Chemical solution, chemical solution container

Abstract

The present invention provides a chemical solution having excellent defect suppression properties, and also provides a chemical solution container containing the chemical solution. [Solution] The chemical solution of the present invention is a chemical solution containing a compound other than an alkane or an alkene, and one or more organic solvents selected from the group consisting of decane and undecane, and the chemical solution further contains one or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms, and the content of the organic components is 0.10 to 1,000,000 ppt by mass relative to the total mass of the chemical solution.

Description

[Technical Field]

[0001] The present invention relates to a drug solution and a drug solution container. [Background technology]

[0002] During the manufacture of semiconductor devices through wiring formation processes including photolithography, chemical solutions containing water and / or organic solvents are used as pre-wet solutions, resist solutions (resist compositions), developers, rinse solutions, stripping solutions, chemical mechanical polishing (CMP) slurries, and post-CMP cleaning solutions, or as dilutions thereof. In recent years, advances in photolithography technology have led to advances in pattern miniaturization. One method for achieving this is to shorten the wavelength of the exposure light source, and attempts are being made to form patterns using even shorter wavelength light such as extreme ultraviolet (EUV) as the exposure light source, instead of conventionally used ultraviolet light, KrF excimer lasers, and ArF excimer lasers. As the patterns to be formed become finer, the chemicals used in this process are required to have even greater defect suppression properties.

[0003] As a chemical liquid used in conventional pattern formation, Patent Document 1 discloses "a method for producing an organic processing liquid for patterning chemically amplified resist films, which can reduce particle generation in pattern formation technology (paragraph

[0010] )." [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-84122 Summary of the Invention [Problem to be solved by the invention]

[0005] The present inventors have studied the organic processing liquid (chemical liquid) for patterning produced by the above-mentioned production method and have found that there is room for improvement in terms of defect suppression. Therefore, an object of the present invention is to provide a chemical solution that has excellent defect suppression properties, and a chemical solution container that contains the chemical solution. [Means for solving the problem]

[0006] As a result of extensive research into solving the above problems, the present inventors have found that the above problems can be solved by the following configuration.

[0007] [1] A chemical solution containing a compound other than an alkane or an alkene, and one or more organic solvents selected from the group consisting of decane and undecane, The chemical solution further contains one or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms, The chemical solution has a content of the organic component of 0.10 to 1,000,000 ppt by mass relative to the total mass of the chemical solution. [2] The chemical solution according to [1], which contains two or more of the organic components. [3] The chemical solution according to [1] or [2], which contains both one or more alkanes having 12 to 50 carbon atoms and one or more alkenes having 12 to 50 carbon atoms. [4] The distance between the Hansen solubility parameters of the organic solvents and eicosene is 3 to 20 MPa. 0.5 The drug solution according to any one of [1] to [3], [5] The range of Hansen solubility parameters for eicosene is 3-20 MPa. 0.5 The organic solvent is contained in an amount of 20 to 80% by mass relative to the total mass of the chemical solution, The range of Hansen solubility parameters for eicosene is 3-20 MPa. 0.5The chemical solution according to any one of [1] to [3], wherein the organic solvent other than the organic solvent is contained in an amount of 20 to 80 mass % relative to the total mass of the chemical solution. [6] The chemical solution is propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, ethyl lactate, propylene carbonate, isopropanol, 4-methyl-2-pentanol, butyl acetate, methyl methoxypropionate, propylene glycol monoethyl ether, propylene glycol monopropyl ether, cyclopentanone, γ-butyrolactone, diisoamyl ether, isoamyl acetate, dimethyl sulfoxide, N-methylpyrrolidone, diethylene glycol, ethylene glycol, dipropylene glycol The chemical solution according to any one of [1] to [5], containing one or more organic solvents selected from the group consisting of ethanol, propylene glycol, ethylene carbonate, sulfolane, cycloheptanone, 2-heptanone, butyl butyrate, isobutyl isobutyrate, pentyl propionate, isopentyl propionate, ethylcyclohexane, mesitylene, decane, undecane, 3,7-dimethyl-3-octanol, 2-ethyl-1-hexanol, 1-octanol, 2-octanol, ethyl acetoacetate, dimethyl malonate, methyl pyruvate, and dimethyl oxalate. [7] The chemical solution according to any one of [1] to [6], wherein the content of the organic component is 1 to 150 ppt by mass relative to the total mass of the chemical solution. [8] The chemical solution according to any one of [1] to [7], further comprising a metal component, the content of the metal component being 0.01 to 500 ppt by mass relative to the total mass of the chemical solution. [9] The chemical solution according to any one of [1] to [7], further containing a metal component, wherein the mass ratio of the content of the organic component to the content of the metal component is 0.001 to 10,000.

[10] The chemical solution according to [8] or [9], wherein the mass ratio of the content of the organic component to the content of the metal component is 0.05 to 2000.

[11] The chemical solution according to any one of [8] to

[10] , wherein the mass ratio of the content of the organic component to the content of the metal component is 0.1 to 100.

[12] The chemical solution according to any one of [8] to

[11] , wherein the metal component contains metal particles and metal ions.

[13] The chemical solution according to

[12] , wherein the mass ratio of the content of the organic component to the content of the metal particles is 0.01 to 1000.

[14] The chemical solution according to

[12] or

[13] , wherein the mass ratio of the content of the organic component to the content of the metal particles is 0.1 to 10.

[15] The chemical solution according to any one of

[12] to

[14] , wherein the mass ratio of the content of the organic component to the content of the metal particles is 0.28 to 3.5.

[16] The chemical solution according to any one of

[12] to

[15] , wherein the mass ratio of the content of the organic component to the content of the metal ions is 0.01 to 1000.

[17] The chemical solution according to any one of

[12] to

[16] , wherein the mass ratio of the content of the organic component to the content of the metal ions is 0.1 to 5.

[18] The chemical solution according to any one of

[12] to

[17] , wherein the mass ratio of the content of the organic component to the content of the metal ions is 0.2 to 1.3.

[19] Contains two or more of the above organic components, The chemical solution according to any one of [1] to

[18] , wherein at least one of the two or more organic components has a boiling point of 380° C. or higher.

[20] The organic solvent contains two or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms, The chemical solution according to any one of [1] to

[19] , wherein the mass content of any one of alkanes having 16 to 34 carbon atoms among the two or more alkanes having 12 to 50 carbon atoms is the largest. 〔twenty one〕 A drug solution according to any one of [1] to

[20] , which is contained in a container; A chemical solution container, wherein a liquid-contacting portion that comes into contact with the chemical solution in the container is made of electropolished stainless steel or fluorine-based resin. 〔twenty two〕 The drug solution container according to

[21] , wherein the void ratio within the container calculated by formula (1) is 2 to 50% by volume. Equation (1): Porosity = {1 - (volume of the chemical solution in the container / volume of the container)} x 100 [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a chemical solution having excellent defect suppression properties, and also to provide a chemical solution container containing the chemical solution. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described in detail below. The following description of the components may be based on a representative embodiment of the present invention, but the present invention is not limited to such an embodiment. In this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits. In the present invention, "ppm" stands for "parts-per-million (10 -6 ) and "ppb" stands for "parts-per-billion (10 -9 ) and "ppt" stands for "parts-per-trillion (10 -12 ) and "ppq" stands for "parts-per-quadrillion (10 -15 )" Furthermore, in the description of groups (atomic groups) in the present invention, when a notation does not specify whether they are substituted or unsubstituted, it encompasses both groups that do not have a substituent and groups that contain a substituent, as long as it does not impair the effects of the present invention. For example, the term "hydrocarbon group" encompasses not only hydrocarbon groups that do not have a substituent (unsubstituted hydrocarbon groups), but also hydrocarbon groups that contain a substituent (substituted hydrocarbon groups). This also applies to each compound. In the present invention, "radiation" refers to, for example, far ultraviolet, extreme ultraviolet (EUV), X-rays, or electron beams. In the present invention, "light" refers to actinic rays or radiation. Unless otherwise specified, "exposure" in the present invention includes not only exposure with far ultraviolet, X-rays, EUV, or the like, but also writing with particle beams such as electron beams or ion beams.

[0010] [Chemical solution] The chemical solution according to the embodiment of the present invention contains a compound other than an alkane or an alkene, and one or more organic solvents selected from the group consisting of decane and undecane. The chemical solution further contains an organic component. The organic component is at least one selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms. The content of the organic component is 0.10 to 1,000,000 ppt by mass relative to the total mass of the chemical solution.

[0011] Although the mechanism by which the drug solution solves the above problems is not entirely clear, the inventor speculates that the mechanism may be as follows: Note that the following mechanism is speculation, and even if the effects of the present invention are achieved by a different mechanism, it is still within the scope of the present invention. A chemical solution contains trace amounts of impurities that are mixed in during storage, transportation through piping, and the like, and these impurities are likely to cause various defects. The various defects include, for example, defects that occur when the chemical solution is applied to the manufacturing process of semiconductor devices. More specifically, these defects include metal residue defects when the chemical solution is used as a pre-wet liquid or a rinse liquid, defects that occur when bridging portions occur between patterns when the chemical solution is used as a developer for patterns, and defects such as those described above that occur when the chemical solution is used as a pipe cleaning liquid and then transported through the cleaned pipes before use as the pre-wet liquid, rinse liquid, or developer. The chemical solution of the present invention, which contains a predetermined amount of organic components, behaves like a saturated solution and is less likely to be contaminated with impurities (especially impurities that are likely to cause defects). Since the organic components, alkanes and alkenes, have a predetermined number of carbon atoms or more, their affinity for impurities present in liquid-contacting parts such as containers and piping used for storing and transporting the chemical solution is appropriately suppressed, thereby suppressing the elution of impurities from the liquid-contacting parts. On the other hand, the alkenes and alkanes that are organic components have a predetermined number of carbon atoms or less, and it is possible to prevent the organic components themselves from causing defects. The present inventors speculate that, based on this mechanism, various processes using the chemical solution of the present invention were able to suppress the occurrence of defects in the final product.

[0012] [Organic solvent] The chemical solution of the present invention (hereinafter also simply referred to as "chemical solution") contains a compound other than an alkane or an alkene, and one or more organic solvents selected from the group consisting of decane and undecane. In other words, in this specification, alkanes and alkenes, except for decane and undecane, are not included in the organic solvent. In this specification, the organic solvent refers to a liquid organic compound contained in an amount exceeding 10,000 ppm by mass per component relative to the total mass of the chemical solution. In other words, in this specification, a liquid organic compound contained in an amount exceeding 10,000 ppm by mass relative to the total mass of the chemical solution corresponds to an organic solvent. The organic solvent that the chemical solution must contain is a compound other than an alkane or an alkene, decane, and / or undecane. The organic solvent is preferably a compound other than an alkane or an alkene. In addition, in this specification, the term "liquid" means that the substance is liquid at 25°C under atmospheric pressure.

[0013] The content of the organic solvent in the chemical solution is not particularly limited, but is generally preferably 98.0% by mass or more, more preferably more than 99.0% by mass, even more preferably 99.9% by mass or more, and particularly preferably 99.99% by mass or more, relative to the total mass of the chemical solution. The upper limit is less than 100% by mass. The organic solvent may be used alone or in combination of two or more. When two or more organic solvents are used, the total content is preferably within the above range.

[0014] In order to achieve better defect suppression (hereinafter simply referred to as "chemical defect suppression") when the chemical is applied to various processes (for example, as a pre-wet liquid, developer, rinse liquid, or cleaning liquid for cleaning equipment that comes into contact with these liquids), the distance between the Hansen solubility parameters of the organic solvent and eicosene is 3 to 20 MPa. 0.5 is preferred. The distance between the Hansen solubility parameters of organic solvents and eicosene is 3MPa. 0.5 In this case, it is considered that the elution of organic components from filters used in purifying the chemical solution can be appropriately suppressed, and the content of organic components in the chemical solution can be easily controlled to be equal to or less than the upper limit allowed by the chemical solution of the present invention. In addition, it is easy to suppress the incorporation of unintended impurities (especially organic impurities with low polarity) from the environment (air, and containers and piping used in storing and transporting the liquid) into the chemical solution. The distance between the Hansen solubility parameters of organic solvents and eicosene is 20MPa. 0.5 If the chemical solution is below this value, it is considered that the solubility of the organic components contained in the chemical solution is good, and when the chemical solution is applied to a wafer or the like, the organic components are likely to be prevented from agglomerating on the wafer and causing defects. When two or more organic solvents are used, it is preferable that at least one of them satisfies the above Hansen solubility parameter range, it is preferable that at least two of them satisfies the above Hansen solubility parameter range, and it is preferable that all of them satisfies the above Hansen solubility parameter range. When two or more organic solvents are used, it is preferable that the weighted average value of the Hansen solubility parameters based on the molar ratio of the contents of the respective organic solvents satisfies the above range of the Hansen solubility parameters.

[0015] For example, it is preferable that the organic solvents in the chemical solution are substantially only organic solvents that satisfy the above-mentioned Hansen solubility parameter range. The content of the organic solvents that satisfy the above-mentioned Hansen solubility parameter range is 99% by mass or more (preferably 99.9% by mass or more) based on the total mass of the organic solvents.

[0016] Furthermore, for example, the organic solvent is preferably a mixed solvent containing both an organic solvent that satisfies the above-mentioned range of Hansen solubility parameters and an organic solvent that does not satisfy the above-mentioned range of Hansen solubility parameters. In this case, it is preferable that the chemical solution (mixed solvent) contains 20 to 80 mass % (preferably 30 to 70 mass %) of organic solvents that satisfy the above-mentioned Hansen solubility parameter range, relative to the total mass of the chemical solution, and 20 to 80 mass % (preferably 30 to 70 mass %) of organic solvents that do not satisfy the above-mentioned Hansen solubility parameter range, relative to the total mass of the chemical solution. When the content of the organic solvent satisfying the above Hansen solubility parameter range and the content of the organic solvent not satisfying the above Hansen solubility parameter range are each within a certain range, the affinity of the entire chemical solution for metal-based materials and organic-based materials can be adjusted to an appropriate range, and the effect of the present invention is considered to be better than when the content of the organic solvent not satisfying the above Hansen solubility parameter range is too low or too high (for example, 1% by mass or more but less than 20% by mass, or more than 80% by mass, based on the total mass of the chemical solution (mixed solvent)).

[0017] When the content of the organic solvent that does not satisfy the above Hansen solubility parameter range is an odd amount (for example, more than 1% by mass but less than 20% by mass), the odd amount of organic solvent that does not satisfy the above Hansen solubility parameter range is likely to act in the direction of precipitating organic impurities and / or ionic metal components with relatively high polarity that have been unintentionally mixed (contaminated) in the chemical solution from the environment. On the other hand, when the content of the organic solvent that does not satisfy the above Hansen solubility parameter range is 20% by mass or more, it is thought that the effect of making it difficult for these components to be taken up from the environment takes precedence over the above precipitating effect, and the defect suppression ability of the chemical solution as a whole is improved. If the content of organic solvents that do not satisfy the above-mentioned range of Hansen solubility parameters is 80 mass % or less, it is believed that excessive uptake of low-polarity organic impurities and / or particulate metal components from the environment can be suppressed, thereby improving defect suppression.

[0018] The total content of the organic solvent satisfying the above-mentioned Hansen solubility parameter range and the organic solvent not satisfying the above-mentioned Hansen solubility parameter range is preferably 98.0% by mass or more, more preferably more than 99.0% by mass, even more preferably 99.9% by mass or more, and particularly preferably 99.99% by mass or more, based on the total mass of the chemical solution, with the upper limit being less than 100% by mass. In addition, in organic solvents that do not satisfy the above Hansen solubility parameter range, the Hansen solubility parameter difference with respect to eicosene is 3 to 20 MPa. 0.5 isn't it. In organic solvents that do not satisfy the above Hansen solubility parameter range, the distance of the Hansen solubility parameter for eicosene is 0 MPa 0.5 More than 3MPa 0.5 Less than (preferably 0 MPa 0.5 Super 3MPa 0.5 less than 20 MPa 0.5 More than (preferably 20 MPa 0.5 Super 50MPa 0.5 (See below).

[0019] In order to better suppress defects in the chemical solution, the Hansen solubility parameter of the organic solvent for eicosane is 5~25MPa. 0.5 is preferred. The assumed mechanism is similar to that described above regarding the distance between the Hansen solubility parameters of organic solvents and eicosene. When two or more organic solvents are used, it is preferable that at least one of them satisfies the above Hansen solubility parameter range, it is preferable that at least two of them satisfies the above Hansen solubility parameter range, and it is preferable that all of them satisfies the above Hansen solubility parameter range. Furthermore, the content of the organic solvents that satisfy the above Hansen solubility parameter range is preferably 50% by mass or more but less than 100% by mass, more preferably 80% by mass or more but less than 100% by mass, and even more preferably 95% by mass or more but less than 100% by mass, based on the total mass of the chemical solution. When two or more organic solvents are used, it is preferable that the weighted average value of the Hansen solubility parameters based on the molar ratio of the contents of the respective organic solvents satisfies the above range of the Hansen solubility parameters.

[0020] In this specification, the Hansen solubility parameters refer to the Hansen solubility parameters described in "Hansen Solubility Parameters: A Users Handbook, Second Edition" (pages 1-310, CRC Press, published in 2007), etc. That is, the Hansen solubility parameters express solubility as a multidimensional vector (dispersion term (δd), dipole-dipole term (δp), and hydrogen bond term (δh)), and these three parameters are considered to be the coordinates of a point in a three-dimensional space called Hansen space. The Hansen solubility parameter distance is the distance between two compounds in the Hansen space, and can be calculated using the following formula: (Ra) 2 =4(δd2-δd1) 2 +(δp2-δp1) 2 +(δh2-δh1) 2 Ra: The distance between the Hansen solubility parameters of the first compound and the second compound (unit: MPa) 0.5 ) δd1: Dispersion term of the first compound (unit: MPa 0.5 ) δd2: Dispersion term of the second compound (unit: MPa 0.5 ) δp1: dipole-dipole term of the first compound (unit: MPa 0.5 ) δp2: dipole-dipole term of the second compound (unit: MPa 0.5 ) δh1: hydrogen bond term of the first compound (unit: MPa 0.5 ) δh2: Hydrogen bond term of the second compound (unit: MPa 0.5 ) In this specification, the Hansen solubility parameter of a compound is specifically calculated using HSPiP (Hansen Solubility Parameter in Practice).

[0021] The type of organic solvent is not particularly limited, and known organic solvents can be used. Examples of the organic solvent include alkylene glycol monoalkyl ether carboxylates, alkylene glycol monoalkyl ethers, alkyl lactates, alkyl alkoxypropionates, cyclic lactones (preferably having 4 to 10 carbon atoms), monoketone compounds which may have a ring (preferably having 4 to 10 carbon atoms), alkylene carbonates, alkyl alkoxyacetates, alkyl pyruvates, dialkyl sulfoxides, cyclic sulfones, dialkyl ethers, monohydric alcohols, glycols, alkyl acetates, and N-alkylpyrrolidones.

[0022] Examples of organic solvents contained in the chemical solution include propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone (CHN), ethyl lactate (EL), propylene carbonate (PC), isopropanol (IPA), 4-methyl-2-pentanol (MIBC), butyl acetate (nBA), methyl methoxypropionate, propylene glycol monoethyl ether, propylene glycol monopropyl ether, cyclopentanone, γ-butyrolactone, diisoamyl ether, isoamyl acetate, dimethyl sulfoxide, and N

[0033] Preferred is one or more selected from the group consisting of 2-methylpyrrolidone, diethylene glycol, ethylene glycol, dipropylene glycol, propylene glycol, ethylene carbonate, sulfolane, cycloheptanone, 2-heptanone, butyl butyrate, isobutyl isobutyrate, pentyl propionate, isopentyl propionate, ethylcyclohexane, mesitylene, decane, undecane, 3,7-dimethyl-3-octanol, 2-ethyl-1-hexanol, 1-octanol, 2-octanol, ethyl acetoacetate, dimethyl malonate, methyl pyruvate, and dimethyl oxalate. Examples of using two or more organic solvents include a combined use of PGMEA and PGME, and a combined use of PGMEA and PC. The type and content of the organic solvent in the chemical solution can be measured using a gas chromatograph mass spectrometer.

[0023] In order to obtain a more excellent defect suppressing effect of the chemical solution, the ClogP of the organic solvent is preferably from 0.05 to 7.00, and more preferably from 0.07 to 2.00. The ClogP value is the calculated common logarithm logP of the partition coefficient P between 1-octanol and water. Although known methods and software can be used to calculate the ClogP value, the present invention uses the ClogP program incorporated into Cambridgesoft's ChemBioDrawUltra 12.0 unless otherwise specified. When two or more organic solvents are used, it is preferable that the weighted average value of the ClogP values ​​based on the molar ratio of the contents of the respective organic solvents satisfies the above range of the ClogP value.

[0024] [Organic ingredients] The chemical solution contains an organic component. The organic component is at least one selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms. The chemical solution may contain one organic component alone or two or more organic components, but it is preferable that the chemical solution contain two or more organic components in order to obtain a more excellent defect suppressing effect of the chemical solution. When two or more organic components are contained, the chemical solution satisfies at least one of the following requirements A to C, and preferably satisfies requirement C. Requirement A: The chemical solution contains two or more alkanes selected from the group consisting of alkanes having 12 to 50 carbon atoms. Requirement B: The chemical solution contains two or more alkenes selected from the group consisting of alkenes having 12 to 50 carbon atoms. Requirement C: The solvent contains one or more selected from the group consisting of alkanes having 12 to 50 carbon atoms and one or more selected from the group consisting of alkenes having 12 to 50 carbon atoms.

[0025] In order to obtain a more excellent defect suppression property of the chemical solution, the content of the organic component is 0.10 to 1,000,000 mass ppt relative to the total mass of the chemical solution, and in order to obtain a more excellent defect suppression property of the chemical solution, the content is preferably 0.5 to 10,000 mass ppt, more preferably 0.5 to 1,000 mass ppt, even more preferably 1 to 150 mass ppt, and particularly preferably 1 to 60 mass ppt. When two or more organic components are used, the total content is preferably within the above range.

[0026] In order to achieve better defect suppression properties of the chemical solution, the ClogP of the organic component is preferably 5.0 or more, more preferably 8.0 to 26.0, and even more preferably 9.0 to 17.0. The ClogP value is the calculated common logarithm logP of the partition coefficient P between 1-octanol and water. Although known methods and software can be used to calculate the ClogP value, the present invention uses the ClogP program incorporated into Cambridgesoft's ChemBioDrawUltra 12.0 unless otherwise specified. The molecular weight of the organic component is preferably 200-600, more preferably 220-450. The boiling point of the organic component is usually 180°C or higher, preferably 190 to 600°C, and more preferably 200 to 500°C. It is also preferable that the chemical solution contains two or more organic components, at least one of which has a boiling point of 380°C or higher (preferably 380 to 480°C). In this specification, the boiling point means the boiling point at standard atmospheric pressure.

[0027] <Alkane> The organic components, alkanes with 12 to 50 carbon atoms, are C j H 2j+2 (j represents an integer of 12 to 50, and two j's have the same value). The above alkanes may be linear or branched. On the other hand, alkanes having 12 to 50 carbon atoms do not contain a cyclic structure. In other words, the above alkanes are not cycloalkanes.

[0028] The alkane preferably has 14 to 40 carbon atoms, more preferably 16 to 34 carbon atoms. In addition, in order to obtain a more excellent defect suppression property of the chemical solution, it is preferable that the chemical solution contains two or more alkanes selected from the group consisting of alkanes having 12 to 50 carbon atoms, and it is preferable that the content by mass of any one of the alkanes having 16 to 34 carbon atoms among the two or more alkanes having 12 to 50 carbon atoms is the largest.

[0029] In order to obtain a more excellent defect suppression property of the chemical solution, when the chemical solution contains an alkane having 12 to 50 carbon atoms, the content thereof is preferably 0.01 to 5,000 mass ppt, more preferably 0.5 to 1,000 mass ppt, and even more preferably 1 to 50 mass ppt, relative to the total mass of the chemical solution. When two or more of the above alkanes are contained, it is preferable that the total content is within the above range.

[0030] <Alkene> The organic component, an alkene having 12 to 50 carbon atoms, contains one or more C=C double bonds in the molecule. Alkenes with 12 to 50 carbon atoms containing one C=C double bond in the molecule are C n C 2n+2-2x (n is an integer of 12 to 50, and x is an integer of 1 or more, and represents the number of C=C double bonds that the alkene has). n C 2n+2-2x In this case, the two n's are the same value, and "2n+2-2x" is a value greater than or equal to 4. Alkenes having 12 to 50 carbon atoms may be linear or branched. On the other hand, alkenes having 12 to 50 carbon atoms do not contain a cyclic structure. In other words, alkenes having 12 to 50 carbon atoms are not cycloalkenes. In order to obtain a more excellent defect suppression property of the chemical solution, when the chemical solution contains an alkene having 12 to 50 carbon atoms, the content thereof is preferably 0.1 to 5,000 mass ppt, more preferably 0.5 to 1,000 mass ppt, and still more preferably 1 to 50 mass ppt, relative to the total mass of the chemical solution. When two or more of the above alkenes are used, the total content is preferably within the above range.

[0031] Because of its superior defect suppression properties, C n C 2n+2-2x The alkene represented by the formula (I) wherein x is 1 preferably has 14 to 40 carbon atoms, more preferably 16 to 34 carbon atoms. The chemical solution is C n C 2n+2-2x In the case where the chemical solution contains an alkene represented by the formula (I) where x is 1, the content thereof is preferably 0.01 to 5,000 mass ppt, more preferably 0.1 to 1,000 mass ppt, and still more preferably 1 to 40 mass ppt, relative to the total mass of the chemical solution. Two or more types of C n C 2n+2-2xWhen an alkene represented by the formula (I) where x is 1 is used, the total content is preferably within the above range.

[0032] C n C 2n+2-2x The number of carbon atoms (that is, n) of the alkene represented by the formula (I) where x is 2 or more is preferably 30 to 50, and more preferably 30 to 40. The number of double bonds (that is, x) is preferably 2 to 15, and more preferably 2 to 10. C n C 2n+2-2x Alkenes represented by the formula where x is 2 or more are squalene (C 30 H 50 ), lycopene (C 40 H 56 ), Neurosporen (C 40 H 58 ), phytoene (C 40 H 64 ), or phytofluene (C 40 H 62 ) is preferred, with squalene being more preferred. The chemical solution is C n C 2n+2-2x In the case where the chemical solution contains an alkene represented by the formula (I) where x is 2 or more, the content thereof is preferably 0.01 to 5,000 mass ppt, more preferably 0.1 to 1,000 mass ppt, and still more preferably 1 to 10 mass ppt, relative to the total mass of the chemical solution. Two or more types of C n C 2n+2-2x When an alkene represented by the formula (I) where x is 2 or more is used, the total content is preferably within the above range.

[0033] The content of organic components in the chemical solution can be measured using a GCMS (gas chromatography mass spectrometry).

[0034] [Metal Components] The chemical solution may contain a metal component. In the present invention, the metal component includes metal particles and metal ions, and for example, the content of the metal component refers to the total content of the metal particles and metal ions. The chemical solution may contain either metal particles or metal ions, or may contain both, and preferably contains both metal particles and metal ions.

[0035] Examples of the metal element in the metal component include Na (sodium), K (potassium), Ca (calcium), Fe (iron), Cu (copper), Mg (magnesium), Mn (manganese), Li (lithium), Al (aluminum), Cr (chromium), Ni (nickel), Ti (titanium), and Zn (zirconium). The metal component may contain one or more metal elements. The metal particles may be a simple substance or an alloy, or the metal may exist in a state associated with an organic substance. The metal components may be metal components that are inevitably contained in each component (raw material) contained in the chemical solution, or metal components that are inevitably contained during the production, storage, and / or transportation of the treatment solution, or may be intentionally added.

[0036] When the chemical solution contains a metal component, the content thereof is preferably 0.01 to 500 mass ppt, more preferably 0.01 to 250 mass ppt, and even more preferably 0.01 to 100 mass ppt, relative to the total mass of the chemical solution, in order to obtain better defect suppression properties of the chemical solution. It is believed that if the content of metal components is 0.01 mass ppt or more, it is easier to prevent organic compounds (especially polar organic compounds) that may be contained in the chemical solution from agglomerating into particles on the substrate or the like and causing defects. Furthermore, if the content of the metal component is less than 500 mass ppt, it is easy to avoid an increase in the occurrence of defects resulting from the metal component.

[0037] When the chemical solution contains metal ions, the content thereof is preferably 0.01 to 400 mass ppt, more preferably 0.01 to 200 mass ppt, and even more preferably 0.01 to 80 mass ppt, relative to the total mass of the chemical solution, in order to obtain better defect suppression properties of the chemical solution. When the chemical solution contains metal particles, the content thereof is preferably 0.01 to 400 mass ppt, more preferably 0.01 to 150 mass ppt, and even more preferably 0.01 to 40 mass ppt, relative to the total mass of the chemical solution, in order to obtain better defect suppression properties of the chemical solution.

[0038] Furthermore, in order to obtain better defect suppression properties of the chemical solution, when the chemical solution contains a metal component, the mass ratio of the organic component content to the metal component content (mass content of organic component / mass content of metal component) is preferably 0.001 to 10,000, more preferably 0.05 to 2,000, even more preferably 0.1 to 2,000, and particularly preferably 0.1 to 100. In order to obtain better defect suppression properties of the chemical solution, when the chemical solution contains metal particles, the mass ratio of the organic component content to the metal particle content (mass content of organic component / mass content of metal particle) is preferably 0.01 to 30,000, more preferably 0.1 to 6,000, even more preferably 0.1 to 1,000, particularly preferably 0.1 to 10, and most preferably 0.28 to 3.5. In order to obtain a more excellent defect suppression property of the chemical solution, when the chemical solution contains metal ions, the mass ratio of the organic component content to the metal ion content (mass content of organic component / mass content of metal ion) is preferably 0.01 to 10,000, more preferably 0.1 to 2,500, even more preferably 0.01 to 1,000, particularly preferably 0.1 to 5, and most preferably 0.2 to 1.3.

[0039] The types and contents of specific metal ions and specific metal particles in the chemical solution can be measured by SP-ICP-MS (Single Nano Particle Inductively Coupled Plasma Mass Spectrometry). Here, the SP-ICP-MS method uses the same equipment as the regular ICP-MS method (inductively coupled plasma mass spectrometry), but differs only in the data analysis, which can be performed using commercially available software. In ICP-MS, the content of the target metal component is measured regardless of the form of its existence. Therefore, the total mass of the target metal particles and metal ions is quantified as the content of the metal component.

[0040] On the other hand, the SP-ICP-MS method can measure the content of metal particles, so the content of metal ions in a sample can be calculated by subtracting the content of metal particles from the content of metal components in the sample. An example of an apparatus for the SP-ICP-MS method is the Agilent 8800 triple quadrupole ICP-MS (inductively coupled plasma mass spectrometry, for semiconductor analysis, option #200) manufactured by Agilent Technologies, and measurements can be performed using the method described in the Examples. Other apparatuses that can be used include the NexION350S manufactured by PerkinElmer and the Agilent 8900 manufactured by Agilent Technologies.

[0041] [Other ingredients] The chemical solution may contain other components in addition to those described above, such as other organic compounds, water, and resins.

[0042] <Water> The chemical solution may contain water. The water is not particularly limited, and examples thereof include distilled water, ion-exchanged water, and pure water. Water may be added to the chemical solution, or may be unintentionally mixed into the chemical solution during the production process of the chemical solution. Examples of unintentional mixing during the production process of the chemical solution include, but are not limited to, when water is contained in a raw material (e.g., an organic solvent) used in the production of the chemical solution, or when water is mixed during the production process of the chemical solution (e.g., contamination).

[0043] The water content in the chemical solution is not particularly limited, but is generally preferably 0.05 to 2.0 mass % relative to the total mass of the chemical solution. The water content in the chemical solution refers to the water content measured using an apparatus that employs the Karl Fischer water content determination method as its measurement principle.

[0044] <Resin> The chemical solution may further contain a resin. The resin is preferably a resin P containing a group that decomposes under the action of an acid to generate a polar group (a repeating unit containing an acid-decomposable group). The resin is more preferably a resin containing a repeating unit represented by formula (AI) described below, which is a resin whose solubility in a developer containing an organic solvent as the main component decreases under the action of an acid. The resin containing a repeating unit represented by formula (AI) described below contains a group that decomposes under the action of an acid to generate an alkali-soluble group. Examples of the polar group include an alkali-soluble group, such as a carboxy group, a fluorinated alcohol group (preferably a hexafluoroisopropanol group), a phenolic hydroxyl group, and a sulfo group.

[0045] In the acid-decomposable group, the polar group is protected by a group that is detached by an acid (acid-detachable group). Examples of the acid-detachable group include -C(R 36 )(R 37 )(R 38 ), -C(R 36 )(R 37 )(OR 39 ), and -C(R 01 )(R 02 )(OR 39 ) etc.

[0046] In the formula, R 36 ~R 39 R each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. 36 and R 37 may be bonded to each other to form a ring.

[0047] R 01and R 02 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group.

[0048] Resin P, the solubility of which in a developer containing an organic solvent as a main component decreases due to the action of an acid, will be described in detail below.

[0049] (Formula (AI): Repeating unit containing an acid-decomposable group) Resin P preferably contains a repeating unit represented by formula (AI).

[0050] [ka]

[0051] In formula (AI), Xa1 represents a hydrogen atom or an alkyl group which may have a substituent. T represents a single bond or a divalent linking group. Ra1 to Ra3 each independently represent an alkyl group (straight-chain or branched) or a cycloalkyl group (monocyclic or polycyclic). Two of Ra1 to Ra3 may be bonded to form a cycloalkyl group (monocyclic or polycyclic).

[0052] The content of the repeating unit containing an acid-decomposable group (preferably a repeating unit represented by formula (AI)) is preferably 20 to 90 mol %, more preferably 25 to 85 mol %, and even more preferably 30 to 80 mol %, based on all repeating units in the resin P.

[0053] Resin P may contain other repeating units in addition to the repeating unit containing an acid-decomposable group, such as a repeating unit containing a lactone structure, a repeating unit containing a phenolic hydroxyl group, a repeating unit containing a polar group, and a repeating unit containing a silicon atom in the side chain.

[0054] The weight-average molecular weight of Resin P, as measured by GPC (Gel permeation chromatography) in terms of polystyrene, is preferably 1,000 to 200,000, more preferably 3,000 to 20,000, and even more preferably 5,000 to 15,000. A weight-average molecular weight of 1,000 to 200,000 can prevent deterioration of heat resistance and dry etching resistance, and can also prevent deterioration of developability and deterioration of film-formability due to increased viscosity.

[0055] The dispersity (molecular weight distribution) is usually 1 to 5, preferably 1 to 3, more preferably 1.2 to 3.0, and even more preferably 1.2 to 2.0.

[0056] In the chemical solution, the content of the resin P is preferably 50 to 99.9 mass % of the total solid content, and more preferably 60 to 99.0 mass %. In addition, in the chemical solution, one type of resin P may be used, or a plurality of types may be used.

[0057] The chemical solution may further contain known components such as an acid generator, a basic compound, a quencher, a hydrophobic resin, a surfactant, and a solvent, provided that they do not conflict with the requirements of the present invention. The chemical solution may contain components contained in actinic ray-sensitive or radiation-sensitive resin compositions described in, for example, JP 2013-195844 A, JP 2016-057645 A, JP 2015-207006 A, WO 2014 / 148241 A, JP 2016-188385 A, and JP 2017-219818 A.

[0058] <Other organic compounds> The chemical solution may contain organic compounds other than those mentioned above. Other organic compounds refer to organic compounds that are neither alkanes having 12 to 50 carbon atoms nor alkenes having 12 to 50 carbon atoms, and that are contained in an amount of 10,000 mass ppm or less relative to the total mass of the chemical solution. Examples of other organic compounds include alkanes having less than 12 carbon atoms and alkenes having less than 12 carbon atoms.

[0059] The other organic compounds may be added to the chemical solution, or may be mixed unintentionally during the manufacturing process of the chemical solution. Examples of unintentional mixing during the manufacturing process of the chemical solution include, but are not limited to, when the other organic compounds are contained in raw materials (e.g., organic solvents) used in manufacturing the chemical solution, and when the other organic compounds are mixed during the manufacturing process of the chemical solution (e.g., contamination).

[0060] When the chemical solution contains other organic compounds, the content thereof is preferably 0.001 to 10,000 mass ppt, more preferably 0.1 to 80 mass ppt, and even more preferably 1 to 15 mass ppt, relative to the total mass of the chemical solution.

[0061] The content of other organic compounds in the chemical solution can be measured using a GCMS (gas chromatography mass spectrometry).

[0062] [Chemical use] The chemical solution according to the above embodiment is preferably used in the manufacture of semiconductor devices.

[0063] Specifically, in the manufacturing process of semiconductor devices, which includes a lithography process, an etching process, an ion implantation process, a stripping process, etc., the liquid is used to treat organic substances after each process or before moving to the next process, and is suitably used as a pre-wet liquid, a developer, a rinse liquid, a stripping liquid, etc. For example, it can also be used to rinse the edge line of a semiconductor substrate before and after resist coating. In addition, the chemical liquid may be used as a dilution liquid for the resin contained in the resist liquid, or may be diluted with other organic solvents and / or water.

[0064] Furthermore, the above-mentioned chemical solution can be used for purposes other than the manufacture of semiconductor devices, and can also be used as a developer for polyimide, resist for sensors, resist for lenses, etc., and as a rinse solution. The chemical solution can also be used as a solvent for medical or cleaning purposes, for example, for cleaning pipes, containers, and substrates (such as wafers and glass). As for the cleaning application, it is also preferable to use it as a cleaning liquid (pipe cleaning liquid, container cleaning liquid, etc.) for cleaning pipes, containers, etc. that come into contact with the above-mentioned pre-wet liquid or other liquid.

[0065] Among these, the chemical liquids exhibit excellent effects when applied to pre-wet liquids, developer liquids, and rinse liquids in pattern formation, and also when applied to pipe cleaning liquids used in pipes for transporting these liquids.

[0066] [Method for producing chemical solution] The method for producing the chemical solution is not particularly limited, and known production methods can be used. Among them, the method for producing the chemical solution preferably includes a filtration step of filtering the material to be purified containing the organic solvent using a filter to obtain the chemical solution, in order to obtain a chemical solution that exhibits more excellent effects of the present invention.

[0067] The material to be purified used in the filtration step may be procured by purchase or may be obtained by reacting raw materials. The material to be purified preferably has a low impurity content. Examples of commercially available products of such materials include those known as "high purity grade products."

[0068] The method for reacting raw materials to obtain a product to be purified (typically, a product to be purified containing an organic solvent) is not particularly limited, and known methods can be used. For example, there is a method for reacting one or more raw materials in the presence of a catalyst to obtain an organic solvent. More specifically, examples of such methods include a method of reacting acetic acid with n-butanol in the presence of sulfuric acid to obtain butyl acetate; a method of reacting ethylene, oxygen, and water in the presence of Al(C2H5)3 to obtain 1-hexanol; a method of reacting cis-4-methyl-2-pentene in the presence of Ipc2BH (Diisopinocampheylborane) to obtain 4-methyl-2-pentanol; a method of reacting propylene oxide, methanol, and acetic acid in the presence of sulfuric acid to obtain PGMEA (propylene glycol 1-monomethyl ether 2-acetate); a method of reacting acetone and hydrogen in the presence of copper oxide-zinc oxide-aluminum oxide to obtain IPA (isopropyl alcohol); and a method of reacting lactic acid and ethanol to obtain ethyl lactate.

[0069] <Filtration process> The method for producing a chemical solution according to an embodiment of the present invention includes a filtration step of filtering the material to be purified using a filter to obtain a chemical solution. The method for filtering the material to be purified using a filter is not particularly limited, but it is preferable to pass the material to be purified (liquid) through a filter unit having a housing and a filter cartridge housed in the housing, with or without pressure.

[0070] Filter pore size The pore size of the filter is not particularly limited, and filters having pore sizes commonly used for filtering materials to be purified can be used. In particular, the pore size of the filter is preferably 200 nm or less, more preferably 20 nm or less, even more preferably 10 nm or less, particularly preferably 5 nm or less, and most preferably 3 nm or less, because this makes it easier to control the number of particles (metal particles, etc.) contained in the chemical solution within a desired range. The lower limit is not particularly limited, but a pore size of 1 nm or more is generally preferred from the viewpoint of productivity. In this specification, the pore size and pore size distribution of a filter refer to the pore size and pore size distribution determined by the bubble point of isopropanol (IPA) or HFE-7200 ("Novec 7200", manufactured by 3M, hydrofluoroether, C4F9OC2H5).

[0071] A filter having a pore size of 5.0 nm or less is preferable because it is easier to control the number of particles contained in the drug solution. Hereinafter, a filter having a pore size of 5 nm or less will also be referred to as a "micropore filter." The micropore filter may be used alone or in combination with a filter having a different pore size. From the viewpoint of superior productivity, it is preferable to use the micropore filter in combination with a filter having a larger pore size. In this case, clogging of the micropore filter can be prevented by passing the purified product, which has been previously filtered through a filter having a larger pore size, through the micropore filter. That is, when one filter is used, the pore size of the filter is preferably 5.0 nm or less, and when two or more filters are used, the pore size of the filter having the smallest pore size is preferably 5.0 nm or less.

[0072] The sequential use of two or more filters with different pore sizes is not particularly limited, but may include a method of sequentially arranging the filter units described above along a pipeline through which the purified product is transported. In this case, if an attempt is made to maintain a constant flow rate per unit time of the purified product throughout the entire pipeline, a filter unit with a smaller pore size may be subjected to a higher pressure than a filter unit with a larger pore size. In this case, it is preferable to arrange a pressure control valve and a damper between the filter units to maintain a constant pressure on the filter unit with a smaller pore size, or to arrange filter units containing the same filter in parallel along the pipeline to increase the filtration area. This allows for more stable control of the number of particles in the chemical solution.

[0073] Filter material The filter material is not particularly limited, and known filter materials can be used. Specifically, resins include polyamides such as nylon (e.g., 6-nylon and 6,6-nylon); polyolefins such as polyethylene and polypropylene; polystyrene; polyimide; polyamideimide; poly(meth)acrylate; polytetrafluoroethylene, perfluoroalkoxyalkane, perfluoroethylenepropene copolymer, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoroethylene copolymer, polychlorotrifluoroethylene, polyvinylidene fluoride, and polyvinyl fluoride; polyvinyl alcohol; polyester; cellulose; cellulose acetate, and the like. Among these, at least one selected from the group consisting of nylon (e.g., 6,6-nylon is preferred), polyolefins (e.g., polyethylene is preferred), poly(meth)acrylate, and polyfluorocarbons (e.g., polytetrafluoroethylene (PTFE) and perfluoroalkoxyalkane (PFA) are preferred) is preferred because of their superior solvent resistance and the resulting chemical solution's superior defect suppression performance. These polymers may be used alone or in combination of two or more. In addition to resin, materials such as diatomaceous earth and glass may also be used. Alternatively, a polymer (such as nylon-grafted UPE) obtained by graft copolymerizing polyamide (for example, nylon such as nylon-6 or nylon-6,6) with polyolefin (such as UPE described below) may be used as the material for the filter.

[0074] The filter may also be a surface-treated filter. The surface treatment method is not particularly limited, and known methods can be used. Examples of surface treatment methods include chemical modification treatment, plasma treatment, hydrophobic treatment, coating, gas treatment, and sintering.

[0075] Plasma treatment is preferred because it hydrophilizes the filter surface. The water contact angle on the surface of the filter material hydrophilized by plasma treatment is not particularly limited, but the static contact angle at 25°C measured with a contact angle meter is preferably 60° or less, more preferably 50° or less, and even more preferably 30° or less.

[0076] As the chemical modification treatment, a method of introducing ion exchange groups into the substrate is preferred. That is, the filter is preferably a filter in which the above-mentioned materials are used as a substrate and ion exchange groups are introduced into the substrate. Typically, a filter is preferred that includes a layer containing a substrate containing ion exchange groups on the surface of the substrate. The surface-modified substrate is not particularly limited, and a filter in which ion exchange groups are introduced into the above-mentioned polymer is preferred in terms of ease of production.

[0077] Examples of the ion exchange group include a sulfonic acid group, a carboxyl group, and a phosphate group as a cation exchange group, and a quaternary ammonium group as an anion exchange group. The method for introducing the ion exchange group into the polymer is not particularly limited, but includes a method in which a compound containing an ion exchange group and a polymerizable group is reacted with the polymer to typically perform grafting.

[0078] The method for introducing ion exchange groups is not particularly limited. For example, fibers of the above resins are irradiated with ionizing radiation (such as α-rays, β-rays, γ-rays, X-rays, and electron beams) to generate active moieties (radicals) in the resin. The irradiated resin is then immersed in a monomer-containing solution to graft polymerize the monomer onto the substrate. As a result, a polymer is produced in which the monomer is bonded to the polyolefin fibers as a graft-polymerized side chain. The resin containing this generated polymer as a side chain is then contacted with a compound containing anion exchange groups or cation exchange groups to introduce ion exchange groups into the graft-polymerized side chain polymer, yielding the final product.

[0079] The filter may also be constructed by combining a woven or nonwoven fabric on which ion exchange groups have been formed by radiation graft polymerization with a conventional glass wool, woven or nonwoven fabric filtering material.

[0080] The use of a filter containing ion exchange groups makes it easy to control the content of metal atom-containing particles in the chemical solution within a desired range. The material of the filter containing ion exchange groups is not particularly limited, but examples thereof include polyfluorocarbons and materials in which ion exchange groups have been introduced into polyolefins, and materials in which ion exchange groups have been introduced into polyfluorocarbons are more preferred. The pore size of the filter containing ion exchange groups is not particularly limited, but is preferably 1 to 30 nm, more preferably 5 to 20 nm. The filter containing ion exchange groups may also serve as the filter having the smallest pore size described above, or may be used separately from the filter having the smallest pore size. In particular, in terms of obtaining a chemical solution that exhibits the effects of the present invention more effectively, a filtration step using a filter containing ion exchange groups and a filter not having ion exchange groups and having the smallest pore size is preferred. The material for the filter having the minimum pore size already described is not particularly limited, but from the viewpoint of solvent resistance and the like, generally, at least one selected from the group consisting of polyfluorocarbons and polyolefins is preferred, and polyolefins are more preferred.

[0081] Therefore, the filters used in the filtration step may be two or more filters made of different materials, for example, two or more filters selected from the group consisting of filters made of polyolefins, polyfluorocarbons, polyamides, and materials into which ion exchange groups have been introduced.

[0082] ·Porous structure of the filter The pore structure of the filter is not particularly limited and may be appropriately selected depending on the components in the product to be purified. In this specification, the pore structure of the filter refers to the pore size distribution, the positional distribution of the pores in the filter, the shape of the pores, etc., and can typically be controlled by the filter manufacturing method. For example, porous membranes can be obtained by sintering powders of resins or the like, and fibrous membranes can be obtained by methods such as electrospinning, electroblowing, and meltblowing, each of which has a different pore structure.

[0083] By "porous membrane" is meant a membrane that retains components of a product to be purified, such as gels, particles, colloids, cells, and poly-oligomers, while allowing components substantially smaller than the pores to pass through the pores. The retention of components of a product by a porous membrane may depend on operating conditions, such as face velocity, the use of surfactants, pH, and combinations thereof, and may depend on the pore size and structure of the porous membrane and the size and structure of the particles to be removed (e.g., hard particles or gels).

[0084] When the product to be purified contains negatively charged particles, polyamide filters can function as non-sieving membranes to remove such particles. Typical non-sieving membranes include, but are not limited to, nylon membranes such as nylon-6 membranes and nylon-6,6 membranes. As used herein, "non-sieving" retention mechanisms refer to retention that occurs through mechanisms such as obstruction, diffusion, and adsorption that are not related to the pressure drop or pore size of the filter.

[0085] Non-sieving retention includes retention mechanisms such as obstruction, diffusion, and adsorption that remove target particles in a purified product, regardless of the filter's pressure drop or pore size. Particle adsorption to the filter surface can be mediated, for example, by intermolecular van der Waals and electrostatic forces. Obstruction occurs when particles moving through a non-sieving membrane layer with a tortuous path cannot be redirected quickly enough to avoid contact with the non-sieving membrane. Diffusion-based particle transport results primarily from the random or Brownian motion of small particles, which creates a certain probability of particle collision with the filter media. Non-sieving retention mechanisms can be active when there are no repulsive forces between the particles and the filter.

[0086] UPE (ultra-high molecular weight polyethylene) filters are typically sieving membranes, meaning membranes that capture particles primarily through sieving retention mechanisms or membranes optimized for capturing particles through sieving retention mechanisms. Typical examples of sieving membranes include, but are not limited to, polytetrafluoroethylene (PTFE) membranes and UPE membranes. The "sieve retention mechanism" refers to the retention of particles that are larger than the pore size of the porous membrane. Sieve retention is improved by forming a filter cake (an agglomeration of particles to be removed on the membrane surface). The filter cake effectively performs the function of a secondary filter.

[0087] The material of the fiber membrane is not particularly limited as long as it is a polymer capable of forming a fiber membrane. Examples of polymers include polyamides. Examples of polyamides include nylon 6 and nylon 6,6. The polymer forming the fiber membrane may be poly(ether sulfone). When the fiber membrane is on the primary side of the porous membrane, it is preferable that the surface energy of the fiber membrane is higher than that of the polymer that is the material of the porous membrane on the secondary side. An example of such a combination is when the fiber membrane is made of nylon and the porous membrane is made of polyethylene (UPE).

[0088] The method for producing the fiber membrane is not particularly limited, and known methods can be used, such as electrospinning, electroblowing, and meltblowing.

[0089] The pore structure of the porous membrane (for example, a porous membrane containing UPE, PTFE, etc.) is not particularly limited, and examples of the pore shape include lace-like, string-like, and node-like. The pore size distribution in the porous membrane and the distribution of its positions within the membrane are not particularly limited. The size distribution may be narrower and the distribution positions within the membrane may be symmetrical. Alternatively, the size distribution may be wider and the distribution positions within the membrane may be asymmetrical (the above membrane is also referred to as an "asymmetric porous membrane"). In an asymmetric porous membrane, the pore size varies within the membrane, and typically, the pore size increases from one surface of the membrane to the other. In this case, the surface with more pores with larger pore sizes is referred to as the "open side," and the surface with more pores with smaller pore sizes is also referred to as the "tight side." Furthermore, examples of asymmetric porous membranes include membranes in which the size of the pores is smallest at a certain position within the thickness of the membrane (also called "hourglass-shaped" membranes).

[0090] With asymmetric porous membranes, the primary side has larger pore size, in other words the primary side is open, creating a pre-filtration effect.

[0091] The porous membrane may include a thermoplastic polymer such as PESU (polyethersulfone), PFA (perfluoroalkoxyalkane, a copolymer of tetrafluoroethylene and perfluoroalkoxyalkane), polyamide, and polyolefin, or may include polytetrafluoroethylene, etc. Among these, ultra-high molecular weight polyethylene is preferred as a material for the porous membrane. Ultra-high molecular weight polyethylene refers to thermoplastic polyethylene with an extremely long chain, and preferably has a molecular weight of one million or more, typically 2 to 6 million.

[0092] The filters used in the filtration step may be two or more types of filters with different pore structures, or a porous membrane filter and a fiber membrane filter may be used in combination. A specific example is a method using a nylon fiber membrane filter and a UPE porous membrane filter.

[0093] It is also preferable to thoroughly wash the filter before use. When an unwashed filter (or a filter that has not been washed sufficiently) is used, impurities contained in the filter are likely to be carried into the chemical solution. Impurities contained in the filter include, for example, the organic components described above. If the filtration step is carried out using an unwashed filter (or a filter that has not been sufficiently washed), the content of the organic components in the chemical solution may exceed the allowable range for the chemical solution of the present invention. For example, when polyolefins such as UPE and polyfluorocarbons such as PTFE are used for the filter, the filter is likely to contain alkanes having 12 to 50 carbon atoms as impurities. Furthermore, when a polyamide such as nylon, a polyimide, or a polymer obtained by graft copolymerizing a polyamide (such as nylon) with a polyolefin (such as UPE) is used for a filter, the filter is likely to contain alkenes having 12 to 50 carbon atoms as impurities. The method for cleaning the filter includes, for example, immersing the filter in an organic solvent with a low impurity content (e.g., a distilled and purified organic solvent (PGMEA, etc.) for one week or more. In this case, the liquid temperature of the organic solvent is preferably 30 to 90°C. The material to be purified may be filtered using a filter whose degree of washing has been adjusted, and the resulting chemical solution may be adjusted to contain a desired amount of organic components derived from the filter.

[0094] As described above, the filtration step according to an embodiment of the present invention may be a multistage filtration step in which the material to be purified is passed through two or more types of filters that differ in at least one property selected from the group consisting of filter material, pore size, and pore structure. The material to be purified may be passed through the same filter multiple times, or may be passed through multiple filters of the same type.

[0095] The material of the liquid-contacting parts of the purification equipment used in the filtration process (meaning the inner wall surfaces that may come into contact with the product to be purified and the chemical solution) is not particularly limited, but is preferably made of at least one material selected from the group consisting of non-metallic materials (such as fluororesins) and electropolished metallic materials (such as stainless steel) (hereinafter, these are collectively referred to as "corrosion-resistant materials"). For example, "the liquid-contacting parts of a production tank are made of a corrosion-resistant material" means that the production tank itself is made of a corrosion-resistant material, or the inner wall surfaces of the production tank are coated with a corrosion-resistant material.

[0096] The non-metallic material is not particularly limited, and known materials can be used. Examples of non-metallic materials include, but are not limited to, at least one selected from the group consisting of polyethylene resin, polypropylene resin, polyethylene-polypropylene resin, and fluorine-based resin (e.g., tetrafluoroethylene resin, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer resin, tetrafluoroethylene-ethylene copolymer resin, trifluorochloroethylene-ethylene copolymer resin, vinylidene fluoride resin, trifluorochloroethylene copolymer resin, and vinyl fluoride resin).

[0097] The metal material is not particularly limited, and known materials can be used. The metal material may be, for example, a metal material having a total chromium and nickel content of more than 25 mass% relative to the total mass of the metal material, and more preferably 30 mass% or more. There is no particular upper limit to the total chromium and nickel content in the metal material, but it is generally preferably 90 mass% or less. Examples of metallic materials include stainless steel and nickel-chromium alloys.

[0098] The stainless steel is not particularly limited, and known stainless steels can be used. Among them, an alloy containing 8% or more by mass of nickel is preferred, and an austenitic stainless steel containing 8% or more by mass of nickel is more preferred. Examples of austenitic stainless steel include SUS (Steel Use Stainless) 304 (Ni content 8% by mass, Cr content 18% by mass), SUS304L (Ni content 9% by mass, Cr content 18% by mass), SUS316 (Ni content 10% by mass, Cr content 16% by mass), and SUS316L (Ni content 12% by mass, Cr content 16% by mass).

[0099] The nickel-chromium alloy is not particularly limited, and any known nickel-chromium alloy can be used, among which a nickel-chromium alloy having a nickel content of 40 to 75 mass % and a chromium content of 1 to 30 mass % is preferred. Examples of nickel-chromium alloys include Hastelloy (trade name, the same applies hereinafter), Monel (trade name, the same applies hereinafter), and Inconel (trade name, the same applies hereinafter), etc. More specific examples include Hastelloy C-276 (Ni content 63 mass%, Cr content 16 mass%), Hastelloy-C (Ni content 60 mass%, Cr content 17 mass%), Hastelloy C-22 (Ni content 61 mass%, Cr content 22 mass%), etc. Furthermore, the nickel-chromium alloy may further contain boron, silicon, tungsten, molybdenum, copper, cobalt, and the like in addition to the above alloy, as required.

[0100] The method for electrolytically polishing a metal material is not particularly limited, and known methods can be used, such as those described in paragraphs

[0011] to

[0014] of JP 2015-227501 A and paragraphs

[0036] to

[0042] of JP 2008-264929 A.

[0101] It is believed that electrolytic polishing of metal materials results in a higher chromium content in the surface passive layer than in the parent phase, and therefore, it is believed that the use of a refining device with wetted parts made of electrolytically polished metal materials makes it difficult for metal-containing particles to leak into the product being refined. The metal material may be buffed. The buffing method is not particularly limited, and known methods can be used. The size of the abrasive grains used for the buffing finish is not particularly limited, but #400 or smaller is preferred, as this tends to reduce the surface irregularities of the metal material. Buffing is preferably performed before electrolytic polishing.

[0102] <Other processes> The method for producing a chemical solution may further include steps other than the filtration step, such as a distillation step, a reaction step, and a static elimination step.

[0103] (Distillation process) The distillation step is a step of distilling a purified product containing an organic solvent to obtain a distilled purified product. The method for distilling the purified product is not particularly limited, and known methods can be used. A typical method is to place a distillation column on the upstream side of a purification device subjected to the filtration step, and introduce the distilled purified product into a production tank. In this case, the liquid-contacting parts of the distillation column are not particularly limited, but are preferably made of the corrosion-resistant materials already described.

[0104] (Reaction step) The reaction step is a step in which raw materials are reacted to produce a product to be purified that contains an organic solvent as a reaction product. The method for producing the product to be purified is not particularly limited, and known methods can be used. A typical example is a method in which a reaction tank is placed on the upstream side of a production tank (or distillation column) of a purification device that is subjected to the filtration step, and the reaction product is introduced into the production tank (or distillation column). In this case, the liquid-contacting parts of the production tank are not particularly limited, but are preferably made of the corrosion-resistant materials already described.

[0105] (static elimination process) The charge removal step is a step of removing static electricity from the material to be purified to reduce the charged potential of the material to be purified. The method for removing static electricity is not particularly limited, and any known method can be used, such as contacting the product to be purified with a conductive material. The contact time for the material to be purified with the conductive material is preferably 0.001 to 60 seconds, more preferably 0.001 to 1 second, and even more preferably 0.01 to 0.1 second. Examples of conductive materials include stainless steel, gold, platinum, diamond, and glassy carbon. As a method for bringing the material to be purified into contact with the conductive material, for example, a grounded mesh made of a conductive material is placed inside the pipeline and the material to be purified is passed through the mesh.

[0106] It is preferable that the purification of the target substance, including the opening of containers, cleaning of containers and equipment, storage of solutions, and analysis, be all performed in a clean room. The clean room is preferably a clean room with a cleanliness level of Class 4 or higher as defined by the international standard ISO14644-1:2015 established by the International Organization for Standardization. Specifically, it is preferable that the clean room meets any of ISO Class 1, ISO Class 2, ISO Class 3, and ISO Class 4, more preferably ISO Class 1 or ISO Class 2, and even more preferably ISO Class 1.

[0107] The storage temperature of the drug solution is not particularly limited, but a storage temperature of 4°C or higher is preferred, as this makes it more difficult for impurities contained in trace amounts in the drug solution to be eluted, resulting in better effects of the present invention.

[0108] [Chemical solution container] The drug solution produced by the above purification method may be stored in a container until use. Such a container and the liquid medicine contained therein are collectively referred to as a liquid medicine container. The liquid medicine is taken out of the stored liquid medicine container and used.

[0109] The container for storing the chemical solution is preferably one that is highly clean and allows little elution of impurities, for use in semiconductor device manufacturing. Specific examples of containers that can be used include the "Clean Bottle" series manufactured by Aicello Chemical Co., Ltd. and the "Pure Bottle" manufactured by Kodama Resin Industry Co., Ltd., but are not limited to these.

[0110] As the container, it is also preferable to use a multi-layer bottle whose inner wall has a six-layer structure made of six types of resin, or a multi-layer bottle whose inner wall has a seven-layer structure made of six types of resin, in order to prevent impurities from being mixed in (contaminated) with the drug solution. Examples of such containers include the container described in JP 2015-123351 A.

[0111] The liquid-contacting portion of this container may be made of the corrosion-resistant material already described (preferably electrolytically polished stainless steel or fluororesin) or glass. In order to obtain a more excellent effect of the present invention, it is preferable that 90% or more of the area of ​​the liquid-contacting portion is made of the above material, and it is more preferable that the entire liquid-contacting portion is made of the above material.

[0112] The porosity within the container of the drug solution container is preferably 2 to 80% by volume, more preferably 2 to 50% by volume, and even more preferably 5 to 30% by volume. The porosity is calculated according to formula (1). Formula (1): Porosity = {1 - (Volume of the drug solution in the container / Volume of the container)} x 100 The container volume is synonymous with the internal volume (capacity) of the container. If the porosity is small to a certain extent, there is little air in the voids, which reduces the amount of organic compounds in the air that get mixed into the chemical solution, making it easier to stabilize the composition of the chemical solution contained therein. If the porosity is 2% by volume or more, there is an appropriate amount of space, making it easy to handle the chemical solution. [Example]

[0113] The present invention will be described in more detail below with reference to the following examples. The materials, amounts used, ratios, treatment details, and treatment procedures shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the following examples.

[0114] In addition, in preparing the chemical solutions in the Examples and Comparative Examples, handling of containers, preparation of the chemical solutions, filling, storage, and analytical measurements were all carried out in a clean room meeting ISO Class 2 or 1. To improve measurement accuracy, when measuring the content of organic components and the content of metal components, when measuring components below the detection limit in normal measurements, the chemical solutions were concentrated before measurement, and the contents were calculated by converting them into the concentration of the solution before concentration.

[0115] [Preparation of chemical solution] [Preparing the filter] All filters used in the purification of chemical solutions were washed with a cleaning solution obtained by distilling and purifying commercially available PGMEA (propylene glycol monomethyl ether acetate). The entire filter unit containing the filter was immersed in PGMEA to clean all liquid-contacting parts. The cleaning period (immersion period) was one week or longer. The PGMEA liquid temperature was maintained at 30°C during the cleaning process. The following filters were used: UPE: Ultra-high molecular weight polyethylene filter, manufactured by Entegris, pore size 3 nm PTFE: Polytetrafluoroethylene filter, manufactured by Entegris, pore size 10 nm Nylon: Nylon filter, manufactured by PALL, pore size 5 nm Nylon-grafted UPE: Nylon / ultra-high molecular weight polyethylene graft copolymer filter, manufactured by Entegris, pore size 3 nm Polyimide: Polyimide filter, manufactured by Entegris, pore size 10 nm

[0116] 〔purification〕 <Product to be purified> The following organic solvents were used as materials to be purified in the production of the chemical solutions of the Examples and Comparative Examples. All of the following organic solvents were commercially available products. The values ​​in parentheses are the distances (units: MPa) between the Hansen solubility parameters for eicosene in each organic solvent alone. 0.5 ) is shown. PGMEA: Propylene glycol monomethyl ether acetate (9.5) CHN: Cyclohexanone (9.1) EL: Ethyl lactate (12.9) PGME: Propylene glycol monomethyl ether (11.0) PC: Propylene carbonate (19.1) MMP: Methyl methoxypropionate (8.8) IPA: Isopropanol (15.8) MIBC: 4-methyl-2-pentanol (11.1) nBA: Butyl acetate (5.6) MeOH: Methanol (23.7) Undecane: Undecane (1.8) Butyl Butyrate: Butyl butyrate (4.6) Isoamyl Ether: Isoamyl ether (diisoamyl ether) (2.1) Ethylcyclohexane: Ethylcyclohexane (1.8) iAA: Isoamyl acetate (6.0) Isobutyl isobutyrate: Isobutyl isobutyrate (3.6) Methyl Malonate: Dimethyl malonate (10.3) When two organic solvents were used in combination, the respective organic solvents were purchased before mixing, and the mixture was mixed in predetermined amounts to prepare the product to be purified. When two organic solvents are used in combination, the numerical values ​​shown indicate the mixing ratio (mass ratio) of the organic solvents. For example, the description "PGME / PGMEA=7 / 3" means a 7:3 mixture (mass ratio) of PGMEA and PGME, and the distance of the Hansen solubility parameter (weighted average value of the Hansen solubility parameter based on the molar ratio of the content of each organic solvent) for eicosene in the entire mixture is 11.0 MPa. 0.5 is.

[0117] <Container> The following containers were used to store the drug solutions. EP-SUS: A vessel with electropolished stainless steel parts in contact with the liquid PFA: Container with liquid-contacting parts coated with perfluoroalkoxyalkane

[0118] One selected from the above-mentioned purified products was distilled, and the distilled purified product was passed through the above-mentioned washed filter at least once, and then placed in various containers with a predetermined porosity.

[0119] In addition, the pipes used to transport the material to be purified and the chemical solution during the purification process were either stainless steel pipes with electrolytically polished liquid contact parts or stainless steel pipes that were not electrolytically polished. The chemical solutions shown in Table 1 were prepared by appropriately changing the type of product to be purified, the type of filter, the filter cleaning period, the number of times the liquid was passed through, the type of piping, and the length of the piping (transport distance through the piping). However, the chemical solutions in which the total amount of hydrocarbons exceeded 1,000,000 mass ppt in Comparative Example AB01 and the like were prepared by passing the solution through a filter that had not been subjected to the above-mentioned cleaning treatment. Furthermore, chemical solutions containing alkanes and / or alkenes having less than 12 carbon atoms, such as Comparative Example HB07, were prepared by adding alkanes and alkenes having 6 and 10 carbon atoms to the material to be purified after passing it through a filter, so as to achieve the contents shown in Table 1. Hereinafter, the numbers of Examples or Comparative Examples will correspond to the numbers of the chemical solutions. For example, the chemical solution prepared and tested in Example AA01 will be referred to as Chemical Solution AA01.

[0120] 〔analysis〕 The contents of organic components and metal components in the chemical solution were measured by the following method.

[0121] <Organic ingredient content> The content of organic components in each chemical solution was analyzed using a gas chromatography mass spectrometry (GC / MS) device.

[0122] <Metal component content> The content of metal components (metal ions and metal particles) in the chemical solution was measured by a method using ICP-MS and SP-ICP-MS. The following equipment was used: Manufacturer: PerkinElmer Model: NexION350S The following analysis software was used for the analysis. ·Syngistix Nano Application Module for "SP-ICP-MS" Syngistix for ICP-MS software Of the alkanes or alkenes detected in the chemical solution, all alkanes or alkenes with 20 or more carbon atoms had boiling points of 380°C or higher.

[0123] The table below shows the production conditions of the chemical solution in each example, and the contents of the organic component and metal component. Tables 1a1 to 1a19 list the types of organic solvents and filters used in producing the chemical solutions. Tables 1b1 to 1b19 show the alkane contents in the chemical solutions. Tables 1c1 to 1c19 show the alkene contents in the chemical solutions. Tables 1d1 to 1d19 show the content of metal components in the chemical solutions.

[0124] In Tables 1a1 to 1a19, the values ​​listed in the lower part of the "HSP distance vs. eicosane" and "HSP distance vs. eicosene" columns are the distances (unit: MPa) of the Hansen solubility parameters of the organic solvents used for eicosane or eicosene. 0.5 ) means In a system in which two or more organic solvents are mixed, the Hansen solubility parameter refers to the weighted average value of the Hansen solubility parameters based on the molar ratio of the contents of each organic solvent. The "clogP" column indicates the clogP value of the organic solvent used. In a system in which two or more organic solvents are mixed, the clogP value refers to a weighted average value of the clogP values ​​based on the molar ratio of the contents of each organic solvent. In Tables 1b1 to 1b19 and Tables 1c1 to 1c19, alkanes and C k H 2k The values ​​listed in the lower part of the column listing the number of carbon atoms in alkenes (alkenes containing one C=C double bond) represented by k H 2k For example, in Table 1b1, the chemical solution AA01 contains 2 ppt by mass of an alkane having 18 carbon atoms relative to the total mass of the chemical solution. In addition, alkanes with carbon numbers of 12 to 50 and C k H 2k Among the alkenes represented by the formula, alkanes with carbon numbers not listed and C k H 2k The content of alkene represented by the formula (I) is omitted. A value of "0" for the content of alkanes and alkenes means that the content of those alkanes and alkenes was less than 0.001 mass ppt (detection limit) relative to the total mass of the chemical solution. In this case, the chemical solution is considered to contain no alkanes or alkenes with a content of "0." In Tables 1b1 to 1b19 and Tables 1c1 to 1c19, the "Total Amount" column indicates the total content of alkanes having 12 to 50 carbon atoms in the chemical solution, and the total content of alkenes having 12 to 50 carbon atoms in the chemical solution, respectively. In other words, even if the chemical solution contains alkanes or alkenes having 6 or 10 carbon atoms, these contents are not added together for the purpose of calculating the "Total Amount" column. In Tables 1b1 to 1b19, the values ​​shown in the lower row of the column "Maximum carbon number contained" indicate the carbon number of the alkane with the largest mass content among alkanes of each carbon number contained in the chemical solution. In Tables 1c1 to 1c19, “C n H m The value in the lower part of the "" column is the content of alkenes containing two or more C=C double bonds. As an alkene containing two or more C=C double bonds, only squalene (clogP: 12.9) was detected. The values ​​shown in the lower part of the "Total Amount of Organic Components" column in Tables 1d1 to 1d19 indicate the total content of organic components in the chemical solution. In other words, even if the chemical solution contains alkanes or alkenes with 6 or 10 carbon atoms, the contents of these are not added together for the purpose of calculating the "Total Amount of Organic Components" column. The values ​​listed in the lower rows of the "Ratios 1 to 3" columns in Tables 1d1 to 1d19 respectively indicate the "mass ratio of the organic component content to the metal component content," the "mass ratio of the organic component content to the metal particle content," and the "mass ratio of the organic component content to the metal ion content" in the chemical solution.

[0125] [Table 1]

[0126] [Table 2]

[0127] [Table 3]

[0128] [Table 4]

[0129] [Table 5]

[0130] [Table 6]

[0131] Table 7

[0132] Table 8

[0133] Table 9

[0134] Table 10

[0135] Table 11

[0136] Table 12

[0137] Table 13

[0138] Table 14

[0139] Table 15

[0140] Table 16

[0141] Table 17

[0142] Table 18

[0143] Table 19

[0144] Table 20

[0145] Table 21

[0146] Table 22

[0147] Table 23

[0148] Table 24

[0149] Table 25

[0150] Table 26

[0151] Table 27

[0152] Table 28

[0153] Table 29

[0154] Table 30

[0155] Table 31

[0156] Table 32

[0157] Table 33

[0158] Table 34

[0159] Table 35

[0160] Table 36

[0161] Table 37

[0162] Table 38

[0163] Table 39

[0164] Table 40

[0165] Table 41

[0166] Table 42

[0167] Table 43

[0168] Table 44

[0169] Table 45

[0170] Table 46

[0171] Table 47

[0172] Table 48

[0173] Table 49

[0174] Table 50

[0175] Table 51

[0176] Table 52

[0177] Table 53

[0178] Table 54

[0179] Table 55

[0180] Table 56

[0181] Table 57

[0182] Table 58

[0183] Table 59

[0184] Table 60

[0185] Table 61

[0186] Table 62

[0187] Table 63

[0188] Table 64

[0189] Table 65

[0190] Table 66

[0191] Table 67

[0192] Table 68

[0193] Table 69

[0194] Table 70

[0195] Table 71

[0196] Table 72

[0197] Table 73

[0198] Table 74

[0199] Table 75

[0200] Table 76

[0201] Table 77

[0202] Table 78

[0203] Table 79

[0204] [Table 80]

[0205] [test] The prepared drug solution was stored in the container at 30°C for 90 days and then subjected to the following tests.

[0206] [Evaluation of coating defect suppression] The defect suppression performance of the chemical solution was evaluated by the following method. A bare silicon wafer approximately 300 mm in diameter was prepared, and while the wafer was being rotated at 500 rpm, 100 ml of each chemical solution was transferred from the container to the dispenser via piping (manufactured by Nichias Corporation; liquid contact parts: stainless steel; φ: inner diameter 4.35 mm, outer diameter 6.35 mm; length: 10 m; previously washed with a cleaning solution made from commercially available distilled and purified PGMEA). The solution was dispensed at a rate of 5 ml / s over 20 seconds. The wafer was then rotated at 2000 rpm for 30 seconds to perform a spin-drying process. This was used as the evaluation wafer. Next, the number of defects 17 nm or larger in size present on the entire surface of the wafer and their composition were investigated using the KLA-Tencor wafer inspection system "SP-5" and the Applied Materials fully automated defect review and classification system "SEMVision G6."

[0207] Of the defects measured, particulate foreign matter was classified into "metal residue defects" primarily composed of metal and "particulate organic residue defects" primarily composed of organic matter, and each was counted separately. Furthermore, defects other than particulate foreign matter were counted as "stain defects." The measurement results were evaluated according to the following criteria. Furthermore, an "overall evaluation" was calculated based on the total number of these defects and evaluated according to the following criteria. The fewer the coating defects, the better the performance of the chemical liquid when used as a pre-wet liquid, developer, or rinse liquid.

[0208] (Metal residue defect evaluation criteria) A: The number of defects was 20 or less per wafer. B: The number of defects was 21 or more per wafer but not more than 100 per wafer. C: The number of defects was 101 or more / wafer and 500 or less / wafer. D: The number of defects was 501 or more / wafer and 1,000 or less / wafer. E: The number of defects was 1,001 or more per wafer and 5,000 or less per wafer. F: The number of defects was 5001 or more per wafer.

[0209] (Evaluation criteria for particulate organic residue defects) A: The number of defects was less than 50 per wafer. B: The number of defects was 51 or more per wafer and 200 or less per wafer. C: The number of defects was 201 or more / wafer and 500 or less / wafer. D: The number of defects was 501 or more per wafer and 1,000 or less per wafer. E: The number of defects was 1,001 or more per wafer and 5,000 or less per wafer. F: The number of defects was 5001 or more per wafer.

[0210] (Evaluation criteria for stain-like defects) A: The number of defects was less than 50 per wafer. B: The number of defects was 51 or more per wafer and 200 or less per wafer. C: The number of defects was 201 or more / wafer and 500 or less / wafer. D: The number of defects was 501 or more per wafer and 1,000 or less per wafer. E: The number of defects was 1,001 or more per wafer and 5,000 or less per wafer. F: The number of defects was 5001 or more per wafer.

[0211] (Evaluation criteria for overall evaluation) A: The total number of defects for each type was 100 or less per wafer. B: The total number of defects for each type was 101 or more / wafer and 500 or less / wafer. C: The total number of defects for each type was 501 or more / wafer and 1,000 or less / wafer. D: The total number of defects for each type was 1,001 or more per wafer and 5,000 or less per wafer. E: The total number of defects for each type was 5,001 or more per wafer and 30,000 or less per wafer. F: The total number of defects for each defect was 30,001 or more per wafer.

[0212] [Evaluation of Pattern Defect Suppression] A resist composition having the following formulation was prepared, and a pattern was formed using the chemical solution. In this case, the chemical solution AA01 was used as the pre-wet liquid, the chemical solution HA01 was used as the developer, and the chemical solution FA01 was used as the rinse liquid, which will be described later. However, when evaluating the performance of the chemicals as pre-wetting liquids, each of the chemicals to be evaluated was used as the pre-wetting liquid. Similarly, when evaluating the performance of the chemicals as developing liquids, each of the chemicals to be evaluated was used as the developing liquid. When evaluating the performance of the chemicals as rinsing liquids, each of the chemicals to be evaluated was used as the rinsing liquid. When discharging the chemical solution to be used as a pre-wet solution, developer, or rinse solution, the chemical solution was transported from the container to the discharge port of the coating device or the like via piping (manufactured by Nichias Corporation; liquid contact part: stainless steel; φ: inner diameter 4.35 mm, outer diameter 6.35 mm; length: 10 m; used after cleaning with a cleaning solution made by distilling and purifying commercially available PGMEA).

[0213] <Resist composition> Resist composition 1 was obtained by mixing the components in the following ratio. ·Resin (A-1): 0.77g Photoacid generator (B-1): 0.03g Basic compound (E-3): 0.03g PGMEA (commercially available, high-purity grade): 67.5g EL (commercially available, high purity grade): 75g

[0214] (resin) The following resins were used:

[0215] [ka]

[0216] (Photoacid generator) The following compounds were used as photoacid generators.

[0217] [ka]

[0218] (basic compounds) The following compounds were used as basic compounds.

[0219] [ka]

[0220] <Pattern formation and evaluation> The chemicals were evaluated for their ability to suppress residue defects, bridge defects, and stain defects using the following methods. 3S " was used. First, AL412 (manufactured by Brewer Science) was applied to a 300 mm diameter silicon wafer and baked at 200°C for 60 seconds to form a 20 nm thick resist underlayer film. A pre-wet liquid was applied thereon, and then a resist composition was applied thereon and baked at 100°C for 60 seconds (PB: Prebake) to form a 30 nm thick resist film.

[0221] This resist film was exposed through a reflective mask using an EUV exposure machine (manufactured by ASML; NXE3350, NA 0.33, Dipole 90°, outer sigma 0.87, inner sigma 0.35). It was then baked at 85°C for 60 seconds (PEB: Post Exposure Bake). The silicon wafer was then developed by spraying a developer onto it for 30 seconds using a spray method, and rinsed with a rinse solution by spin coating for 20 seconds. The silicon wafer was then rotated at 2000 rpm for 40 seconds to form a line-and-space pattern with a space width of 20 nm and a pattern line width of 15 nm.

[0222] An image of the above pattern was obtained, and the obtained image was analyzed using the above-mentioned analysis device to measure the number of defects per unit area. The total number of defects was used as an "overall evaluation" and evaluated according to the following criteria. In addition, among the defects, the number of "PLOT defects," which are protrusion-like defects, "BRIDGE defects," which are defects that resemble bridges between patterns, and "GEL defects," which are defects that are film-like residues, was counted and evaluated according to the following criteria.

[0223] (Evaluation criteria for overall evaluation) A: The total number of defects was less than 50 per wafer. B: The total number of defects was 51 or more / wafer and 200 or less / wafer. C: The total number of defects was 201 or more / wafer and 500 or less / wafer. D: The total number of defects was 501 or more / wafer and 1,000 or less / wafer. E: The total number of defects was 1001 or more / wafer and 5000 or less / wafer. F: The total number of defects was 5001 or more per wafer.

[0224] (PLOT defect evaluation criteria) A: The number of defects was 20 or less per wafer. B: The number of defects was 21 or more / wafer and 50 or less / wafer. C: The number of defects was 51 or more / wafer and 100 or less / wafer. D: The number of defects was 101 or more per wafer and 500 or less per wafer. E: The number of defects was 501 or more / wafer and 1,000 or less / wafer. F: The number of defects was 1001 or more per wafer.

[0225] (BRIDGE defect evaluation criteria) A: The number of defects was 20 or less per wafer. B: The number of defects was 21 or more / wafer and 50 or less / wafer. C: The number of defects was 51 or more / wafer and 100 or less / wafer. D: The number of defects was 101 or more per wafer and 500 or less per wafer. E: The number of defects was 501 or more / wafer and 1,000 or less / wafer. F: The number of defects was 1001 or more per wafer.

[0226] (GEL defect evaluation criteria) A: The number of defects was 20 or less per wafer. B: The number of defects was 21 or more / wafer and 50 or less / wafer. C: The number of defects was 51 or more / wafer and 100 or less / wafer. D: The number of defects was 101 or more per wafer and 500 or less per wafer. E: The number of defects was 501 or more / wafer and 1,000 or less / wafer. F: The number of defects was 1001 or more per wafer.

[0227] [Pipe cleaning performance] Immediately after purchase, 1000 ml of the chemical solution to be evaluated was passed through the piping (manufactured by Nichias Corporation / liquid contact part: PFA / φ: inner diameter 4.35 mm, outer diameter 6.35 mm / length: 10 m) at 100 ml / min to clean the piping. Next, a test similar to the above-mentioned evaluation of coating defect suppression was carried out, except that the chemical solution AAO1 was discharged onto the wafer through this pipe. The better the test results for suppressing coating defects performed in this way, the better the pipe cleaning performance of the chemical liquid used for cleaning the pipes can be evaluated.

[0228] The test results are shown in the table below.

[0229] [Table 81]

[0230] [Table 82]

[0231] [Table 83]

[0232] [Table 84]

[0233] [Table 85]

[0234] [Table 86]

[0235] [Table 87]

[0236] [Table 88]

[0237] [Table 89]

[0238] [Table 90]

[0239] Table 91

[0240] Table 92

[0241] Table 93

[0242] Table 94

[0243] Table 95

[0244] Table 96

[0245] Table 97

[0246] Table 98

[0247] Table 99

[0248] Table 100

[0249] From the results shown in the table, it was confirmed that the chemical solution of the present invention has excellent defect suppression properties.

[0250] It was confirmed that when the content of organic components in the chemical solution was 0.5 to 150 mass ppt (preferably 1 to 60 mass ppt), the defect suppression tended to be more excellent (results of Examples AA09, 12 to 15, etc.).

[0251] It was confirmed that when the content of metal components in the chemical solution is 0.01 to 500 mass ppt (preferably 0.01 to 250 mass ppt, more preferably 0.01 to 100 mass ppt), the defect suppression tends to be better (results of Examples AA08 and 11, comparison between Examples CA04 and CA07, etc.).

[0252] When the metal ion content of the chemical solution is 0.01 to 400 mass ppt (preferably 0.01 to 200 mass ppt, more preferably 0.01 to 80 mass ppt), it has been confirmed that the defect suppression tends to be more excellent (results of Examples AA08 and 11, etc.).

[0253] When the content of metal particles in the chemical solution is 0.01 to 400 mass ppt (preferably 0.01 to 150 mass ppt, more preferably 0.01 to 40 mass ppt), it has been confirmed that defect suppression tends to be more excellent (results of Examples AA08 and 11, etc.).

[0254] It was confirmed that when the mass ratio of the organic component content to the metal component content in the chemical solution is 0.05 to 2000 (preferably 0.1 to 2000), the defect suppression ability tends to be better (e.g., comparison between Examples FA04 and FA07).

[0255] The Hansen solubility parameter range of the organic solvent of the drug solution to eicosene is 3 to 20 MPa 0.5 In this case, it was confirmed that the defect suppression property tended to be better (results of Examples KA, LA, NA, OA, etc.). Furthermore, when the chemical solution contains both an organic solvent that satisfies the above-mentioned range of Hansen solubility parameters and an organic solvent that does not satisfy the above-mentioned range of Hansen solubility parameters, it has been confirmed that the defect suppression tends to be more excellent when the organic solvent that satisfies the above-mentioned range of Hansen solubility parameters is contained in an amount of 20 to 80 mass% based on the total mass of the chemical solution, and the organic solvent that does not satisfy the above-mentioned range of Hansen solubility parameters is contained in an amount of 20 to 80 mass% (preferably 30 to 70 mass%) based on the total mass of the chemical solution (e.g., comparison of Examples SA01 to SA05).

Claims

1. A chemical solution containing a compound other than an alkane and an alkene, and one or more organic solvents selected from the group consisting of decane and undecane, the organic solvent is a liquid organic compound contained in an amount exceeding 10,000 ppm by mass per component, The chemical liquid is a pre-wet liquid, a developer, a rinse liquid, or a pipe cleaning liquid, the chemical solution contains one or more organic solvents selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, ethyl lactate, propylene carbonate, isopropanol, 4-methyl-2-pentanol, butyl acetate, methyl methoxypropionate, diisoamyl ether, isoamyl acetate, butyl butyrate, isobutyl isobutyrate, ethylcyclohexane, undecane, dimethyl malonate, and methanol; The chemical solution further contains one or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms; The content of the organic component is 0.10 to 1,000,000 ppt by mass relative to the total mass of the chemical solution.

2. A chemical solution containing a compound other than an alkane and an alkene, and one or more organic solvents selected from the group consisting of decane and undecane, The organic solvent is a liquid organic compound contained in an amount exceeding 10,000 ppm by mass per component, The chemical liquid is a pre-wet liquid, a developer, a rinse liquid, or a pipe cleaning liquid, the chemical solution contains the organic solvent having a Hansen solubility parameter distance for eicosene of 1.8 to 23.7 MPa 0.5 , The chemical solution further contains one or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms and alkenes having 12 to 50 carbon atoms; The content of the organic component is 0.10 to 1,000,000 ppt by mass relative to the total mass of the chemical solution.

3. The chemical solution according to claim 1 or 2, which contains two or more types of the organic components.

4. The chemical solution according to any one of claims 1 to 3, comprising both the one or more alkanes having 12 to 50 carbon atoms and the one or more alkenes having 12 to 50 carbon atoms.

5. The distance between the Hansen solubility parameters of the organic solvent and eicosene is 3 to 20 MPa. ０．５ The drug solution according to any one of claims 1 to 4,

6. The Hansen solubility parameter range for eicosene is 3 to 20 MPa 0.5 The organic solvent is contained in an amount of 20 to 80% by mass relative to the total mass of the chemical solution, The Hansen solubility parameter range for eicosene is 3 to 20 MPa 0.5 The chemical solution according to any one of claims 1 to 4, wherein the organic solvent other than the organic solvent is contained in an amount of 20 to 80% by mass relative to the total mass of the chemical solution.

7. The chemical solution according to any one of claims 1 to 6, wherein the content of the organic component is 1 to 150 ppt by mass relative to the total mass of the chemical solution.

8. The chemical solution according to any one of claims 1 to 7, further comprising a metal component, the content of the metal component being 0.01 to 500 ppt by mass relative to the total mass of the chemical solution.

9. The chemical solution according to any one of claims 1 to 7, further comprising a metal component, wherein the mass ratio of the content of the organic component to the content of the metal component is 0.001 to 10,000.

10. 10. The chemical solution according to claim 8, wherein a mass ratio of the content of the organic component to the content of the metal component is 0.05 to 2000.

11. The chemical solution according to any one of claims 8 to 10, wherein a mass ratio of the content of the organic component to the content of the metal component is 0.1 to 100.

12. The chemical solution according to any one of claims 8 to 11, wherein the metal component contains metal particles and metal ions.

13. The chemical solution according to claim 12, wherein a mass ratio of the content of the organic component to the content of the metal particles is 0.01 to 1000.

14. The chemical solution according to claim 12 or 13, wherein a mass ratio of the content of the organic component to the content of the metal particles is 0.1 to 10.

15. The chemical solution according to any one of claims 12 to 14, wherein a mass ratio of the content of the organic component to the content of the metal particles is 0.28 to 3.

5.

16. The chemical solution according to any one of claims 12 to 15, wherein a mass ratio of the content of the organic component to the content of the metal ions is 0.01 to 1000.

17. The chemical solution according to any one of claims 12 to 16, wherein a mass ratio of the content of the organic component to the content of the metal ions is 0.1 to 5.

18. The chemical solution according to any one of claims 12 to 17, wherein a mass ratio of the content of the organic component to the content of the metal ions is 0.2 to 1.

3.

19. Contains two or more of the organic components, The chemical solution according to any one of claims 1 to 18, wherein the boiling point of one or more of the two or more organic components is 380°C or higher.

20. The organic solvent contains two or more organic components selected from the group consisting of alkanes having 12 to 50 carbon atoms, The chemical solution according to any one of claims 1 to 19, wherein the mass content of any one of the alkanes having 16 to 34 carbon atoms among the two or more alkanes having 12 to 50 carbon atoms is the largest.

21. A method for treating a vascular disease comprising: a container; and the chemical solution according to any one of claims 1 to 20 contained in the container; A chemical solution container, wherein a liquid-contacting portion that comes into contact with the chemical solution in the container is made of electropolished stainless steel or fluorine-based resin.

22. 22. The drug solution container according to claim 21, wherein the void ratio within the container calculated by formula (1) is 2 to 50% by volume. Equation (1): Porosity = {1 - (volume of the chemical solution in the container / container volume of the container)} x 100

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