Die bonding device and method for manufacturing semiconductor device

Abstract

To provide a technique for performing self diagnosis on the basis of log data of an inspection result.SOLUTION: A die bonding device comprises: an application device which applies a paste-like adhesive onto a substrate; an imaging device which images the paste-like adhesive applied on the substrate; and a control device which performs a visual inspection on the basis of an image of the paste-like adhesive captured by the imaging device. The control device is configured to perform the visual inspection every time the paste-like adhesive is applied onto the substrate, record data including both or at least one of the application area of the paste-like adhesive and the application position of the paste-like adhesive calculated from the image in a storage device as log data, and determine whether the state of the applied paste-like adhesive is normal or abnormal on the basis of the data acquired in the visual inspection and the log data recorded in the storage device before the visual inspection.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder that uses a resin paste as an adhesive. [Background technology]

[0002] A die bonder as a die bonding device is a device that bonds (places and adheres) a semiconductor chip (hereinafter simply referred to as a die) onto a substrate such as a wiring board or a lead frame, or onto an already bonded die, using a bonding material such as resin paste, solder, gold plating, etc. For example, in a die bonder that bonds a die to the surface of a substrate, the following operations (tasks) are repeatedly performed: the die is picked up by suction from the wafer using a suction nozzle called a collet attached to the tip of the bonding head, the die is placed in a predetermined position on the substrate, and bonding is performed by applying a pressing force and heating the bonding material.

[0003] For example, when resin is used as the bonding material, a resin paste such as Ag (silver) epoxy or acrylic is used as the adhesive (hereinafter referred to as a paste adhesive). The paste adhesive for adhering the die to the substrate is enclosed in a syringe, which moves up and down relative to the substrate to inject and apply the paste adhesive. That is, a predetermined amount of paste adhesive is applied to a predetermined position by the syringe containing the paste adhesive, and the die is then pressed and baked onto the paste adhesive to adhere it. A recognition camera (preform camera) is attached near the syringe, which confirms the position where the paste adhesive will be applied, performs positioning, and also confirms that the applied paste adhesive has been applied to the predetermined position, in the predetermined shape, and in the predetermined amount. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-44466 Summary of the Invention [Problem to be solved by the invention]

[0005] When an abnormality is detected during the visual inspection of the paste adhesive, an error is generated and the equipment stops, but the inspection results are not recorded in a log.

[0006] An object of the present disclosure is to provide a technology for performing self-diagnosis based on log data of test results. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] A brief summary of representative aspects of this disclosure is as follows. That is, the die bonding apparatus includes an applicator that applies a paste adhesive onto a substrate, an imaging device that images the paste adhesive applied to the substrate, and a control device that performs an appearance inspection based on the image of the paste adhesive captured by the imaging device. The control device is configured to perform an appearance inspection each time the paste adhesive is applied to the substrate, record data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the image in a storage device as log data, and determine whether the condition of the applied paste adhesive is normal or abnormal based on the data acquired during the appearance inspection and the log data recorded in the storage device before the appearance inspection. [Effects of the Invention]

[0008] According to the above die bonding apparatus, it is possible to perform self-diagnosis based on the log data of the inspection results. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. [Figure 2]FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view showing a main part of the die supply section shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 is a block diagram showing an example of the configuration of the preform section. [Figure 7] FIG. 7 is a top view showing an example of the configuration of a substrate in an embodiment. [Figure 8] FIG. 8 is a flowchart showing the steps of applying a paste adhesive. [Figure 9] FIG. 9 is a diagram showing an example of log data during application inspection of a paste adhesive. [Figure 10] FIG. 10 is a diagram showing an example of log data during a pre-bond inspection of a paste adhesive. [Figure 11] FIG. 11 is a top view showing the state during application inspection of the paste adhesive. [Figure 12] FIG. 12 is a top view showing the state of the paste adhesive during pre-bond inspection. [Figure 13] FIG. 13 is a diagram showing an example of the transition of the number of applications and the application area. [Figure 14] FIG. 14 is a diagram showing examples of abnormality factors based on the inspection results and log data for the application area. [Figure 15] FIG. 15 is a diagram showing the change in the number of applications and the application position Y. [Figure 16] FIG. 16 is a diagram showing examples of abnormality factors based on the inspection results for the application position and application area. [Figure 17] FIG. 17 shows an example of the transition of the number of applications and the application area, and an image of correcting the set value of the discharge pressure. [Figure 18]FIG. 18 shows an example of the transition of the number of applications and the application area, and an image of correcting the set value of the discharge pressure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but this is merely an example and does not limit the interpretation of the present disclosure.

[0011] The configuration of a die bonder in an embodiment will be described with reference to Figures 1 and 2. Figure 1 is a top view showing an outline of the die bonder in an embodiment. Figure 2 is a diagram illustrating the operation of a pickup head and a bonding head when viewed from the direction of arrow A in Figure 1.

[0012] The die bonder 10 is broadly divided into a die supply unit 1 that supplies a die D to be mounted on a substrate S, a pickup unit 2, an intermediate stage unit 3, a preform unit 9, a bonding unit 4, a transport unit 5, a substrate supply unit 6, a substrate unloading unit 7, and a control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-to-back direction of the die bonder 10, and the X-axis direction is the left-to-right direction. The die supply unit 1 is located on the front side of the die bonder 10, and the bonding unit 4 is located on the back side. Here, the substrate S has multiple product areas (hereinafter referred to as attachment areas P) that will become a final package. For example, if the substrate S is a lead frame, the attachment area P has tabs on which the die D is placed.

[0013] First, the die supply unit 1 supplies a die D to be mounted in the attachment area P of the substrate S. The die supply unit 1 has a wafer holder 12 that holds a wafer 11, and a peeling unit 13, shown by a dotted line, that pushes up the die D from the wafer 11. The die supply unit 1 moves in the X and Y axes directions by a driving means (not shown), and moves the die D to be picked up to the position of the peeling unit 13.

[0014] The pickup unit 2 has a pickup head 21, a Y drive unit 23, various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X-axis direction, and a wafer recognition camera 24. The pickup head 21 has the collet 22 that suction-holds the pushed-up die D at its tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y-axis direction. The wafer recognition camera 24 grasps the pickup position of the die D to be picked up from the wafer 11.

[0015] The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

[0016] The preform unit 9 has a syringe 91, a drive unit 93, a preform camera 94 as an imaging device (first imaging device), and a preform stage FS. The syringe 91 applies a paste adhesive to the substrate S that has been transported to the preform stage FS by the transport unit 5. The drive unit 93 moves the syringe 91 in the X-axis direction, the Y-axis direction, and the up and down direction. The preform camera 94 grasps the application position of the syringe 91, etc. The preform stage FS is raised when applying the paste adhesive to the substrate S, and supports the substrate S from below. The preform stage FS has suction holes (not shown) for vacuum-absorbing the substrate S, making it possible to fix the substrate S.

[0017] The bonding unit 4 includes a bonding head 41, a Y-axis drive unit 43, a substrate recognition camera 44 as a second imaging device, and a bonding stage BS. The bonding head 41, like the pickup head 21, includes a collet 42 that suction-holds the die D at its tip. The Y-axis drive unit 43 moves the bonding head 41 in the Y-axis direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) in the attachment area P of the substrate S and recognizes the bonding position. When the die D is placed on the substrate S, the bonding stage BS is raised to support the substrate S from below. The bonding stage BS has suction holes (not shown) for vacuum-suctioning the substrate S, allowing the substrate S to be fixed in place. With this configuration, the bonding head 41 corrects its pickup position and posture based on the image data captured by the stage recognition camera 32 and picks up the die D from the intermediate stage 31. Then, based on the image data captured by the board recognition camera 44, the bonding head 41 bonds the die D onto the attachment area P of the conveyed board S where the paste adhesive has been applied.

[0018] The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 that serves as a transport path along which the substrate S moves. The substrate S moves by driving a nut (not shown) of the substrate transport claw 51 that is provided on the transport lane 52 with a ball screw (not shown) that is provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 6 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 7 and hands the substrate S over to the substrate unloading unit 7.

[0019] Next, the configuration of the die supply section 1 will be described with reference to Fig. 3. Fig. 3 is a schematic cross-sectional view showing the main part of the die supply section shown in Fig. 1.

[0020] The die supply unit 1 includes a wafer holder 12 that moves horizontally (in the X and Y directions) and a peeling unit 13 that moves vertically. The wafer holder 12 includes an expand ring 15 that holds a wafer ring 14 and a support ring 17 that horizontally positions a dicing tape 16 fixed to the wafer ring 14. The dies D diced into a mesh pattern on the wafer 11 are adhesively fixed to the dicing tape 16. The peeling unit 13 is disposed inside the support ring 17.

[0021] The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when pushing up the die D. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, widening the gap between the dies D, and the peeling unit 13 pushes up or horizontally moves the dicing tape 16 from below the die D, improving the pick-up ability of the die D.

[0022] The control system of the die bonder 10 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of the control system of the die bonder shown in Fig. 1.

[0023] As shown in Fig. 4, the control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 is broadly divided into a control and arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a composed of a RAM (Random Access Memory) or the like for storing processing programs, etc., and an auxiliary storage unit 82b composed of a HDD (Hard Disk Drive) or the like for storing control data, image data, etc. required for control. The input / output unit 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor, and an image capture unit 83d for capturing image data from the optical system 88. The input / output device 83 also has a motor control device 83e that controls drive units 86 and 93, such as the XY table (not shown) of the die supply unit 1 and the ZY drive axis of the bonding head table, and an I / O signal control device 83f that receives or controls signals from a signal unit 87, such as various sensor signals and switches for lighting devices, etc. The optical system 88 includes the wafer recognition camera 24, preform camera 94, stage recognition camera 32, and substrate recognition camera 44 shown in Figure 1 or 2. The control / arithmetic unit 81 receives necessary data via the bus line 84, performs calculations, and controls the bonding head 41, etc., and sends information to the monitor 83a, etc.

[0024] The control unit 8 stores image data captured by the optical system 88 via the image capture device 83d in the storage device 82. Using software programmed based on the stored image data, the control and calculation device 81 positions the die D and substrate S, inspects the application pattern of the paste adhesive, and inspects the surfaces of the die D and substrate S. Based on the positions of the die D and substrate S calculated by the control and calculation device 81, the software drives the drive unit 86 via the motor control device 83e. Through this process, the die D on the wafer 11 is positioned, and the drive units of the die supply unit 1 and bonding unit 4 are operated to bond the die D onto the substrate S. The recognition camera used in the optical system 88 is a grayscale camera, a color camera, etc., and quantifies brightness (light intensity) and color.

[0025] Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1.

[0026] (Step S51: Wafer / substrate loading process) Wafer rings 14 holding dicing tape 16 to which dies D separated from the wafer 11 are attached are stored in a wafer cassette (not shown) and are then carried into the die bonder 10. The control unit 8 supplies the wafer rings 14 from the wafer cassette filled with the wafer rings 14 to the die supply unit 1. The control unit 8 also prepares a substrate S and carries it into the die bonder 10. The control unit 8 attaches the substrate S to the substrate transport claws 51 in the substrate supply unit 6.

[0027] (Step S52: Pick-up process) The control unit 8 moves the wafer ring 14 so that the wafer holder 12 can pick up the desired die D from the wafer ring 14, and performs positioning and surface inspection based on data captured by the wafer recognition camera 24. The control unit 8 then peels the positioned die D from the dicing tape 16 using the peeling unit 13. Concurrently, the control unit 8 lowers the pickup head 21 to directly above the die D to be picked up, and the collet 22 of the pickup head 21 vacuum-sucks the die D peeled from the dicing tape 16. The control unit 8 then raises, translates, and lowers the pickup head 21 to place the die D at a predetermined location on the intermediate stage 31. At this time, the control unit 8 sucks the die D using a suction hole (not shown) in the intermediate stage 31 and separates it from the pickup head 21. In this way, the die D peeled from the dicing tape 16 is sucked and held by the collet 22 and transported to and placed on the intermediate stage 31.

[0028] The control unit 8 uses the stage recognition camera 32 to capture an image of the die D on the intermediate stage 31, and performs positioning and surface inspection of the die D. The control unit 8 calculates the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder through image processing. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as an initial setting for the device. The control unit 8 then performs surface inspection of the die D through image processing.

[0029] Then, the control unit 8 returns the pickup head 21, which has transported the die D to the intermediate stage 31, to the die supply unit 1. Following the above-described procedure, the next die D is peeled off from the dicing tape 16, and thereafter, the dies D are peeled off one by one from the dicing tape 16 following the same procedure.

[0030] (Step S53: Bonding process) The control unit 8 transports the substrate S to the preform stage FS using the transport unit 5. The control unit 8 uses the preform camera 94 to acquire an image of the surface of the substrate S before application and confirm the surface to which the paste adhesive is to be applied. If there are no problems with the surface to be applied, the control unit 8 confirms and positions the substrate S supported by the preform stage FS at the position where the paste adhesive will be applied. Positioning is performed using pattern matching, as with the bonding head unit. The paste adhesive is applied from the syringe 91. The control unit 8 ejects the paste adhesive from the nozzle at the tip of the syringe 91 and applies it according to the nozzle's trajectory. The control unit 8 drives the syringe 91 along the X, Y, and Z axes using the drive unit 93 to the desired shape, and applies (draws) the adhesive along a free trajectory, such as an X or a cross shape. After application, the control unit 8 uses the preform camera 94 to confirm whether the paste adhesive has been applied accurately and inspects the applied paste adhesive. That is, the visual inspection confirms whether the applied paste adhesive has been applied in the specified position, shape, and amount. The inspection contents include, for example, the presence or absence of paste adhesive, the area of ​​application, the shape of application (insufficiency, overflow), etc. The inspection is carried out by counting the number of pixels after separating the area of ​​paste adhesive using binarization processing, as well as by comparing differences and scores obtained by pattern matching.

[0031] If there are no problems with the application, the control unit 8 transports the substrate S to the bonding stage BS using the transport unit 5. Then, the control unit 8 images the substrate S placed on the bonding stage BS using the substrate recognition camera 44. The control unit 8 calculates the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder through image processing. Note that the substrate position reference point is previously set to a predetermined position of the substrate check unit as the initial setting of the device. The control unit 8 may inspect the applied paste adhesive based on the image data captured by the substrate recognition camera 44.

[0032] The control unit 8 corrects the suction position of the bonding head 41 based on the amount of deviation of the die D calculated in step S52, and suctions the die D with the collet 42. The bonding head 41, which has suctioned the die D from the intermediate stage 31, is raised, translated, and lowered to attach the die D to a predetermined position on the substrate S supported by the bonding stage BS. Then, the control unit 8 inspects whether the die D has been bonded at the desired position based on image data captured by the substrate recognition camera 44.

[0033] (Step S54: Substrate removal process) The control unit 8 transports the substrate S with the die D bonded thereto to the substrate unloading unit 7. The control unit 8 removes the substrate S with the die D bonded thereto from the substrate transport claws 51 at the substrate unloading unit 7. The substrate S is unloaded from the die bonder 10.

[0034] As described above, the die D is mounted on the substrate S and carried out from the die bonder. Thereafter, in a wire bonding process, the die D is electrically connected to the electrodes of the substrate S via Au wires or the like. Thereafter, the substrate S is carried to a molding process, and the die D and the Au wires are sealed with molding resin (not shown), thereby completing the package.

[0035] The application of the paste adhesive in the preform part will be described with reference to Fig. 6. Fig. 6 is a block diagram showing an example of the configuration of the preform part.

[0036] 6, the preform unit 9 includes a syringe 91, a drive unit 93, a preform camera 94, a syringe holder 95, a dispenser 96, a pipe 97 for supplying air pressure, and a preform stage FS. The syringe 91, the drive unit 93, the syringe holder 95, the dispenser 96, and the pipe 97 constitute a coating device.

[0037] When applying the paste adhesive to the substrate S, the paste adhesive is placed in a syringe 91 having an application nozzle 92 at the tip at the bottom, and a predetermined amount of paste adhesive is dispensed by supplying pressurized gas such as air from an air pulse dispenser 96 from the top of the syringe 91 for a certain period of time. During application, with the application nozzle 92 close to the substrate, the syringe 91 is scanned (drawing operation) in a two-dimensional manner in the XY plane in a single stroke (generally starting from the center and returning to the center).

[0038] The dispenser 96 has a compressed air supply port 96a connected to a positive pressure source, a vacuum exhaust port 96b connected to a negative pressure source, an exhaust port 96c for exhausting the compressed air supplied to the syringe, and an air control output port 96d.

[0039] The operation of the dispenser 96 will now be described. Compressed air introduced from the compressed air supply port 96a is adjusted to an appropriate pressure by a discharge regulator (not shown) and is then discharged from the air control output port 96d via a valve unit (not shown). A pressure sensor 96e for monitoring the output is located inside the air control output port 96d. The compressed air supplied to the syringe 91 is forcibly exhausted from the exhaust port 96c via a valve unit (not shown). Furthermore, when not being discharged, a slight vacuum must be applied to prevent dripping due to the weight of the paste adhesive. This vacuum is achieved by adjusting the compressed air from the compressed air supply port 96a to an appropriate pressure (negative pressure) via a vacuum regulator (not shown), and then discharging it from the vacuum exhaust port 96b. This negative pressure is controlled by a valve unit (not shown) and connected to the air control output port 96d.

[0040] The process of discharging the paste adhesive will now be described. The paste adhesive is contained in a syringe 91. First, the control unit 8 instructs the drive unit 93 to lower the syringe holder 95, causing the tip of the application nozzle 92 to descend from a relatively high position and reach a predetermined height (nozzle height (Hn)) above the upper surface of the substrate S at the start of dispensing. The nozzle height (Hn) is, for example, 100 to 200 μm. At this point, the control unit 8 instructs the dispenser 96 to supply compressed air through the piping 97, causing the air pressure in the syringe 91 to rise rapidly and gradually begin dispensing. Synchronously with this, the drawing operation begins. Specifically, the control unit 8 instructs the drive unit 93 to move the syringe holder 95, causing the application nozzle 92 to move horizontally in two dimensions. The application nozzle 92 generally returns to the writing start position, at which point the drawing operation ends. At the same time, when the supply of compressed air from dispenser 96 is stopped by an instruction from control unit 8, the air pressure in syringe 91 drops rapidly, but the discharge gradually weakens and stops. Almost simultaneously with the stop, drive unit 93 raises application nozzle 92 by an instruction from control unit 8.

[0041] The process of applying a paste adhesive will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the process of applying a paste adhesive.

[0042] (Application: Step S1) First, the application of the paste adhesive will be described with reference to Fig. 7. Fig. 7 is a top view showing an example of the configuration of a substrate in an embodiment.

[0043] The control unit 8 applies the paste adhesive using the syringe 91 to the attachment area P in the first row and first column at the top right of the substrate S, on which the attachment areas P are arranged in a grid pattern, in a downward sequence. Then, after applying the paste adhesive to the attachment area P in the fourth row and first column at the bottom right, the control unit 8 applies the paste adhesive PA to the attachment area P in the fourth row and first column at the bottom right, in a downward sequence from the top position (first row) in the second column from the right. The control unit 8 then applies the paste adhesive to the third column, fourth column, ..., eighth column in the same manner.

[0044] (Appearance inspection: Step S2) Next, the appearance inspection of the paste adhesive will be described with reference to Fig. 7. Each time the paste adhesive is applied to one attachment area P of the substrate S, the control unit 8 takes an image of the applied paste adhesive using the preform camera 94, and performs an appearance inspection based on the captured image. That is, the control unit 8 applies the paste adhesive to each row number in units of a certain column number on the substrate S, and then performs the above-mentioned appearance inspection.

[0045] (Storing the test results: Step S3) Next, the storage of inspection results such as visual inspection will be explained using Figs. 9 to 12. Fig. 9 is a diagram showing an example of log data during a paste adhesive application inspection. Fig. 10 is a diagram showing an example of log data during a paste adhesive pre-bond inspection. Fig. 11 is a top view showing the state during a paste adhesive application inspection. Fig. 12 is a top view showing the state during a paste adhesive pre-bond inspection.

[0046] (a) Preform part The control unit 8 stores the inspection results (measurements) and setting conditions based on the images captured by the preform camera 94 as log data in the storage device 82, along with the date and time when the paste adhesive was applied for each column number (column No.) and row number (row No.), as shown in Figure 9.

[0047] The inspection results to be stored are the X coordinate (application position X) and Y coordinate (application position Y) of the application position of the paste adhesive (center of gravity position of the area), the area of ​​the paste adhesive (application area), the application width of the paste adhesive at the first position (application width 1) and the application width at the second position (application width 2). Also, the inspection results to be stored are the X coordinate (substrate recognition position X) and Y coordinate (substrate recognition position Y) of the recognition position of the substrate S before the paste adhesive is applied. Only one of the inspection results of the application position of the paste adhesive and the area of ​​the paste adhesive may be stored.

[0048] The above inspection results are calculated by the control unit 8 by imaging the applied paste adhesive PA or substrate S as shown in Fig. 11 using the preform camera 94 and processing the image. The application position of the paste adhesive PA is the center of gravity position (C) of the pixel, the application area (CA) of the paste adhesive PA is the number of pixels, and the application width 1 (W1) and application width 2 (W2) are the number of pixels.

[0049] The stored setting conditions are the paste adhesive application conditions, such as nozzle height, discharge pressure, and discharge time. Other measured values ​​are the measured discharge pressure, measured discharge time, the actual table operation time of the drive unit 93, an image of the paste adhesive PA at the time of registration, and an image of the paste adhesive PA at the time of an abnormality. Here, "the time of registration" refers to the timing when production begins after the pre-operational adjustments are completed and the paste adhesive application state falls within the specified range or equals the target value. "Within the specified range" refers to the application amount being within a specified range, or the amount, thickness, or shape of the paste adhesive protruding from the die during die bonding satisfying the process specifications. The discharge pressure is measured using the pressure signal (PRS) output from the dispenser 96. The discharge time is measured by measuring the discharge signal (DSC) output from the dispenser 96.

[0050] (b) Bonding section 10, the control unit 8 stores the inspection results (measurement values) based on the image captured by the substrate recognition camera 44 as log data for each column number and row number, along with the pre-bond inspection date and time, in the storage device 82. Here, "pre-bond" refers to the time immediately before the substrate S, on which the paste adhesive has been applied, is transferred from the preform stage FS to the bonding stage BS and the die D is bonded.

[0051] The inspection results to be stored are the area of ​​the paste adhesive PB before bonding (pre-bond application area), the width of the paste adhesive PB at a first position before bonding (pre-bond application width 1), and the application width at a second position (pre-bond application width 2), which are captured by the substrate recognition camera 44 and calculated by image processing.

[0052] The control unit 8 calculates the above inspection results by capturing an image of the applied paste adhesive PB as shown in FIG. 12 using the substrate recognition camera 44 and processing the image. The pre-bond application area (CAB) is the number of pixels, and the pre-bond application width 1 (WB1) and pre-bond application width 2 (WB2) are also the number of pixels. The pre-bond application area (CAB), pre-bond application width 1 (WB1), and pre-bond application width 2 (WB2) may be larger than the application area (CA), application width 1 (W1), and application width 2 (W2) shown in FIG. 9. This is because, in the case of a matte-finished substrate or a paste adhesive with low viscosity, the paste adhesive spreads over time.

[0053] (Determining whether an abnormality has occurred: Step S4) The control unit 8 determines that the coating area is abnormal if the coating area exceeds the upper limit (CAmax) or falls below the lower limit (CAmin) of the coating area. The control unit 8 also determines that the coating position is abnormal if the coating position exceeds the upper limit (CPmax) or falls below the lower limit (CPmin) of the coating position.

[0054] (Self-diagnosis: Step S5) The control unit 8 performs self-diagnosis based on the log data.

[0055] First, the control unit 8 compares the inspection data from the visual inspection with the log data acquired before the visual inspection, grasps the tendency, and determines the type of abnormality.

[0056] (a) Application area Anomaly detection based on the log data of the application area will be described with reference to Fig. 13. Fig. 13 is a diagram showing an example of the transition of the number of applications and the application area.

[0057] FIG. 13 is a graph showing the number of applications of paste adhesive for each row on the horizontal axis and the application area data on the vertical axis. With continuous use, the application area gradually decreases due to the difference in head of the paste adhesive inside the syringe 91. Furthermore, the application area gradually decreases due to changes in viscosity of the paste adhesive over time. In these cases, the application area changes almost uniformly along the dashed line ML shown in the figure (the amount of change in the application area is almost uniform). Here, the line ML is an approximate line calculated by the least squares method based on the log data recorded before the abnormality occurred. "Uniform change" means that the area changes between the upper limit UL of the predetermined range, shown by the dotted line parallel to the line ML, and the lower limit LL of the predetermined range, shown by the dotted line.

[0058] The control unit 8 determines that there is a sudden abnormality (ERR1) when the coating area exceeds the predetermined range upper limit UL and also exceeds the upper limit of the coating area (CAmax), or when the coating area falls below the predetermined range lower limit LL and also falls below the lower limit of the coating area (CAmin).The control unit 8 determines that there is an abnormality due to a change over time (ERR2) when the coating area is equal to or less than the predetermined range upper limit UL and equal to or greater than the predetermined range lower limit LL and exceeds the upper limit of the coating area (CAmax), or when the coating area falls below the predetermined range lower limit LL.

[0059] The coating area of ​​the 11th coating is below the lower limit (CAmin) of the coating area, which is abnormal, and is below the lower limit LL of the specified range, which is a sudden abnormality (ERR1). The coating area of ​​the 33rd coating is below the lower limit (CAmin) of the coating area, which is abnormal, and is below the upper limit UL of the specified range and above the lower limit LL of the specified range, which is an abnormality due to changes over time (ERR2). Here, the upper limit (CAmax) of the coating area is 495 (pix), and the lower limit (CAmin) is 465 (pix). Here, pix is ​​the number of pixels.

[0060] By using such log data, it is possible to distinguish between an abnormality (ERR2) in which the coating area changes uniformly and exceeds the lower limit (CAmin) of the coating area, and an abnormality (ERR1) in which the coating area suddenly exceeds the lower limit (CAmin).

[0061] (Sudden abnormality) If the control unit 8 determines that the abnormality is sudden, it estimates the cause of the abnormality based on, for example, a matrix table created from the log data and inspection results described below. If the control unit 8 determines that the cause of the abnormality is a malfunction of the coating device, it issues a warning to check the difference between the set discharge pressure and the measured discharge pressure, and the difference between the set discharge time and the measured discharge time. If the control unit 8 determines that the cause of the abnormality is some other abnormality, it issues a warning to check for the presence of air bubbles after replacing the paste adhesive (the history of replacing the paste adhesive).

[0062] A method for estimating the cause of an abnormality from the log data and inspection results will be described with reference to Fig. 14. Fig. 14 is a diagram showing an example of an abnormality cause based on the inspection results and log data for the application area.

[0063] FIG. 14 is a matrix table comparing the measurement data and setting data when an abnormality (error) occurs with the log data before the abnormality occurs, and the control unit 8 estimates the cause of the abnormality based on this table.

[0064] For example, as shown in the fourth to sixth lines in FIG. 14, the control unit 8 compares the set discharge pressure, set discharge time, or set nozzle height when the coating area was measured at the time of the abnormality with the set discharge pressure, set discharge time, or set nozzle height in the log data. If the results are significantly different (there is a change), the control unit 8 determines that the setting is incorrect (an error due to a setting change). Also, as shown in the first or second line in FIG. 14, if the setting at the time of the abnormality and the log data are the same (there is no change), the control unit 8 determines that the abnormality is in the dispenser 96, a part of the piping 97, or the syringe 91. Here, the abnormality in the part of the piping 97 or the syringe 91 is, for example, a clog or a leak.

[0065] 14, if the measured discharge time differs significantly between when an abnormality occurred and the log data, the control unit 8 determines that there is a change in the drawing time and that there is an abnormality in the control of the drive unit 93. Instead of the discharge time, the operation time of the XY axes of the drive unit 93 may be measured, and if there is a change in this operation time, it is determined that there is an abnormality in the drive unit 93.

[0066] Although not shown, if the measured dispensing time changes significantly with respect to the set dispensing time, it may be determined that there is an abnormality in the dispenser 96. Furthermore, comparing the image of the paste adhesive saved at the time of registration as described above with the image of the paste adhesive saved when the abnormality occurred may be used to further estimate the cause.

[0067] (Abnormalities due to changes over time) When the control unit 8 determines that the abnormality is due to a change over time, it issues a warning that the remaining amount of paste adhesive is low or that the viscosity of the paste adhesive has changed. How to determine whether the viscosity of the paste adhesive has changed (deteriorated) will be described below.

[0068] Deterioration (changes in viscosity) of the paste adhesive is determined from the difference between the application width of the paste adhesive (application width 1, application width 2) acquired by the preform camera 94 and the application width of the paste adhesive (pre-bond application width 1, pre-bond application width 2) acquired by the board recognition camera 44, and from the data on the elapsed transport time (comparison of data for the same transport time). Even if the application width of the paste adhesive recognized by the preform camera 94 is the same, if the application width of the paste adhesive recognized by the board recognition camera 44 (data for the same transport time) is different, a change in viscosity of the paste adhesive can be assumed.

[0069] For example, compare the application width (W1, W2) shown in Figure 11 with the application width before bonding (WB1, WB2) shown in Figure 12. Then, if the rate of change (WB1 / W1, WB2 / W2) is compared with the rate of change calculated from the application width recorded as log data and the application width before bonding and there is a large change, it is determined that the paste adhesive has deteriorated. However, the comparison is made using log data where the difference between the time the paste adhesive was applied and the time of inspection before bonding is the same.

[0070] In addition, if the application shape of the paste adhesive makes it difficult to measure the application width, the application area (CA) is compared with the application area before bonding (CAB). If the rate of change (CAB / CA) is significantly different from the rate of change calculated based on the log data, it is determined that the paste adhesive has deteriorated.

[0071] (b) Application position Anomaly detection based on the application position log data will be described with reference to Fig. 15. Fig. 15 is a diagram showing the transition of the application count and the application position Y.

[0072] FIG. 15 is a graph showing the number of applications for each row on the horizontal axis and the data for application position Y on the vertical axis. The application position Y changes almost uniformly along the straight line ML shown by the dashed-dotted line in the figure. Here, the straight line ML is an approximation line calculated by the least squares method based on the log data recorded before the abnormality occurred. "Change uniformly" means that the application position Y changes between the upper limit UL of the predetermined range shown by the dotted line parallel to the straight line ML and the lower limit LL of the predetermined range shown by the dotted line.

[0073] The control unit 8 determines that there is a sudden abnormality (ERR1) when the application position exceeds the predetermined range upper limit UL and exceeds the application position upper limit value (CPmax), or when the application position falls below the predetermined range lower limit LL and falls below the application position lower limit value (CPmin).The control unit 8 determines that there is an abnormality due to changes over time (ERR2) when the application position is equal to or less than the predetermined range upper limit UL and equal to or greater than the predetermined range lower limit LL and exceeds the application position upper limit value (CPmax), or when the application position falls below the predetermined range lower limit LL.

[0074] The coating position Y at the 11th coating is below the lower limit (CPmin) of the coating position Y, which is abnormal, and is also below the lower limit LL of the specified range, which is a sudden abnormality (ERR1). The coating position Y at the 33rd coating is below the lower limit (CPmin) of the coating position Y, which is abnormal, and is below the upper limit UL of the specified range and above the lower limit LL of the specified range, which is an abnormality due to changes over time (ERR2). Here, the upper limit (CPmax) of the coating position is 755 (pix), and the lower limit (CPmin) is -75 (pix). Note that ERR2 is also below the lower limit LL of the specified range.

[0075] When the control unit 8 determines that the abnormality is a sudden one, it determines that the cause of the abnormality is a sudden position change due to a loose part or the like, and issues a warning to that effect.

[0076] When the control unit 8 determines that the abnormality is due to a change over time, it issues a warning that the application position has changed due to the table of the drive unit 93 stretching due to continuous operation.

[0077] An abnormality is determined in the table of the driving unit 93 or the substrate transport mechanism of the transport unit 5 from the difference in data between the recognized position of the substrate S before the application of the paste adhesive (substrate recognized position X, substrate recognized position Y) and the application position after application (application position X, application position Y). If the position of the substrate S is normal but the application position is misaligned, it can be determined that there is an abnormality in the operation of the table of the driving unit 93.

[0078] A method for estimating the cause of an abnormality in addition to the presence or absence of an abnormality in the coating area will be described with reference to Fig. 16. Fig. 16 is a diagram showing examples of abnormality causes based on the inspection results for the coating position and coating area.

[0079] As shown in Figure 16, if the coating area inspection result is normal but coating position X or coating position Y has fluctuated significantly, it is determined that there is a change in the fixed position of the syringe 91 or a malfunction in the table of the drive unit 93. If the coating area inspection result is abnormal and coating position X or coating position Y has fluctuated significantly, check the cause of the coating area error.

[0080] (Correction: Step S6) A method for correcting set values based on log data of the coating area will be described with reference to FIG. 17. FIG. 17 is a diagram showing an example of the transition of the coating number and the coating area and an image of correcting the set value of the discharge pressure.

[0081] Compare the current coating area data with the log data. When the coating area data changes uniformly, the setting of the discharge pressure or the discharge time may be changed (increased or decreased) so that the change amount of the measured coating area approaches 0, and the specified coating area may be maintained. Specifically, for example, it is performed as follows.

[0082] Let the number of samplings for the correction calculation be N. In the figure, the case of N = 8 is shown.

[0083] When the number of samplings reaches N, an approximate straight line shown by the dotted line in the figure is calculated from them by the least squares method or the like, and the slope (A) of the approximate straight line is calculated.

[0084] Consider the slope (A) and change the settings such as the discharge pressure and the discharge time. When the slope (A) exceeds the upper limit (A>Amax), the discharge pressure or the discharge time is reduced. When the slope (A) is below the lower limit (A<Amin), the discharge pressure or the discharge time is increased. Here, Amax is the upper limit value of the slope (A), and Amin is the lower limit value of the slope (A). In the figure, it is the case of A<Amin, and the discharge pressure is increased to increase the slope (A) of the approximate straight line shown by the solid line in the figure.

[0085] The correction of the set value based on the log data of the coating position is performed in the same manner as the correction of the set value based on the log data of the coating area. When comparing the current coating position data and it changes uniformly, the setting of the coating position is changed so that the change amount of the measured coating position approaches 0, and the specified coating position is maintained.

[0086] Another correction method for the set value based on the log data of the coating area will be described with reference to FIG. 18. FIG. 18 is a diagram showing an example of the transition of the coating number and the coating area and an image of correcting the set value of the discharge pressure.

[0087] When comparing the current coating area data and it changes uniformly, set the correction threshold inside the upper and lower limit values, and when it exceeds the correction threshold, change the setting of the discharge pressure or discharge time to maintain the specified coating area.

[0088] The method for correcting the set value based on the log data of the coating area is to correct the setting by increasing or decreasing the discharge pressure or discharge time so that the deviation between the measured coating area (MCA) and the registered coating area (RCA) is within the reference range. At this time, separate from the upper limit value (CAmax) and lower limit value (CAmin) of the coating area, set the correction upper threshold value (CCAmax) and correction lower threshold value (CCAmin) of the coating area that serve as the judgment criteria for starting the discharge amount correction. Here, in the figure, the correction upper threshold value (CCAmax) of the coating area is 490 (pix), and the correction lower threshold value (CCAmin) is 470 (pix). The upper limit value (CAmax) of the coating area is 495 (pix), and the lower limit value (CAmin) is 465 (pix).

[0089] When MCA < CCAmin and CAmin < MCA, increase the discharge pressure or discharge time. When CCAmax < MCA and MCA < CAmax, decrease the discharge pressure or discharge time. The increase and decrease control of the discharge pressure or discharge time, etc., ends when the measured coating area (MCA) reaches the registered coating area (RCA). In the figure, at the 26th coating time, since it exceeds (falls below) the correction lower threshold value (CCAmin) of the coating area, the discharge pressure is increased.

[0090] The correction of the set value based on the log data of the coating position is performed in the same manner as the correction of the set value based on the log data of the coating area. When comparing the current coating position data and it changes uniformly, set the correction threshold inside the upper and lower limit values, and when it exceeds the correction threshold, change the setting of the coating position to maintain the specified coating position. Correct the setting by increasing or decreasing the X coordinate or Y coordinate of the coating position so that the deviation between the measured coating position (MCP) and the registered coating position (RCP) is within the reference range. At this time, separate from the upper limit value (CPmax) and lower limit value (CPmin) of the coating position, set the correction upper threshold value (CCPmax) and correction lower threshold value (CCPmin) of the coating position that serve as the judgment criteria for starting the correction of the coating position.

[0091] When MCP < CCPmin and CCPmin < MCP, increase the setting of the coating position. When CCPmax < MCP and MCP < CPmax, decrease the setting of the coating position.

[0092] According to this embodiment, since the appearance inspection results (coating area, coating position, etc.) and the setting data at that time are recorded as log data, comparison is possible with other conditions combined. Therefore, it is possible to self-diagnose the position of coating abnormalities (appearance inspection abnormalities) of the paste adhesive applied to the substrate, the conditions at that time, the abnormalities of the paste adhesive used, and the mechanism of the coating device. Also, based on that judgment, it is possible to correct the setting data of the coating amount and the coating position. Improvement of bond accuracy and reduction of device failures (judgment of the maintenance timing) become possible.

[0093] ​​​​​​​​​​​​​​​​​​​41 Bonding head 94 Preform camera (first imaging device) D...Die FS···Preform stage (first stage) S... board

Claims

1. a first stage supporting a substrate; an applicator that applies a paste adhesive onto the substrate; a first imaging device that images the substrate and the paste adhesive applied to the substrate; a bonding head for mounting a die on the substrate to which the paste adhesive has been applied; a control device that performs a first appearance inspection based on a first image of the paste adhesive captured by the first imaging device; Equipped with The control device performing an appearance inspection every time the paste adhesive is applied to the substrate, and recording data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the first image in a storage device as log data; calculating an approximate straight line showing a change in the coating area or the coating position, or both, based on the log data recorded in the storage device before the appearance inspection; a predetermined range defined by an upper limit and a lower limit of the predetermined range indicated by a straight line parallel to the approximation straight line; determining whether the data acquired during the visual inspection is within the predetermined range; A die bonding apparatus configured to determine whether the state of the applied paste adhesive is normal or abnormal.

2. 2. The die bonding apparatus of claim 1, The control device is configured to determine that an abnormality has occurred due to a change over time when the data acquired during the appearance inspection is within the predetermined range and deviates from a normal range.

3. 2. The die bonding apparatus of claim 1, The die bonding apparatus is configured such that, when the data acquired during the visual inspection falls outside the predetermined range and also falls outside a normal range, the control device determines that a sudden abnormality has occurred.

4. 4. The die bonding apparatus according to claim 3, the application device includes a syringe that stores the paste adhesive and a dispenser that supplies pressurized gas to discharge the paste adhesive from the syringe, The control device further recording, as the log data, a set value of the discharge pressure of the pressurized gas, a set value of the discharge time of the pressurized gas, a measured value of the discharge pressure, and a measured value of the discharge time in the storage device; A die bonding apparatus configured to detect a sudden abnormality in the coating area, and determine that an abnormality has occurred in the dispenser when the set value of the discharge pressure differs from the measured value of the discharge pressure, or when the set value of the discharge time differs from the measured value of the discharge time.

5. A first stage supporting a substrate; an applicator that applies a paste adhesive onto the substrate; a conveying device that conveys the substrate coated with the paste adhesive to a second stage; a first imaging device that images the substrate and the paste adhesive applied to the substrate; a second imaging device that captures an image of the paste adhesive on the substrate transported to the second stage; a bonding head for mounting a die on the substrate to which the paste adhesive has been applied; a control device that performs a first appearance inspection based on a first image of the paste adhesive captured by the first imaging device; Equipped with The control device performing an appearance inspection every time the paste adhesive is applied to the substrate, and recording data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the first image in a storage device as log data; determining whether the state of the applied paste adhesive is normal or abnormal based on the data acquired during the visual inspection and the log data recorded in the storage device prior to the visual inspection; further performing a second appearance inspection based on a second image of the paste adhesive captured by the second imaging device; further recording, as the log data, in the storage device, an application width of the paste adhesive calculated from the first image and a pre-bond application width of the paste adhesive calculated from the second image; A die bonding device configured to determine whether a paste adhesive has deteriorated based on the rate of change between the application width during visual inspection and the application width before bonding, and the rate of change between the application width as log data recorded in the memory device before the visual inspection and the application width before registration.

6. A first stage for supporting a substrate; an applicator that applies a paste adhesive onto the substrate; a conveying device that conveys the substrate coated with the paste adhesive to a bonding stage; a first imaging device that images the substrate and the paste adhesive applied to the substrate; a second imaging device that images the paste adhesive on the substrate transported to the bonding stage; a bonding head for mounting a die on the substrate to which the paste adhesive has been applied; a control device that performs a first appearance inspection based on a first image of the paste adhesive captured by the first imaging device; Equipped with The control device performing an appearance inspection every time the paste adhesive is applied to the substrate, and recording data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the first image in a storage device as log data; determining whether the state of the applied paste adhesive is normal or abnormal based on the data acquired during the visual inspection and the log data recorded in the storage device prior to the visual inspection; further performing a second appearance inspection based on a second image of the paste adhesive captured by the second imaging device; Further, as the log data, a pre-bond application area of ​​the paste adhesive calculated from the second image is recorded in the storage device; A die bonding device configured to determine whether a paste adhesive has deteriorated based on the rate of change between the application area during visual inspection and the application area before bonding, and the rate of change between the application area as log data recorded in the memory device before the visual inspection and the application area before registration.

7. A first stage for supporting a substrate; an applicator that applies a paste adhesive onto the substrate; a first imaging device that images the substrate and the paste adhesive applied to the substrate; a bonding head for mounting a die on the substrate to which the paste adhesive has been applied; a control device that performs a first appearance inspection based on a first image of the paste adhesive captured by the first imaging device; Equipped with The control device performing an appearance inspection every time the paste adhesive is applied to the substrate, and recording data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the first image in a storage device as log data; determining whether the state of the applied paste adhesive is normal or abnormal based on the data acquired during the visual inspection and the log data recorded in the storage device prior to the visual inspection; acquiring a third image by imaging the substrate with the first imaging device before the paste adhesive is applied; recording the substrate recognition position calculated from the third image in the storage device as the log data; When it is determined that the application position of the paste adhesive is abnormal, the die bonding apparatus determines the cause of the abnormality based on the substrate recognition position and the application position.

8. 2. The die bonding apparatus of claim 1, the application device includes a syringe that stores the paste adhesive, a dispenser that supplies pressurized gas to discharge the paste adhesive from the syringe, and a drive unit that moves the syringe, The control device If the application area obtained during the visual inspection is within the predetermined range and is out of a normal range, a warning is given that the amount of paste adhesive remaining in the syringe is low or that the viscosity has changed; The die bonding apparatus is configured to warn of an abnormality caused by elongation due to continuous operation of the drive unit if the application position acquired during the visual inspection is within the specified range and deviates from the normal range.

9. 9. The die bonding apparatus according to claim 8, The abnormality is a misalignment of the paste adhesive application position in the die bonding device.

10. 2. The die bonding apparatus of claim 1, the application device includes a syringe that stores the paste adhesive, a dispenser that supplies pressurized gas to discharge the paste adhesive from the syringe, and a drive unit that moves the syringe, The control device Furthermore, a set value of the discharge pressure of the pressurized gas, a set value of the discharge time of the pressurized gas, and a set value of the application position are recorded in a storage device as log data; A die bonding apparatus configured to correct the setting value of the discharge pressure, the setting value of the discharge time, or the setting value of the application position so that the amount of change approaches zero when the data acquired during the appearance inspection is within the specified range and also within a normal range.

11. 11. The die bonding apparatus of claim 10, The control device For each of the N appearance inspections, the approximation line is calculated by the least squares method based on the coating area of ​​the log data, and the slope of the approximation line is calculated; If the slope is greater than a predetermined maximum slope, reduce the set value of the discharge pressure or the set value of the discharge time; The die bonding apparatus is configured to increase a set value of the discharge pressure or a set value of the discharge time when the slope is smaller than a predetermined minimum slope.

12. 11. The die bonding apparatus of claim 10, The control device setting a correction threshold value between the upper and lower limits of the normal range; If the coating area obtained during the appearance inspection exceeds the correction threshold value and does not exceed the lower limit value, increasing the set value of the discharge pressure or the set value of the discharge time, The die bonding apparatus is configured to reduce the set value of the discharge pressure or the set value of the discharge time when the application area acquired during the appearance inspection exceeds the correction threshold value but does not exceed the upper limit value.

13. a coating step of coating a paste adhesive on a substrate; an inspection step of capturing an image of the paste adhesive applied to the substrate with an imaging device to obtain an image each time the paste adhesive is applied to the substrate, and performing an appearance inspection based on the image; a mounting step of bonding a die onto the substrate on which the paste adhesive has been applied; Including, The inspection step includes: recording data including the application area of ​​the paste adhesive and / or the application position of the paste adhesive calculated from the image as log data in a storage device; calculating an approximate straight line showing a change in the coating area or the coating position, or both, based on the log data recorded in the storage device before the appearance inspection; a predetermined range defined by an upper limit and a lower limit of the predetermined range indicated by a straight line parallel to the approximation straight line; determining whether the data acquired during the visual inspection is within the predetermined range; A method for manufacturing a semiconductor device, in which it is determined whether an applied paste adhesive is normal or abnormal.

14. 14. The method of manufacturing a semiconductor device according to claim 13, A method of manufacturing a semiconductor device, wherein the inspection step determines that the abnormality is due to a change over time if the data acquired during the visual inspection is within the predetermined range and deviates from a normal range.

15. 14. The method of manufacturing a semiconductor device according to claim 13, In the inspection step, if the data acquired during the visual inspection falls outside the predetermined range and also falls outside a normal range, it is determined that a sudden abnormality has occurred.

16. 14. The method of manufacturing a semiconductor device according to claim 13, the applying step is performed by an applying device having a syringe that stores the paste adhesive and a dispenser that supplies pressurized gas to discharge the paste adhesive from the syringe; The inspection step includes: Furthermore, a set value of the discharge pressure of the pressurized gas, a set value of the discharge time of the pressurized gas, and a set value of the application position are recorded in a storage device as log data; A method for manufacturing a semiconductor device, wherein if the data acquired during the visual inspection is within the specified range and within a normal range, the set value of the discharge pressure, the set value of the discharge time, or the set value of the application position is corrected so that the amount of change approaches zero.

Images