Molded parts

Abstract

To suppress flooding to through-holes since the through-holes are formed only in a non-flooding area, thereby to further suppress flooding to inner components through the through-holes.SOLUTION: A molding component 1 comprises: inner components 10, 20 including electronic component bodies (detection element bodies 11, 21), and lead wires 12, 13, 22, 23 extended from the electronic component bodies (detection element bodies 11, 21); connection terminals 30 connected to the lead wires 11, 13, 22, 23; a first molding part 40 for covering the inner components 10, 20 and holding the connection terminals 30; and a second molding part 50 for covering the first molding part 40. The second molding part 50 has a non-flooding area X arranged in an area where flooding is suppressed. Through-holes (outer through-holes 51a) arranged from a front surface of the second molding part 50 to the first molding part 40 are formed only in the non-flooding area X of the second molding part 50.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to molded parts. [Background technology]

[0002] Vehicles such as automobiles are equipped with wheel speed sensors that measure the rotational speed of wheels. A known example of such a wheel speed sensor is the device described in Patent Document 1. The wheel speed sensor described in Patent Document 1 includes a plurality of detection element units and a holder unit that holds the plurality of detection element units. The holder unit is formed by injection molding while the detection element units are maintained in a predetermined arrangement. Furthermore, the detection element units and the holder unit are covered with a resin molded unit to form a molded body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-096828 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, when forming the resin molded part, a pin is used to fix the holder part as an insert, and therefore a through hole is formed in the resin molded part, penetrating from the outer surface of the resin molded part to the holder part. It is therefore desirable to further suppress water penetration into the internal components.

[0005] Therefore, an object of the present invention is to provide a molded part that further suppresses water penetration into the internal parts. [Means for solving the problem]

[0006] The molded part of the present disclosure is a molded part comprising an internal part having an electronic component body and a lead wire extending from the electronic component body, a connection terminal connected to the lead wire, a first molded part covering the internal component and holding the connection terminal, and a second molded part covering the first molded part, wherein the second molded part has a non-water-immersed area that is arranged in an area where water penetration is suppressed, and a through hole is formed only in the non-water-immersed area of ​​the second molded part, reaching from the surface of the second molded part to the first molded part. [Effects of the Invention]

[0007] According to the present disclosure, since the through holes are formed only in the non-water-submerged region, water penetration into the through holes is suppressed, which further suppresses water penetration into the internal components through the through holes. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. [Figure 2] FIG. 3 is a perspective view showing a portion of the molded part excluding a second molded portion. [Figure 3] 10 is a partially enlarged view showing a part of the coupling portion of the first molded portion together with an exposed portion of the lead wire and an exposed portion of the connection terminal. FIG. [Figure 4] 10 is a partially enlarged view showing a part of the coupling portion of the first molded portion together with an exposed portion of the lead wire and an exposed portion of the connection terminal. FIG. [Figure 5] FIG. 2 is a plan view showing the molded part in a state where it has been assembled to the assembly target part, together with a part of the assembly target part. [Figure 6] FIG. 2 is a side view showing the molded part assembled to the assembly target part together with a part of the assembly target part. [Figure 7] FIG. 1 is an explanatory diagram showing a process for manufacturing a molded part. [Figure 8] FIG. 1 is an explanatory diagram showing a process for manufacturing a molded part. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The molded parts of the present disclosure are as follows:

[0011] (1) A molded part comprising: an internal component having an electronic component body and a lead wire extending from the electronic component body; a connection terminal connected to the lead wire; a first molded part covering the internal component and holding the connection terminal; and a second molded part covering the first molded part, wherein the second molded part has a non-water-submerged area arranged in an area where water penetration is suppressed, and a through hole is formed only in the non-water-submerged area of ​​the second molded part, reaching from the surface of the second molded part to the first molded part.

[0012] With such a molded part, the first molded part is a single part that covers the internal part and holds the connection terminal, so when molding the second molded part, the internal part covered by the first molded part and the connection terminal held by the first molded part can be positioned within the second molded part by utilizing the through holes formed in the non-water-immersed area.

[0013] Furthermore, because the through-holes that can be used to position the first molded part, which is a part that covers the internal components and holds the connection terminals, are formed only in the non-water-permeable area, water is less likely to penetrate the through-holes themselves, and water is less likely to penetrate between the first molded part and the second molded part, thereby suppressing water penetration into the internal components.

[0014] Furthermore, since the internal components and the connection terminals can be molded using the first molding portion, which is a single component, the number of manufacturing steps can be reduced compared to when the internal components and the connection terminals are molded separately.

[0015] (2) In the molded part of (1), the first molded part has a head part that covers the electronic component body, a connection terminal holding part that holds a part of the connection terminal, and a connecting part that connects the head part and the connection terminal holding part, and in the connecting part, the lead wire and the connection terminal each have an exposed part that is exposed from the first molded part, and in the connecting part, the exposed part of the lead wire and the exposed part of the connection terminal are connected by solder, and the second molded part may cover the exposed part of the lead wire, the exposed part of the connection terminal, and the solder that connects the exposed part of the lead wire and the exposed part of the connection terminal in the connecting part.

[0016] Such a molded part has exposed portions of the lead wires and exposed portions of the connection terminals at the connecting portions, making it easy to solder.

[0017] Furthermore, since the solder is covered by the second molded portion, the connection between the lead wire and the connection terminal is more secure. Furthermore, since the exposed portions of the lead wire, the exposed portions of the connection terminal, and the solder are covered by the second molded portion, water penetration into the exposed portions of the lead wire, the exposed portions of the connection terminal, and the solder is suppressed.

[0018] (3) In the molded part of (1) or (2), the connection terminal may have a connector exposure portion exposed from the first molded portion and the second molded portion, and the connector exposure portion may be a connection portion that is connected to a connector that is connected to another electrical component.

[0019] According to this molded part, the first molded portion holds the connector exposure portion in a fixed position suitable for connection to the connector, which makes it easier for the connector exposure portion to be connected to the connector.

[0020] (4) In any one of the molded parts (1) to (3), the non-water-submersible region may include a region that covers the electronic component body.

[0021] In such a molded part, the non-submersible region includes the region covering the electronic component body, and the through-hole is formed in the region covering the electronic component body (the region covering the head portion). This makes it easy to position the portion of the first molded part that covers the electronic component body within the second molded part using the through-hole. This improves the positional accuracy of the electronic component body within the first molded part and the second molded part.

[0022] (5) In the molded part of any one of (1) to (4), an O-ring is attached to the outer periphery of the second molded portion, and the non-water-immersed region is separated from the other region by the O-ring.

[0023] In this molded part, the water-blocking effect of the O-ring provides a water-tight region, and through holes are formed in the second molded part only in this water-tight region, thereby preventing water from seeping into the internal parts.

[0024] (6) In any one of the molded parts (1) to (5), the second molded portion has a first surface and a second surface facing opposite to the first surface, the through holes are formed in both the first surface and the second surface, and there are at least two or more through holes formed in the first surface.

[0025] In such a molded part, the through holes are formed in both the first surface and the second surface, so the first molded part can be positioned in the direction connecting the first surface and the second surface using the through holes. Also, because two or more through holes are formed in the first surface, rotational misalignment of the first molded part as an insert is suppressed during molding of the second molded part.

[0026] [Details of the embodiments of the present disclosure] Specific examples of molded parts according to the present disclosure are described below with reference to the drawings. However, the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0027] The drawings are schematic, and for the sake of convenience, components may be omitted or simplified as appropriate. Furthermore, the relative sizes and positions of components shown in different drawings are not necessarily accurately depicted and may be changed as appropriate. Hatching may also be used in drawings such as plan views that are not cross-sectional views to facilitate understanding of the embodiments.

[0028] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0029] [First embodiment] The following describes a molded part 1 according to this embodiment. FIG. 1 is a perspective view of the molded part 1. FIG. 2 is a perspective view of the molded part 1 excluding the second molded part 50. FIG. 3 is a partially enlarged view of the connecting portion 43 of the first molded part 40, along with the exposed portions 12a and 13a of the lead wires 12 and 13 and the exposed portions 31a and 32a of the connection terminal 30. FIG. 4 is a partially enlarged view of the connecting portion 43 of the first molded part 40, along with the exposed portions 22a and 23a of the lead wires 22 and 23 and the exposed portions 33a and 33a of the connection terminal 30. FIG. 3 is a perspective view from the first surface I side, and FIG. 4 is a perspective view from the second surface II side. In each drawing and the following description, the longitudinal direction of the molded part 1 is designated as L, and the width direction is designated as W.

[0030] <Configuration of molded part 1> The molded part 1 is used, for example, to measure the rotational speed of a vehicle tire. The molded part 1 detects magnetic field fluctuations caused by the rotation of a detection object that rotates along with the tire. The molded part 1 includes two internal parts 10, 20, a connection terminal 30 connected to each of the internal parts 10, 20, a first molded part 40 that covers the internal parts 10, 20 and holds the connection terminal 30, and a second molded part 50 that covers the first molded part 40. The second molded part 50 has a first surface I and a second surface II facing opposite to the first surface I.

[0031] <Configuration of internal components 10 and 20> Internal component 10 has a detection element body 11 as an electronic component body, and multiple (two in this case) lead wires 12 and 13 extending from detection element body 11. The two lead wires 12 and 13 are arranged in parallel with a gap between them. Internal component 20 has a similar configuration to internal component 10. Internal component 20 has a detection element body 21 as an electronic component body, and multiple (two in this case) lead wires 22 and 23.

[0032] The internal components 10 and 20 are aligned in the width direction W of the molded component 1. The four lead wires 12, 13, 22, and 23 extend along the longitudinal direction L of the molded component 1 in parallel with one another.

[0033] The detection element bodies 11 and 21 detect magnetic field fluctuations caused by the rotation of a detection object that rotates with the rotation of a tire, for example. The detection element bodies 11 and 21 may also detect magnetic field fluctuations around the detection element bodies 11 and 21 that occur with the movement of a magnet attached to a rotor or the like in a magnetic encoder. The detection element bodies 11 and 21 output electrical signals corresponding to such magnetic field fluctuations (wheel rotation speed). The detection element bodies 11 and 21 are, for example, arranged at different positions in the rotation direction of the detection object, thereby generating electrical signals at different times. The electrical signals output from the detection element bodies 11 and 21 are transmitted to the connection terminal 30 via lead wires 12, 13, 22, and 23. The electrical signals sent to the connection terminal 30 are input to other electrical components (for example, a control unit or a control device).

[0034] The lead wires 12, 13, 22, and 23 are formed, for example, in the shape of a rectangular thin plate. The lead wires 12 and 13 extend in parallel from the detection element body 11, and the lead wires 22 and 23 extend in parallel from the detection element body 21. The detection element bodies 11 and 21 are adjacent to each other with a gap between them. The detection element bodies 11 and 21 are also in the same position within the first molding portion 40. Therefore, the lead wires 12, 13, 22, and 23 are also parallel to each other as a whole. As shown in FIG. 3, the tips of the lead wires 12 and 13 have exposed portions 12a and 13a exposed from the first molding portion 40. Parts of the exposed portions 12a and 13a of the lead wires 12 and 13 are lead wire soldered portions 12b and 13b. Furthermore, the lead wires 12 and 13 are soldered to the connection terminals 30 with solder 60 at the lead wire soldering portions 12b and 13b of the lead wires 12 and 13.

[0035] 4, like the lead wires 12 and 13, the lead wires 22 and 23 also have exposed portions 22a and 23a exposed from the first molded portion 40. Parts of the exposed portions 22a and 23a of the lead wires 22 and 23 are lead wire soldering portions 22b and 23b. The lead wires 22 and 23 are connected to the connection terminals 30 by soldering with solder 60 at the lead wire soldering portions 22b and 23b of the lead wires 22 and 23.

[0036] <Configuration of connection terminal 30> The connection terminal 30 has four connection terminals 31, 32, 33, and 34. The connection terminal 30 is made of a metal material such as copper, copper alloy, aluminum, aluminum alloy, or stainless steel. The connection terminal 30 is formed, for example, by pressing a metal plate with excellent conductivity. It is preferable that the connection terminal 30 has enough rigidity to maintain a fixed shape.

[0037] The connection terminals 31, 32, 33, and 34 are connected to the lead wires 12, 13, 22, and 23, respectively. As shown in Figures 1 and 2, one end of each of the connection terminals 31, 32, 33, and 34 is exposed from the first molded portion 40 to form exposed portions 31a, 32a, 33a, and 34a.

[0038] Here, connection terminals 31 and 32 of connection terminal 30 will be described. As shown in FIG. 3, parts of exposed portions 31a and 32a of connection terminals 31 and 32 are connection terminal soldering portions 31b and 32b. Connection terminal soldering portions 31b and 32b are connected to lead wire soldering portions 12b and 13b described above with solder 60. The connection of connection terminals 33 and 34 to lead wires 22 and 23 is similar to the connection of connection terminals 31 and 32 to lead wires 12 and 13, and therefore will not be described here. Note that connection terminal soldering portions 33b and 34b shown in FIG. 4 have the same configuration as connection terminal soldering portions 31b and 32b.

[0039] Each of the connection terminals 31, 32, 33, and 34 has a connector-use exposed portion 31c, 32c, 33c, and 34c exposed from the first molded portion 40 and the second molded portion 50. Specifically, the other end of each of the connection terminals 31, 32, 33, and 34, opposite the exposed portions 31a, 32a, 33a, and 34a, is exposed from the first molded portion 40 and the second molded portion 50, forming the connector-use exposed portion 31c, 32c, 33c, and 34c. The connector-use exposed portions 31c, 32c, 33c, and 34c are connected to a connector that is connected to another electrical component. The connector-use exposed portions 31c, 32c, 33c, and 34c allow the molded part 1 itself to have a connector. This allows the molded part 1 itself to be directly connected to a connector extending from another electrical component (e.g., a control unit or a control device).

[0040] <First molding section 40> The first molded portion 40 has a head portion 41, a connection terminal holding portion 42, and a connecting portion 43 that connects the head portion 41 and the connection terminal holding portion 42. The first molded portion 40 is formed of, for example, resin. The first molded portion 40 is a portion that is molded using a resin material with the internal components 10 and 20 as inserts.

[0041] The head portion 41 covers the detection element bodies 11 and 21. The head portion 41 has a recess 41a and an inner through-hole 41b that penetrates from the surface of the first molded portion 40 to the internal component 20.

[0042] In the head portion 41 of the first molded portion 40, a plurality of (three in this case) recesses 41a are formed on the first surface I side of the second molded portion 50, and at least one (one in this case) recess 41a is formed on the second surface II side of the second molded portion 50. The recess 41a is a portion into which the tip of a positioning pin for fixing the first molded portion 40 is inserted when molding the second molded portion 50. In other words, the recess 41a is a portion into which a positioning pin of a mold device is inserted when mold molding is performed using the first molded portion 40 as an insert. The recess 41a is a recess that opens to the surface of the first molded portion 40 but does not reach the surfaces of the internal components 10, 20.

[0043] Furthermore, in the head portion 41 of the first molded portion 40, a plurality of (here, two) inner through holes 41b are formed on the first surface I side of the second molded portion 50. The inner through holes 41b are marks of positioning pins used to fix parts of the internal components 10, 20 when the first molded portion 40 is molded. When the first molded portion 40 is removed from the mold, the inner through holes 41b are formed as marks of the positioning pins. The inner through holes 41b penetrate all the way to the surfaces of the internal components 10, 20, and parts of the surfaces of the internal components 10, 20 are exposed within the inner through holes 41b. In this embodiment, the positioning pins press and fix parts of the lead wires 12, 13, 22, and 23 of the internal components 10, 20, for example. The inner through holes 41b are formed so as to expose parts of the lead wires 12, 13, 22, and 23. As a result, the lead wires 12, 13, 22, and 23 that were fixed by positioning pins when the first molded portion 40 was molded are exposed to the outside of the first molded portion 40 through the inner through-holes 41b. Similarly, holes are also formed on the second surface II of the molded part 1 as traces of holding parts for holding the internal parts 10 and 20, but these are not shown in the drawings.

[0044] The connection terminal holding portion 42 holds a portion of the connection terminal 30. The connection terminal holding portion 42 holds multiple (four in this example) connection terminals 31, 32, 33, and 34 in fixed positions. This holds the exposed portions 31a, 32a, 33a, and 34a and the connector exposed portions 31c, 32c, 33c, and 34c in fixed positions. This holds the connector exposed portions 31c, 32c, 33c, and 34c in fixed positions suitable for connection with connectors of other electrical components. For example, the connector exposed portions 31c, 32c, 33c, and 34c are held in positions that are parallel to each other and protrude in the same direction. Furthermore, the exposed portions 31a, 32a, 33a, and 34a are held in fixed positions suitable for connection with the lead wires 12, 13, 22, and 23 (for example, positions that contact the lead wires 12, 13, 22, and 23 from the side opposite the connecting portion 43).

[0045] The connecting portion 43 connects the head portion 41 and the connection terminal holding portion 42 so that the connection terminal holding portion 42 is kept in a fixed position relative to the head portion 41. The connecting portion 43 may be thinner than the head portion 41 and the connection terminal holding portion 42.

[0046] In this embodiment, the connecting portion 43 has mounting portions 44 corresponding to the lead wires 12, 13, 22, and 23. The mounting portion 44 has a first mounting surface 44a facing the first surface of the molded part 1 and a second mounting surface 44b facing the second surface of the molded part 1. The second mounting surface 44b faces in the opposite direction to the first mounting surface 44a. The mounting portion 44 also serves as a partition between the lead wires 12, 13 and the lead wires 22, 23.

[0047] In this embodiment, the normal directions (arrow N in FIG. 3) of the first mounting surface 44a and the second mounting surface 44b are the same. The lead wires 12 and 13 are mounted on the first mounting surface 44a, and the lead wires 22 and 23 are mounted on the second mounting surface 44b. By arranging the lead wires 12 and 13 on the first mounting surface 44a and the lead wires 22 and 23 on the second mounting surface 44b, the solder 60 on the lead wires 12 and 13 (see FIG. 3) and the solder 60 on the lead wires 22 and 23 (see FIG. 4) do not come into contact with each other. This prevents short circuits between the lead wires 12 and 13 and the lead wires 22 and 23.

[0048] In addition, a first separating wall 45 is disposed between the lead wires 12 and 13 to separate the lead wires 12 and 13. This first separating wall 45 prevents the solder 60 on the lead wire 12 from coming into contact with the solder 60 on the lead wire 13. Furthermore, the lead wires 12 and 13 do not come into contact with each other. This prevents a short circuit between the lead wires 12 and 13.

[0049] Similarly, a second separating wall 46 is disposed between the lead wires 22 and 23 to separate the lead wires 22 and 23. This second separating wall 46 prevents the solder 60 on the lead wire 22 from coming into contact with the solder 60 on the lead wire 23. Furthermore, the lead wires 22 and 23 do not come into contact with each other. This prevents a short circuit between the lead wires 22 and 23.

[0050] <Second molding section 50> The second molded portion 50 covers the first molded portion 40. The second molded portion 50 includes a head covering portion 51 that covers the head portion 41 of the first molded portion 40, a cylindrical portion 52 that surrounds a portion of the connection terminal 30, and a connecting portion 53 that connects the head covering portion 51 and the cylindrical portion 52. The second molded portion 50 also includes an annular protrusion 54 that protrudes outward from the outer periphery of the connecting portion 53.

[0051] In the head portion covering portion 51 of the second molded portion 50, a plurality of (three in this example) outer through holes 51a are formed on the first surface I side, and at least one (one in this example) outer through hole 51a is formed on the second surface II side. The outer through holes 51a are marks of positioning pins used to fix a portion of the first molded portion 40 when the second molded portion 50 is molded. When the second molded portion 50 is removed from the mold, the outer through hole 51a is formed as the mark of the positioning pin. The outer through hole 51a penetrates all the way to the surface of the first molded portion 40, and a portion of the first molded portion 40 is exposed within the outer through hole 51a. In this embodiment, the positioning pin engages with the recess 41a of the first molded portion 40 to fix the first molded portion 40. Therefore, the recess 41a, which was fixed by the positioning pin when the second molded portion 50 was molded, is exposed to the outside of the second molded portion 50 through the outer through hole 51a.

[0052] The cylindrical portion 52 surrounds the connector exposed portions 31c, 32c, 33c, and 34c of the connection terminal 30. The cylindrical portion 52 and the connector exposed portions 31c, 32c, 33c, and 34c are formed in a shape suitable for engagement with a mating connector connected to another electrical component. For example, the mating connector has a plurality of mating terminal portions connectable to the connector exposed portions 31c, 32c, 33c, and 34c. The mating terminal portions are formed in, for example, a columnar terminal shape. The mating connector has a housing portion that holds the plurality of mating terminal portions in positions corresponding to the connector exposed portions 31c, 32c, 33c, and 34c. The cylindrical portion 52 is formed in a cylindrical shape into which the housing portion of the mating connector can be inserted. As a result, the cylindrical portion 52 and the connector exposed portions 31c, 32c, 33c, and 34c are directly connected to the mating connector connected to another electrical component.

[0053] The connecting portion 53 is located between the head covering portion 51 and the cylindrical portion 52. The connecting portion 53 covers the exposed portions 12a, 13a, 22a, 23a of the lead wires 12, 13, 22, 23, the exposed portions 31c, 32c, 33c, 34c for connectors of the connection terminals 31, 32, 33, 34, and the solder 60. As a result, the lead wires 12, 13, 22, 23, the connection terminals 30, and the solder 60 are covered by the second molded portion 50 and are not exposed to the outside of the molded part 1.

[0054] An O-ring 70 is attached to the peripheral portion of the connecting portion 53, closer to the head covering portion 51 than the annular protrusion 54. The O-ring 70 is fitted into a fitting groove 55 (see FIG. 8) formed in the connecting portion 53. The O-ring 70 is an annular member made of an elastic material such as rubber.

[0055] <Arrangement of molded part 1> Fig. 5 is a plan view showing the molded part 1 assembled to the assembly target part 80 together with a part of the assembly target part 80. Fig. 6 is a side view showing the molded part 1 assembled to the assembly target part 80 together with a part of the assembly target part 80.

[0056] 5 and 6 , the molded part 1 is assembled to the assembly target part 80 by inserting at least a portion of it into a hole 81 of the assembly target part 80. In this embodiment, the head covering part 51 and a portion of the connecting part 53 are inserted into the hole 81 of the assembly target part 80. The opening of the hole 81 of the assembly target part 80 is formed with, for example, a large diameter part 82 that receives the annular protrusion 54. The large diameter part 82 is formed in a shape that matches the shape of the annular protrusion 54, and the annular protrusion 54 is fitted into the large diameter part 82.

[0057] An O-ring 70 is fitted into fitting groove 55 formed on the head covering portion 51 side of annular protrusion 54. The outer periphery of O-ring 70 is in liquid-tight contact with the inner periphery of hole 81. This prevents water from entering from the cylindrical portion 52 side of O-ring 70 to the head covering portion 51 side of O-ring 70. Therefore, even if water does enter from the outer surface 83 of assembly target component 80 to the head covering portion 51 side, the O-ring 70 acts as a boundary to prevent water from entering from the cylindrical portion 52 side to the head covering portion 51 side.

[0058] As described above, in the second molded part 50, a region X where water penetration is suppressed (hereinafter referred to as "non-water-submerged region X") is set on the head portion covering part 51 side, with the O-ring 70 as the boundary (see FIGS. 5 and 6). In other words, as shown in FIGS. 5 and 6, the O-ring 70 separates the second molded part 50 into the non-water-submerged region X and the other region (hereinafter referred to as "water-submerged region Y").

[0059] In this embodiment, an engagement groove 56 is formed on the outer periphery of the second molding portion 50, closer to the tubular portion 52 than the annular protrusion 54. A locking member 90 is joined around the engagement groove 56. The locking member 90 is fixed to the outer surface 83 of the assembly target component 80 with screws 91. This secures the molded part 1 to the assembly target component 80. Preferably, the surface of the locking member 90 that contacts the outer surface 83 of the assembly target component 80 is formed to match the shape of the outer surface 83 of the assembly target component 80. The surface of the locking member 90 and the outer surface 83 of the assembly target component 80 are in close contact with each other. The locking member 90 and the outer surface 83 of the assembly target component 80 also further prevent water from entering from the tubular portion 52 to the head cover 51, with the outer surface 83 of the assembly target component 80 acting as a boundary. A seal member may be sandwiched between the locking member 90 and the outer surface 83. With this configuration, even if the shapes of the surface of the locking member 90 and the outer surface 83 of the part 80 to be assembled are not formed to be in close contact, the effect of the sealing member further prevents water from entering from the tubular portion 52 side to the head portion covering portion 51 side, with the outer surface 83 of the part 80 to be assembled as the boundary.

[0060] In this embodiment, the non-water-submerged area X includes an area that covers the electronic component body (detection element body 11, 21). In this embodiment, the entire head portion covering portion 51 of the first molded portion 40 that covers the electronic component body (detection element body 11, 21) is located within the non-water-submerged area X. Furthermore, the outer through-holes 51a are formed only in the head portion covering portion 51. In other words, the outer through-holes 51a are formed only in the non-water-submerged area of ​​the second molded portion. This results in a structure that makes it difficult for water to penetrate the outer through-holes 51a.

[0061] Furthermore, the inner through hole 41b formed in the first molding portion 40 is also formed only in the head portion 41. That is, in this embodiment, the outer through hole 51a and the inner through hole 41b are formed in positions close to each other. Even if the outer through hole 51a and the inner through hole 41b are formed in this arrangement, water is prevented from entering the outer through hole 51a, and therefore water is also prevented from entering the inner through hole 41b.

[0062] Furthermore, since the outer through-holes 51a of the second molded portion 50 are formed only around the area that covers the electronic component body (detector element bodies 11, 21), the shape of the second molded portion 50 can be simplified.

[0063] <Method of manufacturing molded part 1> 7 and 8 are explanatory diagrams showing a process for manufacturing the molded part 1. Fig. 7 shows a side view of the first molded portion 40 after it has been molded, with the lead wires 12, 13, 22, and 23 and the connection terminal 30 connected with solder 60. Fig. 8 also shows a side cross-sectional view of the first molded portion 40 and the solder 60 set in a mold device 100 when the second molded portion 50 is molded using the first molded portion 40 as an insert, following the process shown in Fig. 7.

[0064] 7, first, the internal components 10, 20 and the connection terminal 30 are fixed in place by the first molding portion 40. Exposed portions 12a, 13a, 22a, 23a of the lead wires 12, 13, 22, 23 exposed from the first molding portion 40 and exposed portions 31a, 32a, 33a, 34a of the connection terminal 30 are connected by solder 60.

[0065] Next, the first molded portion 40, internal components 10, 20, connection terminals 30, and solder 60 shown in FIG.

[0066] The mold device 100 includes, for example, a lower support mold 101 that supports the first molded portion 40 from the second surface II side, an upper support mold 102 that supports the first molded portion 40 from the first surface I side, and a connection terminal support mold 103 that supports the connector exposed portions 33c, 34c (also including the connector exposed portions 31c, 32c, although not shown) exposed from the first molded portion 40.

[0067] The tip of the positioning pin 101a of the lower support mold 101 is held in the recess 41a of the first molding portion 40. The tip of the positioning pin 102a of the upper support mold 102 is held in the recess 41a of the first molding portion 40. In addition, the connection terminal support mold 103 holds the connection terminal 30. As a result, the first molding portion 40 is properly held by the mold device 100 even though the recess 41a is formed only in the head portion 41.

[0068] The molds 101, 102, and 103 of the mold device 100 are described as an example, and the device for molding the molded part 1 is not limited to the mold device 100.

[0069] <Effects of the above-described embodiments> Next, examples of effects obtained by the above-described embodiments will be described. Note that in the following description, the effects will be described based on the specific configurations exemplified in the above-described embodiments, but these may be replaced with other specific configurations exemplified in the present specification as long as the same effects are obtained.

[0070] Furthermore, the replacement may be made across multiple embodiments, i.e., configurations illustrated in different embodiments may be combined to produce the same effect.

[0071] The molded part 1 configured as described above includes the first molded part 40 that covers the internal parts 10, 20 and holds the connection terminal 30, so the first molded part 40 can be positioned by the through holes (outer through holes 51a) formed only in the non-water-submerged area X. Furthermore, because the molded part 1 includes the first molded part 40 that covers the internal parts 10, 20 and holds the connection terminal 30, the positional relationship between the internal parts 10, 20 and the connection terminal 30 can be consistently defined. This reduces variation in manufactured parts.

[0072] Furthermore, a through hole (outer through hole 51a) is formed in the non-water-submerged region X, penetrating from the outside of the second molded portion 50 to the first molded portion 40. For this reason, water is unlikely to penetrate into the outer through hole 51a itself, and water is also unlikely to penetrate between the first molded portion 40 and the second molded portion 50. This prevents water from penetrating into the internal components 10, 20. Therefore, regardless of where in the first molded portion 40 a through hole (inner through hole 41b) for positioning the internal components 10, 20 is formed, water is prevented from penetrating into the internal components 10, 20.

[0073] Furthermore, since the internal components 10, 20 and the connection terminal 30 can be molded integrally, the number of manufacturing steps for the molded component 1 as a whole can be reduced.

[0074] Furthermore, according to the molded part 1, in the connecting portion 43 of the first molded portion 40, the lead wires 12, 13, 22, 23 and the connection terminals 30 each have exposed portions exposed from the first molded portion 40 (exposed portions 12a, 13a, 22a, 23a of the lead wires 12, 13, 22, 23, and exposed portions 31a, 32a, 33a, 34a of the connection terminals 31, 32, 33, 34), making it easy to perform the soldering work of the solder 60.

[0075] Furthermore, since the lead wires 12, 13, 22, 23 and the connection terminals 30 are connected by the solder 60, the connection between the lead wires 12, 13, 22, 23 and the connection terminals 30 is reliable.

[0076] Furthermore, since the solder 60 is covered with the second molded portion 50, the connection between the lead wires 12, 13, 22, 23 and the connection terminal 30 becomes even more reliable.

[0077] The connection terminal 30 also has connector exposed portions 31c, 32c, 33c, and 34c, which are connected to connectors that connect to other electrical components. This is achieved by the first molded portion 40 holding the connector in a fixed position suitable for connection to the connector.

[0078] Furthermore, the connector exposed portions 31c, 32c, 33c, and 34c of the connection terminal 30 function as connectors and are connected to connectors of other electrical components. Therefore, no electrical conductor such as an electric wire is required to connect between the molded part 1 and the connector. This allows the molded part 1 itself to function as a connector. This simplifies the configuration between the molded part 1 and the connector that connects to the other electrical component.

[0079] The non-water-submerged region includes the region covering the electronic component body (detection element body 11, 21), and the through-hole (outer through-hole 51a) is formed only in the region covering the head portion 41 (head portion covering portion 51). The first molding portion 40 is formed with a through-hole (inner through-hole 41b) through which a positioning pin for fixing the internal components 10, 20 is passed during molding. The inner through-hole 41b penetrates the internal components 10, 20 and the outside of the first molding portion 40. Therefore, if water were to enter this inner through-hole 41b, the internal components 10, 20 would also be submerged. If the outer through-hole 51a were also formed in the region covering the head portion 41 (head portion covering portion 51), the outer through-hole 51a and the inner through-hole 41b would be close to each other. When the outer through-hole 51a and the inner through-hole 41b are close to each other, it is thought that water that seeps in through the outer through-hole 51a is likely to pass through the gap between the second molded portion 50 and the first molded portion 40 and seep in through the inner through-hole 41b. However, since the outer through-hole 51a is formed in the non-water-permeable region X, water penetration into the outer through-hole 51a is suppressed, and water penetration into the inner through-hole 41b is also suppressed.

[0080] Furthermore, the through holes (outer through holes 51a) formed in the second molded portion 50 are formed only in the region covering the head portion 41 (head portion covering portion 51), and are not formed in other regions. Therefore, it is not necessary to form through holes in various places in the second molded portion 50, and the shape of the second molded portion 50 can be simplified.

[0081] An O-ring 70 is attached to the outer periphery of the second molded portion 50, and the O-ring 70 separates the non-water-submerged region X from the other region Y. In other words, the non-water-submerged region X is provided by the water-stopping effect of the O-ring 70. A through-hole (outer through-hole 51a) is formed in the second molded portion 50 only in this non-water-submerged region X. This prevents water from entering the internal components 10, 20.

[0082] Furthermore, two or more through holes (outer through holes 51a) are formed on one surface (first surface I) of the molded part 1. That is, when the second molded portion 50 is molded, it is fixed to the first surface I by two or more positioning pins. This prevents the insert (first molded portion 40) from rotating (misaligning) when the second molded portion 50 is molded.

[0083] <Other> In the embodiment described above, the O-ring 70 is used to prevent water from entering the non-water-submerged region X (the region where the outer through-hole 51a is formed), and the O-ring 70 separates the non-water-submerged region X from the other region (water-submerged region Y). However, the non-water-submerged region X can be separated from the other region (water-submerged region Y) by a method other than the O-ring 70. For example, the O-ring 70 may not be used to prevent water from entering the non-water-submerged region X (the region where the outer through-hole 51a is formed), and the surface of the locking member 90 and the outer surface 83 of the assembly target component 80 (a sealing member may be further added) may be used instead. In this case, the contact portion between the surface of the locking member 90 and the outer surface 83 of the assembly target component 80 separates the non-water-submerged region X from the other region (water-submerged region Y).

[0084] Furthermore, in the above-described embodiment, two parallel internal components 10, 20 are provided, but the molded component may be provided with only one internal component, or may be provided with three or more internal components.

[0085] Furthermore, in the above-described embodiment, the lead wires 12, 13, 22, 23 and the connection terminals 30 are connected with the solder 60 after the first molded portion 40 is molded, but the lead wires 12, 13, 22, 23 and the connection terminals 30 may be connected with the solder 60 before the first molded portion 40 is molded. In this case, a configuration can be adopted in which the lead wires 12, 13, 22, 23 and the connection terminals 30 are not exposed at the coupling portion 43. With such a configuration, the shape of the first molded portion 40 can be further simplified.

[0086] In the above-described embodiment, the lead wires 12, 13, 22, 23 and the connection terminals 30 are connected by solder 60, but this is not limiting. The lead wires 12, 13, 22, 23 and the connection terminals 30 may also be connected by welding.

[0087] Furthermore, in the above-described embodiment, the internal components 10, 20 are molded as inserts when the first molded portion 40 is molded, but this is not limited to this. The internal components 10, 20 do not have to be molded as inserts when the first molded portion 40 is molded. In this case, a configuration in which the inner through-hole 41b is not formed can be adopted. For example, a first molded portion having a recess into which the internal components 10, 20 can be fitted may be molded separately from the internal components 10, 20, and the internal components 10, 20 may be fitted into the recess of the first molded portion.

[0088] Furthermore, in the above-described embodiment, the non-submerged area X is set to include an area covering the electronic component body (detection element body 11, 21). However, the non-submerged area X may be set to not include an area covering the electronic component body (detection element body 11, 21). For example, the non-submerged area X may be set in the connecting portion 53. In that case, the outer through-hole 51a is formed only in the connecting portion 53.

[0089] Furthermore, in the above-described embodiment, three outer through holes 51a are formed on the first surface I side, but a configuration in which one outer through hole 51a is formed on the first surface I side may also be used. In this case, it is preferable that the outer through hole 51a has a shape other than a cylinder or a cone. For example, it is preferable that the shape of the outer through hole 51a is a polygonal pillar shape or an elliptical pillar shape. Also, a configuration in which a number other than three outer through holes 51a are formed on the first surface I side may also be used. However, because the outer through holes 51a are locations where water can enter the internal components 10, 20, it is preferable that the number of outer through holes 51a is as small as possible.

[0090] <Modifications of the above-described embodiments> In the embodiments described above, the material, composition, dimensions, shape, relative positional relationship, or implementation conditions of each component may also be described, but these are merely examples in all aspects and are not limited to those described in the present specification.

[0091] Therefore, countless modifications and equivalents not shown as examples are contemplated within the scope of the technology disclosed in the present specification, including, for example, modifying, adding, or omitting at least one component, and further, extracting at least one component in at least one embodiment and combining it with a component in another embodiment. [Explanation of symbols]

[0092] 1 Molded parts 10,20 Internal parts 11,21 Detector element body 12, 13, 22, 23 Lead wires 12a,13a,22a,23a Exposed part 12b, 13b, 22b, 23b Lead wire soldering area 30, 31, 32, 33, 34 Connection terminals 31a,32a,33a,34a Exposed part 31b, 32b, 33b, 34b Connection terminal soldering part 31c, 32c, 33c, 34c Exposed parts for connectors 40 1st molding section 41 Head 41a Recess 41b Inner through hole 42 Connection terminal holder 43 Connecting part 44 Placement section 44a First mounting surface 44b Second mounting surface 45 1st isolation wall 46 Second isolation wall 50 2nd molding section 51 Head covering part 51a Outer through hole 52 Cylindrical part 53 Connecting part 54 Annular protrusion 55 Fitting groove 56 Engagement groove 60 solder 70 O-rings 80 Parts to be assembled 81 Hole 82 Large diameter section 83 Exterior 90 Locking member 91 screws 100 mold equipment 101 Lower support mold 101a, 102a Locating pin 102 Upper support mold 103 Connection terminal support mold I Front page II Side 2 L Longitudinal direction N arrow W width direction X Non-flooded area Y Flood area

Claims

1. an internal component having an electronic component body and lead wires extending from the electronic component body; a connection terminal connected to the lead wire; a first molding portion that covers the internal components and holds the connection terminals; a second molding portion covering the first molding portion; Equipped with the second molded portion has a water-resistant region disposed in the water-resistant region, A molded part, wherein a through hole is formed in only the non-submerged region of the second molded part, the through hole reaching from the surface of the second molded part to the first molded part.

2. 2. The molded part according to claim 1, the first molding portion has a head portion that covers the electronic component body, a connection terminal holding portion that holds a part of the connection terminal, and a connecting portion that connects the head portion and the connection terminal holding portion, In the coupling portion, the lead wire and the connection terminal each have an exposed portion exposed from the first molded portion, In the connecting portion, the exposed portion of the lead wire and the exposed portion of the connection terminal are connected by solder, The second molded portion is a molded part that covers the exposed portion of the lead wire in the connecting portion, the exposed portion of the connection terminal, and the solder that connects the exposed portion of the lead wire and the exposed portion of the connection terminal.

3. The molded part according to claim 1 or 2, the connection terminal has a connector exposure portion exposed from the first molded portion and the second molded portion, The connector exposure portion is a connecting portion that is connected to a connector that is connected to another electrical component.

4. The molded part according to claim 1 or 2, The non-water-submerged region includes a region covering the electronic component body.

5. The molded part according to claim 1 or 2, An O-ring is attached to the outer periphery of the second molding portion, A molded part, wherein the non-water-submerged area is separated from other areas by the O-ring.

6. The molded part according to claim 1 or 2, The second molding portion has a first surface and a second surface facing away from the first surface, the through-holes are formed in both the first surface and the second surface, A molded part, wherein the number of through holes formed in the first surface is at least two.

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