Packaging structures, devices and methods of forming same
The packaging structure with a slit and recess design for sound-generating cells addresses the challenge of high yield and performance, enhancing manufacturing reliability and efficiency.
Patent Information
- Application Number
- JP2025074987
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-07-25
- Filing Date
- 2025-04-28
- Publication Date
- 2025-11-05
- Estimated Expiration
- 2043-09-08
AI Technical Summary
Existing microspeakers face challenges in achieving high yield rates and performance, particularly in the manufacturing of sound-generating cells with complex designs.
A packaging structure for sound-generating cells is designed with a specific slit and recess configuration, incorporating a membrane with opposite subparts connected to an anchor structure, and a method for forming this structure using semiconductor processes.
The proposed design enhances yield and performance by reducing stress concentration during manufacturing, improving the reliability and efficiency of sound-generating cells.
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Abstract
Description
[Technical Field]
[0001] The present invention relates to a packaging structure, a device, and a method for forming the same, and more particularly to a packaging structure including a sound-generating cell with a high yield rate and / or high performance, a device including the packaging structure, a method for forming the packaging structure, and a method for forming the device. [Background technology]
[0002] Micro sound generating devices, such as MEMS (microelectromechanical systems) microspeakers, have been rapidly developed in recent years because their small size allows them to be used in various electronic devices. For example, a MEMS microspeaker may use a thin-film piezoelectric material as an actuator and a silicon-containing layer as a membrane, which are formed by at least one semiconductor process. To enable the widespread use of microspeakers, the industry is working to design microspeakers with high yield rates and high performance. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] U.S. Patent Application Publication No. 2020 / 0100033 [Patent Document 2] U.S. Patent No. 1,135,0217 [Patent Document 3] US Patent Application Publication No. 2013 / 0018218 [Patent Document 4] US Patent Application Publication No. 2014 / 0121449 [Patent Document 5] US Patent Application Publication No. 2014 / 0121450 Summary of the Invention [Means for solving the problem]
[0004] Therefore, a primary object of the present invention is to provide a packaging structure including a sound-generating cell with a specific slit design and / or a specific recess design for improving yield and performance, and to provide a method for forming the packaging structure. The present invention also provides a device including the packaging structure, and to provide a method for forming the device.
[0005] One embodiment of the present invention provides a packaging structure including a cover and a cell disposed within the cover. The cell includes a membrane, an actuation layer, and an anchor structure. The membrane includes a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart being opposite each other when viewed along a top view direction, and the first membrane subpart and the second membrane subpart being opposite each other in a first direction perpendicular to the top view direction. The actuation layer is disposed on the first membrane subpart and the second membrane subpart in the top view direction. The membrane is fixed by the anchor structure. The first membrane subpart includes a first fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and an end of the first membrane subpart other than the first fixed end is unfixed. The second membrane subpart includes a second fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and an end of the second membrane subpart other than the second fixed end is unfixed.
[0006] Another embodiment of the present invention provides an apparatus including a housing and the above-described packaging structure.
[0007] Another embodiment of the present invention provides a method for forming a package structure. The method includes performing a manufacturing method to produce a cell and placing the cell in a cover. The method for manufacturing a cell includes providing a wafer including a first layer and a second layer and patterning the first layer of the wafer to form at least one trench line. The first layer includes a membrane secured by anchor structures of the cell, the at least one trench line forming at least one slit in the membrane and penetrating the membrane. The membrane includes a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart being opposite each other when viewed along a top view direction, and the first membrane subpart and the second membrane subpart being opposite each other in a first direction perpendicular to the top view direction. The first membrane subpart includes a first fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and an end of the first membrane subpart other than the first fixed end is free. The second membrane subpart includes a second fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and an end of the second membrane subpart other than the second fixed end is free.
[0008] Another embodiment of the present invention provides a method of forming a device, the method comprising forming a packaging structure according to the method described above, and assembling the packaging structure via surface mount technology to a device including a housing.
[0009] These and other objects of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. [Brief explanation of the drawings]
[0010] [Figure 1] FIG. 1 is a schematic top view showing a sound generating cell according to a first embodiment of the present invention. [Figure 2]FIG. 2 is an enlarged schematic view showing the structure of region R1 in FIG. [Figure 3] 3A to 3C are schematic diagrams illustrating a structure at different steps of a method for manufacturing a sound generating cell according to an embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram illustrating a structure at different steps of a method for manufacturing a sound generating cell according to an embodiment of the present invention. [Figure 5] FIG. 5 is a schematic diagram illustrating a structure at different steps of a method for manufacturing a sound-generating cell according to an embodiment of the present invention. [Figure 6] FIG. 6 is a schematic diagram illustrating a structure at different steps of a method for manufacturing a sound generating cell according to an embodiment of the present invention. [Figure 7] FIG. 7 is a schematic diagram illustrating a structure at different steps of a method for manufacturing a sound generating cell according to an embodiment of the present invention. [Figure 8] FIG. 8 is a schematic diagram illustrating a structure at different steps of a method for manufacturing a sound generating cell according to an embodiment of the present invention. [Figure 9] FIG. 9 is a schematic top view showing a sound generating cell according to a second embodiment of the present invention. [Figure 10] FIG. 10 is an enlarged schematic view showing the structure of region R2 in FIG. [Figure 11] FIG. 11 is a schematic top view showing a sound generating cell according to a third embodiment of the present invention. [Figure 12] FIG. 12 is a schematic top view showing a sound generating cell according to a fourth embodiment of the present invention. [Figure 13] FIG. 13 is a schematic top view showing a sound generating cell according to a fifth embodiment of the present invention. [Figure 14] FIG. 14 is a schematic top view showing a sound generating cell according to a sixth embodiment of the present invention. [Figure 15] FIG. 15 is an enlarged schematic view showing the structure of region R3 in FIG. [Figure 16] FIG. 16 is a schematic top view showing a sound generating cell according to a seventh embodiment of the present invention. [Figure 17]FIG. 17 is a schematic top view showing a sound generating cell according to an eighth embodiment of the present invention. [Figure 18] FIG. 18 is a schematic top view showing a sound generating cell according to a ninth embodiment of the present invention. [Figure 19] FIG. 19 is a schematic cross-sectional view showing a sound generating cell according to a ninth embodiment of the present invention. [Figure 20] FIG. 20 is a schematic top view showing a sound generating cell according to a tenth embodiment of the present invention. [Figure 21] FIG. 21 is a schematic diagram showing a package structure according to one embodiment of the present invention. [Figure 22] FIG. 22 is a bottom view showing the package structure shown in FIG. [Figure 23] FIG. 23 is a schematic cross-sectional view showing the package structure shown in FIG. [Figure 24] FIG. 24 is a schematic diagram showing a package structure according to one embodiment of the present invention. [Figure 25] FIG. 25 is a schematic cross-sectional view showing a package structure according to one embodiment of the present invention. [Figure 26] FIG. 26 is a schematic cross-sectional view showing the diagram. [Figure 27] FIG. 27 is a schematic diagram showing a package structure according to one embodiment of the present invention. [Figure 28] FIG. 28 is a schematic cross-sectional view showing the package structure shown in FIG. [Figure 29] FIG. 29 is a schematic cross-sectional view of an apparatus according to one embodiment of the present invention. [Figure 30] FIG. 30 is a schematic diagram illustrating an apparatus according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0011] In order to provide those skilled in the art with a better understanding of the present invention, preferred embodiments and general material or range parameters of the main components are detailed in the following description. These preferred embodiments of the present invention are shown in the accompanying drawings with numbered elements to further describe the contents and effects to be achieved. Note that the drawings are simplified schematic diagrams, and the material and parameter ranges of the main components are examples based on today's technology to provide a clearer explanation of the basic structure, implementation, or operation method of the present invention, and only show components and combinations relevant to the present invention. In reality, components may be more complex, and the ranges of parameters or materials used may evolve according to future technological advances. In addition, for ease of explanation, the components shown in the drawings may not represent their actual number, shape, and dimensions, and details may be adjusted according to design requirements.
[0012] In the following description and claims, the terms "comprises," "includes," and "having" are used in an open-ended manner and should be interpreted to mean "including, but not limited to." Thus, when the terms "comprises," "includes," and / or "having" are used in describing the invention, they may refer to the presence of corresponding features, regions, steps, operations, and / or components, but are not limited to the presence of one or more corresponding features, regions, steps, operations, and / or components.
[0013] In the following description and claims, when "a B1 component is formed by / from C1," it means that C1 is present in or used to form the B1 component, and does not exclude the presence and use of one or more other features, regions, steps, operations and / or components in forming the B1 component.
[0014] In the following, the term "horizontal" generally means a direction parallel to a horizontal plane, the term "horizontal plane" generally means a plane parallel to the directions X and Y in the drawings, and the terms "vertical" and "top-view" generally mean a direction parallel to the direction Z in the drawings, the directions X, Y and Z being perpendicular to each other. In the following, the terms "top view" and "bottom view" generally mean a visual effect along the vertical direction, and the term "side view" generally means a visual effect along the horizontal direction.
[0015] In the following description and claims, the term "substantially" generally means that there may be small or no deviations. For example, the terms "substantially parallel" and "substantially along" mean that the angle between two components is equal to or less than a certain angle threshold, for example, 10 degrees, 5 degrees, 3 degrees, or 1 degree. For example, the term "substantially aligned" means that the deviation between two components may be equal to or less than a certain difference threshold, for example, 2 μm or 1 μm. For example, the term "substantially the same" means that the deviation is within 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.
[0016] Terms such as first, second, and third may be used to describe various components, but such components are not limited by such terms. Such terms are used in the specification only to distinguish one component from another, and unless otherwise specified in the specification, such terms do not relate to the order of manufacture. The same terms may be used in the claims, but terms such as first, second, and third may be used in relation to the order in which elements are described. Thus, in the following description, a first component may be a second component in the claims.
[0017] It should be noted that the technical features in the different embodiments described below can be substituted, recombined or mixed with each other to form other embodiments without departing from the spirit of the present invention.
[0018] In the present invention, a sound-generating cell may perform acoustic transduction, converting a signal (e.g., an electrical signal or other suitable type of signal) into sound waves. In some embodiments, the sound-generating cell may be, without limitation, a component within a sound-generating device, speaker, microspeaker, or other suitable device for converting electrical signals into sound waves. Note that operation of a sound-generating cell refers to acoustic transduction performed by the sound-generating cell (e.g., sound waves are generated by actuating the sound-generating cell with an electrical drive signal).
[0019] In use, the sound-generating cell may be placed on a base. The base may be rigid or flexible and may include silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g., polyimide (PI), polyethylene terephthalate (PET)), any other suitable material, or a combination thereof. By way of example, the base may be, but is not limited to, a circuit board including a laminate (e.g., copper clad laminate, CCL), a land grid array (LGA) board, or any other suitable substrate including a conductive material. Note that the normal direction of the base may be parallel to the Z direction in the drawing.
[0020] 1 and 2, Fig. 1 is a schematic top view showing a sound-generating cell according to a first embodiment of the present invention, and Fig. 2 is an enlarged schematic view showing the structure of region R1 in Fig. 1. As shown in Fig. 1, the sound-generating cell 100 includes a membrane 110 and at least one anchor structure 120 on the outer side of the membrane 110, and the membrane 110 is connected to the anchor structure 120 so as to be fixed by the anchor structure 120. For example, the membrane 110 may be surrounded by the anchor structure 120, but is not limited thereto.
[0021] In operation of the sound generating cell 100, the membrane 110 can be actuated to move. In this embodiment, the membrane 110 can be actuated to move in, but not limited to, an upward and downward direction. It is noted that, in the present invention, the terms "moving upward" and "moving downward" refer to the membrane 110 moving substantially along the direction Z. During operation of the sound generating cell 100, the anchor structure 120 can be fixed. That is, the anchor structure 120 can be a fixed end (or fixed edge) relative to the membrane 110 during operation of the sound generating cell 100.
[0022] The shape of the membrane 110 can be designed based on requirements. In some embodiments, the shape of the membrane 110 can be, but is not limited to, a polygon (i.e., a rectangle or a beveled rectangle), a shape with curved edges, or other suitable shapes. For example, the shape of the membrane 110 shown in FIG. 1 can be a beveled rectangle, but is not limited to such a configuration.
[0023] The membrane 110 and the anchor structure 120 may comprise any suitable material. In some embodiments, the membrane 110 and the anchor structure 120 may individually comprise, but are not limited to, silicon (e.g., monocrystalline silicon or polycrystalline silicon), a silicon compound (e.g., silicon carbide or silicon oxide), germanium, a germanium compound (e.g., gallium nitride or gallium arsenide), gallium, a gallium compound, or a combination thereof. The materials of the membrane 110 and the anchor structure 120 may be the same or different.
[0024] 1, the membrane 110 includes a first membrane subpart 112 and a second membrane subpart 114, which are opposite each other when viewed from above (i.e., the first membrane subpart 112 and the second membrane subpart 114 are opposite each other in a horizontal direction (e.g., direction Y) perpendicular to the top view direction (i.e., direction Z)), and only one end of the first membrane subpart 112 is fixed by being connected to an anchor structure 120, and only one end of the second membrane subpart 114 is fixed by being connected to an anchor structure 120, while the other ends of the first membrane subpart 112 and the second membrane subpart 114 are not fixed and are not connected to the anchor structure 120 (hereinafter, these ends will be referred to as "unfixed ends"). That is, in FIG. 1 , the first fixed end 112a of the first membrane subpart 112 is the only fixed end of the first membrane subpart 112, and the second fixed end 114a of the second membrane subpart 114 is the only fixed end of the second membrane subpart 114, with the first membrane subpart 112 directly connected to the anchor structure 120 via only the first fixed end 112a, and the second membrane subpart 114 directly connected to the anchor structure 120 via only the second fixed end 114a. In the present invention, the first fixed end 112a and the second fixed end 114a can be fully or partially fixed. For example, in the embodiment shown in FIG. 1 , the first fixed end 112a and the second fixed end 114a are fully fixed.
[0025] As shown in Fig. 1, the membrane 110 has a plurality of slits SL, and the membrane 110 can be divided into subparts by the slits SL. In the present invention, the slits SL may have at least one straight line pattern, at least one curved line pattern, or a combination thereof, and the width of the slits SL must be sufficiently small. For example, the width of the slits SL may be in the range of 1 µm to 5 µm, but is not limited thereto.
[0026] In Figures 1 and 2, the membrane 110 may have a first slit SL1, at least one second slit SL2, and at least one third slit SL3, where the first slit SL1 is formed between the first membrane subpart 112 and the second membrane subpart 114, the second slit SL2 is formed between the first membrane subpart 112 and the anchor structure 120, and the third slit SL3 is formed between the second membrane subpart 114 and the anchor structure 120, and the end of the second slit SL2 may be located in a corner region CR of the membrane 110 (shown in Figure 2), and the end of the third slit SL3 may be located in another corner region CR of the membrane 110. For example, in FIG. 1, the membrane 110 may have one linear first slit SL1, two second slits SL2, and two third slits SL3, and the first membrane subpart 112 may be between the two second slits SL2 when viewed from above, and the second membrane subpart 114 may be between the two third slits SL3 when viewed from above, but is not limited to such a configuration.
[0027] 1, the non-fixed ends of each subpart may be defined by slits SL. For the first membrane subpart 112, a first non-fixed end 112n1 opposite the first fixed end 112a when viewed from above may be defined by a first slit SL1, and a second non-fixed end 112n2 adjacent to the first fixed end 112a may be defined by a second slit SL2. For the second membrane subpart 114, a third non-fixed end 114n3 opposite the second fixed end 114a when viewed from above may be defined by a first slit SL1, and a fourth non-fixed end 114n4 adjacent to the second fixed end 114a may be defined by a third slit SL3.
[0028] In the present invention, the shape of the subparts of the membrane 110 may be designed based on requirements, and the shape of the subparts of the membrane 110 may be polygonal (i.e., rectangular), curved, or other suitable shapes. For example, in FIG. 1, the shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 are substantially rectangular, and the first membrane subpart 112 and the second membrane subpart 114 may be substantially identical, but are not limited to this. Therefore, in FIG. 1, the second non-fixed end 112n2 may be adjacent to and between the first non-fixed end 112n1 and the first fixed end 112a, and the fourth non-fixed end 114n4 may be adjacent to and between the third non-fixed end 114n3 and the second fixed end 114a, but is not limited to this configuration. In FIG. 1, the second slit SL2 and the third slit SL3 are connected to the first slit SL1. For example, the first slit SL1 may be, but is not limited to be, connected between two second slits SL2 and between two third slits SL3.
[0029] The shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 may be substantially rectangular, so that the first fixed end 112a, the first non-fixed end 112n1, the second fixed end 114a, and the third non-fixed end 114n3 are substantially parallel to each other and have substantially the same length, and the second non-fixed end 112n2 and the fourth non-fixed end 114n4 are substantially parallel to each other (i.e., parallel to the direction X) and have substantially the same length. That is, the first slit SL1 defining the first non-fixed end 112n1 and the third non-fixed end 114n3 is parallel to the first fixed end 112a and the second fixed end 114a.
[0030] In some embodiments, in FIG. 1, the second slit SL2 and the third slit SL3 may be connected so that they combine to form a long, straight slit, but are not limited to such a configuration.
[0031] 1, the first fixed end 112a of the first membrane subpart 112 is one of the ends of the membrane 110, and the second fixed end 114a of the second membrane subpart 114 is another of the ends of the membrane 110. The second non-fixed end 112n2 of the first membrane subpart 112 may or may not be one of the ends of the membrane 110, and the fourth non-fixed end 114n4 of the second membrane subpart 114 may or may not be one of the ends of the membrane 110. For example, in Figure 1, when viewed from above, the second slit SL2 is between the first membrane subpart 112 and one of the ends of the membrane 110, and when viewed from above, the third slit SL3 is between the second membrane subpart 114 and one of the ends of the membrane 110, so that the second non-fixed end 112n2 of the first membrane subpart 112 does not have to be an end of the membrane 110, and the fourth non-fixed end 114n4 of the second membrane subpart 114 does not have to be an end of the membrane 110, but is not limited to such a configuration.
[0032] It should be noted that the slits SL may release residual stress in the film 110, which may be generated during the manufacturing process of the film 110 or may be inherently present in the film 110.
[0033] The sound-generating cell 100 may include an actuation layer 130 disposed on the membrane 110 in direction Z and configured to actuate the membrane 110. In some embodiments, as shown in FIG. 1 , the actuation layer 130 may not completely overlap the membrane 110 when viewed from above. For example, in FIG. 1 , the actuation layer 130 may be disposed on the first membrane subpart 112 and the second membrane subpart 114, and the actuation layer 130 may overlap a portion of the first membrane subpart 112 and a portion of the second membrane subpart 114 when viewed from above. Optionally, in FIG. 1 , the actuation layer 130 may be disposed on and overlap the anchor structure 120, and the actuation layer 130 may overlap the fixed ends of the subparts of the membrane 110, but is not limited to such a configuration.
[0034] As shown in FIG. 1, in order to improve the reliability of the slits SL and the actuation layer 130, there may be a distance between the actuation layer 130 and the slits SL when viewed from above, but the present invention is not limited to such a configuration.
[0035] The actuation layer 130 may include an actuator having a monotonic electromechanical transduction function with respect to the movement of the membrane 110 along the Z direction. In some embodiments, the actuation layer 130 may include, but is not limited to, a piezoelectric actuator, an electrostatic actuator, a nanoscale electrostatic drive (NED) actuator, an electromagnetic actuator, or any other suitable actuator. For example, in one embodiment, the actuation layer 130 may include a piezoelectric actuator, which may include two electrodes, a piezoelectric material layer (e.g., lead zirconate titanate, PZT) disposed between the electrodes, etc., which may actuate the membrane 110 based on a drive signal (e.g., a drive voltage) received by the electrodes, but is not limited to such a configuration. For example, in another embodiment, the actuation layer 130 may include, but is not limited to, an electromagnetic actuator (e.g., a planar coil), which may actuate the membrane 110 based on a received drive signal (e.g., a drive current) and a magnetic field (i.e., the membrane 110 may be actuated by an electromagnetic force). For example, in yet another embodiment, the actuation layer 130 may include an electrostatic actuator (e.g., a conductive plate) or an NED actuator, which may actuate the membrane 110 based on a received drive signal and electrostatic field (i.e., the membrane 110 may be actuated by electrostatic force), but is not limited to such a configuration.
[0036] The membrane 110 is actuated by the actuation layer 130 to move along the direction Z, thereby providing acoustic transduction. That is, sub-parts of the membrane 110 are actuated to move up and down to provide acoustic transduction. Note that sound waves are generated by the movement of the membrane 110 actuated by the actuation layer 130, and the movement of the membrane 110 is related to the sound pressure level (SPL) of the sound waves.
[0037] As the subparts move up and down, openings in direction Z may be formed adjacent to all of the non-fixed ends. For example, during operation of the sound-generating cell 100, a central opening may be formed between the first non-fixed end 112n1 of the first membrane subpart 112 and the third non-fixed end 114n3 of the second membrane subpart 114, and side openings may be formed between the second non-fixed end 112n2 of the first membrane subpart 112 and the anchor structure 120 and between the fourth non-fixed end 114n4 of the second membrane subpart 114 and the anchor structure 120, respectively.
[0038] The subparts of the membrane 110 move along the same or opposite directions based on requirements. In some embodiments, the first membrane subpart 112 and the second membrane subpart 114 may move up and down synchronously in direction Z (i.e., the first membrane subpart 112 and the second membrane subpart 114 may be actuated to move in the same direction) to avoid the formation of a large central opening between the first membrane subpart 112 and the second membrane subpart 114, but are not limited to such a configuration.
[0039] The actuation layer 130 may actuate the membrane 110 to generate acoustic waves based on a received drive signal, where the acoustic waves correspond to an input audio signal and the drive signal applied to the actuation layer 130 corresponds to (is related to) the input audio signal.
[0040] It should be noted that the short sides of the sound-generating cell 100 (or membrane 110) may be advantageous for achieving a higher resonant frequency, while the long sides of the sound-generating cell 100 (or membrane 110) may be advantageous for increasing the SPL. That is, a sound-generating cell 100 (or membrane 110) with a large aspect ratio, which is the ratio of the long side length to the short side length, may be able to achieve both a higher resonant frequency and a larger SPL than a cell with a small aspect ratio. The aspect ratio of the sound-generating cell 100 (or membrane 110) may depend on practical requirements. For example, to improve the performance of the sound-generating cell 100, the aspect ratio of the sound-generating cell 100 (or membrane 110) may be greater than 2, but is not limited to such a configuration.
[0041] The following provides further details of the method for manufacturing the sound-generating cell 100, with further examples. Note that in the following manufacturing method, the actuation layer 130 of the sound-generating cell 100 may include, for example, a piezoelectric actuator, but is not limited to such a configuration. The actuation layer 130 of the sound-generating cell 100 may include any suitable type of actuator.
[0042] In the following manufacturing methods, the formation process may include atomic layer deposition (ALD), chemical vapor deposition (CVD), and other suitable processes or combinations thereof. The patterning process may include photolithography, etching processes, any other suitable processes or combinations thereof, etc.
[0043] 3 to 8, which are schematic diagrams illustrating a structure at different steps of a method for manufacturing a sound-generating cell according to one embodiment of the present invention. In this embodiment, the sound-generating cell 100 can be manufactured by at least one semiconductor process to be, but not limited to, a MEMS chip. As shown in FIG. 3, a wafer WF is prepared, which includes a first layer WL1 and a second layer WL2, and may optionally include an insulating layer WL3 between the first layer WL1 and the second layer WL2.
[0044] The first layer WL1, the insulating layer WL3, and the second layer WL2 may each include any suitable material so that the wafer WF can be of any suitable type. For example, the first layer WL1 and the second layer WL2 may each include, but are not limited to, silicon (e.g., monocrystalline silicon or polycrystalline silicon), a silicon compound (e.g., silicon carbide, silicon oxide), a germanium compound, gallium, a gallium compound (e.g., gallium nitride, gallium arsenide), or a combination thereof. In some embodiments, the first layer WL1 may include monocrystalline silicon so that the wafer WF is a silicon-on-insulator (SOI) wafer, but is not limited to such a configuration. For example, the insulating layer WL3 may include, but is not limited to, an oxide such as silicon oxide (e.g., silicon dioxide). The thicknesses of the first layer WL1, the insulating layer WL3, and the second layer WL2 may be individually adjusted based on requirements.
[0045] 3, a compensation oxide layer CPS may be optionally formed on the upper side of the wafer WF, the upper side being above the upper surface WL1a of the first layer WL1 opposite to the second layer WL2, and the first layer WL1 being between the compensation oxide layer CPS and the second layer WL2. The material of the oxide included in the compensation oxide layer CPS and the thickness of the compensation oxide layer CPS can be designed based on requirements.
[0046] 3, the first conductive layer CT1 and the actuating material AM are sequentially formed on the upper side of the wafer WF (on the first layer WL1), and the first conductive layer CT1 may be between the actuating material AM and the first layer WL1. In some embodiments, the first conductive layer CT1 may contact the actuating material AM.
[0047] The first conductive layer CT1 may include any suitable conductive material, and the actuation material AM may include any suitable material. In some embodiments, the first conductive layer CT1 may include a metal (such as platinum), and the actuation material AM may include a piezoelectric material, but is not limited to such a configuration. For example, the piezoelectric material may include, but is not limited to, a lead zirconate titanate (PZT) material, etc. Furthermore, the thicknesses of the first conductive layer CT1 and the actuation material AM may be individually adjusted based on requirements.
[0048] Next, in FIG. 3, the actuation material AM, the first conductive layer CT1 and the compensation oxide layer CPS can be patterned in sequence.
[0049] As shown in Figure 4, an isolation insulating layer SIL can be formed and patterned on the actuation material AM. The thickness and material of the isolation insulating layer SIL can be designed based on requirements. For example, the material of the isolation insulating layer SIL can be, but is not limited to, oxide.
[0050] As shown in FIG. 4, a second conductive layer CT2 may be formed on the actuation material AM and the isolation insulating layer SIL, and then the second conductive layer CT2 may be patterned. The thickness and material of the second conductive layer CT2 may be designed based on requirements. For example, the second conductive layer CT2 may include, but is not limited to, a metal (such as platinum). For example, the second conductive layer CT2 may contact the actuation material AM.
[0051] The actuation material AM, the first conductive layer CT1 and the second conductive layer CT2 may be sublayers within the actuation layer 130 of the sound-generating cell 100 such that the actuation layer 130 has a piezoelectric actuator including two electrodes and the actuation material AM between the two electrodes (e.g., the first conductive layer CT1 and the second conductive layer CT2 function as a first electrode and a second electrode, respectively, in the actuation layer 130).
[0052] In FIG. 4, the separation insulating layer SIL may be configured to separate at least a portion of the first conductive layer CT1 from at least a portion of the second conductive layer CT2.
[0053] As shown in Figure 5, the first layer WL1 of the wafer WF can be patterned to form trench lines TL. In Figure 5, the trench lines TL are the portions of the first layer WL1 that have been removed. That is, the trench lines TL are between two portions of the first layer WL1.
[0054] As shown in Figure 6, the wafer WF is placed on the substrate SB and the adhesive layer AL, and the adhesive layer AL is bonded between the substrate SB and the first layer WL1 of the wafer WF. In Figure 6, the actuation layer 130 is between the wafer WF and the substrate SB. This step allows the first layer WL1 of the wafer WF and structures above the wafer WF (i.e., structures above the upper surface WL1a of the wafer WF) to be protected in subsequent steps.
[0055] As shown in FIG. 7 , the second layer WL2 of the wafer WF may be patterned so that the second layer WL2 forms the anchor structure 120 and the first layer WL1 forms the membrane 110 secured to the anchor structure 120. Specifically, the second layer WL2 of the wafer WF may have a first portion and a second portion, and the first portion of the second layer WL2 may be removed, and the second portion of the second layer WL2 may form the anchor structure 120. Because the first portion of the second layer WL2 is removed, the first layer WL1 forms the membrane 110, which corresponds to the removed first portion of the second layer WL2 when viewed from above. For example, the first portion of the second layer WL2 may be removed by, but is not limited to, a reactive ion etching (DRIE) process. Note that subparts of the membrane 110 (e.g., the first membrane subpart 112 and the second membrane subpart 114) are determined when the first layer WL1 of the wafer WF is patterned to form the trench line TL.
[0056] Optionally, in FIG. 7, since the insulating layer WL3 of the wafer WF is present, after patterning the second layer WL2 of the wafer WF, a portion of the insulating layer WL3 corresponding to the first portion of the second layer WL2 may be removed so that the first layer WL1 forms the film 110, but is not limited to such a configuration.
[0057] Further, in FIG. 7, the second portion of the second layer WL2, the portion of the insulating layer WL3 overlapping the second portion of the second layer WL2, and the portion of the first layer WL1 overlapping the second portion of the second layer WL2 can combine to function as anchor structure 120.
[0058] 8, removing the substrate SB and adhesive layer AL by an appropriate process completes the fabrication of the sound generating cell 100. For example, the substrate SB and adhesive layer AL may be removed by, but are not limited to, a peeling process.
[0059] 8, a first portion of the second layer WL2 is removed to form the membrane 110 included in the first layer WL1, so that the trench lines TL form slits SL in the membrane 110 and penetrate the membrane. Because the slits SL are formed by the trench lines TL, the width of the trench lines TL can be designed based on the requirements of the slits SL. For example, the width of the trench lines TL can be, but is not limited to, 5 μm or less, 3 μm or less, or 2 μm or less so that the slits SL have a desired width.
[0060] The sound generating cell and its manufacturing method of the present invention are not limited to the above-described embodiments. Other embodiments of the present invention are described below. For ease of comparison, the same components are denoted by the same reference numerals below. The following description focuses on the differences between the embodiments, and overlapping parts will not be repeated.
[0061] 9 and 10, Fig. 9 is a schematic top view showing a sound generating cell according to a second embodiment of the present invention, and Fig. 10 is an enlarged schematic view showing the structure of region R2 in Fig. 9. As shown in Figs. 9 and 10, the difference between this embodiment and the first embodiment is that the sound generating cell 200 of this embodiment includes recessed structures RS arranged at the corners of the sound generating cell 200 and outside the membrane 110, and the recessed structures RS are directly connected to the slit sections SLs in the corner regions CR of the membrane 110. In the embodiment shown in Fig. 9, the sound generating cell 200 may include, but is not limited to, four recessed structures RS arranged at the four corners of the sound generating cell 200 and outside the membrane 110.
[0062] The slit segments SLs in the corner region CR may be slits SL connected to the second slits SL2 or the third slits SL3, or may be part of the second slits SL2 or part of the third slits SL3. The slit segments SLs may have a curved pattern, a straight pattern, or a combination thereof. For example, in FIG. 10 , the slit segments SLs are connected between the end of the second slit SL2 located in the corner region CR and the recess structure RS, and the slit segments SLs may have, but are not limited to, a curved pattern.
[0063] 9 and 10, the recessed structure RS may be formed on the anchor structure 120 and at a corner of the sound-generating cell 200. For example, the sound-generating cell 200 may have a first layer WL1 and a second layer WL2 disposed below the first layer WL1 (e.g., FIG. 8), where a portion of the first layer WL1 is configured to function as the membrane 110 (i.e., the first layer WL1 may include the membrane 110), another portion of the first layer WL1 surrounds the membrane 110 and combines with the second layer WL2 to form the anchor structure 120, where the slit sections SLs in the corner regions CR of the membrane 110 pass through the first layer WL1, and the recessed structure RS passes through the first layer WL1 and has a bottom that belongs to the anchor structure 120 (e.g., the second layer WL2), but is not limited to such a configuration. In this case, in the manufacturing method of the sound-generating cell 200, the slits SL and the recessed structure RS in the membrane 110 may be patterned (etched) in the same process (the same etching process).
[0064] 9 and 10, the recess structure RS may have a curved pattern, and the curved pattern of the recess structure RS can be designed based on requirements. For example, in Fig. 10, the slit sections SLs of the corner region CR and the recess structure RS can be combined to form a semicircular arc pattern, but are not limited to such a configuration.
[0065] The presence of the curved recess structures RS connected to the slit sections SLs located in the corner regions CR can increase the success rate of the manufacturing process of the sound generating cell 200, thereby increasing the yield rate of the sound generating cell 200. Specifically, in the process of removing the substrate SB and the adhesive layer AL (e.g., a peeling process), the presence of the curved recess structures RS connected to the slit sections SLs located in the corner regions CR changes the stress concentration position from the corner regions CR of the film 110 (e.g., the ends of the slits SL) to the recess structures RS, and the stress acting on the recess structures RS can be dispersed, thereby reducing damage to the film 110 in this process. Furthermore, because the recess structures RS have a curved pattern, the stress acting on the recess structures RS can be effectively dispersed in this process, thereby reducing damage to the recess structures RS and increasing the success rate of the manufacturing process of the sound generating cell 200.
[0066] Referring to FIG. 11, FIG. 11 is a schematic top view showing a sound-generating cell according to a third embodiment of the present invention. As shown in FIG. 11, the difference between this embodiment and the first embodiment is that the membrane 110 of the sound-generating cell 300 of this embodiment includes a latch structure 310. Under the condition that the first membrane subpart 112 and the second membrane subpart 114 move along direction Z (i.e., the normal direction of the base on which the membrane 110 is disposed), the latch structure 310 can lock the first membrane subpart 112 and the second membrane subpart 114 when the movement distance of the first membrane subpart 112 along direction Z and the movement distance of the second membrane subpart 114 along direction Z are greater than a threshold value. That is, the latch structure 310 is configured to limit the movement distance of the first membrane subpart 112 and the second membrane subpart 114.
[0067] Because the subparts of the membrane 110 have only one fixed end, the subparts of the membrane 110 are fragile and may be damaged during the manufacturing process. In this embodiment, the presence of the latch structure 310 increases the success rate of manufacturing the membrane 110 and increases the yield rate of the sound-generating cell 300. Specifically, in the process of removing the substrate SB and the adhesive layer AL (e.g., a peeling process), the displacement of the first membrane subpart 112 and the displacement of the second membrane subpart 114 in direction Z are caused by the adhesive force of the adhesive layer AL. In this case, when the first membrane subpart 112 and the second membrane subpart 114 move along direction Z with a displacement exceeding a threshold, the latch structure 310 locks the first membrane subpart 112 and the second membrane subpart 114 to limit their movement and provide a restoring force for the first membrane subpart 112 and the second membrane subpart 114, thereby reducing damage to the membrane 110.
[0068] The latch structure 310 may have any suitable design based on requirements. In this embodiment, the latch structure 310 shown in FIG. 11 may be formed by slits SL. For example, in FIG. 11, the latch structure 310 is formed by two first slits SL1 and three fourth slits SL4 and SL4', where the first slits SL1 and the fourth slits SL4 and SL4' are located between the first membrane subpart 112 and the second membrane subpart 114, and the three fourth slits SL4 and SL4' are connected between the two first slits SL1. In FIG. 11, the first slits SL1 may be parallel to each other, but are not limited to such a configuration. In FIG. 11, the fourth slit SL4′ extending along the direction X is connected between two fourth slits SL4 extending along the direction Y, and the fourth slit SL4 extending along the direction Y may be connected between the fourth slit SL4′ extending along the direction X and the first slit SL1 extending along the direction X, but is not limited to such a configuration.
[0069] 11 , the latch structure 310 includes a first latch component 312 and a second latch component 314, where the first latch component 312 is part of the first membrane subpart 112 (equivalently, the first latch component 312 may belong to the first membrane subpart 112), and the second latch component 314 may be part of the second membrane subpart 114 (equivalently, the second latch component 314 may belong to the second membrane subpart 114). In FIG. 11 , the first latch component 312 is disposed between the second latch component 314 of the second membrane subpart 114 and another portion of the second membrane subpart 114, and the second latch component 314 may be disposed between the first latch component 312 of the first membrane subpart 112 and another portion of the first membrane subpart 112. For example, in FIG. 11, the length direction of the first latch component 312 and the length direction of the second latch component 314 may be substantially parallel to the direction X, but are not limited to such a configuration.
[0070] When the first membrane subpart 112 and the second membrane subpart 114 move along the direction Z with a displacement greater than a threshold value, the first latch component 312 buckles to the second latch component 314, locking the first membrane subpart 112 and the second membrane subpart 114. Note that the width of the slit SL and the size of the latch component are related to the buckling effect of the latch structure 310.
[0071] Referring to Fig. 12, Fig. 12 is a schematic top view showing a sound-generating cell according to a fourth embodiment of the present invention. As shown in Fig. 12, the difference between this embodiment and the first embodiment is that the membrane 110 of the sound-generating cell 400 of this embodiment includes at least one spring connected between subparts of the membrane 110, and the number of springs can be designed based on requirements. In Fig. 12, the membrane 110 can include a first spring SPR1 directly connected between the first membrane subpart 112 and the second membrane subpart 114.
[0072] The presence of the first spring SPR1 can increase the success rate of manufacturing the membrane 110 and increase the yield rate of the sound generating cell 400. Specifically, in the process of removing the substrate SB and the adhesive layer AL, the displacement of the first membrane subpart 112 and the displacement of the second membrane subpart 114 along the direction Z are caused by the adhesive force of the adhesive layer AL. When the first membrane subpart 112 and the second membrane subpart 114 move along the direction Z with a large displacement, the first spring SPR1 limits the movement of the first membrane subpart 112 and the second membrane subpart 114 and applies a restoring force to the first membrane subpart 112 and the second membrane subpart 114, thereby reducing damage to the membrane 110.
[0073] The spring may have an appropriate design based on requirements. As shown in FIG. 12, the first spring SPR1 may be formed by a slit SL. In this embodiment, the first spring SPR1 shown in FIG. 12 is formed by two first slits SL1 and two fifth slits SL5, where the fifth slits SL5 are connected to the first slits SL1, and the fifth slits SL5 may have a curved pattern. For example, the fifth slits SL5 may include a hook-shaped curved pattern, and one end of the fifth slit SL5 is not connected to another slit SL, but this configuration is not limited to this. For example, the first slits SL1 may be parallel to each other, but this configuration is not limited to this.
[0074] When the membrane 110 moves, the spring may be subjected to stress caused by the deformation of the membrane 110. In Figure 12, the fifth slit SL5 includes a curved pattern (i.e., a hook-shaped curved pattern), which reduces the effect of stress concentration and reduces damage to the membrane 110 and the first spring SPR1, which may increase the yield rate of the sound generating cell 400.
[0075] In addition, as shown in Fig. 12, the direction of connection from the first spring SPR1 to the first membrane subpart 112 may be different from the direction of connection from the first spring SPR1 to the second membrane subpart 114. For example, in Fig. 12, the direction of connection from the first spring SPR1 to the first membrane subpart 112 may be opposite to the direction of connection from the first spring SPR1 to the second membrane subpart 114, but is not limited to such a configuration. For example, in Fig. 12, the first spring SPR1 may be substantially I-shaped, but is not limited to such a configuration.
[0076] Referring to FIG. 13, FIG. 13 is a schematic plan view of a sound-generating cell according to a fifth embodiment of the present invention. As shown in FIG. 13, the difference between this embodiment and the fourth embodiment lies in the design of the first spring SPR1. In FIG. 13, the first spring SPR1 of the membrane 110 of the sound-generating cell 500 is formed by two second slits SL1, two fifth slits SL5, and a sixth slit SL6. Two fifth slits SL5 are connected to the same first slit SL1, and the sixth slit SL6 is connected to another first slit SL1. The fifth slits SL5 may have two curved patterns and one linear pattern. The sixth slit SL6 is located between the two fifth slits SL5 and may have a curved pattern. For example, the fifth slit SL5 may have a hook-shaped curved pattern, and one end of the fifth slit SL5 is not connected to the other slits SL1, but this configuration is not limited to this.
[0077] Additionally, in the first spring SPR1 shown in Fig. 13, the connection direction from the first spring SPR1 to the first membrane subpart 112 may be the same as the connection direction from the first spring SPR1 to the second membrane subpart 114, but is not limited to such a configuration. For example, in Fig. 13, the first spring SPR1 may be substantially U-shaped, but is not limited to such a configuration. This design may reduce the size of the central opening between the first membrane subpart 112 and the second membrane subpart 114, thereby reducing air leakage during operation of the sound generating cell 500.
[0078] When the membrane 110 moves, the spring may be subjected to stress caused by the deformation of the membrane 110. In Figure 13, the design of the U-shaped first spring SPR1 with the curved slit SL reduces the effect of stress concentration and reduces damage to the membrane 110 and the first spring SPR1, which may result in a higher yield rate of the sound generating cell 500.
[0079] 14 and 15, Fig. 14 is a schematic top view showing a sound-generating cell according to a sixth embodiment of the present invention, and Fig. 15 is an enlarged schematic view showing the structure of region R3 in Fig. 14. As shown in Figs. 14 and 15, the difference between this embodiment and the first embodiment is that the membrane 110 of the sound-generating cell 600 of this embodiment further includes a third membrane subpart 116 and a fourth membrane subpart 118. The third membrane subpart 116 and the fourth membrane subpart 118 are disposed between the first membrane subpart 112 and the second membrane subpart 114 when viewed from above, and the third membrane subpart 116 and the fourth membrane subpart 118 may be located opposite each other when viewed from above. That is, the third membrane subpart 116 is positioned by the first side (e.g., the left side) of the sound generating cell 600 between the first membrane subpart 112 and the second membrane subpart 114 when viewed from above, and the fourth membrane subpart 118 is positioned by the second side (e.g., the right side) of the sound generating cell 600 between the first membrane subpart 112 and the second membrane subpart 114 when viewed from above, and the first and second sides of the sound generating cell 600 may be opposite when viewed from above.
[0080] 14 , only one end of the third membrane subpart 116 is fixed by being connected to the anchor structure 120, and only one end of the fourth membrane subpart 118 is fixed by being connected to the anchor structure 120, and the other ends of the third membrane subpart 116 and the fourth membrane subpart 118 are not fixed and may not be connected to the anchor structure 120. That is, the third fixed end 116a of the third membrane subpart 116 is the only fixed end of the third membrane subpart 116, and the fourth fixed end 118a of the fourth membrane subpart 118 is the only fixed end of the fourth membrane subpart 118, and the third membrane subpart 116 may be directly connected to the anchor structure 120 via only the third fixed end 116a, and the fourth membrane subpart 118 may be directly connected to the anchor structure 120 via only the fourth fixed end 118a.
[0081] In FIG. 14 , one second slit SL2 is disposed between the first membrane subpart 112 and the third membrane subpart 116 to define a second non-fixed end 112n2 of the first membrane subpart 112 and a fifth non-fixed end 116n5 of the third membrane subpart 116, and another second slit SL2 is disposed between the first membrane subpart 112 and the fourth membrane subpart 118 to define another second non-fixed end 112n2 of the first membrane subpart 112 and a sixth non-fixed end 118n6 of the fourth membrane subpart 118. However, one third slit SL3 may be positioned between the second membrane subpart 114 and the third membrane subpart 116 to define a fourth non-fixed end 114n4 of the second membrane subpart 114 and another fifth non-fixed end 116n5 of the third membrane subpart 116, and another third slit SL3 may be positioned between the second membrane subpart 114 and the fourth membrane subpart 118 to define another fourth non-fixed end 114n4 of the second membrane subpart 114 and another sixth non-fixed end 118n6 of the fourth membrane subpart 118. In some embodiments, the fifth non-fixed end 116n5 of the third membrane subpart 116 may be adjacent to the third fixed end 116a of the third membrane subpart 116, and the sixth non-fixed end 118n6 of the fourth membrane subpart 118 may be adjacent to the fourth fixed end 118a of the fourth membrane subpart 118, but is not limited to such a configuration.
[0082] As shown in FIG. 14, the shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 are substantially trapezoidal, the shape of the third membrane subpart 116 and the shape of the fourth membrane subpart 118 are substantially triangular, and the first membrane subpart 112 and the second membrane subpart 114 may be substantially coincident, and the third membrane subpart 116 and the fourth membrane subpart 118 may be substantially coincident, but are not limited to such configurations.
[0083] During operation of the sound generating cell 600, there are side openings between the first membrane subpart 112 and the third membrane subpart 116, between the second membrane subpart 114 and the third membrane subpart 116, between the first membrane subpart 112 and the fourth membrane subpart 118, and between the second membrane subpart 114 and the fourth membrane subpart 118. The size of the side openings is relative to the low frequency roll-off (LFRO) effect in the frequency response of the sound generating cell 600; at low frequencies, a strong LFRO effect can cause an apparent SPL drop of sound waves.
[0084] Specifically, for the side opening of the sound generating cell 600, the low frequency acoustic resistance is:
[0085]
number
[0086] According to the above formula, the smaller d (i.e., the maximum size of the side opening in direction Z) is, the greater the acoustic resistance at low frequencies is. In the first embodiment shown in FIG. 1 , for the first membrane subpart 112, the maximum size of the side opening in direction Z is the maximum distance in direction Z between the second non-fixed end 112n2 and the anchor structure 120. In the sixth embodiment shown in FIG. 14 , for the first membrane subpart 112, the maximum size of the side opening in direction Z is the maximum distance in direction Z between the second non-fixed end 112n2 of the first membrane subpart 112 and the fifth non-fixed end 116n5 of the third membrane subpart 116 (or the sixth non-fixed end 118n6 of the fourth membrane subpart 118). In the sixth embodiment shown in Figure 14, since the third membrane subpart and the fourth membrane subpart are present, d in the above equation can be reduced by controlling the third membrane subpart 116 and the fourth membrane subpart 118 to approach the first membrane subpart 112 and the second membrane subpart 114 in the direction Z during operation of the sound generating cell 112. That is, in Figure 14, the third membrane subpart 116 is configured to reduce sound leakage on the first side (left side) of the sound generating cell 600, and the fourth membrane subpart 118 is configured to reduce sound leakage on the second side (right side) of the sound generating cell.
[0087] The sound-generating cell 600 may include at least one suitable structure to increase low-frequency acoustic resistance by reducing d (i.e., the maximum size of the side opening in direction Z). In this embodiment, this suitable structure may cause the fifth non-fixed end 116n5 of the third membrane subpart 116 to be proximate to the second non-fixed end 112n2 of the first membrane subpart 112 and the fourth non-fixed end 114n4 of the second membrane subpart 114 in direction Z, and the sixth non-fixed end 118n6 of the fourth membrane subpart 118 to be proximate to the second non-fixed end 112n2 of the first membrane subpart 112 and the fourth non-fixed end 114n4 of the second membrane subpart 114 in direction Z, during operation of the sound-generating cell 600. Thus, during operation of the sound generating cell 600, the size of the side openings may be reduced, thereby increasing the low frequency acoustic resistance and reducing LFRO effects in the frequency response of the sound generating cell 600.
[0088] For example, to reduce d, the membrane 110 may include at least one spring connected between subparts of the membrane 110 so that the free ends of the subparts are close to each other in direction Z during operation of the sound-generating cell 600. As shown in Figure 14, the membrane 110 includes at least one second spring SPR2 and at least one third spring SPR3, where the second spring SPR2 may be directly connected between the first membrane subpart 112 and the third membrane subpart 116 or directly connected between the first membrane subpart 112 and the fourth membrane subpart 118, and the third spring SPR3 may be directly connected between the second membrane subpart 114 and the third membrane subpart 116 or directly connected between the second membrane subpart 114 and the fourth membrane subpart 118. 14, the membrane 110 includes two second springs SPR2 and two third springs SPR3, the two second springs SPR2 being connected between the first membrane subpart 112 and the third membrane subpart 116 and between the first membrane subpart 112 and the fourth membrane subpart 118, respectively, and the two third springs SPR3 being connected between the second membrane subpart 114 and the third membrane subpart 116 and between the second membrane subpart 114 and the fourth membrane subpart 118, respectively, but is not limited to such a configuration. Note that the second springs SPR2 and the third springs SPR3 are formed by slits SL (e.g., slits SL other than the first slit SL1, the second slit SL2, and the third slit SL3).
[0089] Additionally, in the single spring shown in FIG. 14, the direction of connection from the spring to one subpart may be the same as the direction of connection from the spring to another subpart, but is not limited to such a configuration. For example, in FIG. 14, the spring may be substantially U-shaped, but is not limited to such a configuration. For example, the U-shape of the spring may have a large curvature, but is not limited to such a configuration. This design reduces the size of the side opening between the two subparts (i.e., reduces d), thereby reducing air leakage during operation of the sound-generating cell 600 and thereby reducing LFRO effects in the frequency response of the sound-generating cell 600.
[0090] For example, to reduce d, actuation layer 130 may be disposed on first membrane subpart 112, second membrane subpart 114, third membrane subpart 116, and fourth membrane subpart 118. During operation of sound-generating cell 600, actuation layer 130 may actuate these subparts to move along direction Z such that their unanchored ends are closer to each other in direction Z.
[0091] Furthermore, in region R3 shown in FIG. 15 , the sound-generating cell 600 may include a recess structure RS on the outside of the membrane 110, where the recess structure RS is directly connected to the slit sections SLs in the corner region CR of the membrane 110, and the recess structure RS may have a curved pattern (e.g., the recess structure RS may have a semicircular arc pattern). For example, in FIG. 15 , the slit sections SLs are connected between the end of the second slit SL2 located in the corner region CR and the recess structure RS, and the slit sections SLs may have a straight pattern, but are not limited to such a configuration. The presence of the curved recess structure RS connected to the slit sections SLs located in the corner region CR may increase the success rate of the manufacturing process of the sound-generating cell 600 and increase the yield rate of the sound-generating cell 600.
[0092] Referring to FIG. 16, FIG. 16 is a schematic top view showing a sound-generating cell according to a seventh embodiment of the present invention. As shown in FIG. 16, the difference between this embodiment and the sixth embodiment lies in the spring design. In the sound-generating cell 700 shown in FIG. 16, a fifth slit SL5 including a hook-shaped curved pattern and a straight line pattern is individually connected to the first slit SL1, the second slit SL2, or the third slit SL3. The second spring SPR2 and the third spring SPR3 can be formed by the first slit SL1, the second slit SL2, the third slit SL3, and the fifth slit SL5, but are not limited to such a configuration. Furthermore, in FIG. 16, the springs can be substantially V-shaped, but are not limited to such a configuration.
[0093] Referring to Fig. 17, Fig. 17 is a schematic top view showing a sound generating cell according to an eighth embodiment of the present invention. As shown in Fig. 17, the difference between this embodiment and the sixth embodiment is that the slit SL of the membrane 110 of the sound generating cell 800 further includes at least one side slit SLi formed in the third membrane subpart 116 and / or the fourth membrane subpart 118.
[0094] Because the presence of the side slits SLi may weaken the structural strength of the third membrane subpart 116 and the fourth membrane subpart 118, the second spring SPR2 and the third spring SPR3 may pull the third membrane subpart 116 and the fourth membrane subpart 118 during operation of the sound generating cell 800 so that their unfixed ends are closer to the unfixed ends of the first membrane subpart 112 and the second membrane subpart 114 in direction Z.
[0095] On the other hand, compared to a structure without side slits SLi, the membrane 110 of this embodiment forms multiple small openings instead of the original large opening formed between the two non-fixed ends of the subparts during operation of the sound-generating cell 800. At least one small opening is formed between the two non-fixed ends, and at least one small opening can be formed by the side slits SLi. That is, the d of the original large opening changes to multiple d' of the small openings, where d' is smaller than d. For example, according to the above formula, if one original large opening is replaced with three small openings and d of the original large opening is three times larger than d' of the small openings, the acoustic resistance of the three small openings will be nine times larger than the acoustic resistance of the original large opening. Therefore, this design can increase the acoustic resistance at low frequencies.
[0096] As shown in FIG. 17, the second spring SPR2 may be formed by a first slit SL1, a second slit SL2, a fifth slit SL5 and a side slit SLi, and the third spring SPR3 may be formed by a first slit SL1, a third slit SL3, a fifth slit SL5 and a side slit SLi, but is not limited to such a configuration.
[0097] In some embodiments, as shown in FIG. 17, the actuation layer 130 is disposed on the first membrane subpart 112 and the second membrane subpart 114, and the actuation layer 130 is not disposed on the third membrane subpart 116 and the fourth membrane subpart 118 (i.e., no actuation layer is disposed on the third membrane subpart 116 and the fourth membrane subpart 118), but is not limited to such a configuration.
[0098] 17, the membrane 110 may optionally include a first spring SPR1 directly connected between the first membrane subpart 112 and the second membrane subpart 114. For example, the first spring SPR1 shown in FIG. 17 may be formed by two first slits SL1 and two fifth slits SL5, but is not limited to such a configuration.
[0099] 18 and 19, FIG. 18 is a schematic top view of a sound-generating cell according to a ninth embodiment of the present invention, and FIG. 19 is a schematic side view of a sound-generating cell according to the ninth embodiment of the present invention. FIGS. 18 and 19 show only the first membrane subpart 112, and the design of the second membrane subpart 114 may be similar to that of the first membrane subpart 112. As shown in FIG. 18, the difference between this embodiment and the first embodiment lies in the design of the fixed end of the membrane 110 subpart. In the sound-generating cell 900 of this embodiment, the fixed end of the membrane 110 subpart is partially fixed, and includes at least one fixed portion and at least one non-fixed portion, with the fixed portion of the fixed end fixed and the non-fixed portion of the fixed end not fixed. For example, in FIG. 18, the first fixed end 112a of the partially fixed first membrane subpart 112 may include two fixed portions AP and one non-fixed portion NP between the two fixed portions AP, but is not limited to such a configuration. The non-fixed portion NP of the first fixed end 112a moves in the direction Z when the sound generating cell 900 is operated (i.e., when the first membrane subpart 112 is actuated), increasing the deformation of the membrane 110 and thereby increasing the SPL of the sound waves generated by the sound generating cell 900.
[0100] The slits SL of the membrane 110 may include at least one inner slit so that the fixed end has a fixed portion AP and a non-fixed portion NP. In this embodiment, the first membrane subpart 112 has at least one first inner slit SLn1 and at least one second inner slit SLn2. The non-fixed portion NP of the first fixed end 112a is defined by the first inner slit SLn1, and the second inner slit SLn2 is connected to the first inner slit SLn1. Therefore, the first fixed end 112a has a fixed portion AP and a non-fixed portion NP. That is, the first inner slit SLn1 is parallel to the first fixed end 112a and is located between the first membrane subpart 112 and the anchor structure 120, and the second inner slit SLn2 is not parallel to the first fixed end 112a. 18, the first membrane subpart 112 has one first slit SL1 and two second slits SL2, and the second inner slit SLn2 may be a straight slit perpendicular to the first fixed end 112a, but is not limited to such a configuration. For example, the second inner slit SLn2 extends from the first fixed end 112a toward the first slit SL1, and the second inner slit SLn2 is not connected to the first slit SL1.
[0101] The first inner slit SLn1 defining the non-fixed portion NP of the first fixed end 112a may be connected between two slits SL. For example, in Fig. 18, the first inner slit SLn1 may be connected between two second inner slits SLn2 so that the fixed portion AP and the non-fixed portion NP of the first fixed end 112a are separated by the second inner slit SLn2, but is not limited to such a configuration.
[0102] Optionally, in FIG. 18, the first inner slit SLn1 and the second inner slit SLn2 may be separated from the first slit SL1, the second slit SL2, and the third slit SL3, but are not limited to such a configuration.
[0103] As shown in Fig. 18, the first membrane subpart 112 can be divided into multiple parts by inner slits SL. For example, in Fig. 18, the first membrane subpart 112 can be divided into three parts 912p1, 912p2, and 912p3, where 912p1 and 912p are between the second slit SL2 and the second inner slit SLn2, and part 912p2 can be between two second inner slits SLn2. For example, in Fig. 18, part 912p1 and part 912p3 can have a fixing portion AP of the first fixed end 112a so as to be fixed by the anchor structure 120. For example, in FIG. 18, portion 912p2 may have a non-fixed portion NP of the first fixed end 112a such that portion 912p2 moves along direction Z with a larger displacement (compared to portions 912p1 and 912p3) during operation of the sound generating cell 900, thereby increasing the SPL of the sound waves generated by the sound generating cell 900.
[0104] As shown in FIG. 18, the actuation layer 130 may include three portions 912p1, 912p2, and 912p3 respectively disposed on the first membrane subpart 112 to actuate the first membrane subpart 112.
[0105] In Figure 19, which shows a side view of the sound-generating cell 900 during operation, during operation of the sound-generating cell 900, the portion 912p2 moves along the direction Z with a larger displacement (compared to portions 912p1, 912p3), and the non-fixed portion NP of the first fixed end 112a may be higher in the direction Z than the fixed portion AP.
[0106] Referring to FIG. 20, FIG. 20 is a schematic top view showing a sound-generating cell according to a tenth embodiment of the present invention. As shown in FIG. 20, the difference between this embodiment and the ninth embodiment lies in the design of the fixed ends of the subparts of the membrane 110. In the sound-generating cell 900′ shown in FIG. 20, the first fixed end 112a of the first membrane subpart 112 may include two non-fixed portions NP and one fixed portion AP between the two non-fixed portions NP, but is not limited to such a configuration. In FIG. 20, the first membrane subpart 112 has two first inner slits SLn1 and two second inner slits SLn2, and the first inner slit SLn1 may be connected between the second inner slit SLn2 and the second inner slit SLn2, but is not limited to such a configuration.
[0107] 20, part 912p2 may have a fixed portion AP of the first fixed end 112a such that it is fixed by the anchor structure 120. In Fig. 20, part 912p1 and part 912p3 have a non-fixed portion NP of the first fixed end 112a such that part 912p1 and part 912p3 may move along direction Z with a large displacement (compared to part 912p2) during operation of the sound generating cell 900', thereby increasing the SPL of sound waves generated by the sound generating cell 900'.
[0108] The following provides a further detailed description of the packaging structure PKG of the sound-generating cell SPC by way of example. Note that the packaging structure PKG is not limited to the following exemplary embodiments, and the packaging structure PKG may have any embodiment of the sound-generating cell SPC that does not deviate from the spirit of the present invention (for example, one of the above embodiments or a combination of the above embodiments).
[0109] 21 to 23, Fig. 21 is a schematic diagram showing a package structure according to an embodiment of the present invention, Fig. 22 is a bottom view showing the package structure shown in Fig. 21, and Fig. 23 is a schematic cross-sectional view showing the package structure shown in Fig. 21. As shown in Fig. 21 to 23, the package structure PKG of the sound generating cell SPC of the present invention includes a base BS, a cover HS placed on the base BS, and the above-mentioned sound generating cell SPC placed in the cover HS, with the sound generating cell SPC being between the base BS and the cover HS.
[0110] The base BS may be rigid or flexible and may comprise any suitable material. For example, the base BS may comprise silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g., PI, PET), any other suitable material, or a combination thereof. As an example, in FIGS. 21-23, the base BS may be a circuit board including a laminate (e.g., copper clad laminate, CCL), a land grid array (LGA) board, or any other suitable board including a conductive material. The base BS may include one or more conductive components, such as, but not limited to, connection traces, active components, passive components, and / or connection pads. For example, in FIG. 22, the base BS has at least one conductive layer CDB, where the sound-generating cell SPC and the conductive layer CDB are disposed on both sides of the base BS, and the conductive layer CDB includes a plurality of conductive pads CPC and a conductive ring CRC, and the conductive pads CPC are configured to electrically connect between the sound-generating cell SPC and an external device of the package structure PKG.
[0111] The base BS may be, but is not limited to be, substantially parallel to the direction X and the direction Y (i.e., the normal direction of the base BS may be substantially parallel to the direction Z). For example, in Figures 21 to 23, the base BS may be, but is not limited to be, substantially parallel to the membrane 110 of the sound-generating cell SPC.
[0112] The cover HS includes a superstructure TS and at least one sidewall SW, where the sidewall SW is between the base BS and the superstructure TS. In some embodiments, the base BS and the superstructure TS may be substantially parallel to each other. For example, without limitation, in FIGS. 21-23 , the superstructure TS may be substantially parallel to direction X and direction Y (i.e., the normal direction of the superstructure TS may be substantially parallel to direction Z), and the sidewall SW may be substantially parallel to direction Z. For example, without limitation, in FIGS. 21-23 , the superstructure TS may be substantially parallel to the membrane 110 of the sound-generating cell SPC, and the sidewall SW may surround the sound-generating cell SPC.
[0113] The upper structure TS and sidewall SW may be rigid or flexible and may comprise any suitable material. For example, the upper structure TS and sidewall SW may individually comprise silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g., PI, PET), any other suitable material, or a combination thereof. By way of example, and not limitation, in Figures 21-23, the upper structure TS and sidewall SW may comprise metal and form a unitary structure (e.g., a cap).
[0114] 21 to 23, the sound-generating cell SPC is disposed on the base BS, and the cavity CV in the cover HS is divided into two sub-cavities (i.e., a first sub-cavity CV1 and a second sub-cavity CV2) by a membrane 110 of the sound-generating cell SPC, with the membrane 110 being between the two sub-cavities. The first sub-cavity CV1 may be between the membrane 110 and the superstructure TS, and the second sub-cavity CV2 may be between the membrane 110 and the base BS.
[0115] 21 to 23, at least a first cover opening OP1 and at least a second cover opening OP2 may be individually formed on the cover HS or the base BS, with the first cover opening OP1 connected to the first sub-cavity CV1 and the second cover opening OP2 connected to the second sub-cavity CV2. For example, the first cover opening OP1 may be, but is not limited to, a sound outlet. For example, as shown in FIGS. 21 to 23, the first cover opening OP1 may be, but is not limited to, formed in the upper structure TS and the second cover opening OP2 may be formed in the base BS.
[0116] The number of the first cover openings OP1, the arrangement of the first cover openings OP1, the number of the second cover openings OP2 and the arrangement of the second cover openings OP2 can be designed based on requirements.
[0117] In some embodiments, one first cover opening OP1 and / or one second cover opening OP2 may correspond to an area of the packaging structure PKG where the sound-generating cell SPC generates the highest sound waves SPL. For example (FIGS. 21-23), without limitation, one first cover opening OP1 may be located at the center of the top structure TS in a top view (or the center of the sidewall SW in a side view) and / or one second cover opening OP2 may be located at the center of the base BS in a top view. For example, without limitation, the first cover opening OP1 and / or the second cover opening OP2 may correspond to the center of the membrane 110 in the normal direction (i.e., direction Z) of the base BS. For example, each membrane 110 may correspond to at least one first cover opening OP1 and / or at least one second cover opening OP2.
[0118] For example (e.g., FIG. 27), when the cover HS includes a plurality of first cover openings OP1 (or a plurality of second cover openings OP2), the first cover openings OP1 (or the second cover openings OP2) may be arranged in, but is not limited to, a plurality of rows extending along a certain direction (e.g., direction X) and / or a plurality of rows extending along another direction (e.g., direction Y). For example, when the cover HS includes a plurality of first cover openings OP1 (or a plurality of second cover openings OP2), the first cover openings OP1 (or the second cover openings OP2) may be arranged in, but is not limited to, an array.
[0119] The pattern of the first cover opening OP1 seen from above and the pattern of the second cover opening OP2 seen from above can be designed based on requirements, for example, the pattern of the cover opening seen from above can be a polygon (e.g., a rectangle, a hexagon, etc.), a circle, or any other suitable shape.
[0120] The size of the first cover opening OP1 and the size of the second cover opening OP2 are designed based on requirements, the smaller the size of the sound outlet (e.g., the first cover opening OP1), the greater the protective effect of the cover HS, and the larger the total area of the sound outlet (e.g., the first cover opening OP1), the smaller the acoustic resistance of the cover HS. Therefore, in some embodiments, in order to increase the protective effect and decrease the acoustic resistance of the cover HS, the size of the sound outlet (e.g., the first cover opening OP1) is made smaller as the number of sound outlets increases.
[0121] The sound generating cell SPC may use any suitable method to be electrically connected to an external device. For example, in Figures 21-23, the sound generating cell SPC may be electrically connected to an external device via, but not limited to, a conductive part of the base BS (e.g., a connection pad CPC).
[0122] In the present invention, the sound generating cell SPC is electrically connected to a controller, which is configured to generate a drive signal, which can be applied to the actuation layer 130 to actuate the membrane 110. The controller can be located within the packaging structure PKG or outside the packaging structure PKG.
[0123] The method for forming the package structure PKG may be any suitable method. In some embodiments, a cover HS and a base BS are provided, and the sound-generating cell SPC may be manufactured by the method described above. The sound-generating cell SPC may then be disposed on the base BS and disposed within the cover HS. For example, but not limited to, the sound-generating cell SPC may be disposed on the base BS before disposing the cover HS on the base BS. For example, but not limited to, a second cover opening OP2 may be formed in the base BS before disposing the sound-generating cell SPC on the base BS, and a first cover opening OP1 may be formed in the cover HS before disposing the sound-generating cell SPC within the cover HS.
[0124] 24, which is a schematic diagram showing a package structure according to one embodiment of the present invention. As shown in FIG. 24, the first cover opening OP1 does not have to be located in the center of the top structure TS when viewed from the top, but is not limited to this. As shown in FIG. 24, the first cover opening OP1 may correspond to the center of the membrane 110 in the normal direction of the base BS (i.e., direction Z).
[0125] 25 and 26, Fig. 25 is a schematic diagram showing a package structure according to one embodiment of the present invention, and Fig. 26 is a schematic cross-sectional view showing the package structure shown in Fig. 25. As shown in Fig. 25 and 26, a first cover opening OP1 may be, but is not limited to, formed in a side wall SW of the cover HS.
[0126] 27 and 28, Fig. 27 is a schematic diagram showing a package structure according to one embodiment of the present invention, and Fig. 28 is a schematic cross-sectional view showing the package structure shown in Fig. 27. As shown in Fig. 27 and 28, the upper structure TS (or side wall SW) of the cover HS of the package structure PKG has a plurality of first cover openings OP1, and the first cover openings OP1 may be small or significantly small. For example, the size of the first cover openings OP1 may be, but is not limited to, 10%, 5%, 3%, or 1% or less of the upper structure TS of the cover HS.
[0127] Because the upper structure TS has a plurality of small-sized first cover openings OP1, the upper structure TS of the present invention can provide high physical protection for the sound-generating cells SPC when the upper structure TS has low acoustic resistance. For example, but not limited to, the upper structure TS of the present invention can protect the sound-generating cells SPC during subsequent use of the packaging structure PKG (e.g., operation of the sound-generating cells SPC, the process of placing the packaging structure PKG in a device), thereby increasing the yield rate of the packaging structure PKG and the yield rate of the device. Furthermore, the presence of the upper structure TS with a plurality of first cover openings OP1 makes it difficult for foreign matter (e.g., dust, particles, sharp objects, etc.) to enter the packaging structure PKG.
[0128] In a first frequency response of the membrane 110 of the sound generating cell SPC before being placed in the packaging structure PKG, the minimum resonance peak of the membrane 110 is generated at a first frequency (i.e., the first frequency is the minimum resonance frequency of the membrane 110) and has a first peak value (i.e., SPL). In a second frequency response of the membrane 110 of the sound generating cell SPC after being placed in the packaging structure PKG, the minimum resonance peak of the membrane 110 is generated at a second frequency (i.e., the second frequency is the minimum resonance frequency of the membrane 110) and has a second peak value (i.e., SPL). In some embodiments, the first frequency is greater than the second frequency and / or the first peak value is greater than the second peak value.
[0129] In the second frequency response of the membrane 110 of the sound generating cell SPC after being placed in the packaging structure PKG, the second frequency (i.e., the minimum resonant frequency) and the second peak value (i.e., the peak value of the minimum resonant peak) decrease as the total area of the first cover opening OP1 decreases. In some embodiments, the difference between the first frequency and the second frequency may be 1000 Hz, 2000 Hz, 5000 Hz, or other suitable value or more. Therefore, in the packaging structure PKG, the minimum resonant frequency of the membrane 110 and the peak value of the minimum resonant peak of the membrane 110 may be changed by adjusting the total area of the first cover opening OP1.
[0130] The following provides a further detailed description of the device APT including the above-mentioned sound-generating cell SPC by way of example. The device APT may be a headphone, an earphone, an earbud, or any other suitable sound-generating device. It should be noted that the device APT is not limited to the following exemplary embodiments, and the sound-generating cell SPC included in the device APT may be any embodiment (for example, one of the above embodiments or a combination of the above embodiments) without departing from the spirit of the present invention.
[0131] Referring to Fig. 29, Fig. 29 is a schematic cross-sectional view showing an apparatus according to an embodiment of the present invention. As shown in Fig. 29, the apparatus APT includes a housing OC, a packaging structure PKG of the sound generating cell SPC, and an apparatus base BS_AS, and the packaging structure PKG can be disposed on the apparatus base BS_AS and in the housing OC. It should be noted that the packaging structure PKG of the sound generating cell SPC can be one of the above embodiments or a combination of the above embodiments.
[0132] The device base BS_AS may comprise silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g., PI, PET), any other suitable material, or combinations thereof. As an example, in Figure 29, the device base BS_AS is a circuit board including a laminate (e.g., copper clad laminate, CCL), a land grid array (LGA) substrate, or any other suitable substrate including a conductive material, and the device base BS_AS may include one or more conductive components, such as, but not limited to, connection traces, active components, passive components, and / or connection pads.
[0133] As shown in FIG. 29, the device base BS_AS has at least one device base opening BS_ASp, and the second sub-cavity CV2 of the package structure PKG can be connected to the device base opening BS_ASp of the device base BS_AS through the second cover opening OP2 of the package structure PKG.
[0134] As shown in FIG. 29, the housing OC has at least one exit opening OCp, and the first sub-cavity CV1 of the packaging structure PKG can be connected to the front outside of the device APT through the first cover opening OP1 of the packaging structure PKG and the exit opening OCp of the housing OC.
[0135] Optionally, the housing OC in this embodiment may clamp the device base BS_AS and the packaging structure PKG (for example, the housing OC may contact a sidewall of the device base BS_AS and a sidewall SW of the packaging structure PKG) to fix the device base BS_AS and the packaging structure PKG within the device APT and separate the first sub-cavity CV1 and the second sub-cavity CV2. Optionally, a gasket may be further provided within the device APT, and the gasket may be, but is not limited to, disposed between the packaging structure PKG and the housing OC, and the gasket may surround the exit opening OCp.
[0136] In FIG. 29, the package structure PKG may be assembled into the device APT via surface mount technology, whereby the package structure PKG may be placed on the device base BS_AS by disposing a conductive adhesive layer CAL (e.g., including solder) between the device base BS_AS and the base BS of the package structure PKG.
[0137] In the present invention, since surface mounting technology is used, the packaging structure PKG including the sound-generating cell SPC must be designed to withstand the maximum process temperature of the surface mounting technology. As a result, the packaging structure PKG has a heat-resistant temperature limit higher than the maximum process temperature of the surface mounting technology, so that the packaging structure PKG is not damaged and can maintain normal operation (i.e., can generate sound waves normally) even after the surface mounting technology is performed. In some embodiments, since the maximum process temperature of the surface mounting technology can be in the range of 240°C to 250°C, the upper limit of the heat-resistant temperature of the packaging structure PKG may be, but is not limited to, higher than 240°C or higher than 250°C. Furthermore, in some embodiments, each material included in the packaging structure PKG has a heat-resistant temperature limit higher than the maximum process temperature of the surface mounting technology to ensure that the packaging structure PKG is not damaged during the surface mounting technology. For example, each material included in the packaging structure PKG has a heat-resistant temperature limit higher than, but not limited to, higher than 240°C or higher than 250°C.
[0138] The surface mounting technology is described below, but the following surface mounting technology is an example, and some steps are omitted to clarify the description of the surface mounting technology.
[0139] In the surface mount technology process, a device base BS_AS having at least one conductive pad BS_ASc, at least one conductive trace, and a device base opening BS_ASp is first provided, and the conductive pad BS_ASc and the device base opening BS_ASp may be formed before performing the surface mount technology. Next, a conductive adhesive layer CAL is placed on the conductive pad BS_ASc of the device base BS_AS. For example, but not limited to, the conductive adhesive layer CAL may be printed on the device base BS_AS. Next, an electronic component such as a package structure PKG of a sound-generating cell SPC is placed on the conductive adhesive layer CAL and brought into contact with the conductive adhesive layer CAL, and the conductive pad CPC of the package structure PKG is brought into contact with the conductive adhesive layer CAL. Next, a temperature-raising step (e.g., a reflow step) is performed to raise the process temperature so that the conductive adhesive layer CAL melts and adheres to the conductive pad BS_ASc of the device base BS_AS and the conductive pad CPC of the package structure PKG. As a result, by using surface mounting technology, the package structure PKG is placed on the device base BS_AS and electrically connected to the conductive pads BS_ASc via the conductive adhesive layer CAL.
[0140] In conventional speakers or conventional sound generating devices, some components (such as rubber suspensions and / or adhesives attached to coils) cannot withstand the maximum process temperature of surface mount technology, so surface mount technology cannot be used in conventional speakers (or conventional sound generating devices). In contrast, in the present invention, the package structure PKG is designed to withstand the maximum process temperature of surface mount technology, so damage to the package structure PKG does not occur and the package structure PKG can operate normally after surface mount technology is applied. Furthermore, because surface mount technology is applied in the present invention, there is no need to perform a wire bonding method / process (a method / process using conductive wires to electrically connect electronic components and the device base BS_AS), so the lateral dimensions of the device APT can be significantly reduced.
[0141] The method for forming the device APT may be any suitable method. In some embodiments of the method for forming the device APT, the package structure PKG may be formed by the method described above. The package structure PKG may then be assembled to the device APT including the housing OC via surface mount technology. For example, the package structure PKG may be disposed on the device base BS_AS of the device APT via surface mount technology.
[0142] Referring to Fig. 30, Fig. 30 is a schematic diagram illustrating an apparatus according to one embodiment of the present invention. As shown in Fig. 30, the apparatus APT of this embodiment includes a packaging structure PKG of the sound-generating cell SPC and two vent devices VD, all of which may be disposed within a housing OC.
[0143] The vent device VD is configured to form or close a vent, and when the vent is formed, the internal cavity CVi of the device APT is connected to the periphery of the device APT through the vent. As shown in Figure 30, the vent device VD includes a vent substrate ST_V having at least one substrate opening OPV, a cover structure CS_V disposed on the vent substrate ST_V, and a membrane structure TF_V disposed between the vent substrate ST_V and the cover structure CS_V, where the membrane structure TF_V is configured to operate to form or close the vent, and the cover structure CS_V is configured to cover and protect the membrane structure TF_V and has at least one lid opening (not shown). When the vent is formed by the membrane structure TF_V, an airflow passes through the lid opening of the cover structure CS_V, the vent, and the substrate opening OPV of the vent substrate ST_V, connecting the internal cavity CVi of the device APT to the periphery of the device APT.
[0144] The vent device VD may be configured to suppress the occlusion effect during operation of the sound-generating cell SPC. The occlusion effect results from the enclosed volume of the ear canal causing a large perceived sound pressure by the user (i.e., listener). In some cases, when a user performs certain activities that cause bone-conducted sound (such as walking, jogging, talking, eating, or touching an acoustic transducer) and uses the device APT filled in the user's ear canal, the occlusion effect causes the user to hear occlusion sounds, thereby reducing the user's listening quality. In this embodiment, the vent of the vent device VD may be formed or closed based on the occurrence or non-occurrence of the occlusion effect. When an occlusion effect occurs, the vent of the vent device VD is formed to prevent the volume of the ear canal from being enclosed, thereby suppressing the occlusion effect. When an occlusion effect does not occur, the vent of the vent device VD is closed to improve the quality of the sound waves generated by the device APT. Therefore, the presence of the vent device VD may improve the performance and experience of the user using the device APT.
[0145] In the embodiment shown in Figure 30, the two vent devices VD may be symmetrically arranged, but are not limited to this. In one embodiment, the vent device VD may be a MEMS device or a package containing a MEMS structure.
[0146] In one embodiment, the device APT further includes a sensing device, and the vent of the vent device VD is formed or closed based on a sensing result generated by the sensing device. For example, the sensing device may include a motion sensor, a force sensor, a light sensor, an acceleration sensor, a pressure sensor, an altitude sensor, a proximity sensor, or a combination thereof.
[0147] The vent device VD, the packaging structure PKG and the sensing device are coupled to a controller, which can generate signals to control the vent device VD, the packaging structure PKG and the sensing device.
[0148] Details or modifications of the vent device, controller and sensing device are disclosed in U.S. Patent Application Nos. 17 / 344980, 17 / 344983, 17 / 842810 and 18 / 172346, the disclosures of which are incorporated by reference in their entirety and made a part of this specification.
[0149] In the present invention, a cell having a different function from the sound-generating cell may have the structure of any of the sound-generating cells described above or a structure combining the above embodiments. Therefore, a method for manufacturing the cell may be referred to as a method for manufacturing the sound-generating cell described above, a method for constructing and forming a packaging structure including the cell may be referred to as a method for constructing and forming a packaging structure for the sound-generating cell described above, and a method for constructing and forming a device including the cell (or including a packaging structure including the cell) may be referred to as a method for constructing and forming a device including the sound-generating cell described above (or including a packaging structure including the sound-generating cell).
[0150] In some embodiments, a cell disposed within the packaging structure of the present invention may have a different acoustic function than the sound-generating cell. In some embodiments, a cell disposed within the packaging structure of the present invention may be a vent cell within a vent device configured to form or close its vent, thereby suppressing blockage effects during operation of the sound-generating cell. For example, in a modified embodiment of the device APT shown in FIG. 30, the packaging structure, vent device VD, includes a vent cell having the structure described above (i.e., one or a combination of the above-described embodiments shown in FIGS. 1-20). Therefore, the design of the membrane or membrane structure TF_V for the vent cell may refer to one or a combination of the above-described embodiments shown in FIGS. 1-20 (e.g., FIG. 11), and the design of the cover structure CS_V may refer to one or a combination of the above-described embodiments shown in FIGS. 21-28 (e.g., FIGS. 21-23). Note that in this modified embodiment, the sound-generating cell SPC may include the structure described in the present invention or another suitable structure.
[0151] In summary, according to the design of the sound-generating or venting cell of the present invention, the sound-generating or venting cell can achieve a higher resonant frequency, a larger SPL, a higher yield rate, and / or a lower air leakage. Also, some cells having different functions from the sound-generating cell can be called a sound-generating cell.
[0152] Those skilled in the art will readily appreciate that numerous modifications and variations of the apparatus and method may be made while retaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the content and scope of the appended claims.
Claims
1. 1. A method of forming a package structure, comprising:
1. Performing a manufacturing method to manufacture a cell, the manufacturing method comprising: providing a wafer including a first layer and a second layer; patterning a first layer of the wafer to form at least one trench line; disposing the cell within a cover; Including, the first layer includes a membrane secured by the anchor structure of the cell, the at least one trench line forming at least one slit in the membrane and penetrating the membrane; the membrane includes a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart being opposite each other when viewed along a top view direction, and the first membrane subpart and the second membrane subpart being opposite each other in a first direction perpendicular to the top view direction; the first membrane subpart includes a first fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and an end of the first membrane subpart other than the first fixed end is not fixed; the second membrane subpart includes a second fixed end that is fully or partially connected to the anchor structure to be fully or partially fixed by the anchor structure, and the other end of the second membrane subpart is not fixed; a first ratio of the film is greater than 2, and the first ratio of the film is a ratio between a first length of a first side of the film and a second length of a second side of the film when viewed from above; Formation method.
2. forming a first cover opening in the cover prior to disposing the cell within the cover; The method of claim 1 , wherein the cover includes a superstructure and a sidewall, the superstructure being substantially parallel to the membrane, and the first cover opening is formed in the superstructure.
3. forming a first cover opening in the cover prior to disposing the cell within the cover; The method of claim 1 , wherein the cover includes a superstructure and a sidewall, and the first cover opening is formed in the sidewall.
4. forming a plurality of first cover openings in the cover prior to disposing the cells within the cover; The method of claim 1 , wherein the cover includes a superstructure and a sidewall, the superstructure being substantially parallel to the membrane, and the first cover opening is formed in the superstructure.
5. The method for manufacturing the cell includes: forming recessed structures at the corners of the cells; The method of claim 1 further comprising:
6. The method for manufacturing the cell includes: forming a latch structure configured to limit the travel distance of the first membrane sub-part and the second membrane sub-part; further comprising The method of claim 1 , wherein the moving distance is a distance along a normal direction of a base on which the cell is disposed.
7. The method for manufacturing the cell includes: forming a spring between the first membrane subpart and the second membrane subpart; The method of claim 1 further comprising:
8. The method for manufacturing the cell includes: patterning the first layer of the wafer such that the film further comprises a third film subpart and a fourth film subpart; further comprising the third membrane subpart is configured to reduce acoustic leakage on a first side of the cell; The method of claim 1 , wherein the fourth membrane subpart is configured to reduce acoustic leakage on a second side of the cell.
9. The method for manufacturing the cell includes: forming at least one first internal slit and at least one second internal slit in the first membrane subpart; further comprising the first fixed end is partially fixed; the first fixed end includes at least one fixed portion and at least one non-fixed portion; the at least one non-fixed portion of the first fixed end is defined by the at least one first inner slit; The method of claim 1 , wherein the at least one fixed portion and the at least one non-fixed portion are divided according to the at least one second inner slit.
10. 1. A method of forming a device, comprising: forming a package structure by the method of claim 1; assembling the package structure to the device including a housing via surface mount technology; A forming method comprising:
11. a membrane comprising a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart being opposite one another; an actuation layer disposed on the first membrane subpart and the second membrane subpart; A sound-generating cell comprising: the first membrane subpart includes a first fixed end that is completely or partially fixed, and the other end of the first membrane subpart is not fixed; the second membrane subpart includes a second fixed end that is completely or partially fixed, and the other end of the second membrane subpart is not fixed; A sound-generating cell, wherein a first ratio of the membrane is greater than 2, the first ratio of the membrane being a ratio between a first length of a first side of the membrane and a second length of a second side of the membrane.
12. The membrane comprises: a first slit formed between the first membrane subpart and the second membrane subpart, the first slit defining a first non-fixed end of the first membrane subpart, the first non-fixed end being opposite the first fixed end when viewed from above; a second slit defining a second non-fixed end of the first membrane subpart, the second non-fixed end being adjacent to the first fixed end; 12. The sound generating cell of claim 11, comprising:
13. 13. The sound generating cell of claim 12, wherein a first non-fixed end of the first membrane subpart and a third non-fixed end of the second membrane subpart are defined by the first slit, and when viewed from above, the third non-fixed end of the second membrane subpart is opposite the second fixed end of the second membrane subpart.
14. 12. The sound-generating cell of claim 11, further comprising recessed structures disposed at corners of the sound-generating cell, the recessed structures configured to distribute stresses applied to the recessed structures during a peeling process.
15. 15. The sound generating cell of claim 14, wherein the membrane includes slit sections in corner regions, and the recessed structures are directly connected to the slit sections.
16. The sound generating cell of claim 14 , wherein the recessed structure has a curved pattern.
17. 12. The sound-generating cell of claim 11, comprising four recessed structures disposed at four corners of the sound-generating cell, the four recessed structures configured to distribute stress applied to the recessed structures during a peeling process.
18. the membrane includes a latch structure configured to limit a distance of travel of the first membrane sub-part and the second membrane sub-part; The sound generating cell of claim 11 , wherein the distance traveled is a distance along a direction normal to a base on which the sound generating cell is disposed.
19. 20. The sound generating cell of claim 18, wherein the latch structure includes a first latch component and a second latch component, the first latch component being part of the first membrane subpart and the second latch component being part of the second membrane subpart.
20. The membrane comprises: a first slit formed between the first membrane subpart and the second membrane subpart; further comprising 20. The sound generating cell of claim 18, wherein the latching structure is defined at least in part by the first slit.
21. 12. The sound generating cell of claim 11, wherein the membrane further comprises a first spring directly connected between the first membrane subpart and the second membrane subpart.
22. The membrane comprises: at least one slit formed between the first membrane subpart and the second membrane subpart; further comprising 22. The sound generating cell of claim 21, wherein at least a portion of said first spring is defined by said at least one slit.
23. 23. The sound generating cell of claim 22, wherein one of the at least one slits includes a hook-shaped curved pattern.
24. The membrane comprises: a third membrane subpart disposed by the first side of the sound-generating cell between the first membrane subpart and the second membrane subpart when viewed from above; Including, the third membrane sub-part is configured to reduce acoustic leakage on a first side of the sound-generating cell; 12. The sound generating cell of claim 11, wherein the third membrane subpart includes a fixed third fixed end, and the ends of the third membrane subpart other than the third fixed end are unfixed.
25. The membrane comprises: a fourth membrane subpart disposed by a second side of the sound-generating cell between the first membrane subpart and the second membrane subpart when viewed from above; Including, the fourth membrane sub-part is configured to reduce acoustic leakage on a second side of the sound-generating cell; 25. The sound generating cell of claim 24, wherein the fourth membrane subpart includes a fixed fourth fixed end, and the ends of the fourth membrane subpart other than the fourth fixed end are unfixed.
26. The membrane comprises: a first slit formed between the first membrane subpart and the second membrane subpart, a first non-fixed end of the first membrane subpart defined by the first slit, the first non-fixed end being opposite the first fixed end; 25. The sound generating cell of claim 24, wherein a second slit is formed between the first membrane subpart and the third membrane subpart, wherein a second non-fixed end of the first membrane subpart and a fourth non-fixed end of the third membrane subpart are defined by the second slit, the second non-fixed end of the first membrane subpart being adjacent to the first fixed end of the first membrane subpart, and the fourth non-fixed end of the third membrane subpart being adjacent to the third fixed end of the third membrane subpart.
27. The membrane comprises: a second spring directly connected between the first membrane subpart and the third membrane subpart; 25. The sound generating cell of claim 24, further comprising:
28. 25. The sound generating cell of claim 24, wherein at least one side slit is formed in the third membrane subpart, and an actuating layer is not disposed on the third membrane subpart.
29. the first fixed end is partially fixed; the first fixed end includes at least one fixed portion and at least one non-fixed portion, the at least one fixed portion being fixed and the at least one non-fixed portion being non-fixed; The sound-generating cell of claim 11 , wherein the at least one non-fixed portion of the first fixed end moves toward a normal direction of a base on which the sound-generating cell is disposed when the first membrane sub-part is actuated.
30. the first membrane subpart has at least one first inner slit and at least one second inner slit; the at least one non-fixed portion of the first fixed end is defined by the at least one first inner slit; the at least one second inner slit extends from the first fixed end toward the first slit; 30. The sound generating cell of claim 29, wherein the first slit is formed between the first membrane subpart and the second membrane subpart, and the non-fixed end of the first membrane subpart is defined by the first slit.
31. the first membrane subpart includes two second inner slits extending from the first fixed end toward the first slit; 31. A sound generating cell according to claim 30, wherein a portion of the working layer is disposed between the two second inner slits.
32. 31. The sound generating cell of claim 30, wherein the at least one fixed portion and the at least one non-fixed portion are divided according to the at least one first inner slit.
33. 1. A method for manufacturing a sound-generating cell, comprising: providing a wafer including a first layer and a second layer; patterning a first layer of the wafer to form at least one trench line; placing the wafer on a substrate; Including, the first layer includes a membrane, and the at least one trench line forms at least one slit in the membrane and extends through the membrane; the membrane comprises a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart being opposite one another; the first membrane subpart includes a first fixed end that is completely or partially fixed, and the other end of the first membrane subpart is not fixed; the second membrane subpart includes a second fixed end that is fully or partially fixed, and the other end of the second membrane subpart is not fixed; a first ratio of the film is greater than 2, the first ratio being a ratio between a first length of a first side of the film and a second length of a second side of the film; Manufacturing method.
34. forming recessed structures at corners of the sound-generating cell; The method of claim 33 further comprising:
35. forming a latch structure configured to limit the travel distance of the first membrane sub-part and the second membrane sub-part; further comprising The method of claim 33, wherein the movement distance is a distance along a direction normal to a base on which the sound-generating cell is disposed.
36. forming a spring between the first membrane subpart and the second membrane subpart; The method of claim 33 further comprising:
37. patterning the first layer of the wafer such that the film further comprises a third film subpart and a fourth film subpart; further comprising the third membrane sub-part is configured to reduce acoustic leakage on a first side of the sound-generating cell; 34. The method of claim 33, wherein the fourth membrane sub-part is configured to reduce acoustic leakage on a second side of the sound-producing cell.
38. forming at least one first internal slit and at least one second internal slit in the first membrane subpart; further comprising the first fixed end is partially fixed; the first fixed end includes at least one fixed portion and at least one non-fixed portion; the at least one non-fixed portion of the first fixed end is defined by the at least one first inner slit; 34. The method of claim 33, wherein the at least one fixed portion and the at least one non-fixed portion are divided according to the at least one second inner slit.
Citation Information
Patent Citations
Micromechanical Acoustic Transducer
JP2020522178A
Transducer
JP2021052305A
Vocal device, package structure and vocal chip, package structure, and manufacturing method of vocal device
JP2022013874A
Acoustic transducer, wearable sound device, and manufacturing method of acoustic transducer
JP2022016392A
Micromechanical sound transducer
US11350217B2