Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of reducing unintended impacts on processing being performed on a substrate.SOLUTION: A substrate processing apparatus includes: a cup 1 capable of storing a process liquid 92 for processing a substrate 91; a stage 2 capable of being lifted and lowered along a lifting / lowering shaft 31 extending in a vertical direction z in the cup 1; a mounting base 4 provided on the stage 2 to mount the substrate 91; and a pivot member 5 which is mounted pivotally with respect to the mounting base 4 around a pivot shaft 51, the pivot shaft extending along a circumferential direction θ about the lifting / lowering shaft 31. The pivot member 5 includes a holding portion 52 positioned on the inside of the pivot shaft 51 in a radial direction r, and an abutting portion 53 positioned on the outside of the pivot shaft 51 in the radial direction r. As the stage 2 is lowered, the abutting portion 53 abuts on the cup 1 to pivot the pivot member 5, and thereby the interval between the holding portion 52 and the mounting base 4, with the substrate 91 sandwiched therebetween, decreases.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Various substrate processing apparatuses have been proposed that perform predetermined processes on substrates made of semiconductors such as silicon (Si). Patent Document 1 discloses an example of a conventional substrate processing apparatus. The substrate processing apparatus disclosed in this document is an apparatus that performs a lift-off process, which simultaneously removes a resist layer formed on a substrate and a metal layer deposited on the resist layer. This substrate processing apparatus includes a cup, a mounting table, and a rotating member. The cup stores a processing liquid for the lift-off process. The mounting table is disposed within the cup and is used to mount the substrate. The mounting table is capable of rising and lowering relative to the cup. The rotating member is rotatably supported relative to the mounting table. An abutting member is provided within the cup. When the mounting table is lowered with a substrate placed thereon, the rotating member abuts against the abutting member. This causes the rotating member to rotate, and the substrate is held between the mounting table and the rotating member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 2017-147354 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the contact member may unduly disrupt the flow of the processing liquid in the cup. Alternatively, the resist layer or metal layer removed by the lift-off process may adhere to the contact member. Thus, there is a problem in that the contact member may have an unintended effect on the processing of the substrate.

[0005] The present invention has been devised in light of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus that can reduce unintended effects on processing of substrates. [Means for solving the problem]

[0006] The substrate processing apparatus provided by the present invention comprises a cup capable of storing processing liquid for processing a substrate, a stage capable of rising and falling along an elevation axis extending vertically within the cup, a loading table provided on the stage for placing the substrate thereon, and a rotating member attached to the loading table so as to be rotatable around a rotation axis extending circumferentially around the elevation axis, the rotating member having a holding portion located radially inward from the rotation axis and an abutting portion located radially outward from the rotation axis, and as the stage descends, the abutting portion abuts against the cup, causing the rotating member to rotate and reducing the distance between the holding portion and the loading table across the substrate.

[0007] In a preferred embodiment of the present invention, the cup rotates around the lifting shaft to discharge the treatment liquid radially outward.

[0008] In a preferred embodiment of the present invention, the cup has an upper end, a side portion connected to the upper end, and a bottom portion connected below the side portion, and the entire bottom portion is included inside the upper end when viewed vertically.

[0009] In a preferred embodiment of the present invention, the abutting portion abuts against the upper end portion.

[0010] In a preferred embodiment of the present invention, the abutting portion abuts against the side surface portion.

[0011] In a preferred embodiment of the present invention, the abutment portion has an extension portion extending from the pivot axis and a protrusion portion connected to an adjustment portion provided on the extension portion, and the protrusion portion abuts against the upper end portion.

[0012] In a preferred embodiment of the present invention, the abutment portion has an extension portion extending from the rotation axis and a protrusion portion screwed into an adjustment portion provided on the extension portion, and as the stage descends, the extension portion abuts against the upper end portion, and then the protrusion abuts against the side portion.

[0013] In a preferred embodiment of the present invention, when the substrate is processed, the liquid level of the processing liquid is located above the substrate.

[0014] In a preferred embodiment of the present invention, the lifting shaft is covered by a bellows member within the cup. [Effects of the Invention]

[0015] According to the present invention, unintended effects on processing of a substrate can be reduced.

[0016] Other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a plan view of a main part of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view of a main part taken along line II-II in FIG. [Figure 3] 1 is an enlarged cross-sectional view showing a main part of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 4] 4 is a cross-sectional view of a main part illustrating an operation of the substrate processing apparatus according to the first embodiment of the present invention. FIG. [Figure 5] 5A to 5C are enlarged cross-sectional views of essential parts illustrating the operation of the substrate processing apparatus according to the first embodiment of the present invention. [Figure 6] 4 is a cross-sectional view of a main part illustrating an operation of the substrate processing apparatus according to the first embodiment of the present invention. FIG. [Figure 7] 5A to 5C are enlarged cross-sectional views of essential parts illustrating the operation of the substrate processing apparatus according to the first embodiment of the present invention. [Figure 8] 4 is a cross-sectional view of a main part illustrating an operation of the substrate processing apparatus according to the first embodiment of the present invention. FIG. [Figure 9] 4 is a cross-sectional view of a main part illustrating an operation of the substrate processing apparatus according to the first embodiment of the present invention. FIG. [Figure 10] FIG. 10 is a cross-sectional view showing a main part of a substrate processing apparatus according to a second embodiment of the present invention. [Figure 11] FIG. 10 is an enlarged cross-sectional view showing a main part of a substrate processing apparatus according to a second embodiment of the present invention. [Figure 12] 10A and 10B are cross-sectional views of a main part illustrating the operation of a substrate processing apparatus according to a second embodiment of the present invention. [Figure 13] 10A and 10B are enlarged cross-sectional views of essential parts showing the operation of the substrate processing apparatus according to the second embodiment of the present invention. [Figure 14] 10A and 10B are cross-sectional views of a main part illustrating the operation of a substrate processing apparatus according to a second embodiment of the present invention. [Figure 15] 10A and 10B are enlarged cross-sectional views of essential parts showing the operation of the substrate processing apparatus according to the second embodiment of the present invention. [Figure 16] 10A and 10B are enlarged cross-sectional views of essential parts showing the operation of a substrate processing apparatus according to a third embodiment of the present invention. [Figure 17] 10A and 10B are enlarged cross-sectional views of essential parts showing the operation of a substrate processing apparatus according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] Preferred embodiments of the present invention will now be described in detail with reference to the drawings.

[0019] The terms "first," "second," "third," etc. in this disclosure are used for identification purposes only and are not intended to impose any ranking on their objects.

[0020] First Embodiment 1 to 9 show a substrate processing apparatus according to a first embodiment of the present invention. The substrate processing apparatus A1 of this embodiment includes a cup 1, a stage 2, a drive unit 3, a mounting table 4, a rotating member 5, and a drain chamber 6. The type of processing performed on a substrate 91 by the substrate processing apparatus according to the present invention is not limited in any way. Hereinafter, a configuration for performing a lift-off process, which simultaneously removes a resist layer formed on the substrate 91 and a metal layer laminated on the resist layer, will be described as an example. In addition to the lift-off process, other processing performed on the substrate 91 includes, for example, a process in which the substrate 91 is submerged in a processing liquid 92 stored in the cup 1 for a long period of time, causing the resist layer to swell and dissolve.

[0021] FIG. 1 is a plan view of a main portion of the substrate processing apparatus A1. FIG. 2 is a cross-sectional view of a main portion taken along line II-II in FIG. 1. FIG. 3 is an enlarged cross-sectional view of a main portion of the substrate processing apparatus A1. FIG. 4 is a cross-sectional view of a main portion showing the operation of the substrate processing apparatus A1. FIG. 5 is an enlarged cross-sectional view of a main portion showing the operation of the substrate processing apparatus A1. FIG. 6 is a cross-sectional view of a main portion showing the operation of the substrate processing apparatus A1. FIG. 7 is an enlarged cross-sectional view of a main portion showing the operation of the substrate processing apparatus A1. FIGS. 8 and 9 are cross-sectional views of a main portion showing the operation of the substrate processing apparatus A1. In these figures, the vertical direction z is the direction in which the stage 2 moves up and down. The circumferential direction θ is the circumferential direction about an elevation shaft 31 extending in the vertical direction z (described later), and the radial direction r is the radial direction about the elevation shaft 31. FIGS. 2 to 4 show a state in which the stage 2 is positioned at the upper end during elevation of the stage 2 (described later). FIGS. 6 to 8 show a state in which the stage 2 is positioned at the lower end.

[0022] [1 cup] The cup 1 is capable of storing a processing liquid 92 for processing a substrate 91. The shape and material of the cup 1 are not limited in any way. The cup 1 is made of a metal such as stainless steel. As shown in FIGS. 1 and 2 , the cup 1 of this embodiment has an upper end 11, a side surface 12, and a bottom surface 13. In the illustrated example, the cup 1 further has an outer wall 14. Note that the cup 1 capable of storing the processing liquid 92 is not limited to a cup used for storing a fixed amount of the processing liquid 92 for a predetermined period of time, but also includes a cup used for, for example, a cup in which the processing liquid 92 is constantly supplied to the cup 1 in a predetermined process, temporarily retained in the cup 1, and then sequentially discharged.

[0023] The upper end 11 is a portion of the cup 1 that is located at the upper end in the vertical direction z. The specific shape of the upper end 11 is not limited in any way, and in the illustrated example, it is a circular plate-like portion. In the state shown in FIGS. 2 and 3, the upper end 11 is located below the protrusion 532 of the rotating member 5 in the vertical direction z, and overlaps with the protrusion 532 when viewed along the vertical direction z. As will be described later, the specific configuration of the protrusion 532 is not limited in any way.

[0024] The side portion 12 extends downward in the vertical direction z from the upper end portion 11. The height of the side portion 12 in the vertical direction z is set to a height that can accommodate the stage 2, the drive unit 3, the mounting table 4, and the rotating member 5. The height of the side portion 12 in the vertical direction z is set to a height that can maintain the liquid level of the processing liquid 92 at a predetermined height relative to the substrate 91. In the illustrated example, the side portion 12 is a tapered inclined portion whose dimension in the radial direction r decreases from above to below in the vertical direction z. The side portion 12 has a circular ring shape when viewed along the vertical direction z. The inclination angle of the side portion 12 is not limited in any way and is, for example, an angle of approximately 30° to 75° with respect to the horizontal plane (a plane that includes the radial direction r and the circumferential direction θ), and in the illustrated example, is an angle of approximately 60° with respect to the horizontal plane.

[0025] The bottom surface portion 13 is connected to the side surface portion 12 below in the vertical direction z. The shape of the bottom surface portion 13 is not limited in any way, and in the illustrated example, it is circular. The entire bottom surface portion 13 is contained inside the upper end portion 11 when viewed along the vertical direction z. In the illustrated example, the upper end portion 11 is annular and the bottom surface portion 13 is circular, so that the inner diameter of the upper end portion 11 is larger than the outer diameter of the bottom surface portion 13 when viewed along the vertical direction z. An opening is provided in the center of the bottom surface portion 13 for inserting the lifting shaft 31 described below.

[0026] The outer wall portion 14 is connected to the outer peripheral edge of the upper end portion 11 in the radial direction r, and extends downward in the vertical direction z from the upper end portion 11. The outer wall portion 14 has a cylindrical shape and its height in the vertical direction z is lower than that of the side portion 12.

[0027] [Stage 2] The stage 2 is capable of moving up and down in the cup 1 in the vertical direction z, and supports a mounting table 4. The specific configuration of the stage 2 is not limited in any way, and in the illustrated example, the stage 2 has a base 21 and a disk portion 22.

[0028] The base 21 is a portion fixed to the upper end of the lifting shaft 31, which will be described later. The base 21 is made of, for example, a metal such as stainless steel, or a resin. The disk portion 22 is fixed to the base 21 and extends from the base 21 in the radial direction r. The disk portion 22 is, for example, a circular plate-shaped portion when viewed along the vertical direction z. The disk portion 22 is made of, for example, a metal such as stainless steel.

[0029] [Drive unit 3] The driving unit 3 has a driving function for raising and lowering the stage 2. In this embodiment, the driving unit 3 also has a driving function for rotating the cup 1. The specific configuration of the driving unit 3 is not limited in any way, and in this embodiment, it has an elevation shaft 31, a support unit 32, a bellows member 33, an elevation driving mechanism 34, and a rotation driving mechanism 35.

[0030] The lifting shaft 31 has an upper end fixed to the base 21 of the stage 2, and is an axis for raising and lowering the stage 2 in the vertical direction z. The lifting shaft 31 extends downward in the vertical direction z through an opening in the bottom portion 13 of the cup 1.

[0031] The support part 32 is attached to an opening in the bottom part 13 of the cup 1. An elevation shaft 31 is inserted inside the support part 32. When the support part 32 is rotated around the elevation shaft 31, the cup 1 and the stage 2 rotate together. Furthermore, the bellows member 33 rotates together with the cup 1 and the stage 2. Furthermore, the elevation shaft 31 may rotate together with the cup 1 and the stage 2. Depending on the specific configuration of the drive part 3, the cup 1 and the stage 2 may be configured to rotate separately.

[0032] The bellows member 33 is a member with a bellows structure that is expandable and contractible in the vertical direction z. There are no particular limitations on the material of the bellows member 33, and it may be made of a metal such as stainless steel, a resin, or the like. The upper end of the bellows member 33 is attached to the base 21 of the stage 2, and the lower end is attached to the support part 32. The inside and outside of the bellows member 33 are separated in an airtight manner between the base 21 and the support part 32.

[0033] The lifting drive mechanism 34 is a drive mechanism that raises and lowers the lifting shaft 31. The specific configuration of the lifting drive mechanism 34 is not limited in any way, and a motor, a cylinder, or the like can be used as appropriate. In the illustrated example, the lifting drive mechanism 34 is connected to the lower end of the lifting shaft 31, but the position where the lifting drive mechanism 34 is provided is not limited in any way.

[0034] The rotation drive mechanism 35 is a drive mechanism that rotates the cup 1 and the stage 2 around the lift shaft 31. The specific configuration of the rotation drive mechanism 35 is not limited in any way, and a motor, gears, etc. can be used as appropriate. In the illustrated example, the rotation drive mechanism 35 is configured to rotate the cup 1 and the stage 2 via the support unit 32, but the configuration of the rotation drive mechanism 35 is not limited in any way. For example, the rotation drive mechanism 35 may be configured to directly rotate the cup 1. Also, in the illustrated example, the rotation drive mechanism 35 is disposed to the side of the support unit 32, but the position at which the rotation drive mechanism 35 is provided is not limited in any way. The rotation speed of the cup 1 and the stage 2 by the rotation drive mechanism 35 is set to a rotation speed at which the processing liquid 92 stored in the cup 1 can be sufficiently discharged by the centrifugal force caused by the rotation of the cup 1, as will be described later.

[0035] [Placement table 4] The mounting table 4 is provided on the stage 2 and has a substrate 91 placed thereon. The specific configuration of the mounting table 4 is not limited in any way, and in the example shown, it has a plurality of blocks 41. The plurality of blocks 41 are fixed on the disk portion 22 of the stage 2 and are arranged at equal pitches along the circumferential direction θ. In the example shown, four blocks 41 are arranged at a pitch of 90°, but this is just one example, and the number of blocks 41 and the size of the pitch are not limited in any way. The shape and material of the blocks 41 are not limited in any way. The material of the blocks 41 is preferably one that can adequately support the substrate 91 while not causing unnecessary reactions with or damage to the substrate 91, and is made of, for example, resin.

[0036] As shown in FIGS. 2 and 3 , each block 41 has a mounting surface 411. The mounting surface 411 is a flat surface facing upward in the vertical direction z. The position and shape of the mounting surface 411 are not limited in any way. In the illustrated example, the mounting surface 411 is located above the base 21 in the vertical direction z, and is set so that in processing the substrate 91 described below, the mounted substrate 91 is located at a position lower than the liquid level of the processing liquid 92 stored in the cup 1. In addition, in the illustrated example, the size of the mounting surface 411 is set to be large enough to support a portion of the substrate 91 near its outer periphery.

[0037] [Rotating member 5] The rotating member 5 is rotatably attached to the mounting table 4 (block 41). The number of rotating members 5 is not limited in any way, and in the illustrated example, four rotating members 5 are provided corresponding to the four blocks 41. The rotating member 5 has a rotating shaft 51, a holding portion 52, and an abutting portion 53.

[0038] The rotating shaft 51 is an axis extending along the circumferential direction θ, and is formed by, for example, a bolt, a shaft, etc. Note that the fact that the rotating shaft 51 is an axis extending along the circumferential direction θ means that the rotating shaft 51 is an axis extending along the tangent direction of a circle centered on the lifting shaft 31, and does not mean that the rotating shaft 51 is curved in an arc shape. The rotating shaft 51 is fixed to the block 41.

[0039] The holding portion 52 is a portion located inward in the radial direction r from the rotation shaft 51. The abutting portion 53 is a portion located outward in the radial direction r from the rotation shaft 51. The specific configurations of the holding portion 52 and the abutting portion 53 are not limited in any way. In the illustrated example, the size of the abutting portion 53 in the radial direction r is larger than the size of the holding portion 52 in the radial direction r. The holding portion 52 and the abutting portion 53 may be formed by a single integrated member, or may be formed by combining multiple members. In the illustrated example, the rotating member 5 has a main body portion 50, an extending portion 531, and a protruding portion 532.

[0040] The main body 50 is a portion through which the rotation shaft 51 passes, and is a substantially rectangular portion with the radial direction r as the longitudinal direction when viewed along the vertical direction z. The material of the main body 50 is not limited in any way, and it may be made of, for example, resin. The holding portion 52 is formed by a portion of the main body 50 that is located more inward in the radial direction r than the rotation shaft 51. The holding portion 52 in the illustrated example also has a protruding portion 521. The protruding portion 521 is a portion of the holding portion 52 that protrudes inward in the radial direction r from an upper portion of the holding portion 52 in the vertical direction z. The protruding portion 521 is a portion for forming a predetermined gap between the holding portion 52 and the placement surface 411.

[0041] Meanwhile, the abutting portion 53 is configured by a portion of the main body 50 located outside the rotation axis 51 in the radial direction r, the extending portion 531, and the protruding portion 532. The extending portion 531 is attached to the lower end surface of the main body 50 in the vertical direction z, and extends outward from the main body 50 in the radial direction r as a whole. The shape, material, etc. of the extending portion 531 are not limited in any way. In the illustrated example, the extending portion 531 is made of a metal such as stainless steel, and has a bent shape having a first extending portion 5311, a second extending portion 5312, and an inclined portion 5313.

[0042] The first extending portion 5311 is attached to the lower end surface of the main body 50 and extends outward in the radial direction r along this lower end surface. As will be described later, in the state shown in Figures 6 and 7 where the stage 2 is located at the lower end, the first extending portion 5311 extends along the radial direction r.

[0043] The second extending portion 5312 is located further outward in the radial direction r than the first extending portion 5311, and is located higher in the vertical direction z than the first extending portion 5311 in the state shown in FIGS. 6 and 7. The second extending portion 5312 extends in the same direction as the first extending portion 5311, and extends along the radial direction r in the state shown in FIGS. 6 and 7. An adjustment portion 5314 is formed on the second extending portion 5312. The adjustment portion 5314 is a portion to which the protrusion 532 is coupled.

[0044] 6 and 7, the inclined portion 5313 is inclined so that the inclined portion 5313 is positioned higher in the vertical direction z as it moves outward in the radial direction r. In this state, the inclined portion 5313 is set to be parallel to the side surface portion 12 with a gap therebetween.

[0045] The protrusion 532 is coupled to an adjustment portion 5314 provided on the second extending portion 5312 and can be moved and adjusted relative to the extending portion 531 in the direction of the arrow shown in FIG. 3 . The specific configurations of the protrusion 532 and the adjustment portion 5314 are not limited in any way. A configuration in which the protrusion 532 is held relative to the extending portion 531 and the position of the protrusion 532 relative to the extending portion 531 can be adjusted by a predetermined operation by the user, thereby adjusting the amount by which the protrusion 532 protrudes from the extending portion 531, is appropriately adopted. Examples of a form in which the protrusion 532 and the adjustment portion 5314 are coupled together include a screw connection, as described below. Alternatively, the protrusion 532 and the adjustment portion 5314 may be configured to clamp one another, and the clamping force may be adjustable, thereby adjusting the movement of the protrusion 532. Alternatively, the protrusion 532 and the adjustment portion 5314 may be coupled together using magnetic force.

[0046] In the illustrated example, the protrusion 532 is configured by a member having a male thread, such as a so-called hexagon socket set screw. The adjustment portion 5314 is configured by a female thread, and is configured, for example, by fixing a hexagonal nut to the metal plate member that constitutes the extension portion 531. As a result, the protrusion 532 and the adjustment portion 5314 are joined to each other by screwing. Note that the adjustment portion 5314 having a female thread may be provided by forming a female screw hole in the metal plate member that constitutes the extension portion 531. In the state shown in FIGS. 6 and 7, the lower end of the protrusion 532 in the vertical direction z protrudes downward in the vertical direction z from the second extension portion 5312.

[0047] [Drainage chamber 6] Drain chamber 6 is a chamber into which processing liquid 92 is discharged from cup 1 after processing. The specific configuration of drain chamber 6 is not limited in any way. Furthermore, the substrate processing apparatus according to the present invention may be configured without a structure such as drain chamber 6 for receiving processing liquid 92 discharged from cup 1. In this embodiment, drain chamber 6 is formed of a metal plate made of, for example, stainless steel, and has an upper plate portion 61, a lower plate portion 62, an inner plate portion 63, and a discharge path 64.

[0048] The upper plate portion 61 is a portion located above in the vertical direction z, and in the illustrated example, is, for example, annular. The upper plate portion 61 is located above the upper end portion 11 of the cup 1 in the vertical direction z. The upper end portion 11 overlaps the upper end portion 11 when viewed along the vertical direction z. The stage 2 is located inside the upper plate portion 61 when viewed along the vertical direction z.

[0049] The lower plate portion 62 is located below the upper plate portion 61 in the vertical direction z, and has, for example, a circular ring shape when viewed along the vertical direction z. The lower plate portion 62 has a shape and size that generally overlaps with the upper plate portion 61 when viewed along the vertical direction z. The lower plate portion 62 is located below the lower end of the outer wall portion 14 in the vertical direction z.

[0050] The inner plate portion 63 has a cylindrical shape and extends upward in the vertical direction z from the inner edge of the lower plate portion 62 in the radial direction r. When viewed along the vertical direction z, the inner plate portion 63 is located between the side surface portion 12 and the outer wall portion 14 of the cup 1 and overlaps with the upper end portion 11. The lower end of the inner plate portion 63 is located lower than the lower end of the outer wall portion 14 in the vertical direction z. The upper end of the inner plate portion 63 is located higher than the lower end of the outer wall portion 14 and lower than the upper plate portion 61 in the vertical direction z. In other words, when viewed from the outside in the radial direction r, the outer wall portion 14 and the inner plate portion 63 partially overlap each other.

[0051] The discharge path 64 is a flow path for guiding the treatment liquid 92 discharged from the cup 1 to a predetermined location. In the illustrated example, the discharge path 64 extends outward in the radial direction r from the annular space surrounded by the upper plate portion 61, the lower plate portion 62, and the inner plate portion 63.

[0052] Next, the operation of the substrate processing apparatus A1 will be described.

[0053] 2 shows a state in which processing of a substrate 91 is started. In this state, the stage 2 has been raised by the lifting drive mechanism 34 of the drive unit 3 and is located at the top end in the vertical direction z. The rotating member 5 is rotatably supported on the mounting table 4 and is not in contact with, for example, a cup 1. Because the contact portion 53 is larger than the holding portion 52 in the radial direction r, due to balance caused by gravity, the contact portion 53 is located below in the vertical direction z and the holding portion 52 is located above in the vertical direction z. In this state, the holding portion 52 of the rotating member 5 does not overlap with the mounting surface 411 of the mounting table 4 when viewed along the vertical direction z, and is located outside the mounting surface 411 in the radial direction r.

[0054] Next, the substrate 91 is placed as shown in Fig. 4. The substrate 91 is placed by lowering the substrate 91 from above in the vertical direction z using, for example, a holder (not shown). Then, as shown in Fig. 3, the portion of the substrate 91 near its outer periphery is brought into contact with the placement surface 411 of the placement table 4, and the substrate 91 is placed.

[0055] Next, the lifting drive mechanism 34 of the drive unit 3 lowers the stage 2 downward in the vertical direction z. As a result, the mounting table 4, the rotating member 5, and the substrate 91 together with the stage 2 lower relative to the cup 1. As the stage 2 lowers, the upper end 11 and the protrusion 532 of the rotating member 5, which were separated from each other in FIGS. 3 and 4, come into contact as shown in FIG. 5. This contact may occur at the lower end of the protrusion 532 or at the outer end of the second extension 5312 in the radial direction r. When the stage 2 further lowers from this state, the rotation shaft 51 of the rotating member 5 lowers, while the lowering of the protrusion 532 is prevented by the upper end 11. As a result, the rotating member 5 rotates around the rotation shaft 51 (clockwise in FIG. 5).

[0056] 6 and 7 show a state in which the stage 2 has completed its descent and is positioned at its lower end in the vertical direction z. From the state shown in FIG. 5 onward, the cup 1, stage 2, mounting table 4, and substrate 91 descend while the protrusion 532 remains in contact with the upper end 11 of the cup 1. Accordingly, the rotation shaft 51 sequentially rotates and assumes the position shown in FIGS. 6 and 7. In this state, the first extension 5311 and the second extension 5312 extend along the radial direction r. The inclined portion 5313 is parallel to the side surface 12 with a gap therebetween. Furthermore, the second extension 5312 is parallel to the upper end 11 with a gap therebetween.

[0057] 6 and 7, the rotation of the rotating member 5 accompanying the descent of the stage 2 reduces the distance between the protrusion 521 of the holder 52 and the mounting surface 411 of the mounting table 4. During this operation, a portion of the substrate 91 is present between the protrusion 521 and the mounting surface 411. Therefore, when the stage 2 reaches the bottom end, the distance between the protrusion 521 and the mounting surface 411 is reduced to its smallest, with the substrate 91 sandwiched between them. At this time, the protrusion 521 may be in contact with the substrate 91, or may be separated from the substrate 91 by a small gap.

[0058] Next, a processing liquid 92 is poured into the cup 1. In this embodiment, as shown in Fig. 8, the processing liquid 92 is poured into the cup 1 by, for example, a nozzle 82. There are no particular limitations on the specific type of processing liquid 92, and it is selected appropriately in accordance with the processing to be performed on the substrate 91.

[0059] When performing a lift-off process on the substrate 91, for example, two types of liquids are sequentially selected as the processing liquid 92. The first type is an insoluble liquid that does not dissolve the resist layer. An example of the insoluble liquid is pure water. For example, pure water, which is an insoluble liquid, is poured into the cup 1 from the nozzle 82 as the processing liquid 92. The amount of the processing liquid 92 poured is set to an amount that allows the substrate 91 placed on the mounting table 4 to be fully immersed in the processing liquid 92. In this case, the liquid surface of the processing liquid 92 is located above the substrate 91 in the vertical direction z. In the illustrated example, the liquid surface is located above the entire block 41 and the entire main body 50 of the rotating member 5 in the vertical direction z. Meanwhile, the extension portion 531 of the abutting portion 53 protrudes upward from the processing liquid 92, exceeding the liquid surface of the processing liquid 92.

[0060] After pouring the insoluble processing liquid 92 into the cup 1, ultrasonic waves are applied to the substrate 91 via the processing liquid 92 using, for example, an ultrasonic generator 81. The specific configuration of the ultrasonic generator 81 is not limited, and it may be, for example, a horn-type ultrasonic generator. The ultrasonic waves from the ultrasonic generator 81 peel, for example, most of the metal layer stacked on the resist layer and part of the resist layer from the substrate 91. When applying ultrasonic waves to the substrate 91, it is preferable to reciprocate the ultrasonic generator 81 in, for example, a radial direction r, as shown by the arrows in the figure. It is also preferable to rotate the stage 2, the mounting table 4, the rotating member 5, and the substrate 91 at a low speed in a circumferential direction θ in synchronization with the reciprocating movement of the nozzle 82 in the radial direction r. This allows the ultrasonic waves from the ultrasonic generator 81 to be applied to the entire surface of the substrate 91.

[0061] When ultrasonic waves are applied from the ultrasonic generator 81, most of the metal layer to be removed and part of the resist layer are suspended or precipitated in the processing liquid 92. Then, the processing liquid 92 is discharged from the cup 1. In this embodiment, the processing liquid 92 is discharged by utilizing centrifugal force generated by rotating the cup 1 around the lifting shaft 31.

[0062] As shown in FIG. 9 , the support part 32 is rotated by the rotary drive mechanism 35 of the drive part 3, thereby rotating the cup 1. The rotation speed at this time is required to be a speed that allows the processing liquid 92 inside the cup 1 to be sufficiently discharged, and is significantly faster than the rotation speed in the step in which ultrasonic waves are applied from the ultrasonic generator 81, for example. The centrifugal force caused by the rotation of the cup 1 causes the processing liquid 92 to flow along the side part 12 of the cup 1, outward in the radial direction r, and upward in the vertical direction z. As a result, the processing liquid 92 passes over the upper end part 11 and is gradually discharged outward in the radial direction r of the cup 1.

[0063] The processing liquid 92 discharged from the cup 1 falls onto the lower plate 62 through the gap between the upper end 11 and the upper plate 61. It then flows out to a predetermined waste liquid location through the discharge path 64. At this time, the outer wall 14 of the cup 1 overlaps the inner plate 63 of the drainage chamber 6 when viewed from the outside in the radial direction r, thereby preventing the processing liquid 92 from splashing into areas where the support 32, the lifting drive mechanism 34, the rotation drive mechanism 35, etc. are disposed. Note that in this embodiment, the mounting table 4, the rotation member 5, and the substrate 91 are configured to rotate together with the cup 1, but the present invention is not limited to this. For example, when discharging the processing liquid 92, only the cup 1 may be configured to rotate at high speed.

[0064] When the discharge of the insoluble liquid serving as the processing liquid 92 is completed, in this example, a soluble liquid having solubility in the resist layer is poured into the cup 1 as the second processing liquid 92. An example of such a processing liquid 92 is IPA (isopropyl alcohol). When pouring the processing liquid 92, which is a soluble liquid, it is preferable to pour the processing liquid 92 by spraying it onto the substrate 91. This causes the resist layer remaining on the surface of the substrate 91 to be dissolved by the processing liquid 92, which is a soluble liquid. After the dissolution of the remaining resist layer by the processing liquid 92 is completed, the processing liquid 92 is discharged by utilizing centrifugal force due to the rotation of the cup 1, using the same method as that described with reference to FIG. 9.

[0065] After the processing liquid 92 has been discharged, the lifting mechanism 34 raises the stage 2 to the upper end, thereby returning to the state shown in FIGS. 3 and 4. Thereafter, the substrate 91 is lifted from the mounting table 4 by a predetermined holder or the like (not shown). This completes the lift-off process for the substrate 91. After the processing liquid 92 has been discharged and before the stage 2 is raised, a predetermined gas may be blown onto the substrate 91, for example, to dry any processing liquid 92 remaining on the substrate 91.

[0066] Next, the operation of the substrate processing apparatus A1 will be described.

[0067] According to this embodiment, as the stage 2 descends, the contact portion 53 of the rotating member 5 contacts the cup 1, causing the rotating member 5 to rotate and hold the substrate 91. Therefore, there is no need to provide a contact member in the cup 1 for contacting the rotating member 5. This makes it possible to prevent the contact member from unduly disrupting the flow of the processing liquid 92 in the cup 1. It is also possible to prevent the resist layer or metal layer removed by the lift-off process from adhering to the contact member. This reduces unintended effects on the processing of the substrate 91.

[0068] In the substrate processing apparatus A1, as shown in FIG. 9 , the processing liquid 92 is discharged from the cup 1 by rotating the cup 1. Unlike the present embodiment, when the processing liquid 92 is discharged from a discharge port provided in the bottom portion 13 of the cup 1, as in Patent Document 1, for example, small pieces or powder of the metal layer or resist layer suspended in the processing liquid 92 may re-adhere and remain on the upper surface of the substrate 91. According to the present embodiment, the processing liquid 92 is discharged outward in the radial direction r by utilizing centrifugal force generated by the rotation of the cup 1. As a result, small pieces or powder of the metal layer or resist layer contained in the processing liquid 92 are blown outward in the radial direction r along with the processing liquid 92. This prevents small pieces or powder of the metal layer or resist layer from remaining on the substrate 91. Furthermore, unlike Patent Document 1, there is no need for extra processing, such as providing a discharge port in the cup 1 or joining an abutting member, thereby simplifying the apparatus.

[0069] The side surface 12 of the cup 1 is formed as a tapered inclined portion. Therefore, when the cup 1 is rotated to discharge the treatment liquid 92, the treatment liquid 92 flows obliquely upward along the side surface 12 and can be discharged more smoothly over the upper end 11. As shown in FIG. 7 , when the treatment liquid 92 is discharged, the inclined portion 5313 of the extension portion 531 of the rotating member 5 is set parallel to the side surface 12 with a gap therebetween. This allows the treatment liquid 92 to flow smoothly through the gap between the side surface 12 and the inclined portion 5313, and the treatment liquid 92 can be discharged appropriately.

[0070] 5 to 7, contact portion 53 of rotating member 5 contacts upper end portion 11 of cup 1, thereby rotating rotating member 5. This makes it possible to avoid situations where, when stage 2 further descends after contact portion 53 of rotating member 5 contacts upper end portion 11, rotating member 5 and cup 1 rub against each other too strongly, hindering smooth rotation of rotating member 5 or causing irregular rotation of rotating member 5.

[0071] The contact portion 53 has a protrusion 532 that abuts against the upper end portion 11. The protrusion 532 is attached to the extension portion 531 by screwing and is movable relative to the extension portion 531. This allows the position of the protrusion 532 relative to the extension portion 531 to be adjusted so that the distance between the protrusion 521 of the holder 52 and the mounting surface 411 of the mounting table 4 is appropriate for holding the substrate 91, for example, in the states shown in FIGS. 6 and 7 . Once the position adjustment of the protrusion 532 is complete, the distance between the protrusion 521 of the holder 52 and the mounting surface 411 of the mounting table 4 can be reproducibly set to an appropriate distance during subsequent operations of the substrate processing apparatus A1. This is suitable for preventing the distance from varying each time the substrate processing apparatus A1 is operated. Furthermore, even if the upper end portion 11 of the cup 1 is deformed due to long-term use, the substrate 91 can be held appropriately by adjusting the position of the protrusion 532.

[0072] By providing the bellows member 33 inside the cup 1, even when the processing liquid 92 is stored, it is possible to prevent the processing liquid 92 from adhering to the lifting shaft 31 and the like.

[0073] 10 to 17 show other embodiments of the present invention. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment.

[0074] Second Embodiment 10 to 15 show a substrate processing apparatus according to a second embodiment of the present invention. The substrate processing apparatus A2 of this embodiment differs from the above-described substrate processing apparatus A1 mainly in the configuration of the rotating member 5. FIGS. 10 and 11 show the substrate processing apparatus A2 in the same state as in FIGS. 2 and 3. FIGS. 14 and 15 show the substrate processing apparatus A2 in the same state as in FIGS. 6 and 7. FIGS. 12 and 13 show the substrate processing apparatus A2 in a state between the state shown in FIGS. 10 and 11 and the state shown in FIGS. 14 and 15.

[0075] In the rotating member 5 of the substrate processing apparatus A2, the extending portion 531 is attached to the upper end surface of the main body 50. The extending portion 531 has a first extending portion 5311 and an inclined portion 5313, but does not have a second extending portion 5312.

[0076] The first extending portion 5311 extends outward in the radial direction r along the upper end surface of the main body portion 50. In the state shown in Figures 14 and 15, the first extending portion 5311 extends along the radial direction r.

[0077] The inclined portion 5313 extends outward in the radial direction r from the outer end of the first extending portion 5311 in the radial direction r. In the state shown in Figures 14 and 15, the inclined portion 5313 is inclined so as to be positioned higher in the vertical direction z as it moves outward in the radial direction r from the outer end of the first extending portion 5311. In this state, the inclined portion 5313 is set to be parallel to the side surface portion 12 with a gap therebetween.

[0078] In this embodiment, an adjustment portion 5315 is provided on the inclined portion 5313, and the protrusion portion 532 is coupled to this adjustment portion 5315 by screwing. The adjustment portion 5315 is configured by fixing a hexagonal nut to the metal plate member that constitutes the extension portion 531. Note that the adjustment portion 5315 may also be provided by forming a female screw hole in the metal plate member that constitutes the extension portion 531. Also, similar to the adjustment portion 5314 described above, the configuration of the adjustment portion 5315 is not limited in any way.

[0079] The adjustment portion 5315 is disposed further inward in the radial direction r than the position of the adjustment portion 5314 in the rotating member 5 of the substrate processing apparatus A1 in the radial direction r. That is, in the rotating member 5 of the substrate processing apparatus A2, the inclined portion 5313 protrudes further outward in the radial direction r than the protrusion 532. In the state shown in FIGS. 10 and 11 , the inclined portion 5313 partially overlaps with the upper end portion 11 when viewed along the vertical direction z. On the other hand, the protrusion 532 is located further inward in the radial direction r than the upper end portion 11 when viewed along the vertical direction z, and overlaps with the side portion 12.

[0080] In the substrate processing apparatus A2, the same operations as those described for the substrate processing apparatus A1 are performed to process the substrate 91. When the substrate 91 is placed on the mounting table 4, the rotation drive mechanism 35 lowers the stage 2, mounting table 4, rotating member 5, and substrate 91 relative to the cup 1. Then, as shown in FIGS. 12 and 13, the inclined portion 5313 abuts against the upper end 11 (or the boundary between the upper end 11 and the side surface 12). When the stage 2, mounting table 4, and substrate 91 are further lowered from this state, the rotating member 5 rotates about the lifting shaft 31 with the inclined portion 5313 abutting against the upper end 11 (or the boundary between the upper end 11 and the side surface 12).

[0081] Furthermore, when the stage 2, the mounting table 4, and the substrate 91 are lowered and reach the lower end position shown in FIGS. 14 and 15, the protrusion 532 abuts against the side surface 12, while the inclined portion 5313 is separated from the upper end 11. That is, during the descent from the state shown in FIGS. 12 and 13 to the state shown in FIGS. 14 and 15, the inclined portion 5313 abuts against the upper end 11 (or the boundary between the upper end 11 and the side surface 12), and the protrusion 532 abuts against the side surface 12. Then, the inclined portion 5313 immediately separates from the upper end 11, and the stage 2 and the like are lowered with the protrusion 532 abutting against the side surface 12, reaching the state shown in FIGS. 14 and 15. In the state shown in FIGS. 14 and 15, the distance between the protrusion 521 and the mounting surface 411 is minimized across the substrate 91.

[0082] This embodiment also reduces unintended effects on processing of the substrate 91. In this embodiment, as shown in FIGS. 13 and 15 , the inclined portion 5313 first abuts against the upper end 11 (or the boundary between the upper end 11 and the side surface 12), starting the rotation of the rotating member 5. When the stage 2 is lowered to the bottom, the protrusion 532 abuts against the side surface 12, determining the size of the gap between the protrusion 521 and the mounting surface 411. The abutment of the inclined portion 5313 against the upper end 11 prevents the inclined portion 5313 and the cup 1 from strongly rubbing against each other during the subsequent rotation of the rotating member 5 as it descends, preventing smooth rotation of the rotating member 5 or causing irregular rotation of the rotating member 5. The side surface 12 is a cylindrical portion with a tapered shape as a whole. Such a side surface 12 has high rigidity and is less likely to deform. Therefore, the abutment of the protrusion 532 makes it possible to more reliably set the distance between the protrusion 521 and the placement surface 411 to a predetermined size.

[0083] Third Embodiment 16 shows a substrate processing apparatus according to a third embodiment of the present invention. In the substrate processing apparatus A3 of this embodiment, as the stage 2 descends, the abutment portion 53 abuts against the side portion 12, but does not abut against the upper end portion 11.

[0084] The contact portion 53 of this embodiment has an extending portion 531. The extending portion 531 has, for example, a shape in which the tip thereof is curved upward. Furthermore, the angle formed by the side surface portion 12 of this embodiment with the horizontal plane is smaller than that of the substrate processing apparatuses A1 and A2, for example, about 40°.

[0085] When the stage 2 descends from the upper end position, the tip of the extension portion 531 abuts against the side surface portion 12. Then, when the stage 2 further descends and reaches the lower end position, the main body portion 50 is aligned in the radial direction r as shown in the figure, and the holding of the substrate 91 is completed.

[0086] This embodiment also reduces unintended effects on processing of the substrate 91. Furthermore, as can be understood from this embodiment, the contact portion 53 of the rotating member 5 of the present invention may be configured to rotate by contacting the cup 1, and may be configured to contact only the side surface portion 12 and not the upper end portion 11. Furthermore, a protrusion and an adjustment portion may be provided in this embodiment.

[0087] <Fourth embodiment> 17 shows a substrate processing apparatus according to a fourth embodiment of the present invention. In the substrate processing apparatus A4 of this embodiment, a flat region 121 is provided on the side surface 12 of the cup 1. The flat region 121 is a portion of the side surface 12 that has been subjected to bending, drawing, or the like, and has a horizontal surface. When the stage 2 is positioned at the lower end, the flat region 121 is located below the substrate 91 and the rotation shaft 51, and in the illustrated example, is located below the block 41.

[0088] In the rotating member 5 of this embodiment, the contact portion 53 has an extending portion 531 and a tip portion 533. In the illustrated example, the extending portion 531 is bent obliquely downward from the main body portion 50. The tip portion 533 is preferably attached to the tip of the extending portion 531 and is rotatable. When the stage 2 is positioned at the upper end, the tip portion 533 overlaps with the flat region 121 when viewed along the vertical direction z. Note that the above-described protrusion and adjustment portion may be used instead of the tip portion 533.

[0089] In this embodiment, when the stage 2 descends, the tip 533 comes into contact with the flat region 121 of the side surface 12. This causes the rotating member 5 to rotate around the rotation axis 51. Then, when the stage 2 reaches the bottom end, the substrate 91 is completely held by the protruding portion 521 of the rotating member 5 and the mounting surface 411 of the mounting table 4.

[0090] This embodiment also reduces unintended effects on processing of substrate 91. Furthermore, as can be seen from this embodiment, the shape of side surface 12 is not limited in any way as long as it is a shape that allows abutment portion 53 of pivoting member 5 to abut against it, thereby pivoting pivoting member 5. Even with cup 1 having flat region 121 formed on side surface 12, it is possible to prevent the flow of processing liquid 29 in cup 1 from being unduly disrupted, compared to the configuration of the prior art in which an abutment member is provided inside the cup, and it is possible to prevent the resist layer or metal layer removed by the lift-off process from adhering to the abutment member.

[0091] The substrate processing apparatus according to the present invention is not limited to the above-described embodiment, and the specific configuration of each part of the substrate processing apparatus according to the present invention can be freely designed and modified in various ways. [Explanation of symbols]

[0092] A1, A2, A3, A4: Substrate processing equipment 1: Cup 2: Stage 3: Drive unit 4: Mounting table 5: Rotating member 6: Drainage chamber 11: Upper end 12: Side part 13: Bottom part 14:Outer wall 21: Bass 22: Disc section 29: Processing liquid 31: Elevating axis 32: Support part 33: Bellows member 34: Lifting drive mechanism 35: Rotation drive mechanism 41: Block 50: Main body 51: Rotating shaft 52: Holding part 53: Contact part 61: Upper plate 62: Lower plate part 63:Inner plate part 64:Exhaust channel 81: Ultrasonic wave generating unit 82: Nozzle 91: Circuit board 92: Processing liquid 121: Flat area 411: Placement surface 521:Protrusion 531 :Extension part 532:Protrusion 533:Tip 5311: 1st extension part 5312:Second extension part 5313: Inclined part 5314,5315: Adjustment section r: Radial direction z: vertical direction θ: Circumferential direction

Claims

1. a cup capable of storing a processing liquid for processing the substrate; a stage that can be raised and lowered along an elevation axis that extends vertically within the cup; a mounting table provided on the stage and on which the substrate is placed; a rotating member attached to the mounting table so as to be rotatable around a rotation axis extending in a circumferential direction around the lifting shaft, the rotating member has a holding portion located radially inward from the rotating shaft and a contact portion located radially outward from the rotating shaft, the holding portion includes a portion that is spaced radially inward from the rotation axis, and that forms a gap between the holding portion and the mounting table in which a part of the substrate can be present when the contact portion is not in contact with the cup, As the stage descends, the abutting portion abuts against the cup, causing the rotating member to rotate, thereby narrowing the gap between the portion of the holding portion that sandwiches the substrate and forms the gap and the mounting table. Substrate processing equipment.

2. The substrate processing apparatus according to claim 1 , wherein the cup rotates about the lifting shaft to discharge the processing liquid radially outward.

3. the cup has an upper end, a side surface connected to the upper end, and a bottom surface connected to a lower portion of the side surface, The substrate processing apparatus according to claim 1 , wherein the entire bottom surface portion is included inside the upper end portion when viewed along the vertical direction.

4. The substrate processing apparatus according to claim 3 , wherein the contact portion contacts the upper end portion.

5. The substrate processing apparatus according to claim 3 , wherein the contact portion contacts the side surface portion.

6. the abutment portion has an extension portion extending from the rotation shaft and a protrusion portion coupled to an adjustment portion provided on the extension portion, The substrate processing apparatus according to claim 4 , wherein the protrusion abuts against the upper end portion.

7. the abutment portion has an extension portion extending from the rotation shaft and a protrusion portion screwed into an adjustment portion provided on the extension portion, The substrate processing apparatus according to claim 3 , wherein, as the stage descends, the extension contacts the upper end, and then the protrusion contacts the side surface.

8. 8. The substrate processing apparatus according to claim 1, wherein a liquid surface of the processing liquid is positioned above the substrate when the substrate is being processed.

9. 8. The substrate processing apparatus according to claim 1, wherein said lifting shaft is covered by a bellows member within said cup.

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