Circuit Module

Abstract

To minimize deterioration in quality of a transmission signal and to optimize a mounting area.SOLUTION: A circuit module comprises: a wiring board; a first line provided on the wiring board to transmit a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board side by side with the first line to transmit a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, having one end connected with the first line and the other end connected with a power supply circuit for supplying the power; and a sheet-like first conductor provided at least at a part of the second line side lateral face of a housing for holding the first inductor.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a circuit module. [Background technology]

[0002] Crosstalk can occur between parallel wires on a board. This can cause a signal transmitted through one wire to be transferred to another wire, or it can generate noise. In order to suppress crosstalk between wires, it is effective to increase the distance between parallel wires.

[0003] However, in recent years, the demand for miniaturization of products has accelerated, and it is sometimes not possible to ensure sufficient distance between wires. In such cases, one way to suppress crosstalk is to shorten the distance that wires run parallel to each other. However, this is sometimes not feasible from a layout design perspective.

[0004] Patent Document 1 discloses a technique for suppressing crosstalk by bending a plurality of wiring patterns in a complex manner rather than arranging them in parallel. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 1-119087 Summary of the Invention [Problem to be solved by the invention]

[0006] However, a layout that bends the wiring pattern in a complex manner degrades the quality of the transmitted signal. For this reason, the technology disclosed in Patent Document 1 is unsuitable for increasing transmission speeds. As such, it is necessary to consider a method for suppressing crosstalk without degrading transmission characteristics and optimizing the layout of the mounting area.

[0007] The present invention has been made in view of the above, and an object of the present invention is to provide a circuit module that can minimize the deterioration of transmission signal quality and optimize the mounting area. [Means for solving the problem]

[0008] In order to solve the above-described problems and achieve the object, a circuit module according to one aspect of the present disclosure includes: a wiring board; a first line provided on the wiring board for transmitting a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board alongside the first line for transmitting a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, one end connected to the first line and the other end connected to a power supply circuit for supplying the power; and a sheet-like first conductor provided on at least a portion of a side surface of a housing that holds the first inductor, the side facing the second line. , the first conductor is connected to the first line . In order to solve the above-mentioned problems and achieve the object, a circuit module according to another aspect of the present disclosure includes a wiring board; a first line provided on the wiring board for transmitting a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board parallel to the first line for transmitting a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, one end connected to the first line and the other end connected to a power supply circuit for supplying the power; a sheet-like first conductor provided on at least a portion of a side surface of a housing holding the first inductor facing the second line; a second inductor provided on the wiring board, one end connected to the second line and the other end connected to a power supply circuit for supplying power; and a sheet-like second conductor provided on at least a portion of the side surface of the second inductor facing the first line, wherein the second conductor is connected to the second line. [Effects of the Invention]

[0009] The circuit module according to the present invention can minimize the deterioration of the quality of the transmission signal and optimize the mounting area. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a transmission system that is the premise of the circuit module of the present disclosure. [Figure 2] FIG. 2 is a diagram showing an equivalent circuit of the transmission circuit. [Figure 3] FIG. 3 is a schematic diagram that simplifies the equivalent circuit shown in FIG. [Figure 4] FIG. 4 is a diagram illustrating crosstalk between wirings. [Figure 5] FIG. 5 is a diagram showing the configuration of a main part of a circuit module according to the first embodiment of the present disclosure. [Figure 6] 6 is a cross-sectional view taken along the line X1-X1 in FIG. [Figure 7] FIG. 7 is a diagram showing the configuration of a main part of a circuit module according to the second embodiment of the present disclosure. [Figure 8] 8 is a cross-sectional view taken along the line X2-X2 in FIG. [Figure 9] FIG. 9 is a diagram showing the configuration of a main part of a circuit module according to a third embodiment of the present disclosure. [Figure 10] FIG. 10 is a diagram illustrating the effect of providing a sheet-shaped conductor. [Figure 11] FIG. 11 is a diagram illustrating a simulation for elucidating the coupling mechanism of crosstalk. [Figure 12] FIG. 12 is a diagram illustrating a simulation for elucidating the coupling mechanism of crosstalk. [Figure 13] FIG. 13 is a diagram illustrating a simulation for elucidating the coupling mechanism of crosstalk. [Figure 14] FIG. 14 is a diagram showing the results of a simulation performed using the substrate shown in FIG. [Figure 15] FIG. 15 shows the results of a simulation performed using the substrate shown in FIGS. [Figure 16] FIG. 16 is a plan view showing the substrate described with reference to FIGS. 5 and 6, viewed from above one main surface thereof. [Figure 17] FIG. 17 is a diagram showing a substrate in which the inductors are arranged at positions shifted relative to the longitudinal direction of the wiring. [Figure 18] FIG. 18 is a plan view showing one main surface of the substrate as viewed from above. [Figure 19] FIG. 19 is a diagram showing the measurement results of S parameters when the antennas are arranged as shown in FIGS. [Figure 20] FIG. 20 is a diagram showing a simulation model for verifying the crosstalk suppression effect. [Figure 21]FIG. 21 shows the simulation results for a microstrip line model with a 50Ω matched substrate and an interlayer thickness of 0.25 mm. [Figure 22] FIG. 22 shows the simulation results for a microstrip line model with a 50 Ω matched substrate and an interlayer thickness of 0.25 mm. [Figure 23] FIG. 23 shows the simulation results for a microstrip line model with a 50Ω matched substrate and an interlayer thickness of 0.25 mm. [Figure 24] FIG. 24 shows the simulation results for a microstrip line model with a 50Ω matched substrate and an interlayer thickness of 0.15 mm. [Figure 25] FIG. 25 shows the simulation results for a microstrip line model with a 50Ω matched substrate and an interlayer thickness of 0.15 mm. [Figure 26] FIG. 26 shows the simulation results for a microstrip line model with a 50Ω matching and a substrate interlayer thickness of 0.15 mm. [Figure 27] FIG. 27 is a diagram showing the relationship between the distance between wires and the parallel running distance in a wiring design for suppressing crosstalk. [Figure 28] FIG. 28 is a diagram showing the configuration of a main part of a circuit module according to the fourth embodiment. [Figure 29] FIG. 29 is a diagram showing the configuration of a main part of a circuit module according to the fifth embodiment. [Figure 30] FIG. 30 is a diagram showing the configuration of a main part of a circuit module according to the sixth embodiment. [Figure 31] FIG. 31 is a diagram showing the configuration of a main part of a circuit module according to the seventh embodiment. [Figure 32] FIG. 32 is a diagram showing the configuration of a main part of a circuit module according to the eighth embodiment. [Figure 33] FIG. 33 is a diagram showing the configuration of a main part of a circuit module according to the ninth embodiment. [Figure 34]FIG. 34 is a bottom view of the inductor shown in FIG. [Figure 35] FIG. 35 is a bottom view of the inductor used in the circuit module according to the tenth embodiment. [Figure 36] FIG. 36 is a diagram showing the conditions of the wiring substrate used in each embodiment. [Figure 37] FIG. 37 is a diagram showing the configuration of the main part of a circuit module according to the eleventh embodiment. [Figure 38] FIG. 38 is a diagram showing the configuration of the main part of a circuit module according to the twelfth embodiment. [Figure 39] FIG. 39 is a diagram showing the configuration of the main part of a circuit module according to the thirteenth embodiment. [Figure 40] 40 is a cross-sectional view taken along the line X3-X3 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] The transmission systems according to the embodiments will be described in detail below with reference to the drawings. Note that the present disclosure is not limited to these embodiments. Each embodiment is an example, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. From embodiment 2 onwards, descriptions of matters common to embodiment 1 will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0012] (Transmission System) FIG. 1 is a diagram showing a schematic configuration of a transmission system that is the premise of the circuit module of the present disclosure.

[0013] 1, a transmission system 100 implements an interface between an on-board device (hereinafter also referred to as "DEV") 300, such as an on-board camera, and an electronic control unit (hereinafter also referred to as "ECU") 200 as a connection target device, using a SerDes transmission method. Specifically, as shown in Fig. 1, the transmission system 100 connects a first circuit module 1 and second circuit modules 2A, 2B, 2C, and 2D via coaxial cables 3A, 3B, 3C, and 3D, respectively. Signals are transmitted between the first circuit module 1 and the second circuit modules 2A, 2B, 2C, and 2D, respectively.

[0014] Furthermore, the transmission system 100 applies a DC voltage to the signal transmission path, and realizes PoC (Power over Coax) for supplying power to the DEV 300 via the coaxial cable 3.

[0015] 1, the first circuit module 1 includes a first interface IC 11, first power supply circuits (power supply circuits) 12A, 12B, 12C, and 12D, and a PoC circuit 13. The second circuit module 2A, which is a circuit provided outside the first circuit module 1, includes a second interface IC 21A, a second power supply circuit 22A, and a PoC circuit 23A. The PoC circuits 13A and 23A include at least an inductor.

[0016] The second circuit modules 2B, 2C, and 2D, which are separate circuits provided outside the first circuit module 1, also have the same components as the second circuit module 2A. Specifically, the second circuit module 2B includes a second interface IC21B, a second power supply circuit 22B, and a PoC circuit 23B. The PoC circuits 13B and 23B include at least an inductor. The second circuit module 2C includes a second interface IC21C, a second power supply circuit 22C, and a PoC circuit 23C. The PoC circuits 13C and 23C include at least an inductor. The second circuit module 2D includes a second interface IC21D, a second power supply circuit 22D, and a PoC circuit 23D. The PoC circuits 13D and 23D include at least an inductor.

[0017] The first interface IC11 converts signals input from the ECU 200 and outputs the converted signals to the second circuit modules 2A, 2B, 2C, and 2D via the coaxial cables 3A, 3B, 3C, and 3D. The first interface IC11 also converts signals input via the coaxial cables 3A, 3B, 3C, and 3D and outputs the converted signals to the ECU 200. The first interface IC11 and the coaxial cable 3A are connected by a wiring 40A. The first interface IC11 and the coaxial cable 3B are connected by a wiring 40B. The first interface IC11 and the coaxial cable 3C are connected by a wiring 40C. The first interface IC11 and the coaxial cable 3D are connected by a wiring 40D.

[0018] Each of the second interface ICs 21A, 21B, 21C, and 21D converts a signal input from the DEV 300 and outputs the converted signal to the first circuit module 1 via the coaxial cables 3A, 3B, 3C, and 3D. Also, each of the second interface ICs 21A, 21B, 21C, and 21D converts a signal input via the coaxial cables 3A, 3B, 3C, and 3D and outputs the converted signal to the DEVs 300A, 300B, 300C, and 300D.

[0019] 1, dashed arrows indicate the signal transmission direction from the first interface IC11 to the second interface ICs 21A, 21B, 21C, and 21D, and solid arrows indicate the signal transmission paths from the second interface ICs 21A, 21B, 21C, and 21D to the first interface IC11.

[0020] The first power supply circuit 12A supplies power to the first interface IC 11, ECU 200, etc. The first power supply circuit 12A also supplies power to the signal transmission path of the coaxial cable 3A via the PoC circuit 13A. The second power supply circuit 22A is supplied with power from the signal transmission path of the coaxial cable 3A via the PoC circuit 23A. The second power supply circuit 22A supplies power to the second interface IC 21A, DEV 300A, etc.

[0021] The first power supply circuit 12B supplies power to the signal transmission path of the coaxial cable 3B via the PoC circuit 13B. The second power supply circuit 22B supplies power to the second interface IC 21B, the DEV 300B, and the like.

[0022] The first power supply circuit 12C supplies power to the signal transmission path of the coaxial cable 3C via the PoC circuit 13C. The second power supply circuit 22C supplies power to the second interface IC 21C, the DEV 300C, and the like.

[0023] The first power supply circuit 12D supplies power to the signal transmission path of the coaxial cable 3D via the PoC circuit 13D. The second power supply circuit 22D supplies power to the second interface IC 21D, the DEV 300D, and the like.

[0024] In this example, four first power supply circuits 12A, 12B, 12C, and 12D are provided, each corresponding to one of the four second circuit modules 2A, 2B, 2C, and 2D, but it is also possible to provide fewer than four first power supply circuits and supply power to multiple second circuit modules from one first power supply circuit.

[0025] 1, the signal transmission speed from the first interface IC11 to the second interface ICs 21A, 21B, 21C, and 21D is assumed to be slower than the signal transmission speed from the second interface ICs 21A, 21B, 21C, and 21D to the first interface IC11. Specifically, the signal transmission speed from the first interface IC11 to the second interface ICs 21A, 21B, 21C, and 21D is assumed to be a relatively slow transmission speed, for example, 1 MHz to several tens of MHz. Furthermore, the signal transmission speed from the second interface ICs 21A, 21B, 21C, and 21D to the first interface IC11 is assumed to be a relatively fast transmission speed, for example, several hundred MHz to several thousand MHz.

[0026] Fig. 2 is a diagram showing an equivalent circuit of a transmission circuit. Fig. 3 is a schematic diagram that simplifies the equivalent circuit shown in Fig. 2. In Fig. 2, PoC circuit 13 is shown as a representative of PoC circuits 13A, 13B, 13C, and 13D in Fig. 1. In Fig. 2, PoC circuit 23 is shown as a representative of PoC circuits 23A, 23B, 23C, and 23D in Fig. 1.

[0027] As shown in FIG. 2, the transmission circuit 10 includes a transmission line P1'-P2' provided between a first port P1 and a second port P2, a first capacitor C1 provided between the first port P1 and the transmission line P1'-P2', a second capacitor C2 provided between the second port P2 and the transmission line P1'-P2', a PoC circuit 13 shunt-connected to the connection point between the first capacitor C1 and the transmission line P1'-P2', and a PoC circuit 23 shunt-connected to the connection point between the second capacitor C2 and the transmission line P1'-P2'.

[0028] 2, PoC circuit 13 includes, for example, a parallel circuit of inductor L11 and resistor R11, a parallel circuit of inductor L12 and resistor R12, and a parallel circuit of inductor L13 and resistor R13 connected in series. Ends of PoC circuit 13 are connected to first power supply circuit (power supply circuit) 12 (12A, 12B, 12C, 12D) as shown in Fig. 1, but here the configuration is shown in which they are connected to GND potential as an equivalent circuit.

[0029] Furthermore, the PoC circuit 13 can be simplified to a first inductor L1 as shown in Fig. 3. The first capacitor C1 and the first inductor L1 configure a first bias T circuit T1. As shown in Fig. 3, in this disclosure, the resistors R11, R12, and R13 shown in Fig. 2 are omitted (open), and a simulation to be described later is performed.

[0030] 2, PoC circuit 23 is formed by connecting in series, for example, a parallel circuit of inductor L21 and resistor R21, a parallel circuit of inductor L22 and resistor R22, and a parallel circuit of inductor L23 and resistor R23. An end of PoC circuit 23 is connected to second power supply circuit (power supply circuit) 22 as shown in Fig. 1, but here, a configuration is shown in which the end is connected to GND potential as an equivalent circuit.

[0031] Furthermore, the PoC circuit 23 can be simplified to a second inductor L2 as shown in Fig. 3. The second capacitor C2 and the second inductor L2 form a second bias T circuit T2. As shown in Fig. 3, in this disclosure, the resistors R21, R22, and R23 shown in Fig. 2 are omitted (open), and a simulation to be described later is performed.

[0032] 2 and 3, the first port P1 corresponds to the signal input / output terminal of the first interface IC11. The second port P2 corresponds to the signal input / output terminal of the second interface IC21. The transmission line P1'-P2' corresponds to the coaxial cable 3, the port P1' corresponds to the signal input / output terminal of the first circuit module 1, and the port P2' corresponds to the signal input / output terminal of the second circuit modules 2A, 2B, 2C, and 2D.

[0033] (Causes and solutions to crosstalk) Returning to FIG. 1 , crosstalk may occur between the wiring from the first interface IC 11 to the coaxial cables 3A, 3B, 3C, and 3D. Furthermore, depending on the arrangement of the PoC circuits 13A, 13B, 13C, and 13D, inductors may couple with each other, resulting in crosstalk. For example, depending on the arrangement of the inductor of the PoC circuit 13A and the inductor of the PoC circuit 13B, they may be inductively coupled, resulting in crosstalk. The inventors have investigated the causes of this crosstalk and countermeasures. The causes of crosstalk and countermeasures investigated by the inventors are described below. For convenience of explanation, in the following description, the PoC circuit 13A will be referred to as “inductor 13A” and the PoC circuit 13B will be referred to as “inductor 13B.” Although the following description will mainly focus on inductors 13A and 13B, similar crosstalk countermeasures can be applied to the PoC circuits 13C and 13D.

[0034] Fig. 4 is a diagram illustrating crosstalk between wiring lines. As shown in Fig. 4, wiring lines 40A and 40B, which are transmission lines for signals to be transmitted, are provided on a substrate 50. Wiring lines 40A and 40B transmit power supply voltages for supplying electric power along with the signals to be transmitted. Wiring line 40A is provided substantially parallel to wiring line 40B. In this example, a guard pattern 51 is provided between wiring line 40A and wiring line 40B.

[0035] Inductors 13A and 13B are provided on one main surface of the substrate 50. These correspond to the inductors 13A and 13B in Fig. 1 and are inductors that form a bias T circuit.

[0036] One end of inductor 13A is connected to wiring 40A. The other end of inductor 13A is connected to power supply pattern 120A. The power supply pattern 120A is supplied with a power supply voltage from the first power supply circuit 12A of FIG. 1. One end of inductor 13B is connected to wiring 40B. The other end of inductor 13B is connected to power supply pattern 120B. The power supply pattern 120B is supplied with a power supply voltage from the first power supply circuit 12B of FIG. 1.

[0037] Crosstalk may occur when wiring 40A and wiring 40B are arranged in parallel or when inductor 13A and inductor 13B are provided close to each other, as shown in Fig. 4. Configurations for suppressing this crosstalk will be described with reference to Figs.

[0038] (First embodiment) Fig. 5 is a diagram showing the configuration of a main part of a circuit module according to a first embodiment of the present disclosure. Fig. 5 shows a substrate 50a, which is a main part of the circuit module. Fig. 6 is a cross-sectional view of the X1-X1 portion in Fig. 5. Fig. 6 is a cross-sectional view of inductors 13A and 13B including the substrate 50a. This disclosure focuses on PoC circuits, and meets strict crosstalk requirements by providing a unique configuration for the inductors used in PoC circuits.

[0039] 6, inductor 13A includes magnetic core 130A, winding 131A wound around core 130A, and housing 132A supporting these. One end of winding 131A is electrically connected to terminal 133A. Terminal 133A is electrically connected to wiring 40A, which is the first line. The other end of winding 131A is electrically connected to terminal 134A. Terminal 134A is electrically connected to power supply pattern 120A.

[0040] Inductor 13B includes a magnetic core 130B, a winding 131B wound around core 130B, and a housing 132B that supports these. One end of winding 131B is electrically connected to terminal 133B. Terminal 133B is electrically connected to wiring 40B, which is the second line. The other end of winding 131B is electrically connected to terminal 134B. Terminal 134B is electrically connected to power supply pattern 120B. Guard pattern 51 is electrically connected to the ground layer GND via a through hole H1.

[0041] As shown in Figures 5 and 6, inductors 13A and 13B are provided with sheet-like conductors 15A and 15B on a substrate 50a of a circuit module according to the first embodiment. As shown in Figure 6, conductors 15A and 15B are bent into an L-shape. The sheet-like shape refers to a shape (planar shape) that has a two-dimensional surface and is thin compared to its length and width.

[0042] Conductor 15A covers a portion of the surface of inductor 13A. Conductor 15A has a side surface portion 150A and an upper surface portion 151A. Side surface portion 150A of conductor 15A covers the side surface of the housing of inductor 13A that faces wiring 40B, which is the second line. In other words, side surface portion 150A of conductor 15A covers the side surface of the housing of inductor 13A that is closer to wiring 40B. Furthermore, upper surface portion 151A of conductor 15A covers the upper surface of inductor 13A.

[0043] Conductor 15B covers a portion of the surface of inductor 13B. Conductor 15B has a side surface portion 150B and an upper surface portion 151B. Side surface portion 150B of conductor 15B covers the side surface of the housing of inductor 13B that faces wiring 40A, which is the first line. In other words, it covers the side surface of the housing of inductor 13B that is closer to wiring 40A. Furthermore, upper surface portion 151B of conductor 15B covers the upper surface of inductor 13B.

[0044] In this embodiment, conductors 15A and 15B are formed by folding copper foil. Conductors 15A and 15B can cover the opposing surfaces of inductor 13A and inductor 13B as well as their upper surfaces, thereby suppressing crosstalk.

[0045] Inductors 13A and 13B, each having conductors 15A and 15B arranged on a side surface of the inductor housing including the height direction, are mounted on two wirings 40A and 40B, respectively. As a result, conductor 15A is provided on at least a portion of the side surface of the housing holding inductor 13A that faces wiring 40B. Conductor 15B is provided on at least a portion of the side surface of the housing holding inductor 13B that faces wiring 40A. By arranging inductors 13A and 13B in this manner, crosstalk can be suppressed by the eddy current loss (absorption loss) effect generated in conductors 15A and 15B.

[0046] Here, the conductors 15A and 15B are formed, for example, as shown in the following (1) to (3). (1) A thin metal foil conductor is bonded to the surface of the inductors 13A and 13B with an adhesive. (2) A conductor is created by press-molding a bendable metal plate. The metal plate is molded so that it partially fits the shape of the inductor housings 132A and 132B, and is joined to the housings 132A and 132B with latches. (3) A metal portion is provided in a part of the inductor housings 132A and 132B, and a conductor is joined to the metal portion by a method such as thermocompression bonding.

[0047] Conductors formed in a similar manner are also used in the following embodiments. Sheet-like conductors include conductors formed by vapor deposition or plating on the surface of the inductor housing. That is, instead of using conductors 15A and 15B, conductive paint may be applied directly to the inductor housing, or a conductor may be formed on the surface of the inductor housing by vapor deposition or plating. This also applies to the following embodiments. Note that an embodiment in which a conductor is formed by vapor deposition or plating will be described later.

[0048] (Second embodiment) Fig. 7 is a diagram showing the configuration of a main part of a circuit module according to a second embodiment of the present disclosure. Fig. 7 shows a substrate 50b, which is a main part of the circuit module. Fig. 8 is a cross-sectional view of the X2-X2 portion in Fig. 7. Fig. 8 is a cross-sectional view of inductors 13A and 13B including the substrate 50b. In the second embodiment, a sheet-like conductor is provided for one of the inductors, and a sheet-like conductor is not provided for the other inductor.

[0049] 7 and 8, in a substrate 50b of a circuit module according to the second embodiment, a sheet-like conductor 15B is provided on an inductor 13B, but a sheet-like conductor is not provided on an inductor 13A. The conductor 15B is formed in the same manner as in the first embodiment. As shown in FIG. 8, the conductor 15B is bent into an L-shape.

[0050] In the second embodiment, inductor 13B, which has a conductor provided on the immediate surface including the height direction of the inductor housing, is mounted on one of wirings 40B. By arranging inductor 13B in this manner, crosstalk can be suppressed by the effect of eddy current loss (absorption loss) generated in conductor 15B.

[0051] (Third embodiment) Fig. 9 is a diagram showing the configuration of a main part of a circuit module according to a third embodiment of the present disclosure. Fig. 9 shows a substrate 50c, which is a main part of the circuit module. Fig. 9 is a cross-sectional view of the substrate 50c taken along a portion corresponding to the X2-X2 portion in Fig. 7. Fig. 9 is a cross-sectional view of inductors 13A and 13B including the substrate 50c. In the third embodiment, conductors 15A and 15B are at ground potential.

[0052] The inductors are mounted as shown in FIG. 9, and conductors 15A and 15B are provided to surround a portion of inductor 13A and a portion of inductor 13B. The end of conductor 15A is electrically connected to guard pattern 51a. Therefore, conductor 15A is at ground potential. The end of conductor 15B is electrically connected to guard pattern 51a. Therefore, conductor 15B is at ground potential. Crosstalk can be suppressed by the eddy current loss (absorption loss) effect generated in conductors 15A and 15B.

[0053] (Crosstalk suppression effect) The inventors have verified the effect of suppressing crosstalk by using conductors. Specifically, first, on a substrate 50a shown in FIG. 5, one end of a wiring 40A is designated as port P1, the other end as port P2, and one end of a wiring 40B is designated as port P3, the other end as port P4. Ports P1 and P3 are then measured, and the S-parameter (S31) is confirmed. For the measurement, an inductor with a length of approximately 3.2 mm, a width of approximately 2.5 mm, and an inductance value of 2.2 μH is used.

[0054] FIG. 10 is a diagram illustrating the effect of providing conductors. FIG. 10 is a diagram illustrating measurement results of S parameters. In FIG. 10, the dashed dotted line indicates crosstalk when no copper foil is provided, and the solid line indicates crosstalk when copper foil is provided. As can be seen from FIG. 10, it can be confirmed that providing conductors 15A and 15B reduces crosstalk by approximately 10 dB. In other words, when conductors 15A and 15B are provided, the value of the S parameter (S31) is lower than when they are not provided, and crosstalk is reduced.

[0055] Next, the inventors carried out a simulation to elucidate the crosstalk coupling mechanism. Figures 11 to 13 are diagrams for explaining the simulation to elucidate the crosstalk coupling mechanism.

[0056] 11, substrate 52 has ground layers GND1 and GND2, a wiring 41A provided above ground layer GND1, and a wiring 41B provided above ground layer GND2. In Fig. 11, a dielectric is provided between ground layer GND1 and wiring 41A. In addition, a dielectric is provided between ground layer GND2 and wiring 41B.

[0057] 11, the ground layers GND1 and GND2 are electrically separated due to the presence of an insulating portion D1 where no conductive layer is provided. If crosstalk can be suppressed by separating the ground layers as shown in FIG. 11, crosstalk occurs through the ground layers that are inner layers of the substrate 52.

[0058] Fig. 12 is a diagram showing an example in which wiring 41B is covered with a shield. Board 53 in Fig. 12 shows a state in which wiring 41A and wiring 41B are the same as board 52 in Fig. 11, but a board without insulating part D1 in Fig. 11 is provided with metal shield 15. Shield 15 is electrically connected to the ground layer of board 53.

[0059] 13 is a diagram showing the state of the substrate 53 as viewed from the direction of arrow Y13 in FIG. 12. As shown in FIGS. 12 and 13, the shield 15 is provided so as to cover the wiring 41B. That is, the wiring 41B is provided in the space surrounded by the shield 15 and the ground layer of the substrate 53. Therefore, if crosstalk can be suppressed by adding the shield 15, the crosstalk will be generated through the space above the substrate 53.

[0060] FIG. 14 shows the results of a simulation using the board shown in FIG. 11. In FIG. 14, the dashed line indicates the case where the ground layers GND1 and GND2 are electrically separated by providing an insulating portion D1. In addition, the dashed line indicates the case where the insulating portion D1 is not provided and the ground layers are not separated. As shown in FIG. 14, the dashed line and the dashed line show similar characteristics. This shows that separating the ground layers does not have the effect of suppressing crosstalk.

[0061] Fig. 15 shows the results of a simulation performed using the substrate shown in Fig. 12 and Fig. 13. In Fig. 15, the dashed-dotted line shows the case where shield 15 is not provided. Also, in Fig. 15, the solid line shows the characteristics as an electrostatic shield, and the dashed line shows the characteristics as a magnetic shield.

[0062] As shown in Fig. 15, when shield 15 is provided as shown in Fig. 12 and Fig. 13, it is found that it has an effect as an electrostatic shield and also as a magnetic shield, thereby suppressing crosstalk. By providing shield 15, the crosstalk suppression effect can be obtained from both the magnetic shield and the electrostatic shield.

[0063] 14 and 15, it was confirmed that coupling between the wirings occurs through the space above the substrate 53 in Fig. 12. By providing the shield 15, the effect of suppressing crosstalk can be obtained as shown in Fig. 10.

[0064] (When staggered) From the above, it was confirmed that shielding above the board is effective. The inventors confirmed that crosstalk was suppressed when the mounting positions of the inductors were shifted in the wiring length direction in order to increase the effective shield area.

[0065] 16 is a plan view showing one main surface of the substrate 50a described with reference to FIGS. 5 and 6 as viewed from above. In the state shown in FIG. 16, the positions of the inductors 13A and 13B are the same relative to the longitudinal direction of the wirings 40A and 40B. Therefore, the side surface of the inductor 13A facing the wiring 40B and the side surface of the inductor 13B facing the wiring 40A face each other.

[0066] FIG. 17 is a diagram showing a substrate 50a' in which the positions of inductors 13A and 13B are shifted relative to the longitudinal direction of wirings 40A and 40B. FIG. 18 is a plan view showing one main surface of the substrate 50a' as viewed from above. As shown in FIGS. 17 and 18, inductors 13A and 13B are mounted at positions shifted relative to the longitudinal direction of wirings 40A and 40B. In this example, the shift amount Z is 4 mm. In the case of FIG. 16 described above, the shift amount is 0 mm.

[0067] Fig. 19 is a diagram showing the measurement results of the S parameter (S31) when the antennas are arranged as shown in Fig. 17 and Fig. 18. In Fig. 19, the solid line indicates a case where the deviation is 0 mm, and the dashed line indicates a case where the deviation is 4 mm. As shown in Fig. 19, when the deviation is 4 mm, a crosstalk suppression effect of 3 dB to 5 dB was obtained compared to when the deviation is 0 mm.

[0068] (distance between wires, parallel running distance) Next, the inventors investigated the crosstalk suppression effect when the distance between the wires and the distance at which the wires are arranged in parallel are changed. First, a simulation model was created to verify the crosstalk suppression effect.

[0069] Fig. 20 is a diagram showing a simulation model for verifying the crosstalk suppression effect. In Fig. 20, wiring 40A and wiring 40B are provided on a substrate 50'. That is, two microstrip lines are provided close to each other. The length between wiring 40A and wiring 40B is defined as distance D. Furthermore, the distance over which wiring 40A and wiring 40B are provided in parallel is defined as parallel distance L. In this simulation model, the S parameter (S31) was measured when distance D and parallel distance L were changed, and the crosstalk suppression effect was verified.

[0070] 21 to 23 show simulation results for a 50 Ω matched microstrip line model with a 0.25 mm interlayer thickness of the substrate 50'. A 6-layer substrate with a 1.5 mm thickness or a 4-layer substrate with a 0.8 mm thickness is assumed. FIG. 21 shows the case where the distance D is 2 mm. FIG. 22 shows the case where the distance D is 3 mm. FIG. 23 shows the case where the distance D is 4 mm.

[0071] 24 to 26 show simulation results for a 50 Ω matched microstrip line model with a 0.15 mm interlayer thickness of the substrate 50'. A 12-layer substrate with a 1.5 mm thickness or a 6-layer substrate with a 0.8 mm thickness is assumed. Fig. 24 shows the case where the distance D is 1 mm. Fig. 25 shows the case where the distance D is 2 mm. Fig. 26 shows the case where the distance D is 3 mm.

[0072] Fig. 27 is a diagram showing the relationship between the distance D between wires and the parallel running distance L in wiring design to suppress crosstalk. As shown in Fig. 5, using inductors 13A and 13B with conductors 15A and 15B added can suppress crosstalk by approximately 10 dB. If the crosstalk threshold is to be -45 dB or less at a frequency of 1 GHz, the criteria shown in Fig. 27 must be followed.

[0073] In FIG. 27, "with conductor" indicates the case where a conductor is provided, and "without conductor" indicates the case where a conductor is not provided. When the thickness between layers of the wiring board is 0.25 mm, the width (wiring width) of wiring 40A, 40B is preferably 0.35 mm or more and 0.5 mm or less. In this case, when the distance D between the wirings is 2 mm, the parallel running distance L is not permitted in the "without conductor" case, and is preferably 12 mm or less in the "with conductor" case. Furthermore, when the distance D between the wirings is 3 mm, the parallel running distance L is preferably 4 mm or less in the "without conductor" case and 20 mm or less in the "with conductor" case. When the distance D between the wirings is 4 mm, the parallel running distance L may be 10 mm or less in the "without conductor" case, and 20 mm or more in the "with conductor" case (marked with an * in the figure).

[0074] On the other hand, when the thickness between layers of the wiring board is 0.12 mm, the width (wiring width) of wiring 40A, 40B is preferably 0.1 mm or more and 0.2 mm or less. In this case, when the distance D between the wirings is 1 mm, the parallel running distance L is preferably 2 mm or less in the "without conductor" state and 10 mm or less in the "with conductor" state. Furthermore, when the distance D between the wirings is 2 mm, the parallel running distance L may be 8 mm or less in the "without conductor" state and 20 mm or more in the "with conductor" state (marked with an * in the figure). When the distance D between the wirings is 3 mm, the parallel running distance L may be 20 mm or more in the "without conductor" and "with conductor" states (marked with an * in the figure).

[0075] Comparing the "without conductor" case and the "with conductor" case in Figure 27, it can be seen that the "with conductor" case, which is the case with the circuit module of the present disclosure, relaxes the restrictions on the design of the wiring board. As such, the circuit module of the present disclosure allows for a highly flexible design layout. This minimizes degradation of the quality of the transmission signal and optimizes the mounting area.

[0076] (Fourth embodiment) FIG. 28 is a diagram showing the configuration of a main part of a circuit module according to the fourth embodiment. FIG. 28 shows a cross section of a substrate 50d, which is a main part of the circuit module, cut at the same position as in FIG. 6, including inductors 13A and 13B. As shown in FIG. 28, a conductor 15A is provided in inductor 13A. As shown in FIG. 28, conductor 15A has a side surface portion 150A and an upper surface portion 151A, and is bent into an L shape. The upper surface portion 151A is provided on the upper surface of housing 132A. One end of side surface portion 150A is electrically connected to guard pattern 51a.

[0077] 28, a conductor 15B is provided in inductor 13B. As shown in FIG. 28, conductor 15B has a side surface portion 150B and an upper surface portion 151B, and is bent into an L shape. Upper surface portion 151B is provided on the upper surface of housing 132B. One end of side surface portion 150B is electrically connected to guard pattern 51a.

[0078] The guard pattern 51a is electrically connected to the ground layer GND via a through hole H1. Therefore, the electric field generated by the wiring 40A or 40B is capacitively coupled to the conductors 15A and 15B, and then a current flows toward the ground layer GND. This enhances the crosstalk suppression effect.

[0079] (Fifth embodiment) FIG. 29 is a diagram showing the configuration of the main part of a circuit module according to the fifth embodiment. FIG. 29 shows a cross section of a substrate 50e, which is the main part of the circuit module, cut at the same position as in FIG. 6, including the inductor 13B. The fifth embodiment is configured without the inductor 13A of the fourth embodiment. As in the fourth embodiment, one end of the side surface portion 150B is electrically connected to the guard pattern 51a. Therefore, after the electric field generated by the wiring 40A is capacitively coupled to the conductor 15B, a current flows toward the ground layer GND. This enhances the crosstalk suppression effect.

[0080] (Sixth embodiment) Fig. 30 is a diagram showing the configuration of a main part of a circuit module according to a sixth embodiment. Fig. 30 shows a cross section of a substrate 50f, which is a main part of the circuit module, taken at the same position as in Fig. 6, through inductors 13A and 13B. In the sixth embodiment, sheet-like conductors 15A and 15B are electrically connected to wiring 40A and 40B.

[0081] As shown in Fig. 30, one end of side surface portion 150A of conductor 15A is electrically connected to wiring 40A. One end of side surface portion 150B of conductor 15B is electrically connected to wiring 40B. By making such connections, the overall size of the inductor, including the sheet-like conductor, can be made smaller than in the fourth embodiment. Therefore, the sixth embodiment can contribute to space saving.

[0082] By connecting conductors 15A and 15B to wiring 40A and 40B, which are transmission lines for signals to be transmitted, the high-frequency components of the signals on wiring 40A and 40B are capacitively coupled to conductors 15A and 15B. This capacitive coupling makes it easier for current to flow from conductors 15A and 15B to the ground layer GND. This makes it possible to suppress crosstalk.

[0083] If the wiring 40A, 40B is a power supply line for supplying power, the impedance on the power supply side is low, so an effect similar to that obtained when connected to the ground layer GND can be obtained.

[0084] Seventh embodiment FIG. 31 is a diagram illustrating the configuration of a main part of a circuit module according to a seventh embodiment. FIG. 31 shows a cross section of a substrate 50g, which is a main part of the circuit module, cut at the same position as in FIG. 6, including inductors 13A and 13B. In the seventh embodiment, multiple sheet-like conductors are provided in one inductor. That is, inductor 13A is provided with conductors 15A and 17A. Conductor 15A has a side surface portion 150A and an upper surface portion 151A. One end of side surface portion 150A is connected to guard pattern 51a. Sheet-like conductor 17A has a side surface portion 170A and an upper surface portion 171A. One end of side surface portion 170A is connected to power supply pattern 120A. Conductor 15A and conductor 17A are electrically isolated from each other, and insulation between power supply pattern 120A and ground layer GND is maintained.

[0085] 31, the ground electrode G2 is electrically connected to the ground layer GND via a through hole H2, and the ground electrode G3 is electrically connected to the ground layer GND via a through hole H3.

[0086] Furthermore, inductor 13B is provided with sheet-like conductors 15B and 17B. Conductor 15B has a side surface portion 150B and an upper surface portion 151B. One end of side surface portion 150B is connected to wiring 40B. Conductor 17B has a side surface portion 170B and an upper surface portion 171B. One end of side surface portion 170B is connected to ground electrode G3. Conductors 15B and 17B are electrically separated, and an insulated state between wiring 40B and ground layer GND is maintained.

[0087] According to the configuration as shown in FIG. 31, it is possible to obtain the combined effect of the fourth embodiment and the sixth embodiment.

[0088] (Eighth embodiment) FIG. 32 is a diagram illustrating the configuration of a main part of a circuit module according to the eighth embodiment. FIG. 32 shows a cross section of a substrate 50h, which is a main part of the circuit module, cut at the same position as in FIG. 6, including inductors 13A and 13B. In the eighth embodiment, a sheet-like conductor is provided on each electrode of inductors 13A and 13B. That is, as shown in FIG. 32, a conductor 18A is connected to a terminal 133A of inductor 13A. The conductor 18A has a side surface portion 180A and a bottom surface portion 181A. The terminal 133A is electrically connected to wiring 40A via the bottom surface portion 181A. The side surface portion 180A extends in the height direction of the terminal 133A (direction away from wiring 40A).

[0089] Furthermore, a sheet-like conductor 19A is connected to a terminal 134A of the inductor 13A. The conductor 19A has a side surface portion 190A and a bottom surface portion 191A. The terminal 134A is electrically connected to the power supply pattern 120A via the bottom surface portion 191A. The side surface portion 190A extends in the height direction of the terminal 134A (in the direction away from the power supply pattern 120A).

[0090] Furthermore, a sheet-like conductor 18B is connected to a terminal 133B of the inductor 13B. The conductor 18B has a side surface portion 180B and a bottom surface portion 181B. The terminal 133B is electrically connected to the wiring 40B via the bottom surface portion 181B. The side surface portion 180B extends in the height direction of the terminal 133B (in the direction away from the wiring 40B).

[0091] Furthermore, a sheet-like conductor 19B is connected to a terminal 134B of the inductor 13B. The conductor 19B has a side surface portion 190B and a bottom surface portion 191B. The terminal 134B is electrically connected to the power supply pattern 120B via the bottom surface portion 191B. The side surface portion 190B extends in the height direction of the terminal 134B (in the direction away from the power supply pattern 120B).

[0092] As shown in FIG. 32, crosstalk can be suppressed by providing conductors 18A, 19A, 18B, and 19B having portions extending in the height direction of the electrodes of inductors 13A and 13B.

[0093] (Ninth embodiment) Fig. 33 is a diagram showing the configuration of the main part of a circuit module according to the ninth embodiment. Fig. 33 shows a cross section of a substrate 50i, which is the main part of the circuit module, taken at the same position as in Fig. 6, including inductors 13A and 13B. Fig. 34 is a bottom view of inductor 13A shown in Fig. 33. In the ninth embodiment, inductors 13A and 13B each have a plurality of terminals, at least one of which is an open terminal that is not connected to a winding.

[0094] 33, terminal 133A is electrically connected to wiring 40A. Terminal 134A is electrically connected to power supply pattern 120A. Terminal 133B is electrically connected to wiring 40B. Terminal 134B is electrically connected to power supply pattern 120B.

[0095] 33 and 34, housing 132A of inductor 13A has terminals 133A, 134A, 135A, and 136A. One end of winding 131A is electrically connected to terminal 133A. The other end of winding 131A is electrically connected to terminal 134A. Terminals 135A and 136A are open terminals that are not connected to winding 131A. Terminal 135A is electrically connected to guard pattern 51a via lower surface portion 181A. Terminal 136A is electrically connected to ground electrode G2 via lower surface portion 191A.

[0096] Similarly, housing 132B of inductor 13B has terminals 133B, 134B, 135B, and 136B. One end of winding 131B is electrically connected to terminal 133B. The other end of winding 131B is electrically connected to terminal 134B. Terminals 135B and 136B are open terminals that are not connected to winding 131B. Terminal 135B is electrically connected to guard pattern 51a via lower surface portion 181B. Terminal 136B is electrically connected to ground electrode G3 via lower surface portion 191B.

[0097] (Tenth embodiment) Fig. 35 is a view from the bottom side of inductor 13A used in the circuit module according to the tenth embodiment. When inductor 13A has multiple terminals, the terminal arrangement is not limited to the arrangement shown in Fig. 33 and Fig. 34, and the terminal arrangement may be the arrangement shown in Fig. 35. That is, depending on the arrangement of wiring 40A, guard pattern 51a, power supply pattern 120A, etc., inductor 13A having open terminals shown in Fig. 35 may be used.

[0098] In inductor 13A shown in Fig. 35, one end of winding 131A is electrically connected to terminal 133A. The other end of winding 131A is electrically connected to terminal 134A. Terminals 135A and 136A are open terminals that are not connected to winding 131A. Inductor 13A is mounted on a substrate by terminals 133A, 134A, 135A, and 136A.

[0099] 36 is a diagram showing the conditions for the wiring board used in each of the above-described embodiments. As shown in FIG. 36, when the thickness between layers of the wiring board is 0.25 mm, the width (wiring width) of the wiring 40A, 40B is preferably 0.35 mm or more and 0.5 mm or less. In this case, when the distance D between the wiring boards is 2 mm, the parallel running distance L is preferably 12 mm or less. Furthermore, when the distance D between the wiring boards is 3 mm, the parallel running distance L is preferably 20 mm or less. Note that the wiring board thickness of 0.25 mm is assumed to be a 6-layer board with a thickness of 1.5 mm or a 4-layer board with a thickness of 0.8 mm.

[0100] On the other hand, if the thickness between layers of the wiring board is 0.12 mm, it is preferable that the width (wiring width) of wiring 40A, 40B is 0.1 mm or more and 0.2 mm or less, the distance D between the wiring boards is 1 mm, and the parallel running distance L is 10 mm or less. Note that the thickness between layers of the wiring board of 0.12 mm is assumed to be a 12-layer board with a thickness of 1.5 mm or a 6-layer board with a thickness of 0.8 mm. By mounting inductors 13A, 13B using a wiring board that satisfies the conditions shown in Figure 36, crosstalk can be suppressed to a generally required level.

[0101] (Eleventh embodiment) FIG. 37 is a diagram showing the configuration of the main part of a circuit module according to the eleventh embodiment. FIG. 37 shows a cross section of a substrate 50j, which is the main part of the circuit module, cut at the same position as in FIG. 6, including inductors 13A and 13B. The eleventh embodiment has conductors 16A and 16B formed by vapor deposition or plating. Conductor 16A is formed along the surface of the housing of inductor 13A. Conductor 16B is formed along the surface of the housing of inductor 13B.

[0102] Conductor 16A includes an upper surface portion 161A formed on the upper surface of the housing of inductor 13A and a side surface portion 160A formed on the side surface of the housing of inductor 13A. Top surface portion 161A and side surface portion 160A are continuous and electrically conductive. In this example, end portion 16AT of side surface portion 160A is not connected to terminal 133A. Side surface portion 160A extends in the height direction of terminal 133A (direction away from wiring 40A).

[0103] The conductor 16B includes an upper surface portion 161B formed on the upper surface of the housing of the inductor 13B and a side surface portion 160B formed on the side surface of the housing of the inductor 13B. The upper surface portion 161B and the side surface portion 160B are continuous and electrically conductive. In this example, an end portion 16BT of the side surface portion 160B is not connected to the terminal 133B. The side surface portion 160B extends in the height direction of the terminal 133B (in the direction away from the wiring 40B). The side surface portion 160A and the side surface portion 160B face each other. The circuit module according to the eleventh embodiment can also suppress crosstalk and ensure the performance required to achieve PoC.

[0104] (Twelfth embodiment) Fig. 38 is a diagram showing the configuration of the main part of a circuit module according to a twelfth embodiment. Fig. 38 shows a cross section of a substrate 50k, which is the main part of the circuit module, taken at the same position as in Fig. 6, through inductors 13A and 13B. The twelfth embodiment has conductors 16A and 16B formed by vapor deposition or plating.

[0105] The circuit module according to the twelfth embodiment differs from the circuit module according to the eleventh embodiment in that an end 16AT of the side surface portion 160A is connected to a terminal 133A, and an end 16BT of the side surface portion 160B is connected to a terminal 133B. As a result, the conductor 16A is electrically connected to the wiring 40A via the terminal 133A. Furthermore, the conductor 16B is electrically connected to the wiring 40B via the terminal 133B. The circuit module according to the twelfth embodiment can also suppress crosstalk and ensure the performance required to achieve PoC.

[0106] (Thirteenth embodiment) Fig. 39 is a diagram showing the configuration of the main parts of a circuit module according to a thirteenth embodiment. Fig. 40 is a cross-sectional view of the X3-X3 portion in Fig. 39. Fig. 39 is a cross-sectional view of inductors 13A and 13C including a substrate 50m. This disclosure focuses on PoC circuits, and meets strict crosstalk requirements by providing a unique configuration for the inductors used in PoC circuits.

[0107] The inductor 13A shown in FIG. 39 has the same configuration as the inductor 13A of the eleventh embodiment described with reference to FIG. 37. The thirteenth embodiment has conductors 16A and 16C formed by vapor deposition or plating. The conductor 16A is the same as that of the circuit module of the eleventh embodiment. The inductor 13C shown in FIG. 39 differs from the inductor 13A in the shape of its housing. The housing of the inductor 13C has a protrusion PT. The protrusion PT protrudes from the side of the inductor 13C toward the inductor 13A. In this example, the protrusion PT is a rectangular parallelepiped. In this example, the length of the protrusion PT in the direction along the guard pattern 51 is the same as the length of the housing of the inductor 13C in the direction along the guard pattern 51. The inductor 13C is mounted on the surface of the substrate 50m so that the protrusion PT faces the inductor 13A.

[0108] The conductor 16C formed on the surface of the inductor 13C includes a top surface portion 161C and a side surface portion 160C. The top surface portion 161C and the side surface portion 160C are continuous and electrically conductive. The side surface portion 160C is formed along the surface shape of the protrusion PT. That is, the side surface portion 160C is formed continuous with the top surface PTU and the side surface PTS of the protrusion PT, and is also formed on a portion of the bottom surface PTD. An end portion 16CT of the side surface portion 160C is located on the bottom surface PTD. The conductor 16C and the guard pattern 51 are electrically connected on the bottom surface PTD. Using the inductor 13C having the protrusion PT enables good electrical connection between the conductor 16C and the guard pattern 51. The guard pattern 51 is electrically connected to the ground layer GND via a through hole H1. This electrically connects the conductor 16C to the ground layer GND. This suppresses crosstalk and ensures performance that achieves PoC.

[0109] The shape of the protrusion PT is not limited to a rectangular parallelepiped as shown in Fig. 39. The shape of the protrusion PT may be any shape that allows electrical connection between the conductor 16C formed on the surface of the protrusion PT and the guard pattern 51. Also, an inductor having a protrusion PT, such as inductor 13C, may be used instead of inductor 13A. In this case, both inductors facing each other across the guard pattern 51 will have a protrusion PT.

[0110] With respect to the claims, the present disclosure may take the following forms. <1> A wiring board; a first line provided on the wiring board for transmitting a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board in parallel with the first line for transmitting a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, one end of which is connected to the first line and the other end of which is connected to a power supply circuit for supplying the power; a sheet-like first conductor provided on at least a part of a side surface of a housing that holds the first inductor, the side surface being on the second line side; A circuit module comprising: <2> The first conductor has a portion that covers the top surface of a housing that holds the first inductor. <1> The circuit module according to claim 1. <3> The antenna further includes a second inductor provided on the wiring board, the second inductor having one end connected to the second line and the other end connected to a power supply circuit for supplying electric power, and a sheet-like second conductor provided on at least a part of the side surface of the second inductor on the first line side. <1> or <2> The circuit module according to claim 1. <4> A side surface of the first inductor on the second line side and a side surface of the second inductor on the first line side face each other. <3> The circuit module according to claim 1. <5> The first inductor and the second inductor are provided at positions shifted from each other in the longitudinal direction of the parallel running portion of the first line and the second line. <3> The circuit module according to claim 1. <6> The first conductor is electrically connected to a ground potential. <1> from <5> 10. A circuit module according to claim 9, wherein: <7> The first conductor is connected to the first line. <1> from <5> 10. A circuit module according to claim 9, wherein: <8> The second conductor is electrically connected to a ground potential. <3> from <5> 10. A circuit module according to claim 9, wherein: <9> The second conductor is connected to the second line. <3> from <5> 10. A circuit module according to claim 9, wherein: <10> The first line and the second line are connected to a ground potential. <1> from <9> 10. A circuit module according to claim 9, wherein: [Explanation of symbols]

[0111] 1 First Circuit Module 2A, 2B, 2C, 2D Second Circuit Module 12A, 12B, 12C, 12D power circuit 13A, 13B inductors 15A, 15B, 17A, 17B, 18A, 18B, 19A, 19B conductors 22A, 22B, 22C, 22D power supply circuit 41A, 41B wiring 50, 50a, 50b, 50c, 50d, 50e, 50f, 50g, 50h, 50i, 50j, 50k, 50m, 52, 53 board 51, 51a guard pattern 100 Transmission Systems 120A, 120B power supply pattern 130A, 130B core 131A, 131B windings 132A, 132B housing 133A, 133B, 134A, 134B, 135A, 135B, 136A, 136B terminals G2, G3 ground electrodes GND, GND1, GND2 ground planes P1, P2, P3, P4 ports

Claims

1. A wiring board; a first line provided on the wiring board for transmitting a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board in parallel with the first line for transmitting a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, one end of which is connected to the first line and the other end of which is connected to a power supply circuit for supplying the power; a sheet-like first conductor provided on at least a part of a side surface of a housing that holds the first inductor, the side surface being on the second line side; Equipped with The first conductor is a circuit module connected to the first line.

2. A wiring board; a first line provided on the wiring board for transmitting a signal to be transmitted to a first circuit provided outside the wiring board and a power supply voltage for supplying power to the first circuit; a second line provided on the wiring board in parallel with the first line for transmitting a signal to be transmitted to a second circuit provided outside the wiring board separately from the first circuit and a power supply voltage for supplying power to the second circuit; a first inductor provided on the wiring board, one end of which is connected to the first line and the other end of which is connected to a power supply circuit for supplying the power; a sheet-like first conductor provided on at least a part of a side surface of a housing that holds the first inductor, the side surface being on the second line side; a second inductor provided on the wiring board, one end of which is connected to the second line and the other end of which is connected to a power supply circuit for supplying electric power; and a sheet-like second conductor provided on at least a portion of a side surface of the second inductor facing the first line; Equipped with The second conductor is a circuit module connected to the second line.

3. The circuit module according to claim 1 , wherein the first conductor has a portion covering an upper surface of a housing that holds the first inductor.

4. 3. The circuit module according to claim 1, further comprising: a second inductor provided on the wiring board, one end of the second inductor connected to the second line and the other end of the second inductor connected to a power supply circuit for supplying power; and a sheet-like second conductor provided on at least a portion of the side of the second inductor facing the first line.

5. The circuit module according to claim 2 , wherein a side surface of the first inductor facing the second line and a side surface of the second inductor facing the first line face each other.

6. The circuit module according to claim 4 , wherein the first inductor and the second inductor are provided at positions offset from each other in the longitudinal direction of the parallel-running portion of the first line and the second line.

7. 3. The circuit module according to claim 1, wherein the first conductor is electrically connected to a ground potential.

8. The circuit module according to claim 2 , wherein the first conductor is connected to the first line.

9. The circuit module according to claim 4 , wherein the second conductor is electrically connected to a ground potential.

10. 3. The circuit module according to claim 1, further comprising a guard pattern provided between the first line and the second line and electrically connected to a ground potential.

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