Semiconductor Devices

Abstract

To provide a semiconductor device in which a solder member is less likely to be bridged between a semiconductor element and a conductive member.SOLUTION: A semiconductor device has: a semiconductor element 200 that comprises a first main electrode 210 formed on a first principal surface 200a, a second main electrode 220 formed on a second principal surface 200b at a rear side of the first principal surface in a plate thickness direction, and a protection film 240 provided on the first principal surface and including a sectionalizing part 241 for dividing the first main electrode into a plurality of regions; a conductive member 400 that comprises, on an opposed surface 400b facing the first principal surface in the plate thickness direction, a plurality of opposed parts 261 and 262 facing the first main electrode in the plate thickness direction, and an interposed part 263 provided between the plurality of opposed parts in an arrangement direction of the plurality of opposed parts; and a solder member 310 provided between the first main electrode and the plurality of opposed parts, being sectionalized into the plurality of regions by the sectionalizing part and the interposed part. The sectionalizing part is less likely to be wetted by the solder member than the first main electrode, and the interposed part is less likely to be wetted by the solder member than the opposed part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The disclosure herein relates to a semiconductor device comprising a semiconductor element, a conductive member, and solder. [Background technology]

[0002] Patent Document 1 describes a semiconductor device including a semiconductor substrate on which two emitter electrodes are formed, and a heat spreader fixed to each of the two emitter electrodes via solder. A polyimide film is provided between the two emitter electrodes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-48889 Summary of the Invention [Problem to be solved by the invention]

[0004] The polyimide film is difficult to wet with solder, so the solder spreads onto the heat spreader side, making it easier for the solder to form bridges between the semiconductor substrate and the heat spreader.

[0005] Therefore, an object of the present disclosure is to provide a semiconductor device in which the solder member is less likely to bridge between the semiconductor element and the conductive member. [Means for solving the problem]

[0006] A semiconductor device according to one aspect of the present disclosure includes: a semiconductor element (200) including a first main electrode (210) formed on a first main surface (200a), a second main electrode (220) formed on a second main surface (200b) on the back side of the first main surface in the plate thickness direction, and a protective film (240) provided on the first main surface and including partitions (241) that partition the first main electrode into a plurality of regions; a conductive member (400) including, on an opposing surface (400b) opposing the first main surface in the plate thickness direction, a plurality of opposing portions (261, 262) opposing the first main electrode in the plate thickness direction, and intervening portions (263) provided between the plurality of opposing portions in the arrangement direction of the plurality of opposing portions; a solder member (310) provided between the first main electrode and the plurality of opposing portions and partitioned into a plurality of regions by partition portions and intervening portions; The partition portion is less wettable with the solder material than the first main electrode, The interposed portion is less wettable with the solder material than the opposing portion, The length of the intervening portion in the arrangement direction is equal to or less than the length of the partition portion in the arrangement direction. .

[0007] This makes it difficult for the solder member (310) to bridge between the semiconductor element (200) and the conductive member (400).

[0008] The reference numbers in parentheses above merely indicate the corresponding relationship with the configurations described in the embodiments below, and do not in any way limit the technical scope. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram illustrating a semiconductor device. [Figure 2] 2 is a cross-sectional view of the semiconductor device taken along line II-II shown in FIG. [Figure 3] FIG. 2 is a top view of a semiconductor element. [Figure 4] Three-dimensional view of the terminal. [Figure 5] FIG. 10 is a top view of the semiconductor element with the second terminal surface superimposed thereon. [Figure 6] FIG. 6 is a cross-sectional view of the semiconductor device taken along line VI-VI shown in FIG. [Figure 7] FIG. 10 is a top view illustrating a modified example of the semiconductor element. [Figure 8] FIG. 10 is a top view of a modified example in which the second terminal surface is superimposed on the semiconductor element. [Figure 9] FIG. 10 is a top view illustrating a modified example of the semiconductor element. [Figure 10]FIG. 10 is a top view of a modified example in which the second terminal surface is superimposed on the semiconductor element. [Figure 11] FIG. 10 is a cross-sectional view illustrating a modified example of the semiconductor device. [Figure 12] FIG. 10 is a top view illustrating a modified example of the terminal. [Figure 13] FIG. 10 is a cross-sectional view illustrating a modified example of the semiconductor device. [Figure 14] FIG. 10 is a correlation diagram illustrating the correlation between the contact angle of solder and the life of a semiconductor element. [Figure 15] FIG. 10 is a cross-sectional view illustrating a modified example of the semiconductor device. [Figure 16] FIG. 10 is a cross-sectional view illustrating a modified example of the semiconductor device. [Figure 17] FIG. 10 is a cross-sectional view illustrating a modified example of the semiconductor device. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment will be assigned the same reference numerals, and duplicated explanations may be omitted. In each embodiment, when only a part of the configuration is described, the other previously described embodiments may be applied to the other parts of the configuration.

[0011] In addition, it is not only possible to combine parts that are explicitly stated as being possible in each embodiment, but it is also possible to partially combine embodiments, embodiments and variants, and variants even if not explicitly stated, as long as there are no particular problems with the combination.

[0012] (First embodiment) The mechanical configuration of the semiconductor device 100 will be described below. Three mutually orthogonal directions are defined as the x-direction, y-direction, and z-direction. Note that the "directions" are omitted in the drawings. Note that the plate thickness direction corresponds to the z-direction, and the arrangement direction corresponds to the x-direction.

[0013] 1 and 2, the semiconductor device 100 includes a semiconductor element 200, solder 300, a terminal 400, a first heat sink 500, a second heat sink 600, a plurality of terminals 700, and a coating resin 800 that coats these. The plurality of terminals 700 specifically include a first main terminal 710, a second main terminal 720, and a signal terminal 730. Note that the coating resin 800 is omitted from Fig. 2. The terminals 400 correspond to the conductive member.

[0014] The semiconductor device 100 is known as a so-called 1-in-1 package that constitutes one of multiple arms that constitute a three-phase inverter. The semiconductor device 100 is incorporated, for example, into an inverter circuit of a vehicle. Note that the semiconductor device 100 is not limited to the 1-in-1 package shown in FIG. 1. The semiconductor device 100 may also be a 2-in-1 package.

[0015] The semiconductor device 200 is configured by forming a power transistor such as an insulated gate bipolar transistor (IGBT) on a semiconductor material such as silicon, silicon carbide, etc. The power transistor has a so-called vertical structure so that current flows in the z direction.

[0016] The semiconductor element 200 has a flat shape with a small thickness in the z direction. The semiconductor element 200 has a first main surface 200a and a second main surface 200b that are spaced apart in the z direction. The second main surface 200b is provided on the back side of the first main surface 200a in the plate thickness direction.

[0017] 2, an emitter electrode 210, a gate liner 230, and a protective film 240 are provided on the first main surface 200a. The emitter electrode 210 is divided into a first emitter electrode 211 and a second emitter electrode 212 by the protective film 240. The first emitter electrode 211 and the second emitter electrode 212 may be electrically connected via a base electrode (not shown). A collector electrode 220 is provided over the entire surface of the second main surface 200b.

[0018] The emitter electrode 210 corresponds to a first main electrode, the collector electrode 220 corresponds to a second main electrode, and the gate liner 230 corresponds to a signal wiring.

[0019] For ease of explanation, the first main surface 200a will be divided into a first region 281, a second region 282, a third region 283, and a first peripheral region 287 as shown in Fig. 3. The first region 281 to the first peripheral region 287 will be explained in detail below.

[0020] 3, the first region 281 to the third region 283 are disposed in the center of the first main surface 200a. The first region 281 and the second region 282 are arranged side by side and spaced apart in the x-direction. The third region 283 is provided between the first region 281 and the second region 282. The first peripheral region 287 is provided on the first main surface 200a in a manner that surrounds the first region 281 to the third region 283 in an annular shape in the circumferential direction around the z-direction.

[0021] 3, a first emitter electrode 211 is formed in a first region 281. A second emitter electrode 212 is formed in a second region 282. A part of a gate liner 230 and a part of a protective film 240 are provided in a third region 283.

[0022] Hereinafter, a portion of the gate liner 230 provided in the third region 283 will be referred to as a first gate liner 231. A portion of the protective film 240 provided in the third region 283 will be referred to as a first protective portion 241. The first gate liner 231 is covered and protected by the first protective portion 241. The first protective portion 241 corresponds to a partition portion.

[0023] Furthermore, the first peripheral region 287 is provided with the remainder of the gate liner 230, the remainder of the protective film 240, and a plurality of pads 740. Hereinafter, the remainder of the gate liner 230 provided in the first peripheral region 287 will be referred to as a second gate liner 232. The remainder of the protective film 240 provided in the first peripheral region 287 will be referred to as a second protective portion 242. The second gate liner 232 is covered and protected by the second protective portion 242.

[0024] In FIG. 3, the gate liner 230 is shown by a broken line to clarify the position of the gate liner 230.

[0025] The gate liner 230 is a wiring having a low resistance to transmit an on / off signal to the gate electrode of the power transistor formed in the semiconductor element 200 without delay.

[0026] The protective film 240 is a protective member made of a material containing polyimide for protecting the gate liner 230. The protective film 240 is less wettable with the solder 300 than the emitter electrode 210. More specifically, the first protective portion 241 and the second protective portion 242 are less wettable with the solder 300 than the first emitter electrode 211 and the second emitter electrode 212, respectively.

[0027] The pads 740 are electrodes for signals. The pads 740 are provided, for example, on the end side in the y direction of the semiconductor element 200. The pads 740 are exposed from the second protective portion 242.

[0028] Each of the pads 740 is used, for example, for a gate electrode, a Kelvin emitter, a current sensor, an anode potential of a temperature sensor, a cathode potential of the temperature sensor, etc. The pads 740 are electrically connected to the signal terminals 730 via bonding wires (not shown).

[0029] The terminal 400 is a conductive block having a substantially rectangular parallelepiped shape and is made of a metal material such as copper that has excellent thermal and electrical conductivity.

[0030] 2, the terminal 400 has a first terminal surface 400a spaced apart in the z direction, a second terminal surface 400b on the reverse side thereof, and four connecting terminal surfaces 400c connecting the first terminal surface 400a and the second terminal surface 400b. The second terminal surface 400b is located closer to the first main surface 200a in the z direction than the first terminal surface 400a. The second terminal surface 400b corresponds to the opposing surface.

[0031] Also, a first plating 250 is provided on the first terminal surface 400a, a second plating 260 is provided on the second terminal surface 400b, and a third plating 270 is provided on the connecting terminal surface 400c.

[0032] In the following, in order to specifically describe the second terminal surface 400b, the second terminal surface 400b will be described by dividing it into a fourth region 284, a fifth region 285, and a sixth region 286. The fourth region 284 to the sixth region 286 will be specifically described below.

[0033] 4, the fourth region 284 and the fifth region 285 are spaced apart from each other in the x direction. The sixth region 286 is provided between the fourth region 284 and the fifth region 285.

[0034] A second plating 260 is provided in each of the fourth region 284 to the sixth region 286. For ease of explanation, the second plating 260 provided in the fourth region 284 will be referred to as a first opposing plating 261. The second plating 260 provided in the fifth region 285 will be referred to as a second opposing plating 262. The second plating 260 provided in the sixth region 286 will be referred to as a third opposing plating 263. The front view of FIG. 4 is a front view of the terminal 400 as seen from the second terminal surface 400b side.

[0035] The first opposing plating 261 and the second opposing plating 262 correspond to opposing portions, and the third opposing plating 263 corresponds to an intervening portion.

[0036] 3 to 5, fourth region 284 faces a part of first region 281 in the z direction. Fifth region 285 faces a part of second region 282 in the z direction. Sixth region 286 faces a part of first region 281, a part of second region 282, and third region 283 in the z direction. Note that FIG. 5 shows second terminal surface 400b superimposed on semiconductor element 200 to clarify the positional relationship between first uneven portion 263a and first protective portion 241, which will be described later.

[0037] Accordingly, the first opposing plating 261 faces a part of the first emitter electrode 211 in the z direction. The second opposing plating 262 faces a part of the second emitter electrode 212 in the z direction. The third opposing plating 263 faces a part of the first emitter electrode 211, the second emitter electrode 212, the first protective portion 241, and the first gate liner 231 in a manner that overlaps them in the z direction.

[0038] 6, a first uneven portion 263a that is uneven in the z direction is formed on the surface of the third opposing plating 263 facing the first protective portion 241. The first uneven portion 263a is formed continuously on the surface of the third opposing plating 263 facing the first protective portion 241. The first uneven portion 263a corresponds to an uneven shape.

[0039] The first uneven portion 263a is created by irradiating a laser onto the surface of the third opposing plating 263 on the first protective portion 241 side. When irradiated with a laser, the surface of the third opposing plating 263 on the first protective portion 241 side melts and vaporizes. This portion then becomes concave, forming the first uneven portion 263a on the surface. The third opposing plating 263 has a lower melting point than the terminal 400. A temperature exceeding the melting point of the third opposing plating 263 is applied by the laser. This melts the third opposing plating 263.

[0040] The third opposing plating 263 has low wettability due to the formation of a first uneven portion 263a on its surface. As a result, the first uneven portion 263a is less wettable with the solder 300 than the first opposing plating 261 and the second opposing plating 262. More specifically, the first uneven portion 263a is less wettable with the first bonding solder 311 (described below) and the second bonding solder 312 (described below) than the first opposing plating 261 and the second opposing plating 262, respectively.

[0041] The third plating 270 also has a second uneven portion 270a that is uneven in a direction perpendicular to the connecting terminal surface 400c, similar to the third opposing plating 263. The second uneven portion 270a is formed continuously on the surface of the third plating 270 on the side away from the connecting terminal surface 400c.

[0042] The third plating 270 has low wettability due to the formation of the second uneven portion 270a on its surface. As a result, the second uneven portion 270a is less wettable by the solder 300 than the first plating 250, the first opposing plating 261, and the second opposing plating 262. More specifically, the second uneven portion 270a is less wettable by the second solder 320, the first bonding solder 311 described below, and the second bonding solder 312 described below than the first plating 250, the first opposing plating 261, and the second opposing plating 262. Details of the solder 300 will be described later.

[0043] 2, the first heat sink 500 has a flat shape with a small thickness in the z direction. The first heat sink 500 is provided on the second main surface 200b side of the semiconductor element 200.

[0044] 1 is connected to the first heat sink 500. The first main terminal 710 is a terminal 700 that is electrically connected to the collector electrode 220 of the semiconductor element 200.

[0045] The first heat sink 500 has a heat dissipation function of dissipating heat from the transistors formed in the semiconductor element 200 to the outside of the semiconductor element 200, and a function of electrically connecting the collector electrode 220 and the first main terminal 710. Like the terminal 400, the first heat sink 500 is formed using a metal member such as copper that has excellent thermal conductivity and electrical conductivity.

[0046] The second heat sink 600 also has a flat shape with a small thickness in the z direction. As shown in FIG.

[0047] A second main terminal 720 is connected to the second heat sink 600. The second main terminal 720 is a terminal 700 that is electrically connected to the emitter electrode 210 of the semiconductor element 200.

[0048] The second heat sink 600 has a heat dissipation function of dissipating heat from the transistors formed in the semiconductor element 200 to the outside of the semiconductor element 200, and a function of electrically relaying the emitter electrode 210 and the second main terminal 720. Like the terminal 400 and the first heat sink 500, the second heat sink 600 is formed using a metal member such as copper that has excellent thermal conductivity and electrical conductivity.

[0049] Next, we will explain the solder 300. The solder 300 has a first solder 310, a second solder 320, and a third solder 330. The first solder 310 corresponds to a solder member.

[0050] A first solder 310 is provided between the emitter electrode 210 and the second plating 260. More specifically, the first solder 310 is divided into a first joining solder 311 provided between the first emitter electrode 211 and the first opposing plating 261, and a second joining solder 312 provided between the second emitter electrode 212 and the second opposing plating 262.

[0051] The first emitter electrode 211 and the first opposing plating 261 are electrically and mechanically joined via a first joining solder 311. The second emitter electrode 212 and the second opposing plating 262 are electrically and mechanically joined via a second joining solder 312.

[0052] The second solder 320 is provided between the first plating 250 and the second heat sink 600. The first plating 250 and the second heat sink 600 are electrically and mechanically joined via the second solder 320.

[0053] A third solder 330 is provided between the collector electrode 220 and the first heat sink 500. The collector electrode 220 and the first heat sink 500 are electrically and mechanically joined via the third solder 330.

[0054] <Contact angle of first solder> As shown in FIGS. 5 and 6, the end of the first uneven portion 263a on the first emitter electrode 211 side is located closer to the first emitter electrode 211 in the x direction than the end of the first protective portion 241 on the first emitter electrode 211 side.

[0055] The end of the first uneven portion 263a on the second emitter electrode 212 side is located closer to the second emitter electrode 212 in the x direction than the end of the first protective portion 241 on the second emitter electrode 212 side.

[0056] The length L1 of the first uneven portion 263a in the x direction is longer than the length L2 of the first protection portion 241 in the x direction.

[0057] Furthermore, the entire portion of the first protection part 241 that faces the terminal 400 in the z direction is included within the projection area of ​​the first concave-convex part 263a in the z direction.

[0058] As described above, the first uneven portion 263a and the first protective portion 241 are less likely to be wetted by the first bonding solder 311 and the second bonding solder 312, respectively.

[0059] 6, the contact angle between the part of the first bonding solder 311 on the first protective section 241 side and the first emitter electrode 211 is acute. The contact angle between the part of the second bonding solder 312 on the first protective section 241 side and the second emitter electrode 212 is acute.

[0060] 5 and 6, all of the terminals 400 are included within a projected area in the z direction of the semiconductor element 200. More specifically, all of the terminals 400 are included within a projected area in the z direction of the combined area of ​​the first emitter electrode 211, the second emitter electrode 212, and the first protective portion 241 of the semiconductor element 200.

[0061] As described above, each of the four connecting terminal surfaces 400c connecting the first terminal surface 400a and the second terminal surface 400b has a second uneven portion 270a formed thereon that is difficult to wet with the first joining solder 311, the second joining solder 312, and the second solder 320, respectively.

[0062] 6, the contact angle between the part of the first bonding solder 311 on the second protective section 242 side and the first emitter electrode 211 is acute. The contact angle between the part of the second bonding solder 312 on the second protective section 242 side and the second emitter electrode 212 is acute.

[0063] The first bonding solder 311 and the second bonding solder 312 each form a roughly truncated quadrangular pyramid. That is, the first solder 310 is divided into the first bonding solder 311 and the second bonding solder 312 by the first protective portion 241 and the first uneven portion 263a.

[0064] This makes it difficult for the first bonding solder 311 and the second bonding solder 312 to be bridged, and makes it difficult for the first bonding solder 311 and the second bonding solder 312 to be electrically and mechanically bonded.

[0065] <Electrical resistance of the conductive path between the first and second heat sinks> As shown in FIG. 2, the first heat sink 500 and the second heat sink 600 are electrically connected via the first solder 310 , the semiconductor element 200 , the second solder 320 , the terminal 400 , and the third solder 330 .

[0066] As explained above, the first uneven portion 263a is less likely to be wetted by the first bonding solder 311 and the second bonding solder 312. The first bonding solder 311 and the second bonding solder 312 are less likely to be electrically and mechanically bonded to the portion of the terminal where the first uneven portion 263a is provided. Therefore, current is less likely to flow between the first terminal surface 400a and the second terminal surface 400b at the location where the first uneven portion 263a of the terminal 400 is provided, and the electrical resistance between the first terminal surface 400a and the second terminal surface 400b is high.

[0067] 6, the sum of the length L3 in the x direction of the first opposing plating 261 and the length L4 in the x direction of the second opposing plating 262 is longer than the length L1 in the x direction of the first uneven portion 263a. This makes it easier to prevent the electrical resistance between the first terminal surface 400a and the second terminal surface 400b from becoming too high.

[0068] Furthermore, the length L1 in the x direction of the first uneven portion 263a may be shorter than both the length L3 in the x direction of the first opposing plating 261 and the length L4 in the x direction of the second opposing plating 262.

[0069] (Second embodiment) In the first embodiment, the emitter electrode 210 is described as being divided into two by the first protective portion 241, but the emitter electrode 210 may be divided into two or more by a plurality of first protective portions 241 extending in the y direction. Accordingly, the first gate liner 231 may be covered and protected by each of the plurality of first protective portions 241.

[0070] As shown in FIGS. 7 and 8, in the second embodiment, each of the first emitter electrode 211 and the second emitter electrode 212 is further divided into two in the x direction by one of the multiple first protective portions 241.

[0071] A first gate liner 231 is disposed in a first protective portion 241 between one of the first emitter electrodes 211 divided into two in the x direction and the other first emitter electrode 211 .

[0072] Similarly, a first gate liner 231 is arranged in a first protective portion 241 between one of the two second emitter electrodes 212 divided in the x direction and the other second emitter electrode 212.

[0073] 8, a plurality of continuous first uneven portions 263a are formed on the second terminal surface 400b at positions facing the plurality of first protective portions 241 in the z direction. Note that in order to clarify the positional relationship between the first uneven portions 263a and the first protective portions 241, Fig. 8 shows the second terminal surface 400b superimposed on the semiconductor element 200.

[0074] The length L1 in the x direction of each of the multiple first uneven portions 263a is longer than the length L2 in the x direction of each of the multiple first protection portions 241. Therefore, the second embodiment can also achieve the same effects as the first embodiment.

[0075] In the second embodiment, an example in which the emitter electrode 210 is divided into four sections in the x direction by the plurality of first protective portions 241 has been specifically described, but the number of sections into which the emitter electrode 210 is divided is not limited to four. The emitter electrode 210 may be divided into four or more sections in the x direction.

[0076] (Third embodiment) 9 and 10, in addition to the first protective portion 241 that is continuous in the y direction, a first protective portion 241 that is continuous in the x direction may be provided. The first emitter electrode 211 and the second emitter electrode 212 may each be further divided into two in the y direction by the first protective portion 241 that is continuous in the x direction. Accordingly, the first gate liner 231 may be covered and protected by the first protective portion 241 that is continuous in the x direction.

[0077] 10, a first uneven portion 263a continuing in the x direction and a first uneven portion 263a continuing in the y direction are formed at portions of the second terminal surface 400b that face each other in the z direction to the first protective portion 241 continuing in the x direction and the first protective portion 241 continuing in the y direction. Note that in order to clarify the positional relationship between the first uneven portion 263a and the first protective portion 241, Fig. 10 shows the second terminal surface 400b superimposed on the semiconductor element 200.

[0078] The length L1 in the x direction of the first uneven portion 263a that is continuous in the y direction is longer than the length L2 in the x direction of the first protective portion 241 that is continuous in the y direction among the first protective portions 241 that are continuous in the y direction. The length L5 in the y direction of the first uneven portion 263a that is continuous in the x direction is longer than the length L6 of both ends in the y direction of the first protective portion 241 that is continuous in the x direction. Therefore, the third embodiment can also achieve the same effects as the first embodiment.

[0079] (Fourth embodiment) In the first to third embodiments, the description has been given of an embodiment in which the entire portion of the first protective portion 241 facing the terminal 400 is included within the z-direction projection area of ​​the first uneven portion 263a. However, as shown in the fourth embodiment in Figures 11 and 12, the entire first protective portion 241 may be included within the z-direction projection area of ​​the first uneven portion 263a. Note that Figure 12 shows a diagram in which the outlines of the first emitter electrode 211 and the second emitter electrode 212 are superimposed on the second terminal surface 400b.

[0080] In this case, the entire semiconductor element 200 is included in the z-direction projection area of ​​the terminal 400. Furthermore, a fourth opposing plating 264 is provided on the second terminal surface 400b, annularly surrounding the area where the first opposing plating 261, the second opposing plating 262, and the third opposing plating 263 are combined.

[0081] A third uneven portion 264a that is uneven in the z direction is formed on the fourth opposing plating 264. The third uneven portion 264a is formed continuously on the surface of the fourth opposing plating 264 on the second protective portion 242 side. The third uneven portion 264a is less likely to be wetted by the first bonding solder 311 and the second bonding solder 312 than the first opposing plating 261 and the second opposing plating 262, respectively.

[0082] For this reason, the contact angle between the first bonding solder 311 on the connecting terminal surface 400c side and the first emitter electrode 211 is an acute angle. The contact angle between the second bonding solder 312 on the connecting terminal surface 400c side and the second emitter electrode 212 is also an acute angle. Even if the second uneven portion 270a is not formed on the connecting terminal surface 400c, the first bonding solder 311 and the second bonding solder 312 each form a substantially quadrangular pyramid shape. The fourth embodiment can also achieve the same effects as the first embodiment.

[0083] <Action and effect> As explained above, the first uneven portion 263a and the first protective portion 241 are difficult to wet with the first joining solder 311 and the second joining solder 312, respectively, and the first solder 310 is divided into the first joining solder 311 and the second joining solder 312.

[0084] This makes it difficult for the first bonding solder 311 and the second bonding solder 312 to form a bridge between the semiconductor element 200 and the terminal 400. Accordingly, it is easier to prevent the thickness of the first solder 310 in the z direction from becoming locally thin.

[0085] This makes it easier to prevent stress from concentrating on the first solder 310. It also makes it easier to prevent cracks from occurring in the first solder 310.

[0086] As described above, the entire portion of the first protection portion 241 that faces the terminal 400 in the z direction is included within the projection area of ​​the first concave-convex portion 263a in the z direction.

[0087] The length L1 of the first uneven portion 263a in the x direction is longer than the length L2 of the first protection portion 241 in the x direction.

[0088] As a result, the contact angle between the portion of the first bonding solder 311 on the first protective portion 241 side and the first emitter electrode 211, and the contact angle between the portion of the second bonding solder 312 on the first protective portion 241 side and the second emitter electrode 212 are both acute angles.

[0089] Furthermore, when the contact angle between the semiconductor element 200 and the solder 300 provided on the semiconductor element 200 is acute, the stress applied to the semiconductor element 200 tends to be smaller than when the contact angle is obtuse.

[0090] This tends to reduce the stress applied from the first bonding solder 311 to the first emitter electrode 211. This tends to prevent cracks from occurring in the first emitter electrode 211.

[0091] Similarly, the stress applied from the second bonding solder 312 to the second emitter electrode 212 is likely to be reduced, and the occurrence of cracks in the second emitter electrode 212 is likely to be suppressed.

[0092] In summary, the stress applied from the first solder 310 to the emitter electrode 210 is more likely to be reduced, and the occurrence of cracks in the emitter electrode 210 is more likely to be suppressed.

[0093] As explained above, the first uneven portion 263a is difficult to wet with the first bonding solder 311 and the second bonding solder 312. If there is an area that is not wetted by the first solder 310, such as the first uneven portion 263a, the electrical resistance and thermal resistance between the first terminal surface 400a and the second terminal surface 400b will increase.

[0094] To achieve this, the sum of the x-direction length L3 of the first opposing plating 261 and the x-direction length L4 of the second opposing plating 262 is longer than the x-direction length L1 of the first uneven portion 263a, which makes it easier to prevent the electrical resistance and thermal resistance between the first terminal surface 400a and the second terminal surface 400b from becoming too high.

[0095] As explained above, the surface of the third plating 270 away from the connecting terminal surface 400c is formed with a second uneven portion 270a that is difficult to wet with the first solder 310 and the second solder 320.

[0096] This makes it difficult for the first solder 310 and the second solder 320 to wet and spread from one side to the other on the connecting terminal surface 400c.

[0097] Accordingly, for example, the second solder 320 flows into the first solder 310 side, and the amount of the first solder 310 increases, which makes it easier to prevent cracks from occurring in the emitter electrode 210 due to stress.

[0098] (First Modification) In the embodiments described above, the contact angles of the first bonding solder 311 and the second bonding solder 312 with the emitter electrode 210 have been explained, focusing on the relationship between the x-direction length L1 of the first uneven portion 263a and the x-direction length L2 of the first protective portion 241.

[0099] However, as shown in FIG. 13, the length L1 of the first uneven portion 263a in the x-direction may be equal to or greater than the sum of twice the separation distance L7 between the first uneven portion 263a and the first protective portion 241 in the z-direction and the length L2 of the first protective portion 241 in the x-direction.

[0100] This makes it easier for the contact angle between the part of the first bonding solder 311 on the first protective section 241 side and the first emitter electrode 211 to be 45 degrees or less. It also makes it easier for the contact angle between the part of the second bonding solder 312 on the first protective section 241 side and the second emitter electrode 212 to be 45 degrees or less.

[0101] Furthermore, as shown in FIG. 14, as the contact angle between the semiconductor element 200 and the solder 300 provided on the semiconductor element 200 becomes smaller, the life of the semiconductor element 200 tends to be extended.

[0102] According to this, when the contact angle between the first bonding solder 311 and the first emitter electrode 211 and the contact angle between the second bonding solder 312 and the second emitter electrode 212 are 45 degrees or less, the lifespan of the semiconductor element 200 is likely to be extended by about one digit.

[0103] (Second Modification) In the embodiments described so far, the z-direction projection area of ​​the first uneven portion 263a includes the portion of the first protective portion 241 that faces the terminal 400. However, as shown in Fig. 15, the z-direction projection area of ​​the first uneven portion 263a does not necessarily include the first protective portion 241. As shown in Fig. 15, the first uneven portion 263a may be partially formed at one end of the third opposing plating 263 on the first opposing plating 261 side and at the other end on the second opposing plating 262 side.

[0104] 15, the first solder 310 may be divided into the first bonding solder 311 and the second bonding solder 312 by the first protective portion 241 and the first uneven portion 263a. If the first bonding solder 311 and the second bonding solder 312 are divided, it is easier to prevent the thickness of the first solder 310 from becoming locally thin in the z direction.

[0105] (Third Modification) In the embodiments described so far, the length L1 in the x direction of the first uneven portion 263a is longer than the length L2 in the x direction of the first protective portion 241. However, as shown in Fig. 16 , the length in the x direction of the first uneven portion 263a may be the same as the length in the x direction of the first protective portion 241.

[0106] In this case, the contact angle between the portion of the first bonding solder 311 on the first protective section 241 side and the first emitter electrode 211 is a right angle. The contact angle between the portion of the second bonding solder 312 on the first protective section 241 side and the second emitter electrode 212 is a right angle. The first bonding solder 311 and the second bonding solder 312 are less likely to be bridged between the semiconductor element 200 and the terminal 400. Local thinning of the thickness of the first solder 310 in the z direction is more likely to be suppressed.

[0107] (Fourth Modification) 17, the length L1 in the x direction of the first uneven portion 263a may be shorter than the length L2 in the x direction of the first protective portion 241. In this case as well, the first bonding solder 311 and the second bonding solder 312 are less likely to be bridged between the semiconductor element 200 and the terminal 400. This makes it easier to prevent the thickness of the first solder 310 from becoming locally thin in the z direction.

[0108] (Fifth Modification) Although not shown, a part of the first protective portion 241 may be included within the z-direction projection area of ​​the first uneven portion 263a. Accordingly, for example, the contact angle between the part of the first bonding solder 311 on the first protective portion 241 side and the first emitter electrode 211 may be an acute angle, and the contact angle between the part of the second bonding solder 312 on the first protective portion 241 side and the second emitter electrode 212 may be an obtuse angle.

[0109] (Sixth Modification) Although not shown, a coating film containing polyimide or the like that is resistant to wettability with solder 300 may be provided on second terminal surface 400b instead of third opposing plating 263. It is sufficient that first solder 310 is divided into first joining solder 311 and second joining solder 312 by the coating film and first protective portion 241.

[0110] (Other variations) Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more, or less are also within the scope and spirit of the present disclosure. [Explanation of symbols]

[0111] 200...semiconductor element, 200a...first main surface, 200b...second main surface, 210...emitter electrode, 220...collector electrode, 230...gate liner, 240...protective film, 241...first protective portion, 261...first opposing plating, 262...second opposing plating, 263...third opposing plating, 263a...first uneven portion, 310...first solder, 400...terminal, 400b...second terminal surface

Claims

1. a semiconductor element (200) including: a first main electrode (210) formed on a first main surface (200a); a second main electrode (220) formed on a second main surface (200b) on the back side of the first main surface in the plate thickness direction; and a protective film (240) provided on the first main surface and including partition portions (241) that partition the first main electrode into a plurality of regions; a conductive member (400) including, on an opposing surface (400b) opposing the first main surface in the plate thickness direction, a plurality of opposing portions (261, 262) opposing the first main electrode in the plate thickness direction, and intervening portions (263) provided between the plurality of opposing portions in an arrangement direction of the plurality of opposing portions; a solder member (310) provided between the first main electrode and the plurality of opposing portions and partitioned into a plurality of regions by the partition portion and the intervening portion; the partition portion is less wettable with the solder material than the first main electrode, the interposed portion is less likely to be wetted by the solder member than the opposed portion, The semiconductor device, wherein the length of the intervening portion in the arrangement direction is equal to or less than the length of the partitioning portion in the arrangement direction.

2. A semiconductor device as described in claim 1, wherein an uneven portion (264a) is formed on the opposing surface, surrounding the intervening portion and the plurality of opposing portions in a ring shape, and is uneven in the plate thickness direction and less likely to become wetted by the solder member than the opposing portions.

3. The conductive member has a back surface (400a) on the back side of the opposing surface, spaced apart from the opposing surface in the plate thickness direction, and a connecting surface (400c) connecting the opposing surface and the back surface, 3. The semiconductor device according to claim 1, wherein said connecting surface has an uneven portion (270a) that is uneven in a direction perpendicular to said connecting surface.

4. A semiconductor device described in any one of claims 1 to 3, wherein the first main electrode is partitioned into three or more parts in the arrangement direction by a plurality of the partition portions.

5. A semiconductor device described in any one of claims 1 to 4, wherein the first main electrode is divided into two by the partition portion in an orthogonal direction perpendicular to the arrangement direction of the first main surface.

6. A semiconductor device described in any one of claims 1 to 5, wherein the conductive member is a metal member having a surface plated with a material having a melting point lower than that of the metal member.

7. A semiconductor device described in any one of claims 1 to 6, having a coating resin (800) that covers the semiconductor element and the conductive member.

8. A semiconductor device as described in Claim 7, wherein main terminals connected to the collector electrode (220) and emitter electrode of the semiconductor element, respectively, protrude from the coating resin in a direction perpendicular to the plate thickness direction.

9. A semiconductor device as described in claim 7 or 8, wherein at least a signal terminal connected to a gate electrode of the semiconductor element protrudes from the coating resin in a direction perpendicular to the plate thickness direction.

10. A semiconductor device as described in Claim 7, wherein the main terminals connected to the collector electrode (220) and emitter electrode of the semiconductor element, respectively, and the signal terminals connected to at least the gate electrode of the semiconductor element, each extend in opposite directions from opposite sides of the coating resin in a direction perpendicular to the plate thickness direction from the coating resin.

11. A heat dissipation member (600) for dissipating heat from the semiconductor element to the outside, 11. The semiconductor device according to claim 7, wherein the heat dissipation member is exposed from the coating resin.

12. A semiconductor device described in any one of claims 1 to 11, wherein the semiconductor device constitutes one of a plurality of arms that constitute a three-phase inverter, or constitutes two of the plurality of arms.

13. A semiconductor device described in any one of claims 1 to 12, wherein the semiconductor element is a power transistor formed in a semiconductor material made of silicon or silicon carbide.

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