Manufacturing method for laminated electronic components

Abstract

To provide a manufacturing method of a laminated electronic component, easily solving the factor of the generation of failure.SOLUTION: A manufacturing method of a laminated electronic component 1 is a manufacturing method of the laminated electronic component 1, comprising: a print step of printing a plurality of internal electrodes 15 on a ceramic green sheet 30; a lamination step of laminating the ceramic green sheet 30 on which the internal electrode 15 is printed to form a mother block 40; and a press step of pressing the mother block 40, and comprises at least one state inspection and recording step of: a print state inspection and recording step of inspecting a print state of the internal electrode 15 printed on the ceramic green sheet 30 and recording an inspection result; a lamination state inspection and recording step of inspecting the lamination state of the ceramic green sheet 30 in the mother block 40 and recording the inspection result; and an overlapping state inspection recording step of inspecting an overlapping state of the internal electrode 15 in the mother block 40, and recording the inspection result.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a laminated electronic component. [Background technology]

[0002] Conventionally, a method for manufacturing a multilayer electronic component, such as a multilayer ceramic capacitor, includes the steps of printing internal electrodes on green sheets that serve as dielectric layers, laminating multiple sheets of these to create a mother block, and cutting the mother block into small pieces (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2019-175990 Summary of the Invention [Problem to be solved by the invention]

[0004] Defects in multilayer ceramic capacitors that occur after dicing include those caused by printing defects on the internal electrodes or misalignment during lamination or pressing. However, in the past, individual multilayer ceramic capacitors were not related to the manufacturing process, such as which part of the printing plate the internal electrodes were printed on, or what the lamination or pressing conditions were, so it was not possible to identify the cause of the defect and prevent future defects.

[0005] An object of the present invention is to provide a method for manufacturing a laminated electronic component that makes it easy to identify the cause of defects. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a laminated electronic component, comprising a printing step of printing a plurality of internal electrodes on ceramic green sheets, a lamination step of stacking the ceramic green sheets on which the internal electrodes have been printed to form a mother block, and a pressing step of pressing the mother block, and the method includes at least one state inspection and recording step of: a printing state inspection and recording step of inspecting the printing state of the internal electrodes printed on the ceramic green sheets and recording the inspection results; a lamination state inspection and recording step of inspecting the lamination state of the ceramic green sheets in the mother block and recording the inspection results; and a lamination state inspection and recording step of inspecting the overlapping state of the internal electrodes in the mother block and recording the inspection results. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a method for manufacturing a laminated electronic component that makes it easy to identify the cause of defects. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic perspective view of a multilayer ceramic capacitor 1 according to an embodiment. [Figure 2] 2 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line II-II of FIG. [Figure 3] 3 is a flowchart illustrating a method for manufacturing the multilayer ceramic capacitor 1. [Figure 4] FIG. 2 is a schematic diagram showing a state in which an internal electrode 15 is printed on a ceramic green sheet 30. [Figure 5] FIG. 1 is a block diagram of an internal electrode inspection and recording device 100. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described. While possible laminated electronic components for the manufacturing method of the present invention include a thermistor, a coil, and a laminated ceramic capacitor 1, the embodiment will be described taking the laminated ceramic capacitor 1 as an example. Fig. 1 is a schematic perspective view of the laminated ceramic capacitor 1 of the embodiment. Fig. 2 is a cross-sectional view of the laminated ceramic capacitor 1 taken along line II-II of Fig. 1.

[0010] (Multilayer ceramic capacitor 1) The multilayer ceramic capacitor 1 has a substantially rectangular parallelepiped shape and includes a laminate 2 and a pair of external electrodes 3 provided on both ends of the laminate 2. The laminate 2 includes an inner layer portion 11 in which a plurality of dielectric layers 14 and a plurality of internal electrodes 15 are laminated.

[0011] In the following description, the direction in which a pair of external electrodes 3 are provided in the multilayer ceramic capacitor 1 will be referred to as the length direction L, and the direction in which the dielectric layers 14 and internal electrodes 15 are stacked will be referred to as the stacking direction T. The direction intersecting both the length direction L and the stacking direction T will be referred to as the width direction W. Of the six outer surfaces of the laminate 2, a pair of outer surfaces facing the stacking direction T will be referred to as main surfaces A, a pair of outer surfaces facing the width direction W will be referred to as side surfaces B, and a pair of outer surfaces facing the length direction L will be referred to as end faces C.

[0012] (Laminate 2) The laminate 2 includes a laminated chip 10 and a side gap portion 20.

[0013] (Stacked chip 10) The laminated chip 10 includes an inner layer portion 11 and outer layer portions 12 disposed on both main surfaces A of the inner layer portion 11 .

[0014] (Inner layer 11) The inner layer portion 11 is formed by laminating a plurality of dielectric layers 14 and internal electrodes 15 .

[0015] (Dielectric layer 14) The dielectric layer 14 is made of a ceramic material, such as a dielectric ceramic containing BaTiO3 as a main component.

[0016] (Internal electrode 15) The internal electrodes 15 are formed of a metal material such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, or Au. The internal electrodes 15 include a plurality of first internal electrodes 15A and a plurality of second internal electrodes 15B. The first internal electrodes 15A and the second internal electrodes 15B are arranged alternately. Note that, unless it is necessary to distinguish between the first internal electrodes 15A and the second internal electrodes 15B, they will be collectively referred to as the internal electrodes 15.

[0017] The internal electrode 15 includes opposing portions 152 that face each other between the first internal electrode 15A and the second internal electrode 15B, and lead portions 151 that do not face each other between the first internal electrode 15A and the second internal electrode 15B and are drawn from the opposing portions 152 toward one end face C. Ends of the lead portions 151 are exposed at the end face C and electrically connected to the external electrode 3. The extending directions of the lead portions 151 differ between the first internal electrode 15A and the second internal electrode 15B, and the lead portions 151 are drawn alternately toward one end face C and the other end face C. An electric charge is accumulated between the opposing portions 152 made of a ceramic material of the first internal electrode 15A and the second internal electrode 15B that are adjacent in the stacking direction T, and the lead portions 151 function as a capacitor.

[0018] (Outer layer part 12) The outer layer portion 12 may be made of the same dielectric ceramic material as the dielectric layer 14 of the inner layer portion 11 .

[0019] (External electrode 3) The external electrodes 3 include an external electrode 3A provided on one end face C of the laminate 2, and an external electrode 3B provided on the other end face C of the laminate 2. When there is no need to particularly distinguish between the external electrodes 3A and 3B, they will be collectively described as the external electrode 3. The external electrode 3 covers not only the end face C, but also a portion of the main face A and the side face B on the end face C side.

[0020] (Manufacturing Method of Multilayer Ceramic Capacitor 1) 3 is a flowchart illustrating a method for manufacturing the multilayer ceramic capacitor 1. The method for manufacturing the multilayer ceramic capacitor 1 includes a ceramic green sheet preparation step S1, a printing step S2, a print state inspection and recording step S3, a lamination step S4, a lamination state inspection and recording step S5, a pressing step S6, a superposition state inspection and recording step S7, a marking step S8, a cutting step S9, a removing step S10, an external electrode formation step S11, and a firing step S12.

[0021] (Ceramic green sheet production process S1) In the ceramic green sheet preparation step S1, particles containing BaTiO3, a binder, a dispersant, an organic solvent, and the like are mixed on a PET film to produce a slurry-like ceramic paste. This ceramic paste is then formed into a sheet on a carrier film using a die coater, gravure coater, microgravure coater, or the like to produce a ceramic green sheet 30 (shown in FIG. 4). In this embodiment, the ceramic green sheet 30 is a long, rolled-up sheet, but is not limited thereto and may be in the form of a sheet.

[0022] (Printing process S2) In the printing step S2, an internal electrode paste, which is made into a slurry state by mixing conductive particles containing a metal material such as Ni, a binder, a solvent, etc., is printed by various methods on the ceramic green sheet 30 to print the internal electrodes 15. The printing of the internal electrodes 15 is performed by methods such as gravure printing, inkjet printing, and screen printing.

[0023] FIG. 4 is a schematic diagram of a ceramic green sheet 30 on which internal electrodes 15 are printed. The internal electrodes 15 are printed and aligned in multiple rows and columns on the ceramic green sheet 30. In the figure, the area surrounded by the dotted line is an area that is cut out from the ceramic green sheet 30 and serves as a unit when manufacturing a mother block 40 (shown in FIG. 5), which will be described later, and is hereinafter referred to as a unit sheet 31. A plurality of internal electrodes 15 aligned in multiple rows and columns are printed on the unit sheet 31. The internal electrodes 15 in the unit sheet 31 may be formed by printing once or multiple times.

[0024] (blurred / misaligned) The internal electrodes 15 are preferably printed in a uniform thickness at predetermined positions aligned in multiple rows and columns without smearing. However, smearing or misalignment may occur in the internal electrodes 15 due to damage to specific areas of the gravure plate or screen or the condition of the ceramic green sheet 30 during printing. In Fig. 4, the hatched portions 15a and 15b are examples of internal electrodes 15 with smearing, and the portion indicated by 15c is an example of an internal electrode 15 with misalignment.

[0025] If the internal electrodes 15 have defects such as smudges or misalignment, the final product, the multilayer ceramic capacitor 1, may be defective. Defects in the internal electrodes 15 may occur not only in the printing step S2, but also in the lamination step S4 and the pressing step S6. When a defect is detected in the final product, the multilayer ceramic capacitor 1, unless the cause of the defect, such as in which step and how the defect occurred, can be identified, it is impossible to prevent subsequent defects from occurring.

[0026] Therefore, in the embodiment, the method includes a printing state inspection and recording process S3, a stacking state inspection and recording process S5, and an overlapping state inspection and recording process S7 for inspecting the state of the internal electrode 15, and further includes a marking process S8 for marking the internal electrode 15 if it is defective, and a removal process S10 for removing defective stacking chips.

[0027] 5 is a block diagram of an internal electrode inspection and recording device 100 that performs a printing state inspection and recording step S3, a stacking state inspection and recording step S5, an overlapping state inspection and recording step S7, and a marking step S8. The internal electrode inspection and recording device 100 includes a printing state inspection unit 110, a stacking state inspection unit 120, an overlapping state inspection unit 130, a recording unit 140, a control unit 150, and a marking unit 160. The printing state inspection unit 110, the stacking state inspection unit 120, and the overlapping state inspection unit 130 include image acquisition units 111, 121, and 131 and image processing units 112, 122, and 132, respectively.

[0028] (Printing status inspection recording process S3) The print state inspection and recording step S3 is a step of inspecting the print state of the internal electrodes 15 on the ceramic green sheet 30 printed in the printing step S2 and recording the print state.

[0029] The image acquisition unit 111 of the print state inspection unit 110 used in the print state inspection and recording step S3 is an optical microscope or an electron microscope with an imaging function. The image acquisition unit 111 images the ceramic green sheet 30 on which the internal electrodes 15 are printed, for example, for each unit sheet 31, from above, as shown in Fig. 5. Note that the image acquisition is preferably taken after the internal electrodes 15 have dried.

[0030] The image processing unit 112 compares the image of the unit sheet 31 taken by the image acquisition unit 111 with a reference image, and detects the internal electrodes 15 whose difference from the reference image is equal to or greater than a certain level as, for example, defective internal electrodes 15. Alternatively, the images relating to the internal electrodes 15 in the unit sheet 31 may be averaged, and images that deviate significantly from the average may be deemed defective.

[0031] The recording unit 140 records the state of each unit sheet 31. The recorded information includes, for example, the number of the unit sheet 31 from the beginning of the ceramic green sheet 30, and if the image processing unit 112 detects a defective internal electrode 15 in the unit sheet 31, the position (row and column number) of the internal electrode 15, the cause of the defect (blurring or misalignment), etc. The recording unit 140 may record only information about the unit sheet 31 including the internal electrode 15 in which a defect has been detected, or may record information about all unit sheets 31 regardless of whether a defect exists, or may record only information about the internal electrode 15 in which a defect has been detected, rather than information about the entire unit sheet 31.

[0032] (Lamination process S4) Following the print state inspection recording step S3, the ceramic green sheet 30 on which the internal electrodes 15 are printed is cut out into unit sheets 31, and the individual unit sheets 31 are stacked. A plurality of unit sheets 31 are stacked on the base plate 50. When stacking on the base plate 50, the first and last sheets of the stacking are arranged as unit sheets 32 for outer layer portions on which no internal electrodes 15 are printed.

[0033] A plurality of unit sheets 31 having internal electrodes 15 are stacked on a base plate 50 so that the internal electrodes 15 face the same direction and are shifted by half a pitch between adjacent unit sheets 31, thereby forming a mother block 40A before being compressed. When cutting out the unit sheets 31, two different types of unit sheets 31 whose internal electrodes 15 are shifted by half a pitch from each other may be cut out, and a plurality of the two types of unit sheets 31 may be stacked to form the mother block 40A before being compressed.

[0034] (ID code) The base plate 50 is, for example, a metal plate, and is provided with a unique ID code. When the unit sheets 31 are stacked on the base plate 50 to manufacture the mother block 40, the ID code is transferred to, for example, a blank portion on the periphery of the mother block 40A. The mother block 40 may be divided into multiple pieces in the in-plane direction, and in that case, a different ID code may be assigned to each divided mother block 40.

[0035] Each ID code is linked to information such as the order of the unit sheets 31 of the ceramic green sheet 30 stacked on the base plate 50 to which the ID code is attached.

[0036] (Layer misalignment) In Figure 5, the unit sheets 31 in the mother block 40A, marked with the symbols m1, m3, and m5, are unit sheets 31 in which the internal electrode 15 becomes the first internal electrode 15A, and are stacked so that both ends are in the same position as shown in the figure.

[0037] In the figure, the unit sheets 31 marked with symbols m2, m4, and m6 are unit sheets 31 whose internal electrodes 15 become second internal electrodes 15B, and are laminated so that both ends are in the same position as shown. However, for example, suppose that both ends of the unit sheet 31 marked with diagonal lines and marked with symbol m4 in the lamination step S4 are not in the same positions as those of m2 and m6, but are shifted slightly to the right of m2 and m6 in the figure. In this case, the position of the internal electrode 15 of the unit sheet 31 marked with m4 will also be shifted from the predetermined position, which may result in a defective multilayer ceramic capacitor 1 as a final product.

[0038] (Lamination state inspection and recording process S5) Therefore, the manufacturing method of the multilayer ceramic capacitor 1 of the embodiment includes a lamination state inspection and recording step S5. The lamination state inspection and recording step S5 is a step of inspecting the lamination state of the unit sheets 31, detecting and recording any lamination misalignment of the unit sheets 31.

[0039] The image acquisition unit 121 of the stacking state inspection section 120 used in the stacking state inspection and recording step S5 is, for example, an optical microscope or an electron microscope with an imaging function. Unlike the image acquisition unit 111 in the print state inspection and recording step S3, the image acquisition unit 121 in the embodiment, although not limited thereto, images one end of the length direction and / or width direction of the stacked multiple unit sheets 31. Then, images of the misalignment state of the end of the unit sheets 31 are acquired. The image acquisition unit 121 also acquires the ID code attached to the mother block 40A in the stacking step S4.

[0040] The image processing unit 122 compares the image of one end of the stacked unit sheets 31 in the length direction and / or width direction, captured by the image acquisition unit 121, with, for example, a reference image. If the end of a unit sheet 31 is displaced from a predetermined position and the difference from the reference image is equal to or greater than a certain threshold, the unit sheet 31 is detected as defective, for example. In the illustrated embodiment, the unit sheet 31 designated by the symbol m4 is detected as defective, and therefore the mother block 40A including this unit sheet 31 is detected as defective.

[0041] The recording unit 140 records, for each ID assigned to the mother block 40A, the stacking state, such as whether or not there is a stacking defect, and if so, which layer of the unit sheet 31 the stacking defect is in. The recording unit 140 may record only the information of the mother block 40A in which the stacking defect is detected, or may record the information of all the mother blocks 40A regardless of whether or not there is a stacking defect.

[0042] (Pressing process S6) After lamination, the mother block 40A is pressed. The pressing may be a rigid press or an isostatic press. The pressing is preferably performed in a state where the mother block 40A is separated from the base plate 50, but may also be performed in a state where the mother block 40A is held to the base plate 50.

[0043] (Overlap state inspection and recording process S7) (Press misalignment) In the mother block 40B after the mother block 40A is pressed, there is a possibility that overlapping misalignment occurs in the internal electrodes 15. Therefore, the embodiment includes an overlapping state inspection and recording step S7. In the overlapping state inspection and recording step S7, the overlapping state of the internal electrodes 15 in the mother block 40B is inspected, and any overlapping misalignment is detected and recorded.

[0044] The image acquisition unit 131 of the superposition state inspection unit 130 used in the superposition state inspection and recording step S7 irradiates the mother block 40B with, for example, X-rays, and receives the transmitted X-ray image that has passed through the mother block 40B from the underside to acquire the transmitted X-ray image. Since the X-ray transmittance differs between the internal electrodes 15 and the dielectric layers 14, the superposition state of the internal electrodes 15 can be detected. Note that the image acquisition unit 131 is not limited to one that uses X-rays, and may, for example, be one that exposes part of the internal electrodes 15 on the side surface of the mother block 40 and inspects the stacking state.

[0045] The image processing unit 132 compares the image captured by the image acquisition unit 131 with, for example, a reference image. If the difference between the overlapping state of the internal electrodes 15 and the reference image is equal to or greater than a certain threshold, the image processing unit 132 detects the overlapping state as, for example, a defective overlapping state.

[0046] The recording unit 140 records the overlay state, such as whether or not there is an overlay defect, in association with the ID assigned to the mother block 40 B. The recording unit 140 may record only the information of the mother block 40 B in which an overlay defect has been detected, or may record the information of all the mother blocks 40 B regardless of whether or not there is an overlay defect.

[0047] The control unit 150 links the information recorded in the recording unit 140 in the printing state inspection recording process S3, the information recorded in the recording unit 140 in the stacking state inspection recording process S5, and the information recorded in the recording unit 140 in the overlapping state inspection recording process S7 to an ID code.

[0048] (Marking process S8) In the marking step S8, the control unit 150 reads the ID code attached to each mother block 40. This makes it possible to determine the printing state of the internal electrodes 15 of each unit sheet 31 included in the mother block 40 corresponding to the ID, the stacking state of the unit sheets 31, and the overlapping state of the internal electrodes 15. The marking section 160 judges from the printing state of the internal electrodes 15, the stacking state of the unit sheets 31, and the overlapping state of the internal electrodes 15, and marks the portion of the mother block 40 that will become the laminated chip 10 that has a high probability of becoming defective when it is made into the multilayer ceramic capacitor 1. In the embodiment, the portion indicated by diagonal lines in the upper right of Fig. 5 is the marked portion of the mother block 40.

[0049] The portion to be marked may be a portion that is determined to be defective in all of the printing state inspection and recording step S3, the stacking state inspection and recording step S5, and the overlapping state inspection and recording step S7. Alternatively, the part may be a part that is determined to be defective in any two of the printing state inspection and recording step S3, the stacking state inspection and recording step S5, and the overlapping state inspection and recording step S7. Furthermore, it may be a portion that is determined to be defective in any one of the printing state inspection and recording step S3, the stacking state inspection and recording step S5, and the overlapping state inspection and recording step S7.

[0050] In the embodiment, the marking is performed after pressing, when the mother block 40 is separated from the base plate 50, but this is not limited to this, and the marking may be performed before pressing, when the mother block 40 is held on the base plate 50.

[0051] The marking may be done by a person using a pen or the like, by a robot, by printing using an inkjet or the like, or by cutting using a processing machine such as a laser. The marking may be a spot, or if the spots are concentrated in a specific area, the entire area may be filled in.

[0052] (Small pieces process S9) The dicing step S9 is a step of cutting the mother block 40 into pieces of a predetermined size to obtain a plurality of laminated chips 10. The dicing may be performed by cutting, cutting, or breaking.

[0053] The dicing is preferably performed while the mother block 40 is held by an adhesive holding sheet. This is because it is possible to preserve the ID code information even after dicing. The adhesive holding sheet is preferably one that develops / decreases its adhesiveness depending on the temperature. In this case, for example, a spot heater, cooler, Peltier element, etc. is used to make the temperature of the marked portion of the holding sheet different from that of the other portions, thereby causing only the marked portion of the laminated chip 10 to lose its adhesiveness. This makes it possible to peel and remove only the marked laminated chip 10 from the holding sheet. Note that the marked laminated chip 10 may remain on the holding sheet.

[0054] (Removal step S10) A suction nozzle, an electromagnet, a magnet, etc. can be used to remove the marked laminated chips 10. The marked laminated chips 10 can be sorted by a robot equipped with an image sensing camera or manually.

[0055] (External electrode formation step S11) Next, a conductive paste for forming the external electrodes 3 is applied to the end faces C of the laminated chip 10 .

[0056] (Firing process S12) Then, the laminate is heated in a nitrogen atmosphere at a set firing temperature for a predetermined time, whereby the external electrodes 3 are baked onto the laminate 2, and the multilayer ceramic capacitor 1 is manufactured.

[0057] (effect) As described above, this embodiment includes a printing state inspection and recording step S3 between the printing step S2 and the stacking step S4, a stacking state inspection and recording step S5 between the stacking step S4 and the pressing step S6, and a stacking state inspection and recording step S7 between the pressing step S6 and the dicing step S9. This makes it easier to identify the cause of the defect, such as in which step the defect occurred, and enables measures to prevent the defect from occurring.

[0058] In this embodiment, the three inspection and recording processes, the print state inspection and recording process S3, the stack state inspection and recording process S5, and the overlap state inspection and recording process S7, are included, but this is not limited to this. For example, the process may include one of these three inspection and recording processes, or may include two inspection and recording processes. If one inspection and recording process is included, it is possible to identify defects that occur in at least that inspection and recording process, and it is possible to take measures to prevent defects from occurring.

[0059] Furthermore, according to the embodiment, by removing the stacked chips 10 in which defects have been detected in the removal step S10, it is possible to prevent the outflow of the defective stacked chips 10 to the subsequent steps.

[0060] Furthermore, according to the embodiment, an ID code is directly attached to the mother block 40A before pressing, so that the mother block 40B can be managed in association with the ID even in downstream processes, for example, when the mother block 40A is separated from the base plate 50.

[0061] The preferred embodiments of the present invention have been described above, but the present invention also includes the following combinations. <1> A method for manufacturing a laminated electronic component, comprising: a printing step of printing a plurality of internal electrodes on ceramic green sheets; a lamination step of laminating the ceramic green sheets on which the internal electrodes have been printed to form a mother block; and a pressing step of pressing the mother block, wherein the method further comprises at least one state inspection and recording step of: a printing state inspection and recording step of inspecting the printing state of the internal electrodes printed on the ceramic green sheets and recording the inspection results; a lamination state inspection and recording step of inspecting the lamination state of the ceramic green sheets in the mother block and recording the inspection results; and a lamination state inspection and recording step of inspecting the overlapping state of the internal electrodes in the mother block and recording the inspection results.

[0062] <2> a marking step of marking a predetermined location on the mother block based on the state information recorded in the state inspection recording step; <1> 10. A method for producing the laminated electronic component according to claim 9.

[0063] <3> a dicing step of dicing the mother block into a plurality of stacked chips; and a removing step of removing specific stacked chips based on the markings made in the marking step. <1> or <2> 10. A method for producing the laminated electronic component according to claim 9.

[0064] <4> The mother blocks are each assigned an ID code, and the inspection results recorded in the state inspection recording step are linked to the ID codes. The method includes a dicing step of dicing the mother blocks into a plurality of stacked chips, and a removal step of removing specific diced stacked chips based on the inspection results linked to the ID codes. <1> from <3> 10. A method for producing a laminated electronic component according to any one of claims 1 to 9.

[0065] <5> In the laminating step, the ceramic green sheets are laminated on a base plate to which the ID code is attached, thereby attaching the ID code to the mother block. <4> 10. A method for producing the laminated electronic component according to claim 9. [Explanation of symbols]

[0066] 1. Multilayer ceramic capacitors 3 External electrode 10 stacked chips 14 Dielectric layer 15 Internal electrode 30 Ceramic green sheet 31 Unit Sheet 40, 40A, 40B mother blocks 50 base plate 100 Internal electrode inspection and recording device 110 Printing condition inspection unit 111,121,131 Image acquisition unit 112,122,132 Image processing unit 120 Stacking condition inspection unit 130 Superposition status inspection unit 140 Recording Unit 150 control section 160 Marking section

Claims

1. a printing step of printing a plurality of internal electrodes on a ceramic green sheet; a lamination step of laminating the ceramic green sheets on which the internal electrodes are printed to form a product; a pressing step of pressing the product; a dicing step of dicing the product into a plurality of diced products; A method for manufacturing a laminated electronic component, comprising: During the printing process and the fragmenting process, a printing state inspection and recording step of inspecting the printing state of the internal electrodes printed on the ceramic green sheet and recording the inspection result; a lamination state inspection and recording step of inspecting the lamination state of the ceramic green sheets in the product and recording the inspection results; a superposition state inspection and recording step of inspecting the superposition state of the internal electrodes in the product and recording the inspection results; and further comprising at least one state inspection recording step of After the small piece process, a removing step is further provided in which specific small pieces are removed based on the state inspection step of the state inspection recording step. Manufacturing method for laminated electronic components.

2. a marking step of marking a predetermined location on the product based on the state information recorded in the state inspection recording step; The method for manufacturing the laminated electronic component according to claim 1 .

3. The removal step comprises: removing specific pulverized products based on the markings made in the marking step; The method for manufacturing the laminated electronic component according to claim 2 .

4. Each of the products is assigned an ID code, The inspection result recorded in the state inspection recording step is linked to the ID code, a dicing step of dicing the product into a plurality of diced products; The removing step removes the specific diced product based on the inspection result linked to the ID code. The method for manufacturing the laminated electronic component according to claim 1 .

5. In the laminating step, the ceramic green sheets are laminated on a base plate to which the ID code is attached, thereby attaching the ID code to the product. The method for producing the laminated electronic component according to claim 4 .

Images