Circulation device and method for controlling circulation device

Abstract

To provide a technique for efficiently exchanging a residual processing liquid.SOLUTION: Before a new processing liquid is filled, the temperature of the processing liquid remaining in a pipe is increased. A high-temperature liquid has lower viscosity and is more likely to be discharged from piping. After the remaining processing liquid is discharged, the processing liquid newly stored in a storage tank is circulated through an external path.SELECTED DRAWING: Figure 20

Description

[Technical Field]

[0001] The present disclosure relates to a circulation device and a method for controlling the same. [Background technology]

[0002] In the manufacturing process of semiconductor devices, the surface of a substrate such as a semiconductor wafer is treated with a chemical solution. An example of such a treatment is a cleaning treatment, and an example of such a chemical solution (hereinafter, also referred to as a "treatment solution", including a rinse solution and an organic solvent) is an acidic liquid.

[0003] For example, in a single-substrate processing apparatus, in which substrates are processed one by one, the substrates are rotated while being held substantially horizontally, and a processing solution is supplied to the surface of the rotating substrate. Such processing is carried out in a processing enclosure commonly referred to as a chamber.

[0004] The processing liquid is supplied to the substrate, then collected and reused. Specifically, the processing liquid is supplied to the chamber, and after being used for processing, the processing liquid is collected. Such supply and collection of the processing liquid is performed by a circulation device provided outside the chamber.

[0005] When a plurality of chambers are provided, each chamber is housed in a processing unit. The processing units are stacked in a substantially vertical direction and are included in a configuration commonly called a tower. A plurality of towers may be provided.

[0006] The supply of the processing liquid from the circulation device and the recovery of the processing liquid to the circulation device are performed for each tower, and the supply and recovery of the processing liquid to the multiple chambers are performed for each tower.

[0007] The circulation device performs a circulation process (tentatively referred to as "external circulation") in which the treatment liquid is supplied to and recovered from the tower, as well as a circulation process (tentatively referred to as "internal circulation") in which the treatment liquid is circulated inside the circulation device without passing through the tower.

[0008] External circulation and internal circulation for each of these towers are mentioned, for example, in the following Patent Document 1. Furthermore, the use of sulfuric acid as the treatment liquid is mentioned, for example, in the following Patent Document 2.

[0009] Furthermore, the discharge of the processing liquid by its own weight is mentioned in the following Patent Documents 3, 4, and 5. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Patent Publication No. 2021-052038 [Patent Document 2] Japanese Patent Publication No. 2020-088208 [Patent Document 3] Japanese Patent Publication No. 2021-174973 [Patent Document 4] Patent No. 5860731 [Patent Document 5] Patent Publication No. 2021-44476 Summary of the Invention [Problem to be solved by the invention]

[0011] The trunk device has a storage tank for storing the treatment solution. In both external and internal circulation, the treatment solution is temporarily stored in the storage tank.

[0012] The processing liquid is exchanged to improve its processing capacity. This exchange is also referred to as "liquid exchange" for convenience. In liquid exchange, the processing liquid stored in the storage tank is mainly discharged, and new processing liquid is stored in the storage tank. Processing liquid remaining in routes other than the storage tank, such as the external circulation and internal circulation, is also subject to discharge.

[0013] The amount and temperature of the treatment liquid remaining in the external circulation path, for example, in the tower, vary depending on the situation. The same is true for the internal circulation path. To efficiently exchange the liquid in response to such situations, it is desirable to discharge the remaining treatment liquid for a time period that corresponds to its temperature. If the temperature of the treatment liquid is low, the viscosity of the treatment liquid is high, and if the viscosity of the treatment liquid is high, the time required for discharge is long.

[0014] It is desirable to complete the draining of the processing liquid remaining in the circulation device before introducing new processing liquid into the circulation device. Therefore, one possible approach is to estimate the time from the start to the completion of draining for each temperature of the remaining processing liquid (hereinafter also referred to as the "required drain time"), and then introduce new processing liquid into the circulation device after the required drain time has elapsed since the circulation device started its draining operation. However, this approach requires that the required drain time be estimated in advance for each temperature of the remaining processing liquid.

[0015] It is believed that it is sufficient to estimate the required drain time for each temperature as long as the required drain time for the expected lower limit (e.g., room temperature) of the temperature of the remaining processing liquid is estimated. The viscosity of the remaining processing liquid is equal to or lower than the viscosity of the remaining processing liquid at the lower limit temperature. After the required drain time for the lower limit has elapsed, the remaining processing liquid is considered to have been completely drained, regardless of the temperature of the remaining processing liquid.

[0016] However, the higher the temperature of the remaining processing liquid is, the longer the time required for such discharge becomes, which poses a problem of poor efficiency in liquid exchange.

[0017] The present disclosure has been made in view of the above-mentioned problems, and aims to provide a technique for efficiently replacing remaining processing liquid. [Means for solving the problem]

[0018] A first aspect of a method for controlling a circulation device according to the present disclosure is a method for controlling a circulation device that supplies and recovers a liquid to and from an external path, the circulation device including: a storage tank for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the storage tank and used for the supply of the liquid; a first valve connected to the storage tank and controlling the discharge of the liquid from the storage tank to the outside of the circulation device; a pump provided in the first pipe, having an inlet connected to the first inlet end and an outlet, and for pressing the liquid; a heater provided in the first pipe and connected to the outlet end for heating the liquid; a second pipe having a second outlet end through which the liquid flows into the storage tank and used for the recovery of the liquid; and the second pipe. a third pipe having a third outlet end through which the liquid is discharged into the storage tank and which is a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device; a third valve provided in the third pipe and controlling the flow of the liquid from the third outlet end to the storage tank; a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end and which is a path for the discharge of the liquid from the second pipe to the outside of the circulation device; and a fourth valve provided in the fourth pipe and controlling the discharge of the liquid.

[0019] The method in the first aspect includes a first step of closing the first valve, the third valve, and the fourth valve, opening the second valve, driving the heater to heat the liquid, and driving the pump during a first period; a second step of stopping the pump, opening the first valve, the second valve, and the fourth valve, and closing the third valve during a second period after the first period; a third step of stopping the pump, closing the first valve, and opening the third valve during a third period after the second period; and a fourth step of closing the first valve, the third valve, and the fourth valve, opening the second valve, driving the heater to heat the liquid, and driving the pump during a fourth period after the third period.

[0020] A second aspect of the method for controlling a circulation device according to the present disclosure is the first aspect. In the second aspect, the circulation device further includes: a fifth pipe having a fifth outlet end through which the liquid flows out to the storage tank and connected to the first pipe on the opposite side of the heater from the pump; a fifth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the opposite side of the fifth valve from the fifth outlet end and serving as a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a sixth valve provided in the sixth pipe and controlling the discharge of the liquid.

[0021] In the method of the second aspect, the fifth valve and the sixth valve are closed in the first step, the fifth valve and the sixth valve are opened in the second step, and the fifth valve is opened and the sixth valve is closed in the fourth step.

[0022] The method in the second aspect further includes a fifth step of closing the first valve, the second valve, the third valve, the fourth valve, and the sixth valve, opening the fifth valve, driving the heater to heat the liquid, and driving the pump during a fifth period between the third period and the fourth period.

[0023] A third aspect of the method for controlling a circulation device according to the present disclosure is the second aspect. In the third aspect, the circulation device further includes a filter provided in the first pipe between the heater and the fifth and sixth pipes; a seventh pipe having a seventh outlet end through which the liquid flows into the storage tank and connected to the first pipe between the heater and the filter; a seventh valve provided in the seventh pipe and controlling the outflow of the liquid from the seventh outlet end to the storage tank; an eighth pipe connected to the seventh pipe on the opposite side of the seventh valve from the seventh outlet end and serving as a path for discharging the liquid from the seventh pipe to the outside of the circulation device; an eighth valve provided in the eighth pipe and controlling the discharge of the liquid; a ninth pipe connected to the filter and serving as a path for discharging the liquid from the filter to the outside of the circulation device; and a ninth valve provided in the ninth pipe and controlling the discharge of the liquid.

[0024] In the method of the third aspect, the seventh valve, the eighth valve, and the ninth valve are closed in the first step, the seventh valve, the eighth valve, and the ninth valve are opened in the second step, and the seventh valve, the eighth valve, and the ninth valve are closed in the fourth step and the fifth step.

[0025] The method in the third aspect further includes a sixth step of closing the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the eighth valve, and the ninth valve, opening the seventh valve, driving the heater to heat the liquid to a temperature lower than or equal to the temperature of the liquid in the fifth period, and driving the pump, during a sixth period between the third period and the fifth period.

[0026] A fourth aspect of the method for controlling a circulation device according to the present disclosure is the third aspect. In the fourth aspect, the circulation device further includes a tenth valve connected to the outlet and controlling the discharge of the liquid to the outside of the circulation device.

[0027] The method in the fourth aspect further includes a seventh step of closing the tenth valve in the first step, the second step, the third step, the fourth step, the fifth step, the sixth step, the seventh valve, the eighth valve, and the ninth valve in a seventh period between the third period and the sixth period, closing the tenth valve, opening the tenth valve, and driving the pump.

[0028] A first aspect of a circulation device according to the present disclosure is a circulation device that supplies and recovers a liquid to an external path, comprising: a storage tank that stores the liquid; a first pipe that has a first inlet end through which the liquid flows from the storage tank and is used for the supply of the liquid; a first valve that is connected to the storage tank and controls the discharge of the liquid from the storage tank to the outside of the circulation device; a pump that is provided in the first pipe, has an intake port connected to the first inlet end and an outlet port, and is used for pressing out the liquid; a heater that is provided in the first pipe and is connected to the outlet port, and is used for heating the liquid; a second pipe that has a second outlet end through which the liquid flows out to the storage tank and is used for the recovery of the liquid; a third pipe having a third outlet end through which the liquid is discharged into the storage tank and which is a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device; a third valve provided in the third pipe and controlling the flow of the liquid from the third outlet end to the storage tank; a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end and which is a path for discharging the liquid from the second pipe to the outside of the circulation device; a fourth valve provided in the fourth pipe and controlling the discharge of the liquid; and a control unit that controls the first valve, the second valve, the third valve, the fourth valve, the pump, and the heater.

[0029] The control unit closes the first valve, the third valve, and the fourth valve, opens the second valve, drives the heater to heat the liquid, and drives the pump during a first period; stops the pump, opens the first valve, the second valve, and the fourth valve, and closes the third valve during a second period after the first period; stops the pump, closes the first valve, and opens the third valve during a third period after the second period; and closes the pump, closes the first valve, and opens the third valve during a fourth period after the third period; closes the first valve, the third valve, and the fourth valve, and opens the second valve, drives the heater to heat the liquid, and drives the pump.

[0030] A second aspect of the circulation device according to the present disclosure is the first aspect. In the second aspect, the circulation device further includes: a fifth pipe having a fifth outlet end through which the liquid flows out to the storage tank and connected to the first pipe on the opposite side of the heater from the pump; a fifth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the opposite side of the fifth valve from the fifth outlet end and serving as a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a sixth valve provided in the sixth pipe and controlling the discharge of the liquid.

[0031] In the second aspect, the control unit closes the fifth valve and the sixth valve in the first period, opens the fifth valve and the sixth valve in the second period, opens the fifth valve and closes the sixth valve in the fourth period, and closes the first valve, the second valve, the third valve, the fourth valve and the sixth valve and opens the fifth valve in a fifth period between the third period and the fourth period, drives the heater to heat the liquid, and drives the pump.

[0032] A third aspect of the circulation device according to the present disclosure is the second aspect. In the third aspect, the circulation device further includes a filter provided in the first pipe between the heater and the fifth and sixth pipes; a seventh pipe having a seventh outlet end through which the liquid flows into the storage tank and connected to the first pipe between the heater and the filter; a seventh valve provided in the seventh pipe and controlling the outflow of the liquid from the seventh outlet end to the storage tank; an eighth pipe connected to the seventh pipe on the opposite side of the seventh valve from the seventh outlet end and serving as a path for discharging the liquid from the seventh pipe to the outside of the circulation device; an eighth valve provided in the eighth pipe and controlling the discharge of the liquid; a ninth pipe connected to the filter and serving as a path for discharging the liquid from the filter to the outside of the circulation device; and a ninth valve provided in the ninth pipe and controlling the discharge of the liquid.

[0033] In the third aspect, the control unit closes the seventh, eighth, and ninth valves during the first period, opens the seventh, eighth, and ninth valves during the second period, closes the seventh, eighth, and ninth valves during the fourth and fifth periods, and closes the first, second, third, fourth, fifth, sixth, eighth, and ninth valves and opens the seventh valve during a sixth period between the third and fifth periods, drives the heater to heat the liquid to a temperature lower than the temperature of the liquid during the fifth period, and drives the pump.

[0034] A fourth aspect of the circulation device according to the present disclosure is the third aspect. In the fourth aspect, the circulation device further includes a tenth valve connected to the outlet and controlling the discharge of the liquid to the outside of the circulation device.

[0035] In the fourth aspect, the control unit closes the tenth valve during the first period, the second period, the third period, the fourth period, the fifth period, and the sixth period, and closes the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the seventh valve, the eighth valve, and the ninth valve, and opens the tenth valve, and drives the pump during a seventh period between the third period and the sixth period. [Effects of the Invention]

[0036] The first aspect of the control method for a circulation device according to the present disclosure and the first aspect of the circulation device according to the present disclosure efficiently discharge the remaining liquid, thereby contributing to improving the efficiency of liquid exchange.

[0037] The second aspect of the control method for a circulation device according to the present disclosure and the second aspect of the circulation device according to the present disclosure lower the viscosity of the liquid used for extracellular circulation, thereby contributing to smooth extracellular circulation.

[0038] The third aspect of the control method for a circulation device according to the present disclosure and the third aspect of the circulation device according to the present disclosure contribute to smooth internal circulation.

[0039] The fourth aspect of the control method for a circulation device according to the present disclosure and the fourth aspect of the circulation device according to the present disclosure contribute to replacing the liquid remaining in the pump. [Brief explanation of the drawings]

[0040] [Figure 1] 1 is a cross-sectional view schematically showing a substrate processing apparatus. [Figure 2] 1 is a vertical cross-sectional view schematically showing a substrate processing apparatus. [Figure 3] FIG. 3 is a longitudinal cross-sectional view schematically showing a longitudinal cross-section of the substrate processing apparatus taken along line III-III. [Figure 4] FIG. 10 is a side view schematically illustrating an example of a configuration of the left part of the processing block as viewed in the left direction. [Figure 5]FIG. 10 is a side view schematically illustrating an example of a configuration of the right part of the processing block as viewed in the right direction. [Figure 6] FIG. 2 is a cross-sectional view schematically showing the configuration of a processing unit. [Figure 7] FIG. 2 is a vertical cross-sectional view schematically showing the configuration of a processing unit. [Figure 8] FIG. 2 is a block diagram showing a functional configuration for controlling the operation of each component of the substrate processing apparatus. [Figure 9] FIG. 2 is a block diagram showing an example of the configuration of a control unit. [Figure 10] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 11] FIG. 10 is a diagram illustrating the configuration of an external path outside the circulation device. [Figure 12] FIG. 2 is a block diagram showing an outline of the functions of a control unit. [Figure 13] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 14] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 15] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 16] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 17] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 18] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 19] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 20] 10 is a flowchart illustrating the operation of the circulation device. DETAILED DESCRIPTION OF THE INVENTION

[0041] Hereinafter, each embodiment of the present disclosure will be described with reference to the accompanying drawings. The components described in each embodiment are merely examples, and the scope of the present disclosure is not intended to be limited to these examples. The drawings are merely schematic. In the drawings, the dimensions and number of each part may be exaggerated or simplified as necessary to facilitate understanding. In the drawings, parts having similar configurations and functions are assigned the same reference numerals, and duplicate explanations will be omitted as appropriate.

[0042] In the following explanation, a right-handed XYZ Cartesian coordinate system is used to explain the positional relationships of each element. Specifically, it is assumed that the X-axis and Y-axis extend horizontally and the Z-axis extends vertically (up and down). In the drawings, the direction in which the tip of the arrow points is indicated as the + (plus) direction, and the opposite direction is indicated as the - (minus) direction. Specifically, the vertically upward direction is the +Z direction, and the vertically downward direction is the -Z direction.

[0043] In this specification, expressions indicating relative or absolute positional relationships (e.g., "parallel," "orthogonal," "center") not only indicate the exact positional relationship, but also indicate a state including tolerances and a state in which the same level of functionality is obtained. Expressions indicating that two or more things are equal (e.g., "identical," "equal," "homogeneous") not only indicate a state in which they are strictly equal quantitatively, but also indicate a state in which there is a difference that allows for tolerances or similar functionality, unless otherwise specified.

[0044] Unless otherwise specified, expressions indicating a shape (such as "rectangular shape" or "cylindrical shape") not only represent a strict geometric shape, but also represent shapes that have, for example, irregularities or chamfers, within the scope of achieving the same effect.

[0045] The expressions "comprises," "includes," "has," "includes," or "has" of one element are not exclusive expressions that exclude the presence of other elements.

[0046] Unless otherwise specified, the expression "connected" includes not only a state in which two elements are in contact with each other, but also a state in which two elements are separated by another element.

[0047] Unless otherwise specified, "moving" in a certain direction may include not only moving parallel to this direction, but also moving in a direction having a component in this direction.

[0048] <1. Configuration of the substrate processing apparatus> Fig. 1 is a cross-sectional view schematically showing the substrate processing apparatus 790. Fig. 2 is a longitudinal cross-sectional view schematically showing the longitudinal section of the substrate processing apparatus 790 taken along the front-rear direction (±X direction).

[0049] The substrate processing apparatus 790 processes a substrate (e.g., a semiconductor wafer) W using a processing liquid that is supplied to and recovered from the circulation apparatus according to the present disclosure. The circulation apparatus and a control method thereof will be described in detail later. The circulation apparatus and the substrate processing apparatus 790 may be collectively understood as a substrate processing system.

[0050] For example, a thin, flat plate having a substantially disk shape is applied to the substrate W. In Fig. 1, the outer edge of the substrate W stored in a carrier C (described later) and the outer edge of the substrate W held by a holder 711 (described later) are both indicated by dashed lines.

[0051] The substrate processing apparatus 790 includes, for example, an indexer unit 792 and a processing block 793. The processing block 793 is connected to the indexer unit 792.

[0052] The indexer unit 792 and the processing block 793 are aligned in the horizontal direction. The indexer unit 792, for example, supplies a substrate W to the processing block 793. The processing block 793, for example, processes the substrate W. The indexer unit 792, for example, retrieves the substrate W from the processing block 793.

[0053] In this specification, for convenience, the horizontal direction in which the indexer unit 792 and the processing block 793 are aligned is taken as the ±X direction (also referred to as the front-to-back direction). Of the ±X directions (front-to-back direction), the direction from the processing block 793 to the indexer unit 792 is taken as the -X direction (also referred to as the front direction or forward), and the direction from the indexer unit 792 to the processing block 793 is taken as the +X direction (also referred to as the rear direction or backward).

[0054] The horizontal direction perpendicular to the ±X directions (front-to-back directions) is used as the ±Y direction (also called the width direction). Within the ±Y directions (width directions), the direction toward the right when facing the -X direction (front direction) is used as the +Y direction (also called the right direction or rightward), and the direction toward the left when facing the -X direction (front direction) is used as the -Y direction (also called the left direction or leftward).

[0055] The direction perpendicular to the horizontal direction is taken as the ±Z direction (also called the up-down direction). Of the ±Z directions (up-down direction), the direction of gravity is taken as the -Z direction (also called the down direction or downward), and the direction opposite to the direction of gravity is taken as the +Z direction (also called the up direction or upward). When no particular distinction is made between front, rear, right, and left, these are all simply referred to as lateral directions.

[0056] <1-1. Indexer Configuration> As shown in FIG. 1, the indexer section 792 includes a plurality of (for example, four) carrier placement sections 721, a transport space 722, and one or more (for example, one) first transport mechanisms (also referred to as indexer mechanisms) 723.

[0057] The multiple carrier placement sections 721 are arranged in the width direction (±Y direction). One carrier C is placed on each carrier placement section 721. The carrier C accommodates multiple substrates W. For example, a FOUP (front opening unified pod) is used as the carrier C.

[0058] The transport space 722 is located behind (in the +X direction) the carrier placement unit 721. The transport space 722 extends in the width direction (in the ±Y direction). The first transport mechanism 723 is located in the transport space 722.

[0059] The first transport mechanism 723 is located behind (in the +X direction) the carrier platform 721. The first transport mechanism 723 transports substrates W. The first transport mechanism 723 accesses the carriers C placed on the carrier platform 721.

[0060] The first transport mechanism 723 includes a hand 7231 and a hand driver 7232. The hand 7231 supports one substrate W in a horizontal position. The hand driver 7232 is connected to the hand 7231 and moves the hand 7231. Specifically, the hand driver 7232 moves the hand 7231 in the front-to-rear directions (±X directions), width directions (±Y directions), and up-down directions (±Z directions). The hand driver 7232 has multiple electric motors.

[0061] As shown in FIGS. 1 and 2, the hand driving unit 7232 includes, for example, a rail 7232a, a horizontal moving unit 7232b, a vertical moving unit 7232c, a rotating unit 7232d, and an advancing / retreating moving unit 7232e.

[0062] The rail 7232a is fixed, for example, to the bottom of the transport space 722. The rail 7232a extends in the width direction (±Y direction).

[0063] The horizontal movement section 7232b is supported by the rail 7232a and moves in the width direction (±Y direction) relative to the rail 7232a.

[0064] The vertical movement section 7232c is supported by the horizontal movement section 7232b and moves up and down relative to the horizontal movement section 7232b.

[0065] The rotating portion 7232d is supported by the vertical moving portion 7232c. The rotating portion 7232d rotates relative to the vertical moving portion 7232c. The rotating portion 7232d rotates about a rotation axis A1. The rotation axis A1 is an imaginary line extending in the vertical direction.

[0066] The advancing and retreating moving unit 7232e moves relative to the rotating unit 7232d. The advancing and retreating moving unit 7232e moves back and forth along a horizontal direction determined by the orientation of the rotating unit 7232d. The advancing and retreating moving unit 7232e is connected to the hand 7231.

[0067] The hand driving unit 7232 allows the hand 7231 to move in parallel in the vertical direction, in any horizontal direction, and rotate about the rotation axis A1.

[0068] <1-2. Processing block configuration> Fig. 3 is a longitudinal cross-sectional view schematically illustrating an example of the longitudinal cross-section of the substrate processing apparatus 790 taken along line III-III in Fig. 1, viewed toward the rear (+X direction). Fig. 4 is a side view schematically illustrating an example of the configuration of the left (-Y direction) portion (also referred to as the left part) of the processing block 793, viewed along the left (-Y direction). Fig. 5 is a side view schematically illustrating an example of the configuration of the right (+Y direction) portion (also referred to as the right part) of the processing block 793, viewed along the right (+Y direction).

[0069] For example, as shown in Figures 1 to 5, the processing block 793 includes two transport spaces 74A, 74B, two second transport mechanisms 75A, 75B, a plurality of (here, 24) processing units 76, two substrate placement portions 77A, 77B, one partition wall 73w, and a horizontal exhaust system 780.

[0070] The transport space 74A is located at the center of the processing block 793 in the width direction (±Y direction). The transport space 74A extends in the front-rear direction (±X direction). The front portion (also referred to as the front part) of the transport space 74A is connected to the transport space 722 of the indexer unit 792.

[0071] The transport space 74B has substantially the same shape as the transport space 74A. Specifically, the transport space 74B is located in the center of the processing block 793 in the width direction (±Y direction). The transport space 74B extends in the front-rear direction (±X direction). A front portion (also referred to as a front part) of the transport space 74B is connected to the transport space 722 of the indexer unit 792.

[0072] The transport space 74B is located below the transport space 74A. The transport space 74B is located so as to overlap the transport space 74A in a plan view. When the transport spaces 74A and 74B are not distinguished from each other, they are both simply referred to as the transport space 74.

[0073] The partition wall 73w has, for example, a horizontal plate shape. The partition wall 73w is located below the transport space 74A and above the transport space 74B. The partition wall 73w separates the transport space 74A from the transport space 74B.

[0074] The substrate platform 77A is located in the transport space 74A. The substrate platform 77A is located at the front of the transport space 74A. The first transport mechanism 723 of the indexer unit 792 also accesses the substrate platform 77A. One or more substrates W are placed on the substrate platform 77A.

[0075] The substrate placing portion 77B is located in the transport space 74B. The substrate placing portion 77B is located below the substrate placing portion 77A. The substrate placing portion 77B is located at the front of the transport space 74B. The substrate placing portion 77B is located so as to overlap with the substrate placing portion 77A in a plan view. The substrate placing portion 77B is located at the same position as the substrate placing portion 77A in a plan view.

[0076] The first transport mechanism 723 of the indexer unit 792 also accesses the substrate platform 77B. One or more substrates W are placed on the substrate platform 77B. When the substrate platform 77A, 77B are not distinguished from each other, they are both simply referred to as the substrate platform 77.

[0077] The second transport mechanism 75A is located in the transport space 74A. The second transport mechanism 75A transports the substrate W. The second transport mechanism 75A has access to the substrate platform 77A.

[0078] The second transport mechanism 75B is located in the transport space 74B. The second transport mechanism 75B transports the substrate W. The second transport mechanism 75B has the same structure as the second transport mechanism 75A. The second transport mechanism 75B accesses the substrate placement section 77B. When the second transport mechanisms 75A and 75B are not to be distinguished from each other, they are both simply referred to as the second transport mechanism 75.

[0079] Each of the second transport mechanisms 75 includes a hand 751 and a hand driver 752. The hand 751 supports one substrate W in a horizontal position. The hand driver 752 is connected to the hand 751. The hand driver 752 moves the hand 751 in the front-to-rear directions (±X directions), width directions (±Y directions), and up-down directions. The hand driver 752 includes multiple electric motors.

[0080] Specifically, the hand driving unit 752 includes, for example, two support columns 752a, a vertical moving unit 752b, a horizontal moving unit 752c, a rotating unit 752d, and an advancing / retreating moving unit 752e.

[0081] The two support columns 752a are fixed, for example, to the side of the transport space 722. The two support columns 752a are aligned in the front-rear direction (±X direction). Each support column 752a extends in the up-down direction.

[0082] The vertical movement section 752b is supported by two support columns 752a. The vertical movement section 752b extends in the front-rear direction (±X direction) and is installed between the two support columns 752a. The vertical movement section 752b moves in the up-down direction relative to the two support columns 752a.

[0083] The horizontal movement section 752c is supported by the vertical movement section 752b. The horizontal movement section 752c moves in the front-to-back directions (±X directions) relative to the vertical movement section 752b. The horizontal movement section 752c moves in the front-to-back directions (±X directions) between the two support columns 752a.

[0084] The rotating portion 752d is supported by the horizontal moving portion 752c. The rotating portion 752d rotates relative to the horizontal moving portion 752c. The rotating portion 752d rotates about a rotation axis A2. The rotation axis A2 is an imaginary line that extends in the vertical direction.

[0085] The advancing and retreating moving unit 752e moves relative to the rotating unit 752d. The advancing and retreating moving unit 752e moves back and forth in a horizontal direction determined by the orientation of the rotating unit 752d. The advancing and retreating moving unit 752e is connected to the hand 751.

[0086] Such a hand driving unit 752 allows the hand 751 to perform translation in the vertical direction, translation in any horizontal direction, and rotation around the rotation axis A2.

[0087] Each of the 24 processing units 76 performs a predetermined processing on the substrate W transported by the second transport mechanism 75 .

[0088] The processing block 793 includes six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D. When the processing units 76A, 76B, 76C, and 76D are not distinguished from one another, they are all simply referred to as processing units 76.

[0089] The six processing units 76A are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76A are lined up in a row in the vertical direction. The six processing units 76B are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76B are lined up in a row in the vertical direction. The six processing units 76C are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76C are lined up in a row in the vertical direction. The six processing units 76D are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76D are lined up in a row in the vertical direction.

[0090] Each of the six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D is included in the towers mentioned above (four towers in this case).

[0091] The six processing chambers 761 in the six processing units 76A are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76B are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76C are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76D are stacked in the vertical direction.

[0092] The six processing units 76A and the six processing units 76B are located to the left (-Y direction) of the transport spaces 74A and 74B. The six processing units 76A and the six processing units 76B are lined up in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76B are located behind the six processing units 76A (+X direction).

[0093] The six processing units 76C and the six processing units 76D are located to the right (+Y direction) of the transport spaces 74A and 74B. The six processing units 76C and the six processing units 76D are lined up in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76D are located behind the six processing units 76C (+X direction).

[0094] The six processing units 76A and the six processing units 76C face each other across the transport spaces 74A and 74B. The six processing units 76B and the six processing units 76D face each other across the transport spaces 74A and 74B.

[0095] The second transport mechanism 75 accesses the holder 711 of the processing unit 76. The second transport mechanism 75A, located above the partition wall 73w, transports substrates W to the upper 12 processing units 76 (4 units x upper 3 tiers) of the 24 processing units 76, and unloads the substrates W from these upper 12 processing units 76. The second transport mechanism 75B, located below the partition wall 73w, transports substrates W to the lower 12 processing units 76 (4 units x lower 3 tiers) of the 24 processing units 76, and unloads the substrates W from these lower 12 processing units 76.

[0096] <1-3. Processing unit configuration> 6 is a cross-sectional view showing a schematic configuration of the processing unit 76, taking processing unit 76A as an example. Each processing chamber 761 is adjacent to the transfer space 74.

[0097] FIG. 7 is a vertical cross-sectional view showing a schematic configuration of the processing unit 76, taking the processing unit 76C as an example.

[0098] 6 and 7, each processing unit 76 includes a processing chamber 761 (also referred to as a chamber or a processing housing), a supply pipe space 762, and an exhaust pipe space 763. For example, the multiple processing units 76 have the same structure.

[0099] <1-4. Processing chamber configuration> The processing chamber 761 has, for example, a substantially box shape. The processing chamber 761 has, for example, a substantially rectangular shape in plan view, front view, and side view. The processing chamber 761 has a processing space 761s therein. The processing unit 76 processes the substrate W in the processing space 761s. In FIG. 6, the outer edge of the substrate W held by the holder 711 is indicated by a dashed line.

[0100] The processing chamber 761 has a substrate transfer opening 761o on the transfer space 74 side. The substrate transfer opening 761o is formed in a side wall of the processing chamber 761. The substrate transfer opening 761o has a size that allows the substrate W to pass through. The second transfer mechanism 75 moves the substrate W between the outside of the processing chamber 761 (specifically, the transfer space 74) and the inside of the processing chamber 761 (specifically, the processing space 761s) via the substrate transfer opening 761o. Each processing unit 76 has a shutter (not shown) that opens and closes the substrate transfer opening 761o.

[0101] Each of the processing units 76 includes, for example, a holder 711 and a fluid supply unit 712 .

[0102] The holder 711 is located inside the processing chamber 761. The holder 711 holds a substrate W. More specifically, the holder 711 holds one substrate W in a horizontal position. The holder 711 includes a part (also referred to as a drive part) that rotates the substrate W held by the holder 711, for example, around an imaginary rotation axis A3 along the vertical direction.

[0103] A spin chuck is applied to the holder 711. The spin chuck rotates the substrate W, for example, about a rotation axis A3 that passes through the center of the substrate W and extends in the up-down direction.

[0104] Specifically, the spin chuck includes a chuck pin (chuck member) 711p, a spin base 711b, a rotation shaft 711s coupled to the center of the lower surface of the spin base 711b, and an electric motor 711m as a drive unit that applies a rotational force to the rotation shaft 711s.

[0105] The rotation shaft 711s extends in the vertical direction along the rotation axis A3. For example, the rotation shaft 711s is a hollow shaft.

[0106] A spin base 711b is coupled to the upper end of the rotation shaft 711s. The spin base 711b has a disk shape that is aligned in the horizontal direction. In a plan view, the spin base 711b is circular, centered on the rotation axis A3, and has a diameter larger than that of the substrate W. A plurality of (e.g., six) chuck pins 711p are positioned at intervals in the circumferential direction on the periphery of the upper surface of the spin base 711b.

[0107] The multiple chuck pins 711p can be opened and closed between a closed state in which they contact the peripheral edge of the substrate W to grip the substrate W, and an open state in which they are retracted from the peripheral edge of the substrate W. In the open state, for example, the multiple chuck pins 711p contact the lower surface of the peripheral edge of the substrate W to support the substrate W from below.

[0108] The chuck pin 711p is driven to open and close by a unit including, for example, a link mechanism built into the spin base 711b and a drive source located outside the spin base 711b. The drive source includes, for example, a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism.

[0109] Each of the processing units 76 includes, for example, a heater unit 719. The heater unit 719 is located above the spin base 711b. An elevator shaft 719r extending vertically along the rotation axis A3 is coupled to the lower surface of the heater unit 719.

[0110] The lift shaft 719r is inserted through a through-hole that passes through the center of the spin base 711b in the vertical direction and through a hollow portion that passes through the rotation shaft 711s in the vertical direction.

[0111] The lower end of the lift shaft 719r extends further downward than the lower end of the rotation shaft 711s. A lift unit 719m is coupled to the lower end of the lift shaft 719r. By operating the lift unit 719m, the heater unit 719 moves up and down between a lower position close to the upper surface of the spin base 711b and an upper position where the heater unit 719 supports the lower surface of the substrate W and lifts the substrate W from the chuck pins 711p.

[0112] The lifting unit 719m includes, for example, a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism, which allows the lifting unit 719m to position the heater unit 719 at any intermediate position between the lower position and the upper position.

[0113] For example, the substrate W can be heated by radiant heat from the heating surface 719u, which is the upper surface of the heater unit 719, in a state where the heating surface 719u is disposed at a position separated by a predetermined distance from the lower surface of the substrate W. For example, if the substrate W is lifted by the heater unit 719, the heating surface 719u is brought into contact with the lower surface of the substrate W, and the substrate W is heated with a greater amount of heat by heat conduction from the heating surface 719u.

[0114] The heater unit 719 has the form of a disk-shaped hot plate. The heater unit 719 includes a plate body, a plurality of support pins, and a heater. The upper surface of the plate body is a flat surface that is aligned with the horizontal plane. In a plan view, the plate body has a circular shape similar to that of the substrate W and a diameter slightly smaller than that of the substrate W.

[0115] The outer peripheral edge of the plate body is located inside the chuck pins 711p. In other words, the plate body is surrounded by the chuck pins 711p in the horizontal direction. This prevents the heater unit 719 from interfering with the chuck pins 711p when the heater unit 719 moves up and down.

[0116] Each of the support pins is, for example, a hemispherical pin that protrudes slightly upward from the upper surface of the plate body. The support pins are arranged approximately evenly on the upper surface of the plate body. The upper surface (heating surface 719u) of the plate body does not necessarily need to have support pins.

[0117] For example, when multiple substrates W are supported by contacting the support pins, the lower surfaces of the substrates W and the upper surface (heating surface 719u) of the plate body face each other with a small gap between them, which allows the heater unit 719 to heat the substrates W efficiently and uniformly.

[0118] The heater may be, for example, a resistor built into the plate body. The upper surface of the plate body (heating surface 719u) can be heated to a temperature higher than the boiling point of the organic solvent by energizing the heater. A power supply line to the heater is passed through the lift shaft 719r. A power supply unit 719e that supplies power to the heater is connected to the power supply line.

[0119] Each of the processing units 76 includes, for example, a cylindrical cup 717 surrounding a holder 711 inside a processing chamber 761 .

[0120] The fluid supply unit 712 supplies, for example, a plurality of types of fluids to the substrate W held by the holder 711. The plurality of types of fluids include, for example, processing liquids such as chemical liquids, rinse liquids, and organic solvents. The chemical liquids include, for example, etching liquids and cleaning liquids. The chemical liquids used include, for example, acidic liquids (acid-based liquids) and alkaline liquids (alkaline-based liquids).

[0121] The acidic solution contains, for example, at least one of hydrofluoric acid (hydrofluoric acid), a mixed solution of hydrochloric acid and hydrogen peroxide (SC2), sulfuric acid, a mixed solution of sulfuric acid and hydrogen peroxide (SPM), hydrofluoric nitric acid (a mixed solution of hydrofluoric acid and nitric acid), and hydrochloric acid.

[0122] The alkaline solution includes, for example, at least one of ammonia hydrogen peroxide solution (SC1), ammonia water, ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH).

[0123] The rinse liquid is, for example, a liquid for washing away a chemical liquid on the substrate W. For example, deionized water (DIW) is used as the rinse liquid.

[0124] The organic solvent is, for example, a liquid for removing the rinse liquid on the substrate W. As the organic solvent, for example, isopropyl alcohol (IPA) or the like is used.

[0125] The plurality of fluids include, for example, gases such as inert gases, for example, nitrogen gas.

[0126] The fluid supply unit 712 includes, for example, a first moving nozzle 71n, a second moving nozzle 72n, and a third moving nozzle 73n, each of which ejects a predetermined fluid.

[0127] The first movable nozzle 71n is moved in the horizontal direction by the first moving unit 71M. By moving in the horizontal direction, the first movable nozzle 71n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first home position").

[0128] The first discharge position may be, for example, a position where the first processing liquid discharged from the first movable nozzle 71n lands on the center of rotation of the upper surface of the substrate W. The first home position is a position outside the holder 711 in a plan view. More specifically, the first home position may be a position outside the cup 717 in a plan view.

[0129] The first moving nozzle 71n may be moved up or down by the first moving unit 71M to approach the upper surface Wa of the substrate W held by the holding part 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding part 711.

[0130] The first moving unit 71M includes, for example, a first rotation shaft 71s extending in the vertical direction, a first arm 71a coupled to the first rotation shaft 71s and extending horizontally, and a first arm driving mechanism 71m that drives the first arm 71a.

[0131] The first arm drive mechanism 71m swings the first arm 71a by rotating the first rotation shaft 71s about a virtual rotation axis A4 that extends in the vertical direction. The first movable nozzle 71n is attached to the first arm 71a at a position horizontally spaced from the rotation axis A4.

[0132] In response to the swinging of the first arm 71a, the first moving nozzle 71n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The first arm driving mechanism 71m may move the first arm 71a up and down, for example, by raising and lowering the first rotation shaft 71s in the vertical direction.

[0133] The first moving nozzle 71n has a function of supplying a first processing liquid (also referred to as a first processing liquid) to the upper surface Wa of the substrate W held by the holder 711. A first processing liquid supply pipe P1 that functions as a pipe for supplying the first processing liquid is connected to the first moving nozzle 71n.

[0134] A first processing liquid on-off valve V1 that functions as a valve for opening and closing the flow path of the first processing liquid supply pipe P1 is installed in the first processing liquid supply pipe P1. The first processing liquid is supplied to the first processing liquid supply pipe P1 from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, an acidic liquid such as sulfuric acid (HSO) is used as the first processing liquid. The first moving nozzle 71n may be a straight nozzle that ejects the first processing liquid, or may be a two-fluid nozzle that ejects a mixture of the first processing liquid and an inert gas.

[0135] The second movable nozzle 72n is moved in the horizontal direction by the second movable unit 72M. By moving in the horizontal direction, the second movable nozzle 72n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second home position").

[0136] The second discharge position may be, for example, a position where the second processing liquid discharged from the second movable nozzle 72n lands on the center of rotation of the upper surface of the substrate W. The second home position is a position outside the holder 711 in a plan view. More specifically, the second home position may be a position outside the cup 717 in a plan view.

[0137] The second moving nozzle 72n may be moved upward or downward by the second moving unit 72M to approach the upper surface Wa of the substrate W held by the holding portion 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding portion 711.

[0138] The second moving unit 72M includes, for example, a second rotation shaft 72s extending in the vertical direction, a second arm 72a coupled to the second rotation shaft 72s and extending horizontally, and a second arm driving mechanism 72m that drives the second arm 72a.

[0139] The second arm drive mechanism 72m swings the second arm 72a by rotating the second rotation shaft 72s about a virtual rotation axis A5 that extends in the vertical direction. The second movable nozzle 72n is attached to the second arm 72a at a position horizontally spaced from the rotation axis A5.

[0140] In response to the swinging of the second arm 72a, the second movable nozzle 72n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The second arm drive mechanism 72m may move the second arm 72a up and down, for example, by raising and lowering the second rotation shaft 72s in the vertical direction.

[0141] The second moving nozzle 72n has a function of supplying a second processing liquid (also referred to as a second processing liquid) to the upper surface Wa of the substrate W held by the holder 711. A second processing liquid supply pipe P2 that functions as a pipe for supplying the second processing liquid is connected to the second moving nozzle 72n.

[0142] A second processing liquid on-off valve V2 that functions as a valve for opening and closing the flow path of the second processing liquid supply pipe P2 is installed in the second processing liquid supply pipe P2. The second processing liquid is supplied to the second processing liquid supply pipe P2 from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, an alkaline liquid such as an ammonia-hydrogen peroxide solution (SC1) is used as the second processing liquid. The second moving nozzle 72n may be a straight nozzle that discharges the second processing liquid, or may be a two-fluid nozzle that discharges a mixture of the second processing liquid and an inert gas.

[0143] The third movable nozzle 73n is moved in the horizontal direction by the third movable unit 73M. By moving in the horizontal direction, the third movable nozzle 73n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third home position").

[0144] The third discharge position may be, for example, a position where the third processing liquid discharged from the third movable nozzle 73n lands on the center of rotation of the upper surface of the substrate W. The third home position is a position outside the holder 711 in a plan view. More specifically, the third home position may be a position outside the cup 717 in a plan view.

[0145] The third moving nozzle 73n may be moved up and down by the third moving unit 73M to approach the upper surface Wa of the substrate W held by the holding portion 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding portion 711.

[0146] The third moving unit 73M includes, for example, a third rotation shaft 73s extending in the vertical direction, a third arm 73a coupled to the third rotation shaft 73s and extending horizontally, and a third arm driving mechanism 73m that drives the third arm 73a.

[0147] The third arm drive mechanism 73m swings the third arm 73a by rotating the third rotation shaft 73s about a virtual rotation axis A6 that extends in the vertical direction. The third movable nozzle 73n is attached to the third arm 73a at a position horizontally spaced from the rotation axis A6.

[0148] In response to the swing of the third arm 73a, the third movable nozzle 73n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The third arm drive mechanism 73m may move the third arm 73a up and down by raising and lowering the third rotation shaft 73s in the vertical direction.

[0149] The third moving nozzle 73n has a function of supplying a third processing liquid (also referred to as a third treatment liquid) to the upper surface Wa of the substrate W held by the holder 711. A third processing liquid supply pipe P3 that functions as a pipe for supplying the third treatment liquid is connected to the third moving nozzle 73n.

[0150] A third processing liquid on-off valve V3 that functions as a valve for opening and closing the flow path of the third processing liquid supply pipe P3 is installed in the third processing liquid supply pipe P3. The third processing liquid supply pipe P3 is supplied with the third processing liquid from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, a rinse liquid such as deionized water (DIW) is used as the third processing liquid. The third moving nozzle 73n may be a straight nozzle that discharges the third processing liquid, or may be a two-fluid nozzle that discharges a mixture of the third processing liquid and an inert gas.

[0151] The processing unit 76 includes, for example, a fan filter unit (FFU) as an air supply section 718. The FFU can further purify the air in a clean room in which the substrate processing apparatus 790 is installed and supply the purified air into the processing chamber 761.

[0152] The FFU is attached, for example, to the ceiling wall of the processing chamber 761. The FFU is equipped with a fan and a filter (e.g., a HEPA filter) for taking in air from within the clean room and sending it into the processing chamber 761, and can form a downflow of clean air within the processing chamber 761. In order to more uniformly distribute the clean air supplied from the FFU within the processing chamber 761, a punched plate with a large number of blow-out holes may be placed directly below the ceiling wall.

[0153] For example, an exhaust port 762o is provided in a part of the side wall of the processing chamber 761 near the floor wall of the processing chamber 761, and is connected to communicate with the outside of the substrate processing apparatus 790 (such as a factory exhaust facility). For example, of the clean air supplied from the FFU and flowing down inside the processing chamber 761, the air that passes near the cup 717 and the like is exhausted to the outside of the substrate processing apparatus 790 via the exhaust port 762o. For example, a configuration for introducing an inert gas such as nitrogen gas into the upper part of the processing chamber 761 may be added.

[0154] <1-5. Supply pipe space configuration> As shown in Figures 4 and 5, four supply pipe spaces 762 extend vertically. For example, one supply pipe space 762A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one supply pipe space 762B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one supply pipe space 762C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one supply pipe space 762D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the supply pipe spaces 762A to 762D are not distinguished from one another, they are all simply referred to as supply pipe spaces 762.

[0155] The supply pipe space 762 is an area where pipes are arranged to supply fluids to the processing chamber 761. For example, a first processing liquid supply pipe P1, a second processing liquid supply pipe P2, a third processing liquid supply pipe P3, a first processing liquid on-off valve V1, a second processing liquid on-off valve V2, and a third processing liquid on-off valve V3 are arranged in the supply pipe space 762. The first processing liquid supply pipe P1, the second processing liquid supply pipe P2, and the third processing liquid supply pipe P3 are drawn from the supply pipe space 762 into the processing chamber 761 and connected to a first moving nozzle 71n, a second moving nozzle 72n, and a third moving nozzle 73n.

[0156] <1-6. Exhaust pipe space configuration> As shown in FIGS. 4 and 5, four exhaust pipe spaces 763 extend vertically. For example, one exhaust pipe space 763A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one exhaust pipe space 763B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one exhaust pipe space 763C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one exhaust pipe space 763D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the exhaust pipe spaces 763A to 763D are not distinguished from one another, they are all simply referred to as exhaust pipe spaces 763.

[0157] Each exhaust pipe space 763 is an area where piping is arranged to exhaust gas from the processing chamber 761. As shown in Figures 4 to 7, each exhaust pipe space 763 is provided with, for example, an exhaust path switching mechanism 770, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773.

[0158] For example, in the exhaust pipe space 763A, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76A at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76A at the highest stage (sixth stage). For example, in the exhaust pipe space 763B, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76B at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76B at the highest stage (sixth stage). For example, in the exhaust pipe space 763C, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76C at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76C at the highest stage (sixth stage). For example, in the exhaust pipe space 763D, exhaust path switching mechanisms 770 are arranged for each of the processing chambers 761 of the processing units 76D from the lowest (first) to the highest (sixth) processing units 76D.

[0159] There are, for example, four sets of the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773. The first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are pipes for discharging gas, which is discharged from the processing chamber 761 via the exhaust path switching mechanism 770, to the outside of the substrate processing apparatus 790.

[0160] In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 extend from the side of the lowest (first) processing chamber 761 to the side of the highest (sixth) processing chamber 761. In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are aligned in the width direction (±Y direction). In each exhaust pipe space 763, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 have the function of exhausting gases flowing in via the exhaust path switching mechanism 770 from each of the processing chambers 761 of the six vertically stacked processing units 76.

[0161] When the first vertical exhaust pipes 771 are used to distinguish between the processing units 76A to 76D, they are referred to as first vertical exhaust pipes 771A to 771D. When the second vertical exhaust pipes 772 are used to distinguish between the processing units 76A to 76D, they are referred to as second vertical exhaust pipes 772A to 772D. When the third vertical exhaust pipes 773 are used to distinguish between the processing units 76A to 76D, they are referred to as third vertical exhaust pipes 773A to 773D.

[0162] The first set (first group) of first vertical exhaust pipes 771A, second vertical exhaust pipes 772A, and third vertical exhaust pipes 773A are configured to exhaust gas from each of the six stages of processing units 76A. The second set (second group) of first vertical exhaust pipes 771B, second vertical exhaust pipes 772B, and third vertical exhaust pipes 773B are configured to exhaust gas from each of the six stages of processing units 76B. The third set (third group) of first vertical exhaust pipes 771C, second vertical exhaust pipes 772C, and third vertical exhaust pipes 773C are configured to exhaust gas from each of the six stages of processing units 76C. The fourth set (fourth group) of first vertical exhaust pipes 771D, second vertical exhaust pipes 772D, and third vertical exhaust pipes 773D are configured to exhaust gas from each of the six stages of processing units 76D.

[0163] The exhaust path switching mechanism 770 is a mechanism for switching the gas exhaust path from the processing chamber 761 to the outside of the substrate processing apparatus 790 via one of the vertical exhaust pipes, namely, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773.

[0164] The exhaust path switching mechanisms 770 are disposed on either side of the processing chamber 761. The exhaust path switching mechanisms 770 are connected to the processing chamber 761 via exhaust ports 762o, for example, to exhaust gas from the processing chamber 761. The exhaust path switching mechanisms 770 are also connected to, for example, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773 that extend in the vertical direction.

[0165] 6, the exhaust path switching mechanism 770 has, for example, a first opening / closing unit 71d and a second opening / closing unit 72d. The first opening / closing unit 71d and the second opening / closing unit 72d have, for example, a door-like structure and operate like a swinging door.

[0166] The first open / close unit 71d and the second open / close unit 72d rotate about a rotation axis driven by a motor, etc. The exhaust path switching mechanism 770 is set to one of the following states by opening and closing the first open / close unit 71d and the second open / close unit 72d: a state in which gas flows from the processing space 761s into the first vertical exhaust pipe 771 (also referred to as a first state), a state in which gas flows from the processing space 761s into the second vertical exhaust pipe 772 (also referred to as a second state), and a state in which gas flows from the processing space 761s into the third vertical exhaust pipe 773 (also referred to as a third state).

[0167] For example, during a period in which a first chemical liquid is discharged from first movable nozzle 71n, exhaust path switching mechanism 770 is set to the first state. For example, during a period in which a second chemical liquid is discharged from second movable nozzle 72n, exhaust path switching mechanism 770 is set to the second state. For example, during a period in which a third chemical liquid is discharged from third movable nozzle 73n, exhaust path switching mechanism 770 is set to the third state.

[0168] <1-7. Horizontal exhaust system configuration> As shown in Figures 3 to 5, the horizontal exhaust system 780 includes a first horizontal exhaust pipe 781A, a second horizontal exhaust pipe 782A, a third horizontal exhaust pipe 783A, a first horizontal exhaust pipe 781B, a second horizontal exhaust pipe 782B, and a third horizontal exhaust pipe 783B.

[0169] 3 and 4, the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are positioned above the two uppermost (sixth) processing units 76A and 76B so as to extend in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are aligned, for example, in the width direction (±Y direction).

[0170] For example, a first vertical exhaust pipe 771A for the processing unit 76A and a first vertical exhaust pipe 771B for the processing unit 76B are connected to the first horizontal exhaust pipe 781A so as to communicate with each other. The first horizontal exhaust pipe 781A exhausts gas from the first vertical exhaust pipes 771A and 771B.

[0171] For example, the second horizontal exhaust pipe 782A is connected to a second vertical exhaust pipe 772A for the processing unit 76A and a second vertical exhaust pipe 772B for the processing unit 76B so that they communicate with each other. The second horizontal exhaust pipe 782A exhausts gas from the second vertical exhaust pipes 772A and 772B.

[0172] For example, a third vertical exhaust pipe 773A for the processing unit 76A and a third vertical exhaust pipe 773B for the processing unit 76B are connected to the third horizontal exhaust pipe 783A so as to communicate with each other. The third horizontal exhaust pipe 783A exhausts gas from the third vertical exhaust pipes 773A and 773B.

[0173] 3 and 5, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are positioned above the two uppermost (sixth) processing units 76C and 76D so as to extend in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are aligned, for example, in the width direction (±Y direction).

[0174] For example, a first vertical exhaust pipe 771C for the processing unit 76C and a first vertical exhaust pipe 771D for the processing unit 76D are connected to the first horizontal exhaust pipe 781B so as to communicate with each other. The first horizontal exhaust pipe 781B exhausts gas from the first vertical exhaust pipes 771C and 771D.

[0175] For example, the second horizontal exhaust pipe 782B is connected to a second vertical exhaust pipe 772C for the processing unit 76C and a second vertical exhaust pipe 772D for the processing unit 76D so that they communicate with each other. The second horizontal exhaust pipe 782B exhausts gas from the second vertical exhaust pipes 772C and 772D.

[0176] For example, the third horizontal exhaust pipe 783B is connected to a third vertical exhaust pipe 773C for the processing unit 76C and a third vertical exhaust pipe 773D for the processing unit 76D so as to communicate with each other. The third horizontal exhaust pipe 783B exhausts gas from the third vertical exhaust pipes 773C and 773D.

[0177] The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are longer than the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

[0178] Gas flows backward (in the +X direction) inside each of the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, the third horizontal exhaust pipe 783A, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

[0179] The substrate processing apparatus 790 has an exhaust section 768 including, for example, four exhaust pipe spaces 763 and a horizontal exhaust system 780, and this exhaust section 768 can exhaust gas from the processing chamber 761 to the outside of the substrate processing apparatus 790 (such as the factory's exhaust equipment).

[0180] A processing liquid storage unit 705 is provided at the rear (+X direction) of the substrate processing apparatus 790. The processing liquid storage unit 705 stores processing liquid distributors 701 and 702 and processing liquid supply sources 703 and 704. For example, the processing liquid supply source 703 stores a chemical liquid, and the processing liquid supply source 704 stores a rinse liquid.

[0181] Both processing liquid distributors 701 and 702 obtain processing liquids, specifically, a chemical liquid from a processing liquid supply source 703 and a rinse liquid from a processing liquid supply source 704. The processing liquid distributor 701 distributes the processing liquid to processing units 76C and 76D. The processing liquid distributor 702 distributes the processing liquid to processing units 76A and 76B.

[0182] Pipes for supplying the processing liquid from the processing liquid distributor 701 to the processing units 76C and 76D are provided in supply pipe spaces 762C and 762D, respectively. Pipes for supplying the processing liquid from the processing liquid distributor 702 to the processing units 76A and 76B are provided in supply pipe spaces 762A and 762B, respectively.

[0183] <1-8. Control system of substrate processing equipment> 1, the substrate processing apparatus 790 includes a control unit 79. The control unit 79 is a part for controlling the operation of each component of the substrate processing apparatus 790, for example.

[0184] 8 is a block diagram showing a functional configuration for controlling the operation of each component of the substrate processing apparatus 790. A control unit 79 is communicatively connected to the first transfer mechanism 723, the second transfer mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780.

[0185] More specifically, the control unit 79 is communicably connected to each of the elements to be controlled, for example, the plurality of processing units 76 and the horizontal exhaust system 780. This allows the control unit 79 to control the operations of, for example, the first transfer mechanism 723, the second transfer mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780.

[0186] 9 is a block diagram showing an example configuration of the control unit 79. The control unit 79 is realized by, for example, a general computer, etc. The control unit 79 has, for example, a communication unit 791, an input unit 797, an output unit 798, a storage unit 794, a processing unit 795, and a drive 796, which are connected via a bus line 79Bu.

[0187] The communication unit 791 transmits and receives signals via communication lines between, for example, the first transport mechanism 723, the second transport mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780. The communication unit 791 may receive signals from, for example, a management server for managing the substrate processing apparatus 790.

[0188] The input unit 797 inputs, for example, a signal corresponding to an operator's action, etc. The input unit 797 includes, for example, an operation unit such as a mouse and a keyboard that can input a signal corresponding to an operation, a microphone that can input a signal corresponding to a voice, and various sensors that can input a signal corresponding to a movement.

[0189] The output unit 798 outputs, for example, various types of information in a form that can be recognized by an operator. The output unit 798 includes, for example, a display unit that visibly outputs various types of information and a speaker that audibly outputs various types of information. The display unit may have the form of a touch panel that is integrated with at least a part of the input unit 797, for example.

[0190] The storage unit 794 stores, for example, the program Pg1 and various information. The storage unit 794 is configured with, for example, a non-volatile storage medium such as a hard disk or a flash memory. The storage unit 794 may have, for example, one storage medium, two or more integrated storage media, or two or more separate storage media. The storage medium stores, for example, information regarding the operating conditions of the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780. The information regarding the operating conditions of the processing units 76 includes, for example, a processing recipe for processing the substrate W.

[0191] The processing unit 795 includes, for example, an arithmetic processing unit 795a functioning as a processor and a memory 795b serving as a work area for arithmetic processing. The arithmetic processing unit 795a may include, for example, an electronic circuit such as a central processing unit (CPU), and the memory 795b may include, for example, a random access memory (RAM). The processing unit 795 realizes the functions of the control unit 79 by, for example, reading and executing a program Pg1 stored in the storage unit 794. Therefore, in the control unit 79, various functional units that control the operation of each unit of the substrate processing apparatus 790 are realized by, for example, the processing unit 795 performing arithmetic processing according to the procedures described in the program Pg1. That is, the functions and operations of the substrate processing apparatus 790 can be realized by the control unit 79 included in the substrate processing apparatus 790 executing the program Pg1. Some or all of the functional units realized by the control unit 79 may be realized in hardware, for example, using dedicated logic circuits.

[0192] The drive 796 is, for example, a part to which a portable storage medium Sm1 can be attached and detached. For example, when the storage medium Sm1 is attached to the drive 796, the drive 796 exchanges data between the storage medium Sm1 and the processing unit 795. When the storage medium Sm1 storing the program Pg1 is attached to the drive 796, the drive 796 reads the program Pg1 from the storage medium Sm1 into the storage unit 794 and stores it therein.

[0193] The following describes an example of the overall operation of the substrate processing apparatus 790. In the substrate processing apparatus 790, for example, the control unit 79 controls each unit of the substrate processing apparatus 790 in accordance with a recipe that describes the transport procedure, processing conditions, etc. of the substrate W, thereby performing a series of operations described below.

[0194] When a carrier C accommodating an unprocessed substrate W is placed on the carrier platform 721, the first transport mechanism 723 removes the unprocessed substrate W from the carrier C. The first transport mechanism 723 transports the unprocessed substrate W to the substrate platform 77. The second transport mechanism 75 transports the unprocessed substrate W from the substrate platform 77 to a processing unit 76 specified by a recipe or the like. The transfer of the substrate W between the first transport mechanism 723 and the second transport mechanism 75 may be performed directly between the hand 7231 and the hand 751, for example, without going through the substrate platform 77.

[0195] The processing unit 76 into which the substrate W has been loaded performs a predetermined series of substrate processing steps on the substrate W. In this series of substrate processing steps, for example, a chemical liquid and a rinse liquid are supplied to the upper surface Wa of the substrate W held by the holder 711 in this order.

[0196] After the treatment using the rinse liquid, an organic solvent may be supplied. After the treatment using the organic solvent, for example, a treatment (also referred to as a drying treatment) is performed in which the organic solvent is removed from the upper surface Wa of the substrate W and the upper surface Wa of the substrate W is dried. In the drying treatment, for example, the substrate W held by the holder 711 is rotated about the rotation axis A3 by an electric motor 711m serving as a drive unit.

[0197] When a series of substrate processing steps for the substrate W are completed in the processing unit 76, the second transport mechanism 75 removes the processed substrate W from the processing unit 76. The second transport mechanism 75 transports the processed substrate W to the substrate mounting part 77. The first transport mechanism 723 transports the substrate W from the substrate mounting part 77 to the carrier C on the carrier mounting part 721.

[0198] In the substrate processing apparatus 790, the first transport mechanism 723 and the second transport mechanism 75 repeatedly perform the above-described transport operation in accordance with the recipe, and each processing unit 76 performs a series of substrate processing on the substrate W in accordance with the processing recipe. In this way, the series of substrate processing on the substrate W is performed one after another.

[0199] <2. Explanation of the circulation device> 10 and 13 to 19 are piping diagrams illustrating the configuration of the circulation device 100. In these figures, a processing liquid supply source 30 and a waste liquid section 40, which are located outside the circulation device 100 and will be described later, are also shown.

[0200] FIG. 11 is a diagram illustrating the configuration of an external path P located outside the circulation device 100. The circulation device 100 supplies and recovers the liquid Q to the external path P. Specifically, the external path P is towers P10 and P30. The liquid Q is supplied to the towers P10 and P30 by pipes P1a and P3a, respectively. The liquid Q is recovered from the towers P10 and P30 by pipes P1b and P3b, respectively.

[0201] The circulation device 100 can be employed in either of the processing liquid distribution sections 701 and 702.

[0202] When the circulation device 100 is employed as the processing liquid distribution section 701, for example, the pipes P1a and P1b are pipes through which the processing liquid flows in the six processing units 76C, and the pipes P3a and P3b are pipes through which the processing liquid flows in the six processing units 76D.

[0203] For example, the processing liquid is supplied to and collected from the tower P10 and the six processing units 76C via pipes P1a and P1b. The processing liquid is supplied to and collected from the tower P30 and the six processing units 76D via pipes P3a and P3b. The pipes P1a and P1b are provided in the supply pipe space 762C, and the pipes P3a and P3b are provided in the supply pipe space 762D.

[0204] When the circulation device 100 is employed as the processing liquid distribution section 702, for example, the tower P10 is a pipe through which the processing liquid flows in six processing units 76A, and the tower P30 is a pipe through which the processing liquid flows in six processing units 76B.

[0205] For example, the processing liquid is supplied to and collected from the tower P10 and the six processing units 76A via pipes P1a and P1b. The processing liquid is supplied to and collected from the tower P30 and the six processing units 76B via pipes P3a and P3b. The pipes P1a and P1b are provided in the supply pipe space 762A, and the pipes P3a and P3b are provided in the supply pipe space 762B.

[0206] The circulation device 100 includes a storage tank T. The storage tank T stores a liquid Q. The liquid Q is, for example, sulfuric acid or a diluted solution thereof (dilute sulfuric acid).

[0207] The circulation device 100 includes a valve 81. The valve 81 is connected to a reservoir T. The valve 81 controls the discharge of the liquid Q from the reservoir T to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

[0208] The circulation device 100 includes a pipe 1. The pipe 1 has an inlet end 101 and is used to supply a liquid Q via pipes P1a and P3a. The pipes P1a and P3a can be considered to be included in the pipe 1. The liquid Q flows into the inlet end 101 from a storage tank T.

[0209] The circulation device 100 includes a pipe 2. The pipe 2 has an outlet end 202 and is used to collect the liquid Q via pipes P1b and P3b. The pipes P1b and P3b can be considered to be included in the pipe 2. The liquid Q flows out from the outlet end 202 into a storage tank T.

[0210] The circulation device 100 includes a valve 21. The valve 21 is provided in the pipe 2 and controls the outflow of the liquid Q from the outflow end 202 to the storage tank T. For example, an on-off valve is used as the valve 21.

[0211] The circulation in which the liquid Q flows out of the storage tank T and into the storage tank T via the pipes 1 and 2 and the valve 21 is commonly referred to as "external circulation." The pipes 1 and 2 and the valve 21 that contribute to the external circulation are sometimes referred to as the external circulation path.

[0212] The circulation device 100 includes a pump 12. The pump 12 is provided in the pipe 1. The pump 12 has an intake port 12a and an outlet port 12b. The intake port 12a is connected to the inlet end 101. The pump 12 pumps the liquid Q from the intake port 12a to the outlet port 12b. For example, a magnetically levitated centrifugal pump is used as the pump 12. For example, a bearingless pump manufactured by Levitronix is ​​used as the magnetically levitated centrifugal pump.

[0213] The circulation device 100 includes a heater 11. The heater 11 is provided in the pipe 1 and connected to the discharge port 12b. The heater 11 heats the liquid Q. For example, a pair of heaters 11 are provided in the pipe 1 in series with each other.

[0214] The circulation device 100 includes a pipe 3. The pipe 3 is a path for the liquid Q to be stored outside the circulation device 100, specifically, for example, from the processing liquid supply source 30 to the storage tank T. The pipe 3 has an outlet end 302. The liquid Q flows out from the outlet end 302 into the storage tank T.

[0215] When the circulation device 100 is employed as the processing liquid distribution unit 701, the processing liquid supply source 703 functions as the processing liquid supply source 30. When the circulation device 100 is employed as the processing liquid distribution unit 702, the processing liquid supply source 704 functions as the processing liquid supply source 30.

[0216] The circulation device 100 includes a valve 31. The valve 31 is provided in the pipe 3 and controls the outflow of the liquid Q from the outflow end 302 to the storage tank T. The valve 31 may be, for example, an on-off valve.

[0217] The circulation device 100 includes a pipe 4. The pipe 4 is connected to the pipe 2 on the side opposite the outlet end 202 of the valve 21. For example, the pipe 4 has an end 401, which is connected to the pipe 2. The end 401 is located between the valve 21 and the pipes P1b and P3b. The pipe 4 is a path for discharging the liquid Q from the pipe 2 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

[0218] The circulation device 100 includes a valve 84. The valve 84 is provided in the pipe 4 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 84.

[0219] The circulation device 100 includes a pipe 5. The pipe 5 is connected to the pipe 1 on the opposite side of the heater 11 from the pump 12. The pipe 5 has an outlet end 502. The liquid Q flows out from the outlet end 502 into the storage tank T. For example, the pipe 5 has an end 501, which is connected to the pipe 1. The end 501 is located between the heater 11 and the pipes P1a and P3a.

[0220] The circulation device 100 includes a valve 51. The valve 51 is provided in the pipe 5 and controls the outflow of the liquid Q from the outflow end 502 to the storage tank T. For example, an on-off valve is used as the valve 51.

[0221] The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1 and 5 and valve 51 is commonly referred to as "internal circulation." The pipes 1 and 5 and valve 51 that contribute to the internal circulation are sometimes referred to as the internal circulation path.

[0222] The circulation device 100 includes a pipe 6. The pipe 6 is connected to the pipe 5 on the side opposite the outlet end 502 of the valve 51. For example, the pipe 6 is connected to the pipe 5 at the end 501. The pipe 6 is a path for discharging the liquid Q from the pipe 5 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

[0223] The circulation device 100 includes a valve 86. The valve 86 is provided in the pipe 6 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 86.

[0224] The circulation device 100 includes a filter 16. The filter 16 is provided in the pipe 1 between the heater and the pipes 5 and 6. The filter 16 has the function of removing impurities from the liquid Q.

[0225] For example, the filter 16 is a pair of filters 161, 163 connected in parallel to each other in the pipe 1. Such a parallel connection contributes to reducing the pressure loss in the filter 16 and, in turn, in the pipe 1.

[0226] The circulation device 100 includes a pipe 7. The pipe 7 has an outlet end 708. The pipe 7 is connected to the pipe 1 between the heater 11 and the filter 16. For example, the pipe 7 is connected to the pipe 1 at an end 707. The liquid Q flows out from the outlet end 708 into the reservoir T.

[0227] The circulation device 100 includes a valve 71. The valve 71 is provided in the pipe 7 and controls the outflow of the liquid Q from the outflow end 708 to the storage tank T. The valve 71 may be, for example, an on-off valve.

[0228] The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1 and 7 and valve 71 is commonly referred to as "preliminary circulation." The pipes 1 and 7 and valve 71 that contribute to the preliminary circulation are sometimes referred to as a preliminary circulation path.

[0229] The circulation device 100 includes a pipe 8. The pipe 8 is connected to the pipe 7 on the side opposite the outlet end 708 of the valve 71. For example, the pipe 8 is connected to the pipe 7 at the end 707. The pipe 8 is a path for discharging the liquid Q from the pipe 7 to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

[0230] The circulation device 100 includes a valve 88. The valve 88 is provided in the pipe 8 and controls the discharge of the liquid Q. For example, an on-off valve is used as the valve 88.

[0231] The circulation device 100 includes a pipe 9. The pipe 9 is connected to a filter 16. The pipe 9 is a path for discharging the liquid Q from the filter 16 to the outside of the circulation device 100, specifically to a waste liquid section 40, for example.

[0232] The circulation device 100 includes a valve 89. The valve 89 is provided in the pipe 9 and controls the discharge of the liquid Q. For example, the valve 89 may include a valve 891 connected to the filter 161 and a valve 893 connected to the filter 163. For example, an on-off valve may be used for both the valves 891 and 893.

[0233] The circulation device 100 includes a valve 80. The valve 80 is connected to the outlet 12b. The valve 80 controls the discharge of the liquid Q to the outside of the circulation device 100, specifically to the waste liquid section 40, for example.

[0234] The circulation device 100 includes a flow meter 15. The flow meter 15 is provided between the inlet end 101 and the suction port 12a. The flow meter 15 measures the flow rate of the liquid Q in the pipe 1.

[0235] The circulation device 100 includes a thermometer 17 and a pressure gauge 18. The thermometer 17 and the pressure gauge 18 are provided, for example, between the heater 11 and the filter 16. The thermometer 17 measures the temperature of the liquid Q in the pipe 1. The pressure gauge 18 measures the pressure of the liquid Q in the pipe 1.

[0236] 12 is a block diagram showing an outline of the functions of the control unit U. The control unit U controls the operations of the valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89. For example, the control unit U supplies a control signal Sv to the valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89 to control their opening and closing.

[0237] The control unit U controls the operation of the heater 11 and the pump 12. For example, the control unit U supplies a control signal Sh to the heater 11 to control the heating of the liquid Q by the heater 11. For example, the control unit U supplies a control signal Sp to the pump 12 to control the flow rate of the liquid Q by the pump 12.

[0238] The control unit U receives input of data Fd from the flowmeter 15, which indicates the flow rate of the liquid Q flowing through the pipe 1. The control unit U receives input of data Td from the thermometer 17, which indicates the temperature of the liquid Q in the pipe 1 (hereinafter also simply referred to as "liquid temperature"). The control unit U receives input of data Pd from the pressure gauge 18, which indicates the pressure of the liquid Q in the pipe 1.

[0239] The control of the rotation speed of the pump 12 by the control unit U using the control signal Sp based on the data Fd and Pd, and the control of the heating of the liquid Q by the heater 11 by the control unit U using the control signal Sh based on the data Td are realized using well-known techniques, so details of the techniques for realizing such control of the pump 12 and the heater 11 will be omitted.

[0240] The relationship between the valve opening and closing operation, the liquid temperature, and the operation of the pump 12 (specifically, driving and stopping (hereinafter also simply referred to as "on" and "off")) will be explained below. In the following explanation, the pair of triangles that make up the symbol representing the valve will be a black triangle when the valve is in an open state (hereinafter also referred to as an "open state"), and a white triangle when the valve is in a closed state (hereinafter also referred to as a "closed state").

[0241] <2-1. Temperature adjustment before changing the liquid> In order to replace the liquid Q, the liquid Q before replacement is discharged from the circulation device 100. This discharge is easier when the viscosity of the liquid Q is low. The higher the temperature of the liquid Q, the lower the viscosity of the liquid Q.

[0242] 13 shows a state in which step J1 is being performed. In step J1, the liquid temperatures of both the liquid Q in the circulation device 100 and the liquid Q in the external path P are increased during a first period prior to the discharge.

[0243] In step J1, valves 81, 31, 84, 51, 86, 71, 80, 88, and 89 are closed, valve 21 is opened, heater 11 is driven to raise the temperature of liquid Q, and pump 12 is turned on. For example, liquid Q is raised to 140°C.

[0244] The heated liquid Q is circulated externally. Specifically, as indicated by the liquid flow F1, the liquid Q flows through the inlet end 101 of the pipe 1, the pump 12, the heater 11, and the filter 16 in this order. The liquid flow F1 is divided into a liquid flow F1a flowing through the pipe P1a and a liquid flow F1b flowing through the pipe P1b. The liquid flows F1a and F3a flow into the towers P10 and P30, respectively.

[0245] From tower P10, liquid Q flows through pipe P1b as liquid flow F1b into pipe 2. From tower P30, liquid Q flows through pipe P3b as liquid flow F3b into pipe 2. Liquid flows F1b and F3b join in pipe 2 to become liquid flow F2. Liquid flow F2 passes through valve 21 and flows out from outlet end 202 into storage tank T.

[0246] 10 shows an example of the state immediately before step J1 is performed. The pump 12 is not driven, and the valve 80 is open. The liquid Q flows from the valve 80 to the waste liquid section 40 as a liquid flow F80. When a magnetically levitated centrifugal pump is used as the pump 12, this state can be considered a preparatory state that makes the pump 12 liquid-tight and contributes to easy operation of the pump 12 in the following steps. In this preparatory state, the valve 21 may be open.

[0247] <2-2. Discharge of processing liquid> 14 shows the state in which step J2 is being performed. Step J2 is performed in a second period after step J1. In step J2, the liquid Q is discharged from the circulation device 100. Since step J2 is a process before the liquid Q is newly stored in the storage tank T, the valve 31 is closed.

[0248] In step J2, the valve 81 is opened, and the liquid Q in the storage tank T is discharged to the outside, specifically to the waste liquid section 40. The discharge of the liquid Q is illustrated as a liquid flow F11.

[0249] In step J2, valves 21 and 84 are opened, and liquid Q that was in pipes P1b, P3b, and 2 is discharged to the outside, specifically to waste liquid section 40. Liquid Q flows as liquid flow F2b in the direction from outlet end 202 to end 401. Liquid flow F1b flowing from pipe P1b to end 401, liquid flow F3b flowing from pipe P3b to end 401, and liquid flow F2b join together to form liquid flow F4, and liquid Q is discharged to waste liquid section 40 via valve 84.

[0250] In step J2, valves 51 and 86 are opened, and liquid Q in pipe 5 is discharged to the outside, specifically to waste liquid section 40. Liquid Q flows as liquid flow F5b in the direction from outlet end 502 to end 501, and liquid flow F5b becomes liquid flow F6 and flows through pipe 6, and liquid Q is discharged to waste liquid section 40 via valve 86.

[0251] In step J2, valves 71 and 88 are opened, and liquid Q in pipe 7 is discharged to the outside, specifically to waste liquid section 40. Liquid Q flows as liquid flow F7b in the direction from outflow end 708 to end 707, and liquid flow F7b becomes liquid flow F8 and flows through pipe 8, and liquid Q is discharged to waste liquid section 40 via valve 88.

[0252] In step J2, valve 89 is opened, and liquid Q that was in pipe 6 and filter 16 is discharged to the outside, specifically to the waste liquid section 40. Liquid Q flows from filter 161 through valve 891 as liquid flow F91. Liquid Q flows from filter 163 through valve 893 as liquid flow F93. Liquid flows F91 and F93 join in pipe 9 to become liquid flow F9, and liquid Q is discharged to the waste liquid section 40.

[0253] These discharges can occur due to the weight of liquid Q. Liquid Q has a low viscosity because it is heated to a predetermined high temperature (140°C in the above example) in step J1. This makes it easy to estimate the required discharge time regardless of the temperature of liquid Q remaining before step J1 is performed. Step J2 efficiently discharges the remaining processing liquid, thereby contributing to improving the efficiency of liquid exchange.

[0254] In step J2, the pump 12 is stopped and the valve 80 is closed. This state is particularly suitable when a magnetically levitated centrifugal pump is used as the pump 12. In this case, it is desirable that the liquid Q be filled between the intake port 12a and the discharge port 12b in order for the pump 12 to operate normally. From this perspective, it can be said that the liquid Q that has not been discharged from the circulation device 100 remains even in step J2.

[0255] <2-3. Storage of processing liquid> Figure 15 shows the state in which step J3 is being performed. Step J3 is performed in a third period after step J2. In step J3, liquid Q is stored in storage tank T from the outside, specifically from processing liquid supply source 30. In step J3, pump 12 is stopped, valves 80 and 81 are closed, and valve 31 is open. It does not matter whether valves 21, 51, 71, 84, 86, 88, and 89 are open or closed, but Figure 15 illustrates a case in which they are closed.

[0256] With the valve 31 in an open state, the liquid Q flows as a liquid flow F3 from the processing liquid supply source 30 through the valve 31 and from the outlet end 302, and the liquid Q is stored in the storage tank T. In step J3, the liquid temperature of the liquid Q stored in the storage tank T is, for example, room temperature.

[0257] <2-4. External circulation of treatment liquid> 16 shows the state in which step J4 is being executed. Step J4 is executed in the fourth period after step J3. In step J4, the liquid Q newly stored in the storage tank T in step J3 is circulated externally and internally. In step J4, the pump 12 is turned on.

[0258] In step J4, the heater 11 is driven to raise the temperature of the liquid Q. For example, the liquid temperature Qt rises to 140°C.

[0259] In step J4, valves 31, 71, 80, 81, 84, and 88 are closed, and valve 21 is opened. Liquid Q flows from tower P10 through pipe P1b into pipe 2 as liquid flow F1b. Liquid Q flows from tower P30 through pipe P3b into pipe 2 as liquid flow F3b. Liquid flows F1b and F3b join in pipe 2 to become liquid flow F2. Liquid flow F2 passes through valve 21 and flows out from outlet end 202 into storage tank T.

[0260] Valve 51 is opened, valve 86 is closed, and liquid Q flows as liquid flow F5 through valve 51 from end 501 to outlet end 502 of pipe 5.

[0261] The valve 89 is closed, and the liquid flow F1 flowing through the pipe 1 is divided into the above-mentioned liquid flow F5, a liquid flow F1a flowing through the pipe P1a toward the tower P10, and a liquid flow F3a flowing through the pipe P3a toward the tower P30. The heated liquid Q is circulated externally and internally.

[0262] In this way, before newly introducing the liquid Q into the circulation device 100 and prior to discharging the existing liquid Q into the circulation device 100, the temperature of the liquid Q in the circulation device 100 is raised, so that the viscosity of the liquid decreases before the discharge. Raising the liquid temperature before discharging the liquid in this way contributes to reducing the time required to discharge the liquid.

[0263] <2-5. Internal circulation of processing liquid> By performing internal circulation of the liquid Q prior to step J4 to raise the liquid temperature, the viscosity of the liquid Q to be used for external circulation in step J4 is reduced, thereby contributing to smooth external circulation.

[0264] 17 shows the state in which step J5 is being performed. Step J5 is performed in a fifth period between step J3 of storing the treatment liquid and step J4 of external circulation. In step J5, valve 51 is opened, and valves 71, 80, 81, 21, 31, 84, 86, 88, and 89 are closed.

[0265] In step J5, the heater 11 is driven and the pump 12 is turned on. For example, the liquid temperature Qt is 40° C. The liquid Q flows through the pipes 1 and 5 as liquid flows F1 and F5, respectively, and performs internal circulation.

[0266] <2-6. Preliminary circulation of processing liquid> Preliminary circulation of the liquid Q prior to step J5 to raise the liquid temperature and lower the viscosity of the liquid Q contributes to smooth internal circulation via the filter 16 in step J5.

[0267] 18 shows the state in which step J6 is being performed. Step J6 is performed in a sixth period between step J3 of storing the treatment liquid and step J5 of internal circulation. In step J6, valves 81, 21, 31, 84, 51, 86, 88, 89, and 80 are closed, and valve 71 is open.

[0268] In step J6, the heater 11 is driven and the pump 12 is turned on. For example, the liquid temperature Qt is set to a value equal to or lower than the liquid temperature Qt in the internal circulation, e.g., 40°C. The liquid Q flows through pipes 1 and 7 as liquid flows F1 and F7, respectively, to perform preliminary circulation.

[0269] <2-7. Filling the pump with processing liquid> Charging new liquid Q into pump 12 prior to step J6 serves to replace the liquid Q remaining in pump 12.

[0270] 19 shows the state in which step J7 is being performed. Step J7 is performed in a seventh period between step J3 of storing the treatment liquid and step J6 of performing preliminary circulation. In step J7, valves 21, 31, 51, 71, 81, 84, 86, 88, and 89 are closed, valve 80 is opened, and pump 12 is driven.

[0271] In step J7, the liquid Q flows as a liquid flow F1 from the inlet end 101 through the pipe 1 without passing through the pump 12 and reaching the heater 11. The liquid flow F1 passes through the valve 80 and flows as a liquid flow F80, and the liquid Q flows to the waste liquid section 40.

[0272] The liquid Q stored in the reservoir T in step J3 is replaced with the liquid Q remaining inside the pump 12 in step J7.

[0273] <2-8. Flowchart of the Circulation Device Operation> 20 is a flowchart illustrating the operation of the circulation device 100 when all of the above steps J1, J2, J3, J4, J5, J6, and J7 are performed. Since steps J1, J2, J3, J4, J5, J6, and J7 are used when exchanging the liquid Q, which is the processing liquid, the flowchart is titled "Replacement of Processing Liquid."

[0274] Steps S11, S13, S15, S17, S19, S21, and S22 are executed by the control unit U by opening and closing valves 21, 31, 51, 71, 80, 84, 86, 88, 891, and 893 (hereinafter also referred to as "opening and closing of the valve group") using a control signal Sv, by driving (specifically, heating) and stopping heater 11 using a control signal Sh, and by driving and stopping pump 12 using a control signal Sp.

[0275] In step S11, process J1 is performed. Since process J1 is performed prior to process J2 in which liquid Q is discharged from circulation device 100, step S11 is marked with "(heating before discharge)."

[0276] In step S12, it is determined whether the liquid temperature Qt is equal to or higher than the temperature T1. This determination is made by the control unit U based on the data Td. If a positive determination is not obtained in step S12, steps S11 and S12 are continued to be executed until the liquid temperature Qt reaches the temperature T1. In the above example, the temperature T1 is 140°C.

[0277] If a positive determination is obtained in step S12, specifically if the liquid temperature Qt reaches the temperature T1, step S13 is executed.

[0278] In step S13, the process J2 is executed. In the process J2, the liquid Q is discharged from the circulation device 100, and therefore, step S13 is denoted with "(drainage)".

[0279] In step S14, it is determined whether the drainage has been completed. For example, the position of the liquid surface of the liquid Q in the storage tank T is detected, and it is determined based on this position whether the drainage has been completed.

[0280] If a positive determination is not obtained in step S14, specifically, steps S13 and S14 are continued to be executed until the distance between the liquid surface of the liquid Q and the bottom surface of the storage tank T becomes equal to or less than the first predetermined distance.

[0281] If a positive determination is obtained in step S14, specifically, for example, if the distance between the liquid surface of the liquid Q and the bottom surface of the storage tank T becomes equal to or less than a first predetermined distance, step S15 is executed.

[0282] The position of the liquid level of the liquid Q may be detected by a liquid sensor located a first predetermined distance away from the bottom surface of the storage tank T, or may be detected by optical distance measurement from above the storage tank T.

[0283] In step S15, the process J3 is executed. In the process J3, the liquid Q is stored in the storage tank T, so "(storage)" is added to step S15.

[0284] In step S16, it is determined whether the storage has been completed. This determination is made, for example, by detecting the position of the liquid surface of the liquid Q in the storage tank T, and determining whether the storage has been completed based on this position.

[0285] If a positive determination is not obtained in step S16, specifically, steps S15 and S16 are continued to be executed until the distance between the liquid surface of the liquid Q and the bottom surface of the storage tank T becomes equal to or greater than the second predetermined distance.

[0286] If a positive determination is obtained in step S16, specifically, for example, if the distance between the liquid surface of the liquid Q and the bottom surface of the storage tank T is equal to or greater than a second predetermined distance, step S17 is executed.

[0287] The position of the liquid level of the liquid Q may be detected by a liquid sensor located a second predetermined distance away from the bottom surface of the storage tank T, or may be detected by optical distance measurement from above the storage tank T.

[0288] In step S17, step J7 is executed. Since step J7 is for filling new liquid Q into pump 12, step S17 is denoted with "(filling)".

[0289] In step S18, it is determined whether filling is complete. This determination is made by the control unit U, for example, based on whether a first predetermined time has elapsed since step S17 was first executed. The first predetermined time is measured in advance and stored in the control unit U. Each time step S18 is executed, the control unit U compares the time elapsed since step S17 was first executed with the first predetermined time. The determination in step S18 is made based on the result of this comparison.

[0290] If a positive determination is not made in step S18, specifically, steps S17 and S18 continue to be executed until the time elapsed since step S17 was first executed reaches a first predetermined time.

[0291] If a positive determination is obtained in step S18, specifically, for example, if the time elapsed since step S17 was first executed reaches a first predetermined time, step S19 is executed.

[0292] In step S19, process J6 is executed. Since preliminary circulation is performed in process J6, step S19 is marked with "(preliminary circulation)".

[0293] In step S20, it is determined whether the liquid temperature Qt is equal to or higher than the temperature T6. This determination is made by the control unit U based on the data Td. If a positive determination is not obtained in step S20, steps S19 and S20 are continued to be executed until the liquid temperature Qt reaches the temperature T6. In the above example, the temperature T6 is 40°C.

[0294] If a positive determination is obtained in step S20, specifically if the liquid temperature Qt reaches the temperature T6, step S21 is executed.

[0295] In step S21, process J5 is executed. Since internal circulation is performed in process J5, "(internal circulation)" is added to step S19.

[0296] In step S22, it is determined whether internal circulation has been completed. As a first example of such a determination, the following method can be adopted. This determination is made by the control unit U based on whether a second predetermined time has elapsed since step S21 was first executed. The second predetermined time is measured in advance and stored in the control unit U. Each time step S22 is executed, the control unit U compares the time elapsed since step S21 was first executed with the second predetermined time. The determination in step S22 is made based on the result of this comparison.

[0297] If a positive determination is not made in step S22, specifically, steps S21 and S22 are continued to be executed until the time elapsed since step S21 was first executed reaches a second predetermined time.

[0298] If a positive determination is obtained in step S22, specifically, for example, if the time elapsed since step S21 was first executed reaches a second predetermined time, step S23 is executed.

[0299] As a second example of the determination in step S22, the following method can be adopted. In step S22, it is determined whether the liquid temperature Qt is equal to or higher than the temperature T5. This determination is made by the control unit U based on the data Td. If a positive determination is not obtained in step S22, specifically, steps S21 and S22 are continued to be executed until the liquid temperature Qt reaches the temperature T5. In the above example, the temperature T5 is 40°C.

[0300] If a positive determination is obtained in step S22, specifically if the liquid temperature Qt reaches the temperature T5, step S23 is executed.

[0301] In step S23, process J4 is executed. In process J4, external circulation is performed together with internal circulation, so step S23 is marked with "(internal circulation and external circulation)".

[0302] In step S24, it is determined whether the liquid temperature Qt is equal to or higher than the temperature T4. This determination is made by the control unit U based on the data Td. If a positive determination is not obtained in step S24, steps S23 and S24 are continued to be executed until the liquid temperature Qt reaches the temperature T4. In the above example, the temperature T4 is 140°C.

[0303] If a positive determination is obtained in step S24, specifically if the liquid temperature Qt reaches the temperature T4, the replacement of the liquid Q is completed.

[0304] <3. Transformation> <3-1. Variation of Process J3> As described above, in step J3, it does not matter whether the valves 21, 51, 71, 84, 86, 88, and 89 are open or closed. Step J3 is performed after step J2, and in step J2, the valves 21, 51, 71, 84, 86, 88, and 89 are open. Maintaining the valves 21, 51, 71, 84, 86, 88, and 89 open in step J3 also contributes to suppressing opening and closing operations.

[0305] <3-2. Variation of Process J5> Immediately after step J4, the temperature of the external path P and / or the temperature of the liquid Q that may have remained in the external path P may be around room temperature. Therefore, even if external circulation accompanied by internal circulation is performed immediately after the end of step J4, it is expected that the liquid flow F5 into the pipe 5, where the viscosity of the liquid Q is high, will occur preferentially over the liquid flow F2 flowing through the external path P, where the viscosity of the liquid Q is low.

[0306] Therefore, at the beginning of step J5, external circulation without internal circulation is performed, which contributes to easy supply of the liquid Q warmed by the internal circulation to the external path P.

[0307] Specifically, at the beginning of step J5, the valves 21, 31, 51, 71, 80, 81, 84, 86, 88, and 89 are closed, and the valve 21 is opened.

[0308] As in step J4, liquid Q flows from tower P10 through pipe P1b as liquid flow F1b into pipe 2. Liquid Q flows from tower P30 through pipe P3b as liquid flow F3b into pipe 2. The liquid flows F1b and F3b join in pipe 2 to become liquid flow F2. Liquid flow F2 passes through valve 21 and flows out from outlet end 202 into storage tank T.

[0309] Unlike in step J4, liquid flow F5 does not flow, so liquid flow F1 flowing through pipe 1 is divided into liquid flow F1a flowing through pipe P1a toward tower P10 and liquid flow F3a flowing through pipe P3a toward tower P30.

[0310] The liquid temperature Qt may temporarily drop due to external circulation without internal circulation. If the liquid temperature Qt obtained from the data Td is temperature T5, the valve 51 is opened to generate a liquid flow F5, which is accompanied by internal circulation.

[0311] Such a modification of step J5 can be explained as adding a step of performing external circulation without internal circulation before the above-mentioned step J5.

[0312] <3-3. Variation of Process J2> In the explanation of step J2, a case where the pump 12 is stopped is exemplified. If a magnetically levitated centrifugal pump is not used for the pump 12, it is also possible to drain the liquid from inside the pump 12. In step J2, the valve 80 is opened, the pump 12 is driven, and the liquid Q between the inlet end 101 and the outlet 12b is discharged.

[0313] All or part of the components constituting each of the above-described embodiments and various modified examples can be combined as appropriate within the scope of not being inconsistent. [Explanation of symbols]

[0314] 1 Pipe (1st Pipe) 2 Piping (2nd Piping) 3 Pipe (3rd Pipe) 4 Pipe (4th Pipe) 5 Pipe (5th Pipe) 6 Pipe (6th Pipe) 7 Pipe (7th Pipe) 8 Pipe (8th Pipe) 9 Pipe (8th Pipe) 11 Heater 12 Pump 12a Inlet 12b Discharge port 16 filters 21 valve (second valve) 30 Processing liquid supply source (liquid supply source) 31 valve (3rd valve) 40 Waste liquid section (external) 51 valve (5th valve) 71 valve (7th valve) 80 valves (10th valve) 81 valve (first valve) 84 valves (4th valve) 86 valves (6th valve) 88 valves (8th valve) 89 valves (9th valve) 100 Circulation device 101 Inflow end (1st inflow end) 202 Outlet end (second outlet end) 302 Outlet end (third outlet end) 502 Outlet end (5th outlet end) 708 Outlet (7th Outlet) P external route Q liquid T storage tank U control section

Claims

1. 1. A method for controlling a circulation device that supplies and withdraws liquid to an external pathway, the method comprising: The circulation device is a reservoir for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid; a first valve connected to the reservoir tank and controlling discharge of the liquid from the reservoir tank to the outside of the circulation device; a pump provided in the first pipe, the pump having a suction port connected to the first inlet end and a discharge port, the pump configured to pump out the liquid; a heater provided in the first pipe and connected to the discharge port, the heater heating the liquid; a second pipe having a second outlet end through which the liquid is discharged into the reservoir and used for recovering the liquid; a second valve provided in the second pipe to control the outflow of the liquid from the second outlet end to the reservoir; a third pipe having a third outlet end through which the liquid flows into the storage tank, the third pipe being a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device; a third valve provided in the third pipe and controlling the outflow of the liquid from the third outlet end to the storage tank; a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end, the fourth pipe being a path for discharging the liquid from the second pipe to the outside of the circulation device; and a fourth valve provided in the fourth pipe for controlling the discharge of the liquid; Equipped with The method comprises: a first step of closing the first valve, the third valve, and the fourth valve, opening the second valve, driving the heater to increase the temperature of the liquid, and driving the pump during a first period; a second step of stopping the pump, opening the first valve, the second valve, and the fourth valve, and closing the third valve during a second period after the first period; a third step of stopping the pump, closing the first valve, and opening the third valve during a third period after the second period; and a fourth step of closing the first valve, the third valve, and the fourth valve, opening the second valve, driving the heater to increase the temperature of the liquid, and driving the pump during a fourth period after the third period; A method for controlling a circulation device, comprising:

2. The circulation device is a fifth pipe having a fifth outlet end through which the liquid is discharged into the storage tank, the fifth pipe being connected to the first pipe on the opposite side of the heater from the pump; a fifth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the opposite side of the fifth valve from the fifth outlet end, the sixth pipe being a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a sixth valve provided in the sixth pipe for controlling the discharge of the liquid; Further provided with The method comprises: In the first step, the fifth valve and the sixth valve are closed, In the second step, the fifth valve and the sixth valve are opened, In the fourth step, the fifth valve is opened and the sixth valve is closed; a fifth step of closing the first valve, the second valve, the third valve, the fourth valve, and the sixth valve, opening the fifth valve, driving the heater to increase the temperature of the liquid, and driving the pump during a fifth period between the third period and the fourth period. The method for controlling a circulation device according to claim 1 , further comprising:

3. The circulation device is a filter provided in the first pipe between the heater and the fifth pipe and the sixth pipe; a seventh pipe having a seventh outlet end through which the liquid is discharged into the reservoir, the seventh pipe being connected to the first pipe between the heater and the filter; a seventh valve provided in the seventh pipe and controlling the outflow of the liquid from the seventh outlet end to the storage tank; an eighth pipe connected to the seventh pipe on the opposite side of the seventh valve from the seventh outlet end, and serving as a path for discharging the liquid from the seventh pipe to the outside of the circulation device; an eighth valve provided in the eighth pipe and controlling the discharge of the liquid; a ninth pipe connected to the filter and serving as a path for discharging the liquid from the filter to the outside of the circulation device; and a ninth valve provided in the ninth pipe and controlling the discharge of the liquid; Further provided with The method comprises: In the first step, the seventh valve, the eighth valve, and the ninth valve are closed, In the second step, the seventh valve, the eighth valve, and the ninth valve are opened, In the fourth step and the fifth step, the seventh valve, the eighth valve, and the ninth valve are closed; a sixth step of closing the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the eighth valve, and the ninth valve, opening the seventh valve, driving the heater to heat the liquid to a temperature equal to or lower than the temperature of the liquid in the fifth period, and driving the pump during a sixth period between the third period and the fifth period. The method for controlling a circulation device according to claim 2 , further comprising:

4. The circulation device is a tenth valve connected to the outlet and controlling the discharge of the liquid to the outside of the circulation device; Further provided with The method comprises: the tenth valve is closed in the first step, the second step, the third step, the fourth step, the fifth step, and the sixth step; a seventh step of closing the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the seventh valve, the eighth valve, and the ninth valve, and opening the tenth valve, and driving the pump during a seventh period between the third period and the sixth period; The method for controlling a circulation device according to claim 3 , further comprising:

5. 1. A circulation device for supplying and withdrawing liquid to an external pathway, comprising: a reservoir for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid; a first valve connected to the reservoir tank and controlling discharge of the liquid from the reservoir tank to the outside of the circulation device; a pump provided in the first pipe, the pump having a suction port connected to the first inlet end and a discharge port, the pump configured to pump out the liquid; a heater provided in the first pipe and connected to the discharge port, the heater heating the liquid; a second pipe having a second outlet end through which the liquid is discharged into the reservoir and used for recovering the liquid; a second valve provided in the second pipe to control the outflow of the liquid from the second outlet end to the reservoir; a third pipe having a third outlet end through which the liquid flows into the storage tank, the third pipe being a path for the liquid to be stored in the storage tank from a liquid supply source outside the circulation device; a third valve provided in the third pipe and controlling the outflow of the liquid from the third outlet end to the storage tank; a fourth pipe connected to the second pipe on the opposite side of the second valve from the second outlet end, the fourth pipe being a path for discharging the liquid from the second pipe to the outside of the circulation device; a fourth valve provided in the fourth pipe for controlling the discharge of the liquid; and a control unit that controls the first valve, the second valve, the third valve, the fourth valve, the pump, and the heater; Equipped with The control unit During a first period, the first valve, the third valve, and the fourth valve are closed, the second valve is opened, the heater is driven to raise the temperature of the liquid, and the pump is driven; during a second period after the first period, the pump is stopped, the first valve, the second valve, and the fourth valve are opened, and the third valve is closed; During a third period after the second period, the pump is stopped, the first valve is closed, and the third valve is opened; during a fourth period after the third period, the first valve, the third valve, and the fourth valve are closed, the second valve is opened, the heater is driven to raise the temperature of the liquid, and the pump is driven; Circulation device.

6. a fifth pipe having a fifth outlet end through which the liquid is discharged into the storage tank, the fifth pipe being connected to the first pipe on the opposite side of the heater from the pump; a fifth valve provided in the fifth pipe and controlling the outflow of the liquid from the fifth outlet end to the storage tank; a sixth pipe connected to the fifth pipe on the opposite side of the fifth valve from the fifth outlet end, the sixth pipe being a path for discharging the liquid from the fifth pipe to the outside of the circulation device; and a sixth valve provided in the sixth pipe for controlling the discharge of the liquid; Further provided with The control unit During the first period, the fifth valve and the sixth valve are closed; during the second period, the fifth valve and the sixth valve are opened; During the fourth period, the fifth valve is opened and the sixth valve is closed; during a fifth period between the third period and the fourth period, the first valve, the second valve, the third valve, the fourth valve, and the sixth valve are closed, the fifth valve is opened, the heater is driven to increase the temperature of the liquid, and the pump is driven; The circulation device according to claim 5 .

7. a filter provided in the first pipe between the heater and the fifth pipe and the sixth pipe; a seventh pipe having a seventh outlet end through which the liquid is discharged into the reservoir, the seventh pipe being connected to the first pipe between the heater and the filter; a seventh valve provided in the seventh pipe and controlling the outflow of the liquid from the seventh outlet end to the storage tank; an eighth pipe connected to the seventh pipe on the opposite side of the seventh valve from the seventh outlet end, and serving as a path for discharging the liquid from the seventh pipe to the outside of the circulation device; an eighth valve provided in the eighth pipe and controlling the discharge of the liquid; a ninth pipe connected to the filter and serving as a path for discharging the liquid from the filter to the outside of the circulation device; and a ninth valve provided in the ninth pipe and controlling the discharge of the liquid; Further provided with During the first period, the seventh valve, the eighth valve, and the ninth valve are closed; During the second period, the seventh valve, the eighth valve, and the ninth valve are opened; the seventh valve, the eighth valve, and the ninth valve are closed during the fourth period and the fifth period; during a sixth period between the third period and the fifth period, the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the eighth valve, and the ninth valve are closed, the seventh valve is opened, the heater is driven to raise the temperature of the liquid to a temperature equal to or lower than the temperature of the liquid during the fifth period, and the pump is driven; The circulation device according to claim 6.

8. a tenth valve connected to the outlet and controlling the discharge of the liquid to the outside of the circulation device; Further provided with the tenth valve is closed during the first period, the second period, the third period, the fourth period, the fifth period, and the sixth period; during a seventh period between the third period and the sixth period, the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve, the seventh valve, the eighth valve, and the ninth valve are closed, the tenth valve is opened, and the pump is driven; The circulation device according to claim 7.

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