Conductor cooling structure

Abstract

To provide a conductor member cooling structure capable of improving the cooling efficiency for a conductor member.SOLUTION: A conductor member cooling structure 1 is a flat-plate-like member for cooling a conductor member C1 placed on a surface 111, and includes a cooling plate 11 having a conductor groove 112 formed on the surface 111, and formed along the shape of the conductor member C1 in a longitudinal direction D11 and having a depth sufficient to accommodate a part of the conductor member C1 in a thickness direction D12, and a heat transfer member 12 formed of an insulating material that covers an area wider than the conductor groove 112 on the surface 111 of the cooling plate 11 so as to be sandwiched between an inner groove surface 112a of the conductor groove 112 and the conductor member C1, and transfers heat of the conductor member C1 to the cooling plate 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a conductor cooling structure for cooling a conductor member that connects a component terminal of an electric or electronic component to an electrical connection target. [Background technology]

[0002] Conventionally, there is known a cooling structure in which the bottom wall of the device housing serves as a cooling plate, and heat from a conductor member that connects the component terminals of an electric / electronic component to an electrical connection target is transferred to the cooling plate and dissipated (see, for example, Patent Document 1). The cooling structure of Patent Document 1 is structured to transfer heat from the metal conductor member to the cooling plate via an insulating member, thereby dissipating heat from the conductor member while preventing electrical leakage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-127302 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, in the cooling structure of Patent Document 1, the heat transfer distance between the conductor member and the cooling plate via the intervening material is long, and the cooling efficiency tends to be low.

[0005] Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a conductor cooling structure that can improve the cooling efficiency of a conductor member. [Means for solving the problem]

[0006] In order to solve the above problems, the conductor cooling structure is a flat plate-like member formed of a conductive metal in a strip shape, one end of which is connected to a component terminal of a predetermined electric / electronic component, and the other end of which is connected to an electrical connection target of the electric / electronic component, and in a state where a conductor member is placed on the surface and the electric / electronic component is fixed to the surface, the conductor cooling structure cools the conductor member, and the conductor member is formed along the longitudinal shape of the conductor member. and the portion of the conductor member that is placed on the surface has a shape that overlaps over the entire length. The cooling plate is characterized by having a conductor groove formed on its surface with a depth sufficient to accommodate the conductor member at least partially in its thickness direction, and a heat transfer member formed of an insulating material that covers at least an area on the surface of the cooling plate that is wider than the conductor groove so as to be sandwiched between the inner surface of the conductor groove and the conductor member, and that transfers heat from the conductor member to the cooling plate. [Effects of the Invention]

[0007] According to the above-described conductor cooling structure, the cooling efficiency for the conductor member can be improved. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a conductor cooling structure according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the conductor cooling structure shown in FIG. [Figure 3] 2 is a side view of the conductor cooling structure as seen from the direction of arrow V11 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment of a conductor cooling structure will be described below.

[0010] Fig. 1 is a perspective view showing a conductor cooling structure according to one embodiment, and Fig. 2 is an exploded perspective view of the conductor cooling structure shown in Fig. 1. Also, Fig. 3 is a side view of the conductor cooling structure as seen from the direction of arrow V11 in Fig. 1.

[0011] The conductor cooling structure 1 in this embodiment is configured to cool conductor members C1 that connect component terminals E11 of a relay, which is an electric / electronic component E1, to an electrical connection target of the electric / electronic component E1. The electric / electronic component E1 is provided with a pair of component terminals E11, and a pair of conductor members C1 are provided in a one-to-one correspondence with the pair of component terminals E11. Each conductor member C1 is made of a conductive metal such as copper and is formed into an L-shaped strip bent 90° along the middle, with one end connected to the component terminal E11 and the other end connected to the electrical connection target to form a bus bar through which current flows. The conductor cooling structure 1 for cooling the pair of conductor members C1 includes a cooling plate 11 and a heat transfer member 12 that transfers heat generated in the conductor member C1 when current is passed through the cooling plate 11.

[0012] The cooling plate 11 is a flat member on which a pair of conductor members C1 are placed and on which an electric / electronic component E1 is fixed, thereby cooling the conductor members C1. A pair of conductor grooves 112 is formed on the surface 111 of the cooling plate 11, and the pair of conductor members C1 are aligned in a one-to-one relationship with the L-shaped bent shape of the pair of conductor members C1 in the longitudinal direction D11. Each conductor groove 112 is formed as an L-shaped angular groove having a depth sufficient to accommodate at least a portion (approximately half in this embodiment) of the conductor member C1 in the thickness direction D12.

[0013] Furthermore, component-fixing studs 113 are provided on the surface 111 of the cooling plate 11 to fix an electric / electronic component E1 having a pair of conductor members C1 connected to component terminals E11. A pair of fixing flanges E12 protrude from the outer surface of the electric / electronic component E1 for screw fastening, and a pair of component-fixing studs 113 are provided on the cooling plate 11 in a one-to-one correspondence with the pair of fixing flanges E12. With the pair of conductor members C1 fixed to the electric / electronic component E1, each fixing flange E12 is placed on the tip surface of each component-fixing stud 113. Then, screws E13 passing through the fixing flanges E12 are screwed into threaded holes 113a of the component-fixing studs 113, thereby fixing the electric / electronic component E1 together with the pair of conductor members C1 to the cooling plate 11.

[0014] The heat transfer member 12 is a flexible sheet material that is placed on the surface 111 of the cooling plate 11 so as to be sandwiched between the groove inner surfaces 112a of the pair of conductor grooves 112 and the pair of conductor members C1. An example of this flexible sheet material is a heat transfer sheet such as Laird's Tflex SF600 Series (registered trademark). In this embodiment, the heat transfer member 12 is disposed to cover the entire surface 111 of the cooling plate 11, thereby covering a wider area than the pair of conductor grooves 112 and transferring heat from the pair of conductor members C1 to the cooling plate 11. The heat transfer member 12 is also provided with stud through-holes 121 through which a pair of component fixing studs 113 of the cooling plate 11 penetrate. The electric / electronic component E1 is fixed to the cooling plate 11 by the above-described screw fastening, pressing the pair of conductor members C1 into the pair of conductor grooves 112 with the heat transfer member 12 sandwiched therebetween.

[0015] Furthermore, each conductor groove 112 in the cooling plate 11 is wider than each conductor member C1 by an amount corresponding to the thickness of the heat transfer member 12. When the electric / electronic component E1 is fixed by the above-described screw fastening, the portion of the heat transfer member 12 covering each conductor groove 112 is pressed into the conductor groove 112 by the conductor member C1. When the conductor member C1 is pressed against the conductor groove 112, the heat transfer member 12, which is a flexible sheet material, is pressed into the conductor groove 112 so as to be crushed in the member thickness direction D13 of the heat transfer member 12. This pressing brings the heat transfer member 12 into close contact with the groove inner surface 112a of each conductor groove 112 and the outer surface of the conductor member C1 at the following locations: First, the heat transfer member 12 is sandwiched and tightly contacted between both the groove bottom surface 112a-1 of the groove inner surface 112a of each conductor groove 112 and the groove opposing surface C11 of the front and back surfaces of the conductor member C1 that faces the groove bottom surface 112a-1. Furthermore, the heat transfer member 12 is sandwiched and in close contact with both a pair of opposing groove side surfaces 112a-2 on the groove inner surface 112a and a pair of side end surfaces C12 extending in the thickness direction D12 of the conductive member C1.

[0016] According to the conductor cooling structure 1 described above, the distance between the conductor member C1 and the cooling plate 11 is kept short, corresponding to the thickness of the heat transfer member 12 inside the conductor groove 112. Furthermore, because the heat transfer member 12 covers a wider area than the conductor groove 112, the heat transfer member 12 transfers heat to the cooling plate 11 and cools the following areas: First, the groove-facing surface C11 of the front and back surfaces of the conductor member C1 that faces the cooling plate 11 is cooled. In addition, the heat transfer member 12 also transfers heat to the cooling plate 11 from the side end surface C12 of the conductor member C1 that is located inside the conductor groove 112 in the thickness direction D12. Because the cooled areas extend to the side end surfaces C12 of the conductor member C1 in this way, coupled with the short distance between the conductor member C1 and the cooling plate 11, the cooling efficiency for the conductor member C1 can be improved.

[0017] In this embodiment, the conductor groove 112 is wider than the conductor member C1 by an amount corresponding to the thickness of the heat transfer member 12. With this configuration, the heat transfer member 12 can be effectively inserted between the side end surface C12 of the conductor member C1 and the groove side surface 112a-2 of the conductor groove 112, thereby effectively transferring heat between them, thereby further improving cooling efficiency.

[0018] Moreover, in this embodiment, the heat transfer member 12 is disposed so as to cover the entire surface 111 of the cooling plate 11. With this configuration, the heat transfer member 12 does not require fine shaping, and the heat transfer member 12 can be effectively interposed between the groove inner surface 112a of the conductor groove 112 and the conductor member C1, thereby reducing manufacturing costs.

[0019] In this embodiment, component fixing studs 113 are provided on the surface 111 of the cooling plate 11, and stud through holes 121 are formed in the heat transfer member 12. When the electric / electronic component E1 is fixed to the cooling plate 11 via the component fixing studs 113, the conductor member C1 is pressed into the conductor groove 112 with the heat transfer member 12 sandwiched between the component fixing studs 113 and the groove inner surface 112a. With this configuration, the conductor member C1 can be effectively pressed into the conductor groove 112 of the cooling plate 11 with the heat transfer member 12 sandwiched between them by fixing the electric / electronic component E1, thereby reducing manufacturing costs compared to providing a separate pressing structure for the conductor member C1.

[0020] Furthermore, in this embodiment, the heat transfer member 12 is a flexible sheet material, and when the conductor member C1 is pressed against the conductor groove 112, the heat transfer member 12 comes into close contact with both the groove bottom surface 112a-1 and the groove opposing surface C11, and both the groove side surface 112a-2 and the side end surface C12. According to this configuration, by using a flexible sheet material for the heat transfer member 12, the degree of contact between the conductor member C1 and the heat transfer member 12 at the above-mentioned locations in the conductor groove 112 can be increased, thereby further improving cooling efficiency.

[0021] The above-described embodiment merely shows a typical example of the conductor cooling structure, and the conductor cooling structure is not limited to this and can be implemented in various modifications.

[0022] For example, in the above-described embodiment, the conductor cooling structure 1 for cooling a conductor member C1 connected to a relay, which is an electric / electronic component E1, is exemplified as an example of the conductor cooling structure. However, the conductor cooling structure is not limited to this, and the object to be cooled may be a conductor member connected to an electric component other than a relay, or may be a conductor member connected to another electronic component.

[0023] Furthermore, in the above-described embodiment, as an example of a conductor cooling structure, a conductor cooling structure 1 in which a pair of conductor grooves 112 are provided in the cooling plate 11 in one-to-one correspondence with a pair of conductor members C1 connected to an electric / electronic component E1 is exemplified. However, the conductor cooling structure is not limited to this, and may be one in which there is one conductor member connected to an electric / electronic component and only one conductor groove is provided in the cooling plate in one-to-one correspondence with the conductor member. Alternatively, three or more conductor members may be connected to an electric / electronic component and a plurality of conductor grooves may be provided in one-to-one correspondence with the plurality of conductor members.

[0024] Furthermore, in the above-described embodiment, as an example of a conductor cooling structure, a conductor cooling structure 1 is illustrated in which the conductor groove 112 is formed as an L-shaped rectangular groove in the cooling plate 11 corresponding to the conductor member C1 formed in the shape of an L-shaped strip. However, the conductor cooling structure is not limited to this. The shape of the conductor member to be cooled may be any shape other than L as long as it is strip-shaped, and the conductor groove provided in the cooling plate may also be formed in a shape other than L depending on the shape of the conductor member. Furthermore, the conductor groove is not limited to a rectangular groove, and may be a polygonal groove other than a rectangular groove, a round groove, or the like, as long as it is deep enough to accommodate the conductor member at least partially in the thickness direction.

[0025] In the above-described embodiment, the heat transfer member 12 is exemplified by a heat transfer sheet such as Laird's Tflex SF600 Series (registered trademark), but the heat transfer member is not limited to this and any material may be used as long as it is made of an insulating material that is sandwiched between the inner surface of the conductor groove and the conductor members and transfers heat from the conductor members to the cooling plate.

[0026] In the above-described embodiment, the conductor groove 112 is exemplified as an example of the conductor groove, which is wider than the conductor member C1 by an amount corresponding to the thickness of the heat transfer member 12. However, the conductor groove is not limited to this, and any groove width may be adopted as long as it is formed along the length direction of the strip-shaped conductor member and can accommodate at least a portion of the conductor member C1 in the thickness direction. However, as described above, the conductor groove 112 is wider than the conductor member C1 by an amount corresponding to the thickness of the heat transfer member 12, making it possible to effectively transfer heat via the heat transfer member 12 and further improve cooling efficiency.

[0027] Furthermore, in the above-described embodiment, the heat transfer member 12 arranged to cover the entire surface 111 of the cooling plate 11 is exemplified as an example of the heat transfer member. However, the heat transfer member is not limited to this, and may be, for example, a conductor member or a member processed into a shape corresponding to the shape of the conductor groove, as long as it covers an area wider than the conductor groove on the surface of the cooling plate. However, as described above, the heat transfer member 12 arranged to cover the entire surface 111 of the cooling plate 11 does not require detailed shape processing of the heat transfer member 12, thereby reducing manufacturing costs.

[0028] Furthermore, in the above-described embodiment, as an example of a conductor cooling structure, a conductor cooling structure 1 is shown in which component fixing studs 113 are provided on the surface 111 of the cooling plate 11 and stud through holes 121 are provided in the heat transfer member 12. However, the conductor cooling structure is not limited to this, and any manner of attaching an electric / electronic component to the cooling plate can be adopted, and the heat transfer member can be formed in various shapes that do not interfere with the attachment. However, as described above, by attaching the electric / electronic component E1 to the cooling plate 11 via the component fixing studs 113 and using a heat transfer member 12 shaped to avoid the component fixing studs 113, manufacturing costs can be reduced.

[0029] Furthermore, in the above-described embodiment, as an example of the heat transfer member, the heat transfer member 12 is formed from a flexible sheet material and is crushed when the conductor member C1 is pressed against the conductor groove 112, thereby coming into close contact with various locations on the inner surface 112a of the conductor groove 112 and various locations on the conductor member. However, the heat transfer member is not limited to this, and may be, for example, a hard resin formed into a shape corresponding to the inner surface shape of the conductor groove and the outer surface shape of the conductor member. However, as described above, by using a flexible sheet material for the heat transfer member 12 and crushing it when the conductor member C1 is pressed against it to come into close contact with the above-described locations, the cooling efficiency can be further improved. [Explanation of symbols]

[0030] 1 Conductor cooling structure 11 Cooling plate 12 Heat transfer material 111 Surface 112 Conductor groove 112a Groove inner surface 112a-1 Groove bottom surface 112a-2 Groove side 113 Part fixing stud 113a screw hole 121 Stud through hole C1 Conductor material C11 Groove facing surface C12 side end face D11 Longitudinal direction D12 Thickness direction D13 Material thickness direction E1 Electrical and electronic components E11 Component terminal E12 fixed flange E13 screw

Claims

1. a cooling plate made of a conductive metal in the shape of a strip, one end of which is connected to a component terminal of a predetermined electric / electronic component and the other end of which is connected to an electrical connection target of the electric / electronic component, and which is a flat plate-like member on whose surface the electric / electronic component is fixed in a state in which the electric / electronic component is placed and which cools the conductor member, the cooling plate extending along the longitudinal shape of the conductor member, the portion of the conductor member that is placed on the surface being shaped to overlap over its entire length, and a conductor groove formed on its surface that is deep enough to accommodate the conductor member over at least a portion of its thickness; a heat transfer member formed of an insulating material that covers at least an area of ​​the surface of the cooling plate that is wider than the conductor groove so as to be sandwiched between the inner surface of the conductor groove and the conductor member, and that transfers heat from the conductor member to the cooling plate; A conductor cooling structure comprising:

2. 2. The conductor cooling structure according to claim 1, wherein the conductor groove is wider than the conductor member by an amount corresponding to the thickness of the heat transfer member.

3. The conductor cooling structure according to claim 1 , wherein the heat transfer member is disposed so as to cover the entire surface of the cooling plate.

4. a component fixing stud is provided on the surface of the cooling plate, and the component fixing stud fixes the electric / electronic component having the conductor member connected to the component terminal, so as to press the conductor member against the conductor groove with the heat transfer member sandwiched between the component fixing stud and the inner surface of the groove; 4. The conductor cooling structure according to claim 3, wherein the heat transfer member is provided with a stud through-hole through which the component fixing stud passes.

5. The conductor cooling structure described in claim 1, characterized in that when the conductor member is pressed against the conductor groove, the heat transfer member is crushed in the thickness direction of the heat transfer member, and is in close contact with both the groove bottom surface on the inner surface of the groove and the groove opposing surfaces of the front and back surfaces of the conductor member facing the groove bottom surface, as well as both the groove side surfaces on the inner surface of the groove and the side end surfaces of the conductor member extending in the thickness direction.

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