Amplifier module and communication device

Abstract

This amplifier module comprises a Doherty amplifier circuit. The Doherty amplifier circuit includes a first transistor chip that constitutes a carrier amplifier, a first output signal line that transmits a first amplified signal outputted from the carrier amplifier, a second transistor chip that constitutes a peak amplifier, and a second output signal line that transmits a composite signal of the first amplified signal and a second amplified signal outputted from the peak amplifier. The direction from a drain terminal of the second transistor chip toward a connection part with a first bonding wire in a first conductor of the first output signal line and the direction from the drain terminal of the second transistor chip toward a connection part with a second bonding wire in the second conductor of the second output signal line are the same direction.

Description

[Technical Field]

[0001] This disclosure relates to an amplifier module and a communication device. This application claims priority to Japanese Patent Application No. 2020-090328, filed on May 25, 2020, and incorporates the entire contents of that application by reference. [Background technology]

[0002] In a Doherty amplifier circuit, power loss occurs when the output signal of the carrier amplifier flows into the peak amplifier during back-off operation. To suppress this power loss, it is ideal for the impedance of the peak amplifier to be in an open state during back-off operation, with the connection point between the carrier amplifier output and the peak amplifier output as the reference. For this reason, a delay line is provided on the output side of the peak amplifier. However, a long delay line increases the circuit size.

[0003] Patent Document 1 discloses a Doherty amplifier in which the drain terminal of a carrier amplifier die is connected to a printed wiring by a bonding wire, and the drain terminal of a peak amplifier die is connected to the printed wiring by a bonding wire. In the Doherty amplifier disclosed in Patent Document 1, a bonding wire (hereinafter referred to as a "first bonding wire") connected to a printed wiring (hereinafter referred to as a "first conductor") for transmitting an output signal from the carrier amplifier die and a bonding wire (hereinafter referred to as a "second bonding wire") connected to a printed wiring (hereinafter referred to as a "second conductor") for transmitting a composite signal of the output signal of the carrier amplifier die and the output signal of the peak amplifier die extend from the output terminal (drain terminal) of the peak amplifier die. The first bonding wire extends in a direction perpendicular to the direction connecting the input terminal and output terminal (drain terminal) of the peak amplifier die (hereinafter referred to as the "circuit direction"), and the second bonding wire extends in the circuit direction. In the peak amplifier die, the drain terminal is bent at a right angle to extend the first bonding wire in a direction perpendicular to the circuit direction, and the end of the drain terminal extends in the circuit direction. The first bonding wire is connected to the part extending in the circuit direction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2018 / 0175802 Summary of the Invention

[0005] An amplifier module according to one aspect of the present disclosure is an amplifier module including a Doherty amplifier circuit, the Doherty amplifier circuit including a first transistor chip constituting a carrier amplifier, a first output signal line transmitting a first amplified signal output from the carrier amplifier, a second transistor chip constituting a peak amplifier, and a second output signal line transmitting a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, the first output signal line including a first conductor provided on a printed circuit board, a first end connected to the first conductor, and a second end connected to a drain terminal of the second transistor chip. the second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, and the direction from the drain terminal of the second transistor chip toward the connection portion of the first conductor with the first end of the first bonding wire is the same as the direction from the drain terminal of the second transistor chip toward the connection portion of the second conductor with the second end of the second bonding wire.

[0006] Another aspect of the present disclosure provides an amplifier module including a Doherty amplifier circuit, the Doherty amplifier circuit including: a first transistor chip constituting a carrier amplifier; a first output signal line transmitting a first amplified signal output from the carrier amplifier; a second transistor chip constituting a peak amplifier; and a second output signal line transmitting a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, the first output signal line including a first conductor provided on a printed circuit board and a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip, the second output signal line including a second conductor spaced apart from the first conductor on the printed circuit board and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, and the direction from the gate terminal to the drain terminal of the second transistor chip is the same as the direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire.

[0007] A communication device according to one aspect of the present disclosure is a communication device including a transmission circuit that outputs a high-frequency transmission signal, and an amplifier module that amplifies the transmission signal output by the transmission circuit, wherein the amplifier module includes a Doherty amplifier circuit, and includes a first transistor chip that constitutes a carrier amplifier, a first output signal line that transmits a first amplified signal output from the carrier amplifier, a second transistor chip that constitutes a peak amplifier, and a second output signal line that transmits a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, and the first output signal line includes a first conductor provided on a printed circuit board, a first end connected to the first conductor, and and a first bonding wire having a second end connected to the drain terminal of a second transistor chip, and the second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, and the direction from the drain terminal of the second transistor chip to the connection portion of the first conductor with the first end of the first bonding wire is the same as the direction from the drain terminal of the second transistor chip to the connection portion of the second conductor with the second end of the second bonding wire.

[0008] A communication device according to another aspect of the present disclosure is a communication device including a transmission circuit that outputs a high-frequency transmission signal, and an amplifier module that amplifies the transmission signal output by the transmission circuit, wherein the amplifier module includes a Doherty amplifier circuit and includes a first transistor chip that constitutes a carrier amplifier, a first output signal line that transmits a first amplified signal output from the carrier amplifier, a second transistor chip that constitutes a peak amplifier, and a second output signal line that transmits a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, and the first output signal line is connected to a first conductor provided on a printed circuit board and a first conductor provided on a printed circuit board. the second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, and the direction from the gate terminal to the drain terminal of the second transistor chip is the same as the direction from the drain terminal of the second transistor chip to the connection portion of the first conductor with the first end of the first bonding wire.

[0009] The present disclosure can be realized not only as an amplifier module having the characteristic configuration described above, but also as a communication device including an amplifier module, or as a method for manufacturing an amplifier module. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a block diagram showing an example of the configuration of a wireless communication device according to a first embodiment. [Figure 2] 1 is a block diagram showing an example of the configuration of an amplifier circuit according to a first embodiment. [Figure 3A] 3 is a plan view showing an example of a connection structure of signal lines at an output terminal of the peak amplifier according to the first embodiment. FIG. [Figure 3B]5 is a plan view showing another example of the connection structure of signal lines at the output terminal of the peak amplifier according to the first embodiment. FIG. [Figure 3C] 10 is a plan view showing yet another example of the connection structure of signal lines at the output terminal of the peak amplifier according to the first embodiment. FIG. [Figure 4A] FIG. 1 is a circuit diagram showing a coupling point between the output of a carrier amplifier and the output of a peak amplifier in a conventional Doherty amplifier circuit. [Figure 4B] 2 is a circuit diagram showing a connection point between the output of a carrier amplifier and the output of a peak amplifier in the Doherty amplifier circuit according to the first embodiment. FIG. [Figure 5] 10 is a graph showing the impedance from the coupling point to the peak amplifier side during back-off operation. [Figure 6] FIG. 10 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to a second embodiment. [Figure 7] FIG. 11 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to a third embodiment. [Figure 8] FIG. 10 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to a fourth embodiment. [Figure 9] FIG. 11 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] <Problems to be solved by this disclosure> In the Doherty amplifier disclosed in Patent Document 1, the drain terminal of the peak amplifier is bent and extended in the circuit direction. Therefore, the overall length of the drain terminal of the peak amplifier is long, and the portion of the drain terminal to which the first bonding wire is connected is far from the center of the terminal, which is the starting point for propagation of the output signal of the peak amplifier within the drain terminal. This causes the impedance of the peak amplifier to deviate from the open state during back-off operation. Furthermore, because the drain terminal of the peak amplifier die is bent in the circuit direction, the size of the peak amplifier die increases. This hinders miniaturization of the entire Doherty amplifier.

[0012] <Advantages of this disclosure> According to the present disclosure, it is possible to achieve a Doherty amplifier circuit that is small in size and highly efficient.

[0013] <Summary of Embodiments of the Present Disclosure> Hereinafter, an outline of embodiments of the present disclosure will be listed and described.

[0014] (1) An amplifier module according to this embodiment is an amplifier module including a Doherty amplifier circuit, the Doherty amplifier circuit including a first transistor chip constituting a carrier amplifier, a first output signal line transmitting a first amplified signal output from the carrier amplifier, a second transistor chip constituting a peak amplifier, and a second output signal line transmitting a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, the first output signal line including a first conductor provided on a printed circuit board, a first end connected to the first conductor, and a second end connected to a drain terminal of the second transistor chip. The second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, wherein the direction from the drain terminal of the second transistor chip toward the connection portion of the first conductor to the first end of the first bonding wire is the same as the direction from the drain terminal of the second transistor chip toward the connection portion of the second conductor to the second end of the second bonding wire. The "direction" here means one direction, not two directions. With the above configuration, the connection point between the output of the carrier amplifier and the output of the peak amplifier is the drain terminal of the second transistor. Therefore, there is no wiring from the drain terminal of the second transistor to the connection point, and therefore, the impedance on the peak amplifier side during back-off operation can be brought closer to an open state without providing a delay line. Furthermore, since the direction from the drain terminal of the second transistor chip toward the connection portion of the first conductor with the first end of the first bonding wire and the direction from the drain terminal of the second transistor chip toward the connection portion of the second conductor with the second end of the second bonding wire are aligned, there is no need to bend the drain terminal of the second transistor chip, and it is possible to prevent the impedance on the peak amplifier side from deviating from the open state from the connection point during back-off operation, thereby preventing the Doherty amplifier circuit from becoming larger.

[0015] (2) The direction from the gate terminal to the drain terminal of the second transistor chip may be the same as the direction from the drain terminal of the second transistor chip to the connection portion of the first conductor with the first end of the first bonding wire. This eliminates the need to bend the drain terminal of the second transistor chip, and prevents the impedance on the peak amplifier side from deviating from the open state during back-off operation, thereby preventing the Doherty amplifier circuit from becoming large.

[0016] (3) The first output signal line may further include a third bonding wire having a first end connected to a drain terminal of the first transistor chip and a second end connected to the first conductor, and the direction from the drain terminal of the first transistor chip to a connection portion of the first conductor with the second end of the third bonding wire may be the same as or opposite to the direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire. This makes it possible to prevent the manufacturing process from becoming complicated due to inconsistencies in the wiring directions of bonding wires.

[0017] (4) A direction from the gate terminal to the drain terminal of the first transistor chip may be the same as a direction from the drain terminal of the first transistor chip to a connection portion of the first conductor with the second end of the third bonding wire. This eliminates the need to bend the drain terminal of the first transistor chip, and prevents the first transistor chip from becoming large.

[0018] (5) The Doherty amplifier circuit may further include a first impedance matching circuit connected to the drain terminal of the second transistor chip via the first output signal line and a third output signal line connecting the drain terminal of the first transistor chip and the first impedance matching circuit, the third output signal line including a third conductor provided on the printed circuit board and connected to the first impedance matching circuit, and a third bonding wire having a first end connected to the drain terminal of the first transistor chip and a second end connected to the third conductor, wherein a direction from the drain terminal of the first transistor chip to a connection portion of the third conductor with the second end of the third bonding wire may be the same as or opposite to a direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire. This prevents the manufacturing process from becoming complicated due to inconsistent wiring directions of bonding wires.

[0019] (6) A direction from the gate terminal to the drain terminal of the first transistor chip may be the same as a direction from the drain terminal of the first transistor chip to a connection portion of the third conductor with the second end of the third bonding wire. This eliminates the need to bend the drain terminal of the first transistor chip, and prevents the first transistor chip from becoming large.

[0020] (7) The first transistor chip and the second transistor chip may be arranged in a direction intersecting a direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire, and the direction from the gate terminal to the drain terminal of the first transistor chip may be the same as the direction from the gate terminal to the drain terminal of the second transistor chip. This allows for efficient arrangement of components of a Doherty amplifier circuit and prevents the Doherty amplifier circuit from becoming large.

[0021] (8) The first transistor chip and the second transistor chip may be arranged along a direction from the drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire, and the direction from the gate terminal to the drain terminal of the first transistor chip may be opposite to the direction from the gate terminal to the drain terminal of the second transistor chip. This allows for efficient arrangement of components of a Doherty amplifier circuit and prevents the Doherty amplifier circuit from becoming large.

[0022] (9) The first conductor may be disposed between the first transistor chip and the second transistor chip, thereby enabling more efficient arrangement of components of the Doherty amplifier circuit and preventing the Doherty amplifier circuit from becoming large.

[0023] (10) The Doherty amplifier circuit may further include a second impedance conversion circuit connected to the drain terminal of the second transistor chip via the second output signal line, thereby adjusting the load impedance of the entire Doherty amplifier circuit and achieving even higher efficiency.

[0024] (11) The first bonding wire and the second bonding wire do not need to cross each other, which simplifies the wiring for connecting the output signal line and the drain terminal of the second transistor.

[0025] (12) The first bonding wire and the second bonding wire may be parallel to each other, which facilitates wiring for connecting the output signal line and the drain terminal of the second transistor.

[0026] (13) The first bonding wire and the second bonding wire may cross each other, thereby increasing the degree of freedom in wiring for connecting the output signal line and the drain terminal of the second transistor.

[0027] (14) An amplifier module according to this embodiment is an amplifier module including a Doherty amplifier circuit, the Doherty amplifier circuit including: a first transistor chip constituting a carrier amplifier; a first output signal line transmitting a first amplified signal output from the carrier amplifier; a second transistor chip constituting a peak amplifier; and a second output signal line transmitting a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, the first output signal line including a first conductor provided on a printed circuit board and a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip, the second output signal line including a second conductor spaced apart from the first conductor on the printed circuit board and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, and the direction from the gate terminal to the drain terminal of the second transistor chip is the same as the direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire. As a result, the junction between the output of the carrier amplifier and the output of the peak amplifier becomes the drain terminal of the second transistor. Therefore, there is no wiring from the drain terminal of the second transistor to the junction, and thus, the impedance on the peak amplifier side from the junction to the open state during back-off operation can be kept close to the open state without providing a delay line. Furthermore, because the direction from the gate terminal to the drain terminal of the second transistor chip is aligned with the direction from the drain terminal of the second transistor chip to the connection portion of the first conductor with the first end of the first bonding wire, there is no need to bend the drain terminal of the second transistor chip. This prevents the impedance on the peak amplifier side from deviating from the open state during back-off operation, thereby preventing the Doherty amplifier circuit from becoming larger.

[0028] (15) A communication device according to this embodiment is a communication device including a transmission circuit that outputs a high-frequency transmission signal and an amplifier module that amplifies the transmission signal output by the transmission circuit, wherein the amplifier module includes a Doherty amplifier circuit, a first transistor chip that constitutes a carrier amplifier, a first output signal line that transmits a first amplified signal output from the carrier amplifier, a second transistor chip that constitutes a peak amplifier, and a second output signal line that transmits a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, and the first output signal line includes a first conductor provided on a printed circuit board, a first end connected to the first conductor, and a second end connected to the second conductor. and a first bonding wire having a second end connected to the drain terminal of the transistor chip, wherein the second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, wherein the direction from the drain terminal of the second transistor chip toward the connection portion of the first conductor to the first end of the first bonding wire is the same as the direction from the drain terminal of the second transistor chip toward the connection portion of the second conductor to the second end of the second bonding wire. As a result, the connection point between the output of the carrier amplifier and the output of the peak amplifier is the drain terminal of the second transistor. Therefore, there is no wiring from the drain terminal of the second transistor to the connection point, and therefore, the impedance on the side of the peak amplifier from the connection point during back-off operation can be made closer to an open state without providing a delay line. Furthermore, since the direction from the drain terminal of the second transistor chip toward the connection portion of the first conductor with the first end of the first bonding wire and the direction from the drain terminal of the second transistor chip toward the connection portion of the second conductor with the second end of the second bonding wire are aligned, there is no need to bend the drain terminal of the second transistor chip, and it is possible to prevent the impedance on the peak amplifier side from deviating from the open state from the connection point during back-off operation, thereby preventing the Doherty amplifier circuit from becoming larger.

[0029] (16) A communication device according to this embodiment is a communication device including a transmission circuit that outputs a high-frequency transmission signal and an amplifier module that amplifies the transmission signal output by the transmission circuit, wherein the amplifier module includes a Doherty amplifier circuit, a first transistor chip that constitutes a carrier amplifier, a first output signal line that transmits a first amplified signal output from the carrier amplifier, a second transistor chip that constitutes a peak amplifier, and a second output signal line that transmits a composite signal of the first amplified signal and a second amplified signal output from the peak amplifier, and the first output signal line includes a first conductor provided on a printed circuit board and a second conductor connected to the first conductor. and a first bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the drain terminal of the second transistor chip, and the second output signal line includes a second conductor spaced apart from the first conductor on the printed circuit board, and a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor, the direction from the gate terminal to the drain terminal of the second transistor chip being the same as the direction from the drain terminal of the second transistor chip to the connection portion of the first conductor with the first end of the first bonding wire. As a result, the connection point between the output of the carrier amplifier and the output of the peak amplifier is the drain terminal of the second transistor. Therefore, there is no wiring from the drain terminal of the second transistor to the connection point, and therefore, the impedance on the side of the peak amplifier from the connection point during back-off operation can be made closer to an open state without providing a delay line. Furthermore, since the direction from the gate terminal to the drain terminal of the second transistor chip is aligned with the direction from the drain terminal of the second transistor chip to the connection portion with the first end of the first bonding wire in the first conductor, there is no need to bend the drain terminal of the second transistor chip, and it is possible to prevent the impedance on the peak amplifier side from deviating from the open state from the connection point during back-off operation, thereby preventing the Doherty amplifier circuit from becoming larger.

[0030] <Details of the embodiment of the present disclosure> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. At least some of the following preferred embodiments may be combined in any desired manner.

[0031] (First embodiment) [1-1. Wireless communication device] Fig. 1 is a block diagram showing an example of the configuration of a wireless communication device according to this embodiment. The wireless communication device 10 is, for example, a base station device for mobile communication. The wireless communication device 10 includes a base band unit (hereinafter also referred to as BBU) 20, a remote radio head (hereinafter also referred to as RRH) 30, an amplifier circuit 100, a duplexer 40, and an antenna 50. In the illustrated example, the wireless communication device 10 has a plurality of communication systems, each including the BBU 20, the RRH 30, the amplifier circuit 100, the duplexer 40, and the antenna 50, but is not limited to this. The wireless communication device 10 may be provided with one of the above communication systems.

[0032] The RRH 30 performs processing for transmitting and receiving, as a wireless signal, data transmitted and received between the RRH 30 and a mobile terminal connected to the wireless communication device 10. The BBU 20 performs digital signal processing and the like on the data transmitted and received by the RRH 30. The RRH 30 and the BBU 20 are connected via a line using a transmission path such as optical fiber. Note that, although the illustrated example shows a case where one RRH 30 is connected to one BBU 20, multiple RRHs 30 may be connected to one BBU 20.

[0033] The RRH 30 includes a transmission circuit 31 and a reception circuit 32. The transmission circuit 31 performs quadrature modulation on transmission data provided as a digital baseband signal from the BBU 20. An amplifier circuit 100 is connected to the transmission circuit 31. The transmission circuit 31 converts the transmission data into an analog radio signal and outputs the radio signal to the amplifier circuit 100.

[0034] The amplifier circuit 100 amplifies a radio signal (transmission signal). The amplified transmission signal is output to the duplexer 40. The duplexer 40 separates the transmission signal from the reception signal and outputs the transmission signal to the antenna 50. The transmission signal output from the duplexer 40 is transmitted from the antenna 50.

[0035] A radio signal (received signal) from a mobile terminal received by the antenna 50 is input to the duplexer 40. The duplexer 40 separates the transmitted signal from the received signal and outputs the received signal to the receiving circuit 32.

[0036] The receiving circuit 32 amplifies the received signal and performs AD (analog-to-digital) conversion on the amplified received signal. The receiving circuit 32 quadrature demodulates the digital received signal (received data) and outputs the quadrature-demodulated received data as a baseband signal.

[0037] The BBU 20 includes an interface unit 21 and a signal processing circuit 22. The signal processing circuit 22 is connected to an upper network via the interface unit 21, and exchanges IP packets with the upper network. Furthermore, the signal processing circuit 22 performs conversion processing between IP packets and baseband signals.

[0038] [1-2. Amplification circuit] Next, a description will be given of the amplifier circuit 100. The amplifier circuit 100 is an example of an amplifier module.

[0039] Fig. 2 is a block diagram showing an example of the configuration of an amplifier circuit according to this embodiment. The amplifier circuit 100 shown in Fig. 2 includes a driver amplifier 200 and a Doherty amplifier circuit 500. The Doherty amplifier circuit 500 includes a divider 210, input matching circuits 220 and 240, a phase delay circuit 230, a carrier amplifier 300, an impedance conversion circuit 310, a peak amplifier 400, and an impedance conversion circuit 410.

[0040] The driver amplifier 200, the carrier amplifier 300, and the peak amplifier 400 are each configured by a transistor chip such as a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), or a GaN HEMT (Gallium Nitride High-Electron-Mobility Transistor). The driver amplifier 200, the carrier amplifier 300, and the peak amplifier 400 may be configured by transistor chips having the same structure, material, or characteristics, or may be configured by transistor chips having different structures, materials, or characteristics at least in one respect.

[0041] In the amplifier circuit 100, the driver amplifier 200 is a preamplifier, and the input side of the Doherty amplifier circuit 500 is connected to the output terminal (drain terminal) of the driver amplifier 200. More specifically, a signal line 201 extending from the output terminal of the driver amplifier 200 is connected to the input side of the Doherty amplifier circuit 500.

[0042] The Doherty amplifier circuit 500 includes a divider 210. The above-mentioned signal line 201 is connected to an input terminal of the divider 210. Signal lines 211 and 212 extend from two output terminals of the divider 210, respectively. The driver amplifier 200 amplifies the high-frequency signal output from the transmission circuit 31 and outputs the amplified signal. The divider 210 distributes the high-frequency signal output from the driver amplifier 200 to the signal lines 211 and 212.

[0043] The signal line 211 is connected to the input terminal (gate terminal) of the carrier amplifier 300 via the input matching circuit 220. The carrier amplifier 300 is biased to class A or class AB, amplifies the signal regardless of the power level of the input signal, and outputs the amplified signal (first amplified signal).

[0044] The signal line 212 is connected to the input terminal (gate terminal) of the peak amplifier 400 via a phase delay circuit 230 and an input matching circuit 240. The phase delay circuit 230 imparts a phase delay of 90° to the input signal. The peak amplifier 400 is biased to class C, and amplifies the input signal when the power level of the input signal is equal to or greater than a predetermined value, and outputs the amplified signal (second amplified signal).

[0045] The output terminal (drain terminal) of the carrier amplifier 300 is connected to the impedance conversion circuit 310 via an output signal line (third output signal line) 302. An output signal line (first output signal line) 301 extends from the impedance conversion circuit 310. The impedance conversion circuit 310 imparts a phase delay of 90° to the input signal. The impedance conversion circuit 310 adjusts the load impedance of the carrier amplifier 300. The output signal lines 302 and 301 transmit a first amplified signal output from the carrier amplifier 300. The output signal line 301 is connected to the output terminal (drain terminal) of the peak amplifier 400. In other words, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 is the output terminal 450 of the peak amplifier 400. That is, the output terminal of the carrier amplifier 300 is connected to the output terminal of the peak amplifier 400 via the impedance conversion circuit 310.

[0046] An output signal line (second output signal line) 401 is connected to the output terminal of the peak amplifier 400. The output signal line 401 transmits a composite signal of the amplified signal (first amplified signal) output from the carrier amplifier 300 and the amplified signal (second amplified signal) output from the peak amplifier 400. The output signal line 401 is connected to an impedance conversion circuit 410. The impedance conversion circuit 410 adjusts the impedance of the entire Doherty amplifier circuit 500.

[0047] When the power level of the input signal from the driver amplifier 200 is low, the Doherty amplifier circuit 500 configured as described above amplifies the signal using the carrier amplifier 300 and outputs the amplified signal. When the power level of the input signal from the driver amplifier 200 is high, the Doherty amplifier circuit 500 amplifies the signal using each of the carrier amplifier 300 and the peak amplifier 400, combines the two amplified signals, and outputs a combined signal. The output signal from the Doherty amplifier circuit 500 is provided to the duplexer 40.

[0048] [1-3. Signal line connection structure at the output terminal of the peak amplifier] 3A is a plan view showing an example of a connection structure of signal lines at an output terminal of a peak amplifier according to this embodiment. The above-described Doherty amplifier circuit 500 is mounted on a printed circuit board. The output signal line 301 includes a microstrip line 311 (first conductor) printed on the printed circuit board and bonding wires (first bonding wires) 312A and 312B. Similarly, the output signal line 401 includes a microstrip line (second conductor) 411 printed on the printed circuit board and bonding wires (second bonding wires) 412A and 412B. However, the conductor is not limited to a microstrip line as long as it is a conductor provided on the printed circuit board that allows wire bonding. For example, it may be a strip line including a portion exposed from the board.

[0049] Peak amplifier 400, which is a transistor chip, includes connection portions 440A, 440B, 440C, and 440D at input terminals (gate terminals) and connection portions 450A, 450B, 450C, and 450D at output terminals (drain terminals). Note that connection portions 440A, 440B, 440C, and 440D are connection portions of leads at one input terminal, and connection portions 440A, 440B, 440C, and 440D are electrically connected to each other. Connection portions 450A, 450B, 450C, and 450D are connection portions of leads at one output terminal, and connection portions 450A, 450B, 450C, and 450D are electrically connected to each other.

[0050] The microstrip line 311 and the microstrip line 411 are spaced apart from each other. The microstrip line 311 and the connection portions 450C and 450D are connected by bonding wires 312A and 312B. That is, one end of the bonding wire 312A is joined to the microstrip line 311, and the other end of the bonding wire 312A is joined to the connection portion 450C. One end of the bonding wire 312B is joined to the microstrip line 311, and the other end of the bonding wire 312B is joined to the connection portion 450D. This realizes the connection between the output signal line 301 and the output terminal of the peak amplifier 400.

[0051] The microstrip line 411 and the connection portions 450A and 450B are connected by bonding wires 412A and 412B. That is, one end of the bonding wire 412A is joined to the microstrip line 411, and the other end of the bonding wire 412A is joined to the connection portion 450A. One end of the bonding wire 412B is joined to the microstrip line 411, and the other end of the bonding wire 412B is joined to the connection portion 450B. This realizes the connection between the output signal line 401 and the output terminal of the peak amplifier 400.

[0052] 3A, the bonding wires 312A, 312B, 412A, and 412B do not cross each other. For example, the bonding wires 312A, 312B, 412A, and 412B are parallel to each other. This facilitates wire bonding. In other words, the wiring for connecting the output signal line 301 and the output terminal of the peak amplifier (second transistor) 400 can be simplified.

[0053] 3A, a microstrip line 311 is arranged in a position close to connecting portions 450C and 450D of the peak amplifier 400, and a microstrip line 411 is arranged in a position close to connecting portions 450A and 450B. Bonding wires 312A and 312B extending from the microstrip line 311 are connected to connecting portions 450C and 450D close to the microstrip line 311. Bonding wires 412A and 412B extending from the microstrip line 411 are connected to connecting portions 450A and 450B close to the microstrip line 411.

[0054] 3A, the bonding wires 312A and 312B included in the output signal line 301 (i.e., for outputting the carrier amplifier 300) are arranged adjacent to each other, and the bonding wires 412A and 412B included in the output signal line 401 (i.e., for outputting a combined signal obtained by combining the output signal of the carrier amplifier 300 and the output signal of the peak amplifier 400) are arranged adjacent to each other. However, FIG. 3A is merely one example of the arrangement of the bonding wires 312A, 312B, 412A, and 412B, and is not limited to this.

[0055] 3B is a plan view showing another example of the connection structure of signal lines at the output terminal of the peak amplifier according to this embodiment. In this example, a bonding wire 312A is connected to connecting portion 450B, and a bonding wire 312B is connected to connecting portion 450C. Furthermore, a bonding wire 412A is connected to connecting portion 450A, and a bonding wire 412B is connected to connecting portion 450D.

[0056] In the example shown in FIG. 3B, the bonding wires 312A and 312B included in the output signal line 301 are arranged adjacent to each other, but the bonding wires 412A and 412B included in the output signal line 401 are not adjacent to each other. The bonding wires 312A and 312B are sandwiched between the bonding wires 412A and 412B. Even in this connection configuration, the bonding wires 312A, 312B, 412A, and 412B do not cross each other. This facilitates wire bonding. In FIG. 3B, the bonding wires 312A, 312B, 412A, and 412B are not parallel to each other, but the bonding wires 312A, 312B, 412A, and 412B may be parallel to each other.

[0057] 3B, a space is provided between the peak amplifier 400 and the microstrip line 411, and the microstrip line 311 is disposed in the space. That is, the microstrip line 311 is sandwiched between the peak amplifier 400 and the microstrip line 411. Each of the bonding wires 412A and 412B straddles the microstrip line 311 to connect the peak amplifier 400 and the microstrip line 411. In this manner, the peak amplifier 400 and one of the microstrip lines 311, 411 may be disposed at a distance from each other, with the other of the microstrip lines 311, 411 sandwiched therebetween. Furthermore, either the bonding wires 312A, 312B or the bonding wires 412A, 412B may straddle the microstrip line.

[0058] Although not shown, the bonding wires 412A and 412B may be sandwiched between the bonding wires 312A and 312B. That is, for example, the bonding wire 312A may be connected to the connecting portion 450A, the bonding wire 312B may be connected to the connecting portion 450D, the bonding wire 412A may be connected to the connecting portion 450B, and the bonding wire 412B may be connected to the connecting portion 450C. Furthermore, the bonding wires 312A and 312B for outputting the carrier amplifier 300 and the bonding wires 412A and 412B for outputting the composite signal may be arranged alternately. That is, for example, the bonding wire 312A may be connected to the connecting portion 450A, the bonding wire 412A may be connected to the connecting portion 450B, the bonding wire 312B may be connected to the connecting portion 450C, and the bonding wire 412B may be connected to the connecting portion 450D.

[0059] 3C is a plan view showing yet another example of the connection structure of signal lines at the output terminal of the peak amplifier according to this embodiment. In this example, a bonding wire 312A is connected to a connection portion 450A, and a bonding wire 312B is connected to a connection portion 450D. Furthermore, a bonding wire 412A is connected to a connection portion 450B, and a bonding wire 412B is connected to a connection portion 450C. The bonding wire 312A intersects with the bonding wires 412A and 412B in a plan view. However, the bonding wire 312A is not in contact with the bonding wires 412A and 412B in a three-dimensional view. That is, the bonding wire 312A is vertically spaced apart from the bonding wires 412A and 412B.

[0060] 3C, at least some of the bonding wires 312A, 312B, 412A, and 412B may cross each other. This improves the degree of freedom in wiring. Although not shown, the bonding wires 312A and 312B may cross the bonding wires 412A and 412B.

[0061] [1-4. Impedance from the coupling point to the peak amplifier side during back-off operation] FIG. 4A shows the conventional Doherty amplifier circuit. Career 4A is a circuit diagram showing a connection point between the output of the amplifier and the output of the peak amplifier, and FIG. 4B is a circuit diagram showing a connection point between the output of the carrier amplifier and the output of the peak amplifier in the Doherty amplifier circuit according to this embodiment.

[0062] In the Doherty amplifier circuit 500A shown in Fig. 4A, an impedance conversion circuit 410 is provided on the output side of the peak amplifier 400. An output signal line 301 extending from the impedance conversion circuit 310 provided on the output side of the carrier amplifier 300 and an output signal line 401 extending from the impedance conversion circuit 410 are connected to each other at a junction 430. The output signal line 401 and the impedance conversion circuit 410 are included between the output terminal of the peak amplifier 400 and the junction 430. However, the impedance conversion circuit 310 shown in Fig. 4A has the same configuration as the impedance conversion circuit according to this embodiment and does not include a delay line.

[0063] In the Doherty amplifier circuit 500 according to this embodiment, an impedance conversion circuit 310 is provided on the output side of the carrier amplifier 300. An output signal line 301 extending from the impedance conversion circuit 310 is connected to an output terminal 450 of the peak amplifier 400. An output signal line 401 extends from the output terminal of the peak amplifier 400 and is connected to the impedance conversion circuit 410. In the Doherty amplifier circuit 500 according to this embodiment, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 is the output terminal 450 of the peak amplifier 400.

[0064] Fig. 5 is a graph (Smith chart) showing the impedance from the node to the peak amplifier side during back-off operation. In Fig. 5, "old node" indicates the impedance on the peak amplifier side during back-off operation as viewed from node 430 shown in Fig. 4A, and "new node" indicates the impedance from the node to the peak amplifier side during back-off operation in Doherty amplifier circuit 500 according to this embodiment.

[0065] If no delay line is provided on the output side of the carrier amplifier 300, the impedance from the node 430 to the peak amplifier 400 during back-off operation is the impedance from the output terminal 450 of the peak amplifier 400 to the node. Therefore, in the Doherty amplifier circuit 500A shown in Fig. 4A, the impedance from the node 430 to the peak amplifier 400 during back-off operation includes impedances determined by the physical properties of the impedance conversion circuit 410 and the output signal line 401. For this reason, the impedance from the node 430 to the peak amplifier 400 during back-off operation is at the position of the "old node" away from the open circuit (the position "∞" in the figure).

[0066] On the other hand, in the Doherty amplifier circuit 500 according to this embodiment, the connection point is the output terminal 450 of the peak amplifier 400. Therefore, the impedance from the connection point to the peak amplifier 400 during back-off operation does not include the impedance determined by the physical properties of the impedance conversion circuit 450 and the output signal line 401. For this reason, the impedance from the connection point to the peak amplifier 400 during back-off operation is at the position of the "new connection point," and approaches open, which is the ideal impedance.

[0067] [2. Second Embodiment] Fig. 6 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to the second embodiment. In the figure, the X1 direction and the X2 direction are opposite to each other. In Fig. 6, the X1 direction and the X2 direction both indicate the horizontal direction. In Fig. 6, the X1 direction indicates the leftward direction, and the X2 direction indicates the rightward direction. The X1 direction and the X2 direction are opposite to each other. The Y direction is a direction perpendicular to the X1 and X2 directions.

[0068] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y direction. The carrier amplifier 300 is arranged so that the direction from the gate terminal 340 to the drain terminal 350 is the X2 direction. The peak amplifier 400 is arranged so that the direction from the gate terminal 440 to the drain terminal 450 is the X2 direction. In other words, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 and the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 are the same direction.

[0069] An output signal line 302 is arranged on the output side of the carrier amplifier 300, i.e., on the X2 direction side. The output signal line 302 includes a microstrip line 321 (third conductor) printed on a printed circuit board and bonding wires (third bonding wires) 322A, 322B, 322C, and 322D. However, the output signal line 302 is not limited to a microstrip line as long as it is a conductor provided on the printed circuit board that allows wire bonding. For example, it may be a strip line including a portion exposed from the board.

[0070] Carrier amplifier 300, which is a transistor chip, includes connection portions 340A, 340B, 340C, and 340D of an input terminal (gate terminal 340) and connection portions 350A, 350B, 350C, and 350D of an output terminal (drain terminal 350). Connection portions 340A, 340B, 340C, and 340D are connection portions of leads at one input terminal, and connection portions 340A, 340B, 340C, and 340D are electrically connected to each other. Connection portions 350A, 350B, 350C, and 350D are connection portions of leads at one output terminal, and connection portions 350A, 350B, 350C, and 350D are electrically connected to each other.

[0071] The microstrip line 321 is connected to an input terminal (not shown) of the impedance conversion circuit 310. The microstrip line 321 is connected to connection portions 350A, 350B, 350C, and 350D by bonding wires 322A, 322B, 322C, and 322D. That is, one end (first end) of the bonding wire 322A is joined (bonded) to the connection portion 350A, and the other end (second end) of the bonding wire 322A is joined to the connection portion 321A of the microstrip line 321. One end (first end) of the bonding wire 322B is joined to the connection portion 350B, and the other end (second end) of the bonding wire 322B is joined to the connection portion 321B of the microstrip line 321. One end (first end) of the bonding wire 322C is joined to the connecting portion 350C, and the other end (second end) of the bonding wire 322C is joined to the connecting portion 321C of the microstrip line 321. One end (first end) of the bonding wire 322D is joined to the connecting portion 350D, and the other end (second end) of the bonding wire 322D is joined to the connecting portion 321D of the microstrip line 321. This achieves connection between the output signal line 302 and the output terminal of the carrier amplifier 300. Note that, although the bonding wires 322A, 322B, 322C, and 322D do not cross each other in FIG. 6, this is not a limitation. Parts of the bonding wires 322A, 322B, 322C, and 322D may cross each other. The bonding wires 322A, 322B, 322C, and 322D may also be parallel to each other.

[0072] An output signal line 301 is arranged on the output side of the peak amplifier 400, i.e., on the X2 direction side. The microstrip line 311 is connected to an output terminal (not shown) of the impedance conversion circuit 310. Of the connection parts 450A, 450B, 450C, and 450D of the drain terminal 450 of the peak amplifier 400, the two connection parts 450C and 450D on the side closer to the carrier amplifier 300 (on the Y direction side) are connected to the microstrip line 311 by bonding wires 312A and 312B. That is, one end (second end) of the bonding wire 312A is joined (bonded) to the connection part 450C, and the other end (first end) of the bonding wire 312A is joined to the connection part 311A ​​of the microstrip line 311. One end (second end) of the bonding wire 312B is joined to the connection portion 450D, and the other end (first end) of the bonding wire 312B is joined to the connection portion 311B of the microstrip line 311. This realizes a connection between the output signal line 301 and the output terminal of the peak amplifier 400. Note that in FIG. 6, the bonding wires 312A and 312B do not cross each other, but this is not a limitation. The bonding wires 312A and 312B may cross each other. The bonding wires 312A and 312B may be parallel to each other. The bonding wires 312A and 312B and the bonding wires 322A, 322B, 322C, and 322D may be parallel to each other.

[0073] An output signal line 401 is arranged on the output side of the peak amplifier 400, i.e., on the X2 direction side. The microstrip line 411 is connected to an input terminal (not shown) of the impedance conversion circuit 410. Of the connection portions 450A, 450B, 450C, and 450D of the drain terminal 450 of the peak amplifier 400, the two connection portions 450A and 450B on the side away from the carrier amplifier 300 (the opposite side in the Y direction) are connected to the microstrip line 411 by bonding wires 412A and 412B. That is, one end (first end) of the bonding wire 412A is joined (bonded) to the connection portion 450A, and the other end (second end) of the bonding wire 412A is joined to the connection portion 411A of the microstrip line 411. One end (first end) of the bonding wire 412B is joined to the connection portion 450B, and the other end (second end) of the bonding wire 412B is joined to the connection portion 411B of the microstrip line 411. This realizes a connection between the output signal line 401 and the output terminal of the peak amplifier 400. Note that in FIG. 6, the bonding wires 412A and 412B do not cross each other, but this is not limiting. The bonding wires 412A and 412B may cross each other. The bonding wires 412A and 412B may be parallel to each other. The bonding wires 412A and 412B may be parallel to the bonding wires 322A, 322B, 322C, and 322D. Furthermore, the bonding wires 312A, 312B, 412A, and 412B may be arranged as shown in FIGS. 3B and 3C.

[0074] The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the X2 direction. The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411 is the X2 direction. In other words, the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and prevents the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, the Doherty amplifier circuit 500 can be prevented from becoming large.

[0075] The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the X2 direction. That is, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, it is possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0076] Furthermore, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0077] The direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D of the microstrip line 321 is the X2 direction. That is, the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D of the microstrip line 321 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. Therefore, the wiring directions of the bonding wires 322A, 322B, 322C, 322D, 312A, and 312B can be aligned to a certain extent. This makes it possible to prevent the manufacturing process from becoming complicated due to inconsistencies in the wiring directions of the bonding wires.

[0078] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the X2 direction. That is, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D of the microstrip line 321. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0079] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y direction. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same as the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400. This allows the microstrip lines 311 and 321 and the impedance conversion circuit 310 to be arranged on the output sides of the carrier amplifier 300 and the peak amplifier 400. This allows the components of the Doherty amplifier circuit 500 to be arranged efficiently, and prevents the Doherty amplifier circuit 500 from becoming larger.

[0080] 3. Third Embodiment Fig. 7 is a plan view showing the connection structure of signal lines in a carrier amplifier and a peak amplifier according to the third embodiment. In the figure, the Y1 direction and the Y2 direction are opposite to each other. In Fig. 7, the Y1 direction and the Y2 direction both indicate vertical directions. In Fig. 7, the Y1 direction indicates an upward direction and the Y2 direction indicates a downward direction. The Y1 direction and the Y2 direction are opposite to each other. The X direction is a direction perpendicular to the Y1 and Y2 directions.

[0081] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y1 direction. The carrier amplifier 300 is arranged so that the direction from the gate terminal 340 to the drain terminal 350 is the Y2 direction. The peak amplifier 400 is arranged so that the direction from the gate terminal 440 to the drain terminal 450 is the Y1 direction. In other words, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is opposite to the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400.

[0082] A microstrip line 321 is arranged on the output side, i.e., the Y2 direction side, of the carrier amplifier 300. That is, a drain terminal 350 of the carrier amplifier 300 and the microstrip line 321 face each other in the Y1 direction. Bonding wires 322A, 322B, 322C, and 322D extend along the Y2 direction and connect connection portions 350A, 350B, 350C, and 350D of the drain terminal 350 to connection portions 321A, 321B, 321C, and 321D of the microstrip line 321, respectively.

[0083] A microstrip line 311 is arranged on the output side, i.e., the Y1 direction side, of the peak amplifier 400. That is, a drain terminal 450 of the peak amplifier 400 and the microstrip line 311 face each other in the Y1 direction. Bonding wires 312A and 312B extend along the Y1 direction and connect connection portions 450A and 450B of the drain terminal 450 to connection portions 311A ​​and 311B of the microstrip line 311, respectively.

[0084] A microstrip line 411 is arranged on the output side, i.e., the Y1 direction side, of the peak amplifier 400. That is, a drain terminal 450 of the peak amplifier 400 and the microstrip line 411 face each other in the Y1 direction. Bonding wires 412A and 412B extend along the Y1 direction and connect connection portions 450C and 450D of the drain terminal 450 to connection portions 411A and 411B of the microstrip line 411, respectively.

[0085] The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the Y1 direction. The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411 is the Y1 direction. In other words, the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and prevents the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, the Doherty amplifier circuit 500 can be prevented from becoming large.

[0086] The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the Y1 direction. That is, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, it is possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0087] Furthermore, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0088] The direction from the drain terminal 350 of the carrier amplifier 300 to the connection points 321A, 321B, 321C, and 321D of the microstrip line 321 is the Y2 direction. That is, the direction from the drain terminal 350 of the carrier amplifier 300 to the connection points 321A, 321B, 321C, and 321D of the microstrip line 321 is the opposite direction to the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311. Therefore, the wiring directions of the bonding wires 322A, 322B, 322C, 322D, 312A, and 312B can be aligned within a certain range. This makes it possible to prevent the manufacturing process from becoming complicated due to inconsistencies in the wiring directions of the bonding wires.

[0089] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the Y2 direction. That is, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D of the microstrip line 321. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0090] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y1 direction. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is opposite to the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400. This allows the microstrip lines 311 and 321 and the impedance conversion circuit 310 to be arranged between the carrier amplifier 300 and the peak amplifier 400. This allows the components of the Doherty amplifier circuit 500 to be arranged efficiently, and prevents the Doherty amplifier circuit 500 from becoming larger.

[0091] [4. Fourth Embodiment] 8 is a plan view showing a signal line connection structure in a carrier amplifier and a peak amplifier according to a fourth embodiment. In the figure, the X1 direction and the X2 direction are opposite directions. The Y direction is perpendicular to the X1 and X2 directions.

[0092] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y direction. The carrier amplifier 300 is arranged so that the direction from the gate terminal 340 to the drain terminal 350 is the X2 direction. The peak amplifier 400 is arranged so that the direction from the gate terminal 440 to the drain terminal 450 is the X2 direction. In other words, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 and the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 are the same direction.

[0093] An output signal line 301 is arranged on the output side, i.e., the X2 direction side, of the carrier amplifier 300. In this embodiment, the output signal line 301 connects a drain terminal 350 of the carrier amplifier 300 and a drain terminal 450 of the peak amplifier 400.

[0094] The output signal line 301 includes a microstrip line 311, bonding wires 312A and 312B, and bonding wires (third bonding wires) 313A, 313B, 313C, and 313D. The microstrip line 311 and connecting portions 350A, 350B, 350C, and 350D are connected by bonding wires 313A, 313B, 313C, and 313D. That is, one end (first end) of the bonding wire 313A is bonded to connecting portion 350A, and the other end (second end) of the bonding wire 313A is bonded to connecting portion 314A of the microstrip line 311. One end (first end) of the bonding wire 313B is bonded to connecting portion 350B, and the other end (second end) of the bonding wire 313B is bonded to connecting portion 314B of the microstrip line 311. One end (first end) of the bonding wire 313C is joined to the connecting portion 350C, and the other end (second end) of the bonding wire 313C is joined to the connecting portion 314C of the microstrip line 311. One end (first end) of the bonding wire 313D is joined to the connecting portion 350D, and the other end (second end) of the bonding wire 313D is joined to the connecting portion 314D of the microstrip line 311. This achieves connection between the output signal line 301 and the output terminal of the carrier amplifier 300. Note that, although the bonding wires 313A, 313B, 313C, and 313D do not cross each other in FIG. 8 , this is not a limitation. Parts of the bonding wires 313A, 313B, 313C, and 313D may cross each other. The bonding wires 313A, 313B, 313C, and 313D may also be parallel to each other.

[0095] An output signal line 301 is arranged on the output side of the peak amplifier 400, i.e., on the X2 direction side. Of the connection parts 450A, 450B, 450C, and 450D of the drain terminal 450 of the peak amplifier 400, the two connection parts 450C and 450D on the side closer to the carrier amplifier 300 (on the Y direction side) are connected to the microstrip line 311 by bonding wires 312A and 312B. That is, one end (second end) of the bonding wire 312A is bonded to the connection part 450C, and the other end (first end) of the bonding wire 312A is bonded to the connection part 311A ​​of the microstrip line 311. One end (second end) of the bonding wire 312B is bonded to the connection part 450D, and the other end (first end) of the bonding wire 312B is bonded to the connection part 311B of the microstrip line 311. This establishes a connection between the output signal line 301 and the output terminal of the peak amplifier 400. Note that, although the bonding wires 312A and 312B do not cross each other in FIG. 8, this is not limiting. The bonding wires 312A and 312B may cross each other. The bonding wires 312A and 312B may be parallel to each other. The bonding wires 312A and 312B and the bonding wires 313A, 313B, 313C, and 313D may be parallel to each other.

[0096] An output signal line 401 is arranged on the output side of the peak amplifier 400, i.e., on the X2 direction side. The microstrip line 411 is connected to an input terminal (not shown) of the impedance conversion circuit 410. Of the connection portions 450A, 450B, 450C, and 450D of the drain terminal 450 of the peak amplifier 400, the two connection portions 450A and 450B on the side away from the carrier amplifier 300 (the opposite side in the Y direction) are connected to the microstrip line 411 by bonding wires 412A and 412B. That is, one end (first end) of the bonding wire 412A is joined (bonded) to the connection portion 450A, and the other end (second end) of the bonding wire 412A is joined to the connection portion 411A of the microstrip line 411. One end (first end) of the bonding wire 412B is joined to the connection portion 450B, and the other end (second end) of the bonding wire 412B is joined to the connection portion 411B of the microstrip line 411. This realizes a connection between the output signal line 401 and the output terminal of the peak amplifier 400. Note that in FIG. 8, the bonding wires 412A and 412B do not cross each other, but this is not limiting. The bonding wires 412A and 412B may cross each other. The bonding wires 412A and 412B may be parallel to each other. The bonding wires 412A and 412B and the bonding wires 313A, 313B, 313C, and 313D may be parallel to each other. Furthermore, the bonding wires 312A, 312B, 412A, and 412B may be arranged as shown in FIGS. 3B and 3C.

[0097] The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the X2 direction. The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411 is the X2 direction. In other words, the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and prevents the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, the Doherty amplifier circuit 500 can be prevented from becoming large.

[0098] The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the X2 direction. That is, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, it is possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0099] Furthermore, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0100] The direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311 is the X2 direction. That is, the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. Therefore, the wiring directions of the bonding wires 313A, 313B, 313C, 313D, 312A, and 312B can be aligned within a certain range. This makes it possible to prevent the manufacturing process from becoming complicated due to inconsistencies in the wiring directions of the bonding wires.

[0101] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the X2 direction. That is, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0102] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y direction. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same as the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400. This allows the microstrip line 311 to be arranged on the output side of the carrier amplifier 300 and the peak amplifier 400. Therefore, the components of the Doherty amplifier circuit 500 can be arranged efficiently, and an increase in the size of the Doherty amplifier circuit 500 can be suppressed.

[0103] [5. Fifth Embodiment] 9 is a plan view showing a connection structure of signal lines in a carrier amplifier and a peak amplifier according to a fifth embodiment. In the figure, the Y1 direction and the Y2 direction are opposite directions. The X direction is perpendicular to the Y1 and Y2 directions.

[0104] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y1 direction. The carrier amplifier 300 is arranged so that the direction from the gate terminal 340 to the drain terminal 350 is the Y2 direction. The peak amplifier 400 is arranged so that the direction from the gate terminal 440 to the drain terminal 450 is the Y1 direction. In other words, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is opposite to the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400.

[0105] An output signal line 301 is arranged on the output side, i.e., the Y2 direction side, of the carrier amplifier 300. In this embodiment, a drain terminal 350 of the carrier amplifier 300 and a drain terminal 450 of the peak amplifier 400 are connected by the output signal line 301.

[0106] A microstrip line 311 is arranged on the output side, i.e., the Y2 direction side, of the carrier amplifier 300. That is, a drain terminal 350 of the carrier amplifier 300 and the microstrip line 311 face each other in the Y1 direction. Bonding wires 313A, 313B, 313C, and 313D extend along the Y2 direction and connect connection portions 350A, 350B, 350C, and 350D of the drain terminal 350 to connection portions 314A, 314B, 314C, and 314D of the microstrip line 311, respectively.

[0107] A microstrip line 311 is arranged on the output side, i.e., the Y1 direction side, of the peak amplifier 400. That is, a drain terminal 450 of the peak amplifier 400 and the microstrip line 311 face each other in the Y1 direction. Bonding wires 312A and 312B extend along the Y1 direction and connect connection portions 450A and 450B of the drain terminal 450 to connection portions 311A ​​and 311B of the microstrip line 311, respectively.

[0108] A microstrip line 411 is arranged on the output side, i.e., the Y1 direction side, of the peak amplifier 400. That is, a drain terminal 450 of the peak amplifier 400 and the microstrip line 411 face each other in the Y1 direction. Bonding wires 412A and 412B extend along the Y1 direction and connect connection portions 450C and 450D of the drain terminal 450 to connection portions 411A and 411B of the microstrip line 411, respectively.

[0109] The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the Y1 direction. The direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411 is the Y1 direction. In other words, the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 311A ​​and 311B of the microstrip line 311 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection points 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and prevents the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, the Doherty amplifier circuit 500 can be prevented from becoming large.

[0110] The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the Y1 direction. That is, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state. Furthermore, it is possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0111] Furthermore, the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 411A and 411B of the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the Doherty amplifier circuit 500 from becoming large.

[0112] The direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311 is the Y2 direction. That is, the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311 is the opposite direction to the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311. Therefore, the wiring directions of the bonding wires 313A, 313B, 313C, 313D, 312A, and 312B can be aligned to a certain extent. This prevents the manufacturing process from becoming complicated due to inconsistencies in the wiring directions of the bonding wires.

[0113] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the Y2 direction. That is, the direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D of the microstrip line 311. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0114] The carrier amplifier 300 and the peak amplifier 400 are arranged along the Y1 direction. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 is opposite to the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400. This allows the microstrip line 311 to be arranged between the carrier amplifier 300 and the peak amplifier 400. Therefore, the components of the Doherty amplifier circuit 500 can be arranged efficiently, and an increase in the size of the Doherty amplifier circuit 500 can be prevented.

[0115] [6. Modifications] In the above embodiments, the output signal line 301 includes two bonding wires 312A and 312B, and the output signal line 401 includes two bonding wires 412A and 412B. However, this is not a limitation. The number of bonding wires included in the output signal lines 301 and 401 is not limited. For example, the number of bonding wires may be determined based on the power of the signal to be transmitted. That is, the number of bonding wires is determined so that the maximum power transmitted through one bonding wire is equal to or less than the allowable value. The same applies to the bonding wires 322A, 322B, 322C, and 322D and 313A, 313B, 313C, and 313D. Furthermore, in the above embodiments, the output signal line 301 is directly connected to the output terminal (drain terminal) of the peak amplifier 400. However, this is not a limitation. For example, a very small impedance (e.g., a few ohms or less) may be provided between the output signal line 301 and the drain terminal. That is, it is sufficient if the output signal line 301 is substantially directly connected to the drain terminal of the peak amplifier 400 .

[0116] [7. Effects] The amplifier circuit 100 includes a Doherty amplifier circuit 500. The Doherty amplifier circuit 500 includes a carrier amplifier 300, an output signal line 301, a peak amplifier 400, and an output signal line 401. The carrier amplifier 300 is configured by a transistor chip (first transistor chip). The output signal line 301 transmits a first amplified signal output from the carrier amplifier 300. The peak amplifier 400 is configured by a transistor (second transistor). The output signal line 401 transmits a composite signal of the first amplified signal output from the carrier amplifier 300 and a second amplified signal output from the peak amplifier 400. The output signal line 301 includes a microstrip line 311 and bonding wires 312A and 312B provided on a printed circuit board. The bonding wires 312A and 312B include first ends connected to the microstrip line 311 and second ends connected to a drain terminal 450 of the peak amplifier 400. The output signal line 401 includes a microstrip line 411 separated from the microstrip line 311 on the printed circuit board, and bonding wires 412A and 412B. The bonding wires 412A and 412B have first ends connected to a drain terminal 450 of the peak amplifier 400 and second ends connected to the microstrip line 411. The direction from the drain terminal 450 of the peak amplifier 400 toward connection parts 311A ​​and 311B of the microstrip line 311 to the first ends of the bonding wires 312A and 312B is the same as the direction from the drain terminal 450 of the peak amplifier 400 toward connection parts 411A and 411B of the microstrip line 411 to the second ends of the bonding wires 412A and 412B. As a result, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 is the drain terminal 450 of the peak amplifier 400. Therefore, there is no wiring from the drain terminal 450 of the peak amplifier 400 to the junction point, and as a result, the impedance on the side from the junction point to the peak amplifier 400 during back-off operation can be made closer to an open state without providing a delay line.Furthermore, since the direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 311A ​​and 311B where the bonding wires 312A and 312B in the microstrip line 311 are connected to the first ends thereof and the direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 411A and 411B where the bonding wires 412A and 412B in the microstrip line 411 are connected to the second ends thereof are aligned, there is no need to bend the drain terminal 450 of the peak amplifier 400, and it is possible to prevent the impedance on the peak amplifier 400 side from deviating from the open state during back-off operation, and it is possible to prevent the Doherty amplifier circuit 500 from becoming larger.

[0117] The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 may be the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and makes it possible to prevent the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state, thereby preventing the Doherty amplifier circuit 500 from becoming larger.

[0118] The output signal line 301 may further include bonding wires 313A, 313B, 313C, and 313D. The bonding wires 313A, 313B, 313C, and 313D have first ends connected to a drain terminal 350 of the carrier amplifier 300 and second ends connected to the microstrip line 311. The direction from the drain terminal 350 of the carrier amplifier 300 to connection portions 314A, 314B, 314C, and 314D of the microstrip line 311 with the second ends of the bonding wires 313A, 313B, 313C, and 313D may be the same direction as or opposite to the direction from the drain terminal 450 of the peak amplifier 400 to connection portions 311A ​​and 311B of the microstrip line 311 with the first ends of the bonding wires 312A and 312B. This makes it possible to prevent the manufacturing process from becoming complicated due to the wiring directions of the bonding wires being different from each other.

[0119] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 may be the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 314A, 314B, 314C, and 314D with the second ends of the bonding wires 313A, 313B, 313C, and 313D of the microstrip line 311. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0120] The Doherty amplifier circuit 500 may further include an impedance conversion circuit 310 and an output signal line 302. The impedance conversion circuit 310 is connected to the drain terminal 450 of the peak amplifier 400 via the output signal line 301. The output signal line 302 connects the drain terminal 350 of the carrier amplifier 300 and the impedance conversion circuit 310. The output signal line 302 may include a microstrip line 321 provided on a printed circuit board and bonding wires 322A, 322B, 322C, and 322D. The microstrip line 321 is connected to the impedance conversion circuit 310. The bonding wires 322A, 322B, 322C, and 322D include first ends connected to the drain terminal 350 of the carrier amplifier 300 and second ends connected to the microstrip line 321. The direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D with the second ends of the bonding wires 322A, 322B, 322C, and 322D in the microstrip line 321 may be the same as or opposite to the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311. This makes it possible to prevent the manufacturing process from becoming complicated due to the wiring directions of the bonding wires being different from each other.

[0121] The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 may be the same direction as the direction from the drain terminal 350 of the carrier amplifier 300 to the connection portions 321A, 321B, 321C, and 321D with the second ends of the bonding wires 322A, 322B, 322C, and 322D of the microstrip line 321. This eliminates the need to bend the drain terminal 350 of the carrier amplifier 300, and makes it possible to prevent the carrier amplifier 300 from becoming large.

[0122] The carrier amplifier 300 and the peak amplifier 400 may be arranged along a direction intersecting a direction from the drain terminal 450 of the peak amplifier 400 toward connection portions 311A ​​and 311B of the microstrip line 311 with the first ends of the bonding wires 312A and 312B. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 and the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 may be the same direction. This allows the components of the Doherty amplifier circuit 500 to be arranged efficiently, and prevents the Doherty amplifier circuit 500 from becoming larger.

[0123] The carrier amplifier 300 and the peak amplifier 400 may be arranged along a direction from the drain terminal 450 of the peak amplifier 400 toward connection portions 311A ​​and 311B of the microstrip line 311 with the first ends of the bonding wires 312A and 312B. The direction from the gate terminal 340 to the drain terminal 350 of the carrier amplifier 300 may be opposite to the direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400. This allows the components of the Doherty amplifier circuit 500 to be arranged efficiently, and prevents the Doherty amplifier circuit 500 from becoming larger.

[0124] The microstrip line 311 may be arranged between the carrier amplifier 300 and the peak amplifier 400. This allows the components of the Doherty amplifier circuit 500 to be arranged more efficiently, and prevents the Doherty amplifier circuit 500 from becoming larger.

[0125] The Doherty amplifier circuit 500 may further include an impedance conversion circuit 410. The impedance conversion circuit 410 is connected to a drain terminal 450 of the peak amplifier 400 via an output signal line 401. This allows the load impedance of the entire Doherty amplifier circuit 500 to be adjusted, enabling even higher efficiency.

[0126] The bonding wires 312A and 312B and the bonding wires 412A and 412B do not need to cross each other, which simplifies the wiring for connecting the output signal line 301 and the drain terminal 450 of the peak amplifier 400.

[0127] The bonding wires 312A and 312B and the bonding wires 412A and 412B may be parallel to each other, which makes it possible to easily install wiring for connecting the output signal line 301 and the drain terminal 450 of the peak amplifier 400.

[0128] The bonding wires 312A and 312B and the bonding wires 412A and 412B may cross each other, which increases the degree of freedom in the wiring for connecting the output signal line 301 and the drain terminal 450 of the peak amplifier 400.

[0129] The amplifier circuit 100 includes a Doherty amplifier circuit 500. The Doherty amplifier circuit 500 includes a carrier amplifier 300, an output signal line 301, a peak amplifier 400, and an output signal line 401. The carrier amplifier 300 is configured by a transistor chip (first transistor chip). The output signal line 301 transmits a first amplified signal output from the carrier amplifier 300. The peak amplifier 400 is configured by a transistor (second transistor). The output signal line 401 transmits a composite signal of the first amplified signal output from the carrier amplifier 300 and a second amplified signal output from the peak amplifier 400. The output signal line 301 includes a microstrip line 311 and bonding wires 312A and 312B provided on a printed circuit board. The bonding wires 312A and 312B include first ends connected to the microstrip line 311 and second ends connected to a drain terminal 450 of the peak amplifier 400. The output signal line 401 includes a microstrip line 411 separated from the microstrip line 311 on the printed circuit board, and bonding wires 412A and 412B. The bonding wires 412A and 412B have first ends connected to a drain terminal 450 of the peak amplifier 400 and second ends connected to the microstrip line 411. The direction from the gate terminal 440 of the peak amplifier 400 to the drain terminal 450 is the same direction as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B of the microstrip line 311 with the first ends of the bonding wires 312A and 312B. As a result, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 becomes the drain terminal 450 of the peak amplifier 400. Therefore, there is no wiring from the drain terminal 450 of the peak amplifier 400 to the junction point, and as a result, the impedance on the side from the junction point to the peak amplifier 400 during back-off operation can be made closer to an open state without providing a delay line.Furthermore, since the direction from the gate terminal 440 of the peak amplifier 400 to the drain terminal 450 and the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311 are aligned, there is no need to bend the drain terminal 450 of the peak amplifier 400, and it is possible to prevent the impedance on the peak amplifier 400 side from the connection point during back-off operation from deviating from the open state, thereby preventing the Doherty amplifier circuit 500 from becoming larger.

[0130] The wireless communication device 10 includes a transmission circuit 31 and an amplifier circuit 100. The transmission circuit 31 outputs a high-frequency transmission signal. The amplifier circuit 100 amplifies the transmission signal output by the transmission circuit 31. The amplifier circuit 100 includes a Doherty amplifier circuit 500. The Doherty amplifier circuit 500 includes a carrier amplifier 300, an output signal line 301, a peak amplifier 400, and an output signal line 401. The carrier amplifier 300 is configured by a transistor chip (first transistor chip). The output signal line 301 transmits a first amplified signal output from the carrier amplifier 300. The peak amplifier 400 is configured by a transistor (second transistor). The output signal line 401 transmits a composite signal of the first amplified signal output from the carrier amplifier 300 and the second amplified signal output from the peak amplifier 400. The output signal line 301 includes a microstrip line 311 provided on a printed circuit board, and bonding wires 312A and 312B. The bonding wires 312A and 312B have first ends connected to the microstrip line 311 and second ends connected to a drain terminal 450 of the peak amplifier 400. The output signal line 401 includes a microstrip line 411 separated from the microstrip line 311 on the printed circuit board, and bonding wires 412A and 412B. The bonding wires 412A and 412B have first ends connected to the drain terminal 450 of the peak amplifier 400 and second ends connected to the microstrip line 411. The direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311 is the same as the direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 411A and 411B with the second ends of the bonding wires 412A and 412B in the microstrip line 411. As a result, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 becomes the drain terminal 450 of the peak amplifier 400.Therefore, there is no wiring from the drain terminal 450 of the peak amplifier 400 to the coupling point, and as a result, the impedance on the peak amplifier 400 side from the coupling point during back-off operation can be made closer to an open state without providing a delay line. Furthermore, the direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311 is aligned with the direction from the drain terminal 450 of the peak amplifier 400 toward the connection parts 411A and 411B with the second ends of the bonding wires 412A and 412B in the microstrip line 411. This eliminates the need to bend the drain terminal 450 of the peak amplifier 400, and prevents the impedance on the peak amplifier 400 side from the coupling point during back-off operation from deviating from the open state, thereby preventing the Doherty amplifier circuit 500 from becoming larger.

[0131] The wireless communication device 10 includes a transmission circuit 31 and an amplifier circuit 100. The transmission circuit 31 outputs a high-frequency transmission signal. The amplifier circuit 100 amplifies the transmission signal output by the transmission circuit 31. The amplifier circuit 100 includes a Doherty amplifier circuit 500. The Doherty amplifier circuit 500 includes a carrier amplifier 300, an output signal line 301, a peak amplifier 400, and an output signal line 401. The carrier amplifier 300 is configured by a transistor chip (first transistor chip). The output signal line 301 transmits a first amplified signal output from the carrier amplifier 300. The peak amplifier 400 is configured by a transistor (second transistor). The output signal line 401 transmits a composite signal of the first amplified signal output from the carrier amplifier 300 and the second amplified signal output from the peak amplifier 400. The output signal line 301 includes a microstrip line 311 provided on a printed circuit board, and bonding wires 312A and 312B. The bonding wires 312A and 312B have first ends connected to the microstrip line 311 and second ends connected to a drain terminal 450 of the peak amplifier 400. The output signal line 401 includes a microstrip line 411 separated from the microstrip line 311 on the printed circuit board, and bonding wires 412A and 412B. The bonding wires 412A and 412B have first ends connected to the drain terminal 450 of the peak amplifier 400 and second ends connected to the microstrip line 411. The direction from the gate terminal 440 to the drain terminal 450 of the peak amplifier 400 is the same as the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311. As a result, the connection point between the output of the carrier amplifier 300 and the output of the peak amplifier 400 becomes the drain terminal 450 of the peak amplifier 400. Therefore, there is no wiring from the drain terminal 450 of the peak amplifier 400 to the connection point, and as a result, the impedance on the side of the peak amplifier 400 from the connection point during back-off operation can be made closer to an open state without providing a delay line.Furthermore, since the direction from the gate terminal 440 of the peak amplifier 400 to the drain terminal 450 and the direction from the drain terminal 450 of the peak amplifier 400 to the connection portions 311A ​​and 311B with the first ends of the bonding wires 312A and 312B in the microstrip line 311 are aligned, there is no need to bend the drain terminal 450 of the peak amplifier 400, and it is possible to prevent the impedance on the peak amplifier 400 side from the connection point during back-off operation from deviating from the open state, thereby preventing the Doherty amplifier circuit 500 from becoming larger.

[0132] [8. Supplementary Notes] The embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is defined by the claims, not the above-described embodiments, and includes meanings equivalent to the claims and all modifications within the scope thereof. [Explanation of symbols]

[0133] 10. Wireless communication devices 21 Interface section 22 Signal processing circuit 31 Transmitting circuit 32 Receiving circuit 40 Duplexer 50 Antennas 100 Amplifier circuit (amplifier module) 200 Driver Amplifier 201 Signal Line 210 Distributor 211,212 signal lines 220,240 Input matching circuit 230 Phase Delay Circuit 300 Carrier Amplifier (First Transistor Chip) 301 Output signal line (first output signal line) 302, output signal line (third output signal line) 310 Impedance conversion circuit (first impedance conversion circuit) 311 Microstrip line (first conductor) 311A, 311B connection part 312A, 312B Bonding wire (first bonding wire) 313A, 313B, 313C, 313D Bonding wire (third bonding wire) 314A, 314B, 314C, 314D connection parts 321 Microstrip Line (Third Conductor) 321A, 321B, 321C, 321D connection parts 322A, 322B, 322C, 322D Bonding wire (third bonding wire) 340 Input terminal (gate terminal) 340A, 340B, 340C, 340D connection parts 350 Output terminal (drain terminal) 350A, 350B, 350C, 350D connection part 400 Peak Amplifier (Transistor, Second Transistor Chip) 401 Output signal line (second output signal line) 410 Impedance conversion circuit (second impedance conversion circuit) 411 Microstrip line (second conductor) 411A, 411B connection part 412A, 412B Bonding wire (second bonding wire) 430 Connection point 440 Input terminal (gate terminal) 440A, 440B, 440C, 440D connection parts 450 Output terminal (drain terminal) 450A, 450B, 450C, 450D connection part 500,500A Doherty amplifier circuit

Claims

1. An amplifier module including a Doherty amplifier circuit, The Doherty amplifier circuit a first transistor chip constituting a carrier amplifier; a first output signal line; a second transistor chip constituting a peak amplifier; a second output signal line; a first impedance conversion circuit connected to a drain terminal of the second transistor chip via the first output signal line; a third output signal line connecting the drain terminal of the first transistor chip and the first impedance conversion circuit; Including, The first output signal line is a first conductor provided on the printed circuit board; a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip; Including, The second output signal line is a second conductor spaced apart from the first conductor on the printed circuit board; a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor; Including, The third output signal line is a third conductor provided on the printed circuit board and connected to the first impedance conversion circuit; a third bonding wire having a first end connected to the drain terminal of the first transistor chip and a second end connected to the third conductor; Including, a direction from a drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire is the same as a direction from a drain terminal of the second transistor chip toward a connection portion of the second conductor with the second end of the second bonding wire, a direction from the drain terminal of the first transistor chip toward a connection portion of the third conductor with the second end of the third bonding wire is the same as or opposite to a direction from the drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire; Amplifier module.

2. a direction from the gate terminal to the drain terminal of the second transistor chip is the same as a direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire; The amplifier module according to claim 1 .

3. a direction from the gate terminal to the drain terminal of the first transistor chip is the same as a direction from the drain terminal of the first transistor chip to a connection portion of the third conductor with the second end of the third bonding wire; 3. The amplifier module according to claim 1.

4. the first transistor chip and the second transistor chip are arranged along a direction intersecting a direction from a drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire, a direction from the gate terminal to the drain terminal of the first transistor chip and a direction from the gate terminal to the drain terminal of the second transistor chip are the same direction; The amplifier module according to any one of claims 1 to 3.

5. the first transistor chip and the second transistor chip are arranged along a direction from a drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire, a direction from the gate terminal to the drain terminal of the first transistor chip is opposite to a direction from the gate terminal to the drain terminal of the second transistor chip; The amplifier module according to any one of claims 1 to 3.

6. the first conductor is disposed between the first transistor chip and the second transistor chip; The amplifier module according to claim 5 .

7. the Doherty amplifier circuit further includes a second impedance conversion circuit connected to the drain terminal of the second transistor chip via the second output signal line. The amplifier module according to any one of claims 1 to 6.

8. The first bonding wire and the second bonding wire do not cross each other. The amplifier module according to any one of claims 1 to 7.

9. The first bonding wire and the second bonding wire are parallel to each other. The amplifier module according to any one of claims 1 to 7.

10. The first bonding wire and the second bonding wire cross each other. The amplifier module according to any one of claims 1 to 7.

11. An amplifier module including a Doherty amplifier circuit, The Doherty amplifier circuit a first transistor chip constituting a carrier amplifier; a first output signal line; a second transistor chip constituting a peak amplifier; a second output signal line; a first impedance conversion circuit connected to a drain terminal of the second transistor chip via the first output signal line; a third output signal line connecting the drain terminal of the first transistor chip and the first impedance conversion circuit; Including, The first output signal line is a first conductor provided on the printed circuit board; a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip; Including, The second output signal line is a second conductor spaced apart from the first conductor on the printed circuit board; a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor; Including, The third output signal line is a third conductor provided on the printed circuit board and connected to the first impedance conversion circuit; a third bonding wire having a first end connected to the drain terminal of the first transistor chip and a second end connected to the third conductor; Including, a direction from the gate terminal to the drain terminal of the second transistor chip is the same as a direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire, a direction from the drain terminal of the first transistor chip toward a connection portion of the third conductor with the second end of the third bonding wire is the same as or opposite to a direction from the drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire; Amplifier module.

12. a transmission circuit that outputs a high-frequency transmission signal; an amplifier module that amplifies the transmission signal output by the transmission circuit; A communication device comprising: the amplifier module includes a Doherty amplifier circuit; The Doherty amplifier circuit a first transistor chip constituting a carrier amplifier; a first output signal line; a second transistor chip constituting a peak amplifier; a second output signal line; a first impedance conversion circuit connected to a drain terminal of the second transistor chip via the first output signal line; a third output signal line connecting the drain terminal of the first transistor chip and the first impedance conversion circuit; Including, The first output signal line is a first conductor provided on the printed circuit board; a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip; Including, The second output signal line is a second conductor spaced apart from the first conductor on the printed circuit board; a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor; Including, The third output signal line is a third conductor provided on the printed circuit board and connected to the first impedance conversion circuit; a third bonding wire having a first end connected to the drain terminal of the first transistor chip and a second end connected to the third conductor; Including, a direction from a drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire is the same as a direction from a drain terminal of the second transistor chip toward a connection portion of the second conductor with the second end of the second bonding wire, a direction from the drain terminal of the first transistor chip toward a connection portion of the third conductor with the second end of the third bonding wire is the same as or opposite to a direction from the drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire; Communication equipment.

13. a transmission circuit that outputs a high-frequency transmission signal; an amplifier module that amplifies the transmission signal output by the transmission circuit; A communication device comprising: the amplifier module includes a Doherty amplifier circuit; The Doherty amplifier circuit a first transistor chip constituting a carrier amplifier; a first output signal line; a second transistor chip constituting a peak amplifier; a second output signal line; a first impedance conversion circuit connected to a drain terminal of the second transistor chip via the first output signal line; a third output signal line connecting the drain terminal of the first transistor chip and the first impedance conversion circuit; Including, The first output signal line is a first conductor provided on the printed circuit board; a first bonding wire having a first end connected to the first conductor and a second end connected to a drain terminal of the second transistor chip; Including, The second output signal line is a second conductor spaced apart from the first conductor on the printed circuit board; a second bonding wire having a first end connected to the drain terminal of the second transistor chip and a second end connected to the second conductor; Including, The third output signal line is a third conductor provided on the printed circuit board and connected to the first impedance conversion circuit; a third bonding wire having a first end connected to the drain terminal of the first transistor chip and a second end connected to the third conductor; Including, a direction from the gate terminal to the drain terminal of the second transistor chip is the same as a direction from the drain terminal of the second transistor chip to a connection portion of the first conductor with the first end of the first bonding wire, a direction from the drain terminal of the first transistor chip toward a connection portion of the third conductor with the second end of the third bonding wire is the same as or opposite to a direction from the drain terminal of the second transistor chip toward a connection portion of the first conductor with the first end of the first bonding wire; Communication equipment.

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