Semiconductor device and manufacturing method thereof

Abstract

To provide a method for manufacturing a semiconductor device.SOLUTION: A method for manufacturing a semiconductor device includes the steps of: forming a trench in a substrate, the trench extending downward from a top surface of the substrate and having a sidewall and a bottom surface, in which the included angle between the sidewall and the bottom surface is 90 degrees or more; forming a well region on the top surface of the substrate, and the sidewall and the bottom surface of the trench; forming a source region on the bottom surface of the trench; forming a body contact region adjacent to the source region on the bottom surface of the trench; forming a gate structure along the top surface of the substrate and the sidewall and the bottom surface of the trench; and forming a source contact in the trench, the source contact penetrating the gate structure and electrically connecting the source region and the body contact region to each other.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] Some embodiments of the present disclosure relate to a semiconductor device and a manufacturing method thereof. [Background technology]

[0002] Metal oxide semiconductor field effect transistors (MOTs) can be divided into horizontal channel MOSFETs and vertical channel MOSFETs according to their channel direction. Vertical channel MOSFETs can supply the same current in a smaller area and achieve a smaller on-resistance (Rdson), thus significantly reducing production costs. How to further improve the efficiency of vertical channel MOSFETs has also become an important issue. Summary of the Invention [Means for solving the problem]

[0003] Some embodiments of the present disclosure provide a method for manufacturing a semiconductor device, including forming a trench in a substrate, the trench extending downward from a top surface of the substrate, the trench having sidewalls and a bottom surface, the sidewalls and the bottom surface forming an included angle of 90° or greater; forming a well region on the top surface of the substrate and on the sidewalls and bottom surface of the trench; forming a source region on the bottom surface of the trench; forming a body contact region on the bottom surface of the trench adjacent to the source region; forming a gate structure along the top surface of the substrate and the sidewalls and bottom surface of the trench; and forming a source contact in the trench that penetrates the gate structure and electrically connects the source region to the body contact region.

[0004] In some embodiments, the trench is an inverted trapezoidal trench.

[0005] In some embodiments, forming a trench in a substrate includes forming a plurality of stepped dielectric layer stacks on the substrate and etching the substrate using the stepped dielectric layer stacks as a mask to form the trench.

[0006] In some embodiments, forming a graded dielectric layer stack on a substrate includes forming a dielectric layer stack on a substrate including a first dielectric layer made of a plurality of cross-stacked first materials and a second dielectric layer made of a second material different from the plurality of first materials, and patterning the dielectric layer stack multiple times with a photomask to form the graded dielectric layer stack.

[0007] In some embodiments, when etching a substrate using the graded dielectric layer stack as a mask, the graded dielectric layer stack and the substrate are etched at the same etch rate.

[0008] In some embodiments, the lattice orientation of the substrate determines the included angle between the sidewall and the bottom surface.

[0009] Some embodiments of the present disclosure provide a semiconductor device comprising: a substrate having a trench extending downward from a top surface of the substrate, the trench having sidewalls and a bottom surface, the sidewalls and the bottom surface forming an included angle of 90° or greater; a gate structure in the substrate and along the top surface of the substrate, the sidewalls and the bottom surface of the trench; a source contact in the substrate trench and through the gate structure electrically connected to a source region of the substrate; and a drain electrode underlying the substrate.

[0010] In some embodiments, the trench is an inverted trapezoidal trench.

[0011] In some embodiments, the source region is at the bottom of the trench, and the substrate further comprises a well region along the top surface of the substrate, the sidewalls and the bottom of the trench, and a body contact region at the bottom of the trench and adjacent to the source region.

[0012] In some embodiments, the sidewalls of the trench extend in the same direction as the lattice alignment of the substrate. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 2] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 3] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 4] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 5] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 6] 1 is a cross-sectional view illustrating a semiconductor device according to some embodiments of the present disclosure. [Figure 7] 10A and 10B are cross-sectional views illustrating semiconductor devices according to some other embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Some embodiments of the present disclosure relate to forming vertical channel power semiconductor devices. Power semiconductor devices with vertical channels can provide a large current in the same area and therefore a small on-resistance.

[0015] 1-6 illustrate cross-sectional views of semiconductor devices according to some embodiments of the present disclosure. Referring to FIG. 1, a substrate 110 is provided. The substrate 110 may be any suitable semiconductor substrate. For example, the substrate 110 may be a silicon substrate or a silicon carbide substrate. In some embodiments, the substrate 110 is a lightly doped region having a first conductivity type; for example, the substrate 110 may be an N-type lightly doped region and include N-type dopants such as arsenic, phosphorus, and nitrogen.

[0016] Subsequently, a dielectric layer stack is formed on the substrate 110. The dielectric layer stack includes a plurality of cross-stacked first dielectric layers 210 and a plurality of second dielectric layers 220, where the first dielectric layer 210 is made of a first material and the second dielectric layer 220 is made of a second material different from the first material. In some embodiments, the first dielectric layer 210 may be made of silicon oxide, and the second dielectric layer 220 may be made of silicon nitride. In some embodiments, the thickness of the first dielectric layer 210 and the second dielectric layer 220 may be between 0.1 microns and 0.5 microns. In some embodiments, the dielectric layer stack may include between 2 and 10 first dielectric layers 210 and 220. In the following description, the present disclosure will exemplify a case where the dielectric layer stack includes three first dielectric layers 210A, 210B, and 210C and three second dielectric layers 220A, 220B, and 220C.

[0017] Then, a first patterning process is performed using a photomask to pattern the dielectric layer stack having the first sidewall S1. Specifically, a first photoresist layer is first formed on the dielectric layer stack, and the first photoresist layer is patterned using a photomask. Then, all the dielectric layers in the dielectric layer stack are patterned using the first photoresist layer. At this time, the photomask is at a first position.

[0018] Subsequently, a photomask is moved in the first direction D1, and a second patterning process is performed using the photomask to partially pattern the dielectric layer stack, so that the dielectric layer stack has a first sidewall S1 and a second sidewall S2 offset in the first direction D1, where the second sidewall S1 is on the first sidewall S1. Specifically, a second photoresist layer is formed on the dielectric layer stack, and the photomask is moved along the first direction D1 based on the first position to place the photomask in a second position, and the second photoresist layer is patterned using the photomask. The second photoresist layer is offset by a certain distance along the first direction D1 from the first photoresist layer. Subsequently, the second dielectric layer 220C is first etched using a first gas using the second photoresist layer as a mask, and then the first dielectric layer 210C is etched using a second gas using the second dielectric layer 220C as a mask. Because the second dielectric layer 220 and the first dielectric layer 210 are made of different materials, different etching gases can be selected to etch the first dielectric layer 210 and the second dielectric layer 220, respectively. In the present disclosure, the first gas may be defined as a gas whose etching rate for the second dielectric layer 220 is greater than the etching rate for the first dielectric layer 210. The second gas may be defined as a gas whose etching rate for the first dielectric layer 210 is greater than the etching rate for the second dielectric layer 220.

[0019] Subsequently, a photomask is moved in the first direction, and a third patterning process is performed using the photomask to partially pattern the dielectric layer stack, so that the dielectric layer stack further has a third sidewall S3, and the third sidewall S3 is offset in the first direction D1 from the second sidewall S2, and the third sidewall S3 is on the second sidewall S2. Specifically, a third photoresist layer is formed on the dielectric layer stack, and the photomask is moved along the first direction D1 based on the second position to position the photomask at a third position, and the third photoresist layer is patterned using the photomask. The third photoresist layer is offset from the second photoresist layer by a certain distance along the first direction D1. Subsequently, the second dielectric layer 220C and the second dielectric layer 220B are respectively etched using a first gas using the photoresist layer and the first dielectric layer 210C as masks, respectively. Subsequently, the first dielectric layer 210C and the intermediate first dielectric layer 210B are etched using the second gas, with the second dielectric layer 220C and the second dielectric layer 220B serving as masks, respectively.

[0020] Subsequently, a photomask is moved in the first direction, and a fourth patterning process is performed using the photomask to partially pattern the dielectric layer stack, so that the dielectric layer stack further has a fourth sidewall S4, which is offset in the first direction from the third sidewall S3 and is located on the third sidewall S3. Specifically, a fourth photoresist layer is formed on the dielectric layer stack, and the photomask is moved along the first direction based on the third position to position the photomask at a fourth position, and the fourth photoresist layer is patterned using the photomask. The fourth photoresist layer is offset by a certain distance in the first direction D1 from the third photoresist layer. Subsequently, the second dielectric layer 220C, the second dielectric layer 220B, and the second dielectric layer 220A are etched using a first gas, respectively, using the fourth photoresist layer, the first dielectric layer 210C, and the first dielectric layer 210B as masks. This results in a stepped sidewall on one side of the dielectric layer stack.

[0021] Subsequently, similarly to the above, the sidewalls on the other side of the dielectric layer stack are also formed in a stepped shape (e.g., by starting to move the photomask from the first position in the second direction D2), thus forming a plurality of stepped dielectric layer stacks 200 on the substrate 110. In the present disclosure, the stepped dielectric layer stack 200 can be formed by patterning the dielectric layer stack using the photomask PM. The shape of the sidewalls of the stepped dielectric layer stack 200 is determined by the amplitude of each movement of the photomask PM. Furthermore, the offset distances of the second, third, and fourth photoresist layers correspond to the amplitude of each movement of the photomask. The stepped dielectric layer stack 200 includes sequentially shrunk sidewalls S1, S2, S3, and S4. In some embodiments, the horizontal distance between two adjacent sidewalls (e.g., the horizontal distance between sidewalls S1 and S2, the horizontal distance between sidewalls S2 and S3, and the horizontal distance between sidewalls S3 and S4) is between about 0.1 microns and 0.5 microns. The stepped dielectric layer stack 200 includes a plurality of cross-stacked first dielectric layers 210 and a plurality of cross-stacked second dielectric layers 220, where the first dielectric layers 210 are made of a first material and the second dielectric layers 220 are made of a second material different from the first material. In some embodiments, the first dielectric layers 210 may be made of silicon oxide and the second dielectric layers 220 may be made of silicon nitride. In some embodiments, the thicknesses of the first dielectric layers 210 and the second dielectric layers 220 may be between 0.1 microns and 0.5 microns. In some embodiments, the dielectric layer stack may include between 2 and 10 first and second dielectric layers 210 and 220, respectively.

[0022] 2 , a trench T is formed in the substrate 110. Specifically, the trench T can be formed by etching the substrate 110 using the stepped dielectric layer stack 200 as a mask. When etching the substrate 110 using the stepped dielectric layer stack 200 as a mask, the stepped dielectric layer stack 200 and the substrate 110 are etched at the same etching rate until the stepped dielectric layer stack 200 is completely etched. Thus, a stepped trench T can be formed in the substrate 110.

[0023] After forming the stepped trench T, a smoothing process can be performed on the surface of the substrate 110, thereby smoothing the surface of the trench T in the substrate 110. In some embodiments, referring to FIG. 3 , an oxidation process can first be performed on the substrate 110 to form an oxide layer 111 on the surface of the substrate 110, and then referring to FIG. 4 , the oxide layer 111 is removed, thereby smoothing the surface of the trench T in the substrate 110. After the smoothing process, the trench T extends downward from the top surface 112 of the substrate 110, and the trench T has sidewalls 114 and a bottom surface 116, with the included angle between the sidewalls 114 and the bottom surface 116 being greater than 90°. That is, the trench T is an inverted trapezoidal trench.

[0024] 5 , a first ion implantation process is performed on the substrate 110 to form well regions 122 on the top surface 112 of the substrate 110, the sidewalls 114 of the trench T, and the bottom surface 116. Specifically, when performing the first ion implantation process, dopants of a second conductivity type may be implanted into the substrate 110 to form well regions 122 having the second conductivity type on the top surface 112 of the substrate 110, the sidewalls 114 of the trench T, and the bottom surface 116. In some embodiments, the well regions 122 may be lightly doped regions of the second conductivity type, for example, the well regions 122 may be lightly doped regions of P-type and include P-type dopants such as boron, gallium, and aluminum. The remaining regions not implanted with dopants of the second conductivity type are still maintained as doped regions of the first semiconductor type, and the doped regions having the first semiconductor type may be referred to as drift regions 121. The doping concentration of the well region 122 is higher than the doping concentration of the drift region 121 .

[0025] Subsequently, a second ion implantation process is performed on the substrate 110 to form a source region 124 at the bottom surface 116 of the trench T. Specifically, when performing the second ion implantation process, dopants of a first conductivity type may be implanted into the substrate 110 to form the source region 124 having the first conductivity type at the bottom surface 116 of the trench T. In some embodiments, the source region 124 may be a heavily doped region of the first conductivity type, and the doping concentration of the source region 124 may be higher than the doping concentration of the well region 122; for example, the source region 124 may be a heavily doped region of N-type and include N-type dopants such as arsenic, phosphorus, and nitrogen.

[0026] After forming the source region 124, a junction field-effect transistor (JFET) region 126 may also be formed on the top surface 112 of the substrate 110, such that the JFET region 126 and the source region 124 have the same conductivity type and doping concentration. In some embodiments, the JFET region 126 may be a heavily doped region of a first conductivity type, for example, the JFET region 126 may be a heavily doped region of N-type and include N-type dopants such as arsenic, phosphorus, and nitrogen.

[0027] Subsequently, a third ion implantation process is performed on the substrate 110 to form a body contact region 128 at the bottom surface 116 of the trench T adjacent to the source region 124. Specifically, when performing the third ion implantation process, dopants of a second conductivity type may be implanted into the substrate 110 to form the body contact region 128 having the second conductivity type at the bottom surface 116 of the trench T. In some embodiments, the body contact region 128 may be a heavily doped region of the second conductivity type, and the doping concentration of the body contact region 128 may be higher than the doping concentration of the well region 122; for example, the body contact region 128 may be a heavily doped region of P type and include P-type dopants such as boron, gallium, and aluminum.

[0028] Subsequently, a gate structure 130 is formed along the top surface 112 of the substrate 110, the sidewalls 114, and the bottom surface 116 of the trench T. In some embodiments, the gate structure 130 may have a first horizontal portion located on the top surface 112 of the substrate 110, a sloped portion located on the sidewalls 114 of the trench T, and a second horizontal portion located on the bottom surface 116 of the trench T. Specifically, a gate dielectric layer 132 may first be formed on the substrate 110 and along the top surface 112 of the substrate 110, the sidewalls 114, and the bottom surface 116 of the trench T. Subsequently, a gate layer 134 is formed on the gate dielectric layer 132. The gate dielectric layer 132 and the gate layer 134 may be collectively referred to as the gate structure 130. Subsequently, openings may be formed in the gate structure 130 to expose the body contact region 128 and a portion of the source region 124. In some embodiments, the gate dielectric layer 132 may be made of silicon oxide and the gate layer 134 may be made of polycrystalline silicon.

[0029] 6 , a dielectric layer 140 is formed on the substrate 110 and in the trench T. The dielectric layer 140 also completely fills the opening of the gate structure 130. Subsequently, a source contact 150 is formed in the trench T, penetrating the gate structure 130 and contacting the source region 124 and the body contact region 128. Specifically, an opening exposing the source region 124 and the body contact region 128 is first formed in the dielectric layer 140, and then a contact material is formed in the opening to form the source contact 150. Thus, the source contact 150 simultaneously penetrates the dielectric layer 140 and the gate structure 130 and contacts the source region 124 and the body contact region 128, with the dielectric layer 140 surrounding the source contact 150. Subsequently, a drain electrode 160 is formed under the substrate 110.

[0030] In this manner, the semiconductor device shown in FIG. 6 can be obtained. The semiconductor device may include a substrate 110, a gate structure 130, a source contact 150, and a drain electrode 160. The substrate 110 includes a trench T extending downward from a top surface 112 of the substrate 110, the trench T having sidewalls 114 and a bottom surface 116, and an included angle between the sidewalls 114 and the bottom surface 116 is greater than 90°. The substrate 110 includes a drift region 121, a well region 122, a JFET region 126, a body contact region 128, and a source region 124. The well region 122 is located above the drift region 121, and is aligned with the top surface 112 of the substrate 110, the sidewalls 114, and the bottom surface 116 of the trench T. The JFET region 126 is located on the top surface 112 of the substrate 110. A source region 124 is at the bottom 116 of the trench T. A body contact region 128 is at the bottom 116 of the trench T and adjacent to the source region 124. A gate structure 130 is on the substrate 110 and along the top surface 112 of the substrate 110, the sidewalls 114 and the bottom surface 116 of the trench T. A source contact 150 is in the trench T of the substrate 110 and extends through the gate structure 130 and contacts the substrate 110, electrically connecting the source region 124 and the body contact region 128. A drain electrode 160 is below the substrate 110.

[0031] The semiconductor device of the present disclosure has a vertical channel, which is a well region 122 along the sidewall 114 of the trench T. When a semiconductor device has a vertical channel and, for example, the included angle between the sidewall 114 and the bottom surface 116 of the trench T is greater than 90°, a large current can be supplied in the same area, thereby providing a large on-resistance. The included angle between the sidewall 114 and the bottom surface 116 is determined by the lattice alignment direction of the substrate 110. Specifically, the included angle between the sidewall 114 and the bottom surface 116 can determine the extension direction of the well region 122 along the trench sidewall 114, i.e., the channel direction. When the channel direction is the same as the alignment direction of the substrate 110, carriers can have maximum carrier mobility in the channel. That is, the lattice orientation of the substrate 110 determines the included angle between the sidewall 114 and the bottom surface 116, ensuring that carriers have maximum carrier mobility and maximum current in the channel (e.g., when the extension direction of the trench sidewall 114 is the same as the lattice orientation of the substrate 110). Because a portion of the gate structure 130 is formed along the trench sidewall 114, when the extension direction of the trench sidewall 114 is the same as the lattice orientation of the substrate 110, the extension direction of the gate structure 130 on the trench sidewall 114 is also the same as the lattice orientation of the substrate 110.

[0032] FIG. 7 illustrates a cross-sectional view of a semiconductor device according to some other embodiments of the present disclosure. The semiconductor device of FIG. 7 is similar to the semiconductor device of FIG. 6, except that the angle between the sidewall 114 and the bottom surface 116 of the trench in the semiconductor device of FIG. 7 is 90°. To fabricate the semiconductor device of FIG. 7, the stepped dielectric layer stack in the process of FIG. 1 can be directly replaced with a hard mask layer having vertical sidewalls, and the substrate 110 can be etched using the hard mask layer having vertical sidewalls. The processes of FIGS. 2 to 6 are then performed to form the semiconductor device of FIG. 7. When the angle between the sidewall 114 and the bottom surface 116 of the trench in the semiconductor device is 90°, the semiconductor device can also supply a large current in the same area and therefore provide a small on-resistance.

[0033] The above are only some embodiments of the present disclosure, not all embodiments, and any equivalent changes made by those skilled in the art to the technical solutions of the present disclosure after reading the specification of the present disclosure shall all fall within the scope of the claims of the present disclosure. [Explanation of symbols]

[0034] 110: Substrate 111: Oxide layer 112:Top surface 114: Side wall 116: Bottom 121: Drift region 122: Well area 124: Source area 126: Junction field effect transistor area / JFET area 128: Body contact area 130: Gate structure 132: Gate dielectric layer 134: Gate layer 140: Dielectric layer 150: Source contact 160: Drain electrode 210: First dielectric layer 220: Second dielectric layer S1, S2, S3, S4: Side wall T: Trench

Claims

1. forming a trench in a substrate extending downward from a top surface of the substrate, the trench having sidewalls and a bottom surface, the included angle between the sidewalls and the bottom surface being greater than or equal to 90 degrees; forming a well region on the top surface of the substrate, the sidewalls and the bottom surface of the trench; forming a source region on the bottom surface of the trench; forming a body contact region adjacent to the source region at the bottom surface of the trench; forming a gate structure along the top surface of the substrate, the sidewalls and the bottom surface of the trench; forming a source contact in the trench through the gate structure and electrically connecting the source region and the body contact region; Including, forming the trench in the substrate, forming a plurality of graded dielectric layer stacks on the substrate; etching the substrate using the graded dielectric layer stack as a mask to form the trench; Including, A method for manufacturing a semiconductor device.

2. 2. The method for manufacturing a semiconductor device according to claim 1, wherein the trench is an inverted trapezoidal trench.

3. forming the graded dielectric layer stack on the substrate, forming a dielectric layer stack on the substrate, the dielectric layer stack including a plurality of cross-stacked first dielectric layers made of a first material and a plurality of cross-stacked second dielectric layers made of a second material different from the first material; patterning the dielectric layer stack multiple times with a photomask to form the graded dielectric layer stack; The method for manufacturing a semiconductor device according to claim 1 , comprising:

4. 2. The method of claim 1, wherein when the substrate is etched using the stepped dielectric layer stack as a mask, the stepped dielectric layer stack and the substrate are etched at the same etching rate.

5. 5. The method for manufacturing a semiconductor device according to claim 1, wherein an included angle between the sidewall and the bottom surface is determined by a lattice arrangement direction of the substrate.

6. a substrate having a trench extending downward from a top surface of the substrate, the trench having sidewalls and a bottom surface, the sidewalls and the bottom surface forming an included angle of 90° or greater; a source region at the bottom of the trench; and a junction field effect transistor (JFET) region at an upper surface of the substrate, the junction field effect transistor (JFET) region having the same semiconductor type and doping concentration as the source region; a gate structure in the substrate and along a top surface of the substrate, the sidewalls and the bottom surface of the trench; a source contact in the trench of the substrate and electrically connected through the gate structure to the source region of the substrate; a drain electrode underlying the substrate; A semiconductor device comprising:

7. 7. The semiconductor device according to claim 6, wherein the trench is an inverted trapezoidal trench.

8. the source region is at the bottom of the trench; The substrate is a well region along the top surface of the substrate, the sidewalls and the bottom surface of the trench; a body contact region at the bottom of the trench and adjacent to the source region; 8. The semiconductor device according to claim 6, further comprising:

9. 8. The semiconductor device according to claim 6, wherein the extending direction of the sidewalls of the trench is the same as the lattice arrangement direction of the substrate.

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