electronic machinery

Abstract

Provided is an electronic device that enables a reduction in dust or the like that adheres to a ventilation region of a heat-generating component or a heat-dissipating component. An electronic device (10) has: a power supply unit (40); and a housing (20) that accommodates the power supply unit (40) and in which an air inlet (21h) is formed. The air inlet (21h) is located to the right of the power supply unit (40). The power supply unit (40) has, on the rightward-facing side thereof, air inlet regions (42A, 42B) that allow air to pass from the outside to the inside of a case (41) of the power supply unit (40). A dust barrier (29) stands in the vertical direction and is formed between the air inlet regions (42A and 42B) and the air inlet (21h).

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Electronic devices such as game consoles, personal computers, and server computers are equipped with circuit boards, cooling fans for cooling heat-generating components on the circuit boards, heat sinks, and the like. The housing that houses the circuit boards and the like has vents formed therein for introducing external air or discharging internal air. International Publication No. 2021 / 193879 discloses an example of such an electronic device. Summary of the Invention [Problem to be solved by the invention]

[0003] Even when electronic devices are not in use, dust and other particles may enter the housing through the ventilation holes. Depending on the position of the electronic device, this dust and other particles may adhere to components that require cooling (such as heat sinks and power supply units) located inside the housing. [Means for solving the problem]

[0004] The electronic device proposed in this disclosure includes a component and a housing that houses the component and has a ventilation opening formed therein. The ventilation opening is located in a first direction relative to the component. The component has a ventilation area on the side facing the first direction through which air passes from the outside to the inside of the component or from the inside to the outside of the component. A dustproof wall is formed between the ventilation area of ​​the component and the ventilation opening, standing in a second direction that intersects with the first direction. This electronic device can reduce dust and other particles that adhere to the ventilation area of ​​the component. [Brief explanation of the drawings]

[0005] [Figure 1A] 1 is a perspective view showing an example of an electronic device proposed in the present disclosure. [Figure 1B] 1B is a perspective view showing the electronic device shown in FIG. 1A placed in a vertical position. [Figure 2] FIG. 2 is an exploded view showing the state in which the upper panel is removed from the device body. [Figure 3] FIG. [Figure 4A] FIG. 2 is a plan view showing components arranged in a housing of the device body. [Figure 4B] FIG. 4B is an enlarged view of the area indicated by the dashed line B in FIG. 4A. [Figure 4C] FIG. 1C is a diagram showing components when the electronic device is placed in a vertical position as shown in FIG. 1B. [Figure 5] FIG. 2 is a perspective view showing the intake area of ​​the power supply unit. [Figure 6] 6 is a cross-sectional view taken along line VI-VI shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0006] The electronic device proposed in this disclosure will be described below with reference to the drawings. Figures 1A and 1B are perspective views of electronic device 10, which is an example of the electronic device proposed in this disclosure. In Figure 1A, electronic device 10 is placed in a horizontal position, and in Figure 1B, electronic device 10 is placed in a vertical position. Figure 2 shows the electronic device 10 with upper panel 12 removed from device body 11.

[0007] In the following description, X1 and X2 shown in FIG. 1A are defined as right and left directions, Y1 and Y2 are defined as front and rear directions, and Z1 and Z2 are defined as up and down directions. These directions are defined to explain the shapes and relative positional relationships of elements (components, members, and sections) of electronic device 10, and do not limit the orientation of electronic device 10 during use. Also, in FIGS. 1B and 4C, arrow V indicates the up and down directions when electronic device 10 is in a vertical orientation, as described below.

[0008] 1A and 2, electronic device 10 may have device body 11 and upper panel 12 covering upper surface 21a of device body 11. As shown in these figures, upper panel 12 may be sized to cover the entire upper surface 21a of device body 11, or may be sized to cover only a portion of upper surface 21a (for example, a portion where intake port 21h and exhaust openings 21c and 21d, which will be described later, are formed).

[0009] The upper panel 12 is detachable from the device body 11. The upper panel 12 has attachment portions (attachment protrusions) that are detachable from a plurality of attachment portions (attachment holes) 21b formed on the upper surface 21a of the device body 11. The electronic device 10 may also have a lower panel 13 that covers the lower surface of the device body 11.

[0010] [Vertical and horizontal positions of electronic devices] The electronic device 10 can be placed in a horizontal position (FIG. 1A) or a vertical position (FIG. 1B). In the horizontal position, the electronic device 10 is placed so that the bottom surface of the electronic device 10 (the bottom panel 13 in the illustrated example) faces downward. On the other hand, in the vertical position, the electronic device 10 is placed so that, for example, the left side surface of the electronic device 10 (the left side surface 22a of the device body 11 (see FIG. 3)) faces downward.

[0011] In this specification, the "vertical position" refers to a position in which the ventilation opening (intake opening 21h (see FIG. 2) described later) is located above a heat-generating component (for example, power supply unit 40 described later) or a heat-dissipating component. The intake opening 21h and power supply unit 40 will be described in detail later.

[0012] When electronic device 10 is in a horizontal position (see FIG. 1A), it may be structured so that it can be placed directly on a surface (placement surface) such as a desk or floor and stably supported, or it may be structured so that it can be stably supported on a placement surface by attaching a stand member (not shown) to electronic device 10. Similarly, when electronic device 10 is in a vertical position (see FIG. 1B), it may be structured so that it can be placed directly on a placement surface and stably supported, or it may be structured so that it can be stably supported on a placement surface by attaching a stand member (not shown) to electronic device 10.

[0013] The electronic device 10 does not necessarily have to be designed to be used in these two positions. For example, the electronic device 10 may be designed to be used only in a position (vertical position) in which the vent (air inlet 21h (see FIG. 2) described later) is located above a heat-dissipating component or a heat-generating component (power supply unit 40 described later).

[0014] [Device body] The device body 11 has a housing 20 (see FIG. 2). As shown in FIG. 4A, the housing 20 houses a cooling fan 61, a power supply unit 40, heat sinks (heat dissipation devices) 51, 52, and 53, etc. The housing 20 also houses a circuit board 31 (see FIG. 6). Various electronic components, such as a CPU (Central Processing Unit) and a GPU (Graphical Processing Unit), are mounted on the circuit board 31.

[0015] The power supply unit 40 uses current supplied from an external power source to supply drive power to various components, such as the CPU, of the device main body 11. The power supply unit 40 has a case 41 (see FIG. 5). A circuit board having a transformer, a rectifier circuit, etc. is housed inside the case 41.

[0016] The heat sinks 51, 52, and 53 are directly connected to heat-generating components such as a CPU, or are thermally connected to the heat-generating components via heat pipes. The cooling fan 61 creates an airflow that passes through the inside of the case 41 of the power supply unit 40 and through the heat sinks 51, 52, and 53.

[0017] [housing] As shown in FIG. 2, the housing 20 has an upper wall 21 that covers the upper sides of the power supply unit 40, heat sinks 51, 52, and 53, and forms the upper surface 21a of the device body 11. The housing 20 may also have a right wall 23 (see FIG. 3) that forms the right side of the device body 11, a front wall 24 (see FIG. 3) that forms the front surface 24a of the device body 11, and a lower wall 25 (see FIG. 6) that forms the lower surface of the device body 11. The housing 20 may be composed of multiple members that are combined with each other. For example, the housing 20 may have an upper housing 20A (see FIG. 6) and a lower housing 20B (see FIG. 6) that are combined with each other in the vertical direction. The housing 20 may also have an exterior panel 20C (see FIG. 2) that surrounds the front and side surfaces of the upper housing 20A and the lower housing 20B.

[0018] [Air intake and air flow path] As shown in FIG. 2, an air intake port 21h is formed in the housing 20. The air intake port 21h is formed, for example, in the top wall 21 of the housing 20. The cooling fan 61 (see FIG. 6) is disposed, for example, with its axis C1 facing up and down, and the air intake port 21h is formed above the cooling fan 61. As shown in FIG. 6, an air intake port 25h may also be formed in the bottom wall 25 of the housing 20. This air intake port 25h is formed below the cooling fan 61. Protective plates 62 and 63 may be attached to cover the air intake ports 21h and 25h and have multiple openings formed therein through which air passes.

[0019] When the cooling fan 61 is driven, external air is introduced into the housing 20 through the air intakes 21h and 25h. The air introduced into the housing 20 spreads in the radial direction of the cooling fan 61 and flows through an air flow path formed between the top wall 21 of the housing 20 and the circuit board 31 (more specifically, the upper electromagnetic shield 33, which will be described later). That is, as shown in FIG. 4A , air flows F1 to F5 are formed between the top wall 21 of the housing 20 and the circuit board 31. A flow path wall 26 that defines the flow paths of the air flows F1 to F5 may be formed within the housing 20. This flow path wall 26 may be curved so as to surround the cooling fan 61. An air flow path may also be formed between the bottom wall 25 of the housing 20 and the circuit board 31 (more specifically, the lower electromagnetic shield 34).

[0020] 6, when the upper panel 12 is attached to the upper surface 21a of the device body 11, a gap G1 may be provided between the air intake port 21h and the upper panel 12. Similarly, when the lower panel 13 is attached to the lower surface of the device body 11, a gap G2 may be provided between the air intake port 25h and the lower panel 13. These gaps G1 and G2 open, for example, toward the front and right side of the electronic device 10, and function as air flow paths from the outside of the electronic device 10 to the air intake ports 21h and 25h.

[0021] The positions of the air intakes 21h and 25h are not limited to the example shown in the figures. For example, the air intakes may be formed in the right wall 23 of the housing 20. In this case, the cooling fan 61 may be positioned so that its axis C1 faces the left-right direction. Furthermore, the number of air intakes does not have to be two. For example, the air intake 25h does not have to be formed in the bottom wall 25.

[0022] 4A, three heat sinks 51, 52, and 53 are arranged in the housing 20. The three heat sinks 51, 52, and 53 are arranged in the order of the first heat sink 51, the second heat sink 52, and the third heat sink 53 from the front side of the electronic device 10.

[0023] As shown in FIG. 4A , the airflows F1 to F3 formed inside the housing 20 are guided by the flow path wall 26 and flow from the cooling fan 61 generally toward the left (toward the power supply unit 40). The airflow F4 is an airflow downstream of the airflow F2 and is formed toward the first heat sink 51. A portion of the airflow F4 that has passed through the first heat sink 51 passes through the second heat sink 52. The airflow F5 is an airflow downstream of the airflow F3 and is formed toward the second heat sink 52. A portion of the airflow F5 that has passed through the second heat sink 52 passes through the third heat sink 53. The air that has passed through the heat sinks 51, 52, and 53 is discharged to the rear side of the electronic device 10.

[0024] The arrangement and number of heat sinks in the housing 20 are not limited to the example shown in Fig. 4A etc. The number of heat sinks may be one or two.

[0025] [Power supply unit placement] As shown in FIG. 3, air intake 21h is formed on the right side of housing 20. Meanwhile, power supply unit 40 is disposed on the left side of housing 20. Air intake 21h is located to the right of power supply unit 40. Case 41 of power supply unit 40 has air intake areas (ventilation areas) 42A and 42B (see FIG. 5) on its right side (the side facing air intake 21h). A plurality of air intake holes 40h (see FIG. 5) are formed in air intake areas 42A and 42B. That is, as shown in FIG. 5, a plurality of air intake holes 40h are formed in right wall 42 of case 41, and the areas in which these air intake holes 40h are formed are air intake areas 42A and 42B.

[0026] As shown in FIG. 4A, the right wall 42 of the case 41 has a first right wall 42a formed along the front-to-rear direction and a second right wall 42b extending diagonally forward and to the right from the first right wall 42a. Air intake holes 40h are formed in the second right wall 42b and in a front portion of the first right wall 42a. The air intake areas 42A and 42B of the right wall 42 face the flow path of the airflow F4 described above. Therefore, a portion of the airflow F4 formed by driving the cooling fan 61 is introduced into the case 41 through the air intake holes 40h.

[0027] As shown in Fig. 5, the case 41 has a plurality of exhaust holes 40g for discharging air. The plurality of exhaust holes 40g may be formed, for example, in the rear portion of the case 41. More specifically, the plurality of exhaust holes 40g may be formed in the rear portion of the top wall 43 of the case 41 and in the rear wall 44 of the case 41. The positions at which the exhaust holes 40g are formed are not limited to the example shown in the figure. For example, the exhaust holes 40g may be formed in the left wall of the case 41.

[0028] [Dustproof wall] When the electronic device 10 is in a horizontal position (see FIG. 1A), the air intake 21h is located to the right of the air intake areas 42A and 42B on the right wall 42 of the power supply unit 40. Therefore, when the electronic device 10 is in a vertical position (see FIG. 1B), the air intake 21h is located above the air intake areas 42A and 42B, as shown in FIG. 4C. By positioning the air intake 21h above the electronic device 10 when the electronic device 10 is running, it is possible to prevent dust and other particles from being sucked in through the air intake 21h. However, if the electronic device 10 is left in a vertical position for an extended period of time while not in use, dust and other particles that enter through the air intake 21h will gradually adhere to the air intake areas of the case 41.

[0029] Therefore, as shown in FIGS. 4A and 4C, the electronic device 10 has a dustproof wall 29. The dustproof wall 29 is formed between the air intake areas 42A and 42B of the power supply unit 40 and the air intake port 21h. The dustproof wall 29 stands in the vertical direction (the vertical direction (Z1-Z2 direction) when the electronic device 10 is in a horizontal position). In other words, the dustproof wall 29 stands in a direction that intersects with the direction (to the right) in which the air intake port 21h is located relative to the air intake areas 42A and 42B. With this structure, when the electronic device 10 is placed in a vertical position, the dustproof wall 29 can reduce dust and other particles that enter through the air intake port 21h and adhere to the air intake areas 42A and 42B of the power supply unit 40.

[0030] In FIG. 4A, line L1 is a straight line that passes through the front end of air intake port 21h and extends in the left-right direction, and line L2 is a straight line that passes through the rear end of air intake port 21h and extends in the left-right direction. At least a portion of dustproof wall 29 is located between lines L1 and L2. As a result, as shown in FIG. 4C, when electronic device 10 is placed in a vertical position, dustproof wall 29 is located below air intake port 21h. As a result, dustproof wall 29 can effectively reduce dust and other particles that enter through air intake port 21h and adhere to intake areas 42A and 42B of power supply unit 40.

[0031] In the example described in the present disclosure, as shown in FIG. 4A , the front end 29a of the dustproof wall 29 is located substantially on the line L1. The front end 29a of the dustproof wall 29 may extend forward beyond the line L1. Meanwhile, the rear end 29b of the dustproof wall 29 is located forward of the line L2. As will be described in detail later, a first heat sink 51 is disposed behind the dustproof wall 29. The first heat sink 51 also reduces dust and the like that adheres to the intake areas 42A and 42B of the power supply unit 40 when the electronic device 10 is placed in a vertical position. Unlike the example shown in the figure, the rear end 29b of the dustproof wall 29 may extend rearward beyond the line L2.

[0032] [Dust barrier height] As shown in FIG. 6, the dustproof wall 29 extends downward from the top wall 21 of the housing 20. Flow paths for airflows F1 to F5 (see FIG. 4A) are formed between the air intake port 21h and the air intake areas 42A and 42B formed in the case 41 of the power supply unit 40. The height H1 of the dustproof wall 29 may be greater than half the width W1 in the vertical direction of the air flow path formed in the housing 20. This effectively prevents dust and other particles that have entered through the air intake port 21h from adhering to the air intake areas 42A and 42B in the right wall 42 of the case 41.

[0033] The height H1 of the dustproof wall 29 may preferably be greater than two-thirds of the width W1 of the air flow path in the vertical direction. The height H1 of the dustproof wall 29 may more preferably be greater than three-quarters of the width W1 of the air flow path in the vertical direction. The height H1 of the dustproof wall 29 may more preferably be substantially the same as the width W1 of the air flow path in the vertical direction.

[0034] 6, the upper side of the circuit board 31 is covered with an electromagnetic shield 33. The width W1 of the air flow path in the vertical direction may be the distance between the electromagnetic shield 33 and the upper wall 21 of the housing 20 at the position where the dustproof wall 29 is formed.

[0035] A gap to accommodate tolerances may be formed between the lower end of the dustproof wall 29 and the electromagnetic shield 33. A cushioning member may be disposed between the lower end of the dustproof wall 29 and the electromagnetic shield 33 to fill this gap.

[0036] [Position and posture of dust barrier] The dustproof wall 29 is formed on the housing 20. That is, the housing 20 is made of resin, and the dustproof wall 29 is molded integrally with the housing 20. This makes it possible to prevent an increase in the number of parts. The dustproof wall 29 is formed on the top wall 21 of the housing 20. The top wall 21 is a wall that covers all of the parts accommodated in the housing 20. By forming the dustproof wall 29 on such top wall 21, it is possible to ensure a degree of freedom in the position and orientation of the dustproof wall 29.

[0037] For example, the dustproof wall 29 is preferably formed along the direction of the airflow inside the housing 20. In the example described in the present disclosure, when the cooling fan 61 is driven, airflows F1 to F5 are formed that spread in the radial direction of the cooling fan 61 and curve around the axis C1, as shown in Fig. 4A. The dustproof wall 29 is preferably formed along the direction of the airflows F1 to F5.

[0038] 4A, a tangent D1 to a circle centered on the axis C1 of the cooling fan 61 is inclined relative to the front-to-rear direction (Y1-Y2 direction) and the left-to-right direction (X1-X2 direction) of the electronic device 10, and extends rearward and leftward. Similarly to the tangent D1, the dustproof wall 29 is preferably inclined relative to the front-to-rear direction and the left-to-right direction. This orientation of the dustproof wall 29 reduces air resistance caused by the dustproof wall 29.

[0039] The dustproof wall 29 is located to the right (toward the cooling fan 61) away from the intake areas 42A and 42B of the right wall 42 of the power supply unit 40. This reduces the resistance caused by the dustproof wall 29 to the airflow sent to the power supply unit 40.

[0040] 4A, a flow path for airflow F4 is formed between the air intake areas 42A and 42B and the dust protection wall 29. A first heat sink 51 is disposed midway along the flow path for airflow F4. In other words, the dust protection wall 29 is spaced to the right from the air intake areas 42A and 42B so that airflow F4 can be supplied to the first heat sink 51.

[0041] It should be noted that the component disposed in the flow path of the airflow F4 is not limited to the heat sink 51. In other words, a heat generating device or a heat dissipation device other than a heat sink may be disposed in the flow path of the airflow F4.

[0042] 4A, the dustproof wall 29 extends forward from the position of the first heat sink 51. More specifically, the dustproof wall 29 extends diagonally forward and to the right from the position of the first heat sink 51. A distance D5 is ensured between the front end 29a of the dustproof wall 29 and the flow path wall (curved wall) 26 that defines the flow paths of the airflows F1 and F2. By ensuring this distance D5, a flow path is formed for the airflows F2 and F4 that avoid the dustproof wall 29.

[0043] 4B, the first heat sink 51 has a plurality of fins 51a arranged in the left-right direction. The fins 51a are also inclined with respect to the front-rear and left-right directions of the electronic device 10 and extend forward and to the right. The dustproof wall 29 extends in a direction along the fins 51a. This allows the airflow F4 formed along the dustproof wall 29 to pass smoothly through the first heat sink 51.

[0044] 4B, the dustproof wall 29 extends from the fin 51a1 located at the right end of the multiple fins 51a constituting the first heat sink 51 in a direction along this fin 51a1. That is, the dustproof wall 29 is disposed so that the end face of the fin 51a1 and the end face of the dustproof wall 29 face each other. The dustproof wall 29 and the fin 51a1 extend forward and to the right.

[0045] [Dust exhaust opening] As shown in FIG. 3, an exhaust opening 21d is formed in the upper wall 21 of the housing 20. The exhaust opening 21d is located downstream of the airflow F5 (see FIG. 4A) with respect to the dustproof wall 29. The airflow F5 is an airflow formed between the cooling fan 61 (intake port 21h) and the dustproof wall 29. Dust and other particles that have accumulated on the right side surface of the dustproof wall 29 (the side surface on the intake port 21h side) are moved downstream by the airflow F5. The dust and other particles can then be discharged from the exhaust opening 21d. For example, a user can use a device such as a vacuum cleaner to suck out the dust and other particles from the exhaust opening 21d.

[0046] 3, exhaust openings 21d are formed along the front surface (the surface upstream of air flow F5) of second heat sink 52 that receives air flow F5. With this arrangement of exhaust openings 21d, even if dust or the like accumulates on the front surface (leading edges of the multiple fins) of second heat sink 52 due to air flow F5, the dust or the like can be discharged through exhaust openings 21d. Each exhaust opening 21d may have an elongated shape in a direction along the front surface of second heat sink 52.

[0047] The structure for discharging dust and the like accumulated on the side surface of the dustproof wall 29 is not limited to the example described here. For example, a discharge opening may be formed along the right side surface of the dustproof wall 29.

[0048] 3, an exhaust opening 21c is formed in the top wall 21 of the housing 20. The exhaust opening 21c is located, for example, on the right side (the side of the intake port 21h) of the intake areas 42A and 42B of the right wall 42 of the power supply unit 40. Even if dust or the like accumulates in the intake areas 42A and 42B due to the airflow F4 generated by the cooling fan 61, the dust or the like can be exhausted through the exhaust opening 21c.

[0049] 3, a plurality of discharge openings 21c aligned along the intake areas 42A and 42B may be formed in the upper wall 21. Each discharge opening 21c may have an elongated shape in the direction along the intake areas 42A and 42B.

[0050] The electronic device 10 has an upper panel 12 (FIG. 1A) attached to the upper surface 21a of the device body 11. The exhaust openings 21c and 21d are covered by the upper panel 12. When the upper panel 12 is attached to the upper surface 21a, the exhaust openings 21c and 21d may be blocked. A user can remove the upper panel 12 from the device body 11 to exhaust dust and the like.

[0051] [summary] (1) The electronic device proposed in this disclosure includes a component (e.g., a power supply unit 40) and a housing that houses the component and has a ventilation opening. The ventilation opening is located in a first direction relative to the component, and the component has a ventilation area on the side facing the first direction through which air passes from the outside to the inside of the component or from the inside to the outside of the component. A dustproof wall is formed between the ventilation area of ​​the component and the ventilation opening, standing in a second direction that intersects with the first direction. This electronic device can reduce dust and other particles that adhere to the ventilation area of ​​the component.

[0052] (2) In the electronic device of (1), an air flow path is formed inside the housing between the ventilation opening and the ventilation area of ​​the component, and the housing has a wall portion that defines the air flow path, and an opening (e.g., exhaust opening 21d) located downstream of the dustproof wall in the air flow direction may be formed in the wall portion.

[0053] (3) In the electronic device of (1) or (2), an air flow path may be formed between the vent and the ventilation area of ​​the component, and the height of the dustproof wall in the second direction may be equal to or greater than half the width of the air flow path in the second direction. This effectively reduces dust and the like that adheres to the ventilation area of ​​the component.

[0054] (4) In the electronic device of (1) or (2), an air flow path is formed between the ventilation opening and the ventilation area of ​​the component, and the height of the dustproof wall in the second direction may be 2 / 3 or more of the width of the air flow path in the second direction.

[0055] (5) In the electronic device described in any one of (1) to (4), a cooling fan may be housed in the housing, and the dustproof wall may be disposed along the airflow generated by driving the cooling fan, thereby making it possible to prevent the dustproof wall from creating air resistance.

[0056] (6) In the electronic device described in any one of (1) to (5), the dustproof wall may be formed on the housing, which increases the degree of freedom in the position and orientation of the dustproof wall.

[0057] (7) In the electronic device according to any one of (1) to (6), the component may be a heat generating component or a heat dissipating component.

[0058] (8) In the electronic device according to any one of (1) to (6), an air flow path may be formed between the dustproof wall and the ventilation area of ​​the component, allowing air to pass smoothly through the ventilation flow path of the component.

[0059] (9) In the electronic device of (8), a heat generating component or a heat dissipating component may be disposed midway along the air flow path.

[0060] (10) In the electronic device described in any one of (1) to (9), the housing has an air flow path therein between the ventilation opening and the ventilation area of ​​the component, and the air flow path includes a flow path (e.g., flow paths F2, F4) that leads from the ventilation opening to the ventilation area of ​​the component while avoiding the position of the dustproof wall.

[0061] [Variations] It should be noted that the electronic device proposed in this disclosure is not limited to the electronic device 10 described above.

[0062] For example, the component that is prevented from adhering to dust and the like by dustproof wall 29 does not have to be a power supply unit. For example, in a structure in which dust and the like that enters through an air intake port adheres to a heat sink, a dustproof wall may be formed between the air intake port and the heat sink.

[0063] Furthermore, depending on the arrangement of the cooling fan and the heat-generating component (e.g., power supply unit) or heat-dissipating component (e.g., heat sink), air may flow from the heat-generating component (or heat-dissipating component) toward the cooling fan and be discharged to the outside of the electronic device. In this case, a dustproof wall may be formed between the exhaust side of the heat-generating component (or heat-dissipating component) and the exhaust port of the electronic device. The dustproof wall may then reduce dust and other particles that enter through the exhaust port and accumulate on the exhaust side of the heat-generating component (or heat-dissipating component). [Explanation of symbols]

[0064] 10: electronic device, 11: device body, 12: upper panel, 13: lower panel, 20: housing, 20A: upper housing, 20B: lower housing, 20C: exterior panel, 21: upper wall, 21a: top surface, 21c and 21d: exhaust opening, 21h: intake port, 22a: left side surface, 23: right wall, 24: front wall, 24a: front surface, 25: lower wall, 25h: intake port, 26: flow path wall, 29: dustproof wall, 29a : front end, 29b: rear end, 31: circuit board, 33 and 34: electromagnetic shield, 40: power supply unit, 40g: exhaust hole, 40h: intake hole, 41: case, 42: right wall, 42A and 42B: intake area, 42a: first right wall, 42b: second right wall, 43: upper wall, 44: rear wall, 51, 52 and 53: heat sink, 51a: fin, 51a1: fin, 61: cooling fan, 62: protective plate.

Claims

1. Parts and a housing that accommodates the components and has a vent hole formed therein; and the vent is located in a first direction relative to the component; the component has a ventilation area on the side facing the first direction for allowing air to pass from the outside to the inside of the component or from the inside to the outside of the component; A dustproof wall is formed between the ventilation area of ​​the component and the ventilation opening, the dustproof wall standing in a second direction intersecting the first direction. electronic equipment.

2. an air flow path is formed within the housing between the vent and the ventilation area of ​​the component; the housing has a wall defining the air flow path; The wall portion has an opening formed therein that is located downstream of the dustproof wall in the air flow direction.

10. The electronic device according to claim 1.

3. an air flow path is formed between the vent and the ventilation area of ​​the component; The height of the dustproof wall in the second direction is equal to or greater than half the width of the air flow path in the second direction.

10. The electronic device according to claim 1.

4. an air flow path is formed between the vent and the ventilation area of ​​the component; The height of the dustproof wall in the second direction is equal to or greater than two-thirds of the width of the air flow path in the second direction.

10. The electronic device according to claim 1.

5. The cooling fan is accommodated in the housing, and the dustproof wall is disposed along the airflow formed by the driving of the cooling fan.

10. The electronic device according to claim 1.

6. The dustproof wall is formed on the housing.

10. The electronic device according to claim 1.

7. The component is a heat-generating component or a heat-dissipating component.

10. The electronic device according to claim 1.

8. An air flow path is formed between the dustproof wall and the ventilation area of ​​the component.

10. The electronic device according to claim 1.

9. A heat-generating component or a heat-dissipating component is disposed in the air flow path.

9. The electronic device according to claim 8.

10. the housing has an air flow path therein between the vent and the ventilation area of ​​the component; The air flow path includes a flow path from the vent to the ventilation area of ​​the component while avoiding the location of the dust barrier.

10. The electronic device according to claim 1.

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