Antistatic polymer composition

Abstract

To provide a polymer composition having a reduced tendency to create a static electric charge during molding operation.SOLUTION: A polymer composition contains an ionic liquid that is distributed within a polymer matrix. The ionic liquid has a melting temperature of about 400°C or less and is a salt that contains a cationic species and a counterion. The polymer matrix includes an aromatic polymer having a glass transition temperature of about 100°C or more. The ionic liquid can exist in liquid form during melt processing, which allows it to be more uniformly blended within the aromatic polymer matrix. This improves electrical connectivity and thereby enhances the ability of the composition to rapidly dissipate static electric charges from its surface.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001]

[0001] This application is a direct sequel to U.S. Provisional Application No. 61 / 977,215, filed April 9, 2014 (the entirety of which is hereby incorporated by reference). Priority is claimed to the US Provisional Patent Application No. 2004 / 0119994, filed on May 1, 2004, the disclosure of which is incorporated herein by reference. [Background technology]

[0002] Camera modules (or components) are often used in mobile phones, laptop computers, digital cameras, digital video cameras, and the like. Examples include compact camera modules including a lens barrel attached to a base, digital camera shutter modules, digital camera components, cameras in game consoles, medical cameras, surveillance cameras, and the like. Various attempts have been made to use aromatic polymers for molding components of camera modules. Unfortunately, various problems are often encountered when attempting to form such molded components from aromatic polymers. For example, friction between the molded components and between the molded components and collection trays can induce static charges, which can lead to the formation of dust particles if not handled properly (e.g., during shipping). In some products, such as compact camera modules, these dust particles can be harmful and cause serious product defects. Therefore, there is a need for polymer compositions that have a reduced tendency to generate static charges during molding operations. Summary of the Invention

[0003]

[0002] According to one aspect of the present invention, a polymer matrix is ​​provided. The present invention discloses a polymer composition comprising an ionic liquid having a melting point of about 400°C or less and a salt comprising a cationic species and a counterion. The polymer matrix comprises an aromatic polymer having a glass transition temperature of about 100°C or more.

[0004] In accordance with another aspect of the present invention, a molded part is disclosed that includes a polymer composition, the polymer composition including an ionic liquid distributed within a polymer matrix, the polymer matrix including an aromatic polymer having a glass transition temperature of about 100° C. or greater.

[0005] Other features and aspects of the present invention are set forth in more detail below. A full and enabling disclosure of the present invention, including the best mode thereof, to one skilled in the art, is set forth more particularly in the remainder of the specification, including reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is an enlarged perspective view of one embodiment of a fine pitch electrical connector that can be formed in accordance with the present invention. [Figure 2]

[0007] 2 is a front view of the opposing walls of the fine pitch electrical connector of FIG. 1. FIG. [Figure 3]

[0008] FIG. 3 is a schematic diagram of one embodiment of an extruder screw that can be used to form the polymer composition of the present invention. [Figure 4]

[0009] FIG. 4 is a front perspective view of an electronic component that may use an antenna structure formed in accordance with an embodiment of the present invention. [Figure 5] FIG. 5 is a rear perspective view of an electronic component that may employ an antenna structure formed in accordance with an embodiment of the present invention. [Figure 6]

[0010] FIG. 6 is a perspective view of a compact camera module (CCM) that can be formed in accordance with one embodiment of the present invention. [Figure 7] FIG. 7 is a front view of a compact camera module (CCM) that can be formed in accordance with one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0007]

[0011] Those skilled in the art will understand that this disclosure describes only exemplary embodiments and is not intended to limit the invention in its broader aspects.

[0012] Generally speaking, the present invention relates to polymer compositions that have a reduced tendency to generate static charges during molding operations, shipping, assembly, handling, and the like. More specifically, the compositions include an ionic liquid distributed within a polymer matrix that includes an aromatic polymer. In addition to being electrically conductive, the ionic liquid can exist in liquid form during melt processing, allowing it to blend more uniformly within the polymer matrix. This improves electrical conductivity, thereby increasing the composition's ability to rapidly dissipate static charges from its surface. This anti-static behavior can be characterized by a relatively low surface and / or volume resistivity as required by IEC-60093. That is, molded parts formed from the polymer compositions have a surface and / or volume resistivity of about 1×10 15 Ω or less, in some embodiments about 1×10 14 Ω or less, in some embodiments about 1×10 9 Ω ~ approx. 9×10 13 Ω, in some embodiments, about 1×10 10 ~Approx. 1×10 13 Furthermore, the molded part also exhibits a surface resistivity of about 1×10 15 Ω·m or less, in some embodiments, about 1×10 9 Ω m ~ approx. 9×10 14 Ω·m, in some embodiments, about 1×10 10 ~Approx. 5×10 14 It can also be expressed as volume resistivity in Ω·m.

[0008]

[0013] The inventors have also discovered that the ability of ionic liquids to disperse rapidly within the polymer matrix can allow for the use of relatively low concentrations to achieve desired antistatic properties. However, because they are used at relatively low concentrations, the thermal and mechanical properties of the composition are not adversely affected. In this regard, the ionic liquid typically comprises from about 0.1% to about 10% by weight of the polymer composition, in some embodiments from about 0.3% to about 5% by weight, in some embodiments from about 0.4% to about 3% by weight, and in some embodiments, from about 0.5% to about 1.5% by weight. While the concentration of the aromatic polymer may generally vary based on the presence of other optional ingredients, they are typically present in an amount of from about 25% to about 95% by weight, in some embodiments from about 30% to about 80% by weight, and in some embodiments, from about 40% to about 70% by weight.

[0009]

[0014] Various aspects of the invention will now be described in more detail. I. Aromatic polymers:

[0015] The aromatic polymers used in the present polymer compositions are generally "high performance" polymers in that they have relatively high glass transition temperatures, which can impart a significant degree of heat resistance to the resulting composition. For example, the aromatic polymers may have glass transition temperatures of about 100° C. or higher, in some embodiments about 120° C. or higher, in some embodiments from about 140° C. to about 350° C., and in some embodiments from about 150° C. to about 320° C. Glass transition temperatures can be determined using differential scanning calorimetry (DSC) as is well known in the art, for example, in accordance with ISO Test No. 11357.

[0010]

[0016] Aromatic polymers are typically substantially amorphous or semi-crystalline in nature. An example of a suitable semi-crystalline aromatic polymer is an aromatic polyamide. Particularly suitable aromatic polyamides have a relatively high melting point, such as about 200°C or higher, in some embodiments about 220°C or higher, and in some embodiments, about 240°C to about 320°C, as determined using differential scanning calorimetry according to ISO Test No. 11357. Furthermore, the glass transition temperature of aromatic polyamides is generally about 110°C to about 160°C.

[0011]

[0017] Aromatic polyamides contain repeating units, usually joined by amide bonds (NH-CO), that are composed of dicarboxylic acids (e.g., aromatic dicarboxylic acids), diamines (e.g., fatty acids), and the like. Aromatic polyamides are synthesized by polycondensation of aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, 4,4'-oxydibenzoic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfone-4,4'-dicarboxylic acid, 4,4'-biphenyldicarboxylic acid, and the like, as well as combinations thereof. Terephthalic acid is particularly preferred. Of course, it should be understood that other types of acid units, such as aliphatic dicarboxylic acid units, polyfunctional carboxylic acid units, and the like, can also be used. Aromatic polyamides can also contain aliphatic repeat units derived from aliphatic diamines, typically having 4 to 14 carbon atoms. Examples of such diamines include linear aliphatic alkylenediamines such as 1,4-tetramethylenediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, and the like; 2-methyl-1,5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2-methyl-1,8-octanediamine, 5 ...,4-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2,4-dimethyl- branched aliphatic alkylenediamines such as 1,9-nonanediamine and / or 2-methyl-1,8-octadecyl-1,9-nonanediamine; and combinations thereof. Of course, other diamine units such as alicyclic diamines and aromatic diamines can also be used.

[0012]

[0018] Particularly suitable polyamides include poly(nonamethylene terephthalamide) (PA9T), poly(nonamethylene terephthalamide / nonamethylenedecanediamide) (PA9T / 910), poly(nonamethylene terephthalamide / nonamethylenedodecanediamide) (PA9T / 912), poly(nonamethylene terephthalamide / 11-aminoundecanamide) (PA9T / 11), poly(nonamethylene Poly(decamethylene terephthalamide / 12-aminododecanamide) (PA9T / 12), Poly(decamethylene terephthalamide / 11-aminoundecanamide) (PA10T / 11), Poly(decamethylene terephthalamide / 12-aminododecanamide) (PA10T / 12), Poly(decamethylene terephthalamide / decamethylenedodecanediamide) (PA10T / 1010), Poly(decamethylene terephthalamide / decamethylene dodecanediamide) (PA10T / 1012), poly(decamethylene terephthalamide / tetramethylene hexanediamide) (PA10T / 46), poly(decamethylene terephthalamide / caprolactam) (PA10T / 6), poly(decamethylene terephthalamide / hexamethylene hexanediamide) (PA10T / 66), poly(dodecamethylene terephthalamide / dodecamethylene dodecanediamide) (PA12T / 1212), poly(dodecamethylene terephthalamide / caprolactam) (PA12T / 6), poly(dodecamethylene terephthalamide / hexamethylene hexanediamide) (PA12T / 66), and the like. Further examples of suitable aromatic polyamides are described in U.S. Patent 8,324,307 to Harder et al.

[0013]

[0019] Another suitable semi-crystalline aromatic polymer that can be used in the present invention is polyaryletherketone. Polyaryletherketone is a semi-crystalline polymer having a relatively high melting point, such as from about 300°C to about 400°C, in some embodiments from about 310°C to about 390°C, and in some embodiments, from about 330°C to about 380°C. Furthermore, the glass transition temperature may be from about 110°C to about 200°C. Particularly suitable polyaryletherketones are those containing primarily phenyl groups in combination with ketone and / or ether groups. Examples of such polymers include polyetheretherketone (PEEK), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetherketoneetherketoneketone (PEKEKK), and polyetheretherketoneketone (PEEKK). , polyether-diphenyl-ether-ether-diphenyl-ether-phenyl-ketone-phenyl, etc., and blends and copolymers thereof.

[0014]

[0020] Of course, as noted above, substantially amorphous polymers without a discernible melting point can also be used in the polymer composition. Suitable amorphous polymers include, for example, polyphenylene oxide (PPO), aromatic polycarbonates, and aromatic polyetherimides. For example, aromatic polycarbonates typically have a glass transition temperature of about 130°C to about 160°C and contain aromatic repeating units derived from one or more aromatic diols. Particularly suitable aromatic diols are bisphenols, such as gem-bisphenols, in which two phenolic groups are bonded to a single carbon atom of a divalent connecting group. Examples of such bisphenols include 4,4'-isopropylidenediphenol (bisphenol A), 4,4'-ethylidenediphenol, 4,4'-(4-chloro-α-methylbenzylidene)diphenol, 4,4'-cyclohexylidene diphenol, 4,4-(cyclohexylmethylene)diphenol, and the like, as well as combinations thereof. The aromatic diol can be reacted with phosgene. For example, phosgene may be a carbonyl chloride having the formula: C(O)Cl. Another route to the synthesis of aromatic polycarbonates may involve the transesterification of aromatic diols (e.g., bisphenols) with diphenyl carbonate.

[0015] II. Ionic Liquids:

[0021] The ionic liquid of the present invention may be a salt having a melting point low enough to remain in liquid form when melt-processed with the aromatic polymer. For example, the melting point of the ionic liquid may be about 400°C or less, in some embodiments about 350°C or less, in some embodiments about 1°C to about 100°C, and in some embodiments about 5°C to about 50°C. The salt comprises a cationic species and a counterion. The cationic species includes compounds having at least one heteroatom (e.g., nitrogen or phosphorus) as the "cation center." Examples of such heteroatom compounds include those having the following structure:

[0016] [ka]

[0017]

[0022] (In the above formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , and R 8 are independently hydrogen; substituted or unsubstituted C1-C 10 Alkyl groups (e.g., methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, etc.); substituted or unsubstituted C3-C 14 Cycloalkyl groups (e.g., adamantyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclooctyl, cyclohexenyl, etc.); substituted or unsubstituted C1-C 10 Alkenyl groups (e.g., ethylene, propylene, 2-methylpropylene, pentylene, etc.); substituted or unsubstituted C2-C 10 Alkynyl groups (e.g., ethynyl, propynyl, etc.); substituted or unsubstituted C1-C 10 alkoxy groups (e.g., methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, t-butoxy, sec-butoxy, n-pentoxy, etc.); substituted or unsubstituted acyloxy groups (e.g., methacryloxy, methacryloxyethyl, etc.); substituted or unsubstituted aryl groups (e.g., phenyl); substituted or unsubstituted heteroaryl groups (e.g., pyridyl, furanyl, thienyl, thiazolyl, isothiazolyl, triazolyl, imidazolyl, isoxazolyl, pyrrolyl, pyrazolyl, pyridazinyl, pyrimidinyl, quinolyl, etc.); and the like). For example, in one particular embodiment, the cationic species is a quaternary onium having the structure: + R 1 R 2 R 3 R 4 (In the formula, R 1 , R 2 , and / or R 3 are independently C1-C6 alkyl (e.g., methyl, ethyl, butyl, etc.), and R 4 is hydrogen or C1 For example, the cationic component may be tributylmethylammonium (R 1 , R 2 , and R 3 is butyl and R 4 is methyl).

[0018]

[0023] Suitable counterions for the cationic species include, for example, halogens (e.g., chlorine, bromine, iodine, etc.); sulfates or sulfonates (e.g., methyl sulfate, ethyl sulfate, butyl sulfate, hexyl sulfate, octyl sulfate, hydrogen sulfate, methanesulfonate, dodecylbenzenesulfonate, dodecyl sulfate, trifluoromethanesulfonate, heptadecafluorooctanesulfonate, sodium dodecylethoxysulfate, etc.); sulfosuccinates; amides (e.g., dicyanamide); imides (e.g., bis(pentafluoroethyl-sulfonyl)imide, bis(trifluoromethylsulfonyl)imide, bis(trifluoromethyl)imide, etc.); borates (e.g., tetrafluoroethylene ... Counterions that can be used include, for example, fluoroborate, tetracyanoborate, bis[oxalato]borate, bis[salicylate]borate, etc.; phosphates or phosphinates (e.g., hexafluorophosphate, diethylphosphate, bis(pentafluoroethyl)phosphinate, tris(pentafluoroethyl)trifluorophosphate, tris(nonafluorobutyl)trifluorophosphate, etc.); antimonates (e.g., hexafluoroantimonate); aluminates (e.g., tetrachloroaluminate); fatty acid carboxylates (e.g., oleate, isostearate, pentadecafluorooctanoate, etc.); cyanates; acetates; and the like, as well as combinations of any of the above. To promote improved compatibility with aromatic polymers, it may be desirable to select counterions that are generally hydrophobic in nature, such as imides, fatty acid carboxylates, and the like. Particularly suitable hydrophobic counterions can include, for example, bis(pentafluoroethylsulfonyl)imide, bis(trifluoromethylsulfonyl)imide, and bis(trifluoromethyl)imide.

[0019] III. Optional Ingredients: A.Conductive filler:

[0024] In addition to ionic liquids, other conductive fillers can be used in the polymer composition to help improve its antistatic properties. Examples of suitable conductive fillers include metal particles (e.g., aluminum flakes), metal fibers, carbon particles (e.g., graphite, expanded graphite, graphene, carbon black, graphitized carbon black, etc.), carbon nanotubes, and carbon fibers. Carbon fibers and graphite are particularly preferred. In some embodiments, a synergistic effect can be achieved by using ionic liquids in combination with conductive fillers. While not intending to be limited by theory, the inventors believe that ionic liquids flow quickly during melt processing, helping to provide better connectivity and electrical flow paths between some conductive fillers (e.g., carbon fiber, graphite, etc.) and the polymer matrix, thereby further reducing surface resistance. When used, conductive fillers typically comprise from about 0.5% to about 30% by weight of the polymer composition, from about 1% to about 25% by weight in some embodiments, and from about 2% to about 20% by weight in some embodiments.

[0020] B. Fibrous fillers:

[0025] Fibrous fillers, which are generally not electrically conductive, may also be used in the polymer composition to help improve strength. Examples of such fibrous fillers include glass, ceramics (e.g., alumina, silica, titanium dioxide, etc.), minerals (e.g., wollastonite, xonotlite, dawsonite, etc.), aramids (e.g., EI du Pont de Nemours, Wilmington, Delaware), and cellulose ethers (e.g., cellulose ethers ... Examples include those formed from polymers such as Kevlar®, available from Epson Corporation, polyolefins, polyesters, and the like, as well as mixtures thereof.

[0021]

[0026] Particularly suitable glass fibers include, for example, E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, S1-glass, S2-glass, and the like, as well as mixtures thereof. The volume average length of such glass fibers may be relatively small, for example, from about 10 to about 500 micrometers, in some embodiments, from about 100 to about 400 micrometers, in some embodiments, from about 150 to about 350 micrometers, and in some embodiments, from about 200 to about 325 micrometers. The glass fibers may also have a narrow length distribution. That is, at least about 70% by volume of the fibers, in some embodiments, at least about 80% by volume of the fibers, and in some embodiments, at least about 90% by volume of the fibers have a length within the aforementioned range. Such small lengths and / or narrow distributions can further facilitate achieving a desirable combination of strength, flow, and surface quality, making them particularly suitable for molded parts having tight dimensional tolerances. In addition to having the length characteristics described above, the glass fibers may also have a relatively high aspect ratio (average length divided by nominal diameter) to promote improved mechanical properties and surface quality of the resulting polymer composition. For example, the fibers may have an aspect ratio of from about 1 to about 100, and in some embodiments, from about 10 to about 60, with from about 30 to about 50 being particularly useful in some embodiments. The fibers may have a nominal diameter of, for example, from about 1 to about 35 micrometers, and in some embodiments, from about 2 to about 20 micrometers, and in some embodiments, from about 3 to about 10 micrometers.

[0022]

[0027] Inorganic fibers (also known as "whiskers") are also suitable for use in the present invention. Anhydrous calcium sulfate and wollastonite fibers, such as those available from Nyco Minerals under the trade name NYGLOS® (e.g., NYGLOS® 4W or NYGLOS® 8), are particularly suitable. The volume-average length of such inorganic fibers may be relatively small, for example, from about 1 to about 200 micrometers, in some embodiments, from about 2 to about 150 micrometers, in some embodiments, from about 5 to about 100 micrometers, and in some embodiments, from about 10 to about 50 micrometers. In addition to having the length characteristics described above, the inorganic fibers may also have a relatively high aspect ratio (average length divided by nominal diameter) to help further enhance the mechanical properties and surface quality of the resulting polymer composition. For example, the inorganic fibers may have an aspect ratio of from about 1 to about 50, in some embodiments, from about 2 to about 20, and in some embodiments, from about 4 to about 15. The whiskers may have a nominal diameter, for example, from about 1 to about 35 micrometers, in some embodiments, from about 2 to about 20 micrometers, and in some embodiments, from about 3 to about 15 micrometers.

[0023]

[0028] Regardless of the specific type used, the relative amount of fibrous filler in the polymer composition can be selectively controlled to facilitate achieving desired mechanical properties without adversely affecting other properties of the composition, such as its flowability. For example, fibrous fillers (e.g., glass fibers, inorganic fibers, etc., as well as combinations thereof) typically comprise from about 2% to about 40% by weight of the polymer composition, in some embodiments, from about 5% to about 35% by weight, and in some embodiments, from about 6% to about 30% by weight. While fibers can be used within the above ranges, one particularly beneficial feature of the present invention is the ability to use low fiber contents while still achieving desired mechanical properties. While not intending to be limited by theory, it is believed that a narrow fiber length distribution can facilitate achieving excellent mechanical properties, thereby allowing for the use of lower amounts of fibers.

[0024] C. Particulate fillers:

[0029] Particulate fillers, which are generally not electrically conductive, may also be used in the polymer composition to help achieve desired properties and / or color. If used, such particulate fillers typically comprise from about 5% to about 40% by weight, in some embodiments from about 10% to about 35% by weight, and in some embodiments, from about 10% to about 30% by weight of the polymer composition. Clay minerals may be particularly suitable for use in the present invention. Such clay minerals may be used in combination with other clay minerals, such as fluorine-containing clays, to provide a polymeric composition that is resistant to water and / or moisture. Examples of such materials include talc (Mg3SiO4) 10 (OH)2), halloysite (Al2Si2O5(OH)4), kaolinite (Al2Si2O5(OH)4), illite ((K,H3O)(Al,Mg,Fe)2(Si,Al)4O 10 [(OH)2,(H2O)], montmorillonite (Na,Ca) 0.33 (Al,Mg)2SiO 10 (OH)2·nH2O), vermiculite ((MgFe,Al)3(Al,Si)4O 10 (OH)2·4H2O), palygorskite ((Mg,Al)2Si4O 10 (OH)·4(H2O)), pyrophyllite (Al2Si4O 10 (OH)2), etc., as well as combinations thereof. Still other particulate fillers can be used instead of, or in addition to, clay minerals. For example, other suitable silicate fillers can be used, such as calcium silicate, aluminum silicate, mica, diatomaceous earth, wollastonite, etc. For example, mica may be a particularly suitable mineral for use in the present invention. There are several chemically distinct mica species with considerable differences in their geological state of existence, but all have substantially the same crystalline structure. As used herein, the term "mica" refers to muscovite (KAl2(AlSi3)O 10 (OH)2), Biotite (K(Mg,Fe)3(AlSi3)O 10 (OH)2), phlogopite (KMg3(AlSi3)O 10 (OH)2), lepidolite (K(Li,Al) 2~3 (AlSi3)O10 (OH)2), gluconite (K,Na)(Al,Mg,Fe)2(Si,Al)4O 10 (OH)2), etc., as well as combinations thereof.

[0025] D. Other additives:

[0030] Further additives that can be included in the composition include, for example, antimicrobial agents, pigments, antioxidants, stabilizers, surfactants, waxes, solid solvents, flame retardants, anti-sag agents, and other materials added to improve properties and processability. Lubricants that can withstand the processing conditions of aromatic polymers without substantial decomposition can also be used in the polymer composition. Examples of such lubricants include fatty acid esters, their salts, esters, fatty acid amides, organic phosphate esters, and hydrocarbon waxes of the type commonly used as lubricants in the processing of engineering plastic materials, as well as mixtures thereof. Suitable fatty acids typically have a backbone carbon chain of about 12 to about 60 carbon atoms, such as myristic acid, palmitic acid, stearic acid, arachidic acid, montanic acid, octadecanoic acid, parinaric acid, and the like. Suitable esters include fatty acid esters, fatty alcohol esters, wax esters, glycerol esters, glycol esters, and complex esters. Fatty acid amides include fatty acid primary amides, fatty acid secondary amides, methylene and ethylene bisamides, and alkanolamides, such as palmitic acid amide, stearic acid amide, oleic acid amide, and N,N'-ethylene bisstearamide. Also suitable are metal salts of fatty acids, such as calcium stearate, zinc stearate, and magnesium stearate; and hydrocarbon waxes, such as paraffin wax, polyolefin and oxidized polyolefin wax, and microcrystalline wax. Particularly suitable lubricants are stearic acid, salts, or amides, such as pentaerythritol tetrastearate, calcium stearate, or N,N'-ethylene bisstearamide. When used, the lubricant(s) typically comprise from about 0.05% to about 1.5% by weight of the polymer composition, and in some embodiments, from about 0.1% to about 0.5% by weight.

[0026] IV. Formation:

[0031] The aromatic polymer, ionic liquid, and other optional additives may be melt processed or blended together to form the polymer composition within a temperature range of from about 250° C. to about 450° C., in some embodiments from about 280° C. to about 400° C., and in some embodiments from about 300° C. to about 380° C. In general, any of a variety of melt processing techniques may be used in the present invention. For example, the components (e.g., aromatic polymer, ionic liquid, etc.) can be fed separately or in combination to an extruder that includes at least one screw rotatably mounted and housed within a barrel (e.g., a cylindrical barrel) and can define a feed section along the length of the screw and a melt section disposed downstream of the feed section.

[0027]

[0032] The extruder may be a single-screw or twin-screw extruder. For example, referring to FIG. 3, one embodiment of a single-screw extruder 80 is shown, including a housing or barrel 114 and a screw 120 rotatably driven on one end by a suitable drive 124 (typically including a motor and gearbox). If desired, a twin-screw extruder including two separate screws can be used. The screw configuration is not particularly critical to the present invention and may include any number and / or orientation of flight and grooves as known in the art. For example, as shown in FIG. 3, the screw 120 includes flight grooves that form generally helical grooves extending radially around the core of the screw 120. Adjacent to the drive 124 is a hopper 40 for feeding polymer and / or other materials (e.g., inorganic particles) to a feed section 132 through an opening in the barrel 114. Opposite the drive 124 is an outlet end 144 of the extruder 80, where the extruded plastic is discharged for further processing.

[0028]

[0033] A feed section 132 and a melt section 134 are defined along the length of the screw 120. The feed section 132 is the entrance portion of the barrel 114, where the aromatic polymer and / or ionic liquid are added. The melt section 134 is a phase change section in which the aromatic polymer changes from a solid to a liquid. While these sections are not explicitly defined and shown in the manufacturing extruder, it is well within the skill of one of ordinary skill in the art to reliably identify the feed section 132 and the melt section 134, where the solid-to-liquid phase change occurs. Although not required, the extruder 80 can also include a mixing section 136 located adjacent the exit end of the barrel 114 and downstream of the melt section 134. If desired, one or more distributive and / or dispersive mixing elements can be used within the mixing and / or melt section of the extruder. Suitable distributive mixers for single-screw extruders include, for example, Saxon, Dulmage, and cavity transfer mixers. Suitable dispersive mixers include, for example, Blister Ring, Leroy / Maddock, and CRD mixers. As is well known in the art, mixing can be further enhanced by using pins within the barrel that cause folding and reorientation of the polymer melt, such as those used in Buss kneader extruders, cavity transfer mixers, and vortex intermesh pin mixers.

[0029]

[0034] If used, fibers (e.g., conductive fillers such as carbon fibers, and / or fibrous fillers such as glass fibers) can also be added to hopper 40 at a location downstream thereof. In one particular embodiment, the fibers can be added downstream of the location where the aromatic polymer is fed, but prior to the melt section. For example, in FIG. 3, hopper 42 is shown located in the area of ​​feed section 132 of extruder 80. The fibers fed to hopper 42 may initially be relatively long, for example, having a volume average length of from about 1,000 to about 5,000 micrometers, in some embodiments from about 2,000 to about 4,500 micrometers, and in some embodiments, from about 3,000 to about 4,000 micrometers. However, by feeding these long fibers at a location where the aromatic polymer is still in a solid state, the polymer can act as an abrasive to reduce the fiber dimensions to the volume average length and length distribution set forth above. However, it should be understood that any optional fibers can simply be fed to the extruder at a desired length. In such an embodiment, the fibers can be added, for example, to the extruder mixer. In yet another embodiment, fibers may be omitted altogether.

[0030]

[0035] The inventors have found that regardless of the particular method of forming it, the resulting polymer composition can have excellent thermal properties. For example, the melt viscosity of the polymer composition can be sufficiently low so that the polymer composition can easily flow into a mold cavity having small dimensions. In one particular embodiment, the polymer composition has a melt viscosity of 1000 s. -1The composition may have a melt viscosity of from about 0.1 to about 80 Pa·sec, in some embodiments from about 0.5 to about 50 Pa·sec, and in some embodiments, from about 1 to about 30 Pa·sec, measured at a shear rate of 100°C. The melt viscosity may be measured according to ISO Test No. 11443 at a temperature 15°C above the melting point of the composition (e.g., 350°C). The composition may also have a relatively high melting point. For example, the melting point of the polymer may be from about 250°C to about 400°C, in some embodiments from about 280°C to about 395°C, and in some embodiments, from about 300°C to about 380°C.

[0031] V. Molded parts:

[0036] Once formed, the polymeric compositions can be molded into any of a variety of different shaped parts using techniques known in the art. For example, molded parts can be formed using a one-component injection molding process in which dried, preheated plastic granules are injected into a mold. Regardless of the molding technique used, the polymeric compositions of the present invention, possessing a unique combination of good antistatic properties, high flowability, and good mechanical properties, have been found to be particularly well-suited for electronic components having tight dimensional tolerances. For example, such components generally include at least one micro-sized dimension (e.g., thickness, width, height, etc.), such as less than about 500 micrometers, in some embodiments, from about 50 to about 450 micrometers, and in some embodiments, from about 100 to about 400 micrometers.

[0032]

[0037] One such component is a fine-pitch electrical connector. More specifically, such electrical connectors are often used to removably mount central processing units (CPUs) to printed circuit boards. The connector can include insertion passages configured to receive contact pins. These passages are defined by opposing walls, which can be formed from a thermoplastic resin. To facilitate achieving desired electrical properties, the pitch of these pins is generally small so that the desired large number of contact pins can be accommodated in a given space. This requires that the pitch of the pin insertion passages and the width of the opposing walls that bound these passages be small as well. For example, the walls may have a width of about 500 micrometers or less, in some embodiments, from about 50 to about 450 micrometers, and in some embodiments, from about 100 to about 400 micrometers. In the past, it has often been difficult to properly fill molds with such thin widths with thermoplastic resins. However, due to their unique properties, the polymer compositions of the present invention are particularly well-suited for forming the walls of fine-pitch connectors.

[0033]

[0038] One particularly suitable fine-pitch electrical connector is shown in FIG. 1. The electrical connector 200 includes a board-side portion C2 that can be mounted on the surface of a circuit board P. The connector 200 can also include a wiring material-side portion C1 that is configured to connect separate wires 3 to the circuit board P by mating with the board-side connector C2. The board-side portion C2 can include a mating recess 10a into which the wiring material-side connector C1 is mated, and a first housing 10 having a narrow and elongated shape in the width direction of the housing 10. The wiring material-side portion C1 can further include a second housing 20 that is narrow and elongated in the width direction of the housing 20. The second housing 20 can have a plurality of terminal-receiving cavities 22 arranged in parallel in the width direction, and a first housing 20 having a narrow and elongated shape in the width direction of the housing 20. A two-row arrangement can be created including upper and lower terminal-receiving cavities 22. Terminals 5 mounted on the distal ends of separate wires 3 can be received in each of the terminal-receiving cavities 22. If desired, fastening portions 28 (mating portions) can also be provided on the housing 20 that correspond to connecting members (not shown) on the board-side connector C2.

[0034]

[0039] As discussed above, the interior walls of first housing 10 and / or second housing 20 can have a relatively small width dimension and can be formed from the polymer composition of the present invention. For example, a wall is shown in more detail in FIG. 2. As shown, an insertion passage or space 225 capable of accommodating a contact pin is defined between opposing walls 224. Wall 224 has a width "w" within the ranges discussed above. When wall 224 is formed from a polymer composition including fibers (e.g., component 400), such fibers may have a volume average length and a narrow length distribution within a particular range that best matches the width of the wall. For example, the ratio of the width of at least one wall to the volume average length of the fibers is from about 0.8 to about 3.2, in some embodiments, from about 1.0 to about 3.0, and in some embodiments, from about 1.2 to about 2.9.

[0035]

[0040] It should also be understood that any other portion of the housing, in addition to or instead of the wall, can be formed from the polymer composition of the present invention. For example, a connector can include a shield that encapsulates the housing. Part or all of the shield can be formed from the polymer composition of the present invention. For example, the housing and the shield can each be a one-piece structure integrally molded from the polymer composition. Furthermore, the shield can be a two-piece structure including a first shell and a second shell, each of which can be formed from the polymer composition of the present invention.

[0036]

[0041] Of course, the polymer compositions can also be used in a wide variety of other components. For example, the polymer compositions can be formed into planar substrates for use in electronic components. The substrates can be thin, e.g., about 500 micrometers or less, in some embodiments, about 50 to about 450 micrometers, and in some embodiments, about 100 to about 400 micrometers thick. For example, in one embodiment, a planar substrate can be provided with one or more conductive elements using various known techniques (e.g., laser direct structuring, electroplating, etc.). The conductive elements can serve a variety of different purposes. For example, in one embodiment, the conductive elements form integrated circuits such as those used in SIMS cards. In other embodiments, the conductive elements form various different types of antennas, such as patch antenna structures, inverted-F antenna structures, enclosed and open-slot antenna structures, loop antenna structures, monopoles, dipoles, planar inverted-F antenna structures, composites of these designs, and the like. The resulting antenna structures can be included in the housings of relatively small, portable electronic components, such as those described above, that have relatively little available internal space.

[0037]

[0042] One particularly suitable electronic component including the antenna structure shown in FIGS. 4-5 is a portable device 410 having the functionality of a mobile phone. As shown in FIG. 4, the device 410 can have a housing 412 formed from plastic, metal, other suitable dielectric material, other suitable conductive material, or a combination of such materials. A display 414, such as a touchscreen display, can be provided on the front of the device 410. The device 410 can also be provided with a speaker port 440 and other input / output ports. User input can be gathered using one or more buttons 438 and other user input devices. As shown in FIG. 5, an antenna structure 426 is also provided on the back 442 of the device 410, although it should be understood that the antenna structure can generally be located at any desired location on the device. As noted above, As such, antenna structure 426 can include a planar substrate formed from the polymer composition of the present invention. The antenna structure can be electrically connected to other components in an electronic device using any of a variety of known techniques. For example, housing 412 or a portion of housing 412 can serve as a conductive ground plane for antenna structure 426.

[0038]

[0043] Planar substrates formed from the polymer compositions of the present invention can also be used in other applications. For example, in one embodiment, the planar substrate can be used to form the base of a compact camera module (CCM) commonly used in wireless communication devices (e.g., mobile phones). Referring to Figures 6-7, for example, one particular embodiment of a compact camera module 500 is shown in greater detail. As shown, the compact camera module 500 includes a lens assembly 504 disposed on a base 506. The base 506 is, in turn, disposed on an optional main board 508. Due to their relatively thin characteristics, the base 506 and / or the main board 508 are particularly suitable for formation from the polymer compositions of the present invention described above. The lens assembly 504 can have any of a variety of configurations known in the art, including fixed-focus and / or autofocus lenses. For example, in one embodiment, the lens assembly 504 is in the form of a hollow barrel containing a lens 604, which is in communication with an image sensor 602, which is disposed on the main board 508 and controlled by circuitry 601. The barrel can have any of a variety of shapes, such as rectangular, cylindrical, etc. In some embodiments, the barrel can also be formed from the polymer composition of the present invention and can have a wall thickness within the ranges described above. It should be understood that other components of the camera module can also be formed from the polymer composition of the present invention. For example, as shown, lens assembly 504 can be covered by polymer film 510 (e.g., polyester film) and / or insulating cap 502. In some embodiments, film 510 and / or cap 502 can also be formed from the polymer composition of the present invention.

[0039]

[0044] Still other possible electronic components in which the polymer compositions can be used include, for example, mobile phones, laptop computers, small portable computers (e.g., ultraportable computers, netbook computers, and tablet computers), watch-type devices, pendant-type devices, headphone or earphone-type devices, media players with wireless communication capabilities, portable computers (sometimes also called personal digital assistants), remote controllers, global positioning system (GPS) devices, portable game devices, battery covers, speakers, camera modules, integrated circuits (e.g., SIM cards), housings for electronic devices, electrical control devices, circuit breakers, switches, power electronics, printer parts, and the like.

[0040]

[0045] Regardless of the particular method of use, the inventors have found that molded parts formed from the polymer compositions of the present invention can have excellent mechanical and thermal properties. As noted above, this is due in part to the unique ability of ionic liquids to be uniformly blended and dispersed within the polymer matrix. For example, molded parts can have a thermal conductivity of about 4 kJ / m as measured at 23°C according to ISO Test 179-1 (technically equivalent to ASTM-D256 Method B). 2 In some embodiments, the range is from about 2 to about 60 kJ / m 2 In some embodiments, from about 2 to about 40 kJ / m 2 In some embodiments, from about 3 to about 30 kJ / m 2 The part can have a relatively high impact strength (Charpy notched impact strength) of about 20 to about 500 MPa, and in some embodiments, about 50 to about 400 MPa, and in some embodiments, about 80 to about 350 MPa; a tensile break strain of about 0.5% or more, and in some embodiments, about 0.6% to about 20%, and in some embodiments, about 0.8% to about 3.5%; and and / or a tensile modulus of about 5,000 MPa to about 30,000 MPa, in some embodiments, about 6,000 MPa to about 20,000 MPa, and in some embodiments, about 7,000 MPa to about 15,000 MPa. Tensile properties can be measured at 23°C according to ISO Test 527 (technically equivalent to ASTM-D638). The molded parts may also exhibit a flexural strength of about 20 to about 500 MPa, in some embodiments, about 50 to about 400 MPa, and in some embodiments, about 100 to about 350 MPa; a flexural strain at break of about 0.5% or greater, in some embodiments, about 0.6% to about 20%, and in some embodiments, about 0.8% to about 3.5%; and / or a flexural modulus of about 5,000 MPa to about 30,000 MPa, in some embodiments, about 6,000 MPa to about 20,000 MPa, and in some embodiments, about 7,000 MPa to about 15,000 MPa. Flexural properties can be measured according to ISO Test 178 (technically equivalent to ASTM-D790) at 23° C. Molded parts can also exhibit a deflection temperature under load (DTUL) of greater than or equal to about 200° C., and in some embodiments, from about 220° C. to about 280° C., as measured at a specified load of 1.8 MPa according to ASTM-D648-07 (technically equivalent to ISO Test 75-2).

[0041]

[0046] Molded parts can also have improved flame retardant performance even in the absence of conventional flame retardants. The flame retardancy of a composition can be determined, for example, according to the Underwriters Laboratories Publication 94 procedure, entitled "Test for Flammability of Plastic Materials: UL 94." As described in more detail below, several ratings can be applied based on the time to extinguishment (total burn time) and the ability to resist dripping. According to this procedure, for example, molded parts formed from the compositions of the present invention can achieve a V0 rating, meaning that the part has a total burn time of 50 seconds or less and zero total number of drips of burning particles that would ignite cotton, measured at a given part thickness (e.g., 0.25 or 0.8 mm). For example, when exposed to an open flame, molded parts formed from the compositions of the present invention can exhibit a total burn time of about 50 seconds or less, in some embodiments, about 45 seconds or less, and in some embodiments, from about 1 to about 40 seconds. Furthermore, the total number of drips of burning particles produced during the UL 94 test can be three or less, in some embodiments, two or less, and in some embodiments, one or less (e.g., zero). Such testing can be performed after conditioning for 48 hours at 23°C and 50% relative humidity. [Example]

[0042]

[0047] The present invention can be better understood with reference to the following examples. Test Method:

[0048] Antistatic Test: To test for antistatic behavior, a molded disc / plaque was gently rubbed with paper to generate a static charge on the molded part surface. The part was then placed near a small piece of paper. If a static charge was generated on the part surface, an attractive force would be generated between the part and the paper. If no static charge was generated, moving the part closer to the paper would not result in any movement of the paper. If the paper moved, it was recorded as "none" and if the paper did not move, it was recorded as "yes."

[0043]

[0049] Melt viscosity: Melt viscosity (Pa·sec) is measured at 1000 s according to ISO test No. 11443. -1The flow rate can be determined using a Dynisco LCR7001 capillary flow meter at a shear rate of 1000 rpm and a temperature 15°C above the melting point (e.g., 350°C). ) had a diameter of 1 mm, a length of 20 mm, an L / D ratio of 20.1, and an entrance angle of 180°. The barrel diameter was 9.55 mm ± 0.005 mm and the rod length was 233.4 mm.

[0044]

[0050] Melting Point: The melting point (Tm) of a polymer or composition can be determined by differential scanning calorimetry (DSC) as known in the art. Melting point is measured according to ISO Test No. 11 357. For the DSC procedure, samples were heated and cooled at 20°C / min as specified in ISO standard 10350, with DSC measurements performed on a TA-Q2000 instrument.

[0045]

[0051] Deflection Temperature Under Load (DTUL): Deflection temperature under load can be determined according to ISO Test No. 75-2 (technically equivalent to ASTM-D648-07). More specifically, a test specimen having a length of 80 mm, a thickness of 10 mm, and a width of 4 mm can be subjected to a longitudinal three-point bending test with a specified load (maximum outer fiber stress) of 1.8 MPa. The specimen can be lowered into a silicone oil bath and the temperature can be increased at 2°C / min until it deflects 0.25 mm (0.32 mm for ISO Test No. 75-2).

[0046]

[0052] Tensile modulus, tensile stress, and tensile elongation: Tensile properties can be tested according to ISO Test No. 527 (technically equivalent to ASTM-D638). Modulus and strength measurements can be performed on the same specimen sample having a length of 80 mm, a thickness of 10 mm, and a width of 4 mm. The test temperature can be 23°C, and the test speed can be 1 or 5 mm / min.

[0047]

[0053] Flexural Modulus, Flexural Stress, and Flexural Strain: Flexural properties can be tested according to ISO Test No. 178 (technically equivalent to ASTM-D790). The test can be performed on a support span of 64 mm. The test can be performed on the center section of an uncut ISO-3167 multipurpose bar. The test temperature can be 23°C and the test speed can be 2 mm / min.

[0048]

[0054] Notched Charpy Impact Strength: Notched Charpy properties can be tested according to ISO Test No. 179-1 (technically equivalent to ASTM-D256 Method B). This test can be performed using a Type A notch (0.25 mm root radius) and Type 1 specimen dimensions (80 mm length, 10 mm width, and 4 mm thickness). Specimens can be cut from the center of a general-purpose bar using a single-tooth milling machine. The test temperature can be 23°C.

[0049]

[0055] Surface and Volume Resistivity: Surface and volume resistivity values ​​can be determined according to IEC-60093 (equivalent to ASTM-D257-07). This test can be performed using 60 x 60 mm plaques. This test can be performed using the voltammetry method with an electrometer (Keithley K8009 or ETS-823). When testing with the Keithley K-8009, a 4 minute discharge time and a 1 minute charge time can be used. The ETS-823 plate If testing with a lobe, readings can be taken immediately after stabilization.

[0050]

[0056] UL-94: The test specimen was supported in a vertical position and the flame was applied to the bottom of the specimen. The specimens were then exposed to the flame for 0 seconds and then removed until burning ceased, at which point the flame was reapplied for an additional 10 seconds before being removed. Two sets of five specimens were tested. The specimen dimensions were 125 mm long, 13 mm wide, and 0.8 mm thick. Two sets were conditioned before and after the aging treatment. For the unaged tests, each thickness was tested after conditioning for 48 hours at 23°C and 50% relative humidity. For the aged tests, five specimens of each thickness were tested after conditioning for 7 days at 70°C.

[0051] [Table 1]

[0052] Working Example:

[0057] 69.2 wt% PA9T (Geneter® G1300H), 0.8 wt% A polymer composition was formed containing an ionic liquid, 30% by weight of glass fiber, and 30% by weight of glass fiber. The ionic liquid was tri-n-butylmethylammonium bis(trifluoromethanesulfonyl)imide (FC-4400 from 3M). A control sample was also formed without the ionic liquid. The experiments were carried out using an 18 mm single screw extruder. Samples were injection molded into plaques (60 mm x 60 mm) and tested for thermal and mechanical properties. The results are shown in the table below.

[0053] [Table 2]

[0054]

[0058] These and other modifications and variations of the present invention may be practiced by those skilled in the art without departing from the spirit and scope of the present invention. Additionally, it should be understood that some aspects of the various aspects may be interchanged in whole or in part. Furthermore, those skilled in the art will recognize that the foregoing description is for illustrative purposes only and is not intended to limit the invention as further described in the claims. The claims as filed are as follows: [Claim 1] 1. A polymer composition comprising an ionic liquid distributed within a polymer matrix, the ionic liquid having a melting point of about 400°C or less and being a salt comprising a cationic species and a counterion, and the polymer matrix comprising an aromatic polymer having a glass transition temperature of about 100°C or more. [Claim 2] 10. The polymer composition of claim 1, wherein the ionic liquid comprises from about 0.1% to about 10% by weight of the composition. [Claim 3] 3. The polymer composition of claim 1, wherein the aromatic polymer comprises from about 25% to about 95% by weight of the composition. [Claim 4] 4. The polymer composition according to claim 1, wherein the cationic species is a quaternary onium. [Claim 5] Quaternary oniums have the structure: N + R 1 R 2 R 3 R 4 (In the formula, R 1 , R 2 , and / or R 3 are independently C1-C6 alkyl, and R 4 5. The polymer composition according to claim 4, wherein the ammonium compound has the formula (I) where I is hydrogen or a C1 to C4 alkyl group. [Claim 6] 6. The polymer composition of claim 5, wherein the ammonium compound is tributylmethylammonium. [Claim 7] 7. The polymer composition of claim 1, wherein the counterion is a halogen, sulfate, sulfonate, sulfosuccinate, amide, imide, borate, phosphate, phosphinate, antimonate, aluminate, fatty acid carboxylate, cyanate, acetate, or a combination thereof. [Claim 8] 8. The polymer composition of claim 7, wherein the counterion is bis(pentafluoroethylsulfonyl)imide, bis(trifluoromethylsulfonyl)imide, or bis(trifluoromethyl)imide. [Claim 9] 9. The polymer composition according to claim 1, wherein the aromatic polymer is semi-crystalline. [Claim 10] 10. The polymer composition of claim 9, wherein the aromatic polymer is a polyamide. [Claim 11] 11. The polymer composition of claim 10, wherein the polyamide has a melting point of about 200°C or greater. [Claim 12] 12. The polymer composition according to claim 10 or 11, wherein the polyamide comprises aromatic repeating units derived from an aromatic dicarboxylic acid and aliphatic repeating units derived from an aliphatic diamine having 4 to 14 carbon atoms. [Claim 13] 13. The polymer composition of claim 12, wherein the aromatic dicarboxylic acid is terephthalic acid. [Claim 14] 14. The polymer composition of claim 12 or 13, wherein the aliphatic diamine is 1,9-nonanediamine, 2-methyl-1,8-octanediamine, or a combination thereof. [Claim 15] 10. The polymer composition of claim 9, wherein the aromatic polymer is a polyaryletherketone. [Claim 16] 9. The polymer composition according to claim 1, wherein the aromatic polymer is substantially amorphous. [Claim 17] 17. The polymer composition of claim 16, wherein the aromatic polymer is polyphenylene oxide. [Claim 18] 17. The polymer composition of claim 16, wherein the aromatic polymer is a polyetherimide. [Claim 19] 17. The polymer composition of claim 16, wherein the aromatic polymer is a polycarbonate. [Claim 20] 20. The polymer composition of claim 19, wherein the polycarbonate comprises aromatic repeat units derived from a bisphenol. [Claim 21] 21. The polymer composition of claim 20, wherein the bisphenol is 4,4'-isopropylidenediphenol. [Claim 22] 22. The polymer composition according to claim 1, further comprising carbon fiber, graphite, carbon black, or a combination thereof. [Claim 23] 23. The polymer composition according to claim 1, further comprising inorganic fibers, glass fibers, or a combination thereof. [Claim 24] A molded part comprising the polymer according to any one of claims 1 to 23. [Claim 25] 1. A molded part comprising a polymer composition, the polymer composition comprising an ionic liquid distributed within a polymer matrix, the polymer matrix comprising an aromatic polymer having a glass transition temperature of about 100°C or greater. [Claim 26] The part is approximately 1 x 10 15 Surface resistivity of less than Ω and / or approximately 1 x 10 determined according to IEC-60093 15 26. The molded part according to claim 24 or 25, exhibiting a volume resistivity of less than or equal to Ω·m. [Claim 27] 26. A camera module comprising a molded part according to claim 24 or 25. [Claim 28] A camera module comprising the polymer composition according to any one of claims 1 to 23.

Claims

1. A polymer composition comprising an ionic liquid distributed within a polymer matrix, the ionic liquid having a melting point of 400°C or less and being a salt comprising a cationic species and a counterion, the polymer composition comprising glass fibers, and the polymer matrix comprising an aromatic polymer having a glass transition temperature of 100°C or more, the aromatic polymer being semi-crystalline, the aromatic polymer being a polyamide, the polymer matrix being free of a thermoplastic polyurethane resin, and The polymer composition, wherein the polymer composition is formed by melt processing in an extruder, and the glass fibers having a volume average length of 1,000 to 5,000 micrometers are fed into the extruder.

2. 10. The polymer composition of claim 1, wherein the ionic liquid comprises from 0.1% to 10% by weight of the composition.

3. The polymer composition of claim 1 or 2, wherein the aromatic polymer comprises 25% to 95% by weight of the composition.

4. The polymer composition of any one of claims 1 to 3, wherein the cationic species is a quaternary onium.

5. The quaternary onium has the structure: ＋ R １ R ２ R ３ R ４ (In the formula, R １ , R ２ , and R ３ is independently C １ ~C ６ alkyl, and R ４ is hydrogen or C １ ~C ４ 5. The polymer composition of claim 4, wherein the ammonium compound has a hydroxyl group, and the hydroxyl group is an alkyl group.

6. 6. The polymer composition of claim 5, wherein the ammonium compound is tributylmethylammonium.

7. the counterion is a halogen, sulfate, sulfonate, sulfosuccinate, amide, imide, borate, phosphate, phosphinate, antimonate, aluminate, fatty acid carboxylate, cyanate, acetate, or a combination thereof; The polymer composition according to any one of claims 1 to 6.

8. 8. The polymer composition of claim 7, wherein the counterion is bis(pentafluoroethylsulfonyl)imide, bis(trifluoromethylsulfonyl)imide, or bis(trifluoromethyl)imide.

9. 10. The polymer composition of claim 1, wherein the polyamide has a melting point of 200°C or greater.

10. 10. The polymer composition of claim 1 or 9, wherein the polyamide comprises aromatic repeat units derived from an aromatic dicarboxylic acid and aliphatic repeat units derived from an aliphatic diamine having from 4 to 14 carbon atoms.

11. 11. The polymer composition of claim 10, wherein the aromatic dicarboxylic acid is terephthalic acid.

12. 12. The polymer composition of claim 10 or 11, wherein the aliphatic diamine is 1,9-nonanediamine, 2-methyl-1,8-octanediamine, or a combination thereof.

13. The polymer composition of any of claims 1 to 12, further comprising carbon fiber, graphite, carbon black, or a combination thereof.

14. The polymer composition of claim 1, further comprising inorganic fibers that are not glass fibers.

15. A molded part comprising the polymer composition according to any one of claims 1 to 14.

16. 4.9 x 10 calculated according to IEC-60093 １１ Ω to 1 x 10 １５ Surface resistivity of Ω and / or 1 x 10 determined according to IEC-60093 １５ 16. The molded part of claim 15, exhibiting a volume resistivity of less than or equal to Ω·m.

17. A camera module comprising the molded part of claim 15.

18. A camera module comprising the polymer composition according to any one of claims 1 to 14.

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