Etching solution

Abstract

To provide an etchant capable of suppressing precipitation and adhesion of silica generated during an etching process to a silicon oxide film.SOLUTION: An etchant for removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film, includes a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to an etching solution for silicon nitride films, an etching method using the same, and a method for manufacturing a semiconductor substrate. [Background technology]

[0002] In the manufacturing process of a semiconductor device, a process is performed in which a silicon nitride film (hereinafter also referred to as "SiN film") and a silicon oxide film (hereinafter also referred to as "SiO2 film") are selectively etched and removed from a substrate having the SiN film. Conventionally, a method of etching a SiN film using phosphoric acid at a high temperature of 150°C or higher is known.

[0003] In recent years, the semiconductor field has seen a trend toward higher integration, which has led to demands for more complex and finer wiring, and methods have been proposed for increasing the ratio of the etching rate of a SiN film to that of a SiO 2 film (for example, Patent Documents 1 to 3).

[0004] Patent Document 1 proposes an etching composition containing a first inorganic acid, at least one silane inorganic acid salt produced by reacting a second inorganic acid with a silane compound, and a solvent. Patent Document 2 proposes an etching composition containing an inorganic acid, a siloxane compound, an ammonium-based compound, and a solvent. Patent Document 3 proposes an etching solution containing an organic phosphonic acid compound, phosphoric acid, and water.

[0005] Furthermore, as a method for selectively removing SiN films from SiO2 films and SiN films, for example, Patent Document 4 proposes a polishing composition containing ceria-coated inorganic oxide particles, a silicone-containing compound having at least one group selected from ethyleneoxy groups (EO) and propyleneoxy groups (PO) and a substituted ethylenediamine group, nonionic organic molecules having at least two hydroxyl groups, and a solvent. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-29717 [Patent Document 2] Japanese Patent Application Publication No. 2018-85513 [Patent Document 3] Japanese Patent Publication No. 2020-96162 [Patent Document 4] International Publication No. 2021 / 242755 Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, the semiconductor industry has witnessed a trend toward higher integration, leading to increasingly complex and miniaturized wiring, necessitating more efficient removal of silicon nitride films. In particular, in the manufacturing process of three-dimensional semiconductor devices such as three-dimensional NAND flash memories, further improvements in the etching rate ratio of SiN films to SiO films are required from the standpoints of productivity and yield. Furthermore, conventional etching methods using phosphoric acid at temperatures above 150°C involve the decomposition of a portion of the SiN film into silicic acid (Si(OH)4) and ammonium phosphate ((NH4)3PO4), which then undergoes a dehydration reaction to produce silica (SiO2). This silica then precipitates and adheres to the SiO2 film. In particular, there is a need for an etching solution that can prevent the deposition and adhesion of silica on the SiO2 film, even when the concentration of silica generated during the etching process is high (e.g., 200 ppm).

[0008] Therefore, the present disclosure provides an etching solution that can suppress the deposition and adhesion of silica generated during an etching process onto a silicon oxide film, an etching method using the same, and a method for manufacturing a semiconductor substrate. [Means for solving the problem]

[0009] In one aspect, the present disclosure relates to an etching solution for use in a process of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film, the etching solution comprising a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water.

[0010] In one aspect, the present disclosure relates to an etching method including a step of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film thereon using the etching solution of the present disclosure.

[0011] In one aspect, the present disclosure relates to a method for manufacturing a semiconductor substrate, the method comprising the step of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film thereon using the etching solution of the present disclosure, the substrate being a substrate for use in semiconductors. [Effects of the Invention]

[0012] According to one aspect of the present disclosure, an etching solution can be provided that can suppress deposition and adhesion of silica generated during an etching process onto a silicon oxide film. DETAILED DESCRIPTION OF THE INVENTION

[0013] In one or more embodiments, the present disclosure relates to an etching solution for use in a process of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film, the etching solution containing a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water (hereinafter also referred to as the "etching solution of the present disclosure"). The etching solution of the present disclosure can suppress deposition and adhesion of silica generated during the etching process to the silicon oxide film.

[0014] Although the details of the mechanism by which the effects of the present disclosure are manifested are not clear, it is presumed as follows. In the present disclosure, a siloxane compound modified with a compound having an alkyleneoxy group, for example, a siloxane compound represented by formula (II), is adsorbed onto the surface of Si(OH)4, silica, or SiO2 film generated during the etching process. When adsorbed onto the SiO2 film surface, it acts as a protective film to suppress the deposition and adhesion of silica, and when adsorbed onto silica, it is thought to suppress the adhesion of silica due to repulsion with the siloxane compound adsorbed onto the SiO2 film surface. However, the present disclosure need not be construed as being limited to these mechanisms.

[0015] In one or more embodiments, the etching solution of the present disclosure can be prepared by blending a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, water, and, as necessary, optional components. That is, in one or more embodiments, the etching solution of the present disclosure is prepared by blending a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water. In the present disclosure, the term "comprises" means that not only the siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water, but also optional components can be blended as needed. Furthermore, in the present disclosure, the blending amount of each component in the etching solution can be interpreted as the content in the etching solution.

[0016] [Siloxane compounds modified with compounds having alkyleneoxy groups] In one or more embodiments, the etching solution of the present disclosure contains a siloxane compound modified with a compound having an alkyleneoxy group. In one or more embodiments, the etching solution of the present disclosure contains a siloxane compound modified with a compound having an alkyleneoxy group. The siloxane compound modified with a compound having an alkyleneoxy group may be used alone or in combination of two or more. Examples of the alkyleneoxy group include at least one selected from an ethyleneoxy group (EO) and a propyleneoxy group (PO). EO is preferred from the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film.

[0017] From the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film, the siloxane compound modified with a compound having an alkyleneoxy group in the present disclosure is preferably a siloxane compound having a structure represented by the following formula (I), and more preferably a siloxane compound represented by the following formula (II).

[0018] [ka] In the formula (I), R is an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an anionic group. t is 1 to 50, and r is 1 to 30.

[0019] [ka] In the formula (II), R is an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an anionic group. t / (s+t)×100 is 4 or more, and r is 1 to 30.

[0020] In the formula (I) and formula (II), examples of the anionic group include a phosphonic acid group, a sulfate group, a carboxylic acid group, and a phosphate group (—O—PO—(OH) 2 ). From the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film, R in the formulas (I) and (II) is preferably an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an anionic group, more preferably a methyl group, a methoxy group, or a phosphate group, and even more preferably a phosphate group. In the formula (II), t / (s+t)×100 is, from the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film, 4 or more, preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, even more preferably 20 or more, even more preferably 30 or more, even more preferably 40 or more, and is preferably 100 or less, more preferably 80 or less, even more preferably 70 or less, and even more preferably 60 or less. From the same viewpoint, t / (s+t)×100 is preferably 4 or more and 100 or less, more preferably 7 or more and 100 or less. In the formulas (I) and (II), t is preferably 1 or more and 50 or less, more preferably 1 or more and 30 or less, from the same viewpoint. In the formulas (I) and (II), r is 1 or more and 30 or less, and from the same viewpoint, r is preferably 1 or more and 25 or less, and more preferably 3 or more and 20 or less.

[0021] From the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film, the HLB of the siloxane compound modified with the compound having an alkyleneoxy group is preferably 4 or more, more preferably 5 or more, and even more preferably 10 or more. Here, the HLB value is defined as "7 + sum of the number of hydrophilic group groups - sum of the number of lipophilic group groups," using the number of groups determined by the functional group as described in Davis, JT; Proc. Intern. Congr. Surface Activity, 2nd, London, 1, 426 (1957).

[0022] Examples of the siloxane compound modified with a compound having an alkyleneoxy group include at least one selected from PEG-7 dimethicone phosphate (HLB: 14.6), PEG-3 dimethicone (HLB: 4.5), PEG-10 dimethicone (HLB: 4.5 or 14), and trisiloxane ethoxylate (HLB: 5.4).

[0023] The amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.03% by mass or more, more preferably 0.04% by mass or more, and even more preferably 0.05% by mass or more, from the viewpoint of suppressing deposition and adhesion of silica to the SiO2 film. From the same viewpoint, the amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.03% by mass or more and 0.2% by mass or less, more preferably 0.04% by mass or more and 0.15% by mass or less, and even more preferably 0.05% by mass or less. From the same viewpoint, the amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.03% by mass or more and 0.2% by mass or less, more preferably 0.04% by mass or more and 0.15% by mass or less, and even more preferably 0.05% by mass or more and 0.1% by mass or less. When two or more types of siloxane compounds modified with a compound having an alkyleneoxy group are used in combination, the amount of the siloxane compound modified with a compound having an alkyleneoxy group refers to the total amount of the siloxane compounds. The amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, and even more preferably 0.03% by mass or more, from the viewpoint of improving the ratio of the etching rate of a silicon nitride film to that of a silicon oxide film (SiN / SiO selectivity ratio). From the same viewpoint, the amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.01% by mass or more and 0.2% by mass or less, more preferably 0.02% by mass or more and 0.1% by mass or less, more preferably 0.03% by mass or more and 0.08% by mass or less, and even more preferably 0.05% by mass or less. From the same viewpoint, the amount of the siloxane compound modified with a compound having an alkyleneoxy group in the etching solution of the present disclosure is preferably 0.01% by mass or more and 0.2% by mass or less, more preferably 0.02% by mass or more and 0.1% by mass or less, more preferably 0.03% by mass or more and 0.08% by mass or less, and even more preferably 0.03% by mass or more and 0.05% by mass or less.

[0024] [phosphoric acid] The amount of phosphoric acid in the etching solution of the present disclosure is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more, from the viewpoint of improving the ratio of the etching rate of a silicon nitride film to that of a silicon oxide film (hereinafter also referred to as the "SiN / SiO2 selectivity ratio"), and from the same viewpoint, it is preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less. From the same viewpoint, the amount of phosphoric acid in the etching solution of the present disclosure is preferably 50% by mass or more and 95% by mass or less, more preferably 70% by mass or more and 90% by mass or less, and even more preferably 80% by mass or more and 85% by mass or less.

[0025] [water] Examples of water contained in the etching solution of the present disclosure include distilled water, ion-exchanged water, pure water, ultrapure water, etc. The amount of water in the etching solution of the present disclosure is preferably 2% by mass or more, more preferably 5% by mass or more, and even more preferably 7% by mass or more, and is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less.

[0026] [High temperature stabilizer] In one or more embodiments, the etching solution of the present disclosure may further contain or be blended with a high-temperature stabilizer to prevent clogging of the filter during circulating use while maintaining the SiN / SiO selectivity ratio. Examples of the high-temperature stabilizer include at least one selected from sulfonic acid compounds, maleic acid, and oxalic acid. Examples of sulfonic acid compounds include paratoluenesulfonic acid and benzenesulfonic acid.

[0027] [Organophosphonic acid compounds] In one or more embodiments, the etching solution of the present disclosure may further contain or be blended with an organic phosphonic acid compound from the viewpoint of improving the SiN / SiO selectivity ratio and / or further suppressing deposition and adhesion of silica to the SiO film. Examples of the organic phosphonic acid compound from the viewpoint of improving the SiN / SiO selectivity ratio and suppressing deposition and adhesion of silica to the SiO film include phosphoric acid polymers such as polyvinyl phosphonic acid (PVPA), alkyl phosphonic acids, alkenyl phosphonic acids, and alkyl ether phosphonic acids.

[0028] [Nonionic surfactants] In one or more embodiments, the etching solution of the present disclosure may further contain or be formulated with a nonionic surfactant to further suppress deposition and adhesion of silica to the SiO film. Examples of the nonionic surfactant include polyoxyalkylene alkyl ethers, such as at least one selected from polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, and polyoxyethylene polyoxypropylene lauryl myristyl ether, to further suppress deposition and adhesion of silica to the SiO film.

[0029] [Other ingredients] The etching solution of the present disclosure may further contain or be blended with other components, as long as the effects of the present disclosure are not impaired. Examples of other components include acids other than phosphoric acid, chelating agents, surfactants other than the nonionic surfactants described above, solubilizers, preservatives, rust inhibitors, disinfectants, antibacterial agents, and antioxidants.

[0030] [Method of manufacturing etching solution] In one aspect, the present disclosure relates to a method for producing an etching solution (hereinafter also referred to as the "etching solution production method of the present disclosure"), which includes a step (hereinafter also referred to as the "compounding step") of blending a siloxane compound modified with the compound having an alkyleneoxy group, phosphoric acid, water, and, as needed, the optional components described above. In the present disclosure, the term "blending" includes simultaneously or sequentially mixing the siloxane compound modified with the compound having an alkyleneoxy group, phosphoric acid, water, and, if necessary, the optional components described above. The order of mixing is not particularly limited. The blending can be carried out using a mixer such as a homomixer, a homogenizer, an ultrasonic disperser, or a wet ball mill.

[0031] From the viewpoint of improving the SiN / SiO2 selectivity ratio, the pH of the etching solution of the present disclosure is preferably 0.1 or more, more preferably 0.2 or more, even more preferably 0.3 or more, and is preferably 2 or less, more preferably 1.5 or less, and even more preferably 1 or less. From the same viewpoint, the pH of the etching solution of the present disclosure is preferably 0.1 or more and 2 or less, more preferably 0.2 or more and 1.5 or less, and even more preferably 0.3 or more and 1 or less. In the present disclosure, the pH of the etching solution is the value at 25°C of the etching solution during use, and can be measured using a pH meter, specifically, by the method described in the Examples.

[0032] In one or more embodiments, the etching solution of the present disclosure is intended to be used for etching at an etching temperature of 110°C or higher and 250°C or lower.

[0033] The etching solution of the present disclosure may be stored and supplied in a concentrated state as long as its stability is not impaired. This is preferable because it reduces production and transportation costs. The concentrated solution can then be used in the etching process after being diluted appropriately with water, an aqueous phosphoric acid solution, or the like, as needed. The dilution ratio is preferably 5 to 100 times.

[0034] [kit] In one aspect, the present disclosure relates to a kit for producing the etching solution of the present disclosure (hereinafter also referred to as the "kit of the present disclosure"). An example of the kit of the present disclosure is a kit (two-component etching solution) that contains a solution (first liquid) containing a siloxane compound modified with a compound having an alkyleneoxy group and a solution (second liquid) containing phosphoric acid in a mutually immiscible state, and that is mixed at the time of use. After the first liquid and the second liquid are mixed, they may be diluted with water or an aqueous phosphoric acid solution as needed. The first liquid or the second liquid may contain all or a part of the water used to prepare the etching solution. The phosphoric acid contained in the second liquid may be all or a part of the phosphoric acid used to prepare the etching solution. The first liquid and the second liquid may each contain the optional components described above as needed. According to the kit of the present disclosure, an etching solution can be obtained that can suppress the deposition and adhesion of silica generated during the etching process to the SiO2 film.

[0035] [Substrate to be processed] In one or more embodiments, the substrate to be etched using the etching solution of the present disclosure is a substrate having a silicon nitride film and a silicon oxide film. In one or more embodiments, the substrate having a silicon nitride film and a silicon oxide film may be a substrate having a three-dimensional structure in which multiple silicon nitride films and multiple silicon oxide films are alternately stacked. Examples of the substrate include substrates used in semiconductors and substrates used in flat panel displays. Examples of the silicon nitride film include nitride films formed by low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), etc. Examples of the silicon oxide film include oxide films formed by thermal oxidation, LPCVD, PECVD, ALD, etc. In one or more embodiments, the etching solution of the present disclosure can be suitably used in the manufacture of three-dimensional semiconductor devices such as three-dimensional NAND flash memories, etc. For example, in one or more embodiments, the etching solution of the present disclosure can be used to etch a substrate having a three-dimensional structure in which a plurality of silicon nitride films and a plurality of silicon oxide films are alternately stacked.

[0036] [Etching method] In one aspect, the present disclosure relates to an etching method (hereinafter also referred to as the "etching method of the present disclosure") that includes a step of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film using an etching solution of the present disclosure (hereinafter also referred to as the "etching step"). By using the etching method of the present disclosure, it is possible to suppress deposition and adhesion of silica generated during the etching process to the SiO2 film, thereby achieving the effect of improving the productivity of semiconductor substrates with improved quality. The etching method and conditions in the etching process can be the same as those in the etching process in the semiconductor substrate manufacturing method of the present disclosure, which will be described later.

[0037] [Method of manufacturing semiconductor substrate] In one aspect, the present disclosure relates to a method for manufacturing a semiconductor substrate (hereinafter also referred to as the "semiconductor substrate manufacturing method of the present disclosure"), which includes a step of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film using an etching solution of the present disclosure (etching step), wherein the substrate is a substrate for use in semiconductors. According to the semiconductor substrate manufacturing method of the present disclosure, it is possible to suppress the deposition and adhesion of silica generated during the etching process to the SiO2 film, thereby achieving the effect of efficiently manufacturing semiconductor substrates with improved quality.

[0038] In the etching step, examples of the etching method include immersion etching and single wafer etching.

[0039] In the etching step, from the viewpoint of improving the SiN / SiO2 selectivity ratio, the etching temperature of the etching solution is preferably 110° C. or higher, more preferably 120° C. or higher, even more preferably 140° C. or higher, still more preferably 150° C. or higher, and preferably 250° C. or lower, more preferably 230° C. or lower, still more preferably 200° C. or lower, and still more preferably 180° C. or lower. From the same viewpoint, the etching temperature of the etching solution is preferably 110° C. or higher and 250° C. or lower, more preferably 120° C. or higher and 230° C. or lower, still more preferably 140° C. or higher and 200° C. or lower, and still more preferably 150° C. or higher and 180° C.

[0040] In the etching step, the etching time can be set, for example, preferably 30 minutes or more, more preferably 60 minutes or more, and preferably 270 minutes or less, more preferably 180 minutes or less.

[0041] In the etching step, the etching rate of the silicon nitride film is preferably 40 Å / min or more, more preferably 50 Å / min or more, and even more preferably 60 Å / min or more, from the viewpoint of improving productivity.

[0042] In the etching step, the etching rate of the silicon oxide film is preferably 1 Å / min or less, more preferably 0.5 Å / min or less, and even more preferably 0.3 Å / min or less, from the viewpoint of improving productivity.

[0043] In the etching step, the SiN / SiO2 selectivity ratio is preferably 150 or more, more preferably 200 or more, and even more preferably 300 or more, from the viewpoint of improving productivity. [Example]

[0044] The present disclosure will be specifically described below using examples, but the present disclosure is not limited to these examples in any way.

[0045] 1. Preparation of Etching Solution (Examples 1 to 7 and Comparative Examples 1 to 4) The siloxane compound or additive represented by formula (II) shown in Table 1, an aqueous phosphoric acid solution, and water, if necessary, were mixed to obtain etching solutions (pH 0.45) for Examples 1 to 7 and Comparative Examples 1 to 4. The amounts (mass %, active content) of the siloxane compound or additive, phosphoric acid, and water in each etching solution are shown in Table 1.

[0046] The following components were used to prepare the etching solution. (Siloxane compound represented by formula (II)) PEG-7 Dimethicone Phosphate [Phoenix Chemical Company, "PS-100," HLB: 14.6] PEG-3 dimethicone [Shin-Etsu Chemical Co., Ltd.'s "KF-6015", HLB: 4.5] PEG-10 Dimethicone [Shin-Etsu Chemical Co., Ltd. "KF-6017", HLB: 4.5] PEG-10 Dimethicone [Shin-Etsu Chemical Co., Ltd.'s "KF-6043", HLB: 14] Trisiloxane ethoxylate ["SILWET L-77" manufactured by Biomedical Sciences, Inc., HLB: 5.4] (additives) PVPA (Polyvinylphosphonic acid) [Maruzen Petrochemical Co., Ltd.] 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine [Fujifilm Wako Pure Chemical Industries, Ltd.] Dimethyldimethoxysilane (Tokyo Chemical Industry Co., Ltd.) (phosphoric acid) Phosphoric acid aqueous solution [phosphoric acid concentration 85%, manufactured by Rinkagaku Kogyo Co., Ltd.]

[0047] 2.Measuring methods for each parameter [pH of etching solution] The pH value of the etching solution at 25° C. was measured using a pH meter (manufactured by DKK-Toa Corporation), and was the value measured one minute after the electrode of the pH meter was immersed in the etching solution.

[0048] [Method for calculating r, s, and t of the siloxane compound represented by formula (II)] The denaturation rate and the number of moles of EO added, r, were calculated using an H-NMR (nuclear magnetic resonance apparatus), the average molecular weight was measured by size exclusion chromatography (SEC), and s and t were calculated from these values. <Conditions for H-NMR> Apparatus: JNM-ESC400 (manufactured by JEOL Ltd.) Number of integrations: 8 times Relaxation waiting time: 30 s Pulse angle: 45° <Conditions for SEC> Column: K-806L + K-806L (manufactured by Showa Denko KK) Eluent: 1 mmol / L formin DM20 / CHCl3 Flow rate: 1.0 mL / min Column temperature: 40°C Detector: RI ​​​​​​​​​​​​​​The etching rate of the silicon nitride film, the etching rate of the silicon oxide film, and the selectivity ratio were calculated using the following formulas. The calculation results are shown in Table 1. The effect of inhibiting silica deposition and adhesion to the silicon oxide film can also be evaluated from the etching rate of the silicon oxide film. If the etching rate of the silicon oxide film is negative, it can be determined that silica is deposited and adheres to the silicon oxide film. The closer this value is to 0 Å / min, the greater the effect of inhibiting silica deposition and adhesion to the silicon oxide film. Silicon nitride film (SiN film) etching rate (Å / min) = silicon nitride film etching amount (Å) / 90 (min) Silicon oxide film (SiO2 film) etching rate (Å / min) = silicon oxide film etching amount (Å) / 90 (min) Selectivity ratio = silicon nitride film etching rate / silicon oxide film etching rate

[0050] [Table 1]

[0051] As shown in Table 1, the etching solutions of Examples 1 to 7 containing the siloxane compound represented by formula (II) suppressed the deposition and adhesion of silica to the SiO2 film, and further improved the SiN / SiO2 selectivity ratio, compared to Comparative Examples 1 to 4 which did not contain the siloxane compound represented by formula (II). [Industrial Applicability]

[0052] The etching solution of the present disclosure is useful in a method for manufacturing semiconductor substrates for high density or high integration.

Claims

1. An etching solution for removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film, The composition contains a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water, The content of the phosphoric acid is 50% by mass or more, and The etching solution has a content of the siloxane compound of 0.01% by mass or more and 0.2% by mass or less.

2. The etching solution according to claim 1 , wherein the etching solution is a mixture of a siloxane compound modified with a compound having an alkyleneoxy group, phosphoric acid, and water.

3. 2. The etching solution according to claim 1, wherein the siloxane compound modified with a compound having an alkyleneoxy group is a siloxane compound having a structure represented by the following formula (I): 【Chemistry 1】 In the formula (I), R represents an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, or an anionic group. t represents from 1 to 50, and r represents from 1 to 30.

4. 2. The etching solution according to claim 1, wherein the siloxane compound modified with a compound having an alkyleneoxy group is a siloxane compound represented by the following formula (II): 【Chemistry 2】 In the formula (II), R represents an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, or an anionic group. t / (s+t)×100 is 4 or more, and r is 1 to 30.

5. The etching solution according to claim 3 or 4, wherein R in the formula (I) and the formula (II) is a methyl group, a methoxy group, or a phosphate group.

6. The etching solution according to claim 3 or 4, wherein R in the formula (I) and the formula (II) is a phosphate group.

7. The etching solution according to claim 1 or 2, wherein the pH of the etching solution is 2 or less.

8. The etching solution according to claim 1 or 2, which is used for etching at an etching temperature of 110°C or higher and 250°C or lower.

9. An etching solution described in claim 1 or 2, wherein the HLB of the siloxane compound modified with the compound having an alkyleneoxy group is 10 or more.

10. 3. An etching method comprising the step of removing a silicon nitride film from a substrate having a silicon nitride film and a silicon oxide film thereon, using the etching solution according to claim 1.

11. A method for manufacturing a silicon nitride film by etching a silicon oxide film on a substrate, the method comprising the steps of: The method for manufacturing a semiconductor substrate, wherein the substrate is a substrate for use in a semiconductor.

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