are formed by the gas.

[0107] 6, the concentration sensor 149 measures the phosphoric acid concentration contained in the rinse liquid received by the rinse liquid receiving unit 146, but this embodiment is not limited to this. The concentration sensor 149 may measure the phosphoric acid concentration contained in the rinse liquid flowing through the pipe 141. In this case, the rinse liquid diversion unit 140 does not need to include the rinse liquid receiving unit 146.

[0108] 6, the rinse liquid diverter 140 supplies the rinse liquid received by the rinse liquid receiver 146 to the first storage tank 110, but this embodiment is not limited to this. The rinse liquid diverter 140 may supply the rinse liquid in the second storage tank 120 to the first storage tank 110.

[0109] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 7. Figure 7 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 7 has the same configuration as that described above with reference to Figure 6, except that the first storage tank 110 and the second storage tank 120 each have a double-tank structure, and a rinse liquid diversion unit 140 supplies the rinse liquid from the outer tank 120b of the second storage tank 120 to the first storage tank 110. Therefore, to avoid redundancy, repeated description will be omitted.

[0110] 7, the first storage tank 110 has a double-tank structure. The first storage tank 110 has an inner tank 110a and an outer tank 110b. The outer tank 110b surrounds the inner tank 110a. Both the inner tank 110a and the outer tank 110b have upper openings that open upward.

[0111] The inner bath 110a stores phosphoric acid solution and is configured to be able to accommodate multiple substrates W. The outer bath 110b is provided on the outer surface of the upper opening of the inner bath 110a. The height of the upper edge of the outer bath 110b is higher than the height of the upper edge of the inner bath 110a.

[0112] The inner bath 110a and the outer bath 110b each store a phosphoric acid solution. A plurality of substrates W are placed in the inner bath 110a. More specifically, a plurality of substrates W held by a substrate holder 130 are placed in the inner bath 110a. By being placed in the inner bath 110a, the plurality of substrates W are immersed in the phosphoric acid solution in the inner bath 110a.

[0113] The second reservoir 120 has a double reservoir structure. The second reservoir 120 has an inner reservoir 120a and an outer reservoir 120b. The outer reservoir 120b surrounds the inner reservoir 120a. Both the inner reservoir 120a and the outer reservoir 120b have upper openings that open upward.

[0114] The inner bath 120a is configured to store a rinse liquid and to be able to accommodate a plurality of substrates W. The outer bath 120b is provided on the outer surface of the upper opening of the inner bath 120a. The height of the upper edge of the outer bath 120b is higher than the height of the upper edge of the inner bath 120a.

[0115] The inner bath 120a and the outer bath 120b each store a rinse liquid. A plurality of substrates W are placed in the inner bath 120a. More specifically, the plurality of substrates W held by the substrate holder 130 are placed in the inner bath 120a. By being placed in the inner bath 120a, the plurality of substrates W are immersed in the rinse liquid in the inner bath 120a.

[0116] The rinse liquid diversion unit 140 has a pipe 141, a valve 142, and a pump 143. The rinse liquid in the second storage tank 120 is supplied to the first storage tank 110 via the pipe 141. One end of the pipe 141 is located in the outer tank 120b of the second storage tank 120, and the other end of the pipe 141 is connected to the pipe 114a. Therefore, the rinse liquid in the second storage tank 120 is supplied to the first storage tank 110 via the pipe 141 and the pipe 114a.

[0117] The pipe 141 is connected to the pipe 148a. The pipe 148a connects the pipe 141 to a waste liquid mechanism. The connection point between the pipe 141 and the pipe 148a is preferably located downstream of the pump 143.

[0118] A valve 148b is provided on the pipe 148a. When the valve 148b is opened, the rinse liquid that has passed through the pipe 148a is supplied to the waste liquid mechanism. In this way, the rinse liquid can be discarded by the pipe 148a and the valve 148b.

[0119] According to this embodiment, the rinse liquid in the outer tank 120b of the second storage tank 120 can be selectively diverted to the first storage tank 110.

[0120] 1 to 7, the rinse liquid diverted in the rinse liquid diverter 140 can be directly supplied to the first storage tank 110, but this embodiment is not limited to this. The rinse liquid diverted in the rinse liquid diverter 140 may be supplied to the first storage tank 110 via a circulation pipe that circulates the phosphoric acid liquid in the first storage tank 110.

[0121] In the substrate processing apparatus 100 shown in FIGS. 1 to 7, the rinse liquid supply unit 122 is located above the second storage tank 120, but this embodiment is not limited to this.

[0122] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 8. Figure 8 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 8 has the same configuration as that described above with reference to Figure 6 or Figure 7, except that the rinse liquid from the second storage tank 120 is supplied to the first storage tank 110 via a circulation pipe that circulates the phosphoric acid liquid in the first storage tank 110, the phosphoric acid liquid is discharged from the first storage tank 110, and the rinse liquid is supplied from within the second storage tank 120. Therefore, to avoid redundancy, redundant description will be omitted.

[0123] As shown in Figure 8, the first storage tank 110 has a double-tank structure. The first storage tank 110 has an inner tank 110a and an outer tank 110b. The outer tank 110b surrounds the inner tank 110a. Both the inner tank 110a and the outer tank 110b have upper openings that open upward.

[0124] The inner bath 110a stores phosphoric acid solution and is configured to be able to accommodate multiple substrates W. The outer bath 110b is provided on the outer surface of the upper opening of the inner bath 110a. The height of the upper edge of the outer bath 110b is higher than the height of the upper edge of the inner bath 110a.

[0125] The inner bath 110a and the outer bath 110b each store a phosphoric acid solution. A plurality of substrates W are placed in the inner bath 110a. More specifically, a plurality of substrates W held by a substrate holder 130 are placed in the inner bath 110a. By being placed in the inner bath 110a, the plurality of substrates W are immersed in the phosphoric acid solution in the inner bath 110a.

[0126] A circulation pipe 116 is connected to the first storage tank 110. The circulation pipe 116 circulates the phosphoric acid solution in the first storage tank 110 so that it flows out of the first storage tank 110 and returns to the first storage tank 110. The circulation pipe 116 connects the outer tank 110b to the lower part of the inner tank 110a.

[0127] A pump 116a is disposed in the circulation pipe 116. The pump 116a sends the phosphoric acid solution to the first storage tank 110. The circulation pipe 116 circulates the phosphoric acid solution in the first storage tank 110. When the phosphoric acid solution in the first storage tank 110 circulates through the circulation pipe 116, impurities in the phosphoric acid solution may be removed. Alternatively, when the phosphoric acid solution in the first storage tank 110 circulates through the circulation pipe 116, the phosphoric acid solution may be heated to a predetermined temperature.

[0128] The circulation pipe 116 is connected to a circulation liquid supply pipe 116t. The circulation pipe 116 guides the phosphoric acid solution that has flowed out of the first storage tank 110 back into the first storage tank 110. Specifically, the upstream end of the circulation pipe 116 is located in the outer tank 110b, and the downstream end of the circulation pipe 116 is located in the inner tank 110a. The downstream end of the circulation pipe 116 is connected to a circulation liquid supply pipe 116t located in the inner tank 110a.

[0129] The circulating liquid supply pipe 116t is disposed in the inner bath 110a. Here, the circulating liquid supply pipe 116t is disposed at the bottom of the inner bath 110a of the first storage tank 110. The circulating liquid supply pipe 116t supplies the circulated phosphoric acid solution to the inner bath 110a. Therefore, when the substrates W are immersed in the phosphoric acid solution in the inner bath 110a, an upflow can be formed in the inner bath 110a by supplying the phosphoric acid solution from the circulating liquid supply pipe 116t.

[0130] A drainage unit 118 is connected to the first storage tank 110. The drainage unit 118 allows the phosphoric acid solution in the first storage tank 110 to be discharged. Furthermore, the drainage unit 118 discharges the phosphoric acid solution stored in the first storage tank 110, and the phosphoric acid supply unit 112 and the diluent supply unit 114 supply phosphoric acid and diluent to the first storage tank 110, thereby allowing the phosphoric acid solution stored in the first storage tank 110 to be replaced with new phosphoric acid solution.

[0131] The drainage section 118 has a drainage pipe 118a and a valve 118b. The drainage pipe 118a and the valve 118b allow the phosphoric acid solution in the inner tank 110a to be discharged.

[0132] A drainage pipe 118a is connected to the bottom wall of the inner tank 110a. A valve 118b is disposed in the drainage pipe 118a. The valve 118b is opened and closed by the control device 180. When the valve 118b is opened, the phosphoric acid solution stored in the inner tank 110a is discharged to the outside through the drainage pipe 118a. The discharged phosphoric acid solution is sent to a wastewater treatment device (not shown) for treatment. It is preferable that the rinse solution in the second storage tank 120 can also be discharged, similar to the first storage tank 110.

[0133] The rinse liquid supply unit 122 includes a pipe 122a, a valve 122b, and a rinse liquid supply pipe 122t. The rinse liquid is discharged from the rinse liquid supply pipe 122t to the second storage tank 120. One end of the pipe 122a is connected to a rinse liquid supply source. A valve 122b is provided in the pipe 122a. The other end of the pipe 122a is provided with a rinse liquid supply pipe 122t. The valve 122b controls the supply of the rinse liquid to the second storage tank 120. When the valve 122b is opened under the control of the control device 180, the rinse liquid that has passed through the pipe 122a is supplied to the second storage tank 120 from the rinse liquid supply pipe 122t.

[0134] The rinse liquid supply pipe 122t is disposed in the second storage tank 120. The rinse liquid supply pipe 122t is disposed at the bottom of the second storage tank 120. Therefore, when the substrate W is immersed in the rinse liquid in the second storage tank 120, an upflow can be formed in the second storage tank 120 by supplying the rinse liquid from the rinse liquid supply pipe 122t.

[0135] In the substrate processing apparatus 100, the phosphoric acid treatment is preferably performed by immersing the substrate W in heated phosphoric acid. This allows the phosphoric acid treatment to be completed in a short period of time. Furthermore, the rinsing treatment is preferably performed by immersing the substrate W in a heated rinsing liquid. This prevents damage to the phosphoric acid-treated substrate W due to temperature changes and allows the rinsing treatment to be completed in a short period of time.

[0136] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 9. Figure 9 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 9 has the same configuration as that described above with reference to Figure 8, except that it is capable of performing high-temperature phosphoric acid processing and rinsing processing on substrates W and that it switches between different rinse liquids depending on the temperature of the rinse liquid. Therefore, to avoid redundancy, a duplicated description will be omitted.

[0137] 9, the phosphoric acid solution in the first storage tank 110 can be heated. Here, the substrate processing apparatus 100 further includes a filter 116b, a heater 116c, an adjustment valve 116d, and a valve 116e. In addition to the pump 116a, the circulation pipe 116 is also provided with the filter 116b, the heater 116c, the adjustment valve 116d, the valve 116e, and a circulating liquid supply pipe 116t. The pump 116a, the filter 116b, the heater 116c, the adjustment valve 116d, and the valve 116e are arranged in this order from upstream to downstream of the circulation pipe 116.

[0138] The circulation pipe 116 guides the phosphoric acid solution that has flowed out of the first storage tank 110 back into the first storage tank 110. Specifically, the upstream end of the circulation pipe 116 is located in the outer tank 110b, and the downstream end of the circulation pipe 116 is located in the inner tank 110a. The downstream end of the circulation pipe 116 is connected to a circulating liquid supply pipe 116t located in the inner tank 110a.

[0139] The pump 116a sends the phosphoric acid solution from the circulation pipe 116 to the circulation liquid supply pipe 116t. The filter 116b filters the phosphoric acid solution flowing through the circulation pipe 116. The filter 116b filters out foreign matter such as particles in the phosphoric acid solution flowing through the circulation pipe 116.

[0140] The heater 116c heats the phosphoric acid solution flowing through the circulation pipe 116. The heater 116c adjusts the temperature of the phosphoric acid solution. The heater 116c heats the phosphoric acid solution flowing through the circulation pipe 116 and adjusts it to a processing temperature. The processing temperature is, for example, about 160°C or higher and 200°C or lower. The heater 116c may be capable of measuring the temperature of the phosphoric acid solution as well as heating it. In this case, the heater 116c has both a heating unit and a temperature measuring unit.

[0141] The regulating valve 116d adjusts the opening of the circulation pipe 116 to adjust the flow rate of the phosphoric acid solution supplied to the circulating fluid supply pipe 116t. The regulating valve 116d adjusts the flow rate of the phosphoric acid solution. The regulating valve 116d includes a valve body (not shown) with a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position. The same applies to the other regulating valves. The valve 116e opens and closes the circulation pipe 116. The regulating valve 116d may be omitted. In this case, the flow rate of the phosphoric acid solution supplied to the circulating fluid supply pipe 116t is adjusted by controlling the pump 116a.

[0142] The circulating fluid supply pipe 116t is disposed in the inner tank 110a. Here, the circulating fluid supply pipe 116t is disposed at the bottom of the inner tank 110a of the first storage tank 110. The circulating fluid supply pipe 116t is disposed inside the inner tank 110a. The circulating fluid supply pipe 116t supplies the circulated phosphoric acid solution to the inner tank 110a.

[0143] In FIG. 9, one regulating valve 116d and one valve 116e are shown to avoid overly complicating the drawing, but a plurality of at least one of the regulating valves 116d and the valves 116e may be provided.

[0144] 9, the second storage tank 120 can store a heated rinse liquid. The rinse liquid supply unit 122 has a first rinse liquid supply unit 122p and a second rinse liquid supply unit 122q. The first rinse liquid supply unit 122p supplies the heated rinse liquid to the second storage tank 120. For example, the first rinse liquid supply unit 122p supplies the rinse liquid heated to a temperature of 45° C. or higher and 70° C. or lower to the second storage tank 120. The second rinse liquid supply unit 122q supplies the rinse liquid at room temperature to the second storage tank 120.

[0145] The first rinse liquid supply unit 122p includes a pipe 122a1, a valve 122b1, and a heater 122c. The pipe 122a1 is connected to a rinse liquid supply source. The pipe 122a1 is provided with a valve 122b1 and a heater 122c. The valve 122b1 can control the supply of the rinse liquid to the second storage tank 120. The heater 122c adjusts the temperature of the rinse liquid. The heater 122c heats the rinse liquid flowing through the pipe 122a1 and adjusts the temperature of the rinse liquid to (for example, approximately 60°C to 80°C).

[0146] The second rinse liquid supply unit 122q includes a pipe 122a2 and a valve 122b2. The rinse liquid is discharged from one end of the pipe 122a2 to the second storage tank 120. The pipe 122a2 is connected to a rinse liquid supply source. A valve 122b2 is disposed on the pipe 122a2. The supply of the rinse liquid to the second storage tank 120 can be controlled by the valve 122b2.

[0147] One end of the pipe 122a is connected to the pipes 122a1 and 122a2. The other end of the pipe 122a is connected to a rinse liquid supply pipe 122t. The rinse liquid is supplied to the second storage tank 120 from the rinse liquid supply pipe 122t.

[0148] For example, while the rinse liquid diversion unit 140 supplies the rinse liquid from the second storage tank 120 to the first storage tank 110 during a specific period of the rinse liquid immersion period, the first rinse liquid supply unit 122p may supply heated rinse liquid to the second storage tank 120. The first rinse liquid supply unit 122p may supply heated rinse liquid to the second storage tank 120 before the specific period. The first rinse liquid supply unit 122p may also supply heated rinse liquid to the second storage tank 120 during the specific period.

[0149] On the other hand, when the rinse liquid diversion unit 140 stops supplying the rinse liquid from the second storage tank 120 to the first storage tank 110 during a specific period of the rinse liquid immersion period, the second rinse liquid supply unit 122q may supply the rinse liquid to the second storage tank 120. Furthermore, the second rinse liquid supply unit 122q may supply unheated rinse liquid to the second storage tank 120 after the specific period.

[0150] In FIG. 9, the pipes 122a1 and 122a2 are connected to the rinse liquid supply pipe 122t via the pipe 122a, but the pipe 122a1 may be separated from the pipe 122a2 and connected to the rinse liquid supply pipe 122t.

[0151] The rinse liquid diverter 140 may further include a temperature sensor 149a capable of detecting the temperature of the rinse liquid. For example, the controller 182 may determine whether to divert the rinse liquid from the rinse liquid receiver 146 to the first storage tank 110 based on the detection result of the temperature sensor 149a. Typically, when the temperature of the rinse liquid detected by the temperature sensor 149a is higher than a threshold, the controller 182 determines to divert the rinse liquid from the rinse liquid receiver 146 to the first storage tank 110. On the other hand, when the temperature of the rinse liquid detected by the temperature sensor 149a drops to or below the threshold, the controller 182 determines to stop diverting the rinse liquid from the rinse liquid receiver 146 to the first storage tank 110.

[0152] 6, 8, and 9, the rinse liquid diversion unit 140 includes a rinse liquid receiving unit 146 that receives the rinse liquid overflowing from the second storage tank 120, and the rinse liquid in the rinse liquid receiving unit 146 flows from the rinse liquid receiving unit 146 to the first storage tank 110 or the circulation pipe 116. However, this embodiment is not limited to this. The rinse liquid in the rinse liquid receiving unit 146 may flow from the rinse liquid receiving unit 146 to the first storage tank 110 or the circulation pipe 116 via a tank that stores the rinse liquid.

[0153] 6, 8, and 9, the rinse liquid is discarded after the rinse liquid diverter 140 stops diverting the rinse liquid to the first storage tank 110, but this embodiment is not limited to this. Even after the rinse liquid diverter 140 stops diverting the rinse liquid to the first storage tank 110, the rinse liquid diverter 140 may continue to use the rinse liquid for another purpose.

[0154] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 10. Figure 10 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 10 has the same configuration as that described above with reference to Figure 9, except that the rinse liquid diversion unit 140 further includes a storage tank 147 and reuses the rinse liquid according to the conductivity of the rinse liquid. Therefore, to avoid redundancy, a duplicated description will be omitted.

[0155] 10 , the rinse liquid diversion unit 140 further includes a storage tank 147. The storage tank 147 stores the rinse liquid between the rinse liquid receiving unit 146 and the circulation pipe 116. A valve 142a is disposed between the storage tank 147 and the rinse liquid receiving unit 146, and a valve 142b is disposed between the storage tank 147 and the circulation pipe 116. The storage tank 147, the valve 142a, and the valve 142b temporarily store the rinse liquid in the rinse liquid receiving unit 146 until it is supplied to the first storage tank 110 via the circulation pipe 116. This allows the timing of flowing the rinse liquid through the circulation pipe 116 to be adjusted as needed.

[0156] A conductivity meter 145 is disposed in the pipe 141. The conductivity meter 145 can measure the conductivity of the rinse liquid. For example, after a predetermined time has elapsed during the rinse liquid immersion period, almost no phosphoric acid liquid components flow out from the substrate W. Therefore, the rinse liquid in the second storage tank 120 contains almost no impurities, and the rinse liquid in the second storage tank 120 can be reused as a new rinse liquid. For example, by measuring the conductivity of the rinse liquid, it can be determined whether the rinse liquid needs to be reused.

[0157] The rinse liquid diversion unit 140 further includes a pipe 148p and a valve 148q. The pipe 148p connects the pipe 141 and the rinse liquid supply mechanism. The valve 148q is disposed in the pipe 148p. When the valve 148q is opened, the rinse liquid that has passed through the pipe 148p is supplied to the rinse liquid supply mechanism. For example, the rinse liquid in the second storage tank 120 can be reused by opening the valve 148q depending on the conductivity of the rinse liquid.

[0158] 1 to 10, the rinsing process is performed in the second storage tank 120, but this embodiment is not limited to this. In addition to the rinsing process, another process may be performed in the second storage tank 120.

[0159] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 11. Figure 11 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 11 has the same configuration as that described above with reference to Figure 10, except that a processing liquid other than a rinse liquid is supplied to the second storage tank 120, and therefore, redundant description will be omitted to avoid redundancy.

[0160] 10, not only the rinse liquid but also a first component liquid and a second component liquid are supplied to the second storage tank 120. For example, ammonia is supplied to the second storage tank 120 as the first component liquid, and hydrogen peroxide solution is supplied as the second component liquid.

[0161] The substrate processing apparatus 100 further includes a first component liquid supply unit 123 and a second component liquid supply unit 124. The first component liquid supply unit 123 includes a pipe 123a and a valve 123b. One end of the pipe 123a is connected to a first component liquid supply source. A valve 123b is disposed on the pipe 123a. The other end of the pipe 123a is connected to a pipe 122a. The valve 123b controls the supply of the first component liquid to the second storage tank 120 via the pipes 123a and 122a. When the valve 123b is opened under the control of the control device 180, the first component liquid that has passed through the pipes 123a and 122a is supplied to the second storage tank 120.

[0162] The second component liquid supply unit 124 includes a pipe 124a and a valve 124b. One end of the pipe 124a is connected to a second component liquid supply source. A valve 124b is disposed in the pipe 124a. The other end of the pipe 124a is connected to the pipe 122a. The valve 124b controls the supply of the second component liquid to the second storage tank 120 via the pipes 124a and 122a. When the valve 124b is opened under the control of the control device 180, the second component liquid that has passed through the pipes 124a and 122a is supplied to the second storage tank 120.

[0163] Here, the first component liquid supply unit 123 and the second component liquid supply unit 124 supply the first component liquid and the second component liquid to the second storage tank 120. This allows the second storage tank 120 to not only rinse the substrate W but also perform chemical liquid processing on the substrate W.

[0164] It is preferable that a storage tank for storing heated phosphoric acid liquid is disposed in the circulation pipe 116. It is also preferable that a rinse liquid is sprayed onto the substrate W above the second storage tank 120.

[0165] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 12. Figure 12 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 12 has the same configuration as that described above with reference to Figure 11, except that a temperature-controlled tank for storing heated phosphoric acid liquid is arranged in the circulation pipe 116, and a rinsing liquid is sprayed onto the substrates W above the second storage tank 120. Therefore, redundant description will be omitted to avoid redundancy.

[0166] 12, the substrate processing apparatus 100 further includes a temperature-adjusted tank 116f. The temperature-adjusted tank 116f is disposed on the circulation pipe 116. This allows the temperature-adjusted tank 116f to store heated phosphoric acid solution. The storage tank 147 is preferably disposed adjacent to the temperature-adjusted tank 116f. For example, the storage tank 147 is preferably disposed within a distance of 2 m from the temperature-adjusted tank 116f. This allows the temperature of the rinse solution stored in the storage tank 147 to be maintained at a high temperature.

[0167] Furthermore, it is preferable to arrange a rinse liquid jet outlet 122f and a rinse liquid jet outlet 122g above the second storage tank 120. The rinse liquid jet outlets 122f and 122g can jet the rinse liquid onto the substrate W before or after it is immersed in the rinse liquid in the second storage tank 120.

[0168] Next, the substrate processing method of this embodiment will be described with reference to Figures 1 to 14. Figures 13(a) to 14(c) are schematic views for explaining the substrate processing method of this embodiment.

[0169] 13(a), the substrate holding unit 130 holds the substrate W above the first storage tank 110. The substrate holding unit 130 may receive the substrate W from another substrate holding mechanism above the first storage tank 110. Alternatively, the substrate holding unit 130 may move to above the first storage tank 110 while holding the substrate W.

[0170] 13(b), the substrate holding unit 130 immerses the substrate W in the phosphoric acid solution in the first storage tank 110. The control unit 182 controls the substrate holding unit 130 so that the substrate W is immersed in the phosphoric acid solution in the first storage tank 110 by lowering the substrate W while the substrate holding unit 130 holds the substrate W.

[0171] 13(c), the substrate holding unit 130 lifts the substrate W from the phosphoric acid solution in the first storage tank 110. The control unit 182 controls the substrate holding unit 130 so that the substrate W is lifted out of the phosphoric acid solution in the first storage tank 110 by raising the substrate W while the substrate holding unit 130 holds the substrate W.

[0172] At this time, the rinse liquid in the second reservoir 120 may be discarded.

[0173] 13(d), the substrate holding unit 130 holds the substrate W above the second storage tank 120. The substrate holding unit 130 may receive the substrate W from another substrate holding mechanism above the second storage tank 120. Alternatively, the substrate holding unit 130 may move to above the second storage tank 120 while holding the substrate W.

[0174] At this time, a rinse liquid may be supplied to the second storage tank 120. In this case, it is preferable that the rinse liquid supplied to the second storage tank 120 is heated.

[0175] 14(a), the substrate holding unit 130 immerses the substrate W in the rinse liquid in the second storage tank 120. The control unit 182 controls the substrate holding unit 130 so that the substrate W is immersed in the rinse liquid in the second storage tank 120 by the substrate holding unit 130 being lowered while holding the substrate W.

[0176] Here, when the substrate W is immersed in the rinse liquid in the second storage tank 120, the rinse liquid overflows from the second storage tank 120. When the substrate W is treated with high-temperature phosphoric acid, the temperature of the rinse liquid in the second storage tank 120 also rises. The rinse liquid receiving unit 146 receives the rinse liquid that overflows from the second storage tank 120. The rinse liquid in the second storage tank 120 is supplied to the first storage tank 110 via the rinse liquid receiving unit 146, the storage tank 147, and the circulation pipe 116. The rinse liquid in the second storage tank 120 may be temporarily stored in the rinse liquid receiving unit 146 and / or the storage tank 147, and then supplied to the first storage tank 110 at a predetermined timing.

[0177] At this time, a rinse liquid may be supplied to the second storage tank 120. In this case, it is preferable that the rinse liquid supplied to the second storage tank 120 is heated.

[0178] 14(b), the substrate holding unit 130 maintains the substrate W immersed in the rinse liquid of the second storage tank 120. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130 maintains the substrate W immersed in the rinse liquid of the second storage tank 120. Note that after a predetermined period of time has elapsed since the substrate W was immersed in the rinse liquid of the second storage tank 120, the rinse liquid of the rinse liquid receiving unit 146 is not supplied to the first storage tank 110. For example, the rinse liquid of the rinse liquid receiving unit 146 may be discarded.

[0179] At this time, a rinse liquid may be supplied to the second storage tank 120. In this case, the rinse liquid supplied to the second storage tank 120 may not be heated.

[0180] 14(c), the substrate holding unit 130 rises to lift the substrate W from the rinse liquid in the second storage tank 120. The control unit 182 controls the substrate holding unit 130 so that the substrate holding unit 130 rises while holding the substrate W, thereby lifting the substrate W from the rinse liquid in the second storage tank 120. At this time, the rinse liquid is sprayed onto the substrate W from the rinse liquid spray ports 122f, 122g.

[0181] Thereafter, the rinse liquid may be discharged from the second storage tank 120 and another chemical liquid may be supplied to the second storage tank 120, and the substrate W may be subjected to another chemical liquid treatment.

[0182] According to this embodiment, the rinse liquid in the second storage tank 120 for a specific period is stored in the storage tank 147. This allows the rinse liquid with a high phosphoric acid concentration and high temperature to be effectively supplied to the first storage tank 110.

[0183] Next, a substrate processing system 10 including the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 15. Fig. 15 is a schematic diagram of the substrate processing system 10 including the substrate processing apparatus 100 of this embodiment. The substrate processing system 10 shown in Fig. 15 includes a first substrate processing apparatus 100A to a third substrate processing apparatus 100C.

[0184] As shown in FIG. 15, the substrate processing system 10 includes an input section 20, multiple storage sections 30, a transfer mechanism 40, a discharge section 50, a buffer unit BU, a first transport device CTC, a second transport device WTR, a drying processing device 60, multiple substrate processing devices 100, and a control device 180.

[0185] The plurality of substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The drying processing apparatus 60, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in a line. For example, the drying processing apparatus 60, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged adjacent to the transport path of the first transfer apparatus CTC in the following order from the closest to the transport path of the first transfer apparatus CTC: drying processing apparatus 60, first substrate processing apparatus 100A, second substrate processing apparatus 100B, and third substrate processing apparatus 100C.

[0186] Here, each of the first to third substrate processing apparatuses 100A to 100C includes a first storage tank 110 that stores a phosphoric acid solution, a second storage tank 120 that stores a rinse solution at least for a certain period of time, and a substrate holding unit 130. Here, the substrate holding units 130 in the first to third substrate processing apparatuses 100A to 100C may be referred to as substrate holding units 130A to 130C. Substrates W that have undergone different processes may be loaded into each of the first to third substrate processing apparatuses 100A to 100C.

[0187] The substrates W to be processed in the substrate processing apparatus 100 are loaded through an input section 20. The input section 20 includes a plurality of mounting tables 22. The substrates W processed in the substrate processing apparatus 100 are unloaded through an output section 50. The output section 50 includes a plurality of mounting tables 52.

[0188] The storage units 30 that house substrates W are placed on the input unit 20. The storage units 30 placed on the input unit 20 store substrates W that have not been processed by the substrate processing apparatus 100. Here, the two storage units 30 are placed on the two mounting tables 22, respectively.

[0189] Each of the plurality of storage units 30 stores a plurality of substrates W. Each substrate W is stored in the storage unit 30 in a horizontal position. The storage unit 30 is, for example, a FOUP (Front Opening Unified Pod).

[0190] The storage units 30 placed on the discharge unit 50 store the substrates W processed by the substrate processing apparatus 100. The discharge unit 50 includes a plurality of mounting tables 52. The two storage units 30 are each placed on two mounting tables 52. The discharge unit 50 stores the processed substrates W in the storage units 30 and discharges the storage units 30 together.

[0191] The buffer unit BU is arranged adjacent to the input section 20 and the discharge section 50. The buffer unit BU takes in the storage section 30 placed in the input section 20 together with the substrate W, and places the storage section 30 on a shelf (not shown). The buffer unit BU also receives the processed substrate W and stores it in the storage section 30, and places the storage section 30 on the shelf. A transfer mechanism 40 is arranged inside the buffer unit BU.

[0192] The transfer mechanism 40 transfers the storage unit 30 between the input unit 20 and the output unit 50 and the shelves. The transfer mechanism 40 also transfers only the substrates W to the first transport device CTC. In other words, the transfer mechanism 40 transfers the lot of substrates W to the first transport device CTC.

[0193] After receiving a lot of unprocessed substrates W from the transfer mechanism 40, the first transfer device CTC converts the orientation of the substrates W from a horizontal orientation to a vertical orientation and transfers the substrates W to the second transfer device WTR. Furthermore, after receiving a lot of processed substrates W from the second transfer device WTR, the first transfer device CTC converts the orientation of the substrates W from a vertical orientation to a horizontal orientation and transfers the lot of substrates W to the transfer mechanism 40.

[0194] The second transfer device WTR is movable from the third substrate processing apparatus 100C to the second substrate processing apparatus 100B along the longitudinal direction of the substrate processing system 10. The second transfer device WTR can transfer lots of substrates W to and from the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C. Specifically, the second transfer device WTR transfers the substrates W to the substrate holders 130A to 130C of the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C, and the substrates W are subjected to phosphoric acid treatment and rinsing treatment by the substrate holders 130A to 130C, respectively.

[0195] 1 to 15, the embodiment has been described in which the rinse liquid in the second storage tank 120 of the substrate processing apparatus 100 is diverted to the first storage tank 110 of the same substrate processing apparatus 100, but the present embodiment is not limited to this. The rinse liquid in the second storage tank 120 may be diverted to the first storage tank 110 of another substrate processing apparatus 100. Furthermore, the rinse liquid in the second storage tank 120 may be diverted to a first storage tank 110 other than the first storage tank 110 that processed the substrate W immersed in the rinse liquid in the second storage tank 120.

[0196] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual thickness, length, number, spacing, etc. of each component shown in the above embodiments due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention. [Industrial Applicability]

[0197] The present invention is suitably used in a substrate processing apparatus and a substrate processing method. [Explanation of symbols]

[0198] 100 Substrate processing apparatus 110 1st storage tank 112 Phosphoric acid supply section 114 Diluent supply unit 120 Second storage tank 122 Rinse liquid supply unit 130 Board holding part 140 Rinse liquid diversion section W substrate

Claims

1. a first storage tank for storing phosphoric acid solution; a second storage tank for storing a rinse liquid; a substrate holder that holds a substrate and descends to immerse the substrate in the rinse liquid in the second reservoir; a rinse liquid diversion unit that supplies the rinse liquid from the second storage tank to the first storage tank during a specific period of a rinse liquid immersion period in which the substrate is immersed in the rinse liquid in the second storage tank, and stops supplying the rinse liquid from the second storage tank to the first storage tank during a period after the specific period of the rinse liquid immersion period; A substrate processing apparatus comprising:

2. The phosphoric acid solution in the first storage tank is circulated by a circulation pipe that flows out of the first storage tank and returns to the first storage tank. The substrate processing apparatus according to claim 1 , wherein the rinse liquid diverter supplies the rinse liquid from the second reservoir tank to the first reservoir tank via the circulation pipe.

3. a phosphoric acid supply unit that supplies phosphoric acid to the first storage tank; a diluent supply unit that supplies a diluent to the first storage tank; a rinse liquid supply unit that supplies a rinse liquid to the second storage tank; The substrate processing apparatus of claim 2 , further comprising:

4. Further, a heater is provided to heat the phosphoric acid solution flowing through the circulation pipe. The substrate processing apparatus of claim 3 , wherein the rinse liquid supply unit heats the rinse liquid and supplies it to the second storage tank before the specific period, and supplies the rinse liquid to the second storage tank without heating it after the specific period.

5. The substrate processing apparatus according to claim 4 , wherein the rinse liquid diversion unit includes a storage tank that stores at least a portion of the rinse liquid in the second storage tank for the specific period.

6. Further comprising a temperature control tank disposed in the circulation pipe, The substrate processing apparatus according to claim 5 , wherein the storage tank is disposed adjacent to the temperature adjustment tank.

7. immersing the substrate in a phosphoric acid solution stored in a first storage tank; immersing the substrate in the rinse liquid stored in the second storage tank; a diversion step of supplying the rinse liquid from the second storage tank to the first storage tank during a specific period of a rinse liquid immersion period during which the substrate is immersed in the rinse liquid; a diversion stopping step of stopping the supply of the rinse liquid from the second storage tank to the first storage tank during a period after the specific period of the rinse liquid immersion period; A substrate processing method comprising:

8. The method further includes a step of circulating the phosphoric acid solution in the first storage tank through a circulation pipe through which the phosphoric acid solution flows out of the first storage tank and returns to the first storage tank, The substrate processing method according to claim 7 , wherein the diverting step supplies the rinse liquid in the second storage tank to the first storage tank via the circulation pipe.

9. supplying phosphoric acid to the first reservoir; supplying a diluent to the first reservoir; supplying a rinse liquid to the second reservoir; The substrate processing method of claim 8 , further comprising:

10. The method further comprises a step of heating the phosphoric acid solution flowing through the circulation pipe, 10. The substrate processing method according to claim 9, wherein, in the step of supplying the rinse liquid, the rinse liquid is heated and supplied to the second storage tank before the specific period, and the rinse liquid is supplied to the second storage tank without being heated after the specific period.

11. The substrate processing method according to claim 10 , wherein the diversion step includes a step of storing the rinse liquid in the second storage tank in a storage tank for the specific period.

12. The method further includes a step of storing the phosphoric acid solution flowing through the circulation pipe in a temperature-controlled tank, The substrate processing method according to claim 11 , wherein the storage tank is disposed adjacent to the temperature-regulating tank.

Images