Resin material supply mechanism, resin molding device, and method for manufacturing resin molded product

Abstract

To provide a resin material supply mechanism that can accurately measure total weight of a resin tablet.SOLUTION: A resin material supply mechanism is provided with: a send-out unit that sequentially sends out resin materials; a total weight measuring unit that collectively measures weight of the plurality of resin materials sent out by the send-out unit; a delivery unit that delivers the plurality of resin materials sent out by the send-out unit to a conveying mechanism that conveys the resin materials to forming dies; and a moving unit that moves the resin materials among the send-out unit, the total weight measuring unit, and the delivery unit.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a resin material supply mechanism, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a technique for individually measuring the weight of multiple resin tablets required in a press unit. Specifically, Patent Document 1 discloses a resin material supply mechanism including a pot portion for individually accommodating cylindrical resin tablets, a load cell for individually measuring the weight of the resin tablets accommodated in the pot portion, and a discharge shutter for discharging the resin tablets accommodated in the pot portion.

[0003] In the resin material supply mechanism described in Patent Document 1, if the weight of a resin tablet contained in a pot does not satisfy a reference weight condition, the resin tablet is determined to be defective. Resin tablets determined to be defective are discharged to the outside by a discharge shutter. In this way, resin tablets that satisfy the reference weight condition are selected and supplied to the press unit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2019-202436 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology described in Patent Document 1, resin molding is performed using multiple resin tablets, so measurement errors of the resin tablets whose weights are measured individually may accumulate, resulting in a large error in the total weight of the multiple resin tablets.

[0006] In particular, in order to improve the precision of resin molded products, in a resin molding device that controls the position of a plunger based on the total weight of resin tablets used in resin molding, it is necessary to adjust the total weight of the resin tablets to a high degree of precision. However, the resin material supply mechanism described in Patent Document 1 is difficult to apply to such a resin molding device because it may result in a large error in the total weight of the resin tablets.

[0007] The present invention was made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a resin material supply mechanism, a resin molding device, and a method for manufacturing a resin molded product that are capable of measuring the total weight of resin tablets with high precision. [Means for solving the problem]

[0008] The problem to be solved by the present invention is as described above, and in order to solve this problem, a resin material supply mechanism according to the present invention comprises a delivery unit that sequentially delivers resin material; a total weight measuring unit that collectively measures the weight of the plurality of resin materials delivered by the delivery unit; a transfer unit that delivers the plurality of resin materials delivered by the delivery unit to a transfer mechanism that transports the resin materials to a molding die; and a transfer unit that transfers the resin material between the delivery unit, the total weight measuring unit, and the transfer unit. The moving unit is formed to correspond to the plurality of resin materials and includes a plurality of first placement sections on which the resin materials can be placed, and the total weight measuring unit is formed to correspond to the plurality of first placement sections and includes a plurality of support sections that can support the resin materials placed on the first placement sections from below, and a lifting unit that can lift and lower the plurality of support sections collectively. It is something.

[0009] A resin molding apparatus according to the present invention includes the resin material supply mechanism.

[0010] In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a chip volume measurement process for measuring the volume of a chip placed on a substrate, a resin volume measurement process for measuring the volume of a resin material, a plunger position calculation process for calculating the relationship between the resin filling rate of the cavity and the position of the plunger based on the measured volumes of the chip and the resin material, and a filling rate response control process for controlling operations related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate. [Effects of the Invention]

[0011] According to the present invention, the total weight of the resin tablets can be measured with high accuracy. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to an embodiment; [Figure 2] FIG. 2 is a front cross-sectional view showing the configuration of a resin molding module according to an embodiment. [Figure 3] 1A is a schematic plan view showing the configuration of a lower mold according to one embodiment as viewed from the mold surface side (above); FIG. 1B is a schematic bottom view showing the configuration of an upper mold according to one embodiment as viewed from the mold surface side (below); [Figure 4] (a) A schematic plan view showing a connecting groove that connects cull portions. (b) A schematic plan view showing an example in which cull portions are connected via a cavity. [Figure 5] (a) A front cross-sectional view showing how the cavity depth becomes shallower when clamped by the mold clamping mechanism, and (b) a front cross-sectional view showing how the cavity depth becomes deeper when resin is supplied by the plunger. [Figure 6] 1 is a flowchart showing an example of a method for manufacturing a resin molded product. [Figure 7] FIG. 10 is a diagram showing changes over time in clamp load, plunger position, and plunger load according to the first control mode. [Figure 8] 10 is a flowchart showing a specific example of filling rate-based control. [Figure 9] (a) is a front cross-sectional view showing the lower mold and the upper mold in a clamped state, (b) is a front cross-sectional view showing the lower mold and the upper mold in a state where the clamp load is reduced. [Figure 10] FIG. 10 is a diagram showing changes over time in clamp load, plunger position, and plunger load according to the second control mode. [Figure 11] FIG. 4 is a perspective view showing the configuration of a resin material supply mechanism. [Figure 12] FIG. 4 is a plan view showing the configuration of a resin material supply mechanism. [Figure 13] FIG. 2 is a front view showing the delivery unit, the individual weight measuring unit, the moving unit, and the chuck. [Figure 14] 3A and 3B are an enlarged perspective view and a partially enlarged side view showing a moving unit and a total weight measuring unit; [Figure 15] (a) A side view showing a state in which the support part is inserted into the groove part. (b) A front partial cross-sectional view showing a state in which the support part is inserted into the groove part. (c) A side view showing a state in which the resin tablet is lifted by the support part. (b) A front partial cross-sectional view showing a state in which the resin tablet is lifted by the support part. DETAILED DESCRIPTION OF THE INVENTION

[0013] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the figure will be defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0014] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 will be described with reference to Fig. 1. The resin molding apparatus 1 resin-encapsulates electronic elements such as semiconductor chips (hereinafter simply referred to as "chips 2a") to manufacture resin molded products. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

[0015] The resin molding apparatus 1 includes, as its components, a supply module 10, a resin molding module 20, and an unloading module 30. Each component is detachable and replaceable with respect to the other components.

[0016] <Supply Module 10> The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which a chip 2a is mounted, and a resin tablet T to the resin molding module 20. In this embodiment, a lead frame is used as the substrate 2, but various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can also be used. The supply module 10 mainly includes a frame sending unit 11, a frame measuring unit 12, a frame supply unit 13, a resin material supply mechanism 200, a loader 17, and a control unit 18.

[0017] The frame sending section 11 sends out the non-resin-sealed substrate 2 housed in an in-magazine unit (not shown) to the frame measuring section 12. The frame measuring section 12 measures the volume of the chip 2a attached to the substrate 2. The frame measuring section 12 is one embodiment of the chip volume measuring section of the present application. Details of the frame measuring section 12 will be described later. After measurement in the frame measuring section 12 is completed, the substrate 2 is sent out to the frame supplying section 13. The frame supplying section 13 receives the substrate 2 from the frame measuring section 12, aligns the received substrate 2 appropriately, and hands it over to the loader 17.

[0018] The resin material supply mechanism 200 supplies the resin tablets T to the loader 17, which will be described later. The resin material supply mechanism 200 can measure the weight of the resin tablets T. Details of the resin material supply mechanism 200 will be described later. The loader 17 is one embodiment of the conveying mechanism of the present application.

[0019] The loader 17 transports the substrate 2 and the resin tablet T received from the frame supply unit 13 and the resin material supply mechanism 200 to the resin molding module 20.

[0020] The control unit 18 controls the operation of each module of the resin molding apparatus 1. The control unit 18 is one embodiment of the calculation unit of the present application. The control unit 18 controls the operations of the supply module 10, the resin molding module 20, and the carry-out module 30. The control unit 18 can also be used to arbitrarily change (adjust) the operation of each module.

[0021] In this embodiment, an example is shown in which the control unit 18 is provided in the supply module 10, but the control unit 18 can also be provided in other modules. It is also possible to provide multiple control units 18. For example, it is possible to provide a control unit 18 for each module or device, and to control the operations of each module individually while linking them together.

[0022] <Resin molding module 20> The resin molding module 20 resin-seals the chip 2a mounted on the substrate 2. In this embodiment, two resin molding modules 20 are arranged side by side. By using the two resin molding modules 20 to resin-seal the substrate 2 in parallel, the manufacturing efficiency of resin molded products can be improved. The resin molding module 20 mainly comprises molding dies (lower die 110 and upper die 140) and a die clamping mechanism 190 (see FIG. 2).

[0023] The molding dies (lower die 110 and upper die 140) use molten resin material to resin-seal the chip 2a mounted on the substrate 2. The molding dies include a pair of upper and lower dies, namely, the lower die 110 and the upper die 140 (see FIG. 2, etc.). The molding dies are provided with a heating unit (not shown) such as a heater.

[0024] The mold clamping mechanism 190 (see FIG. 2) moves the lower mold 110 up and down to clamp or open the forming molds (lower mold 110 and upper mold 140).

[0025] <Exit module 30> The unloading module 30 receives and unloads the resin-sealed substrate 2 from the resin molding module 20. The unloading module 30 mainly includes an unloader 31 and a substrate accommodating section 32.

[0026] The unloader 31 holds the resin-sealed substrate 2 and carries it out to the substrate accommodation section 32. The substrate accommodation section 32 accommodates the resin-sealed substrate 2.

[0027] <Outline of Operation of Resin Molding Apparatus 1> Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be described with reference to FIGS.

[0028] In the supply module 10, the frame sending unit 11 sends out the substrate 2 stored in an in-magazine unit (not shown) to the frame measuring unit 12. The frame measuring unit 12 measures the volume of the chips 2a on the received substrate 2, and then sends the substrate 2 to the frame supply unit 13. The frame supply unit 13 aligns the received substrate 2 appropriately and hands it over to the loader 17.

[0029] Furthermore, the resin material supply mechanism 200 measures the total weight of the number of resin tablets T required for one resin molding in the resin molding module 20, and transfers them to the loader 17. The loader 17 transports the received substrate 2 and resin tablets T to the molding die of the resin molding module 20.

[0030] In the resin molding module 20, the mold clamping mechanism 190 clamps the molding die. Then, the resin tablet T is heated and melted by a heating section (not shown) of the molding die, and the substrate 2 is resin-sealed using the generated molten resin.

[0031] After the resin sealing is completed, the mold clamping mechanism 190 opens the molding die. Then, the resin-sealed substrate 2 is released from the mold. Thereafter, the unloader 31 carries the substrate 2 out of the molding die and stores it in the substrate storage section 32 of the carry-out module 30. At this time, unnecessary portions of the resin-molded substrate 2 (unnecessary resin such as culls and runners) are appropriately removed. In this way, the resin-sealed substrate 2 (resin molded product) is manufactured.

[0032] <Detailed Configuration of Resin Molded Module 20> Next, a more detailed description will be given of the configuration of the resin molding module 20. As shown in Fig. 2, the resin molding module 20 mainly includes a lower mold installation section 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold installation section 130, an upper mold 140, a disc spring 150, an upper mold cavity adjustment mechanism 160, an air vent opening / closing mechanism 170, a transfer mechanism 180, and a mold clamping mechanism 190.

[0033] <Lower mold installation section 100> 2 is a portion where a lower mold 110 is provided. The lower mold installation portion 100 mainly includes a lower mold movable base portion 101 and a lower mold attachment portion .

[0034] The lower mold movable base part 101 forms the lower part of the lower mold installation part 100. The lower mold attachment part 102 is a part where the lower mold 110 is attached. The lower mold attachment part 102 is provided on the upper part of the lower mold movable base part 101.

[0035] <Lower mold 110> The lower mold 110 shown in Figures 2, 3(a), and 9 forms the lower part of the molding die. The lower mold 110 mainly comprises a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114, and a lower mold elastic member 115. In the lower mold 110 of this embodiment, as shown in Figure 3(a), the pot block 112 is located in the center, and the lower mold cavity blocks 113 are arranged on the left and right of it, and the lower mold side blocks 111 are arranged further outside the lower mold cavity block 113.

[0036] The lower die side blocks 111 form the outer periphery of the lower die 110. The lower die side blocks 111 are provided on the upper surface of the lower die mounting portion .

[0037] The pot block 112 is a portion that accommodates the resin tablets T supplied from the supply module 10. The pot block 112 has a plurality of through holes (pots) formed therein for accommodating the resin tablets T. The pot block 112 is sandwiched between lower mold cavity blocks 113 on the left and right. The pot block 112 is provided on the upper surface of the lower mold mounting portion 102.

[0038] 3(a) illustrates a pot block 112 having two through holes (pots) formed therein for the sake of simplicity, but the number of pots is not limited to this. Any number of pots can be formed depending on the number of resin tablets T required for resin molding. For example, it is possible to form eight pots that can accommodate eight resin tablets T supplied from a resin material supply mechanism 200 (see FIG. 12, etc.) described later.

[0039] The lower die cavity block 113 is a portion on which the substrate 2 is placed. The lower die cavity block 113 is disposed between the lower die side block 111 and the pot block 112. The lower die cavity block 113 is disposed so as to be movable in the vertical direction relative to the lower die side block 111 and the pot block 112.

[0040] The lower die pillar 114 is a member that is disposed so as to extend downward from the lower die cavity block 113. The upper end of the lower die pillar 114 is fixed to the lower part of the lower die cavity block 113.

[0041] The lower mold elastic member 115 applies an upward force to the lower mold cavity block 113. The lower mold elastic member 115 is formed of, for example, a compression coil spring. The lower mold elastic member 115 is disposed between the lower mold cavity block 113 and the lower mold mounting portion 102. The biasing force of the lower mold elastic member 115 always applies an upward force to the lower mold cavity block 113.

[0042] <Lower die cavity adjustment mechanism 120> 2 adjusts the position of the lower die cavity block 113. The lower die cavity adjustment mechanism 120 mainly includes a lower die first wedge member 121, a lower die second wedge member 122, and a lower die wedge member driver 123.

[0043] The lower die first wedge member 121 and the lower die second wedge member 122 are a pair of members with tapered portions formed on the surfaces facing each other. The lower die second wedge member 122 is disposed above the lower die first wedge member 121. The lower die second wedge member 122 is disposed below the lower die pillar 114. The lower end of the lower die pillar 114 abuts against the lower die second wedge member 122, thereby restricting the downward movement of the lower die cavity block 113. This determines the position of the lower die cavity block 113.

[0044] The lower die wedge member driving unit 123 moves the lower die first wedge member 121 in the horizontal direction (left and right direction). The lower die wedge member driving unit 123 is formed by, for example, a servo motor or an air cylinder. The lower die wedge member driving unit 123 is connected to the lower die first wedge member 121 via an appropriate power transmission member. By driving the lower die wedge member driving unit 123, the lower die first wedge member 121 can be moved arbitrarily in the left and right direction.

[0045] The lower die cavity adjustment mechanism 120 configured in this manner can adjust the position of the lower die cavity block 113. Specifically, when the lower die wedge member drive unit 123 is driven to move the lower die first wedge member 121 in the left-right direction, the lower die second wedge member 122, which is in contact with the lower die first wedge member 121, is displaced up and down along the tapered portion. As the lower die second wedge member 122 is displaced up and down, the position at which the downward movement of the lower die pillar 114 is restricted is displaced, and thus the position of the lower die cavity block 113 can be adjusted.

[0046] <Upper mold installation section 130> 2 and 9 is a portion where an upper die 140 is provided. The upper die installation portion 130 mainly includes an upper die fixing base portion 131, an upper die attachment portion 132, and a heater plate 133.

[0047] The upper mold fixing base portion 131 forms the upper part of the upper mold installation portion 130. The upper mold mounting portion 132 is a portion to which the upper mold 140 is attached. The upper mold mounting portion 132 is formed by combining a plurality of members. The upper mold mounting portion 132 is provided at the lower part of the upper mold fixing base portion 131. A support portion 132a is provided on the outer periphery of the upper mold mounting portion 132 to support the upper mold 140 (upper mold base portion 141) described below from below. The heater plate 133 is for heating the upper mold 140. The heater plate 133 is provided on the bottom surface of the upper mold mounting portion 132.

[0048] <Upper mold 140> The upper mold 140 shown in Figures 2, 3(b), and 9 forms the upper part of the molding die. The upper mold 140 mainly comprises an upper mold base portion 141, upper mold side blocks 142, an upper mold cavity block 143, an upper mold support 145, and upper mold pillars 146. In this embodiment, as shown in Figure 3(b), a cull block 144 is located in the center, with upper mold cavity blocks 143 arranged on the left and right of it, and upper mold side blocks 142 arranged on the outer periphery of the upper mold cavity block 143 (excluding the cull block side).

[0049] The upper die base portion 141 is a member that supports the upper die side block 142, which will be described later. The upper die base portion 141 is formed in a plate shape with a predetermined thickness in the upper and lower directions. The outer periphery of the upper die base portion 141 is supported from below by the support portion 132a of the upper die mounting portion 132. This supports the upper die base portion 141 so that it can move in the vertical direction relative to the upper die installation portion 130.

[0050] The upper die side block 142 forms the side surface of the cavity C formed by the upper die 140. The upper die side block 142 is one embodiment of the side block of the present application. The upper die side block 142 is formed in a frame shape with an opening formed in a position corresponding to the resin molded product (cavity C). The upper die side block 142 is provided on the lower surface of the upper die base portion 141. An air vent groove 142a is formed in the upper die side block 142.

[0051] 2 is for discharging air from within the cavity C to the outside. The air vent groove 142a is formed at an appropriate position on the lower surface of the upper side block 142.

[0052] The upper mold cavity block 143 forms the upper surface of the cavity C formed by the upper mold 140. The upper mold cavity block 143 is one embodiment of the cavity block of the present application. The upper mold cavity block 143 is arranged inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142). The upper mold cavity block 143 is arranged so as to be movable relative to the upper mold side block 142 in the vertical direction.

[0053] The cull block 144 is disposed opposite the pot block 112 of the lower mold 110 and forms the side surface of the cavity C formed by the upper mold 140. A groove-like cull portion 144a and a runner portion 144b are formed on the lower surface of the cull block 144 to guide the resin material into the cavity C (see FIG. 3(b)). Note that, to facilitate understanding of the flow of resin, FIG. 2 schematically shows the through-hole (pot) of the pot block 112 communicating with the cavity C (described later) via the cull portion 144a and the runner portion 144b.

[0054] The upper die support 145 contacts the upper die installation part 130 to restrict upward movement of the upper die 140 and determine the position of the upper die 140. The upper die support 145 is fixed to the upper surface of the upper die base part 141. A plurality of upper die supports 145 are provided at appropriate positions on the upper surface of the upper die base part 141.

[0055] The upper die pillar 146 is a member arranged to extend upward from the upper die cavity block 143. The lower end of the upper die pillar 146 is fixed to the upper part of the upper die cavity block 143. The upper die pillar 146 is arranged to penetrate the upper die base portion 141.

[0056] 2 shows a state in which a release film F is attached to the lower surface of the upper mold 140 (the surface forming the cavity C).

[0057] <150 Disc Spring> The disc spring 150 applies a downward force to the upper die 140. The disc spring 150 is disposed between the lower surface of the upper die installation portion 130 (heater plate 133) and the upper surface of the upper die 140 (upper die base portion 141). The biasing force of the disc spring 150 always applies a force to the upper die 140 in a direction away from the upper die installation portion 130 (downward).

[0058] <Upper die cavity adjustment mechanism 160> The upper die cavity adjustment mechanism 160 adjusts the position of the upper die cavity block 143. The upper die cavity adjustment mechanism 160 includes an upper die cavity block holding member 161, an upper die cavity block drive unit 162, a restricting member 163, an upper die elastic member 164, an upper die first wedge-shaped member 165, an upper die second wedge-shaped member 166, and an upper die wedge-shaped member drive unit 167.

[0059] The upper mold cavity block holding member 161 holds the upper mold cavity block 143. The upper mold cavity block holding member 161 is formed in the shape of a hollow frame when viewed from the front. The upper mold cavity block holding member 161 is formed by combining multiple members (such as upper and lower plate-shaped members and multiple cylindrical members connecting the upper and lower plate-shaped members). The upper mold cavity block holding member 161 is arranged to penetrate the upper mold fixing base portion 131 from top to bottom. The upper mold cavity block holding member 161 is provided so as to be movable up and down relative to the upper mold fixing base portion 131. The upper ends of the upper mold pillars 146 are fixed to the lower surface of the upper mold cavity block holding member 161. This allows the upper mold cavity block 143 to be held by the upper mold pillars 146.

[0060] The upper mold cavity block driving unit 162 moves the upper mold cavity block holding member 161 in the vertical direction (up and down). The upper mold cavity block driving unit 162 is formed by, for example, a servo motor or an air cylinder. The upper mold cavity block driving unit 162 is provided above the upper mold cavity block holding member 161. By driving the upper mold cavity block driving unit 162, the upper mold cavity block holding member 161 (and therefore the upper mold cavity block 143) can be moved arbitrarily in the vertical direction relative to the upper mold installation unit 130.

[0061] The restricting member 163 restricts the movement of the upper cavity block holding member 161 by contacting the upper cavity block holding member 161. The restricting member 163 is formed by combining multiple members (plate-shaped members, etc.). The restricting member 163 includes an upper portion that straddles the upper cavity block holding member 161 from the left and right, and a central portion that is positioned inside the upper cavity block holding member 161. The central portion of the restricting member 163 is positioned so that it can contact the lower portion (bottom) of the upper cavity block holding member 161 from above. The restricting member 163 can restrict the upward movement of the upper cavity block holding member 161 by contacting the lower portion of the upper cavity block holding member 161 from above. This allows the depth of the cavity C to be determined.

[0062] The upper mold elastic member 164 applies an upward force to the regulating member 163. The upper mold elastic member 164 is formed of, for example, a compression coil spring. The upper mold elastic member 164 is disposed between the regulating member 163 and the upper mold attachment portion 132. The biasing force of the upper mold elastic member 164 always applies an upward force to the regulating member 163.

[0063] The upper die first wedge-shaped member 165 and the upper die second wedge-shaped member 166 are a pair of members with tapered portions formed on the surfaces facing each other. The upper die second wedge-shaped member 166 is disposed below the upper die first wedge-shaped member 165. The upper die first wedge-shaped member 165 and the upper die second wedge-shaped member 166 are disposed inside the upper die cavity block holding member 161. More specifically, the upper die first wedge-shaped member 165 and the upper die second wedge-shaped member 166 are disposed between the upper die fixed base portion 131 and the regulating member 163. The upper die second wedge-shaped member 166 is fixed to the upper surface of the regulating member 163.

[0064] The upper wedge member driving unit 167 moves the upper wedge member 165 in the horizontal direction (left and right direction). The upper wedge member driving unit 167 is formed by, for example, a servo motor or an air cylinder. The upper wedge member driving unit 167 is connected to the upper wedge member 165 via an appropriate power transmission member. By driving the upper wedge member driving unit 167, the upper wedge member driving unit 167 can be moved arbitrarily in the left and right direction.

[0065] The upper mold cavity adjustment mechanism 160 configured in this manner can adjust the position of the upper mold cavity block 143. Specifically, when the upper mold cavity block driver 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is created between the restricting member 163 and the lower part of the upper mold cavity block holding member 161. In other words, this gap allows the restricting member 163 to move up and down. In this state, when the upper mold wedge member driver 167 is driven to move the upper mold first wedge member 165 left and right, the upper mold second wedge member 166, which is in contact with the upper mold first wedge member 165, is displaced up and down along the tapered portion. Furthermore, the restricting member 163 is displaced up and down together with the upper mold second wedge member 166. After adjusting the restricting member 163 to a predetermined position, the upper mold cavity block driving unit 162 is driven again to move the upper mold cavity block holding member 161 upward until it comes into contact with the restricting member 163. By displacing the restricting member 163 up and down in this manner, the position at which the upward movement of the upper mold cavity block holding member 161 is restricted is displaced, and therefore the position of the upper mold cavity block 143 can be adjusted.

[0066] <Air vent opening and closing mechanism 170> 2 opens and closes the air vent groove 142a that connects the cavity C to the outside. The air vent opening and closing mechanism 170 mainly includes an air vent pin 171 and an air vent driver 172.

[0067] The air vent pin 171 is for closing the air vent groove 142a and is provided in a through-hole in the upper side block 142 that is in communication with the air vent groove 142a so as to be movable up and down.

[0068] The air vent drive unit 172 moves the air vent pin 171 in the up and down direction. The air vent drive unit 172 is formed by, for example, a servo motor or an air cylinder. The air vent drive unit 172 is connected to the air vent pin 171 via an appropriate power transmission member. By driving the air vent drive unit 172, the air vent pin 171 can be moved arbitrarily in the up and down direction. For example, by moving the air vent pin 171 downward, the air vent groove 142a can be closed.

[0069] <Transfer mechanism 180> The transfer mechanism 180 supplies the resin material to the cavity C. The transfer mechanism 180 mainly includes a transfer drive unit 181, a plunger 182, and a plunger load measurement unit 183.

[0070] The transfer drive unit 181 is a drive source that moves a plunger 182 (described later) in the vertical direction (up and down). The transfer drive unit 181 is formed by, for example, a servo motor or an air cylinder. The transfer drive unit 181 is provided on the lower mold movable base unit 101 below the pot block 112.

[0071] The plunger 182 injects the resin tablet T (resin material) accommodated in the pot block 112 and supplies it to the cavity C. The plunger 182 is arranged in the pot block 112 so as to be able to move up and down (raise and lower).

[0072] The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 is the force with which the transfer driving unit 181 presses the plunger 182. The plunger load measuring unit 183 is formed by, for example, a load cell. The plunger load measuring unit 183 is provided between the transfer driving unit 181 and the plunger 182.

[0073] In this embodiment, no elastic member or the like (pressure equalization mechanism) is disposed between the transfer driver 181 and the plunger 182 to equalize the force applied to the resin material by each plunger 182 (and thus the resin pressure in the cavity C). Therefore, the plunger 182 moves by an amount proportional to the output of the transfer driver 181. For example, when the plunger 182 is pushed up from below using an air cylinder having an extendable rod as the transfer driver 181, the plunger 182 also moves by an amount equal to the amount of movement of the rod of the transfer driver 181. Furthermore, for example, when the transfer driver 181 moves the plunger 182 via an appropriate speed reduction mechanism, the plunger 182 moves by an amount obtained by multiplying the output of the transfer driver 181 by the speed reduction ratio of the speed reduction mechanism.

[0074] <Shape of cull portion 144a> As described above, since the plunger 182 is configured to move by an amount proportional to the output of the transfer drive unit 181, when multiple plungers 182 are used to supply resin material to the cavity C, it is desirable to have a configuration that uniforms the resin pressure within the cavity C. In this embodiment, multiple plungers 182 (pots) supply resin material to a common cavity C, so that the resin pressure is uniform throughout the cavity C. Other methods for uniforming the resin pressure within the cavity C include, for example, forming a connecting groove 144c that connects the cull portions 144a as shown in FIG. 4(a), or, if there are multiple cavities C, forming a connecting groove 144d that connects the cavities C (supplying resin material from the multiple cull portions 144a to the common cavity C) as shown in FIG. 4(b). By connecting the cull portions 144a in this manner, it is possible to suppress variations in the pressure applied to the resin material due to variations in the plunger load of each plunger 182.

[0075] <Mold clamping mechanism 190> 2 raises the lower mold 110 and clamps the lower mold 110 and the upper mold 140 together. The mold clamping mechanism 190 is one embodiment of the clamping mechanism of the present application. The mold clamping mechanism 190 mainly includes a fixed platen 191, a support 192, a drive mechanism 193, and a clamp load measuring unit 194.

[0076] The fixed platen 191 is a part that is placed on the ground and supports other members. A lower mold 110 (lower mold installation part 100) is provided above the fixed platen 191 via a drive mechanism 193, which will be described later.

[0077] The support pillars 192 support the upper mold 140 (upper mold installation section 130). The support pillars 192 are provided so as to extend upward from the fixed platen 191. The upper mold fixing base section 131 of the upper mold installation section 130 is fixed to the top of the support pillars 192. As a result, the upper mold 140 (upper mold installation section 130) is positioned above the lower mold 110 (lower mold installation section 100).

[0078] The drive mechanism 193 moves the lower mold 110 (lower mold installation section 100) in the vertical direction (up and down). The drive mechanism 193 is formed by a drive source such as a servo motor and an appropriate power transmission mechanism. The drive mechanism 193 is disposed between the fixed platen 191 and the lower mold installation section 100. By driving the drive mechanism 193, the lower mold installation section 100 can be moved (raised and lowered) in the vertical direction as desired. For example, the drive mechanism 193 can raise the lower mold 110 toward the upper mold 140 to close the mold. The drive mechanism 193 can also lower the lower mold 110 away from the upper mold 140 to open the mold.

[0079] The clamp load measuring unit 194 measures the force (clamp load) applied when the lower mold 110 and the upper mold 140 are clamped together by the mold clamping mechanism 190. The clamp load measuring unit 194 is formed by, for example, a load cell or a strain gauge. The clamp load measuring unit 194 is provided on the support 192. The clamp load measuring unit 194 can measure the clamp load based on the load applied to the support 192.

[0080] 2 shows a state in which the lower mold 110 and the upper mold 140 are clamped together after the substrate 2 and the resin tablet T have been transported to the molding die.

[0081] <Outline of manufacturing method for resin molded products> A method for manufacturing a resin molded product using the resin molding apparatus 1 configured as described above will be described below.

[0082] In this embodiment, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin) when resin molding is performed in resin molding module 20. To help understand this control, first, factors that cause variations in the dimensions of products in resin molding apparatus 1 will be explained using FIG.

[0083] 5(a), when the mold clamping mechanism 190 raises the lower mold 110 and clamps the lower mold 110 and the upper mold 140, the upper mold side block 142 of the upper mold 140 comes into contact with the lower mold 110. Therefore, the clamping load from the mold clamping mechanism 190 is mainly applied to the upper mold side block 142. When the clamping load is applied to the upper mold side block 142, the upper mold side block 142 is compressed vertically and deforms slightly, which may cause the depth (vertical thickness) of the cavity C to become shallower.

[0084] 5(b), when resin is supplied into cavity C by plunger 182 of transfer mechanism 180, pressure from the resin material in cavity C acts upward on upper die cavity block 143. As a result, upper die cavity block 143 is pushed upward and moves or deforms slightly, which may increase the depth of cavity C.

[0085] In this way, when resin molding is performed using the resin molding apparatus 1, the depth of the cavity C may change depending on the operation of each part, so by suppressing this change, it is possible to improve the dimensional accuracy of the resin molded product. Below, we will explain a manufacturing method for a resin molded product (a control mode of the clamp load and plunger load) that can improve such dimensional accuracy.

[0086] 6, the volumes of the resin tablet T and the chips 2a on the substrate 2 are measured. A specific description will be given below.

[0087] The volume of the resin tablets T is calculated based on the total weight of the resin tablets T measured in the resin material supply mechanism 200 of the supply module 10 as described above. Specifically, the total weight measurement unit 250 of the resin material supply mechanism 200, which will be described later, measures the total weight of the number of resin tablets T required for one resin molding in the resin molding module 20. The volume of the resin tablets T is calculated from the weight of the resin tablets T measured by the total weight measurement unit 250 and the specific gravity of the resin tablets T.

[0088] The volume of the chips 2a on the substrate 2 is measured in the frame measurement unit 12 of the supply module 10 as described above. The frame measurement unit 12 can measure the volume of the chips 2a on the substrate 2 using any measuring device. An example of the frame measurement unit 12 is a volume meter that measures the volume of the chips 2a on the substrate 2. The volume meter is a laser volume meter that measures the shape (and therefore the volume) of the chips 2a by using laser light to detect the distance to the chips 2a on the substrate 2. Note that the method for measuring the volume of the chips 2a is not particularly limited, and various other devices can be used for measurement. For example, various types of three-dimensional scanners can be used.

[0089] 6, the position of the plunger 182 at a predetermined resin filling rate in the cavity C is calculated. This will be explained in detail below.

[0090] The control unit 18 calculates the capacity of the cavity C based on the pre-stored dimensions of each part (upper die side block 142, upper die cavity block 143, pot block 112, cull block 144, etc.) and the vertical position of the upper die cavity block 143. The vertical position of the upper die cavity block 143 can be determined based on the drive amount of the upper die wedge-shaped member drive unit 167, etc. The control unit 18 can calculate what percentage of the capacity of the cavity C has been filled with molten resin material (resin filling rate) at what position the plunger 182 has risen, based on the calculated capacity of the cavity C and the volumes of the resin tablet T and tip 2a measured in step S10.

[0091] In this embodiment, as shown in FIG. 5, the control unit 18 calculates the positions of the plunger 182 where the resin filling rate of the cavity C is 0%, 25%, 50%, 75%, and 100% (hereinafter referred to as positions P0, P25, P50, P75, and P100, respectively).

[0092] Strictly speaking, when the plunger 182 is at a position lower than position P0, the resin filling rate of cavity C will be 0% regardless of the position of plunger 182. However, in this embodiment, the position at which plunger 182 rises and resin material begins to be supplied into cavity C is defined as position P0 where the resin filling rate is 0%.

[0093] 6, the substrate 2 and the resin tablet T are each transported to the molding die of the resin molding module 20. Specifically, the substrate 2 is placed on the lower die 110, and the resin tablet T is placed in the pot of the pot block 112.

[0094] Next, in step S40 of Fig. 6, the lower mold 110 and the upper mold 140 are clamped together by the mold clamping mechanism 190. Specifically, the mold clamping mechanism 190 raises the lower mold 110, and the lower mold 110 contacts the upper mold 140 from below. This closes the cavity C. At this time, as shown in Fig. 9(a), the upper mold 140 rises to a position where the upper mold support 145 contacts the upper mold installation section 130 (heater plate 133).

[0095] Hereinafter, using the graphs shown in Figure 7, we will also explain an example of the change over time in the clamp load (units, for example, tonf, N, etc.), plunger position (upper and lower positions of plunger 182 with the initial position being 0, units, for example, mm, etc.), and plunger load (units, for example, tonf, N, etc.) that accompanies the operation of the resin molding device 1.

[0096] In step S40, lower mold 110 and upper mold 140 are clamped together, and as a result, the clamp load increases to CL1 at time t1 in FIG.

[0097] Next, in step S50 in FIG. 6, the plunger 182 starts to rise (time t2 in FIG. 7).

[0098] 6, the filling rate-based control is executed. The filling rate-based control controls the operation of the resin molding apparatus 1 based on the resin filling rate of the cavity C.

[0099] An example of the filling rate-dependent control is shown in Fig. 8. Fig. 8 shows an example of controlling the clamp load and the moving speed of the plunger 182 based on the resin filling rate.

[0100] Specifically, when the position of plunger 182 reaches position P50 (the position where the resin filling rate is 50%) (YES in step S61), the clamp load is increased from CL1 to CL2 (step S62). In Fig. 7, plunger 182 reaches position P50 at time t3, and the clamp load is increased from CL1 to CL2 from time t3 to time t4.

[0101] Furthermore, when the position of plunger 182 reaches position P50 (the position where the resin filling rate is 50%) (YES in step S61), the movement speed of plunger 182 is adjusted (step S62). In Fig. 7, the change over time of plunger 182 (the slope of the plunger position graph) becomes gentle at time t3. That is, the movement speed of plunger 182 is adjusted to be slower.

[0102] Next, when the position of plunger 182 reaches position P100 (the position where the resin filling rate is 100%) (YES in step S63), plunger 182 is stopped (step S64). In Fig. 7, plunger 182 reaches position P100 at time t5, and the movement (rising) of plunger 182 is stopped.

[0103] 8 shows an example in which the clamp load and the movement speed of plunger 182 are adjusted only once when the resin filling rate reaches 50%, but the number of adjustments is not limited to this and adjustments can be made multiple times. For example, the clamp load, etc. can be adjusted each time the resin filling rate reaches 25%, 50%, and 75% (when plunger 182 reaches positions P25, P50, and P75). The resin filling rate that triggers this adjustment is not limited to the above example and can be set arbitrarily.

[0104] In this way, by gradually increasing the clamp load according to the resin filling rate, it is possible to suppress changes in the depth of cavity C. Specifically, as the resin filling rate increases, the force with which the resin material pushes upper mold cavity block 143 upward increases, and therefore the depth of cavity C becomes deeper (see FIG. 5(b)). Therefore, by increasing the clamp load according to the resin filling rate as described above, the depth of cavity C becomes shallower (see FIG. 5(a)), which offsets the tendency of changes in the depth of cavity C (increases and decreases in depth), and it is possible to suppress changes in the depth of cavity C.

[0105] Furthermore, by adjusting the movement speed of plunger 182 according to the resin filling rate, it is possible to prevent the resin material from being left unfilled. Specifically, the resin material flowing inside cavity C flows through portions that are relatively easy to flow (for example, portions of substrate 2 where chip 2a is not provided) and portions that are relatively difficult to flow (for example, portions of substrate 2 where chip 2a is provided), so it is sometimes desirable to adjust the flow speed to improve circulation of the resin. Therefore, by adjusting the movement speed of plunger 182 according to the resin filling rate as described above, it is possible to improve circulation of the resin.

[0106] Furthermore, in this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the values ​​obtained by actually measuring the volumes of the resin tablet T and the chip 2a of the substrate 2, so that the resin filling rate of the cavity C can be accurately determined regardless of variations in the volume of each resin tablet T. This makes it possible to more accurately suppress changes in the depth of the cavity C.

[0107] The appropriate clamp load value and the appropriate moving speed of the plunger 182 for the resin filling rate can be determined in advance by experiment, numerical analysis, or the like.

[0108] Next, cavity control is executed in step S70 of Fig. 6. Cavity control is a process of adjusting the position of the upper mold cavity block 143 before pressure adjustment control, which will be described later.

[0109] Specifically, in a state in which the lower mold 110 and the upper mold 140 are clamped together as shown in FIG. 9(a), the clamp load is reduced as shown in FIG. 9(b). At this time, the upper mold cavity block driver 162 presses the upper mold cavity block holding member 161 downward while the clamp load is reduced. In FIG. 7, the clamp load is reduced from CL2 to CLdown at time t6. At this time, there is a risk that the depth of cavity C will increase due to the reduction in clamp load, but because the upper mold cavity block driver 162 presses the upper mold cavity block holding member 161 downward, it is possible to prevent cavity C from becoming deeper.

[0110] When the clamp load decreases, as shown in Figure 9(b), the disc spring 150 causes the upper mold 140 to move relatively away from the upper mold installation portion 130, forming a small gap (see part A in Figure 9(b)) between the regulating member 163 and the upper mold cavity block holding member 161.

[0111] The formation of such a gap ensures a range of motion for the upper die second wedge-shaped member 166. In other words, the upper die second wedge-shaped member 166 can move up and down. By driving the upper die wedge-shaped member driving unit 167 in this state, the position of the upper die cavity block 143 can be adjusted as desired.

[0112] 7, for example, the upper mold cavity block 143 is slightly lowered. This allows the depth of the cavity C to be made slightly shallower, making it easier to apply high pressure to the resin material in the cavity C in the pressure adjustment control (step S80), first final adjustment control (step S90), and second final adjustment control (step S100), which will be described later.

[0113] Next, pressure adjustment control is executed in step S80 of Fig. 6. Pressure adjustment control is to increase the pressure applied to the resin material in the cavity C by adjusting the clamp load.

[0114] Specifically, as shown in FIG. 7, the clamp load is increased from CLdown to CLM (a preset clamp load) (time t7). At this time, the plunger 182 is stopped. Therefore, the resin material filled in the cavity C supports the cavity C as it tries to shallower as the clamp load increases, thereby suppressing changes in the depth of the cavity C. This also increases the pressure applied to the resin material in the cavity C, suppressing the occurrence of resin insufficiency, and improving the accuracy of the resin molded product. Note that FIG. 7 shows how the plunger load increases as the pressure in the cavity C increases.

[0115] Next, a first final adjustment control is executed in step S90 of Fig. 6. The first final adjustment control is a control for adjusting the clamp load to a preset final clamp load.

[0116] Specifically, as shown in Fig. 7, the clamp load is increased from CLM to CLf (final clamp load) (time t8). At this time, the plunger 182 is stopped. Therefore, the resin material filled in the cavity C supports the cavity C as it tries to become shallower as the clamp load increases, thereby suppressing changes in the depth of the cavity C. This also increases the pressure applied to the resin material in the cavity C, suppressing occurrences such as insufficient resin filling, and improving the precision of the resin molded product.

[0117] Next, second final adjustment control is executed in step S100 of Fig. 6. The second final adjustment control is a control for adjusting the plunger load to a preset final plunger load.

[0118] Specifically, as shown in Fig. 7, the plunger 182 is moved so that the plunger load becomes Trf (time t9). In the example shown in Fig. 7, the plunger load at the time when the first final adjustment control is completed (time t8) is less than Trf, so the plunger 182 is raised to increase the plunger load to Trf.

[0119] For example, if the plunger load at the time when the first final adjustment control is completed (time t8) is greater than Trf, the plunger 182 is lowered in step S100 to reduce the plunger load to Trf. If the plunger load at the time when the first final adjustment control is completed (time t8) is Trf, the plunger 182 is not moved in step S100, and the plunger load is maintained at Trf. In this way, by adjusting the final plunger load to a preset value, the accuracy of the resin molded product can be improved.

[0120] Note that while moving the plunger 182 as in the second final adjustment control can efficiently adjust the pressure applied to the resin material in the cavity C, it also changes the amount of resin material in the cavity C, which can easily change the depth of the cavity C. Therefore, in this embodiment, the clamping force is increased in advance to the final clamping force in the first final adjustment control, and the plunger load is increased accordingly to a value close to the final plunger load. This makes it possible to keep the amount of movement of the plunger 182 in the second final adjustment control small, thereby suppressing changes in the depth of the cavity C.

[0121] Next, in step S110 of FIG. 6, the clamp load and plunger load are maintained while waiting until the curing time (hardening time) has elapsed.

[0122] Next, in step S120 of FIG. 6, plunger 182 is lowered to reduce the plunger load, and lower mold 110 and upper mold 140 are opened by mold clamping mechanism 190.

[0123] 6, the substrate 2 for which resin molding (resin sealing) has been completed is carried out from the molding die. The carried-out substrate 2 is transported to the carry-out module 30.

[0124] As described above, by appropriately controlling the clamp load and plunger load, it is possible to suppress changes in the depth of the cavity C and improve the dimensional accuracy of the resin molded product.

[0125] <Another example of control mode> Another example of the method for manufacturing a resin molded product (aspects of controlling the clamp load and plunger load) will be described below.

[0126] The example shown in Figure 10 shows another example of the control mode of the clamp load and the like shown in Figure 7. For convenience, the control mode shown in Figure 7 will be referred to as the first control mode, and the control mode shown in Figure 10 will be referred to as the second control mode. The second control mode shown in Figure 10 differs from the first control mode of Figure 7 mainly in the control content from time t6 to time t7 (steps S70 and S80 in Figure 6). This difference will be explained below.

[0127] In the first control mode, in the cavity control in step S70 of Figure 6, the position of the upper mold cavity block 143 is adjusted so that the depth of cavity C becomes shallower, but in the second control mode, the position of the upper mold cavity block 143 is adjusted so that the depth of cavity C becomes deeper.

[0128] That is, in the second control mode, in step S70, the clamp load is reduced to CLdown, and then the upper wedge member driving unit 167 is driven to slightly lift the upper cavity block 143. This causes the depth of the cavity C to become slightly deeper.

[0129] Next, pressure adjustment control is executed in step S80 of Fig. 6. Here, in the second control mode, as described above, the depth of cavity C is adjusted to be deeper in step S70. When the depth of cavity C is deepened in this way, the volume of cavity C also changes (increases), and the resin filling rate, which was 100%, decreases and falls below 100%.

[0130] Therefore, at this point, the control unit 18 again calculates the relationship between the resin filling rate of the cavity C and the position of the plunger 182. The calculation method is the same as that in step S20.

[0131] Next, the clamp load is increased from CLdown to CLM2 (time t7). At this time, because the resin filling rate is below 100%, the plunger 182 is raised to supply the resin material into the cavity C, while the clamp load CL is increased in stages. That is, similar to the above-described filling rate-based control (step S60), the clamp load is increased in stages when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. At this time, it is also possible to adjust the moving speed of the plunger 182. In the example shown in FIG. 10, the clamp load is increased in two stages, CLM1 and CLM2.

[0132] In this way, in the pressure adjustment control (step S80), as in the above-described filling rate-dependent control (step S60), the clamp load is increased stepwise in accordance with the resin filling rate, thereby suppressing changes in the depth of the cavity C. However, it is also possible to configure the pressure adjustment control so as not to perform the above-described filling rate-dependent control.

[0133] Furthermore, in the above-described filling rate-based control (step S60), an example has been shown in which the clamp load and the movement speed of plunger 182 are adjusted according to the resin filling rate. However, as another example, it is also possible to control the operation of air vent opening / closing mechanism 170 (see FIG. 2) according to the resin filling rate. For example, when the resin filling rate reaches a predetermined value (when plunger 182 reaches a position corresponding to the predetermined resin filling rate), air vent pin 171 can be lowered to close air vent groove 142a. This allows the opening and closing of air vent groove 142a to be accurately controlled according to the resin filling rate.

[0134] Furthermore, in the above-mentioned filling rate-dependent control (step S60), an example was shown in which each part was controlled based on the position of the plunger 182 corresponding to each resin filling rate (0%, 25%, 50%, 75% and 100%), but the control method is not limited to this, and it is also possible to perform control based on, for example, other positions using these positions as a reference.

[0135] For example, when the plunger 182 is raised (when the resin material is supplied to the cavity C), the position P0 of the plunger 182 where the resin filling rate is 0% is used as a reference, and when the plunger 182 reaches a position a predetermined distance (for example, 5 mm) below the position P0, it is possible to perform controls such as adjusting the movement speed of the plunger 182 or closing the air vent groove 142a.

[0136] In this way, by using position P0 as a reference and performing control when plunger 182 reaches a position below that, it is possible to execute control based on the position of plunger 182 before resin material is supplied to cavity C. This makes it possible to control each part even at timing (timing that does not depend on the resin filling rate), such as immediately before or at the same time that resin material starts to be supplied to cavity C.

[0137] <Resin material supply mechanism 200> The following describes the configuration of the resin material supply mechanism 200. The resin material supply mechanism 200 of this embodiment can measure with high accuracy the total weight of the resin tablets T, which is used to calculate the volume of the resin tablets T. As shown in Figures 11 and 12, the resin material supply mechanism 200 mainly includes a sending unit 210, an individual weight measuring unit 220, a moving unit 230, a chuck 240, a total weight measuring unit 250, a delivery unit 260, and an extrusion mechanism 270.

[0138] <Transmission unit 210> The delivery unit 210 delivers the cylindrical resin tablets T sequentially to the individual weight measuring unit 220, which will be described later. The delivery unit 210 can deliver the resin tablets T stored inside to the right while aligning them in a row.

[0139] <Individual weight measurement section 220> 11 is for individually measuring the weight of the resin tablet T. The individual weight measuring unit 220 is disposed to the right of the sending unit 210. The individual weight measuring unit 220 mainly includes a main body unit 221 and a weight detection unit 222.

[0140] The main body 221 is a portion on which the resin tablet T is placed. The main body 221 is formed in a substantially rectangular parallelepiped shape. The main body 221 mainly includes a placement portion 221a.

[0141] The mounting portion 221a is formed in a groove shape by recessing the upper surface of the main body portion 221 downward. The mounting portion 221a is formed so as to extend in the left-right direction. The mounting portion 221a is formed in a V-shape in a side cross section. A cylindrical resin tablet T with its axis facing left and right can be placed on the mounting portion 221a. The mounting portion 221a, which is formed in a V-shape in a side cross section, can prevent the resin tablet T placed on the mounting portion 221a from rolling.

[0142] The weight detection unit 222 measures the weight of the resin tablet T placed on the main body 221. The weight detection unit 222 is arranged so as to support the main body 221 from below. The weight detection unit 222 can measure the load applied to the main body 221. For example, a load cell can be used as the weight detection unit 222. Note that the weight detection unit 222 is not limited to a load cell, and various devices capable of measuring weight can be used, such as a weight sensor using a piezoelectric element or a capacitance type weight sensor.

[0143] Furthermore, the individual weight measuring unit 220 is configured to be able to discharge the resin tablet T whose weight has been measured to the outside of the resin material supply mechanism 200, as shown in FIG. 13, when the measurement result of the weight of the resin tablet T exceeds a preset range. When the measurement result of the weight of the resin tablet T exceeds the preset range, for example, the weight of the resin tablet T exceeds the allowable error range compared to the target value, or the weight of the resin tablet T exceeds the allowable error range. In this case, the resin tablet T can be determined to be a defective product. In this way, by discharging the resin tablet T that is considered to be a defective product, resin molding can be performed using a resin tablet T of an appropriate weight, and the accuracy of the resin molded product can be improved.

[0144] Various mechanisms can be employed as the mechanism for discharging the resin tablets T. For example, a mechanism can be employed in which an openable / closable shutter is provided on the bottom surface of the main body 221 and the resin tablets T are discharged downward via the shutter, or a mechanism can be employed in which the main body 221 is rotated to drop and discharge the resin tablets T.

[0145] <Moving unit 230> The moving section 230 shown in Figs. 11 to 14 moves the resin tablets T between the delivery section 210, a total weight measuring section 250 (described later), and a delivery section 260 (described later). The moving section 230 is formed in a rectangular parallelepiped shape that is long in the front-to-rear direction. The moving section 230 is disposed to the right of the delivery section 210 and the individual weight measuring section 220. The moving section 230 mainly includes a first placement section 231, a groove section 232, and a first roll prevention section 233.

[0146] The first placement portion 231 shown in FIG. 14 is formed in a groove shape by recessing the upper surface of the moving portion 230 downward. The first placement portion 231 is formed so as to extend from the left end to the right end of the moving portion 230. The first placement portion 231 is formed in a V-shape in a side cross section. A cylindrical resin tablet T with its axis oriented left and right can be placed on the first placement portion 231. The first placement portion 231 formed in a V-shape in a side cross section can prevent the resin tablet T placed on the first placement portion 231 from rolling. In addition, the first placement portion 231 can position the resin tablet T. This makes it possible to uniquely determine the position of the core of the resin tablet T, and to prevent problems (e.g., collision between the resin tablet T and the side surface of the storage portion 261) when the extrusion mechanism 270 described later transfers the resin tablet T to the transfer portion 260. A plurality of first placement portions 231 are formed at regular intervals along the longitudinal direction of the moving portion 230. In this embodiment, as shown in Figure 11 etc., the moving section 230 is illustrated as having eight first placement sections 231 formed thereon, but the present invention is not limited to this, and the number of first placement sections 231 can be changed as desired.

[0147] 14 is formed in a groove shape by further recessing the bottom of the first placement part 231. The groove part 232 is formed so as to extend from the left end to the right end of the moving part 230.

[0148] The first rolling prevention part 233 is for preventing the resin tablet T placed on the first placing part 231 from rolling. The first rolling prevention part 233 is formed in a rectangular flat plate shape. The first rolling prevention part 233 is fixed to the upper surface of the moving part 230. The first rolling prevention part 233 is arranged on both the front and rear sides of the first placing part 231. By arranging the first rolling prevention part 233, it is possible to prevent the resin tablet T placed on the first placing part 231 from rolling back and forth over the first placing part 231.

[0149] The moving unit 230 can move back and forth linearly in the front-rear direction by an appropriate moving mechanism (for example, a rail that guides the moving unit 230 so that it can move in the front-rear direction, a servo motor that moves the moving unit 230 along the rail to any position, etc.). The moving unit 230 can move in the front-rear direction from the right side of the sending unit 210 (individual weight measuring unit 220) to the left side of the delivery unit 260 described below. In other words, the moving unit 230 can move on a movement path along a direction (front-rear direction) perpendicular to the movement direction (left-right direction) of the resin tablet T sent out from the sending unit 210.

[0150] <Chuck 240> 11 and 13 are used to transfer the resin tablet T. A pair of chucks 240 is provided, one on the left and one on the right. One chuck 240 can sandwich and hold the resin tablet T sent out from the sending unit 210, and place it on the placement unit 221a of the individual weight measuring unit 220. The other chuck 240 can sandwich and hold the resin tablet T placed on the individual weight measuring unit 220, and place it on the first placement unit 231 of the moving unit 230.

[0151] <Total weight measuring unit 250> 11, 12, and 14 measures the weight of a plurality of resin tablets T placed on the moving part 230 all at once. The total weight measuring part 250 is disposed to the right of the moving part 230 (on the opposite side of the moving part 230 from the individual weight measuring part 220). The total weight measuring part 250 mainly includes a support part 251, a second anti-rolling part 252, a connecting part 253, a weight detecting part 254, and a moving part 255.

[0152] The support portion 251 supports the resin tablet T from below. The support portion 251 is formed in a rectangular prism shape with its longitudinal direction facing the left-right direction. The support portion 251 is provided so as to protrude leftward from the left side surface of the connecting portion 253, which will be described later. The support portion 251 mainly includes a second placement portion 251a.

[0153] The second placement portion 251a is formed in a groove shape by recessing the upper surface of the support portion 251 downward. The second placement portion 251a is formed so as to extend along the longitudinal direction of the support portion 251. The second placement portion 251a is formed in a V-shape in a side cross-sectional view.

[0154] The support parts 251 are arranged in a line in the front and rear direction so as to correspond to the first placement parts 231 of the moving part 230. In this embodiment, eight support parts 251 are arranged so as to correspond to the eight first placement parts 231. The support parts 251 are arranged such that the intervals between them are the same as the intervals between the first placement parts 231.

[0155] The second rolling prevention portion 252 is intended to prevent the resin tablet T supported by the support portion 251 from rolling. The second rolling prevention portion 252 is formed in a cylindrical shape with its longitudinal direction facing the left-right direction. The second rolling prevention portion 252 is provided so as to protrude leftward from the left side surface of the connecting portion 253, which will be described later. The second rolling prevention portions 252 are arranged so as to correspond to the multiple support portions 251, respectively. A pair of second rolling prevention portions 252 are arranged in the front and rear above the support portion 251.

[0156] The connecting portion 253 connects the plurality of support portions 251 and the second anti-rolling portion 252. The connecting portion 253 is formed in a rectangular parallelepiped shape that is long in the front-rear direction. The support portion 251 and the second anti-rolling portion 252 are fixed to the left side surface of the connecting portion 253.

[0157] The weight detection unit 254 shown in Figures 11, 12, and 15 measures the weight of the resin tablet T supported by the support unit 251. The weight detection unit 254 is fixed to the right side surface of the connecting unit 253. The weight detection unit 254 can measure the load applied to the connecting unit 253. For example, a load cell can be used as the weight detection unit 254. Note that the weight detection unit 254 is not limited to a load cell, and various devices capable of measuring weight can be used, such as a weight sensor using a piezoelectric element or a capacitance type weight sensor.

[0158] The moving unit 255 moves the connecting unit 253 in the vertical and horizontal directions. The moving unit 255 is one embodiment of the lifting unit of the present application. The moving unit 255 is connected to the connecting unit 253 via the weight detection unit 254. The moving unit 255 can move in the vertical and horizontal directions by an appropriate moving mechanism (for example, a rail that guides the moving unit 255 so that it can move in the vertical and horizontal directions, a servo motor that moves the moving unit 255 along the rail to an arbitrary position, etc.).

[0159] <Delivery Department 260> The delivery section 260 shown in FIGS. 11 and 12 delivers the resin tablets T delivered by the delivery section 210 to the loader 17. The delivery section 260 is formed in a rectangular parallelepiped shape that is long in the front-to-rear direction. The delivery section 260 is arranged together with the total weight measurement section 250 so as to be aligned front-to-rear along the movement path of the movement section 230. Specifically, the delivery section 260 is arranged to the right of the movement section 230 and behind the total weight measurement section 250. As a result, the total weight measurement section 250 and the delivery section 260 are arranged so as to be aligned along the movement path of the movement section 230 that moves back and forth. The delivery section 260 mainly includes a storage section 261 and a rotation shaft 262.

[0160] The storage section 261 is a portion that stores the resin tablet T. The storage section 261 is formed in a concave shape that opens to the left side surface of the delivery section 260. A plurality of storage sections 261 are arranged in a line in the front and rear direction to correspond to the first placement sections 231 of the moving section 230. In this embodiment, eight storage sections 261 are formed to correspond to the eight first placement sections 231. The spacing between the multiple storage sections 261 is formed to be the same as the spacing between the multiple first placement sections 231.

[0161] The rotating shaft 262 rotatably supports the delivery unit 260. The rotating shaft 262 is provided at both the front and rear ends of the delivery unit 260. The delivery unit 260 can rotate about the rotating shaft 262 by the power of a drive source (air cylinder or the like) not shown.

[0162] The delivery unit 260 can move linearly back and forth in the vertical direction by an appropriate movement mechanism (for example, a rail that guides the delivery unit 260 so that it can move in the vertical direction, a servo motor that moves the delivery unit 260 to an arbitrary position along the rail, etc.). When the delivery unit 260 moves upward, it can deliver the resin tablet T stored in the storage unit 261 to the loader 17.

[0163] <Extrusion mechanism 270> The pushing mechanism 270 pushes out the resin tablet T placed on the moving part 230 and delivers it to the delivery part 260. The pushing mechanism 270 is disposed on the left side of the moving part 230 (on the opposite side of the delivery part 260 across the moving part 230). The pushing mechanism 270 mainly includes a pushing part 271 and a support part 272.

[0164] The extrusion section 271 is a section that extrudes the resin tablet T. The extrusion section 271 is formed in the shape of a rectangular flat plate. The extrusion section 271 is arranged so that the plate surface is approximately horizontal. The front-rear width of the extrusion section 271 is formed so as to cover the entirety of the multiple (eight in this embodiment) first placement sections 231 formed in the moving section 230.

[0165] Although the extrusion mechanism 270 of this embodiment is configured to extrude the resin tablets T using the extrusion unit 271 formed in a flat plate, the present invention is not limited to this configuration, and various other configurations can be adopted. For example, the extrusion unit 271 can be a cylindrical member with its longitudinal direction oriented in the left-right direction. By arranging multiple cylindrical members in a row in front and behind so as to correspond to the multiple first placement units 231, the resin tablets T placed on the first placement units 231 can be extruded all at once.

[0166] The support portion 272 is a portion that supports the push-out portion 271. The support portion 272 is formed in a rectangular plate shape with its longitudinal direction facing the front-rear direction. The left end portion of the push-out portion 271 is fixed to the right side surface of the support portion 272.

[0167] The push-out mechanism 270 can be moved left and right by an appropriate movement mechanism (for example, a rail that guides the support part 272 so that it can move left and right, an air cylinder that moves the support part 272 along the rail, etc.).

[0168] <Supply mode of resin tablet T> The following describes how the resin tablets T are supplied to the loader 17 using the resin material supply mechanism 200 configured as described above.

[0169] 12, the plurality of resin tablets T accommodated in the delivery section 210 move toward the right end of the delivery section 210 while being aligned in a row. The resin tablets T that have reached the right end of the delivery section 210 are placed in the individual weight measuring section 220 by the chuck 240. The weight of the resin tablets T placed in the individual weight measuring section 220 is measured by the weight detecting section 222. In this way, the weight of a single resin tablet T delivered from the delivery section 210 can be measured by the weight detecting section 222.

[0170] If the weight of the resin tablet T measured by the weight detection unit 222 exceeds a preset range, the resin tablet T is considered to be a defective product and is therefore discharged from the individual weight measurement unit 220. Resin tablets T whose weight does not exceed the preset range are placed on the first placement unit 231 of the moving unit 230 by the chuck 240.

[0171] By placing the resin tablets T whose weights have been measured in the individual weight measuring unit 220 on the moving unit 230 while moving the moving unit 230 back and forth as appropriate, the resin tablets T can be placed on each first placing unit 231, as shown in Fig. 12. The number of resin tablets T required for one resin molding in the resin molding module 20 is placed on the moving unit 230. At this time, as shown in Fig. 13, the resin tablets T placed on the first placing unit 231 are prevented from rolling by the inclined surface of the first placing unit 231 and first rolling prevention units 233 provided in front and behind the first placing unit 231.

[0172] After the resin tablets T are placed on the first placement portions 231 of the moving portion 230, the total weight measuring portion 250 moves to the left as shown in FIGS. 15(a) and 15(b). As a result, the plurality of support portions 251 provided on the total weight measuring portion 250 are inserted into the groove portions 232 of the moving portion 230 from the right. As a result, the support portions 251 are positioned below each resin tablet T. At the same time, the second roll prevention portions 252 of the total weight measuring portion 250 are positioned above each resin tablet T on the left and right sides, respectively.

[0173] In this state, as shown in Figures 15(c) and 15(d), the total weight measuring unit 250 moves upward. As a result, each support part 251 of the total weight measuring unit 250 lifts the plurality of resin tablets T upward all at once. At this time, the resin tablets T are prevented from rolling by the inclined surfaces of the second placement parts 251a formed on the support parts 251 and the second rolling prevention parts 252 arranged on the left and right of the resin tablets T.

[0174] With the plurality of resin tablets T lifted by the total weight measuring unit 250, the weight of the plurality of resin tablets T is measured collectively by the weight detecting unit 254. This makes it possible to measure the total weight of the plurality of resin tablets T used in one resin molding in the resin molding module 20.

[0175] As described above, in this embodiment, the total weight of a plurality of resin tablets T used in one resin molding can be measured collectively in the resin material supply mechanism 200. This makes it possible to reduce measurement errors compared to measuring the weights of the resin tablets T individually and adding them up, and to measure the total weight of the resin tablets T with high accuracy.

[0176] After the total weight measuring unit 250 has finished measuring the weight of the resin tablet T, the total weight measuring unit 250 moves downward, and the resin tablet T is again placed on the first placement portion 231 of the moving unit 230. Thereafter, the total weight measuring unit 250 moves to the right, and the support portion 251 retreats from the groove portion 232 of the moving unit 230.

[0177] 11 and 12, the moving unit 230 moves rearward and stops between the delivery unit 260 and the extrusion mechanism 270. In this state, the extrusion mechanism 270 moves rightward, causing the extrusion unit 271 to extrude each resin tablet T to the right and store it in each storage unit 261 of the delivery unit 260.

[0178] The delivery section 260 containing the resin tablets T rotates so that the container section 261 faces upward, and moves upward to deliver each resin tablet T to the loader 17.

[0179] In this way, the resin material supply mechanism 200 of this embodiment can measure the weight of each resin tablet T and the total weight of multiple resin tablets T. Information regarding the weight of the resin tablets T is stored in the control unit 18 and can be managed.

[0180] Furthermore, as a modified example of the resin material supply mechanism 200, it is also possible to configure it so that the resin tablets T can be discharged from the total weight measurement unit 250 to the outside of the resin material supply mechanism 200 all at once. For example, when the measurement results of the weights of the plurality of resin tablets T exceed a preset range, the total weight measurement unit 250 discharges the plurality of resin tablets T whose weights have been measured all at once to the outside. Various mechanisms can be adopted as a mechanism for discharging the plurality of resin tablets T. For example, a mechanism similar to the mechanism by which the individual weight measurement unit 220 discharges the resin tablets T can be adopted.

[0181] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0182] For example, the components (supply module 10, etc.) used in the resin molding apparatus 1 of the above embodiment are examples and can be attached, detached, or replaced as appropriate. For example, the number of resin molding modules 20 can be changed. Furthermore, the configurations and operations of the components (supply module 10, etc.) used in the resin molding apparatus 1 of the present embodiment are examples and can be changed as appropriate.

[0183] In addition, in the above embodiment, an example was shown in which the cull portion 144a and the runner portion 144b were formed in the cull block 144, but for example, the cull portion 144a and part of the runner portion 144b may be formed in the pot block 112. In addition, in the above embodiment, an example was shown in which the pot block 112 was provided with a plurality of through holes (pots), but the number of through holes may be one.

[0184] Furthermore, the control modes exemplified in the above embodiment are merely examples, and the detailed control contents (for example, target values ​​of the clamp load and plunger load, control timing, etc.) can be changed as desired. For example, in the above embodiment, an example is shown in which the second final adjustment control (step S100) is executed after the first final adjustment control (step S90) is completed, but it is also possible to start the second final adjustment control before the first final adjustment control is completed.

[0185] In the above embodiment, the disc spring 150 is used as an example of the force applying unit that applies force to the upper die 140, but the present invention is not limited to this and various other configurations can be adopted. For example, various elastic members or actuators such as air cylinders can also be used as the force applying unit.

[0186] In the above embodiment, the volume of the chips 2a on the substrate 2 is measured in the frame measuring unit 12 provided in the resin molding apparatus 1, but the present invention is not limited to this. For example, the resin molding apparatus 1 can also perform resin molding using a substrate 2 whose volume has been measured externally. In this case, the resin molding apparatus 1 does not need to be provided with the frame measuring unit 12.

[0187] Furthermore, in the above embodiment, examples of filling rate-responsive control include clamping force adjustment control that adjusts the clamping load, plunger speed adjustment control that adjusts the moving speed of plunger 182, and air vent switching control that switches between opening and closing air vent groove 142a. However, the present invention is not limited to these, and it is possible to control any operation related to resin molding.

[0188] Furthermore, the moving section 230 illustrated in the above embodiment is merely an example, and the specific shape and the like can be changed as desired. For example, the first placement section 231 can be formed into a curved shape corresponding to the side surface (curved surface) of the resin tablet T. Furthermore, it is not necessarily required to provide the first rolling prevention section 233 on the moving section 230. For example, if the first placement section 231 can sufficiently prevent the resin tablet T from rolling, the first rolling prevention section 233 may be omitted. Furthermore, the shape of the groove section 232 is not particularly limited, and the shape, size, and the like can be changed as desired as long as the support section 251 for lifting the resin tablet T can be inserted therein.

[0189] Furthermore, the total weight measuring unit 250 illustrated in the above embodiment is merely an example, and the specific shape and the like can be changed as desired. For example, the shape, number, arrangement, and the like of the second rolling prevention unit 252 for preventing the resin tablet T from rolling can be changed as desired. Furthermore, the shape, size, and the like of the support unit 251 for supporting the resin tablet T can be changed as desired. For example, the second placement unit 251a formed in the support unit 251 can be formed into a curved surface corresponding to the side surface (curved surface) of the resin tablet T. Furthermore, the support unit 251 can be composed of multiple members.

[0190] Furthermore, the arrangement and orientation of each part of the resin material supply mechanism 200 exemplified in the above embodiment are not particularly limited, and can be changed as desired depending on the shape, size, etc. of the resin molding apparatus 1.

[0191] <Additional Notes> The resin material supply mechanism 200 according to the first aspect of the present disclosure includes: a delivery section 210 that sequentially delivers resin materials (resin tablets T); a total weight measuring unit 250 for collectively measuring the weight of the plurality of resin materials sent out by the sending unit 210; a transfer section 260 that transfers the plurality of resin materials sent out by the sending section 210 to a loader 17 (transport mechanism) that transports the resin materials to molding dies (lower die 110 and upper die 140); a transfer unit 230 that transfers the resin material between the delivery unit 210, the total weight measurement unit 250, and the delivery unit 260; It is equipped with: According to the resin material supply mechanism 200 of the first aspect of the present disclosure, the total weight of the resin tablets T can be measured with high accuracy. That is, by measuring the weights of a plurality of resin materials collectively, errors are less likely to accumulate compared to when the weights of the resin materials are measured individually and added together, and the total weight of the resin tablets T can be measured with high accuracy. This makes it possible to calculate the volume of the resin tablets with high accuracy based on the total weight of the resin tablets T, and ultimately to achieve high accuracy in the resin molded product.

[0192] In the resin material supply mechanism 200 of the second side according to the first side, The total weight measuring unit 250 discharges the plurality of resin materials whose weights have been measured when the measured weights of the plurality of resin materials exceed a preset range. According to the resin material supply mechanism 200 of the second aspect of the present disclosure, resin tablets T having a weight significantly different from the desired weight can be discharged all at once, and resin molding can be performed using resin tablets T having a weight close to the desired weight. This allows for high precision of the resin molded product.

[0193] The resin material supply mechanism 200 of the third aspect according to the first or second aspect is The apparatus further includes an individual weight measuring unit 220 that individually measures the weight of the resin material sent out by the sending unit 210 and discharges the resin material whose weight has been measured if the measured weight of the resin material exceeds a preset range. According to the resin material supply mechanism 200 of the third aspect of the present disclosure, it is possible to discharge resin tablets T having a weight significantly different from the desired weight and perform resin molding using resin tablets T having a weight close to the desired weight, thereby achieving high precision in the resin molded product.

[0194] In the resin material supply mechanism 200 of the fourth side according to any one of the first to third sides, The total weight measuring unit 250 and the delivery unit 260 are arranged to be aligned along the movement path of the movement unit 230. According to the resin material supply mechanism 200 of the fourth aspect of the present disclosure, the total weight measuring unit 250 can be disposed at an appropriate position, thereby enabling the resin material supply mechanism 200 to be space-saving overall.

[0195] In the resin material supply mechanism 200 of the fifth aspect according to any one of the first to fourth aspects, The moving unit 230 is a plurality of first placement portions 231 formed to correspond to the plurality of resin materials and capable of placing the resin materials thereon; a plurality of grooves 232 formed below the plurality of resin materials placed on the first placement portion 231; Equipped with The total weight measuring unit 250 a plurality of support portions 251 formed to correspond to the plurality of groove portions 232, capable of being inserted into the groove portions 232, and capable of supporting the resin material from below; a moving section 255 (lifting section) capable of lifting and lowering the plurality of support sections 251 collectively; It is equipped with: According to the resin material supply mechanism 200 of the fifth aspect of the present disclosure, the weights of a plurality of resin materials can be measured collectively with a simple configuration.

[0196] In a sixth aspect of the resin material supply mechanism 200 according to the fifth aspect, The moving unit 230 includes a first rolling prevention unit 233 that prevents the resin material placed on the first placement unit 231 from rolling, The total weight measuring unit 250 includes a second rolling prevention unit 252 that prevents the resin material supported by the support unit 251 from rolling. A second placement portion 251a having a V-shaped cross section is formed on the upper surface of the support portion 251. According to the resin material supply mechanism 200 of the sixth aspect of the present disclosure, it is possible to effectively prevent the resin material from rolling. In particular, in this embodiment, in order to ensure a space below the resin tablet T for inserting the support part 251, it is assumed that the depth of the first mounting part 231 on which the resin tablet T is mounted is shallow, making it easier for the resin tablet T to roll. Therefore, by providing the first rolling prevention part 233 on the upper surface of the moving part 230, it is possible to effectively prevent the resin tablet T from rolling.

[0197] A resin molding apparatus 1 according to a seventh aspect of the present disclosure includes: The apparatus includes a resin material supply mechanism 200 according to any one of the first to sixth aspects. According to the resin molding apparatus 1 of the seventh aspect of the present disclosure, it is possible to measure the total weight of the resin tablets T with high accuracy. This makes it possible to calculate the volume of the resin tablets with high accuracy based on the total weight of the resin tablets T, thereby enabling high accuracy of the resin molded product.

[0198] The resin molding apparatus 1 of an eighth aspect according to the seventh aspect comprises: a lower mold 110 on which the substrate 2 is placed; an upper mold 140 that forms a cavity C by an upper mold side block 142 (side block) and an upper mold cavity block 143 (cavity block) that is provided so as to be able to move up and down relative to the upper mold side block 142; a clamping mechanism 190 (clamping mechanism) that clamps the lower mold 110 and the upper mold 140; a transfer mechanism 180 that supplies a resin material to the cavity C by a plunger 182; a control unit 18 that performs a filling rate response control (step S60, step S80 in the second control mode) that controls an operation related to resin molding when the plunger 182 reaches a position corresponding to a predetermined resin filling rate, using a relationship between the resin filling rate of the cavity C calculated based on the volume of the chip 2a arranged on the substrate 2 and the volume of the resin material (resin tablet T) and the position of the plunger 182; Equipped with The volume of the resin material is calculated based on the weight of the plurality of resin materials measured by the total weight measuring unit 250 of the resin material supply mechanism 200 . According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, it is possible to manufacture highly accurate resin molded products. That is, since the resin filling rate can be accurately determined based on the volume of the resin tablets T actually used and the chips 2a of the substrate 2, it is possible to control each part based on this resin filling rate. This allows for improved accuracy of the resin molded products.

[0199] A resin molding apparatus 1 of a ninth aspect according to the eighth aspect, a frame measuring unit 12 (chip volume measuring unit) that measures the volume of the chip 2a arranged on the substrate 2; The apparatus further includes a calculation unit (control unit 18) that calculates the relationship between the resin filling rate and the position of the plunger 182 based on the measurement results of the frame measurement unit 12 and the total weight measurement unit 250. According to the resin molding apparatus 1 of the ninth aspect of the present disclosure, the position of the plunger 182 (resin filling rate) can be determined based on the actually measured volumes of the chip 2a and resin material, so that highly accurate control can be performed even if, for example, the volumes of the resin material (resin tablet T) or the chip 2a vary.

[0200] A method for producing a resin molded product according to a tenth aspect of the present disclosure includes: A method for manufacturing a resin molded product using a resin molding apparatus 1 according to any one of seventh to ninth aspects, a chip volume measurement step (step S10) of measuring the volume of the chip 2a arranged on the substrate 2; A resin volume measurement step (step S10) of measuring the volume of the resin material; a plunger position calculation step (step S20) of calculating the relationship between the resin filling rate of the cavity C and the position of the plunger 182 based on the measured volumes of the tip 2a and the resin material; and a filling rate corresponding control step (step S60, step S80 in the second control mode) of controlling an operation related to resin molding when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. The method for manufacturing a resin molded product according to the tenth aspect of the present disclosure can manufacture a highly accurate resin molded product. That is, the resin filling rate can be accurately determined based on the volume of the resin tablet T and the chips 2a of the substrate 2 that are actually used, and each part can be controlled based on this resin filling rate. This improves the accuracy of the resin molded product. [Explanation of symbols]

[0201] 1 Resin molding equipment 17 Loader 18 Control Unit 110 Lower mold 140 Upper mold 142 Upper side block 180 Transfer mechanism 182 Plunger 190 Mold clamping mechanism 200 Resin material supply mechanism 210 Transmission Unit 220 Individual weight measuring section 230 Mobile Unit 231 First loading section 232 Groove 233 First rolling prevention part 250 Total weight measurement unit 251 Support part 252 Second rolling prevention part 255 Moving Part 260 Delivery Department

Claims

1. a delivery section that sequentially delivers the resin material; a total weight measuring unit that collectively measures the weight of the plurality of resin materials sent out by the sending unit; a transfer unit that transfers the plurality of resin materials sent out by the sending unit to a transfer mechanism that transfers the resin materials to a molding die; a transfer unit that transfers the resin material between the delivery unit, the total weight measurement unit, and the delivery unit; Equipped with The moving unit is a plurality of first placement portions formed to correspond to the plurality of resin materials and capable of placing the resin materials thereon; The total weight measuring unit a plurality of support portions formed to correspond to the plurality of first placement portions and capable of supporting the resin material placed on the first placement portions from below; a lifting unit that can lift and lower the plurality of support units collectively; A resin material supply mechanism comprising:

2. the total weight measuring unit discharges the plurality of resin materials whose weights have been measured when the measurement results of the weights of the plurality of resin materials exceed a predetermined range; The resin material supply mechanism according to claim 1 .

3. The apparatus further includes an individual weight measuring unit that individually measures the weight of the resin material sent out by the sending unit, and discharges the resin material whose weight has been measured if the measured weight of the resin material exceeds a predetermined range. The resin material supply mechanism according to claim 1 .

4. The total weight measuring unit and the delivery unit are arranged to be aligned along the movement path of the movement unit. The resin material supply mechanism according to claim 1 .

5. The moving unit is a plurality of grooves formed below the plurality of resin materials placed on the first placement portion, The plurality of support portions include: The grooves are formed to correspond to the plurality of grooves and are insertable into the grooves. The resin material supply mechanism according to claim 1 .

6. the moving unit includes a first rolling prevention unit that prevents the resin material placed on the first placement unit from rolling; the total weight measuring unit includes a second rolling prevention unit that prevents the resin material supported by the support unit from rolling; A second placement portion having a V-shaped cross section is formed on an upper surface of the support portion. The resin material supply mechanism according to claim 5 .

7. A resin molding device comprising the resin material supply mechanism according to claim 1.

8. a lower mold on which the substrate is placed; an upper mold that forms a cavity using a side block and a cavity block that is provided so as to be able to move up and down relative to the side block; a clamping mechanism that clamps the lower mold and the upper mold; a transfer mechanism that supplies the resin material to the cavity by a plunger; a control unit that performs filling rate response control, which controls operations related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate, using a relationship between the resin filling rate of the cavity calculated based on the volume of the chip placed on the substrate and the volume of the resin material and the position of the plunger; Equipped with the volume of the resin material is calculated based on the weights of the plurality of resin materials measured by the total weight measuring unit of the resin material supply mechanism; The resin molding apparatus according to claim 7.

9. a chip volume measuring unit for measuring the volume of a chip placed on the substrate; a calculation unit that calculates the relationship between the resin filling rate and the position of the plunger based on the measurement results of the tip volume measurement unit and the total weight measurement unit; Further comprising: The resin molding apparatus according to claim 8.

10. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 7 to 9, a chip volume measuring step of measuring the volume of a chip arranged on a substrate; a resin volume measuring step of measuring the volume of the resin material; a plunger position calculation step of calculating a relationship between a resin filling rate of the cavity and a plunger position based on the measured volumes of the tip and the resin material; a filling rate corresponding control step of controlling an operation related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate; A method for producing a resin molded product comprising the steps of:

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