Method for manufacturing elements of electronic devices with improved reliability, and related elements, electronic devices, and electronic equipment
The integration of a fixing element anchors the passivation layer to the semiconductor body, addressing adhesion issues and enhancing the reliability of silicon carbide electronic devices by preventing delamination and electrical discharges.
JP7758501B2Active Publication Date: 2025-10-22STMICROELECTRONICS SRL
Patent Information
- Application Number
- JP2021128777
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-09-04
- Filing Date
- 2021-08-05
- Publication Date
- 2025-10-22
- Estimated Expiration
- 2041-08-05
Smart Images
Figure 0007758501000001 
Figure 0007758501000002 
Figure 0007758501000003
Abstract
To provide a manufacturing method of an element of an electronic device having improved reliability, a related element, an electronic device, and electronic apparatus.SOLUTION: A manufacturing method of an anchorage element 82 of a passivation layer 69 of an electronic device 50 is provided, comprising: forming, in a semiconductor body 80 made of SiC and at a certain distance from a top surface 52a of a semiconductor body 80, a first implanted region having, along a first axis (X), a first maximum dimension value d1; forming, in the semiconductor body 80, a second implanted region, which is superimposed to the first implanted region and has a second maximum dimension d2 smaller than the first maximum dimension d1; and carrying out a process of thermal oxidation of the first implanted region and the second implanted region in order to form the anchorage element.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Semiconductor device
JP2020136479A
Silicon carbide semiconductor device
WO2020012810A1
Semiconductor device
WO2020105097A1