Cutting method for workpiece

Abstract

To provide a cutting method for a workpiece that is able to remove liquid from an imaging area of a workpiece during kerf checking and able to prevent adhesion of cutting chips to the workpiece.SOLUTION: A cutting method includes: a cutting step of forming a cut groove in a workpiece 200, held on a holding table 10, by means of a cutting blade 21; and an imaging step of imaging the cut groove, formed on an outer periphery 206 of the workpiece 200, by means of an imaging unit 30, with a liquid kept supplied to an upper surface of the workpiece 200 by a liquid supply unit; wherein the imaging step is performed while air 610 is jetted to an imaging area 300 in a direction toward the outer periphery 206 of the workpiece 200.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for cutting a workpiece. [Background technology]

[0002] A cutting device that cuts the workpiece along a planned dividing line with a cutting blade is used as a processing device for dividing a workpiece into individual devices. Patent Document 1 discloses a cutting device that prevents cutting fluid from adhering to the objective lens of a microscope in the imaging means by spraying air to remove most of the cutting fluid from the workpiece before the shutter of the imaging means opens. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-116518 Summary of the Invention [Problem to be solved by the invention]

[0004] During the cutting of a workpiece, an operation called kerf check is performed, in which the cut groove is imaged and image processing is used to confirm the quality and position of the cut groove. In this case, cutting water is supplied to the top surface of the workpiece when the workpiece is cut. If the imaged area is wet during the kerf check, water droplets will interfere with the recognition of the cut groove. For this reason, conventional processing equipment must stop the supply of cutting water and blow air onto the imaged area to remove water droplets adhering to the imaged area. However, because conventional processing equipment performs the kerf check near the center of the workpiece, a large area is dried by the air, which can lead to problems such as cutting debris drying and adhering to the area where the device is formed.

[0005] The present invention has been made in view of the above, and an object of the present invention is to provide a method for cutting a workpiece that can remove liquid from the imaging area of ​​the workpiece during kerf checking and prevent cutting debris from adhering to the workpiece. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the method for cutting a workpiece of the present invention includes a cutting step of forming a cut groove in a workpiece held on a holding table with a cutting blade, and an imaging step of imaging the cut groove formed on the outer periphery of the workpiece with an imaging unit in a state where a liquid is supplied to the upper surface of the workpiece by a liquid supply unit, and the imaging step is performed by imaging the cut groove formed on the outer periphery of the workpiece from the vicinity of an imaging area in a direction from the center side of the workpiece to the outer periphery of the workpiece with respect to the imaging area. As the workpiece moves, it approaches the upper surface of the workpiece. direction Towards Carry out while spraying air At the same time, the direction of the air injection is the same as the direction of the liquid flow in a plan view. It is characterized by the following features. In order to solve the above-mentioned problems and achieve the object, the method for cutting a workpiece of the present invention comprises a cutting step of forming a cutting groove in a workpiece held on a holding table with a cutting blade, and an imaging step of imaging the cutting groove formed on the outer periphery of the workpiece with an imaging unit while liquid is supplied to the upper surface of the workpiece by a liquid supply unit, wherein the imaging step is carried out while spraying air toward the imaging area in a direction toward the outer periphery of the workpiece, and wherein in the imaging step, the imaging unit is positioned on one end side of the workpiece and the liquid supply unit is positioned on the other end side of the workpiece.

[0007] The present invention Cutting method The method includes a cutting step of forming a cutting groove in a workpiece held on a holding table with a cutting blade, and an imaging step of imaging the cutting groove formed on the outer periphery of the workpiece with an imaging unit in a state where a liquid is supplied to an upper surface of the workpiece by a liquid supply unit, A device region in which a plurality of devices are formed and a peripheral excess region surrounding the device region are formed on the upper surface of the workpiece, and the imaging step includes: The method is performed by injecting air from the vicinity of the imaging area in a direction approaching the upper surface of the workpiece or directly below the imaging area as it moves from the center of the workpiece toward the outer periphery of the workpiece, and The cutting groove formed in the peripheral excess area is photographed. It is characterized by .

[0008] In the imaging step of the cutting method, The imaging unit is positioned on one end side of the workpiece, and the liquid supply unit is positioned on the other end side of the workpiece. This may also be done.

[0009] In the imaging step of the cutting method, The liquid supply unit is a water curtain that is installed above the holding table and has a jet nozzle extending in a direction intersecting the moving direction of the holding table, and the liquid is supplied to the workpiece by the water curtain. This may also be done. [Effects of the Invention]

[0010] The present invention has the effect of removing water droplets from the imaging area during kerf checking and preventing the adhesion of cutting chips from the workpiece. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a cutting device that performs a cutting method according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a workpiece to be machined by the cutting device shown in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view illustrating the relationship between the processing unit, the imaging unit, and the supply unit shown in FIG. [Figure 4] FIG. 4 is a schematic top view illustrating the relationship between the supply unit and the water curtain shown in FIG. [Figure 5] FIG. 5 is a schematic side view for explaining the relationship between the supply unit and the water curtain shown in FIG. [Figure 6] FIG. 6 is a diagram for explaining the imaging area of ​​the imaging unit shown in FIG. [Figure 7] FIG. 7 is a flowchart showing an example of a processing procedure relating to the cutting method of the cutting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0013] In the embodiments described below, an XYZ Cartesian coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. One direction within a horizontal plane is defined as the X-axis direction, the direction perpendicular to the X-axis direction within the horizontal plane is defined as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The XY plane containing the X-axis and Y-axis is parallel to the horizontal plane. The Z-axis direction perpendicular to the XY plane is the vertical direction.

[0014] [Embodiment] An example of a cutting method for a workpiece according to an embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of a cutting device that executes the cutting method according to an embodiment. FIG. 2 is a perspective view showing a workpiece to be processed by the cutting device shown in FIG. 1. FIG. 3 is a cross-sectional schematic view illustrating the relationship between the processing unit, imaging unit, and supply unit shown in FIG. 1. FIG. 4 is a top schematic view illustrating the relationship between the supply unit and water curtain shown in FIG. 1. FIG. 5 is a side schematic view illustrating the relationship between the supply unit and water curtain shown in FIG. 1. FIG. 6 is a view illustrating the imaging area of ​​the imaging unit shown in FIG. 1.

[0015] The cutting device 1, which is a processing device shown in FIG. 1 according to the embodiment, is a device that cuts a workpiece 200, which is an image-capturing object shown in FIG. 2, with a cutting blade 21 to divide the workpiece 200 into individual devices 204. In the embodiment, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with a substrate 201 made of silicon, sapphire, gallium, or the like. The workpiece 200 has devices 204 formed in areas partitioned in a grid pattern by a plurality of planned division lines 203 formed in a grid pattern on an upper surface 202 of the substrate 201. The upper surface 202 of the substrate 201 is the surface of the substrate 201 of the workpiece 200 held on the holding table 10.

[0016] Furthermore, the workpiece 200 according to the embodiment may be a so-called TAIKO (registered trademark) wafer having a thin central portion and a thick peripheral portion, or may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic substrate on which the devices 204 and the planned dividing lines 203 are not set, a ferrite substrate, a glass plate, or a substrate containing at least one of nickel and iron. In the embodiment, the workpiece 200 has an adhesive tape 211 attached to the back surface 205, with an annular frame 210 attached to the outer periphery, and is supported by the annular frame 210.

[0017] (cutting equipment) As shown in FIG. 1 , the cutting device 1 according to the embodiment includes a holding table 10, a cutting unit 20, an imaging unit 30, a moving unit 40, a supply unit 60, a water curtain 70, and a control unit 100. The holding table 10 holds the workpiece 200 by suction on a holding surface 11. The cutting unit 20 cuts the workpiece 200 held by the holding table 10 with a cutting blade 21 attached to a spindle 22. The imaging unit 30 captures an image of the workpiece 200 held by the holding table 10. The moving unit 40 moves the holding table 10 and the cutting unit 20 relative to each other. The supply unit 60 supplies air toward the upper surface of the workpiece 200. The water curtain 70 sprays cleaning water from multiple nozzles toward the upper surface of the workpiece 200 held by the holding table 10. The control unit 100 controls each component of the cutting device 1.

[0018] The moving unit 40 includes at least an X-axis moving unit 41 that moves the holding table 10 for processing in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 42 that moves the cutting unit 20 and the imaging unit 30 for indexing in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, and a Z-axis moving unit 43 that moves the cutting unit 20 and the imaging unit 30 for cutting in the Z-axis direction.

[0019] The X-axis movement unit 41 moves the holding table 10 in the X-axis direction, thereby performing processing feed between the holding table 10 and the cutting unit 20 relative to each other along the X-axis. The Y-axis movement unit 42 moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, thereby performing indexing feed between the holding table 10 and the cutting unit 20 relative to each other along the Y-axis. The Z-axis movement unit 44 moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, thereby performing cutting feed between the holding table 10 and the cutting unit 20 relative to each other along the Z-axis.

[0020] The holding table 10 has a disk-shaped holding surface 11 made of porous ceramic or the like that holds the workpiece 200. The holding table 10 is movable in the X-axis direction by an X-axis movement unit 41 and rotatable about an axis parallel to the Z-axis direction by a rotary drive source (not shown). The holding surface 11 of the holding table 10 is connected to a vacuum suction source (not shown). The workpiece 200, which is integrated with an annular frame 210, is placed on the holding surface 11 of the holding table 10 via adhesive tape 211, and the holding surface 11 is sucked by the vacuum suction source, thereby suction-holding the workpiece 200 integrated with the annular frame 210. Although not shown in FIG. 1, the holding table 10 also has a clamping portion around the holding surface 11 that clamps the annular frame 210.

[0021] The cutting unit 20 is a unit in which a cutting blade 21 that cuts a workpiece 200 held on the holding table 10 is rotatably mounted. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 using a Y-axis movement unit 42 and a Z-axis movement unit 43. The cutting unit 20 includes the cutting blade 21, a spindle 22, and a cutting water supply unit 24. The cutting blade 21 is fixed to the tip of the spindle 22 and rotates around an axis parallel to the Y-axis direction as the spindle 22 rotates. The spindle 22 is rotatably supported by the spindle housing around an axis parallel to the Y-axis direction with its tip exposed to the outside, and is housed within the spindle housing. The cutting water supply unit 24 supplies cutting water from a cutting water supply source to the machining area through a water channel inside the cover. The processing area refers to the area of ​​the workpiece 200 that is being cut by the rotating cutting blade 21, and is the area where the rotating cutting blade 21 is in contact with the workpiece 200. The cutting water includes, for example, pure water, water, etc.

[0022] The imaging unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. In the embodiment, the imaging unit 30 is disposed at a position aligned with the cutting unit 20 in the X-axis direction. As shown in FIG. 3 , the imaging unit 30 includes a housing 34 that houses an objective lens 31 facing the workpiece 200 held on the holding table 10 and has an opening 33 formed in a bottom 32 facing the workpiece 200, a flat protective plate 35 made of a transparent body that covers the opening 33, and an imaging device 36.

[0023] The housing 34 accommodates the objective lens 31 in its lower end. In this embodiment, the housing 34 is formed in a rectangular cylindrical shape and is attached to the cutting unit 20. The opening 33 penetrates the bottom 32 of the housing 34 and, in this embodiment, is formed in a circular shape and is provided in the center of the bottom 32. The planar shape of the protective plate 35 is formed in a rectangular shape, the same as the bottom 32 of the housing 34. The protective plate 35 is fixed to the underside of the bottom 32 of the housing 34. In this embodiment, the protective plate 35 is fixed to the underside of the bottom 32 with an adhesive, sealing the opening 33 and preventing mist consisting of cutting chips, cutting water, etc. from entering the housing 34 through the opening 33.

[0024] The imaging device 36 is attached to the upper end of the housing 34, and photographs an area to be divided of the workpiece 200 before cutting, which is held on the holding table 10, through the objective lens 31, the opening 33, and the protective plate 35. The imaging device 36 includes, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging device 36 photographs the workpiece 200 held on the holding table 10, obtains an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0025] The housing 34 also houses a light source 38 that emits light to illuminate the workpiece 200 held on the holding table 10 through the objective lens 31, the opening 33, and the protective plate 35, and a half mirror 39 that reflects the light emitted by the light source 38 toward the objective lens 31 and allows the imaging unit 30 to image the workpiece 200 on the holding table 10 through the objective lens 31, etc. In the embodiment, the light source 38 is a light-emitting element such as an LED (Light Emitting Diode), but in the present invention, it may also be an optical fiber that propagates the light emitted by the light-emitting element such as an LED.

[0026] The supply unit 60 supplies air toward the holding surface 11 of the holding table 10 below the protective plate 35. The supply unit 60 includes an air supply nozzle 61, an air supply source 62, a pipe 63, and an on-off valve 64. The air supply nozzle 61 injects air 610 in an injection direction 600 from the center toward the outer periphery of the workpiece 200 toward the imaging area of ​​the imaging unit 30 on the upper surface of the workpiece 200 held on the holding table 10 below the protective plate 35. The injection direction 600 of the air supply nozzle 61 includes a direction capable of removing liquid from the imaging area of ​​the workpiece 200 or preventing liquid from entering the imaging area. The pipe 63 connects the air supply nozzle 61 and the air supply source 62 and supplies air 610 from the air supply source 62 to the air supply nozzle 61. The on-off valve 64 is provided in the pipe 63 and is configured to be able to adjust the flow in the pipe 63 under the control of the control unit 100. For example, when imaging a cut groove in the workpiece 200, the supply unit 60 causes the control unit 100 to jet air 610 from the air supply nozzle 61 in a jetting direction 600.

[0027] Returning to FIG. 1, the water curtain 70 is a tubular member through which cleaning water flows, and is an example of a liquid supply unit. The cleaning water includes, for example, pure water, water, etc. The water curtain 70 extends in the Y-axis direction across the X-axis movement unit 41 of the cutting device 1, and is fixed to the top surface of the device body at both longitudinal ends. The water curtain 70 is disposed above the holding table 10 in the Z-axis direction (vertical direction), and does not interfere with the holding table 10 or the workpiece 200 during movement.

[0028] The water curtain 70 is a cleaning water supply unit connected to a cleaning water supply source (not shown) that supplies cleaning water to the upper surface 202 of the workpiece 200. A cleaning water flow rate adjustment valve (not shown) that adjusts the flow rate of cleaning water sprayed from the water curtain 70 is connected between the water curtain 70 and the cleaning water supply source. As shown in FIGS. 4 and 5 , the water curtain 70 has multiple injection ports 71 that can spray cleaning water 700 supplied from the cleaning water supply source toward the substrate 201 of the workpiece 200. The multiple injection ports 71 extend in a longitudinal direction (Y-axis direction) that intersects with the movement direction (X-axis direction) of the holding table 10. The multiple injection ports 71 are formed on the underside of the main body of the water curtain 70 at intervals along the Y-axis direction. The injection ports 71 are provided in an area that covers the holding table 10, including the clamp unit 12. This allows the water curtain 70 to spray cleaning water evenly over the entire workpiece 200 and the holding table 10. The injection port 71 may be formed in a range that covers at least the workpiece 200 .

[0029] The supply unit 60 also injects air 610 into the imaging area 300 in an injection direction 600 toward the outer periphery 206 of the workpiece 200. The imaging area 300 is a partial area (spot) on the top surface 202 of the workpiece 200 that is imaged by the imaging unit 30. The imaging area 300 may be an area that includes only the top surface 202 of the workpiece 200, or an area that extends from the top surface 202 of the workpiece 200 to the surface area of ​​the adhesive tape 211. The outer periphery 206 of the workpiece 200 includes the edge of the substrate 201 and a portion of the top surface 202 near the edge. The air supply nozzle 61 of the supply unit 60 is configured to be able to inject air 610 toward the outer periphery 206 of the top surface 202 of the workpiece 200 or toward the top surface 202 of the workpiece 200 directly below. That is, the air supply nozzle 61 is configured so that the jetted air 610 prevents the cleaning water 700 from entering the imaging area 300 of the imaging target.

[0030] 6, the imaging area 300 is an area for imaging the end of the cutting groove 220 near the outer periphery 206 of the workpiece 200. The cutting device 1 sets a plurality of imaging areas 300 for the workpiece 200 in an outer periphery excess area 230 on the upper surface 202 of the substrate 201. The outer periphery excess area 230 is a flat area of ​​the substrate 201 that surrounds the device area 240 where the device 204 is formed, and is an area where the tip of the cutting groove 220 will be located when the cutting groove 220 is formed.

[0031] In this embodiment, the imaging region 300 is set in the peripheral excess region 230 of the substrate 201, but is not limited to this. The imaging region 300 may include a device region 240 in which a device 204 is formed, as long as it is near the outer periphery 206 of the substrate 201 in which the cutting groove 220 is formed. The number of imaging regions 300 in the workpiece 200 may be, for example, one imaging region 300 set for the cutting groove 220, or two or more imaging regions 300 may be set. Furthermore, even if the imaging region 300 is set in the device region 240, cleaning water can be removed from the imaging region 300 by air 610, thereby improving the quality of the image captured of the imaging region 300.

[0032] 4 and 5 , in the imaging step of the cutting method, the imaging unit 30 is positioned at one end side 251 of the workpiece 200 held on the holding table 10. The water curtain 70 is positioned at the other end side 252 of the workpiece 200, and supplies cleaning water 700 from the other end side 252 to the one end side 251. The one end side 251 and the other end side 252 of the workpiece 200 are opposite ends of the workpiece 200 with the device region 240 in between. The one end side 251 of the workpiece 200 is downstream in the flow of the cleaning water 700. The other end side 252 of the workpiece 200 is upstream in the flow of the cleaning water 700.

[0033] The supply unit 60 is positioned near the imaging region 300 and sprays air 610 from the air supply nozzle 61 in a spray direction 600, i.e., in a direction inclined from the center of the workpiece 200 toward the outer periphery of the workpiece 200, thereby preventing the cleaning water 700, which is supplied so that the water curtain 70 covers the upper surface 202 of the workpiece 200, from infiltrating into the imaging region 300. In this embodiment, the supply unit 60 sprays the air 610 from near the imaging region 300 on the upstream side of the flow of the cleaning water 700, thereby dispersing the cleaning water 700 heading toward the imaging region 300 to the outside of the imaging region 300. The supply unit 60 is configured to spray air 610 that can remove water droplets, cutting chips, etc. present in the imaging region 300 from the imaging region 300 toward the outer periphery 206 of the substrate 201. The supply unit 60 can prevent the cutting chips from moving toward the center of the top surface 202 of the workpiece 200 by directing the injection direction 600 toward the outer periphery 206 of the workpiece 200 .

[0034] The control unit 100 controls each of the above-mentioned components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200. The control unit 100 is a computer. The control unit 100 includes an arithmetic processing device having a microprocessor such as a central processing unit (CPU), a storage device having memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to the above-mentioned components of the cutting device 1 via the input / output interface device. The control unit 100 executes the program to realize each step of the cutting method, such as the cutting step and the imaging step.

[0035] The control unit 100 is also connected to a display unit (not shown) that is configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit (not shown) that the operator uses to register machining content information, etc. The input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

[0036] The control unit 100 controls the kerf check operation in the cutting device 1. The kerf check operation is an operation in which the cutting device 1 (dicer) automatically checks the cutting status of the cut line during cutting. The control unit 100 analyzes the image captured in the imaging area 300 based on the kerf check data, and executes check processing related to the cut groove 220, such as positional deviation, chipping, and width of the cut groove 220.

[0037] The above describes an example of the configuration of the cutting device 1 according to this embodiment. Note that the configuration described above using Figures 1 to 6 is merely an example, and the configuration of the cutting device 1 according to this embodiment is not limited to this example. The functional configuration of the cutting device 1 according to this embodiment can be flexibly modified depending on the specifications and operation.

[0038] (Method of cutting workpiece) Next, a cutting method executed by the cutting device 1 according to the embodiment will be described. Fig. 7 is a flowchart showing an example of a processing procedure relating to the cutting method of the cutting device 1 according to the embodiment. The processing procedure shown in Fig. 7 is realized by the control unit 100 of the cutting device 1 executing a program. The processing procedure shown in Fig. 7 is executed by the control unit 100 when, for example, an image of the imaging area 300 is captured by the imaging unit 30 during a kerf check.

[0039] 7, the control unit 100 of the cutting device 1 forms a cutting groove 220 in the workpiece 200 held on the holding table 10 with the cutting blade 21 (step 1001). For example, the control unit 100 controls the cutting blade 21 so as to cut the workpiece 200 along the planned dividing line 203. When the process of step 1001 is completed, the control unit 100 advances the process to step 1002.

[0040] The control unit 100 starts supplying cleaning water 700 to the upper surface 202 of the workpiece 200 using the liquid supply unit (step 1002). For example, the control unit 100 controls the start of driving the water curtain 70 so that the cleaning water 700 is supplied to the workpiece 200 held by the holding table 10. As a result, the water curtain 70 is in a state where it supplies the cleaning water 700 to the entire upper surface 202 of the workpiece 200. When the processing of step 1002 is completed, the control unit 100 advances the processing to step 1003.

[0041] The control unit 100 moves the imaging unit 30 to the imaging region 300 of the imaging target and the supply unit 60 to the ejection position (step 1003). For example, the control unit 100 identifies the imaging region 300 of the imaging target, and moves the imaging unit 30 using the moving unit 40 or rotates the holding table 10 so that the imaging unit 30 moves to the imaging region and the supply unit 60 moves to the ejection position. In the embodiment, the supply unit 60 is provided so as to be movable relative to the imaging unit 30. Therefore, the control unit 100 can position the imaging unit 30 above the imaging region 300, thereby positioning the supply unit 60 at the ejection position corresponding to the imaging region 300. When the process of step 1003 is completed, the control unit 100 advances the process to step 1004.

[0042] The control unit 100 starts the supply unit 60 to spray air 610 (step 1004). For example, the control unit 100 instructs the supply unit 60 positioned at the spraying position to start spraying air 610. This causes the supply unit 60 to spray air 610 from the imaging region 300 of the imaging target toward the outer periphery 206 of the substrate 201 of the workpiece 200. When the process of step 1004 ends, the control unit 100 advances the process to step 1005.

[0043] The control unit 100 causes the imaging unit 30 to capture an image of the imaging area 300 (step 1005). For example, the control unit 100 controls the imaging unit 30 so that the imaging unit 30 captures an image of the imaging area 300. After the control unit 100 stores the imaging information captured by the imaging unit 30 in association with the imaging area 300 in the storage device, the process proceeds to step 1006.

[0044] The control unit 100 determines whether or not all of the imaging targets have been imaged (step 1006). For example, the control unit 100 determines that all of the imaging targets have been imaged when the next imaging target is not scheduled in the imaging schedule information of the workpiece 200. If the control unit 100 determines that all of the imaging targets have not been imaged (No in step 1006), it sets the next imaging target, returns the process to step 1003 already described, and continues the process. If the control unit 100 determines that all of the imaging targets have been imaged (Yes in step 1006), it proceeds to step 1007.

[0045] The control unit 100 ends the spraying of air 610 and the supply of cleaning water 700 (step 1007). For example, the control unit 100 instructs the supply unit 60 to end the spraying of air and instructs the water curtain 70 to end the supply of cleaning water 700. As a result, the supply unit 60 ends the spraying of air 610, and the water curtain 70 ends the supply of cleaning water 700. When the process of step 1007 ends, the control unit 100 ends the process procedure shown in FIG. 7. Note that in the case of a workpiece 200 on which a device 204 with strict tolerance for adhesion of cutting debris is formed, the water curtain 70 may constantly supply cleaning water 700 while cutting the workpiece 200. In that case, the process procedure shown in FIG. 7 does not include the process of step 1003 and the process of ending the supply of cleaning water in step 1007.

[0046] The processing procedure shown in Fig. 7 shows an example of a processing procedure for continuously capturing images in a plurality of imaging regions 300. In the processing procedure shown in Fig. 7, step 1001 is included in the cutting step of the cutting method, and steps 1002 to 1005 are included in the imaging step of the cutting method, but is not limited to this.

[0047] As described above, the cutting device 1 performs the cutting method, thereby forming a cutting groove 220 in the workpiece 200 with the cutting blade 21. Then, while supplying cleaning water 700 to the upper surface 202 of the workpiece 200, the cutting device 1 removes the cleaning water 700 from the imaging region 300 with air 610 sprayed onto the workpiece 200 by the supply unit 60, and then images the imaging region 300. As a result, even when the cutting device 1 images the imaging region 300 while flowing cleaning water 700 over the entire upper surface 202 of the workpiece 200, the air 610 dries the area around the imaging region 300, thereby improving the quality of the image of the imaging region 300. Furthermore, in the unlikely event that cutting debris is present in the imaging region 300, the cutting device 1 can remove the cutting debris from the imaging region 300 together with the cleaning water 700 with the air 610. As a result, the cutting device 1 can remove liquid from the imaging region 300 during kerf checking and prevent cutting chips from the workpiece 200 from adhering thereto.

[0048] Furthermore, the cutting device 1 can capture an image of the imaging area 300, which includes the cutting groove 220 formed in the peripheral excess area 230 surrounding the device area 240 of the workpiece 200. For example, if the cutting device 1 performs a kerf check near the center of the workpiece 200, a large area may be dried by air, and cutting debris may dry and adhere to the device area 240. In contrast, the cutting device 1 according to the embodiment captures an image of the imaging area 300 included in the peripheral excess area 230. Therefore, the area dried by air 610 is limited to the peripheral excess area 230 where no devices 204 are formed. Therefore, even if cutting debris dries and adheres, it does not affect the product. Furthermore, by performing a kerf check in the peripheral excess area 230 and blowing air in a direction inclined from the center of the workpiece 200 toward the outer periphery 206, cutting debris, water droplets, etc. can be removed to the outside of the workpiece 200.

[0049] Furthermore, the cutting device 1 is installed above the holding table 10 and can supply cleaning water 700 by a water curtain 70 having a jet nozzle 71 extending in a direction intersecting the direction of movement of the holding table 10. This allows the cutting device 1 to image the imaging area 300 while supplying cleaning water 700 to the entire upper surface 202 of the workpiece 200, thereby preventing cutting chips from adhering to the workpiece 200.

[0050] Furthermore, the cutting device 1 can position the imaging unit 30 at one end side 251 of the workpiece 200, and the water curtain 70 at the other end side 252 of the workpiece 200. This allows the cutting device 1 to image the imaging area 300 from which the cleaning water 700 has been removed, downstream of the cleaning water 700 that has been flowed from the other end side 252 of the workpiece 200 over the entire upper surface 202, thereby improving cleaning efficiency compared to measuring near the center of the workpiece 200.

[0051] The present invention is not limited to the above-described embodiments, etc. In other words, various modifications can be made without departing from the gist of the present invention.

[0052] In the above embodiment, the cutting method has been described using a circular workpiece 200, but is not limited to this. The cutting method may also be used with workpieces of other shapes, such as squares, polygons, etc.

[0053] In the above embodiment, the cutting method has been described as being such that the imaging unit 30 is positioned at one end 251 of the workpiece 200 and the water curtain 70 is positioned at the other end 252 of the workpiece 200. However, the cutting method is not limited to this. The cutting method may also be such that the imaging unit 30 is positioned at one end 251 of the workpiece 200 and the water curtain 70 is positioned near the center of the workpiece 200.

[0054] In the above embodiment, the cutting method has been described in which the supply unit 60 sprays the air 610 in a direction inclined toward the outer periphery 206 of the substrate 201, but is not limited thereto. For example, when imaging with cleaning water 700 flowing, the supply unit 60 may spray the air 610 directly downward on the upstream side of the imaging region 300 in the flow of the cleaning water 700 to prevent the cleaning water 700 from entering the imaging region 300. When the air 610 is sprayed directly downward, an area near the center of the workpiece 200 is also dried by the air, which may dry the device region 240 and cause cutting debris to adhere to the device region 240. Therefore, it is necessary to adjust the amount and intensity of the air 610 spray so that the area dried by the air 610 does not reach the device region 240 but remains in the outer periphery excess region 230. In the cutting method, when the direction of the air 610 being sprayed is inclined toward the outer periphery 206 of the substrate 201, the cleaning water 700 is removed from the imaging area 300, the cleaning water 700 penetrates into the imaging area 300 during imaging, and the air 610 is blown, which has the effect of drying the center side of the workpiece 200 more than the imaging area 300, thereby preventing cutting debris from adhering to the device area 240. [Explanation of symbols]

[0055] 1 Cutting equipment 10 Holding table 11 Holding surface 20 Cutting unit 21 Cutting blade 22 Spindle 30 Imaging unit 36 Imaging device 40 Mobile Units 41 X-axis moving unit 42 Y-axis moving unit 43 Z-axis movement unit 60 supply units 61 Air supply nozzle 62 Air supply source 70 Water Curtain 71 Nozzle 100 control unit 200 Workpiece 201 Substrate 202 Top surface 203 Planned division line 204 devices 206 Outer perimeter 220 Cutting groove 230 Surplus outer area 240 Device Area 251 One end side 252 Other end side 300 imaging area 600 Injection direction 610 Air 700 cleaning water

Claims

1. a cutting step of forming a cutting groove in the workpiece held on the holding table by a cutting blade; an imaging step of imaging the cut groove formed on the outer periphery of the workpiece with an imaging unit while supplying liquid to the upper surface of the workpiece with a liquid supply unit; The imaging step includes: The method is performed by injecting air from the vicinity of the imaging area in a direction approaching the upper surface of the workpiece as it moves from the center side of the workpiece toward the outer periphery of the workpiece, and A method for cutting a workpiece, characterized in that, in a plan view, the direction in which the air is sprayed is the same as the flow of the liquid.

2. a cutting step of forming a cutting groove in the workpiece held on the holding table by a cutting blade; an imaging step of imaging the cut groove formed on the outer periphery of the workpiece with an imaging unit while supplying liquid to the upper surface of the workpiece with a liquid supply unit; The imaging step includes: This is done by injecting air into the imaging area in a direction toward the outer periphery of the workpiece. In the imaging step, The imaging unit is positioned on one end side of the workpiece, The method for cutting a workpiece is characterized in that the liquid supply unit is positioned on the other end side of the workpiece.

3. a cutting step of forming a cutting groove in the workpiece held on the holding table by a cutting blade; an imaging step of imaging the cut groove formed on the outer periphery of the workpiece with an imaging unit while supplying liquid to the upper surface of the workpiece with a liquid supply unit; a device region in which a plurality of devices are formed and a peripheral excess region surrounding the device region are formed on an upper surface of the workpiece; The imaging step includes: A method for cutting a workpiece, characterized in that air is sprayed from the vicinity of an imaging area toward the imaging area in a direction approaching the top surface of the workpiece or directly below the imaging area as it moves from the center of the workpiece toward the outer periphery of the workpiece, and the cutting groove formed in the outer periphery excess area is imaged.

4. In the imaging step, The imaging unit is positioned on one end side of the workpiece, 4. The method for cutting a workpiece according to claim 3, wherein the liquid supply unit is positioned on the other end side of the workpiece.

5. In the imaging step, the liquid supply unit is a water curtain that is installed above the holding table and has a jet nozzle that extends in a direction intersecting the moving direction of the holding table; 5. The method for cutting a workpiece according to claim 1, wherein the liquid is supplied to the workpiece by the water curtain.

Images