Imprinting device

Abstract

To provide an imprint device which can stably form a pattern of an imprint material according to a distortion in a shot area.SOLUTION: An imprint device according to the present invention comprises a control unit which causes a supply unit to supply an imprint material onto at least a first area in a prescribed shot area of a substrate, causes an energy supply unit to supply energy to the imprint material supplied onto the first area such that the polymerization degree of the imprint material supplied onto the first area is increased, causes a movement unit to move at least one of a mold and the substrate such that a pattern area formed on the mold is brought into contact with the imprint material on the substrate, and causes the energy supply unit to supply the energy to the imprint material supplied onto the prescribed shot area such that the imprint material supplied onto the prescribed shot area is solidified after bringing the pattern area into contact with the imprint material on the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an imprint apparatus. [Background technology]

[0002] Conventionally, it has been known that when an imprint process is performed in an imprint device while distortion exists within a shot area of ​​a substrate, the overlay accuracy between a pattern already formed in the shot area and a newly formed pattern decreases. Patent Document 1 discloses an imprinting apparatus that suppresses a decrease in overlay accuracy by changing the supply amount of imprinting material supplied to each region within a shot region of a substrate in accordance with distortion within the shot region. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-212439 Summary of the Invention [Problem to be solved by the invention]

[0004] In the imprinting device disclosed in Patent Document 1, imprinting material is supplied to each area within a shot area of ​​a substrate in different amounts depending on the distortion within the shot area, and then a mold is brought into contact with the imprinting material. Therefore, when a mold is brought into contact with the imprint material, the imprint material may spread and be flattened. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an imprint apparatus that can stably form a pattern of an imprint material that corresponds to the distortion within a shot area of ​​a substrate. [Means for solving the problem]

[0005] The imprinting apparatus according to the present invention is an imprinting apparatus that forms a pattern of an imprinting material on a substrate using a mold, and includes a supply unit that supplies the imprinting material onto the substrate, an energy supply unit that supplies energy to the imprinting material on the substrate to increase the degree of polymerization, a movement unit that moves at least one of the mold and the substrate, and a control unit, and the supply unit moves the imprinting material within a predetermined shot area of ​​the substrate. No. a first supplying step of supplying an imprint material onto a first region; and a first energy supplying step of supplying energy to the imprint material supplied onto the first region by an energy supplying unit so as to increase the degree of polymerization of the imprint material supplied onto the first region; a second supply step of supplying an imprint material onto a second region other than the first region within a predetermined shot region by a supply unit after the first energy supply step is performed; and a control unit that performs a moving step of moving at least one of the mold and the substrate by the moving unit so that the pattern area formed on the mold and the imprint material on the substrate come into contact with each other, and a second energy supplying step of supplying energy by the energy supplying unit to the imprint material supplied onto the predetermined shot area so that the imprint material supplied onto the predetermined shot area is solidified after the pattern area and the imprint material on the substrate come into contact with each other. The control unit performs the first supply step and the second supply step so that the supply amount per unit area of ​​the imprint material in the first region is greater than the supply amount per unit area of ​​the imprint material in the second region. Characterized by [Effects of the Invention]

[0006] According to the present invention, it is possible to provide an imprint apparatus that can stably form a pattern of an imprint material that corresponds to distortion within a shot area of ​​a substrate. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic cross-sectional view of an imprint apparatus according to a first embodiment. [Figure 2] 4 is a flowchart showing an imprint process performed by the imprint apparatus according to the first embodiment. [Figure 3] FIG. 10 is an enlarged cross-sectional view of a shot area when a predetermined step in the imprint process is performed. [Figure 4] 1A and 1B are a schematic cross-sectional view and a partially enlarged schematic cross-sectional view of an imprint apparatus according to a second embodiment; [Figure 5] 10 is a flowchart showing an imprint process performed by an imprint apparatus according to a second embodiment. [Figure 6] FIG. 10 is an enlarged cross-sectional view of a shot area when a predetermined step in the imprint process is performed. DETAILED DESCRIPTION OF THE INVENTION

[0008] An imprint apparatus according to this embodiment will be described in detail below with reference to the accompanying drawings. Note that the following embodiment does not limit the configuration according to the claims of this application. Furthermore, although a plurality of features are described in this embodiment, not all of these features are necessarily required, and a plurality of features may be arbitrarily combined. Furthermore, the attached drawings are drawn at a scale different from the actual scale to facilitate understanding of the imprinting apparatus according to this embodiment, and the same or similar components are given the same reference numbers, and duplicate explanations are omitted.

[0009] In the following description, an axis perpendicular to the surface of the substrate 10 is referred to as the Z axis, and two axes perpendicular to each other in a plane parallel to the surface of the substrate 10 are referred to as the X axis and the Y axis, respectively. The rotation direction around the X axis, the rotation direction around the Y axis, and the rotation direction around the Z axis are respectively referred to as the θX direction, the θY direction, and the θZ direction.

[0010] [First embodiment] In response to the demand for miniaturization in semiconductor devices, MEMS, etc., in addition to conventional photolithography technology, imprint technology, which forms a pattern of imprint material on a substrate surface by shaping the imprint material on the substrate surface using a mold, is attracting attention. By utilizing such imprinting techniques, nanoscale patterns can be formed on the surface of a substrate.

[0011] As described above, an imprint apparatus employing imprint technology can be used to form nanoscale patterns on semiconductor wafers in the manufacturing process of semiconductor devices. The accuracy of alignment between a pattern layer already formed on a substrate surface and a new pattern layer when the two are stacked is also called overlay accuracy, and this overlay accuracy is important for the proper functioning of the manufactured semiconductor device.

[0012] In the imprint apparatus, the substrate is held by a substrate chuck that is polished to a very high degree of flatness so as to reduce distortion of the substrate surface when it is held by chuck. However, there is a limit to the flatness that can be achieved by polishing techniques, and since distortion, albeit small, remains on the substrate holding surface of the substrate chuck, the substrate surface may still be distorted when held by the substrate chuck. That is, deviations in the flatness, or planarity, of the substrate holding surface of the substrate chuck can cause in-plane distortions in the substrate surface to conform to the substrate holding surface of the substrate chuck.

[0013] Furthermore, when a pattern area formed on a mold is brought into contact with imprint material supplied onto a substrate surface on which such in-plane distortion has occurred, in-plane distortion can be generated in the pattern area so that the pattern area matches the flatness of the substrate surface. All of the above-mentioned distortions are factors that deteriorate the overlay accuracy.

[0014] As described above, in an imprinting device, when the imprinting material supplied onto the substrate surface and the pattern area formed on the mold are brought into contact with each other, it is necessary to prevent deterioration in overlay accuracy by making the shapes of the substrate surface and the pattern area mirror-symmetrically match each other. Furthermore, if a pattern is already formed on the substrate surface, when the imprint material supplied onto the pattern and the pattern area formed in the mold are brought into contact with each other, it is required that the shape of the pattern and the shape of the pattern area match each other.

[0015] Therefore, a conventional imprinting apparatus is known that suppresses deterioration of overlay accuracy by changing the amount of imprinting material supplied to each region within a shot region in accordance with distortion within the shot region on the substrate surface. However, in such an imprinting apparatus, the imprinting material is supplied to each region within the shot region in a supply amount that differs from one another, and then the mold is brought into contact with the imprinting material. Therefore, when a mold is brought into contact with the imprint material, the imprint material spreads and becomes flattened, making it difficult to suppress deterioration in overlay accuracy by correcting local distortion.

[0016] Therefore, in consideration of the problems with the conventional technology, this embodiment aims to provide an imprinting device that is particularly advantageous for overlaying a pattern of imprinting material already formed on a substrate surface with a pattern of imprinting material that is newly formed on top of that.

[0017] FIG. 1 shows a schematic cross-sectional view of an imprint apparatus 1 according to the first embodiment. The imprinting apparatus 1 of this embodiment is a lithography apparatus that forms a pattern of imprinting material on a substrate using a mold, and is employed in a lithography process included in the process of manufacturing devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media as articles.

[0018] Specifically, in the imprinting apparatus 1 according to this embodiment, uncured imprinting material supplied onto the substrate surface is brought into contact with a mold (the mold is brought into contact with the imprinting material on the substrate surface to imprint it), and then, by applying energy for curing to the imprinting material, a pattern of the cured material to which the pattern of the mold has been transferred can be formed on the substrate surface. The type used here is also called a mold, a template, or an original plate.

[0019] In the imprinting apparatus 1 according to this embodiment, a material (curable composition) that is cured when curing energy is applied is used as the imprinting material. The curing energy used here includes electromagnetic waves, heat, etc., and the electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared rays, visible light, ultraviolet rays, etc.

[0020] In the imprint apparatus 1 according to this embodiment, a composition that is cured by irradiation with light or heat is used as the curable composition. In particular, a photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound referred to here is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants and polymer components.

[0021] In the imprinting apparatus 1 according to this embodiment, the imprinting material may be applied to the substrate surface in the form of a film using a spin coater or a slit coater, or may be applied to the substrate surface in the form of droplets, islands formed by multiple droplets connected together, or a film using a liquid ejection head. The viscosity (at 25° C.) of the imprint material used in the imprint apparatus 1 according to this embodiment is, for example, not less than 1 mPa·s and not more than 100 mPa·s.

[0022] Furthermore, in the imprinting apparatus 1 according to this embodiment, glass, ceramics, metal, semiconductor, resin, etc. are used as the material of the substrate, and if necessary, a member made of a material different from the substrate may be formed on the substrate surface. Specifically, the substrate used in the imprint apparatus 1 according to this embodiment includes a silicon wafer, a compound semiconductor wafer, quartz glass, and the like.

[0023] As shown in Figure 1, the imprinting apparatus 1 according to this embodiment includes a first irradiation unit 2 (energy supply unit), a mold holding unit 3 (imprint head), a substrate holding unit 4 (stage), a supply unit 5 (dispenser), an imaging unit 6, and a control unit 7.

[0024] The first irradiation unit 2 irradiates the imprint material 14 supplied onto the substrate 10 with light 9 that hardens the imprint material 14. In other words, the first irradiation unit 2 supplies energy to the imprint material 14 supplied onto the substrate 10 to increase the degree of polymerization. The imprint apparatus 1 according to this embodiment uses, as the imprint material 14, an ultraviolet-curable imprint material that is cured by being irradiated with light 9, such as ultraviolet light, from the first irradiation unit 2. That is, the imprinting apparatus 1 according to this embodiment employs a photo-curing method as a method for curing the imprinting material 14 .

[0025] However, the imprinting apparatus 1 according to this embodiment is not limited to this, and may also employ a thermal curing method for curing the imprinting material 14 by utilizing heat. When the thermal curing method is adopted, a heating unit that applies heat to cure the imprint material 14 (heats the imprint material 14) is provided in place of the first irradiation unit 2.

[0026] The mold holding unit 3 is composed of a mold chuck 11 that holds the mold 8 by suction, and a mold moving unit 38 (moving unit) that includes an actuator that can move the mold chuck 11 that holds the mold 8 at least in the Z direction (up and down direction). Then, by moving the mold chuck 11 downward (in the −Z direction) by the mold moving part 38, the pattern region 8a formed on the mold 8 and the imprint material 14 on the substrate 10 come into contact with each other. Next, when the pattern area 8a formed on the mold 8 and the imprint material 14 on the substrate 10 come into contact with each other, the mold moving unit 38 is controlled by the control unit 7 so that the imprinting force applied to the mold 8 and the imprint material 14 on the substrate 10 is constant. Thereafter, the imprint material 14 on the substrate 10 is hardened, and by moving the mold chuck 11 upward (in the +Z direction) by the mold moving part 38, the pattern area 8a formed on the mold 8 is separated (released) from the hardened imprint material 14 on the substrate 10.

[0027] Furthermore, the mold holding portion 3 is provided with a recess for forming a space 13 defined (partitioned) by the partition plate 41 and the mold 8. By adjusting the pressure in the space 13, the mold 8 (pattern area 8a) can be deformed when the pattern area 8a formed on the mold 8 and the imprint material 14 on the substrate 10 are brought into contact with each other, or when the mold 8 is separated from the hardened imprint material 14 on the substrate 10. For example, by increasing the pressure in the space 13, the mold 8 can be deformed into a convex shape relative to the substrate 10, and the pattern area 8a formed on the mold 8 and the imprint material 14 on the substrate 10 can be brought into contact with each other.

[0028] The substrate holding unit 4 is composed of a substrate chuck 16 that suction-holds the substrate 10, and a substrate moving unit 17 (moving unit) that includes an actuator that can move the substrate chuck 16 that holds the substrate 10 in at least the X and Y directions. The substrate holder 4 is also provided with a mirror 18 and an interferometer 19, and the position of the substrate holder 4 can be determined from the optical path length measured between the mirror 18 and the interferometer 19. The position of the substrate holder 4 may be determined using an encoder instead of the mirror 18 and the interferometer 19 .

[0029] Furthermore, the mold holding unit 3 that holds the mold 8 includes a posture adjustment unit that adjusts the inclination of the mold 8, and the substrate holding unit 4 that holds the substrate 10 includes a posture adjustment unit that adjusts the inclination of the substrate 10. By using these attitude adjustment units to correct the relative tilt between the mold 8 and the substrate 10, the pattern area 8a formed on the mold 8 and the shot area on the substrate 10 can be made parallel to each other. The relative tilt between the mold 8 and the substrate 10 may be corrected by an attitude adjustment unit included in either the mold holding unit 3 or the substrate holding unit 4, or may be corrected by an attitude adjustment unit included in each of the mold holding unit 3 and the substrate holding unit 4.

[0030] The supply unit 5 supplies the imprint material 14 onto a predetermined shot area of ​​the substrate 10 . After irradiation, the imaging unit 6 captures an image of the light 35 that passes through the mold 8 and is reflected by the substrate 10, thereby detecting the contact state between the mold 8 and the imprint material on the substrate 10.

[0031] The control unit 7 is composed of an information processing device (computer) including a CPU, memory, etc., and controls and operates each part of the imprinting apparatus 1 according to this embodiment in an integrated manner in accordance with a program stored in a storage unit (not shown). Specifically, the control unit 7 controls the imprint process for forming a pattern in each shot area on the substrate 10, and the processes related thereto. The control unit 7 may be provided inside the imprinting apparatus 1 according to this embodiment, or may be provided outside the imprinting apparatus 1 according to this embodiment.

[0032] The detection unit 12 detects the marks (alignment marks) formed on the mold 8 and the marks (alignment marks) formed on the substrate 10. The control unit 7 then determines the relative positional deviation between the mold 8 and the substrate 10 from the detection results of the detection unit 12, and then moves at least one of the mold 8 and the substrate 10 to align the mold 8 and the substrate 10, respectively.

[0033] In the imprinting apparatus 1 according to this embodiment, the mold moving unit 38 moves the mold 8 relative to the substrate 10, thereby bringing the pattern area 8a formed on the mold 8 and the imprinting material 14 on the substrate 10 into contact with each other, but this is not limited to this. For example, the substrate chuck 16 may be moved upward (in the +Z direction) by the substrate moving unit 17, so that the pattern region 8a formed on the mold 8 and the imprint material 14 on the substrate 10 come into contact with each other. In addition, the mold chuck 11 may be moved downward by the mold moving unit 38, and the substrate chuck 16 may be moved upward by the substrate moving unit 17, thereby bringing the pattern area 8a formed on the mold 8 and the imprint material 14 on the substrate 10 into contact with each other. That is, in the imprinting apparatus 1 according to this embodiment, at least one of the substrate moving unit 17 and the mold moving unit 38 can be used as a moving unit that moves the mold 8 and the substrate 10 relative to each other in order to bring the pattern area 8a and the imprinting material 14 into contact with each other.

[0034] FIG. 2(a) is a flowchart showing the operation of the imprint apparatus 1 according to this embodiment, specifically, the imprint process of forming a pattern by molding the imprint material 14 with the mold 8 in each shot area of ​​the substrate 10. Each step in the flowchart is controlled by the control unit 7.

[0035] First, when the imprint process on the substrate 10 is started, the substrate 10 is loaded into the imprint apparatus 1 according to this embodiment (step S101). Specifically, in step S101, the substrate 10 is carried into the imprint apparatus 1 according to this embodiment via a substrate transport mechanism (not shown), and then the substrate 10 is held by the substrate chuck 16 of the substrate holding unit 4.

[0036] Next, a supplying step is performed in which the imprint material 14 is supplied onto the substrate 10 (step S102). Specifically, in step S102, the imprint material 14 is supplied from the supply unit 5 to a predetermined shot area (target shot area) on the substrate 10 where the pattern of the imprint material 14 is to be formed.

[0037] Next, a contact step (movement step) is performed in which the mold 8 and the imprint material 14 on the substrate 10 are brought into contact with each other (step S103). Specifically, in step S103, the mold 8 and the substrate 10 are brought relatively close to each other, so that the imprint material 14 supplied onto the specified shot area of ​​the substrate 10 and the pattern area 8a formed on the mold 8 come into contact with each other.

[0038] Next, the mold 8 and the substrate 10 are aligned relative to each other (step S104). Note that the alignment in step S104 is performed after the contact step in step S103 is completed and the pattern in the pattern region 8a formed on the mold 8 is sufficiently filled with the imprint material 14. Specifically, in step S104, the detection unit 12 detects the marks formed on the mold 8 and the marks formed on the substrate 10, and then the mold 8 and the substrate 10 are aligned relative to each other based on the detection results.

[0039] Here, in the imprint apparatus 1 according to this embodiment, the mold 8 and the substrate 10 are aligned relative to each other in step S104, but distortions that may result from the mold 8, the substrate 10, the imprint apparatus 1, or any combination thereof are not corrected. The distortion referred to here includes distortion of the pattern formed on the mold 8 caused by deviations in flatness on the holding surfaces of the substrate chuck 16 and mold chuck 11, the main surface of the substrate 10, the main surface of the mold 8, or any combination thereof. In addition, the distortion referred to here also includes errors in the pattern formed on the mold 8 and distortion of the substrate 10. All of these distortions affect the overlay accuracy.

[0040] In the imprinting apparatus 1 according to this embodiment, as shown below, the degree of polymerization of the imprinting material 14 supplied to a specific area on the shot area can be selectively increased to correct pattern distortion due to deviations in flatness and improve overlay accuracy.

[0041] FIG. 2B is a flowchart showing the steps included in the process of supplying the imprint material 14 in step S102 for correcting such distortion in the imprint apparatus 1 according to this embodiment.

[0042] First, based on information such as the distortion of the pattern formed on the mold 8 and the distortion of the substrate 10 as described above, the imprint material 14 is supplied from the supply unit 5 to a first area within a specified shot area on the substrate 10 (step S201, first supply process).

[0043] Next, the imprint material 14 supplied to the first region in step S201 is irradiated with light 9 from the first irradiating unit 2 so as to increase the degree of polymerization (step S202, first energy supplying step). The irradiation amount of light 9 here is set so that the degree of polymerization of the imprint material 14 supplied to the first region is higher than the degree of polymerization when supplied in step S201, and lower than the degree of polymerization when cured in the subsequent step S106.

[0044] That is, in step S202, the imprint material 14 supplied to the first region may be irradiated with the light 9 from the first irradiation unit 2 so as to increase the degree of polymerization of the imprint material 14 to a degree that does not cause curing. In other words, the irradiation amount of the light 9 from the first irradiation unit 2 in step S202 is 1 / 10 or less, preferably 1 / 100 or less, more preferably 1 / 1000 or less of the irradiation amount required to harden the imprint material 14.

[0045] Furthermore, if the magnitude of the shear force generated during the relative alignment of the mold 8 and the substrate 10 in step S104 exceeds 10 N, the shape of each pattern may be distorted during the alignment, which may result in a decrease in alignment accuracy. Therefore, when irradiating light 9 from the first irradiation unit 2 in step S202, the degree of polymerization of the imprint material 14 supplied to the first region can be increased so that the magnitude of the shear force is 10 N or less, preferably 5 N or less, and more preferably 1 N or less.

[0046] In other words, if the imprint material 14 is in a liquid state when supplied in step S201 and in a solid state when hardened in step S106, then in step S202, the imprint material 14 is preferably in a gel (semi-hardened) state.

[0047] Furthermore, the first region to which the imprint material 14 is supplied in step S201 is determined based on information such as distortion of the pattern formed on the mold 8 due to deviation in flatness and distortion of the substrate 10 (determining step). Specifically, the first area to which the imprint material 14 is supplied is determined based on the above-mentioned distortion information obtained from the positions and sizes detected in multiple marks formed in a specified shot area of ​​the substrate 10 and in the pattern area 8a of the mold 8.

[0048] Next, the imprint material 14 required to form a pattern is supplied from the supply unit 5 to a second region other than the first region in a predetermined shot region on the substrate 10 (step S203, second supply step). It is preferable that the supply amount per unit area of ​​the imprint material 14 supplied onto the second region in step S203 is smaller than the supply amount per unit area of ​​the imprint material 14 supplied onto the first region in step S201. That is, by making the supply amount per unit area of ​​the imprint material 14 in step S201 greater than the supply amount per unit area of ​​the imprint material 14 in step S203, it is possible to more effectively generate distortion in the pattern region 8a as described below.

[0049] Furthermore, although the above example shows that the imprint material 14 is supplied to each of the first area and the second area in a predetermined shot area on the substrate 10, the present invention is not limited to this. That is, a predetermined shot area on the substrate 10 may be divided into three or more areas, and the supply of the imprint material 14 and the irradiation of the light 9 may be carried out sequentially in accordance with the above procedure.

[0050] Returning to FIG. 2(a), after the mold 8 and the substrate 10 are relatively aligned in step S104, it is determined whether the relative positional deviation between the mold 8 and the substrate 10 is within an allowable range (step S105). If the relative positional deviation between the mold 8 and the substrate 10 is not within the allowable range (No in step S105), the process returns to step S104, and the relative positioning of the mold 8 and the substrate 10 is performed again. On the other hand, if the positional deviation is within the allowable range (Yes in step S105), the process proceeds to step S106. In step S106, a curing step (second energy supply step) is performed in which the imprint material 14 supplied to a predetermined shot area on the substrate 10 is cured (solidified) by irradiating the imprint material 14 with light 9 from the first irradiation unit 2.

[0051] FIG. 3(a) is an enlarged cross-sectional view of a predetermined shot area to which the imprint material 14 is supplied in step S102. Specifically, FIG. 3(a) shows an imprint material 14a having a relatively high degree of polymerization in a first region and an imprint material 14b having a relatively low degree of polymerization in a second region. Also, in FIG. 3(a), patterns that have already been formed with distortion between the substrate 10 and the imprint materials 14a and 14b are not shown.

[0052] FIG. 3B is an enlarged cross-sectional view of a predetermined shot area where steps S103 to S106 have been performed. Specifically, FIG. 3(b) shows a center position 401 of the first region and a center position 402 of the second region.

[0053] As shown in Figure 3(b), compared to the imprint material 14b in the second region, the imprint material 14a in the first region, which has a higher degree of polymerization, is less likely to spread when the mold 8 is pressed against it in step S103. Therefore, by performing the curing step in step S106, the thickness of the imprint material 14a in the first region becomes larger than the thickness of the imprint material 14b in the second region.

[0054] At this time, the pattern region 8 a formed on the mold 8 is deformed so as to follow the thickness distribution of the imprint material 14 . Specifically, at position 401, a force for bending the pattern region 8a in a valley fold (concave shape) is applied to the pattern region 8a, causing deformation in the direction of shrinkage within the pattern surface. On the other hand, at position 402, a mountain-folding (convex) bending force is applied to pattern region 8a, causing deformation in the elongation direction within the pattern surface.

[0055] In this way, in the imprint apparatus 1 according to this embodiment, by causing deviation in flatness in the pattern area 8a so as to follow the thickness distribution of the imprint material 14, it is possible to generate distortion within the pattern surface.

[0056] Returning to FIG. 2(a), after the curing step in step S106, a demolding step is performed in which the mold 8 and the imprint material 14 on the substrate 10 are separated from each other (step S107).

[0057] Then, it is determined whether the process consisting of steps S102 to S107 has been completed for all of the designated shot areas on the substrate 10 (step S108). If the process has not been completed for all of the designated shot areas on the substrate 10 (No in step S108), the process returns to step S102 and continues the process. On the other hand, if the processing has been completed for all specified shot areas on the substrate 10 (Yes in step S108), the process proceeds to step S109, the substrate 10 is unloaded from the imprint apparatus 1 according to this embodiment, and the imprint processing for the substrate 10 is completed.

[0058] As described above, in the imprinting apparatus 1 according to this embodiment, the degree of polymerization of the imprinting material 14 in the first region within the shot region on the substrate 10 is increased in the supply process based on information such as distortion of the pattern formed on the mold 8 due to deviations in flatness and distortion of the substrate 10. In other words, based on the difference between the shapes of the pattern area 8a formed in the mold 8 and a predetermined shot area on the substrate 10, a first area within the shot area is determined, and the degree of polymerization of the imprint material 14 in the first area is increased. This allows localized in-plane distortion to occur in the pattern region 8a of the mold 8 during the curing step, thereby improving the overlay accuracy.

[0059] [Second embodiment] 4(a) shows a schematic cross-sectional view of an imprinting apparatus 71 according to the second embodiment. Note that the imprinting apparatus 71 according to this embodiment has the same configuration as the imprinting apparatus 1 according to the first embodiment, except for the addition of a second irradiation unit 60. Therefore, the same components are designated by the same reference numerals and descriptions thereof will be omitted. FIG. 4(b) is a schematic cross-sectional view of a second irradiation unit 60 (energy supply unit) provided in an imprint apparatus 71 according to the second embodiment.

[0060] As shown in Figure 4(b), the second irradiation unit 60 includes a light source 51, a light modulation element 53 (spatial light modulation element), optical elements 54a and 54b, and can irradiate light 50 onto a predetermined area on the substrate 10. That is, in the imprint apparatus 71 according to this embodiment, the first irradiation unit 2 can irradiate the entire predetermined shot area of ​​the substrate 10 with light 9, while the second irradiation unit 60 can irradiate a predetermined area within the predetermined shot area of ​​the substrate 10 with light 50.

[0061] The light source 51 is selected from light sources such as lamps, laser diodes, LEDs, etc. that can provide the output required to emit light 50 of a wavelength that polymerizes (increases the degree of polymerization) the imprint material 14 on the substrate 10 to a predetermined viscosity. Light 50 emitted from the light source 51 passes through the optical element 54 a and is then guided to the light modulation element 53 .

[0062] The light modulation element 53 is composed of a digital micromirror device (DMD). By placing the light modulation element 53 between the light source 51 and the substrate 10 and adjusting the angle of each micromirror, the position and size of the irradiation range of the light 50 on the substrate 10 can be controlled (set) as desired. That is, the magnification of the light 50 is adjusted by the light modulation element 53 so that the light 50 is irradiated (projected) onto a predetermined area on the substrate 10 after passing through the optical element 54b.

[0063] In addition, by changing the angle of each micromirror over time, the irradiation time of the light 50 onto a predetermined area on the substrate 10 can be controlled arbitrarily. The light modulation element 53 is not limited to a digital micromirror device, and elements such as a liquid crystal display (LCD) device or an LCOS (Liquid Crystal On Silicon) device may also be used.

[0064] In the imprinting apparatus 71 according to this embodiment, the degree of polymerization of the imprinting material 14 on the substrate 10 is selectively increased using an optical modulation element 53 based on information such as distortion of the pattern formed on the mold 8 due to deviations in flatness and distortion of the substrate 10, thereby improving the overlay accuracy.

[0065] FIG. 5(a) is a flowchart showing the operation of the imprint apparatus 71 according to this embodiment, specifically, the imprint process of forming a pattern by molding the imprint material 14 with the mold 8 in each shot area of ​​the substrate 10. The flowchart for the imprint apparatus 71 according to this embodiment is the same as that for the imprint apparatus 1 according to the first embodiment, except that step S702 is performed instead of step S102 in the supply process. Therefore, only step S702 will be described below. FIG. 5B is a flowchart showing each step included in the step of supplying the imprint material 14 in step S702 in the imprint apparatus 71 according to this embodiment.

[0066] First, the imprint material 14 is supplied from the supply unit 5 over the entire predetermined shot area on the substrate 10 (step S801). In step S801, the imprint material 14 is supplied over the entire predetermined shot area on the substrate 10, so the imprint material 14 may be supplied in film form onto the substrate 10 using a spin coater or a slit coater instead of the supply unit 5.

[0067] Next, light 50 is irradiated from the second irradiation unit 60 to each area in a predetermined shot area on the substrate 10 so that the light irradiation time is changed depending on the distortion of the pattern formed on the mold 8 due to deviation in flatness, distortion of the substrate 10, etc. (step S802).

[0068] FIG. 6(a) shows an enlarged cross-sectional view of a predetermined shot area irradiated with light 50 in step S802. Specifically, FIG. 6(a) shows an imprint material 14a having the relatively highest degree of polymerization, an imprint material 14b having the relatively second highest degree of polymerization, and an imprint material 14c having the relatively lowest degree of polymerization. Also, in FIG. 6(a), patterns that have already been formed with distortion between the substrate 10 and the imprint material 14a, the imprint material 14b, and the imprint material 14c are not shown.

[0069] The degree of polymerization of the imprint material 14 changes depending on the amount of light irradiated onto the imprint material 14 . Therefore, in the imprint apparatus 71 according to this embodiment, the irradiation time of the light 50 is changed to adjust the degree of polymerization of the imprint material 14 in each region. That is, in FIG. 6(a), the irradiation time of the light 50 to the imprint material 14a is relatively the longest, the irradiation time of the light 50 to the imprint material 14b is relatively the second longest, and the irradiation time of the light 50 to the imprint material 14c is relatively the shortest.

[0070] FIG. 6B is an enlarged cross-sectional view of a predetermined shot area where steps S103 to S106 have been performed. Specifically, Figure 6(b) shows the center position 401 of the area where imprint material 14b is supplied, the center position 402 of the area where imprint material 14c is supplied, and the center position 403 of the area where imprint material 14a is supplied.

[0071] As shown in FIG. 6(b), the spreading caused by pressing the mold 8 in step S103 is suppressed in the order of relatively high polymerization degree, that is, imprint material 14a, imprint material 14b, and imprint material 14c. Therefore, by performing the curing step in step S106, the thicknesses of the imprint materials 14a, 14b, and 14c increase in this order.

[0072] At this time, the pattern region 8 a formed on the mold 8 is deformed so as to follow the thickness distribution of the imprint material 14 . Specifically, at position 401, a force for bending the pattern region 8a in a valley fold (concave shape) is applied to the pattern region 8a, causing deformation in the direction of shrinkage within the pattern surface. Furthermore, at position 403, a stronger force for bending into a valley fold (concave shape) is applied to pattern region 8a than at position 401, and thus a larger deformation in the shrinking direction occurs within the pattern surface than at position 401. On the other hand, at position 402, a mountain-folding (convex) bending force is applied to pattern region 8a, causing deformation in the elongation direction within the pattern surface.

[0073] In this way, in the imprinting apparatus 71 according to this embodiment, by causing deviation in flatness in the pattern region 8a so as to follow the thickness distribution of the imprinting material 14, it is possible to cause distortion within the pattern surface.

[0074] In the above description, the irradiation times of the light 50 to the imprint material 14a, the imprint material 14b, and the imprint material 14c are made different from one another, but the present invention is not limited to this. That is, the irradiation times of the light 50 on the imprint material 14 supplied to each of two regions in a predetermined shot region on the substrate 10 may be made different from each other. Furthermore, the irradiation time of the light 50 on the imprint material 14 supplied to each of four or more regions in a predetermined shot region on the substrate 10 may be different from each other.

[0075] As described above, in the imprinting apparatus 1 according to this embodiment, the degree of polymerization of the imprinting material 14 is changed in each region within the shot area on the substrate 10 during the supply process based on information such as distortion of the pattern formed on the mold 8 due to deviations in flatness and distortion of the substrate 10. In other words, based on the difference between the shapes of the pattern area 8a formed on the mold 8 and the predetermined shot area on the substrate 10, the degree of polymerization of the imprint material 14 is made different in each area within the shot area. This allows localized in-plane distortion to occur in the pattern region 8a of the mold 8 during the curing step, thereby improving the overlay accuracy.

[0076] In the imprint apparatus 71 according to this embodiment, the timing of irradiation with the light 50 is not limited to the supply step in step S702, but may be set arbitrarily between the contact step in step S103 and the curing step in step S106. That is, for example, the degree of polymerization of the imprint material 14 in a predetermined region may be increased by irradiating the imprint material 14 with light 50 when the imprint material 14 has reached a desired thickness during the contacting step in step S103.

[0077] According to this embodiment, an imprinting apparatus can be provided that is particularly advantageous for overlaying a pattern of imprinting material already formed on a substrate with a pattern of imprinting material to be newly formed thereon.

[0078] [Production method] The pattern of the cured product formed using the imprint apparatus according to this embodiment is used permanently in at least a part of various articles, or temporarily when manufacturing various articles. The term "articles" as used herein includes electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc.

[0079] The electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. The mold also includes a mold for imprinting.

[0080] The pattern of the cured material formed using the imprint apparatus according to this embodiment is used as it is as at least a part of the constituent member of the above-mentioned article. Alternatively, the pattern of the cured product is temporarily used as a resist mask, and after etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

[0081] Although the preferred embodiments have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist thereof. [Explanation of symbols]

[0082] 1 Imprinting device 2. First irradiation unit (energy supply unit) 5 Supply section 7 Control Unit Type 8 10 Substrate 14 Imprint material 17 Substrate moving part (moving part) 38-type moving part (moving part) 60 Second irradiation unit (energy supply unit)

Claims

1. An imprinting apparatus for forming a pattern of an imprint material on a substrate using a mold, a supply unit that supplies the imprint material onto the substrate; an energy supply unit that supplies energy to the imprint material on the substrate to increase a degree of polymerization; a moving unit that moves at least one of the mold and the substrate; A control unit, a first supply step of supplying the imprint material onto a first region within a predetermined shot region of the substrate by the supply unit; a first energy supplying step of supplying energy to the imprint material supplied onto the first region by the energy supply unit so as to increase a degree of polymerization of the imprint material supplied onto the first region; a second supply step of supplying the imprint material onto a second region other than the first region within the predetermined shot region by the supply unit after performing the first energy supply step; a moving step of moving at least one of the mold and the substrate by the moving unit after performing the second supply step so that a pattern region formed on the mold and the imprint material on the substrate come into contact with each other; a second energy supplying step of supplying energy to the imprint material supplied onto the predetermined shot area by the energy supply unit after bringing the pattern area and the imprint material on the substrate into contact with each other, so that the imprint material supplied onto the predetermined shot area is solidified; a control unit that performs the above; Equipped with An imprinting apparatus characterized in that the control unit performs the first supply process and the second supply process so that the supply amount per unit area of ​​the imprinting material in the first region is greater than the supply amount per unit area of ​​the imprinting material in the second region.

2. The imprint apparatus according to claim 1 , wherein the control unit determines the first area based on a difference between the shapes of the pattern area and the predetermined shot area.

3. 3. The imprint apparatus according to claim 1, wherein the energy supply unit includes an irradiation unit that irradiates the imprint material on the substrate with light.

4. 4. The imprint apparatus according to claim 3, wherein the irradiation unit includes a first irradiation unit that irradiates light onto an entire predetermined shot area of ​​the substrate, and a second irradiation unit that irradiates light onto a predetermined area within the predetermined shot area.

5. 5. The imprint apparatus according to claim 1, wherein the energy supply unit includes a heating unit that heats the imprint material on the substrate.

6. forming a pattern of an imprint material on a substrate using a mold by using the imprint apparatus according to any one of claims 1 to 5; processing the substrate on which the pattern is formed; and manufacturing an article from the processed substrate.

7. A method for forming a pattern of an imprint material on a substrate using a mold in an imprint apparatus including: a supply unit that supplies an imprint material onto a substrate; an energy supply unit that supplies energy to the imprint material on the substrate to increase a degree of polymerization; and a movement unit that moves at least one of a mold and the substrate, the method comprising: a first supply step of supplying the imprint material onto a first region within a predetermined shot region of the substrate by the supply unit; a first energy supplying step of supplying energy to the imprint material supplied onto the first region by the energy supply unit so as to increase a degree of polymerization of the imprint material supplied onto the first region; a second supply step of supplying the imprint material onto a second region other than the first region within the predetermined shot region by the supply unit after performing the first energy supply step; a moving step of moving at least one of the mold and the substrate by the moving unit after performing the second supply step so that a pattern region formed on the mold and the imprint material on the substrate come into contact with each other; a second energy supplying step of supplying energy to the imprint material supplied onto the predetermined shot area by the energy supply unit after bringing the pattern area and the imprint material on the substrate into contact with each other, so that the imprint material supplied onto the predetermined shot area is solidified; Including, A method characterized in that the amount of imprint material supplied per unit area in the first region in the first supply step is greater than the amount of imprint material supplied per unit area in the second region in the second supply step.

8. 8. The method of claim 7, further comprising determining the first area based on a difference between the shapes of the pattern area and the predetermined shot area.

9. The method according to claim 7 or 8, wherein the energy supply unit includes an irradiation unit that irradiates the imprint material on the substrate with light.

10. 10. The method according to claim 9, wherein the irradiation unit includes a first irradiation unit that irradiates light onto an entire predetermined shot area of ​​the substrate, and a second irradiation unit that irradiates light onto a predetermined area within the predetermined shot area.

11. 11. The method of claim 7, wherein the energy supply unit includes a heating unit that heats the imprint material on the substrate.

Images