Wafer polishing equipment and method for picking and placing wafer thin plates

Abstract

To provide a wafer grinding apparatus and a method for picking and placing wafer thin plates.SOLUTION: The present invention discloses a wafer grinding apparatus and a method for picking and placing wafer thin plates. The wafer griding apparatus includes a plurality of wafer holders, a driving device, a grinding device, a front table, a rear table, a transferring device and a control unit. In each wafer holder, a plurality of positioning holes used for positioning the wafer thin plates are respectively formed at intervals so as to penetrate through the wafer folder. In each wafer holder, there are formed an identification mark that is used for distinguishing and identifying each wafer holder, a first positioning mark that is used for identifying the configuration center of each positioning hole and a hole position mark that is used for identifying each positioning hole. The present invention enables generation of a grinding record beneficial to tracking the processing history of the wafer thin plates by the identification marks and the hole position marks bindable corresponding to the wafer thin plates.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an equipment assembly used in a wafer thin plate polishing process, and more particularly to a wafer polishing equipment and a method for picking and placing wafer thin plates. [Background technology]

[0002] The wafer polishing equipment comprises a plurality of wafer holders, a driving device, a polishing device, and a transfer device, wherein each of the wafer holders is arranged at intervals on the driving device, and the driving device drives each of the wafer holders to operate in a circular motion, and each of the wafer holders has a plurality of positioning holes formed therethrough through which a large number of wafer thin plates are placed, the polishing device performs polishing processing on each of the wafer thin plates, and the transfer device transfers each of the wafer thin plates to each of the positioning holes, and after the polishing process is completed, transfers each of the wafer thin plates and removes them from the wafer holder.

[0003] The transfer device includes a pick-and-place unit, a processing unit, and a robot arm, which sequentially places a number of wafer thin plates into the different positioning holes.

[0004] After the polishing process is completed, the transfer device sequentially transfers and removes the multiple wafer thin plates that have been polished. Summary of the Invention [Problem to be solved by the invention]

[0005] There is a lack of records of the processing history for each wafer thin plate; in other words, there is a lack of records of the polishing process for the wafer thin plate. Not only must the length of time required to polish the wafer thin plate be recorded, but the wafer holder and the positioning hole where the wafer thin plate is positioned must also be recorded. The transfer device cannot recognize the wafer holder and the positioning hole where each wafer thin plate is transferred and positioned, which is disadvantageous in tracking the processing history of each wafer thin plate. [Means for solving the problem]

[0006] The main object of the present invention is to provide a wafer polishing equipment and a method for picking and placing wafer thin plates.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions: A wafer polishing facility including a plurality of wafer holders (10), a driving device (20), a polishing device (30), a front stage (40), a rear stage (50), a transfer device (60), and a control unit (70), Each of the wafer holders 10 arranged at intervals on the driving device 20 has a plurality of positioning holes 11 formed therethrough at intervals, which are used to install and position each of the wafer thin plates 90, and the polishing device 30 is used to polish each of the wafer thin plates 90, Each wafer holder 10 is formed with an identification mark 12 used to distinguish and identify each wafer holder 10, a first positioning mark 13 used to recognize the center of each positioning hole 11, and a plurality of hole position marks 14 are formed adjacent to each positioning hole 11, and each hole position mark 14 is used to distinguish and identify each positioning hole 11, The front stage 40 is formed with at least one first arrangement structure 41 for placing the wafer thin plate 90 waiting to be polished; The back-mounting table 50 is formed with at least one second arrangement structure 51 for placing the polished wafer thin plate 90 thereon; The transfer device 60 includes a robot arm 62 and a pick-and-place unit 61 installed at a working end 63 of the robot arm 62. The pick-and-place unit 61 includes a seat 64 connected to the robot arm 62, a lifter 65 connected to the seat 64, a suction chuck module 66 connected to the lifter 65, and an image capturer 67, whereby the lifter 65 brakes the suction chuck module 66 to raise and lower, thereby approaching or separating from one selected wafer thin plate 90, the suction chuck module 66 includes at least one vacuum suction chuck 662 used to suck and release the wafer thin plate 90, and the image capturer 67 is connected to the seat 64 and used to capture an image. The control unit 70 is mainly composed of electronic circuits, which includes a programmable controller 71, a storage medium 72, and a microprocessor 73, the programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73, the programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robot arm 62, the storage medium 72 is a readable and writable storage medium, and is used to store the polishing record of each wafer thin plate 90, the microprocessor 73 is electrically connected to the image capture 67, The microprocessor 73 runs an image recognition program to recognize the image captured by the image capture 67, and controls the robot arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result to place or remove the wafer thin plate 90. The microprocessor 73 also associates the individual identification code of the wafer thin plate 90 with the identification mark 12 and the hole position mark 14 for placing the wafer thin plate 90 to generate the polishing record corresponding to the wafer thin plate 90.

[0008] The method for picking and placing such wafer thin plates is carried out using the wafer polishing equipment as described above, and includes the following steps: the robot arm 62 brakes the pick-and-place unit 61 to reach the space above (upper) the support table 40, and the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to position the wafer thin plate 90 to be polished, which is previously arranged on the first arrangement structure 41, based on the image captured by the image capture 67, and then controls the suction chuck module 66 to suck the wafer thin plate 90; and the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10; the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to align with the selected positioning hole 11 based on the first positioning mark 13 based on the image captured by the image capture 67; and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of the corresponding positioning hole 11 of the wafer thin plate 90; and a step of placing the wafer thin plate 90 by a pick-and-place unit, in which the wafer thin plate 90 released from the suction chuck module 66 enters the corresponding positioning hole 11, thereby operating the driving device 20 and the polishing device 30 to complete the polishing process for the wafer thin plate 90; After the polishing process is completed, the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10, and the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to align it relative to the selected polished wafer thin plate 90 based on the image captured by the image capture 67, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of the corresponding positioning hole 11 of the wafer thin plate 90, aligning the wafer thin plate by the pick and place unit; a step of transferring the wafer thin plate by a transfer device, in which the suction chuck module 66 sucks the wafer thin plate 90, and then the suction chuck module 66 is linked to lift the wafer thin plate 90 until it is separated from the wafer holder 10; then the robot arm 62 brakes the pick-and-place unit 61 to move it above the back-end table 50; the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to align it relative to the second arrangement structure 51 based on the recognition result of the image captured by the image capture 67; and the pick-and-place unit 61 releases (releases) the polished wafer thin plate 90 from the second arrangement structure 51; a step of generating the polishing record corresponding to the wafer thin plate 90 by linking the individual identification code of the wafer thin plate 90 with the identification mark 12 and the hole position mark 14 that correspond to the wafer thin plate 90 by the microprocessor 73, and storing the polishing record in the storage medium 72. [Effects of the Invention]

[0009] According to the present invention, it is possible to record the identification mark of the wafer holder on which each wafer thin plate is placed and the hole position mark corresponding to the positioning hole, and the polishing record is generated in conjunction with the individual identification code of the wafer thin plate, thereby advantageously tracking the processing history of each wafer thin plate. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view showing a partial configuration of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 2] 1 is a partial top view of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 3] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 4] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 5] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 6] 1 is a partial perspective view of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 7] 1 is a circuit block diagram of a transfer device according to a first embodiment of the present invention. [Figure 8] 1 is a flowchart of a method for picking and placing a wafer thin plate according to a first embodiment of the present invention. [Figure 9] 1 is a perspective view showing placement of a wafer thin plate on a wafer holder in wafer polishing equipment according to a first embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view showing a partial configuration of a wafer polishing facility according to a second embodiment of the present invention. [Figure 11] FIG. 10 is a partially enlarged top view of a wafer holder according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] [Example 1] As shown in FIGS. 1 to 7, the wafer polishing equipment includes a plurality of wafer holders 10, a driving device 20, a polishing device 30, a front stage 40, a rear stage 50, a transfer device 60, and a control unit 70, among which, each of the wafer holders 10 is arranged at intervals on the driving device 20, and the driving device 20 is used to drive each of the wafer holders 10 to perform a circulating operation, and each of the wafer holders 10 performs a rotating operation while performing the circulating operation, and each of the wafer holders 10 has a plurality of positioning holes 11 formed therethrough at intervals, and in this example, In this example, the positioning holes 11 are selected to be equidistantly spaced apart, and each positioning hole 11 is used to install and position a wafer thin plate 90, and the polishing device 30 is used to polish and install each wafer thin plate 90 on each wafer holder 10. Those skilled in the art of the present invention will be familiar with the driving device 20 and the polishing device 30, and the driving device 20 and the polishing device 30 are not necessarily related to the technical features of the present invention, so a detailed description of the specific configuration of the driving device 20 and the polishing device 30 will be omitted.

[0012] Each wafer holder 10 has an identification mark 12 formed thereon, which is used to distinguish and identify each wafer holder 10; each wafer holder 10 has a first positioning mark 13 formed thereon, which is used to identify the center of each positioning hole 11; in this example, each first positioning mark 13 is located at the radial center of each wafer holder 10, and each positioning hole 11 is arranged to surround the first positioning mark 13; each wafer holder 10 has a plurality of hole position marks 14 formed thereon, which are adjacent to each positioning hole 11 and are used to distinguish and identify each positioning hole 11.

[0013] The identification mark 12, the first positioning mark 13 and each of the hole position marks 14 may each be in the form of a number, a letter, a figure or a combination thereof, and different wafer holders 10 have different identification marks 12. In this example, numbers are selected as the identification marks 12, and the first positioning mark 13 and the hole position marks 14 each select holes formed through the wafer holder 10, and each of the hole position marks 14 selects holes of different diameters.

[0014] A plurality of first positioning structures 41 and a plurality of first positioning marks 42 are formed at intervals on the front stage 40 in accordance with the quantity and positional relationship of each positioning hole 11 of each wafer holder 10, and are used to place the wafer thin plate 90 waiting to be polished. Each of the first positioning marks 42 is used to distinguish and identify each of the first positioning structures 41, and a second positioning mark 43 is formed on the front stage 40, and the second positioning mark 43 is used to identify the alignment center of each of the first positioning structures 41.

[0015] The quantity and arrangement of the first arrangement structures 41 do not have to be limited to matching the quantity and arrangement of each of the positioning holes 11, and the quantity of the first arrangement structures 41 can be increased or decreased as needed. When one first arrangement structure 41 is selectively formed on the front stage 40, the first arrangement mark 42 and the second positioning mark 43 are selectively not formed on the front stage 40 accordingly, and when multiple first arrangement structures 41 are selectively formed on the front stage 40, the first arrangement mark 42 and the second positioning mark 43 are selectively formed on the front stage 40 accordingly.

[0016] A plurality of second positioning structures 51 are formed at intervals on the back-mounting table 50 in accordance with the number and positional relationship of each positioning hole 11 of each wafer holder 10, and are used to place each of the polished wafer thin plates 90 thereon. A third positioning mark 53 is formed on the back-mounting table 50, and the third positioning mark 53 is used to identify the positioning center of each of the second positioning structures 51.

[0017] The quantity and arrangement of the second arrangement structures 51 do not have to be limited to matching the quantity and arrangement of each of the positioning holes 11, and the quantity of the second arrangement structures 51 can be increased or decreased as needed. When one second arrangement structure 51 is selectively formed on the rear stage 50, the second arrangement mark 52 and the third positioning mark 53 are selectively not formed on the rear stage 50 accordingly, and when multiple second arrangement structures 51 are selectively formed on the rear stage 50, the second arrangement mark 52 and the third positioning mark 53 are selectively formed on the rear stage 50 accordingly.

[0018] The transfer device 60 is used to transfer each of the wafer thin plates 90 between the front stage 40, the wafer holder 10 and the rear stage 50, and includes a pick-and-place unit 61 and a robot arm 62, of which the pick-and-place unit 61 is installed at the working end 63 of the robot arm 62, and the robot arm 62 is used to brake the pick-and-place unit 61 to move closer to or away from a selected one of the wafer holders 10.

[0019] The pick and place unit 61 includes a mounting base 64, a lifter 65, a suction chuck module 66, and an image capturer 67. The mounting base 64 is connected to the robot arm 62, the lifter 65 is connected to the mounting base 64, and the suction chuck module 66 is connected to the lifter 65. The lifter 65 controls the lifting of each suction chuck module 66, thereby moving the suction chuck module 66 up and down to approach or move away from a selected wafer thin plate 90. The suction chuck module 66 includes three vacuum suction chucks 662 used to suck and release the wafer thin plate 90. The number of vacuum suction chucks 662 in each suction chuck module 66 can be increased or decreased as needed. Each suction chuck module 66 is limited to having at least one vacuum suction chuck 662.

[0020] The image capture device 67 is connected to the abutment seat 64 and is used to capture an image. In this example, an imaging lens having a photosensitive element (not shown in the figure) is selected as the image capture device 67. Examples of the photosensitive element include a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS).

[0021] The control unit 70 is mainly composed of electronic circuits and may be selectively installed at an appropriate location in the wafer polishing equipment. It includes a programmable controller 71, a storage medium 72, and a microprocessor 73, wherein the programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73, respectively, the programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robot arm 62, the storage medium 72 is a readable and writable storage medium used to store polishing records for each wafer thin plate 90, and the microprocessor 73 is electrically connected to the image capture device 67.

[0022] The microprocessor 73 runs an image recognition program to recognize the image captured by the image capture 67, and controls the robot arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result to place the wafer thin plate 90 waiting to be polished into the selected positioning hole 11 of the selected wafer holder 10, and to remove the polished wafer thin plate 90 from the selected positioning hole 11 of the selected wafer holder 10. The microprocessor 73 also associates the individual identification code of the wafer thin plate 90 with the first alignment mark 42, the identification mark 12, the hole position mark 14, and the second alignment mark 52 that correspond to the wafer thin plate 90, to generate the polishing record corresponding to the wafer thin plate 90.

[0023] If the front stand 40 does not have the first placement mark 42, the polishing record formed by the processing of the microprocessor 73 does not have the first placement mark 42, and if the rear stand 50 does not have the second placement mark 52, the polishing record formed by the processing of the microprocessor 73 does not have the second placement mark 52.

[0024] As shown in Figures 8 and 9, the method for picking and placing wafer thin plates performed using the above-mentioned wafer polishing equipment includes the following steps: scooping up the wafer thin plate by a pick and place unit; aligning the wafer holder by the pick and place unit; placing the wafer thin plate by the pick and place unit; aligning the wafer thin plate by the pick and place unit; transferring the wafer thin plate by a transfer device; and storing a polishing record.

[0025] In the step of picking up the wafer thin plate by the pick and place unit, the robot arm 62 brakes the pick and place unit 61 to reach the space above (upper) the stage 40, and based on the result of recognizing the image of the stage 40 captured by the image capture 67, the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to align it relative to a selected one of the multiple wafer thin plates 90 waiting to be polished that are pre-arranged on each of the first arrangement structures 41, and the microprocessor 73 records the corresponding first arrangement mark 42 of the first arrangement structure 41 on which the wafer thin plate 90 is placed, and then the control unit 70 controls each of the vacuum suction chucks 662 of the suction chuck module 66 to suck the wafer thin plate 90, and the control unit 70 records the corresponding first arrangement mark 42 of the wafer thin plate 90.

[0026] The process of calibrating the suction chuck module 66 to align it relative to the selected wafer thin plate 90 by the transfer device 60 mainly involves moving the robot arm 62 to align the center of the pick and place unit 61 with the second positioning mark 43, and then the control unit 70 controls the robot arm 62 to move based on the second positioning mark 43, thereby moving the pick and place unit 61 toward above the selected wafer thin plate 90, and the control unit 70 controls the movement direction and movement amount of the robot arm 62 based on the alignment difference between the wafer thin plate 90 and the suction chuck module 66, thereby aligning the suction chuck module 66 with the wafer thin plate 90.

[0027] When one first positioning structure 41 is selectively formed on the front stage 40 and the second positioning mark 43 and the first positioning mark 42 are not present, the control unit 70 controls the movement of the robot arm 62, thereby moving the pick and place unit 61 above the selected wafer thin plate 90, and the control unit 70 controls the movement direction and movement amount of the robot arm 62 based on the alignment difference between the wafer thin plate 90 and the suction chuck module 66, thereby aligning the suction chuck module 66 with the wafer thin plate 90.

[0028] In the step of positioning the wafer holder by the pick and place unit, the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10, and the image capture 67 captures the identification mark 12 of the wafer holder 10. The microprocessor 73 runs the image recognition program to recognize and record the wafer holder 10 on which each wafer thin plate 90 is placed, and the image capture 67 captures the image of the first positioning mark 13 of the wafer holder 10. 73 recognizes the first positioning mark 13 and calculates the axial positioning distance deviation value between the pick and place unit 61 and the selected positioning hole 11 based on the first positioning mark 13, and the control unit 70 controls the movement amount and movement direction of the robot arm 62 so that the transfer device 60 can calibrate the suction chuck module 66 to align it relative to the selected positioning hole 11, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of the corresponding positioning hole 11 of the wafer thin plate 90.

[0029] In the step of placing the wafer thin plate by the pick and place unit, the control unit 70 controls the wafer thin plate 90 released (released) from the suction chuck module 66 to enter the positioning hole 11 .

[0030] By repeating the steps of scooping up the wafer thin plate using the pick and place unit, aligning the wafer holder using the pick and place unit, and placing the wafer thin plate using the pick and place unit, a large number of wafer thin plates 90 waiting to be polished can be placed sequentially in each of the positioning holes 11 of each wafer holder 10, thereby operating the drive unit 20 and the polishing device 30 and completing the polishing process for each wafer thin plate 90.

[0031] In the step of positioning the wafer thin plate by the pick and place unit, after the polishing process is completed, the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10, and the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to position it relative to the selected polished wafer thin plate 90 based on the recognition result of the image of the wafer holder 10 captured by the image capture 67, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of the corresponding positioning hole 11 of the wafer thin plate 90.

[0032] In the step of transferring the wafer thin plate by the transfer device, the suction chuck module 66 sucks the wafer thin plate 90, and then the suction chuck module 66 is linked to lift the wafer thin plate 90 until it is separated from the wafer holder 10. Then, the robot arm 62 brakes the pick and place unit 61 to move it above the back-end table 50. Based on the result of recognizing the image captured by the image capture 67, the control unit 70 controls the transfer device 60 to calibrate the suction chuck module 66 to align it relative to the second placement structure 51, and the pick and place unit 61 releases (releases) the polished wafer thin plate 90 from the second placement structure 51 of the back-end table 50. The control unit 70 also records the corresponding second placement mark 52 of the second placement structure 51 on which the wafer thin plate 90 is placed.

[0033] The process of calibrating the suction chuck module 66 to align it relative to the second arrangement structure 51 by the transfer device 60 mainly involves moving the robot arm 62 to align the center of the pick and place unit 61 with the third positioning mark 53, and then the control unit 70 controls the robot arm 62 to move based on the third positioning mark 53, thereby moving the pick and place unit 61 toward above the selected second arrangement structure 51, and the control unit 70 controls the movement direction and movement amount of the robot arm 62 based on the alignment difference between the second arrangement structure 51 and the suction chuck module 66, thereby aligning the suction chuck module 66 with the second arrangement structure 51.

[0034] In the step of storing the polishing record, the microprocessor 73 links the individual identification code of the wafer thin plate 90 with the first alignment mark 42, the identification mark 12, the hole position mark 14, and the second alignment mark 52 that correspond to the wafer thin plate 90 to generate the polishing record corresponding to the wafer thin plate 90, and stores the polishing record in the storage medium 72.

[0035] If the front stand 40 does not have the first placement mark 42, the polishing record formed by the processing of the microprocessor 73 does not have the first placement mark 42, and if the rear stand 50 does not have the second placement mark 52, the polishing record formed by the processing of the microprocessor 73 does not have the second placement mark 52.

[0036] During the process of placing the wafer thin plate 90 on the selected wafer holder 10 and removing the wafer thin plate 90 from the wafer holder 10, the transfer device 60 can recognize the first positioning structure 41, the wafer holder 10, the positioning holes 11, and the second positioning structure 51 on which each wafer thin plate 90 is placed, and records the first positioning mark 42 of the first positioning structure 41 on which each wafer thin plate 90 is placed, the identification mark 12 corresponding to the wafer holder 10, the hole position mark 14 corresponding to the positioning holes 11, and the second positioning mark 52 corresponding to the second positioning structure 51.The transfer device 60 also stores the polishing record generated in association with the individual identification code of each wafer thin plate 90 in a storage medium 72, thereby advantageously tracking the processing history of each wafer thin plate 90.

[0037] The vacuum chuck module 66 further includes a positioning stand 664 , and each of the vacuum chucks 662 is mounted on the positioning stand 664 , and the lifter 65 is connected to the positioning stand 664 .

[0038] [Example 2] As shown in FIG. 10, the second embodiment differs from the first embodiment mainly in that the shape of the robot arm 62 is different.

[0039] [Example 3] As shown in FIG. 11, the configuration of Example 3 is mainly different from that of Example 1 in that the hole position marks 14 are holes with different shapes. [Explanation of symbols]

[0040] 10: Wafer holder 11: Positioning hole 12: Identification mark 13: First positioning mark 14: Hole position mark 20: Drive unit 30: Polishing equipment 40: Front stand 41:First arrangement structure 42: First placement mark 43: Second positioning mark 50: Rear stand 51:Second arrangement structure 52: Second placement mark 53: Third positioning mark 60:Transfer device 61: Pick and place unit 62: Robot arm 63: Working end 64:Abutting seat 65: Lifter 66: Vacuum chuck module 662: Vacuum suction chuck 664: Positioning stand 67: Image capture 70: Control unit 71: Programmable controller 72:Storage medium 73: Microprocessor 90: Wafer thin plate

Claims

1. A wafer polishing facility comprising a plurality of wafer holders (10), a driving device (20), a polishing device (30), a front table (40), a rear table (50), a transfer device (60), and a control unit (70), Each of the wafer holders (10) arranged at intervals on the driving device (20) has a plurality of positioning holes (11) formed therethrough at intervals, the positioning holes being used to install and position the wafer thin plates (90), and the polishing device (30) is used to polish each of the wafer thin plates (90); Each wafer holder (10) is formed with an identification mark (12) used to distinguish and recognize each wafer holder (10), a first positioning mark (13) used to recognize the placement center of each positioning hole (11), and a plurality of hole position marks (14) are formed adjacent to each positioning hole (11), and each hole position mark (14) is used to distinguish and recognize each positioning hole (11), The front stage (40) is formed with at least one first arrangement structure (41) for placing the wafer thin plate (90) waiting to be polished; The rear stage (50) is formed with at least one second arrangement structure (51) for placing the wafer thin plate (90) after polishing is completed; The transfer device (60) includes a robot arm (62) and a pick-and-place unit (61) installed at a working end (63) of the robot arm (62); The pick-and-place unit (61) includes a seat (64) connected to the robot arm (62), a lifter (65) connected to the seat (64), a suction chuck module (66) connected to the lifter (65), and an image capture (67), whereby the lifter (65) brakes the suction chuck module (66) to raise and lower, thereby approaching or moving away from one selected wafer thin plate (90), the suction chuck module (66) includes at least one vacuum suction chuck (662) used to suck and release the wafer thin plate (90), and the image capture (67) is connected to the seat (64) and used to capture an image. The control unit (70) is mainly composed of electronic circuits, including a programmable controller (71), a storage medium (72), and a microprocessor (73), the programmable controller (71) and the storage medium (72) are electrically connected to the microprocessor (73), the programmable controller (71) is electrically connected to the pick-and-place unit (61) and the robot arm (62), the storage medium (72) is a readable and writable storage medium, and is used to store polishing records of each of the wafer thin plates (90), and the microprocessor (73) is electrically connected to an image capture (67); The microprocessor (73) runs an image recognition program to recognize the image captured by the image capture (67), and controls the robot arm (62) and the pick-and-place unit (61) through the programmable controller (71) based on the recognition result to place or remove the wafer thin plate (90). The microprocessor (73) also associates the individual identification code of the wafer thin plate (90) with the identification mark (12) and the hole position mark (14) for placing the wafer thin plate (90) to generate the polishing record corresponding to the wafer thin plate (90).

2. A plurality of the first arrangement structures (41) and a plurality of first arrangement marks (42) are formed at intervals on the front stage (40) in accordance with the number and arrangement relationship of the positioning holes (11) of each of the wafer holders (10), and each of the first arrangement marks (42) is used to distinguish and recognize each of the first arrangement structures (41), and a second positioning mark (43) is formed on the front stage (40) and is used to recognize the arrangement center of each of the first arrangement structures (41), 2. The wafer polishing equipment according to claim 1, wherein the microprocessor (73) associates the individual identification code of each wafer thin plate (90) with the first alignment mark (42), the identification mark (12), and the hole position mark (14) that correspond to each wafer thin plate (90), thereby generating a plurality of polishing records each corresponding to each wafer thin plate (90).

3. 2. The wafer polishing equipment according to claim 1, wherein a plurality of the second positioning structures (51) are formed at intervals on the rear stage (50) in accordance with the quantity and positional relationship of each of the positioning holes (11) of each of the wafer holders (10), and a third positioning mark (53) used to identify the positioning center of each of the second positioning structures (51) is formed on the rear stage (50).

4. A plurality of second arrangement marks (52) are formed on the rear table (50) to be used for distinguishing and recognizing each of the second arrangement structures (51), 4. The wafer polishing equipment according to claim 3, wherein the microprocessor (73) associates the individual identification code of each wafer thin plate (90) with the identification mark (12), the hole position mark (14), and the second placement mark (52) that correspond to each wafer thin plate (90), thereby generating a plurality of polishing records each corresponding to each wafer thin plate (90).

5. 10. A method for picking and placing wafer thin plates using a wafer polishing installation as claimed in claim 1, comprising: a step of the robot arm (62) braking the pick-and-place unit (61) to reach the space above the front stage (40), and the control unit (70) controlling the transfer device (60) to calibrate the suction chuck module (66) to position the wafer thin plate (90) waiting for polishing, which is pre-arranged on the first arrangement structure (41) based on the recognition result of the image captured by the image capture (67), and then controlling the suction chuck module (66) to suck the wafer thin plate (90), thereby picking up the wafer thin plate by the pick-and-place unit; a step of positioning the wafer holder by the pick and place unit, in which the robot arm (62) brakes the pick and place unit (61) to move to a space above the selected wafer holder (10); the control unit (70) controls the transfer device (60) to calibrate the suction chuck module (66) to position the wafer holder relative to the selected positioning hole (11) using the first positioning mark (13) as a reference based on the image captured by the image capture (67); and the control unit (70) records the identification mark (12) of the wafer holder (10) and the hole position mark (14) of the corresponding positioning hole (11) of the wafer thin plate (90); a step of placing the wafer thin plate (90) by a pick-and-place unit, in which the wafer thin plate (90) released from the suction chuck module (66) enters the corresponding positioning hole (11), thereby operating the driving device (20) and the polishing device (30), thereby completing the polishing process for the wafer thin plate (90); After the polishing process is completed, the robot arm (62) brakes the pick-and-place unit (61) to move to the space above the selected wafer holder (10), and the control unit (70) controls the transfer device (60) to calibrate the suction chuck module (66) to align it relative to the selected polished wafer thin plate (90) based on the image captured by the image capturer (67), and the control unit (70) records the identification mark (12) of the wafer holder (10) and the hole position mark (14) of the corresponding positioning hole (11) of the wafer thin plate (90), thereby aligning the wafer thin plate by the pick-and-place unit; a step of transferring the wafer thin plate by a transfer device, in which the suction chuck module (66) sucks the wafer thin plate (90), and then the suction chuck module (66) is engaged to lift the wafer thin plate (90) until it is separated from the wafer holder (10), and then the robot arm (62) brakes the pick-and-place unit (61) to move it above the back-end table (50), the control unit (70) controls the transfer device (60) to calibrate the suction chuck module (66) to align it relative to the second arrangement structure (51) based on the result of recognizing the image captured by the image capture (67), and the pick-and-place unit (61) releases the polished wafer thin plate (90) from the second arrangement structure (51); a step of generating the polishing record corresponding to the wafer thin plate (90) by linking the individual identification code of the wafer thin plate (90) with the identification mark (12) and the hole position mark (14) that correspond to the wafer thin plate (90) by the microprocessor (73), and storing the polishing record in the storage medium (72).

Images