Transportation method

Abstract

To provide a transportation method that reduces the risk of breakage of multiple Fabry-Perot interference filters while transporting the filters.SOLUTION: A transportation method for transporting objects 100A and 100B including multiple Fabry-Perot interference filters 1 includes a first step of storing the objects 100A and 100B in a storage container P. The Fabry-Perot interference filter 1 includes a substrate 11 and first and second mirror portions 31 and 32 provided on the substrate 11 and facing each other via an air gap S and having a variable distance from each other. In the first step, the objects 100A and 100B are accommodated and supported in the storage container P in a state where the plurality of Fabry-Perot interference filters 1 are two-dimensionally arranged.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a transportation method. [Background technology]

[0002] BACKGROUND ART A known conventional Fabry-Perot interference filter includes a substrate, and a fixed mirror and a movable mirror that face each other on the substrate with a gap between them (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2013-506154 Summary of the Invention [Problem to be solved by the invention]

[0004] When transporting the above-described Fabry-Perot interference filters, it is conceivable to individually store the Fabry-Perot interference filters in a storage container. However, in recent years, with increasing market demand for such Fabry-Perot interference filters, there has been a need to transport a large number of Fabry-Perot interference filters at once. In this case, the task of individually storing the Fabry-Perot interference filters in a storage container must be repeated, which raises concerns about increased burden due to increased work time and the risk of defective products due to reduced work accuracy (for example, damage to the storage container caused by contact with the movable mirror). Therefore, a method is desired that enables the transportation of a large number of Fabry-Perot interference filters while reducing the risk of damage.

[0005] An object of the present invention is to provide a method for transporting a large number of Fabry-Perot interference filters while reducing the risk of breakage. [Means for solving the problem]

[0006] The transportation method of the present invention is a method for transporting an object including a plurality of Fabry-Perot interference filters, and includes a first step of storing the object in a storage container, the Fabry-Perot interference filters having a substrate and a first mirror portion and a second mirror portion provided on the substrate, facing each other via a gap and having a variable distance between them, and in the first step, the object is stored and supported in the storage container with the plurality of Fabry-Perot interference filters arranged two-dimensionally.

[0007] In this method, the object to be transported includes a plurality of Fabry-Perot interference filters. In the first step, the Fabry-Perot interference filters are accommodated and supported in a storage container while being arranged two-dimensionally. In this way, when a plurality of Fabry-Perot interference filters are arranged two-dimensionally, it is easier to accommodate and support them collectively so that mirror portions such as the first mirror portion and the second mirror portion do not come into contact with each other, compared to handling the Fabry-Perot interference filters individually. Therefore, this method makes it possible to transport a plurality (a large number) of Fabry-Perot interference filters with a simple configuration while reducing the risk of breakage.

[0008] In the transportation method according to the present invention, the object may be a wafer on which a plurality of Fabry-Perot interference filters are formed, the wafer including a first surface on the first mirror portion and second mirror portion side of a substrate, and a second surface opposite the first surface, and in the first step, the object may be accommodated and supported in the container with the plurality of Fabry-Perot interference filters arranged two-dimensionally as a wafer. In this case, the plurality of Fabry-Perot interference filters are integrated as a wafer. This allows for transportation with a simpler configuration while reducing the risk of damage to a large number (plurality) of Fabry-Perot interference filters.

[0009] In the transport method according to the present invention, the object may include an adhesive layer adhered to the second surface, a support provided on the outer edge of the adhesive layer, and a clamping portion for clamping the support provided on the inner surface of the container. In the first step, the object may be supported in the container by clamping the support with the clamping portion. In this case, the object can be supported without the clamping portion abutting against the wafer itself, which is the object. Therefore, damage to the Fabry-Perot interference filter due to contact with the clamping portion is prevented when the object is accommodated and supported.

[0010] In the transportation method according to the present invention, in the first step, the object may be supported in the storage container by vertically clamping the support with a clamping unit with the first surface facing downward. In this case, the first surface on the mirror side faces downward in the storage container. Therefore, even if the mirror portion of one Fabry-Perot interference filter is broken, the fragments are unlikely to affect other Fabry-Perot interference filters.

[0011] In the transport method according to the present invention, the wafer has an effective area including a plurality of Fabry-Perot interference filters and a dummy area surrounding the effective area and forming an outer edge. The dummy area includes a plurality of dummy filters each having an intermediate layer disposed between a first mirror portion and a second mirror portion facing each other. The inner surface of the container has a clamping portion for clamping the object in the dummy area. In the first step, the object may be supported in the container by clamping the dummy area with the clamping portion. In this case, the object can be supported in the container without using a separate member such as a support. Furthermore, since the dummy area is provided on the outer edge of the wafer, the strength of the wafer is improved and warping is suppressed. This makes it easier to place the object in the container.

[0012] In the transportation method according to the present invention, in the first step, the object may be supported in the container by vertically clamping the dummy area with a clamping unit with the first surface facing downward. In this case, the first surface on the mirror side faces downward in the container. Therefore, even if the mirror portion of one Fabry-Perot interference filter is broken, the fragments are unlikely to affect other Fabry-Perot interference filters.

[0013] In the transportation method according to the present invention, the object includes an adhesive layer and a plurality of Fabry-Perot interference filters that are configured separately from one another, arranged two-dimensionally, and bonded to the adhesive layer. A support is provided on the outer edge of the adhesive layer, and a clamping portion is provided on the inner surface of the container for vertically clamping the support. The Fabry-Perot interference filters include a first surface facing the first and second mirror portions relative to the substrate, and a second surface opposite the first surface and bonded to the adhesive layer. In the first step, the object may be supported in the container by clamping the support with the clamping portion with the first surface facing downward. In this case, the plurality of Fabry-Perot interference filters configured separately from one another are arranged two-dimensionally and bonded to the adhesive layer. This makes it easier to accommodate and support the filters without contacting the mirror portions. Furthermore, the first surface faces downward within the container. Therefore, even if the mirror portion of one Fabry-Perot interference filter is damaged, the fragments are less likely to affect other Fabry-Perot interference filters.

[0014] In the transportation method according to the present invention, a hygroscopic layer is provided on the surface of the adhesive layer opposite the second surface, and an adsorption layer is provided on the surface of the hygroscopic layer opposite the adhesive layer. In the first step, the objects may be accommodated and supported in a storage container such that the adsorption layer of one object faces the first surface below the first surface of another object. In this case, the hygroscopic layer and the adsorption layer can be disposed in the storage container simultaneously with the accommodation of the objects in the storage container. In particular, in this case, the hygroscopic layer can be disposed closer to the Fabry-Perot interference filter than when a hygroscopic member is disposed, for example, on the bottom of the storage container. Furthermore, the adsorption layer is disposed below the first surface so as to face the first surface. Therefore, even if the mirror portion of one Fabry-Perot interference filter is damaged, the fragments are adsorbed to the adsorption layer, preventing the damage from affecting other Fabry-Perot interference filters.

[0015] The transportation method according to the present invention may include a second step of placing the storage container in a vacuum pack and evacuating the vacuum pack to create a vacuum inside the storage container after the first step. In this case, the storage container can be evacuated without affecting the Fabry-Perot interference filter. [Effects of the Invention]

[0016] According to the present invention, it is possible to provide a transportation method that allows transportation of a large number of Fabry-Perot interference filters while reducing the risk of breakage thereof. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a plan view of a Fabry-Perot interference filter according to an embodiment of the present invention. [Figure 2] FIG. 2 is a bottom view of the Fabry-Perot interference filter shown in FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view of the Fabry-Perot interference filter taken along line III-III in FIG. 1. [Figure 4] FIG. 2 is a cross-sectional view of a dummy filter according to the embodiment. [Figure 5] FIG. 2 is a plan view of a wafer according to the embodiment. [Figure 6] FIG. 6 is an enlarged plan view of a portion of the wafer shown in FIG. [Figure 7] FIG. 6 is a cross-sectional view of a Fabry-Perot interference filter portion and a dummy filter portion of the wafer shown in FIG. 5. [Figure 8] 10A to 10C are schematic cross-sectional views showing an example of a transport method according to the present embodiment. [Figure 9] FIG. 10 is a schematic cross-sectional view showing an example of a transport method according to a modified example. [Figure 10] FIG. 10 is a cross-sectional view of a wafer according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In each drawing, identical or corresponding elements are assigned the same reference numerals, and redundant explanations may be omitted.

[0019] The transportation method according to this embodiment is a method for transporting an object including a Fabry-Perot interference filter. Therefore, first, an embodiment of an object including a Fabry-Perot interference filter to be transported will be described. [Fabry-Perot interference filter and dummy filter configuration]

[0020] FIG. 1 is a plan view of a Fabry-Perot interference filter according to this embodiment. FIG. 2 is a bottom view of the Fabry-Perot interference filter shown in FIG. 1. FIG. 3 is a cross-sectional view of the Fabry-Perot interference filter taken along line III-III in FIG. 1. As shown in FIGS. 1 to 3, the Fabry-Perot interference filter 1 includes a substrate 11. The substrate 11 has a first surface 11a and a second surface 11b facing each other. An antireflection layer 21, a first stacked body 22, an intermediate layer 23, and a second stacked body 24 are stacked in this order on the first surface 11a. An air gap S is defined between the first stacked body 22 and the second stacked body 24 by the frame-shaped intermediate layer 23.

[0021] The shape and positional relationship of each part when viewed from a direction perpendicular to the first surface 11a (plan view) are as follows: The outer edge of the substrate 11 is, for example, rectangular with a side length of approximately several hundred μm to several mm. The outer edge of the substrate 11 and the outer edge of the second laminate 24 coincide with each other. The outer edges of the antireflection layer 21, the first laminate 22, and the intermediate layer 23 coincide with each other. The substrate 11 has an outer edge portion 11c that is located further outward from the center of the void S than the outer edge of the intermediate layer 23. The outer edge portion 11c is, for example, frame-shaped, and surrounds the intermediate layer 23 when viewed from a direction perpendicular to the first surface 11a. The void S is, for example, circular.

[0022] The Fabry-Perot interference filter 1 transmits light having a predetermined wavelength through a light-transmitting region 1a defined in the center thereof. The light-transmitting region 1a is, for example, a cylindrical region. The substrate 11 is made of, for example, silicon, quartz, or glass. When the substrate 11 is made of silicon, the antireflection layer 21 and the intermediate layer 23 are made of, for example, silicon oxide. The thickness of the intermediate layer 23 is, for example, several tens of nanometers to several tens of micrometers.

[0023] The portion of the first stack 22 corresponding to the light-transmitting region 1a functions as a first mirror section 31. The first mirror section 31 is a fixed mirror. The first mirror section 31 is disposed on the first surface 11a via the antireflection layer 21. The first stack 22 is configured by alternately stacking multiple polysilicon layers 25 and multiple silicon nitride layers 26. In the Fabry-Perot interference filter 1, a polysilicon layer 25a, a silicon nitride layer 26a, a polysilicon layer 25b, a silicon nitride layer 26b, and a polysilicon layer 25c are stacked in this order on the antireflection layer 21. The optical thickness of each of the polysilicon layer 25 and the silicon nitride layer 26 constituting the first mirror section 31 is preferably an integer multiple of ¼ of the central transmission wavelength. The first mirror section 31 may also be disposed directly on the first surface 11a without the antireflection layer 21.

[0024] The portion of the second stack 24 corresponding to the light-transmitting region 1a functions as a second mirror section 32. The second mirror section 32 is a movable mirror. The second mirror section 32 faces the first mirror section 31 across a gap S on the opposite side of the first mirror section 31 from the substrate 11. The direction in which the first mirror section 31 and the second mirror section 32 face each other is parallel to the direction perpendicular to the first surface 11a. The second stack 24 is disposed on the first surface 11a via the antireflection layer 21, the first stack 22, and the intermediate layer 23. The second stack 24 is configured by alternately stacking multiple polysilicon layers 27 and multiple silicon nitride layers 28 one by one. In the Fabry-Perot interference filter 1, a polysilicon layer 27a, a silicon nitride layer 28a, a polysilicon layer 27b, a silicon nitride layer 28b, and a polysilicon layer 27c are stacked in this order on the intermediate layer 23. The optical thickness of each of the polysilicon layer 27 and the silicon nitride layer 28 that constitute the second mirror section 32 is preferably an integral multiple of ¼ of the central transmission wavelength.

[0025] Note that silicon oxide layers may be used instead of silicon nitride layers in the first stacked body 22 and the second stacked body 24. Furthermore, titanium oxide, tantalum oxide, zirconium oxide, magnesium fluoride, aluminum oxide, calcium fluoride, silicon, germanium, zinc sulfide, or the like may be used as the material for each layer constituting the first stacked body 22 and the second stacked body 24. Here, the surface of the first mirror section 31 facing the gap S (the surface of the polysilicon layer 25c) and the surface of the second mirror section 32 facing the gap S (the surface of the polysilicon layer 27a) face each other directly across the gap S. However, an electrode layer and a protective layer (not constituting a mirror) may be formed on the surface of the first mirror section 31 facing the gap S and the surface of the second mirror section 32 facing the gap S. In this case, the first mirror section 31 and the second mirror section 32 face each other across the gap S with these layers interposed therebetween. In other words, even in such a case, the first mirror portion 31 and the second mirror portion 32 can be opposed to each other with the gap S therebetween.

[0026] A plurality of through holes 24b are formed in the second laminate 24 in a portion corresponding to the void S (a portion overlapping with the void S when viewed from a direction perpendicular to the first surface 11a). Each of the through holes 24b reaches the void S from the surface 24a of the second laminate 24 opposite the intermediate layer 23. The plurality of through holes 24b are formed to an extent that does not substantially affect the function of the second mirror section 32. The plurality of through holes 24b are used to form the void S by removing a portion of the intermediate layer 23 by etching.

[0027] The second stack 24 further includes a covering portion 33 and a peripheral portion 34 in addition to the second mirror portion 32. The second mirror portion 32, covering portion 33, and peripheral portion 34 are integrally formed so as to have a portion of the same laminate structure and be continuous with one another. The covering portion 33 surrounds the second mirror portion 32 when viewed perpendicular to the first surface 11a. The covering portion 33 covers the surface 23a of the intermediate layer 23 opposite the substrate 11, as well as the side surface 23b (the outer side surface, i.e., the side surface opposite the gap S) of the intermediate layer 23, the side surface 22a of the first stack 22, and the side surface 21a of the antireflection layer 21, and extends to the first surface 11a. That is, the covering portion 33 covers the outer edge of the intermediate layer 23, the outer edge of the first stack 22, and the outer edge of the antireflection layer 21.

[0028] The peripheral edge portion 34 surrounds the covering portion 33 when viewed perpendicularly to the first surface 11a. The peripheral edge portion 34 is located on the first surface 11a at the outer edge portion 11c. The outer edge of the peripheral edge portion 34 coincides with the outer edge of the substrate 11 when viewed perpendicularly to the first surface 11a. The peripheral edge portion 34 is thinned along the outer edge of the outer edge portion 11c. That is, the portion of the peripheral edge portion 34 along the outer edge of the outer edge portion 11c is thinner than the other portions of the peripheral edge portion 34 excluding the portion along the outer edge. In the Fabry-Perot interference filter 1, the peripheral edge portion 34 is thinned by removing a portion of the polysilicon layer 27 and the silicon nitride layer 28 that constitute the second stacked body 24. The peripheral edge portion 34 has a non-thinned portion 34a that is continuous with the covering portion 33 and a thinned portion 34b that surrounds the non-thinned portion 34a. In the thinned portion 34b, the polysilicon layer 27 and the silicon nitride layer 28 other than the polysilicon layer 27a provided directly on the first surface 11a are removed.

[0029] The height from the first surface 11a to the surface 34c of the non-thinned portion 34a on the side opposite to the substrate 11 is shorter than the height from the first surface 11a to the surface 23a of the intermediate layer 23. The height from the first surface 11a to the surface 34c of the non-thinned portion 34a is, for example, 100 nm to 5000 nm. The height from the first surface 11a to the surface 23a of the intermediate layer 23 is, for example, 500 nm to 20000 nm. The width of the thinned portion 34b (the distance between the outer edge of the non-thinned portion 34a and the outer edge of the outer edge portion 11c when viewed from a direction perpendicular to the first surface 11a) is 0.01 times or more the thickness of the substrate 11. The width of the thinned portion 34b is, for example, 5 μm to 400 μm. The thickness of the substrate 11 is, for example, 500 μm to 800 μm.

[0030] A first electrode 12 is formed on the first mirror portion 31 so as to surround the light-transmitting region 1a when viewed from a direction perpendicular to the first surface 11a. The first electrode 12 is formed by doping impurities into the polysilicon layer 25c to reduce its resistance. A second electrode 13 is formed on the first mirror portion 31 so as to include the light-transmitting region 1a when viewed from a direction perpendicular to the first surface 11a. The second electrode 13 is formed by doping impurities into the polysilicon layer 25c to reduce its resistance. When viewed from a direction perpendicular to the first surface 11a, the size of the second electrode 13 is preferably large enough to include the entire light-transmitting region 1a, but may be approximately the same size as the light-transmitting region 1a.

[0031] A third electrode 14 is formed on the second mirror section 32. The third electrode 14 faces the first electrode 12 and the second electrode 13 across a gap S. The third electrode 14 is formed by doping impurities into the polysilicon layer 27a to reduce its resistance.

[0032] A pair of terminals 15 are provided facing each other with the light-transmitting region 1a in between. Each terminal 15 is disposed in a through-hole extending from the surface 24a of the second laminate 24 to the first laminate 22. Each terminal 15 is electrically connected to the first electrode 12 via a wiring 12a. Each terminal 15 is formed of a metal film such as aluminum or an alloy thereof.

[0033] A pair of terminals 16 are provided facing each other across the light-transmitting region 1a. Each terminal 16 is disposed in a through-hole extending from the surface 24a of the second laminate 24 to the first laminate 22. Each terminal 16 is electrically connected to the second electrode 13 via a wiring 13a, and is also electrically connected to the third electrode 14 via a wiring 14a. The terminals 16 are formed of a metal film such as aluminum or an alloy thereof. The direction in which the pair of terminals 15 face each other is perpendicular to the direction in which the pair of terminals 16 face each other (see FIG. 1).

[0034] A plurality of trenches 17, 18 are provided on the surface 22b of the first stack 22. The trench 17 extends in an annular shape so as to surround the connection portion of the wiring 13a with the terminal 16. The trench 17 electrically insulates the first electrode 12 from the wiring 13a. The trench 18 extends in an annular shape along the inner edge of the first electrode 12. The trench 18 electrically insulates the first electrode 12 from the region inside the first electrode 12 (the second electrode 13). The region inside each of the trenches 17, 18 may be an insulating material or an empty space.

[0035] A trench 19 is provided on the surface 24a of the second stack 24. The trench 19 extends in an annular shape so as to surround the terminal 15. The trench 19 electrically insulates the terminal 15 from the third electrode 14. The region within the trench 19 may be an insulating material or an empty space.

[0036] An antireflection layer 41, a third stacked body 42, an intermediate layer 43, and a fourth stacked body 44 are stacked in this order on the second surface 11b of the substrate 11. The antireflection layer 41 and the intermediate layer 43 have the same configurations as the antireflection layer 21 and the intermediate layer 23, respectively. The third stacked body 42 and the fourth stacked body 44 have stacked structures symmetrical to the first stacked body 22 and the second stacked body 24, respectively, with respect to the substrate 11. The antireflection layer 41, the third stacked body 42, the intermediate layer 43, and the fourth stacked body 44 have the function of suppressing warpage of the substrate 11.

[0037] The third stack 42, the intermediate layer 43, and the fourth stack 44 are thinned along the outer edge of the outer edge portion 11c. That is, the portions of the third stack 42, the intermediate layer 43, and the fourth stack 44 that are along the outer edge of the outer edge portion 11c are thinner than the other portions of the third stack 42, the intermediate layer 43, and the fourth stack 44 excluding the portions that are along the outer edge. In the Fabry-Perot interference filter 1, the third stack 42, the intermediate layer 43, and the fourth stack 44 are thinned by removing the entire third stack 42, the intermediate layer 43, and the fourth stack 44 in the portions that overlap with the thinned portion 34b when viewed from a direction perpendicular to the first surface 11a.

[0038] The third laminate 42, the intermediate layer 43, and the fourth laminate 44 have openings 40a formed therein so as to include the light-transmitting regions 1a when viewed from a direction perpendicular to the first surface 11a. The openings 40a have substantially the same diameter as the light-transmitting regions 1a. The openings 40a are open to the light-emitting side. The bottom surfaces of the openings 40a reach the anti-reflection layer 41.

[0039] A light-shielding layer 45 is formed on the surface of the fourth stack 44 on the light-emitting side. The light-shielding layer 45 is made of, for example, aluminum. A protective layer 46 is formed on the surface of the light-shielding layer 45 and the inner surface of the opening 40a. The protective layer 46 covers the outer edges of the third stack 42, the intermediate layer 43, the fourth stack 44, and the light-shielding layer 45, and also covers the anti-reflection layer 41 on the outer edge portion 11c. The protective layer 46 is made of, for example, aluminum oxide. Note that by setting the thickness of the protective layer 46 to 1 to 100 nm (preferably about 30 nm), the optical influence of the protective layer 46 can be ignored.

[0040] In the Fabry-Perot interference filter 1 configured as described above, when a voltage is applied between the first electrode 12 and the third electrode 14 via the pair of terminals 15, 16, an electrostatic force corresponding to the voltage is generated between the first electrode 12 and the third electrode 14. The electrostatic force attracts the second mirror portion 32 toward the first mirror portion 31 fixed to the substrate 11, and the distance between the first mirror portion 31 and the second mirror portion 32 is adjusted. In this way, in the Fabry-Perot interference filter 1, the distance between the first mirror portion 31 and the second mirror portion 32 changes due to the electrostatic force.

[0041] The wavelength of light transmitted through the Fabry-Perot interference filter 1 depends on the distance between the first mirror portion 31 and the second mirror portion 32 in the light-transmitting region 1a. Therefore, the wavelength of light to be transmitted can be appropriately selected by adjusting the voltage applied between the first electrode 12 and the third electrode 14. At this time, the second electrode 13 has the same potential as the third electrode 14. Therefore, the second electrode 13 functions as a compensation electrode for keeping the first mirror portion 31 and the second mirror portion 32 flat in the light-transmitting region 1a.

[0042] In the Fabry-Perot interference filter 1, for example, the optical spectrum can be obtained by detecting light transmitted through the light-transmitting region 1a of the Fabry-Perot interference filter 1 with a photodetector while changing the voltage applied to the Fabry-Perot interference filter 1 (i.e., while changing the distance between the first mirror portion 31 and the second mirror portion 32 in the Fabry-Perot interference filter 1).

[0043] As described above, the Fabry-Perot interference filter 1 is provided with a membrane structure M including a first mirror portion 31 and a second mirror portion 32 that face each other via a gap S and whose distance from each other is variable. The membrane structure M includes a main surface Ms on the side opposite to the substrate 11. When viewed from a direction intersecting (orthogonal to) the first surface 11a and main surface Ms of the substrate 11, the membrane structure M is a portion that does not overlap with the intermediate layer 23 in the first laminate 22 and the second laminate 24. In other words, the outer shape of the membrane structure M when viewed from a direction intersecting (orthogonal to) the main surface Ms is determined by the inner edge of the intermediate layer 23, and is circular in this case (see FIG. 1).

[0044] Fig. 4 is a cross-sectional view of a dummy filter according to this embodiment. As shown in Fig. 4, the dummy filter 2 differs from the above-described Fabry-Perot interference filter 1 in that the second laminate 24 does not have a plurality of through-holes 24b formed therein, and that the intermediate layer 23 does not have a gap S formed therein. In the dummy filter 2, the intermediate layer 23 is provided between the first mirror portion 31 and the second mirror portion 32. In other words, the second mirror portion 32 does not float on the gap S, but is disposed on the surface 23a of the intermediate layer 23. [Wafer configuration]

[0045] Next, the configuration of a wafer according to one embodiment will be described. FIG. 5 is a plan view of a wafer according to this embodiment. FIG. 6 is an enlarged plan view of a portion of the wafer shown in FIG. 5. As shown in FIGS. 5 and 6, the wafer 100 includes a substrate layer 110. The substrate layer 110 has a disk-like shape with a diameter of, for example, approximately 150 mm or 200 mm, and an orientation flat OF is formed on a portion of the substrate layer 110. The substrate layer 110 is made of, for example, silicon, quartz, or glass. Hereinafter, a virtual line passing through the center of the substrate layer 110 and parallel to the orientation flat OF when viewed from the thickness direction of the substrate layer 110 will be referred to as a first line 3, and a virtual line passing through the center of the substrate layer 110 and perpendicular to the orientation flat OF when viewed from the thickness direction of the substrate layer 110 will be referred to as a second line 4.

[0046] The wafer 100 is provided with an effective area 101 and a dummy area 102. The dummy area 102 is an area along the outer edge 110c of the substrate layer 110 (i.e., the outer edge 100a of the wafer 100) (forming the outer edge 100a). The effective area 101 is an area inside the dummy area 102. The dummy area 102 surrounds the effective area 101 when viewed from the thickness direction of the substrate layer 110. The dummy area 102 is adjacent to the effective area 101.

[0047] The effective area 101 is provided with a plurality of Fabry-Perot interference filter sections 1A arranged two-dimensionally. The plurality of Fabry-Perot interference filter sections 1A are provided over the entire effective area 101. The dummy area 102 is provided with a plurality of dummy filter sections 2A arranged two-dimensionally. The plurality of dummy filter sections 2A are provided in the dummy area 102 except for a pair of areas 102a. One area 102a is an area along the orientation flat OF. The other area 102a is an area along a portion of the outer edge 110c of the substrate layer 110 opposite the orientation flat OF. The Fabry-Perot interference filter section 1A and the dummy filter section 2A are adjacent to each other at the boundary between the effective area 101 and the dummy area 102. When viewed in the thickness direction of the substrate layer 110, the outer shape of the Fabry-Perot interference filter section 1A and the outer shape of the dummy filter section 2A are the same. The plurality of Fabry-Perot interference filter sections 1A and the plurality of dummy filter sections 2A are arranged symmetrically with respect to a first straight line 3 and a second straight line 4 that are perpendicular to each other. The plurality of dummy filter sections 2A may be provided over the entire dummy area 102. The plurality of dummy filter sections 2A may also be provided in an area of ​​the dummy area 102 excluding one of the areas 102a.

[0048] The plurality of Fabry-Perot interference filter portions 1A are portions that will become the plurality of Fabry-Perot interference filters 1 when the wafer 100 is cut along the lines 5. The plurality of dummy filter portions 2A are portions that will become the plurality of dummy filters 2 when the wafer 100 is cut along the lines 5. When viewed in the thickness direction of the substrate layer 110, the plurality of lines 5 extend in a direction parallel to the orientation flat OF, and the plurality of lines 5 extend in a direction perpendicular to the orientation flat OF. As an example, when each filter portion 1A, 2A has a rectangular shape when viewed in the thickness direction of the substrate layer 110, the filter portions 1A, 2A are arranged in a two-dimensional matrix, and the plurality of lines 5 are set in a lattice pattern so as to pass between adjacent filter portions 1A, 1A, between adjacent filter portions 1A, 2A, and between adjacent filter portions 2A, 2A. 5, a 3×3 array including one Fabry-Perot interference filter section 1A or dummy filter section 2A and the Fabry-Perot interference filter 1 and / or dummy filter section 2A surrounding the one Fabry-Perot interference filter section 1A or dummy filter section 2A is defined as a unit array. In this case, a plurality of unit arrays are arranged in each of four regions defined by a first line 3 and a second line 4 on the wafer 100. The same number of unit arrays are arranged in each of the four regions defined by the first line 3 and the second line 4. Furthermore, the unit arrays are arranged symmetrically with respect to the first line 3 and the second line 4. The width (surface area) of a unit array is larger than its thickness (cross-sectional area).

[0049] 7A is a cross-sectional view of the Fabry-Perot interference filter section 1A, and FIG. 7B is a cross-sectional view of the dummy filter section 2A. As shown in FIGS. 7A and 7B, the substrate layer 110 is a layer that will become a plurality of substrates 11 when the wafer 100 is cut along each line 5. The substrate layer 110 has a first surface 110a and a second surface 110b that face each other. An antireflection layer 210 is provided on the first surface 110a of the substrate layer 110. The antireflection layer 210 is a layer that will become a plurality of antireflection layers 21 when the wafer 100 is cut along each line 5. An antireflection layer 410 is provided on the second surface 110b of the substrate layer 110. The antireflection layer 410 is a layer that will become a plurality of antireflection layers 41 when the wafer 100 is cut along each line 5.

[0050] The device layer 200 is provided on the antireflection layer 210. The device layer 200 includes a first mirror layer 220, an intermediate layer 230, and a second mirror layer 240. The first mirror layer 220 includes a plurality of first mirror portions 31, and is to become a plurality of first stacked bodies 22 when the wafer 100 is cut along each line 5. The plurality of first mirror portions 31 are two-dimensionally arranged on the first surface 110a of the substrate layer 110 via the antireflection layer 210. The intermediate layer 230 is to become a plurality of intermediate layers 23 when the wafer 100 is cut along each line 5. The second mirror layer 240 includes a plurality of second mirror portions 32, and is to become a plurality of second stacked bodies 24 when the wafer 100 is cut along each line 5. The plurality of second mirror portions 32 are two-dimensionally arranged on the first mirror layer 220 via the intermediate layer 23.

[0051] The stress adjustment layer 400 is provided on the anti-reflection layer 410. That is, the stress adjustment layer 400 is provided on the second surface 110b of the substrate layer 110 via the anti-reflection layer 410. The stress adjustment layer 400 has a plurality of layers 420, 430, and 440. The layer 420 is a layer that will become a plurality of third stacked bodies 42 when the wafer 100 is cut along each of the lines 5. The layer 430 is a layer that will become a plurality of intermediate layers 43 when the wafer 100 is cut along each of the lines 5. The layer 440 is a layer that will become a plurality of fourth stacked bodies 44 when the wafer 100 is cut along each of the lines 5.

[0052] A light-shielding layer 450 and a protective layer 460 are provided on the stress adjustment layer 400. The light-shielding layer 450 is a layer that will become a plurality of light-shielding layers 45 when the wafer 100 is cut along each line 5. The protective layer 460 is a layer that will become a plurality of protective layers 46 when the wafer 100 is cut along each line 5.

[0053] 7(a), in each Fabry-Perot interference filter section 1A, a gap S is formed between the first mirror section 31 and the second mirror section 32 facing each other. That is, in each Fabry-Perot interference filter section 1A, the intermediate layer 23 defines the gap S, and the second mirror section 32 floats above the gap S. Each Fabry-Perot interference filter section 1A is provided with a configuration related to a first electrode 12, a second electrode 13, a third electrode 14, a plurality of terminals 15 and 16, an opening 40a, etc., similar to the configuration of the above-mentioned Fabry-Perot interference filter 1. Therefore, even if the plurality of Fabry-Perot interference filter sections 1A remain in the state of a wafer 100, when a voltage is applied to each Fabry-Perot interference filter section 1A via the pair of terminals 15 and 16, the distance between the facing first mirror section 31 and second mirror section 32 changes due to electrostatic force. In this way, it can be said that a plurality of Fabry-Perot interference filters 1 arranged two-dimensionally are already formed and fixed (their relative positions are fixed) on the wafer 100. Furthermore, the effective area 101 includes a plurality of Fabry-Perot interference filters 1.

[0054] 7(b), in each dummy filter section 2A, an intermediate layer 23 is provided between the opposing first mirror section 31 and second mirror section 32. That is, in each dummy filter section 2A, the intermediate layer 23 does not define a gap S, and the second mirror section 32 is disposed on the surface 23a of the intermediate layer 23. Therefore, similar to the configuration of the dummy filter 2 described above, each dummy filter section 2A is provided with components such as a first electrode 12, a second electrode 13, a third electrode 14, a plurality of terminals 15 and 16, and an opening 40a, but the distance between the opposing first mirror section 31 and second mirror section 32 does not change. Note that each dummy filter section 2A does not necessarily have to be provided with components such as the first electrode 12, the second electrode 13, the third electrode 14, a plurality of terminals 15 and 16 (metal films such as aluminum that form the terminals 15 and 16, through holes for arranging the terminals 15 and 16, etc.), and the opening 40a. In this way, it can be said that a plurality of dummy filters 2 arranged two-dimensionally are already formed and fixed (their relative positions are fixed) on the wafer 100. Furthermore, the dummy area 102 includes a plurality of dummy filters 2.

[0055] As shown in FIGS. 6 and 7(a), first grooves 290 that open to the side opposite the substrate layer 110 are formed in the device layer 200. The first grooves 290 are formed along the lines 5. In each Fabry-Perot interference filter section 1A and each dummy filter section 2A, the first grooves 290 surround the first mirror section 31, the intermediate layer 23, and the second mirror section 32. In each Fabry-Perot interference filter section 1A, the first mirror section 31, the intermediate layer 23, and the second mirror section 32 are surrounded by the first groove 290 that is continuous in an annular shape. Similarly, in each dummy filter section 2A, the first mirror section 31, the intermediate layer 23, and the second mirror section 32 are surrounded by the first groove 290 that is continuous in an annular shape. When focusing on adjacent filter sections 1A, 1A, adjacent filter sections 1A, 2A, and adjacent filter sections 2A, 2A, the first groove 290 corresponds to the peripheral edge 34 of one filter section and the area on the peripheral edge 34 of the other filter section. The first groove 290 is connected in the effective area 101 and the dummy area 102, and reaches the outer edge 110c of the substrate layer 110 when viewed from the direction in which the first mirror section 31 and the second mirror section 32 face each other (hereinafter simply referred to as the "facing direction"). It is sufficient that the first groove 290 surrounds at least the second mirror section 32 in each Fabry-Perot interference filter section 1A and each dummy filter section 2A.

[0056] 7(b), second grooves 470 are formed in the stress adjustment layer 400, opening to the side opposite the substrate layer 110. The second grooves 470 are formed along the lines 5. That is, the second grooves 470 are formed to correspond to the first grooves 290. Here, the fact that the second grooves 470 correspond to the first grooves 290 means that the second grooves 470 overlap the first grooves 290 when viewed from the opposing direction. Therefore, the second grooves 470 are connected in the effective area 101 and the dummy area 102, and reach the outer edge 110c of the substrate layer 110 when viewed from the opposing direction.

[0057] When manufacturing the Fabry-Perot interference filter 1 and the dummy filter 2 from the above-described wafer 100, first, an expanding tape (an example of an adhesive layer 501 described later) is attached onto the protective layer 460 (i.e., on the second surface 110b side). Next, with the expanding tape attached to the second surface 110b side, laser light is irradiated from the side opposite the expanding tape, and while the focal point of the laser light is positioned inside the substrate layer 110, the focal point of the laser light L is relatively moved along each line 5. In other words, the laser light is incident on the substrate layer 110 from the side opposite the expanding tape through the surface of the polysilicon layer exposed in the first grooves 290.

[0058] The laser beam irradiation then forms modified regions within the substrate layer 110 along each line 5. The modified regions are regions whose density, refractive index, mechanical strength, and other physical properties differ from those of the surrounding area, and serve as the starting points for cracks extending in the thickness direction of the substrate layer 110. Examples of modified regions include melt-processed regions (meaning at least one of a region that has been melted and then re-solidified, a region in a molten state, and a region in the process of re-solidifying from a melt), crack regions, dielectric breakdown regions, and refractive index change regions, as well as mixtures of these. Further examples of modified regions include regions in which the density of the modified region has changed compared to the density of the unmodified region in the material of the substrate layer 110, and regions in which lattice defects have formed. When the material of the substrate layer 110 is single-crystal silicon, the modified regions can also be referred to as high-dislocation density regions. The number of rows of modified regions arranged in the thickness direction of the substrate layer 110 for each line 5 is appropriately adjusted depending on the thickness of the substrate layer 110.

[0059] Next, by expanding the expanding tape attached to the second surface 110b side, cracks are extended in the thickness direction of the substrate layer 110 from the modified regions formed inside the substrate layer 110, and the substrate layer 110 is cut into a plurality of substrates 11 along each line 5. At this time, the polysilicon layer of the second mirror layer 240 is cut along each line 5 in the first grooves 290, and the anti-reflection layer 410 and the protective layer 460 are cut along each line 5 in the second grooves 470. As a result, a plurality of Fabry-Perot interference filters 1 and a plurality of dummy filters 2 spaced apart from each other are obtained on the expanding tape. [One embodiment of a transport method]

[0060] FIG. 8 is a schematic cross-sectional view showing an example of a transportation method according to this embodiment. As shown in FIG. 8, in the transportation method according to this embodiment, a wafer 100 is the object 100A, 100B to be transported. That is, here, as shown in FIGS. 5 to 8, the object 100A, 100B is transported, which includes a plurality of Fabry-Perot interference filters 1 arranged two-dimensionally as a Fabry-Perot interference filter portion 1A. More specifically, the object 100A, 100B is a wafer 100 on which a plurality of Fabry-Perot interference filters 1 and a plurality of dummy filters 2 are formed. As described above, the wafer 100 is formed with an effective area 101 including a plurality of Fabry-Perot interference filters 1 (Fabry-Perot interference filter portion 1A), and a dummy area 102 surrounding the effective area 101 and forming an outer edge. The wafer 100 includes a main surface (first surface) 100s and a back surface (second surface) 100r opposite to the main surface 100s. The main surface 100s is the surface on the first mirror portion 31 and second mirror portion 32 side of the substrate 11 (substrate layer 110). Here, the main surface 100s is a surface that includes the main surface Ms of the membrane structure portion M of each Fabry-Perot interference filter 1, and is a surface that includes the outer surface of the second mirror portion 32. The back surface 100r is the surface opposite to the main surface 100s. Here, the back surface 100r is the surface that is opposite to the main surface Ms of the membrane structure portion M of each Fabry-Perot interference filter 1, and is the outer surface of the protective layer 460.

[0061] As shown in FIG. 8, a film 500 is attached to the objects 100A and 100B. The film 500 is attached to the back surface 100r of the objects 100A and 100B. Meanwhile, the main surfaces 100s of the objects 100A and 100B are not in contact with each other (i.e., there are no components or the like in contact with the main surfaces 100s) and are exposed to the atmosphere. Here, multiple Fabry-Perot interference filters 1 are arranged two-dimensionally with the same orientation (with the main surfaces Ms facing the side opposite the adhesive layer 501). That is, the main surfaces Ms of the membrane structure portions M of the Fabry-Perot interference filters 1 are located on the same plane.

[0062] The film 500 has various functions. Specifically, the film 500 includes an adhesive layer 501, a moisture-absorbing layer 502, and an adsorption layer 503. The adhesive layer 501 is adhered to the back surface 100r and forms contact with the back surface 100r. In other words, the objects 100A and 100B further include the adhesive layer 501 adhered to the back surface 100r. The adhesive layer 501 is, for example, an expandable tape used as described above when dicing the wafer 100 at the destination. The moisture-absorbing layer 502 is provided on the surface of the adhesive layer 501 opposite the back surface 100r (i.e., the objects 100A and 100B). The adsorption layer 503 is provided on the surface of the moisture-absorbing layer 502 opposite the adhesive layer 501. The adsorption layer 503 adsorbs and holds the microparticles by, for example, adhesive force or electrostatic force. Note that the entire surface of adhesive layer 501 may have adhesive force (i.e., be adhesive), or only a portion of the surface may have adhesive force (i.e., be adhesive). For example, the portion of adhesive layer 501 that abuts against back surface 100r may be an adhesive portion having adhesive force, and wafer 100 may be adhered and fixed to adhesive layer 501 at that adhesive portion.

[0063] The outer edge of the film 500 (here, the adhesive layer 501) protrudes outward from the outer edges of the objects 100A and 100B when viewed in a direction intersecting (orthogonal to) the main surface 100s. A support 510 is provided on the outer edge of the film 500 protruding from the object 100A. The support 510 is, for example, an annular (circular, for example) frame, and is adhered to the adhesive layer 501 below the film 500. The support 510 can be used in common, for example, when dicing the wafer 100 at the destination.

[0064] A storage container P is used to transport the objects 100A and 100B. The storage container P is, for example, box-shaped and has a space formed therein for storing multiple (here, two) objects 100A and 100B. This space is formed so that the multiple objects 100A and 100B can be stored side by side while being spaced apart from each other in the thickness direction (direction from the main surface 100s to the back surface 100r) (particularly, while preventing contact between the main surfaces Ms). On the inner surface Ps of the storage container P, a pair of protrusions Pa and a pair of protrusions Pb are provided for each object 100A and 100B. The corresponding protrusions Pa are formed at the same positions in the vertical direction. The corresponding protrusions Pb are formed at the same positions in the vertical direction, spaced downward from the protrusion Pa. The pair of protrusions Pa and Pb aligned vertically form a clamping portion that clamps the support 510 in the vertical direction. In addition, each of a pair of convex portions Pa, Pb for one object 100A, 100B may be connected to each other and formed integrally (for example, in a circular, semicircular, or U-shaped shape) when viewed in a plane (for example, when viewed from the direction from convex portion Pa to convex portion Pb), or may be separated from each other and formed separately.

[0065] In the transportation method according to this embodiment, first, the objects 100A and 100B are accommodated in a storage container P (first step). In this step, the objects 100A and 100B are accommodated and supported in the storage container P with a plurality of Fabry-Perot interference filters 1 arranged two-dimensionally. As described above, the objects 100A and 100B are wafers 100. Therefore, in this case, the objects 100A and 100B are accommodated and supported in the storage container P with a plurality of Fabry-Perot interference filters 1 arranged two-dimensionally as the wafer 100. That is, in this step, the objects 100A and 100B including a plurality of Fabry-Perot interference filters 1 arranged two-dimensionally and in a sheet-like shape (i.e., a thin plate-like shape) that is substantially undeformable are accommodated in the storage container P. The objects 100A and 100B are accommodated and supported in a storage container P so that the main surfaces 100s (i.e., main surfaces Ms, the same applies below) of the objects 100A and 100B do not come into contact with each other. Here, with the main surfaces 100s facing downward, a support 510 is inserted between the convex portions Pa and Pb, and the support 510 is sandwiched between the convex portions Pa and Pb in the vertical direction, thereby supporting the objects 100A and 100B so that the entire objects 100A and 100B do not come into contact with the inner surface Ps of the storage container P within the storage container P.

[0066] As described above, the objects 100A and 100B are provided with the film 500. Therefore, in this step, the objects 100A and 100B are accommodated in the storage container P, and the moisture absorbing layer 502 and the adsorbent layer 503 are disposed in the storage container P. In particular, in this step, the objects 100A and 100B are accommodated and supported in the storage container P such that the adsorbent layer 503 of one object 100B faces the main surface 100s of the other object 100A below the main surface 100s.

[0067] Next, the entire storage container P is placed in a vacuum pack, and the vacuum pack is evacuated to create a vacuum inside the storage container P (second step). After that, the storage container P and the objects 100A and 100B inside the storage container P are transported together with the vacuum pack to a desired location. This allows multiple Fabry-Perot interference filters 1 to be transported all at once.

[0068] As described above, in the transportation method according to this embodiment, the objects 100A and 100B to be transported include a plurality of Fabry-Perot interference filters 1 (Fabry-Perot interference filter portions 1A). In the first step, the Fabry-Perot interference filters 1 are accommodated and supported in a storage container P in a two-dimensional array. In this way, when a plurality of Fabry-Perot interference filters 1 are arranged two-dimensionally, it is easier to accommodate (insert, arrange) and support them collectively in the storage container P so as not to come into contact with the mirror portions (main surfaces Ms of the membrane structure portions M), such as the first mirror portion 31 and the second mirror portion 32, compared to handling the Fabry-Perot interference filters 1 individually. Therefore, this method enables transportation of a plurality (a large number) of Fabry-Perot interference filters 1 with a simple configuration while reducing the risk of breakage.

[0069] The membrane structure M is a component of the Fabry-Perot interference filter 1 that is relatively susceptible to damage. Therefore, forming the membrane structure M at an early stage (at the wafer 100 stage) is thought to increase the risk of damage. For example, if the membrane structure M is formed at the wafer 100 stage, and water is used in the subsequent cutting process, the membrane-like second mirror portion 32 floating on the gap S may be damaged by water pressure, or water may enter the gap S, causing sticking (a phenomenon in which the second mirror portion 32 comes into contact with the first mirror portion 31 and becomes immobile).

[0070] Furthermore, in a wafer 100 on which membrane structures M are arranged, there is a risk that many Fabry-Perot interference filters 1 may become defective at once due to the intrusion of foreign matter, etc. Furthermore, there is a concern that the membrane structures M may be affected by shaking, vibration, etc. during transportation. Therefore, when attempting to transport a large number of Fabry-Perot interference filters 1 without using individual containers, in order to transport them as a wafer 100 including the membrane structures M, consideration must be given to measures to reduce the risk of damage. In contrast, according to the transportation method of this embodiment, as described above, by handling a large number of Fabry-Perot interference filters 1 in a two-dimensionally arranged state and storing and supporting them in a storage container P, it is possible to transport a large number of Fabry-Perot interference filters 1 collectively while reducing the risk of damage. Note that, as described above, in this embodiment, the problem of using water can be solved by adopting a method of cutting the wafer 100 by forming modified regions inside the substrate layer 110 along each line 5 by irradiating it with laser light.

[0071] In the transportation method according to this embodiment, the objects 100A and 100B are wafers 100 on which a plurality of Fabry-Perot interference filters 1 are formed. The wafer 100 includes a main surface 100s (first surface) on the side of the substrate 11 (substrate layer 110) facing the first mirror section 31 and the second mirror section 32, and a back surface (second surface) 100r on the opposite side of the main surface 100s. In a first step, the objects 100A and 100B are accommodated and supported in a storage container P in a state in which a plurality of Fabry-Perot interference filters 1 are two-dimensionally arranged as the wafer 100. In this way, a plurality of Fabry-Perot interference filters 1 are integrated as the wafer 100. This allows a large number (plurality of) Fabry-Perot interference filters 1 to be accommodated and transported with a simpler configuration while reducing the risk of breakage.

[0072] In the transportation method according to this embodiment, an adhesive layer 501 is provided on the back surface 100r of the wafer 100, which is opposite to the main surface 100s. A support 510 is provided on the outer edge of the adhesive layer 501, and convex portions (clamping portions) Pa and Pb that vertically clamp the support 510 are provided on the inner surface Ps of the storage container P. Then, in the first step, the support 510 is clamped by the convex portions Pa and Pb, thereby supporting the objects 100A and 100B in the storage container P. In this way, multiple Fabry-Perot interference filters 1 are integrated as the wafer 100. Therefore, damage to the Fabry-Perot interference filters 1 due to contact with the clamping portions is prevented when the objects 100A and 100B are stored and supported.

[0073] In the transportation method according to this embodiment, in a first step, the objects 100A and 100B are supported in the storage container P by clamping the support 510 between the convex portions Pa and Pb with the main surface 100s facing downward. Therefore, the mirror portion (the main surface Ms of the membrane structure portion M) faces downward in the storage container P. Therefore, even if the mirror portion (membrane structure portion M) of one Fabry-Perot interference filter 1 is damaged, the influence of the broken pieces is unlikely to extend to other Fabry-Perot interference filters 1.

[0074] In the transportation method according to this embodiment, a hygroscopic layer 502 is provided on the surface of the adhesive layer 501 opposite to the main surface 100s, and an adsorption layer 503 is provided on the surface of the hygroscopic layer 502 opposite to the adhesive layer 501. In the first step, the objects 100A and 100B are accommodated and supported in a storage container P so that the adsorption layer 503 of one object 100B faces the main surface 100s of another object 100A below the main surface 100s. Therefore, the hygroscopic layer 502 and the adsorption layer 503 can be disposed in the storage container P at the same time as the objects 100A and 100B are accommodated in the storage container P. Particularly in this case, the hygroscopic layer 502 can be disposed closer to the Fabry-Perot interference filter 1 than when a hygroscopic member is disposed on, for example, the bottom of the storage container P. Furthermore, the adsorption layer 503 is disposed below the main surface Ms of the membrane structure M so as to face the main surface Ms. Therefore, even if damage occurs to the membrane structure M in one Fabry-Perot interference filter 1, the fragments will be adsorbed onto the adsorption layer 503 in the storage container P (for example, the adsorption layer 503 on the back surface 100r of the object adjacent to the object containing the damaged Fabry-Perot interference filter 1), thereby preventing the impact from spreading to other Fabry-Perot interference filters 1.

[0075] The transportation method according to this embodiment includes, after the first step, a second step of placing the storage container P in a vacuum pack and evacuating the vacuum pack to create a vacuum inside the storage container P. In this case, it is possible to create a vacuum inside the storage container P without affecting the Fabry-Perot interference filter 1.

[0076] The above embodiment has described one embodiment of the transporting method according to the present invention. Therefore, the transporting method according to the present invention is not limited to the above-described method and can be any modified version of the above-described method. Next, modified versions of the transporting method will be described. In the wafer 100, when viewed from the thickness direction of the substrate layer 110, the outer shapes of the Fabry-Perot interference filter sections 1A and the dummy filter sections 2A do not need to be identical. Furthermore, when cutting out multiple Fabry-Perot interference filters 1 from the wafer 100, it is not necessary to cut out all of the dummy filter sections 2A (i.e., it is not necessary to individualize all of the dummy filter sections 2A). Furthermore, the configuration of the dummy area 102 is not limited to the above-described one. For example, in the region corresponding to the dummy area 102, at least the second mirror section 32 does not need to be surrounded by the annular continuous first groove 290 (for example, the first groove 290 may simply cross the region corresponding to the dummy area 102), and the first groove 290 does not need to be formed in the device layer 200. Furthermore, a part of the device layer 200 or the entire device layer 200 may not be provided in the region corresponding to the dummy area 102. In other words, the dummy area is not an essential component of the wafer to be transported.

[0077] FIG. 9 is a schematic cross-sectional view showing an example of a transportation method according to a modified example. As shown in FIG. 9, the objects 100A and 100B here include an adhesive layer 501 and a plurality of Fabry-Perot interference filters 1 that are configured separately from each other, arranged two-dimensionally, and adhered to the adhesive layer 501. The plurality of Fabry-Perot interference filters 1 are preferably fixed while spaced apart from each other to prevent them from coming into contact with each other and being damaged. In this case, the two-dimensional arrangement is not limited to a periodic arrangement (e.g., a two-dimensional lattice-like arrangement) and may be an arrangement in which the filters are randomly distributed within a predetermined plane. Furthermore, the main surfaces Ms of the membrane structure portions M of each Fabry-Perot interference filter 1 (the first surface on the side of the first mirror portion 31 and the second mirror portion 32 with respect to the substrate 11 of the Fabry-Perot interference filter 1, and the second surface opposite the first surface) are located on the same plane. Such objects 100A, 100B can be constructed, for example, by manufacturing Fabry-Perot interference filters 1 by dicing the wafer 100 as described above, then picking them up and adhering them to the adhesive layer 501. That is, sheet-like objects 100A, 100B including a plurality of Fabry-Perot interference filters 1 are formed. In this state, the sheet-like objects 100A, 100B are deformable depending on the flexibility of the adhesive layer 501. Then, by supporting the outer edge of the adhesive layer 501 on a support 510, the plurality of Fabry-Perot interference filters 1 are two-dimensionally arranged and fixed so that their relative positions do not change (a sheet-like object that does not substantially deform). Here, the objects 100A, 100B do not include dummy filters 2. In this case, too, in the first step, the support 510 is clamped between the convex portions Pa and Pb with the main surface Ms (the first surface described above) of the membrane structure portion M of each Fabry-Perot interference filter 1 facing downward, thereby allowing the sheet-like objects 100A and 100B to be accommodated (inserted, placed) and supported in the storage container P as described above.

[0078] In this case, multiple Fabry-Perot interference filters 1, each constructed separately from the other, are arranged in a two-dimensional sheet shape and adhered (fixed) to the adhesive layer 501. This makes it easier to store and support the filters without contacting the mirror portion (the main surface Ms (first surface) of the membrane structure M). Furthermore, in this case, when the Fabry-Perot interference filters 1 are manufactured by dicing the wafer 100 and then picked up, any Fabry-Perot interference filters 1 determined to be defective in a prior inspection can be removed, allowing only non-defective filters to be transported, without including any defective ones. Furthermore, the first surface faces downward within the storage container P. This makes it difficult for the influence of the broken pieces to reach other Fabry-Perot interference filters 1, even if the mirror portion (membrane structure M) of one Fabry-Perot interference filter 1 is damaged. Furthermore, even if damage occurs to the mirror portion (membrane structure portion M) of one Fabry-Perot interference filter 1, the fragments are adsorbed onto the adsorption layer 503, thereby preventing the damage from spreading to other Fabry-Perot interference filters 1.

[0079] In the above example, the objects 100A and 100B are supported in the storage container P via the film 500 and the support 510. However, the film 500 and the support 510 do not have to be used. That is, a clamping portion that vertically clamps the object, which is the wafer 100, in the dummy area 102 may be provided on the inner surface Ps of the storage container P, and in the first step, the object may be supported in the storage container P by clamping the dummy area 102 with the clamping portion while the main surface 100s faces downward. In this case, the object can be supported in the storage container P without using a separate member such as the support 510. Furthermore, since the dummy area 102 is provided on the outer edge of the object, which is the wafer 100, the strength of the wafer 100 is improved and warping is suppressed. This makes it easier to store the object in the storage container P.

[0080] 10, a substantially undeformable sheet-like (i.e., plate-like) wafer 600 formed by bonding a first wafer 610 and a second wafer 620 may be the object of transportation. The wafer 600 includes a plurality of Fabry-Perot interference filter portions 650A. The plurality of Fabry-Perot interference filter portions 650A are portions that will become a plurality of Fabry-Perot interference filters 650 when the wafer 600 is cut along lines 5 set on each of the first wafer 610 and the second wafer 620. When viewed in the thickness direction of the wafer 600, the plurality of Fabry-Perot interference filter portions 650A are two-dimensional.

[0081] The first wafer 610 includes a substrate layer 611, a plurality of first mirror portions 612, and a plurality of drive electrodes 613. The substrate layer 611 has a surface 611a and a surface 611b facing each other. The substrate layer 611 is formed of an optically transparent material. Each of the first mirror portions 612 is, for example, a metal film, a dielectric multilayer film, or a composite film thereof. Each of the drive electrodes 613 is, for example, formed of a metal material.

[0082] The second wafer 620 includes a substrate layer 621, a plurality of second mirror portions 622, and a plurality of drive electrodes 623. The substrate layer 621 has a surface 621a and a surface 621b facing each other. The substrate layer 621 is formed of an optically transparent material. Each second mirror portion 622 is, for example, a metal film, a dielectric multilayer film, or a composite film thereof. Each drive electrode 623 is, for example, formed of a metal material.

[0083] In the wafer 600, one Fabry-Perot interference filter section 650A is configured by one first mirror section 612, one drive electrode 613, one second mirror section 622, and one drive electrode 623. Below, the configuration of the wafer 600 will be described, focusing on one Fabry-Perot interference filter section 650A.

[0084] A recess 614 is formed on a surface 611a of the substrate layer 611. A protrusion 615 is provided on a bottom surface 614a of the recess 614. The height of the protrusion 615 is smaller than the depth of the recess 614. In other words, an end surface 615a of the protrusion 615 is recessed with respect to the surface 611a of the substrate layer 611. The first mirror 612 is provided on the end surface 615a of the protrusion 615. The drive electrode 613 is provided on the bottom surface 614a of the recess 614 so as to surround the protrusion 615. The drive electrode 613 is electrically connected to an electrode pad (not shown), for example, via wiring (not shown) provided on the substrate layer 611. The electrode pad is provided, for example, in an area of ​​the substrate layer 611 that is accessible from the outside.

[0085] A surface 621b of the substrate layer 621 is bonded to a surface 611a of the substrate layer 611 by, for example, a plasma polymerization film. A second mirror section 622 and a driving electrode 623 are provided on the surface 621b of the substrate layer 621. The second mirror section 622 faces the first mirror section 612 across a gap S. The driving electrode 623 is provided on the surface 621b of the substrate layer 621 so as to surround the second mirror section 622, and faces the driving electrode 613 across the gap S. The driving electrode 623 is electrically connected to an electrode pad (not shown), for example, via wiring (not shown) provided on the substrate layer 621. The electrode pad is provided, for example, in an area of ​​the substrate layer 621 that is accessible from the outside.

[0086] A groove 621c is formed in the surface 621a of the substrate layer 621 so as to surround the second mirror portion 622 and the driving electrode 623 when viewed from the thickness direction of the wafer 600. The groove 621c extends in an annular shape. The portion of the substrate layer 621 surrounded by the groove 621c serves as a diaphragm-shaped holder 621d, which is displaceable in the thickness direction of the wafer 600. Note that the diaphragm-shaped holder 621d may be configured by forming a groove surrounding the second mirror portion 622 and the driving electrode 623 when viewed from the thickness direction of the wafer 600 on at least one of the surface 621a and the surface 621b of the substrate layer 621. Alternatively, a groove surrounding the first mirror portion 612 and the driving electrode 613 when viewed from the thickness direction of the wafer 600 may be formed in the substrate layer 611, thereby configuring a diaphragm-shaped holder in the substrate layer 611. Furthermore, instead of the diaphragm-shaped holding portion, the holding portion may be configured by a plurality of beams arranged radially.

[0087] In the wafer 600 in which each Fabry-Perot interference filter section 650A is configured as described above, when a voltage is applied between the driving electrode 613 and the driving electrode 623 in each Fabry-Perot interference filter section 650A, an electrostatic force corresponding to the voltage is generated between the driving electrode 613 and the driving electrode 623. The electrostatic force attracts the portion of the substrate layer 621 surrounded by the groove 621c toward the substrate layer 611, thereby adjusting the distance between the first mirror section 612 and the second mirror section 622. As a result, light having a wavelength corresponding to the distance between the first mirror section 612 and the second mirror section 622 is transmitted.

[0088] The wafer 600 as the object to be transported includes a plurality of Fabry-Perot interference filters 650 arranged two-dimensionally. The Fabry-Perot interference filter 650 includes a substrate formed from a substrate layer 611, and a first mirror section 612 and a second mirror section 622 provided on the substrate, facing each other with a gap S therebetween and with a variable distance between them. In addition, in the wafer 600 and the Fabry-Perot interference filter 650, when the substrate layer 611 is used as a reference, a first surface on the side of the first mirror section 31 and the second mirror section 32 relative to the substrate layer 611 (and the substrate formed from the substrate layer 611) is a surface 621a of the substrate layer 621 (and the substrate formed from the substrate layer 621). In addition, a second surface opposite the first surface is a surface 611b of the substrate layer 611 (and the substrate formed from the substrate layer 611).

[0089] When such a wafer 600 is transported as the object, in the first step, the object is accommodated in the container P, as in the above case. In this case, in the first step, the object is accommodated and supported in the container P in a state where a plurality of Fabry-Perot interference filters 650 are two-dimensionally arranged. [Explanation of symbols]

[0090] 1,650...Fabry-Perot interference filter, 2...dummy filter, 11...substrate, 31...first mirror portion, 32...second mirror portion, 100,600...wafer, 100A, 100B...object, 101...effective area, 102...dummy area, 501...adhesive layer, 502...moisture absorption layer, 503...adsorption layer, P...storage container, Ps...inner surface, Pa, Pb...convex portion (clamping portion).

Claims

1. 1. A method for transporting an object including a plurality of Fabry-Perot interference filters, comprising: a first step of storing the object in a storage container, the Fabry-Perot interference filter includes a substrate, and a first mirror portion and a second mirror portion provided on the substrate, facing each other with a gap therebetween and with a variable distance therebetween; the object is a wafer on which the plurality of Fabry-Perot interference filters are formed, the wafer includes a first surface on a side of the substrate facing the first mirror portion and the second mirror portion, and a second surface opposite to the first surface, In the first step, the object is accommodated and supported in the accommodation container in a state where the plurality of Fabry-Perot interference filters are two-dimensionally arranged as the wafer and each of the plurality of Fabry-Perot interference filters is spaced apart from a bottom surface of the accommodation container via a gap; the object includes an adhesive layer adhered to the second surface; a support is provided on the outer edge of the adhesive layer, In the first step, the object is supported in the container by supporting the support. Transportation method.

2. In the first step, the object is supported in the container by supporting the support in a vertical direction with the first surface facing downward. The method of claim 1.

3. A method for transporting an object including a plurality of Fabry-Perot interference filters, comprising: a first step of storing the object in a storage container, the Fabry-Perot interference filter includes a substrate, and a first mirror portion and a second mirror portion provided on the substrate, facing each other with a gap therebetween and with a variable distance therebetween; the object is a wafer on which the plurality of Fabry-Perot interference filters are formed, the wafer includes a first surface on a side of the substrate facing the first mirror portion and the second mirror portion, and a second surface opposite to the first surface, In the first step, the object is accommodated and supported in the accommodation container in a state where the plurality of Fabry-Perot interference filters are two-dimensionally arranged as the wafer and each of the plurality of Fabry-Perot interference filters is spaced apart from a bottom surface of the accommodation container via a gap; the wafer is formed with an effective area including the plurality of Fabry-Perot interference filters and an outer edge surrounding the effective area; In the first step, the object is supported in the container by supporting the outer edge. Transportation method.

4. In the first step, the object is supported in the container by supporting the outer edge in a vertical direction with the first surface facing downward. The method of claim 3.

5. A method for transporting an object including a plurality of Fabry-Perot interference filters, comprising: a first step of storing the object in a storage container, the Fabry-Perot interference filter includes a substrate, and a first mirror portion and a second mirror portion provided on the substrate, facing each other with a gap therebetween and with a variable distance therebetween; In the first step, the object is supported in the container in a state where the plurality of Fabry-Perot interference filters are two-dimensionally arranged and each of the plurality of Fabry-Perot interference filters is spaced apart from a bottom surface of the container via a gap; the object includes an adhesive layer; and the plurality of Fabry-Perot interference filters that are formed separately from one another, two-dimensionally arranged, and adhered to the adhesive layer; a support is provided on the outer edge of the adhesive layer, the Fabry-Perot interference filter includes a first surface on the first mirror portion and the second mirror portion side of the substrate, and a second surface on the opposite side to the first surface and bonded to the adhesive layer, In the first step, the object is supported in the container by supporting the support body with the first surface facing downward. Transportation method.

6. a moisture absorbing layer is provided on a surface of the adhesive layer opposite to the second surface, an adsorption layer is provided on the surface of the moisture absorption layer opposite to the adhesive layer, In the first step, the object is accommodated and supported in the accommodation container so that the adsorption layer of one of the objects faces the first surface of another of the objects below the first surface of the other object. The transportation method according to claim 1 or 5.

7. a second step of housing the storage container in a vacuum pack after the first step, and evacuating the vacuum pack to create a vacuum inside the storage container; The transportation method according to any one of claims 1 to 6.

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