Wafer polishing equipment and method for picking and placing a large number of thin wafers

Abstract

To provide a wafer grinding apparatus and a method for picking and placing multiple wafer thin plates.SOLUTION: The present invention discloses a wafer grinding apparatus and a method for picking and placing multiple wafer thin plates. The wafer griding apparatus includes a plurality of wafer holders, a driving device, a grinding device, a front table, a rear table, a transferring device and a control unit. In each wafer holder, a plurality of positioning holes used for positioning the wafer thin plates are respectively formed at intervals so as to penetrate through the wafer folder. In each wafer holder, there are formed an identification mark that is used for distinguishing and identifying each wafer holder, a first positioning mark that is used for identifying the configuration center of each positioning hole and a hole position mark that is used for identifying each positioning hole. The present invention enables the transfer of multiple wafer thin plates at once, and also enables generation of a grinding record beneficial to tracking the processing history of the wafer thin plates by the identification marks and the hole position marks bindable corresponding to the wafer thin plates.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an equipment assembly used in a wafer polishing process, and more particularly to a wafer polishing equipment and a method for picking and placing a large number of wafers. [Background technology]

[0002] The wafer polishing equipment comprises a plurality of wafer holders, a driving device, a polishing device, and a transfer device, of which the driving device drives each of the wafer holders to operate in a circular motion, and each of the wafer holders has a plurality of positioning holes formed therethrough through which a large number of wafer thin plates are placed, the polishing device performs polishing processing on each of the wafer thin plates, and the transfer device transfers each of the wafer thin plates to each of the positioning holes and, after the polishing process is completed, transfers each of the wafer thin plates and removes them from the wafer holder.

[0003] The transfer device includes a pick-and-place unit, a processing unit, and a robot arm, which sequentially places a number of wafer thin plates into the different positioning holes.

[0004] After the polishing process is completed, the transfer device sequentially transfers and removes the multiple wafer thin plates that have been polished. Summary of the Invention [Problem to be solved by the invention]

[0005] In the transfer device, a large number of the thin wafer plates are sequentially transferred to the wafer holders, so there is room for improvement in overall efficiency.

[0006] There is a lack of records of the processing history for each wafer thin plate; in other words, there is a lack of records of the polishing process for the wafer thin plate. Not only must the length of time required to polish the wafer thin plate be recorded, but the wafer holder and the positioning hole where the wafer thin plate is positioned must also be recorded. The transfer device cannot recognize the wafer holder and the positioning hole where each wafer thin plate is transferred and positioned, which is disadvantageous in tracking the processing history of each wafer thin plate. [Means for solving the problem]

[0007] SUMMARY OF THE INVENTION The main object of the present invention is to provide a wafer polishing equipment and a method for picking and placing a large number of thin wafers.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions: A wafer polishing facility including a plurality of wafer holders (10), a driving device (20), a polishing device (30), a front stage (40), a rear stage (50), a transfer device (60), and a control unit (70), Each of the wafer holders 10 arranged at intervals on the driving device 20 has a plurality of positioning holes 11 formed therethrough at intervals, which are used to install and position each of the wafer thin plates 90, and the polishing device 30 is used to polish each of the wafer thin plates 90, Each wafer holder 10 is formed with an identification mark 12 used to distinguish and identify each wafer holder 10, a first positioning mark 13 used to recognize the center of each positioning hole 11, and a plurality of hole position marks 14 are formed adjacent to each positioning hole 11, and each hole position mark 14 is used to distinguish and identify each positioning hole 11, A plurality of first positioning structures 41 and a plurality of first positioning marks 42 are formed at intervals on the front stage 40 in accordance with the number and arrangement of the positioning holes 11 of each of the wafer holders 10, and are used to place the wafer thin plates 90 waiting to be polished. Each of the first positioning marks 42 is used to distinguish and identify each of the first positioning structures 41. A second positioning mark 43 is formed on the front stage 40 and is used to identify the center of placement of each of the first positioning structures 41. A plurality of second positioning structures 51 are formed at intervals on the back-mounting table 50 in accordance with the number and arrangement of the positioning holes 11 of each of the wafer holders 10, and are used to place the polished wafer thin plates 90 thereon. A third positioning mark 53 is formed on the back-mounting table 50, and is used to identify the center of placement of each of the second positioning structures 51. The transfer device 60 includes a robot arm 62 and a pick-and-place unit 61 installed at a working end 63 of the robot arm 62. The pick-and-place unit 61 includes an adjustment module 64, a plurality of lifters 65, a plurality of suction chuck modules 66, and an image capturer 67. The adjustment module 64 is connected to the robot arm 62 and has a mounting seat 642 that is driven and rotated. Each of the lifters 65 is spaced apart from each other on the radial outer periphery of the mounting seat 642 so as to surround the rotation center of the mounting seat 642. The lifters 65 are connected to the suction chuck modules 66, respectively, so that the lifters 65 brake the suction chuck modules 66 to raise and lower, respectively, so that the lifters 65 approach and move away from the wafer thin plates 90, respectively, and the suction chuck modules 66 include at least one vacuum suction chuck 662 used to suck and release the wafer thin plates 90, respectively. The image capture 67 is connected to the adjustment module 64 and used to capture images. The control unit 70 is mainly composed of electronic circuits, which includes a programmable controller 71, a storage medium 72, and a microprocessor 73, the programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73, the programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robot arm 62, the storage medium 72 is a readable and writable storage medium, and is used to store the polishing record of each wafer thin plate 90, the microprocessor 73 is electrically connected to the image capture 67, The microprocessor 73 runs an image recognition program to recognize the image captured by the image capture 67, and controls the robot arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result, thereby placing or removing a large number of the wafer thin plates 90 at a time; The microprocessor 73 also associates the individual identification code of each wafer thin plate 90 with the first alignment mark 42, the identification mark 12, and the hole position mark 14 that correspond to each wafer thin plate 90, thereby generating a plurality of polishing records each corresponding to each wafer thin plate 90.

[0009] Such a method for picking and placing multiple wafer sheets is carried out using the wafer polishing equipment as described above, and includes the following steps: the robot arm 62 brakes the pick-and-place unit 61 to reach the space above the front stage 40; the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to position the wafer thin plates 90 to be polished relative to each of the first arrangement structures 41 based on the image captured by the image capture 67; then, each of the suction chuck modules 66 sucks each of the wafer thin plates 90, and the control unit 70 records the corresponding first arrangement mark 42 of each of the wafer thin plates 90; and the pick-and-place unit picks up the wafer thin plates. the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10; the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to align them relative to each of the positioning holes 11 based on the image captured by the image capture 67; and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of each of the corresponding positioning holes 11 of each of the wafer thin plates 90; and a step of placing the wafer thin plates by a pick and place unit, in which the wafer thin plates 90 released from the suction chuck modules 66 enter the positioning holes 11, thereby placing one wafer thin plate 90 in each positioning hole 11 of one wafer holder 10, and then operating the driving device 20 and the polishing device 30 to complete the polishing process for each wafer thin plate 90; After the polishing process is completed, the robot arm 62 brakes the pick and place unit 61 to move to the space above the selected wafer holder 10, and the control unit 70 controls the transfer device 60 to calibrate each suction chuck module 66 to position the polished wafer thin plate 90 disposed on each wafer holder 10 based on the image captured by the image capture 67, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of the corresponding positioning hole 11 of each wafer thin plate 90, thereby aligning the wafer thin plate by the pick and place unit; a step of transferring the wafer thin plates by a transfer device, in which each of the suction chuck modules 66 sucks each of the wafer thin plates 90, and then each of the suction chuck modules 66 is linked to lift each of the wafer thin plates 90 until it is separated from the wafer holder 10; thereafter, the robot arm 62 brakes the pick-and-place unit 61 to move it above the backstage 50; the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to position them relative to each of the second arrangement structures 51 based on the recognition result of the image captured by the image capture 67; and the pick-and-place unit 61 releases each of the polished wafer thin plates 90 to each of the second arrangement structures 51 of the backstage 50; a step of storing the polishing records, wherein the microprocessor 73 associates the individual identification code of each wafer thin plate 90 with the first alignment mark 42, the identification mark 12, and the hole position mark 14 that correspond to each wafer thin plate 90, and stores each polishing record in the storage medium 72. [Effects of the Invention]

[0010] According to the present invention, it is possible to transfer a large number of wafer thin plates to the selected wafer holder at one time, and after the polishing process is completed, it is possible to remove a large number of wafer thin plates from the wafer holder at one time, thereby improving the overall efficiency of performing the polishing process.In addition, according to the present invention, it is possible to record the first placement mark of the first placement structure on which each wafer thin plate is placed, the identification mark corresponding to the wafer holder, and the hole position mark corresponding to the positioning hole, and to generate the polishing record in conjunction with the individual identification code of each wafer thin plate, thereby advantageously tracking the processing history of each wafer thin plate. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a partial configuration of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 2] 1 is a partial top view of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 3] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 4] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 5] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 6] 1 is a partial perspective view of a wafer polishing equipment according to a first embodiment of the present invention. [Figure 7] FIG. 1 is a cross-sectional view of a pick-and-place unit according to a first embodiment of the present invention. [Figure 8] 1 is a circuit block diagram of a transfer device according to a first embodiment of the present invention. [Figure 9] 1 is a flowchart of a method for picking and placing multiple wafer thin plates according to a first embodiment of the present invention. [Figure 10] 1 is a perspective view showing placement of a wafer thin plate on a wafer holder in wafer polishing equipment according to a first embodiment of the present invention. [Figure 11] 1 is a top view showing a state in which alignment between a wafer thin plate and a positioning hole is adjusted in the wafer polishing equipment according to the first embodiment of the present invention. [Figure 12]FIG. 10 is a perspective view showing a partial configuration of a wafer polishing facility according to a second embodiment of the present invention. [Figure 13] FIG. 10 is a partially enlarged top view of a wafer holder according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] [Example 1] As shown in FIGS. 1 to 8, the wafer polishing equipment includes a plurality of wafer holders 10, a driving device 20, a polishing device 30, a front stage 40, a rear stage 50, a transfer device 60, and a control unit 70, among which, each of the wafer holders 10 is disposed at intervals on the driving device 20, and the driving device 20 is used to drive each of the wafer holders 10 to perform a circulating operation, and each of the wafer holders 10 performs a rotating operation while performing the circulating operation, and each of the wafer holders 10 has a plurality of positioning holes 11 formed therethrough at intervals, and in this example, In this example, the positioning holes 11 are selected to be equidistantly spaced apart, and each positioning hole 11 is used to install and position a wafer thin plate 90, and the polishing device 30 is used to polish and install each wafer thin plate 90 on each wafer holder 10. Those skilled in the art of the present invention will be familiar with the driving device 20 and the polishing device 30, and the driving device 20 and the polishing device 30 are not necessarily related to the technical features of the present invention, so a detailed description of the specific configuration of the driving device 20 and the polishing device 30 will be omitted.

[0013] Each wafer holder 10 has an identification mark 12 formed thereon, which is used to distinguish and identify each wafer holder 10; each wafer holder 10 has a first positioning mark 13 formed thereon, which is used to identify the center of each positioning hole 11; in this example, each first positioning mark 13 is located at the radial center of each wafer holder 10, and each positioning hole 11 is arranged to surround the first positioning mark 13; each wafer holder 10 has a plurality of hole position marks 14 formed thereon, which are adjacent to each positioning hole 11 and are used to distinguish and identify each positioning hole 11.

[0014] The identification mark 12, the first positioning mark 13 and each of the hole position marks 14 may each be in the form of a number, a letter, a figure or a combination thereof, and different wafer holders 10 have different identification marks 12. In this example, numbers are selected as the identification marks 12, and the first positioning mark 13 and the hole position marks 14 each select holes formed through the wafer holder 10, and each of the hole position marks 14 selects holes of different diameters.

[0015] A plurality of first positioning structures 41 and a plurality of first positioning marks 42 are formed at intervals on the front stage 40 in accordance with the quantity and positional relationship of each positioning hole 11 of each wafer holder 10, and are used to place the wafer thin plate 90 waiting to be polished. Each of the first positioning marks 42 is used to distinguish and identify each of the first positioning structures 41, and a second positioning mark 43 is formed on the front stage 40, and the second positioning mark 43 is used to identify the alignment center of each of the first positioning structures 41.

[0016] A plurality of second positioning structures 51 are formed at intervals on the back-mounting table 50 in accordance with the number and positional relationship of each positioning hole 11 of each wafer holder 10, and are used to place each of the polished wafer thin plates 90 thereon. A third positioning mark 53 is formed on the back-mounting table 50, and the third positioning mark 53 is used to identify the positioning center of each of the second positioning structures 51.

[0017] The transfer device 60 is used to transfer each of the wafer thin plates 90 between the front stage 40, the wafer holder 10 and the rear stage 50, and includes a pick-and-place unit 61 and a robot arm 62, of which the pick-and-place unit 61 is installed at the working end 63 of the robot arm 62, and the robot arm 62 is used to brake the pick-and-place unit 61 to move closer to or away from a selected one of the wafer holders 10.

[0018] The pick and place unit 61 includes an adjustment module 64, a plurality of lifters 65, a plurality of suction chuck modules 66, and an image capturer 67. The adjustment module 64 is connected to the robot arm 62 and has a mounting seat 642 that is driven and rotated. The lifters 65 are spaced apart from one another on the radial outer periphery of the mounting seat 642 so as to surround the rotation center of the mounting seat 642. Each lifter 65 is connected to each of the suction chuck modules 66, so that each lifter 65 Each of the suction chuck modules 66 can be raised and lowered by braking, thereby approaching or moving away from each of the wafer thin plates 90, and each of the suction chuck modules 66 includes three vacuum suction chucks 662 used to suck and release (release) the wafer thin plates 90, and the number of the vacuum suction chucks 662 in each of the suction chuck modules 66 can be increased or decreased as needed, with the limitation being that each of the suction chuck modules 66 has one vacuum suction chuck 662.

[0019] The image capture 67 is connected to the adjustment module 64 and is used to capture images of the wafer holder 10, the front stage 40, and the rear stage 50. In this example, an imaging lens having a photosensitive element (not shown in the figure) is selected as the image capture 67. Examples of the photosensitive element include a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS).

[0020] The control unit 70 is mainly composed of electronic circuits and may be selectively installed at an appropriate location in the wafer polishing equipment. It includes a programmable controller 71, a storage medium 72, and a microprocessor 73, wherein the programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73, respectively, the programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robot arm 62, the storage medium 72 is a readable and writable storage medium used to store polishing records for each wafer thin plate 90, and the microprocessor 73 is electrically connected to the image capture device 67.

[0021] The microprocessor 73 runs an image recognition program to recognize the image captured by the image capture 67, and controls the robot arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result to place a number of wafer thin plates 90 waiting to be polished onto the selected wafer holder 10 at one time, and remove a number of polished wafer thin plates 90 from the selected wafer holder 10 at one time. The microprocessor 73 also associates the individual identification code of each wafer thin plate 90 with the first alignment mark 42, the identification mark 12, and the hole position mark 14 that correspond to each wafer thin plate 90, to generate a number of polishing records corresponding to each wafer thin plate 90.

[0022] As shown in Figures 9 to 11, the method for picking and placing a large number of wafer thin plates performed using the above-mentioned wafer polishing equipment includes the following steps: a step of scooping up the wafer thin plates by a pick and place unit; a step of aligning the wafer holder by the pick and place unit; a step of placing the wafer thin plates by the pick and place unit; a step of aligning the wafer thin plates by the pick and place unit; a step of transferring the wafer thin plates by a transfer device; and a step of storing a polishing record.

[0023] In the step of picking up the wafer thin plate by the pick and place unit, the robot arm 62 brakes the pick and place unit 61 to reach the space above (upper) the stage 40, and based on the result of recognizing the image of the stage 40 captured by the image capture 67, the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to respectively align them relative to the multiple wafer thin plates 90 to be polished that are pre-arranged on each of the first arrangement structures 41, and records the corresponding first arrangement marks 42 of each of the wafer thin plates 90 by the microprocessor 73, and then the control unit 70 controls each of the vacuum suction chuck modules 662 of each of the suction chuck modules 66 to suck each of the corresponding wafer thin plates 90, and the control unit 70 records the corresponding first arrangement marks 42 of each of the wafer thin plates 90.

[0024] The process of calibrating each of the suction chuck modules 66 to align them relative to each of the wafer thin plates 90 by the transfer device 60 mainly involves moving the transfer device 60 to align the center of the pick and place unit 61 with the second positioning mark 43, and then the control unit 70 controls the adjustment module 64 based on the alignment difference between each of the wafer thin plates 90 and each of the suction chuck modules 66 to make the mounting seat 642 rotatable or non-rotatable, thereby aligning each of the suction chuck modules 66 with each of the wafer thin plates 90.

[0025] In the step of positioning the wafer holder by the pick and place unit, the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10, and the image capture 67 captures the identification mark 12 of the wafer holder 10. The microprocessor 73 runs the image recognition program to recognize and record the wafer holder 10 on which each wafer thin plate 90 is placed, and the image capture 67 captures the wafer holder 10. The microprocessor 73 recognizes the first positioning mark 13 and calculates a distance deviation value of the axial positioning between the pick and place unit 61 and the first positioning mark 13. Then, the control unit 70 controls the robot arm 62 to be operable or inoperable to compensate for the distance deviation value. The pick and place unit 61 and the first positioning mark 13 are aligned vertically, and the image capture 67 captures the wafer holder. The microprocessor 73 recognizes the image and calculates the angular deviation value between the positioning holes 11 and the suction chuck modules 66 based on the angle centered on the first positioning mark 13. Then, the control unit 70 controls the adjustment module 64 to make the mounting seat 642 rotatable or non-rotatable, thereby compensating for the angular deviation value, and adjusts the suction chuck modules 66 to the respective positions. The positioning holes 11 are formed to be aligned vertically, so that the control unit 70 can control the transfer device 60 to calibrate each of the suction chuck modules 66 to be aligned relative to each of the positioning holes 11 based on the result of recognizing the image of the wafer holder 10 captured by the image capture 67, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of each of the corresponding positioning holes 11 of each of the wafer thin plates 90.

[0026] In the step of placing the wafer thin plate by the pick and place unit, the control unit 70 controls each of the wafer thin plates 90 released from each of the suction chuck modules 66 to enter each of the positioning holes 11, thereby placing one wafer thin plate 90 in each of the positioning holes 11 for each of the wafer holders 10, and by operating the driving device 20 and the polishing device 30, the polishing process for each of the wafer thin plates 90 can be completed.

[0027] By repeating the steps of scooping up the wafer thin plate using the pick and place unit, aligning the wafer holder using the pick and place unit, and placing the wafer thin plate using the pick and place unit, the wafer thin plate 90 waiting to be polished can be placed in each of the positioning holes 11 of each of the wafer holders 10 by adopting a method of placing multiple wafer thin plates 90 at once, which allows the drive unit 20 and the polishing device 30 to be operated, thereby completing the polishing process for each of the wafer thin plates 90.

[0028] In the step of positioning the wafer thin plate by the pick and place unit, after the polishing process is completed, the robot arm 62 brakes the pick and place unit 61 to move to the space above (upper) the selected wafer holder 10, and based on the result of recognizing the image of the wafer holder 10 captured by the image capture 67, the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to position relative to each of the polished wafer thin plates 90 placed on each of the wafer holders 10, and the control unit 70 records the identification mark 12 of the wafer holder 10 and the hole position mark 14 of each of the corresponding positioning holes 11 of each of the wafer thin plates 90.

[0029] In the step of transferring the wafer thin plate by the transfer device, each of the suction chuck modules 66 sucks each of the wafer thin plate 90, and then each of the suction chuck modules 66 is linked to lift each of the wafer thin plate 90 until it is separated from the wafer holder 10, and then the robot arm 62 brakes the pick and place unit 61 to move it above the back-end table 50, and based on the result of recognizing the image captured by the image capture 67, the control unit 70 controls the transfer device 60 to calibrate each of the suction chuck modules 66 to align it relative to each of the second arrangement structures 51, and the pick and place unit 61 releases each of the wafer thin plate 90 that has been polished to each of the second arrangement structures 51 of the back-end table 50.

[0030] In the step of storing the polishing records, the microprocessor 73 links the individual identification code of each wafer thin plate 90 with the first alignment mark 42, the identification mark 12, and the hole position mark 14 that correspond to each wafer thin plate 90 to generate a number of polishing records corresponding to each wafer thin plate 90, and stores each polishing record in the storage medium 72.

[0031] The transfer device 60 can transfer and place a large number of the wafer thin plates 90 placed on the front stage 40 onto the selected wafer holder 10 at one time, and after the polishing process of the polishing device 30 is completed, the transfer device 60 can remove a large number of the wafer thin plates 90 from the wafer holder 10 at one time and transfer and place them on the back stage 50, thereby reducing the time spent on placing and removing the wafer thin plates 90 and improving the overall efficiency of carrying out the polishing process of the wafer polishing equipment.

[0032] During the process of placing each wafer thin plate 90 on the selected wafer holder 10 and removing each wafer thin plate 90 from the wafer holder 10, the transfer device 60 can recognize the first arrangement structure 41, the wafer holder 10, and the positioning hole 11 in which each wafer thin plate 90 is placed, and records the first arrangement mark 42 of the first arrangement structure 41 in which each wafer thin plate 90 is placed, the identification mark 12 corresponding to the wafer holder 10, and the hole position mark 14 corresponding to the positioning hole 11.The transfer device 60 also stores the polishing record generated in conjunction with the individual identification code of each wafer thin plate 90 in a storage medium 72, thereby advantageously tracking the processing history of each wafer thin plate 90.

[0033] In addition, a plurality of second alignment marks 52 are formed on the rear stage 50, and each of the second alignment marks 52 is used to distinguish and recognize each of the second alignment structures 51.

[0034] In the step of transferring wafer thin plates by the pick and place unit, the control unit 70 records the second alignment marks 52 of the second alignment structures 51 corresponding to each of the wafer thin plates 90, and the microprocessor 73 further associates the second alignment marks 52 used to identify the second alignment structures 51 on which each of the wafer thin plates 90 is placed, thereby generating the polishing records corresponding to each of the wafer thin plates 90.

[0035] Each of the suction chuck modules 66 further includes a positioning stand 664, each of the vacuum suction chucks 662 is mounted on the positioning stand 664, and each of the lifters 65 is mainly composed of a pneumatic cylinder 652, and the piston rod 654 of each of the pneumatic cylinders 652 reciprocates axially along the up and down direction. Each of the piston rods 654 is connected to the corresponding positioning stand 664, thereby allowing each of the suction chuck modules 66 to move up and down.

[0036] [Example 2] As shown in FIG. 12, the second embodiment differs from the first embodiment mainly in that the shape of the robot arm 62 is different.

[0037] [Example 3] As shown in FIG. 13, the third embodiment differs from the first embodiment mainly in that the hole position marks 14 are holes with different shapes. [Explanation of symbols]

[0038] 10: Wafer holder 11: Positioning hole 12: Identification mark 13: First positioning mark 14: Hole position mark 20: Drive unit 30: Polishing equipment 40: Front stand 41:First arrangement structure 42: First placement mark 43: Second positioning mark 50: Rear stand 51:Second arrangement structure 52: Second placement mark 53: Third positioning mark 60:Transfer device 61: Pick and place unit 62: Robot arm 63: Working end 64: Regulatory module 642: Mounting seat 65: Lifter 652: Pneumatic cylinder 654: Piston rod 66: Vacuum chuck module 662: Vacuum suction chuck 664: Positioning stand 67: Image capture 70: Control unit 71: Programmable controller 72:Storage medium 73: Microprocessor 90: Wafer thin plate

Claims

1. A wafer polishing facility comprising a plurality of wafer holders (10), a driving device (20), a polishing device (30), a front table (40), a rear table (50), a transfer device (60), and a control unit (70), Each of the wafer holders (10) arranged at intervals on the driving device (20) has a plurality of positioning holes (11) formed therethrough at intervals, the positioning holes being used to install and position the wafer thin plates (90), and the polishing device (30) is used to polish each of the wafer thin plates (90); Each wafer holder (10) is formed with an identification mark (12) used to distinguish and recognize each wafer holder (10), a first positioning mark (13) used to recognize the placement center of each positioning hole (11), and a plurality of hole position marks (14) are formed adjacent to each positioning hole (11), and each hole position mark (14) is used to distinguish and recognize each positioning hole (11), A plurality of first positioning structures (41) and a plurality of first positioning marks (42) are formed at intervals on the front stage (40) in accordance with the number and positional relationship of the positioning holes (11) of each of the wafer holders (10), and are used to place the wafer thin plates (90) waiting to be polished, and each of the first positioning marks (42) is used to distinguish and recognize each of the first positioning structures (41), and a second positioning mark (43) is formed on the front stage (40), and is used to recognize the center of placement of each of the first positioning structures (41), A plurality of second positioning structures (51) are formed at intervals on the back-mounting table (50) in accordance with the number and positional relationship of the positioning holes (11) of each of the wafer holders (10), and are used to place the wafer thin plates (90) that have been polished. Third positioning marks (53) are formed on the back-mounting table (50), and are used to identify the centers of the second positioning structures (51). The transfer device (60) includes a robot arm (62) and a pick-and-place unit (61) installed at the working end (63) of the robot arm (62). The pick-and-place unit (61) includes an adjustment module (64), a plurality of lifters (65), a plurality of suction chuck modules (66), and an image capture (67). The adjustment module (64) is connected to the robot arm (62) and has a mounting seat (642) for receiving driving rotation. Each of the lifters (65) is sized to surround the center of rotation of the mounting seat (642) within the diameter of the mounting seat (642). The lifters (65) are arranged at intervals around the circumference in the direction of the wafer thin plate (90), and each lifter (65) is connected to each suction chuck module (66), so that each lifter (65) brakes each suction chuck module (66) to raise and lower, thereby approaching and moving away from each wafer thin plate (90), each suction chuck module (66) includes at least one vacuum suction chuck (662) used to suck and release each wafer thin plate (90), and the image capture (67) is connected to the adjustment module (64) and used to capture an image, The control unit (70) is mainly composed of electronic circuits, including a programmable controller (71), a storage medium (72), and a microprocessor (73), the programmable controller (71) and the storage medium (72) are electrically connected to the microprocessor (73), the programmable controller (71) is electrically connected to the pick-and-place unit (61) and the robot arm (62), the storage medium (72) is a readable and writable storage medium, and is used to store polishing records of each of the wafer thin plates (90), and the microprocessor (73) is electrically connected to an image capture (67); The microprocessor (73) runs an image recognition program to recognize the image captured by the image capture (67), and controls the robot arm (62) and the pick-and-place unit (61) through the programmable controller (71) based on the recognition result, thereby placing or removing a large number of the wafer thin plates (90) at once; The microprocessor (73) also associates the individual identification code of each wafer thin plate (90) with the first alignment mark (42), the identification mark (12) and the hole position mark (14) that correspond to each wafer thin plate (90), thereby generating a plurality of polishing records each corresponding to each wafer thin plate (90).

2. A plurality of second arrangement marks (52) are formed on the rear table (50) to be used for distinguishing and recognizing each of the second arrangement structures (51), 2. The wafer polishing equipment according to claim 1, wherein the microprocessor (73) associates the individual identification code of each wafer thin plate (90) with the first alignment mark (42), the identification mark (12), the hole position mark (14), and the second alignment mark (52) that correspond to each wafer thin plate (90), thereby generating a plurality of polishing records each corresponding to each wafer thin plate (90).

3. 10. A method for picking and placing multiple wafer sheets using a wafer polishing installation having a wafer holder with tracking, pick-and-place alignment as claimed in claim 1, comprising: a step of the robot arm (62) braking the pick-and-place unit (61) to reach the space above the front stage (40), the control unit (70) controlling the transfer device (60) to calibrate each of the suction chuck modules (66) to position the wafer thin plates (90) to be polished relative to each of the first arrangement structures (41) based on the recognition result of the image captured by the image capture (67), and then each of the suction chuck modules (66) sucks each of the wafer thin plates (90), and the control unit (70) records the corresponding first arrangement mark (42) of each of the wafer thin plates (90), and picking up the wafer thin plates by the pick-and-place unit; a step of positioning the wafer holder by the pick and place unit, in which the robot arm (62) brakes the pick and place unit (61) to move to a space above the selected wafer holder (10); the control unit (70) controls the transfer device (60) to calibrate each of the suction chuck modules (66) to position them relative to each of the positioning holes (11) based on the result of recognizing the image captured by the image capture (67); and the control unit (70) records the identification mark (12) of the wafer holder (10) and the hole position mark (14) of each of the corresponding positioning holes (11) of each of the wafer thin plates (90); a step of placing wafer thin plates (90) by a pick-and-place unit, in which each of the wafer thin plates (90) released from each of the suction chuck modules (66) enters each of the positioning holes (11), thereby placing one wafer thin plate (90) in each of the positioning holes (11) for each of the wafer holders (10), thereby operating the driving device (20) and the polishing device (30), thereby completing the polishing process for each of the wafer thin plates (90); After the polishing process is completed, the robot arm (62) brakes the pick-and-place unit (61) to move to the space above the selected wafer holder (10), and the control unit (70) controls the transfer device (60) to calibrate each of the suction chuck modules (66) to align the wafer thin plates (90) relative to each of the polished wafer thin plates (90) disposed on each of the wafer holders (10) based on the recognition result of the image captured by the image capture (67), and the control unit (70) records the identification mark (12) of the wafer holder (10) and the hole position mark (14) of each of the corresponding positioning holes (11) of each of the wafer thin plates (90), thereby aligning the wafer thin plates by the pick-and-place unit; a step of transferring the wafer thin plates by a transfer device, in which each of the suction chuck modules (66) sucks each of the wafer thin plates (90), and then each of the suction chuck modules (66) is linked to lift each of the wafer thin plates (90) until it is separated from the wafer holder (10), and then the robot arm (62) brakes the pick-and-place unit (61) to move it above the back-end table (50), the control unit (70) controls the transfer device (60) to calibrate each of the suction chuck modules (66) to position them relative to each of the second arrangement structures (51) based on the result of recognizing the image captured by the image capture (67), and the pick-and-place unit (61) releases each of the wafer thin plates (90) that have been polished onto each of the second arrangement structures (51) of the back-end table (50); a step of storing the polishing records, wherein the microprocessor (73) links the individual identification code of each of the wafer thin plates (90) with the first placement mark (42), the identification mark (12), and the hole position mark (14) that correspond to each of the wafer thin plates (90), and stores each of the polishing records in the storage medium (72).

4. A plurality of second arrangement marks (52) are formed on the rear table (50) to be used for distinguishing and recognizing each of the second arrangement structures (51), 4. The method for picking and placing a plurality of wafer thin plates according to claim 3, wherein in the step of transferring the wafer thin plates by the pick-and-place unit, the control unit (70) records the second alignment marks (52) of the second alignment structures (51) corresponding to each of the wafer thin plates (90), and the microprocessor (73) further associates the second alignment marks (52) that correspond to each of the wafer thin plates (90) to generate the polishing records corresponding to each of the wafer thin plates (90).

Images