Semiconductor Devices

Abstract

To suppress the generation of resin burrs that penetrate under a flexible insulating member in an encapsulating member in semiconductor devices equipped with the flexible insulating member on a heat dissipation surface.SOLUTION: A power module 10 has a conductive die bond portion 1, a semiconductor element 2 bonded to the upper surface of the die bond portion 1, an encapsulating member 4 encapsulating the die bond portion 1 and the semiconductor element 2, and a flexible insulating member 5 bonded to the lower surface of the die bond portion 1. The flexible insulating member 5 has a convex portion 5a that is disposed in the depressed portion 4a of the lower surface of the encapsulating member 4 and that protrudes from the lower surface of the encapsulating member 4.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor device, and more particularly to a semiconductor device having an insulating member made of a flexible insulating material. [Background technology]

[0002] Conventionally, insulating materials used in semiconductor devices such as power modules have been poorly flexible. Therefore, when attaching the insulating material of a power module to a cooler such as a heat sink, thermal compound is applied to one or both of the cooler and the insulating material of the power module, and gaps between the two, which occur due to unevenness or warping of the cooler or the insulating material of the power module, are filled with the thermal compound. However, the thermal resistance of the thermal compound is higher than that of the cooler, which hinders the cooling effect of the cooler.

[0003] As a technology to solve this problem, for example, Patent Document 1 below discloses a technology that applies an insulating member made of a flexible insulating material (hereinafter referred to as a "flexible insulating member") to a power module, thereby preventing gaps from forming between the cooler and the insulating member without using a thermal compound. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-23212 Summary of the Invention [Problem to be solved by the invention]

[0005] In the power module of Patent Document 1, a flexible insulating member is provided on the heat dissipation surface of the power module (i.e., the surface attached to the cooler) so that it protrudes from a sealing member made entirely of molded resin. Therefore, when the power module is molded using molded resin, the molded resin easily gets under the edge of the flexible insulating member, causing resin burrs in that area. Resin burrs on the sealing member can deteriorate the adhesion between the power module and the cooler, hindering the cooling effect, or destroy the insulating member, reducing its insulation properties.

[0006] The present disclosure has been made to solve the above-mentioned problems, and aims to prevent the occurrence of resin burrs in a sealing member that penetrates under the flexible insulating member in a semiconductor device that has a flexible insulating member on its heat dissipation surface. [Means for solving the problem]

[0007] A semiconductor device according to the present disclosure includes a conductive die bond part, a semiconductor element bonded to an upper surface of the die bond part, a sealing member that seals the die bond part and the semiconductor element, and a flexible insulating member bonded to a lower surface of the die bond part, wherein the flexible insulating member is disposed in a recessed portion in the lower surface of the sealing member, and The underside of the flexible insulating member is A protrusion protruding from the lower surface of the sealing member is provided . [Effects of the Invention]

[0008] According to the semiconductor device of the present disclosure, the flexible insulating member is disposed in a recessed portion on the underside of the sealing member and has a convex portion that protrudes from the underside of the sealing member, thereby preventing molding resin from getting under the end of the flexible insulating member when the semiconductor device is molded, and preventing resin burrs from occurring on the sealing member. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view of a power module according to a first embodiment. [Figure 2] 2 is a plan view of the lower surface side of the power module according to the first embodiment. FIG. [Figure 3] FIG. 10 is a cross-sectional view of a power module according to a second embodiment. [Figure 4] FIG. 10 is a plan view of the lower surface side of the power module according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] <First Embodiment> 1 and 2 are diagrams showing the configuration of a power module 10, which is a semiconductor device according to a first embodiment. Fig. 1 shows a cross-sectional view of the power module 10, and Fig. 2 shows a plan view of the lower surface of the power module 10. For ease of explanation, the upper surfaces of the elements shown in Fig. 1 will be called the "upper surface" and the lower surfaces will be called the "lower surface," but these do not refer to the directions in which the respective surfaces face when the power module 10 is actually used.

[0011] The power module 10 comprises a conductive frame including a die bond portion 1 and terminal portions 6, a semiconductor element 2 bonded to the upper surface of the die bond portion 1, and wiring 3 connecting the semiconductor element 2 to the terminal portions 6. The die bond portion 1, semiconductor element 2, wiring 3, and terminal portions 6 are sealed with a sealing member 4 made of a mold resin. However, a portion of the terminal portions 6 protrudes from the sealing member 4 so that it can be connected to the outside. A flexible insulating member 5 made of a flexible insulating material is bonded to the lower surface of the die bond portion 1. The hardness of the flexible insulating member 5 is assumed to be lower than that of the sealing member 4. Here, the upper surface of the sealing member 4 is defined as the "first main surface" and the lower surface as the "second main surface."

[0012] A recess 4a is provided in the second main surface of the sealing member 4, and the flexible insulating member 5 is placed in this recess 4a. In addition, a protrusion 5a that protrudes from the second main surface of the sealing member 4 is provided on the lower surface of the flexible insulating member 5. In other words, as shown in FIG. 1 , the upper part of the flexible insulating member 5 fits into the recess 4a of the sealing member 4, and the lower part of the flexible insulating member 5 protrudes from the sealing member 4. Therefore, in a cross-sectional view, the lower surface of the sealing member 4 is located between the upper and lower surfaces of the flexible insulating member 5.

[0013] When the power module 10 is actually used, the flexible insulating member 5 is attached to a cooler (not shown) such as a heat sink. Therefore, the lower surface of the flexible insulating member 5 becomes the heat dissipation surface of the power module 10.

[0014] When the power module 10 operates, the semiconductor element 2 generates heat. There are three heat dissipation paths for the heat generated in the semiconductor element 2: from the semiconductor element 2 to the terminal part 6 through the wiring 3, from the semiconductor element 2 to the air through the sealing member 4, and from the semiconductor element 2 to the cooler through the flexible insulating member 5. Of these, the path that dissipates the most heat is the path that dissipates heat to the cooler.

[0015] According to the power module 10 of the first embodiment, the flexible insulating member 5 provided on the heat dissipation surface is made of a flexible material, so that when the power module 10 is attached to a cooler, no thermal compound is used and it is possible to prevent a gap from being formed between the cooler and the flexible insulating member 5. As the thermal compound is no longer necessary, it is possible to reduce the number of assembly steps for a system incorporating the power module 10, contributing to cost reduction.

[0016] Furthermore, since the flexible insulating member 5 is disposed in the recessed portion 4a on the underside of the sealing member 4 and has a protruding portion 5a protruding from the second main surface of the sealing member 4, the molding resin is prevented from getting under the end of the flexible insulating member 5 when the power module 10 is molded using the molding resin, and resin burrs are less likely to occur on the sealing member 4. This improves the adhesion between the power module 10 and the cooler, and prevents the cooling effect of the cooler from being hindered by resin burrs. As a result, quality deterioration of the power module 10 is suppressed, which can contribute to improving the quality of a system incorporating the power module 10.

[0017] Furthermore, suppressing the generation of resin burrs suppresses damage to the flexible insulating member 5 caused by the resin burrs, and prevents a decrease in the insulating properties of the flexible insulating member 5. This contributes to improving the quality and safety of the power module 10 and the system incorporating it.

[0018] <Embodiment 2> 3 and 4 are diagrams showing the configuration of a power module 10 which is a semiconductor device according to embodiment 2. Fig. 3 shows a cross-sectional view of the power module 10, and Fig. 4 shows a plan view of the underside of the power module 10.

[0019] In the power module 10 according to the second embodiment, a plurality of protrusions 4b are provided on the underside of the sealing member 4. In this embodiment, as shown in FIG. 4, the protrusions 4b are arranged at the four corners of the sealing member 4, which is rectangular in plan view. The amount by which the protrusions 4b protrude from the underside of the sealing member 4 is smaller than the amount by which the convex portions 5a of the flexible insulating member 5 protrude from the underside of the sealing member 4. In other words, the convex portions 5a of the flexible insulating member 5 protrude downward more than the protrusions 4b of the sealing member 4.

[0020] Other configurations of the power module 10 are the same as those in the first embodiment, and therefore will not be described here.

[0021] In the second embodiment, the same effects as in the first embodiment can be obtained. Furthermore, if a flexible insulating member 5 is used on the heat dissipation surface of the power module 10, it may be difficult to maintain the horizontality of the power module 10 when attaching the power module 10 to a cooler. However, in the power module 10 of the second embodiment, the convex portion 5a of the sealing member 4, which is harder than the flexible insulating member 5, acts as a stopper to determine the position of the power module 10, making it easy to maintain the horizontality of the power module 10. This improves the ease of attachment of the power module 10.

[0022] It should be noted that the embodiments can be freely combined, and the embodiments can be modified or omitted as appropriate.

[0023] Various aspects of the present disclosure are summarized below as appendices.

[0024] (Appendix 1) a conductive die bond portion; a semiconductor element bonded to an upper surface of the die bond portion; a sealing member that seals the die bond portion and the semiconductor element; a flexible insulating member bonded to the lower surface of the die bond portion; Equipped with The flexible insulating member is disposed in a recessed portion in the lower surface of the sealing member and has a protrusion protruding from the lower surface of the sealing member. Semiconductor device.

[0025] (Appendix 2) In a cross-sectional view, the lower surface of the sealing member is located between the upper surface and the lower surface of the flexible insulating member. 2. The semiconductor device according to claim 1.

[0026] (Appendix 3) the sealing member has a plurality of protrusions on a lower surface thereof; a protrusion amount from the bottom surface of the sealing member at the protrusion portion is smaller than a protrusion amount from the bottom surface of the sealing member at the convex portion of the flexible insulating member; 10. The semiconductor device according to claim 1 or 2.

[0027] (Appendix 4) In a plan view, the sealing member is rectangular, and the protrusions are disposed at four corners of the sealing member. 4. The semiconductor device according to claim 3. [Explanation of symbols]

[0028] 1 die bond portion, 2 semiconductor element, 3 wiring, 4 sealing member, 4a recessed portion, 4b protruding portion, 5 flexible insulating member, 5a convex portion, 6 terminal portion, 10 power module.

Claims

1. a conductive die bond portion; a semiconductor element bonded to an upper surface of the die bond portion; a sealing member that seals the die bond portion and the semiconductor element; a flexible insulating member bonded to the lower surface of the die bond portion; Equipped with The flexible insulating member is disposed in a recessed portion in the lower surface of the sealing member, and the lower surface of the flexible insulating member is provided with a protrusion that protrudes from the lower surface of the sealing member. Semiconductor device.

2. In a cross-sectional view, the lower surface of the sealing member is located between the upper surface and the lower surface of the flexible insulating member. The semiconductor device according to claim 1 .

3. the sealing member has a plurality of protrusions on a lower surface thereof; a protrusion amount from the bottom surface of the sealing member at the protrusion portion is smaller than a protrusion amount from the bottom surface of the sealing member at the convex portion of the flexible insulating member; 3. The semiconductor device according to claim 1.

4. In a plan view, the sealing member is rectangular, and the protrusions are disposed at four corners of the sealing member. The semiconductor device according to claim 3 .

Images