Thermoelectric Module

Abstract

To provide a fastening structure of a thermoelectric module for enhancing reliability and durability at high temperature.SOLUTION: A thermoelectric module includes: a first metal substrate 110 including a first through hole; a first resin layer 120 arranged on the first through hole; a first electrode part which is arranged on the first resin layer 120 and includes a plurality of first electrodes 130; a plurality of P type thermoelectric legs 140 and a plurality of N type thermoelectric legs which are arranged on the first electrode part; a second electrode part which is arranged on the thermoelectric legs and includes a plurality of second electrodes 160; a second resin layer 170 which is arranged on the second electrode part; and a second metal substrate 180 which is arranged on the second resin layer 170 and includes a second through hole. The first metal substrate includes an effective region A1 where the first electrode part is arranged and a shell region A2 formed in the shell of the effective region, the second metal substrate includes an effective region B1 where the second electrode part is arranged and a shell region B2 formed in the shell of the effective region, and the first and second through holes occupy a part of the effective regions of the first and second metal substrates, are formed at mutually corresponding positions, and penetrate a fastening member 190 therethrough.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a thermoelectric module, and more particularly to a fastening structure for a thermoelectric module. [Background technology]

[0002] Thermoelectric phenomena occur due to the movement of electrons and holes inside the material. It is a phenomenon that occurs when heat and electricity are directly converted into each other.

[0003] Thermoelectric elements are a general term for elements that utilize thermoelectric phenomena, and are made by connecting P-type and N-type thermoelectric materials with metal electrodes. It has a structure in which a PN junction pair is formed by joining the two.

[0004] Thermoelectric elements are elements that utilize the temperature change of electrical resistance, and generate electromotive force due to temperature differences. The Seebeck effect is a phenomenon in which heat is absorbed or generated by electric current. They can be classified into elements that utilize the Peltier effect, etc.

[0005] Thermoelectric elements are widely used in home appliances, electronic components, communication components, etc. Thermoelectric elements can be applied to cooling devices, heating devices, power generation devices, etc. The requirements for thermoelectric performance of the device are becoming increasingly higher.

[0006] The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, and includes a plurality of thermoelectric elements between an upper substrate and a lower substrate. The legs are arranged in an array, and a plurality of upper electrodes are disposed between the plurality of thermoelectric legs and the upper substrate. and a plurality of lower electrodes are disposed between the plurality of thermoelectric legs and the lower substrate.

[0007] One of the upper and lower substrates of the thermoelectric element serves as a high temperature portion, and the other serves as a low temperature portion. At this time, a temperature difference occurs between the high temperature and low temperature substrates, causing the This can cause thermal deformation and stress concentration at the bonding interface of the substrates. Peeling and cracks may occur at the joining interface, which may reduce the quality of the product.

[0008] In particular, the edge of the substrate in the high temperature area has a higher thermal deformation amount than the center area. When joining the edge of the substrate at a low temperature, stress concentration at the joining interface increases due to thermal deformation. It is possible. Summary of the Invention [Problem to be solved by the invention]

[0009] The technical problem to be solved by the present invention is to provide a fastening structure for a thermoelectric module. do. [Means for solving the problem]

[0010] A thermoelectric module according to an embodiment of the present invention includes: a first metal substrate having a first through hole; a first insulating layer disposed on a first metal substrate; and a plurality of first electrodes disposed on the first insulating layer. a first electrode portion including: a plurality of P-type and N-type thermoelectric legs disposed on the first electrode portion; a second electrode portion including a plurality of second electrodes disposed on the plurality of P-type and N-type thermoelectric legs; a second insulating layer disposed on the second electrode portion; and a second through-hole disposed on the second insulating layer. a second metal substrate including an effective area where a first electrode portion is arranged; and an outer region formed on the outer periphery of the effective region, and the second metal substrate has a second electrode portion disposed thereon. an effective area disposed on the first through hole and an outer area formed on the outer periphery of the effective area; The hole is formed in the effective area of ​​the first metal substrate, and the second through hole is 2. The first through-hole and the second through-hole are formed within the effective area of ​​the metal substrate. are formed at positions corresponding to each other.

[0011] The first metal substrate and the second metal substrate are connected through the first through-hole and the second through-hole. The device may further include a fastening member for fixing the metal substrate.

[0012] The second metal substrate includes a plurality of second metal substrates spaced apart from each other, each second metal substrate having at least The insulating film may include at least one second through hole.

[0013] An insulating member may be disposed between the plurality of second metal substrates spaced apart from one another.

[0014] The insulating member may have a thickness smaller than that of the second metal substrates.

[0015] The length direction of a part of the plurality of first electrodes arranged on the first metal substrate is The length direction of some of the second electrodes arranged on the second metal substrate is different from the length direction of the remaining second electrodes. The length direction may be the long width direction of each electrode, as opposed to the length direction of the portion.

[0016] At least two of the first electrodes of the first electrode portion excluding the edge region are elongated. The length direction of the remaining electrodes is arranged in a second direction perpendicular to the first direction, and the length direction of the remaining electrodes is arranged in the first direction. At least two of the second electrodes of the second electrode portion excluding the edge region are arranged. The length direction of the electrodes is arranged in a second direction perpendicular to the first direction, and the length direction of the remaining electrodes is arranged in the second direction perpendicular to the first direction. It can be arranged in a first direction.

[0017] Among the plurality of first electrodes excluding the edge region, the first electrodes whose length direction is arranged in the second direction are The number of poles is a multiple of 2, and the length direction of the plurality of second electrodes excluding the edge region is The number of second electrodes arranged in the second direction may be a multiple of two.

[0018] The plurality of second electrodes are arranged in two columns or two rows facing each other in the edge region. At least a portion of the second electrode may be arranged with its length aligned in the second direction.

[0019] The first metal substrate is disposed adjacent to the first through hole. a first hole arrangement region, which is a space formed by imaginary lines connecting the surfaces of the first electrode; The metal substrate has a surface of the second electrode disposed adjacent to the second through hole. a second hole arrangement area, which is a space formed by a virtual line connecting the first hole arrangement area At least one first electrode adjacent to the second hole has its length aligned in the second direction, At least one second electrode adjacent to the hole placement region has its length aligned in the second direction. obtain.

[0020] The at least one first electrode extends from an imaginary line that defines the first hole arrangement area. and the at least one of the plurality of projections is arranged so as to at least partially overlap with a virtual space formed by an extension line of the projections. The second electrodes are formed by an extension line extending from the imaginary line defining the second hole arrangement region. The space may be arranged so as to overlap at least a portion of the space.

[0021] The first through-holes include a plurality of first through-holes, and the first hole arrangement region is a region where the first through-holes are arranged. The second through holes are formed around the through holes, and the second through holes include a plurality of second through holes. A hole placement region may be formed around each of the plurality of second through holes.

[0022] The plurality of first through holes and the plurality of second through holes correspond to each other. The ion implantation device may be formed at a position where the ion implantation device is located.

[0023] The first metal substrate may further include a third through hole disposed in an outer region of the first metal substrate.

[0024] The ratio of the area of ​​the second metal substrate to the area of ​​the first metal substrate is 0.5 to 0.95. It is possible.

[0025] The fastening member may further include an insulating insert member disposed adjacent to the fastening member.

[0026] The diameter of the first through hole and the diameter of the second through hole may be different from each other.

[0027] The diameter of the second through hole may be 1.1 to 2.0 times the diameter of the first through hole. do.

[0028] A portion of the insulating insert may be disposed within the second through hole.

[0029] The semiconductor device may further include a third insulating layer disposed between the first metal substrate and the first insulating layer. do. [Effects of the Invention]

[0030] According to an embodiment of the present invention, a substrate in the hot section and a substrate in the cold section occupying a portion of the effective area of ​​the substrate are provided. By fastening them together in this way, the thermal deformation of the substrate in the high temperature area is reduced and stress is applied to the joint area. This prevents the concentration of force and improves the reliability and durability of the thermoelectric module at high temperatures. Cut.

[0031] According to an embodiment of the present invention, within the limited space in which each hole arrangement region is formed, , allowing for optimal placement of multiple P-type and N-type thermoelectric legs without wasting space, The power generation performance of the thermoelectric module can be maintained. [Brief explanation of the drawings]

[0032] [Figure 1] 1 is a side view of a thermoelectric module according to a first embodiment of the present invention. [Figure 2] 1 is a perspective view of a thermoelectric module according to a first embodiment of the present invention. [Figure 3] 1 is an exploded perspective view of a thermoelectric module according to a first embodiment of the present invention. [Figure 4] 1 is a side view illustrating a state in which a thermoelectric module according to a first embodiment of the present invention is installed in a cooling unit. [Figure 5] FIG. 10 is a perspective view of a thermoelectric module according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a side view illustrating a state in which a thermoelectric module according to a second embodiment of the present invention is installed in a cooling unit. [Figure 7] 10 is a diagram illustrating a first example of a method for arranging first electrodes and second electrodes on a plurality of first metal substrates and a plurality of second metal substrates. [Figure 8] 8 is a diagram illustrating a state in which a plurality of first electrodes and a plurality of second electrodes shown in FIG. 7 are stacked. [Figure 9] 4A and 4B are diagrams illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate, respectively. [Figure 10] 4A and 4B are diagrams illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate, respectively. [Figure 11] 4A and 4B are diagrams illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate, respectively. [Figure 12] 4A and 4B are diagrams illustrating an embodiment of a method for disposing a first electrode and a second electrode on a first metal substrate and a second metal substrate, respectively. [Figure 13] 1 is a diagram illustrating a fastening structure for a power generation module according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0033] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0034] However, the technical concept of the present invention is not limited to the described embodiments, and various different embodiments may be used. The present invention can be embodied in various forms, and within the scope of the technical concept of the present invention, one of the components may be included between the embodiments. One or more of these can be selectively combined or substituted for use.

[0035] Furthermore, the terms (including technical and scientific terms) used in the embodiments of the present invention are expressly and specifically Unless otherwise defined, the present invention will be applied to the inventions generally understood by those skilled in the art. and commonly used terms such as dictionary-defined terms are not to be interpreted in the context of the relevant art. The meaning can be interpreted taking into account the contextual meaning of

[0036] Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not to be construed as limiting the scope of the invention. It's not an attempt to be restrictive.

[0037] As used herein, the singular can include the plural unless the context clearly dictates otherwise, such as "A and If "(and) at least one of B and C" is stated, then A, B, and C It may include one or more of all combinations of

[0038] In addition, in the description of the components of the embodiment of the present invention, first, second, A, B, (a), (b ) and other terms can be used.

[0039] Such terms are used merely to distinguish one component from another, and The terms do not limit the nature, order, or sequence of the components.

[0040] It is also noted that a component is "coupled," "connected," or "connected" to another component. When mounted, the component is directly coupled, connected, or joined to other components. Not only when the component is in a state where it is not a component, but also when there are other components between that component and other components. This also includes cases where the terms "coupled," "coupled," or "connected" are used interchangeably.

[0041] It is also described as being formed or placed "above or below" each component. When two components are in direct contact with each other, the words "upper" and "lower" are used. In the case where one or more other components are formed or disposed between the two components, Also, when it is expressed as "upper" or "lower," it means one component. The reference may include not only the upward direction but also the downward direction.

[0042] FIG. 1 is a side view of a thermoelectric module according to a first embodiment of the present invention, and FIG. 2 is a side view of a thermoelectric module according to a first embodiment of the present invention. 3 is a perspective view of a thermoelectric module according to a first embodiment of the present invention; FIG. FIG. 4 is an exploded perspective view of a thermoelectric module according to a first embodiment of the present invention, in which the thermoelectric module is mounted in a cooling section. FIG. 10 is a side view illustrating the state in which the device is installed.

[0043] 1 to 4, the thermoelectric module includes a first metal substrate 110, a first resin layer 111, and a 20, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 15 0, a plurality of second electrodes 160, a second resin layer 170, a second metal substrate 180, a fastening member 1 90 and a heat insulating material 200, and the first metal substrate 110 and the second metal substrate 180 are fastening parts. It may include at least one through hole for passing the material 190 through.

[0044] According to another embodiment of the present invention, one thermoelectric module includes one first metal substrate 110, a plurality of and a first metal substrate 110 and a plurality of second metal substrates 180. A first resin layer 120, a plurality of first electrodes 130, and a plurality of P-type thermoelectric legs 140 disposed therebetween. , a plurality of N-type thermoelectric legs 150, a plurality of second electrodes 160, a second resin layer 170, and The metal substrate 110 and the second metal substrate 180 are at least It may also include one through hole.

[0045] The first metal substrate 110 is formed in a plate shape. The first metal substrate 110 is also provided with a cooling section C or The first metal substrate 1 may be fixed on a heat generating portion (not shown). In this example, the cooling unit C is fixed to the first metal substrate 110. A hole 20h is formed at a position corresponding to the first through hole 111 formed in the The fastening member 190 can be inserted through the first through-hole 111 into the hole 20h. As in the embodiment of FIG. 11, the first metal substrate 110 has an outer region, i.e., a plurality of P-type thermoelectric The third through hole is also provided in an area where the leg 140 and the plurality of N-type thermoelectric legs 150 are not arranged. At this time, the fastening member 190 is connected to the third through-hole 113 and The cooling unit C can be inserted into the hole 20h formed at a position corresponding to the third through-hole 113. A heat dissipation pad H may be further disposed between the first metal substrate 110 and the cooling portion C. stomach.

[0046] The first metal substrate 110 is made of at least one of aluminum, aluminum alloy, copper, and copper alloy. In this case, when a voltage is applied to the thermoelectric module, the first metal substrate The plate 110 absorbs heat by the Peltier effect and The second metal substrate 180 can act as a high temperature part by radiating heat. On the other hand, when different temperatures are applied to the first metal substrate 110 and the second metal substrate 180, Due to the temperature difference, electrons in the high temperature region move to the low temperature region, generating a thermoelectric power. This is called the Seebeck effect, and the thermoelectric power generated by this effect Electricity is generated within the circuit.

[0047] The first metal substrate 110 includes at least one first through hole 111. 111 is a position corresponding to a second through hole 181 formed in a second metal substrate 180, which will be described later. The first through-hole 111 is formed at a predetermined distance from the outer periphery of the first metal substrate 110. At this time, fastening members may be inserted into the first through-hole 111 and the second through-hole 181. As the fastening member 190 passes through, the first metal substrate 110 and the second metal substrate 18 are fastened together by the fastening member 190. At this time, the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 may be fixed. The diameter of the first through-holes 111 formed in the second metal layer 110 and the thickness of the second metal layer 110 in contact with the second electrodes 160 are The diameters of the second through holes 181 formed on the first surface of the substrate 180 may be the same. The first electrodes 130 are in contact with each other depending on the arrangement and position of the insulating insert member, which will be described later. The diameter of the first through-holes 111 formed on the first surface of the metal substrate 110 and the size of the second electrodes The diameter of the second through-hole 181 formed on the first surface of the second metal substrate 180 in contact with the metal substrate 160 is They may differ from each other.

[0048] A first resin layer 120 is applied onto a first metal substrate 110, and a plurality of first electrodes 130 are arranged on the first resin layer 120. can be.

[0049] Here, the first metal substrate 110 can be in direct contact with the first resin layer 120. Therefore, the first metal substrate 110 has a surface on which the first resin layer 120 is to be disposed, i.e., the first The surface of the metal substrate 110 facing the first resin layer 120 is entirely or partially roughened. According to this, when the first metal substrate 110 and the first resin layer 120 are thermocompression bonded to each other, the first resin This can prevent the layer 120 from floating. In this specification, the surface roughness means unevenness. It is sometimes confused with surface roughness.

[0050] The first resin layer 120 and the second resin layer 170 are made of a resin composition containing a resin and an inorganic filler. The resin may be an epoxy resin or a silicone resin. The inorganic filler may be contained in an amount of 68 to 88 vol% of the resin composition. If the inorganic filler content exceeds 88 vol%, the resin layer may become too hot. The adhesive strength between the resin layer and the metal substrate may be low, and the resin layer may be easily broken.

[0051] The epoxy resin may include an epoxy compound and a curing agent. The epoxy compound may be contained in a volume ratio of 10 to 10 of the curing agent. Among crystalline epoxy compounds, amorphous epoxy compounds, and silicone epoxy compounds The crystalline epoxy compound may contain at least one mesogen. Mesogens can contain liquid crystal structures. It is the basic unit of stal and contains a rigid structure. The compound is a typical amorphous epoxy compound that has two or more epoxy groups in its molecule. glycidyl ethers derived from, for example, bisphenol A or bisphenol F Here, the curing agent may be an amine-based curing agent, a phenol-based curing agent, or an acid anhydride-based curing agent. Curing agent, polymercaptan-based curing agent, polyaminoamide-based curing agent, isocyanate-based curing agent and blocked isocyanate curing agents, The above curing agents may be used in combination.

[0052] The inorganic filler may include aluminum oxide and nitride, the nitride being the inorganic filler. The nitride may be contained in an amount of 55 to 95 wt%, and more preferably 60 to 80 wt%. When the content of the SiO2 is within the above range, the thermal conductivity and bonding strength can be increased. The nitride may include at least one of boron nitride and aluminum nitride. Here, the boron nitride may be a boron nitride aggregate in which plate-shaped boron nitride is aggregated. .

[0053] At this time, the particle size D50 of the boron nitride aggregates is 250 to 350 μm, and the oxidized The particle size D50 of the aluminum can be 10-30 μm. Boron nitride aggregate particles The particle size D50 of the aluminum oxide and the particle size D50 of the aluminum oxide satisfy such a numerical range. When the boron nitride aggregates and aluminum oxide are dispersed uniformly in the epoxy resin composition, As a result, the resin layer as a whole can have uniform heat conduction effect and adhesive performance. do.

[0054] According to the embodiment of the present invention, the first metal substrate 110 side and the second metal substrate 180 side are For example, the first resin layer 120 and the second resin layer 121 may be included. A third resin layer (not shown) may be further disposed between the first electrodes 130. A fourth resin layer (not shown) may be further disposed between the second electrode 160 and the second resin layer 170. At this time, the composition, Young's modulus, and thermal expansion coefficient of the first resin layer 120 and the third resin layer (not shown) are At least one of the number and thickness of the second resin layer 170 and the fourth resin layer 171 may be different from each other. At least one of the composition, Young's modulus, thermal expansion coefficient, and thickness of (not shown) is mutually exclusive. For example, one of the first resin layer 120 and the third resin layer (not shown) may be a resin. If the resin composition is a resin composition, the other is at least one of the composition, Young's modulus, thermal expansion coefficient, and thickness. Another one is a different resin composition, an aluminum oxide layer, or a silicon and aluminum The composite may include a silicon-containing composite. The material may be at least one of oxides, carbides, and nitrides containing silicon and aluminum. For example, the complex may have Al-Si bonds, Al-O-Si bonds, Si-O bonds, and Al-Si-O bonds. It can contain at least one of Al- and Al-O bonds. Si bond, Al-O-Si bond, Si-O bond, Al-Si-O bond and Al-O bond The composite containing at least one of these has excellent insulating properties and therefore high voltage resistance. Alternatively, the composite can be made of titanium, di- Page 10 10 along with silicon and aluminum. It is also an oxide, carbide, or nitride that further contains nickel, boron, zinc, etc. The composite is made of at least one of an inorganic binder and an organic / inorganic mixed binder and aluminum. The inorganic binder can be obtained by mixing the inorganic binder with silicon dioxide and then heat treating the mixture. Silicon (SiO2), metal alkoxides, boron oxide (B2O3) and zinc oxide (ZnO 2) The inorganic binder may contain at least one of the inorganic particles. When it comes into contact with water, it becomes a sol or gel and can act as a binding agent. At the time, silica (SiO2), metal alkoxide, and boron oxide (B2O3) are the least of the One of them is to increase the adhesion to metal, and the other is to increase the strength of the resin layer. In this specification, the voltage resistance is defined as the resistance to a predetermined voltage and and the property of maintaining the dielectric strength without breakdown for a specified period under a specified current. C2.5kV and 1mA current for 10 seconds without dielectric breakdown. The voltage can be said to be 2.5 kV. When one of them is a resin composition, the other is a material having a composition, a Young's modulus, a thermal expansion coefficient, and a thickness. At least one of them is a different resin composition, an aluminum oxide layer, or a silicon The resin may contain a composite containing silicon and aluminum. The oil layer may be mixed with an insulating layer.

[0055] A plurality of first electrodes 130 are disposed on the first resin layer 120. In this case, a plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are arranged. The first electrode 130 is electrically connected to the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150. Here, the first electrode 130 is made of copper (Cu), aluminum (Al), silver (Ag), and It may contain at least one of nickel (Ni).

[0056] A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrode 130. At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are connected to the first electrode 13 0 and can be joined by soldering.

[0057] At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are bismuth (Bi) and It can be a bismuth telluride (Bi-Te)-based thermoelectric leg containing tellurium (Te) as the main raw material. The P-type thermoelectric leg 140 is made of antimony (Sb), nickel, and tantalum (Tb) for 100 wt% of the total weight. Ni (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B ), gallium (Ga), tellurium (Te), bismuth (Bi) and indium (In) Bismuth telluride (Bi-Te)-based main raw material containing at least one of the following: 99-99. The thermoelectric leg contains 999 wt% of a mixture containing Bi or Te at 0.001 to 1 wt%. For example, if the main raw material is Bi-Se-Te, and Bi or Te accounts for 0.01% of the total weight, The N-type thermoelectric leg 150 can further contain 0.001 to 1 wt% of the total weight of 100 Selenium (Se), nickel (Ni), aluminum (Al), copper (C) u), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bi Bismuth tellurite containing at least one of smectic (Bi) and indium (In) Bi-Te-based main raw material 99-99.999 wt% and mixtures containing Bi or Te For example, the thermoelectric leg may contain 0.001 to 1 wt% of Bi-Sb- Te, and may further contain Bi or Te in an amount of 0.001 to 1 wt% of the total weight. do.

[0058] The P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are formed in a bulk type or a laminate type. Generally, the bulk type P-type thermoelectric leg 140 or the bulk type N-type thermoelectric leg 150 is The electrical material is heat treated to produce ingots, which are then crushed and sieved. After obtaining the powder for the thermoelectric leg, it is sintered and the sintered body is cut. The stacked P-type thermoelectric leg 140 or the stacked N-type thermoelectric leg 150 can be obtained by a sheet. A paste containing thermoelectric material is applied to a substrate of a shape to form unit members, and then the unit members are stacked. It can be obtained through a cutting process.

[0059] At this time, the pair of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 have the same shape and structure. The P-type thermoelectric legs 140 may have different shapes and volumes. Since the electrical conduction characteristics of the N-type thermoelectric leg 150 are different from those of the N-type thermoelectric leg 150, the height or The cross-sectional area may be formed to be different from the height or cross-sectional area of ​​the P-type thermoelectric leg 140.

[0060] The performance of the thermoelectric device according to an embodiment of the present invention can be expressed by a thermoelectric figure of merit. The exponent (ZT) can be expressed as follows:

[0061]

number

[0062] where α is the Seebeck coefficient [V / K], σ is the electrical conductivity [S / m], and α 2 σ is the power factor ([W / mK 2 ]) and T is is the temperature, and k is the thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, where a is the thermal diffusivity [cm 2 / S], cp is the specific heat [J / gK], and ρ is the density [g / cm 3 ].

[0063] To obtain the thermoelectric performance index of a thermoelectric element, measure the Z value (V / K) using a Z meter. The measured Z value can be used to calculate the Seebeck index (ZT).

[0064] The P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may be cylindrical, polygonal, or elliptical. Alternatively, the P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a thickness of For example, the P-type thermoelectric leg or the N-type thermoelectric leg may be formed on a sheet-like substrate. It is formed by stacking multiple structures in which semiconductor material is applied to the material and then cutting them. As a result, loss of material can be prevented and electrical conductivity can be improved.

[0065] The plurality of second electrodes 160 are connected to the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150. At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are placed on the second The second electrode 160 may be soldered to the second electrode 160. Here, the second electrode 160 is made of copper (Cu). , aluminum (Al), silver (Ag), and nickel (Ni), It can be done.

[0066] The second resin layer 170 is disposed on the plurality of second electrodes 160. A plurality of second metal substrates 180 are disposed thereon.

[0067] The second metal substrate 180 is disposed on the second resin layer 170 facing one of the first metal substrates 110. The second metal substrate 180 is made of aluminum, an aluminum alloy, copper, or a copper alloy. It can be.

[0068] The area of ​​the first metal substrate 110 and the area of ​​the second metal substrate 180 may be the same, and as described above, When the third through-hole 113 is formed in the first metal substrate 110, the first metal substrate 110 The area may be larger than the area of ​​the second metal substrate 180. In this case, the area of ​​the first metal substrate 110 The area ratio of the second metal substrate 180 to the area of ​​the It may be 0.90, and more preferably 0.70 to 0.85.

[0069] Other examples include applications requiring a relatively larger surface area or thermal deformation. If it is necessary to further minimize the number of metal layers, the second metal substrate 180 may be formed by one metal substrate 11. In this case, each of the first metal substrate 110 may be divided into a plurality of portions. The area ratio of the second metal substrate 180 is 0.10 to 0.50, preferably 0.15 to 0.45, More preferably, it may be 0.2 to 0.40. For example, on one first metal substrate 110, Two second metal substrates 180 may be arranged. At this time, the second metal substrates 180 are spaced apart from each other. For example, the first metal substrate 110 may have an area of ​​100 mm×100 mm. The second metal substrates 180 each have an area of ​​45 mm x 100 mm and are spaced apart from each other. The spacing between the second metal substrates 180 may be about 10 mm.

[0070] As another example, four second metal substrates 180 are disposed on one first metal substrate 110. In this case, the second metal substrates 180 may be arranged to be spaced apart from each other. For example, The first metal substrate 110 has an area of ​​100 mm x 100 mm, and the second metal substrate 180 has an area of ​​100 mm x 100 mm. The area of ​​the second metal substrates 180 is 45 mm x 45 mm, and the distance between the second metal substrates 180 is approximately It can be 10mm.

[0071] As another example, the spacing between the second metal substrates 180 may be less than 5 mm. The first metal substrate 110 has an area of ​​100 mm×100 mm, and the second metal substrate 180 has an area of The size of the second metal substrate 180 is 49.5 mm x 49.5 mm, and the spacing between the second metal substrates 180 is 2 mm. The connecting members 230 connecting the plurality of second metal substrates 180 are formed to have a width of 2 mm. obtain.

[0072] At this time, the thickness of the first metal substrate 110 may be 0.1 mm to 2 mm. The thickness of the substrate 180 may be the same as or greater than the thickness of the first metal substrate 110. When the thickness of the metal substrate 180 is greater than the thickness of the first metal substrate 110, the second metal substrate 180 The thickness of the second metal substrate 110 may be 1.1 to 2.0 times the thickness of the first metal substrate 110. The plate 180 may be bent by the fastening member 190, so it is thicker than the first metal substrate 110. can be formed significantly.

[0073] At least one second through-hole 181 is formed in the second metal substrate 180. The second through-holes 181 are formed in an effective area inside the outer area B2 of each second metal substrate 180. The effective area may be formed to occupy a portion of the area B1. The thermoelectric module has a plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 141 that can substantially realize the Seebeck effect. The effective area can be defined as the area in which the electrode 150 is disposed, and the terminal electrodes can be disposed within this effective area. The terminal electrodes may extend from the active area to be connected to external terminals or wires. At least one or more of the plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 The first electrodes 130 and the second electrodes 160 may be electrically connected to at least one of the first electrodes 130 and the second electrodes 160. In this region, the plurality of first electrodes 130 and the plurality of second electrodes 160 are vertically overlapped with each other. The second through-hole 181 formed in the second metal substrate 180 may be When there are a plurality of second through holes 181, the second through holes 181 may be formed at predetermined intervals from the outer periphery of the second metal. The second through-holes 181 may be spaced apart from the outer periphery of the substrate 180 at equal intervals. The fastening members 190 are arranged to overlap the corresponding first through holes 111. The fastening member 190 can pass through the bolt 111 and the second through-hole 181. The first metal substrate 110 and the second metal substrate 180 are formed so as to occupy a part of the effective areas A1 and B1 of the first metal substrate 110 and the second metal substrate 180. By fixing the first metal substrate 110 and the second metal substrate 180 to each other, the thermal change This reduces the size and prevents stress from concentrating at the joint.

[0074] Although not shown, the effective areas A1 and B1 of the first metal substrate 110 and the second metal substrate 180 are In order not to affect the A2 and B2 portions of the outer area of ​​each board, i.e., the edge area of ​​the board, When fastening, the fixing force between the substrates may be relatively high, but the thermoelectric module can be By exposing it to a high temperature environment of 100°C or higher, the Seebeck effect can be utilized, and heat of 100°C or higher can be generated. In applications that utilize the Peltier effect, the temperature difference between the low-temperature and high-temperature regions is The relative heat difference can cause damage to the thermoelectric module. In the case of a thermoelectric module that utilizes the effect, the high-temperature metal substrate expands due to heat, and the low-temperature metal The substrate shrinks due to the separate cooling element, and thermal stress is concentrated at the edge region of the substrate. The thermal stress generated during this process is transmitted to the electrodes, thermoelectric legs, and resin layers arranged between the substrates. This can cause peeling and cracks at the weak interface, resulting in damage to the thermoelectric module. Although not shown, the first metal substrate 110 and the second metal A sealing member may be further disposed between the substrates 180. The sealing member may be a first gold Between the metal substrate 110 and the plurality of second metal substrates 180, the first electrode 130, the P-type thermoelectric leg 14 0, the N-type thermoelectric leg 150 and the second electrode 160. The first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric leg 150 and the second electrode 160 are externally The sealing member can seal the part from moisture, heat, contamination, etc. The outermost part of the electrode 130, a plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 and a plurality of upper electrodes 160. a sealing material disposed between the sealing case and the first metal substrate 110; and a sealing material disposed between the sealing case and the second metal substrate 180. In this way, the sealing case can be attached to the first metal substrate 11 via the sealing material. 0 and the second metal substrate 180. Accordingly, the sealing case When the first metal substrate 110 and the second metal substrate 180 are in direct contact with each other, the sealing case As a result, heat conduction occurs between the first metal substrate 110 and the second metal substrate 180. The problem of low temperature difference can be prevented. Here, the sealing material is epoxy resin and and silicone resin, or epoxy resin and silicone resin At least one of the sealants may include a double-sided tape. Between the sealing case and the first metal substrate 110 and between the sealing case and the second metal substrate 180 The first electrode 130, the P-type thermoelectric leg 140, and the N-type thermoelectric leg 140 form an airtight seal between them. 150 and the second electrode 160 can enhance the sealing effect, and the finishing material, finishing layer , waterproof material, waterproof layer, etc. Here, the sealing case and the first metal substrate 110 The sealant for sealing the gap is disposed on the upper surface of the first metal substrate 110. The sealant that seals between the case and the second metal substrate 180 is For this reason, the area of ​​the first metal substrate 110 is equal to the total area of ​​the second metal substrate 180. The sealing case may be larger than the body area. For this purpose, the sealing case is made of plastic. It can be an injection molded product made of materials such as a sealing cover. The above description of the member is merely exemplary, and the sealing member may be modified in various ways. Although not shown, a heat insulating material may be further included to surround the sealing member. The sealing member may also include a thermal insulating component.

[0075] Referring to FIG. 7, the first metal substrate 110 has a first hole 111 adjacent to the first through hole 111. The first hole arrangement region 112 is formed in the first through-hole 111 and the first through-hole 112. Although the electrodes are adjacent to each other, imaginary lines 201, 202, and 203 connect the surfaces of the adjacent electrodes. The first hole arrangement area 112 is formed in a polygonal shape. In this case, the first hole arrangement area 112 has a rectangular shape. The first electrodes 130 may not be arranged on the second metal substrate 180. A second hole arrangement region 182 is formed adjacent to the second through-hole 181 on the surface facing the metal substrate 110. The second hole arrangement region 182 is the region closest to the second through-hole 181. , the space formed by imaginary lines 211, 212, 213, and 214 connecting the surfaces of adjacent electrodes The second hole arrangement area 182 may be formed in a polygonal shape, and preferably in a quadrilateral shape. In this case, the second hole arrangement region 182 may have a plurality of second electrodes 1 60 may not be placed.

[0076] The fastening member 190 fastens the first metal substrate 110 and at least one second metal substrate 180. At this time, a part of the fastening member 190 passes through the second through-hole 181 and the first through-hole 111. The end of the cooling section C is inserted into the hole 20h and joined.

[0077] Referring to FIG. 4, the fastening member 190 may include a first member 191 and a second member 192. The first member 191 passes through the second through-hole 181 and the first through-hole 111, and has one end The first member 191 is embedded in the cooling section C and fixed thereto. At this time, a screw thread is formed on the outer periphery of the first member 191. The diameter of the first member 191 can be set to the diameter of the second through hole 181 and the first through hole 111. The diameter is equal to or smaller than the diameters of the second through-hole 181 and the first through-hole 111. can be formed.

[0078] The second member 192 extends from the other end of the first member 191 and has a diameter equal to that of the second through-hole 181. The second member 192 is formed with a larger diameter. Prevents spreading from 0.

[0079] When there are a plurality of second metal substrates 180, the heat insulating material 200 is used to separate the plurality of second metal substrates 180. The insulating material 200 may be made of epoxy resin, silicone resin, and ceramic. The thermal insulation material 200 may include at least one of the above-mentioned sealant. The connecting member 230 may be used in combination with the connecting member 230 described below.

[0080] The heat sink 220 may be disposed on the second metal substrate 180. For example, the heat sink 2 20 is disposed on one of the two surfaces of the second metal substrate 180 opposite to the surface on which the second resin layer 170 is disposed. In this case, the second metal substrate 180 and the heat sink 220 may be integrally formed. Although not shown, a heat sink may also be formed on the first metal substrate 110. Each of the link 220 has a plurality of flat substrates 221 arranged in parallel. The space between the planar substrate 221 may have a structure that forms an air passage. The spacing between may be less than 10 mm.

[0081] A thermoelectric module 20 according to another embodiment of the thermoelectric module will be described below with reference to FIGS. 5 and 6. This will be explained with reference to FIG.

[0082] FIG. 5 is a perspective view of a thermoelectric module according to a second embodiment of the present invention, and FIG. 6 is a perspective view of a thermoelectric module according to a second embodiment of the present invention. 1 is a side view illustrating a state in which a thermoelectric module according to an embodiment is installed in a cooling unit.

[0083] 5 and 6, the thermoelectric module 20 is formed between a plurality of second metal substrates 180. A connecting member 230 for connecting the two may further be included.

[0084] The connecting member 230 is a glue that connects the plurality of second metal substrates 180 together. At this time, the thermoelectric module 20 is provided with heat insulation treatment in the spaces between the second metal substrates 180. Although it can be omitted, as described above, a heat insulating layer is provided between the first metal substrate 110 and the second metal substrate 180. The material 200 can be placed.

[0085] Although not shown, the thermoelectric module does not include the connecting member 230 and is made up of a plurality of second metal substrates. 180. The connecting members 180 may be connected to each other by extension members extending from parts of the connecting members 180.

[0086] In this case, the extension member may be formed to have a thickness smaller than that of the second metal substrate 180. For example, The thickness of the metal substrate 180 may be 0.2 mm to 4 mm, and the thickness of the extension member may be 0.1 mm to 2 mm. In this case, the thickness ratio of the plurality of second metal substrates to the thickness of the extension member may be 1. Can be ~2 or less.

[0087] One surface of the connecting member 230 is recessed from one surface of the second metal substrate 180, forming a groove 241. In this case, the connecting member 230 may be formed in a cross shape. For example, the first metal substrate 1 The area of ​​the first metal substrate 10 is 100 mm x 100 mm, and the area of ​​the second metal substrate 180 is 45 mm x 4 When the thickness is 0.2 mm to 4 mm, the connecting member 230 has a width of 10 mm. The groove formed by the connecting member 230 has a depth of 0.1 mm to 2 mm. The distance between the connecting member 230 and the second metal substrate 180 can be 0.1 mm to 2 mm. The difference in thickness forms a groove, and the thickness of the second metal substrate 180 is thin at the center, and the thickness of the second metal substrate 180 is thin at the center. This can have the effect of reducing thermal deformation of the metal substrate 180.

[0088] In this specification, a plurality of second metal substrates 180 are disposed between the plurality of second metal substrates 180 spaced apart from each other. The heat insulating material 200, the connecting member 230, and the extension member that connect the metal substrate 180 are collectively referred to as the connecting portion. The connecting member may be an insulating member containing an insulating material.

[0089] Hereinafter, various embodiments for arranging the plurality of first electrodes 130 and the plurality of second electrodes 160 will be described. The embodiment will be described with reference to FIGS.

[0090] FIG. 7 shows a method of disposing a first electrode and a second electrode on a first metal substrate 110 and a second metal substrate 180. 8 is a diagram illustrating a first embodiment of the method, and FIG. 8 is a diagram illustrating a plurality of first electrodes and a plurality of second electrodes shown in FIG. 9 to 11 are diagrams illustrating a state in which the first metal substrate 110 and the second electrode are overlapped. 2 shows various embodiments of a method for disposing the first electrode and the second electrode on the metal substrate 180. This is a drawing.

[0091] 7 to 11, the first electrodes 130 are formed by the first metal substrate 110 being connected to the second metal substrate 110. The second electrodes 160 are disposed on one side facing the plate 180, and the second metal substrate 180 is The first electrodes 130 are disposed on one surface facing the metal substrate 110. The plurality of second electrodes are arranged with a second hole arrangement region 182 spaced apart. The positions of the first hole arrangement area 112 and the second hole arrangement area 182 may be mutually different. Corresponds to yes.

[0092] Here, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 has a rectangular shape. The long width W1 and the short width W2 are divided into two parts. The ratio of the long width W1 to the short width W2 of the electrode 130 and the second electrode 160 can be varied, and is preferably The ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 is 2.05 to 4. 50. In this specification, the direction of the long width may be referred to as the length direction.

[0093] Although not shown, the first metal substrate 110 and the second metal substrate 180 have a through hole in their effective areas. If the holes 111 and 181 are not formed, the length direction of the plurality of first electrodes 130 is In this case, the second electrodes 160 may be arranged in the first direction Y in the edge region of the effective region. At least some of the electrodes arranged in two columns or two rows facing each other are aligned in a first direction Y The remaining electrodes are arranged in a second direction X perpendicular to the first electrodes 130, and the remaining electrodes are separated by a short width W2 of the electrodes. The first metal substrate 110 and the second metal substrate 111 may move from the first metal substrate 110 to the second metal substrate 111 and may overlap at least partially. Multiple P-type and N-type thermoelectric legs between the metal substrates 180 can all be connected in series. Cut.

[0094] The effective areas of the first metal substrate 110 and the second metal substrate 180 according to the embodiment of the present invention are small. When at least one through hole 111, 181 is formed, the first electrode 130 and the plurality of second electrodes The length direction of the electrodes 160, excluding the electrodes in the edge regions, is the first direction Y and the second direction Y and the second direction X perpendicular to the first direction can be mixed and arranged.

[0095] At this time, a small area of ​​the plurality of first electrodes 130 or the plurality of second electrodes 160 excluding the edge area is At least two electrodes are arranged in a second direction X perpendicular to the first direction Y, and the remaining electrodes are arranged in the second direction X. They may be arranged in a first direction Y perpendicular to X.

[0096] At least one hole arrangement region adjacent to the first hole arrangement region 112 or the second hole arrangement region 182 One electrode is arranged such that its length direction faces the second direction X, and the at least one adjacent electrode The other one may also be arranged so that its length direction faces the second direction X. In any case, the two first electrodes 130 and the at least two second electrodes 160 do not overlap each other. , some of which may overlap.

[0097] Specifically, at least one of the plurality of first electrodes 130 adjacent to the first hole arrangement region 112 The two first electrodes 130a and 130b are arranged such that their length directions are directed in the second direction X. The remaining first electrodes 130 may be arranged such that their length directions are aligned in the first direction Y. do.

[0098] At this time, at least one of the second electrodes 160 adjacent to the second hole arrangement region 182 The two second electrodes 160a and 160b may be arranged in the second direction X. Of the plurality of second electrodes 160c arranged, two rows facing each other also have their length directions aligned in the second direction. The remaining second electrodes 160 may be arranged in the direction X. The length direction of the remaining second electrodes 160 may be arranged in the first direction Y. In this case, the first electrodes 130a and 130b arranged in the second direction X and the second electrodes 130b and 130c arranged in the second direction X are arranged in the same manner. The second electrodes 160a and 160b arranged in two directions do not overlap each other or overlap partially. Here, the arrangement of the plurality of first electrodes 130 and the plurality of second electrodes 160 is as follows: They can be applied interchangeably.

[0099] More specifically, as shown in FIG. 8, the edge regions of the first electrodes 130 are At least two of the remaining lines are defined by the imaginary lines 201 and 202, which define the first hole arrangement area 112. The virtual space (H1 or H2) formed by the extensions from 2, 203, and 204 and at least The second electrodes 160 may be arranged in the second direction X with some overlapping. At least two imaginary lines 211, 212, 213 defining the second hole arrangement area 182 are 3, 214 and the virtual space (H3 or H4) formed by the extension line. The holes can be arranged in the second direction X. Through this, each hole arrangement area is formed. Within the limited space, optimal placement of multiple P-type and N-type thermoelectric legs is possible. The number, positions and shapes of the first hole arrangement areas 112 and the second hole arrangement areas 182 are As a result, the number of electrodes arranged in the second direction X may increase. The number of electrodes arranged in the second direction X may be a multiple of two, and at least one of the electrodes arranged in the second direction X may be a multiple of two. The other two may be arranged to overlap at least partially with H1 to H4.

[0100] In this specification, the electrode arrangement of the plurality of first electrodes 130 and the plurality of second electrodes 160 is The first direction Y and the second direction X may be applied interchangeably, and are not limited thereto.

[0101] Referring to FIG. 9, the first electrodes 130 adjacent to the first hole arrangement region 112 The two first electrodes 130d and 130f may be arranged such that their length directions are directed in the second direction X, The two first electrodes 130d and 130f and the two adjacent first electrodes 130c and 130e The length direction may be similarly arranged in the second direction X. The remaining first electrodes 130 may be arranged in the length direction may be arranged to face the first direction Y.

[0102] At this time, two second electrodes 160 adjacent to the second hole arrangement region 182 are The electrodes 160d and 160e may be arranged such that their length directions are directed in the second direction X, and the second holes The other two second electrodes 160f and 160g adjacent to the placement region 182 are also similarly The second electrodes may be arranged in two rows facing each other in the edge region. The remaining second electrodes 160h may also be arranged so that their length directions are directed in the second direction. 60 may be arranged so that the length direction faces the first direction Y.

[0103] Referring to FIG. 10, the first metal substrate 110 and the second metal substrate 180 have a first through hole 1. 11 and the second through-hole 181 may be formed in plural, and accordingly, the first hole arrangement area 1 The first electrodes 13 and the second hole arrangement region 182 may also be formed in plural. The first electrodes 130g and 130h adjacent to each first hole arrangement region 112 are long. The two first electrodes 130g and 130h may be arranged such that their height directions face the second direction X. The length directions of the two adjacent first electrodes 130i and 130j are also similarly arranged in the second direction X. At this time, the first hole arrangement region 112 is formed in a plurality of regions, and the first electrodes 130 are arranged in a plurality of regions. A multiple of two of the first electrodes may be arranged to face the second direction X. At least eight of the first electrodes 130g, . . . , 130n of the electrodes 130 are oriented in the second direction X. The remaining first electrodes 130 may be arranged such that their length directions are aligned in the first direction Y. It can be arranged as follows.

[0104] At this time, the second electrode 160 has two adjacent second hole arrangement regions 182 in the first direction Y. The second electrodes 160i and 160j may be arranged such that their length directions are directed in the second direction X. The other two second electrodes 160k and 160l adjacent to the two hole arrangement region 182 are also It can be arranged in the second direction X as well.

[0105] At this time, the second hole arrangement region 182 is formed in plural, and two of the plural second electrodes 160 are arranged in plural. The multiple of the number of the plurality ... At least eight of the second electrodes 160i, . . . , 160p are arranged in the longitudinal direction. The electrodes may be arranged in two rows facing each other in the edge region. The second electrode 160q may also be arranged such that its length direction faces the second direction X. The remaining second electrodes 160 may be arranged such that their length directions are oriented in the first direction Y.

[0106] Referring to FIG. 11, the first hole arrangement region 112 is formed in a plurality of regions, and a plurality of first electrodes 1 Four first electrodes 130o spaced apart from one first hole arrangement region 112 among the first electrodes 130o, , 130r may be arranged so that the length direction faces the second direction X. Here, the first hole arrangement A plurality of electrodes are arranged between the placement region 112 and the first electrodes 130o, . . . , 130r. However, the first electrodes 130o, . . . , 130r are arranged in the first hole arrangement region 112. The virtual space formed by the extension lines extending from each virtual line is at least partially overlapped with the second virtual space. In addition, the first hole arrangement region of another one of the plurality of first electrodes 130 may be arranged in the direction X. Four first electrodes 130s, . . . , 130v adjacent to the region 112 in the first direction are arranged in the second direction X can be placed in

[0107] At this time, the second electrode 160 has four second hole arrangement regions 182 adjacent to it in the first direction Y. 160r, . . . , 160u and four 160v, . . . , 160y may be arranged such that their length directions are oriented in the second direction X.

[0108] Referring to FIG. 12, the first metal substrate 110 and the second metal substrate 180 have a first through hole 1. 11 and the second through-hole 181 may be formed in plural, and accordingly, the first hole arrangement area 1 The first metal substrate 110 and the second hole arrangement region 182 may also be formed in plural. may include four first through holes 111 and four first hole arrangement areas 112. The second metal substrate 180 has four second through holes 181 and four second hole arrangement areas 1 It may contain 82.

[0109] At this time, two of the first electrodes 130 adjacent to each first hole arrangement region 112 are The first electrodes 130-1 and 130-2 may be arranged such that their length directions are directed in the second direction X. The other two first electrodes 130-3 and 130-4 adjacent to the hole arrangement region 112 are also The first electrodes 130 may be arranged such that their directions are directed in the second direction X. A multiple of two of the first electrodes may be arranged to face the second direction X. More specifically, At least 16 of the first electrodes 130-1, . . . , 130-4 are oriented in the second direction X The remaining first electrodes 130 may be arranged such that their length directions are oriented in the first direction Y. It can be arranged like this.

[0110] Also, the hole arranging area 112 is adjacent to one of the first hole arranging areas 112 and faces the second direction X. At least one of the four first electrodes 130-1, . . . , 130-4 arranged as shown in The length directions of 2n adjacent first electrodes 130-2n (n is an integer of 1 or more) are also aligned in the second direction X. Here, the positions where the 2n first electrodes 130-2n are arranged are The arrangement of the second electrodes 180 may be modified in various ways.

[0111] In addition, here, there are multiple holes between the first hole arrangement region 112 and the 2n first electrodes 130-2n. However, 2n first electrodes 130-2n are arranged in the first hole arrangement area. The virtual space formed by the extensions of the virtual lines defining 112 overlaps at least partially with the virtual space formed by the extensions of the virtual lines defining 112. The second direction X can be arranged in this way.

[0112] In FIG. 12, 2n first electrodes 130-2n are arranged in the second direction X. However, the present invention is not limited to this, and 2n second electrodes may be arranged in the first direction Y.

[0113] A first resin layer 120 and a second resin layer 130 are disposed between a first metal substrate 110 and a plurality of first electrodes 130. The second resin layer 170 disposed between the metal substrate 180 and the plurality of second electrodes 160 is shown in FIG. 7 to 11 are omitted for the sake of convenience. The first resin layer 120 and the second resin layer 180 are shown in the figure, each having the same or similar structure. This can also be applied to the embodiments of FIGS.

[0114] Similarly, the terminal electrode 500 is shown only in FIG. 12, but is not limited thereto. 7 to 11, the terminal electrodes 500 are of the same or similar structure. may also be applied.

[0115] As shown in FIGS. 7 to 12, the electrodes are arranged in the second direction X so as to face each other at the edge regions. The two rows are included in the first electrode 130 disposed on the first metal substrate 110, or 2 may be included in the second electrode 160 disposed on the metal substrate 180 .

[0116] At this time, the first electrodes 130 are formed on the first surface of the first metal substrate 110. The diameter d1 of the through-hole 111 and the thickness of the second metal substrate 180 in contact with the plurality of second electrodes 160 are The diameter d2 of the second through holes 181 formed on the first surface may be the same. The first metal substrate 1 contacts the first electrodes 130 depending on the arrangement and position of the insulating insert member. The diameter d1 of the first through-hole 111 formed on the first surface of the substrate 10 and the number of second electrodes 160 The diameter d2 of the second through-hole 181 formed on the first surface of the second metal substrate 180 in contact with It may be different.

[0117] Meanwhile, as shown in FIGS. 7 to 12, the area of ​​the first hole arrangement region 112 is one first It may be 4 times or more, preferably 6 times or more, and more preferably 8 times or more, the area of ​​the electrode 130. When the area of ​​the first hole arrangement region 112 is less than four times the area of ​​one first electrode 130, Under a high voltage of AC 1 kV or more, a current flows through the first through-hole 111 to the first metal substrate 110. This can cause electrical breakdown of the thermoelectric module. In the application field, it is necessary to ensure sufficient insulation distance to prevent electrical breakdown of the thermoelectric module. It is important to maintain the area of ​​the first hole arrangement region 112 to be eight times the area of ​​one first electrode 130. If the voltage is above 2.5kV, no electrical breakdown will occur even under high voltages of AC 2.5kV or higher. Similarly, the area of ​​the second hole arrangement region 182 formed on the second metal substrate 180 is also one second It may be four times or more, preferably six times or more, and more preferably eight times or more, the area of ​​the electrode 160. do.

[0118] 7 to 12, the first metal substrate 11 of the plurality of first electrodes 130 The electrodes arranged closest to the first edge (not shown) of the electrode 0 may be arranged periodically. , the starting point of an imaginary line connecting the first edge of the first metal substrate 110 and the electrode surface disposed most adjacently; The path between the end points can be arranged to be a straight line without any bends. In all of the first electrodes 130 closest to the first edge of the substrate 110, each first electrode 130 The electrode surface closest to the first edge of the first metal substrate 110 is aligned in one direction. 110. The first metal substrate 110 is then disposed at the same distance as the first edge of the first metal substrate 110 without the removed area. For example, the electrode disposed closest to the first edge of the first metal substrate 110 When the path between the start point and the end point of the virtual line connecting the surfaces is a straight line, This may mean that all the electrodes in the first row (not shown) are periodically arranged. According to the method, the complexity of the process of disposing the plurality of first electrodes 130 on the first metal substrate 110 can be reduced. The second electrode 160 and the first electrode 161 disposed on the second metal substrate 180 can be reduced. The arrangement of the thermoelectric legs disposed between the first electrode 30 and the second electrode 160 can be simplified. In addition, the edge of the first metal substrate 110 and the portion disposed closest to the edge of the first metal substrate 110 Since the shortest distance between the first electrodes 130 is kept constant, the first electrodes 130 are closest to the edge of the first metal substrate 110. The adjacently disposed first electrodes 130 may have uniform electrical characteristics.

[0119] If the opening of the imaginary line connecting the first edge of the first metal substrate 110 and the electrode surface disposed most adjacently is When the path between the start point and the end point includes a bending region, the electrodes of the first column of the plurality of first electrodes 130 The periodicity of the arrangement is lost due to the removal of some of the poles or the inclusion of depressed areas. The electrode disposed closest to the first edge of the first metal substrate 110 in the bending region may be The electrode surface may be an electrode surface arranged in a second row (not shown) that is the row next to the first row. The second row is arranged farther from the first edge of the first metal substrate 110 than the first row. The fold area may be extended to accommodate additional through-holes, and may not be the outermost row. Although the first electrode 130 can be arranged to include the In high voltage applications, the thermoelectric module is not suitable because it does not have sufficient insulation distance. Electrical breakdown may occur or the effective area of ​​the first electrode may decrease, resulting in the thermoelectric module This can reduce the efficiency of the system.

[0120] Similarly, the first electrode 130 facing the first edge of the first metal substrate 110 The electrode (Nth column) closest to the second edge (not shown) is the first gold electrode among the plurality of first electrodes 130. The third edge (not shown) between the first and second edges of the metal substrate 110 and the electrode (first row ) and a fourth edge (FIG. 1) of the plurality of first electrodes 130 facing the third edge of the first metal substrate 110. The electrodes (Mth row) closest to the first metal substrate 110 are also closest to each edge of the first metal substrate 110. The path between the start and end points of the virtual line connecting the adjacent electrode surfaces is a straight line without any bending areas. However, depending on the design of the terminal electrode arrangement, etc., the outermost row or the outermost row may be Any one of the rows, for example, the first column, the Nth column, the first row, and the Mth row Only one of the terminal electrodes can have an exceptional path. For example, the terminal electrode can be the outermost row or is placed in one of the outermost rows, the 1st column, the Nth column, the 1st row, and the Mth row. or connected to the first electrode 130 in the first column, the Nth column, the first row, or the Mth row. The outermost and outermost rows of the first electrodes 130 may extend from the first electrodes 130. The remaining columns or rows except for one column or row in which the terminal electrodes are arranged among the outer rows may be arranged to have a fixed distance from each corresponding edge of the first metal substrate 110.

[0121] FIG. 13 shows a junction structure of a thermoelectric element according to an embodiment of the present invention.

[0122] Referring to FIG. 13, the thermoelectric device 100 can be fastened by a plurality of fastening members 400 . The plurality of fastening members 400 fasten the heat sink 220 and the second metal substrate 180 together, or The sink 220 fastens the second metal substrate 180 to the first metal substrate (not shown) and provides heat. The sink 220, the second metal substrate 180, the first metal substrate (not shown), and the cooling portion (not shown) ), or the second metal substrate 180, the first metal substrate (not shown) and the cooling portion (not shown) or fastening the second metal substrate 180 and the first metal substrate (not shown). can.

[0123] For this purpose, the heat sink 220, the second metal substrate 180, the first metal substrate (not shown) The cooling portion (not shown) may have a through hole S through which the fastening member 400 passes. Here, the through-holes S include the second through-holes 181 and the first through-holes 111. Here, a separate insulating insert is provided between the second through hole 181 and the fastening member 400. The insulating insert member 410 may be further disposed on the outer periphery of the fastening member 400. The insulating insert member may be an insulating insert member surrounding the through hole S or an insulating insert member surrounding the wall surface of the through hole S. By doing so, it is possible to increase the insulation distance of the thermoelectric element.

[0124] Meanwhile, the shape of the insulating insert member 410 is as shown in FIGS. 13(a) and 13(b). For example, as illustrated in FIG. 13(a), the insulating insert member 410 may be a second metal substrate. A step is formed in the through-hole S region formed in the plate 180 to surround a part of the wall surface of the through-hole S. Alternatively, the insulating insert member 410 may be disposed so as to be inserted through a through hole formed in the second metal substrate 180. A step is formed in the through-hole S region, and a second electrode (not shown) is attached along the wall surface of the through-hole S. It may be arranged to extend to the first surface on which it is arranged.

[0125] Referring to FIG. 13(a), the through-holes on the first surface of the second metal substrate 180 that contact the second electrode are The diameter d2' of the through hole S is the same as the diameter of the through hole on the first surface of the first metal substrate that contacts the first electrode. At this time, depending on the shape of the insulating insert member 410, the first surface of the second metal substrate 180 may be The diameter d2' of the formed through hole S is the diameter of the through hole formed on the second surface, which is the opposite surface of the first surface. It may be different from the diameter d2 of the hole S. Although not shown, a step is formed in the through-hole S region. The insulating insert member 410 is disposed only on a part of the upper surface of the second metal substrate 180 without any insulating insert member 410 being disposed on the upper surface of the second metal substrate 180. The insulating insert member 410 is attached from the upper surface of the metal substrate 180 to a part or the whole of the wall surface of the through hole S. When the through-hole S is disposed to extend, the through-hole S is formed on the first surface of the second metal substrate 180. The diameter d2' is the same as the diameter d2 of the through hole S formed on the second surface, which is the opposite surface of the first surface. That's fine too.

[0126] Referring to FIG. 13(b), the shape of the insulating insert member 410 determines whether the second metal substrate 180 The diameter d2' of the through hole S on the first surface that contacts the second electrode is The diameter of the through-hole on the first surface of the second metal substrate 180 may be larger than the diameter of the through-hole on the first surface of the second metal substrate 180. The diameter d2' of the through hole S on the first surface of the first metal substrate is 1.1 to 2 times the diameter of the through hole on the first surface of the first metal substrate. The diameter d2' of the through-hole S on the first surface of the second metal substrate 180 may be 0.0 times the diameter d2' of the first metal substrate 180. If the diameter is less than 1.1 times the diameter of the through-hole on the first surface of the substrate, the insulating insert member 410 will not have sufficient insulating effect. The small effect may cause breakdown of the thermoelectric element, and the penetration of the first surface of the second metal substrate 180 The diameter d2' of the through hole S exceeds 2.0 times the diameter of the through hole on the first surface of the first metal substrate. Then, the size of the area occupied by the through-hole S increases relatively, so that the second metal group The effective area of ​​the plate 180 becomes reduced, which may reduce the efficiency of the thermoelectric element.

[0127] The insulating insert member 410 has a shape that allows the insulating insert member 410 to be formed on the first surface of the second metal substrate 180. The diameter d2' of the through hole S is the diameter of the through hole S formed on the second surface, which is the opposite surface of the first surface. As described above, the step in the through-hole S region of the second metal substrate 180 may be different from the diameter d2. If not formed, the diameter d2' of the through-hole S formed on the first surface of the second metal substrate 180 may be the same as the diameter d2 of the through-hole S formed on the second surface, which is the opposite surface to the first surface.

[0128] In the embodiment of the present invention, the first hole arrangement region of the first electrode 130 or the second electrode 160 Even if the hole arrangement area is separated from the first hole arrangement area 112 or the second hole arrangement area 182, the hole arrangement area is defined. In the virtual space formed by the extension lines of each virtual line, at least two electrodes are Since the holes are arranged in the second direction X with at least a partial overlap, each hole arrangement area is formed. Multiple P-type and N-type thermoelectric legs can be mounted in a limited space without wasting space. Optimal placement is possible.

[0129] The thermoelectric element according to the embodiment of the present invention is used in power generation devices, cooling devices, heating devices, etc. Specifically, the thermoelectric device according to the embodiment of the present invention is mainly used in optical communication modules, sensors, medical devices, etc. Medical equipment, measuring equipment, aerospace industry, refrigerators, chillers, automotive ventilation sheets cup holders, washing machines, dryers, wine cellars, water purifiers, power supplies for sensors, It can be applied to thermopiles and the like.

[0130] Here, as an example of the application of the thermoelectric element according to the embodiment of the present invention to medical equipment, PCR (P PCR equipment is used for DNA This equipment amplifies DNA to determine its base sequence, and requires precise temperature control. This is a device that requires thermal cycling. For this reason, a Peltier system Peltier-based thermoelectric element t) may be applied.

[0131] Another example of a medical device to which the thermoelectric element according to the embodiment of the present invention is applied is a photodetector. Here, the photodetector is an infrared / ultraviolet detector, a CCD (Charge Coupled Device) sensor, X-ray detector, TTRS (Thermoelectric Thermal Reference Source, etc. Photodetector cooling (co For this purpose, a Peltier thermoelectric element can be applied. This prevents wavelength changes, output reductions, and resolution degradation caused by temperature rises in the optical fiber. .

[0132] Another example of a medical device application of the thermoelectric element according to the embodiment of the present invention is immunoassay. Immunoassay field, In vitro Diagnos tics field, temperature control and cooling systems (general temperature e control and cooling systems), physical therapy field, liquid Chiller systems, blood / plasma temperature control fields, etc. Along with this, precise temperature control is possible.

[0133] Another example of a thermoelectric element according to an embodiment of the present invention being applied to a medical device is an artificial heart. This allows power to be supplied to the artificial heart.

[0134] Examples of applications of thermoelectric elements according to embodiments of the present invention in the aerospace industry include star tracking systems. , thermal imaging camera, infrared / ultraviolet detector, CCD sensor, Hubble Space Telescope, TTRS, etc. This helps maintain the temperature of the image sensor.

[0135] Other examples of applications of the thermoelectric element according to the embodiment of the present invention in the aerospace industry include cooling devices, There are heaters, generators, etc.

[0136] In addition, the thermoelectric element according to the embodiment of the present invention can be used in other industrial fields such as power generation, cooling and heating. May be applied for heat.

[0137] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will appreciate that The reader is free to make and use the full range of the present invention as defined by the following claims without departing from the spirit and scope of the present invention. It will be understood that the present invention is susceptible to numerous modifications and variations. [Explanation of symbols]

[0138] C: Cooling section 10: Thermoelectric module 110: First metal substrate 111: First through hole 112: First hole placement area 120: 1st resin layer 130: a plurality of first electrodes 140: Multiple P-type thermoelectric legs 150: Multiple N-type thermoelectric legs 160: A plurality of second electrodes 170: Second resin layer 180: Second metal substrate 181: Second through hole 182: Second hole placement area 190: Fastening member 200:Insulation material 220: Heat sink 230: Connecting member

Claims

1. a first metal substrate including a first through hole; a first insulating layer disposed on the first metal substrate; a first electrode portion disposed on the first insulating layer and including a plurality of first electrodes and a terminal electrode; a plurality of thermoelectric legs disposed on the first electrode portion; a second electrode portion including a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second insulating layer disposed on the second electrode portion; and a second metal substrate disposed on the second insulating layer and including a second through hole; the first metal substrate includes an effective area in which a first electrode portion is disposed and an outer area formed on the outer periphery of the effective area, the second metal substrate includes an effective area in which a second electrode portion is disposed and an outer area formed on the outer periphery of the effective area, the first through-hole occupies a portion of the effective area of ​​the first metal substrate; the second through-hole occupies a portion of the effective area of ​​the second metal substrate; the first through-hole and the second through-hole are formed at positions corresponding to each other, an area of ​​an outer region of the first metal substrate is larger than an area of ​​an outer region of the second metal substrate; the first metal substrate includes a first hole arrangement region, which is a space defined by an imaginary line connecting surfaces of first electrodes that are most adjacent to the first through hole and are disposed adjacent to each other, the surfaces being most adjacent to the first through hole; the second metal substrate includes a second hole arrangement region, which is a space formed by an imaginary line connecting surfaces of second electrodes that are most adjacent to the second through hole and are disposed adjacent to each other, the surfaces being most adjacent to the second through hole; A thermoelectric module, wherein the shortest distance between the first through-hole and the first electrode in the first hole arrangement region is greater than the shortest distance between the second through-hole and the second electrode in the second hole arrangement region.

2. The thermoelectric module of claim 1 , further comprising a fastening member passing through the first through-hole and the second through-hole to fasten the first metal substrate and the second metal substrate together.

3. a direction in which some of the first electrodes arranged on the first metal substrate are arranged is different from a direction in which some of the first electrodes are arranged on the first metal substrate; The thermoelectric module according to claim 1 , wherein a direction in which some of the second electrodes arranged on the second metal substrate are arranged is different from a direction in which the remaining second electrodes are arranged.

4. 4. The thermoelectric module according to claim 3, wherein at least two of the plurality of first electrodes excluding the edge regions are arranged such that their longitudinal directions are in a second direction perpendicular to the first direction, and the remaining electrodes are arranged such that their longitudinal directions are in the first direction.

5. The thermoelectric module according to claim 4 , wherein at least one first electrode adjacent to the first hole arrangement region has a longitudinal direction aligned with the second direction.

6. The thermoelectric module according to claim 5 , wherein the at least one first electrode is arranged so as to at least partially overlap with an imaginary space formed by an extension line extending from an imaginary line defining the first hole arrangement region.

7. The thermoelectric module of claim 1 , further comprising a third through hole disposed in an outer region of the first metal substrate.

8. The thermoelectric module of claim 2 further comprising an insulating insert positioned adjacent the fastener.

9. The thermoelectric module of claim 8 , wherein the diameter of the first through hole and the diameter of the second through hole are different from each other.

10. The thermoelectric module of claim 9 , wherein a portion of the insulating insert member is disposed within the second through hole.

11. The thermoelectric module of claim 1 , further comprising a third insulating layer disposed between the first metal substrate and the first insulating layer.

12. 2. The thermoelectric module according to claim 1, having a withstand voltage characteristic of being maintained without dielectric breakdown under an AC voltage of 1 kV to 2.5 kV and a current of 1 mA for 10 seconds.

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