Substrate processing apparatus and operation state monitoring method

Abstract

To provide a substrate processing device which stably confirms an operation state of a grip section and an operation state monitoring method.SOLUTION: A substrate processing device comprises: a hold unit capable of holding a substrate W while gripping the substrate at a plurality of positions; a rotation unit which rotates the hold unit; and a control unit which controls the hold unit and the rotation unit. The hold unit includes: a rotary disk 21 which is rotated by the rotation unit; a first grip section 22A which is rotated together with the rotary disk and movable between a grip position where a peripheral edge of the substrate is gripped and a release position where the substrate is released; and a second grip section 22B which is rotated together with the rotary disk and movable between the grip position and the release position independently of the first grip section. The substrate processing device comprises a detection unit 35 in which, regarding each of the first grip section and the second grip section, a state of being located at the grip position and a state of being located at the release position is detected in a non-contact manner by a sensor. The control unit determines an operation state of the first grip section or the second grip section based on a detection signal of the sensor.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and an operating state monitoring method. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus that holds a wafer with a substrate holding mechanism, rotates the wafer, and supplies a processing liquid to the wafer while the wafer is rotating. The substrate holding mechanism has three holding members (gripping parts) arranged in the circumferential direction, and each holding member holds the wafer by contacting the peripheral edge of the wafer.

[0003] Furthermore, when the rotation of the wafer is stopped, the substrate processing apparatus determines the holding state of the wafer by each holding member based on the contact or non-contact detection result of a contact sensor provided so as to be able to come into contact with each holding member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4819010 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that allows the operating state of a gripping portion to be stably confirmed while the gripping portion is rotating. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a substrate processing apparatus including a holding unit capable of holding a substrate by gripping the peripheral edge of the substrate at a plurality of positions, a rotation unit that rotates the holding unit, and a control unit that controls the holding unit and the rotation unit, wherein the holding unit includes a turntable that is rotated by the rotation unit, a first gripping unit that rotates together with the turntable and is movable between a gripping position where the peripheral edge of the substrate is gripped and a release position where the substrate is released, and a second gripping unit that rotates together with the turntable and is movable between the gripping position and the release position independently of the first gripping unit, and further including a detection unit that detects, in a non-contact manner, a state of each of the first gripping unit and the second gripping unit when the first gripping unit and the second gripping unit are positioned at the gripping position and when the second gripping unit are positioned at the release position while the rotation unit is rotating, the sensor is a reflective optical sensor that emits measurement light and receives reflected light thereof, and the first gripping portion and the second gripping portion each include a reflector having a reflective surface that is perpendicular to an optical axis of the measurement light of the sensor when in either the gripping position or the release position; The control unit determines the operating state of the first gripper or the second gripper based on the detection signal of the sensor. [Effects of the Invention]

[0007] According to one aspect, the substrate processing apparatus can stably check the operating state of the gripper while the gripper is rotating. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is an enlarged view of a portion of FIG. [Figure 3] 1A and 1B are cross-sectional views showing a holding section according to one embodiment, in which (A) is a cross-sectional view showing a gripping position of a first gripping section, and (B) is a cross-sectional view showing a release position of the first gripping section. [Figure 4] 1A and 1B are plan views showing an example of the movement of the first gripping portion and the second gripping portion, where (A) is a plan view showing a state in which both are in the release position, and (B) is a plan view showing a state in which one is in the gripping position and the other is in the release position. [Figure 5]1A and 1B are plan views showing an example of the movement of the first gripping portion and the second gripping portion, where (A) is a plan view showing a state in which both are in the gripping position, and (B) is a plan view showing a state in which one is in the release position and the other is in the gripping position. [Figure 6] FIG. 2 is an enlarged perspective view of an upper portion of the fiber sensor. [Figure 7] FIG. 4 is an explanatory diagram showing a detection signal of a fiber sensor. [Figure 8] FIG. 10 is an explanatory diagram showing limit setting values ​​for detecting an abnormality in the fiber sensor. [Figure 9] FIG. 2 is a block diagram showing the functions of a main controller. [Figure 10] 10A and 10B are schematic diagrams showing an operating state of the gripping portion. [Figure 11] 1 is a flowchart showing a processing flow of substrate processing. [Figure 12] 1 is a flowchart showing a processing flow of an operation status monitoring method. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and duplicate explanations may be omitted. In this specification, the X-axis, Y-axis, and Z-axis directions are perpendicular to each other. The X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is vertical.

[0010] As shown in FIGS. 1 and 2, the substrate processing apparatus 10 is an apparatus that processes a substrate W by supplying a processing liquid to the substrate W. The substrate W may be, for example, a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. A conductive film or an insulating film is formed on the surface of the semiconductor substrate or the glass substrate. The substrate W may also be a laminate of multiple films. Furthermore, an electronic circuit including a device, a concave-convex pattern (both not shown), etc. may be provided on the upper surface Wa or the lower surface Wb of the substrate W.

[0011] The substrate processing apparatus 10 includes a holder 20, a rotation unit 40, a first liquid supply unit 50, a second liquid supply unit 60, a third liquid supply unit 70, a cup 80, and a control unit 90.

[0012] The holder 20 holds the substrate W horizontally. The holder 20 includes a rotatable turntable 21 and a plurality of grippers 22 (first gripper 22A, second gripper 22B) that grip the periphery of the substrate W. The first gripper 22A and the second gripper 22B rotate integrally with the turntable 21 while gripping the substrate W.

[0013] The turntable 21 is formed in a disk shape having a surface parallel to the horizontal direction (X-axis and Y-axis directions). The turntable 21 has a hole in its center, and a liquid supply shaft 72 of the third liquid supply unit 70 is disposed in this hole. Furthermore, the substrate processing apparatus 10 has, below the turntable 21, a plurality of lift pins and a lift pin lifting mechanism for raising and lowering each lift pin (both not shown).

[0014] The grippers 22 hold the substrate W above the turntable 21 and spaced apart from the turntable 21. In this embodiment, six grippers 22 are arranged at intervals along the circumferential direction of the turntable 21 (see also FIGS. 4(A) to 5(B)). Of the six grippers 22, three are first grippers 22A and the other three are second grippers 22B. The three first grippers 22A and the three second grippers 22B are arranged alternately along the circumferential direction of the turntable 21.

[0015] The number of first gripping parts 22A may be three or more, for example, four. Each first gripping part 22A is disposed at equal intervals (at 120° intervals) along the circumferential direction of turntable 21, thereby enabling the load applied to substrate W to be evenly distributed when holding the substrate W. The number of second gripping parts 22B may also be three or more, for example, four. Each second gripping part 22B is disposed at equal intervals (at 120° intervals) along the circumferential direction of turntable 21, thereby enabling the load applied to substrate W to be evenly distributed when holding the substrate W.

[0016] 1, the rotating unit 40 of the substrate processing apparatus 10 rotates the holding unit 20. The rotating unit 40 includes a rotating shaft 41 extending downward from the center of the turntable 21 of the holding unit 20, a rotary motor 42 that rotates the rotating shaft 41, and a belt 43 that transmits the rotational driving force of the rotary motor 42 to the rotating shaft 41. The rotating shaft 41 is formed in a cylindrical shape, and a liquid supply shaft 72 is disposed therein along the vertical direction (Z-axis direction). The axis of the rotating shaft 41 and the center of rotation of the turntable 21 are aligned with each other.

[0017] The first liquid supply unit 50 supplies the processing liquid to the upper surface Wa of the substrate W held by the holder 20. The first liquid supply unit 50 includes, for example, a nozzle 51 that ejects the processing liquid, a movement mechanism 52 that moves the nozzle 51, and a supply line 53 that supplies the processing liquid to the nozzle 51. The nozzle 51 is provided above the holder 20, and ejects the processing liquid downward toward the substrate W held by the holder 20.

[0018] The supply line 53 includes, for example, a common line 53a and a plurality of individual lines 53b connected to the common line 53a. The individual lines 53b are provided for each type of processing liquid. The types of processing liquid include a chemical liquid and a rinse liquid. The chemical liquid may be acidic, alkaline, or neutral. An example of an acidic chemical liquid is dilute hydrofluoric acid (DHF). An example of an alkaline chemical liquid is SC1 (aqueous solution containing hydrogen peroxide and ammonium hydroxide). An example of a neutral chemical liquid is functional water such as ozone water. An example of a rinse liquid is deionized water (DIW). An on-off valve 55 for opening and closing the flow path of the processing liquid and a flow rate controller 56 for controlling the flow rate of the processing liquid are provided in the individual lines 53b.

[0019] 1, the chemical liquid and the rinse liquid are ejected from one nozzle 51, but they may be ejected from different nozzles 51. When there are a plurality of nozzles 51, a supply line 53 is provided for each nozzle 51.

[0020] Similar to the first liquid supply unit 50, the second liquid supply unit 60 supplies the processing liquid to the upper surface Wa of the substrate W held by the holder 20. The second liquid supply unit 60 includes a nozzle 61 that ejects the processing liquid, a movement mechanism 62 that moves the nozzle 61, and a supply line 63 that supplies the processing liquid to the nozzle 61. The nozzle 61 is provided above the holder 20, and ejects the processing liquid downward toward the substrate W held by the holder 20.

[0021] The supply line 63 supplies the drying liquid to the nozzle 61. It is preferable that the drying liquid has a lower surface tension than the rinsing liquid. The drying liquid is, for example, an organic solvent such as IPA (isopropyl alcohol). The upper surface Wa of the substrate W is dried by replacing the liquid film of the rinsing liquid with a liquid film of the drying liquid. IPA can prevent the collapse of the uneven pattern due to surface tension when drying the substrate W. An on-off valve 65 for opening and closing the flow path of the drying liquid and a flow rate controller 66 for controlling the flow rate of the drying liquid are provided midway along the supply line 63.

[0022] The substrate processing apparatus 10 according to this embodiment independently moves the supply position of the rinsing liquid and the supply position of the drying liquid so that the liquid film is not interrupted when replacing the rinsing liquid film with a drying liquid film. Specifically, the nozzle 51 is positioned radially outward from the center of the substrate W, with the nozzle 61 fixed at the center of the upper surface Wa of the substrate W. However, depending on the dimensions and shape of the uneven pattern of the substrate W, the material of the substrate W, and the like, the drying liquid may be discharged from the nozzle 51 of the first liquid supply unit 50. In other words, the substrate processing apparatus 10 does not necessarily have to include the second liquid supply unit 60.

[0023] Unlike the first liquid supply unit 50 and the second liquid supply unit 60, the third liquid supply unit 70 supplies a processing liquid to the underside Wb of the substrate W held by the holder 20. The third liquid supply unit 70 includes a plurality of nozzles 71A, 71B, 71C arranged opposite to the center of the underside of the substrate W held by the holder 20, and a liquid supply shaft 72.

[0024] A plurality of nozzles 71A, 71B, and 71C are formed on the upper surface of the liquid supply shaft 72, and each nozzle ejects a fluid upward. Nozzle 71A ejects, for example, a chemical liquid and a rinse liquid upward. Nozzle 71B ejects, for example, a rinse liquid upward. Nozzle 71C ejects, for example, an inert gas such as N2 gas upward.

[0025] The liquid supply shaft 72 is fixed so as not to rotate inside the rotary shaft 41. The liquid supply shaft 72 has a plurality of supply lines 73A, 73B, 73C connected to the plurality of nozzles 71A, 71B, 71C, respectively.

[0026] The supply line 73A selectively supplies a chemical liquid and a rinse liquid to the nozzle 71A. The supply line 73A includes, for example, a common line 73Aa and a plurality of individual lines 73Ab connected to the common line 73Aa. The individual lines 73Ab are provided for each type of processing liquid. An on-off valve 75A that opens and closes the flow path of the processing liquid and a flow rate controller 76A that controls the flow rate of the processing liquid are provided midway in the individual lines 73Ab.

[0027] Similarly, supply line 73B supplies the rinse liquid to nozzle 71 B. An on-off valve 75B that opens and closes the flow path of the rinse liquid and a flow rate controller 76B that controls the flow rate of the rinse liquid are provided midway along supply line 73B.

[0028] Further, the supply line 73C supplies an inert gas such as N2 gas to the nozzle 71C. An on-off valve 75C for opening and closing the gas flow path and a flow rate controller 76C for controlling the flow rate of the gas are provided midway along the supply line 73C.

[0029] The cup 80 is formed in a container shape (concave shape) to collect various processing liquids supplied to the substrate W. The cup 80 includes a cylindrical portion 81 located outside the turntable 21, a bottom lid portion 82 that closes the lower end of the cylindrical portion 81, and an inclined portion 83 formed on the upper part of the cylindrical portion 81. The cup 80 also includes, on the bottom lid portion 82, a drain pipe 84 that discharges processing liquid accumulated inside the cup 80, and an exhaust pipe 85 that discharges gas accumulated inside the cup 80. The cup 80 is configured not to rotate together with the turntable 21 by being fixed to an appropriate member of the substrate processing apparatus 10.

[0030] Next, the operating mechanism of the holding portion 20, the first gripping portions 22A, and the second gripping portions 22B will be described with reference to FIGS.

[0031] The holding unit 20 operates the three first gripping units 22A and the three second gripping units 22B independently of one another. For each of the three first gripping units 22A, the holding unit 20 has a first driving unit 23A and a first transmission unit 24A that transmits the driving force of the first driving unit 23A to the first gripping unit 22A. Each of the first driving units 23A and each of the first transmission units 24A can rotate integrally with the turntable 21.

[0032] Each first drive unit 23A includes a slider 25, a spring 26 arranged radially inside the slider 25, a cylinder 27 that accommodates the slider 25, a pressure adjustment mechanism 28 that adjusts the pressure inside the cylinder 27, and a rod 29 fixed to the slider 25.

[0033] The slider 25 is housed in a cylinder 27 so as to be reciprocable in the radial direction of the turntable 21. The slider 25 is biased by a spring 26 toward the radially outward direction of the turntable 21. Furthermore, the slider 25 can move toward the radially outward direction of the substrate W by centrifugal force while the turntable 21 rotates each of the first driving parts 23A.

[0034] The spring 26 has a base end fixed to the bottom of the cylinder 27 (the end on the rotation center side), and elastically expands and contracts along the axial direction of the cylinder 27.

[0035] The cylinder 27 is fixed so that its axis is aligned radially with respect to the turntable 21, and guides the slider 25 housed in the internal space. The internal space of the cylinder 27 is divided into a first chamber R1 and a second chamber R2 by the slider 25. The first chamber R1 is located radially outward from the cylinder 27 and is sealed by the structure of the slider 25, cylinder 27, and rod 29. The pressure in the first chamber R1 is adjusted by a pressure adjustment mechanism 28. The second chamber R2 is open to the outside, and its pressure is maintained at ambient air pressure. A spring 26 is disposed in the second chamber R2 in an elastically deformed and compressed state. The spring 26 urges the slider 25 radially outward from the turntable 21 by its restoring force.

[0036] The pressure adjustment mechanism 28, which adjusts the pressure of the first chamber R1, has a connection line L connected to the first chamber R1, and a pressure increase line 28a and a pressure decrease line 28b connected to the connection line L. The connection line L is made up of, for example, a flow path formed inside the turntable 21 and the rotary shaft 41, and an external pipe connected to the rotary shaft 41 via a rotary joint (not shown).

[0037] The pressure increase line 28a is a path for increasing the pressure in the first chamber R1. The pressure increase line 28a is provided with an on-off valve V1, a flow rate controller F1, a pressure controller P1, and the like. The on-off valve V1 opens and closes the flow path of the pressure increase line 28a. The flow rate controller F1 controls the flow rate of a fluid such as air supplied to the first chamber R1 when the pressure in the first chamber R1 is increased. The pressure controller P1 controls the pressure in the first chamber R1 when the pressure in the first chamber R1 is increased.

[0038] Furthermore, the decompression line 28b is a path for reducing the pressure in the first chamber R1. The decompression line 28b is provided with an on-off valve V2, a flow rate controller F2, a pressure controller P2, and the like. The on-off valve V2 opens and closes the flow path of the decompression line 28b. The flow rate controller F2 controls the flow rate of a fluid such as air discharged from the first chamber R1 when the pressure in the first chamber R1 is reduced. The pressure controller P2 controls the pressure in the first chamber R1 when the pressure in the first chamber R1 is reduced.

[0039] On the other hand, the rod 29 of the first driving part 23A extends radially outward from the slider 25, penetrates the first chamber R1 of the cylinder 27, and protrudes from the cylinder 27. The longitudinal direction of the rod 29 is aligned with the movement direction of the slider 25.

[0040] The first transmission unit 24A has a link 30 that connects the rod 29 of the first drive unit 23A and the first gripping unit 22A. The inner end of the link 30 and the protruding end of the rod 29 are rotatably connected to each other by a first pin 31. The outer end of the link 30 and the end of the first gripping unit 22A are rotatably connected to each other by a second pin 32. The link 30 rotates about the first pin 31 as the rod 29 moves forward and backward, and its posture changes between an inclined posture and a lateral posture along the horizontal direction. The outer end of the link 30 is displaced in the vertical direction (Z-axis direction) in accordance with this posture change, thereby operating the first gripping unit 22A.

[0041] First gripping portion 22A is an L-shaped member in a side view, which is formed by integrally molding connection portion 221 connected to first transmission portion 24A (link 30) and contact portion 222 extending in a different direction from connection portion 221. In first gripping portion 22A, third pin 33 is inserted into the connection point between connection portion 221 and contact portion 222. Third pin 33 is fixed to turntable 21. Therefore, first gripping portion 22A can rotate around third pin 33 as a base point.

[0042] One end of the connection part 221 located opposite the third pin 33 is a connecting end 221e that is rotatably connected to the link 30 via the second pin 32. As described above, the outer end of the link 30 moves up and down as the rod 29 moves back and forth, and this operating force is transmitted, so that the connecting end 221e also moves between the lower position LP and the upper position HP.

[0043] The periphery of the connecting end 221e is formed in a block shape that protrudes slightly downward in the vertical direction, and a reflector 221r ​​is provided on its lower end surface. The reflector 221r ​​has a flat reflecting surface 221rs facing downward in the vertical direction and reflects light from the fiber sensor 36 (described later). The reflector 221r ​​is made of a material and structure that has a higher specular reflectance than the turntable 21. When the connecting end 221e is in the lower position LP, the reflecting surface 221rs of the reflector 221r ​​is parallel to the horizontal direction (the direction perpendicular to the optical axis of the fiber sensor 36). On the other hand, when the connecting end 221e is in the upper position HP, the reflecting surface 221rs of the reflector 221r ​​is inclined relative to the horizontal direction (the direction perpendicular to the optical axis of the fiber sensor 36).

[0044] On the other hand, one end of the contact portion 222 located opposite the third pin 33 is a contact end 222e having an inner surface that comes into direct contact with the substrate W. In this embodiment, the inner surface of the contact end 222e is flat, but it can have any appropriate shape (concave, stepped, etc.) depending on the shape of the periphery of the substrate W. This contact end 222e moves in an arc as the first gripping part 22A rotates, and is thereby displaced between a gripping position CP where the substrate W is gripped and a release position UP where the substrate W is released.

[0045] Specifically, when the coupling end 221e of the connection part 221 is located at the lower position LP, the contact part 222 moves radially inward of the turntable 21, and the contact end 222e is located at the gripping position CP. Conversely, when the coupling end 221e of the connection part 221 is located at the upper position HP, the contact part 222 moves radially outward of the turntable 21, and the contact end 222e is located at the release position UP.

[0046] The operation of the first gripper 22A, first driver 23A, and first transmitter 24A will now be described. The pressure adjustment mechanism 28 supplies a fluid, such as air, to the first chamber R1 to increase the pressure in the first chamber R1. As a result, the slider 25 moves radially inward while contracting the spring 26, causing the rod 29 to retract radially inward. As the rod 29 retracts, the link 30 rotates, and the connecting end 221e of the first gripper 22A connected to the link 30 is displaced to the upper position HP. As a result, the contact end 222e of the first gripper 22A moves to the release position UP and separates from the substrate W. The load on the substrate W due to stress release at this time is determined by the supply pressure and supply speed of the fluid, etc. The control unit 90 controls the pressure controller P1 or the flow rate controller F1 to control the driving force or driving speed, thereby reducing the load on the substrate W.

[0047] The pressure adjustment mechanism 28 discharges fluid, such as air, from the first chamber R1 to reduce the pressure in the first chamber R1. As a result, the slider 25 moves radially outward due to the restoring force of the spring 26, causing the rod 29 to advance radially outward. As the rod 29 advances, the link 30 rotates, displacing the connecting end 221e of the first gripping part 22A to the lower position LP. As a result, the contact end 222e of the first gripping part 22A is moved to the gripping position CP and comes into contact with the substrate W. The impact generated at this time is determined by the restoring force of the spring 26, the discharge pressure and discharge speed of the fluid, and other factors. The control unit 90 controls the pressure controller P2 or the flow rate controller F2 to control the driving force or driving speed, thereby suppressing the impact.

[0048] Unlike when the pressure of a fluid such as air is used instead of the restoring force of the spring 26, the first driving unit 23A described above continues to position the first gripping unit 22A at the gripping position CP due to the biasing force of the spring 26, even if the supply of pressure is interrupted due to a malfunction or other reason while the substrate W is rotating. This allows the first gripping unit 22A to prevent the substrate W from falling off during rotation. Furthermore, centrifugal force acts on the slider 25 and rod 29 while the turntable 21 is rotating, allowing the contact end 222e of the first gripping unit 22A to continue to contact the periphery of the substrate W.

[0049] 2, the holding unit 20 has, for each of the three second gripping units 22B, a second driving unit 23B and a second transmission unit 24B that transmits the driving force of the second driving unit 23B to the second gripping unit 22B. Each second driving unit 23B and each second transmission unit 24B can rotate integrally with the turntable 21. The second driving unit 23B and the second transmission unit 24B are configured similarly to the first driving unit 23A and the first transmission unit 24A. Therefore, a description of the specific configuration of the second driving unit 23B and the second transmission unit 24B will be omitted.

[0050] 4(A) to 5(B), each of the first gripping portions 22A and each of the second gripping portions 22B are arranged in groups of three, alternately along the circumferential direction of the turntable 21. This allows the substrate W to be gripped in a balanced manner when the substrate W is gripped only by each of the first gripping portions 22A and when the substrate W is gripped only by each of the second gripping portions 22B, and prevents the center of the substrate W from shifting.

[0051] Furthermore, the substrate processing apparatus 10 releases the substrate W when the substrate W is loaded or unloaded, and alternately grips the peripheral edge of the substrate W with each of the first gripping parts 22A and each of the second gripping parts 22B when the substrate is processed. Therefore, each of the first gripping parts 22A and each of the second gripping parts 22B can be switched between a fully unclamped configuration shown in Fig. 4(A), a first clamped configuration shown in Fig. 4(B), a fully clamped configuration shown in Fig. 5(A), and a second clamped configuration shown in Fig. 5(B).

[0052] The fully unclamped configuration is a configuration in which both the first grippers 22A and the second grippers 22B are positioned at the release position UP, and is implemented, for example, when loading or unloading a substrate W into or from the holder 20. The first clamped configuration is a configuration in which the first grippers 22A are positioned at the gripping position CP while the second grippers 22B are positioned at the release position UP, and is implemented at an appropriate timing during substrate processing. The fully clamped configuration is a configuration in which both the first grippers 22A and the second grippers 22B are positioned at the gripping position CP, and is implemented, for example, when gripping a substrate W between the first grippers 22A and the second grippers 22B. The second clamped configuration is a configuration in which the second grippers 22B are positioned at the gripping position CP while the first grippers 22A are positioned at the release position UP, and is implemented at a different timing from the first clamped configuration during substrate processing.

[0053] In order to monitor the operating state of the grippers 22, the substrate processing apparatus 10 has a detection unit 35 that detects, in a non-contact manner, whether each of the first grippers 22A and each of the second grippers 22B is in the gripping position CP or the release position UP while the turntable 21 is rotating. In detail, the detection unit 35 includes one fiber sensor 36 and an amplifier 38 (pulse generation unit) electrically connected to the fiber sensor 36.

[0054] Fiber sensor 36 is disposed inside cup 80 so as to protrude from bottom cover portion 82, and is fixed so as not to be rotatable relative to cup 80. Fiber sensor 36 is provided at a position radially outward from rotation axis 41 so as to face perpendicularly to reflector 221r ​​of each first gripping portion 22A and reflecting surface 221rs of reflector 221r ​​of each second gripping portion 22B. The upper end of fiber sensor 36 is disposed at a position sufficiently close (for example, within a range of 3 mm to 50 mm) to reflector 221r ​​of each first gripping portion 22A and each second gripping portion 22B.

[0055] As shown in FIG. 6, the fiber sensor 36 is a reflective optical sensor that emits measurement light and receives the reflected light. It is preferable that the fiber sensor 36 be highly oil-resistant and chemical-resistant. The fiber sensor 36 has a cylindrical housing 37 extending vertically. The upper end of the housing 37 is provided with a light-emitting lens 361 and a light-receiving lens 362, which are detectors of the fiber sensor 36. The light-emitting lens 361 emits measurement light with an optical axis parallel to the vertical direction by emitting light from a light-emitting element (not shown) provided within the housing 37. The light-receiving lens 362 transmits the reflected measurement light and focuses it on a light-receiving element (not shown) provided within the housing 37. The detection unit 35 is not limited to a reflective optical sensor. For example, a transmissive sensor with the light-emitting element and light-receiving element located in different positions may be used. The sensor that detects each gripper 22 is not limited to the fiber sensor 36 and may be another optical sensor, ultrasonic sensor, laser displacement meter, or the like.

[0056] The fiber sensor 36 emits measurement light with an intensity adjusted by the amplifier 38 while the turntable 21 is rotating. When the measurement light strikes the turntable 21 facing the fiber sensor 36, it is mostly absorbed or scattered and is not reflected by the fiber sensor 36. Therefore, the fiber sensor 36 receives reflected light with an intensity of almost zero.

[0057] On the other hand, when the measurement light hits the reflector 221r ​​positioned in the lower position LP, a large amount of reflected light is reflected from the reflector 221r. Therefore, the fiber sensor 36 receives a large amount of reflected light. Furthermore, when the measurement light hits the reflector 221r ​​positioned in an inclined position in the upper position HP, the reflected light is diffused on its way to the fiber sensor 36 because the distance is longer than in the lower position LP. Therefore, the fiber sensor 36 receives a lower amount of reflected light than in the lower position LP. In particular, even if the inclined reflector 221r ​​in the upper position HP specularly reflects the measurement light of the fiber sensor 36, it cannot direct the reflected light toward the fiber sensor 36. Therefore, the fiber sensor 36 receives diffused measurement light, resulting in a sufficiently low amount of reflected light.

[0058] The light receiving element of the fiber sensor 36 generates a current value corresponding to the amount of reflected light received. Furthermore, the fiber sensor 36 converts the generated current value into a voltage value and outputs an analog detection signal 100 (see FIG. 7) to the amplifier 38.

[0059] The fiber sensor 36 also has a purge outlet 363 (outlet portion) and a purge outflow notch 364 on the sides of the light-emitting lens 361 and the light-receiving lens 362. The purge outlet 363 is connected to a purge gas supply unit (not shown) via a flow path within the housing 37. The purge gas supply unit continuously or intermittently supplies purge gas to the flow path within the housing 37 under the control of the control unit 90. The purge gas is not particularly limited, and examples include an inert gas such as N2 gas and dry air. The purge gas supplied to the flow path within the housing 37 is continuously or intermittently ejected from the purge outlet 363, and flows along the upper end of the fiber sensor 36 toward the purge outflow notch 364. This purge gas can blow away liquid adhering to the light-emitting lens 361 and the light-receiving lens 362 toward the purge outflow notch 364.

[0060] The amplifier 38 has a function of amplifying the analog detection signal 100 received from the fiber sensor 36 and converting it into a digital signal. To this end, the amplifier 38 has a control circuit board 39. The control circuit board 39 has a processor 39a, a memory 39b, an input / output interface (not shown), a communication module, etc. The control circuit board 39 is also connected to the control unit 90 via the communication module so as to be able to communicate information. When the amplifier 38 is started up, the processor 39a executes a program stored in the memory 39b, thereby controlling the operation of the fiber sensor 36 and processing the detection signal 100.

[0061] Specifically, the detection signal 100 received by the amplifier 38 while the turntable 21 is rotating is formed into a waveform having a flat portion 101 and a mountain-shaped portion 102 as the time changes, as illustrated in Figures 7(A) to (D).

[0062] The flat portion 101 is a period in which the fiber sensor 36 does not face the reflector 221r ​​(faces the rotating disk 21) and therefore receives almost no reflected light.

[0063] The peaked portion 102 is a period during which the fiber sensor 36 faces the reflector 221r ​​and receives a large amount of reflected light. However, as described above, the fiber sensor 36 receives different amounts of reflected light when the reflector 221r ​​is in the lower position LP than when the reflector 221r ​​is in the upper position HP. Therefore, the peaked portion 102 can be classified into a first peaked portion 103 having a high peak value and a second peaked portion 104 having a lower peak value than the first peaked portion 103. The first peaked portion 103 is formed when the reflector 221r ​​is in the lower position LP and receives a large amount of reflected light. The second peaked portion 104 is formed when the reflector 221r ​​is in the upper position HP and receives a small amount of reflected light.

[0064] 7A shows the waveform of the detection signal 100 in the fully unclamped state in which the reflectors 221r ​​of all the gripping units 22 are positioned at the upper position HP. FIG. 7B shows the waveform of the detection signal 100 in the first clamped state or the second clamped state in which one of the reflectors 221r ​​of the first gripping unit 22A or the second gripping unit 22B is positioned at the lower position LP and the other is positioned at the upper position HP. FIG. 7C shows the waveform of the detection signal 100 in the fully clamped state in which the reflectors 221r ​​of all the gripping units 22 are positioned at the lower position LP.

[0065] The processor 39a of the amplifier 38 monitors the detection signal 100 received from the fiber sensor 36 and performs processing to distinguish between the first mountain-shaped portion 103 and the second mountain-shaped portion 104. Furthermore, the processor 39a generates a pulse signal 105 (digital signal) corresponding to the first mountain-shaped portion 103 and outputs it to the control unit 90.

[0066] 7(D), the control circuit board 39 stores in the memory 39b a determination threshold Th that distinguishes between the first and second mountain-shaped portions 103 and 104 (the magnitude of the reflected light amount) of the detection signal 100. The determination threshold Th is set to a value between the peak value of the first mountain-shaped portion 103 and the peak value of the second mountain-shaped portion 104 by conducting experiments or the like in advance. More preferably, the determination threshold Th is between (an intermediate value) the minimum value of the peak values ​​of the six first mountain-shaped portions 103 reflected by the six reflectors 221r ​​(the three first gripping portions 22A and the three second gripping portions 22B) and the maximum value of the peak values ​​of the six second mountain-shaped portions 104.

[0067] The processor 39a monitors the detection signal 100, reads the determination threshold Th, and sets the pulse signal 105 to 1 (ON) when the detection signal 100 is equal to or greater than the determination threshold Th (see FIGS. 7B and 7C). Conversely, when the detection signal 100 is lower than the determination threshold Th, the processor 39a keeps the pulse signal 105 at 0 (OFF). This allows the control circuit board 39 to output the pulse signal 105 to the control unit 90 in accordance with the determination of the first mountain-shaped portion 103 of the detection signal 100.

[0068] 8, the control circuit board 39 controls the limit setting value T lim is stored in the memory 39b. For example, the reflector 221r ​​may become discolored due to aging or may become hard to reflect the measurement light due to the adhesion of liquid.

[0069] Limit setting value T lim is set to a value lower than the peak value of the first mountain-shaped portion 103 and higher than the determination threshold value Th by conducting experiments or the like in advance. For example, the processor 39a determines whether all the first mountain-shaped portions 103 detected in accordance with the reflector 221r ​​in the lower position LP in all clamping modes are within the limit setting value T lim If the value is equal to or greater than the limit setting value T lim If the detected voltage falls below this value, the processor 39a turns on the maintenance signal 106. As a result, the main controller 91 raises a maintenance flag (not shown) to issue an alarm requesting maintenance of the detector 35 via the user interface 94.

[0070] Furthermore, the control circuit board 39 of the amplifier 38 has an APC (Auto Power Control) function that automatically corrects the amount of measurement light in controlling the fiber sensor 36, thereby suppressing the decrease in the amount of light from the fiber sensor 36 over time.

[0071] The control unit 90 includes a main controller 91 and a user interface 94 that is connected to the main controller 91 and operated by a user. The control unit 90 also includes a counting board 95 that is provided between the amplifier 38 and the main controller 91.

[0072] The counting board 95 is a circuit board having a processor, memory, and input / output interface (not shown). The counting board 95 receives the pulse signal 105 output by the amplifier 38, counts the number of pulses for a period instructed by the main controller 91, and transmits the count value to the main controller 91. The function of counting the number of pulses (first mountain-shaped portion 103) of the detection unit 35 may be provided in the amplifier 38 or the main controller 91, and the control unit 90 may be configured without the counting board 95.

[0073] The main controller 91 controls the holding unit 20, the rotating unit 40, the first liquid supply unit 50, the second liquid supply unit 60, and the third liquid supply unit 70. The main controller 91 may be a computer having one or more processors 92, a memory 93, an input / output interface (not shown), and electronic circuits. The processor 92 is one or a combination of a CPU, an ASIC, an FPGA, and a circuit made of multiple discrete semiconductors. The memory 93 includes volatile memory and nonvolatile memory (e.g., a compact disc, a DVD, a hard disk, a flash memory, etc.) and stores programs for operating the substrate processing apparatus 10 and recipes such as process conditions. The control unit 90 controls the operation of the substrate processing apparatus 10 by having the processor 92 execute the programs stored in the memory 93.

[0074] During substrate processing, main controller 91 performs an operation status monitoring method for monitoring the operation status of holder 20. To this end, as shown in Fig. 9, processor 92 forms within main controller 91 a holding control unit 110, a rotation control unit 111, a liquid processing control unit 112, a rotation speed acquisition unit 113, a clamp configuration acquisition unit 114, a count value acquisition unit 115, and an operation monitoring unit 116.

[0075] The holding control unit 110 controls the operation of the holding unit 20 to hold and release the substrate W. As an example, after the lift pins (not shown) that have received the substrate W are lowered, the holding control unit 110 moves one of the grippers 22 (for example, the first gripper 22A) that has been in the fully unclamped state to the gripping position CP to grip the substrate W. During substrate processing, the holding control unit 110 switches from one of the grippers 22 (the first gripper 22A) that is gripping the substrate W to the other (the second gripper 22B) that is not gripping the substrate W. During this switching process, the substrate W is gripped by both the first gripper 22A and the second gripper 22B.

[0076] The rotation control unit 111 controls the operation of the rotation unit 40 to rotate the substrate W held by the holder 20. The rotation control unit 111 commands a motor driver (not shown) to set a target rotation speed, causing the motor driver to supply appropriate power to the rotation motor 42 and rotate the turntable 21 at the target rotation speed. The motor driver receives feedback of the actual rotation speed from an encoder provided on the rotation motor 42 or the like, and adjusts the rotation of the rotation motor 42 so that it matches the target rotation speed. The rotation control unit 111 rotates the turntable 21 at a constant speed of, for example, 200 rpm or less before substrate processing (during preparation, initial operation). During substrate processing, the turntable 21 and the substrate W are rotated at a constant speed within a range of 200 rpm to 1500 rpm.

[0077] Liquid treatment control unit 112 controls the operations of first liquid supply unit 50, second liquid supply unit 60 and third liquid supply unit 70 to discharge various treatment liquids onto substrate W held by holder 20.

[0078] In order to utilize the rotation speed of the turntable 21 (substrate W) in the operation state monitoring method, the rotation speed acquisition unit 113 acquires the rotation speed and stores it in the memory 93. For example, the rotation speed acquisition unit 113 may acquire the actual rotation speed of the turntable 21 as the rotation speed by receiving information on the actual rotation speed from a motor driver. Alternatively, the rotation speed acquisition unit 113 may acquire the target rotation speed of the turntable 21 from the rotation control unit 111 as the rotation speed.

[0079] In the operation state monitoring method, the clamping mode acquisition unit 114 acquires gripping mode information from the holding control unit 110 in order to ascertain the number of gripping units 22 positioned at gripping positions CP. Examples of gripping mode information include a total unclamped mode in which no gripping units 22 are positioned at gripping positions CP, a first clamped mode in which three first gripping units 22A are positioned at gripping positions CP, a total clamped mode in which all (six) gripping units 22 are positioned at gripping positions CP, and a second clamped mode in which three second gripping units 22B are positioned at gripping positions CP.

[0080] The count value acquiring unit 115 transmits a count start command and a count end command to the counting board 95, receives the count value counted in response to the start command and the end command from the counting board 95, and temporarily stores it in the memory 93. In transmitting the start command and the end command, the count value acquiring unit 115 determines whether the turntable 21 is rotating at a constant speed based on the rotation speed of the turntable 21 sequentially received by the rotation speed acquiring unit 113, and transmits the start command and the end command while the turntable 21 is rotating at a constant speed.

[0081] Furthermore, the count value acquiring unit 115 issues a command to count the count value at different sampling periods depending on the rotation speed of the turntable 21. For example, when the rotation speed of the turntable 21 is 200 rpm or less, the count value acquiring unit 115 sets the sampling period to 3 seconds and outputs an end command 3 seconds after outputting the start command. On the other hand, when the rotation speed of the turntable 21 is 200 rpm to 1500 rpm, the count value acquiring unit 115 sets the sampling period to 1 second and outputs an end command 1 second after outputting the start command. This ensures that the number of pulses required for monitoring can be secured even when the rotation speed of the turntable 21 is low, enabling the operational state monitoring method to be performed stably.

[0082] The operation monitoring unit 116 monitors the operation state of each gripping unit 22 based on the rotation speed of the turntable 21 acquired by the rotation speed acquisition unit 113, the gripping form acquired by the clamp form acquisition unit 114, the sampling period, and the count value acquired by the count value acquisition unit 115. Specifically, the operation monitoring unit 116 has a calculation unit 116a that calculates a theoretical count value CL based on the rotation speed of the turntable 21, the number of grips by each gripping unit 22, and the sampling period. The theoretical count value CL can be calculated using the following formula (1) where the rotation speed of the turntable 21 is n [rpm], the number of grips by the gripping units is x, and the sampling period is t [sec]. CL=n / 60×x×t …(1)

[0083] After calculating the theoretical count value CL, the operation monitoring unit 116 compares the calculated theoretical count value CL with the count value, and if the theoretical count value CL matches the count value, it determines that the operation state of each gripping unit 22 is normal.

[0084] 10, a description will be given of how to determine the operating state when one of the gripping parts 22 has released its grip in the full clamping mode in which six gripping parts 22 grip the substrate W. That is, the full clamping mode is a pattern in which the reflecting plates 221r ​​of all of the gripping parts 22 are normally located at the lower position LP, but due to an operational abnormality, the reflecting plate 221r ​​of one of the gripping parts 22 is located at the upper position HP.

[0085] In this case, when the turntable 21 rotates once, the fiber sensor 36 detects five first mountain-shaped portions 103 and one second mountain-shaped portion 104 as the detection signal 100. Therefore, the amplifier 38 that receives the detection signal 100 from the fiber sensor 36 repeatedly outputs five pulses per rotation.

[0086] The counting substrate 95 continuously counts five input pulses per revolution over the period between the start command and the end command issued by the count value acquiring unit 115. In other words, the count value counted by the counting substrate 95 is less than the theoretical count value CL. If the count value is less than the theoretical count value CL, the operation monitoring unit 116 determines that the gripping of the substrate W by the gripping unit 22 in all clamping configurations is abnormal. Note that the operation monitoring unit 116 can determine whether the gripping of the substrate W is normal or abnormal in other gripping configurations using a similar method.

[0087] However, the number of pulses counted by counting board 95 between the start command and the end command may fluctuate slightly. Examples of factors that can cause this include when the actual rotation speed slightly deviates from the target rotation speed even if turntable 21 is basically rotating at a constant speed, or when the pulses being counted overlap at the start and end of sampling.

[0088] To address this variation, the operation monitoring unit 116 is configured to assign an allowable range AR to the theoretical count value CL based on the number of grips each gripper 22 holds. The operation monitoring unit 116 determines the operation state as normal if the count value falls within the allowable range AR centered on the theoretical count value CL, whereas it determines the operation state as abnormal if the count value falls outside the allowable range AR. For example, if each gripper 22 holds three grips (first clamping mode, second clamping mode), the operation monitoring unit 116 sets an allowable range AR of ±30% for the theoretical count value CL. This is because setting an allowable range AR of 34% or more for the theoretical count value CL would result in an abnormality in one gripper 22 not gripping. Similarly, if the gripper 22 holds six grips each (all clamping modes), the operation monitoring unit 116 sets an allowable range AR of ±15% for the theoretical count value CL.

[0089] When the operation monitoring unit 116 determines that there is an abnormality in the gripping of the substrate W, the control unit 90 performs processing such as reporting the abnormality via the user interface 94 or stopping the rotation of the rotation unit 40 and halting substrate processing. Alternatively, when an abnormality is determined during the transition from the first clamping form to the full clamping form, the hold control unit 110 may retry the gripping operation of each second gripper 22B multiple times. This increases the likelihood that each second gripper 22B will grip normally. On the other hand, if the full clamping form is not achieved even after multiple retries, the control unit 90 may take measures such as reporting the abnormality and halting substrate processing. Note that it is also preferable to take similar measures during the transition from the second clamping form to the full clamping form.

[0090] The substrate processing apparatus 10 according to this embodiment is basically configured as described above, and its operation will be described below with reference to the flowchart in Fig. 11. Note that, although the following describes an example of monitoring the operation of the holder 20 and the operating state of each gripper 22 during substrate processing, the monitoring of the operating state of each gripper 22 can also be performed during rotation, for example, before substrate processing (during preparation, initial operation), etc.

[0091] In substrate processing, the control unit 90 of the substrate processing apparatus 10 first loads the substrate into the substrate processing apparatus 10 using a transfer device (not shown) (step S1). At this time, the holding control unit 110 of the control unit 90 moves the contact ends 222e of each of the first grippers 22A and each of the second grippers 22B to the release position UP, thereby forming a fully unclamped configuration (see also FIG. 4A). As a result, the substrate processing apparatus 10 raises the lift pins (not shown) in the cup 80 to receive the substrate W from the transfer device, and then lowers the lift pins to a predetermined position. At this predetermined position, the holding control unit 110 moves the contact ends 222e of each of the first grippers 22A to the gripping position CP. As a result, the holding control unit 110 forms a first clamped configuration in which the contact ends 222e of each of the first grippers 22A grip the periphery of the substrate W (see also FIG. 4B). After forming the first clamped configuration, the lift pins are further retracted downward.

[0092] In the first clamping mode, the rotation control unit 111 commands the motor driver to rotate at a target rotation speed according to the substrate processing recipe, thereby starting the rotation of the turntable 21 and the substrate W (step S2). After starting rotation, the rotation speed of the turntable 21 and the substrate W gradually increases, and when the target rotation speed is reached, the turntable 21 and the substrate W rotate at a constant speed.

[0093] Furthermore, while the turntable 21 and the substrate W are rotating, the detection unit 35 detects the position of the reflector 221r ​​of each gripper 22 using the fiber sensor 36 under the control of the amplifier 38. The amplifier 38 compares the detection signal 100 received from the fiber sensor 36 with the judgment threshold Th, and when the detection signal 100 exceeds the judgment threshold Th, it forms a pulse corresponding to the detection signal. In this way, by using the judgment threshold Th, the amplifier 38 can easily generate a pulse signal 105 corresponding to the detection signal of the fiber sensor 36. The control unit 90 then monitors the operating state of each gripper 22 based on the pulse signal 105 output from the amplifier 38. This operating state monitoring method will be described in detail later.

[0094] Next, the liquid processing control unit 112 supplies a chemical liquid to both the upper surface Wa and the lower surface Wb of the substrate W (step S3). The chemical liquid is supplied from the nozzle 51 of the first liquid supply unit 50 to the center of the upper surface Wa, and spreads over the entire upper surface Wa by centrifugal force, thereby processing the entire upper surface Wa. The chemical liquid is also supplied from the nozzle 71A of the third liquid supply unit 70 to the center of the lower surface Wb, and spreads over the entire lower surface Wb by centrifugal force, thereby processing the entire lower surface Wb.

[0095] In step S3, the first grippers 22A and the second grippers 22B alternately grip the substrate W. For example, after the chemical solution is supplied to the substrate W in the first clamping configuration and the substrate W is etched, the holding control unit 110 switches the substrate W to the second clamping configuration. At this time, the holding control unit 110 transitions to the full clamping configuration in which both the first grippers 22A and the second grippers 22B simultaneously grip the substrate W (see also FIG. 5A). After the full clamping configuration, the holding control unit 110 then releases the first grippers 22A and assumes the second clamping configuration in which the substrate W is gripped by the second grippers 22B (see also FIG. 5B). By supplying the chemical solution to the substrate W in the second clamping configuration, etching can be advanced near the first grippers 22A, where progress was delayed in the first clamping configuration. In particular, during the supply of the chemical solution, the substrate processing apparatus 10 does not need to accelerate or decelerate the rotation speed of the holder 20, and therefore, a decrease in processing speed can be suppressed.

[0096] It is preferable that the substrate processing apparatus 10 continues to remove foreign matter by supplying a chemical solution to the substrate W even after etching of the substrate W is completed. At this time, the holding control unit 110 may also switch the gripping position of the substrate W between each of the first gripping units 22A and each of the second gripping units 22B (for example, transition from the second clamping position to the full clamping position to the first clamping position).

[0097] Next, the liquid processing control unit 112 supplies a rinse liquid to both the upper surface Wa and the lower surface Wb of the substrate W, replacing the liquid film of the chemical liquid formed in step S3 with a liquid film of the rinse liquid. The rinse liquid is supplied from the nozzle 51 of the first liquid supply unit 50 to the center of the upper surface Wa, and spreads over the entire upper surface Wa by centrifugal force, washing away the chemical liquid remaining on the upper surface Wa and forming a liquid film of the rinse liquid. The rinse liquid is also supplied from the nozzle 71A of the third liquid supply unit 70 to the center of the lower surface Wb, and spreads over the entire lower surface Wb by centrifugal force, washing away the chemical liquid remaining on the lower surface Wb and forming a liquid film of the rinse liquid.

[0098] In step S4, the holding control unit 110 also controls the first gripping units 22A and the second gripping units 22B to alternately grip the substrate W. For example, by supplying a rinse liquid to the substrate W in the first clamping configuration, the chemical liquid remaining on the substrate W is washed away, and then the holding control unit 110 switches the substrate W to the second clamping configuration. In this case, the holding control unit 110 also switches to the full clamping configuration in which both the first gripping units 22A and the second gripping units 22B simultaneously grip the substrate W, and then to the second clamping configuration. This allows the substrate processing apparatus 10 to suppress uneven replacement of the chemical liquid with the rinse liquid.

[0099] Next, the liquid processing control unit 112 supplies a drying liquid to the upper surface Wa of the substrate W, replacing the liquid film of the rinsing liquid formed in step S4 with a liquid film of the drying liquid (step S5). The drying liquid is supplied to the center of the upper surface Wa from the nozzle 61 of the second liquid supply unit 60, and spreads over the entire upper surface Wa by centrifugal force, washing away the rinsing liquid remaining on the upper surface Wa and forming a liquid film of the drying liquid.

[0100] In step S5, the holding control unit 110 alternately holds the substrate W between the first grippers 22A and the second grippers 22B. For example, in the first clamping configuration, a drying liquid is supplied to the substrate W to replace the rinsing liquid remaining on the substrate W, and then the substrate W is switched to the second clamping configuration. In this case, the holding control unit 110 also goes through the full clamping configuration in which both the first grippers 22A and the second grippers 22B simultaneously hold the substrate W, and then to the second clamping configuration. This allows the substrate processing apparatus 10 to suppress uneven replacement of the rinsing liquid with the drying liquid.

[0101] Next, the rotation control unit 111 rotates the substrate W at a predetermined rotation speed (step S6). At this time, since no processing liquid is supplied to the substrate W, the drying liquid remaining on the substrate W is shaken off, and the substrate W is dried. In this step S6 as well, the holding control unit 110 alternately grips the substrate W with each of the first gripping units 22A and each of the second gripping units 22B. For example, after shaking off the drying liquid in the first clamping configuration, the substrate W is transferred to the full clamping configuration and then to the second clamping configuration. This allows the substrate processing apparatus 10 to suppress uneven drying of the drying liquid.

[0102] Next, the control unit releases the holding unit 20 from holding the substrate W as the lift pins rise, and transfers the substrate W to the transfer device, thereby unloading the substrate W from the substrate processing apparatus 10 (step S7). This completes the current substrate processing.

[0103] In the processing flow of steps S2 to S6 described above, the control unit 90 performs an operation monitoring method for monitoring whether the operating state of each rotating gripper 22 is normal, as shown in Fig. 12. Specifically, as described above, while the turntable 21 and the substrate W are rotating, the control unit 90 commands the amplifier 38 to measure each gripper 22 using the fiber sensor 36 (step S11). As a result, the amplifier 38 generates a pulse signal 105 corresponding to the first angled portion 103 detected by the fiber sensor 36, and continuously transmits the pulse signal 105 to the counting board 95.

[0104] While the multiple grippers 22 rotate together with the turntable 21, the fiber sensor 36 is fixed. The fiber sensor 36 is fixed directly below a point on the rotational path through which the multiple grippers 22 pass. In detecting the operating state of each gripper 22, the substrate processing apparatus 10 uses one fiber sensor 36 to detect the reflected light from all of the reflectors 221r ​​(see also FIG. 3). This allows the control unit 90 to easily and inexpensively recognize the operating state of each gripper 22. When the reflector 221r ​​is located at the lower position LP and is close to and facing the fiber sensor 36, a large (maximum) amount of reflected light can be returned from the reflector 221r ​​to the fiber sensor 36. When the reflector 221r ​​is located at the lower position LP, the contact end 222e is located at the gripping position CP. Therefore, the control unit 90 can accurately recognize the holding state of the substrate W.

[0105] Conversely, when the reflector 221r ​​is located at the upper position HP and is tilted and away from the fiber sensor 36, a small amount of reflected light is returned from the reflector 221r ​​to the fiber sensor 36. Therefore, based on the small amount of reflected light from the reflector 221r, the control unit 90 can immediately recognize that the object is not at the grip position CP. In other words, the detection unit 35 can increase the recognition accuracy of the control unit 90 by creating a large difference between the shape of the first mountain-shaped portion 103 and the shape of the second mountain-shaped portion 104.

[0106] The count value acquisition unit 115 of the control unit 90 determines whether the turntable 21 and the substrate W have reached a constant rotation speed of the target rotation speed based on the rotation speed acquired by the rotation speed acquisition unit 113 (step S12). If the constant rotation speed has been reached (step S12: YES), the count value acquisition unit 115 instructs the counting substrate 95 to count the pulse signals 105 based on a sampling period set according to the actual rotation speed (step S13). As a result, the counting substrate 95 counts the pulse signals 105 of the amplifier 38 between the start command and the end command received from the count value acquisition unit 115 and transmits the count value to the count value acquisition unit 115. The count value acquisition unit 115 acquires the transmitted count value (step S14) and temporarily stores this count value in the memory 93 until the next count value is acquired.

[0107] In this way, the substrate processing apparatus 10 can easily grasp the overall operating state of each rotating gripper 22 by outputting the pulse signal 105 from the amplifier 38 and counting the number of pulses of the pulse signal 105. Furthermore, the control unit 90 can accurately confirm the operating state of each gripper 22, for example, even at a rotation speed lower than 200 rpm or a high rotation speed of 200 rpm to 1500 rpm, by changing the sampling period according to the rotation speed of the turntable 21. The control unit 90 can then determine the operating state of each gripper 22 with sufficiently high accuracy based on the count value of the sampling period.

[0108] The operation monitoring unit 116 calculates a theoretical count value CL and an allowable range AR based on the target rotation speed of the turntable 21, the number of grips by each gripper 22, and the sampling period (step S15). Furthermore, the operation monitoring unit 116 compares the calculated theoretical count value CL including the allowable range AR with the count value acquired by the count value acquisition unit 115, thereby monitoring the state of each gripper 22 (step S16).

[0109] If the count value is within the allowable range AR centered on the theoretical count value CL (step S16: YES), the operation monitoring unit 116 determines that each gripper 22 is operating normally (step S17). Therefore, the control unit 90 continues the substrate processing as is. The control unit 90 then determines whether the substrate processing has progressed to the completion of the drying of the substrate W (step S6) described above (step S18). If the drying of the substrate W has not been completed (step S18: NO), the process returns to step S13, and the same processing flow is repeated. On the other hand, if the drying of the substrate W has been completed (step S18: YES), the operation status monitoring method is terminated.

[0110] Furthermore, if the count value is not included within the allowable range AR centered on the theoretical count value CL (step S16: NO), the operation monitoring unit 116 determines that there is an abnormality in the operation of one of the grippers 22 (step S19). When this abnormality is determined, the control unit 90 stops the substrate processing and notifies the user of the occurrence of the abnormality via the user interface 94 (step S19). This allows the user to take necessary measures early.

[0111] As described above, the substrate processing apparatus 10 detects the operating state of the grippers 22 (first gripper 22A, second gripper 22B) in a non-contact manner using the detector 35 while the substrate W is rotating. Therefore, for example, even during substrate processing, the substrate processing apparatus 10 can stably check the operating state of the grippers 22, allowing the substrate processing to continue smoothly. In particular, since there is no need to install a detector 35 for each of the multiple grippers 22, the substrate processing apparatus 10 can simplify its device configuration, thereby contributing to lower manufacturing costs.

[0112] The substrate processing apparatus 10 can more effectively recognize the operating state of each gripper 22 when switching between gripping the substrate W between each of the first grippers 22A and each of the second grippers 22B. For example, in the process of switching from the first clamping configuration to the full clamping configuration to the second clamping configuration, the number of substrates W gripped by each gripper 22 changes in the order 3, 6, and 3. If the number of substrates W gripped differs between the configurations, an operational malfunction is occurring. Therefore, for example, if there is an operational abnormality in the full clamping configuration (a gripper 22 not located at the gripping position CP), the control unit 90 preferably controls the apparatus not to transition to the second clamping configuration. This can prevent the substrate W from falling off due to poor gripping of the second grippers 22B. If there is an operational abnormality in the full clamping configuration, the substrate processing apparatus 10 may continue substrate processing in that configuration (or in the first clamping configuration, which is presumed to be normal). Even in this case, by continuing the substrate W, it is possible to prevent the substrate W from being wasted if it has progressed to the drying step in step S6, for example. This process is also the same in the process of switching from the second clamping form to the full clamping form to the first clamping form.

[0113] Furthermore, by providing the fiber sensor 36 below the turntable 21, the substrate processing apparatus 10 can prevent the processing liquid and particles from adhering to the fiber sensor 36 during substrate processing, thereby enabling continuous and stable monitoring of the operating state of the gripping parts. Moreover, the fiber sensor 36 has a purge outlet 363 (discharge part) that continuously or intermittently discharges purge gas toward the light-emitting lens 361 and the light-receiving lens 362 (detector) facing each gripping part 22. This further reduces the chances that the detection accuracy of the fiber sensor 36 will decrease.

[0114] Furthermore, the substrate processing apparatus 10 can notify the user at an early stage of a decrease in the detection signal due to aging or the adhesion of foreign matter, based on the limit setting value Tlim set in the amplifier 38. As a result, the user of the substrate processing apparatus 10 can take appropriate measures, such as maintenance, at an appropriate time.

[0115] The substrate processing apparatus 10 and the operational status monitoring method according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims. The features described in the above embodiments may be configured differently and may be combined within the scope of the appended claims. [Explanation of symbols]

[0116] 10. Substrate processing equipment 20 Holding part 21 Turntable 22A 1st grip part 22B 2nd grip part 35 Detector 36 Fiber Sensor 40 Rotating part 90 Control Unit 100 detection signal W substrate

Claims

1. 1. A substrate processing apparatus comprising: a holder capable of holding a substrate by gripping a peripheral edge of the substrate at a plurality of positions; a rotation unit that rotates the holder; and a control unit that controls the holder and the rotation unit, The holding portion is a rotating disk rotated by the rotating unit; a first gripping unit that rotates together with the turntable and is movable between a gripping position that grips the peripheral edge of the substrate and a release position that releases the substrate; a second gripping portion that rotates together with the turntable and is movable between the gripping position and the release position independently of the first gripping portion; a detection unit that detects, without contact, a state in which the first gripping unit and the second gripping unit are located at the gripping position and a state in which the second gripping unit is located at the release position by a sensor while the rotating unit is rotating, the sensor is a reflective optical sensor that emits measurement light and receives reflected light thereof, the first gripping portion and the second gripping portion each include a reflector having a reflecting surface perpendicular to an optical axis of the measurement light of the sensor when in either the gripping position or the release position; the control unit determines an operating state of the first grip unit or the second grip unit based on the detection signal of the sensor. Substrate processing equipment.

2. the first gripping portion and the second gripping portion vary a distance of the reflecting plate and an attitude of the reflecting surface relative to the sensor by moving between the gripping position and the release position; The substrate processing apparatus according to claim 1 .

3. the sensor has a maximum amount of reflected light when the first gripping portion and the second gripping portion are located at the gripping position, and a minimum amount of reflected light when the first gripping portion and the second gripping portion are located at the release position; The substrate processing apparatus according to claim 2 .

4. A substrate processing apparatus comprising: a holding unit capable of holding a substrate by gripping the periphery of the substrate at multiple positions; a rotating unit that rotates the holding unit; and a control unit that controls the holding unit and the rotating unit, The holding portion is a rotating disk rotated by the rotating unit; a first gripping unit that rotates together with the turntable and is movable between a gripping position that grips the peripheral edge of the substrate and a release position that releases the substrate; a second gripping portion that rotates together with the turntable and is movable between the gripping position and the release position independently of the first gripping portion; a detection unit that detects, without contact, a state in which the first gripping unit and the second gripping unit are located at the gripping position and a state in which the second gripping unit is located at the release position by a sensor while the rotating unit is rotating, each of the first gripping portion and the second gripping portion is formed in an L-shape having a connection portion connected to a transmission portion to which an operating force is transmitted, and a contact portion connected to the connection portion and extending in a direction different from the connection portion to come into contact with a peripheral edge of the substrate; the sensor is provided below the rotating disk and detects a displacement of the contact portion; the control unit determines an operating state of the first grip unit or the second grip unit based on the detection signal of the sensor. Substrate processing equipment.

5. A substrate processing apparatus comprising: a holding unit capable of holding a substrate by gripping the periphery of the substrate at multiple positions; a rotating unit that rotates the holding unit; and a control unit that controls the holding unit and the rotating unit, The holding portion is a rotating disk rotated by the rotating unit; a first gripping unit that rotates together with the turntable and is movable between a gripping position that grips the peripheral edge of the substrate and a release position that releases the substrate; a second gripping portion that rotates together with the turntable and is movable between the gripping position and the release position independently of the first gripping portion; a detection unit that detects, without contact, a state in which the first gripping unit and the second gripping unit are located at the gripping position and a state in which the second gripping unit is located at the release position by a sensor while the rotating unit is rotating, the detection unit includes a pulse generation unit that generates a pulse signal that is turned on at one of the gripping position and the release position and turned off at the other of the gripping position and the release position based on the detection signal of the sensor, the control unit determines an operating state of the first grip unit or the second grip unit based on the detection signal of the sensor. Substrate processing equipment.

6. the control unit counts the number of pulses of the pulse signal generated by the pulse generation unit over a set sampling period, and determines whether the first gripping unit or the second gripping unit is operating normally based on the count value. The substrate processing apparatus according to claim 5 .

7. the control unit sets a plurality of the sampling periods based on the number of rotations of the rotating unit. The substrate processing apparatus according to claim 6 .

8. the pulse generating unit has a determination threshold set between a peak value of the detection signal at one of the gripping position and the release position and a peak value of the detection signal at the other of the gripping position and the release position, and is turned on when the detection signal is equal to or greater than the determination threshold, and is turned off when the detection signal is below the determination threshold. The substrate processing apparatus according to claim 5 .

9. The pulse generating unit has a limit setting value for determining a decrease in the detection signal due to aging or adhesion of foreign matter, based on the detection signal received from the sensor. The substrate processing apparatus according to claim 5 .

10. The sensor has a discharge portion that continuously or intermittently discharges purge gas toward a detector facing the first grip portion and the second grip portion. The substrate processing apparatus according to claim 1 .

11. 1. A method for monitoring an operating state of a substrate processing apparatus comprising: a holder capable of holding a substrate by gripping a peripheral edge of the substrate at a plurality of positions; a rotation unit that rotates the holder; and a control unit that controls the holder and the rotation unit, The holding portion is a rotating disk rotated by the rotating unit; a first gripping unit that rotates together with the turntable and is movable between a gripping position that grips the peripheral edge of the substrate and a release position that releases the substrate; a second gripping portion that rotates together with the turntable and is movable between the gripping position and the release position independently of the first gripping portion; a detection unit that detects, without contact, a state in which the first gripping unit and the second gripping unit are located at the gripping position and a state in which the second gripping unit is located at the release position by a sensor while the rotating unit is rotating, the sensor is a reflective optical sensor that emits measurement light and receives reflected light thereof, the first gripping portion and the second gripping portion each include a reflector having a reflecting surface perpendicular to an optical axis of the measurement light of the sensor when in either the gripping position or the release position; The operating status monitoring method is as follows: a step of detecting the object in a non-contact manner by the sensor of the detection unit; and determining, by the control unit, the operating state of the first gripping unit or the second gripping unit based on the detection signal of the sensor. Operational status monitoring method.

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