Substrate support and ring replacement method

Abstract

To provide a wafer support base in which two kinds of rings included in the wafer support base can be exchanged by a common lifer, and provide an exchange method for the rings and a plasma processing device.SOLUTION: A wafer support base 101 includes: a wafer mounting part (a central part of an electrostatic chuck 104); a first ring (an edge ring E) provided so as to enclose the wafer mounting part; a second ring (an outer ring D) provided so as to enclose the first ring and not to overlap the first ring in a planar view; a third ring (a transfer ring T) which is provided at a lower side of the first ring and the second ring in such a manner that the inside portion overlaps the first ring in the planar view and the outside portion overlaps the second ring in the planar view, and includes a hole Ta in the inside portion; a lifer 108 including a first engagement part 108a, which protrudes upward from the hole of the third ring and is engaged with the first ring, and a second engagement part which is positioned at a lower side of the first engagement part and engaged with the third ring; and an actuator which moves the lifter up and down.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate support Taichung This article explains how to replace the spring ring. [Background technology]

[0002] The mounting table of the plasma processing apparatus disclosed in Patent Document 1 includes a wafer mounting surface, a ring mounting surface, lifter pins, and a drive mechanism. The wafer mounting surface mounts a wafer. The ring mounting surface mounts a first ring having a first engagement portion and a second ring having a through hole reaching the underside of the first engagement portion and a second engagement portion engaging with the first engagement portion. The ring mounting surface also has holes at positions corresponding to the through holes and provided on the outer periphery of the wafer mounting surface. The lifter pins have a first holding portion that fits into the through hole and a second holding portion that is axially connected to the first holding portion and has a protrusion that protrudes from the outer periphery of the first holding portion. The lifter pins are housed in the holes of the ring mounting surface with the first holding portion facing the ring mounting surface. The drive mechanism drives the lifter pins to be able to move up and down. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-113603 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure makes it possible to replace two types of rings provided on a substrate support table with a common lifter. [Means for solving the problem]

[0005] One aspect of the present disclosure includes a substrate mounting portion, a first ring arranged to surround the substrate mounting portion, a second ring arranged to surround the first ring and not overlap the first ring in a planar view, a third ring arranged below the first ring and the second ring so that its inner portion overlaps the first ring in a planar view and its outer portion overlaps the second ring in a planar view and has a hole in its inner portion, a lifter having a first engagement portion protruding upward from the hole of the third ring and engaging with the first ring, and a second engagement portion located below the first engagement portion and engaging with the third ring, and an actuator for raising and lowering the lifter. [Effects of the Invention]

[0006] According to the present disclosure, two types of rings provided on a substrate support stand can be replaced with a common lifter. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing an outline of the configuration of a plasma processing system including a plasma processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a longitudinal cross-sectional view showing an outline of the configuration of a processing module. [Figure 3] FIG. 3 is a partially enlarged view of FIG. 2. [Figure 4] 3 is an enlarged cross-sectional view of a portion different from FIG. 2 in the circumferential direction of the wafer support table. [Figure 5] 10A and 10B illustrate the surroundings of the wafer support pedestal during the attachment process of both the edge ring and the outer ring. [Figure 6] 10A and 10B illustrate the surroundings of the wafer support pedestal during the attachment process of both the edge ring and the outer ring. [Figure 7] 10A and 10B illustrate the surroundings of the wafer support pedestal during the attachment process of both the edge ring and the outer ring. [Figure 8] 10A and 10B are diagrams showing the state around the wafer support table during the process of attaching the edge ring alone. [Figure 9]10A and 10B are diagrams illustrating the state around the wafer support pedestal during the outer ring removal process with the edge ring removed. [Figure 10] 10A and 10B are diagrams showing other examples of the outer ring and the conveying ring. [Figure 11] 10A and 10B are diagrams showing other examples of the positioning configuration of the outer ring and the conveying ring. DETAILED DESCRIPTION OF THE INVENTION

[0008] In a manufacturing process for semiconductor devices, etc., plasma processing such as etching is performed on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer") using plasma. The plasma processing is performed with the substrate placed on a substrate support table inside a reduced-pressure processing chamber.

[0009] This substrate support table includes a substrate mounting portion on which a substrate is placed, as well as consumable components that require periodic replacement. The consumable components include, for example, an edge ring that is disposed adjacent to the substrate on the substrate mounting portion. The edge ring is etched by exposure to plasma and therefore requires replacement. The edge ring is replaced using, for example, a lifter that raises and lowers the edge ring while supporting it, and a transport device that transports the edge ring.

[0010] In some cases, the substrate support table includes an edge ring and another ring disposed to cover the outer surface of the edge ring. This other ring is also etched by exposure to plasma and therefore needs to be replaced periodically, i.e., treated as a consumable part. However, providing separate lifters for replacing the edge ring and the other rings results in high costs.

[0011] Therefore, the technology according to the present disclosure makes it possible to replace two types of rings provided on a substrate support table with a common lifter.

[0012] The substrate support table, the plasma processing apparatus, and the method for replacing the ring of the substrate support table according to the present embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0013] <Plasma processing system> FIG. 1 is a plan view showing an outline of the configuration of a plasma processing system including a plasma processing apparatus according to this embodiment. In the plasma processing system 1 of FIG. 1, a plasma process such as etching is performed on a wafer W as a substrate using plasma.

[0014] The plasma processing system 1 has an atmospheric section 10 and a decompression section 11, which are connected together via load lock modules 20 and 21. The atmospheric section 10 includes an atmospheric module that performs a desired process on a wafer W in an atmospheric pressure atmosphere. The decompression section 11 includes a process module 60 that performs a desired process on a wafer W in a decompression atmosphere (vacuum atmosphere).

[0015] The load lock modules 20 and 21 are provided to connect the loader module 30 included in the atmospheric section 10 and the transfer module 50 included in the reduced pressure section 11 via a gate valve (not shown). The load lock modules 20 and 21 are configured to temporarily hold the wafer W. The load lock modules 20 and 21 are also configured so that the interior thereof can be switched between an atmospheric pressure atmosphere and a reduced pressure atmosphere.

[0016] The atmospheric section 10 has a loader module 30 equipped with a transfer device 40 (described later), and a load port 32 on which a FOUP 31 is placed. The FOUP 31 is capable of storing a plurality of wafers W. The loader module 30 may be connected to an orienter module (not shown) that adjusts the horizontal orientation of the wafer W, a buffer module (not shown) that temporarily stores a plurality of wafers W, and the like.

[0017] The loader module 30 has a rectangular housing, the interior of which is maintained at atmospheric pressure. A plurality of, for example, five load ports 32 are arranged side by side on one side that constitutes the long side of the housing of the loader module 30. Load lock modules 20 and 21 are arranged side by side on the other side that constitutes the long side of the housing of the loader module 30.

[0018] A transfer device 40 configured to be able to transfer the wafer W is provided inside the housing of the loader module 30. The transfer device 40 has a transfer arm 41 that supports the wafer W during transfer, a rotary table 42 that rotatably supports the transfer arm 41, and a base 43 on which the rotary table 42 is mounted. Also, a guide rail 44 extending in the longitudinal direction of the loader module 30 is provided inside the loader module 30. The base 43 is provided on the guide rail 44, and the transfer device 40 is configured to be able to move along the guide rail 44.

[0019] The decompression unit 11 includes a transfer module 50, a processing module 60 serving as a plasma processing apparatus, and a storage module 61 serving as a storage unit. The interiors of the transfer module 50 and the processing module 60 (specifically, the interiors of the decompression transfer chamber 51 and the plasma processing chamber 100, described below) are each maintained in a reduced pressure atmosphere, and the interior of the storage module 61 is also maintained in a reduced pressure atmosphere. For one transfer module 50, a plurality of processing modules 60, for example, six, are provided, and a plurality of storage modules 61, for example, two, are also provided. Note that the number and arrangement of the processing modules 60 are not limited to those in this embodiment and can be set arbitrarily, as long as at least one processing module equipped with a wafer support pedestal, described below, is provided. Furthermore, the number and arrangement of the storage modules 61 are also not limited to those in this embodiment and can be set arbitrarily, for example, at least one is provided.

[0020] The transfer module 50 is configured to transport a wafer W. The transfer module 50 is also configured to transport an edge ring E, an outer ring D, and a transport ring T, which will be described later. The transfer module 50 includes a decompression transfer chamber 51 having a housing that is polygonal in plan view (rectangular in plan view in the illustrated example), and the decompression transfer chamber 51 is connected to the load lock modules 20 and 21.

[0021] The transfer module 50 transports the wafer W that has been loaded into the load lock module 20 to one of the processing modules 60, and also transfers the wafer W that has undergone the desired plasma processing in the processing module 60 out to the atmospheric section 10 via the load lock module 21. In addition, the transfer module 50 may transport the edge ring E, outer ring D, and transport ring T in the storage module 61 together to one processing module 60, and may also transport the edge ring E, outer ring D, and transport ring T in the processing module 60 together to the storage module 61. Furthermore, the transfer module 50 may transport the edge ring E in the storage module 61 to one of the processing modules 60 by itself, and may also unload the edge ring E in the processing module 60 by itself to the storage module 61. In addition, the transfer module 50 may transport the outer ring D and transport ring T in the storage module 61 together to one processing module 60, and may also transport the outer ring D and transport ring T in the processing module 60 together to the storage module 61.

[0022] The processing module 60 performs a desired plasma processing, such as etching, on the wafer W transferred from the transfer module 50. The processing module 60 is connected to the transfer module 50 via a gate valve 62. The specific configuration of the processing module 60 will be described later.

[0023] The storage module 61 stores the edge ring E, outer ring D, and conveying ring T. The edge ring E is stored alone in the storage module 61, or is stored while supported by the conveying ring T which in turn supports the outer ring D. The outer ring D is also stored while supported by the conveying ring T. The conveying ring T is stored while supporting only the outer ring D, or while supporting both the outer ring D and edge ring E. The specific configuration of the conveying ring T will be described later. The storage module 61 is also connected to the transfer module 50 via a gate valve 63 .

[0024] A transfer device 70 is provided inside the reduced pressure transfer chamber 51 of the transfer module 50. The transfer device 70 is configured to be able to hold and transfer a wafer W. The transfer device 70 is also configured to be able to hold and transfer a transfer ring T in a state where it supports the edge ring E and the outer ring D, and in a state where it supports only the outer ring D. The transfer device 70 is also configured to be able to hold and transfer the edge ring E alone.

[0025] The transfer device 70 includes a transfer arm 71 that holds the wafer W, the transfer ring T in the above-described state, and the edge ring E alone during transfer, a rotary table 72 that rotatably supports the transfer arm 71, and a base 73 on which the rotary table 72 is mounted. Also, inside the reduced pressure transfer chamber 51 of the transfer module 50, a guide rail 74 is provided that extends in the longitudinal direction of the transfer module 50. The base 73 is provided on the guide rail 74, and the transfer device 70 is configured to be movable along the guide rail 74.

[0026] In the transfer module 50, the transfer arm 71 receives the wafer W held in the load lock module 20 and carries it into the processing module 60. Also, the transfer arm 71 receives the wafer W held in the processing module 60 and carries it out to the load lock module 21.

[0027] Furthermore, in the transfer module 50, the transfer arm 71 may receive the transfer ring T supporting the edge ring E and the outer ring D, the transfer ring T supporting only the outer ring D, or the edge ring E alone from within the storage module 61, and carry it into the processing module 60. Furthermore, the transfer arm 71 may receive the transfer ring T supporting the edge ring E and the outer ring D, the transfer ring T supporting only the outer ring D, or the edge ring E alone from within the processing module 60, and carry it out to the storage module 61.

[0028] The plasma processing system 1 further includes a controller 80. In one embodiment, the controller 80 processes computer-executable instructions that cause the plasma processing system 1 to perform various operations described herein. The controller 80 may be configured to control each of the other elements of the plasma processing system 1 to perform the various operations described herein. In one embodiment, some or all of the controller 80 may be included in the other elements of the plasma processing system 1. The controller 80 may include, for example, a computer 90. The computer 90 may include, for example, a processing unit (CPU: Central Processing Unit) 91, a memory unit 92, and a communication interface 93. The processing unit 91 may be configured to perform various control operations based on programs stored in the memory unit 92. The memory unit 92 may include a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 93 may communicate with other elements of the plasma processing system 1 via a communication line such as a local area network (LAN).

[0029] <Wafer processing in plasma processing system 1> Next, a wafer processing performed using the plasma processing system 1 configured as above will be described.

[0030] First, the transfer device 40 removes the wafer W from the desired FOUP 31 and loads it into the load lock module 20. Then, the inside of the load lock module 20 is sealed and depressurized. Then, the inside of the load lock module 20 and the inside of the transfer module 50 are connected to each other.

[0031] Next, the wafer W is held by the transfer device 70 and transferred from the load lock module 20 to the transfer module 50 .

[0032] Next, the gate valve 62 is opened, and the transfer device 70 loads the wafer W into the desired processing module 60. Thereafter, the gate valve 62 is closed, and the desired processing is performed on the wafer W in the processing module 60. The processing performed on the wafer W in this processing module 60 will be described later.

[0033] Next, the gate valve 62 is opened, and the transfer device 70 unloads the wafer W from the processing module 60. Thereafter, the gate valve 62 is closed.

[0034] Next, the transfer device 70 loads the wafer W into the load lock module 21. When the wafer W is loaded into the load lock module 21, the inside of the load lock module 21 is sealed and opened to the atmosphere. Thereafter, the inside of the load lock module 21 and the inside of the loader module 30 are connected to each other.

[0035] Next, the wafer W is held by the transfer device 40, and is returned from the load lock module 21 to the desired FOUP 31 via the loader module 30 and accommodated therein. This completes the series of wafer processing steps in the plasma processing system 1.

[0036] <Processing Module 60> Next, the processing module 60 will be described with reference to Figs. 2 and 3. Fig. 2 is a vertical cross-sectional view showing the outline of the configuration of the processing module 60. Fig. 3 is a partially enlarged view of Fig. 2. Fig. 4 is an enlarged cross-sectional view of a portion different from Fig. 2 in the circumferential direction of a wafer support table 101 (described later).

[0037] 2, the processing module 60 includes a plasma processing chamber 100 as a processing container, a gas supply unit 130, an RF (Radio Frequency) power supply unit 140, and an exhaust system 150. The processing module 60 also includes a gas supply unit 125 (see FIG. 4). The processing module 60 further includes a wafer support pedestal 101 as a substrate support pedestal, and an upper electrode 102.

[0038] The wafer support pedestal 101 is disposed in a lower region of a plasma processing space 100s in the plasma processing chamber 100, which is configured to be depressurized. The upper electrode 102 is disposed above the wafer support pedestal 101 and can function as a part of the ceiling of the plasma processing chamber 100.

[0039] The wafer support pedestal 101 is configured to support a wafer W in the plasma processing space 100s. In one embodiment, the wafer support pedestal 101 includes a lower electrode 103, an electrostatic chuck 104, a support 105, an insulator 106, a lifter 107, a lifter 108, an edge ring E, an outer ring D, and a transfer ring T.

[0040] The lower electrode 103 is formed of a conductive material such as aluminum. In one embodiment, a flow path 109 for a temperature control fluid is formed inside the lower electrode 103. A temperature control fluid is supplied to the flow path 109 from a chiller unit (not shown) provided outside the plasma processing chamber 100. The temperature control fluid supplied to the flow path 109 returns to the chiller unit. By circulating, for example, low-temperature brine as a temperature control fluid through the flow path 109, it is possible to cool, for example, the wafer support pedestal 101, the wafer W mounted on the wafer support pedestal 101, the edge ring E, or the outer ring D to a predetermined temperature. By circulating, for example, high-temperature brine as a temperature control fluid through the flow path 109, it is possible to heat, for example, the wafer support pedestal 101, the wafer W mounted on the wafer support pedestal 101, the edge ring E, or the outer ring D to a predetermined temperature. When a temperature control mechanism is provided on the wafer support table 101, the form of the temperature control mechanism is not limited to the above-described flow path 109, and may be other forms such as a resistance heating heater. Also, the component on the wafer support table 101 on which the temperature control mechanism is provided is not limited to the lower electrode 103, and may be other components.

[0041] The electrostatic chuck 104 is provided on the lower electrode 103. The electrostatic chuck 104 is configured to hold a wafer W thereon, and in one embodiment, a central portion thereof constitutes a substrate support portion. In another embodiment, the electrostatic chuck 104 also holds an edge ring E thereon. The electrostatic chuck 104 may attract and hold both the wafer W and the edge ring E by electrostatic force. In one embodiment, the electrostatic chuck 104 is configured such that the upper surface of the central portion is higher than the upper surface of the peripheral portion thereof, and the wafer W is placed on an upper surface 104a of the central portion of the electrostatic chuck 104, and the edge ring E is placed on an upper surface 104b of the peripheral portion of the electrostatic chuck 104.

[0042] The edge ring E is a member provided to surround the central portion (specifically, the outer periphery of the central portion) of the electrostatic chuck 104. In other words, the edge ring E is a member disposed to surround the wafer W placed on the electrostatic chuck 104 (specifically, placed on the upper surface 104a of the central portion of the electrostatic chuck 104). The edge ring E is an example of a "first ring" according to the present disclosure, and is formed in an annular shape, more specifically, in a circular ring shape in a plan view. The edge ring E is made of a conductive material such as Si or SiO2.

[0043] The outer ring D is a member that covers the outer surface of the edge ring E. In other words, the outer ring D is a member that is provided to surround the edge ring E (specifically, the outer periphery of the edge ring E). The outer ring D is an example of a "second ring" according to the present disclosure, and is formed in an annular shape, more specifically, in a circular ring shape in a planar view. A conductive material such as Si or SiC is used as the material of the outer ring D. The material of the edge ring E and the material of the outer ring D may be the same or different.

[0044] This outer ring D is provided so as not to overlap with the edge ring E in a planar view. Specifically, the outer ring D is formed so as not to overlap with the edge ring E in a planar view when it is concentric with the edge ring E. More specifically, for example, the outer ring D is formed so that the diameter of the innermost portion of the outer ring D is larger than the diameter of the outermost portion of the edge ring E. The outer ring D of the wafer support table 101 is replaced using the carrier ring T. The carrier ring T may also be used to replace the edge ring E.

[0045] The conveying ring T is a component disposed below the edge ring E and the outer ring D such that its inner portion overlaps the edge ring E and its outer portion overlaps the outer ring D in a plan view. The conveying ring T is an example of the "third ring" and "inner ring" according to the present disclosure, and is formed in an annular shape, more specifically, in a circular annular shape in a plan view. For example, the conveying ring T is formed so that the diameter of its innermost portion is smaller than the diameter of the outermost portion of the edge ring E, and the diameter of its outermost portion is larger than the diameter of the innermost portion of the outer ring D.

[0046] The material of the carrying ring T is, for example, an insulating material such as SiO2 or a ceramic material (e.g., Al2O3). The material of the carrying ring T may also be a conductive material such as Si or SiC that has a higher electrical resistivity than the edge ring E, i.e., a conductive material such as Si or SiC whose impurity concentration is adjusted so that the electrical resistivity is higher than that of the material of the edge ring E.

[0047] The conveying ring T also has holes Ta, through which the lifters 108 are inserted, at positions corresponding to the respective lifters 108. The holes Ta are provided in the inner peripheral portion of the conveying ring T, which overlaps with the outer peripheral portion of the edge ring E in plan view, so as to penetrate the conveying ring T. 3, a recess Da that is recessed radially outward of the outer ring D is formed around the entire circumference of the innermost periphery of the outer ring D. The conveying ring T is formed to fit within the recess Da of the outer ring D.

[0048] 2, an electrode 110 for holding the wafer W by electrostatic attraction is provided in the center of the electrostatic chuck 104. An electrode 111 for holding the edge ring E by electrostatic attraction may be provided in the peripheral portion of the electrostatic chuck 104. Specifically, the electrode 111 is provided in a portion that overlaps the edge ring E but does not overlap the transfer ring T in a plan view. The electrostatic chuck 104 has a configuration in which the electrodes 110 and 111 are sandwiched between insulating materials made of, for example, an insulating material.

[0049] A DC voltage is applied to the electrode 110 from a DC power supply (not shown). The resulting electrostatic force attracts and holds the wafer W on the upper surface 104a at the center of the electrostatic chuck 104. Similarly, a DC voltage is applied to the electrode 111 from a DC power supply (not shown). The resulting electrostatic force attracts and holds the edge ring E on the upper surface 104b at the periphery of the electrostatic chuck 104. The electrode 111 is, for example, a bipolar electrode including a pair of electrodes 111a and 111b. In this embodiment, the central portion of the electrostatic chuck 104 where the electrode 110 is provided and the peripheral portion where the electrode 111 is provided are integral with each other, but the central portion and the peripheral portion may be separate. In addition, in this embodiment, the electrode 111 for attracting and holding the edge ring E is a bipolar type, but it may be a unipolar type.

[0050] In addition, the central portion of the electrostatic chuck 104 is formed, for example, with a diameter smaller than the diameter of the wafer W, so that when the wafer W is placed on the upper surface 104a of the central portion of the electrostatic chuck 104, the peripheral portion of the wafer W protrudes from the central portion of the electrostatic chuck 104. The edge ring E has a step formed on its upper portion, and the upper surface of the outer periphery is higher than the upper surface of the inner periphery. The inner periphery of the edge ring E is formed to be recessed below the peripheral edge of the wafer W that protrudes from the center of the electrostatic chuck 104. In other words, the inner diameter of the edge ring E is formed to be smaller than the outer diameter of the wafer W.

[0051] The support 105 is a member formed in a ring shape in a plan view using an insulating material such as quartz, and supports the lower electrode 103 and the electrostatic chuck 104. In one embodiment, an outer ring D and a transfer ring T are mounted on the support 105.

[0052] An upper surface 104a in the central portion of the electrostatic chuck 104 serves as a substrate mounting surface on which a wafer W is placed. An upper surface 105a of the support 105 serves as a ring mounting surface on which an outer ring D and a transfer ring T are placed, and an upper surface 104b in the peripheral portion of the electrostatic chuck 104 serves as another ring mounting surface on which an edge ring E is placed, located between the substrate mounting portion and the ring mounting surface.

[0053] The insulator 106 is a cylindrical member made of ceramic or the like, and supports the support 105. The insulator 106 is formed, for example, to have an outer diameter equal to the outer diameter of the support 105, and supports the periphery of the support 105.

[0054] The lifter 107 is a member that moves up and down relative to the upper surface 104a at the center of the electrostatic chuck 104, and is formed, for example, in a columnar shape using a ceramic material. When the lifter 107 is raised, its upper end protrudes from the upper surface 104a, enabling it to support the wafer W. The lifter 107 allows the wafer W to be transferred between the wafer support table 101 and the transfer arm 71 of the transfer device 70. Three or more lifters 107 are provided at intervals from one another and extend in the vertical direction.

[0055] The lifters 107 are raised and lowered by an actuator 112. The actuator 112 has, for example, a support member 113 that supports the plurality of lifters 107, and a drive unit 114 that generates a drive force for raising and lowering the support member 113, thereby raising and lowering the plurality of lifters 107. The drive unit 114 has, for example, a motor (not shown) as a drive source that generates the drive force.

[0056] The lifter 107 is inserted into an insertion hole 115 whose upper end opens in the upper surface 104a of the central portion of the electrostatic chuck 104. The insertion hole 115 is formed, for example, to extend downward from the upper surface 104a of the central portion of the electrostatic chuck 104 to reach the bottom surface of the lower electrode 103.

[0057] The lifter 108 is a lifting member that moves up and down relative to the upper surface 105a of the support 105, which constitutes the ring mounting surface, and is formed in a columnar shape using, for example, ceramic. The lifter 108 is configured so that its upper end can protrude from the upper surface 105a of the support 105 when raised. Specifically, the lifter 108 is configured so that it can protrude from a position on the upper surface 105a of the inner periphery of the support 105 that overlaps with the edge ring E and the transfer ring T in a plan view. Three or more lifters 108 are provided along the circumferential direction of the electrostatic chuck 104 at intervals, and extend in the vertical direction.

[0058] The lifters 108 are raised and lowered by an actuator 116. The actuator 116 has, for example, a support member 117 that supports the plurality of lifters 108, and a drive unit 118 that generates a drive force for raising and lowering the support member 117, thereby raising and lowering the plurality of lifters 107. The drive unit 118 has, for example, a motor (not shown) as a drive source that generates the drive force.

[0059] The lifter 108 is inserted into an insertion hole 119 whose upper end opens on an upper surface 105a of the support body 105 that supports the outer ring D and the conveying ring T. The insertion hole 119 is formed in the inner periphery of the support body 105, for example, so as to penetrate the support body 105.

[0060] As shown in FIG. 3, the lifter 108 has a first engaging portion 108a and a second engaging portion 108b. The first engagement portion 108a is formed by the upper portion of the lifter 108, protrudes upward from the hole Ta in the transport ring T, and engages with the edge ring E. When the lifter 108 is raised, the first engagement portion 108a passes through the hole Ta in the transport ring T and abuts against the bottom surface of the edge ring E, thereby supporting the edge ring E from the bottom surface.

[0061] The second engagement portion 108b is located below the first engagement portion 108a and engages with the conveying ring T. Specifically, the second engagement portion 108b abuts against the bottom surface of the conveying ring T without passing through the hole Ta of the conveying ring T, thereby supporting the conveying ring T from the bottom surface. The second engaging portion 108b is connected to the base end side of the first engaging portion 108a along the axial direction of the lifter 108. The second engaging portion 108b has a protruding portion 108c that protrudes outward from the outer periphery of the first engaging portion 108a at a position where it is connected to the first engaging portion 108a.

[0062] The specific shapes of the first engaging portion 108a, the second engaging portion 108b, and the protruding portion 108c are not particularly limited. For example, the first engaging portion 108a, the second engaging portion 108b, and the protruding portion 108c may each be a cylindrical member and may be coaxial with one another.

[0063] The actuator 116 described above raises and lowers the lifter 108, with the conveying ring T engaged with the second engagement portion 108b, and raises and lowers the outer ring D engaged with the conveying ring T. Furthermore, the actuator 116 raises and lowers the lifter 108, with the edge ring E engaged with the first engagement portion 108a, thereby raising and lowering the edge ring E.

[0064] Gas supply holes (not shown) are formed in the central upper surface 104a of the electrostatic chuck 104 to supply a heat transfer gas to the backside of the wafer W placed on the upper surface 104a. The heat transfer gas is supplied from a gas supply unit (not shown) through the gas supply holes. The gas supply unit may include one or more gas sources and one or more pressure controllers. In one embodiment, the gas supply unit is configured to supply the heat transfer gas from the gas source to the gas supply holes via the pressure controller, for example.

[0065] Furthermore, as shown in FIG. 4 , a heat transfer gas supply path 120 is formed on the upper surface 104b of the peripheral portion of the electrostatic chuck 104. The heat transfer gas supply path 120 supplies a heat transfer gas, such as helium gas, to the back surface of the edge ring E placed on the upper surface 104b. The heat transfer gas supply path 120 is provided to be in fluid communication with the upper surface 104b. The side of the heat transfer gas supply path 120 opposite the upper surface 104b is in fluid communication with a gas supply unit 125. The gas supply unit 125 may include one or more gas sources 126 and one or more flow rate controllers 127. In one embodiment, the gas supply unit 125 is configured to supply gas from, for example, the gas source 121 to the heat transfer gas supply path via the flow rate controller 127. Each flow rate controller 127 may include, for example, a mass flow controller or a pressure-controlled flow rate controller.

[0066] 2, the upper electrode 102 also functions as a showerhead to supply one or more process gases from the gas supply 130 to the plasma processing space 100s. In one embodiment, the upper electrode 102 includes a gas inlet 102a, a gas diffusion chamber 102b, and multiple gas outlets 102c. The gas inlet 102a is, for example, in fluid communication with the gas supply 130 and the gas diffusion chamber 102b. The multiple gas outlets 102c are in fluid communication with the gas diffusion chamber 102b and the plasma processing space 100s. In one embodiment, the upper electrode 102 is configured to supply one or more process gases from the gas inlet 102a through the gas diffusion chamber 102b and the multiple gas outlets 102c to the plasma processing space 100s.

[0067] The gas supply 130 may include one or more gas sources 131 and one or more flow controllers 132. In one embodiment, the gas supply 130 is configured to supply, for example, one or more process gases from respective gas sources 131 to the gas inlet 102a via respective flow controllers 132. Each flow controller 132 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 130 may include one or more flow modulation devices to modulate or pulse the flow rate of one or more process gases.

[0068] The RF power supply 140 is configured to supply RF power, e.g., one or more RF signals, to one or more electrodes, such as the lower electrode 103, the upper electrode 102, or both the lower electrode 103 and the upper electrode 102. This generates plasma from one or more process gases supplied to the plasma processing space 100s. Thus, the RF power supply 140 may function as at least a part of a plasma generating unit configured to generate plasma from one or more process gases in the plasma processing chamber. The RF power supply 140 may include, for example, two RF generators 141a and 141b and two matching circuits 142a and 142b. In one embodiment, the RF power supply 140 is configured to supply a first RF signal from the first RF generator 141a to the lower electrode 103 via the first matching circuit 142a. For example, the first RF signal may have a frequency in the range of 27 MHz to 100 MHz.

[0069] In one embodiment, the RF power supply unit 140 is configured to supply a second RF signal from a second RF generating unit 141b to the lower electrode 103 via a second matching circuit 142b. For example, the second RF signal may have a frequency in the range of 400 kHz to 13.56 MHz. Alternatively, a DC (Direct Current) pulse generating unit may be used in place of the second RF generating unit 141b.

[0070] Furthermore, although not shown, other embodiments are contemplated in this disclosure. For example, in an alternative embodiment, the RF power supply 140 may be configured to supply a first RF signal from an RF generator to the lower electrode 103, a second RF signal from another RF generator to the lower electrode 103, and a third RF signal from yet another RF generator to the lower electrode 103. Additionally, in another alternative embodiment, a DC voltage may be applied to the upper electrode 102.

[0071] Still further, in various embodiments, the amplitude of one or more RF signals (i.e., the first RF signal, the second RF signal, etc.) may be pulsed or modulated. Amplitude modulation may include pulsing the RF signal amplitude between an on state and an off state, or between two or more different on states.

[0072] The exhaust system 150 may be connected to, for example, an exhaust port 100e provided at the bottom of the plasma processing chamber 100. The exhaust system 150 may include a pressure valve and a vacuum pump. The vacuum pump may include a turbomolecular pump, a roughing pump, or a combination thereof.

[0073] <Wafer Processing in Processing Module 60> Next, a description will be given of an example of wafer processing performed using the processing module 60. In the processing module 60, processing such as etching is performed on the wafer W.

[0074] First, the wafer W is loaded into the plasma processing chamber 100 by the transfer device 70, and the lifter 107 is raised and lowered to place the wafer W on the electrostatic chuck 104. Then, a DC voltage is applied to the electrode 110 of the electrostatic chuck 104, whereby the wafer W is electrostatically attracted and held on the electrostatic chuck 104 by electrostatic force. After the wafer W is loaded, the inside of the plasma processing chamber 100 is depressurized to a predetermined vacuum level by the exhaust system 150.

[0075] Next, a processing gas is supplied from the gas supply unit 130 to the plasma processing space 100s via the upper electrode 102. Furthermore, high frequency power HF for plasma generation is supplied from the RF power supply unit 140 to the lower electrode 103, thereby exciting the processing gas and generating plasma. At this time, high frequency power LF for ion attraction may also be supplied from the RF power supply unit 140. Then, the wafer W is subjected to plasma processing by the action of the generated plasma.

[0076] During the plasma processing, a DC voltage is applied to the electrode 111 of the electrostatic chuck 104, whereby the edge ring E is electrostatically attracted and held by the electrostatic chuck 104. During the plasma processing, a heat transfer gas is supplied toward the bottom surfaces of the wafer W and the edge ring E attracted and held by the electrostatic chuck 104 via a heat transfer gas supply path 120 or the like.

[0077] When the plasma processing is terminated, the supply of high frequency power HF from the RF power supply unit 140 and the supply of processing gas from the gas supply unit 130 are stopped. If high frequency power LF has been supplied during the plasma processing, the supply of the high frequency power LF is also stopped. Next, the electrostatic chuck 104 stops attracting and holding the wafer W. In addition, the supply of heat transfer gas to the bottom surface of the wafer W may be stopped.

[0078] Thereafter, the wafer W is raised by the lifter 107, and the wafer W is detached from the electrostatic chuck 104. At the time of detachment, a charge removal process may be performed on the wafer W. Then, the transfer device 70 unloads the wafer W from the plasma processing chamber 100, and the series of wafer processing steps is completed.

[0079] <Effects of the outer ring D and the reason for providing the carrier ring T> In the processing module 60, the outer ring D is made of a conductive material. Therefore, unlike when the outer ring D is made of an insulating material, a sheath is formed above the outer ring D during plasma processing. This provides the following effects.

[0080] (1) The sheath prevents reaction products from adhering to the outer ring D, so that particles resulting from reaction products adhering to the outer ring D can be prevented from affecting the wafer W. (2) The sheath reduces wear on the outer ring D, thereby extending the life of the outer ring D. (3) As a result of the small wear of the outer ring D, a decrease in the etching rate of the peripheral portion of the wafer W due to the wear of the outer ring D can be suppressed.

[0081] However, the outer ring D also wears out along with the edge ring E and needs to be replaced, but the degree of wear differs between the outer ring D and the edge ring E. Therefore, it is preferable that the outer ring D and the edge ring E can be replaced separately. However, providing separate lifters 108 for the outer ring D and the edge ring E in order to replace them separately would result in high costs. To prevent this increase in cost, it is preferable to use a common lifter 108 between the rings.

[0082] Furthermore, because the outer ring D, which is made of a conductive material, is in an electrically floating state during plasma processing, a potential difference occurs between the outer ring D and the edge ring E, which is also made of a conductive material, due to the influence of the plasma. Therefore, if the gap between the outer ring D and the edge ring E is small, abnormal discharge may occur when the potential difference becomes large. Furthermore, if the outer ring D and the edge ring E are made to overlap in plan view, it is difficult to make the gap between them large (for example, 2 mm or more). Therefore, in this embodiment, the outer ring D and the edge ring E do not overlap in a planar view, and a relatively large gap (for example, 0.1 mm to 3 mm at room temperature, more preferably 0.2 mm to 2.5 mm) is provided between the outer periphery of the outer ring D and the inner periphery of the edge ring E.

[0083] Furthermore, if the outer ring D and edge ring E are formed as described above, it is not possible to replace both the outer ring D and the edge ring E using the lifter 108 shared between the rings unless measures are taken. Therefore, a carrying ring T configured to be able to support both the outer ring D and the edge ring E, and a lifter 108 having a first engagement portion 108a that engages with the edge ring E and a second engagement portion 108b that engages with the carrying ring T supporting the outer ring D, are used. Below, the replacement process of the edge ring E and the outer ring D using the carrying ring T and the lifter 108 will be described.

[0084] <Exchange process> First, an example of a process for simultaneously attaching the edge ring E and the outer ring D of the wafer support pedestal 101 in the plasma processing system 1 will be described with reference to FIGS. 5 to 7. FIGS. 5 to 7 are views showing the state around the wafer support pedestal 101 during the above process. The following process is performed under the control of the control device 80.

[0085] (Step S1: Carry-in) First, the transport ring T supporting the edge ring E and outer ring D in the storage module 61 is loaded by the transport device 70 into the plasma processing chamber 100 of the processing module 60 to which the edge ring E and outer ring D are to be attached. Specifically, the transfer ring T in the storage module 61 is held by the transfer arm 71 of the transfer device 70. Next, the transfer arm 71 holding the transfer ring T is inserted into the plasma processing chamber 100 of the processing module 60 to be attached via a loading / unloading port (not shown). At this time, the plasma processing chamber 100 may be depressurized. Then, as shown in FIG. 5 , the transfer ring T is transferred by the transfer arm 71 above the upper surface 104b of the peripheral portion of the electrostatic chuck 104 and the upper surface 105a of the support 105.

[0086] (Step S2: Placement) Next, the edge ring E and the outer ring D are placed on the electrostatic chuck 104 and the support 105 from the transfer device 70 .

[0087] Specifically, all of the lifters 108 are raised, and as shown in FIG. 6, the edge ring E is transferred from the transfer ring T held by the transfer arm 71 to the first engagement portion 108a of the lifter 108 that has passed through the hole Ta of the transfer ring T. Then, all of the lifters 108 continue to rise, and as shown in FIG. 7, the transfer ring T supporting the outer ring D is transferred from the transfer arm 71 to the second engagement portion 108b of the lifter 108. At this time, the lifters 108 are raised until the tops of the second engagement portions 108b reach a first predetermined height. The first predetermined height is a height at which the transfer arm 71 does not interfere with the outer ring D, the transfer ring T, etc. when the transfer arm 71 is inserted or removed between the upper surface 104a of the central portion of the electrostatic chuck 104 and the transferred transfer ring T supported by the second engagement portion 108b and the outer ring D supported by the transfer ring T.

[0088] Next, the transfer arm 71 is extracted from the plasma processing chamber 100. The lifter 108 is also lowered. As a result, the edge ring E, the outer ring D, and the transfer ring T are placed on the upper surface 104b of the peripheral portion of the electrostatic chuck 104 and the upper surface 105a of the support 105. Specifically, the transfer ring T and the outer ring D are first placed on the upper surface 105a of the support 105, and then the edge ring E is placed on the upper surface 104b of the peripheral portion of the electrostatic chuck 104. In other words, the edge ring E is placed on the upper surface 104b of the peripheral portion of the electrostatic chuck 104 (i.e., another ring mounting surface) with the transfer ring T and the outer ring D placed on the upper surface 105a of the support 105 (i.e., the ring mounting surface). This completes the series of processes for simultaneously attaching the edge ring E and the outer ring D.

[0089] After the edge ring E is placed, a DC voltage from a DC power supply (not shown) may be applied to the electrode 111 provided on the electrostatic chuck 104, and the edge ring E may be attracted and held by the electrostatic force generated thereby. In one embodiment, after the edge ring E is placed, a small gap is provided between the lower surface of the edge ring E and the upper surface of the transfer ring T. This is to ensure that the edge ring E is properly placed on the electrostatic chuck 104.

[0090] Next, an example of a process for simultaneously removing the edge ring E and the outer ring D of the wafer support pedestal 101 in the plasma processing system 1 will be described.

[0091] (Step S11: Transfer of edge ring E and outer ring D) First, the edge ring E and the outer ring D are transferred from the electrostatic chuck 104 to the lifter 108 .

[0092] Specifically, first, if a DC voltage has been applied to the electrode 111, the ignition is stopped, and the edge ring E is released from the electrostatic chuck 104 by being attracted thereto. Next, all of the lifters 108 are raised, and the edge ring E is transferred from the upper surface 104b of the peripheral portion of the electrostatic chuck 104 to the first engagement portions 108a of the lifters 108 that have passed through the insertion holes 119 and the holes Ta of the transfer ring T (see FIG. 8, which will be described later). Thereafter, all of the lifters 108 continue to rise, and the transfer ring T supporting the outer ring D is transferred from the upper surface 105a of the support body 105 to the second engagement portions 108b of the lifters 108. At this time, the lifters 108 are raised until the tops of the second engagement portions 108b reach the first predetermined height described above.

[0093] (Step S12:) The edge ring E and the outer ring D are then removed from the plasma processing chamber 100 of the processing module 60 .

[0094] Specifically, the transfer arm 71 is inserted through a transfer port (not shown) into the depressurized plasma processing chamber 100. Then, as shown in Fig. 7 , the transfer arm 71 is moved between the upper surface 104a of the central portion of the electrostatic chuck 104, the transfer ring T supported by the second engagement portion 108b of the lifter 108, and the outer ring D supported by the transfer ring T.

[0095] Next, all of the lifters 108 are lowered, and the carrying ring T supporting the outer ring D is transferred from the second engagement portion 108b of the lifters 108 to the carrying arm 71, as shown in Fig. 6. Thereafter, all of the lifters 108 continue to be lowered, and the edge ring E is transferred from the first engagement portion 108a of the lifters 108 to the carrying ring T supported by the carrying arm 71, as shown in Fig. 5. Next, the transfer arm 71 is extracted from the plasma processing chamber 100, and the transfer ring T supporting the outer ring D and the edge ring E is carried out of the processing module 60. The transferred transfer ring T supporting the outer ring D and the edge ring E is then carried into the storage module 61. This completes the series of processes for simultaneously removing the edge ring E and the outer ring D.

[0096] Next, an example of a process for removing the edge ring E alone will be described with reference to Fig. 8. Fig. 8 is a diagram showing the state around the wafer support table 101 during the above process.

[0097] (Step S21: Transfer of edge ring E) First, the edge ring E is transferred from the electrostatic chuck 104 to the lifter 108 .

[0098] Specifically, first, if a DC voltage has been applied to the electrode 111, the application of the DC voltage is stopped, and the edge ring E is released from the electrostatic chuck 104. Next, all of the lifters 108 are raised, and as shown in FIG. 8 , the edge ring E is transferred from the upper surface 104b of the peripheral portion of the electrostatic chuck 104 to the first engagement portions 108a of the lifters 108 that have passed through the insertion holes 119 and the holes Ta of the transfer ring T. At this time, the lifters 108 are raised to a level where the transfer ring T is not transferred to the second engagement portions 108b, and until the tops of the first engagement portions 108a reach a second predetermined height. Here, the second predetermined height is a height at which the transfer arm 71 does not interfere with the edge ring E, the outer ring D, etc. when the transfer arm 71 is inserted or removed between the outer ring D placed on the support 105 and the edge ring E supported by the first engagement portions 108a.

[0099] (Step S22: Carry out) The edge ring E is then removed from the plasma processing chamber 100 of the processing module 60 . Specifically, the transfer arm 71 is inserted through a transfer port (not shown) into the depressurized plasma processing chamber 100. Then, the transfer arm 71 is moved between the outer ring D placed on the support 105 and the edge ring E supported by the first engagement portion 108a of the lifter 108.

[0100] Next, all of the lifters 108 are lowered, and the edge ring E is transferred from the first engagement portion 108a of each lifter 108 to the transfer arm 71. Subsequently, the transfer arm 71 is extracted from the plasma processing chamber 100, and the edge ring E is transferred alone to the outside of the processing module 60. The transferred edge ring E is then transferred into the storage module 61. This completes the process of removing the edge ring E alone.

[0101] Next, an example of a process for attaching the edge ring E alone will be described.

[0102] (Step S31: Carry-in) First, the edge ring E in the storage module 61 is carried by the transfer device 70 into the plasma processing chamber 100 of the processing module 60 to which the edge ring E is to be attached. Specifically, the edge ring E in the storage module 61 is held by the transfer arm 71 of the transfer device 70. Next, the transfer arm 71 holding the edge ring E is inserted into the plasma processing chamber 100 of the processing module 60, to which the edge ring E is to be attached, through a loading / unloading port (not shown). At this time, the plasma processing chamber 100 may be depressurized. Then, the edge ring E is transferred by the transfer arm 71 above the upper surface 104b of the peripheral portion of the electrostatic chuck 104. At this time, the transfer ring T and the outer ring D are placed on the upper surface 105a of the support 105.

[0103] (Step S32: Placement) Next, the edge ring E is placed on the electrostatic chuck 104 from the transfer device 70 .

[0104] Specifically, all of the lifters 108 are raised, and the edge ring E is transferred from the transport arm 71 to the first engagement portions 108a of the lifters 108 that have passed through the holes Ta of the transport ring T. At this time, the lifters 108 are raised until the tops of the first engagement portions 108a reach the second predetermined height described above. Subsequently, the transfer arm 71 is removed from the plasma processing chamber 100. The lifter 108 is also lowered. As a result, the edge ring E is placed on the upper surface 104b of the peripheral portion of the electrostatic chuck 104. This completes the process of attaching the edge ring E alone.

[0105] Next, an example of the process of removing the outer ring D after the edge ring E has been removed will be described with reference to Fig. 9. Fig. 9 is a diagram showing the state around the wafer support table 101 during the above process.

[0106] (Step S41: Delivery of outer ring D) First, the transfer ring T supporting the outer ring D is transferred from the electrostatic chuck 104 to the lifter 108 .

[0107] 9, the edge ring E is transferred from the upper surface 105a of the support body 105 to the second engagement portions 108b of the lifters 108 that have passed through the insertion holes 119 and the holes Ta of the transport ring T. At this time, the lifters 108 are raised until the tops of the second engagement portions 108b reach the first predetermined height.

[0108] (Step S42: Carry out) Subsequently, the transfer ring T supporting the outer ring D is unloaded from within the plasma processing chamber 100 of the processing module 60 . Specifically, the transfer arm 71 is inserted through a transfer port (not shown) into the depressurized plasma processing chamber 100. Then, the transfer arm 71 is moved between the upper surface 104a of the central portion of the electrostatic chuck 104, the transfer ring T supported by the second engagement portion 108b of the lifter 108, and the outer ring D supported by the transfer ring T.

[0109] Next, all the lifters 108 are lowered, and the transfer ring T supporting the outer ring D is handed over from the second engagement portion 108b of the lifters 108 to the transfer arm 71. Next, the transfer arm 71 is extracted from the plasma processing chamber 100, and the transfer ring T supporting the outer ring D is carried out to the outside of the processing module 60. The carried-out transfer ring T supporting the outer ring D is carried into the storage module 61. This completes the process of removing the outer ring D with the edge ring E removed.

[0110] Next, an example of a process for attaching the outer ring D alone will be described.

[0111] (Step S51: Carry-in) First, the transfer ring T supporting only the outer ring D in the storage module 61 is carried by the transfer device 70 into the plasma processing chamber 100 of the processing module 60 to which the outer ring D is to be attached. Specifically, the transfer ring T, which supports only the outer ring in the storage module 61, is held by the transfer arm 71 of the transfer device 70. Next, the transfer arm 71 holding the transfer ring T is inserted into the plasma processing chamber 100 of the processing module 60 to be attached via a loading / unloading port (not shown). At this time, the plasma processing chamber 100 may be depressurized. Then, the transfer arm 71 transfers the transfer ring T above the upper surface 105a of the support 105.

[0112] (Step S52: Place) Next, the edge ring E is placed on the electrostatic chuck 104 from the transfer device 70 .

[0113] Specifically, all of the lifters 108 are raised, and the transport ring T supporting only the outer ring D is transferred from the transport arm 71 to the second engagement portions 108b of the lifters 108 that have passed through the holes Ta of the transport ring T. At this time, the lifters 108 are raised until the tops of the second engagement portions 108b reach the first predetermined height described above. Next, the transfer arm 71 is extracted from the plasma processing chamber 100. The lifter 108 is also lowered. As a result, the outer ring D and the transfer ring T are placed on the upper surface 105a of the support 105. This completes the process of attaching the outer ring D alone.

[0114] <Effects, etc.> As described above, according to this embodiment, the two types of rings, the edge ring E and the outer ring D, provided on the wafer support table 101 can be replaced by using the common lifter . Furthermore, according to this embodiment, it is possible to selectively replace the edge ring E and the outer ring D simultaneously or replace only the edge ring E. Therefore, when the edge ring E is worn out to a greater extent than the outer ring D, it is possible to replace both the edge ring E and the outer ring D at an appropriate timing, thereby extending the lifespan of both rings.

[0115] Furthermore, according to this embodiment, the edge ring E and the outer ring D can be replaced simultaneously, thereby shortening the time required for their replacement. Also, since the edge ring E and the outer ring D share the same lifter 108, costs and space can be reduced.

[0116] As mentioned above, SiC or a ceramic material may be used as the material of the carrier ring T. By using SiC or a ceramic material, the carrier ring T can have a higher resistance to plasma than when SiO2 is used.

[0117] When replacing both the edge ring E and the outer ring D, the edge ring E and the outer ring D may be removed at the same time, and the outer ring D may be attached using the carrier ring T. After that, the edge ring E may be attached by itself without using the carrier ring T. This allows both the outer ring D and the edge ring E to be attached in more appropriate positions.

[0118] <Modifications of the outer ring and the carrier ring> FIG. 10 shows another example of the outer ring and the conveying ring. To prevent radial misalignment between the outer ring and the conveying ring, a protrusion may be provided on one of them and a recess that engages with the protrusion may be provided on the other. Specifically, as shown in FIG. 10, a recess (hereinafter referred to as an "annular recess") D1b that is recessed upward around the entire circumference along the curve of the outer ring D1 may be formed on the lower surface of the inner peripheral portion of the outer ring D1. Then, a protrusion (hereinafter referred to as an "annular protrusion") T1b that protrudes upward around the entire circumference along the curve of the conveying ring T1 may be formed on the upper surface of the outer peripheral portion of the conveying ring T1 at a position corresponding to the annular recess D1b. The engagement between the annular recess D1b and the annular protrusion T1b can prevent radial misalignment between the outer ring D1 and the conveying ring T1.

[0119] Alternatively, a convex portion may be formed on the lower surface of the inner periphery of the outer ring D1, and a protrusion having a shape corresponding to the concave portion of the outer ring D1 may be formed on the upper surface of the outer periphery of the transport ring T1, which also makes it possible to prevent misalignment between the outer ring D1 and the transport ring T1.

[0120] <Modifications of the positioning of the outer ring and the carrier ring> FIG. 11 is a diagram showing another example of the positioning configuration of the outer ring and the conveying ring. 11, the outer ring D2 and the conveying ring T2 may be positioned radially using a positioning pin P inserted into both the lower surface of the inner periphery of the outer ring D2 and the upper surface of the outer periphery of the conveying ring T2. The positioning pin P is a columnar (specifically, cylindrical) member extending in the vertical direction. Three or more positioning pins P are provided at intervals along the circumferential direction of the outer ring D2 and the conveying ring T2.

[0121] Furthermore, if the outer ring has a lower thermal expansion coefficient than the conveying ring, the radial positioning of the outer ring and the conveying ring may be performed by fitting the inner periphery of the outer ring to the outer periphery of the conveying ring. Specifically, for example, the outer ring may have a portion into which the conveying ring fits, and this positioning may be performed. If the outer ring has a lower thermal expansion coefficient than the conveying ring, even if positioning is performed by fitting as described above, the conveying ring and the outer ring will not be damaged when both of them thermally expand.

[0122] The conveying ring is made of a material with a higher electrical resistivity than the outer ring. That is, the outer ring and the conveying ring are made of different materials. By integrating the outer ring and the conveying ring, which are made of different materials, by welding or the like, the outer ring and the conveying ring may be positioned radially.

[0123] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various additions, omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments. [Explanation of symbols]

[0124] 101 wafer support 104 Electrostatic Chuck 108 Lifter 108a First engaging part 108b Second engaging part 116 Actuator D, D1, D2 outer ring E Edge Ring T, T1, T2 carrier ring Ta hole W wafer

Claims

1. a substrate placement portion; a first ring provided to surround the substrate placement portion; a second ring that surrounds the first ring and does not overlap the first ring in a plan view; a third ring provided below the first ring and the second ring such that an inner portion of the third ring overlaps with the first ring in a plan view and an outer portion of the third ring overlaps with the second ring in a plan view, the third ring having a hole in the inner portion; a lifter provided with a first engagement portion that protrudes upward from the hole of the third ring and engages with the first ring, and a second engagement portion that is located below the first engagement portion and engages with the third ring; an actuator that raises and lowers the lifter.

2. The substrate support table according to claim 1 , wherein the actuator raises and lowers the lifter with the third ring engaged with the second engagement portion, thereby raising and lowering the second ring engaged with the third ring.

3. 3. The substrate support table according to claim 1, wherein the third ring is made of an insulating material or a conductive material having a higher electrical resistivity than the material of the first ring.

4. 4. The substrate support table according to claim 1, wherein the first ring is made of a conductive material.

5. 5. The substrate support table according to claim 1, wherein the first ring is an edge ring.

6. 6. The substrate support table according to claim 1, wherein the second ring is made of a conductive material.

7. A substrate support stand described in any one of claims 1 to 6, wherein the second engagement portion is connected to the first engagement portion along the axial direction of the lifter and has a protrusion that protrudes from the outer periphery of the first engagement portion.

8. 8. The substrate support stand according to claim 1, wherein the actuator raises and lowers the lifter with the first ring engaged with the first engagement portion, thereby raising and lowering the first ring.

9. 9. The substrate support stand according to claim 1, wherein the actuator raises the lifter when transporting the first ring until the top of the first engagement portion reaches a predetermined height.

10. The substrate support stand described in any one of claims 1 to 9, wherein the actuator raises the lifter when transporting the third ring engaged with the second ring until the top of the second engagement portion reaches a predetermined height.

11. A substrate support stand described in any one of claims 1 to 10, wherein the actuator raises the lifter until the top of the first engagement portion reaches a predetermined height when transporting the third ring engaged with the first ring and the second ring.

12. 12. The substrate support table according to claim 1, further comprising a ring mounting surface provided on an outer periphery of the substrate mounting portion, on which the second ring and the third ring are mounted.

13. The substrate support table according to claim 12 , wherein the first ring is placed on another ring mounting surface between the ring mounting surface on which the second ring and the third ring are placed and the substrate mounting portion.

14. an electrode that electrostatically attracts the first ring to the other ring mounting surface; The substrate support pedestal of claim 13 , further comprising: a gas supply mechanism that supplies a heat transfer gas between the another ring mounting surface and the lower surface of the first ring.

15. The substrate support stand according to any one of claims 1 to 14, wherein the actuator raises and lowers the lifter selectively engaged with only the first ring among the first ring, the second ring, and the third ring.

16. A method for replacing a ring of a substrate support, comprising the steps of: The substrate support table includes: a substrate placement portion; a first ring provided to surround the substrate placement portion; a second ring that surrounds the first ring and does not overlap the first ring in a plan view; a third ring provided below the first ring and the second ring such that an inner portion of the third ring overlaps with the first ring in a plan view and an outer portion of the third ring overlaps with the second ring in a plan view, the third ring having a hole in the inner portion; a lifter; A replacement method comprising: supporting the first ring with a first engagement portion of the lifter that protrudes upward from the hole in the third ring and transporting the first ring; and supporting the third ring with a second engagement portion of the lifter that is located below the first engagement portion and transporting the third ring together with the second ring.

Images