Detection unit, method for detecting a heated state, and method for expanding an expandable tape

Abstract

To provide a detection unit for detecting a heating state of an expand tape by a far-infrared irradiation unit, a heating state detection method, and an expansion method.SOLUTION: In an expansion device 4 including a workpiece, an expansion unit 40 for expanding an expand tape of a workpiece unit having an expand tape to which the workpiece is stuck and an annular frame to which the workpiece is stuck, and a far-infrared irradiation unit 49 that irradiates the expand tape expanded by the expansion unit with far-infrared rays to heat and shrink the expand tape, a detection unit 80 for detecting a heating state of the far-infrared irradiation unit includes: a support frame 82 having an opening portion; a heat-resistant tape 84 to be fixed to a support frame so as to block at least a part of the opening portion; and a thermocouple 86 fixed to the back side of the heat-resistant tape. The thermocouple is arranged to face the far-infrared irradiation unit through the heat-resistant tape, and a temperature of the heat-resistant tape heated by the irradiation of the far-infrared irradiation unit is measured by the thermocouple.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The present invention relates to a detection unit for detecting the heating state of a far-infrared radiation unit in an expansion device equipped with the far-infrared radiation unit. [Background technology]

[0002] Conventionally, as disclosed in Patent Document 1, for example, a dividing device is known that divides a wafer supported on a frame via an expanding tape into chips starting from a modified layer formed on the wafer by expanding the expanding tape.

[0003] If slack occurs in the expanded expanding tape, adjacent chips may come into contact with each other after separation, potentially resulting in damage. Therefore, Patent Document 1 proposes that the expanding tape be partially heated with far infrared rays, thereby effectively removing slack in the tape in a cooled atmosphere while suppressing a rise in temperature inside the separation chamber. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-113350 Summary of the Invention [Problem to be solved by the invention]

[0005] In a configuration such as that described in Patent Document 1, if the expanding tape is not heated sufficiently, there is a concern that the expanding tape will not shrink sufficiently and will remain loose. On the other hand, if the expanding tape is heated excessively, there is a concern that the expanding tape will melt or be altered.

[0006] As described above, it is necessary to heat the expanding tape at an appropriate temperature, and for this purpose, it is necessary to detect the temperature of the heated expanding tape.

[0007] In view of the above problems, the present invention proposes a detection unit for detecting the heating state of an expanding tape by a far-infrared irradiation unit, a method for detecting the heating state, and a method for expanding an expanding tape. [Means for solving the problem]

[0008] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0009] According to one aspect of the present invention, there is provided an expansion device including an expansion unit that expands an expanding tape of a workpiece unit having a workpiece, an expanding tape to which the workpiece is attached, and an annular frame to which the expanding tape is attached, and a far-infrared irradiation unit that irradiates far-infrared rays onto the expanding tape expanded by the expansion unit to heat and shrink it. The detection unit detects the heating state of the far-infrared irradiation unit and includes a support frame having an opening, a heat-resistant tape fixed to the support frame so as to cover at least a part of the opening, and a thermocouple fixed to the back side of the heat-resistant tape. The thermocouple is arranged so as to face the far-infrared irradiation unit via the heat-resistant tape, and the temperature of the heat-resistant tape heated by the far-infrared irradiation of the far-infrared irradiation unit is measured by the sheet-like thermocouple.

[0010] According to another aspect of the present invention, there is provided a method for detecting a heating state caused by a far-infrared irradiation unit in an expansion device that includes an expansion unit that expands an expanding tape of a workpiece unit having a workpiece, an expanding tape to which the workpiece is attached, and an annular frame to which the expanding tape is attached, and a far-infrared irradiation unit that irradiates far-infrared rays onto the expanding tape expanded by the expansion unit, thereby heating and causing it to shrink. The method uses a detection unit that includes a heat-resistant tape and a sheet-like thermocouple fixed on the back side of the heat-resistant tape, and arranges the detection unit so that the sheet-like thermocouple faces the far-infrared irradiation unit via the heat-resistant tape of the detection unit, and irradiates far-infrared rays onto the detection unit to measure the temperature of the heat-resistant tape with the sheet-like thermocouple.

[0011] According to another aspect of the present invention, there is provided a method for expanding an expanding tape in an expanding device including an expansion unit that expands the expanding tape and a far-infrared irradiation unit that irradiates the expanding tape expanded by the expansion unit with far-infrared rays to heat and shrink the expanding tape, the method comprising the following steps: using a detection unit that includes a heat-resistant tape and a sheet-like thermocouple fixed to the back side of the heat-resistant tape, and positioning the detection unit so that the sheet-like thermocouple faces the far-infrared irradiation unit via the heat-resistant tape of the detection unit; a heating state detection step in which the far-infrared irradiation unit irradiates far-infrared rays toward the detection unit and measures the temperature of the heat-resistant tape with the sheet-like thermocouple; a setting step in which irradiation conditions for the far-infrared irradiation unit are set based on the temperature measured in the heating state detection step; an expansion step in which, after the setting step, the expanding tape of a workpiece unit is expanded; and a contraction step in which, after the expansion step, the far-infrared irradiation unit heats and contracts the expanding tape under the irradiation conditions set in the setting step.

[0012] According to one aspect of the present invention, the far-infrared irradiation unit irradiates the expanding tape with far-infrared rays while rotating in a horizontal plane relative to the workpiece unit, and the irradiation conditions set in the setting step include the heating temperature of the expanding tape and the rotation speed of the far-infrared irradiation unit. [Effects of the Invention]

[0013] The present invention has the following effects.

[0014] That is, according to one aspect of the present invention, the temperature of the heat-resistant tape heated by the far-infrared irradiation unit is measured with a thermocouple, thereby making it possible to detect the heating state of the expanding tape by the far-infrared irradiation unit. This makes it possible to prevent the expanding tape from not shrinking sufficiently and leaving slack when the expanding tape is not heated sufficiently. It also makes it possible to prevent the expanding tape from being melted or altered due to excessive heating. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a diagram showing the configuration of a splitter equipped with an extension device. [Figure 2] FIG. 10 is a diagram showing an example of a wafer unit. [Figure 3] FIG. 2 is a diagram illustrating the configuration of an expansion device. [Figure 4] (A) is a diagram showing the state of the expanding tape after it has been expanded, and (B) is a diagram showing the state in which gaps have been formed between the chips. [Figure 5] 10A and 10B are diagrams showing how a loosened region is heated by a far-infrared irradiation unit. [Figure 6] FIG. 2 is a diagram showing an example of the configuration of a detection unit. [Figure 7] FIG. 10 is a diagram for explaining the individual measurement of temperatures in areas at different distances in the radial direction. [Figure 8] FIG. 10 is a diagram showing an example of the configuration of a detection unit equipped with a quarter-sized support frame. [Figure 9] 1A is a diagram showing an example of a detection unit configured with a frame pressing plate, and FIG. 1B is a diagram showing an example of a detection unit configured with a frame mounting plate. [Figure 10] FIG. 10 is a diagram showing an example of the configuration of a detection unit on which a plate-like object of the same type as the workpiece is placed. [Figure 11] 1 is a flow chart illustrating the steps that make up the extension method. [Figure 12] FIG. 10 is a diagram illustrating a heating state detection step. DETAILED DESCRIPTION OF THE INVENTION

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an expansion device according to an aspect of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing the configuration of a splitting device 1 equipped with an extension device 4. As shown in FIG. 1, the dividing apparatus 1 is configured to include a cassette table 20, a dividing unit 3, an expansion apparatus 4, a cleaning unit 5, and a UV (ultraviolet) irradiation unit 6. The cassette table 20 and various units are provided on an apparatus table 15, and a wafer unit U is transported between the cassette table 20 and various units by first to third transport units 71 to 73.

[0017] FIG. 2 is a diagram showing a wafer 10 as an example of a workpiece. The wafer 10 is a silicon wafer or the like, which is diced along planned division lines 10s set in a grid pattern to separate it into chips 10c. Regarding the dicing process, Fig. 2 shows a wafer on which division starting points have been formed by cutting, but other dicing processes such as ablation by laser processing or SD processing that forms a modified layer inside the wafer may also be used.

[0018] An electronic circuit such as an IC or LSI (not shown) is formed on the surface of each chip 10c. A DAF 10d for die bonding is attached to the back surface of each chip 10c, making it a chip with a DAF.

[0019] The wafer 10 is disposed inside the annular frame F and is integrally supported by the annular frame F via an expandable tape T attached to the DAF 10d side, thereby constituting a wafer unit U.

[0020] Expanding tape T is made of a base material that has elasticity at room temperature and shrinks when heated to a predetermined temperature (e.g., 70°C) or higher, and has an adhesive layer formed on one side of the base material. Examples of the base material include synthetic resin sheets such as polyvinyl chloride, polypropylene, polyethylene, and polyolefin. The adhesive material that forms the adhesive layer is an ultraviolet-curing resin that hardens when exposed to ultraviolet light. In other words, expanding tape T is an ultraviolet-curing adhesive tape.

[0021] As shown in FIG. 1, the wafer units U are stored in a cassette 21 with the upper surfaces of the wafers 10 exposed. A large number of wafer units U are stored in the cassette 21, stacked vertically in a horizontal position. The cassette 21 storing a large number of wafer units U is detachably set on a cassette stand 20. The cassette stand 20 is an elevator type that can be raised and lowered, and by raising and lowering it, one wafer unit U in the cassette 21 is positioned at a predetermined discharge position.

[0022] The annular frame F of the wafer unit U positioned at the carry-out position is pulled out toward the rear in the Y direction by the first transport unit 71 and placed in a spanning state on a pair of first guide rails 75 that have an L-shaped cross section and extend in the Y direction. The first transport unit 71 grips the annular frame F with a clamp and moves in the Y direction to transport the wafer unit U onto the first guide rails 75. The first guide rails 75 move toward and away from each other in sync in the X direction, and as the wafer unit U approaches each other after it is placed on them, they engage with the edge of the annular frame F and position the wafer unit U at a predetermined transport start position.

[0023] The wafer unit U, which has been positioned at the transfer start position by the first guide rails 75, is placed on the other pair of second guide rails 76 provided on the relay stage 77 by a second transfer unit 72 having a horizontally rotating arm 72a with a plurality of negative pressure suction pads 72b attached to the tip thereof. In the second transfer unit 72, an annular frame F is held by suction on the underside of the suction pad 72b, and the arm 72a is rotated to move the wafer unit U onto the second guide rails 76. The wafer unit U is positioned in the X direction on the second guide rails 76, and is transferred to the dividing unit 3 by a third transfer unit 73 having a configuration similar to that of the first transfer unit 71.

[0024] The dividing unit 3 is disposed inside the cover 3a, and divides the diced wafer 10 into individual chips by expanding the expandable tape T.

[0025] The wafer unit U that has been subjected to the dividing process by the dividing unit 3 is pulled out onto the second guide rails 76 by the third transfer unit 73 and then transferred to the expansion device 4 by the second transfer unit 72.

[0026] The expanding device 4 contracts the slack in the expanding tape T. The wafer unit U, from which the slack in the tape has been contracted, is transported by the second transport unit 72 to the cleaning unit 5, where it is cleaned and dried.

[0027] The cleaning unit 5 is equipped with a negative pressure suction-type spinner table 51 that is rotated by a rotation drive mechanism (not shown). The expanding tape T side of the wafer unit U is suction-held on the spinner table 51, leaving the wafer 10 exposed. A plurality of clamps 52 are disposed at equal intervals around the periphery of the spinner table 51. These clamps 52 operate to grip the annular frame F by centrifugal force when the spinner table 51 rotates at a predetermined rotation speed. The cleaning unit 5 also has a spray unit (not shown) that sprays cleaning water and dry air onto the wafer 10 held on the spinner table 51. During cleaning, a cover 55 closes the space housing the spinner table 51.

[0028] In this cleaning unit 5, the spinner table 51 that adsorbs and holds the wafer unit U rotates at a predetermined cleaning speed, and cleaning water is sprayed from the spray section onto the rotating wafer 10 to rinse the wafer 10. After a predetermined rinsing time has elapsed, the supply of cleaning water is stopped, but the rotation of the spinner table 51 continues, and moisture is blown off the wafer 10 by centrifugal force, and dry air is blown onto the wafer 10 from the spray section, drying the wafer 10. After a predetermined drying time has elapsed, the rotation of the spinner table 51 and the spraying of dry air are stopped.

[0029] After the wafer 10 has been cleaned and dried, the wafer unit U is placed on the first guide rails 75 by the second transfer unit 72 and then transferred to the UV irradiation unit 6 by the first transfer unit 71.

[0030] The UV irradiation unit 6 is disposed within the cover 6a in Fig. 1 and is configured with multiple UV lamps (not shown). The wafer unit U placed on the first guide rails 75 is pushed rearward in the Y direction by the first transport unit 71 and transported into the cover 6a, where the wafer unit U is irradiated with ultraviolet light from the UV lamps, hardening the adhesive layer of the expanding tape T, which is made of an ultraviolet-curable resin. Hardening the adhesive layer makes it easier to peel the numerous separated chips 10c from the expanding tape T, allowing for smooth bonding of the chips 10c in a later process.

[0031] Once the adhesive layer of the expanding tape T has hardened by ultraviolet irradiation, the wafer unit U is gripped by the first transport unit 71 and pulled out onto the first guide rails 75, and is temporarily placed on the first guide rails 75. Next, the first transport unit 71 rises slightly and returns to the UV irradiation unit 6 side, and the wafer unit U is pushed by this first transport unit 71 and stored in the cassette 21.

[0032] Next, the configuration of the expansion device 4 shown in FIG. 3 will be described. The expansion device 4 is configured to include an expansion unit 40 that expands the expanding tape, and a far-infrared irradiation unit 49 that irradiates the expanding tape expanded by the expansion unit 40 with far-infrared rays to heat and shrink the expanding tape.

[0033] The expansion unit 40 is configured to include a frame mounting plate 42 arranged horizontally, a frame pressing plate 41 that moves in the Y-axis direction, a negative pressure suction type suction table 48, and a cylindrical push-up member 43.

[0034] The frame mounting plate 42 is square-shaped and has an opening 42a with a diameter equal to the inner diameter of the annular frame F, and is raised and lowered by the extension and contraction of a piston rod 44a of an air cylinder 44. The annular frame F of the wafer unit U, which has been transported to the expansion device 4 by the second transport unit 72 (FIG. 1), is placed on this frame mounting plate 42.

[0035] The push-up member 43 is composed of a cylindrical member disposed concentrically with the opening 42a of the frame mounting plate 42. This push-up member 43 has a diameter dimension wider than the diameter of the wafer 10, and is raised and lowered in the axial direction by an air cylinder 46. A plurality of rollers 43a are rotatably attached to the upper edge of the push-up member 43 to reduce friction with the expanding tape T when the tape is pushed up.

[0036] A disk-shaped suction table 48 is concentrically disposed inside the push-up member 43. This suction table 48 has a suction plate 48p made of a porous material, and a horizontal suction portion 48a having approximately the same diameter as the wafer 10 is formed on the upper surface of the suction plate 48p.

[0037] The suction table 48 is configured to be able to move up and down while being fixed to the tip of a piston rod 47a of an air cylinder 47. The suction plate 48p of the suction table 48 is connected to a suction source 48c via a valve 48b, and is configured to generate negative pressure in the suction portion 48a.

[0038] The frame holding plate 41 is rectangular and has approximately the same dimensions as the frame mounting plate 42, and has a circular opening 41a formed in the center that is the same size as the opening 42a of the frame mounting plate 42. The frame holding plate 41 is normally housed in the space below the relay stage 77 (FIG. 1), and is arranged so that it can advance and retreat above the frame mounting plate 42 by an air cylinder (not shown). When the frame holding plate 41 advances, as shown in FIG. 3, the frame holding plate 41 is positioned above the frame mounting plate 42 so that the centers of the openings 41a and 42a are approximately aligned.

[0039] As shown in FIG. 3, the far-infrared irradiation unit 49 is disposed above the suction table 48. The far-infrared irradiation unit 49 includes a rod 49a extending in the vertical direction and configured to be extended and retracted in the vertical direction by an air cylinder (not shown), a flange 49b fixed to the lower end of the rod 49a and driven to rotate in a horizontal plane, and four heating elements 49c fixed to the outer peripheral edge of the lower surface of the flange 49b and arranged at 90-degree intervals. The heating elements 49c are preferably of a type that irradiates far-infrared rays downward for heating. The heating elements 49c may also be annularly arranged along the outer peripheral edge of the flange 49b.

[0040] Next, the contraction process of the expanding tape T by the expansion device 4 will be described. 3, first, the annular frame F of the wafer unit U is placed on the frame mounting plate 42 from the second transfer unit 72 (FIG. 1), and the wafer 10 is positioned concentrically with the suction table 48. Next, the frame pressing plate 41 is positioned above the frame mounting plate 42, and the frame mounting plate 42 is raised, so that the annular frame F is sandwiched and fixed between the frame pressing plate 41 and the frame mounting plate 42.

[0041] 4(A), the push-up member 43 and the suction table 48 rise in synchronization, thereby pushing up the wafer 10 to a predetermined expanded position together with the expanding tape T. Note that the expanding tape T at this time may be expanded by raising only the push-up member 43.

[0042] The expanding tape T pushed up to the expanded position is subjected to a force pulling in the radial direction, and is expanded together with the wafer 10. Next, negative pressure is generated in the suction portion 48a to suction-hold the expanding tape T, and the wafer 10 in the expanded state is suction-held to the suction portion 48a via the expanding tape T. In the expanded wafer 10, the chips 10c move away from each other, and gaps are formed between the chips 10c.

[0043] 4(B), the push-up members 43 are lowered to separate from the expanding tape T, and the suction table 48 is lowered until the upper surface of the suction portion 48a holding the annular frame F is at approximately the same height as the annular frame F. As a result, a slack region Ta where the expanding tape T is slackened is formed around the wafer 10.

[0044] 5, the far-infrared irradiation unit 49 is lowered to bring the heater 49c close to the area directly above the slackened area Ta, and the heater 49c generates heat to heat the slackened area Ta. At this time, the flange 49b is rotated 90 degrees at a predetermined speed, and the heaters 49c provided at four locations heat the entire periphery of the slackened area Ta.

[0045] In this way, the slack region Ta heated by the far-infrared irradiation unit 49 contracts, eliminating the slack. Here, the heating of the slack region Ta is performed while the expanded expanding tape T remains in a state where it is sucked and held by the suction portion 48a of the suction table 48. Therefore, the portion of the expanding tape T held by the suction portion 48a, i.e., the circular portion inside the slack region Ta to which the wafer 10 is attached, does not contract. As a result, the gap between the DAF-equipped chips 10c separated by the expansion of the expanding tape T is maintained, and adjacent chips 10c do not come into contact with each other.

[0046] After a predetermined heating time has elapsed during which the slack region Ta of the expanding tape T has sufficiently contracted, the heating element 49c stops generating heat, the far-infrared irradiation unit 49 is raised and moved away from the expanding tape T, and the valve 48b is closed to stop suction. Because the slack region Ta has contracted even after suction has stopped, the expanded portion of the expanding tape T that was held by the suction portion 48a and the wafer 10 remain in the expanded state.

[0047] Then, the frame mounting plate 42 descends, and the frame pressing plate 41 retreats to the space below the relay stage 77 (FIG. 1), thereby completing the contraction process of the expanding tape T.

[0048] Next, the configuration of the detection unit 80 shown in FIG. 6 for detecting the heating state of the expanding tape will be described. As shown in FIG. 6, the detection unit 80 is composed of a support frame 82 having an opening 82a, a heat-resistant tape 84 fixed to the support frame 82 so as to cover at least a portion of the opening 82a, and a sheet-shaped thermocouple 86 fixed to the back side of the heat-resistant tape 84.

[0049] The detection unit 80 in this example is set in the expansion device 4 in the same way as the wafer unit U shown in Figure 1, and is heated by the far-infrared radiation unit 49, making it possible to detect the heating state by the far-infrared radiation unit 49 under the same conditions as when the wafer unit U is heated.

[0050] 6, the support frame 82 is configured as a circular frame having an opening 82a, and has the same configuration as the circular frame of the wafer unit U (FIG. 2). However, it does not have to be completely identical, and there are no particular limitations on the shape as long as it is sandwiched and fixed between the frame pressing plate 41 and the frame mounting plate 42 shown in FIG.

[0051] Approximately half of the opening 82a of the support frame 82 is covered with heat-resistant tape 84. The heat-resistant tape 84 is used to fix the thermocouple 86, and may be provided appropriately depending on the placement of the thermocouple 86. Alternatively, the entire opening 82a may be covered with the heat-resistant tape 84, with the thermocouple 86 provided on a portion of the back side of the heat-resistant tape 84.

[0052] The heat-resistant tape 84 is heated by the far-infrared radiation unit 49 (FIG. 3), and is made of a heat-resistant material, and also functions to protect the thermocouple 86 fixed to the back surface 84a (lower surface).

[0053] In the example of FIG. 6, the thermocouple 86 is fixed to the back surface 84a of the heat-resistant tape 84, but another piece of heat-resistant tape may be used to sandwich the thermocouple 86 between the heat-resistant tapes from both sides to fix it.

[0054] The thermocouple 86 is configured in the form of an elongated sheet having a temperature measurement junction 86a at its tip, and the multiple temperature measurement junctions 86a are arranged so as to be able to measure points at different distances from the center in the radial direction of the support frame 82. The temperature measurement junctions 86a are arranged so as to be able to measure the temperature mainly in the slack region Ta shown in FIG. 4(B).

[0055] For example, as shown in the example of Fig. 7, a configuration is used in which six thermocouples 86 of different lengths are used to measure the temperatures of areas 91a to 91f at different distances in the radial direction, respectively. Each of the areas 91a to 91f mainly corresponds to the slack region Ta shown in Fig. 4(B).

[0056] As shown in FIG. 6, the base ends 86b of the thermocouples 86 are fixed to a fixed frame 82b mounted on the support frame 82 and connected to a controller 100, which records the temperatures of the heat-resistant tape 84 detected by each thermocouple 86.

[0057] In the example shown in Fig. 6, thermocouples 86 are provided at a total of 12 locations, allowing temperature detection over a range of approximately 180 degrees. Alternatively, as shown in Fig. 7, thermocouples 86 may be provided at six locations, allowing temperature detection over a range of approximately 90 degrees. In this case, for example, as shown in the detection unit 80A shown in Fig. 8, a configuration using a support frame 82A that is one-fourth the size may be used. Note that the configuration of Fig. 8 can be suitably adopted for a configuration in which heating elements 49c (Fig. 12) provided at four locations are moved by 90 degrees to perform heating, as described above.

[0058] Furthermore, the detection unit 80 in the above example is set in the expansion device 4 in the same way as the wafer unit U shown in Figure 1 and is heated by the far-infrared irradiation unit 49. However, in addition to this, for example, in the configuration of the expansion device 4 shown in Figure 3, as shown in Figure 9(A), the opening 41a of the frame holding plate 41 may be temporarily blocked with heat-resistant tape 84m and a thermocouple 86m may be placed on the back of the heat-resistant tape 84m to detect the temperature of the heat-resistant tape 84m.

[0059] Alternatively, as shown in FIG. 9(B), a semicircular suction table 92 and rollers 94 along the outer periphery of the circular arc of the suction table 92 may be mounted on a base plate 90, and a detection unit 80B, which is half of the support frame 82 shown in FIG. 6, may be integrated with the base plate 90 to form a unit, which may then be mounted on the frame mounting plate 42 (FIG. 1). In this example, a plate-like object 85 of the same type as the workpiece is attached to heat-resistant tape, more accurately reproducing the conditions under which the wafer unit is actually heated. Alternatively, the unit may be fixed to a base to which the suction table and cylindrical push-up member are attached. In this case, the suction table 48 and cylindrical push-up member 43 shown in FIG. 3 are removed as appropriate.

[0060] 9(A) and 9(B), the horizontal positioning of the thermocouple relative to the far-infrared irradiation unit 49 (FIG. 3) can be accurately performed. When the configuration of FIG. 9(B) is used, the vertical position of the far-infrared irradiation unit 49 (FIG. 3) is adjusted so that the vertical distance of the plate-like object 85 relative to the far-infrared irradiation unit 49 is the same as the vertical distance of the wafer 10 relative to the far-infrared irradiation unit 49 when the wafer 10 is actually bonded and the expanding tape T is heated, as shown in FIG.

[0061] Furthermore, as shown in Figure 10, in the detection unit 80, a plate-like object 85 (half of the wafer 10) of the same type as the workpiece may be placed on heat-resistant tape 84 to more accurately reproduce the situation when the wafer unit is actually heated.

[0062] Next, a method for expanding an expanding tape using the above-described detection unit will be described. Fig. 11 is a flowchart showing the steps constituting this expanding method.

[0063] <Heating state detection step> As shown in FIG. 12, this is a step in which the detection unit 80 is arranged so that the thermocouple 86 faces the far-infrared irradiation unit 49 via the heat-resistant tape 84, and the far-infrared irradiation unit 49 irradiates far-infrared rays onto the detection unit 80, and the temperature of the heat-resistant tape 84 is measured by the thermocouple 86.

[0064] As a result, for example, as in the example of FIG. 7, each thermocouple 86 can individually measure the temperatures of areas 91a to 91f at different distances in the radial direction.

[0065] In the example of FIG. 7, the heater 49c moves from position A1 to positions A2 and A3 in this order, and the heat-resistant tape 84 is heated.

[0066] <Setup steps> This is a step for setting the irradiation conditions of the far-infrared irradiation unit 49 based on the temperature measured in the heating state detection step.

[0067] For example, if the measured temperature is too low and the slack region Ta of the expanding tape T shown in Fig. 4(B) is not sufficiently heated and is not expected to shrink, the output of the heater 49c of the far-infrared irradiation unit 49 is set higher to increase the heating temperature. Alternatively, the rotation speed of the flange portion 49b is set slower to increase the heating time.

[0068] Thus, the irradiation conditions include, for example, the heating temperature of the expanding tape and the rotation speed of the far-infrared irradiation unit.

[0069] <Extended Step> After the setting step is performed, the step of expanding the expandable tape T of the wafer unit U is performed as shown in FIG. 4(A).

[0070] Specifically, as described above, the expanding tape T is expanded as shown in Fig. 4(A) to form gaps between the chips 10c. After expansion, the expanding tape T slackens around the wafer 10, forming slack regions Ta, as shown in Fig. 4(B).

[0071] <Contraction step> After the expansion step is performed, as shown in FIG. 5, the expanding tape T is heated and contracted by the far-infrared irradiation unit 49 under the irradiation conditions set in the setting step.

[0072] As a result, the loosened regions Ta are eliminated, and the wafer unit U can be carried out while maintaining the gaps formed between the chips 10c.

[0073] As described above, according to the present invention, the state of heating of the expanding tape by the far-infrared irradiation unit can be detected by measuring the temperature of the heat-resistant tape heated by the far-infrared irradiation unit with a thermocouple. This prevents the expanding tape from shrinking sufficiently and leaving slack when the expanding tape is insufficiently heated. It also prevents the expanding tape from being melted or altered due to excessive heating. [Explanation of symbols]

[0074] 1 Splitting device 3-split unit 4 Expansion Unit 10 wafers 10c chip 10s division line 40 Expansion Unit 41 Frame retaining plate 42 Frame mounting plate 42a opening 43 Push-up member 43a Roller 44 Air Cylinder 44a Piston rod 46 Air Cylinder 47 Air Cylinder 47a Piston rod 48 Vacuum table 48a Adsorption part 48b valve 48c suction source 48p suction plate 49 Far-infrared irradiation unit 49a Rod 49b Flange part 49c heating element 80 detection units 82 Support Frame 82a opening 82b Fixed Frame 84 Heat-resistant tape 84a Back 85 Plate-shaped objects 86 Thermocouple 86a Temperature measuring junction 100 Controllers Front annular frame T Expanding Tape Ta slack area U Wafer Unit

Claims

1. An expansion device includes an expansion unit that expands an expanding tape of a workpiece unit having a workpiece, an expanding tape to which the workpiece is attached, and an annular frame to which the expanding tape is attached, and a far-infrared irradiation unit that irradiates far-infrared rays to the expanding tape expanded by the expansion unit to heat and shrink the expanding tape, the detection unit detecting a heating state of the far-infrared irradiation unit, a support frame having an opening; a heat-resistant tape fixed to the support frame so as to cover at least a portion of the opening; a thermocouple fixed to the back side of the heat-resistant tape; The thermocouple is disposed so as to face the far-infrared irradiation unit via the heat-resistant tape, and the temperature of the heat-resistant tape heated by the far-infrared irradiation of the far-infrared irradiation unit is measured by the thermocouple; A plurality of thermocouples are provided, and the thermocouples are configured so that the temperature measuring junctions are arranged at positions at different distances from the center in the radial direction of the opening, a detection unit that can measure the temperature of the heat-resistant tape at points that are different distances from the center in the radial direction of the opening;

2. A method for detecting a heating state by a far-infrared irradiation unit in an expansion device including an expansion unit that expands an expanding tape of a workpiece unit having a workpiece, an expanding tape to which the workpiece is attached, and an annular frame to which the expanding tape is attached, and a far-infrared irradiation unit that irradiates far-infrared rays to the expanding tape expanded by the expansion unit to heat and shrink the expanding tape, a detection unit including a support frame having an opening, a heat-resistant tape fixed to the support frame so as to cover at least a part of the opening, and a thermocouple fixed on a back side of the heat-resistant tape; The detection unit is disposed so that the thermocouple faces the far-infrared irradiation unit via the heat-resistant tape of the detection unit, and the far-infrared irradiation unit irradiates the detection unit with far-infrared rays, thereby measuring the temperature of the heat-resistant tape with the thermocouple; A plurality of thermocouples are provided, and the thermocouples are configured so that the temperature measuring junctions are arranged at positions at different distances from the center in the radial direction of the opening, A method for detecting a heated state, which makes it possible to measure the temperature of the heat-resistant tape at points at different distances from the center in the radial direction of the opening.

3. A method for expanding an expanding tape in an expanding device including an expansion unit that expands the expanding tape and a far-infrared irradiation unit that irradiates the expanding tape expanded by the expansion unit with far-infrared rays to heat and shrink the expanding tape, a heating state detecting step of using a detection unit including a support frame having an opening, a heat-resistant tape fixed to the support frame so as to cover at least a part of the opening, and a thermocouple fixed to the back side of the heat-resistant tape, disposing the detection unit so that the thermocouple faces the far-infrared irradiation unit via the heat-resistant tape of the detection unit, and irradiating the detection unit with far-infrared rays from the far-infrared irradiation unit to measure the temperature of the heat-resistant tape with the thermocouple; a setting step of setting irradiation conditions of the far-infrared irradiation unit based on the temperature measured in the heating state detection step; After the setting step is performed, an expanding step of expanding the expandable tape of the workpiece unit; and a contraction step of, after the expansion step, heating and contracting the expanding tape by the far-infrared irradiation unit under the irradiation conditions set in the setting step, A plurality of thermocouples are provided, and the thermocouples are configured so that the temperature measuring junctions are arranged at positions at different distances from the center in the radial direction of the opening, A method for expanding an expanding tape that enables the temperature of the heat-resistant tape to be measured at points at different distances from the center in the radial direction of the opening.

4. the far-infrared irradiation unit irradiates the expanding tape with far-infrared rays while rotating in a horizontal plane relative to the workpiece unit, The irradiation conditions set in the setting step include a heating temperature of the expanding tape and a rotation speed of the far-infrared irradiation unit.

4. The method for expanding an expanding tape according to claim 3.

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