Packaging film and packaging

Abstract

To provide a packaging film and a package that can be produced without a solvent, have excellent adhesiveness to a barrier material, and can form a package with high impact resistance.SOLUTION: There is provided a packaging film 1, including: a barrier material 20; and adhesive layers 30 and 32 laminated on at least one surface of the barrier material 20, wherein the adhesive layers 30 and 32 are cured products of an adhesive layer composition, the adhesive layer composition contains a base polymer, an epoxy component, and a curing agent, and a content of the base polymer is 50 mass% or more relative to a total mass of the adhesive layer composition, and a content of the epoxy component is more than 0.1 mass% and 30 mass% or less relative to the total mass of the adhesive layer composition, and a content of the curing agent is 0.5 mass% or more and 20 mass% or less relative to the total mass of the adhesive layer composition.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a packaging film and a packaging body. [Background technology]

[0002] Barrier laminate films, which contain barrier materials such as aluminum foil as a component, are widely used as packaging films. In barrier laminate films, the layers are bonded together using thermoplastic resins as adhesive resin layers or reactive-curing adhesives as adhesive layers.

[0003] In recent years, as environmental issues such as global warming become more prevalent worldwide, there has been a growing demand for packaging to reduce its environmental impact. One way to reduce environmental impact is to reduce the emission of volatile organic compounds (VOCs). For example, Patent Document 1 proposes a laminated film using a solvent-free adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-254137 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when solvent-free adhesives are used, there is a problem that they have poorer adhesion to barrier materials than solvent-based adhesives, and as a result, packages using solvent-free adhesives have poor impact resistance.

[0006] The present invention has been made in view of the above circumstances, and aims to provide a packaging film and a packaging material that can be produced without a solvent, have excellent adhesion to a barrier material, and can form a packaging material with high impact resistance. [Means for solving the problem]

[0007] That is, the packaging film of the present invention has the following configuration. [1] A barrier material and an adhesive layer located on at least one surface of the barrier material, the adhesive layer is a cured product of a composition for adhesive layer, The adhesive layer composition includes a base polymer, an epoxy component, and a curing agent, the content of the base polymer is 50% by mass or more relative to the total mass of the composition for adhesive layer, the content of the epoxy component is more than 0.1% by mass and 30% by mass or less with respect to the total mass of the composition for adhesive layer, The film for packaging, wherein the content of the curing agent is 0.5% by mass or more and 20% by mass or less with respect to the total mass of the composition for the adhesive layer. [2] The packaging film according to [1], wherein the base polymer is one or more resins selected from polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, polyacrylonitrile, and ionomer. [3] The film for packaging according to [1] or [2], wherein the barrier material is aluminum foil or a vapor-deposited film. [4] The film for packaging according to any one of [1] to [3], wherein the epoxy component is a compound that undergoes ring-opening at 80°C or higher. [5] The film for packaging according to any one of [1] to [4], wherein the adhesive layer has a melt flow rate of 0.5 to 50 g / 10 min. [6] The film for packaging according to any one of [1] to [5], wherein the curing agent is an acid anhydride. [7] The film for packaging according to any one of [1] to [6], further comprising a sealant material on the adhesive layer.

[0008] [8] A package produced using the film for packaging according to any one of [1] to [7]. [Effects of the Invention]

[0009] The packaging film of the present invention can be produced without using a solvent, and can form packaging that has excellent adhesion to barrier materials and high impact resistance. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view of a packaging film according to a first embodiment of the present invention. [Figure 2] FIG. 3 is a cross-sectional view of a packaging film according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] The packaging film of the present invention comprises a barrier material and an adhesive layer located on at least one surface of the barrier material. The adhesive layer of the present invention is a cured product of a composition for an adhesive layer, and the composition for an adhesive layer contains a base polymer, an epoxy component, and a curing agent.

[0012] [First embodiment] <Packaging film> A packaging film according to a first embodiment of the present invention will be described with reference to the drawings. 1 is formed by laminating a substrate 10, a first adhesive layer 30, a barrier material 20, a second adhesive layer 32, and a sealant material 40 in this order. That is, the packaging film 1 comprises the barrier material 20, and the first adhesive layer 30 and the second adhesive layer 32, which are located on both sides of the barrier material 20. The packaging film 1 comprises the sealant material 40 on the surface of the second adhesive layer 32 facing the barrier material 20.

[0013] The oxygen permeability of the packaging film 1 is 4.0 mL / (m 2 ·day), and 2.0mL / (m 2 ·day), and less than 1.0 mL / (m 2·day) is more preferable. When the oxygen permeability of the film 1 for packaging is less than the above upper limit, the film 1 for packaging has excellent oxygen barrier properties. The lower the oxygen permeability of the film 1 for packaging, the more preferable it is, and the lower limit of the oxygen permeability is 0 mL / (m 2 ·day) is preferred. The oxygen permeability of the packaging film 1 can be measured in accordance with the test method for oxygen gas permeability using an electrolytic sensor method described in Appendix A of JIS K7126-2:2006. The oxygen permeability of the packaging film 1 can be adjusted by the material and thickness of the barrier material 20, and a combination thereof.

[0014] The water vapor permeability of the packaging film 1 is 4.0 g / (m 2 ·day), and less than 2.0g / (m 2 ·day), and less than 1.0g / (m 2 ·day) is more preferable. When the water vapor permeability of the film 1 for packaging is less than the above upper limit, the film 1 for packaging has excellent water vapor barrier properties. The lower the water vapor permeability of the film 1 for packaging, the more preferable it is, and the lower limit of the water vapor permeability is 0 g / (m 2 ·day) is preferred. The water vapor permeability of the packaging film 1 can be measured in accordance with the test method described in the moisture sensor method of JIS K7129:2008 under test condition 1 described in Table A.1. The water vapor permeability of the packaging film 1 can be adjusted by the material and thickness of the barrier material 20, and a combination thereof.

[0015] The residual solvent amount of the packaging film 1 is 5.0 mg / m 2 Less than 2.0 mg / m is preferred 2 Less than 1.0 mg / m is more preferable. 2 The following is even more preferable: When the amount of residual solvent in the packaging film 1 is equal to or less than the above upper limit, the odor of the solvent can be further reduced. The amount of residual solvent in the packaging film 1 can be measured, for example, using a capillary gas chromatograph. The amount of residual solvent in the packaging film 1 can be adjusted by the material of the barrier material 20, the material of the first adhesive layer 30, the material of the second adhesive layer 32, the conditions of the heat treatment, and a combination of these.

[0016] The thickness T1 of the packaging film 1 is not particularly limited, but is preferably 35 to 250 μm, more preferably 40 to 200 μm, and even more preferably 50 to 150 μm. When the thickness T1 is equal to or greater than the above lower limit, the strength of the packaging film 1 is increased. When the thickness T1 is equal to or less than the above upper limit, the flexibility of the packaging film 1 is increased, making it easier to handle. The thickness T1 of the packaging film 1 can be measured, for example, with a thickness gauge.

[0017] <Base material> The substrate 10 may be a resin film. Examples of resin films include polyester films, polyolefin films, polyamide (PA) films, cellophane, and laminates thereof. Examples of polyester films include polyethylene terephthalate (PET), biaxially oriented PET, and polybutylene terephthalate (PBT). Examples of polyolefin films include polypropylene (PP), biaxially oriented polypropylene (OPP), non-oriented polypropylene (CPP), high density polyethylene (HDPE), and medium density polyethylene (MDPE). An example of a polyamide (PA) film is biaxially oriented nylon (ONY). Examples of the laminate include a laminate of the above-mentioned resin films. The substrate 10 is preferably made of PET, biaxially oriented PET, PP, OPP, or PA, and more preferably made of biaxially oriented PET or ONY, as these materials can further increase the strength of the packaging film 1. The substrate 10 may be printed on its surface or between layers.

[0018] The substrate 10 preferably has an orientation degree α in the MD direction (machine direction during film production) of 0.5 to 2.5, more preferably 0.7 to 2.0, and even more preferably 1.0 to 1.5. When the orientation degree α is equal to or greater than the above lower limit, the packaging film 1 has better water vapor barrier properties. When the orientation degree α is equal to or less than the above upper limit, the impact resistance of a package produced from the packaging film 1 can be further improved. The substrate 10 preferably has a degree of orientation β in the TD direction (direction perpendicular to the MD direction) of 0.2 to 2.5, more preferably 0.5 to 2.0, and even more preferably 0.7 to 1.5. When the degree of orientation β is equal to or greater than the above lower limit, the packaging film 1 has better water vapor barrier properties. When the degree of orientation β is equal to or less than the above upper limit, the impact resistance of a package made from the packaging film 1 can be further improved. The ratio expressed as the degree of orientation α / the degree of orientation β is preferably from 0.5 to 2.0, more preferably from 0.5 to 1.5.

[0019] The degrees of orientation α and β are calculated from values ​​measured by an infrared dichroism method. The degree of orientation is measured by the transmission method using linearly polarized light, in which the electric field of the light oscillates only in a certain direction, in an infrared spectrophotometer. The measurement method is to first perform a BKG (background) measurement with the polarizer angle set to 0° (the electric field is oriented vertically), then align the sample stretching direction to the vertical direction and measure the absorbance (at this point, the polarization direction and the stretching axis are parallel). The obtained value is the absorbance "A / / ". Next, rotate the sample by 90°, and measure the absorbance with the stretch axis of the sample perpendicular to the polarization direction. The obtained value is the absorbance "A⊥". The ratio of two absorbances, A / / and A⊥, obtained with polarized light parallel and perpendicular to the stretching axis of the sample is taken as the degree of orientation. The measurement wave number in the infrared dichroism method is selected appropriately depending on the material to be measured (see "Molecular Orientation by Infrared Dichroism Method" by Yasuji Kobayashi, "Polymer" in the Journal of the Society of Polymer Science, Vol. 15, No. 175, pp. 877-883). The degree of orientation can be easily determined from the tensile modulus measured in accordance with JIS K7127:1999.

[0020] Thickness T of the substrate 10 10 is determined taking into consideration the material, configuration, etc., and is, for example, preferably 5 to 100 μm, more preferably 10 to 50 μm. 10 When the thickness T of the substrate 10 is equal to or greater than the lower limit, the strength of the packaging film 1 is increased. 10 When the value is equal to or less than the upper limit, the flexibility of the packaging film 1 is increased, making it easier to handle. Thickness T of the substrate 10 10 can be measured, for example, with a thickness gauge.

[0021] <Barrier material> The barrier material 20 has oxygen barrier properties and water vapor barrier properties. When the packaging film 1 has oxygen barrier properties and water vapor barrier properties, deterioration and changes in the contents can be further suppressed when the packaging film 1 is used as a package. Examples of the barrier material 20 include aluminum foil, ethylene-vinyl alcohol polymer (EVOH), polyvinylidene chloride (PVDC), and acrylic-coated PET in which EVOH or the like is applied to PET. The barrier material 20 is preferably aluminum foil because it has superior oxygen barrier properties and water vapor barrier properties.

[0022] Thickness T of barrier material 20 20 The thickness T of the barrier material 20 is determined in consideration of the material and the configuration, and is preferably 3 to 20 μm, and more preferably 5 to 15 μm. 20 When the thickness T of the barrier material 20 is equal to or greater than the lower limit, the oxygen barrier property and the water vapor barrier property can be further improved. 20 When the value is equal to or less than the upper limit, the flexibility of the packaging film 1 is increased, making it easier to handle. Thickness T of barrier material 20 20 can be measured, for example, with a thickness gauge.

[0023] <First adhesive layer> The first adhesive layer 30 is a cured product of the adhesive layer composition. Here, the term "cured product" refers to a product that has sufficiently cured so that the adhesive layer composition does not stick to the hand when touched. By providing the first adhesive layer 30 to the film for packaging 1, the adhesiveness to the barrier material 20 can be improved, and the impact resistance when the film for packaging 1 is used as a package can be further improved. The adhesive layer composition contains a base polymer, an epoxy component, and a curing agent. The adhesive layer composition does not contain a solvent, which reduces the odor of the packaging film 1. In addition, the adhesive layer composition does not contain VOCs, which reduces the environmental impact when producing packaging.

[0024] (base polymer) The base polymer is the polymer that constitutes the first adhesive layer 30 . Examples of the base polymer include one or more resins selected from polyethylene (PE), polypropylene (PP), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), ethylene-acrylic acid copolymer (EAA), polyacrylonitrile (PAN), and ionomers. Examples of polyethylene include the above-mentioned HDPE and MDPE, as well as low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). Examples of polypropylene include the above-mentioned OPP and CPP. Ionomers are synthetic resins that utilize the cohesive force of metal ions to form aggregates of polymers. Examples of ionomers include ethylene-based ionomers, which combine acrylic acid or methacrylic acid with ethylene, as well as urethane-based ionomers, styrene-based ionomers, and ionomers using fluorine-based polymers. Examples of metal ions used in ionomers include sodium ions and zinc ions. Commercially available ionomers include, for example, SURLYN (registered trademark) ionomers manufactured by Dow Chemical Japan Ltd.

[0025] As the base polymer, LDPE and EEA are preferred because they have excellent adhesion to the barrier material 20. Furthermore, LDPE and PP are preferred as the base polymer because they can be used as a sealant material. These base polymers may be used alone or in combination of two or more.

[0026] The content of the base polymer is 50% by mass or more, preferably 50 to 99% by mass, more preferably 75 to 98% by mass, and even more preferably 85 to 95% by mass, based on the total mass of the adhesive layer composition. When the content of the base polymer is equal to or greater than the above-mentioned lower limit, the impact resistance of the packaging film 1 when used as a package can be further improved. When the content of the base polymer is equal to or less than the above-mentioned upper limit, the adhesion to the barrier material 20 can be further improved.

[0027] (epoxy component) The epoxy component is a compound having an epoxy group. By including the epoxy component, the adhesive layer composition of the present embodiment can further enhance the adhesiveness to the barrier material 20. Examples of the epoxy component include epoxy resin prepolymers such as a copolymer of bisphenol A and epichlorohydrin, and a copolymer of bisphenol F and epichlorohydrin. As the epoxy component, a copolymer of bisphenol A and epichlorohydrin is preferred because it can improve the brittleness of the first adhesive layer 30 . The epoxy component may be used alone or in combination of two or more.

[0028] When the epoxy component is heated in the presence of a curing agent, it undergoes ring-opening and polymerization, accelerating curing. The ring-opening temperature of the epoxy component is preferably 80°C or higher, more preferably 150°C or higher, and even more preferably 200°C or higher. When the ring-opening temperature of the epoxy component is equal to or higher than the above lower limit, the ring-opening reaction can be inhibited from proceeding at low temperatures (for example, 60°C or lower), and the adhesion to the barrier material 20 can be further improved. The upper limit of the ring-opening temperature of the epoxy component is not particularly limited, but is, for example, 350°C. The ring-opening temperature of the epoxy component corresponds to the heating temperature during the heat treatment.

[0029] The content of the epoxy component is more than 0.1 mass % and not more than 30 mass %, preferably 1 to 20 mass %, and more preferably 5 to 15 mass %, relative to the total mass of the composition for adhesive layer. When the content of the epoxy component is equal to or greater than the above-mentioned lower limit, the adhesion to the barrier material 20 can be further improved. When the content of the epoxy component is equal to or less than the above-mentioned upper limit, the brittleness of the first adhesive layer 30 can be improved, and the impact resistance when the packaging film 1 is used as a package can be further improved.

[0030] (hardening agent) The curing agent is a compound that promotes the curing of the adhesive layer composition. The adhesive layer composition of this embodiment contains a curing agent, which promotes the curing of the adhesive layer composition and turns into a cured product. The first adhesive layer 30 of this embodiment is a cured product obtained by ring-opening polymerization of the epoxy component, so it does not melt even in an environment of, for example, about 50°C, and has excellent adhesiveness and heat resistance. Examples of the curing agent include acid anhydrides and polyamines. Examples of acid anhydrides include carboxylic acid anhydrides, sulfuric acid anhydrides, nitric acid anhydrides, and phosphoric acid anhydrides. Examples of carboxylic acid anhydrides include maleic anhydride, acetic anhydride, succinic anhydride, phthalic anhydride, and benzoic anhydride. Examples of polyamines include putrescine, spermidine, and spermine. As the curing agent, acid anhydrides are preferred, carboxylic acid anhydrides are more preferred, and maleic anhydride and phthalic anhydride are even more preferred, as they can further accelerate the curing of the epoxy component. The curing agent may be used alone or in combination of two or more kinds.

[0031] The content of the curing agent is preferably 0.5% by mass or more and 20% by mass or less, more preferably 1% by mass or more and 15% by mass or less, and even more preferably 5% by mass or more and 10% by mass or less, relative to the total mass of the adhesive layer composition. When the content of the curing agent is equal to or more than the above-mentioned lower limit, the adhesion to the barrier material 20 can be further improved. When the content of the curing agent is equal to or less than the above-mentioned upper limit, the impact resistance of the packaging film 1 when used as a package can be further improved.

[0032] The adhesive layer composition of this embodiment may contain a curing agent, so that the base polymer becomes a modified polymer. Examples of modified polymers include acid anhydride-modified polyolefins such as acid anhydride-modified polyethylene and acid anhydride-modified polypropylene, acid anhydride-modified EVA, acid anhydride-modified EEA, acid anhydride-modified EAA, acid anhydride-modified polyacrylonitrile, and acid anhydride-modified ionomers. Examples of the reaction product between a polyamine and an epoxy component include epoxy adducts of polyamine, Mannich reaction products, Michael reaction products, and thiourea reaction products.

[0033] The adhesive layer composition of this embodiment may contain components other than the base polymer, epoxy component, and curing agent, such as curing aids, antioxidants, UV absorbers, fillers, and various other additives typically used in resin compositions. Examples of the curing aid include phenols. When the composition for adhesive layer contains other components, the content of the other components is preferably, for example, 5% by mass or less relative to the total mass of the composition for adhesive layer. Furthermore, the adhesive layer composition preferably does not contain a solvent, as this can reduce the odor of the packaging film 1 and reduce the environmental impact during the production of the packaging. Examples of the solvent include organic solvents such as ethanol, acetone, toluene, and xylene. The content of the solvent is, for example, 2 per 5 mg / m 2 Less than 1 mg / m is preferred 2 Less than 0 mg / m is more preferable.2 is most preferred.

[0034] The melt flow rate (MFR) of the first adhesive layer 30 is preferably 0.5 to 50 g / 10 min, more preferably 1 to 30 g / 10 min, and even more preferably 5 to 20 g / 10 min. When the MFR of the first adhesive layer 30 is equal to or greater than the above lower limit, the adhesion to the barrier material 20 can be further improved. When the MFR of the first adhesive layer 30 is equal to or less than the above upper limit, the impact resistance of the packaging film 1 when used as a package can be further improved. In addition, when the MFR of the first adhesive layer 30 is equal to or less than the above upper limit, the first adhesive layer 30 can be prevented from protruding from between the layers, improving the appearance of the packaging film 1. The MFR of the first adhesive layer 30 is determined in accordance with the method described in JIS K7210-1:2014 (ISO 1133-1:2011) "Plastics - Determination of melt mass-flow rate (MFR) and melt volume-flow rate (MVR) of thermoplastics - Part 1: Standard test method." When the base polymer is PE, it is measured at a test temperature of 190°C and a test load of 2.16 kg. When the base polymer is PP, it is measured at a test temperature of 230°C and a test load of 2.16 kg. When the base polymer is EEA, it is measured at a test temperature of 190°C and a test load of 2.16 kg. When the base polymer is polyisocyanate, it is measured at a test temperature of 190°C and a test load of 2.16 kg.

[0035] The first adhesive layer 30 has a wavelength of 910 cm by infrared absorption spectroscopy (IR). -1 It is preferable to recognize the presence of an absorption peak at a wave number of 910 cm by IR. -1 The absorption peak at is an absorption peak derived from the epoxy group. IR wave number 910cm -1 The presence of an absorption peak at 1000 kJ / cm2 indicates the presence of excess epoxy components remaining after the curing reaction. This means that the epoxy components undergo ring-opening upon heating, allowing the curing reaction with the curing agent to proceed sufficiently, thereby strengthening the adhesion to the barrier material 20. On the other hand, the IR wave number is 910 cm -1If no absorption peak is observed at 1000 kJ / cm2, it means that the epoxy component is consumed before reacting with the curing agent, the curing reaction is not sufficient, and strong adhesive strength cannot be obtained.

[0036] The thickness T of the first adhesive layer 30 30 The thickness T of the first adhesive layer 30 is, for example, preferably 1 to 10 μm, more preferably 2 to 8 μm, and even more preferably 2 to 4 μm. 30 When the thickness T of the first adhesive layer 30 is equal to or greater than the lower limit, the adhesiveness to the barrier material 20 can be further improved. 30 When the value is equal to or less than the upper limit, the impact resistance of the packaging film 1 when used as a packaging material can be further improved. The thickness T of the first adhesive layer 30 30 is determined by observing a cross section of the packaging film 1 in the thickness direction using a microscope or the like.

[0037] <Second adhesive layer> The second adhesive layer 32 is a cured product of an adhesive layer composition. By having the second adhesive layer 32, the packaging film 1 can sufficiently bond the barrier material 20 and the sealant material 40, thereby further increasing the impact resistance when the packaging film 1 is used as a package. The composition of the adhesive layer composition in the second adhesive layer 32 is the same as the composition of the adhesive layer composition in the first adhesive layer 30 .

[0038] The MFR of the second adhesive layer 32 is similar to the MFR of the first adhesive layer 30 . The MFR of the second adhesive layer 32 may be the same as or different from the MFR of the first adhesive layer 30 .

[0039] The thickness T of the second adhesive layer 32 32 is the thickness T of the first adhesive layer 30 30 is the same as: The thickness T of the second adhesive layer 32 32 is the thickness T of the first adhesive layer 30 30 It may be the same as or different from.

[0040] <Sealant material> The sealant 40 is a material that improves the sealing properties when the packaging film 1 is made into a bag, and further improves the impact resistance when the packaging film 1 is used to make a package. The sealant material 40 may be a resin similar to the base polymer in the adhesive layer composition described above. As the sealant material 40, LDPE and EEA are preferred because they have excellent adhesiveness to the barrier material 20. Furthermore, as the sealant material 40, LDPE and PP are preferred because they can further enhance the sealing property.

[0041] Sealant material thickness T 40 The thickness T of the sealant material 40 is determined in consideration of the material, the configuration, and the like, and is, for example, preferably 5 to 100 μm, more preferably 5 to 90 μm, further preferably 10 to 80 μm, and particularly preferably 10 to 50 μm. 40 When the thickness T of the sealant material 40 is equal to or greater than the lower limit, the sealing property of the film for packaging 1 can be further improved. 40 When the value is equal to or less than the upper limit, the flexibility of the packaging film 1 is increased, making it easier to handle. Sealant material thickness T 40 can be measured, for example, with a thickness gauge.

[0042] <<Method for manufacturing packaging film>> The method for manufacturing the packaging film 1 includes a step of obtaining the substrate 10 (substrate manufacturing step), a step of obtaining the sealant material 40 (sealant material manufacturing step), a step of laminating the substrate 10, the barrier material 20, and the sealant material 40 via an adhesive layer to obtain a laminate (laminate manufacturing step), and a step of subjecting the laminate to a heat treatment (heat treatment step).

[0043] <Base material manufacturing process> The method for obtaining the substrate 10 in the substrate manufacturing process is selected from conventionally known methods such as inflation, T-die, and co-extrusion depending on the material and configuration of the substrate 10 .

[0044] <Sealant manufacturing process> The method for obtaining the sealant 40 in the sealant manufacturing process is selected from conventionally known methods such as inflation, T-die, and co-extrusion depending on the material and configuration of the sealant 40 .

[0045] <Laminate manufacturing process> In the laminate manufacturing process, a laminate is manufactured of the substrate 10, the barrier material 20, and the sealant material 40. The method for laminating the substrate 10, the barrier material 20, and the sealant material 40 in the laminate manufacturing process is selected from conventionally known methods, such as a dry lamination method. In the dry lamination method, for example, an adhesive layer composition is applied to the surface of the barrier material 20 to be laminated, the substrate 10 and the barrier material 20 are laminated together with the adhesive layer composition interposed therebetween, the adhesive layer composition is applied to the sealant material 40, the barrier material 20 and the sealant material 40 are laminated together with the adhesive layer composition interposed therebetween, and the layers are pressure-bonded to obtain a laminate. The obtained laminate is then wound up, for example, into a roll.

[0046] <Heat treatment process> After producing the laminate as described above, the laminate is subjected to a heat treatment in the heat treatment step. By subjecting the laminate to a heat treatment, the curing of the adhesive layer composition is sufficiently promoted, and the adhesion between the substrate 10 and the barrier material 20 and the adhesion between the barrier material 20 and the sealant material 40 are further improved. In addition, by subjecting the laminate to a heat treatment, the ring-opening polymerization of the epoxy component contained in the adhesive layer composition is sufficiently promoted, and a first adhesive layer 30 and a second adhesive layer 32 having excellent adhesion and heat resistance are obtained.

[0047] The temperature of the heat treatment is, for example, preferably 80°C or higher, more preferably 150°C or higher, and even more preferably 200°C or higher. When the heat treatment temperature is equal to or higher than the above-mentioned lower limit, the ring-opening reaction of the epoxy component contained in the composition for adhesive layer proceeds, sufficiently accelerating the curing of the composition for adhesive layer, and further improving the adhesion between the substrate 10 and the barrier material 20 and the adhesion between the barrier material 20 and the sealant material 40. The upper limit of the heat treatment temperature is determined from the viewpoint of preventing heat damage to each layer constituting the laminate, and is, for example, 350°C or lower.

[0048] The heat treatment time is, for example, preferably 3 to 60 seconds, more preferably 3 to 30 seconds, and even more preferably 5 to 15 seconds. When the heat treatment time is equal to or greater than the above-mentioned lower limit, curing of the adhesive layer composition is sufficiently promoted, further improving the adhesion between the substrate 10 and the barrier material 20 and the adhesion between the barrier material 20 and the sealant material 40. When the heat treatment time is equal to or less than the above-mentioned upper limit, damage to the layers constituting the laminate due to heat can be prevented, and deterioration of the oxygen barrier property and water vapor barrier property of the packaging film 1 can be further prevented. The heat treatment of the laminate can be carried out using a hot air blowing device or the like provided in the production line of the packaging film 1.

[0049] By subjecting the laminate to a heat treatment, the curing of the adhesive layer composition is sufficiently promoted, and a packaging film 1 is obtained in which a first adhesive layer 30 is formed between the substrate 10 and the barrier material 20, and a second adhesive layer 32 is formed between the barrier material 20 and the sealant material 40.

[0050] In addition to the steps described above, the method for manufacturing a packaging film may also include a printing step of providing a printed layer (not shown) on the substrate 10 in order to impart a predetermined appearance to the packaging film. The printing process is not particularly limited, and various printing methods such as offset printing, gravure printing, flexographic printing, screen printing, and inkjet printing can be used.

[0051] ≪Packaging body≫ The packaging body of this embodiment is a bag made from the packaging film 1 of this embodiment. The packaging body may be, for example, a bag made by heat-sealing the sealant materials 40 of the packaging film 1 together. Examples of the form of the package include a palm-sealed bag, a three-side sealed bag, a four-side sealed bag, a gusset bag, a stand-up bag, and bags with zippers attached to these bags. Another example of a packaging body is a container that includes a container body having an opening and a lid body made of packaging film 1, with sealant material 40 abutting the periphery of the opening of the container body and heat-sealing the packaging film 1 to the container body. In this case, polypropylene is preferred as the material for the container body from the viewpoint of ease of recycling.

[0052] As described above, the packaging film 1 of this embodiment includes the barrier material 20, and therefore has excellent oxygen barrier properties and water vapor barrier properties. The adhesive layer composition of this embodiment does not contain an organic solvent, which reduces odor and reduces the environmental impact when producing a package. The adhesive layer composition forming the first adhesive layer 30 contains specific amounts of a base polymer, an epoxy component, and a curing agent. This reduces the brittleness of the first adhesive layer 30, and the packaging film 1 has sufficient strength. In addition, the first adhesive layer 30 has excellent heat resistance. Since the packaging film 1 includes the first adhesive layer 30, the adhesiveness to the barrier material 20 can be further improved. The adhesive layer composition forming the second adhesive layer 32 contains specific amounts of a base polymer, an epoxy component, and a curing agent. This reduces the brittleness of the second adhesive layer 32, and the packaging film 1 has sufficient strength. In addition, the second adhesive layer 32 has excellent heat resistance. Since the packaging film 1 includes the second adhesive layer 32, the adhesiveness between the barrier material 20 and the sealant material 40 can be further improved. Since the packaging film 1 includes the first adhesive layer 30 and the second adhesive layer 32, a package made from the packaging film 1 has excellent impact resistance. The packaging film 1 of this embodiment does not require a drying process and can be manufactured using existing processing equipment. This allows for stable production and eliminates the need for investment in new equipment such as a drying oven, making it highly economical.

[0053] [Second embodiment] <Packaging film> A packaging film according to a second embodiment of the present invention will be described with reference to the drawings. 2 is obtained by laminating an adhesive layer 34 onto a barrier material 22. That is, the packaging film 2 includes the barrier material 22 and the adhesive layer 34 located on one side of the barrier material 22. The adhesive layer 34 is a cured product of a composition for an adhesive layer, similar to the first embodiment. This embodiment differs from the first embodiment in that the barrier material 22 also serves as the substrate.

[0054] The thickness T2 of the packaging film 2 is not particularly limited, but is preferably 35 to 200 μm, more preferably 40 to 150 μm, and even more preferably 50 to 100 μm. When the thickness T2 is equal to or greater than the above lower limit, the strength of the packaging film 2 is increased. When the thickness T2 is equal to or less than the above upper limit, the flexibility of the packaging film 2 is increased, making it easier to handle. The thickness T2 of the packaging film 2 can be measured, for example, with a thickness gauge.

[0055] The oxygen permeability, water vapor permeability and residual solvent amount of the film for packaging 2 are the same as those of the film for packaging 1.

[0056] The barrier material 22 is a material that serves as both the substrate 10 and the barrier material 20 in the first embodiment. Examples of the barrier material 22 include a vapor-deposited film in which aluminum, silica, or the like is vapor-deposited on a resin film similar to the substrate 10, such as a polyester film, a polyolefin film, a polyamide film, cellophane, or a laminate thereof. Among these vapor-deposited films, metal-deposited PET, in which metal is vapor-deposited on PET, is preferred because it has better oxygen barrier properties and water vapor barrier properties, and aluminum-deposited PET, in which aluminum is vapor-deposited on PET (aluminum-deposited PET), is more preferred. The film for packaging 2 includes the barrier material 22, and therefore has excellent oxygen barrier properties and water vapor barrier properties.

[0057] Thickness T of the barrier material 2222 The thickness T of the barrier material 22 is determined in consideration of the material, the configuration, etc., and is preferably 5 to 100 μm, and more preferably 10 to 50 μm. 22 When the thickness T 22 When the thickness T of the barrier material 22 is equal to or greater than the lower limit, the water vapor barrier property of the film 2 for packaging can be improved. 22 When is equal to or less than the upper limit, the flexibility of the film for packaging 2 is increased, making it easier to handle. Thickness T of the barrier material 22 22 can be measured, for example, with a thickness gauge.

[0058] The adhesive layer 34 is a cured product of an adhesive layer composition. The composition of the adhesive layer composition in the adhesive layer 34 is the same as the composition of the adhesive layer composition in the first adhesive layer 30 . The MFR of adhesive layer 34 is similar to the MFR of first adhesive layer 30 . The MFR of adhesive layer 34 may be the same as or different from the MFR of first adhesive layer 30 .

[0059] Since the film for packaging 2 can be easily made into a bag, the adhesive layer 34 preferably functions as a sealant material. For this reason, the base polymer contained in the adhesive layer composition that forms the adhesive layer 34 is preferably LDPE or PP. These base polymers may be used alone or in combination of two or more.

[0060] Thickness T of adhesive layer 34 34 The thickness T of the adhesive layer 34 is determined in consideration of the material, the configuration, and the like, and is, for example, preferably 5 to 100 μm, more preferably 5 to 80 μm, and even more preferably 10 to 50 μm. 34 When the thickness T of the adhesive layer 34 is equal to or greater than the lower limit, the sealing property of the film for packaging 2 can be further improved. 34 When is equal to or less than the upper limit, the flexibility of the film for packaging 2 is increased, making it easier to handle. Thickness T of adhesive layer 34 34 is determined by observing a cross section of the packaging film 2 in the thickness direction using a microscope or the like.

[0061] <<Method for manufacturing packaging film>> The method for manufacturing the packaging film 2 includes a step of obtaining a barrier material 22 (barrier material manufacturing step), a step of laminating an adhesive layer composition onto the barrier material 22 to obtain a laminate (laminate manufacturing step), and a step of subjecting the laminate to a heat treatment (heat treatment step).

[0062] In the barrier material manufacturing process, first, a resin film is manufactured to serve as the base layer of the barrier material 22. The method for obtaining the resin film is the same as the method for obtaining the substrate 10. Next, a vapor deposition layer is formed on one side of the resin film. The method for forming a vapor deposition layer on the resin film is not particularly limited, and a conventionally known vacuum vapor deposition method can be applied (vapor deposition operation). In the vapor deposition operation, the degree of vacuum in the vapor deposition chamber is preferably 0.1 to 0.5 Pa, for example. In the vapor deposition operation, the transport speed of the resin film is preferably, for example, 100 to 400 m / min. By the vapor deposition operation, a vapor-deposited film (barrier material 22) is obtained in which a vapor-deposited layer is formed on one side of the resin film.

[0063] In the laminate manufacturing process, a laminate is obtained by applying a composition for an adhesive layer to the surface of the vapor-deposited layer of the barrier material 22. The obtained laminate is wound into a roll, for example.

[0064] Next, the laminate is subjected to a heat treatment (heat treatment step). The heating conditions (heating temperature, heating time) in the heat treatment step are the same as those in the first embodiment. By subjecting the laminate to a heat treatment, the curing of the adhesive layer composition is sufficiently promoted, and a packaging film 2 is obtained in which an adhesive layer 34 is formed on one surface of the barrier material 22.

[0065] In addition to the above-described steps, the method for manufacturing a packaging film may also include a printing step of providing a printed layer (not shown) on the barrier material 22 in order to give the packaging film a predetermined appearance. The printing process is not particularly limited, and various printing methods such as offset printing, gravure printing, flexographic printing, screen printing, and inkjet printing can be used.

[0066] ≪Packaging body≫ The packaging body of this embodiment is a bag made from the packaging film 2 of this embodiment. An example of the packaging body is a bag made by heat-sealing the adhesive layers 34 of the packaging film 2 together. The form of the package may be the same as the package of the first embodiment. Another example of a packaging body is a container that includes a container body having an opening and a lid body made of a packaging film 2, with an adhesive layer 34 abutting the periphery of the opening of the container body and heat-sealing the packaging film 2 to the container body. In this case, polypropylene is preferred as the material for the container body from the viewpoint of ease of recycling.

[0067] As described above, the film for packaging 2 of this embodiment includes the barrier material 22, and therefore has excellent oxygen barrier properties and water vapor barrier properties. The adhesive layer composition of this embodiment does not contain an organic solvent, which reduces odor and reduces the environmental impact when producing a package. The adhesive layer composition that forms the adhesive layer 34 contains specific amounts of a base polymer, an epoxy component, and a curing agent. This reduces the brittleness of the adhesive layer 34, and provides sufficient strength to the packaging film 2. In addition, the adhesive layer 34 has excellent heat resistance. The film for packaging 2 has the adhesive layer 34, which further enhances the adhesiveness to the barrier material 22. Since the film for packaging 2 has the adhesive layer 34, a package made from the film for packaging 2 has excellent impact resistance. The packaging film 2 does not require a drying process and can be manufactured using existing processing equipment. This allows for stable production and eliminates the need for investment in new equipment such as a drying oven, making it highly economical. The packaging film 2 has a simpler structure than the packaging film 1. Therefore, it is easier to manufacture than the packaging film 1 and has excellent productivity.

[0068] [Other embodiments] In the above embodiment, the substrate 10 is a single layer, but the present invention is not limited to this, and the substrate 10 may be a multi-layer substrate made up of two or more layers. In the above-described embodiment, the substrate 10 is a single layer, but the present invention is not limited to this, and a printed layer may be formed on one side of the substrate 10. By forming a printed layer on one side of the substrate 10, a predetermined appearance can be imparted to the packaging film, making the appearance more beautiful. In the above-described embodiment, the sealant material 40 is provided, but the present invention is not limited to this, and the second adhesive layer 32 may also function as the sealant material. [Example]

[0069] The present invention will be described below with reference to examples, but the present invention is not limited to the following examples. The materials and test conditions used in this example are as follows:

[0070] [Materials used] <Base material> PET: Biaxially oriented PET, Lumirror (registered trademark), manufactured by Toray Advanced Film Co., Ltd., thickness 12 μm. Ny: Biaxially oriented nylon (ONY), Harden (registered trademark), manufactured by Toyobo Co., Ltd., thickness 15 μm.

[0071] <Barrier material> ·Al: Aluminum foil, manufactured by UACJ Corporation, thickness 7 μm. Vapor-deposited PET: VM-PET (product name), manufactured by Toray Advanced Film Co., Ltd., thickness 12 μm.

[0072] <Adhesive layer composition> (base polymer) LDPE: Low-density polyethylene, trade name "Sumikathen (registered trademark)", manufactured by Sumitomo Chemical Co., Ltd. PP: Polypropylene, product name "Novatec (registered trademark) PP", manufactured by Japan Polypropylene Corporation. EEA: Ethylene-ethyl acrylate copolymer, product name "Rexpearl (registered trademark) EEA", manufactured by Mitsubishi Chemical Corporation. Polyisocyanate: Urethane prepolymer, product name "Takelac (registered trademark) E", manufactured by Mitsui Chemicals, Inc. (epoxy component) Epoxy resin prepolymer: Copolymer of bisphenol A and epichlorohydrin, product name "jER (registered trademark)", manufactured by Mitsubishi Chemical Corporation. (hardening agent) Maleic acid modified: Maleic anhydride modified polyolefin, trade name "Modic (registered trademark) PE", manufactured by Mitsubishi Chemical Corporation. Phthalic acid modified: Phthalic anhydride modified polyolefin, product name "Epoxy resin hardener", manufactured by Showa Denko Materials Co., Ltd. Polyamine: Mannich type, trade name "LUCKAMIDE (registered trademark)", manufactured by DIC Corporation.

[0073] <Sealant material> LDPE: Low-density polyethylene film, product name "V-1", manufactured by Tamapoly Co., Ltd., thickness 30 μm. LDPE: Low-density polyethylene film, product name "V-1", manufactured by Tamapoly Co., Ltd., thickness 40 μm. PP: Unstretched polypropylene film, Pylen (registered trademark) Film-CT (product name), manufactured by Toyobo Co., Ltd., thickness 30 μm.

[0074] [Examples 1 to 7, Comparative Examples 1 to 6] A laminate was obtained by applying an adhesive layer composition having the composition shown in Table 1 to a barrier material shown in Table 1, and laminating the substrate and sealant material shown in Table 1 on the laminate. This laminate was subjected to a heat treatment under the heat treatment conditions shown in Table 2 (heat treatment step) to produce packaging films according to the configurations of Examples 1 to 9 and Comparative Examples 1 to 6. However, in Comparative Examples 2 and 3, no heat treatment was performed. In Examples 2 and 9, the adhesive layer also functions as the sealant. In Example 9, the vapor-deposited PET also functions as the substrate. In the table, "AD" in the laminate configuration indicates an "adhesive layer," which is a cured product of the adhesive layer composition. However, in Comparative Example 6, "AD" was a layer in which the adhesive layer composition was not sufficiently cured. In the table, "PE" in the laminate configuration indicates a layer of low-density polyethylene (LDPE). In the table, "*PET" in the laminate configuration indicates vapor-deposited PET. In the table, "maleic acid modified" indicates that a modified polymer of a base polymer modified with maleic anhydride is contained in the content shown in Table 1. In the table, "phthalic acid modified" indicates that a modified polymer of a base polymer modified with phthalic anhydride is contained in the content shown in Table 1. In the table, "-" in the composition for the adhesive layer indicates that the component is not contained.

[0075] [Evaluation method] <Degree of hardening> The adhesive layer (first adhesive layer) was peeled off from the packaging film obtained in each example, and IR measurements were performed using an infrared spectrophotometer (Shimadzu Corporation, model number "IRAffinity-1S"). From the obtained spectral data, the wave number 910 cm originating from the epoxy group was -1 The IR measurement of the adhesive layer composition of each example was carried out in the same manner, and from the obtained spectrum data, the peak height h1 of the IR absorption peak at the wave number 910 cm attributed to the epoxy group was measured. -1 The peak height h2 of the IR absorption peak at wavenumber 910 cm -1The ratio (h1 / h2) of the peak height of the IR absorption peak in -1 was calculated. If the ratio h1 / h2 was less than 0.4, it was determined that the adhesive layer was sufficiently cured, and the degree of curing was designated as "◎". If the ratio h1 / h2 was 0.4 or more, it was determined that the adhesive layer was not sufficiently cured, and the degree of curing was designated as "×". The results are shown in Table 2. In the table, "-" indicates that the presence of the IR absorption peak at a wave number of 910 cm

[0076] <Amount of residual solvent> For the film for packages obtained in each example, the amount of residual solvent was measured using a capillary gas chromatograph. In all samples, the amount of residual solvent was 0 mg / m 2 The results are shown in Table 2.

[0077] <MFR of the adhesive layer > Using the composition for the adhesive layer of each example, the MFR of the adhesive layer was measured. The MFR of the adhesive layer was measured in accordance with the method described in JIS K7210-1:2014 "Plastics - Methods for determining the melt mass-flow rate (MFR) and melt volume-flow rate (MVR) of thermoplastics - Part 1: Standard test methods". When the base polymer was PE, it was measured under the conditions of a test temperature of 190°C and a test load of 2.16 kg. When the base polymer was PP, it was measured under the conditions of a test temperature of 230°C and a test load of 2.16 kg. When the base polymer was EEA, it was measured under the conditions of a test temperature of 190°C and a test load of 2.16 kg. When the base polymer was polyisocyanate, it was measured under the conditions of a test temperature of 190°C and a test load of 2.16 kg. The results are shown in Table 2.

[0078] <IR absorption peak> The adhesive layer (the first adhesive layer) was peeled off from the film for packages obtained in each example, and IR measurement was performed using an infrared spectrophotometer (manufactured by Shimadzu Corporation, model number "IRAffinity-1S"). From the obtained spectral data, the presence or absence of the IR absorption peak at a wave number of 910 cm -1 derived from the epoxy group was confirmed. The results are shown in Table 2.

[0079] <Adhesive strength> The adhesive strength of the packaging film obtained in each example was measured under the following conditions in accordance with JIS Z0238 "Bag Heat Seal Strength Test." The adhesive strength in the table is the average of the measurement results for five test pieces. Adhesion was evaluated based on the following evaluation criteria. The results are shown in Table 2. In the table, (a:b:c) indicates the location where fracture or peeling occurred in the packaging film. "a" indicates that fracture or peeling occurred between the substrate and the barrier material. "b" indicates that fracture or peeling occurred between the barrier material and the sealant material. "c" indicates that the sealant material was fractured. However, in Example 9, it means (b:c). "DB" in the table indicates that the packaging film did not fracture or peel even when the load reached 25 N / 15 mm. The numerical values ​​in the table indicate the load at the time of fracture or peeling, and "0" indicates that peeling occurred at that location immediately after pulling. <<Measurement conditions>> Test piece: 15mm wide. Measurement environment: 23°C, 50% RH. Measuring equipment: Strograph EL (manufactured by Toyo Seiki Seisakusho Co., Ltd.). Grip spacing: 50mm. Tensile speed: 300 mm / min.

[0080] Evaluation Criteria ◎: Was a DB at all positions. △: Breakage or peeling occurred between the barrier material and the sealant material, and other positions were "DB". ×: There was a "0" in any position.

[0081] <Oxygen permeability> The oxygen permeability of the packaging films obtained in each example was measured in accordance with the oxygen gas permeability test method using an electrolytic sensor described in Appendix A of JIS K7126-2:2006, and the oxygen barrier property was evaluated based on the following evaluation criteria. The results are shown in Table 2. Evaluation Criteria ◎: Oxygen permeability 1.0 mL / (m 2 Less than 1 day. ○: Oxygen permeability 1.0 mL / (m 2 ·day) or more 2.0mL / (m 2 Less than 1 day. △: Oxygen permeability 2.0mL / (m 2 ·day) or more 4.0mL / (m 2 Less than 1 day. ×: Oxygen permeability 4.0 mL / (m 2 ·day) or more.

[0082] <Water vapor permeability> For the packaging films obtained in each example, the water vapor permeability was measured under test condition 1 listed in Table A.1 in accordance with the test method described in the moisture sensor method of JIS K7129:2008, and the water vapor barrier property was evaluated based on the following evaluation criteria. The results are shown in Table 2. Evaluation Criteria ◎: Water vapor permeability 1.0g / (m 2 Less than 1 day. ○: Water vapor permeability 1.0 g / (m 2 ·day) or more 2.0g / (m 2 Less than 1 day. △: Water vapor permeability 2.0g / (m 2 ·day) or more 4.0g / (m 2 Less than 1 day. ×: Water vapor permeability 4.0 g / (m 2 ·day) or more.

[0083] <Impact strength> Using the packaging film obtained in each example, a 130 mm x 170 mm flat bag was produced. The flat bag was produced so that the MD direction of the packaging film was the longitudinal direction of the flat bag and the TD direction of the packaging film was the lateral direction of the flat bag. 180 g of water was placed in the flat bag, and the opening was heat-sealed (sealing temperature: 180°C, sealing time: 1 second, sealing pressure: 3.5 kg / cm). 2 The evaluation sample was sealed with a seal (seal width: 10 mm). The impact strength (impact resistance) of the evaluation sample was evaluated by a drop test. The drop test was conducted in accordance with JIS Z0200-8.5.5.2. The test conditions were as follows: The evaluation sample was placed vertically and dropped onto a concrete surface from a height of 120 cm. This operation was repeated three times. Of the 10 evaluation samples, the number of samples in which leakage of the contents was observed was counted and evaluated according to the following evaluation criteria. The results are shown in Table 2. ◎: Leakage was observed in 0 samples. ○: Leakage was observed in two or fewer samples. ×: Leakage was observed in 3 or more samples.

[0084] <Appearance> The packaging film obtained in each example was cut into a 20 cm x 20 cm square and folded in half. This procedure was repeated five times, and the appearance of the packaging film was visually inspected. If no adhesive layer composition was observed to protrude from between the layers, it was marked with "◎", and if adhesive layer composition was observed to protrude from between the layers, it was marked with "×". The results are shown in Table 2.

[0085] <Overall rating> Based on the results of the degree of curing, adhesion, oxygen barrier property, water vapor barrier property, impact resistance, and appearance evaluation, each example of packaging film was comprehensively evaluated according to the following evaluation criteria. The results are shown in Table 2. Films with an overall evaluation of "◎" or "○" were deemed to have passed. Evaluation Criteria ◎: All evaluation results are "◎". ○: The evaluation result has one or more "○" and no "×" in the evaluation result. ×: Any evaluation result is "×".

[0086] [Table 1]

[0087] [Table 2]

[0088] As shown in Table 2, the packaging films of Examples 1 to 9 to which the present invention was applied were overall rated as "◎" or "○", demonstrating that they had excellent oxygen barrier properties and water vapor barrier properties, excellent adhesion between the barrier material and the substrate, and could form packaging that was highly impact resistant. In contrast, Comparative Example 1, in which the content of the base polymer in the adhesive layer composition was outside the range of the present invention, was evaluated as "x" in impact resistance. Comparative Examples 2 and 3, in which the adhesive layer composition did not contain an epoxy component or a curing agent, showed a wave number of 910 cm -1 There was no IR absorption peak at wavenumber 910 cm, and the evaluations of impact resistance and appearance were "x". Comparative Example 4, in which the content of the curing agent in the adhesive layer composition was outside the range of the present invention, was evaluated as "x" for adhesion and impact resistance. Comparative Example 5, in which the content of the epoxy component in the adhesive layer composition was outside the range of the present invention, -1 In Comparative Example 6, in which the adhesive layer was insufficiently cured, the degree of curing, adhesiveness, and impact resistance were evaluated as "x."

[0089] From the above results, it was confirmed that by applying the present invention, it is possible to produce a packaging body without using a solvent, which has excellent adhesion between the barrier material and the substrate and is highly impact resistant. [Explanation of symbols]

[0090] 1, 2 Packaging film 10 Base material 20, 22 Barrier materials 30 adhesive layer (first adhesive layer) 32 adhesive layer (second adhesive layer) 34 Adhesive layer 40 Sealant

Claims

1. A barrier material and an adhesive layer located on at least one surface of the barrier material, the barrier material is aluminum foil or a vapor-deposited film, the adhesive layer is a cured product of a composition for adhesive layer, The adhesive layer composition includes a base polymer, an epoxy component, and a curing agent, the base polymer is one or more resins selected from polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, polyacrylonitrile, and ionomer; the content of the base polymer is 50% by mass or more relative to the total mass of the composition for adhesive layer, the content of the epoxy component is 5% by mass or more and 15% by mass or less with respect to the total mass of the composition for adhesive layer, the content of the curing agent is 0.5% by mass or more and 20% by mass or less with respect to the total mass of the composition for adhesive layer, The thickness of the adhesive layer is 1 μm or more and 10 μm or less.

2. 2. The packaging film according to claim 1, wherein the epoxy component is a compound that undergoes ring-opening at 80°C or higher.

3. 3. The packaging film according to claim 1, wherein the adhesive layer has a melt flow rate of 0.5 to 50 g / 10 min.

4. The packaging film according to any one of claims 1 to 3, wherein the curing agent is an acid anhydride.

5. The packaging film according to any one of claims 1 to 4, further comprising a sealant material on the adhesive layer.

6. A packaging body produced from the packaging film according to any one of claims 1 to 5.

Images